Heat dissipation method and device, intelligent earphone and storage medium

Abstract

The invention discloses a heat dissipation method and device, an intelligent earphone and a storage medium, and relates to the technical field of earphones, the method is applied to the intelligent earphone provided with a heat dissipation component, and the method comprises the following steps: when the intelligent earphone is worn by a user, obtaining a current service state of an audio service of the intelligent earphone; when the current service state is that the audio service exists, reducing the preset heat dissipation power of the heat dissipation component; and controlling the heat dissipation part to dissipate heat according to the reduced preset heat dissipation power. The current service state of the audio service of the intelligent earphone is detected when the intelligent earphone is worn by the user, and the preset heat dissipation power of the heat dissipation component is actively reduced when the audio service is detected to exist in the current service state, so that the heat dissipation function is ensured, the noise generated by the heat dissipation component is reduced, and the user experience is improved. Therefore, the listening process of the user using the earphone is prevented from being influenced, and the user experience is improved.

Description

Technical Field

[0001] This application relates to the field of headphone technology, and more particularly to a heat dissipation method, device, smart headphone, and storage medium. Background Technology

[0002] Currently, in scenarios requiring the use of over-ear headphones, such as gaming, audio-visual entertainment, and long hours of remote work, active cooling components are typically integrated inside the earcups to improve comfort and alleviate the stuffiness caused by the continuous covering of the ears. Existing cooling solutions generally utilize cooling components to drive airflow when the temperature is too high, thereby achieving the exchange of gases and heat dissipation between the inside and outside of the earcups.

[0003] However, since heat dissipation components typically operate at a set power, they generate considerable noise during operation, which is particularly noticeable when users listen to audio through headphones, interfering with the user's audio listening experience. For example, in scenarios where gamers need to hear subtle footsteps or clearly distinguish voices during voice calls, the humming or airflow noise generated by the heat dissipation components will be directly superimposed on the audio, and in severe cases, may even mask critical sound information, leading to a degraded user experience. Summary of the Invention

[0004] The main purpose of this application is to provide a heat dissipation method, device, smart earphone, and storage medium, which aims to solve the technical problem that the heat dissipation components inside the earphone generate a lot of noise during operation, affecting the user's listening experience when using the earphone.

[0005] To achieve the above objectives, this application proposes a heat dissipation method, which is applied to a smart earphone equipped with a heat dissipation component, the method comprising: When the smart earphone is worn by the user, obtain the current service status of the audio service of the smart earphone; When the current service status is that audio service is present, the preset heat dissipation power of the heat dissipation component is reduced; The heat dissipation component is controlled to dissipate heat according to the reduced preset heat dissipation power.

[0006] In one embodiment, the step of reducing the preset heat dissipation power of the heat dissipation component when the current service status is that audio service is present includes: If the current service status is that audio service exists, obtain the preset audio service coefficient; The preset audio service coefficient is reduced to obtain the reduced preset audio service coefficient; The preset heat dissipation power is reduced based on the reduced preset audio service coefficient.

[0007] In one embodiment, the step of controlling the heat dissipation component to dissipate heat according to the reduced preset heat dissipation power includes: Obtain the current noise cancellation status of the active noise cancellation mode of the smart headphones, and obtain the preset noise cancellation status coefficient; The preset noise reduction state coefficient is adjusted according to the current noise reduction state, and the adjustment operation is either an increase operation or a decrease operation. The reduced preset heat dissipation power is adjusted by adjusting the preset noise reduction state coefficient; The heat dissipation component is controlled to dissipate heat according to the adjusted preset heat dissipation power.

[0008] In one embodiment, the step of controlling the heat dissipation component to dissipate heat according to the reduced preset heat dissipation power includes: Obtain the preset environmental noise figure; Collect ambient noise data from the smart earphones and determine the current sound pressure level corresponding to the ambient noise data; When the current sound pressure level reaches a preset sound pressure level threshold, the current sound pressure level interval in which the current sound pressure level is located is determined, and the preset environmental noise coefficient is increased according to the current sound pressure level interval; The reduced preset heat dissipation power is adjusted by increasing the preset preset environmental noise figure; The heat dissipation component is controlled to dissipate heat according to the adjusted preset heat dissipation power.

[0009] In one embodiment, after the step of obtaining the current service status of the audio service of the smart headphones, the method further includes: When the current service status is that there is no audio service, a preset audio service coefficient and a preset upper limit heat dissipation power of the heat dissipation component are obtained, wherein the preset upper limit heat dissipation power is higher than the preset heat dissipation power; The preset audio service coefficient is increased to obtain the increased preset audio service coefficient; The preset heat dissipation power of the heat dissipation component is increased based on the increased preset audio service coefficient to obtain the increased preset heat dissipation power; The minimum power is selected from the increased preset heat dissipation power and the preset upper limit heat dissipation power to control the heat dissipation component for heat dissipation.

[0010] In one embodiment, the step of reducing the preset audio service coefficient to obtain the reduced preset audio service coefficient includes: Acquire the audio data of the audio service and convert the audio data into a spectrogram; Audio features are extracted from the spectrogram, and the current frequency characteristics of the audio features are determined. Based on the current frequency characteristics, the corresponding current reduction level is determined, and the preset audio service coefficient is reduced according to the current reduction level to obtain the reduced preset audio service coefficient.

[0011] In one embodiment, before the step of obtaining the current service status of the audio service of the smart headphones, the method further includes: Detect the wearing temperature of the smart earphones; When the wearing temperature is within the first preset temperature range, the heat dissipation component is controlled to dissipate heat according to the basic heat dissipation power. When the wearing temperature is within the second preset temperature range, the step of obtaining the current service status of the audio service of the smart earphone is executed, wherein the second preset temperature range is higher than the first preset temperature range, and the preset heat dissipation power is higher than the basic heat dissipation power; When the wearing temperature is within the third preset temperature range, the maximum heat dissipation power of the heat dissipation component is obtained, and the heat dissipation component is controlled to dissipate heat according to the maximum heat dissipation power. The third preset temperature range is higher than the second preset temperature range, and the maximum heat dissipation power is higher than the preset heat dissipation power.

[0012] Furthermore, to achieve the above objectives, this application also proposes a heat dissipation device, the device comprising: The service status module is used to obtain the current service status of the audio service of the smart earphone when the smart earphone is worn by the user. The power adjustment module is used to reduce the preset heat dissipation power of the heat dissipation component when the current service status is that audio service is present. The heat dissipation control module is used to control the heat dissipation components to dissipate heat according to the reduced preset heat dissipation power.

[0013] In addition, to achieve the above objectives, this application also proposes a smart earphone, which is equipped with a heat dissipation component; The smart earphones further include: a memory, a processor, and a computer program stored in the memory and executable on the processor, the computer program being configured to implement the steps of the heat dissipation method described above.

[0014] In addition, to achieve the above objectives, this application also proposes a storage medium, which is a computer-readable storage medium, on which a computer program is stored, and when the computer program is executed by a processor, it implements the steps of the heat dissipation method described above.

[0015] One or more technical solutions proposed in this application have at least the following technical effects: The heat dissipation method of this application is applied to a smart earphone equipped with a heat dissipation component. The heat dissipation method includes: when the smart earphone is worn by a user, obtaining the current service status of the audio service of the smart earphone; when the current service status is that there is an audio service, reducing the preset heat dissipation power of the heat dissipation component; and controlling the heat dissipation component to dissipate heat according to the reduced preset heat dissipation power.

[0016] This application detects the current service status of the smart earphone's audio service when the user wears the smart earphone, and actively reduces the preset heat dissipation power of the heat dissipation component when an audio service is detected in the current service status. This ensures heat dissipation while reducing the noise generated by the heat dissipation component, so as to avoid affecting the user's listening process when using the earphone, thereby improving the user experience. Attached Figure Description

[0017] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a flowchart illustrating an embodiment of the heat dissipation method of this application. Figure 2 This is an overall architecture diagram provided for Embodiment 1 of the heat dissipation method of this application; Figure 3 This is a flowchart illustrating Embodiment 2 of the heat dissipation method of this application; Figure 4 This is a flowchart illustrating Embodiment 3 of the heat dissipation method of this application; Figure 5 This is a block diagram of the module structure of the heat dissipation device according to an embodiment of this application; Figure 6 This is a schematic diagram of the hardware operating environment involved in the smart earphones in this application embodiment.

[0020] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0021] To make the above-mentioned objectives, features, and advantages of this application more apparent and understandable, the technical solutions in the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are merely some embodiments of this application, and not all embodiments. All other embodiments obtained by those skilled in the art based on the embodiments of this application without creative effort are within the scope of protection of this application.

[0022] The main solution proposed in this application is as follows: Currently, in scenarios requiring the wearing of over-ear headphones, such as gaming, e-sports, audio-visual entertainment, and long-term remote work, active heat dissipation components are typically integrated inside the earcups to improve wearing comfort and alleviate the stuffiness caused by the continuous covering of the ears. Existing heat dissipation solutions generally utilize heat dissipation components to drive airflow when the temperature is too high, thereby achieving the exchange of gases and heat dissipation between the inside and outside of the earcups.

[0023] However, since heat dissipation components typically operate at a set power, they generate considerable noise during operation, which is particularly noticeable when users listen to audio through headphones, interfering with the user's audio listening experience. For example, in scenarios where gamers need to hear subtle footsteps or clearly distinguish voices during voice calls, the humming or airflow noise generated by the heat dissipation components will be directly superimposed on the audio, and in severe cases, may even mask critical sound information, leading to a degraded user experience.

[0024] To address the aforementioned issues, this application provides a heat dissipation method that detects the current service status of the smart headphones' audio service when the user wears them, and proactively reduces the preset heat dissipation power of the heat dissipation component when an audio service is detected in the current service status. This ensures heat dissipation while reducing noise generated by the heat dissipation component, thereby avoiding affecting the user's listening experience and improving the user experience.

[0025] It should be noted that the implementing entity of this application embodiment can be a smart headset with heat dissipation function, such as a gaming headset, in-ear headset, or over-ear headset. The following description uses a smart headset (hereinafter referred to as a headset) as an example to illustrate this embodiment and the subsequent embodiments.

[0026] Based on this, this application proposes a heat dissipation method according to a first embodiment, referring to... Figure 1 , Figure 1 This is a flowchart illustrating an embodiment of the heat dissipation method of this application. In this embodiment, the method is applied to a smart earphone equipped with a heat dissipation component, and the heat dissipation method may include steps S10~S30: Step S10: When the smart earphone is worn by the user, obtain the current service status of the audio service of the smart earphone.

[0027] It should be noted that the heat dissipation component can be an active heat dissipation module integrated into the headphones, such as a rotating fan or a piezoelectric fan, which is used to reduce the internal temperature of the headphone earcups through airflow or vibration ventilation.

[0028] It should also be noted that the current service status reflects whether the headset is transmitting or processing audio services, such as playing music, making calls, or playing game sound effects.

[0029] In actual use, after the headphones are powered on, they can continuously detect the user's wearing status through built-in sensors (such as capacitive, infrared, or pressure sensors). When the headphones detect that they are being worn, they trigger the heat dissipation function. At this time, the Bluetooth chip inside the headphones can monitor the audio data stream to determine whether audio content (such as music, game sound effects, or call voice) is being played or transmitted, thus determining the current service status of the audio service.

[0030] Step S20: When the current service status is that audio service exists, the preset heat dissipation power of the heat dissipation component is reduced.

[0031] Step S30: Control the heat dissipation component to dissipate heat according to the reduced preset heat dissipation power.

[0032] Understandably, the preset heat dissipation power can be a fixed power reference value pre-set in the heat dissipation component to activate the heat dissipation function. For example, when it is necessary to cool down the smart headphones, the heat dissipation component is activated, and the heat dissipation component dissipates heat from the smart headphones according to the preset heat dissipation power reference value.

[0033] In practical use, when an audio service is detected in the smart earphones, it indicates that the user is listening to an audio service and is more concerned about the purity of the sound quality or is more sensitive to noise. At this time, the preset heat dissipation power of the heat dissipation component can be reduced (such as by 30% or 50%, which is not limited in this embodiment) to weaken or suppress the vibration noise and airflow noise generated by the heat dissipation component during operation, thereby avoiding the noise interfering with the user's listening to the audio content.

[0034] Furthermore, in order to improve the adaptive adjustment capability of heat dissipation in smart headphones, refer to Figure 2 , Figure 2 This is an overall architecture diagram provided for Embodiment 1 of the heat dissipation method of this application. In this embodiment, before the step of obtaining the current service status of the audio service of the smart headset, the method further includes: Step S01: Detect the wearing temperature of the smart earphones.

[0035] It should be noted that the wearing temperature can be the real-time temperature value of the area where the inner part of the earcup contacts the ear skin when the earphone is worn by the user, which can be monitored by the temperature sensor built in the earphone. According to the wearing situation, the temperature can be divided into multiple levels (such as three levels or four levels, and this embodiment does not limit this), so as to implement heat dissipation at different levels. The temperature threshold of each level can be adjusted according to the actual product situation. For example, different earcup materials and different earcup structure designs may have different heat dissipation situations, and multiple temperature thresholds can be set according to the comfort level of human perception.

[0036] Exemplarily, taking the heat dissipation divided into four levels as an example for illustration, but this does not limit the present solution. The first temperature threshold T1 can be set as the basic heat dissipation trigger temperature (for example, T1 = 25 °C), the second temperature threshold T2 can be set as the starting temperature for multi-dimensional adjustment (for example, T2 = 30 °C), and the third temperature threshold T3 can be set as the maximum power trigger temperature (example value: T3 = 38 °C).

[0037] During actual use, as Figure 2 shown, when the earphone starts to be turned on, continuously detect the wearing state of the earphone and determine whether the earphone is in the state of being worn by the user; if the earphone is in the state of being worn by the user, the temperature sensor in the earcup of the earphone can be turned on to continuously detect the temperature, and the wearing temperature t can be obtained. According to the wearing temperature, heat dissipation control at different levels is carried out. For example, when the wearing temperature t < T1, at this time the temperature inside the earcup is relatively low, generally no heat dissipation is required, and the heat dissipation and ventilation function of the heat dissipation component can be turned off, and the power W of the heat dissipation component = 0.

[0038] Step S02: When the wearing temperature is within the first preset temperature range, control the heat dissipation component to dissipate heat according to the basic heat dissipation power.

[0039] It can be understood that the first preset temperature range (such as T1 - T2) can be the temperature threshold segment where the wearing temperature of the earcup has risen slightly. At this time, there is a slight stuffy feeling inside the earcup, and the active heat dissipation and ventilation function of the heat dissipation component is turned on and operates at the basic heat dissipation power.

[0040] It can also be understood that the basic heat dissipation power can be the lowest power that meets the basic ventilation and heat dissipation requirements. Exemplarily, let the maximum heat dissipation power of the heat dissipation component be , then the basic heat dissipation power can be: ; where is the maximum heat dissipation power of the heat dissipation component; This is a proportionality coefficient (e.g., 20%-30%, which is not limited in this embodiment) that can be adjusted according to actual conditions. At this point, the heat dissipation noise is controlled within a range that is not easily perceived by the user. This power can both drive airflow through the micro-vibration of the heat dissipation components and keep the noise within a range that is imperceptible to the user (e.g., <25dB).

[0041] In practical use, such as Figure 2 As shown, when T2>t>T1, the wearing temperature is within the first preset temperature range, and there is a slight stuffy feeling inside the earcups. The active heat dissipation and ventilation function of the heat dissipation component is activated, and it operates at the basic heat dissipation power.

[0042] Step S03: When the wearing temperature is within the second preset temperature range, perform the step of obtaining the current service status of the audio service of the smart earphone, wherein the second preset temperature range is higher than the first preset temperature range, and the preset heat dissipation power is higher than the basic heat dissipation power.

[0043] It should be noted that the second preset temperature range (such as T2-T3) can be the temperature threshold range where the wearing temperature of the earcups has risen significantly. At this time, there is a strong feeling of stuffiness inside the earcups, and it is necessary to turn on the higher power of the heat dissipation components (i.e., the preset heat dissipation power) for heat dissipation and ventilation.

[0044] In practical use, such as Figure 2 As shown, when T3>t>T2, there is a relatively strong feeling of stuffiness inside the earcups, requiring the preset cooling power to be activated for ventilation. However, since the cooling components generate noticeable cooling noise when operating at high power, the preset cooling power needs to be dynamically adjusted based on the audio service status to obtain a reduced preset cooling power (i.e., dynamic power W2) for cooling. For example, when an audio service is detected in the current service status, the preset cooling power of the cooling components is actively reduced, thereby ensuring the cooling function while reducing the noise generated by the cooling components to avoid affecting the user's listening experience and preventing cooling noise from interfering with sound quality.

[0045] Step S04: When the wearing temperature is within the third preset temperature range, obtain the maximum heat dissipation power of the heat dissipation component, and control the heat dissipation component to dissipate heat according to the maximum heat dissipation power. The third preset temperature range is higher than the second preset temperature range, and the maximum heat dissipation power is higher than the preset heat dissipation power.

[0046] Understandably, the third preset temperature range (e.g., >T3) can be the high-temperature threshold range where the earcups become too hot. Continuing to wear the headphones at this point will cause discomfort, requiring the maximum cooling power to be forcibly activated. It also alerts users that they may need to remove the headphones for a break to end their use of the headphones.

[0047] This embodiment obtains the wearing temperature of the earcups and adjusts the heat dissipation power according to different temperature ranges. When the earcups are low temperature, the power is turned off or operated at low power to save energy. When the earcups are at medium temperature, the power is intelligently adjusted according to the audio service status to avoid interfering with the sound quality. When the earcups are high temperature, full power heat dissipation is forced and a rest prompt is given. This adapts to various scenarios and improves the dynamic control capability of headphone heat dissipation.

[0048] This application provides a heat dissipation method applied to a smart earphone equipped with a heat dissipation component. The method includes: acquiring the current service status of the audio service of the smart earphone when it is worn by a user; reducing the preset heat dissipation power of the heat dissipation component when the current service status indicates the presence of an audio service; and controlling the heat dissipation component to dissipate heat according to the reduced preset heat dissipation power. Because this application detects the current service status of the smart earphone's audio service when the user wears it, and actively reduces the preset heat dissipation power of the heat dissipation component when an audio service is detected, it reduces noise generated by the heat dissipation component while ensuring heat dissipation functionality, thus avoiding interference with the user's listening experience and improving the user experience.

[0049] Based on the first embodiment of this application, in the second embodiment of this application, the content that is the same as or similar to the above embodiment can be referred to the above description, and will not be repeated hereafter. On this basis, a second embodiment of the dialogue method of this application is proposed, please refer to... Figure 3 , Figure 3 This is a flowchart illustrating a second embodiment of the heat dissipation method of this application. To reduce the preset heat dissipation power, such as... Figure 3 As shown, in this embodiment, the step of reducing the preset heat dissipation power of the heat dissipation component when the current service status is that audio service exists includes: Step S21: If the current service status is that audio service exists, obtain the preset audio service coefficient.

[0050] Step S22: Reduce the preset audio service coefficient to obtain the reduced preset audio service coefficient.

[0051] It should be noted that the preset audio service coefficient can be a pre-set weighting parameter used to adjust the preset heat dissipation power, denoted as . This is used to reflect the degree of impact of audio services on heat dissipation strategies.

[0052] For example, when audio services are present, the preset audio service coefficient can be reduced (e.g., reduced to 20% or 50%, etc., this embodiment does not limit this) to reduce the interference of heat dissipation noise on sound quality.

[0053] Step S23: Reduce the preset heat dissipation power based on the reduced preset audio service coefficient.

[0054] It is understandable that the preset heat dissipation power is the fixed power activated during the second preset temperature range mentioned above. Combined with the maximum heat dissipation power mentioned above, it can be set as the preset heat dissipation power. ;in, This is a proportionality factor (e.g., 50%-60%, which is not limited in this embodiment).

[0055] In practical use, when audio services are present, the preset audio service coefficient is obtained. At this point, the preset audio service coefficient is reduced, such as... The process involves obtaining a reduced preset audio service coefficient; then multiplying this reduced preset audio service coefficient by a preset heat dissipation power to obtain a reduced preset heat dissipation power, and controlling the heat dissipation components to dissipate heat. This dynamic adjustment of the preset audio service coefficient allows for accurate calculation of a lower and more suitable reduced preset heat dissipation power in scenarios such as audio playback and calls.

[0056] Furthermore, considering that smart headphones have noise cancellation functionality, in this embodiment, the step of controlling the heat dissipation component to dissipate heat according to the reduced preset heat dissipation power includes: Step S31: Obtain the current noise cancellation state of the active noise cancellation mode of the smart headphones, and obtain the preset noise cancellation state coefficient.

[0057] Step S32: Adjust the preset noise reduction state coefficient according to the current noise reduction state. The adjustment operation is either an increase operation or a decrease operation.

[0058] It should be noted that Active Noise Cancellation (ANC) is a technology that uses the headphone's built-in noise cancellation system to generate in real time inverse sound waves with the same amplitude but opposite phase to the ambient noise. These sound waves cancel each other out, reducing the perceived noise intensity for the user. The current noise cancellation status refers to the real-time operating status of the smart headphones' active noise cancellation function, including both on and off modes.

[0059] It should also be noted that the preset noise reduction state coefficient can be another weighted parameter preset to adjust the preset heat dissipation power, denoted as . This is used to quantify the impact of ANC status on heat dissipation power.

[0060] For example, for the added operation, that is, when ANC is turned on, the fan noise will be reduced in ANC mode. Therefore, the preset noise reduction state coefficient can be appropriately increased (such as by 20% or 50%, etc., this embodiment does not limit this) to improve the heat dissipation effect of the headphones.

[0061] To reduce noise, when ANC is off, the fan noise will be more noticeable. Therefore, the preset noise reduction coefficient can be reduced appropriately (e.g., by 20% or 50%) to avoid affecting the user's listening experience with headphones.

[0062] Step S33: Adjust the reduced preset heat dissipation power by adjusting the preset noise reduction state coefficient.

[0063] Step S34: Control the heat dissipation component to dissipate heat according to the adjusted preset heat dissipation power.

[0064] In practical use, when audio services are active, the preset cooling power of the heat dissipation components is reduced, resulting in a lower preset cooling power. Considering the noise cancellation function of the smart headphones, the current noise cancellation state of the active noise cancellation mode is obtained, along with a preset noise cancellation state coefficient. This coefficient is then adjusted based on the current noise cancellation state: when ANC is enabled, the coefficient is increased to improve heat dissipation; when ANC is disabled, it is decreased (e.g., by 20% or 50%) to avoid affecting the user's listening experience. Finally, the adjusted preset noise cancellation coefficient is multiplied by the reduced preset cooling power to obtain the adjusted preset cooling power, which is then used to control the heat dissipation of the heat dissipation components. By combining the active noise cancellation mode of the smart headphones, the cooling power of the heat dissipation components is dynamically adjusted while ensuring a good listening experience for the user, further improving the cooling effect.

[0065] Furthermore, considering the user's environment, in this embodiment, the step of controlling the heat dissipation component to dissipate heat according to the reduced preset heat dissipation power includes: Step S31': Obtain the preset environmental noise coefficient.

[0066] Step S32': Collect the ambient noise data of the smart earphone and determine the current sound pressure level corresponding to the ambient noise data.

[0067] It should be noted that the preset environmental noise coefficient can be other weighted parameters that are pre-set to adjust the preset heat dissipation power, denoted as y3, which is used to reflect the degree of influence of environmental noise on heat dissipation.

[0068] It should also be noted that the ambient noise data is real-time external sound signal collected by the microphones built into the earcups of the headphones, including parameters such as frequency and sound pressure level. This data can be used to determine the noise level in the user's environment (e.g., 40dB in an office, 80dB in a subway). Current Sound Pressure Level (SPR). Sound intensity can be a physical quantity reflecting sound intensity in environmental noise data, with the unit being decibels (dB).

[0069] Step S33': When the current sound pressure level reaches the preset sound pressure level threshold, determine the current sound pressure level interval in which the current sound pressure level is located, and increase the preset environmental noise coefficient according to the current sound pressure level interval.

[0070] Understandably, the preset sound pressure level threshold can be a critical sound pressure level value that triggers the adjustment of heat dissipation power (e.g., 40dB or 50dB, this embodiment does not limit this). When the current sound pressure level of the external noise exceeds the preset sound pressure level threshold, it can be considered that the ambient noise is sufficient to mask the heat dissipation noise generated by heat dissipation, allowing the heat dissipation power to be increased. This is because, audibly, subtle noises can only be heard in extremely quiet environments. If the ambient noise itself is high, subtle noises are easily ignored by the human ear, thus allowing for increased heat dissipation power in certain situations.

[0071] For example, different current sound pressure level ranges can be set for different current sound pressure levels to increase the preset heat dissipation power to varying degrees. Assuming the preset boost threshold is 40dB, the adjustment formula for the preset ambient noise figure is as follows: That is, when the current sound pressure level is less than 40 decibels, the ambient noise is difficult to mask the heat dissipation noise generated by heat dissipation, and the preset ambient noise coefficient is not processed in any way.

[0072] When the current sound pressure level is between 40dB and 70dB, the ambient noise can partially mask the heat dissipation noise generated by heat dissipation. At this time, the preset ambient noise coefficient can be slightly increased to partially improve the heat dissipation power of the heat dissipation components.

[0073] When the current sound pressure level is greater than 70dB, the ambient noise is too loud, and the user cannot hear the heat dissipation noise generated by the heat dissipation inside the headphones. At this time, the preset ambient noise coefficient can be increased significantly to increase the heat dissipation power.

[0074] Step S34': Adjust the reduced preset heat dissipation power by increasing the preset preset ambient noise figure.

[0075] Step S35': Control the heat dissipation component to dissipate heat according to the adjusted preset heat dissipation power.

[0076] In practical use, when audio services are active, the headphones reduce the preset cooling power of the heat dissipation components, resulting in a reduced preset cooling power. Then, considering the ambient noise in the user's environment, a preset ambient noise coefficient is obtained, and the ambient noise data of the smart headphones is collected to determine the corresponding current sound pressure level. If the current sound pressure level reaches a preset sound pressure level threshold, the current sound pressure level range is determined, and the preset ambient noise coefficient is increased according to the aforementioned adjustment formula. Finally, the reduced preset cooling power is adjusted using the increased preset ambient noise coefficient, controlling the heat dissipation components to dissipate heat. Thus, by combining ambient noise data and the preset ambient noise coefficient, environmental changes are automatically identified to optimize the heat dissipation effect.

[0077] Furthermore, to avoid excessive power consumption of the heat dissipation components when the user wears the smart headphones, in this embodiment, after the step of obtaining the current service status of the audio service of the smart headphones, the method further includes: When the current service status is that there is no audio service, a preset audio service coefficient and a preset upper limit heat dissipation power of the heat dissipation component are obtained, wherein the preset upper limit heat dissipation power is higher than the preset heat dissipation power; The preset audio service coefficient is increased to obtain the increased preset audio service coefficient; The preset heat dissipation power of the heat dissipation component is increased based on the increased preset audio service coefficient to obtain the increased preset heat dissipation power; The minimum power is selected from the increased preset heat dissipation power and the preset upper limit heat dissipation power to control the heat dissipation component for heat dissipation.

[0078] It should be noted that the preset upper limit of heat dissipation power can be the maximum allowable power value of the heat dissipation component (e.g., 80% of the maximum heat dissipation power) when the user is wearing headphones and there is no audio service. At this time, it will not significantly affect the user's comfort when wearing the headphones.

[0079] For example, when there is no audio service, the preset audio service coefficient can be increased (such as by 20% or 50%, etc., this embodiment does not limit this) so as to maximize the heat dissipation of the headphones as soon as possible when the user is not using audio services, thereby improving the heat dissipation effect.

[0080] In actual use, when there is no audio service, the earphone can first obtain the preset audio service coefficient and the preset upper limit heat dissipation power of the heat dissipation component. Then, increase the preset audio service coefficient to obtain the increased preset audio service coefficient, and increase the preset heat dissipation power based on the increased preset audio service coefficient to obtain the increased preset heat dissipation power. At this time, considering that the increased preset heat dissipation power may be too large and affect the user's experience of wearing the earphone, the minimum power can be selected from the increased preset heat dissipation power and the preset upper limit heat dissipation power to control the heat dissipation component for heat dissipation. Thus, when the user does not use the audio service, through the limitation of the preset upper limit heat dissipation power, the heat dissipation of the earphone can be maximized as soon as possible without affecting the comfort of the user wearing the earphone, improving the heat dissipation effect.

[0081] Further, based on the above embodiments, the heat dissipation power can also be adjusted by comprehensively considering multi-dimensional information such as the preset audio service coefficient, the preset noise reduction state coefficient, and the preset ambient noise coefficient.

[0082] That is, in the case of T2 ≤ t < T3, the dynamic heat dissipation power is: ; Where, is the proportionality coefficient; is the audio service coefficient, when there is an audio service , when there is no audio service , here it is not limited that the audio service coefficient is adjusted by 20%, and it can be actually set according to the situation; is the preset noise reduction state coefficient, when ANC is turned on , when ANC is turned off , here it is not limited that the preset noise reduction state coefficient is adjusted by 20%, and it can be actually set according to the situation; is the preset ambient noise coefficient, which can be adjusted according to the above sound pressure level range; is the preset upper limit heat dissipation power.

[0083] Combined with the foregoing content, in the technical solution provided in the embodiments of the present application, the heat dissipation and ventilation strategy of the heat dissipation component can be adaptively adjusted in combination with the user's audio service state, ANC state, and external noise data, so as to reduce the temperature of the ear cup while avoiding the influence of the ventilation noise on the user's use, and taking into account the user's wearing comfort and audio experience.

[0084] Based on the first embodiment and / or the second embodiment of the present application, in the third embodiment of the present application, the content that is the same as or similar to the above-mentioned first embodiment and second embodiment can be referred to the above introduction and will not be repeated hereinafter. On this basis, please refer to Figure 4 , Figure 4This is a flowchart illustrating Embodiment 3 of the heat dissipation method of this application. To further improve the accuracy of reducing the preset audio service coefficient, such as... Figure 4 As shown, in this embodiment, the step of reducing the preset audio service coefficient to obtain the reduced preset audio service coefficient includes: Step S221: Obtain the audio data of the audio service and convert the audio data into a spectrogram.

[0085] It should be noted that audio data can be the raw sound signal that the smart headphones are currently processing (such as playing, recording, or transmitting). For example, when playing music, the audio data includes a mixture of signals such as human voices and instrument sounds, while the data during a call is mainly composed of speech segments.

[0086] It should also be noted that a spectrogram can be a visual chart that converts audio data from the time domain to the frequency domain. The horizontal axis represents frequency and the vertical axis represents energy intensity, which can intuitively show the distribution of each frequency component in the audio data.

[0087] Step S222: Extract audio features from the spectrogram and determine the current frequency characteristics of the audio features.

[0088] Understandably, current frequency characteristics can be characteristic parameters that reflect audio data. For example, the frequency characteristics of a drum sound are low frequencies (20-250Hz), the frequency characteristics of a human voice are mid frequencies (250-4kHz), and the frequency characteristics of a cymbal correspond to high frequencies (above 4kHz).

[0089] Step S223: Determine the corresponding current reduction level based on the current frequency characteristics, and reduce the preset audio service coefficient according to the current reduction level to obtain the reduced preset audio service coefficient.

[0090] It should be noted that the current reduction level can be the amount of heat dissipation power suppression determined based on the current frequency characteristics, usually expressed as a linear ratio or a fixed value. For example, if the audio data contains a large number of high-frequency components, the reduction level can be set to 30% (i.e., heat dissipation power is reduced by 30%); if the audio data contains low-frequency speech, the reduction level can be set to "10%".

[0091] For example, when the playback content mainly consists of low-pitched vocals and instrumental music, users are more sensitive to mid-to-high frequency noise (such as fan noise). In this case, the preset audio service coefficient can be significantly reduced by 30% to obtain a reduced preset heat dissipation power. When the playback content consists of intense game sound effects or heavy metal music, the rich sound effects themselves can mask the fan noise. In this case, the preset audio service coefficient can be reduced slightly by 10% to improve heat dissipation efficiency.

[0092] This embodiment converts audio data into a spectrum and extracts frequency characteristics. It can further adjust the preset audio service coefficients according to different reduction degrees based on the current frequency characteristics, thereby optimizing the heat dissipation performance of headphones in different audio scenarios.

[0093] It should be noted that the above examples are only for understanding this application and do not constitute a limitation on the heat dissipation method of this application. Any simple modifications based on this technical concept are within the protection scope of this application.

[0094] This application also provides a heat dissipation device, please refer to... Figure 5 , Figure 5 This is a block diagram of the module structure of the heat dissipation device according to an embodiment of this application; in this embodiment, the heat dissipation device includes: The service status module 501 is used to obtain the current service status of the audio service of the smart earphone when the smart earphone is worn by the user. The power adjustment module 502 is used to reduce the preset heat dissipation power of the heat dissipation component when the current service status is that audio service exists; The heat dissipation control module 503 is used to control the heat dissipation components to dissipate heat according to the reduced preset heat dissipation power.

[0095] In this embodiment, when the smart earphone is worn by a user, the current service status of the audio service of the smart earphone is detected by the service status module. When an audio service is detected in the current service status, the preset heat dissipation power of the heat dissipation component is actively reduced by the power adjustment module. Finally, the heat dissipation control module controls the heat dissipation component to dissipate heat according to the reduced preset heat dissipation power. This ensures heat dissipation while further reducing the noise generated by the heat dissipation component, so as not to affect the user's listening process, thereby improving the user experience.

[0096] In one implementation, the power adjustment module 502 is further configured to: obtain a preset audio service coefficient when the current service status is that audio service exists; reduce the preset audio service coefficient to obtain a reduced preset audio service coefficient; and reduce the preset heat dissipation power based on the reduced preset audio service coefficient.

[0097] In one implementation, the power adjustment module 502 is further configured to obtain the current noise cancellation state of the active noise cancellation mode of the smart headphones and obtain a preset noise cancellation state coefficient; adjust the preset noise cancellation state coefficient according to the current noise cancellation state, wherein the adjustment operation is an increase operation or a decrease operation; and adjust the reduced preset heat dissipation power through the adjusted preset noise cancellation state coefficient. The heat dissipation control module 503 is also used to control the heat dissipation component to dissipate heat according to the adjusted preset heat dissipation power.

[0098] In one implementation, the power adjustment module 502 is further configured to: acquire a preset ambient noise coefficient; collect ambient noise data of the smart earphone and determine the current sound pressure level corresponding to the ambient noise data; when the current sound pressure level reaches a preset sound pressure level threshold, determine the current sound pressure level range in which the current sound pressure level is located, and increase the preset ambient noise coefficient according to the current sound pressure level range; and adjust the reduced preset heat dissipation power using the increased preset ambient noise coefficient. The heat dissipation control module 503 is also used to control the heat dissipation component to dissipate heat according to the adjusted preset heat dissipation power.

[0099] In one implementation, the power adjustment module 502 is further configured to, when the current service status is no audio service, obtain a preset audio service coefficient and a preset upper limit heat dissipation power of the heat dissipation component, wherein the preset upper limit heat dissipation power is higher than the preset heat dissipation power; increase the preset audio service coefficient to obtain an increased preset audio service coefficient; and increase the preset heat dissipation power of the heat dissipation component based on the increased preset audio service coefficient to obtain an increased preset heat dissipation power. The heat dissipation control module 503 is also used to select the minimum power from the increased preset heat dissipation power and the preset upper limit heat dissipation power to control the heat dissipation component to dissipate heat.

[0100] In one implementation, the power adjustment module 502 is further configured to acquire audio data of the audio service and convert the audio data into a spectrum; extract audio features from the spectrum and determine the current frequency characteristics of the audio features; determine the corresponding current reduction degree based on the current frequency characteristics, and reduce the preset audio service coefficient according to the current reduction degree to obtain the reduced preset audio service coefficient.

[0101] In one implementation, the heat dissipation control module 503 is further configured to detect the wearing temperature of the smart earphone; when the wearing temperature is within a first preset temperature range, control the heat dissipation component to dissipate heat according to a basic heat dissipation power; when the wearing temperature is within a second preset temperature range, perform the operation of obtaining the current service status of the audio service of the smart earphone, wherein the second preset temperature range is higher than the first preset temperature range and the preset heat dissipation power is higher than the basic heat dissipation power; when the wearing temperature is within a third preset temperature range, obtain the maximum heat dissipation power of the heat dissipation component and control the heat dissipation component to dissipate heat according to the maximum heat dissipation power, wherein the third preset temperature range is higher than the second preset temperature range and the maximum heat dissipation power is higher than the preset heat dissipation power.

[0102] Other embodiments or specific implementations of the heat dissipation device of this application can be found in the above-described method embodiments, and will not be repeated here.

[0103] The heat dissipation device provided in this application, employing the heat dissipation method described in the above embodiments, can solve the technical problem that the heat dissipation components inside the headphones generate significant noise during operation, affecting the user's listening experience. Compared with the prior art, the beneficial effects of the heat dissipation device provided in this application are the same as those of the heat dissipation method provided in the above embodiments, and other technical features of the heat dissipation device are the same as those disclosed in the methods of the above embodiments, and will not be repeated here.

[0104] This application provides a smart headset with a heat dissipation component. The smart headset includes: at least one processor; and a memory communicatively connected to the at least one processor. The memory stores instructions executable by the at least one processor, which are executed by the at least one processor to enable the at least one processor to perform the smart headset method in the above embodiments.

[0105] The following is for reference. Figure 6 , Figure 6 This is a schematic diagram of the hardware operating environment involved in the smart headphones in the embodiments of this application, showing a structural diagram suitable for implementing the heat dissipation method of the embodiments of this application. The smart headphones in the embodiments of this application may include, but are not limited to, over-ear headphones, gaming headphones, in-ear headphones, etc. Figure 6 The smart earphones shown are merely an example and should not be construed as limiting the functionality and scope of use of the embodiments of this application.

[0106] like Figure 6As shown, a smart headset may include a processing device 1001 (e.g., a central processing unit), which can perform various appropriate actions and processes according to a program stored in a read-only memory 1002 or a program loaded from a storage device 1003 into a random access memory 1004. The random access memory 1004 also stores various programs and data required for the operation of the smart headset. The processing device 1001, the read-only memory 1002, and the random access memory 1004 are interconnected via a bus 1005. An input / output interface 1006 is also connected to the bus. Typically, the following systems can be connected to the input / output interface 1006: an input device 1007 including, for example, a microphone; an output device 1008 including, for example, a speaker, a vibrator, etc.; a storage device 1003 including, for example, a hard disk; and a communication device 1009. The communication device 1009 allows the smart headset to communicate wirelessly or wiredly with other devices to exchange data. Although a smart headset with various systems is shown in the figure, it should be understood that it is not required to implement or possess all the systems shown. More or fewer systems may be implemented or possessed alternatively.

[0107] The smart earphones provided in this application, employing the heat dissipation method described in the above embodiments, can solve the technical problem that the heat dissipation components inside the earphones generate significant noise during operation, affecting the user's listening experience. Compared with the prior art, the beneficial effects of the smart earphones provided in this application are the same as those of the heat dissipation method provided in the above embodiments, and other technical features of the smart earphones are the same as those disclosed in the previous embodiment method, and will not be repeated here.

[0108] It should be understood that the various parts disclosed in this application can be implemented using hardware, software, firmware, or a combination thereof. In the description of the above embodiments, specific features, structures, materials, or characteristics can be combined in any suitable manner in one or more embodiments or examples.

[0109] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

[0110] This application provides a computer-readable storage medium having computer-readable program instructions (i.e., a computer program) stored thereon, the computer-readable program instructions being used to perform the heat dissipation method in the above embodiments.

[0111] The computer-readable storage medium provided in this application may be, for example, a USB flash drive, but is not limited to, electrical, magnetic, optical, electromagnetic, infrared, or semiconductor systems or devices, or any combination thereof. More specific examples of computer-readable storage media may include, but are not limited to: electrical connections having one or more wires, portable computer disks, hard disks, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof. In this embodiment, the computer-readable storage medium may be any tangible medium containing or storing a program that can be used by or in conjunction with an instruction execution system or device. The program code contained on the computer-readable storage medium may be transmitted using any suitable medium, including but not limited to: wires, optical cables, radio frequency (RF), etc., or any suitable combination thereof.

[0112] The aforementioned computer-readable storage medium may be included in the smart headphones; or it may exist independently and not assembled into the smart headphones.

[0113] The aforementioned computer-readable storage medium carries one or more programs that, when executed by the smart earphone, cause the smart earphone to: when the smart earphone is worn by a user, acquire the current service status of the audio service of the smart earphone; when the current service status indicates that an audio service exists, reduce the preset heat dissipation power of the heat dissipation component; and control the heat dissipation component to dissipate heat according to the reduced preset heat dissipation power.

[0114] Computer program code for performing the operations of this application can be written in one or more programming languages ​​or a combination thereof, including object-oriented programming languages ​​such as Java, Smalltalk, and C++, as well as conventional procedural programming languages ​​such as the "C" language or similar programming languages. The program code can be executed entirely on the user's computer, partially on the user's computer, as a standalone software package, partially on the user's computer and partially on a remote computer, or entirely on a remote computer or server. In cases involving remote computers, the remote computer can be connected to the user's computer via any type of network—including a Local Area Network (LAN) or a Wide Area Network (WAN)—or can be connected to an external computer (e.g., via the Internet using an Internet service provider).

[0115] The flowcharts and block diagrams in the accompanying drawings illustrate the architecture, functionality, and operation of possible implementations of systems, methods, and computer program products according to various embodiments of this application. In this regard, each block in a flowchart or block diagram may represent a module, segment, or portion of code containing one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions indicated in the blocks may occur in a different order than those indicated in the drawings. For example, two consecutively indicated blocks may actually be executed substantially in parallel, and they may sometimes be executed in reverse order, depending on the functions involved. It should also be noted that each block in the block diagrams and / or flowcharts, and combinations of blocks in the block diagrams and / or flowcharts, can be implemented using a dedicated hardware-based system that performs the specified function or operation, or using a combination of dedicated hardware and computer instructions.

[0116] The modules described in the embodiments of this application can be implemented in software or hardware. The names of the modules do not necessarily limit the functionality of the unit itself.

[0117] The readable storage medium provided in this application is a computer-readable storage medium that stores computer-readable program instructions (i.e., a computer program) for executing the above-described heat dissipation method. This solves the technical problem that the heat dissipation components inside the headphones generate significant noise during operation, affecting the user's listening experience. Compared with the prior art, the beneficial effects of the computer-readable storage medium provided in this application are the same as those of the heat dissipation method provided in the above embodiments, and will not be repeated here.

[0118] The above description is only a part of the embodiments of this application and does not limit the scope of protection of this application. All equivalent structural transformations made under the technical concept of this application and using the content of this application specification and drawings, or direct / indirect applications in other related technical fields, are included in the scope of protection of this application.

Claims

1. A heat dissipation method, characterized in that, The method is applied to smart headphones equipped with heat dissipation components, and the method includes: When the smart earphone is worn by the user, obtain the current service status of the audio service of the smart earphone; When the current service status is that audio service is present, the preset heat dissipation power of the heat dissipation component is reduced; The heat dissipation component is controlled to dissipate heat according to the reduced preset heat dissipation power.

2. The method as described in claim 1, characterized in that, The step of reducing the preset heat dissipation power of the heat dissipation component when the current service status is that audio service is present includes: If the current service status is that audio service exists, obtain the preset audio service coefficient; The preset audio service coefficient is reduced to obtain the reduced preset audio service coefficient; The preset heat dissipation power is reduced based on the reduced preset audio service coefficient.

3. The method as described in claim 2, characterized in that, The step of controlling the heat dissipation component to dissipate heat according to the reduced preset heat dissipation power includes: Obtain the current noise cancellation status of the active noise cancellation mode of the smart headphones, and obtain the preset noise cancellation status coefficient; The preset noise reduction state coefficient is adjusted according to the current noise reduction state, and the adjustment operation is either an increase operation or a decrease operation. The reduced preset heat dissipation power is adjusted by adjusting the preset noise reduction state coefficient; The heat dissipation component is controlled to dissipate heat according to the adjusted preset heat dissipation power.

4. The method as described in claim 2, characterized in that, The step of controlling the heat dissipation component to dissipate heat according to the reduced preset heat dissipation power includes: Obtain the preset environmental noise figure; Collect ambient noise data from the smart earphones and determine the current sound pressure level corresponding to the ambient noise data; When the current sound pressure level reaches a preset sound pressure level threshold, the current sound pressure level range in which the current sound pressure level is located is determined, and the preset environmental noise coefficient is increased according to the current sound pressure level range. The reduced preset heat dissipation power is adjusted by increasing the preset preset environmental noise figure; The heat dissipation component is controlled to dissipate heat according to the adjusted preset heat dissipation power.

5. The method as described in claim 2, characterized in that, After the step of obtaining the current service status of the audio service of the smart headphones, the method further includes: When the current service status is that there is no audio service, a preset audio service coefficient and a preset upper limit heat dissipation power of the heat dissipation component are obtained, wherein the preset upper limit heat dissipation power is higher than the preset heat dissipation power; The preset audio service coefficient is increased to obtain the increased preset audio service coefficient; The preset heat dissipation power of the heat dissipation component is increased based on the increased preset audio service coefficient to obtain the increased preset heat dissipation power; The minimum power is selected from the increased preset heat dissipation power and the preset upper limit heat dissipation power to control the heat dissipation component for heat dissipation.

6. The method as described in claim 2, characterized in that, The step of reducing the preset audio service coefficient to obtain the reduced preset audio service coefficient includes: Acquire the audio data of the audio service and convert the audio data into a spectrogram; Audio features are extracted from the spectrogram, and the current frequency characteristics of the audio features are determined. Based on the current frequency characteristics, the corresponding current reduction level is determined, and the preset audio service coefficient is reduced according to the current reduction level to obtain the reduced preset audio service coefficient.

7. The method according to any one of claims 1 to 6, characterized in that, Before the step of obtaining the current service status of the audio service of the smart headphones, the method further includes: Detect the wearing temperature of the smart earphones; When the wearing temperature is within the first preset temperature range, the heat dissipation component is controlled to dissipate heat according to the basic heat dissipation power. When the wearing temperature is within the second preset temperature range, the step of obtaining the current service status of the audio service of the smart earphone is executed, wherein the second preset temperature range is higher than the first preset temperature range, and the preset heat dissipation power is higher than the basic heat dissipation power; When the wearing temperature is within the third preset temperature range, the maximum heat dissipation power of the heat dissipation component is obtained, and the heat dissipation component is controlled to dissipate heat according to the maximum heat dissipation power. The third preset temperature range is higher than the second preset temperature range, and the maximum heat dissipation power is higher than the preset heat dissipation power.

8. A heat dissipation device, characterized in that, The device includes: The service status module is used to obtain the current service status of the audio service of the smart earphone when the smart earphone is worn by the user. The power adjustment module is used to reduce the preset heat dissipation power of the heat dissipation component when the current service status is that audio service is present. The heat dissipation control module is used to control the heat dissipation components to dissipate heat according to the reduced preset heat dissipation power.

9. A smart earphone, characterized in that, The smart earphones are equipped with heat dissipation components; The smart earphone further includes: a memory, a processor, and a computer program stored in the memory and executable on the processor, the computer program being configured to implement the steps of the heat dissipation method as described in any one of claims 1 to 7.

10. A storage medium, characterized in that, The storage medium is a computer-readable storage medium, and a computer program is stored on the storage medium. When the computer program is executed by a processor, it implements the steps of the heat dissipation method as described in any one of claims 1 to 7.

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