Electronic device

Abstract

The invention discloses an electronic device, the electronic device comprises a frame body and a circuit board, an electric connection assembly is arranged between the frame body and the circuit board, and the electric connection assembly comprises an elastic member arranged on the circuit board; the connecting part is arranged on the side, facing the frame body, of the elastic piece, a channel is formed in the connecting part, the connecting part comprises a first face, a through hole communicated with the channel is formed in the first face, and liquid metal is arranged in the channel; and the contact part is arranged in the through hole, at least part of the contact part is exposed out of the first surface, when the contact part is extruded by the frame body, the contact part extrudes the liquid metal, and the liquid metal overflows from the through hole to the first surface and is conductively connected with the frame body.

Description

Technical Field

[0001] This application belongs to the field of electronic equipment technology, and specifically relates to an electronic device. Background Technology

[0002] In today's technologically advanced world, various terminal electronic devices are emerging in endless streams, such as VR headsets, mobile phones, tablets, headphones, and watches, to name just a few. In some electronic terminal devices, electrical connection components are a crucial element, used to transmit the minute current between the motherboard and the metal structural components. In some precision electronic devices, metal spring contacts are also used to connect the motherboard to the metal frame to achieve grounding, shielding, and signal transmission.

[0003] Currently, metal contact springs are widely used in electronic terminal devices. However, the contact surfaces of these metal contact springs are prone to oxidation and contamination, leading to increased resistance or unstable contact resistance. This is especially true for models with lower waterproof ratings, where oxidation of the metal contact springs reduces signal transmission capabilities and affects the functionality of the device. Summary of the Invention

[0004] This application aims to provide an electronic device that solves the problem of reduced signal transmission capability caused by oxidation of metal contacts, which affects the functionality of the device.

[0005] To solve the above-mentioned technical problems, this application is implemented as follows: This application provides an electronic device, which includes a frame and a circuit board, and an electrical connection component is disposed between the frame and the circuit board, the electrical connection component including: An elastic element is disposed on the circuit board; A connecting part is disposed on the side of the elastic member facing the frame. A channel is provided in the connecting part. The connecting part includes a first surface, and a through hole communicating with the channel is provided on the first surface. Liquid metal is disposed in the channel. A contact portion is disposed in the through hole and at least partially exposed on the first surface, wherein when the contact portion is squeezed by the frame, the contact portion squeezes the liquid metal, and the liquid metal overflows from the through hole to the first surface and becomes electrically connected to the frame.

[0006] In the embodiments of this application, when the electrical connection component is connected to the frame, the contact portion can first contact the frame. When the contact portion is squeezed by the frame, the contact portion can squeeze the liquid metal. After being squeezed, the liquid metal overflows from the through hole to the first surface, which can achieve self-cleaning of the first surface and extend the service life of the electrical connection component. Moreover, after the liquid metal overflows to the first surface, it can form a liquid interface, avoiding direct friction caused by hard metal contacting the frame. Furthermore, the liquid metal has good conductivity, fluidity, thermal properties, chemical properties, and self-healing properties, which can also ensure effective contact between the liquid metal and the frame, reduce local current density and high-frequency impedance, and increase the efficiency of electrical signal transmission and heat transfer.

[0007] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0008] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is a schematic diagram of the structure of an electrical connection component according to an embodiment of this application; Figure 2 This is a schematic diagram of the structure of an electrical connection component and a frame assembly according to an embodiment of this application; Figure 3 This is a schematic diagram of the structure of a connection part according to an embodiment of this application; Figure 4 This is a schematic diagram of the structure of a first surface where liquid metal overflows, according to an embodiment of this application. Figure 5 This is a schematic diagram of a first check valve in an embodiment of this application; Figure 6 This is a schematic diagram of another electrical connection component according to an embodiment of this application; Figure 7 This is a schematic diagram of the structure of a piston according to an embodiment of this application; Figure 8 This is a schematic diagram of another electrical connection component and frame assembly according to an embodiment of this application.

[0009] Figure label: 100. Electrical connection components; 10. Connecting part; 11. Channel; 111. First channel; 112. Second channel; 12. First surface; 13. Through hole; 131. First through hole; 132. Second through hole; 21. Liquid metal; 22. Conductive liquid film; 31. Flexible protrusion; 311. Air cavity; 32. Piston; 321. Contact structure; 3211. Air guide hole; 322. Sliding structure; 33. Cavity; 40. First one-way valve; 41. First flow channel; 42. Second flow channel; 43. Third flow channel; 44. Fourth flow channel; 45. Sphere; 46. Spring; 50. Limiting fence; 51. Limiting space; 60. Elastic gasket; 70. Second one-way valve; 80. Elastic element; 81. First connecting section; 82. Deformation section; 83. Second connecting section; 200. Frame. Detailed Implementation

[0010] The embodiments of this application will now be described in detail. Examples of these embodiments are illustrated in the accompanying drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the accompanying drawings are exemplary and are only used to explain this application, and should not be construed as limiting this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0011] like Figures 1 to 8 As shown, the electronic device according to some embodiments of this application includes, but is not limited to, VR devices, mobile phones, tablets, headphones, watches, etc. The electronic device includes a frame 200 and a circuit board. The frame 200 is the core structural framework of the electronic device, responsible for supporting the screen, back cover, and internal precision components (such as circuit boards, batteries, camera modules, etc.), preventing deformation of the device body, resisting damage from daily collisions and pressure, avoiding damage to internal components, and also used for component fixing and layout. The circuit board provides mechanical assembly support and electrical connection for the components inside the electronic device, and also carries the medium for signal transmission, signal reception, and power supply. Specifically, an electrical connection component 100 is provided between the frame 200 and the circuit board, and the frame 200 and the circuit board are electrically connected through the electrical connection component 100 to achieve grounding, shielding, and signal transmission.

[0012] like Figure 1As shown, the electrical connection assembly 100 includes: an elastic member 80 disposed on the circuit board; a connection portion 10 disposed on the side of the elastic member 80 facing the frame 200, the connection portion 10 having a channel 11, the connection portion 10 including a first surface 12, the first surface 12 having a through hole 13 communicating with the channel 11, the channel 11 having liquid metal 21 disposed therein; and a contact portion disposed in the through hole 13 and at least partially exposed on the first surface 12, wherein, when the contact portion is squeezed by the frame 200, the contact portion squeezes the liquid metal 21, and the liquid metal 21 overflows from the through hole 13 to the first surface 12 and can electrically connect with the frame 200.

[0013] In the embodiments of this application, when the electrical connection component 100 is connected to the frame 200, the contact portion can first contact the frame 200. When the contact portion is squeezed by the frame 200, the contact portion can squeeze the liquid metal 21. After being squeezed, the liquid metal 21 overflows from the through hole 13 to the first surface 12, which can achieve self-cleaning of the first surface 12 and extend the service life of the electrical connection component 100. Moreover, after the liquid metal 21 overflows to the first surface 12, it can form a liquid interface, avoiding direct friction caused by hard metal contacting the frame 200. Furthermore, the liquid metal 21 has good conductivity, fluidity, thermal properties, chemical properties, and self-healing properties, which can also ensure effective contact between the liquid metal 21 and the frame 200, reduce local current density and high-frequency impedance, and increase the efficiency of electrical signal transmission and heat transmission. Therefore, the electrical connection component 100 described in the embodiments of this application can be applied to various electronic devices that require stable and high-performance electrical connections.

[0014] In this embodiment, the electrical connection assembly 100 includes a connecting portion 10 and a contact portion. The contact portion can be integrally formed with the connecting portion 10, or the contact portion and the connecting portion 10 can be spliced ​​together. The connecting portion 10 is provided with a channel 11, and a through hole 13 communicating with the channel 11 is provided on the first surface 12 of the connecting portion 10. Liquid metal 21 is filled in the channel 11. The liquid metal 21 is fluid; when driven, it can flow within the channel 11, thereby overflowing from the through hole 13 onto the first surface 12. This allows the liquid metal 21 to be laid on the first surface 12, and the flow of the liquid metal 21 can be used to clean the first surface 12, thereby reducing the impedance of the first surface 12.

[0015] Specifically, liquid metal 21 can form a conductive liquid film 22 on the first surface 12. The conductive liquid film 22 can achieve electrical connection by contacting the frame 200. Since liquid metal 21 has good conductivity, fluidity, thermal properties, chemical properties, and self-healing properties, it can meet the conductivity and heat conduction requirements between the electrical connection component 100 and the frame 200. Compared with the prior art of conducting electricity through contact between metal springs and the frame 200, i.e., solid metal to solid metal contact, in this embodiment, liquid metal 21 is used to contact solid metal, which can avoid friction between metal springs and the frame 200, and avoid electrical connection failure due to long-term wear under vibration environment. At the same time, liquid metal 21 can fill the tiny pores on the contact surface of the frame 200 caused by processing or oxidation, which can ensure the conductivity with the frame 200.

[0016] Specifically, the contact portion is provided in the through hole 13. This can be understood as the contact portion being provided corresponding to the through hole 13, the contact portion being provided near the through hole 13, or the contact portion being provided at least partially opposite to the through hole 13, etc., so as to ensure that when the contact portion is squeezed by the frame 200, the squeezing force can be transmitted to the liquid metal 21 in the channel 11 through at least part of the through hole 13, so that the liquid metal 21 flows and can flow out from the through hole 13 to the first surface 12.

[0017] Optionally, the liquid metal 21 includes one of liquid gallium indium and gallium indium tin. Since liquid gallium indium and gallium indium tin have excellent conductivity, excellent fluidity, superior thermal properties, stable chemical properties and strong self-healing properties, they can ensure good electrical and liquid conductivity between the liquid metal 21 and the frame 200.

[0018] Specifically, the electrical connection assembly 100 further includes an elastic element 80, which is disposed on the circuit board and can be integrated into the circuit board by means of welding or conductive adhesive. The connecting portion 10 can be disposed on the side of the elastic element 80 facing the frame 200, and the connecting portion 10 and the elastic element 80 can be connected by means of welding or conductive adhesive; however, this embodiment does not specify a particular connection method. The connecting portion 10 can be electrically connected to the circuit board via the elastic element 80, and it can also be electrically connected to the frame 200 via the liquid metal 21.

[0019] Optionally, the elastic element 80 includes a first connecting segment 81, a deformation segment 82, and a second connecting segment 83 connected in sequence. The first connecting segment 81 can be soldered to a pad on a circuit board. The connecting part 10 includes a second surface disposed opposite to the first surface 12, and the second surface is connected to the second connecting segment 83.

[0020] In this embodiment, the second surface of the connecting portion 10 is connected to the second connecting segment 83, so that the connecting portion 10 and the elastic member 80 can be integrated into one unit, and the electrical connection assembly 100 can connect multiple components into a single module.

[0021] Specifically, the first connecting segment 81 can connect to the circuit board via solder pads, and the connecting part 10 can connect to the frame 200, thereby enabling the circuit board and the frame 200 to be assembled in one module.

[0022] Specifically, the elastic element 80 can be an integrally molded structure, and the second connecting section 83 and the connecting part 10 can be connected by welding or by bonding with conductive adhesive. Alternatively, the second connecting section 83 can also be integrally molded with the connecting part 10.

[0023] Specifically, the deformation segment 82 can be made of a highly elastic and high-strength material, such as beryllium copper, titanium copper, or a high-performance composite elastomer. The deformation segment 82 can provide mechanical support and resilience. The first connecting segment 81 can be the welding end of the elastic element 80, used for welding to the pads of the circuit board. The second connecting segment 83 can be the contact end of the main body, used to connect the connecting part 10 to contact the opposite side parts such as the frame 200 through the connecting part 10.

[0024] Optionally, such as Figure 1 and Figure 2 As shown, channel 11 includes a first channel 111 and a second channel 112 that are connected to each other, and through hole 13 includes a first through hole 131 and a second through hole 132 that are spaced apart. The first through hole 131 is connected to the first channel 111, and the second through hole 132 is connected to the second channel 112. The contact portion is connected to the first through hole 131, and the contact portion can squeeze the liquid metal 21 out of the second through hole 132; or, the contact portion is connected to the second through hole 132, and the contact portion can squeeze the liquid metal 21 out of the first through hole 131.

[0025] In the embodiments of this application, by adjusting the way the contact part and the through hole 13 cooperate, the contact part can squeeze the liquid metal 21 out of the first through hole 131 or the second through hole 132, which can achieve a variety of methods, making the structure of the electrical connection assembly 100 more diverse.

[0026] Specifically, the first through hole 131, the first channel 111, the second channel 112, and the second through hole 132 can be connected in sequence. When the contact part is connected to the first through hole 131, the contact part can squeeze the liquid metal 21 along the direction from the first through hole 131 to the first channel 111 through the contact part, so that the liquid metal 21 converges along the first channel 111 to the second channel 112. After the second channel 112 is filled, it overflows from the second through hole 132 onto the first surface 12.

[0027] Specifically, when the contact part is connected to the second through hole 132, the contact part can squeeze the liquid metal 21 along the direction from the second through hole 132 to the second channel 112 through the cooperation of the contact part and the second through hole 132, so that the liquid metal 21 converges along the second channel 112 to the first channel 111, and after the first channel 111 is filled, it overflows from the first through hole 131 onto the first surface 12.

[0028] In some embodiments of this application, the contact portion includes a flexible protrusion 31, which protrudes from the first surface 12. The flexible protrusion 31 is connected to the connecting portion 10 and surrounds the connecting portion 10 to form an air cavity 311. The air cavity 311 communicates with the second through hole 132. When the flexible protrusion 31 is squeezed by the frame 200, the gas in the air cavity 311 is squeezed into the second channel 112 to squeeze the liquid metal 21 through the gas.

[0029] In this embodiment, when the flexible protrusion 31 is squeezed by the frame 200, the air cavity 311 is compressed, causing the gas to flow to the second channel 112 to squeeze the liquid metal 21. The liquid metal 21 can overflow from the first surface 12 through the first channel, which is a relatively simple and convenient method.

[0030] Specifically, the flexible protrusion 31 can be integrally formed with the connecting part 10. The flexible protrusion 31 can elastically deform to ensure that it can deform when squeezed by the frame 200, thereby compressing the air cavity 311 and allowing the compressed air to enter the second channel 112. The flexible protrusion 31 can be a hemispherical dome, or it can be a rectangular dome, etc.

[0031] Specifically, such as Figures 1 to 2 As shown, air is forced downward through the second channel 112 to compress the liquid metal 21 in the first channel 111. The liquid metal 21 in the first channel 111 is compressed and overflows from the first through hole 131 to the first surface 12, forming a highly conductive liquid film 22, which then contacts the frame 200.

[0032] Specifically, since the flexible protrusion 31 is in direct contact with the frame 200 first, even if the flexible protrusion 31 and the frame 200 have some uneven surfaces or oxide layer pores due to friction, the liquid metal 21 can fill the above uneven surfaces or oxide layer pores, thereby achieving excellent conductivity with the frame 200.

[0033] Optionally, the first surface 12 is provided with a groove, which is connected to the air cavity 311 and the second through hole 132 respectively; wherein, when the flexible protrusion 31 is squeezed by the frame 200, it is squeezed into the groove.

[0034] In this embodiment, a groove is provided on the first surface 12 to accommodate the flexible protrusion 31 after it is squeezed. When the flexible protrusion 31 is squeezed, it fits into the groove, which can ensure that the first surface 12 can remain flat under the pressure of the contact part, thereby ensuring the reliability and stability of the conductive contact between the liquid metal 21 and the frame 200.

[0035] Specifically, the shape of the groove can be adapted to the flexible protrusion 31. The projection of the flexible protrusion 31 on the first surface 12 can coincide with the projection of the groove on the first surface 12. For example, the flexible protrusion 31 is hemispherical, and the corresponding groove can be a circular groove; or, the flexible protrusion 31 is rectangular, and the corresponding groove can be a rectangular groove.

[0036] Optionally, the first channel 111 may include a first sub-channel and a second sub-channel that are connected to each other. The first sub-channel can be connected to the first through hole 131, and the second sub-channel can be connected to the second channel 112, so as to improve the reliability of the arrangement of the first channel 111.

[0037] Optionally, both the first sub-channel and the second channel 112 extend in a direction perpendicular to the first surface 12, and the second sub-channel extends in a direction parallel to the first surface 12. In this way, the flexible protrusion 31 squeezes the air downward, and the air squeezes the liquid metal 21 downward, so that the liquid metal 21 can overflow upward through the first sub-channel into the first through hole 131 to the first plane.

[0038] Optionally, the first sub-channel and the first through hole 131 can be configured one-to-one. There can be multiple first sub-channels, symmetrically distributed relative to the second channel 112, which can improve the uniformity of the liquid metal 21 distribution on the first surface 12. The first one-way valve 40 can be configured one-to-one with each first sub-channel, with one first one-way valve 40 installed within each first sub-channel. The first one-way valve 40 can unidirectionally guide the flow along the direction from the first sub-channel to the first through hole 131.

[0039] Specifically, such as Figure 3 and Figure 4 As shown, the flexible protrusion 31 is positioned opposite to the second channel 112, and each first through hole 131 corresponds to a first sub-channel, illustrating a case where multiple first sub-channels are arranged on opposite sides of the second channel 112. In other cases, multiple first sub-channels can also be evenly arranged around the second channel 112.

[0040] Specifically, the number of second sub-channels can be one or more, and this application embodiment does not specifically limit this. The number of second channels 112 can be one or more, and this application embodiment does not specifically limit this.

[0041] Optionally, the electrical connection assembly 100 includes a first one-way valve 40, which is disposed in the first channel 111 and close to the first through hole 131. The first one-way valve 40 is unidirectionally open along the direction from the first channel 111 to the first through hole 131 and can be used to control the unidirectional overflow of liquid metal 21 from the first through hole 131.

[0042] In this embodiment, a first one-way valve 40 is provided in the first channel 111 and is located close to the first through hole 131. The first one-way valve 40 can be used to control the liquid metal 21 to overflow unidirectionally from the first through hole 131, thus preventing the liquid metal 21 from flowing back. In this way, since the liquid metal 21 cannot flow back and can be continuously supplied, a stable conductive liquid film 22 will always be formed on the first surface 12. This film can clean the first surface 12, avoiding the problem of surface oxidation on the first surface 12, and can also solve the wear problem caused by the direct contact between the first surface 12 and the frame 200.

[0043] Specifically, in this embodiment, if the electronic device experiences a drop or vibration, under the restriction of the liquid metal 21 by the first one-way valve 40, a stable conductive liquid film 22 can always be formed between the first surface 12 and the frame 200, thereby ensuring the stability of the conductive liquid film 22, ensuring good conductivity and thermal conductivity between the electrical connection component 100 and the frame 200, and avoiding resistance fluctuations.

[0044] Optionally, such as Figure 5 As shown, the first one-way valve 40 may include a valve body, a ball 45, and a spring 46; the valve body may be provided with a first flow channel 41, a second flow channel 42, a third flow channel 43, and a fourth flow channel 44 connected in sequence, the fourth flow channel 44 being opposite to the first through hole 131; the opening of the second flow channel 42 is larger than the openings of the first flow channel 41 and the third flow channel 43, and the opening of the third flow channel 43 is larger than the opening of the fourth flow channel 44; the ball 45 is disposed in the second flow channel 42, and the diameter of the ball 45 is larger than the opening of the first flow channel 41 and smaller than the opening of the second flow channel 42; the spring 46 is disposed in the third flow channel 43, one end abutting against the ball 45, and the other end abutting against the end of the fourth flow channel 44.

[0045] Specifically, when the liquid metal 21 flows along the direction from the first flow channel 41 to the second flow channel 42, the liquid metal 21 compresses the sphere 45, which in turn compresses the spring 46. The spring 46 is compressed, thus opening the first flow channel 41 and the second flow channel 42, allowing the liquid metal 21 to pass smoothly through the first one-way valve 40 and overflow from the first through hole 131 onto the first surface 12. Conversely, when the liquid metal 21 flows along the direction from the fourth flow channel to the third flow channel, the liquid metal 21 compresses the spring 46, which in turn compresses the sphere 45, causing the sphere 45 to block the first flow channel 41, preventing the liquid metal 21 from entering the first flow channel 41 from the second flow channel 42.

[0046] In some embodiments of this application, the electrical connection assembly 100 includes a limiting fence 50, which is connected to the frame 200; the inner periphery of the limiting fence 50 forms a limiting space 51. When the end of the connecting portion 10 near the first surface 12 is embedded in the limiting space 51, the outer periphery of the connecting portion 10 is press-fitted with the inner periphery of the limiting fence 50 to limit the overflow of liquid metal 21.

[0047] In this embodiment of the application, the interference fit between the limiting fence 50 and the connecting part 10 can be used to limit the range of motion of the liquid metal 21, prevent the liquid metal 21 from spreading over a large area, and thus ensure the reliability and stability of the conductive connection between the electrical connection component 100 and the frame 200 through the liquid metal 21.

[0048] In this embodiment of the application, when the inner perimeter of the limiting fence 50 is closed to form a limiting space 51, the limiting fence 50 is designed to seal with the connecting part 10 to prevent the liquid metal 21 from spreading.

[0049] In some other embodiments of this application, the electrical connection assembly 100 includes a limiting fence 50, which is connected to the frame 200; the inner periphery of the limiting fence 50 is coated with a hydrophobic layer, which encloses and forms a limiting space 51. When the end of the connecting part 10 near the first surface 12 is embedded in the limiting space 51, the hydrophobic layer restricts the overflow of liquid metal 21. The material of the hydrophobic layer includes at least one of perfluoropolyether and Teflon.

[0050] In this embodiment, the liquid repellent layer can be used to limit the movement of the liquid metal 21 within the limiting space 51, thereby preventing the large-area diffusion of the liquid metal 21 and ensuring the reliability and stability of the conductive connection between the electrical connection component 100 and the frame 200 through the liquid metal 21.

[0051] In this embodiment, the liquid-repellent layer can be made of at least one of perfluoropolyether (PFPE) and Teflon-like materials, giving it excellent liquid-repellent properties. The liquid-repellent layer is applied to the inner circumference of the limiting fence 50, forming a limiting space 51. The liquid-repellent layer and the connecting portion 10 can be in contact or spaced apart. The liquid-repellent layer strictly restricts the movement of the liquid metal 21 within the limiting space 51, preventing large-area diffusion of the liquid metal 21. When the liquid metal 21 comes into contact with the liquid-repellent layer, its wettability on the surface (high contact angle) is extremely poor. The high surface tension of the liquid metal 21 causes it to tend to contract into a spherical shape and be "pushed away" from the liquid-repellent layer, thus greatly promoting capillary forces that pull it back to the first surface 12.

[0052] Specifically, the limiting fence 50 can be fixedly connected to the frame 200. When the frame 200 squeezes the flexible protrusion 31, the limiting fence 50 squeezes the limiting part, so that the end of the limiting part near the first through hole 131 is embedded in the limiting space 51.

[0053] Specifically, the limiting space 51 can be formed by the inner perimeter of the limiting fence 50, or by a hydrophobic layer connected to the inner perimeter of the limiting fence 50. The shape of the limiting space 51 can be adapted to the shape of the outer perimeter of the connecting part 10. For example, the shapes of both the limiting space 51 and the outer perimeter of the connecting part 10 can be circular or square, etc.

[0054] Specifically, along the direction perpendicular to the first surface 12, the extension height of the limiting fence 50 is H, where 10μm≤H≤50μm, to ensure that the limiting fence 50 can effectively restrict the movement range of the liquid metal 21. For example, H can take values ​​of 10μm, 15μm, 20μm, 25μm, 35μm, 40μm, 45μm, or 50μm, etc.

[0055] In some other embodiments of this application, the contact portion includes a piston 32, a portion of which passes through the first through hole 131 and the first channel 111 near one end of the first through hole 131, and a portion of which protrudes from the first surface 12; when the piston 32 is squeezed by the frame 200, the piston 32 squeezes the liquid metal 21.

[0056] In this embodiment, a portion of the piston 32 protrudes from the first surface 12 and partially passes through the first through hole 131 and the first channel 111. Thus, when the piston 32 is compressed by the frame 200, more of the piston 32 enters the first channel 111, causing the piston 32 to compress the liquid metal 21 within the first channel 111. The compressed liquid metal 21 then overflows from the second through hole 132 from the first surface 12. This embodiment uses the piston 32 to compress the liquid metal 21, causing it to overflow from the second through hole 132 from the first surface 12, a relatively simple and convenient method.

[0057] Specifically, a portion of the piston 32 is inserted into the first channel 111, enabling the piston 32 to be assembled with the connecting part 10, and allowing the piston 32 to slide within the first channel 111. A portion of the piston 32 protrudes from the first surface 12, providing some space for the piston 32 to move.

[0058] Optionally, the piston 32 includes a contact structure 321 and a sliding structure 322 connected to each other. A portion of the sliding structure 322 protrudes from the first surface 12, and a portion of the sliding structure 322 passes through the first through hole 131 and the first channel 111 at one end near the first through hole 131. The projection of the sliding structure 322 on the first surface 12 falls within the projection of the contact structure 321 on the first surface 12. The side of the contact structure 321 away from the sliding structure 322 is used to fit against the frame 200. The piston 32, the first surface 12, and the frame 200 enclose to form a cavity 33. The contact structure 321 is provided with a vent 3211 communicating with the cavity 33. The vent 3211 is a micron-sized pore. When the contact structure 321 is squeezed by the frame 200, the vent 3211 discharges the gas in the cavity 33.

[0059] In this embodiment, the piston 32, the first surface 12, and the frame 200 enclose a cavity 33, which restricts the movement of the liquid metal 21 within the cavity 33, preventing large-area diffusion of the liquid metal 21 and thus ensuring the reliability and stability of the electrical connection between the connecting part 10 and the frame 200 via the liquid metal 21. A vent hole 3211 is provided on the contact structure 321 to allow gas to be discharged from the cavity 33, making room for the liquid metal 21.

[0060] Optionally, the vent 3211 is a micron-sized pore. Due to its own surface tension, the liquid metal 21 cannot overflow from the micron-sized pore, thus preventing the liquid metal 21 from passing through the vent 3211. The vent 3211 can also be a nanopore; however, this embodiment does not specifically limit its application.

[0061] Specifically, part of the sliding structure 322 protrudes from the first surface 12, which can reserve movement space for the sliding structure 322, so that the sliding structure 322 can be further squeezed into the first channel 111, ensuring the reliability of the liquid metal 21 overflowing from the second through hole 132 from the first surface 12.

[0062] Specifically, the projection of the sliding structure 322 on the first surface 12 falls within the projection of the contact structure 321 on the first surface 12, so that the contact structure 321 can play a limiting role and prevent the sliding structure 322 from sliding beyond its travel. Moreover, after the contact structure 321 contacts the first surface 12 and the frame 200 respectively, a space for accommodating the liquid metal 21 is created between the first surface 12 and the frame 200.

[0063] Specifically, both the sliding structure 322 and the contact structure 321 are annular, such as a rectangular ring or a circular ring, so as to ensure that the piston 32, the first surface 12 and the frame 200 can be enclosed to form the cavity 33.

[0064] Specifically, the contact structure 321 and the sliding structure 322 can be integrally molded or spliced ​​together. The contact structure 321 contacts the frame 200, and the material of the contact structure 321 can be silicone or plastic, etc., to reduce wear on the frame 200, and to ensure that the electrical connection assembly 100 has appropriate displacement when the electronic device deforms. The sliding structure 322 can be made of metal, and the sliding structure 322 can be interference-fitted with the first channel 111 to prevent liquid metal 21 from overflowing.

[0065] Specifically, the contact structure 321 may be provided with a vent 3211, which can be a micron-sized vent, allowing for ventilation but restricting the passage of liquid metal 21. For example... Figure 7 As shown, the air guide hole 3211 can penetrate the contact structure 321 in the horizontal direction to connect the inside and outside of the cavity 33. In this way, when the piston 32 is squeezed, both the contact structure 321 and the sliding structure 322 move downward, the cavity 33 is compressed, and the gas in the cavity 33 is discharged through the air guide hole 3211, which can prevent the gas from blocking the liquid metal 21 from overflowing from the second through hole 132.

[0066] Optionally, the electrical connection assembly 100 further includes an elastic gasket 60, which is sleeved on the sliding structure 322 and supported between the contact structure 321 and the first surface 12.

[0067] In this embodiment, when the piston 32 is not compressed, the elastic pad 60 can be used to support the contact structure 321, so that at least a portion of the sliding structure 322 protrudes from the first surface 12, thus reserving space for the sliding structure 322 to slide. When the piston 32 is compressed, the elastic pad 60 can be compressed and deformed, so that the sliding structure 322 can compress the liquid metal 21 to flow.

[0068] Specifically, the elastic gasket 60 may include a first annular gasket and / or a second annular gasket. The first annular gasket is embedded in the inner periphery of the sliding structure 322, and the second annular gasket may be sleeved on the outer periphery of the sliding structure 322. In this embodiment, the connection method between the first annular gasket and / or the second annular gasket and the sliding structure 322 is not specifically limited.

[0069] Optionally, the electrical connection assembly 100 includes a second one-way valve 70, which is disposed in the second channel 112 and close to the second through hole 132. The second one-way valve 70 can be unidirectionally opened along the direction from the second channel 112 to the second through hole 132 to control the unidirectional overflow of liquid metal 21 from the second through hole 132.

[0070] In this embodiment, a second one-way valve 70 is provided in the second channel 112 and is located close to the second through hole 132. The second one-way valve 70 can be used to control the liquid metal 21 to overflow unidirectionally from the second through hole 132, preventing the liquid metal 21 from flowing back. In this way, since the liquid metal 21 cannot flow back and can be continuously supplied, a stable conductive liquid film 22 will always be formed on the first surface 12. This film can clean the first surface 12, avoiding the problem of surface oxidation on the first surface 12, and can also solve the wear problem caused by the direct contact between the first surface 12 and the frame 200.

[0071] In this embodiment, if the electronic device experiences a drop or vibration, the second one-way valve 70 restricts the liquid metal 21, ensuring that a stable conductive liquid film 22 is always formed between the first surface 12 and the frame 200. This guarantees the stability of the conductive liquid film 22, ensuring good electrical and thermal conductivity between the electrical connection component 100 and the frame 200, and preventing resistance fluctuations. The second one-way valve 70 can be designed with reference to the first one-way valve 40, and will not be described in detail here.

[0072] In some alternative embodiments, the first through hole 131 is an annular hole, and the first channel 111 includes an annular sub-channel, so that the first through hole 131 and the annular sub-channel are adapted to the shape of the sliding structure 322, ensuring the reliability of the sliding structure 322 being inserted into the first through hole 131 and the annular sub-channel.

[0073] Furthermore, the first channel 111 may also include a third sub-channel to connect to the second channel 112. The second channel 112 may be disposed within the annular sub-channel 11, and the number of second channels 112 may include multiple channels, while the number of third sub-channels may include one or more. The number of second channels 112 and second through holes 132 may be configured in a one-to-one correspondence, and the second channels 112 may be configured in a one-to-one correspondence with the second one-way valve 70. The third sub-channel may extend in a direction parallel to the first surface 12, while both the annular sub-channel and the second channel 112 may extend in a direction perpendicular to the first plane.

[0074] Specifically, such as Figures 6 to 8 As shown, after being squeezed by the frame 200, the piston 32 moves downward, the elastic gasket 60 is compressed, and the gas in the cavity 33 is discharged through the vent 3211. The sliding structure 322 squeezes the liquid metal 21, and the liquid metal 21 flows under pressure from the second channel 112 to the second through hole 132, and overflows from the second through hole 132 onto the first surface 12, so that excellent conductivity is achieved between the electrical connection assembly 100 and the frame 200. At the same time, under the restriction of the second one-way valve 70, the liquid metal 21 can always form a conductive liquid film 22 on the first surface 12.

[0075] The electrical connection assembly described in the embodiments of this application has at least the following advantages: In the embodiments of this application, when the electrical connection component is connected to the frame, the contact portion can first contact the frame. When the contact portion is squeezed by the frame, the contact portion can squeeze the liquid metal. After being squeezed, the liquid metal overflows from the through hole to the first surface, which can achieve self-cleaning of the first surface and extend the service life of the electrical connection component. Moreover, after the liquid metal overflows to the first surface, it can form a liquid interface, avoiding direct friction caused by hard metal contacting the frame. Furthermore, the liquid metal has good conductivity, fluidity, thermal properties, chemical properties, and self-healing properties, which can also ensure effective contact between the liquid metal and the frame, reduce local current density and high-frequency impedance, and increase the efficiency of electrical signal transmission and heat transfer.

[0076] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0077] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. An electronic device, characterized in that, The electronic device includes a frame and a circuit board, and an electrical connection component is disposed between the frame and the circuit board, the electrical connection component including: An elastic element is disposed on the circuit board; A connecting part is disposed on the side of the elastic member facing the frame. A channel is provided in the connecting part. The connecting part includes a first surface, and a through hole communicating with the channel is provided on the first surface. Liquid metal is disposed in the channel. A contact portion is disposed in the through hole and at least partially exposed in the first surface. When the contact portion is squeezed by the frame, the contact portion squeezes the liquid metal, and the liquid metal overflows from the through hole to the first surface and becomes electrically connected to the frame.

2. The electronic device according to claim 1, characterized in that, The channel includes a first channel and a second channel that are connected to each other, and the through hole includes a first through hole and a second through hole that are spaced apart. The first through hole is connected to the first channel, and the second through hole is connected to the second channel. The contact portion is connected to the first through hole, and the contact portion can squeeze the liquid metal out of the second through hole; or, the contact portion is connected to the second through hole, and the contact portion can squeeze the liquid metal out of the first through hole.

3. The electronic device according to claim 2, characterized in that, The contact portion includes a flexible protrusion that protrudes from the first surface. The flexible protrusion is connected to the connecting portion and forms an air cavity with the connecting portion. The air cavity communicates with the second through hole. When the flexible protrusion is squeezed by the frame, the gas in the air cavity is forced into the second channel to squeeze the liquid metal through the gas.

4. The electronic device according to claim 3, characterized in that, The electrical connection assembly includes a first one-way valve, which is disposed in the first channel and close to the first through hole. The first one-way valve conducts unidirectionally along the direction from the first channel to the first through hole.

5. The electronic device according to claim 3, characterized in that, The electrical connection assembly includes a limiting fence, which is connected to the frame. The inner perimeter of the limiting fence forms a limiting space. When the end of the connecting part near the first surface is embedded in the limiting space, the outer perimeter of the connecting part is press-fitted with the inner perimeter of the limiting fence to limit the overflow of the liquid metal. Alternatively, the inner circumference of the limiting fence is coated with a hydrophobic layer, which encloses and forms a limiting space. When the end of the connecting part near the first surface is embedded in the limiting space, the hydrophobic layer restricts the overflow of the liquid metal. The hydrophobic layer is made of at least one of perfluoropolyether and Teflon.

6. The electronic device according to claim 2, characterized in that, The contact portion includes a piston, a portion of which passes through the first through hole and the first channel at one end near the first through hole, and a portion of which protrudes from the first surface; When the piston is squeezed by the frame, the piston squeezes the liquid metal.

7. The electronic device according to claim 6, characterized in that, The piston includes a contact structure and a sliding structure connected to each other. A portion of the sliding structure protrudes from the first surface and passes through the first through hole and the first channel at one end near the first through hole. The projection of the sliding structure on the first surface falls within the projection of the contact structure on the first surface; the side of the contact structure opposite to the sliding structure is used to fit against the frame, and the piston, the first surface, and the frame enclose to form a cavity; The contact structure is provided with a vent hole that connects to the cavity; when the contact structure is squeezed by the frame, the vent hole will discharge the gas inside the cavity.

8. The electronic device according to claim 7, characterized in that, The electrical connection assembly further includes an elastic gasket, which is sleeved on the sliding structure and supported between the contact structure and the first surface.

9. The electronic device according to claim 6, characterized in that, The electrical connection assembly includes a second one-way valve, which is disposed within the second channel and close to the second through hole. The second one-way valve is unidirectionally open along the direction from the second channel to the second through hole.

10. The electronic device according to claim 1, characterized in that, The liquid metal includes at least one of liquid gallium indium and gallium indium tin.

Images