Multistage biconical multi-cavity dynamic gas lock device
By designing a multi-stage double-cone multi-cavity dynamic gas lock device, the problems of uneven airflow distribution and contaminant migration in the existing technology are solved, enabling the rapid inflow of clean gas and the rapid discharge of contaminants, thereby improving the beam stability and imaging quality of the extreme ultraviolet lithography machine.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- GUANGDONG OCEAN UNIVERSITY
- Filing Date
- 2026-03-05
- Publication Date
- 2026-04-21
AI Technical Summary
The existing dynamic gas lock device with a single conical pipe configuration cannot effectively control the airflow distribution in extreme ultraviolet lithography machines, causing contaminants to migrate into the projection lens chamber, affecting the lithography imaging quality and equipment stability. At the same time, the lack of a rapid extraction mechanism for contaminant gases reduces beam transmittance and imaging stability.
The device employs a multi-stage double-cone multi-cavity dynamic gas lock, which uses a multi-stage double-cone pipe section connected in series with a multi-stage straight cylindrical gas cavity section. It is equipped with convection and suppression sections, and combined with the distribution of the air inlet and intake port, it ensures that clean gas flows into the chamber quickly and pollutants are discharged rapidly, preventing damage to the optical aperture channel from the high-pressure gas zone.
It effectively improves the ability to suppress pollutants, enhances the transmittance and imaging stability of extreme ultraviolet light, prevents deformation of the light aperture channel and diffusion of pollutants, and meets the cleanliness requirements of the projection lens chamber.
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Figure CN121900115A_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of extreme ultraviolet lithography technology, and in particular relates to a multi-stage double-cone multi-cavity dynamic gas lock device. Background Technology
[0002] Extreme ultraviolet (EUV) lithography machines use 10-14 nanometer ultraviolet light as a light source and can be used to manufacture chips with advanced processes of 14 nanometers and below. Since EUV light is absorbed by air and most materials, the light source system, projection lens system, and wafer stage system of EUV lithography machines have different vacuum and cleanliness requirements to prevent absorption by contaminants generated during silicon wafer stage processing.
[0003] For silicon wafer chambers, which do not contain optical components, a certain amount of contaminants are allowed. These contaminants are hydrocarbons and water vapor produced by the photochemical reaction of photoresist on the silicon wafer surface under extreme ultraviolet radiation. Therefore, the requirements for clean vacuum are relatively low.
[0004] For projection lens chambers, since they contain reflective optical systems, it is necessary not only to ensure the transmittance of extreme ultraviolet radiation, but also to prevent contaminants that enter through free diffusion from causing carbon deposition and oxidation reactions on the surface of optical elements. Carbon deposition and oxidation reactions will lead to a decrease in the reflectivity of optical elements and a shortened lifespan. Therefore, projection lens chambers must maintain an ultra-clean vacuum environment.
[0005] To transmit the extreme ultraviolet (EUV) beam from the projection lens chamber to the silicon wafer stage chamber, the light source system of an EUV lithography machine is equipped with an aperture channel for the EUV light to pass through. However, due to the different gas environment requirements between the projection lens chamber and the silicon wafer stage chamber, maintaining a vacuum and high cleanliness within the aperture channel, and effectively isolating contaminants from the silicon wafer processing, are key factors affecting the lithography imaging quality and equipment stability.
[0006] To prevent carbon-based contaminants, metal particles, and other volatiles generated in the silicon wafer stage chamber from entering the projection lens chamber, existing dynamic gas lock devices typically employ a single-cone pipe configuration. This involves introducing clean gas at one end of the aperture channel to create a barrier. While this single-cone pipe configuration can mitigate back diffusion of contaminants to some extent, it still suffers from the following drawbacks: ① The clean gas introduction direction is relatively unidirectional, easily leading to uneven airflow distribution within the aperture channel. Backflow and high-pressure zones are prone to form in the central area, increasing the likelihood of contaminants migrating into the projection lens chamber. It may also scour and damage the aperture channel, potentially causing localized stress concentration, deformation, or even microcracks, resulting in fine particulate contaminants. ② The ability to control the flow field is limited, creating a bottleneck in further improving the cleanliness of the projection lens chamber. ③ There is a lack of a rapid extraction mechanism for contaminant gases, making it difficult to promptly remove contaminants that have already entered the aperture channel, thus affecting the transmittance of extreme ultraviolet light and imaging stability within the aperture channel.
[0007] As extreme ultraviolet (EUV) lithography technology continues to develop towards higher numerical apertures, the cleanliness requirements of EUV lithography machine light source systems are also constantly increasing. For existing dynamic gas lock devices with a single conical pipe configuration, their shortcomings in terms of contaminant suppression efficiency, clean gas utilization efficiency, and stable beam transmission are becoming increasingly prominent. Summary of the Invention
[0008] To address the problems of existing technologies, this invention provides a multi-stage double-cone multi-cavity dynamic gas lock device. It proposes for the first time a series configuration of multi-stage double-cone pipe sections and multi-stage straight-cylinder gas chamber sections. Each stage of the double-cone pipe section in the optical aperture channel is divided into a convection section and a suppression section. The larger end of the convection section faces the projection lens chamber, and the smaller end of the convection section connects with the smaller end of the suppression section to form a narrow throat. The larger end of the suppression section faces the silicon wafer stage chamber. Each stage of the straight-cylinder gas chamber section in the optical aperture channel has an air inlet on its circumferential wall and both end walls. And / or an air intake; this ensures that the continuously contracting extreme ultraviolet light is transmitted within the aperture channel, and also ensures that the clean gas introduced by the air intake can quickly flow into the projection lens chamber and the silicon wafer stage chamber, effectively improving the suppression efficiency of contaminants; through the multi-stage distribution of air intakes on the straight cylindrical air chamber wall, the clean gas carrying contaminants in the aperture channel can be quickly discharged, meeting the cleanliness requirements of the projection lens chamber, further improving the extreme ultraviolet light transmittance, and at the same time preventing the generation of high-pressure gas zones that could damage the aperture channel wall.
[0009] To achieve the above objectives, the present invention adopts the following technical solution: a multi-stage double-cone multi-cavity dynamic gas lock device, comprising a multi-stage double-cone pipe section and a multi-stage straight-cylinder gas cavity section in series configuration, wherein the multi-stage double-cone pipe section and the multi-stage straight-cylinder gas cavity section are alternately distributed; each stage of the double-cone pipe section of the aperture channel is divided into a convection section and a suppression section; in any single double-cone pipe section, the large end of the convection section faces the projection lens chamber, the small end of the convection section connects with the small end of the suppression section to form a narrow throat, and the large end of the suppression section faces the silicon wafer stage chamber; in any single straight-cylinder gas cavity section, the channel opening facing the projection lens chamber connects with the large end of the suppression section of the double-cone pipe section, and the channel opening facing the silicon wafer stage chamber connects with the large end of the convection section of the double-cone pipe section. The cylindrical air chamber section is connected end-to-end, and air inlets and / or suction ports are provided on the circumferential and end walls of the straight cylindrical section. In the double-conical pipe section adjacent to the projection lens chamber, the large end of the convection section is connected to the projection lens chamber, and at least one row of air inlets is provided on the pipe wall of the convection section along the axial direction. At least one row of air inlets is provided on the pipe wall of the suppression section along the axial direction. In the double-conical pipe section adjacent to the silicon wafer stage chamber, the large end of the suppression section is connected to the silicon wafer stage chamber, and at least one row of air inlets is provided on the pipe wall of the suppression section along the axial direction. When there are three or more double-conical pipe sections, in any single double-conical pipe section located in the middle position, at least one row of air inlets is provided on the pipe wall of the suppression section along the axial direction.
[0010] In any single double-conical pipe section, the central axis of the air inlet forms an acute angle with the central axis of the optical aperture channel, and the tip of the acute angle points toward the silicon wafer stage chamber.
[0011] In any single double-conical pipe section, there are multiple air inlets in the same row, and these multiple air inlets are evenly distributed along the circumference of the pipe wall.
[0012] In any single double-conical pipe section, the number and spacing of the air inlets in the same row in the circumferential direction are determined based on the pollutant suppression effectiveness.
[0013] In any single double-cone pipe section, each air inlet is independently equipped with a mass flow controller. The flow rate of the clean gas entering the air inlet is adjusted by the mass flow controller. The clean gas can be a single gas or a mixture of gases.
[0014] In any single straight cylindrical air chamber section, when an air inlet and an air intake are provided on the circumferential cylindrical wall, the air inlet and the air intake are mirror-symmetrically distributed with a phase angle of 180°, and the central axis of the air inlet and the air intake is perpendicular to the central axis of the light hole channel; when only an air intake is provided on the circumferential cylindrical wall, there are multiple air intakes, which are evenly distributed along the circumference of the cylindrical wall.
[0015] In any single cylindrical air chamber section, when an air inlet and an air outlet are provided on the cylinder wall facing the projection lens chamber, the air inlet and air outlet are mirror-symmetrically distributed with a 180° phase angle. The central axis of the air inlet and air outlet forms an acute angle with the central axis of the optical aperture channel, and the tip of the acute angle faces the silicon wafer stage chamber. When only an air outlet is provided on the circumferential cylinder wall, there are multiple air outlets, which are evenly distributed along the circumference of the cylinder wall.
[0016] In any single cylindrical air chamber section, when an air inlet and an air outlet are provided on the cylinder wall facing the silicon wafer stage chamber, the air inlet and air outlet are mirror-symmetrically distributed with a 180° phase angle. The central axis of the air inlet and air outlet forms an acute angle with the central axis of the optical aperture channel, and the tip of the acute angle faces the projection lens chamber. When only air outlets are provided on the circumferential cylinder wall, there are multiple air outlets, which are evenly distributed along the circumferential direction of the cylinder wall. The number and spacing of the air outlets in the circumferential direction are determined according to the pollutant suppression efficiency.
[0017] In any single cylindrical air chamber section, each air inlet is independently equipped with a mass flow controller. The flow rate of the clean gas entering the air inlet is adjusted by the mass flow controller. The clean gas can be a single gas or a mixture of gases. Each suction port is independently equipped with a vacuum pump group, which adjusts the pumping speed of the clean gas.
[0018] The cross-sectional shape of the optical aperture channel is circular or rectangular, and the transition between the inner wall of the optical aperture channel and the air inlet and air outlet is set with rounded or straight chamfers.
[0019] The beneficial effects of this invention are: The multi-stage double-cone multi-cavity dynamic gas lock device of the present invention proposes for the first time a series configuration of multi-stage double-cone pipe sections and multi-stage straight cylindrical gas chamber sections. Each stage of the double-cone pipe section of the optical aperture channel is divided into a convection section and a suppression section. The large end of the convection section faces the projection lens chamber, and the small end of the convection section connects with the small end of the suppression section to form a narrow throat. The large end of the suppression section faces the silicon wafer stage chamber. Each stage of the straight cylindrical gas chamber section of the optical aperture channel is provided with an air inlet and / or an air intake on its circumferential cylindrical wall and both end cylindrical walls. It can ensure that the continuously shrinking extreme ultraviolet light is transmitted within the aperture channel, and also ensure that the clean gas introduced by the air inlet can quickly flow into the projection lens chamber and the silicon wafer stage chamber, effectively improving the suppression efficiency of pollutants. Through the multi-stage air intake ports distributed on the straight cylindrical air chamber section wall, the clean gas carrying pollutants in the aperture channel can be quickly discharged, meeting the cleanliness requirements of the projection lens chamber, further improving the extreme ultraviolet light transmittance, and at the same time preventing the generation of high-pressure gas zones that could damage the aperture channel wall. Attached Figure Description
[0020] Figure 1This is a schematic diagram of the structure of a multi-stage double-cone multi-cavity dynamic gas lock device according to the present invention (Embodiment 1); Figure 2 This is a schematic diagram of the structure of a multi-stage double-cone multi-cavity dynamic gas lock device according to the present invention (Embodiment 2); Figure 3 This is a structural schematic diagram of a multi-stage double-cone multi-cavity dynamic gas lock device according to the present invention (Embodiment 3); Figure 4 This is a schematic diagram of the structure of a multi-stage double-cone multi-cavity dynamic gas lock device according to the present invention (Example 4); In the figure, 1—convection section, 2—suppression section, 3—projection lens chamber, 4—silicon wafer stage chamber, 5—air inlet, 6—inhalation port, 7—narrow throat, 8—straight cylindrical air chamber section. Detailed Implementation
[0021] The present invention will now be described in further detail with reference to the accompanying drawings and specific embodiments.
[0022] Example 1
[0023] like Figure 1 As shown, a multi-stage double-cone multi-cavity dynamic gas lock device employs a configuration of two-stage double-cone pipe sections and a single-stage straight-cylinder gas cavity section 8 connected in series, with the single-stage straight-cylinder gas cavity section 8 located between the two-stage double-cone pipe sections. Each stage of the double-cone pipe section of the aperture channel is divided into a convection section 1 and a suppression section 2. In any single double-cone pipe section, the larger end of the convection section 1 faces the projection lens chamber 3, and the smaller end of the convection section 1 connects with the smaller end of the suppression section 2 to form a narrow throat 7. The larger end of the suppression section 2 faces the silicon wafer stage chamber 4. In the straight-cylinder gas cavity section 8, the channel opening facing the projection lens chamber 3 connects with the larger end of the suppression section 2 of the double-cone pipe section. The passage opening facing the silicon wafer stage chamber 4 is connected to the large end of the convection section 1 of the double-conical pipe section. Air inlets 5 and suction ports 6 are provided on the circumferential and end walls of the straight cylindrical air chamber section 8. In the double-conical pipe section adjacent to the projection lens chamber 3, the large end of the convection section 1 is connected to the projection lens chamber 3. A row of air inlets 5 is provided along the axial direction on the pipe wall of the convection section 1, and a row of air inlets 5 is provided along the axial direction on the pipe wall of the suppression section 2. In the double-conical pipe section adjacent to the silicon wafer stage chamber 4, the large end of the suppression section 2 is connected to the silicon wafer stage chamber 4, and a row of air inlets 5 is provided along the axial direction on the pipe wall of the suppression section 2.
[0024] In any single double-conical pipe section, the central axis of the air inlet 5 forms an acute angle with the central axis of the optical aperture channel, and the tip of the acute angle faces the silicon wafer stage chamber 4; there are six air inlets 5 in the same row, and the six air inlets 5 are evenly distributed along the circumference of the pipe wall; each air inlet 5 is independently equipped with a mass flow controller, and the flow rate of the clean gas inlet 5 is adjusted by the mass flow controller. The clean gas is a mixture of one or more of the following gases: hydrogen, helium, nitrogen, neon, and argon.
[0025] In the cylindrical air chamber section 8, the air inlet 5 and air outlet 6 on the circumferential cylindrical wall are mirror-symmetrically distributed with a 180° phase angle, and the central axes of the air inlet 5 and air outlet 6 are perpendicular to the central axis of the optical aperture channel; the air inlet 5 and air outlet 6 on the cylindrical wall facing the projection lens chamber 3 are mirror-symmetrically distributed with a 180° phase angle, and the central axes of the air inlet 5 and air outlet 6 form an acute angle with the central axis of the optical aperture channel, with the tip of the acute angle pointing towards the silicon wafer stage chamber 4; the air inlet 5 and air outlet 6 on the cylindrical wall facing the silicon wafer stage chamber 4 The components are mirror-symmetrically distributed with a 180° phase angle between them. The central axes of the air inlets 5 and 6 form an acute angle with the central axis of the optical aperture channel, and the tip of the acute angle points towards the projection lens chamber 3. Each air inlet 5 is independently equipped with a mass flow controller, and the flow rate of the clean gas inlet 5 is adjusted by the mass flow controller. The clean gas is a mixture of one or more of the following gases: hydrogen, helium, nitrogen, neon, and argon. Each air inlet 6 is independently equipped with a vacuum pump group, and the pumping speed of the clean gas is adjusted by the vacuum pump group.
[0026] The cross-sectional shape of the optical aperture channel is circular, and the transition between the inner wall of the optical aperture channel and the air inlet and air outlet is rounded.
[0027] Example 2
[0028] like Figure 2As shown, a multi-stage double-cone multi-cavity dynamic gas lock device employs a configuration of three-stage double-cone pipe sections and two-stage straight-cylinder gas cavity sections 8 connected in series, with the three-stage double-cone pipe sections and two-stage straight-cylinder gas cavity sections 8 alternating in distribution. Each stage of the double-cone pipe section in the aperture channel is divided into a convection section 1 and a suppression section 2. In any single double-cone pipe section, the larger end of the convection section 1 faces the projection lens chamber 3, and the smaller end of the convection section 1 connects with the smaller end of the suppression section 2 to form a narrow throat 7. The larger end of the suppression section 2 faces the silicon wafer stage chamber 4. In any single straight-cylinder gas cavity section 8, the channel opening facing the projection lens chamber 3 connects with the larger end of the suppression section 2 of the double-cone pipe section, and the channel opening facing the silicon wafer stage chamber 4 connects with the double-cone pipe section 8. The convection section 1 of the section is connected at its large end. The straight cylindrical air chamber section 8 has an air inlet 5 and an air intake 6 on its circumferential and end walls. In the double-conical pipe section adjacent to the projection lens chamber 3, the large end of the convection section 1 is connected to the projection lens chamber 3, and a row of air inlets 5 is arranged along the axial direction on the pipe wall of the convection section 1. A row of air inlets 5 is also arranged along the axial direction on the pipe wall of the suppression section 2. In the double-conical pipe section adjacent to the silicon wafer stage chamber 4, the large end of the suppression section 2 is connected to the silicon wafer stage chamber 4, and a row of air inlets 5 is arranged along the axial direction on the pipe wall of the suppression section 2. In the double-conical pipe section located in the middle, a row of air inlets 5 is arranged along the axial direction on the pipe wall of the suppression section 2.
[0029] In any single double-conical pipe section, the central axis of the air inlet 5 forms an acute angle with the central axis of the optical aperture channel, and the tip of the acute angle faces the silicon wafer stage chamber 4; there are eight air inlets 5 in the same row, and the eight air inlets 5 are evenly distributed along the circumference of the pipe wall; each air inlet 5 is independently equipped with a mass flow controller, and the flow rate of the clean gas inlet 5 is adjusted by the mass flow controller. The clean gas is a mixture of one or more of the following gases: hydrogen, helium, nitrogen, neon, and argon.
[0030] In the cylindrical air chamber section 8, the air inlet 5 and air outlet 6 on the circumferential cylindrical wall are mirror-symmetrically distributed with a 180° phase angle, and the central axes of the air inlet 5 and air outlet 6 are perpendicular to the central axis of the optical aperture channel; the air inlet 5 and air outlet 6 on the cylindrical wall facing the projection lens chamber 3 are mirror-symmetrically distributed with a 180° phase angle, and the central axes of the air inlet 5 and air outlet 6 form an acute angle with the central axis of the optical aperture channel, with the tip of the acute angle pointing towards the silicon wafer stage chamber 4; the air inlet 5 and air outlet 6 on the cylindrical wall facing the silicon wafer stage chamber 4 The components are mirror-symmetrically distributed with a 180° phase angle between them. The central axes of the air inlets 5 and 6 form an acute angle with the central axis of the optical aperture channel, and the tip of the acute angle points towards the projection lens chamber 3. Each air inlet 5 is independently equipped with a mass flow controller, and the flow rate of the clean gas inlet 5 is adjusted by the mass flow controller. The clean gas is a mixture of one or more of the following gases: hydrogen, helium, nitrogen, neon, and argon. Each air inlet 6 is independently equipped with a vacuum pump group, and the pumping speed of the clean gas is adjusted by the vacuum pump group.
[0031] The cross-sectional shape of the optical aperture channel is rectangular, and the transition between the inner wall of the optical aperture channel and the air inlet and air outlet is set as a straight chamfer.
[0032] Example 3
[0033] like Figure 3 As shown, a multi-stage double-cone multi-cavity dynamic gas lock device employs a configuration of four-stage double-cone pipe sections and three-stage straight-cylinder gas cavity sections 8 connected in series, with the four-stage double-cone pipe sections and three-stage straight-cylinder gas cavity sections 8 alternating in distribution. Each stage of the double-cone pipe section in the aperture channel is divided into a convection section 1 and a suppression section 2. In any single double-cone pipe section, the larger end of the convection section 1 faces the projection lens chamber 3, and the smaller end of the convection section 1 connects with the smaller end of the suppression section 2 to form a narrow throat 7. The larger end of the suppression section 2 faces the silicon wafer stage chamber 4. In any single straight-cylinder gas cavity section 8, the channel opening facing the projection lens chamber 3 connects with the larger end of the suppression section 2 of the double-cone pipe section, and the channel opening facing the silicon wafer stage chamber 4 connects with the smaller end of the suppression section 2 of the double-cone pipe section. The convection section 1 is connected at its large end, and the straight cylindrical air chamber section 8 is provided with air inlets 5 and air intakes 6 on its circumferential and end cylindrical walls. In the double-conical pipe section adjacent to the projection lens chamber 3, the large end of the convection section 1 is connected to the projection lens chamber 3, and a row of air inlets 5 is provided on the pipe wall of the convection section 1 along the axial direction. A row of air inlets 5 is provided on the pipe wall of the suppression section 2 along the axial direction. In the double-conical pipe section adjacent to the silicon wafer stage chamber 4, the large end of the suppression section 2 is connected to the silicon wafer stage chamber 4, and a row of air inlets 5 is provided on the pipe wall of the suppression section 2 along the axial direction. In any single double-conical pipe section located in the middle position, a row of air inlets 5 is provided on the pipe wall of the suppression section 2 along the axial direction.
[0034] In any single double-conical pipe section, the central axis of the air inlet 5 forms an acute angle with the central axis of the optical aperture channel, and the tip of the acute angle faces the silicon wafer stage chamber 4; there are six air inlets 5 in the same row, and the six air inlets 5 are evenly distributed along the circumference of the pipe wall; each air inlet 5 is independently equipped with a mass flow controller, and the flow rate of the clean gas inlet 5 is adjusted by the mass flow controller. The clean gas is a mixture of one or more of the following gases: hydrogen, helium, nitrogen, neon, and argon.
[0035] In the cylindrical air chamber section 8, the air inlet 5 and air outlet 6 on the circumferential cylindrical wall are mirror-symmetrically distributed with a 180° phase angle, and the central axes of the air inlet 5 and air outlet 6 are perpendicular to the central axis of the optical aperture channel; the air inlet 5 and air outlet 6 on the cylindrical wall facing the projection lens chamber 3 are mirror-symmetrically distributed with a 180° phase angle, and the central axes of the air inlet 5 and air outlet 6 form an acute angle with the central axis of the optical aperture channel, with the tip of the acute angle pointing towards the silicon wafer stage chamber 4; the air inlet 5 and air outlet 6 on the cylindrical wall facing the silicon wafer stage chamber 4 The components are mirror-symmetrically distributed with a 180° phase angle between them. The central axes of the air inlets 5 and 6 form an acute angle with the central axis of the optical aperture channel, and the tip of the acute angle points towards the projection lens chamber 3. Each air inlet 5 is independently equipped with a mass flow controller, and the flow rate of the clean gas inlet 5 is adjusted by the mass flow controller. The clean gas is a mixture of one or more of the following gases: hydrogen, helium, nitrogen, neon, and argon. Each air inlet 6 is independently equipped with a vacuum pump group, and the pumping speed of the clean gas is adjusted by the vacuum pump group.
[0036] The cross-sectional shape of the optical aperture channel is circular, and the transition between the inner wall of the optical aperture channel and the air inlet and air outlet is rounded.
[0037] Example 4
[0038] like Figure 4As shown, a multi-stage double-cone multi-cavity dynamic gas lock device employs a configuration of four-stage double-cone pipe sections and three-stage straight-cylinder gas cavity sections 8 connected in series, with the four-stage double-cone pipe sections and three-stage straight-cylinder gas cavity sections 8 alternating in distribution. Each stage of the double-cone pipe section in the aperture channel is divided into a convection section 1 and a suppression section 2. In any single double-cone pipe section, the large end of the convection section 1 faces the projection lens chamber 3, and the small end of the convection section 1 connects with the small end of the suppression section 2 to form a narrow throat 7. The large end of the suppression section 2 faces the silicon wafer stage chamber 4. In any single straight-cylinder gas cavity section 8, the channel opening facing the projection lens chamber 3 connects with the large end of the suppression section 2 of the double-cone pipe section, and the channel opening facing the silicon wafer stage chamber 4 connects with the double-cone pipe section 8. The convection section 1 of the section is connected at its large end, and the straight cylindrical air chamber section 8 has only air intake ports 6 on its circumferential and end cylindrical walls; in the double conical pipe section adjacent to the projection lens chamber 3, the large end of the convection section 1 is connected to the projection lens chamber 3, and a row of air inlets 5 is provided on the pipe wall of the convection section 1 along the axial direction, and a row of air inlets 5 is provided on the pipe wall of the suppression section 2 along the axial direction; in the double conical pipe section adjacent to the silicon wafer stage chamber 4, the large end of the suppression section 2 is connected to the silicon wafer stage chamber 4, and a row of air inlets 5 is provided on the pipe wall of the suppression section 2 along the axial direction; in any single double conical pipe section located in the middle position, a row of air inlets 5 is provided on the pipe wall of the suppression section 2 along the axial direction.
[0039] In any single double-conical pipe section, the central axis of the air inlet 5 forms an acute angle with the central axis of the optical aperture channel, and the tip of the acute angle faces the silicon wafer stage chamber 4; there are eight air inlets 5 in the same row, and the eight air inlets 5 are evenly distributed along the circumference of the pipe wall; each air inlet 5 is independently equipped with a mass flow controller, and the flow rate of the clean gas inlet 5 is adjusted by the mass flow controller. The clean gas is a mixture of one or more of the following gases: hydrogen, helium, nitrogen, neon, and argon.
[0040] In the straight cylindrical air chamber section 8, there are eight air intake ports 6 on the circumferential cylindrical wall, and the eight air intake ports 6 are evenly distributed along the circumference of the cylindrical wall; there are eight air intake ports 6 on the cylindrical wall facing the projection lens chamber 3, and the eight air intake ports 6 are evenly distributed along the circumference of the cylindrical wall; there are eight air intake ports 6 on the cylindrical wall facing the silicon wafer stage chamber 4, and the eight air intake ports 6 are evenly distributed along the circumference of the cylindrical wall; each air intake port 6 is independently equipped with a vacuum pump group, and the pumping speed of the clean gas is adjusted by the vacuum pump group.
[0041] The cross-sectional shape of the optical aperture channel is rectangular, and the transition between the inner wall of the optical aperture channel and the air inlet and air outlet is set as a straight chamfer.
[0042] When the dynamic gas lock device adopts the technical solution of this invention, since the optical aperture channel adopts a four-stage double-conical pipe section and a three-stage straight cylindrical air chamber section 8 in series configuration, a multi-stage air curtain with gradient distribution can be formed along the central axis of the optical aperture channel. This forms multiple barriers to the diffusion of pollutants, ensuring stable transmission of extreme ultraviolet light within the optical aperture channel while effectively suppressing the migration of pollutants from the silicon wafer stage chamber 4 to the projection lens chamber 3. The negative pressure suction effect of the multi-stage air intake 6 can effectively and quickly discharge the clean gas carrying pollutants within the optical aperture channel, preventing a large amount of clean gas from accumulating within the optical aperture channel and effectively avoiding the generation of a high-pressure area for gas backflow. This satisfies the cleanliness requirements of the projection lens chamber 3 while reducing the density of pollutants diffusing into the projection lens chamber 3, thereby further improving the transmittance of extreme ultraviolet light and the suppression efficiency of pollutants.
[0043] The solutions in the embodiments are not intended to limit the scope of protection of the present invention. All equivalent implementations or modifications that do not depart from the present invention are included in the scope of protection of the present invention.
Claims
1. A multi-stage double-cone multi-cavity dynamic gas lock device, characterized in that: The system employs a multi-stage double-conical pipe section and a multi-stage straight-cylinder air chamber section connected in series, with the two sections alternating. Each stage of the double-conical pipe section in the aperture channel is divided into a convection section and a suppression section. In any single double-conical pipe section, the larger end of the convection section faces the projection lens chamber, and the smaller end of the convection section connects with the smaller end of the suppression section to form a narrow throat. The larger end of the suppression section faces the silicon wafer stage chamber. In any single straight-cylinder air chamber section, the channel opening facing the projection lens chamber connects with the larger end of the suppression section of the double-conical pipe section, and the channel opening facing the silicon wafer stage chamber connects with the larger end of the convection section of the double-conical pipe section. The circumferential wall and end cylinders of the straight-cylinder air chamber section... All pipe sections are provided with air inlets and / or air intakes; in the double-conical pipe section adjacent to the projection lens chamber, the large end of the convection section is connected to the projection lens chamber, and at least one row of air inlets is provided on the pipe wall of the convection section along the axial direction; in the double-conical pipe section adjacent to the silicon wafer stage chamber, the large end of the suppression section is connected to the silicon wafer stage chamber, and at least one row of air inlets is provided on the pipe wall of the suppression section along the axial direction; when the number of double-conical pipe sections is three or more, in any single double-conical pipe section located in the middle position, at least one row of air inlets is provided on the pipe wall of the suppression section along the axial direction.
2. The multi-stage double-cone multi-cavity dynamic gas lock device according to claim 1, characterized in that: In any single double-conical pipe section, the central axis of the air inlet forms an acute angle with the central axis of the optical aperture channel, and the tip of the acute angle points toward the silicon wafer stage chamber.
3. The multi-stage double-cone multi-cavity dynamic gas lock device according to claim 1, characterized in that: In any single double-conical pipe section, there are multiple air inlets in the same row, and these multiple air inlets are evenly distributed along the circumference of the pipe wall.
4. The multi-stage double-cone multi-cavity dynamic gas lock device according to claim 1, characterized in that: In any single double-conical pipe section, the number and spacing of the air inlets in the same row in the circumferential direction are determined based on the pollutant suppression effectiveness.
5. The multi-stage double-cone multi-cavity dynamic gas lock device according to claim 1, characterized in that: In any single double-cone pipe section, each air inlet is independently equipped with a mass flow controller. The flow rate of the clean gas entering the air inlet is adjusted by the mass flow controller. The clean gas can be a single gas or a mixture of gases.
6. The multi-stage double-cone multi-cavity dynamic gas lock device according to claim 1, characterized in that: In any single straight cylindrical air chamber section, when an air inlet and an air intake are provided on the circumferential cylindrical wall, the air inlet and the air intake are mirror-symmetrically distributed with a phase angle of 180°, and the central axis of the air inlet and the air intake is perpendicular to the central axis of the light hole channel; when only an air intake is provided on the circumferential cylindrical wall, there are multiple air intakes, which are evenly distributed along the circumference of the cylindrical wall.
7. The multi-stage double-cone multi-cavity dynamic gas lock device according to claim 1, characterized in that: In any single cylindrical air chamber section, when an air inlet and an air outlet are provided on the cylinder wall facing the projection lens chamber, the air inlet and air outlet are mirror-symmetrically distributed with a 180° phase angle. The central axis of the air inlet and air outlet forms an acute angle with the central axis of the optical aperture channel, and the tip of the acute angle faces the silicon wafer stage chamber. When only an air outlet is provided on the circumferential cylinder wall, there are multiple air outlets, which are evenly distributed along the circumference of the cylinder wall.
8. The multi-stage double-cone multi-cavity dynamic gas lock device according to claim 1, characterized in that: In any single cylindrical air chamber section, when an air inlet and an air outlet are provided on the cylinder wall facing the silicon wafer stage chamber, the air inlet and air outlet are mirror-symmetrically distributed with a 180° phase angle. The central axis of the air inlet and air outlet forms an acute angle with the central axis of the optical aperture channel, and the tip of the acute angle faces the projection lens chamber. When only air outlets are provided on the circumferential cylinder wall, there are multiple air outlets, which are evenly distributed along the circumferential direction of the cylinder wall. The number and spacing of the air outlets in the circumferential direction are determined according to the pollutant suppression efficiency.
9. A multi-stage double-cone multi-cavity dynamic gas lock device according to claim 1, characterized in that: In any single cylindrical air chamber section, each air inlet is independently equipped with a mass flow controller. The flow rate of the clean gas entering the air inlet is adjusted by the mass flow controller. The clean gas can be a single gas or a mixture of gases. Each suction port is independently equipped with a vacuum pump group, which adjusts the pumping speed of the clean gas.
10. A multi-stage double-cone multi-cavity dynamic gas lock device according to claim 1, characterized in that: The cross-sectional shape of the optical aperture channel is circular or rectangular, and the transition between the inner wall of the optical aperture channel and the air inlet and air outlet is set with rounded or straight chamfers.