Pin welding equipment for LED chip production
Through mechanical linkage driven by a servo motor, the lifting, protection, and clamping actions of the LED chip production equipment are realized synchronously, solving the problems of complex equipment structure and chip damage, and achieving efficient and safe pin soldering.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- XIANGNENG HUALEI OPTOELECTRONICS
- Filing Date
- 2026-02-10
- Publication Date
- 2026-04-21
AI Technical Summary
In existing LED chip production equipment, the independent actuators result in complex equipment structures, large space occupation, and a disconnect between flexible clamping and lifting, protection, and other actions, which increases the probability of chip damage and operation time.
A single servo motor is used to synchronously drive lifting, protection, and clamping actions through pure mechanical linkage of bevel gear pairs, screws, elliptical plates, and trapezoidal plates. Soft clamping is achieved by using buffered pre-tightening force to avoid chip damage.
It achieves a compact equipment structure, reduces electrical complexity and cost, improves production efficiency, and reduces the probability of chip damage, making it particularly suitable for handling brittle semiconductor materials.
Smart Images
Figure CN121892783A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of LED chip manufacturing technology, and in particular to a pin bonding device for LED chip manufacturing. Background Technology
[0002] The core structure of an LED chip is a PN junction composed of P-type and N-type semiconductors. The quality of its pin soldering directly determines the optoelectronic characteristics and long-term reliability of the device. In existing LED chip pin soldering equipment, achieving precise positioning of the PCB carrier board, dynamic protection of the soldering area, and stable clamping of the chip often relies on multiple independent drive units and control modules.
[0003] The independent control of multiple actuators during LED chip production pin soldering results in complex equipment structures and large space requirements. This not only increases manufacturing costs but also reduces the overall reliability of the system. Failures of precision components such as servo motors, such as improper bearing fit or poor lubrication, are more likely to occur in complex systems, affecting the continuous operation of the production line. Secondly, the timing coordination of various functional actions (such as lifting, opening the cover, and clamping) depends on the precise coordination of external sensor signals and electronic control programs, which poses a risk of response delay and synchronization error. Independent mechanisms designed to achieve flexible clamping are often disconnected from lifting, protection, and other actions, failing to form an integrated working logic. This not only prolongs the auxiliary time of a single operation but also increases the probability of chip damage caused by multiple positioning and contact. Summary of the Invention
[0004] This invention discloses a pin welding device for LED chip production, which aims to solve the technical problem that the independent mechanisms designed to achieve flexible clamping in the background technology are often disconnected from lifting, protection and other actions, and cannot form an integrated working logic. This not only prolongs the auxiliary time of a single operation, but also increases the probability of chip damage caused by multiple positioning and contact.
[0005] This invention proposes a pin bonding device for LED chip production, comprising a base plate, with support feet fixedly connected to the four corners of the top outer wall of the base plate, a bonding frame fixedly connected to the top outer wall of the support feet, slide rails provided on both sides of the top outer wall of the bonding frame, sliding rods slidably connected to the inner walls of the slide rails, a positioning protective cover fixedly connected to the top outer wall of the sliding rods, and an arc-shaped plate fixedly connected to the bottom outer wall of the sliding rods. A bracket is fixedly connected to the top outer wall of the base plate, a servo motor is mounted on one side outer wall of the bracket, and a drive rod is connected to one end of the output shaft of the servo motor via a coupling. A screw is rotatably mounted on the bottom inner wall of the bonding frame, and a bonding groove is formed on the top outer wall of the bonding frame. The inner wall of the PCB board body is slidably connected to the PCB board body. Pressing plates are fixedly connected to the four corners of the top outer wall of the PCB board body. Rectangular grooves are opened on both outer walls of the positioning protective cover. A trapezoidal plate is slidably connected to one inner wall of the rectangular groove. A fixed crossbar is fixedly connected to the other inner wall of the rectangular groove. Circular holes are opened on both outer walls of the fixed crossbar. A support rod is slidably connected to the inner wall of the circular hole. A positioning plate is fixedly connected to one outer wall of the support rod. A slider is fixedly connected to the bottom outer wall of the screw. An elliptical plate is rotatably set on the bottom outer wall of the welding frame. A fan-shaped groove is opened on the top outer wall of the elliptical plate. A bevel gear one is fixedly connected to one outer wall of the drive rod. A bevel gear two is fixedly connected to the bottom outer wall of the screw.
[0006] In a preferred embodiment, a positioning clamping pad is fixedly connected to one side of the outer wall of the bottom of the positioning plate, the trapezoidal plate is arranged in a right-angled trapezoidal shape, and one side of the outer wall of the trapezoidal plate is provided with an inclined end, and the pressing plate is adapted to the position of the trapezoidal plate.
[0007] In a preferred embodiment, the positioning clamping pad is adapted to the size of the PCB board body, the outer wall of the support rod is fitted with a second spring, the two ends of the second spring are respectively fixedly connected to the outer wall of the trapezoidal plate and the fixed crossbar, and the slider is slidably connected to the inner wall of the fan-shaped groove.
[0008] In a preferred embodiment, mounting blocks are fixedly connected to the four corners of the outer wall of the top of the welding frame, a telescopic inner rod is fixedly connected to one side of the outer wall of the mounting blocks, circular grooves are provided on both sides of the outer wall of the positioning protective cover, one end of the piston rod of the telescopic inner rod is fixedly connected to the inner wall of the circular groove, and a spring is sleeved on the outer wall of the telescopic inner rod.
[0009] In a preferred embodiment, the two ends of the spring are fixedly connected to the mounting block and the inner wall of the circular groove, respectively, and a sleeve is fixedly connected to the bottom outer wall of the welding frame, the sleeve being connected to the screw rod by threads.
[0010] In a preferred embodiment, support telescopic rods are fixedly connected to the four corners of the bottom outer wall of the PCB board body, one end of the piston rod of the support telescopic rod is fixedly connected to the inner wall of the welding groove, and reinforcing rods are fixedly connected to the two outer walls of the bracket, and the reinforcing rods are fixedly connected to the outer wall of the device base plate.
[0011] In a preferred embodiment, the first bevel gear and the second bevel gear mesh, the arc-shaped plate is slidably connected to the outer wall of the bottom end of the welding frame, and the arc-shaped plate is abutting against the outer wall of the elliptical plate.
[0012] In a preferred embodiment, a positioning welding hole is provided on one outer wall of the positioning protective cover. The positioning welding hole is adapted to the size of the LED chip body and the size of the PCB board body.
[0013] In a preferred embodiment, mounting grooves are provided at the four corners of the outer wall of the top of the device base plate, and an end mounting seat is fixedly connected to the inner wall of the mounting groove, and a guide rod is fixedly connected to the outer wall of the top of the end mounting seat.
[0014] In a preferred embodiment, a capping block is fixedly connected to the top outer wall of the guide rod, and slots are provided on both outer walls of the positioning protective cover. The slots are connected to the circular grooves, and the size of the mounting block is adapted to the slots.
[0015] As can be seen from the above, the LED chip production pin welding equipment provided by this invention avoids the risk of interference or contamination that may be caused by prematurely opening the protective cover before positioning is completed. This makes the equipment's workflow more ergonomic and safety compliant. Using only one servo motor, through pure mechanical linkage such as bevel gear pairs, screws, elliptical plates, and trapezoidal plates, it synchronously drives the three key actions of lifting, protection, and clamping. The structure is compact, greatly saving internal space and reducing the electrical complexity and cost brought about by multi-axis control. The positioning protective cover closes during non-operation periods, forming a local protective environment. The driven clamping mechanism provides a buffered preload, which can reliably fix the tiny LED chips and completely avoid chip cracks or electrode damage that may be caused by traditional rigid clamps. It is particularly suitable for the processing of brittle semiconductor materials. Attached Figure Description
[0016] Figure 1 This is a schematic diagram of the overall structure of a lead bonding device for LED chip production proposed in this invention; Figure 2 This is a schematic diagram of the bottom structure of the welding frame of the LED chip manufacturing pin welding equipment proposed in this invention; Figure 3 This is a schematic diagram of the top structure of the welding frame of a lead welding device for LED chip production proposed in this invention; Figure 4 This is a schematic diagram of the PCB board structure of a pin welding device for LED chip production proposed in this invention. Figure 5 This is a schematic diagram of an elliptical plate structure for a lead bonding device for LED chip production proposed in this invention. Figure 6 This is a schematic diagram of the top structure of the positioning protective cover of a pin welding equipment for LED chip production proposed in this invention; Figure 7 This is a schematic diagram of the top structure of the positioning protective cover of a pin welding equipment for LED chip production proposed in this invention; Figure 8 This is an exploded view of the trapezoidal plate connection structure of a pin welding device for LED chip production proposed in this invention.
[0017] In the diagram: 1. Device base plate; 2. Guide rod; 3. Welding frame; 4. Positioning protective cover; 5. Mounting fixing block; 6. PCB board body; 7. Positioning welding hole; 8. Arc plate; 9. Bracket; 10. Servo motor; 11. Slide rail; 12. Elliptical plate; 13. Drive rod; 14. Bevel gear one; 15. Bevel gear two; 16. Spring one; 17. Trapezoidal plate; 18. Pressing plate; 19. Spring two; 20. Fixed crossbar; 21. Support telescopic rod; 22. Screw; 23. Sleeve; 24. Sliding rod; 25. Sector groove; 26. Slider; 27. Positioning plate; 28. Telescopic inner rod; 29. Positioning clamping pad; 30. Slanted end; 31. Top block; 32. End mounting seat; 33. Support foot. Detailed Implementation
[0018] The technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments.
[0019] The LED chip production pin welding equipment disclosed in this invention is mainly used in independent mechanisms designed to achieve flexible clamping. It is often disconnected from lifting, protection and other actions, and cannot form an integrated working logic. This not only prolongs the auxiliary time of a single operation, but also increases the probability of chip damage due to multiple positioning and contact.
[0020] Reference Figures 1-8A pin welding device for LED chip production includes a base plate 1. The base plate 1 has four support feet 33 fixedly connected to its top outer wall. A welding frame 3 is fixedly connected to the top outer wall of each support foot 33. Slide rails 11 are provided on both sides of the top outer wall of the welding frame 3. A sliding rod 24 is slidably connected to the inner wall of each slide rail 11. A positioning protective cover 4 is fixedly connected to the top outer wall of the sliding rod 24. An arc-shaped plate 8 is fixedly connected to the bottom outer wall of the sliding rod 24. A bracket 9 is fixedly connected to the top outer wall of the base plate 1. A servo motor 10 is mounted on one side outer wall of the bracket 9. One end of the output shaft of the servo motor 10 is connected to a drive rod 13 via a coupling. A screw 22 is rotatably provided on the bottom inner wall of the welding frame 3. A welding groove is formed on the top outer wall of the welding frame 3. The inner wall of the slot is slidably connected to the PCB board body 6. The four corners of the top outer wall of the PCB board body 6 are fixedly connected to the pressing plate 18. The outer walls of the positioning protective cover 4 are provided with rectangular slots. The inner wall of one side of the rectangular slot is slidably connected to the trapezoidal plate 17. The inner wall of the other side of the rectangular slot is fixedly connected to the fixing crossbar 20. The outer walls of the two sides of the fixing crossbar 20 are provided with circular holes. The inner walls of the circular holes are slidably connected to the support rod. The outer wall of one side of the support rod is fixedly connected to the positioning plate 27. The bottom outer wall of the screw 22 is fixedly connected to the slider 26. The bottom outer wall of the welding frame 3 is rotatably provided with an elliptical plate 12. The top outer wall of the elliptical plate 12 is provided with a fan-shaped slot 25. The outer wall of one side of the drive rod 13 is fixedly connected to the bevel gear 14. The bottom outer wall of the screw 22 is fixedly connected to the bevel gear 25.
[0021] Reference Figure 6 , Figure 7 and Figure 8 In a preferred embodiment, a component includes: a positioning clamping pad 29 fixedly connected to one side outer wall of the bottom of the positioning plate 27; a trapezoidal plate 17 arranged in a right-angled trapezoidal shape; a slanted end 30 provided on one side outer wall of the trapezoidal plate 17; and a pressing plate 18 adapted to the position of the trapezoidal plate 17.
[0022] Reference Figure 6 , Figure 7 and Figure 8 In a preferred embodiment, a component includes: a positioning clamping pad 29 adapted to the size of the PCB board body 6; a spring 19 sleeved on the outer wall of the support rod; the two ends of the spring 19 being fixedly connected to the outer wall of the trapezoidal plate 17 and the fixed crossbar 20, respectively; and a slider 26 slidably connected to the inner wall of the fan-shaped groove 25.
[0023] Reference Figure 3 , Figure 4 and Figure 6In a preferred embodiment, a component includes: mounting blocks 5 are fixedly connected to the four corners of the outer wall of the top of the welding frame 3; a telescopic inner rod 28 is fixedly connected to one side of the outer wall of the mounting blocks 5; circular grooves are provided on both sides of the outer wall of the positioning protective cover 4; one end of the piston rod of the telescopic inner rod 28 is fixedly connected to the inner wall of the circular groove; and a spring 16 is sleeved on the outer wall of the telescopic inner rod 28.
[0024] Specifically, after the equipment starts, the servo motor 10 rotates precisely according to the control signal, and its output shaft drives the drive rod 13, which is fixed to it, to rotate synchronously. The bevel gear 14 installed at the end of the drive rod 13 meshes with the bevel gear 15 at the top of the vertically set screw 22. This structure converts the horizontal rotational motion output by the servo motor 10 into the vertical rotational motion of the screw 22 around its axis. When the screw 22 rotates, the sleeve 23, which forms a helical pair with it, generates axial displacement under the drive of the thread. The PCB board body 6 is fixedly connected to the sleeve 23 through a rigid connecting arm, thereby realizing... The PCB board body 6, which carries the LED chips to be soldered, features high-precision, programmable lifting and positioning in the Z-axis direction. This lifting motion is fundamental for chip replacement, alignment, and soldering. A key design feature is the inclusion of a slider 26 fixed to the screw 22. This slider is embedded in the fan-shaped groove 25 of the elliptical plate 12. During the initial rotation of the screw 22, the slider 26 slides within the idle stroke of the fan-shaped groove 25, at which point the elliptical plate 12 remains stationary. This means that the PCB board body 6 can undergo minor height adjustments, such as for PCBs of different thicknesses or for focusing, without affecting the protective state of the working area. When the work area needs to be opened for welding or maintenance, the PCB board body 6 needs to be lowered significantly. At this time, the slider 26 moves to the drive section of the fan-shaped slot 25 and begins to push the elliptical plate 12 to rotate around its axis. The special contour of the elliptical plate 12 then presses against the symmetrically distributed arc plates 8 on both sides, causing the two positioning protective covers 4 to slide open synchronously and smoothly to both sides along the guide rail 11, exposing the welding station. A pressing plate 18 is provided on the PCB board body 6. When the PCB board body 6 is lowered to the working position, such as the welding or inspection position, the pressing plate 18 and a trapezoidal plate 17 are inclined. Once the surface is out of contact and the pressure is released, the trapezoidal plate 17 moves horizontally under the action of the built-in reset spring 19, which in turn pushes the pair of positioning plates 27 hinged to it to retract towards the center. The positioning clamping pads 29 on the inner side of the positioning plates 27 then gently clamp the chip body from both sides with a gentle and uniform force, achieving non-rigid fixation and effectively preventing minor displacement during the soldering process. After the process is completed, the servo motor 10 reverses, the PCB board body 6 rises, and the pressing plate 18 presses down on the inclined surface of the trapezoidal plate 17, forcing the positioning plates 27 to open. The chip is quickly and without damage, making it easy for the robot arm to pick up and put down. In specific application scenarios, it is suitable for LED chip packaging production lines with multiple varieties and high mixing. The design of the fan-shaped slot 25 is the core highlight. It avoids the risk of interference or contamination that may be caused by opening the protective cover too early before the positioning is completed. It makes the equipment workflow more in line with ergonomics and safety regulations. Only one servo motor 10 is used to drive the three key actions of lifting, protection and clamping synchronously through pure mechanical linkage such as bevel gear pair, screw 22, elliptical plate 12 and trapezoidal plate 17. The structure is compact, which greatly saves the internal space of the equipment and reduces the electrical complexity and cost brought about by multi-axis control. The positioning protective cover 4 closes during non-operation periods to form a local protective environment. The driven clamping mechanism provides a buffered pre-tightening force, which can reliably fix the tiny LED chips and completely avoid chip cracks or electrode damage that may be caused by traditional rigid clamps. It is particularly suitable for the processing of brittle semiconductor materials.
[0025] Reference Figure 4 , Figure 5 and Figure 6 In a preferred embodiment, a component includes: two ends of a spring-16 are fixedly connected to the mounting block 5 and the inner wall of the circular groove, respectively; a sleeve 23 is fixedly connected to the outer wall of the bottom end of the welding frame 3; and the sleeve 23 is connected to the screw 22 by threads.
[0026] Reference Figure 2 and Figure 4 In a preferred embodiment, a component includes: a support telescopic rod 21 fixedly connected to the four corners of the bottom outer wall of the PCB board body 6, one end of the piston rod of the support telescopic rod 21 fixedly connected to the inner wall of the welding groove, and a reinforcing rod fixedly connected to the two outer walls of the bracket 9, the reinforcing rod being fixedly connected to the outer wall of the device base plate 1.
[0027] Reference Figure 2 and Figure 5 In a preferred embodiment, a component includes: bevel gear 14 and bevel gear 2 15 meshing with each other, an arc plate 8 slidably connected to the outer wall of the bottom end of the welding frame 3, and an arc plate 8 abutting against the outer wall of the elliptical plate 12.
[0028] Reference Figure 1 , Figure 3 and Figure 4In a preferred embodiment, a component includes: a positioning welding hole 7 is provided on one outer wall of the positioning protective cover 4, the positioning welding hole 7 is adapted to the size of the LED chip body, the positioning welding hole 7 is adapted to the size of the PCB board body 6, mounting grooves are provided at the four corners of the top outer wall of the device base plate 1, an end mounting seat 32 is fixedly connected to the inner wall of the mounting groove, a guide rod 2 is fixedly connected to the top outer wall of the end mounting seat 32, a capping block 31 is fixedly connected to the top outer wall of the guide rod 2, and slots are provided on both outer walls of the positioning protective cover 4, the slots are connected to the circular grooves, and the mounting fixing block 5 is adapted to the size of the slots.
[0029] Specifically, vertical guide rods 2 are fixedly installed at the four corners of the device base plate 1 via end mounting seats 32, and their tops are limited by capping blocks 31, forming a sturdy three-dimensional frame. Support telescopic rods 21 are specially set at the four corners of the bottom of the PCB board body 6, and their piston rods are fixed to the inner wall of the welding groove, providing auxiliary support and buffering during the lifting process, further suppressing the lateral displacement of the PCB board. In addition, the bracket 9 is rigidly connected to the device base plate 1 through the reinforcing rods on both sides, enhancing the torsional rigidity of the overall structure. In the positioning and clamping module, spring 16 is precisely installed between the mounting fixing block 5 and the inner wall of the circular groove of the positioning protective cover 4, providing a stable reset elastic force for the clamping action. At the same time, the slots opened on the side wall of the positioning protective cover 4 are precisely matched with the mounting fixing block 5, realizing the precise sliding and limiting of the moving parts. Finally, the positioning welding holes 7 opened on the positioning protective cover 4 are strictly matched with the LED chip body and the PCB board body 6, providing the ultimate physical positioning reference for the chip. In specific application scenarios, it effectively eliminates the minute vibrations and deformations of the equipment when it is running at high speed and under stress, ensuring the trajectory accuracy of the PCB board lifting and the welding head movement. This is the foundation for achieving micron-level welding. The precise installation of spring-16 and the precise cooperation between the slot and the mounting block 5 ensure that the separation and closing action of the positioning protective cover 4 can be accurately reset to the same position every time. Combined with the positioning welding hole 7 that is strictly adapted to the chip size, it realizes the precise and repeatable physical limit of the chip, which greatly reduces the welding defect rate caused by positioning error.
[0030] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.
Claims
1. A pin bonding device for LED chip production, comprising a device base plate (1), characterized in that, Support feet (33) are fixedly connected to the four corners of the top outer wall of the device base plate (1). A welding frame (3) is fixedly connected to the top outer wall of the support feet (33). Slide rails (11) are provided on both sides of the top outer wall of the welding frame (3). A sliding rod (24) is slidably connected to the inner wall of the slide rail (11). A positioning protective cover (4) is fixedly connected to the top outer wall of the sliding rod (24). An arc plate (8) is fixedly connected to the bottom outer wall of the sliding rod (24). A bracket (9) is fixedly connected to the top outer wall of the device base plate (1). A servo motor (10) is installed on one side outer wall of the bracket (9). One end of the output shaft of the servo motor (10) is connected to a drive rod (13) through a coupling. A screw (22) is rotatably provided on the bottom inner wall of the welding frame (3). A welding groove is opened on the top outer wall of the welding frame (3). A PCB board is slidably connected to the inner wall of the welding groove. The main body (6) has pressing plates (18) fixedly connected to the four corners of the top outer wall of the PCB board main body (6). The outer walls of the positioning protective cover (4) are provided with rectangular grooves. A trapezoidal plate (17) is slidably connected to the inner wall of one side of the rectangular groove. A fixed crossbar (20) is fixedly connected to the inner wall of the other side of the rectangular groove. Circular holes are provided on the outer walls of both sides of the fixed crossbar (20). A support rod is slidably connected to the inner wall of the circular hole. A positioning plate (27) is fixedly connected to the outer wall of one side of the support rod. A slider (26) is fixedly connected to the bottom outer wall of the screw (22). An elliptical plate (12) is rotatably provided on the bottom outer wall of the welding frame (3). A fan-shaped groove (25) is provided on the top outer wall of the elliptical plate (12). A bevel gear one (14) is fixedly connected to the outer wall of one side of the drive rod (13). A bevel gear two (15) is fixedly connected to the bottom outer wall of the screw (22).
2. The lead bonding equipment for LED chip production according to claim 1, characterized in that, A positioning clamping pad (29) is fixedly connected to one side of the bottom outer wall of the positioning plate (27). The trapezoidal plate (17) is set in a right-angled trapezoidal shape. A slanted end (30) is set on one side of the outer wall of the trapezoidal plate (17). The pressing plate (18) is adapted to the position of the trapezoidal plate (17).
3. The lead bonding equipment for LED chip production according to claim 2, characterized in that, The positioning clamping pad (29) is adapted to the size of the PCB board body (6). The outer wall of the support rod is fitted with a spring two (19). The two ends of the spring two (19) are respectively fixedly connected to the outer wall of the trapezoidal plate (17) and the fixed crossbar (20). The slider (26) is slidably connected to the inner wall of the fan-shaped groove (25).
4. The lead bonding equipment for LED chip production according to claim 1, characterized in that, The welding frame (3) has four fixed mounting blocks (5) at the four corners of the top outer wall. The mounting blocks (5) have a telescopic inner rod (28) fixedly connected to one side outer wall. The positioning protective cover (4) has circular grooves on both sides of its outer wall. One end of the piston rod of the telescopic inner rod (28) is fixedly connected to the inner wall of the circular groove. The outer wall of the telescopic inner rod (28) is fitted with a spring (16).
5. The lead bonding equipment for LED chip production according to claim 4, characterized in that, The two ends of the spring (16) are fixedly connected to the mounting block (5) and the inner wall of the circular groove, respectively. The bottom outer wall of the welding frame (3) is fixedly connected to the sleeve (23), and the sleeve (23) is connected to the screw (22) by threads.
6. The lead bonding equipment for LED chip production according to claim 1, characterized in that, Supporting telescopic rods (21) are fixedly connected to the four corners of the bottom outer wall of the PCB board body (6). One end of the piston rod of the supporting telescopic rod (21) is fixedly connected to the inner wall of the welding groove. Reinforcing rods are fixedly connected to the outer walls of both sides of the bracket (9). The reinforcing rods are fixedly connected to the outer wall of the device base plate (1).
7. The lead bonding equipment for LED chip production according to claim 1, characterized in that, The first bevel gear (14) and the second bevel gear (15) mesh with each other, the arc plate (8) is slidably connected to the outer wall of the bottom end of the welding frame (3), and the arc plate (8) is abutted against the outer wall of the elliptical plate (12).
8. The lead bonding equipment for LED chip production according to claim 1, characterized in that, The positioning protective cover (4) has a positioning welding hole (7) on one side of its outer wall. The positioning welding hole (7) is adapted to the size of the LED chip body and the size of the PCB board body (6).
9. The lead bonding equipment for LED chip production according to claim 4, characterized in that, The device base plate (1) has four corners of the top outer wall with mounting grooves. The inner wall of the mounting groove is fixedly connected to the end mounting seat (32), and the top outer wall of the end mounting seat (32) is fixedly connected to the guide rod (2).
10. The lead bonding equipment for LED chip production according to claim 9, characterized in that, The top outer wall of the guide rod (2) is fixedly connected to a capping block (31), and the outer walls of the positioning protective cover (4) are provided with slots. The slots are connected to the circular grooves, and the size of the mounting block (5) is adapted to the slots.