Self-adaptive hot pressing system based on multi-physical field perception

Abstract

The invention particularly relates to a self-adaptive hot pressing system based on multi-physics field perception. Specifically, the top face of the bottom plate is connected to the bottom face of the middle plate based on a piezoelectric brake, and a distance measuring sensing probe is arranged on the periphery of the bottom face of the bottom plate. And during hot-pressing critical contact, according to the parallelism of the to-be-paired bonding plate group, the distance measurement sensing probe timely triggers the hot-pressing process controller to timely adjust the extension and retraction of the piezoelectric brake, and the bottom plate is driven to be hot-pressed on the to-be-paired bonding plate group in parallel, so that the hot-pressing bonding quality is ensured. A pressure-temperature sensing array plate is fixedly adhered to the center of the bottom surface of the bottom plate, during hot-pressing force application, the pressure-temperature sensing array plate acquires pressure and temperature characteristic data in real time, and the multi-physics field acquisition-analysis module receives the characteristic data in real time to perform hot-pressing adhesion primary quality inspection; and on the basis of a pre-constructed model, hot-pressing bonding secondary quality inspection is carried out in combination with the characteristic data, and a hot-pressing process controller is timely triggered to timely adjust hot-pressing parameters, so that the hot-pressing bonding quality is further ensured.

Description

Technical Field

[0001] This invention relates to the field of intelligent hot pressing control technology, and in particular to an adaptive hot pressing system based on multi-physics sensing. Background Technology

[0002] In the production of composite surface light sources for refrigerator air ducts, the sealing reliability and bonding strength of both the diffuser plate and the air duct plate are crucial. However, existing hot-pressing processes for bonding the diffuser plate and air duct plate often present the following problems: 1) Currently, the parallelism adjustment of the hot-pressing body is generally achieved by periodically performing static adjustments based on the pressure-sensitive paper. However, during the hot-pressing bonding process, the parallelism of the hot-pressing body may shift due to the vibration of the equipment. In addition, one or more components in the diffuser plate and air duct plate may have unevenness or slight tilting. Consequently, whether the parallelism of the hot-pressing body itself shifts or the diffuser plate and air duct plate have unevenness or slight tilting, it will make it difficult for the hot-pressing equipment to perform isobaric hot pressing, resulting in unsatisfactory quality of the hot-pressed bonded product. 2) Currently, quality inspection of hot-press bonding of diffuser plates and air ducts typically relies on offline destructive tensile testing or manual microscopic inspection. When conducting hot-press bonding quality inspection using these methods, several issues arise: For the hot-pressed bonded product to be inspected, there is a waiting period from removal from the hot-pressing equipment to obtaining the inspection results; due to the rapid assembly line hot-pressing process, many hot-press bonding operations are often completed while waiting for the inspection results; once an abnormality is detected during quality inspection, numerous hot-press bonding abnormalities have already occurred; in other words, quality inspection lags significantly behind hot-press bonding. To address the aforementioned technical issues, there is an urgent need to propose an adaptive hot pressing system based on multi-physics sensing. Summary of the Invention

[0003] In view of the above-mentioned shortcomings and deficiencies of the prior art, the present invention provides an adaptive hot pressing system based on multi-physics field sensing, which solves the problem of "how to achieve real-time parallel hot pressing bonding of the diffuser plate and the air duct plate, while performing real-time hot pressing bonding quality inspection and timely rapid hot pressing bonding adjustment of the diffuser plate and the air duct plate to ensure the hot pressing bonding quality of the diffuser plate and the air duct plate" when hot pressing bonding the diffuser plate and the air duct plate.

[0004] To achieve the above objectives, the main technical solutions adopted by the present invention include: This invention provides an adaptive hot-pressing system based on multi-physics sensing. The hot-pressing system is used for hot-pressing composite bonding of refrigerator air duct plates and diffuser plates. The hot-pressing system includes: an adaptive hot-pressing component, a multi-physics acquisition and analysis module, and a hot-pressing process controller. The adaptive hot pressing assembly includes: a hot pressing body and a hot pressing operating table mounted directly below the hot pressing body; the hot pressing operating table is used to place the bonding plates to be paired; the hot pressing process controller drives the hot pressing body to move in the vertical direction to apply hot pressing force to the bonding plates to be paired. The hot-pressing body includes an intermediate plate and a bottom plate; the top surface of the bottom plate is connected to the bottom surface of the intermediate plate based on N piezoelectric actuators; M ranging sensor probes are arranged around the bottom surface of the bottom plate; a pressure-temperature sensor array plate is fixedly bonded to the center of the bottom surface of the bottom plate; M and N are integers and N≥3, M≥4; The ranging sensor probe is used to trigger the hot pressing process controller to adjust the extension and retraction of the piezoelectric brake in a timely manner when the hot pressing is at the critical contact, so as to drive the base plate to make parallel contact with the bonding plate assembly to be paired. The pressure-temperature sensor array is used to collect characteristic data involving pressure and temperature distribution in real time during hot pressing. The multiphysics acquisition and analysis module is used to receive the acquired feature data in real time during hot pressing; and based on the pre-built model, it combines the feature data to judge hot pressing anomalies; and based on the judgment results, it triggers the hot pressing parameters of the hot pressing process controller to adjust them in a timely manner.

[0005] Optionally, signal communication and electrical connections are established between the adaptive hot pressing assembly, the multiphysics acquisition-analysis module, and the hot pressing process controller.

[0006] Optionally, the mating adhesive panel assembly includes: refrigerator air duct panel and diffuser panel that need to be hot-pressed for composite bonding.

[0007] Optionally, the adaptive hot press assembly also includes: a base, and a vertical drive shaft fixed to the top surface of the base; the hot press operating table is fixed to the top surface of the base; One end of the hot press body is horizontally connected to an adjustable movable end; the vertical drive shaft has a vertically oriented drive slide; the adjustable movable end is nested outside the vertical drive shaft based on the limit of the drive slide.

[0008] Optionally, the hot press body also includes a top plate; one end of the adjustable movable end is fixedly connected to one side of the top plate; the bottom surface of the top plate is connected to the top surface of the intermediate plate based on the drive rod.

[0009] Optionally, when the hot-pressed body descends vertically, any ranging sensor probe begins to detect the distance between its lower surface and the top surface of the bonding plate assembly to be paired. The critical contact state of hot pressing is: when performing a single hot pressing composite bonding, the distance between the lower surface of any ranging sensor probe and the top surface of the bonding plate group to be paired is equal to 2mm.

[0010] Optionally, after entering the critical contact state of hot pressing, if the distances detected by any two ranging sensor probes are different, within 50ms, the difference in the amount of expansion and contraction between different ranging sensor probes is controlled based on the hot pressing process controller until the base plate is parallel to the bonding plate group to be paired.

[0011] Optionally, based on real-time feature data, the multi-physics acquisition-analysis module constructs pressure and temperature distribution cloud maps and calculates the standard deviation of pressure distribution; In conjunction with pressure and temperature distribution cloud maps and pressure distribution standard deviation, a preliminary quality inspection of the current hot-pressed composite bonding is conducted.

[0012] Optionally, pressure feature vectors can be extracted by the multiphysics acquisition-analysis module based on real-time feature data; The pressure feature vector is used as the input of the CNN deep learning model to output the evaluation parameter values ​​corresponding to the current hot-pressed composite bonding, and a secondary quality inspection is carried out on the current hot-pressed composite bonding. If the evaluation parameter value exceeds the threshold, the hot pressing process controller will be immediately triggered to modify the hot pressing parameters.

[0013] Optionally, the pressure feature vector includes: pressure peak distribution, pressure holding integral area, and maximum downward pressure. Evaluation parameters include: predicted adhesive tensile strength and seal confidence level; Hot pressing parameters include: duration of single hot pressing application and hot pressing temperature.

[0014] The beneficial effects of this application are as follows: In this application, the top surface of the base plate is connected to the bottom surface of the intermediate plate based on multiple piezoelectric actuators, and multiple distance sensing probes are arranged around the bottom surface of the base plate. Based on this, when the hot pressing is critical, according to the real-time parallelism of the bonding plates to be paired, the distance sensing probes trigger the hot pressing process controller to adjust the extension and retraction of the piezoelectric actuators in a timely manner, driving the base plate to be hot pressed parallel to the bonding plates to be paired, so as to ensure the hot pressing bonding quality of the diffuser plate and the air duct plate. In this application, a pressure-temperature sensor array plate is fixedly bonded to the center of the bottom surface of the base plate. During hot pressing, the pressure-temperature sensor array plate collects pressure and temperature characteristic data in real time. At the same time, the multiphysics acquisition-analysis module receives the collected characteristic data in real time to perform primary quality inspection of hot pressing bonding. Based on the pre-built model, combined with the characteristic data, a secondary quality inspection of hot pressing bonding is performed. Based on the results of the secondary quality inspection, the hot pressing process controller is triggered in a timely manner to adjust the hot pressing parameters in a timely manner to further ensure the hot pressing bonding quality of the diffuser plate and the air duct plate. Attached Figure Description

[0015] Figure 1 This is a schematic diagram of the overall structure of a hot pressing system according to an embodiment of the present invention; Figure 2 This is a schematic diagram of a hot-pressing main body structure provided in one embodiment of the present invention; Figure 3 This is a schematic diagram of a piezoelectric brake assembly according to an embodiment of the present invention; Figure 4 This is a schematic diagram of the assembly of a ranging sensor probe according to an embodiment of the present invention; The foregoing Figures 1 to 4 The corresponding component designations include: 1. Adaptive hot pressing assembly; 1-1. Hot pressing body; 1-1-1. Top plate; 1-1-2. Middle plate; 1-1-3. Bottom plate; 1-1-4. Drive rod; 1-1-5. Piezoelectric brake; 1-1-6. Distance sensing probe; 1-1-7. Hot pressing plate; 1-1-8. Pressure-temperature sensor array plate; 1-2. Base; Vertical 1-3. Drive shaft; 1-4. Hot pressing operating table; 1-5. Adjustable movable end; 1-6. Drive slide; 2. Physical field acquisition and analysis module; 3. Hot pressing process controller. Detailed Implementation

[0016] To better explain and facilitate understanding of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments.

[0017] To better understand the above technical solutions, exemplary embodiments of the present invention will be described in more detail below with reference to the accompanying drawings. Although exemplary embodiments of the present invention are shown in the drawings, it should be understood that the present invention can be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that the present invention can be understood more clearly and thoroughly, and that the scope of the present invention can be fully conveyed to those skilled in the art.

[0018] Example 1

[0019] This embodiment proposes an adaptive hot-pressing system based on multi-physics field sensing. It should be noted that the hot-pressing system is specifically used for hot-pressing composite bonding of refrigerator air duct plate and diffuser plate. Figure 1 This is a schematic diagram of the overall structure of the hot pressing system, such as... Figure 1 As shown, the hot pressing system includes: an adaptive hot pressing component 1, a multiphysics acquisition and analysis module 2, and a hot pressing process controller 3; In this embodiment, as Figure 1As shown, a signal communication connection and an electrical connection are established between the adaptive hot pressing component 1, the multiphysics acquisition-analysis module 2, and the hot pressing process controller 3 to achieve the following: the power supply device / grid provides power to the adaptive hot pressing component 1, the multiphysics acquisition-analysis module 2, and the hot pressing process controller 3; the adaptive hot pressing component 1 receives hot pressing drive commands issued by the hot pressing process controller 3 to perform preset hot pressing operations; the multiphysics acquisition-analysis module 2 collects operating condition data characteristics of the adaptive hot pressing component 1 and performs data characteristic analysis; and the hot pressing process controller 3 corrects the issued hot pressing drive commands in a timely manner based on the data characteristic analysis results of the multiphysics acquisition-analysis module 2.

[0020] In this embodiment, the structure of the adaptive hot-pressing assembly 1 should be explained as follows: like Figure 1 As shown, the adaptive hot pressing assembly 1 includes: a hot pressing body 1-1 and a base 1-2; the top surface of the base 1-2 is fixedly equipped with: a vertical drive shaft 1-3 and a hot pressing operating table 1-4; Among them, the hot press operation table 1-4 is used to place the bonding board group to be paired, which includes the refrigerator air duct plate and diffuser plate that need to be hot press composite bonding. like Figure 1 As shown, the vertical drive shaft 1-3 has a vertically oriented drive slide 1-6, and one end of the hot pressing body 1-1 is horizontally connected to an adjustable movable end 1-5. The adjustable movable end 1-5 is nested outside the vertical drive shaft 1-3 based on the drive slide 1-6, and the hot pressing body 1-1 is mounted directly above the hot pressing operating table 1-4 based on the adjustable movable end 1-5. The adaptive hot pressing assembly 1 has a built-in drive motor, and the hot pressing process controller 3, based on the drive motor, drives the hot pressing body 1-1 to reciprocate in the vertical direction to apply hot pressing force to the mating adhesive plate assembly.

[0021] In this embodiment, to further illustrate the hot pressing force applied to the mating adhesive plate assemblies, the structure of the hot pressing body 1-1 is specifically described, including: Figure 2 This is a schematic diagram of the main structure of the hot press, combined with... Figure 1 , Figure 2 The hot-pressing body 1-1 includes a top plate 1-1-1, a middle plate 1-1-2, and a bottom plate 1-1-3; one end of the aforementioned adjustable movable end 1-5 is fixedly connected to one side of the top plate 1-1-1. Furthermore, the bottom surface of the top plate 1-1-1 is connected to the top surface of the middle plate 1-1-2 based on the drive rod 1-1-4; the top surface of the bottom plate 1-1-3 is connected to the bottom surface of the middle plate 1-1-2 based on N piezoelectric actuators 1-1-5; M ranging sensor probes 1-1-6 are arranged around the bottom surface of the bottom plate 1-1-3; a hot press plate 1-1-7 is fixedly bonded to the center of the bottom plate 1-1-3, and a pressure-temperature sensor array plate 1-1-8 is fixedly bonded to the bottom surface of the hot press plate 1-1-7; In this embodiment, preferably, N is an integer and N≥3, M≥4; preferably, the sampling frequency of the ranging sensor probe 1-1-6 is ≥1KHz and the accuracy is ±5μm; preferably, the pressure-temperature sensor array plate 1-1-8 can withstand temperatures exceeding 120 degrees Celsius. In this embodiment, Figure 3 A schematic diagram of the piezoelectric brake assembly is shown below. Figure 3 As shown, an optional piezoelectric brake 1-1-5 assembly method includes: four piezoelectric brakes 1-1-5 arranged side by side are equally spaced and assembled on the bottom surface of the intermediate plate 1-1-2. In this embodiment, Figure 4 A schematic diagram of the ranging sensor probe assembly is shown below. Figure 4 As shown, an optional range sensing probe assembly method includes: four range sensing probes 1-1-6 are respectively arranged at the four corners of the bottom surface of the base plate 1-1-3.

[0022] In this embodiment, when the hot pressing is at critical contact, the ranging sensor probe 1-1-6 timely triggers the hot pressing process controller 3 to adjust the extension and retraction of the piezoelectric brake 1-1-5, driving the pressure-temperature sensor array plate 1-1-8 to make parallel contact with the bonding plate group to be paired. It should be noted that when the hot-press body 1-1 descends vertically, any distance sensing probe 1-1-6 begins to detect the distance between its own lower surface and the top surface of the bonding plate assembly to be paired. It should be noted that the critical contact state of hot pressing is: when performing a single hot pressing composite bonding, the distance between the lower surface of any ranging sensor probe 1-1-6 and the top surface of the bonding plate group to be paired is equal to 2mm. It should be noted that the trigger condition for the timely adjustment of the extension and retraction of the piezoelectric brake 1-1-5 by the hot pressing process controller 3 is: when entering the critical contact state of hot pressing, the situation occurs where "the distance detected by any two distance measuring sensor probes 1-1-6 is different". It should be noted that the method for driving the pressure-temperature sensor array plate 1-1-8 to make parallel contact with the bonding plate group to be paired includes: when the aforementioned "the distance detected by any two ranging sensor probes 1-1-6 is different", within 50ms, the operation of "controlling the difference in the amount of expansion and contraction between different ranging sensor probes 1-1-6 based on the hot pressing process controller 3 until the pressure-temperature sensor array plate 1-1-8 is parallel to the bonding plate group to be paired" is completed. It should be noted that the aforementioned "controlling the difference in extension / retraction between different ranging sensor probes 1-1-6 based on the hot-pressing process controller 3" needs to be implemented using the following method: Based on the distance detected by each ranging sensor probe 1-1-6 between its own lower surface and the top surface of the bonding plate group to be paired, the hot pressing process controller 3 quickly generates a spatial plane equation adapted to the upper surface of the current bonding plate group to be paired; based on the spatial plane equation, it obtains the deviation of the normal vector between the upper surface of the current bonding plate group to be paired and the pressure-temperature sensor array plate 1-1-8; based on the deviation of the normal vector angle, it adjusts the difference in the amount of expansion and contraction between different ranging sensor probes 1-1-6.

[0023] In this embodiment, after the "pressure-temperature sensor array plate 1-1-8 is in parallel contact with the bonding plate group to be paired", the hot pressing process controller 3, based on the drive motor, drives the pressure-temperature sensor array plate 1-1-8 to apply hot pressing force to the bonding plate group to be paired for a preset time. It should be noted that during the aforementioned hot-pressing process, the pressure-temperature sensor array 1-1-8 collects characteristic data involving pressure distribution and temperature distribution in real time, and the multi-physics field acquisition-analysis module 2 receives the collected characteristic data in real time. It should be noted that: based on the real-time received feature data, the multi-physics field acquisition-analysis module 2 constructs pressure and temperature distribution cloud maps and calculates the pressure distribution standard deviation; combining the pressure and temperature distribution cloud maps and the pressure distribution standard deviation, a preliminary quality inspection is performed on the current hot-pressed composite bonding; Preferably, the initial quality inspection includes: if the pressure distribution cloud map shows a local abrupt change (e.g., pressure > 3σ), it is determined that there may be foreign objects protruding during the current hot-pressing bonding process, and the hot-pressing system will automatically activate an early warning prompt; It should be noted that: based on the real-time received feature data, the multi-physics acquisition-analysis module 2 extracts the pressure feature vector; and uses the pressure feature vector as the input of the XGBoost regression model / CNN deep learning model to output the evaluation parameter value corresponding to the current hot-pressed composite bonding, and performs secondary quality inspection on the current hot-pressed composite bonding; if the evaluation parameter value exceeds the set threshold, the hot-pressing process controller 3 is immediately triggered to modify the hot-pressing parameters. The pressure feature vector includes: pressure peak distribution, pressure holding integral area, and maximum downward pressure; the evaluation parameters include: predicted adhesive tensile strength and sealing confidence; the hot pressing parameters include: duration of single hot pressing and hot pressing temperature.

[0024] Based on the adaptive hot pressing system based on multi-physics field sensing described in Embodiment 1 above, the top surface of the base plate 1-1-3 is connected to the bottom surface of the intermediate plate 1-1-2 based on multiple piezoelectric actuators 1-1-5, and multiple distance sensing probes 1-1-6 are arranged around the bottom surface of the base plate 1-1-3. Based on this, when the hot pressing is at the critical contact, according to the real-time parallelism of the pairing adhesive plate group, the distance sensing probes 1-1-6 trigger the hot pressing process controller 3 to adjust the extension and retraction of the piezoelectric actuators 1-1-5 in a timely manner, driving the base plate 1-1-3 to be hot pressed parallel to the pairing adhesive plate group, so as to ensure the hot pressing bonding quality of the diffuser plate and the air duct plate. Based on the adaptive hot pressing system based on multi-physics sensing described in Embodiment 1 above, a pressure-temperature sensor array plate 1-1-8 is fixedly bonded to the center of the bottom surface of the base plate 1-1-3. During hot pressing, the pressure-temperature sensor array plate 1-1-8 collects pressure and temperature characteristic data in real time. At the same time, the multi-physics acquisition-analysis module 2 receives the collected characteristic data in real time to perform primary quality inspection of hot pressing bonding. Based on the pre-built model, it performs secondary quality inspection of hot pressing bonding in combination with the characteristic data. Based on the results of the secondary quality inspection, the hot pressing process controller 3 is triggered in a timely manner to adjust the hot pressing parameters in a timely manner to further ensure the hot pressing bonding quality of the diffuser plate and the air duct plate.

[0025] It should be noted that any reference numerals placed between parentheses in the claims should not be construed as limiting the claims. The word "comprising" does not exclude the presence of components or steps not listed in the claims. The words "a" or "an" preceding a component do not exclude the presence of a plurality of such components. The use of the terms first, second, third, etc., is for convenience only and does not indicate any order. These terms can be understood as part of the component names.

[0026] Furthermore, it should be noted that in the description of this specification, the terms "one embodiment," "some embodiments," "embodiment," "example," "specific example," or "some examples," etc., refer to specific features, structures, materials, or characteristics described in connection with that embodiment or example, which are included in at least one embodiment or example of the present invention. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples. Furthermore, without contradiction, those skilled in the art can combine and integrate the different embodiments or examples described in this specification, as well as the features of different embodiments or examples.

[0027] Although preferred embodiments of the invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the claims should be interpreted to include both the preferred embodiments and all changes and modifications falling within the scope of the invention.

[0028] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, then this invention should also include these modifications and variations.

Claims

1. An adaptive hot-pressing system based on multi-physics sensing, the hot-pressing system being used for hot-pressing composite bonding of refrigerator air duct plates and diffuser plates, characterized in that, The hot pressing system includes: an adaptive hot pressing component, a multiphysics field acquisition and analysis module, and a hot pressing process controller; The adaptive hot pressing assembly includes: a hot pressing body and a hot pressing operating table mounted directly below the hot pressing body; the hot pressing operating table is used to place the bonding plates to be paired; the hot pressing process controller drives the hot pressing body to move in the vertical direction to apply hot pressing force to the bonding plates to be paired. The hot-pressing body includes an intermediate plate and a bottom plate; the top surface of the bottom plate is connected to the bottom surface of the intermediate plate based on N piezoelectric actuators; M ranging sensor probes are arranged around the bottom surface of the bottom plate; a pressure-temperature sensor array plate is fixedly bonded to the center of the bottom surface of the bottom plate; M and N are integers and N≥3, M≥4; The ranging sensor probe is used to trigger the hot pressing process controller to adjust the extension and retraction of the piezoelectric brake in a timely manner when the hot pressing is at the critical contact, so as to drive the base plate to make parallel contact with the bonding plate assembly to be paired. The pressure-temperature sensor array is used to collect characteristic data involving pressure and temperature distribution in real time during hot pressing. The multiphysics acquisition and analysis module is used to receive the acquired feature data in real time during hot pressing; and based on the pre-built model, it combines the feature data to judge hot pressing anomalies; and based on the judgment results, it triggers the hot pressing parameters of the hot pressing process controller to adjust them in a timely manner.

2. The hot pressing system according to claim 1, characterized in that, Signal communication and electrical connections are established between the adaptive hot pressing assembly, the multiphysics acquisition and analysis module, and the hot pressing process controller.

3. The hot pressing system according to claim 1, characterized in that, The assembly of boards to be paired includes: refrigerator air duct board and diffuser board that need to be hot-pressed and bonded together.

4. The hot pressing system according to claim 1, characterized in that, The adaptive hot press assembly also includes: a base, and a vertical drive shaft fixed to the top surface of the base; the hot press operating table is fixed to the top surface of the base; One end of the hot press body is horizontally connected to an adjustable movable end; the vertical drive shaft has a vertically oriented drive slide; the adjustable movable end is nested outside the vertical drive shaft based on the limit of the drive slide.

5. The hot pressing system according to claim 4, characterized in that, The hot press body also includes a top plate; one end of the adjustable movable end is fixedly connected to one side of the top plate; the bottom surface of the top plate is connected to the top surface of the intermediate plate based on the drive rod.

6. The hot pressing system according to claim 1, characterized in that, As the hot-pressed body descends vertically, any distance sensing probe begins to detect the distance between its lower surface and the top surface of the bonding plate assembly to be paired. The critical contact state of hot pressing is: when performing a single hot pressing composite bonding, the distance between the lower surface of any ranging sensor probe and the top surface of the bonding plate group to be paired is equal to 2mm.

7. The hot pressing system according to claim 6, characterized in that, Once the hot-press critical contact state is reached, if the distances detected by any two ranging sensors are different, the difference in the amount of expansion and contraction between the different ranging sensors will be controlled within 50ms based on the hot-press process controller until the base plate is parallel to the bonding plate group to be paired.

8. The hot pressing system according to claim 1, characterized in that, Based on real-time feature data, the multi-physics acquisition-analysis module constructs pressure and temperature distribution cloud maps and calculates the standard deviation of pressure distribution; In conjunction with pressure and temperature distribution cloud maps and pressure distribution standard deviation, a preliminary quality inspection of the current hot-pressed composite bonding is conducted.

9. The hot pressing system according to claim 1, characterized in that, Based on real-time feature data, the multi-physics acquisition-analysis module extracts pressure feature vectors; The pressure feature vector is used as the input of the CNN deep learning model to output the evaluation parameter values ​​corresponding to the current hot-pressed composite bonding, and a secondary quality inspection is carried out on the current hot-pressed composite bonding. If the evaluation parameter value exceeds the threshold, the hot pressing process controller will be immediately triggered to modify the hot pressing parameters.

10. The hot pressing system according to claim 9, characterized in that, The pressure characteristic vector includes: peak pressure distribution, pressure holding integral area, and maximum downward pressure. Evaluation parameters include: predicted adhesive tensile strength and seal confidence level; Hot pressing parameters include: duration of single hot pressing application and hot pressing temperature.

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