Thin loudspeaker

Abstract

The present invention relates to a thin speaker comprising: a frame; a magnetic circuit part coupled to the frame to form a magnetic circuit; a voice coil disposed on the magnetic path; a vibration part which vibrates along with the vibration of the voice coil; and a centring disk disposed on an inner side of the vibration portion and configured to buffer vibration, the vibration portion including: an inner diaphragm connected to the voice coil; and an outer diaphragm disposed on the upper side of the inner diaphragm.

Description

Technical Field

[0001] The present invention relates to a loudspeaker for outputting sound, and more particularly to a thin loudspeaker having a thin structure. Background Technology

[0002] A loudspeaker converts electrical signals into diaphragm vibrations, generating compression and rarefaction waves in the air, thus producing sound. Based on the frequency range produced, loudspeakers can be classified as tweeters, midrange speakers, and woofers. Tweeters produce high frequencies, midrange speakers produce mid-range frequencies, and woofers produce low frequencies. These loudspeakers are built into electronic devices such as televisions (TVs) and audio equipment, serving as sound systems. Recently, as electronic devices with built-in speakers have become increasingly miniaturized, loudspeakers themselves have also needed to be miniaturized.

[0003] Figure 1 This is a schematic cross-sectional view of a loudspeaker in the prior art.

[0004] Reference Figure 1 A prior art loudspeaker 100 may include: a frame 110; a magnetic circuit portion 120, coupled to the frame 110, for forming a magnetic circuit; a voice coil 130, disposed on the magnetic circuit; a vibrating portion 140, which vibrates together with the voice coil 130; a centering support 150 for buffering the vibration of the vibrating portion 140; and a surround 160, which buffers the vibration of the vibrating portion 140 at a position spaced apart from the centering support 150. In this prior art loudspeaker 100, the centering support 150 is disposed below the vibrating portion 140 to buffer the vibration of the vibrating portion 140, and the surround 160 is disposed above the vibrating portion 140 to buffer the vibration of the vibrating portion 140. In this case, the centering support 150 and the surround 160 are configured to overlap with respect to the height direction (Z-axis direction). Therefore, in the existing loudspeaker 100, the centering support 150 and the surround 160 only buffer vibration on one side of the vibrating part 140, thus not only producing segmented vibration but also generating high distortion. Furthermore, in the existing loudspeaker 100, the centering support 150 and the surround 160 are configured to overlap with respect to the height direction (Z-axis direction), thus limiting the reduction of the overall length with respect to the height direction (Z-axis direction). In other words, the existing loudspeaker 100 has limitations in achieving miniaturization. Summary of the Invention

[0005] Technical issues

[0006] The present invention aims to solve the problems described above, and its purpose is to provide a thin loudspeaker that can achieve both miniaturization and reduced split vibration and distortion (THD).

[0007] Technical solution

[0008] To address the technical problems described above, the present invention may include the following technical features.

[0009] The present invention may include: a frame; a magnetic circuit portion, coupled to the frame, for forming a magnetic circuit; a voice coil, disposed on the magnetic circuit; a vibrating portion, vibrating together with the voice coil; and a centering support, disposed inside the vibrating portion, for buffering vibration. The vibrating portion may include: an inner diaphragm, connected to the voice coil; and an outer diaphragm, disposed above the inner diaphragm.

[0010] Beneficial effects

[0011] According to the present invention, the following effects can be achieved.

[0012] First, in this invention, the centering support can be connected to the vibrating part on the side facing inward from the outside of the vibrating part. Therefore, in this invention, the centering support can absorb the vibrational energy of the vibrating part on the inside of the vibrating part, thereby buffering the vibration of the vibrating part at a position different from that of the folded ring, which absorbs the vibrational energy of the vibrating part on the outside of the vibrating part. Therefore, this invention can absorb the vibrational energy of the vibrating part both on the inside and outside, based on the vibrating part, thereby not only preventing the segmented vibration of the vibrating part but also reducing total distortion (THD).

[0013] Second, in this invention, the centering support is positioned inside the vibrating section, allowing it to be configured not to overlap with the folded ring in the height direction. The folded ring absorbs the vibrational energy of the vibrating section from its outer side. That is, unlike a comparative example where the centering support and the folded ring overlap in the height direction from the outer side of the vibrating section, in this invention, the centering support is positioned inside the vibrating section, thus utilizing the space available for its placement. Therefore, this invention allows the vibrating section to be moved downwards to the position where the centering support is positioned, thereby reducing the overall length in the height direction. Attached Figure Description

[0014] Figure 1 This is a schematic cross-sectional view of a loudspeaker in the prior art.

[0015] Figure 2 This is a schematic cross-sectional view of the thin loudspeaker of the present invention.

[0016] Figure 3 This is a schematic partial cross-sectional view of the thin loudspeaker of the present invention.

[0017] Figure 4 This is a schematic cross-sectional view of the magnetic circuit section in the thin loudspeaker of the present invention.

[0018] Figure 5 This is a schematic cross-sectional view of the vibrating part in the thin loudspeaker of the present invention. Detailed Implementation

[0019] Hereinafter, embodiments of the thin loudspeaker of the present invention will be described in detail with reference to the accompanying drawings.

[0020] Reference Figure 2 The thin speaker 1 of the present invention generates sound through vibration. The thin speaker 1 of the present invention can convert electrical signals into vibrations of the diaphragm to generate compression and rarefaction waves in the air, thereby producing sound. This speaker can be integrated into electronic devices such as televisions (TVs) and audio equipment, and used as an audio device.

[0021] Among them, reference Figure 2 The thin loudspeaker 1 of the present invention may include: a frame 2; a magnetic circuit portion 3, which is attached to the frame 2 and is used to form a magnetic circuit; a voice coil 4, which is disposed on the magnetic circuit; a vibrating portion 5, which vibrates together with the voice coil 4; and a centering support 6, which is disposed inside the vibrating portion 5 and is used to buffer vibration.

[0022] Therefore, the thin speaker 1 of the present invention can achieve the following effects.

[0023] First, in the thin loudspeaker 1 of the present invention, the centering support 6 can be connected to the vibrating part 5 in an inward direction (in the direction of arrow ID) from the outside to the inside of the vibrating part 5. Therefore, in the thin loudspeaker 1 of the present invention, the centering support 6 can absorb the vibrational energy of the vibrating part 5 inside the vibrating part 5, thereby buffering the vibration of the vibrating part 5 at a position different from that of the surround 7, where the surround 7 absorbs the vibrational energy of the vibrating part 5 outside the vibrating part 5. Therefore, the thin loudspeaker 1 of the present invention can absorb the vibrational energy of the vibrating part 5 both inside and outside, with reference to the vibrating part 5, thereby not only preventing the split vibration of the vibrating part 5 but also reducing distortion (THD).

[0024] Second, in the thin loudspeaker 1 of the present invention, the centering support 6 is disposed inside the vibrating part 5, thereby allowing it to be configured not to overlap with the surround 7 in the height direction, wherein the surround 7 absorbs the vibration energy of the vibrating part 5 on the outside of the vibrating part 5. That is, unlike the comparative example where the centering support 6 and the surround 7 are disposed on the outside of the vibrating part 5 and overlap in the height direction, in the thin loudspeaker 1 of the present invention, the centering support 6 is disposed inside the vibrating part 5, thus utilizing the space provided by the centering support 6. Therefore, the thin loudspeaker 1 of the present invention allows the vibrating part 5 to be moved downwards to the position where the centering support 6 is disposed, thereby reducing the overall length in the height direction. Alternatively, the height direction can be the height direction of the thin loudspeaker 1 of the present invention.

[0025] The frame, the magnetic circuit section, the voice coil, the vibrating section, and the centering support plate will be described in detail below with reference to the accompanying drawings.

[0026] Reference Figure 2 The thin speaker 1 of the present invention may include a frame 2.

[0027] The frame 2 can form the shape of the thin speaker 1 of the present invention. Multiple parts of the thin speaker 1 of the present invention can be attached to the frame 2. Furthermore, multiple parts of the thin speaker 1 of the present invention can be housed inside the frame 2.

[0028] Reference Figure 2 and Figure 3 The frame 2 may include an upper frame 21 and a lower frame 22.

[0029] The upper frame 21 is attached to the lower frame 22. The upper frame 21 can be configured to be open at the top. Based on the height direction (Z-axis direction), the upper frame 21 can be positioned on the upper side of the lower frame 22.

[0030] The lower frame 22 is attached to the upper frame 21. The lower frame 22 can be configured below the upper frame 21, with reference to the height direction (Z-axis direction). Multiple components of the thin speaker 1 of the present invention can be arranged inside the lower frame 22.

[0031] Reference Figures 2 to 4 The thin speaker 1 of the present invention may include a magnetic circuit section 3.

[0032] The magnetic circuit section 3 is attached to the frame 2 and is used to generate magnetic force. The magnetic circuit section 3 may be attached to the lower frame 22. The magnetic circuit section 3 may be supported by the lower frame 22. The magnetic circuit section 3 may include a magnet 31, a yoke 32, and a pole piece 33 to generate magnetic force.

[0033] The magnet 31 is used to generate a magnetic field. The magnet 31 can form a magnetic circuit together with the yoke 32. The magnetic field in the thin speaker 1 of the present invention can have different strengths depending on the size of the magnet 31.

[0034] The magnetic yoke 32 is used to form a magnetic circuit. The magnetic yoke 32 provides a path for the movement of the magnetic field. Therefore, the magnetic yoke 32, together with the magnet 31, can form a magnetic circuit. The magnet 31 and the pole pieces 33 can be arranged inside the magnetic yoke 32. In this case, multiple magnets 31 and multiple pole pieces 33 can also be arranged inside the magnetic yoke 32.

[0035] The pole piece 33 is disposed on the upper side of the magnet 31. The pole piece 33 and the magnet 31 can form a magnetic circuit together. The pole piece 33 can be formed in a shape corresponding to the magnet 31. A magnetic gap 3a (shown in Figure 31) can be disposed on the inner side of the pole piece 33. Figure 4 (In the middle). The magnetic gap 3a can be formed as a hole through the pole piece 33. At least a portion of the voice coil 4 can be inserted into the magnetic gap 3a.

[0036] Reference Figures 2 to 5 The magnetic circuit section 3 may include a central piece 34 (shown in...). Figure 4 middle).

[0037] The central plate 34 is disposed on the upper part of the magnetic circuit section 3. The central plate 34 may be disposed on the upper side of the pole piece 33. Therefore, the thin loudspeaker 1 of the present invention can prevent magnetic flux leakage at the upper end of the magnetic circuit section 3 by means of the central plate 34. Therefore, the central plate 34 can increase the magnetic flux density on the magnetic circuit at the upper end of the magnetic circuit section 3, thereby improving the efficiency of the thin loudspeaker 1 of the present invention. The central plate 34 may be formed of iron or a permanent magnet to maximize the efficiency of the thin loudspeaker 1 of the present invention.

[0038] Reference Figure 2 The thin speaker 1 of the present invention may include a voice coil 4.

[0039] The voice coil 4 vibrates under the magnetic force generated by the magnetic circuit section 3. When a power source is applied to the voice coil 4, the voice coil 4 vibrates up and down along the vibration axis (A) through interaction with the magnetic field. In this way, the thin speaker 1 of the present invention can play sound while the voice coil 4 vibrates. The voice coil 4 can be integrated with the vibrating section 5. On the other hand, the voice coil 4 can be formed into a cylindrical shape. In this case, the voice coil 4 can be formed into a shape with an open upper and lower part. The upper direction (UD arrow direction) side and the lower direction (DD arrow direction) side of the voice coil 4 can be formed into an open shape. In this case, a portion of the pole piece 33 or the magnet 31 can be disposed inside the voice coil 4.

[0040] Reference Figure 2 and Figure 3 The thin speaker 1 of the present invention may include the vibrating part 5.

[0041] The vibrating part 5 vibrates together with the voice coil 4. The vibrating part 5 can be driven by the voice coil 4, which vibrates under magnetic force. Therefore, in the thin loudspeaker 1 of the present invention, the vibrating part 5 can vibrate by the voice coil 4. Therefore, the vibrating part 42 in the thin loudspeaker 1 of the present invention can generate audio while vibrating together with the voice coil 4.

[0042] Reference Figure 2 , Figure 3 and Figure 5 The vibrating part 5 may include an inner diaphragm 51 and an outer diaphragm 52.

[0043] The internal diaphragm 51 can be connected to the voice coil 4. The internal diaphragm 51 can be disposed below the external diaphragm 52. The internal diaphragm 51 can be configured to abut against the external diaphragm 52. Thus, the internal diaphragm 51 can transmit the vibration force of the voice coil 4 to the external diaphragm 52. The internal diaphragm 51 can support the external diaphragm 52. One side of the internal diaphragm 51 can be connected to the voice coil 4, and the other side can be connected to the surround 7. The internal diaphragm 51 can be connected to the voice coil 4 in an abutting manner on the inner side (ID arrow direction), and can be connected to the surround 7 in an abutting manner on the outer side (OD arrow direction), opposite to the inner side (ID arrow direction). The outer side (OD arrow direction) can be the direction from the inner side of the vibrating part 5 outward.

[0044] The outer diaphragm 52 is disposed above the inner diaphragm 51. The outer diaphragm 52 may be configured to abut against the inner diaphragm 51. In this case, the outer diaphragm 52 may be configured to partially contact the inner diaphragm 51. A portion of the outer diaphragm 52 may be configured to abut against the inner diaphragm 51, and another portion of the outer diaphragm 52 may be configured not to abut against the inner diaphragm 51. The outer diaphragm 52 may be disposed above the upper frame 21. In this case, the outer diaphragm 52 may be configured to partially cover the open upper portion of the upper frame 21.

[0045] Reference Figure 2 , Figure 3 and Figure 5 The vibrating part 5 may include a through hole 53 (shown in...). Figure 5 middle).

[0046] The through hole 53 extends through the outer diaphragm 52. At this time, the through hole 53 can extend through the center of the outer diaphragm 52. Through the through hole 53, the interior of the thin speaker 1 of the present invention can be partially opened.

[0047] Reference Figure 2 The thin speaker 1 of the present invention may include a centering support 6.

[0048] The centering support 6 is disposed inside the vibrating part 5. The centering support 6 can buffer the vibration of the vibrating part 5. The centering support 6 can be connected to the external diaphragm 52 inside the vibrating part 5. The centering support 6 can support the external diaphragm 52. The centering support 6 can absorb the vibration energy generated by the external diaphragm 52 by supporting the external diaphragm 52.

[0049] Reference Figure 2 and Figure 3 The thin speaker 1 of the present invention may include a surround 7.

[0050] The folded ring 7 is used to buffer the vibration of the vibrating part 5. The folded ring 7 can be connected to the inner diaphragm 51 on the outside of the vibrating part 5. The folded ring 7 can be disposed on the outside of the vibrating part 5 to buffer the vibration of the vibrating part 5. Therefore, in the thin speaker 1 of the present invention, the folded ring 7 and the centering support 6 can buffer the vibration of the vibrating part 5 on both sides with respect to the vibrating part 5. Therefore, the thin speaker 1 of the present invention can reduce the segmented vibration and distortion generated in the vibrating part 5 by means of the folded ring 7 and the centering support 6. The folded ring 7 can be disposed between the upper frame 21 and the vibrating part 5. The folded ring 7 can be combined with the inner diaphragm 51 and the upper frame 21 respectively. At this time, the folded ring 7 can absorb the vibration energy generated by the inner diaphragm 51. The folded ring 7 can be combined with the upper frame 21 and thus supported by the upper frame 21.

[0051] Reference Figure 2 , Figure 3 and Figure 5 The thin speaker 1 of the present invention may include a central decorative element 8.

[0052] The central decorative element 8 is disposed in the through hole 53 (shown in...). Figure 5 The central decorative element 8 can be inserted into the through hole 53 to enclose the interior of the thin speaker 1 of the present invention. When the central decorative element 8 is inserted into the through hole 53, the interior of the thin speaker 1 of the present invention can be enclosed. Therefore, the central decorative element 8 can be configured to cover the magnetic circuit portion 3. Therefore, through the central decorative element 8, the thin speaker 1 of the present invention can not only prevent foreign matter from flowing into the interior, but also prevent the internal parts of the thin speaker 1 of the present invention from being exposed, thereby improving the design. In addition, the thin speaker 1 of the present invention can minimize the exposed area of ​​the centering support 6 through the central decorative element 8, thereby preventing damage to parts such as the centering support 6 due to exposure. The central piece 34 (shown in the figure) can be arranged on the lower side of the central decorative element 8. Figure 4 (In the middle). Therefore, with the height direction (Z-axis direction) as a reference, the center piece 34 can be disposed between the center decorative piece 8 and the pole piece 33. At this time, the center decorative piece 8 can be supported by the center piece 34 on the lower side of the center decorative piece 8. Therefore, the center decorative piece 8 can be fixedly inserted into the through hole 53 through the center piece 34.

[0053] On the other hand, the outer diaphragm 52 can be formed in the shape of a dome, a flat surface, or a frustum. In this case, the central decorative element 8 can be formed in a dome, a flat surface, or a conical shape corresponding to the shape of the outer diaphragm 52. When the outer diaphragm 52 and the central decorative element 8 are formed in a dome shape, they can be integrally formed in a dome shape as the central decorative element 8 is inserted into the through hole 53. Alternatively, when the outer diaphragm 52 and the central decorative element 8 are formed in a flat surface, they can be integrally formed in a flat surface as the central decorative element 8 is inserted into the through hole 53. Furthermore, when the outer diaphragm 52 is formed in a frustum shape and the central decorative element 8 is formed in a conical shape, they can be integrally formed in a conical shape as the central decorative element 8 is inserted into the through hole 53.

[0054] The outer periphery of the outer diaphragm 52 can be formed into a circular, quadrilateral, or pentagonal or more polygonal shape. In this case, the outer periphery of the through hole 53 can also be formed into a circular, quadrilateral, or pentagonal or more polygonal shape corresponding to the shape of the outer diaphragm 52. Correspondingly, the shape of the central decorative member 8 can also be formed into a circular, quadrilateral, or pentagonal or more polygonal shape. Furthermore, the outer peripheries of the through hole 53 and the central decorative member 8 can also be formed into shapes different from the outer periphery of the outer diaphragm 52. For example, when the outer periphery of the outer diaphragm 52 is circular, the through hole 53 and the central decorative member 8 can be formed into quadrilateral or pentagonal or more polygonal shapes.

[0055] In the thin loudspeaker 1 of the present invention, the centering support 6 can be connected to both the outer diaphragm 52 and the central decorative member 8. That is, one side of the centering support 6 can be connected to the central decorative member 8, and the other side can be connected to the outer diaphragm 52. Therefore, in the thin loudspeaker 1 of the present invention, the vibration of the outer diaphragm 52 can be transmitted to the central decorative member 8 through the centering support 6. Thus, in the thin loudspeaker 1 of the present invention, the centering support 6 can buffer the vibration of the outer diaphragm 52.

[0056] The present invention described above is not limited to the embodiments and drawings described above. Those skilled in the art can make various substitutions, modifications and alterations without departing from the technical concept of the present invention.

[0057] Implementation

[0058] For various embodiments of this invention, please refer to the above.

[0059] Industrial applicability

[0060] This invention can be applied, for example, to loudspeakers, and therefore has industrial applicability.

Claims

1. A thin loudspeaker, characterized in that, include: frame; A magnetic circuit section, attached to the frame, is used to form a magnetic circuit; A voice coil is disposed on the magnetic circuit; The vibrating part vibrates along with the voice coil; as well as A centering support, disposed on the inner side of the vibrating part, is used to buffer vibration. The vibrating part includes: The internal diaphragm is connected to the voice coil; as well as An external diaphragm is disposed on the upper side of the internal diaphragm.

2. The thin loudspeaker according to claim 1, characterized in that, The thin loudspeaker includes a surround for cushioning the vibration of the vibrating part. The centering support is connected to the external diaphragm on the inner side of the vibrating part. The folded ring is connected to the inner diaphragm on the outside of the vibrating part.

3. The thin loudspeaker according to claim 1, characterized in that, The magnetic circuit section includes: a magnet for generating a magnetic field; a pole piece disposed above the magnet; and a center piece disposed above the pole piece. The central plate is disposed on the upper part of the magnetic circuit section to prevent leakage of magnetic flux at the upper end of the magnetic circuit section.

4. The thin loudspeaker according to claim 1, characterized in that, The vibrating part includes a through hole penetrating the center of the outer diaphragm. The thin speaker includes a central decorative element inserted into the through-hole.

5. The thin loudspeaker according to claim 1, characterized in that, The thin loudspeaker includes a central decorative element inserted into a through-hole disposed inside the outer diaphragm. The magnetic circuit section includes a central plate disposed on the upper part of the magnetic circuit section. The central piece is disposed on the lower side of the central decorative element and is used to support the central decorative element.

6. The thin loudspeaker according to claim 1, characterized in that, The thin loudspeaker includes a central decorative element inserted into a through-hole disposed inside the outer diaphragm. The centering support is connected to the external diaphragm and the central decorative element, respectively.

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