Heat dissipation module, electrical equipment and vehicle

Abstract

The invention discloses a heat dissipation module, electrical equipment and a vehicle, and relates to the technical field of electrical elements. The heat dissipation module comprises a heat dissipation part, a magnetic device and a first molded part. The heat dissipation piece is provided with a heat dissipation cavity. The heat dissipation module comprises at least one magnetic device, and the magnetic device is located in the heat dissipation cavity. The magnetic device comprises a magnetic assembly, and the magnetic assembly comprises a magnetic core and a coil wound on the magnetic core. The first molded part is arranged between the magnetic device and the inner surface of the heat dissipation cavity and is in heat conduction contact with the magnetic device and the inner surface of the heat dissipation cavity. The first molded part is made of a thermosetting material, the curing temperature of the thermosetting material is lower than 200 DEG C, the heat conductivity coefficient is larger than or equal to 1 W / mK, and the breakdown field strength is larger than or equal to 19.5 MV / m.

Description

Technical Field

[0001] This application relates to the technical field of electrical components, and more particularly to a heat dissipation module, electrical equipment, and vehicle. Background Technology

[0002] With the development of technology in the new energy vehicle industry, OEMs are placing increasingly higher demands on the overall power density of on-board chargers in new energy vehicles. Lightweight and compact size have become important indicators for on-board chargers. As for the magnetic components used in on-board chargers, their power density directly affects the weight and size of the on-board charger.

[0003] However, magnetic components are not only bulky, but also generate a lot of heat due to high losses, requiring additional cooling during use. Current on-board chargers typically encapsulate magnetic components such as inductors and transformers in a water channel using thermally conductive adhesive for heat dissipation. This requires a large assembly gap for vacuum potting, resulting in a large amount of adhesive, high thermal resistance, and poor heat dissipation. Furthermore, due to insulation requirements, the magnetic components need to be isolated from the water channel, and the magnetic core and coil within the component also require fixation and isolation via a frame. This not only affects heat dissipation but also increases size, weight, and cost. Summary of the Invention

[0004] Based on this, this application provides a heat dissipation module, electrical equipment, and vehicle to solve the problem that the assembly scheme of magnetic devices in the related technology affects heat dissipation performance and increases product size, weight, and cost.

[0005] In a first aspect, embodiments of this application provide a heat dissipation module, including:

[0006] A heat sink, wherein the heat sink has a heat dissipation cavity;

[0007] At least one magnetic device is located within the heat dissipation cavity; the magnetic device includes a magnetic assembly, the magnetic assembly including a magnetic core and a coil wound around the magnetic core;

[0008] A first molded component is disposed between the inner surface of the magnetic device and the heat dissipation cavity, and is in thermally conductive contact with both the magnetic device and the inner surface of the heat dissipation cavity.

[0009] The first molded part is made of a thermosetting material, the curing temperature of which is below 200°C, the thermal conductivity is greater than or equal to 1 W / mK, and the breakdown field strength is greater than or equal to 19.5 MV / m.

[0010] In some embodiments, the coil and the magnetic core are spaced apart;

[0011] The magnetic device further includes a second molding, at least a portion of which is located between the magnetic core and the coil;

[0012] The second molded part is made of a thermosetting material with a curing temperature below 200°C, a thermal conductivity greater than or equal to 1 W / mK, and a breakdown field strength greater than or equal to 19.5 MV / m.

[0013] In some embodiments, the second molding component further covers the magnetic core and the coil; the first molding component covers the second molding component and is in thermally conductive contact with both the inner surfaces of the second molding component and the heat dissipation cavity.

[0014] In some embodiments, the first molded part and the second molded part are formed in one step or in multiple steps.

[0015] In some embodiments, the magnetic device further includes:

[0016] A base that supports the magnetic core and is fixedly connected to the magnetic core;

[0017] A first limiting block is fixedly connected to the base, and the first limiting block supports the coil and is fixedly connected to the coil.

[0018] In some embodiments, the magnetic device includes a plurality of coils spaced apart along the direction from the base to the magnetic core, and the magnetic device further includes:

[0019] The second limiting block is located between two adjacent coils and is connected to the two adjacent coils;

[0020] The first limiting block supports the coil near the base.

[0021] In some embodiments, the base includes:

[0022] A support member that supports the magnetic core and is fixedly connected to the magnetic core;

[0023] A connector is embedded in the support member, one end of which is electrically connected to the pin of the coil, and the other end extends out of the support member.

[0024] In some embodiments, the support member includes:

[0025] A frame that supports the magnetic core and is fixedly connected to the magnetic core;

[0026] A connecting boss is fixedly connected to the side of the frame away from the magnetic core and protrudes from the frame;

[0027] The connector includes:

[0028] A first connecting part is embedded in the frame and electrically connected to the pin of the coil;

[0029] The second connecting part is embedded in the connecting boss. The other end of the first connecting part is electrically connected to one end of the second connecting part. The other end of the second connecting part extends out of the connecting boss and has a connecting hole.

[0030] In some embodiments, the magnetic core includes:

[0031] A plurality of first magnetic core portions are spaced apart along a first direction;

[0032] A plurality of second magnetic core portions are located between and connected to two adjacent first magnetic core portions; the plurality of second magnetic core portions between two adjacent first magnetic core portions are spaced apart along a second direction, the first direction being perpendicular to the second direction, and the coil is wound around the second magnetic core portion.

[0033] In some embodiments, the heat dissipation module includes a plurality of magnetic devices; the heat dissipation module further includes:

[0034] The third molding component is disposed between and connected to two adjacent magnetic devices. The third molding component is made of a thermosetting material with a curing temperature below 200°C, a thermal conductivity greater than or equal to 1 W / mK, and a breakdown field strength greater than or equal to 19.5 MV / m.

[0035] In some embodiments, the third molded part and the first molded part are formed in one step or multiple times.

[0036] In some embodiments, the magnetic device includes a power factor correction inductor, an on-board charger main transformer, and / or a DC-DC converter main transformer.

[0037] In some embodiments, the heat sink further includes a cooling channel, a liquid inlet, and a liquid outlet, wherein the cooling channel is connected to the liquid inlet and the liquid outlet.

[0038] Secondly, embodiments of this application provide an electrical device including the heat dissipation module described in the first aspect.

[0039] Thirdly, embodiments of this application provide a vehicle including the heat dissipation module described in the first aspect or the electrical equipment described in the second aspect.

[0040] This application has at least the following beneficial effects:

[0041] The first molded component is designed with a thermal conductivity greater than or equal to 1 W / mK, and it is in thermally conductive contact with both the magnetic component and the heat sink. This ensures sufficient heat transfer capacity, allowing heat from the magnetic component to be quickly transferred to the heat sink and dissipated, effectively improving the heat dissipation performance of the magnetic component and replacing the function of thermally conductive adhesive in related technologies. The first molded component is also designed with a breakdown field strength greater than or equal to 19.5 MV / m, meeting the insulation requirements of the magnetic component during operation. This reduces the risk of leakage due to insulation failure between the magnetic core and coil, and between the magnetic component and the heat sink, ensuring the electrical safety of the magnetic component. Finally, the first molded component is designed with a curing temperature below 200℃ to prevent damage to the magnetic core and coil caused by high temperatures during the molding process. Based on the thermosetting material properties of the first molded part, it can be pressurized and filled between the inner surface of the magnetic device and the heat sink cavity through molding or injection molding. During the injection or molding process, the thermosetting material is subjected to pressure, which promotes smoother flow of the thermosetting material, thereby more fully filling the gap between the magnetic device and the heat sink. Compared with thermally conductive adhesive potting process, this pressurized molding method allows for a smaller gap between the magnetic device and the heat sink: on the one hand, it can reduce the amount of thermosetting material used, thereby reducing the weight, volume and manufacturing cost of the heat sink module; on the other hand, it shortens the distance between the magnetic device and the heat sink, reduces the heat transfer path, and allows the heat generated by the magnetic device to be transferred to the heat sink more quickly, further improving the heat dissipation performance. Attached Figure Description

[0042] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0043] Figure 1 This is a schematic diagram of the structure of the heat dissipation module after the first molded part is hidden in one or more embodiments of this application.

[0044] Figure 2 This is a schematic diagram of the structure of the heat dissipation module in one or more embodiments of this application. Figure 1 .

[0045] Figure 3 This is a schematic diagram of the structure of the heat dissipation module in one or more embodiments of this application. Figure 2 .

[0046] Figure 4 This is a schematic diagram of the structure of the magnetic device in some embodiments of this application.

[0047] Figure 5 This is a schematic diagram of the structure of the magnetic component in one or more embodiments of this application.

[0048] Figure 6 This is a schematic diagram of the structure of the magnetic device in some other embodiments of this application.

[0049] Figure 7 for Figure 4 The diagram shows the structure of the magnetic device after one of its magnetic components is hidden.

[0050] Figure 8 This is a schematic diagram of the base structure in one or more embodiments of this application.

[0051] Figure 9 This is an exploded view of the base in one or more embodiments of this application.

[0052] Figure 10 This is a schematic diagram of the magnetic core structure in some other embodiments of this application.

[0053] Explanation of reference numerals in the attached figures:

[0054] 1000-Heat dissipation module, 100-Heat dissipation component, 100a-Heat dissipation cavity, 100b-Liquid inlet, 100c-Liquid outlet, 200-Magnetic device, 210-Magnetic assembly, 211-Magnetic core, 2111-First magnetic core section, 2112-Second magnetic core section, 212-Coil, 2121-First coil, 2122-Second coil, 220-Second molded part, 230-Base, 231-Supporting component, 2311-Frame, 2312-Connecting boss, 232-Connecting component, 2321-First connecting part, 2322-Second connecting part, 232a-Connecting hole, 240-First limiting block, 250-Second limiting block, 300-First molded part. Detailed Implementation

[0055] To make the objectives, technical solutions, and advantages of this application clearer, the technical solutions in the embodiments of this application will be described in more detail below with reference to the accompanying drawings. In the drawings, the same or similar reference numerals denote the same or similar components or components having the same or similar functions throughout. The described embodiments are some, but not all, of the embodiments of this application. The embodiments described below with reference to the accompanying drawings are exemplary and intended to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application. The embodiments of this application will be described in detail below with reference to the accompanying drawings.

[0056] In the description of this application, it should be noted that, unless otherwise expressly specified and limited, the terms "installation," "connection," and "linking" should be interpreted broadly. For example, they can refer to a fixed connection, an indirect connection through an intermediate medium, or the internal communication between two components or the interaction between two components. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0057] In the description of this application, it should be understood that the terms "upper", "lower", "front", "back", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc., indicate the orientation or positional relationship based on the accompanying drawings, and are only for the convenience of describing this application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of this application.

[0058] The terms “first,” “second,” and “third” (if any) in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence.

[0059] Furthermore, the terms “comprising” and “having”, and any variations thereof, are intended to cover non-exclusive inclusion, such that a process, method, system, product, or display that includes a series of steps or units is not necessarily limited to those steps or units that are explicitly listed, but may include other steps or units that are not explicitly listed or that are inherent to such process, method, product, or display.

[0060] In related technologies, to ensure smooth flow of the thermally conductive adhesive, filling the areas between the magnetic components and the water channels, and maintaining insulation between the magnetic components and the water channels, a large gap is required between the water channels and the magnetic components. On one hand, this results in a large distance between the magnetic components and the water channels, leading to high thermal resistance and making it difficult for heat from the magnetic components to be transferred to the water channels, resulting in poor heat dissipation performance. On the other hand, this also leads to a large amount of thermally conductive adhesive used, resulting in a heavy, bulky, and costly heat dissipation module formed by the magnetic components, thermally conductive adhesive, and water channels. Furthermore, in related technologies, due to insulation requirements, the magnetic core and coil need to be electrically insulated through a frame. This causes the heat from the magnetic core to be transferred to the frame first, then through the frame to the thermally conductive adhesive, and finally through the thermally conductive adhesive to the water channels. This long heat transfer path for the magnetic core further reduces its heat dissipation performance, further decreasing the overall heat dissipation performance of the magnetic components.

[0061] In view of this, the applicant has designed a heat dissipation module, electrical equipment and vehicle. The heat dissipation module, electrical equipment and vehicle provided in the embodiments of this application are described in detail below with reference to the accompanying drawings.

[0062] In the attached diagram, X is the first direction, Y is the third direction, and Z is the second direction. The first direction X, the second direction Y, and the third direction Z are perpendicular to each other.

[0063] like Figure 1 , Figure 2 and Figure 3 As shown, the heat dissipation module 1000 includes a heat sink 100, a magnetic device 200, and a first molding 300. The heat sink 100 has a heat dissipation cavity 100a. The heat dissipation module 1000 includes at least one magnetic device 200, which is located within the heat dissipation cavity 100a. The magnetic device 200 includes a magnetic assembly 210, which includes a magnetic core 211 and a coil 212 wound around the magnetic core 211. The first molding 300 is disposed between the magnetic device 200 and the inner surface of the heat dissipation cavity 100a, and is in thermally conductive contact with both the magnetic device 200 and the inner surface of the heat dissipation cavity 100a. The first molding 300 is made of a thermosetting material with a curing temperature below 200°C, a thermal conductivity greater than or equal to 1 W / mK, and a breakdown field strength greater than or equal to 19.5 MV / m.

[0064] The heat sink 100 can be a liquid-cooled heat sink, a water-cooled heat sink, etc., and its type is not limited in this application. The heat sink 100 has a heat dissipation cavity 100a, which is used to accommodate the magnetic devices 200. All magnetic devices 200 are placed in the heat dissipation cavity 100a. The number of magnetic devices 200 can be one or more, and is not limited in this application.

[0065] In the magnetic device 200, the magnetic core 211 concentrates and confines the magnetic field, enhancing its strength to reduce energy loss and simultaneously reducing the number of turns in the coil 212. The coil 212 converts electrical energy into magnetic energy, transmits electrical signals, and performs energy storage and filtering. The magnetic core 211 and coil 212 work together to perform energy conversion and signal transmission. The structure of the magnetic core 211 can be adapted to the application scenario; it can be ring-shaped, E-shaped, U-shaped, I-shaped, etc. Furthermore, the material of the magnetic core 211 can be ferrite, nanocrystalline, amorphous alloy, etc., and is not limited in this application.

[0066] The number of magnetic devices 200 can be one or more, and is not limited in this application. The type of magnetic device 200 is not limited in this application, and it can be a power factor correction inductor (also known as a PFC inductor), an on-board charger main transformer (also known as an OBC main transformer), a DC-DC converter main transformer (also known as a DC main transformer), etc.

[0067] In some embodiments, the magnetic device 200 includes a power factor correction inductor, an on-board charger main transformer, and / or a DC-DC converter main transformer. That is, the magnetic device 200 includes at least one of a power factor correction inductor, an on-board charger main transformer, and a DC-DC converter main transformer. Specifically, when one magnetic device 200 is provided, it can be one of a power factor correction inductor, an on-board charger main transformer, and a DC-DC converter main transformer; when multiple magnetic devices 200 are provided, they can all be of the same type, such as all being power factor correction inductors; or, when multiple magnetic devices 200 are provided, some can be power factor correction inductors, some can be on-board charger main transformers, and others can be DC-DC converter main transformers.

[0068] The coil 212 is made of wire and can be in the form of single-layer winding, multi-layer winding, honeycomb winding, etc. The number of turns and wire diameter of the coil 212 can be designed according to parameters such as current and inductance, and are not limited in this application. The wire can be insulated wire, such as enameled wire or cotton-covered wire, which can prevent short circuits between turns. The material of the wire can be copper, aluminum, silver, etc., and the user can choose according to the specific application scenario, and is not limited in this application.

[0069] The first molded part 300 is made of a thermosetting material. The curing temperature of this thermosetting material is below 200℃, and can be 190℃, 175℃, 150℃, 100℃, etc. The thermal conductivity of this thermosetting material is greater than or equal to 1W / mK, and can be 1W / mK, 1.1W / mK, 2W / mK, 10W / mK, etc. The breakdown strength of this thermosetting material is greater than or equal to 19.5MV / m, and can be 19.5MV / m, 20MV / m, 21MV / m, 30MV / m, etc.

[0070] The curing temperature is below 200℃, which can avoid damage to the magnetic core 211 and coil 212 caused by high temperature during the molding process of the first molded part 300; the thermal conductivity is ≥1W / mK, which can enable the first molded part 300 to have sufficient heat transfer capacity, which helps the heat of the magnetic device 200 to be quickly transferred out through the first molded part 300; the breakdown field strength is ≥19.5MV / m, which can meet the insulation requirements of the magnetic device 200 during operation, reduce the risk of leakage due to insulation failure between the magnetic core 211 and coil 212, and reduce the risk of leakage due to insulation failure between the magnetic device 200 and heat sink 100, thus ensuring the electrical safety of the magnetic device 200.

[0071] Based on the thermosetting material properties of the first molding part 300, it can be filled between the inner surfaces of the magnetic device 200 and the heat dissipation cavity 100a by means of molding or injection molding. After molding, the first molding part 300 forms thermally conductive contact with both the magnetic device 200 and the inner surface of the heat dissipation cavity 100a, and the magnetic device 200 and the heat dissipation component 100 are fixed by the first molding part 300. The heat generated by the magnetic core 211 and the coil 212 can be transferred to the first molding part 300, and then conducted through the first molding part 300 to the heat dissipation component 100, and finally discharged through the heat dissipation component 100.

[0072] If the first molded part 300 is injection molded, the magnetic device 200 can be placed in the heat dissipation cavity 100a of the heat dissipation part 100, and then the heat dissipation part 100 containing the magnetic device 200 can be placed in the cavity of the injection mold. Then, the molten thermosetting material is injected into the heat dissipation cavity 100a under high pressure by the injection molding machine, and then the material is solidified and shaped by the mold heating.

[0073] If the first molded part 300 is molded by compression molding, the magnetic device 200 can be placed in the heat dissipation cavity 100a of the heat dissipation part 100, and then the heat dissipation part 100 containing the magnetic device 200 can be placed into the cavity of the compression mold. The thermosetting material can be placed into the heat dissipation cavity 100a. After the mold is closed, a certain pressure is applied and heated to the curing temperature so that the thermosetting material melts and fills the heat dissipation cavity 100a and cures.

[0074] The first molding component 300 is designed with a thermal conductivity greater than or equal to 1 W / mK, and it is in thermally conductive contact with both the magnetic device 200 and the heat sink 100. This ensures that the first molding component 300 has sufficient heat transfer capacity, facilitating the rapid transfer of heat from the magnetic device 200 to the heat sink 100, which then carries it away. This effectively improves the heat dissipation performance of the magnetic device 200, replacing the function of thermally conductive adhesive in related technologies. The first molding component 300 is also designed with a breakdown field strength greater than or equal to 19.5 MV / m, meeting the insulation requirements of the magnetic device 200 during operation. This reduces the risk of leakage due to insulation failure between the magnetic core 211 and the coil 212, as well as between the magnetic device 200 and the heat sink 100, ensuring the electrical safety of the magnetic device 200. The material of the first molded part 300 is designed with a curing temperature below 200℃ to avoid damage to the magnetic core 211 and coil 212 caused by high temperatures during the molding process. Based on the thermosetting material properties of the first molded part 300, it can be pressurized and filled between the inner surfaces of the magnetic device 200 and the heat sink 100a through molding or injection molding. During injection molding or molding, the thermosetting material is subjected to pressure, which promotes smoother flow and more fully fills the gap between the magnetic device 200 and the heat sink 100. Compared to thermally conductive adhesive potting, this pressurized molding method allows for a smaller gap between the magnetic device 200 and the heat sink 100: on the one hand, it reduces the amount of thermosetting material used, thereby reducing the weight, volume, and manufacturing cost of the heat sink module 1000; on the other hand, it shortens the distance between the magnetic device 200 and the heat sink 100, reducing the heat transfer path and allowing the heat generated by the magnetic device 200 to be transferred to the heat sink 100 more quickly, further improving heat dissipation performance.

[0075] In some embodiments, the coil 212 and the magnetic core 211 are spaced apart; the magnetic device 200 further includes a second molding 220, at least a portion of which is located between the magnetic core 211 and the coil 212. The second molding 220 is made of a thermosetting material with a curing temperature below 200°C, a thermal conductivity greater than or equal to 1 W / mK, and a breakdown field strength greater than or equal to 19.5 MV / m.

[0076] Because the coil 212 and the magnetic core 211 are spaced apart, and at least a portion of the second molding component 220 is located between them, the second molding component 220 can replace the skeleton function in related technologies, eliminating the need for a separate skeleton for the coil 212. Specifically, on the one hand, the second molding component 220 can play the supporting and positioning role of the skeleton: after the second molding component 220 is cured, it can fix the coil 212 to prevent it from loosening or deforming, and at the same time fix the magnetic core 211, ensuring the relative position stability of the magnetic core 211 and the coil 212, thereby ensuring the consistency of the inductor's magnetic circuit structure; on the other hand, the second molding component 220 can realize the electrical insulation function of the skeleton: the portion of the second molding component 220 located between the coil 212 and the magnetic core 211 can make the two electrically insulated, preventing direct contact that could lead to a short circuit; at the same time, the second molding component 220 can also separate different layers or segments of the coil 212, avoiding interlayer breakdown and improving the insulation performance and safety of the inductor.

[0077] Please combine Figure 2 , Figure 4 , Figure 5 and Figure 6 As shown, in some embodiments, the second molding 220 covers the magnetic core 211 and the coil 212, and the first molding 300 covers the second molding 220 and is in thermally conductive contact with the inner surfaces of the second molding 220 and the heat dissipation cavity 100a.

[0078] The second molded component 220 covers the magnetic core 211 and the coil 212. That is to say, the second molded component 220 also covers the surface of the assembly formed by the magnetic core 211 and the coil 212, with only the pins of the coil 212 exposed. The first molded component 300 covers the second molded component 220. That is to say, the second molded component 220 is embedded in the first molded component 300 and is not exposed. With this design, on the one hand, the second mold 220 can fully contact the surfaces of the magnetic core 211 and the coil 212, which can not only quickly conduct the heat generated by both, but also form a sealed protection to isolate external moisture, dust, oil and other impurities, and prevent impurities from entering the gap between the magnetic core 211 and the coil 212, causing electrical short circuits, reduced insulation performance and other faults. At the same time, it improves the structural integrity and vibration resistance of the magnetic device 200. On the other hand, the full contact between the outer surfaces of the first mold 300 and the second mold 220 helps to smoothly transfer the heat absorbed by the second mold 220 to the first mold 300, and then conduct it to the heat sink 100 through the first mold 300, further enhancing the heat dissipation effect.

[0079] The first molded part 300 and the second molded part 220 can be formed in one step or in multiple stages. The multiple stages of forming include forming the second molded part 220 first, and then forming the first molded part 300.

[0080] If the first molded part 300 and the second molded part 220 are integrally formed, then: first, the magnetic core 211 and the coil 212 are processed. After both are processed, the coil 212 is wound around the magnetic core 211 to form the magnetic device 200. Then, the magnetic device 200 is placed in the heat dissipation cavity 100a of the heat sink 100. It should be noted that the coil 212 and the magnetic core 211 must not be in contact, leaving space for subsequent thermosetting material filling, so that at least part of the thermosetting material can be located between the coil 212 and the magnetic core 211 after injection molding or molding. Between 11; then the heat sink 100 containing the magnetic device 200 is placed in the cavity of the injection mold or molding mold, and thermosetting material is injected into the heat sink cavity 100a. The thermosetting material will cover the surface of the magnetic core 211, the surface of the coil 212 and the inner wall of the heat sink cavity 100a, while filling the gap between the coil 212 and the magnetic core 211, as well as the gap between the magnetic device 200 and the inner wall of the heat sink cavity 100a; after the thermosetting material is heated and cured, the first molded part 300 and the second molded part 220 are formed as a whole.

[0081] The first molded part 300 and the second molded part 220 are formed in one step. On the one hand, this simplifies the production process of the heat dissipation module 1000, eliminating the need for two injection molding (or molding) and intermediate assembly steps in stages, reducing process flow and tooling switching, improving production efficiency and reducing manufacturing costs. On the other hand, it enables the two to form a seamless integral structure, avoiding interface gaps that may occur during staged molding, reducing interface thermal resistance and improving the heat dissipation efficiency of the magnetic device 200.

[0082] If the first molded part 300 and the second molded part 220 are formed in stages and multiple times, then: First, process the magnetic core 211 and the coil 212. After both are processed, wind the coil 212 around the magnetic core 211. Place the wound coil 212 and the magnetic core 211 into the cavity of the injection mold or molding mold (ensure that the coil 212 and the magnetic core 211 do not contact each other, leaving space for the thermosetting material of the second molded part 220). Inject the thermosetting material into the cavity. The thermosetting material covers the surfaces of the magnetic core 211 and the coil 212 and forms a thermally conductive contact with them. After heating and curing, the second molded part 220 is formed, thus obtaining the magnetic device 2. Next, the magnetic device 200 is placed into the heat dissipation cavity 100a of the heat sink 100, and then the heat sink 100 containing the magnetic device 200 is placed in the cavity of another injection mold or molding mold. The thermosetting material of the first molding part 300 is injected into the heat dissipation cavity 100a. The thermosetting material covers the surface of the second molding part 220 and the inner wall of the heat dissipation cavity 100a, forming a thermally conductive contact with both and filling the gap between the second molding part 220 and the inner surface of the heat dissipation cavity 100a. After the thermosetting material is heated and cured, the first molding part 300 is formed. The heat sink 100 and the magnetic device 200 are fixedly connected through the first molding part 300.

[0083] The first molded component 300 and the second molded component 220 are formed in stages and multiple times. This allows the second molded component 220 to pre-solidify the magnetic core 211 and the coil 212 into an integral module. When placed into the heat dissipation cavity 100a of the heat sink 100, it can quickly achieve alignment, avoiding assembly deviations caused by loose coil 212 or displacement of magnetic core 211. This helps reduce the assembly difficulty of the magnetic device 200 and the heat sink 100, as well as the molding difficulty of the first molded component 300. In addition, the staged molding (forming the second molded component 220 first, then the first molded component 300) can optimize the thermosetting material formula and process parameters for the main requirements of different gaps: for example, the gap between the magnetic core 211 and the coil 212 needs to balance electrical insulation reliability and structural fixation effect, so a material with better insulation performance can be selected to make the second molded component 220; while the gap between the magnetic device 200 and the heat sink 100 needs to focus on efficient heat conduction and overall structural stability, so a material with higher thermal conductivity can be selected to make the first molded component 300. This targeted design not only meets the functional requirements of different gaps, but also further improves the overall performance and production yield of the heat dissipation module 1000.

[0084] Furthermore, in the embodiment of phased multiple molding, the second molding part 220 or the first molding part 330 itself can also be molded multiple times. For example, when the second molding part 220 is at least partially located in the gap between the magnetic core 211 and the coil 212, and partially covers the surface of the assembly formed by the magnetic core 211 and the coil 212, the second molding part 220 can be formed by secondary injection molding. The portion located between the magnetic core 211 and the coil 212 is formed during the first injection molding to fix the magnetic core 211 and the coil 212, and the portion covering the surface of the assembly formed by the magnetic core 211 and the coil 212 is formed during the second injection molding.

[0085] like Figure 4 and Figure 7 As shown, in some embodiments, the magnetic device 200 further includes a base 230 and a first limiting block 240. The base 230 supports the magnetic core 211 and is fixedly connected to the magnetic core 211; the first limiting block 240 is fixedly connected to the base 230, and the first limiting block 240 supports the coil 212 and is fixedly connected to the coil 212.

[0086] The magnetic core 211 is placed on the base 230, which supports the magnetic core 211. A first limiting block 240 is placed above the base 230, which also supports the first limiting block 240. The coil 212 is located above the first limiting block 240, which supports and is fixedly connected to the coil 212. The fixed connection can be achieved through various methods, such as bonding or snap-fitting. Under the action of the base 230 and the first limiting block 240, the coil 212 and the magnetic core 211 are spaced apart, allowing the heat-fixing material of the second molding part 220 to fill the space between them, thus insulating them.

[0087] The coil 212 and the magnetic core 211 maintain a relatively accurate relative position under the positioning action of the base 230 and the first limiting block 240. The coil 212 and the magnetic core 211 are spaced apart. With this design, there is no need to set additional positioning pins or other complex positioning structures in the cavity of the injection mold or molding mold to fix the position of the coil 212 and the magnetic core 211. This not only helps to reduce the design and processing difficulty of the mold and reduce the mold manufacturing cost, but also avoids injection dead corners caused by the contact between the positioning structure and the coil 212 and the magnetic core 211, ensuring that the thermosetting material can completely fill the gap between the coil 212 and the magnetic core 211 and the surrounding gaps, reducing the number of injection molding times.

[0088] It should be noted that in the embodiment where the magnetic device 200 includes the second molding component 220, the second molding component 220 can not only cover the magnetic core 211 and the coil 212, but also cover the base 230 and the first limiting block 240.

[0089] like Figure 4 , Figure 5 and Figure 7 As shown, in some embodiments, the magnetic device 200 includes a plurality of coils 212 spaced apart along the direction from the base 230 to the magnetic core 211. The magnetic device 200 also includes a second limiting block 250, which is located between two adjacent coils 212 and connected to the two adjacent coils 212. A first limiting block 240 supports the coils 212 close to the base 230.

[0090] Along the direction from the base 230 to the magnetic core 211, that is, along the second direction Z in the figure; for ease of description, as... Figure 5 As shown, two adjacent coils 212 along the direction from the base 230 to the magnetic core 211 are defined as the first coil 2121 and the second coil 2122, respectively, wherein the first coil 2121 is positioned close to the base 230.

[0091] The first limiting block 240 is fixedly connected to the base 230, supporting and fixing the first coil 2121; the second coil 2122 is located above the first coil 2121, and the second limiting block 250 is located between the two, fixedly connected to both the first coil 2121 and the second coil 2122, and supporting the second coil 2122. Under the cooperative action of the first limiting block 240 and the second limiting block 250, the first coil 2121 and the second coil 2122 are kept apart in the second direction Z, and both are spaced apart from the magnetic core 211, so that the thermosetting material of the second molding part 220 can fill the following gaps: between the first coil 2121 and the magnetic core 211, between the second coil 2122 and the magnetic core 211, and between the first coil 2121 and the second coil 2122, thereby achieving electrical insulation between the coil 212 and the magnetic core 211, and between the coils 212 themselves.

[0092] like Figure 8 and Figure 9 As shown, in some embodiments, the base 230 includes a support member 231 and a connector 232. The support member 231 supports the magnetic core 211 and is fixedly connected to the magnetic core 211. The connector 232 is embedded in the support member 231, with one end of the connector 232 electrically connected to the pin of the coil 212 and the other end extending out of the support member 231.

[0093] The magnetic core 211 is placed on and fixedly connected to the support member 231, which supports the magnetic core 211. The support member 231 is made of an insulating material, such as epoxy resin, phenolic resin, polyurethane resin, etc., which is not limited in this application. The connector 232 is conductive and its material can be copper, aluminum, silver, etc. One end of the connector 232 is electrically connected to the pin of the coil 212, and the other end extends out of the support member 231, located outside the support member 231, for electrical connection with devices outside the heat dissipation module 1000. The support member 231 can be injection molded outside the connector 232. The connector 232 is embedded in the support member 231, and the enclosure of the support member 231 achieves electrical isolation from the magnetic core 211, coil 212, and other parts, preventing short circuit risks and improving circuit safety. The design of connector 232, with one end electrically connected to the pin of coil 212 and the other end extending out of support 231, simplifies the docking process between magnetic device 200 and external circuit. At the same time, the extended part of connector 232 can be designed as a standardized structure according to the external interface requirements, which improves the versatility and assembly efficiency of heat dissipation module 1000.

[0094] like Figure 8 and Figure 9As shown, in some embodiments, the support member 231 includes a frame 2311 and a connecting boss 2312. The frame 2311 supports the magnetic core 211 and is fixedly connected to the magnetic core 211. The connecting boss 2312 is connected to the side of the frame 2311 away from the magnetic core 211 and protrudes from the frame 2311. The connector 232 includes a first connecting portion 2321 and a second connecting portion 2322. The first connecting portion 2321 is embedded in the frame 2311, and one end of it is electrically connected to the pin of the coil 212; the second connecting portion 2322 is embedded in the connecting boss 2312, the other end of the first connecting portion 2321 is electrically connected to one end of the second connecting portion 2322, the other end of the second connecting portion 2322 protrudes from the connecting boss 2312, and the other end of the second connecting portion 2322 has a connecting hole 232a.

[0095] The magnetic core 211 is placed on top of the frame 2311 and fixedly connected to the frame 2311, which supports the magnetic core 211. The connecting boss 2312 is located on the lower side of the frame 2311, and the frame 2311 and the connecting boss 2312 are fixedly connected. The design of the connecting boss 2312 protruding from the frame 2311 provides an independent mating space for external components such as plugs used for electrical connection with the second connecting part 2322, avoiding mechanical interference between the plug and the frame 2311 and ensuring smooth insertion and removal of the plug. The connecting hole 232a at the end of the second connecting part 2322 can cooperate with the pins, protrusions, and other structures of the plug, achieving rapid alignment of the electrical connection through hole positioning. Simultaneously, the hole structure enhances the mechanical engagement force of the connection, preventing the plug from falling off in a vibration environment. This improves the convenience of connecting to external plugs and ensures the stability and reliability of the electrical connection. The connecting boss 2312 can be designed in a cylindrical or other shape to facilitate the fitting of plugs and other components onto its exterior.

[0096] like Figure 10 As shown, in some embodiments, the magnetic core 211 includes a plurality of first magnetic core portions 2111 and a plurality of second magnetic core portions 2112. The plurality of first magnetic core portions 2111 are spaced apart along a first direction X; the plurality of second magnetic core portions 2112 are located between two adjacent first magnetic core portions 2111 and connected to the two adjacent first magnetic core portions 2111; the plurality of second magnetic core portions 2112 between two adjacent first magnetic core portions 2111 are spaced apart along a second direction Z, the first direction X being perpendicular to the second direction Z, and a coil 212 is wound around the second magnetic core portion 2112.

[0097] The first magnetic core portion 2111, spaced apart along the first direction X, and the second magnetic core portion 2112, spaced apart along the second direction Z, form a grid structure, which can more evenly disperse the magnetic field, reduce local magnetic saturation, and improve the utilization rate of the magnetic permeability of the magnetic core 211. At the same time, the coil 212 is wound around the second magnetic core portion 2112, and the interval between adjacent second magnetic core portions 2112 provides an independent winding space for the coil 212, which can reduce electromagnetic interference between the coils 212 and facilitate the flexible design of the number of turns and layout of each coil 212 according to the requirements.

[0098] In some embodiments, the magnetic core 211 includes three first magnetic core portions 2111 and four second magnetic core portions 2112. The three first magnetic core portions 2111 are spaced apart along a first direction X, and the four second magnetic core portions 2112 are respectively located in two intervals formed by the three first magnetic core portions 2111, with two second magnetic core portions 2112 provided in each interval. The two second magnetic core portions 2112 between two adjacent first magnetic core portions 2111 are spaced apart along a second direction Z. Four coils 212 are correspondingly provided and are wound around the four second magnetic core portions 2112.

[0099] like Figure 4 As shown, in some embodiments, the magnetic device 200 includes two magnetic components 210, which are arranged side by side along a third direction Y.

[0100] In some embodiments, the heat dissipation module 1000 includes a plurality of magnetic devices 200; the heat dissipation module 1000 also includes a third molding component (not shown in the figure), which is disposed between and connected to two adjacent magnetic devices 200. The third molding component is made of a thermosetting material, the curing temperature of which is below 200°C, the thermal conductivity is greater than or equal to 1 W / mK, and the breakdown field strength is greater than or equal to 19.5 MV / m.

[0101] The third molding component is formed between two adjacent magnetic devices 200, connecting them into a single unit. This improves the integration and structural stability of the multiple magnetic devices 200, preventing displacement or loosening under vehicle vibration conditions. Furthermore, it fills the gaps between adjacent magnetic devices 200, optimizing the internal heat distribution of the heat dissipation module 1000 and reducing localized heat accumulation through its thermal conductivity. It also eliminates the need for additional connectors, simplifying the assembly process and reducing costs. Moreover, its insulation properties prevent electrical interference between adjacent magnetic devices 200, ensuring safety. The third molding component can connect the second molding components 220 of two adjacent magnetic devices 200, or the magnetic components 210 of two adjacent magnetic devices 200; this application does not limit the connection.

[0102] The third molded part and the first molded part 300 can be formed in one step or in multiple stages.

[0103] If the third molded part and the first molded part 300 are formed in one step, the process can be as follows: First, process the magnetic core 211 and the coil 212. After both are processed, wind the coil 212 around the magnetic core 211 to form a magnetic device 200. Then, place multiple magnetic devices 200 into the heat dissipation cavity 100a of the heat sink 100, leaving a gap between adjacent magnetic devices 200, while ensuring that there is a gap between each magnetic device 200 and the inner wall of the heat dissipation cavity 100a. Subsequently, place the heat sink 100a containing multiple magnetic devices 200 into the heat sink 100a. 0 is placed in the cavity of an injection mold or molding mold, and thermosetting material is injected into the heat dissipation cavity 100a. The material will cover the outer surface of each magnetic device 200 and the inner wall of the heat dissipation cavity 100a, and fill the gap between the magnetic device 200 and the inner wall of the heat dissipation cavity 100a, as well as the gap between adjacent magnetic devices 200. After the material is heated and cured, the part that fills the gap between the magnetic device 200 and the inner wall of the heat dissipation cavity 100a forms the first molded part 300, and the part that fills the gap between adjacent magnetic devices 200 forms the third molded part.

[0104] The first molded component 300 and the third molded component are formed in one piece, which simplifies the production process. There is no need to set up additional processes and tooling molds for the third molded component, which reduces the cost of process flow and mold changeover and improves production efficiency. At the same time, the two form a seamless integral structure, avoiding thermal resistance caused by interface gaps. This ensures that the heat conduction path of adjacent magnetic devices 200 through the third molded component and the first molded component 300 to the heat sink 100 is continuous and smooth, improving heat dissipation uniformity and strengthening the overall vibration resistance of the heat dissipation module.

[0105] If the third molded part and the first molded part 300 are formed in stages and multiple times, the process can be as follows: First, process the magnetic core 211 and the coil 212. After both are processed, wind the coil 212 around the magnetic core 211. Place the wound coil 212 and the magnetic core 211 into the cavity of the injection mold or molding mold (ensure that the coil 212 and the magnetic core 211 are relatively fixed to form a complete magnetic device 200). Inject thermosetting material into the gap between adjacent magnetic devices 200. The thermosetting material covers the corresponding surfaces of adjacent magnetic devices 200 and forms a tight bond with them. After heating and curing, the third molded part is formed. Thus, a magnetic device assembly composed of multiple magnetic devices 200 and the third molded part is obtained. Then, place the magnetic device assembly into... The heat sink 100 containing the magnetic device assembly is placed in the cavity of another injection mold or molding mold (it is necessary to ensure that a gap is reserved between the magnetic device assembly and the inner wall of the heat sink 100a to reserve filling space for the thermosetting material of the first molding part 300). The thermosetting material of the first molding part 300 is injected into the heat sink 100a. The thermosetting material covers the surface of the magnetic device assembly and the inner wall of the heat sink 100a, forming a thermally conductive contact with both and filling the gap between the magnetic device assembly and the inner surface of the heat sink 100a. After the thermosetting material is heated and cured, the first molding part 300 is formed. The heat sink 100 and the magnetic device assembly are fixedly connected through the first molding part 300.

[0106] The first mold 300 and the third mold are formed in stages and multiple times, which allows the magnetic device 200 to be pre-assembled and maintain a stable structure. When placed into the heat dissipation cavity 100a, it can be quickly aligned, avoiding assembly deviations caused by loose coil 212 or displacement of magnetic core 211. This helps to reduce the assembly difficulty of magnetic device 200 and heat dissipation 100, as well as the forming difficulty of the first mold 300 and the third mold.

[0107] In some embodiments, the third molding component connects the second molding components 220 of two adjacent magnetic devices 200. In these embodiments, the first molding component 300, the second molding component 220, and the third molding component can be molded in one step or in stages. In staged multiple molding, the third molding component can be injection molded (or molded) together with the first molding component 300, together with the second molding component 220, or separately. Furthermore, the first molding component 300, the second molding component 220, and the third molding component themselves can also be injection molded (or molded) in one step or in multiple steps.

[0108] If the first molded part 300, the second molded part 220, and the third molded part are formed in one step, then: first, the coil 212 is wound around the magnetic core 211 to form a magnetic component 210; then, the magnetic component 210 is placed on the base 230 and the first limiting block 240, and a second limiting block 250 is set to obtain a magnetic device 200; then, multiple magnetic devices 200 are placed into the heat dissipation cavity 100a of the heat sink 100; subsequently, the heat sink 100 containing multiple magnetic devices 200 is placed in the cavity of the injection mold or molding mold, and heat is poured into the heat dissipation cavity 100a. Thermosetting material is injected, which covers the surface of the magnetic core 211, the surface of the coil 212, the surface of the base 230, the surface of the first limiting block 240, the surface of the second limiting block 250, and the inner wall of the heat dissipation cavity 100a, while filling various gaps, such as the gap between the coil 212 and the magnetic core 211, the gap between the magnetic device 200 and the inner wall of the heat dissipation cavity 100a, and the gap between two adjacent magnetic devices 200. After the thermosetting material cools and solidifies, the first molded part 300, the second molded part 220, and the third molded part are formed as an integral structure.

[0109] The first molded part 300, the second molded part 220, and the third molded part are formed in one step. On the one hand, this simplifies the production process of the heat dissipation module 1000, eliminating the need for multiple injection molding (or molding) and intermediate assembly steps in stages, reducing process flow and tooling changes, improving production efficiency and reducing manufacturing costs. On the other hand, it enables the three parts to form a seamless integral structure, avoiding interface gaps that may occur during staged molding, reducing interface thermal resistance and improving heat dissipation efficiency.

[0110] If the first molded part 300, the second molded part 220, and the third molded part are formed in stages, the stage division method can be determined according to the actual application scenario. In a preferred embodiment, the stage division method for staged forming is as follows: First, the coil 212 is wound around the magnetic core 211 to form a magnetic component 210. Then, the magnetic component 210 is placed on the base 230 and the first limiting block 240, and a second limiting block 250 is set at the same time. Next, the combination of the magnetic component 210, the base 230, the first limiting block 240, and the second limiting block 250 is placed into the cavity of the injection mold or molding mold. A thermosetting material is injected into the cavity. The thermosetting material covers the surfaces of the magnetic core 211, the coil 212, the base 230, the first limiting block 240, and the second limiting block 250, and fills the gaps between the components. After heating and curing, the second molded part 220 is formed, thus obtaining the magnetic device 200. Subsequently, multiple magnetic devices 200 are placed... The heat sink 100 containing the magnetic device 200 is placed in the heat dissipation cavity 100a of the heat sink 100. Then, the heat sink 100 containing the magnetic device 200 is placed in the cavity of another injection mold or molding mold. Thermosetting material is injected into the heat dissipation cavity 100a. The thermosetting material covers the surface of the second molded part 220 and the inner wall of the heat dissipation cavity 100a, forming a thermally conductive contact with both. It fills the gap between the second molded part 220 and the inner wall of the heat dissipation cavity 100a, and also fills the gap between two adjacent magnetic devices 200. After the thermosetting material is heated and cured, a first molded part 300 and a third molded part are formed. The thermosetting material that fills the gap between two adjacent magnetic devices 200 is the third molded part, and the thermosetting material that fills the gap between the second molded part 220 and the inner wall of the heat dissipation cavity 100a is the first molded part 300. In the above embodiments, the first molding part 300, the second molding part 220 and the third molding part are formed in stages, so that the second molding part 220 pre-cures the magnetic core 211, the coil 212, the base 230, the first limiting block 240 and the second limiting block 250 into an integral module (i.e., magnetic device 200). When it is placed into the heat dissipation cavity 100a of the heat sink 100, it can quickly achieve alignment, avoiding assembly deviations caused by the loose coil 212 or the displacement of the magnetic core 211. This helps to reduce the assembly difficulty of the magnetic device 200 and the heat sink 100 and the molding difficulty of the first molding part 300 and the third molding part. Furthermore, phased molding can optimize the thermosetting material formulation and process parameters to meet the functional requirements of different gaps: for example, the gap between the magnetic core 211 and the coil 212 needs to balance electrical insulation reliability and structural fixation effect, so a thermosetting material with better insulation performance can be used to make the second mold part 220; while the gap between the magnetic device 200 and the heat sink 100, and the gap between two adjacent magnetic devices 200 need to focus on efficient heat conduction and overall structural stability, so a thermosetting material with higher thermal conductivity can be used to make the first mold part 300 and the third mold part.This targeted design not only meets the functional requirements of different gaps, but also further improves the overall heat dissipation performance, electrical safety, and production yield of the heat dissipation module 1000.

[0111] like Figure 3 As shown, in some embodiments, the heat sink 100 further includes a cooling channel (not shown), an inlet 100b, and an outlet 100c, with the cooling channel connected to the inlet 100b and the outlet 100c.

[0112] The inlet 100b, outlet 100c, and cooling channel of the heat sink 100 form a flow path for the cooling medium. After entering the cooling channel from the inlet 100b, the cooling medium flows along the cooling channel and finally exits the heat sink 100 through the outlet 100c. During this process, the cooling medium absorbs heat from the heat sink 100 through contact with it, enabling the heat sink 100 to dissipate heat quickly and provide a continuous and effective cooling environment for the magnetic device 200. The cooling medium can be water, oil, etc., and is not limited thereto in this application.

[0113] In some embodiments, cooling channels are arranged around the peripheral wall of the heat dissipation cavity 100a. This layout design allows the cooling medium to more uniformly surround the magnetic device 200 within the heat dissipation cavity 100a during its flow, increasing the heat exchange area between the heat dissipation device 100 and the cooling medium. Specifically, on the one hand, the cooling medium can simultaneously absorb heat from the heat dissipation device 100 from multiple directions, helping to avoid heat dissipation dead zones caused by uneven local cooling and improving the uniformity of heat dissipation; on the other hand, the surrounding channels extend the flow path of the cooling medium within the heat dissipation device 100, allowing the cooling medium more time to exchange heat with the heat dissipation device 100, ensuring that heat is fully carried away, thereby further improving the overall heat dissipation efficiency and meeting the continuous heat dissipation requirements of the magnetic device 200 under high-power conditions.

[0114] In some embodiments, the thermosetting material is a resin composition comprising one or more of the following: resin, crosslinking unit, initiator, filler, reinforcing fiber, flame retardant, and release agent.

[0115] Resin, as the matrix, can be selected from unsaturated polyester resin, epoxy vinyl ester resin, etc., to provide structural support for the molded parts, and at the same time serve as a carrier for other functional components to ensure uniform dispersion of each component.

[0116] The crosslinking unit can be styrene, ethylenediamine, or phthalic anhydride, etc. The crosslinking unit can react chemically with the resin molecular chain to form a three-dimensional network crosslinking structure, which improves the curing strength, hardness and high temperature deformation resistance of the molded parts, and avoids the softening or structural failure of the molded parts under long-term high temperature environment.

[0117] Initiators such as benzoyl peroxide and di-tert-butyl peroxide can be selected. Initiators can generate free radicals by decomposition, reduce the activation energy of the reaction between the resin and the crosslinking unit, regulate the start time and reaction rate of the crosslinking reaction, and ensure that the material can fully fill the cavity and complete the curing within a preset time during injection molding or compression molding, thus adapting to the efficiency requirements of different molding processes.

[0118] Fillers such as calcium carbonate, aluminum hydroxide, boron nitride, and alumina can be selected as thermally conductive fillers. Fillers can optimize the overall performance of molded parts through their own characteristics. For example, calcium carbonate can reduce material costs and improve dimensional stability, aluminum hydroxide has both flame retardant and filling functions, while thermally conductive fillers such as boron nitride and alumina can specifically improve the thermal conductivity of the resin composition, enhance the heat transfer ability of the molded parts, and reduce the shrinkage rate during the curing process, ensuring the tightness of the molded parts with the magnetic core and coil.

[0119] Reinforcing fibers can be selected from glass fibers, carbon fibers, etc. Reinforcing fibers can disperse stress through the fiber skeleton structure, enhance the bending resistance, impact resistance and tensile mechanical strength of the molded parts, and reduce cracking or deformation caused by external forces during assembly, transportation or use.

[0120] Flame retardants can be selected from decabromodiphenyl ether, phosphate esters, or magnesium hydroxide, etc. Flame retardants can improve the flame retardancy rating of molded parts and reduce the risk of fire caused by high temperature or short circuit in magnetic devices by inhibiting combustion reaction and forming flame retardant and heat insulation layer.

[0121] Release agents can be selected from dimethyl silicone oil, zinc stearate, etc. Release agents can form a lubricating isolation layer between the molded part and the mold surface, reduce the adhesion between the molded part and the mold after molding, and ensure smooth demolding of the molded part, which not only ensures production efficiency, but also avoids damage to the appearance or structure of the molded part during the demolding process.

[0122] In some embodiments, the total weight of the resin composition is 100%, and the proportions of each component are as follows: resin: 15~40wt%; crosslinking unit: 1~13wt%; initiator: 0.1~3wt%; filler: 30~40wt%; reinforcing fiber: 10~15wt%; flame retardant: 8%~18%; release agent: 0.1~0.5wt%.

[0123] The weight percentage of resin can be 15wt%, 40wt%, 20wt%, 22wt%, 30wt%, etc. A resin content of 15-40wt% helps it to effectively support and uniformly disperse other components as a matrix, providing structural support for the molded parts. It also reduces the possibility of excessive resin content crowding out the space for functional components (such as fillers and reinforcing fibers), and helps maintain the balance of key properties such as thermal conductivity and mechanical properties.

[0124] The weight percentage of the crosslinking unit can be 1 wt%, 5 wt%, 8 wt%, 13 wt%, etc. A crosslinking unit ratio of 1 to 13 wt% can form a moderate three-dimensional network crosslinking structure with the resin, which helps the molded part 140 to have sufficient curing strength, hardness and high temperature deformation resistance, while reducing the possibility of increased material brittleness due to excessive crosslinking, and better adapting to the use environment of the magnetic device 100.

[0125] The weight percentage of the initiator can be 0.1wt%, 1wt%, 1.5wt%, 3wt%, etc. The content of the initiator of 0.1~3wt% helps to control the initiation and rate of the crosslinking reaction, allowing sufficient time for the material to fill the cavity during injection molding or compression molding, and can complete curing within the preset cycle, thus balancing molding efficiency and curing adequacy.

[0126] The filler weight percentage can be 30wt%, 35wt%, 40wt%, etc. A filler percentage of 30-40wt% can improve the thermal conductivity of the material and optimize dimensional stability, while reducing the possibility of decreased material flowability due to an excessively high percentage, thus helping to ensure the filling effect during molding or injection molding.

[0127] The weight percentage of reinforcing fibers can be 10wt%, 12wt%, 15wt%, etc. Adding 10-15wt% of reinforcing fibers can effectively disperse stress through the fiber skeleton, improve the bending and impact resistance of molded parts, and at the same time reduce the probability of uneven dispersion due to excessive fiber content, which helps to ensure the consistency of material mechanical properties.

[0128] The weight percentage of flame retardants can be 8wt%, 12wt%, 18wt%, etc. A flame retardant content of 8% to 18% can effectively exert its flame retardant effect, while also reducing the possibility of excessive addition interfering with the insulation, thermal conductivity, or other functional components of the material. It also forms a synergistic effect with other components, taking into account both the flame retardant requirements of the material and the functional stability of the molded parts.

[0129] The weight percentage of the release agent can be 0.1wt%, 0.2wt%, 0.5wt%, etc. A release agent concentration of 0.1~0.5wt% allows for the formation of a suitable lubricating and isolating layer between the molded part 140 and the mold surface. This helps reduce adhesion between the molded part and the mold after molding, facilitating the demolding process and minimizing potential impacts on the appearance or structure of the molded part during demolding. Simultaneously, this concentration, while aiding in demolding, reduces the potential adverse effects of excessive addition on the compatibility of the material with other components, the insulation of the molded part, or its thermal conductivity. It also creates synergy with other components, balancing molding process requirements and the functional stability of the molded part.

[0130] In some embodiments, the resin is an unsaturated polyester resin or an epoxy vinyl ester resin.

[0131] Among them, unsaturated polyester resin has the advantages of excellent fluidity, fast curing speed and low cost. It can fill the gaps more fully during injection molding or compression molding, which is suitable for the molding efficiency requirements in mass production. At the same time, after curing, it can form a matrix structure with a certain strength, which can meet the basic support and component load-bearing functions of the molded parts. Epoxy vinyl ester resin has better adhesion, electrical insulation and mechanical strength. It can fit more tightly with the surface of magnetic core 211, coil 212, etc., which can reduce the interface gap and reduce thermal resistance. Moreover, the three-dimensional network structure formed after curing has more outstanding high temperature resistance, making it suitable for application scenarios with higher requirements for the structural stability, insulation reliability and long-term high temperature operation performance of magnetic devices 100.

[0132] In some embodiments, the filler is calcium carbonate or aluminum hydroxide.

[0133] When calcium carbonate is used as a filler, it has the characteristics of strong chemical inertness, good compatibility with resin, and easy dispersion of particles. This allows it to achieve a high volume percentage filling while ensuring the moldability of the resin composition. At the same time, calcium carbonate is widely available and inexpensive. When filling with a high volume percentage, it can further reduce the overall material cost by reducing the amount of resin used, and its own particle structure can reduce the shrinkage rate during the resin curing process, improve the dimensional stability of the molded parts, and avoid the relative positional shift of the magnetic core 211 and the coil 212 due to shrinkage.

[0134] When aluminum hydroxide is used as a filler, it not only plays a filling role to optimize the mechanical properties of the molded parts, but also has excellent flame retardant properties. At high temperatures, it can decompose and absorb heat and release water vapor, which works synergistically with flame retardants to improve the flame retardant rating of the molded parts. At the same time, it has good insulation properties and will not affect the electrical isolation effect between the magnetic core 211 and the coil 212, making it suitable for application scenarios with specific requirements for flame retardant performance.

[0135] This application embodiment also provides an electrical device, which includes the heat dissipation module 1000 described above.

[0136] Electrical equipment can be vehicle power supply, vehicle charger, etc., and is not limited in this application.

[0137] An on-board power supply is used to convert the low-voltage DC power from a vehicle battery into the power form required by various on-board devices (such as high-voltage DC, AC, etc.), providing a stable power supply for in-vehicle entertainment systems, navigation devices, charging interfaces, autonomous driving sensors, etc., while ensuring power support for critical functions such as vehicle starting, lighting, and control systems. The structure of an on-board power supply is known to those skilled in the art and is not limited herein. An on-board power supply may include: an energy conversion module, a magnetic core module, a filter assembly, protection circuits, and a housing and heat dissipation structure.

[0138] An on-board charger is used to convert external AC power grid into high-voltage DC power required by the vehicle's power battery, enabling safe charging of the power battery. It can also replenish the low-voltage battery, adapting to parking charging, slow charging, and other operating conditions. The structure of an on-board charger is known to those skilled in the art and is not limited herein. An on-board charger may include: a rectifier module, a power factor correction module, an isolation converter module, a filter and voltage regulator module, a control and communication module, protection circuitry, and a housing and heat dissipation interface.

[0139] Since the electrical equipment includes the aforementioned heat dissipation module 1000, it naturally possesses all the beneficial effects of the heat dissipation module 1000, which will not be elaborated upon here.

[0140] This application also provides a vehicle, which includes the above-described heat dissipation module 1000 or the above-described electrical equipment.

[0141] Since the vehicle includes the aforementioned heat dissipation module 1000, it naturally possesses all the beneficial effects of the heat dissipation module 1000, which will not be elaborated upon here.

[0142] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and are not intended to limit them. Although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features therein. Such modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. A heat dissipation module, characterized in that, include: Heat sink (100), the heat sink (100) having a heat dissipation cavity (100a); At least one magnetic device (200) is located within the heat dissipation cavity (100a); the magnetic device (200) includes a magnetic assembly (210), the magnetic assembly (210) including a magnetic core (211) and a coil (212) wound on the magnetic core (211). The first molding part (300) is disposed between the inner surface of the magnetic device (200) and the heat dissipation cavity (100a), and is in thermally conductive contact with both the inner surface of the magnetic device (200) and the heat dissipation cavity (100a). The first molded part (300) is made of a thermosetting material, wherein the curing temperature of the thermosetting material is below 200°C, the thermal conductivity is greater than or equal to 1 W / mK, and the breakdown field strength is greater than or equal to 19.5 MV / m.

2. The heat dissipation module according to claim 1, characterized in that, The coil (212) and the magnetic core (211) are spaced apart; The magnetic device (200) further includes a second molding (220), at least a portion of which is located between the magnetic core (211) and the coil (212); The second molded part (220) is made of a thermosetting material with a curing temperature below 200°C, a thermal conductivity greater than or equal to 1 W / mK, and a breakdown field strength greater than or equal to 19.5 MV / m.

3. The heat dissipation module according to claim 2, characterized in that, The second molding (220) also covers the magnetic core (211) and the coil (212); the first molding (300) covers the second molding (220) and is in thermally conductive contact with the inner surfaces of the second molding (220) and the heat dissipation cavity (100a).

4. The heat dissipation module according to claim 2 or 3, characterized in that, The first molded part (300) and the second molded part (220) are formed in one step or in multiple steps.

5. The heat dissipation module according to any one of claims 1-3, characterized in that, The magnetic device (200) further includes: A base (230) supports the magnetic core (211) and is fixedly connected to the magnetic core (211); The first limiting block (240) is fixedly connected to the base (230), and the first limiting block (240) supports the coil (212) and is fixedly connected to the coil (212).

6. The heat dissipation module according to claim 5, characterized in that, The magnetic device (200) includes a plurality of coils (212) spaced apart along the direction from the base (230) to the magnetic core (211), and the magnetic device (200) further includes: The second limiting block (250) is located between two adjacent coils (212) and connected to the two adjacent coils (212). The first limiting block (240) supports the coil (212) near the base (230).

7. The heat dissipation module according to claim 5, characterized in that, The base (230) includes: A support member (231) supports the magnetic core (211) and is fixedly connected to the magnetic core (211); A connector (232) is embedded in the support (231). One end of the connector (232) is electrically connected to the pin of the coil (212), and the other end extends out of the support (231).

8. The heat dissipation module according to claim 7, characterized in that, The support member (231) includes: A frame (2311) supports the magnetic core (211) and is fixedly connected to the magnetic core (211); A connecting boss (2312) is fixedly connected to the side of the frame (2311) away from the magnetic core (211) and protrudes from the frame (2311). The connector (232) includes: The first connecting part (2321) is embedded in the frame (2311) and electrically connected to the pin of the coil (212); The second connecting part (2322) is embedded in the connecting boss (2312). The other end of the first connecting part (2321) is electrically connected to one end of the second connecting part (2322). The other end of the second connecting part (2322) extends out of the connecting boss (2312), and the other end of the second connecting part (2322) has a connecting hole (232a).

9. The heat dissipation module according to claim 2 or 3, characterized in that, The magnetic core (211) includes: A plurality of first magnetic core portions (2111) are arranged at intervals along a first direction; A plurality of second magnetic core portions (2112) are located between two adjacent first magnetic core portions (2111) and connected to the two adjacent first magnetic core portions (2111); the plurality of second magnetic core portions (2112) between two adjacent first magnetic core portions (2111) are spaced apart along a second direction, the first direction being perpendicular to the second direction, and the coil (212) is wound around the second magnetic core portion (2112).

10. The heat dissipation module according to any one of claims 1-3, characterized in that, The heat dissipation module (1000) includes multiple magnetic devices (200); the heat dissipation module (1000) also includes: The third molding component is disposed between and connected to two adjacent magnetic devices (200). The third molding component is made of thermosetting material with a curing temperature below 200°C, a thermal conductivity greater than or equal to 1 W / mK, and a breakdown field strength greater than or equal to 19.5 MV / m.

11. The heat dissipation module according to claim 10, characterized in that, The third molded part and the first molded part (300) are formed in one step or multiple times.

12. The heat dissipation module according to any one of claims 1-3, characterized in that, The magnetic device (200) includes a power factor correction inductor, an on-board charger main transformer, and / or a DC-DC converter main transformer.

13. The heat dissipation module according to any one of claims 1-3, characterized in that, The heat sink (100) also has a cooling channel, a liquid inlet (100b) and a liquid outlet (100c), the cooling channel being connected to the liquid inlet (100b) and the liquid outlet (100c).

14. An electrical device, characterized in that, Includes the heat dissipation module (1000) according to any one of claims 1-13.

15. A vehicle, characterized in that, include: The heat dissipation module (1000) according to any one of claims 1-13 or the electrical device according to claim 14.

Images