Temperature gradient automatic test board and test method thereof
By integrating a testing system with automatic temperature, pressure, and voltage control, the problems of low efficiency and poor accuracy in vehicle-mounted sensor testing systems have been solved, achieving efficient and intelligent sensor testing. This system can identify potential defects and improve the authenticity and accuracy of test data.
Patent Information
- Application Number
- CN202610054533.0
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2026-01-15
- Publication Date
- 2026-04-21
AI Technical Summary
Existing vehicle-mounted sensor testing systems are inefficient and inaccurate, require long manual operation times, are difficult to meet the needs of multi-gradient and large-batch testing, and cannot compensate for pressure deviations caused by gas thermal expansion and contraction in real time. They also ignore the dynamic response characteristics of sensors at the moment of pressure change, resulting in the inability to identify potential physical structural defects.
Design a test system that integrates automatic control of temperature, pressure, and voltage. The system uses a main control computer, an environmental chamber, a power supply, a pressure controller, and a signal acquisition module to achieve automatic adjustment and high-precision compensation. It also performs intelligent diagnosis through dual closed-loop control and transient characteristic analysis.
It significantly improves testing efficiency, reduces labor costs, enhances the authenticity and accuracy of test data, and can identify potential physical structural defects in sensors, enabling intelligent fault diagnosis.
Smart Images
Figure CN121898501A_ABST
Abstract
Description
Technical Field
[0001] This invention generally relates to the field of sensor testing technology. More specifically, this invention relates to an automatic temperature gradient testing bench and its testing method. Background Technology
[0002] With the rapid development of automotive electronics technology, on-board sensors (such as pressure sensors and temperature sensors) need to maintain high-precision output characteristics under extreme temperature and pressure conditions. Therefore, rigorous environmental testing must be conducted during the product development verification (DV) and production verification (PV) phases.
[0003] In existing technologies, testing of such sensors typically relies on manual operation. Testers must manually set the temperature in the environmental oven, and after the temperature stabilizes, manually adjust the air pressure and voltage sources, recording the data one by one. This traditional method has the following significant drawbacks: (1) Inefficient: Manual parameter setting is time-consuming and difficult to meet the testing needs of multiple gradients and large batches.
[0004] (2) Repetitive work: Frequent parameter adjustments increase labor costs.
[0005] (3) Limited control accuracy: Due to the huge temperature difference between the inside and outside of the environmental chamber, when the gas pressure is transmitted through a long pipeline, pressure deviation is easily generated due to the thermal expansion and contraction of the gas, and it is difficult to compensate in real time.
[0006] (4) Single fault diagnosis: Existing tests often only focus on the numerical accuracy after steady state, ignoring the dynamic response characteristics of the sensor at the moment of pressure change, resulting in the inability to identify potential physical structural defects (such as micro-blockage or stress anomaly).
[0007] Therefore, the urgent problem to be solved is the low testing efficiency and poor accuracy of testing systems for vehicle-mounted sensors and other related devices. Summary of the Invention
[0008] To address one or more of the aforementioned technical problems, this invention proposes the development of a testing system that integrates automatic control of temperature, pressure, and voltage, and possesses high-precision compensation and intelligent diagnostic functions. To this end, this invention provides solutions in the following aspects.
[0009] In a first aspect, the present invention provides an automatic temperature gradient test bench, comprising: a main control computer (1), an environmental chamber (2), a power supply (3), a signal acquisition module, a pressure controller (5), and a product connection port (9); the main control computer (1) is communicatively connected to the environmental chamber (2), the power supply (3), the signal acquisition module, and the pressure controller (5); the environmental chamber (2) is configured to accommodate the device under test and adjust the test environment temperature; the power supply (3) is electrically connected to the device under test through the product connection port (9) and is configured to provide a test voltage; the pressure controller (5) is connected to the air circuit of the device under test and is configured to adjust the environmental pressure of the device under test; the main control computer (1) is configured to execute a test sequence: sequentially controlling the environmental chamber (2), the power supply (3), and the pressure controller (5) to reach preset temperature, voltage, and air pressure target values, and acquiring feedback signals from the device under test through the signal acquisition module.
[0010] In one embodiment, the test bench further includes a reference pressure sensor located inside the environmental chamber (2) and close to the device under test; the main control computer (1) is also configured to receive real-time pressure data from the reference pressure sensor and construct a dual closed-loop control circuit based on the real-time pressure data and the feedback data from the pressure controller (5) to compensate for the temperature difference inside and outside the environmental chamber and the pressure deviation caused by pipeline transmission.
[0011] In one embodiment, the signal acquisition module includes: a digital multimeter (4) configured to acquire voltage or temperature signals of the device under test that output analog signals; a SENT acquisition card (8) configured to acquire digital voltage or temperature signals of the device under test that output digital signals; and a main control computer (1) configured to selectively read data from the digital multimeter (4) or the SENT acquisition card (8) according to the type of the device under test.
[0012] In one embodiment, a vacuum pump (6) and a compressed air source are also included: the vacuum pump (6) and the compressed air source are respectively connected to the input terminal of the pressure controller (5) to provide negative pressure and positive pressure air sources to support the pressure controller (5) to perform full-range pressure regulation.
[0013] In one embodiment, the main control computer (1) is further configured with a transient feature analysis module: the transient feature analysis module is configured to control the signal acquisition module to record the response curve of the device under test at a preset high sampling rate during the transition process of the pressure controller (5) adjusting the pressure, and extract the dynamic features of the response curve.
[0014] In a second aspect, the present invention also provides an automatic temperature gradient testing method based on the test bench described in one or more of the foregoing embodiments, comprising the following steps: acquiring a test sequence containing multiple temperature points, voltage points, and pressure points, and controlling the environmental chamber to adjust to the target temperature point; after the temperature stabilizes, controlling the power supply to adjust to the target voltage point, and controlling the pressure controller to adjust to the target pressure point; after the pressure stabilizes, acquiring the output data of the device under test; determining whether all voltage and pressure test points at the current temperature point have been completed, and if not, re-controlling the power supply and pressure controller; if completed, proceeding to the next temperature point, until the test ends.
[0015] In one embodiment, the process of adjusting to the target pressure point adopts dual closed-loop compensation control, including: the main control computer reads the measured value of the reference pressure sensor inside the environmental chamber as a feedback variable; calculates the deviation between the measured value and the target pressure point; calculates the correction amount based on the deviation using a PID algorithm, and updates the setting command sent to the pressure controller (5) until the deviation between the measured value and the target pressure point is within a preset threshold range.
[0016] In one embodiment, the system further includes an AI fault diagnosis step based on transient response characteristics, specifically including: initiating high-speed data acquisition at the start of pressure regulation to record the transient response waveform of the device under test from the current pressure to the target pressure; extracting feature vectors from the transient response waveforms, wherein the feature vectors include at least rise time, overshoot, and steady-state error; and inputting the feature vectors into a pre-trained fault classification model to identify whether the device under test has physical defects such as pore blockage, structural damage, or abnormal stress.
[0017] In one embodiment, before the control environment chamber is adjusted to the target temperature point, a test device inspection step is also included: under normal temperature conditions, the control test bench performs preliminary power-on and communication tests on all connected test devices, and only when all test devices are in normal condition is the subsequent temperature change test process initiated.
[0018] In one embodiment, the pressure stability determination employs an adaptive gradient algorithm: the first derivative of the output data of the device under test is calculated in real time, and the pressure is determined to be stable only when the first derivative is continuously lower than the stability threshold for a preset duration, and the output data of the device under test is collected.
[0019] The beneficial effects of this invention are as follows: According to the solution of this invention, the invention significantly saves manpower, reduces repetitive labor, and improves testing efficiency by synergistically and automatically adjusting three physical quantities: temperature, air pressure, and voltage. By adopting a dual closed-loop control strategy, it effectively solves the problem of air path pressure attenuation and fluctuation under extreme temperatures in the environmental chamber, thereby improving the authenticity of the test data. Attached Figure Description
[0020] The above and other objects, features, and advantages of exemplary embodiments of the present invention will become readily apparent upon reading the following detailed description with reference to the accompanying drawings. In the drawings, several embodiments of the invention are illustrated by way of example and not limitation, and like or corresponding reference numerals denote like or corresponding parts, wherein: Figure 1 This is a schematic diagram illustrating the structural composition of an automated temperature gradient testing bench according to an embodiment of the present invention; Figure 2 This is a schematic diagram illustrating the testing process of an automatic temperature gradient testing bench according to an embodiment of the present invention; Figure 3 This is a flowchart schematically illustrating an automatic temperature gradient testing method according to an embodiment of the present invention; Figure 4 This is a schematic diagram illustrating a temperature step graph according to an embodiment of the present invention; Figure 5 This is a schematic line graph illustrating the air pressure regulation in an automatic temperature gradient testing bench according to an embodiment of the present invention; Figure 6 This is a schematic line graph illustrating voltage regulation in an automatic temperature gradient test bench according to an embodiment of the present invention. Detailed Implementation
[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.
[0022] The specific embodiments of the present invention will now be described in detail with reference to the accompanying drawings.
[0023] Figure 1 This is a schematic diagram illustrating the structural composition of an automated temperature gradient testing bench according to an embodiment of the present invention. Figure 2 This is a schematic diagram illustrating the testing process of an automated temperature gradient test bench according to an embodiment of the present invention. It is understood that the device under test in this invention can be an onboard sensor, such as a TMAP sensor (Throttle Manifold Absolute Pressure Sensor), or other devices. In this embodiment of the invention, the device under test is configured as a TMAP sensor integrating pressure and temperature sensing functions for illustrative purposes only.
[0024] like Figure 1As shown, this invention designs an automatic temperature gradient testing bench. The testing bench includes a main control computer 1, an environmental chamber 2, a power supply 3, a signal acquisition module, a pressure controller 5, and a product connection port 9.
[0025] The main control computer 1 serves as the core of the system, running the host computer software and responsible for process control and data processing. The main control computer 1 is communicatively connected to the environmental chamber 2, the power supply 3, the signal acquisition module, and the pressure controller 5.
[0026] In some embodiments, the signal acquisition module includes a digital multimeter 4 and a SENT acquisition card 8, thereby enabling multiple acquisition of analog and digital signals. The digital multimeter 4 is configured to acquire the voltage or temperature signal of the sensor under test that outputs an analog signal; the SENT acquisition card 8 is configured to acquire the digital voltage or temperature signal of the sensor under test that outputs a digital signal. The host computer 1 is configured to selectively read data from the digital multimeter 4 or the SENT acquisition card 8 according to the type of sensor under test.
[0027] Environmental chamber 2 is configured to house the sensor under test and regulate the test environment temperature. For example, the environmental chamber can provide a temperature environment from -40°C to 150°C and communicate with the host computer via GPIB or Ethernet.
[0028] The power supply 3 is electrically connected to the sensor under test via the product connection port 9 and is configured to provide the test voltage. For example, a programmable power supply can be used, controlled by a GPIB card, to provide a precise power supply voltage to the device under test.
[0029] The pressure controller 5 is connected to the gas path of the sensor under test and is configured to regulate the ambient pressure of the sensor under test. In some embodiments, the test bench of the present invention further includes a vacuum pump 6 and a compressed gas source. The vacuum pump 6 and the compressed gas source are respectively connected to the input terminal of the pressure controller 5, providing negative pressure and positive pressure gas sources respectively to support the pressure controller 5 in performing full-range pressure regulation.
[0030] In some embodiments, a reference pressure sensor is installed inside the environmental chamber 2, near the sensor being measured. The main control computer 1 is also configured to receive real-time pressure data from the reference pressure sensor and construct a dual closed-loop control circuit based on this real-time pressure data and feedback data from the pressure controller 5 to compensate for pressure deviations caused by temperature differences inside and outside the environmental chamber and by pipeline transmission. This method enables dual closed-loop control.
[0031] The main control computer 1 is configured to execute a test sequence: sequentially control the environmental chamber 2, power supply 3 and pressure controller 5 to reach the preset temperature, voltage and pressure target values, and acquire the feedback signal of the sensor under test through the signal acquisition module.
[0032] The main control computer 1 is also equipped with a transient feature analysis module: the transient feature analysis module is configured to control the signal acquisition module to record the response curve of the sensor under test at a preset high sampling rate and extract the dynamic features of the response curve during the transition process of the pressure controller 5 adjusting the pressure.
[0033] like Figure 2 As shown, the test procedure in this embodiment is as follows: Step S1: After initialization and self-test begins, the system first checks all connected devices under test (DUT) at room temperature (RT). It reads the feedback from the DUT; if the connection status is abnormal, an alarm is triggered; otherwise, it enters the main loop.
[0034] Step S2: The temperature gradient control main control computer reads the test configuration (e.g., temperature points such as -40℃, 20℃, 150℃, etc.).
[0035] Command issued: Control the ambient temperature chamber to rise or fall to the target point.
[0036] Stability assessment: The system can be determined to be stable in two ways: Method 1: Wait for the preset fixed "stabilization time".
[0037] Method 2 ( Figure 2 (Not shown in the image): The first derivative of the temperature sensor is monitored, and the system is considered stable when the rate of change is consistently below a threshold.
[0038] Step S3: Voltage and Pressure Traversal After the current temperature stabilizes, the system begins to traverse voltage points (e.g., 4.5V, 5.0V, 5.5V) and pressure points (e.g., 10kPa to 400kPa).
[0039] Voltage setting: Controls the target voltage output by the power supply.
[0040] Pressure setting: The main control computer sends the target pressure command to the pressure controller. Simultaneously, it reads the value of the reference pressure sensor Ref_P inside the chamber. The deviation e(t) = P is calculated. target -P real If the deviation exceeds the allowable range, the PID algorithm is used to correct the command sent to the pressure controller until the actual pressure inside the tank reaches the standard.
[0041] Step S4: Data collection and AI diagnosis.
[0042] Transient acquisition: During the pressure adjustment process of the pressure controller (i.e., the dynamic range of pressure change), the acquisition card records the output waveform of the device under test at a high frequency (e.g., 1kHz).
[0043] Feature extraction: Software analysis of waveform rise time T r and overshoot M p If Tr If the waveform is abnormally large, the system will prompt "potential blockage of pores"; if the waveform oscillates, it will prompt "abnormal structural damping".
[0044] Steady-state recording: After the pressure has completely stabilized, record the final measurement value and calculate the accuracy error.
[0045] Step S5: Loop and End.
[0046] The software determines whether the current step is the last pressure, voltage, or temperature point. If not, it jumps to the corresponding step to continue execution; if all steps are completed, the system automatically resets the equipment, saves the data, generates a report, and the test ends.
[0047] Figure 3 This is a flowchart illustrating an automatic temperature gradient testing method according to an embodiment of the present invention.
[0048] like Figure 3 As shown, in step S301, a test sequence containing multiple temperature points, voltage points, and air pressure points is acquired, and the environmental chamber is controlled to adjust to the target temperature point. In some embodiments, before controlling the environmental chamber to adjust to the target temperature point, a test device inspection step is also included: under normal temperature conditions, the test bench is controlled to perform preliminary power-on and communication tests on all connected sensors under test, and the subsequent variable temperature test process is started only when all sensors under test are in normal condition.
[0049] In step S302, after the temperature stabilizes, the power supply is adjusted to the target voltage point, and the pressure controller is adjusted to the target pressure point. In some embodiments, the process of adjusting to the target pressure point employs dual closed-loop compensation control; in this embodiment, a cascaded PID control strategy can be introduced. This strategy uses the deep control loop of the pressure controller to respond quickly and stabilize the pressure at the set value. Simultaneously, a high-precision reference pressure sensor is added inside the environmental chamber, close to the device under test. The main control computer reads the measured value detected by this reference pressure sensor, calculates the deviation, and sends it to the pressure controller, thus forming another closed loop. Specifically, this includes the following steps: In step S3021, the main control computer reads the measured value of the reference pressure sensor inside the environmental chamber as a feedback variable. The main control computer reads the target pressure P at the current test point. target and target temperature T target The main control computer uses a preset lookup table to search for the current T. target Obtain the initial compensation value for pipeline pressure loss P init Send the initial command P to the pressure controller. set =P target + Pinit Next, the dynamic compensation loop is entered, and the measured value P of the reference pressure sensor inside the environmental chamber is read. real .
[0050] In step S3022, the deviation e(t) between the measured value and the target pressure point is calculated. e(t) = P target -P real .
[0051] In step S3023, a correction amount is calculated based on the deviation using a PID algorithm, and the setting command sent to the pressure controller 5 is updated until the deviation between the measured value and the target pressure point is within a preset threshold range. In a practical application scenario, it can be determined whether |e(t)| is less than the allowable error threshold δ. If so, and the holding time is greater than ttable, the pressure is locked, the loop is exited, and subsequent data acquisition is triggered. If not, an incremental PID algorithm can be used to calculate the correction amount. For example, the correction amount... u(k)=K p [e(k)-e(k-1)]+K i e(k)+K d [e(k)-2e(k-1)+e(k-2)]. Update the pressure controller setpoint P. new_set =P current_set + u(k). Where P current_set This is the current setpoint. After waiting for the control cycle, the measured value P from the reference pressure sensor inside the environmental chamber will be fed back. real The dynamic compensation process restarts after each step until the loop is exited.
[0052] Furthermore, this embodiment also includes an AI fault diagnosis step based on transient response characteristics, specifically including: starting high-speed data acquisition at the beginning of pressure regulation to record the transient response waveform of the sensor under test from the current pressure to the target pressure; extracting feature vectors from the transient response waveforms, the feature vectors including at least rise time, overshoot and steady-state error; inputting the feature vectors into a pre-trained fault classification model to identify whether the sensor under test has physical defects such as pore blockage, structural damage or abnormal stress.
[0053] In step S303, after the pressure stabilizes, the output data of the sensor under test is collected. The pressure stabilization determination can be achieved using an adaptive gradient algorithm: the first derivative of the output data of the sensor under test is calculated in real time, and the pressure is determined to be stable only when the first derivative is continuously lower than the stabilization threshold for a preset duration, and the output data of the sensor under test is collected.
[0054] At step S304, it is determined whether all voltage and air pressure test points at the current temperature point have been completed. If not, the power supply and pressure controller are controlled again; if completed, the process proceeds to the next temperature point until the test ends.
[0055] This invention, through the aforementioned scheme, realizes a testing system integrating automatic control of temperature, pressure, and voltage, and possessing high progress compensation and intelligent diagnostic functions. By coordinating and automatically adjusting the three physical quantities of temperature, air pressure, and voltage, it significantly saves manpower and reduces repetitive labor. By integrating a digital multimeter and a SENT acquisition card, it can simultaneously support the testing of analog signal products (e.g., TMAP or MAP) and digital signal products (DMAP or DTMAP). Furthermore, this invention effectively solves the problem of air path pressure attenuation and fluctuation under extreme temperatures within the environmental chamber by employing a dual closed-loop control strategy, improving the accuracy of test data. In addition, this invention identifies potential internal hazards of the product through transient response analysis, achieving intelligent fault diagnosis.
[0056] In the foregoing description of this specification, unless otherwise expressly specified and limited, the terms "fixed," "installed," "connected," or "linked" should be interpreted broadly. For example, the term "linked" can refer to a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium; or it can refer to the internal communication of two components or the interaction between two components. Therefore, unless otherwise expressly limited in this specification, those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.
[0057] Based on the above description in this specification, those skilled in the art will also understand that terms used, such as "upper," "lower," "front," "rear," "left," "right," "length," "width," "thickness," "vertical," "horizontal," "top," "bottom," "inner," "outer," "axial," "radial," "circumferential," "center," "longitudinal," "transverse," "clockwise," or "counterclockwise," are terms indicating orientation or positional relationships based on the orientation or positional relationships shown in the accompanying drawings of this specification. They are only for the purpose of facilitating the explanation of the present invention and simplifying the description, and do not imply that the devices or elements involved must have the specific orientation, or be constructed and operated in a specific orientation. Therefore, the above-mentioned orientation or positional relationship terms should not be understood or interpreted as limitations on the present invention.
[0058] While this specification has shown and described numerous embodiments of the invention, it will be apparent to those skilled in the art that such embodiments are provided by way of example only. Many modifications, alterations, and alternatives will occur to those skilled in the art without departing from the spirit and essence of the invention. It should be understood that various alternatives to the embodiments of the invention described herein may be employed in the practice of this invention.
Claims
1. An automatic temperature gradient testing bench, characterized in that, include: The system includes a main control computer (1), an environmental chamber (2), a power supply (3), a signal acquisition module, a pressure controller (5), and a product connection port (9). The main control computer (1) is communicatively connected to the environmental chamber (2), the power supply (3), the signal acquisition module, and the pressure controller (5). The environmental chamber (2) is configured to accommodate the device under test and adjust the test environment temperature. The power supply (3) is electrically connected to the device under test through the product connection port (9) and is configured to provide test voltage. The pressure controller (5) is connected to the air circuit of the device under test and is configured to adjust the environmental pressure of the device under test. The main control computer (1) is configured to execute a test sequence: sequentially control the environmental chamber (2), the power supply (3), and the pressure controller (5) to reach the preset temperature point, voltage point, and air pressure point target values, and obtain the feedback signal of the device under test through the signal acquisition module.
2. The automatic temperature gradient testing bench according to claim 1, characterized in that, The test bench also includes a reference pressure sensor located inside the environmental chamber (2) and close to the device under test; the main control computer (1) is also configured to receive the real-time pressure data from the reference pressure sensor and construct a dual closed-loop control circuit based on the real-time pressure data and the feedback data from the pressure controller (5) to compensate for the temperature difference inside and outside the environmental chamber and the air pressure deviation caused by pipeline transmission.
3. The automatic temperature gradient testing bench according to claim 1, characterized in that, The signal acquisition module includes: A digital multimeter (4) is configured to acquire the voltage or temperature signal of the device under test that outputs an analog signal; The SENT acquisition card (8) is configured to acquire digital voltage or temperature signals of the device under test that output digital signals; the main control computer (1) is configured to selectively read data through the digital multimeter (4) or the SENT acquisition card (8) according to the type of device under test.
4. The automatic temperature gradient testing bench according to claim 1, characterized in that, It also includes a vacuum pump (6) and a compressed air source: the vacuum pump (6) and the compressed air source are respectively connected to the input terminal of the pressure controller (5) to provide negative pressure and positive pressure air sources to support the pressure controller (5) to perform full-range pressure regulation.
5. The automatic temperature gradient testing bench according to claim 1, characterized in that, The main control computer (1) is also equipped with a transient feature analysis module: the transient feature analysis module is configured to control the signal acquisition module to record the response curve of the device under test at a preset high sampling rate during the transition process of the pressure controller (5) adjusting the pressure, and extract the dynamic features of the response curve.
6. An automatic temperature gradient testing method based on the test bench according to any one of claims 1-5, characterized in that, Includes the following steps: Acquire a test sequence containing multiple temperature, voltage, and pressure points, and control the environmental chamber to adjust to the target temperature point; After the temperature stabilizes, the power supply is adjusted to the target voltage point, and the pressure controller is adjusted to the target air pressure point. After the pressure stabilizes, collect the output data of the device under test; Determine whether all voltage and pressure test points at the current temperature have been completed. If not, re-control the power supply and pressure controller; if completed, proceed to the next temperature point until the test ends.
7. The automatic temperature gradient testing method according to claim 6, characterized in that, The process of adjusting to the target air pressure point employs dual closed-loop compensation control, including: The main control computer reads the measured value of the reference pressure sensor inside the environmental chamber as a feedback variable; Calculate the deviation between the measured value and the target pressure point; Based on the deviation, the correction amount is calculated using a PID algorithm, and the setting command sent to the pressure controller (5) is updated until the deviation between the measured value and the target air pressure point is within the preset threshold range.
8. The automatic temperature gradient testing method according to claim 6, characterized in that, It also includes AI fault diagnosis steps based on transient response characteristics, specifically including: High-speed data acquisition is initiated at the moment of pressure regulation to record the transient response waveform of the device under test from the current pressure change to the target pressure; Extract a feature vector from the transient response waveform, the feature vector including at least rise time, overshoot and steady-state error; The feature vector is input into a pre-trained fault classification model to identify whether the tested equipment has physical defects such as blocked pores, structural damage, or abnormal stress.
9. The automatic temperature gradient testing method according to claim 6, characterized in that, Before the controlled environment chamber is adjusted to the target temperature, a test piece inspection step is also included. Under normal temperature conditions, the control test bench performs preliminary power-on and communication tests on all connected devices under test. Only when all devices under test are in normal condition will the subsequent temperature change test process be initiated.
10. The automatic temperature gradient testing method according to claim 6, characterized in that, The pressure stability determination uses an adaptive gradient algorithm: The first derivative of the output data of the device under test is calculated in real time. Only when the first derivative is continuously lower than the stability threshold for a preset duration is the pressure determined to be stable and the output data of the device under test is collected.