Cover body, electronic equipment and manufacturing method of cover body

Abstract

The embodiment of the invention provides a cover body, electronic equipment and a manufacturing method of the cover body, the cover body comprises a substrate with a first area, a buffer insulating layer and an induction conducting layer which are arranged in a groove structure of the substrate and correspond to the first area, and the induction conducting layer is used for forming induction current or induction electric signals through electromagnetic induction. And the buffer insulating layer is arranged between the induction conducting layer and the inner surface of the corresponding groove of the substrate, and is used for buffering collision between the substrate and the induction conducting layer and insulating and protecting the induction conducting layer. The groove is formed in the substrate, and the buffer substrate and the induction conducting layer are arranged in the groove, so that the strength of the cover body can be effectively improved while the space is saved.

Description

Technical Field

[0001] This application relates to the field of electronic device technology, and more particularly to a cover, an electronic device, and a method for manufacturing a cover. Background Technology

[0002] With the increasing prevalence of mobile electronic devices such as smartphones and tablets, and the addition of various sensors with sensing capabilities, these devices are becoming increasingly functional. Consequently, the issue of space allocation within these devices is becoming more and more critical. Maintaining a slim and lightweight design while meeting the diverse functionalities of electronic devices is currently a major research direction. As an accessory for electronic devices, the back cover protects the internal components while also affecting the device's appearance and user experience.

[0003] Currently, the back cover of electronic devices is usually manufactured by unibody molding. If the space on the back cover is expanded to make functional modules and then pressed together, molding problems will inevitably occur. Furthermore, due to the expansion of the back cover space, the thickness of the back cover will decrease, which may lead to a decrease in strength and make it prone to problems such as puncture and breakage. Therefore, how to expand the back cover space while ensuring the strength of the back cover is an urgent problem to be solved. Summary of the Invention

[0004] To address the aforementioned technical problems, embodiments of this application provide a cover, an electronic device, and a method for manufacturing the cover.

[0005] In a first aspect, embodiments of this application provide a cover, the cover including a substrate having a first region, and corresponding to the first region including a buffer insulating layer and an inductively conductive layer disposed in a groove structure of the substrate, the inductively conductive layer being used to generate an induced current or an induced electrical signal through electromagnetic induction, the buffer insulating layer being disposed between the inductively conductive layer and the inner surface of the corresponding groove of the substrate, for buffering the impact received by the substrate and the inductively conductive layer and insulating and protecting the inductively conductive layer.

[0006] By setting a groove on the cover and setting an inductive conductive layer in the groove, the internal space of the electronic device can be effectively saved, thereby reducing the thickness of the electronic device. Furthermore, a buffer insulating layer is set in the groove to buffer the impact on the substrate, which can improve the overall strength of the cover.

[0007] Optionally, the substrate further includes a second region, which is spaced at a preset distance from the first region. The second region has at least one opening, the position of which is used to install a decorative cover.

[0008] The opening can be used to set the decorative cover for the camera. By ensuring that the setting area of ​​the groove does not overlap with the setting area of ​​the decorative cover, the opening position and the slot position are not too close, which would affect the overall strength of the cover.

[0009] Optionally, the substrate includes a first surface and a second surface disposed opposite to each other, a decorative cover is disposed on the second surface, and the groove is recessed from the first surface to the second surface, or the groove is recessed from the second surface to the first surface.

[0010] When the groove is recessed from the first surface to the second surface, that is, when the groove is set on the first surface, the buffer insulating layer and the conductive layer are sequentially set on the groove facing the middle frame. The groove completely covers the buffer insulating layer and the conductive layer. When the substrate is impacted by an external force, the external force will be transmitted to the buffer insulating layer first to prevent the external force from being further transmitted to the conductive layer, thus effectively protecting the conductive layer.

[0011] When the second surface of the groove is recessed into the first surface, that is, the groove is set on the second surface, the buffer insulating layer is set on the outer surface of the cover. When it is impacted by an external force, the buffer insulating layer will directly absorb the external force and prevent the external force from being further transmitted to the inductive conductive layer and the substrate. This can effectively eliminate the problem of the cover breaking when it is impacted by an external force.

[0012] Optionally, the groove includes a first sub-groove and a second sub-groove, the substrate includes a first surface and a second surface disposed opposite to each other, the first sub-groove is recessed from the first surface to the second surface, the second sub-groove is recessed from the second surface to the first surface, the first sub-groove and the second sub-groove are disposed opposite each other in the thickness direction, the conductive layer is disposed in the first sub-groove, and the buffer insulating layer is disposed in the second sub-groove.

[0013] By setting a first sub-groove and a second sub-groove on the first and second surfaces of the substrate respectively, and setting the conductive layer and the buffer insulating layer in the first and second sub-groove respectively, when subjected to an external impact, the external force is transmitted sequentially from the buffer insulating layer to the substrate and then to the conductive layer. The buffer insulating layer directly absorbs most of the external force, which greatly reduces the external force transmitted to the substrate, thereby effectively ensuring the strength of the cover. Furthermore, since the substrate absorbs the external force again, it can further prevent the external force from being transmitted to the conductive layer, thereby effectively protecting the conductive layer.

[0014] Optionally, the cover further includes an encapsulation assembly, which is filled between the buffer insulating layer, the conductive layer and the sidewall of the groove, for fixing the buffer insulating layer and the conductive layer in the groove.

[0015] By encapsulating the buffer insulation layer and the conductive layer with the groove, the waterproof performance is improved while preventing the conductive layer and the buffer insulation layer from moving within the groove, which would reduce the buffering effect.

[0016] Optionally, the buffer insulation layer includes a buffer element, a first adhesive layer, and a second adhesive layer. The first adhesive layer and the second adhesive layer are disposed opposite each other at a predetermined distance along the thickness direction. The buffer element is disposed between the first adhesive layer and the second adhesive layer. The buffer element is a non-Newtonian fluid.

[0017] Optionally, the conductive layer can be a wireless charging receiving coil for coupling with an external wireless charging transmitting coil, or a wireless charging transmitting coil for coupling with an external wireless charging receiving coil, or an antenna for transmitting wireless signals. When the conductive layer is a wireless charging / discharging coil, because it is located on the cover and the cover thickness is reduced, the signal strength of the wireless induction coil is higher. The conductive layer can also be an antenna, such as an NFC antenna, instead of placing the NFC antenna on the decorative cover. Since the decorative cover is usually metal, this avoids the shielding effect of the decorative cover on the antenna signal, thus improving the antenna signal strength.

[0018] Optionally, the conductive layer includes a first trace layer, a second trace layer, and an insulating dielectric layer. The first trace layer and the second trace layer are arranged parallel to each other with a predetermined distance between them along the thickness direction, and the insulating dielectric layer is disposed between the first trace layer and the second trace layer.

[0019] Secondly, embodiments of this application provide an electronic device, including a mid-frame, a display module, and the aforementioned cover. The display module is used to perform image display. The cover, the mid-frame, and the display module are stacked sequentially. The cover and the mid-frame cooperate to fix and accommodate the display module.

[0020] Thirdly, embodiments of this application provide a method for manufacturing a cover, including providing a substrate, forming a groove in a first region of the substrate, and sequentially stacking the buffer insulating layer and the conductive layer in the groove.

[0021] Optionally, the "forming a groove in the first region of the substrate" includes: performing a first pressing of the substrate to form the outer surface of the cover, and spraying an ink layer in the first region; removing the ink layer outside the first region by exposure, and performing a second pressing of the ink layer to form the inner surface of the cover; removing the inner surface structure covering the first region by laser, and removing the ink layer to obtain the groove.

[0022] Optionally, "forming a groove in the first region of the substrate" includes: providing a substrate, pre-embedding a support pad in the first region of the substrate, forming the inner surface of a cover by pressing, and then peeling off the support pad to form a groove.

[0023] Compared to the problems of existing technologies, the embodiments of this application, by setting a groove in the first region of the cover and setting a buffer insulating layer and an inductive conductive layer in the groove, can effectively increase the strength of the cover while saving space in electronic devices.

[0024] It should be understood that the beneficial effects achieved by the second to third aspects of the technical solutions of the embodiments of this application can be referred to the above-described technical effects of the first aspect and its corresponding possible implementations, and will not be repeated here. Attached Figure Description

[0025] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0026] Figure 1 A schematic diagram of the disassembled structure of an electronic device provided in an embodiment of this application;

[0027] Figure 2 for Figure 1 A cross-sectional structural diagram of an electronic device;

[0028] Figure 3 for Figure 2 Schematic diagram of the cross-sectional structure of the middle cover;

[0029] Figure 4 for Figure 2 A schematic diagram of the disassembled structure of the middle cover;

[0030] Figure 5 A schematic diagram of a cross-sectional structure of a cover provided in the second embodiment of this application;

[0031] Figure 6 A schematic diagram of a cross-sectional structure of a cover provided in the third embodiment of this application;

[0032] Figure 7 A flowchart illustrating a method for manufacturing a cover according to an embodiment of this application;

[0033] Figure 8 A schematic diagram illustrating the manufacturing process of a groove according to an embodiment of this application;

[0034] Figure 9This is a schematic diagram illustrating the manufacturing process of another groove provided in an embodiment of this application. Detailed Implementation

[0035] To facilitate a clear description of the technical solutions of this application, the terms "first" and "second" are used to distinguish identical or similar items with essentially the same function and effect. Those skilled in the art will understand that the terms "first" and "second" do not limit the quantity or execution order, and that the terms "first" and "second" do not necessarily imply that they are different.

[0036] References to "one embodiment" or "some embodiments" as described in this application specification mean that one or more embodiments of this application include a specific feature, structure, or characteristic described in connection with that embodiment. Therefore, the phrases "in one embodiment," "in some embodiments," "in other embodiments," "in still other embodiments," etc., appearing in different parts of this application specification do not necessarily refer to the same embodiment, but rather mean "one or more, but not all, embodiments," unless otherwise specifically emphasized. The terms "comprising," "including," "having," and variations thereof mean "including but not limited to," unless otherwise specifically emphasized.

[0037] This application provides an electronic device, including but not limited to mobile or fixed terminals with a cover and a frame, such as mobile phones, tablets, laptops, ultra-mobile personal computers (UMPCs), handheld computers, walkie-talkies, netbooks, POS machines, personal digital assistants (PDAs), dashcams, virtual reality devices, wireless USB flash drives, Bluetooth speakers / headphones, or in-vehicle pre-installed devices.

[0038] By way of example and not limitation, in this embodiment, the electronic device can also be a wearable device. Wearable devices, also known as wearable smart devices, are a general term for devices that utilize wearable technology to intelligently design and develop everyday wearables, such as glasses, gloves, watches, and shoes. Wearable devices are portable devices that are worn directly on the body or integrated into the user's clothing or accessories. Wearable devices are not merely hardware devices, but also achieve powerful functions through software support, data interaction, and cloud interaction. Broadly speaking, wearable smart devices include those that are feature-rich, large in size, and can achieve complete or partial functions without relying on a smartphone, such as smartwatches or smart glasses, as well as those that focus on a specific type of application function and require the use of other devices such as smartphones, such as various smart bracelets and smart jewelry for vital sign monitoring.

[0039] Furthermore, in this embodiment of the application, the electronic device can also be a terminal device in the Internet of Things (IoT) system. IoT is an important part of the future development of information technology. Its main technical feature is to connect objects to the network through communication technology, thereby realizing an intelligent network of human-machine interconnection and object-to-object interconnection.

[0040] The electronic devices in the embodiments of this application may also be referred to as: terminal equipment, user equipment (UE), mobile station (MS), mobile terminal (MT), access terminal, user unit, user station, mobile station, mobile station, remote station, remote terminal, mobile device, user terminal, terminal, wireless communication equipment, user agent, or user device, etc.

[0041] In this embodiment, the electronic device includes a hardware layer, an operating system layer running on top of the hardware layer, and an application layer running on the operating system layer. The hardware layer includes hardware such as a central processing unit (CPU), a memory management unit (MMU), and main memory. The operating system can be any one or more computer operating systems that implement business processing through processes, such as Linux, Unix, Android, iOS, or Windows. The application layer includes applications such as browsers, address books, word processing software, and instant messaging software.

[0042] Please see Figure 1 , Figure 1 This is a schematic diagram showing the disassembled structure of an electronic device 100 provided in an embodiment of this application.

[0043] like Figure 1 As shown, the electronic device 100 includes a display module 11, a cover 12, a mid-frame 13, a circuit board 14, and a battery 15. The mid-frame 13, circuit board 14, and battery 15 are disposed between the display module 11 and the cover 12. The circuit board 14 and battery 15 may be disposed on the mid-frame 13; for example, the circuit board 14 and battery 15 may be disposed on the side of the mid-frame 13 facing the cover 12. In other embodiments, the circuit board 14 and battery 15 may also be disposed on the side of the mid-frame 13 facing the display module 11.

[0044] Battery 15 can be connected to other devices via a charge / discharge management chip (not shown). The charge / discharge management chip can receive electrical energy from battery 15 and power the processor, internal memory, external memory, display module 11, camera, and communication module in electronic device 100. The charge / discharge management chip can also be used to monitor parameters such as battery capacity, battery cycle count, and battery health status (leakage current, impedance). The charge / discharge management chip can also receive externally input electrical energy to charge battery 15. In some embodiments, the charge / discharge management chip can be integrated into circuit board 14.

[0045] The display module 11 can be an organic light-emitting diode (OLED) display or a liquid crystal display (LCD). It should be understood that the display module 11 may include a display and a touch device, the display being used to output display content to the user, and the touch device being used to receive touch events input by the user on the display module 11.

[0046] The cover 12 can be a metal cover, a glass cover, a plastic cover, or a ceramic cover. In this embodiment, the material of the cover 12 is not limited.

[0047] The middle frame 13 may include a metal plate 131 and a frame. The frame surrounds the outer edge of the metal plate 131. Generally speaking, the frame can be a rectangle. For example, the frame may include a top frame 132 and a bottom frame 133 arranged opposite each other, and a left frame 134 and a right frame 135 located between the top frame 132 and the bottom frame 133 and arranged opposite each other. In this embodiment, the side of the middle frame 13 is the surface enclosed by the top frame 132, the bottom frame 133, the left frame 134, and the right frame 135. The metal plate 131 may be an aluminum plate, an aluminum alloy, or a magnesium alloy. Each frame may be a metal frame, a ceramic frame, or a glass frame. The metal middle frame 13 and the frame may be connected by welding, snap-fitting, or integral molding, or the metal middle frame 13 and the frame may be connected by injection molding of plastic parts.

[0048] Circuit board 14 is an important component of the terminal device and a necessary carrier for software implementation. Circuit board 14 includes: a substrate, functional devices mounted on the substrate, and other components mounted on the substrate. Functional devices include, but are not limited to: voltage conversion circuits for voltage conversion, power amplifier circuits (PA) for signal amplification, cameras for taking pictures and videos, timing controllers for controlling the display module 11, or devices for controlling other functions (such as charging functions, image processing functions, etc.). This application embodiment does not limit the specific functions of the functional devices. Other components include, but are not limited to, resistors, capacitors, inductors, memory cards, sensors, or shielding plates. Circuit board 14 may also include nuts, bolts, and other accessories for fixing. Components can be mounted on the substrate via solder joints.

[0049] It is understood that the circuit board 14 may have raised and / or recessed positions depending on the different components. The specific shape of the circuit board 14, the position of the components, the size, etc. are related to the design layout of the terminal device, and this application embodiment does not specifically limit them.

[0050] In some embodiments, such as Figure 1 As shown, the electronic device 100 may also include a camera and a flash (not shown). The camera may include a front-facing camera 161 and a rear-facing camera 162. The rear-facing camera 162 and the flash may be disposed on the side of the metal plate 131 facing the cover 12, and the cover 12 has mounting holes for mounting the flash and the rear-facing camera 162. The front-facing camera 161 may be disposed on the side of the metal plate 131 facing the display module 11. In some embodiments, the front-facing camera 161 disposed within the electronic device 100 may include one or more cameras, and the rear-facing camera 162 may also include one or more cameras.

[0051] Please refer to the following: Figure 2 , Figure 3 and Figure 4 , Figure 2 for Figure 1 A cross-sectional structural diagram of an electronic device. Figure 3 for Figure 2 A cross-sectional structural diagram of the middle cover 12. Figure 4 for Figure 2 A schematic diagram of the disassembled structure of the middle cover 12.

[0052] like Figure 2 , Figure 3 and Figure 4As shown, the cover 12, battery 15, middle frame 13 and display module 11 are stacked sequentially along the thickness direction. The cover 12 includes a substrate 120, which includes a first region 120A and a second region 120B arranged adjacent to each other. A groove 123 is provided in the first region 120A, and an opening 125 is provided in the second region 120B. The opening 125 can be used to set a decorative cover for the camera.

[0053] The substrate 120 includes a first surface 120C and a second surface 120D disposed opposite to each other. The first surface 120C faces the middle frame 13, and the second surface 120D faces away from the middle frame 13. A groove 123 is disposed on the first surface 120C, or the groove 123 is recessed from the first surface 120C to the second surface 120D. The decorative cover can be disposed on the second surface 120D, that is, the back of the cover.

[0054] The cover 12 also includes a buffer insulating layer 121 and an inductively conductive layer 122. The buffer insulating layer 121, the inductively conductive layer 122, and the groove 123 are all rectangular in cross-section along the thickness direction. The area of ​​the groove 123 is greater than or equal to the area of ​​the buffer insulating layer 121 and the inductively conductive layer 122. The buffer insulating layer 121 and the inductively conductive layer 122 are stacked sequentially in the groove 123.

[0055] By providing a groove 123 in the cover 12 and providing a buffer insulation layer 121 and an inductive conductive layer 122 in the groove, the space occupied by the buffer insulation layer 121 and the inductive conductive layer 122 in the electronic device 100 can be effectively reduced, and the overall thickness of the electronic device can be further reduced, thereby achieving a thinner and lighter design.

[0056] The buffer insulating layer 121 is disposed in close contact with the substrate 120, and the inductive conductive layer 122 is disposed on the side of the buffer insulating layer 121 away from the substrate 120. The buffer insulating layer 121 is used to absorb external force when the cover 12 is impacted, so as to avoid the cover 12 from breaking and cracking, and at the same time to prevent the external force from being further transmitted to the inductive conductive layer 122, so as to avoid damage to the inductive conductive layer 122.

[0057] The buffer insulating layer 121 includes a buffer member 121a, a first adhesive layer 121b, and a second adhesive layer 121c. The first adhesive layer 121b and the second adhesive layer 121c are arranged parallel to each other at a predetermined distance along the thickness direction. The first adhesive layer 121b is disposed near the bottom of the groove 123, and the second adhesive layer 121c is disposed near the conductive layer 122. The buffer member 121a is sandwiched between the first adhesive layer 121b and the second adhesive layer 121c.

[0058] In this embodiment, the buffer 121a is a non-Newtonian fluid. Here, a non-Newtonian fluid refers to a fluid that does not satisfy Newton's law of viscosity, meaning that the relationship between its shear stress and shear strain rate is not linear. When the surface of a non-Newtonian fluid is subjected to pressure (shear stress), the fluid itself begins to harden, exhibiting certain solid properties, rather than undergoing corresponding shear stress deformation. When the shear stress disappears, the non-Newtonian fluid returns to a viscous flow state, exhibiting liquid properties. Because non-Newtonian fluids have the ability to absorb external forces, when an electronic device is dropped or the display screen is impacted, the non-Newtonian fluid will absorb at least part of the external force, thereby protecting the cover from damage.

[0059] Therefore, when the cover 12 of the electronic device 100 is impacted, the external force on the cover 12 will be transmitted to the buffer insulation layer 121 step by step. At this time, the viscosity of the buffer insulation layer 121 itself will increase rapidly due to the action of the external force, and may even exhibit solid characteristics. That is, when the external force is applied to the buffer insulation layer 121, the buffer insulation layer 121 will no longer deform. In addition, the external force will be converted into energy of increased viscosity of the buffer insulation layer 121, thereby offsetting at least part of the instantaneous external force when the electronic device 100 is dropped or impacted. In this way, the cover 12 is less likely to break or crack, thereby improving the reliability of the cover 12.

[0060] The cover 12 can be a component made of materials such as glass or ceramic. Glass and ceramic covers are more prone to breakage and cracking during use. Therefore, by absorbing at least part of the external force on the glass and ceramic covers through the buffer insulation layer 121, the glass and ceramic covers can be better protected and made less prone to breakage and cracking. In addition, using glass and ceramic covers can improve the appearance of electronic devices.

[0061] The conductive inductive layer 122 can be an inductive coil, such as a wireless charging receiving coil or a wireless charging transmitting coil. When acting as a wireless charging receiving coil, after the electronic device 100 successfully connects with an external wireless charging device, the wireless charging device can charge the electronic device 100 through the inductive component. When acting as a wireless charging transmitting coil, after the wireless charging transmitting coil successfully connects with the wireless charging receiving coil of an external device to be charged, the inductive component can supply power to the external device to be charged. The inductive coil can be a rigid board coil, a flexible printed circuit (FPC) coil, or a rigid-flex printed circuit (R-FPC) coil.

[0062] In another embodiment, the sensing component can also be an antenna, such as a near field communication (NFC) coil, for wireless communication with the sensing coil of an external device. In related technologies, the NFC coil is typically located in the rear camera 162 ( Figure 1 The position of the rear camera 162 is usually covered by a metal decorative cover, which has a certain shielding effect on the signal of the NFC coil, resulting in a weak signal emitted by the NFC coil and a short effective sensing distance. However, in this embodiment, by placing the NFC coil in the groove 123, the shielding effect of the metal decorative cover on the NFC coil can be effectively avoided, thereby improving the effective sensing distance of the NFC coil.

[0063] Specifically, the conductive layer 122 includes a first wiring layer 122a, a second wiring layer 122b, and an insulating dielectric layer 122c. The first wiring layer 122a and the second wiring layer 122b are arranged parallel to each other at a predetermined distance along the thickness direction. The first wiring layer 122a is disposed adjacent to the buffer insulating layer 121, and the second wiring layer 122b is disposed adjacent to the opening of the groove 123. The insulating dielectric layer 122c is sandwiched between the first wiring layer 122a and the second wiring layer 122b. The conductive layer 122 also includes a connector 122d, through which the first wiring layer 122a and the second wiring layer 122b are connected to an external driving circuit, such as an external FPC board. It is understood that the first wiring layer 122a and the second wiring layer 122b can also be wrapped with an insulating protective layer to further achieve an insulating effect.

[0064] The cover 12 also includes an encapsulation component 124, which is filled between the buffer insulating layer 121, the conductive layer 122 and the sidewall of the groove 123, or in other words, filled in the gap between the buffer insulating layer 121, the conductive layer 122 and the groove 123, so as to fix the buffer insulating layer 121 and the conductive layer 122 in the groove 123.

[0065] In this embodiment, the encapsulation component 124 is mainly a colloid that fills the gaps between the buffer insulating layer 121, the conductive layer 122, and the groove 123. For example, the encapsulation component 124 can be a pore-sealing resin. After the pore-sealing resin fills the gaps between the buffer insulating layer 121, the conductive layer 122, and the inner wall of the groove 123, the buffer insulating layer 121, the conductive layer 122, and the substrate 120 form an integrated structure, further improving the hardness of the cover 12. Of course, the colloid can also be filled by dispensing, injection molding, or spraying.

[0066] In this embodiment, the electronic device 100 may further include a magnetic field adjustment component 17, which is disposed between the wireless charging receiving coil and the battery 15. When the wireless charging receiving coil is charging the external wireless charging device, the magnetic field adjustment component 17 is used to control the magnetic field between the wireless charging receiving coil and the external wireless charging device within a preset range, so as to avoid the magnetic field range being too large and causing heat generation by passing through other metal parts.

[0067] By setting a groove 123 on the side of the cover 12 facing the screen and placing the sensing component in the groove 123, that is, by integrating the sensing component into the receiving groove of the cover 12 through post-assembly, an embedded functional cover is achieved. This can effectively reduce the space occupied by the sensing component, thereby reducing the overall thickness of the electronic device 100 and achieving product thinning. Furthermore, by setting a buffer insulating layer 121 between the sensing component and the substrate 120, the external force on the cover 12 can be effectively absorbed, avoiding the problem of reduced strength caused by the thinning of the cover 12 due to the setting of the groove 123. This reduces the risk of cracking or puncture of the cover 12 due to external force and solves the molding problem that occurs in one-piece molding.

[0068] Please see Figure 5 , Figure 5 This is a schematic diagram of a cover structure according to the second embodiment of this application.

[0069] like Figure 5 As shown, the cover 12 includes a substrate 120, a buffer insulating layer 121, an inductively conductive layer 122, and a groove 123. The groove 123 is disposed on the side of the substrate 120 facing away from the middle frame 13, that is, the groove 123 is disposed on the second surface 120D of the substrate 120. The groove 123 is recessed from the second surface 120D to the first surface 120C. The buffer insulating layer 121, the inductively conductive layer 122, and the groove 123 all have a rectangular cross-section along the thickness direction. The area of ​​the groove 123 is greater than or equal to the area of ​​the buffer insulating layer 121 and the inductively conductive layer 122. The inductively conductive layer 122 and the buffer insulating layer 121 are stacked sequentially in the groove 123. The inductively conductive layer 122 is disposed at the bottom of the groove 123, and the buffer insulating layer 121 is disposed near the opening of the groove 123. The cover 12 also includes an encapsulation component 124, which fills the gap between the buffer insulating layer 121, the conductive layer 122 and the inner wall of the groove 123 to fix the buffer insulating layer 121 and the conductive layer 122 in the groove 123.

[0070] The buffer insulating layer 121 includes a buffer member 121a, a first adhesive layer 121b, and a second adhesive layer 121c. The first adhesive layer 121b and the second adhesive layer 121c are arranged parallel to each other at a predetermined distance along the thickness direction. The first adhesive layer 121b is disposed adjacent to the conductive layer 122, and the second adhesive layer 121c is disposed adjacent to the opening area of ​​the groove 123. The buffer member 121a is sandwiched between the first adhesive layer 121b and the second adhesive layer 121c. A sealing member 121d may also be disposed on the side of the second adhesive layer 121c away from the buffer member 121a. The sealing member 121d is used to seal the buffer insulating layer 121 and the conductive layer 122 in the groove 123.

[0071] The conductive layer 122 includes a first wiring layer 122a, a second wiring layer 122b, and an insulating dielectric layer 122c. The first wiring layer 122a and the second wiring layer 122b are arranged parallel to each other at a predetermined distance along the thickness direction. The first wiring layer 122a is disposed adjacent to the buffer insulating layer 121, and the second wiring layer 122b is disposed adjacent to the bottom of the groove 123. The insulating dielectric layer 122c is sandwiched between the first wiring layer 122a and the second wiring layer 122b. It is understood that an insulating protective layer can also be provided to wrap the first wiring layer 122a and the second wiring layer 122b to further achieve an insulating effect.

[0072] By setting the groove 123 on the side of the substrate 120 facing away from the middle frame 13, and setting the buffer insulating layer 121 and the inductive conductive layer 122 in the groove 123, the thickness of the device can be effectively reduced. At the same time, since the buffer layer, i.e. the buffer insulating layer 121, is directly set on the back of the substrate 120, the buffer layer can directly absorb the external force when the cover 12 is subjected to external impact, preventing the external force from being further transmitted inward, effectively improving the protection effect on the cover 12 and the inductive conductive layer 122.

[0073] The difference between this embodiment and the first embodiment lies in the arrangement of the groove 123. The rest of the structure is the same as the first embodiment, and will not be described again in this application.

[0074] Please see Figure 6 , Figure 6 This is a schematic diagram of a cover structure according to the third embodiment of this application.

[0075] like Figure 6As shown, the cover 12 includes a substrate 120, a buffer insulating layer 121, an inductive conductive layer 122, and a groove 123. The groove 123 includes a first sub-groove 123a and a second sub-groove 123b. The first sub-groove 123a and the second sub-groove 123b are respectively disposed on opposite sides of the substrate 120, or in other words, the first sub-groove 123a and the second sub-groove 123b are disposed back to back. The first sub-groove 123a can be disposed on the first surface 120C of the substrate 120, that is, the first sub-groove 123a is recessed from the first surface 120C to the second surface 120D. The second sub-groove 123b can be disposed on the second surface 120D of the substrate 120, that is, the second sub-groove 123b is recessed from the second surface 120D to the first surface 120C.

[0076] The conductive layer 122 is disposed in the first sub-groove 123a, the buffer insulating layer 121 is disposed in the second sub-groove 123b, and the encapsulation component 124 fills the gap between the conductive layer 122 and the sidewall of the first sub-groove 123a, or in other words, fills the gap between the conductive layer 122 and the first sub-groove 123a. The encapsulation component 124 also fills the gap between the buffer insulating layer 121 and the sidewall of the second sub-groove 123b, or in other words, fills the gap between the buffer insulating layer 121 and the second sub-groove 123b, for fixing the conductive layer 122 in the first sub-groove 123a and fixing the buffer insulating layer 121 in the second sub-groove 123b.

[0077] By placing the buffer insulating layer 121 in the second sub-groove 123b on the side of the substrate 120 facing away from the middle frame 13, the buffer insulating layer 121 can effectively absorb external force when it is impacted, so as to avoid the cover 12 from breaking and cracking. At the same time, since the conductive layer 122 and the buffer insulating layer 121 are respectively placed in two grooves, it can effectively prevent the external force from being further transmitted to the conductive layer 122, thus avoiding damage to the conductive layer 122.

[0078] Specifically, the buffer insulation layer 121 includes a buffer member 121a, a first adhesive layer 121b, and a second adhesive layer 121c. The first adhesive layer 121b and the second adhesive layer 121c are arranged parallel to each other at a predetermined distance along the thickness direction. The first adhesive layer 121b is located adjacent to the bottom of the second sub-groove 123b and is bonded and fixed to the bottom of the second sub-groove 123b. The second adhesive layer 121c is located at the opening of the second sub-groove 123b, i.e., on the side away from the conductive layer 122. The buffer member 121a is sandwiched between the first adhesive layer 121b and the second adhesive layer 121c. A sealing member 121d can also be provided on the side of the second adhesive layer 121c away from the buffer member 121a. The sealing member 121d is bonded and fixed by the second adhesive layer 121c, used to seal the buffer insulation layer 121 within the second sub-groove 123b.

[0079] In this embodiment, the buffer 121a is a non-Newtonian fluid. Here, a non-Newtonian fluid refers to a fluid that does not satisfy Newton's law of viscosity, meaning that the relationship between its shear stress and shear strain rate is not linear. When the surface of a non-Newtonian fluid is subjected to pressure (shear stress), the fluid itself begins to harden, exhibiting certain solid properties, rather than undergoing corresponding shear stress deformation. When the shear stress disappears, the non-Newtonian fluid returns to a viscous flow state, exhibiting liquid properties. Because non-Newtonian fluids have the ability to absorb external forces, when an electronic device is dropped or the display screen is impacted, the non-Newtonian fluid will absorb at least part of the external force, thereby protecting the cover from damage.

[0080] Therefore, when the cover 12 of the electronic device 100 is impacted, the external force on the cover 12 will first be transmitted to the buffer 121a. At this time, the viscosity of the buffer 121a itself will increase rapidly due to the action of the external force, and may even exhibit solid characteristics. That is, when the external force is applied to the buffer 121a, the buffer 121a will no longer deform. In addition, the external force will be converted into energy from the increase in viscosity of the buffer 121a, thereby offsetting at least part of the instantaneous external force when the electronic device 100 is dropped or impacted. In this way, the cover 12 is less likely to break or crack, thereby improving the reliability of the cover 12.

[0081] The conductive inductive layer 122 can be an inductive coil, such as a wireless charging receiving coil or a wireless charging transmitting coil. When acting as a wireless charging receiving coil, after the electronic device 100 successfully hands over with an externally installed wireless charging device, the wireless charging device can charge the electronic device 100 through the inductive component. When acting as a wireless charging transmitting coil, after the wireless charging transmitting coil successfully hands over with the wireless charging receiving coil of an external device to be charged, the inductive component can supply power to the external device to be charged. The inductive coil can be a rigid board coil, a flexible printed circuit (FPC) coil, or a rigid-flex printed circuit (R-FPC) coil.

[0082] In another embodiment, the conductive layer 122 can also be an antenna, such as a near-field communication (NFC) coil, for wireless communication with the induction coil of an external device. In related technologies, the NFC coil is typically located in the rear camera 162 ( Figure 1The position of the rear camera 162 is usually covered by a metal decorative cover, which has a certain shielding effect on the signal of the NFC coil, resulting in a weak signal emitted by the NFC coil and a short effective sensing distance. However, in this embodiment, by placing the NFC coil in the groove 123, the shielding effect of the metal decorative cover on the NFC coil can be effectively avoided, thereby improving the effective sensing distance of the NFC coil.

[0083] Specifically, the conductive layer 122 includes a first wiring layer 122a, a second wiring layer 122b, and an insulating dielectric layer 122c. The first wiring layer 122a and the second wiring layer 122b are arranged parallel to each other at a predetermined distance along the thickness direction. The first wiring layer 122a is located near the bottom of the first sub-groove 123a, and the second wiring layer 122b is located near the opening of the first sub-groove 123a. The insulating dielectric layer 122c is sandwiched between the first wiring layer 122a and the second wiring layer 122b. It is understood that an insulating protective layer can also be provided to wrap the first wiring layer 122a and the second wiring layer 122b to further achieve an insulating effect.

[0084] In this embodiment, the encapsulation component 124 is mainly a colloid that fills the gaps between the buffer insulating layer 121, the conductive layer 122, and the groove 123. For example, the encapsulation component 124 can be a pore-sealing resin. After the pore-sealing resin fills the gaps between the buffer insulating layer 121, the conductive layer 122, and the inner wall of the groove 123, the buffer insulating layer 121, the conductive layer 122, and the substrate 120 form an integrated structure, further improving the hardness of the cover 12. Of course, the colloid can also be filled by dispensing, injection molding, or spraying.

[0085] By providing a first sub-groove 123a and a second sub-groove 123b on the first surface 120C and the second surface 120D of the substrate, and by providing an inductive conductive layer 122 and a buffer insulating layer 121 on the first sub-groove 123a and the second sub-groove 123b, when subjected to an external impact, the external force is transmitted sequentially from the buffer insulating layer 121 to the substrate and then to the inductive conductive layer 122. The buffer insulating layer 121 directly absorbs most of the external force, which significantly reduces the external force transmitted to the substrate, thereby effectively ensuring the strength of the cover 12. Furthermore, since the substrate 120 absorbs the external force again, it can further prevent the external force from being transmitted to the inductive conductive layer 122, thereby effectively protecting the inductive conductive layer 122.

[0086] The difference between this embodiment and the first embodiment lies in the arrangement of the groove 123. The rest of the structure is the same as the first embodiment, and will not be described again here.

[0087] Please see Figure 7 , Figure 7 This is a flowchart illustrating a method for manufacturing a cover according to an embodiment of this application.

[0088] like Figure 7 As shown, the specific production method includes:

[0089] Step S101: A substrate is provided, and a groove is formed in a first region of the substrate.

[0090] like Figure 8 As shown, Figure 8 This is a schematic diagram illustrating the manufacturing process of a groove 123 provided in an embodiment of this application. A substrate 120 is provided, and the outer surface of the cover and a decorative cover are formed by a first pressing. The substrate 120 faces the middle frame 13 (…). Figure 2 One side is sprayed or printed with an ink layer 126, and the ink in the first area 120A is removed by exposure. The ink layer 126 is then pressed a second time on the side facing the middle frame, i.e., the first surface 120C, to form an inner surface layer 127. The inner surface layer covering the ink layer 126 is then removed by laser, and finally the ink layer is removed to form a groove 123.

[0091] like Figure 9 As shown, Figure 9 This is a schematic diagram illustrating the manufacturing process of another groove 123 provided in an embodiment of this application.

[0092] A substrate 120 is provided, and a support pad 128 is pre-embedded on the side of the substrate 120 facing the middle frame 13. Then, an inner surface layer 127 is formed by pressing. Finally, the support pad 128 is peeled off to form a groove 123.

[0093] Step S102: A buffer insulating layer and an inductive conductive layer are sequentially stacked in the groove.

[0094] A buffer insulating layer 121 is bonded to the bottom of the groove, and an inductively conductive layer 122 is bonded to the side of the buffer insulating layer 121 away from the substrate 120. The buffer insulating layer 121 is disposed in close contact with the substrate 120, and the inductively conductive layer 122 is disposed on the side of the buffer insulating layer 121 away from the substrate 120. The buffer insulating layer 121 is used to absorb external force when the cover 12 is impacted, so as to avoid the cover 12 from breaking or cracking, and at the same time, to prevent the external force from being further transmitted to the inductively conductive layer 122, thus preventing damage to the inductively conductive layer 122.

[0095] The conductive inductive layer 122 can be an inductive coil, such as a wireless charging receiving coil or a wireless charging transmitting coil. When acting as a wireless charging receiving coil, after the electronic device 100 successfully hands over with an externally installed wireless charging device, the wireless charging device can charge the electronic device 100 through the inductive component. When acting as a wireless charging transmitting coil, after the wireless charging transmitting coil successfully hands over with the wireless charging receiving coil of an external device to be charged, the inductive component can supply power to the external device to be charged. The inductive coil can be a rigid board coil, a flexible printed circuit (FPC) coil, or a rigid-flex printed circuit (R-FPC) coil.

[0096] In another embodiment, the conductive layer 122 can also be an antenna, such as a near-field communication (NFC) coil, for wireless communication with the induction coil of an external device. In related technologies, the NFC coil is typically located in the rear camera 162 ( Figure 1 The position of the rear camera 162 is usually covered by a metal decorative cover, which has a certain shielding effect on the signal of the NFC coil, resulting in a weak signal emitted by the NFC coil and a short effective sensing distance. However, in this embodiment, by placing the NFC coil in the groove 123, the shielding effect of the metal decorative cover on the NFC coil can be effectively avoided, thereby improving the effective sensing distance of the NFC coil.

[0097] The above-disclosed embodiments are merely some of the embodiments of this application, and should not be construed as limiting the scope of this application. Those skilled in the art can understand that all or part of the processes for implementing the above embodiments, and equivalent changes made in accordance with the claims of this application, still fall within the scope of this application.

Claims

1. A cover body, characterized in that, The cover includes a substrate having a first region. Corresponding to the first region, it includes a buffer insulating layer and an inductive conductive layer disposed in a groove structure of the substrate. The inductive conductive layer is used to generate an induced current or an induced electrical signal through electromagnetic induction. The buffer insulating layer is disposed between the inductive conductive layer and the inner surface of the corresponding groove of the substrate, and is used to buffer the impact on the substrate and the inductive conductive layer and to insulate and protect the inductive conductive layer.

2. The cover as described in claim 1, characterized in that, The substrate further includes a second region, which is spaced at a preset distance from the first region. The second region has at least one opening, the position of which is used to install a decorative cover.

3. The cover as described in claim 2, characterized in that, The substrate includes a first surface and a second surface disposed opposite to each other, the decorative cover is disposed on the second surface, and the groove is recessed from the first surface to the second surface, or the groove is recessed from the second surface to the first surface.

4. The cover as described in claim 2, characterized in that, The groove includes a first sub-groove and a second sub-groove. The substrate includes a first surface and a second surface disposed opposite to each other. The first sub-groove is recessed from the first surface to the second surface, and the second sub-groove is recessed from the second surface to the first surface. The first sub-groove and the second sub-groove are disposed opposite each other in the thickness direction. The conductive layer is disposed in the first sub-groove, and the buffer insulating layer is disposed in the second sub-groove.

5. The cover as described in claim 1, characterized in that, The cover also includes an encapsulation component, which is filled between the buffer insulating layer, the conductive layer and the sidewall of the groove, for fixing the buffer insulating layer and the conductive layer in the groove.

6. The cover as described in claim 5, characterized in that, The buffer insulation layer includes a buffer element, a first adhesive layer, and a second adhesive layer. The first adhesive layer and the second adhesive layer are disposed opposite each other at a predetermined distance along the thickness direction. The buffer element is disposed between the first adhesive layer and the second adhesive layer. The buffer element is a non-Newtonian fluid.

7. The cover as described in claim 1, characterized in that, The inductive conductive layer is a wireless charging receiving coil used for coupling with an external wireless charging transmitting coil, or the inductive conductive layer is a wireless charging transmitting coil used for coupling with an external wireless charging receiving coil, or the inductive conductive layer is an antenna used for transmitting wireless signals.

8. The cover as described in claim 7, characterized in that, The conductive layer includes a first trace layer, a second trace layer, and an insulating dielectric layer. The first trace layer and the second trace layer are arranged parallel to each other with a predetermined distance between them along the thickness direction. The insulating dielectric layer is disposed between the first trace layer and the second trace layer.

9. An electronic device, characterized in that, The device includes a mid-frame, a display module, and a cover as described in any one of claims 1-8, wherein the display module is used to perform image display, and the cover, the mid-frame, and the display module are stacked sequentially, and the cover cooperates with the mid-frame to fix and accommodate the display module.

10. A method for manufacturing a cover as described in any one of claims 1-8, characterized in that, include: A substrate is provided, and a groove is formed in a first region of the substrate; The buffer insulating layer and the inductive conductive layer are sequentially stacked within the groove.

11. The method for manufacturing the cover as described in claim 10, characterized in that, The phrase "forming a groove in the first region of the substrate" includes: The substrate is first pressed to form the outer surface of the cover, and an ink layer is sprayed onto the first region; The ink layer outside the first area is removed by exposure, and the ink layer is then pressed a second time to form the inner surface of the cover. The groove is obtained by removing the inner surface structure covering the first area using a laser and removing the ink layer.

12. The method for manufacturing the cover as described in claim 10, characterized in that, The "opening a groove in the first region of the substrate" includes: providing a substrate, pre-embedding a support pad in the first region of the substrate, forming the inner surface of the cover by pressing, and then peeling off the support pad to form a groove.

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