Light-emitting module

Abstract

The invention relates to a light-emitting module which comprises a packaging structure, a circuit board, a reflector and at least one light-emitting chip, when the light-emitting module is used, a detection light beam emitted by the light-emitting chip enters a curved surface of the reflector, the reflector is provided with a plurality of focuses, and the focuses are arranged in one-to-one correspondence with light-emitting centers of the corresponding light-emitting chips; and a detection light beam emitted by each light-emitting chip is reflected by the curved surface of the corresponding reflector and then is shaped into a collimated light beam. A plurality of collimated light beams are naturally spliced in space through precise arrangement of the reflector array to form a continuous and uniform illumination light field, so that an illumination blind area caused by an overlarge divergence angle or improper splicing of a traditional light source is eliminated. And meanwhile, the packaging structure covers the light-emitting component, so that the additional volume of the light-emitting module is not increased while optical sealing is realized, and the light-emitting component can keep compact layout, thereby adapting to a long and narrow or miniaturized detection channel. Therefore, the light-emitting module can realize uniform, parallel and blind-area-free illumination in a compact space.

Description

Technical Field

[0001] This application relates to the field of lighting equipment for confined spaces, and more particularly to a light-emitting module. Background Technology

[0002] In many industrial inspection, pharmaceutical sorting, and precision manufacturing scenarios, reliable optical identification, positioning, and counting of objects at the millimeter level or smaller are often required within confined spaces. Traditional inspection systems typically use standard LED modules or point light sources for illumination, but these light sources often suffer from the following problems: 1. Uneven light output: Especially for Lambertian LEDs, the light intensity distribution exhibits cosine decay, resulting in a significant decrease in illuminance at the edge of the detection area; 2. There are blind spots in lighting: In a compact space, it is difficult to seamlessly connect multiple light sources, or they may cause light mixing interference due to their excessive divergence angle; 3. Difficulty in controlling the optical path: The light emitted by conventional light sources is not parallel, resulting in poor detection consistency at long distances or specific angles; 4. Difficult to miniaturize and integrate: Existing optical modules are often large in size and cannot be flexibly adapted to extremely narrow detection channels or miniature sensor layouts.

[0003] Therefore, how to achieve uniform, parallel, and blind-spot-free lighting in a compact space is a technical problem that needs to be solved by those skilled in the art. Summary of the Invention

[0004] This application provides a light-emitting module to achieve uniform, parallel, and blind-spot-free illumination in a compact space.

[0005] To achieve the above objectives, the present invention provides the following technical solution: A light-emitting module includes a light-emitting component and an encapsulation structure, wherein: The light-emitting component includes a circuit board, a reflector, and at least one light-emitting chip; The reflective surface of the mirror is curved, and the focal point of the reflective surface is located at the light-emitting center of the light-emitting chip, which is used to emit a detection beam. The circuit board is used to support and electrically connect the light-emitting chip; The reflector has multiple focal points, and the focal points of the reflector correspond one-to-one with the position of the light-emitting center of the light-emitting chip. The reflector is used to reflect the detection beam into a collimated beam. The encapsulation structure covers the light-emitting component and is used to optically seal the light-emitting component.

[0006] Optionally, in the above-mentioned light-emitting module, the light-emitting chip is a visible light or near-infrared light-emitting chip, and the light-emitting chip is one or a combination of a light-emitting diode, a vertical cavity surface-emitting laser, or a side-emitting laser; The number of light-emitting chips is multiple, arranged in a straight line or in a surface, and the planar dimensions of the light-emitting chips are less than or equal to 0.3 mm × 0.3 mm.

[0007] Optionally, in the above-mentioned light-emitting module, the reflector includes a first mirror body and at least one second mirror body. The surface of the first mirror body is a quadratic surface, and the quadratic curve of the first mirror body is rotated and translated around its axis of symmetry to form the surface of the second mirror body.

[0008] Optionally, in the above-mentioned light-emitting module, the reflector includes multiple reflective units, which are arranged linearly, and each reflective unit is a micro-reflector obtained by cutting a complete quadratic surface, and each micro-reflector has a focal point.

[0009] Optionally, in the above-mentioned light-emitting module, the multiple reflective units have the same shape, the quadratic surface is a parabola, the radius of curvature of the parabola is in the range of -1 mm to -4 mm, and the conic coefficient is -1.

[0010] Optionally, in the above-mentioned light-emitting module, the material of the micro reflector is a metal substrate, and the surface of the metal substrate is coated with a metal film layer; Alternatively, a plastic substrate, the surface of which is coated with a metal reflective layer; Alternatively, a glass substrate, wherein the surface of the glass substrate is coated with a dielectric reflective film layer.

[0011] Optionally, in the above-mentioned light-emitting module, the encapsulation structure includes a transparent filling layer and a transparent protective plate. The transparent filling layer fills the space between the reflector and the circuit board. The parallel light emission of the reflector forms a light-emitting surface. The transparent protective plate covers the light-emitting surface, and the edge of the transparent protective plate is connected to the reflector and the circuit board.

[0012] Optionally, in the above-mentioned light-emitting module, the transparent filling layer is optical silicone, the transparent protective plate is one of optical glass, polycarbonate or polymethyl methacrylate, and the surface of the transparent protective plate is coated with an anti-reflective film layer.

[0013] Optionally, in the above-mentioned light-emitting module, the circuit board integrates a driving circuit, which is electrically connected to the light-emitting chip and is used to control the light-emitting chip to light up and turn off.

[0014] Optionally, the above-mentioned light-emitting module also includes a positioning element, which is disposed on the light-emitting component and is used to detachably install the light-emitting module inside the frame or housing of the detection equipment.

[0015] The light-emitting module provided by this invention, in use, has a detection beam emitted by the light-emitting chip incident on the curved surface of a reflector. Since the reflector has multiple focal points, and each focal point corresponds one-to-one with the light-emitting center of the corresponding light-emitting chip, the detection beam emitted by each light-emitting chip is shaped into a collimated beam after reflection by the curved surface of the corresponding reflector. Multiple collimated beams are naturally spliced ​​together in space through the precise arrangement of the reflector array, forming a continuous and uniform illumination field, eliminating the illumination blind spots caused by excessive divergence angles or improper splicing in traditional light sources. Simultaneously, the encapsulation structure covers the light-emitting component, achieving optical sealing without increasing the additional volume of the light-emitting module, allowing the light-emitting component to maintain a compact layout, thus adapting to narrow or miniaturized detection channels. Therefore, this light-emitting module can achieve uniform, parallel, and blind-spot-free illumination within a compact space. Attached Figure Description

[0016] The accompanying drawings, incorporated in and forming part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application. To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, those skilled in the art can obtain other drawings based on these drawings without creative effort. One or more embodiments are illustrated by way of example through the corresponding images in the accompanying drawings. These exemplary descriptions do not constitute a limitation on the embodiments. Elements with the same reference numerals in the drawings represent similar elements. Unless otherwise stated, the figures in the drawings do not constitute a limitation on scale.

[0017] Figure 1 This is a schematic diagram of the structure of the light-emitting module provided in the embodiments of this application; Figure 2 A schematic diagram of the radiation distribution received by the linear array light-receiving device in the light-emitting module of this application, provided as an embodiment of this application; Figure 3 This is a schematic diagram of the divergence angle of the light-emitting module provided in an embodiment of this application.

[0018] Explanation of reference numerals in the attached figures: Circuit board 1, reflector 2, light-emitting chip 3, reflective unit 4, positioning component 5. Detailed Implementation

[0019] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0020] The following disclosure provides numerous different embodiments or examples for implementing various structures of this application. To simplify the disclosure, specific examples of components and arrangements are described below. These are merely examples and are not intended to limit the scope of this application. Furthermore, reference numerals and / or letters may be repeated in different examples. Such repetition is for simplification and clarity and does not in itself indicate a relationship between the various embodiments and / or arrangements discussed. In addition, various specific examples of processes and materials are provided in this application; however, those skilled in the art will recognize the applicability of other processes and / or the use of other materials.

[0021] For ease of description, spatial relative terms may be used in the text to describe the relative position or movement of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "front," "back," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure undergoes a positional flip, orientation change, or change of motion, these directional indications will change accordingly. For instance, an element described as "below other elements or features" or "below other elements or features" will subsequently be oriented "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations. The device may be otherwise oriented (rotated 90 degrees or in other directions), and the spatial relative descriptors used in the text will be interpreted accordingly.

[0022] See Figure 1This application provides a light-emitting module, including a light-emitting component and a packaging structure. The light-emitting component includes a circuit board 1, a reflector 2, and at least one light-emitting chip 3. The reflective surface of the reflector 2 is curved, and the focal point of the reflective surface is located at the light-emitting center of the light-emitting chip 3. The light-emitting chip 3 is used to emit a detection beam. The circuit board 1 is used to support and electrically connect the light-emitting chip 3. The reflector 2 has multiple focal points, and the positions of the focal points of the reflector 2 and the light-emitting centers of the light-emitting chips 3 correspond one-to-one. The reflector 2 is used to reflect the detection beam into a collimated beam. The packaging structure covers the light-emitting component for optical sealing of the light-emitting component.

[0023] Specifically, when the light-emitting chip 3 emits a detection beam, the detection beam is emitted in all directions with an approximate Lambertian or Gaussian distribution. The light rays incident on the curved surface of the corresponding reflector 2 satisfy the geometric optical conditions of the law of reflection because the focal point of the curved surface coincides with the light-emitting center of the light-emitting chip 3. This causes the reflected light rays to be emitted parallel to the optical axis of the curved surface, forming a collimated beam.

[0024] Specifically, the encapsulation structure covers the light-emitting component, which on the one hand can achieve optical sealing and protect the internal components from dust and moisture, and on the other hand can maintain the compact shape of the light-emitting module without adding extra volume (the light-emitting module does not need to be arranged with an additional shell or other structure), so that the light-emitting module can be directly embedded in a narrow space.

[0025] The light-emitting module provided by this invention, in use, has a detection beam emitted by the light-emitting chip 3 incident on the curved surface of the reflector 2. Since the reflector 2 has multiple focal points, and each focal point corresponds one-to-one with the light-emitting center of the corresponding light-emitting chip 3, the detection beam emitted by each light-emitting chip 3 is shaped into a collimated beam after reflection by the corresponding curved surface of the reflector 2. Multiple collimated beams are naturally spliced ​​together in space through the precise arrangement of the reflector 2 array, forming a continuous and uniform illumination field, eliminating the illumination blind spots caused by excessive divergence angles or improper splicing in traditional light sources. Simultaneously, the encapsulation structure covers the light-emitting component, achieving optical sealing without increasing the additional volume of the light-emitting module, allowing the light-emitting component to maintain a compact layout, thus adapting to narrow or miniaturized detection channels. Therefore, this light-emitting module can achieve uniform, parallel, and blind-spot-free illumination within a compact space.

[0026] In small-scale drug particle detection equipment in the pharmaceutical industry, the light-emitting module provided by this invention is used. The circuit board 1 is a long strip PCB, on which eight near-infrared LED chips (i.e., the aforementioned light-emitting chip 3, with a wavelength of 850 nanometers) are soldered. Each near-infrared LED chip is topped by an aluminum-plated parabolic reflector 2, and the focal point of the reflector 2 is precisely aligned with the light-emitting center of the near-infrared LED chip. The encapsulation structure uses optical silicone to fill the gap between the reflector 2 and the PCB. During operation, the LED emits near-infrared light, which is collimated by the reflector 2 to form a parallel beam, illuminating the drug particle delivery channel for imaging by the linear array camera. The overall thickness of the light-emitting module is only 5 millimeters, allowing it to be installed in narrow spaces while achieving blind-spot-free detection.

[0027] In order to optimize the selection of light source according to the characteristics of the detection object and the light receiving device, and at the same time ensure that the size of the light-emitting chip 3 does not affect the uniformity of the light spot and the collimation effect during miniaturization integration, the light-emitting chip 3 is a visible light or near-infrared light-emitting chip 3. The light-emitting chip 3 is one or a combination of a light-emitting diode, a vertical cavity surface-emitting laser, or an edge-emitting laser. There are multiple light-emitting chips 3, which are arranged in a straight line or in a surface arrangement. The planar size of the light-emitting chip 3 is less than or equal to 0.3 mm × 0.3 mm.

[0028] Specifically, the light-emitting chip 3 can emit visible or near-infrared light, specifically a light-emitting diode (LED), a vertical-cavity surface-emitting laser (VCSEL), or an edge-emitting laser (EEL), or a combination thereof. The wavelength can be selected based on the reflectivity of the object being detected and the photosensitive wavelength of the light-receiving device. Multiple light-emitting chips 3 are used, arranged in a linear array or a planar array to accommodate different detection area shapes. The smaller the light-emitting chip 3, the closer its emitting surface is to a point light source, resulting in better uniformity of the light spot after collimation by the reflector 2, and easier optimization of parallelism. Based on actual production and use, and considering process limitations, the planar dimensions of the light-emitting chip 3 in this application are less than or equal to 0.3 mm × 0.3 mm, ensuring the accuracy of the collimating optical system while improving light emission uniformity and collimation effect.

[0029] By defining the type and wavelength of the light-emitting chip 3, the light-emitting module can be matched with different detection scenarios (such as visible light for visual detection, and near-infrared light for penetration or special reflection), thus flexibly adapting to the detection needs of different fields such as medicine and electronics; multiple light-emitting chips 3 are arranged in a linear array or area array, which can cover detection areas of different shapes, thereby broadening the applicability of the module.

[0030] In one embodiment, the light-emitting module is used for surface defect detection of electronic components. The light-emitting chip 3 is a VCSEL array with a wavelength of 940 nanometers. A total of 16 chips are arranged in a 4×4 array, and each chip is 0.2 mm × 0.2 mm in size. VCSEL has the characteristics of narrow divergence angle and high brightness. When combined with the reflector 2, it can generate highly parallel illumination, covering a 10 mm × 10 mm detection area, which can effectively identify tiny scratches and achieve a detection accuracy of 0.01 mm.

[0031] To optimize the above technical solution, the reflector 2 includes a first mirror body and at least one second mirror body. The surface of the first mirror body is a quadratic surface. The quadratic curve of the first mirror body is rotated and translated around its axis of symmetry to form the surface of the second mirror body.

[0032] Specifically, the surface of the first mirror is a quadratic surface (such as a parabola or ellipsoid). By rotating this quadratic curve around its axis of symmetry, a basic surface of revolution is obtained. Then, through translation, the surface of the second mirror is generated. In other words, using a standard surface (the first mirror) as a template, multiple identical second mirrors are replicated through rotation and translation, forming a mirror array 2. This arrangement ensures that all mirrors have the same optical parameters such as radius of curvature and conic coefficient, guaranteeing precise consistency in the surface shape of all mirrors. This results in identical optical characteristics (such as focal length and collimation angle) for each mirror, enabling uniform splicing of multiple collimated beams. Batch replication of identical mirrors through mathematical transformation avoids errors caused by individual design, simplifies the manufacturing process, reduces production costs, and ensures consistency in the performance of each mirror in the array, resulting in distortion-free final light output and achieving uniform, parallel, and blind-zone-free illumination.

[0033] In production, a standard parabolic surface (first mirror body) can be designed first, with a radius of curvature of -2.5 mm and a conic coefficient of -1. Using precision molding technology, this parabolic surface is used as the mold core, and multiple second mirror bodies of the same shape are replicated by rotation and translation, thus forming the reflector array 2.

[0034] In order to eliminate the dark area between multiple independent reflectors 2 and realize a continuous, blind-zone-free illumination field, the reflector 2 includes multiple reflective units 4, which are linearly arranged. Each reflective unit 4 is a micro reflector obtained by cutting a complete quadratic surface, and each micro reflector has a focal point.

[0035] Specifically, a standard quadratic surface (such as a parabola) is first designed, and then cut along a specific direction to extract multiple micro-plate-like regions. Each region retains the local surface features of the original surface, i.e., a micro-reflector. These micro-reflectors are arranged closely according to the order of cutting to form a complete reflector 2. Depending on different application requirements, the shapes of these micro-reflectors can be the same or different. For example, when uniform illumination is required, reflective units 4 with the same shape can be arranged regularly; when fan-shaped, converging, or specific-shaped light-emitting areas are required, reflective units 4 with gradually changing curvature or different shapes can be used to achieve diverse light field distributions. When the micro-reflectors have the same shape, since each reflective unit 4 comes from the same parent surface, their curvature parameters are exactly the same, and the cutting boundaries are precisely matched, so there are no physical gaps between adjacent reflective units 4. Each light-emitting chip 3 corresponds to one reflective unit 4, and its light-emitting center is located at the focal point of the reflective unit 4. The emitted light beam becomes a collimated beam after being reflected by the corresponding reflective unit 4. Multiple collimated beams are naturally adjacent in space to form a continuously covered illumination area. The cutting and reassembly technology divides a single continuous curved surface into multiple reflective units 4. This retains the independent collimation capability of each reflective unit 4 while eliminating blind spots between them through precise arrangement, achieving seamless light field splicing. This allows the reflector 2 to maintain the continuous curved surface characteristics as a whole while possessing the ability to independently control multiple focal points. The emitted light area is uniform and free of dark areas, making it particularly suitable for full-coverage detection of small objects, avoiding missed detections caused by illumination blind spots. Furthermore, the identical shape of the reflective units 4 facilitates mass production and assembly, improving production efficiency.

[0036] In some embodiments, the light-emitting module is used for drug detection. The reflector 2 is composed of 20 identically shaped micro-reflectors arranged linearly, each reflective unit 4 being 0.5 mm wide and 10 mm long. These units are obtained by precisely cutting a complete parabolic surface (radius of curvature -2.5 mm), with the cut edges optically polished to ensure smooth connection. Each unit corresponds to a 0.2 mm × 0.2 mm near-infrared LED chip. After assembly, the light-emitting surface of the light-emitting module forms a continuous and uniform bright band, completely covering the drug delivery channel, with no dark areas as measured.

[0037] To optimize the above technical solution, multiple reflective units 4 have the same shape, and the quadratic surface is a parabola with a radius of curvature ranging from -1 mm to -4 mm and a conic coefficient of -1.

[0038] Specifically, a parabolic surface possesses the characteristic of perfectly collimating light rays emitted from its focal point, and the conic coefficient -1 is a mathematical characteristic of a standard parabolic surface. A negative radius of curvature indicates that the surface is concave towards the light-emitting chip 3, and its absolute value determines the focal length and size of the reflector 2. With a chip size ≤ 0.3 mm, a radius of curvature within this range allows the reflector 2 to be both compact and effectively collect most of the light, while controlling the divergence angle of the reflected beam within a very small range (e.g., ±3°). This parameter range is optimized to balance the thickness of the light-emitting module with collimation accuracy. The aforementioned parabolic parameters provide a quantitative basis for the design of the reflector 2, ensuring high parallelism of light emission under miniaturization conditions, meeting the requirements for long-distance or high-resolution detection. Based on actual use and data calculations, see [reference needed]. Figure 2 and Figure 3 Within this parameter range, the light-emitting module can maintain a uniform bright band at a working distance of 120 mm, with a half-intensity divergence angle of only ±3°, significantly improving the consistency of the detection system.

[0039] It should be noted that, Figure 2 This is a schematic diagram of the radiation distribution received by the linear array light-receiving device. The x-axis and y-axis represent the spatial positions in the x and y directions, respectively, with units in millimeters. The W / m² irradiance distribution on the left is... Figure 2 It can be seen that within a specified spatial area, the application of the light-emitting module of this application can achieve better spatial uniformity of irradiance distribution. Figure 3 This is a schematic diagram of the divergence angle of the light-emitting module. The x-axis represents the spatial angular distribution in degrees, and the y-axis represents the radiant intensity in W / sr. Figure 3 It can be seen that the half-intensity divergence angle is about ±3°, which indicates good spatial parallelism.

[0040] It should be added that, based on the above embodiments, the reflector 2 of the present invention can be customized according to different application scenarios. Specifically, the radius of curvature or surface shape of at least some of the reflective units 4 in the reflector 2 array can be different from that of other reflective units 4 (i.e., the shapes of multiple reflective units 4 are not the same) to achieve diverse light output distributions. For example, reflective units 4 with gradually changing curvature can be arranged so that the collimated beams generated by each reflective unit 4 have slightly different exit angles, thereby forming a fan-shaped light field in the target area; or reflective units 4 with different radii of curvature can be combined so that some beams converge at a specific position to form a converging light field; the curvature and arrangement density of the reflective units 4 can also be configured according to the shape and size of the object being detected to generate linear, rectangular or other specific shaped illumination areas. In addition, the curvature selection of the reflective unit 4 can be optimized in conjunction with the size of the corresponding light-emitting chip 3. Different sized chips combined with reflective units 4 with different curvatures can further expand the flexibility of light field control. This design enables the light-emitting module to meet the special requirements of various detection scenarios for light field distribution, such as wide-span scanning, ring illumination, local enhancement, etc.

[0041] For example, in a detection system for wide-scanning of a drug delivery channel, the illumination field needs to uniformly cover the width of the conveyor belt while having a certain divergence angle in the conveying direction to accommodate drugs of different heights. In this embodiment, the reflector 2 consists of 16 linearly arranged reflective units 4. The radius of curvature of each reflective unit 4 gradually changes from -2 mm on the left to -3.5 mm on the right, with a conic coefficient of -1 for all. The reflective unit 4 on the left with a smaller radius of curvature produces a slightly divergent beam, while the reflective unit 4 on the right with a larger radius of curvature produces a more collimated beam. When superimposed, these beams form a fan-shaped illumination area 15 mm wide and with a divergence angle of approximately 15° in the length direction, 100 mm from the light-emitting surface of the light-emitting module. This completely covers the drug delivery channel while ensuring that each drug delivery particle is uniformly illuminated. The light-emitting chip 3 uses a 0.25 mm × 0.25 mm near-infrared LED, corresponding one-to-one with each reflective unit 4. This design satisfies the requirement for wide coverage and compensates for imaging differences caused by variations in drug height through fan-shaped light emission.

[0042] It should be noted that the second mirror is formed by rotating and translating the first mirror body using a quadratic curve. This emphasizes the replication process of multiple identical curved surfaces, which is used to efficiently and consistently manufacture multiple reflective units 4 with the same optical parameters. The reflector 2 is composed of multiple reflective units 4 with the same shape arranged linearly. Each reflective unit 4 is a miniature reflector obtained by cutting a complete quadratic surface. This is used to eliminate spliced ​​dark areas and achieve continuous blind-spot-free illumination. The specific mathematical parameters of the parabola, namely the parabola and its radius of curvature range (-1 mm to -4 mm) and conic coefficient (-1), are used to achieve the optimal collimation effect within the given size of the light-emitting chip 3.

[0043] To optimize the above technical solution, the material of the micro reflector is a metal substrate with a metal film layer coated on the surface; or a plastic substrate with a metal reflective layer coated on the surface; or a glass substrate with a dielectric reflective film layer coated on the surface.

[0044] Specifically, the material of the micro reflector is a metal substrate (such as aluminum or copper), and the surface of the metal substrate is coated with a metal film (such as aluminum, silver, or gold). The metal film is formed by vacuum evaporation or sputtering and has high reflectivity for specific wavelengths.

[0045] Specifically, the material of the micro reflector is a plastic substrate (such as polycarbonate or polymethyl methacrylate), and the surface of the plastic substrate is coated with a metal reflective layer. Plastic is lightweight and easy to mold, and after being coated with a metal reflective layer, it can achieve reflective performance similar to that of metal, while reducing weight and cost.

[0046] Specifically, the material of the micro-reflector is a glass substrate, the surface of which is coated with a dielectric reflective film. This dielectric reflective film can be composed of multiple alternating layers of high and low refractive index materials, achieving high reflectivity through interference effects and exhibiting strong wavelength selectivity, allowing for optimization for the visible or near-infrared bands. Material selection must consider the operating wavelength: for example, gold films have high infrared reflectivity, aluminum films are suitable for visible and ultraviolet light, and dielectric reflective films can achieve extremely narrow-band high reflectivity.

[0047] Different substrate and coating combinations enable the reflector 2 to be adapted to the wavelength (visible light or near-infrared) of the light-emitting chip 3, maximizing light energy utilization and reducing absorption loss. At the same time, plastic and glass substrates can be used for complex curved surface molding, while metal substrates are suitable for high-power scenarios. The selectivity of these materials ensures the versatility and performance of the light-emitting module.

[0048] In order to effectively encapsulate the reflector 2 and the circuit board 1 to protect the internal precision structures (such as gold wires and light-emitting chips 3) without affecting the light output quality, the encapsulation structure includes a transparent filling layer and a transparent protective plate. The transparent filling layer is filled between the reflector 2 and the circuit board 1. The parallel light output of the reflector 2 forms a light-emitting surface. The transparent protective plate covers the light-emitting surface, and the edge of the transparent protective plate is connected to the reflector 2 and the circuit board 1.

[0049] Specifically, a transparent filler layer fills the gap between the reflector 2 and the circuit board 1, completely enclosing the light-emitting chip 3, the gold wires of the circuit board 1, and the reflective surface of the reflector 2. The transparent filler layer has high light transmittance, and its refractive index is typically between that of air and optical elements, reducing interface reflection and improving light extraction efficiency. Simultaneously, the transparent filler layer serves multiple functions, including bonding, fixing, and stress buffering, preventing displacement of the light-emitting chip 3 due to vibration or thermal expansion and contraction. A transparent protective plate (such as glass) covers the light-emitting surface of the reflector 2, with its edges connected to the reflector 2 and the circuit board 1, forming a sealed cavity. After the reflector 2 collimates the light beam, it forms the light-emitting surface. The transparent protective plate is located outside this light-emitting surface, neither affecting light transmission nor preventing dust and moisture intrusion, thereby extending the lifespan of the light-emitting module.

[0050] Specifically, the edge of the transparent protective plate is sealed to the reflector 2 and the circuit board 1 with epoxy resin, and the transparent protective plate is made of ultra-white tempered glass.

[0051] To optimize the above technical solution, the transparent filler layer is optical silicone, the transparent protective plate is one of optical glass, polycarbonate or polymethyl methacrylate, and the surface of the transparent protective plate is coated with an anti-reflective film.

[0052] Specifically, optical silicone has high light transmittance, is resistant to yellowing, has good flexibility, and can adapt to temperature changes. The refractive index of optical silicone matches that of glass or plastic, which can reduce Fresnel loss (the energy loss caused by reflection and refraction of light at the interface of media with different refractive indices, the magnitude of which depends on the angle of incidence, the refractive index of the medium, and the properties of the light wave).

[0053] Specifically, the transparent protective plate can be made of optical glass, polycarbonate (PC) or polymethyl methacrylate (PMMA): optical glass has the advantages of high hardness, scratch resistance and good thermal stability; PC has the advantages of strong impact resistance and is suitable for environments prone to collision; PMMA has the advantages of high light transmittance and low cost. Operators can choose according to the actual use scenario of the light-emitting module.

[0054] Specifically, the surface of the transparent protective plate is coated with an anti-reflection film (such as MgF2 (magnesium fluoride) or a multilayer film) to further reduce reflection loss and improve light extraction efficiency.

[0055] Material optimization can improve the light extraction efficiency of the light-emitting module, achieving higher illuminance with the same power consumption and reducing energy consumption. Anti-reflective coatings can also reduce stray light interference and improve the contrast of the detected image.

[0056] To optimize the above technical solution, a driving circuit is integrated on the circuit board 1. The driving circuit is electrically connected to the light-emitting chip 3 and is used to control the lighting and extinguishing of the light-emitting chip 3.

[0057] Specifically, the driving circuit can be designed to simultaneously illuminate all chips to provide high-brightness illumination; or to use time-division sequence control, that is, to sequentially illuminate different light-emitting chips 3 or different illumination areas in a specific order, in conjunction with camera triggering, to achieve multi-angle, multi-phase imaging. During use, the illumination mode can be dynamically adjusted according to the object being detected. For example, high-speed moving objects require simultaneous illumination to obtain sufficient exposure; surface defect detection may require illumination from different angles, which can be achieved by sequentially illuminating light-emitting chips 3 at different locations. This arrangement enhances the applicability of the light-emitting module and expands its application range.

[0058] To optimize the above technical solution, the light-emitting module also includes a positioning component 5, which is disposed on the light-emitting component and is used to detachably install the light-emitting module inside the frame or housing of the detection equipment.

[0059] Specifically, the positioning element 5 can be a snap-fit, threaded hole, positioning pin, magnetic structure, or engaging step, used to achieve quick alignment and fixation. The detachable design allows the light-emitting module to be removed individually for cleaning, maintenance, or replacement without disassembling the entire device. The positioning element 5 may also include an elastic element to ensure the connection stability of the light-emitting module after installation.

[0060] In some embodiments, the light-emitting module has spring clips on both sides, and a positioning slot is provided at the corresponding position on the frame. The operator can push the light-emitting module into the positioning slot, and the spring clips will automatically lock. If the light-emitting module needs to be replaced, it can be removed simply by pressing the spring clips.

[0061] In other embodiments, the reflector 2 of the light-emitting module is provided with a connector on the side away from the circuit board 1. The end of the connector is provided with a first magnetic part, and a slot is opened at the corresponding position of the frame. The bottom of the slot is provided with a second magnetic part that magnetically attracts the first magnetic part. When the operator pushes the connector into the slot, the first magnetic part and the second magnetic part magnetically attract each other, thus fixing the two. If the light-emitting module needs to be disassembled, the connector can be pulled out.

[0062] The above design enables the light-emitting module to be quickly adapted to different installation objects, and allows for rapid installation and disassembly, facilitating maintenance and replacement, and expanding the application range of the light-emitting module.

[0063] It should be noted that the light-emitting module provided by this invention can be used in the field of lighting equipment for confined spaces or other fields. Other fields refer to any field other than the field of lighting equipment for confined spaces. The above are merely examples and do not limit the application areas of the light-emitting module provided by this invention.

[0064] It should be understood that the terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “described” as used herein may also include the plural forms. The terms “comprising,” “including,” “containing,” and “having” are inclusive and therefore indicate the presence of the stated features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not construed as requiring them to be performed in a particular order described or illustrated unless the order of performance is explicitly indicated. It should also be understood that additional or alternative steps may be used.

[0065] Although terms such as first, second, third, etc., may be used in this document to describe multiple elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or segment from another. Unless the context clearly indicates otherwise, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence. Therefore, the first element, component, region, layer, or segment discussed below may be referred to as the second element, component, region, layer, or segment without departing from the teachings of the exemplary embodiments.

[0066] The above description is merely a specific embodiment of this application, enabling those skilled in the art to understand or implement this application. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of this application. Therefore, this application is not to be limited to the embodiments shown herein, but is to be accorded the widest scope consistent with the principles and novel features claimed herein.

Claims

1. A light-emitting module, characterized in that, Includes light-emitting components and packaging structures, wherein: The light-emitting component includes a circuit board, a reflector, and at least one light-emitting chip; The reflective surface of the mirror is curved, and the focal point of the reflective surface is located at the light-emitting center of the light-emitting chip, which is used to emit a detection beam. The circuit board is used to support and electrically connect the light-emitting chip; The reflector has multiple focal points, and the focal points of the reflector correspond one-to-one with the position of the light-emitting center of the light-emitting chip. The reflector is used to reflect the detection beam into a collimated beam. The encapsulation structure covers the light-emitting component and is used to optically seal the light-emitting component.

2. The light-emitting module according to claim 1, characterized in that, The light-emitting chip is a visible light or near-infrared light-emitting chip, and the light-emitting chip is one or a combination of a light-emitting diode, a vertical cavity surface-emitting laser, or a side-emitting laser. The number of light-emitting chips is multiple, arranged in a straight line or in a surface, and the planar dimensions of the light-emitting chips are less than or equal to 0.3 mm × 0.3 mm.

3. The light-emitting module according to claim 2, characterized in that, The reflector includes a first mirror body and at least one second mirror body. The surface of the first mirror body is a quadratic surface. The quadratic curve of the first mirror body is rotated and translated around its axis of symmetry to form the surface of the second mirror body.

4. The light-emitting module according to claim 3, characterized in that, The reflector includes multiple reflective units arranged linearly, and each reflective unit is a miniature reflector obtained by cutting a complete quadratic surface, with each miniature reflector having a focal point.

5. The light-emitting module according to claim 4, characterized in that, The multiple reflective units have the same shape, and the quadratic surface is a parabola with a radius of curvature ranging from -1 mm to -4 mm and a conic coefficient of -1.

6. The light-emitting module according to claim 5, characterized in that, The micro reflector is made of a metal substrate, and the surface of the metal substrate is coated with a metal film layer. Alternatively, a plastic substrate, the surface of which is coated with a metal reflective layer; Alternatively, a glass substrate, wherein the surface of the glass substrate is coated with a dielectric reflective film layer.

7. The light-emitting module according to any one of claims 1 to 6, characterized in that, The encapsulation structure includes a transparent filler layer and a transparent protective plate. The transparent filler layer fills the space between the reflector and the circuit board. The parallel light emission of the reflector forms a light emission surface. The transparent protective plate covers the light emission surface, and the edge of the transparent protective plate is connected to the reflector and the circuit board.

8. The light-emitting module according to claim 7, characterized in that, The transparent filler layer is optical silicone, and the transparent protective plate is one of optical glass, polycarbonate or polymethyl methacrylate. The surface of the transparent protective plate is coated with an anti-reflective film.

9. The light-emitting module according to any one of claims 1 to 6, characterized in that, The circuit board integrates a driving circuit, which is electrically connected to the light-emitting chip and is used to control the light-emitting chip to light up and turn off.

10. The light-emitting module according to any one of claims 1 to 6, characterized in that, It also includes a positioning element disposed on the light-emitting component for detachably mounting the light-emitting module inside the frame or housing of the detection equipment.

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