Heat dissipation assembly

Abstract

The invention discloses a heat dissipation assembly which is used for being in thermal contact with a heat source and comprises a first cavity, at least three communicating cavities, at least two first heat dissipation fin sets and a second cavity. The first cavity is provided with a thermal contact surface and a first chamber, and the thermal contact surface is used for being in thermal contact with a heat source. Each of the at least three communicating cavities is provided with at least one communicating flow channel communicating with the first cavity. The at least two first radiating fin groups are respectively arranged between the communicating cavities. The second cavity is provided with a second chamber. The second cavity is communicated with the first cavity at least through at least one communication flow channel of one communication cavity.

Description

Technical Field

[0001] This invention relates to a heat dissipation assembly, and more particularly to a heat dissipation assembly comprising a heat dissipation fin assembly. Background Technology

[0002] In recent years, heat dissipation assemblies consisting of vapor chambers, heat sinks, and heat pipes have been widely used in various electronic devices for cooling heat sources. In such assemblies, the heat pipes stand on one side of the vapor chamber and penetrate the heat sink fins. Furthermore, capillary structures are incorporated into both the vapor chamber and the heat pipes to facilitate the circulation of the working fluid.

[0003] However, capillary structures occupy space within the vapor chamber and heat pipes, creating flow resistance to the working fluid flowing within them, thus limiting their heat dissipation capacity. Furthermore, the inner side of the heat pipes has a certain volume to accommodate the capillary structures, which prevents cool air from effectively reaching certain areas of the heatsink fins due to obstruction by the heat pipes. In summary, traditional heat dissipation components suffer from poor heat dissipation efficiency. Summary of the Invention

[0004] The present invention provides a heat dissipation component that improves both heat dissipation capacity and heat dissipation efficiency.

[0005] An embodiment of the present invention discloses a heat dissipation assembly for thermal contact with a heat source and includes a first cavity, at least three interconnected cavities, at least two first heat dissipation fin assemblies, and a second cavity. The first cavity has a thermal contact surface and a first chamber, the thermal contact surface being used for thermal contact with the heat source. Each of the at least three interconnected cavities has at least one connecting channel communicating with the first chamber. At least two first heat dissipation fin assemblies are respectively disposed between the interconnected cavities. The second cavity has a second chamber. The second chamber is connected to the first chamber through at least one connecting channel of one of the interconnected cavities. The normal direction of the thermal contact surface is generally parallel to the extension direction of the at least one connecting channel of each of the at least three interconnected cavities. The at least one connecting channel of each of the at least three interconnected cavities is entirely located between the first chamber and the second chamber. The arrangement direction of the at least three interconnected cavities is generally perpendicular to the normal direction of the thermal contact surface.

[0006] According to the heat dissipation assembly disclosed in the above embodiments, since the first heat dissipation fins are respectively disposed between the connecting cavities, and the connecting channel is connected to the first chamber, the working fluid can circulate between the first chamber and the connecting channel through the thermosiphon principle, thus eliminating the need for capillary structures in the first chamber and the connecting channel. In this way, more working fluid can be accommodated in the heat dissipation assembly, significantly improving the maximum heat transfer capacity and heat dissipation capacity per unit volume of the heat dissipation assembly. Furthermore, the connecting cavities without capillary structures have a smaller volume, allowing the cooling airflow to be evenly distributed to the first heat dissipation fins. Therefore, the heat dissipation assembly can cool the heat source more effectively.

[0007] Furthermore, since the capillary structure is omitted in the connecting cavity, there is more flexibility in the choice of materials for the connecting cavity, and lower density materials can be used to further reduce the weight of the heat dissipation components.

[0008] Furthermore, since the second chamber is connected to the first chamber through at least one of the connecting channels of the connecting chamber, the second chamber can achieve a pressure equalization effect, thus distributing the working fluid more evenly into the connecting channel. In this way, the working fluid can circulate more effectively between the first chamber, the connecting channel, and the second chamber, thereby enabling the heat dissipation component to cool the heat source more effectively. Attached Figure Description

[0009] Figure 1 This is a perspective view of the heat dissipation assembly according to the first embodiment of the present invention;

[0010] Figure 2 for Figure 1 A partially enlarged exploded view of the heat dissipation components;

[0011] Figure 3 for Figure 1 A partial enlarged view of another exploded view of the heat dissipation components;

[0012] Figure 4 , Figure 5 For heat source and Figure 1 A cross-sectional view of the heat dissipation components;

[0013] Figure 6 for Figure 1 A partial enlarged view of another exploded view of the heat dissipation components;

[0014] Figure 7 for Figure 1 A partial enlarged view of another exploded view of the heat dissipation components;

[0015] Figure 8 This is a perspective view of the heat dissipation assembly according to the second embodiment of the present invention;

[0016] Figure 9 for Figure 8A partially enlarged exploded view of the heat dissipation components;

[0017] Figure 10 This is a perspective view of the heat dissipation assembly according to the third embodiment of the present invention;

[0018] Figure 11 for Figure 10 A partially enlarged exploded view of the heat dissipation components;

[0019] Figure 12 for Figure 10 A partial enlarged view of another exploded view of the heat dissipation components;

[0020] Figure 13 A side view of the heat source and the heat dissipation assembly according to the fourth embodiment of the present invention;

[0021] Figure 14 for Figure 13 A bottom view of the heat source and heat dissipation components in the middle;

[0022] Figure 15 A cross-sectional schematic diagram of a heat source and a heat dissipation assembly according to a fifth embodiment of the present invention;

[0023] Figure 16 for Figure 15 A bottom view of the heat source and heat dissipation components.

[0024] Symbol Explanation

[0025] 10, 10a, 10b, 10c, 10d: Heat dissipation components

[0026] 100, 100a, 100d: First cavity

[0027] 110, 110d: Base

[0028] 111: Ontology Department

[0029] 112, 112c: Bossed section

[0030] 113: Top surface

[0031] 114: Bottom surface

[0032] 115: Opening

[0033] 116: Bottom connecting groove

[0034] 120: Bottom connecting plate

[0035] 121: Bottom connecting hole

[0036] 122: Bottom surface

[0037] 123: Bottom mounting slot

[0038] 124: Bottom surface of the groove

[0039] 125: Top surface

[0040] 130: Bottom cover plate

[0041] 131, 131d: Thermal contact surface

[0042] 140, 140a: Second heat dissipation fin assembly

[0043] 150, 150d: Bottom support structure

[0044] 151: Make room

[0045] 152: Return Channel

[0046] 153d: Support column

[0047] 200: Connecting cavity

[0048] 210: Connecting Flow Channel

[0049] 300: First heat sink fin assembly

[0050] 310: Fin section

[0051] 400: Windshield

[0052] 500, 500b, 500d: Second cavity

[0053] 510, 510b: Top connecting plate

[0054] 511, 511b: Top surface

[0055] 5110: Installation groove

[0056] 512: Bottom

[0057] 513: Top mounting slot

[0058] 514, 514b: Top connecting hole

[0059] 515: Top connecting groove

[0060] 516, 517: Bottom surface of the trough

[0061] 520: Top cover plate

[0062] 530, 530d: Top support structure

[0063] 531d: Support column

[0064] 20, 20c, 20d: Heat source

[0065] S1: First Chamber

[0066] S2, S2b: Second chamber

[0067] A: Arrangement direction

[0068] G: Direction of gravity

[0069] T: Thickness

[0070] C: Cooling airflow

[0071] N: Normal direction

[0072] E: Extension direction

[0073] B: Arrangement direction

[0074] L: Protrusion length Detailed Implementation

[0075] The following detailed description of the embodiments of the present invention outlines its features and advantages. This description is sufficient to enable anyone skilled in the art to understand the technical content of the embodiments of the present invention and to implement them accordingly. Furthermore, based on the disclosure, claims, and drawings in this specification, anyone skilled in the art can easily understand the related objectives and advantages of the present invention. The following embodiments further illustrate the points of the present invention in detail, but are not intended to limit the scope of the invention in any way.

[0076] Please see Figure 1 , Figure 1 This is a perspective view of a heat dissipation assembly according to a first embodiment of the present invention. In this embodiment, the heat dissipation assembly 10 includes a first cavity 100, a plurality of communicating cavities 200, a plurality of first heat dissipation fin groups 300, two baffles 400, and a second cavity 500. The first cavity 100, the communicating cavities 200, and the second cavity 500 are used to allow a working fluid (not shown) to undergo liquid-vapor phase change circulation. The working fluid is, for example, a refrigerant, but is not limited thereto. The working fluid may also be water, fluorinated liquid, or methanol. The heat dissipation assembly 10 can be applied, for example, to charging piles or servers of various sizes (e.g., height), and can be used, for example, to cool next-generation high-performance chips, silicon photonic chips, various electronic modules in high-end servers, and insulated-gate bipolar transistor (IGBT) power modules, etc.

[0077] Please see Figures 2 to 5 . Figure 2 for Figure 1 A partially enlarged view of the exploded view of the heat dissipation components. Figure 3 for Figure 1 A partially enlarged view of another exploded view of the heat dissipation components. Figure 4 , Figure 5 For heat source and Figure 1 A cross-sectional view of the heat dissipation components.

[0078] In this embodiment, the first cavity 100 includes, for example, a base 110, a bottom connecting plate 120, a bottom cover plate 130, a second heat dissipation fin group 140 and a bottom support structure 150, and has a first chamber S1.

[0079] In this embodiment, the base 110 includes, for example, a body portion 111 and a boss portion 112. The body portion 111 has a top surface 113 and a bottom surface 114 facing away from each other. The boss portion 112 protrudes outward from the bottom surface 114 and has an opening 115. The opening 115 is located on the side of the boss portion 112 away from the body portion 111.

[0080] The first chamber S1 includes, for example, a bottom-connecting groove 116 and a plurality of bottom-connecting holes 121. The bottom-connecting groove 116 is recessed inward from the top surface 113 and connects to the opening 115.

[0081] In this embodiment, a bottom connecting plate 120 is disposed in a bottom connecting groove 116 and has a top surface 125, a bottom surface 122, and a plurality of bottom mounting grooves 123. The top surface 125 and the bottom surface 122 face away from each other. The bottom surface 122 faces the boss portion 112. A bottom connecting hole 121 is located in the bottom connecting plate 120. The bottom connecting hole 121 extends along an arrangement direction A (parallel to the Y-axis direction). The bottom mounting grooves 123 are located in the top surface 125. The bottom connecting hole 121 passes through the bottom surfaces 124 and 122 of the plurality of grooves of these bottom mounting grooves 123 respectively.

[0082] The bottom cover plate 130 is fixed to the opening 115, for example, by welding, and is located on the side of the boss portion 112 away from the body portion 111. Alternatively, the bottom cover plate 130 is provided on the bottom surface 114 via the boss portion 112. Furthermore, the bottom cover plate 130 has a thermal contact surface 131. The thermal contact surface 131 is used for thermal contact with a heat source 20. The heat source 20 is, for example, a high-power electronic component such as a central processing unit (CPU) or a graphics processing unit (GPU). The bottom cover plate 130 is located above the heat source 20, for example, along a gravitational direction G.

[0083] The second heat dissipation fin assembly 140 is disposed on the bottom cover plate 130 and located in the bottom communicating groove 116. In this embodiment, the second heat dissipation fin assembly 140 is, for example, a pin fin. The inner surface of the bottom cover plate 130 facing away from the thermal contact surface 131 or the second heat dissipation fin assembly 140 may be surface treated to improve the surface roughness of the inner surface or the second heat dissipation fin assembly 140 to promote the phase change of the working fluid.

[0084] The bottom support structure 150 is fixed to the body portion 111 of the base 110 by welding, for example, and is located in the bottom connecting groove 116. The bottom support structure 150 can prevent the base 110 from being deformed or damaged when the bottom connecting groove 116 is evacuated or when the working fluid inside the bottom connecting groove 116 is heated to form a positive pressure. In this embodiment, the bottom support structure 150 is, for example, a U-shaped fin formed by stacking multiple U-shaped fins. It should be noted that the bottom support structure 150 may also be a skived fin, a stacked fin, a columnar fin, an I-shaped fin, or an offset-strip fin (also called a discontinuous fin) other than a U-shaped fin. In addition, the bottom support structure 150 has, for example, a clearance space 151 and two return channels 152. The two return channels 152 are connected to the clearance space 151 and are located on opposite sides of the clearance space 151. The second return channel 152 extends along the arrangement direction A. The second heat dissipation fin group 140 is located between the clearance space 151 and the bottom cover plate 130.

[0085] In this embodiment, the number of these connecting cavities 200 is, for example, eight. Each of these connecting cavities 200 has multiple connecting channels 210. These connecting channels 210 of each of these connecting cavities 200 are arranged along the arrangement direction A and are separated from each other. Bottom connecting holes 121 connect the connecting channels 210 of the connecting cavities 200 to the bottom connecting grooves 116. One side of each of these connecting cavities 200 is fixed in these bottom mounting grooves 123. The thickness T of these connecting cavities 200 in the X-axis direction is, for example, 0.5 mm to 5 mm, preferably between 1 mm and 3 mm, more preferably 2 mm or 3 mm. In other embodiments, each of these connecting cavities may also have one connecting channel. Furthermore, these connecting channels 210 may be of any shape, such as irregular, triangular, circular, elliptical, etc., and the number of these connecting channels 210 may be, for example, 10, 12, or any number greater than or equal to 3.

[0086] These connecting cavities 200 are respectively located between these first heat dissipation fin groups 300. The first heat dissipation fin groups 300 are, for example, wavy, or may be referred to as folded fins or louvered fins. In other embodiments, the first heat dissipation fin groups 300 may also be stacked fins, such as snap-fit ​​fins, U-shaped fins, or I-shaped fins. Two baffles 400 are respectively disposed on the two outermost first heat dissipation fin groups 300. These connecting cavities 200 and these first heat dissipation fin groups 300 are located between the two baffles 400. These first heat dissipation fin groups 300 are fixed to these connecting cavities 200 and the two baffles 400, for example, by welding. An external fan (not shown) may, for example, guide a cooling airflow C through these first heat dissipation fin groups 300. In this embodiment, the baffle 400 is a plate without flow channels, used only for blocking wind (i.e., allowing the cooling airflow C to pass more directly through the first heat dissipation fin group 300) and supporting the first heat dissipation fin group 300, but the present invention is not limited thereto. In other embodiments, the baffle may have a similar structure to the communicating cavity. That is, in other embodiments, two communicating cavities may be used instead of two baffles.

[0087] In this embodiment, each of the first heat dissipation fin groups 300 includes, for example, a plurality of fin portions 310. These fin portions 310 in each first heat dissipation fin group 300 are separated from each other along the arrangement direction A. That is, the first heat dissipation fin group 300 in this embodiment adopts a segmented design to reduce the manufacturing cost of the first heat dissipation fin group 300. Similarly, in other embodiments, each communicating cavity can also be designed to include multiple parts separated from each other along the arrangement direction to save on the manufacturing cost of the communicating cavity. Furthermore, in other embodiments, if there is no need to reduce costs, these fin portions of each first heat dissipation fin group can also be integrally formed.

[0088] Please see Figure 4 , Figure 6 and Figure 7 . Figure 6 for Figure 1 A partially enlarged view of another exploded view of the heat dissipation components. Figure 7 for Figure 1 A partially enlarged view of another exploded view of the heat dissipation components.

[0089] In this embodiment, the second cavity 500 includes, for example, a top connecting plate 510, a top cover plate 520 and a top support structure 530, and has a second chamber S2.

[0090] The top connecting plate 510 has a top surface 511, a bottom surface 512, and a plurality of top mounting grooves 513. The top surface 511 faces away from the bottom surface 512. The top mounting grooves 513 are located on the bottom surface 512.

[0091] The second chamber S2, for example, includes a plurality of top connecting holes 514 and a top connecting groove 515. The top connecting holes 514 are located on the top connecting plate 510 and extend along the arrangement direction A. The top connecting groove 515 is recessed inward from the top surface 511 and communicates with these top connecting holes 514. The top connecting holes 514 respectively penetrate the bottom surface 516 of the top mounting grooves 513 and the bottom surface 517 of the top connecting groove 515.

[0092] These top connecting holes 514 are respectively connected to these connecting channels 210 of these connecting cavities 200. For example... Figure 4 As shown, the second chamber S2 is connected to the first chamber S1 through these connecting channels 210. Specifically, the top connecting groove 515 of the second chamber S2 is connected to the bottom connecting groove 116 of the first chamber S1 through the top connecting hole 514, the connecting channel 210, and the bottom connecting hole 121. The other side of these connecting cavities 200 is fixed in these top mounting slots 513 respectively. Figure 4 As shown, the opposite sides of these connecting cavities 200 are respectively fixed to these bottom mounting grooves 123 and these top mounting grooves 513 by welding. Through the design of the bottom mounting grooves 123 and top mounting grooves 513, it is possible to ensure that the connecting channel 210 connects to the bottom connecting groove 116 and the top connecting groove 515, while allowing the connecting cavity 200 to be welded to the bottom mounting groove 123 and the top mounting groove 513. Figure 2 and Figure 6 As shown, in this embodiment, the opposite sides of these connecting cavities 200 abut against, for example, the bottom surfaces 124 of the bottom mounting grooves 123 and the bottom surfaces 516 of the top mounting grooves 513, respectively, to facilitate the positioning of the connecting cavities 200. However, the present invention is not limited thereto. In other embodiments, the bottom mounting groove may also penetrate through the bottom and top surfaces of the bottom connecting plate, so that one side of the connecting cavity is entirely fixed to the bottom mounting groove. In such embodiments, the bottom mounting groove of the bottom connecting plate does not need to have a bottom surface, and an external fixture is used to position the connecting cavity, thus saving the cost of machining the bottom surface. It should be noted that the top mounting groove and the top connecting plate can also be modified similarly so that the top mounting groove of the top connecting plate does not need to have a bottom surface.

[0093] The top cover plate 520 is provided in a mounting groove 5110 on the top surface 511 and covers the top connecting groove 515.

[0094] The top support structure 530 is fixed to the top connecting plate 510 by welding, for example, and is located in the top connecting groove 515. The opposite sides of the top support structure 530 are fixed to the top connecting plate 510 and the top cover plate 520 by welding, for example. The top support structure 530 prevents structural deformation or damage to the top connecting plate 510 when a vacuum is applied to the top connecting groove 515 or when the working fluid inside the top connecting groove 515 is heated to create positive pressure. The top support structure 530 is, for example, a fin structure, such as staggered fins. It should be noted that the top support structure 530 can also be a skived fin, columnar fin, I-shaped fin, or U-shaped fin, other than staggered fins.

[0095] In addition, such as Figure 4 As shown, in this embodiment, the normal direction N (parallel to the Z-axis) of the thermal contact surface 131 is approximately parallel to the extension direction E (parallel to the Z-axis and the gravitational direction G) of the respective connecting channels 210 of the connecting cavities 200. The connecting channels 210 of each of the connecting cavities 200 are entirely located between the first chamber S1 and the second chamber S2. Furthermore, the arrangement direction B (parallel to the X-axis) of these connecting cavities 200 is approximately perpendicular to the normal direction N of the thermal contact surface 131. Therefore, the working fluid can circulate more smoothly between the first chamber S1, the connecting channels 210, and the second chamber S2, for example, by means of gravity. In this way, heat energy is transferred more efficiently from the first chamber 100 to the second chamber 500 through each first heat dissipation fin assembly 300, meaning the temperature gradient of the heat dissipation assembly 10 along the positive Z-axis (opposite to the gravitational direction G) is smaller. Furthermore, the arrangement direction B (parallel to the X-axis direction) of these first heat dissipation fin groups 300 is, for example, approximately perpendicular to the normal direction N of the thermal contact surface 131. It should be noted that approximately parallel directions can, for example, mean that the angle between these two directions is 0 degrees or 180 degrees, with an error range of less than or equal to ±20 degrees; approximately perpendicular directions can, for example, mean that the angle between these two directions is 90 degrees, with an error range of less than or equal to ±20 degrees.

[0096] Furthermore, in this embodiment, the thermal conductivity of the materials of the bottom cover plate 130 and the second heat dissipation fin group 140 is, for example, higher than that of the materials of the base 110, the bottom connecting plate 120, the bottom support structure 150, the connecting cavity 200, the first heat dissipation fin group 300, and the second cavity 500. The density of the materials of the base 110, the bottom connecting plate 120, the bottom support structure 150, the connecting cavity 200, the first heat dissipation fin group 300, and the second cavity 500 is, for example, lower than that of the materials of the bottom cover plate 130 and the second heat dissipation fin group 140. For example, the bottom cover plate 130 and the second heat dissipation fin group 140 may be made of copper, such as red copper, and the base 110, the bottom connecting plate 120, the bottom support structure 150, the connecting cavity 200, the first heat dissipation fin group 300, and the second cavity 500 may be made of aluminum. In other words, only the bottom cover plate 130 and the second heat dissipation fin group 140, which are in contact with the heat source 20, are made of materials with high thermal conductivity, while the rest of the structure is made of materials with lower density. In this way, the overall weight of the heat dissipation assembly 10 can be reduced as much as possible while ensuring the heat conduction efficiency of the heat dissipation assembly 10. In other embodiments, the first cavity, the connecting cavity, the first heat dissipation fin group, and the second cavity can all be made of aluminum; in other embodiments, the base, the bottom connecting plate, the bottom support structure, the connecting cavity, the first heat dissipation fin group, and the second cavity can also be made of copper, which still has the advantage of lower cost compared to water cooling systems or immersion systems while achieving the same heat dissipation capacity.

[0097] The following will be referred to Figure 3 and Figure 4 The operation of the heat dissipation assembly 10 is explained below. In this embodiment, the heat dissipation assembly 10 utilizes the thermosiphon principle to dissipate heat from the heat source 20. The first chamber S1, the connecting channel 210, and the second chamber S2 together constitute a closed space for the circulation of the working fluid. Specifically, the liquid working fluid absorbs heat generated by the heat source 20 in the bottom connecting groove 116 and evaporates into gas. The evaporated working fluid flows through the bottom connecting hole 121, the connecting channel 210, and the top connecting hole 514 to the top connecting groove 515, and then condenses back into liquid. The condensed liquid working fluid flows back to the bottom connecting groove 116 through the top connecting hole 514, the connecting channel 210, and the bottom connecting hole 121 along the direction of gravity G. It should be noted that the connecting channel 210 of each connecting cavity 200 can be used only for liquid working fluid, only for gaseous working fluid, or simultaneously for both liquid and gaseous working fluid.

[0098] Since the first heat dissipation fins 300 are respectively disposed between the connecting cavities 200, and the connecting channel 210 is connected to the first chamber S1, the working fluid can circulate between the first chamber S1 and the connecting channel 210 through the thermosiphon principle, thus eliminating the need for capillary structures in the first chamber S1 and the connecting channel 210. In this way, more working fluid can be accommodated in the heat dissipation assembly 10, the flow resistance of the working fluid in the heat dissipation assembly is reduced, and the problem of dry burning is less likely to occur. Furthermore, the connecting cavities 200, which omit the capillary structures, can have a smaller volume, allowing the cooling airflow C to be blown evenly onto the first heat dissipation fins 300. Therefore, the heat dissipation assembly 10 can cool the heat source 20 more effectively.

[0099] Specifically, the heat dissipation component 10 can, for example, control the operating temperature of a heat source 20 with a power of about 800 watts (W) to below 65 degrees Celsius. Such data shows that the heat dissipation component 10 should be able to effectively cool a heat source 20 with a power of 1200 W or more.

[0100] Furthermore, since the capillary structure is omitted in the connecting cavity 200, there is more flexibility in the selection of materials for the connecting cavity 200, and materials with lower density can be used to further reduce the weight of the heat dissipation component 10.

[0101] Furthermore, since the second chamber S2 is connected to the first chamber S1 through at least one of the connecting channels 210 of the connecting chamber 200, the second chamber S2 can achieve a pressure equalization effect, thus distributing the working fluid more evenly into the connecting channel 210. In this way, the working fluid can circulate more effectively between the first chamber S1, the connecting channel 210, and the second chamber S2, thereby enabling the heat dissipation assembly 10 to cool the heat source 20 more effectively.

[0102] Furthermore, through the top connecting grooves 515 connected to these top connecting holes 514, the second chamber S2 can achieve a better pressure equalization effect, and the working fluid can be more evenly distributed to these connecting channels 210.

[0103] The design of the boss portion 112 allows more working fluid to flow to the second heat dissipation fin group 140 to absorb the heat generated by the heat source 20, thus cooling the heat source 20 more effectively.

[0104] Furthermore, through the clearance space 151 of the bottom support structure 150, more working fluid will flow to the second heat dissipation fin assembly 140 to absorb the heat generated by the heat source 20, thus cooling the heat source 20 more effectively. In addition, through the return channel 152 of the bottom support structure 150, the working fluid can flow more effectively from the connecting channel 210 back to the second heat dissipation fin assembly 140 in the bottom connecting groove 116.

[0105] Other embodiments will be listed below for illustration. It must be noted that the following embodiments use the component reference numerals and some content from the foregoing embodiments, with the same reference numerals representing the same or similar components, and descriptions of identical technical content omitted. For explanations of the omitted parts, please refer to the foregoing embodiments; these will not be repeated in the following embodiments.

[0106] This invention is not limited to the form of a second heat dissipation fin assembly. Please refer to [link / reference]. Figure 8 and Figure 9 . Figure 8 This is a perspective view of a heat dissipation assembly according to a second embodiment of the present invention. Figure 9 for Figure 8 This is a partially enlarged exploded view of the heat dissipation assembly. The difference between the heat dissipation assembly 10a in this embodiment and the heat dissipation assembly 10 in the first embodiment lies only in the form of the second heat dissipation fin group 140a in the first cavity 100a. Specifically, in this embodiment, the second heat dissipation fin group 140a is, for example, a shovel-shaped fin. Of course, in other embodiments, the second heat dissipation fin group may also be a U-shaped fin, an I-shaped fin, an interlaced fin, an aluminum extruded fin, or a stacked fin, other than columnar fins and shovel-shaped fins.

[0107] This invention is not limited to the form of a second cavity. Please refer to [link / reference]. Figures 10 to 12 . Figure 10 This is a perspective view of a heat dissipation assembly according to a third embodiment of the present invention. Figure 11 for Figure 10 A partially enlarged view of the exploded view of the heat dissipation components. Figure 12 for Figure 10 This is a partially enlarged exploded view of the heat dissipation assembly. The difference between the heat dissipation assembly 10b of this embodiment and the heat dissipation assembly 10 of the first embodiment lies only in the form of the second cavity 500b. Specifically, in this embodiment, the second cavity 500b does not have the top cover plate 520 and top support structure 530 of the first embodiment. Furthermore, the second cavity S2b only includes a plurality of top connecting holes 514 and does not include the top connecting groove 515 of the first embodiment. That is, the top surface 511b of the top connecting plate 510b is, for example, flat. The top connecting holes 514b are, for example, blind holes or grooves that do not extend to the top surface 511b.

[0108] This invention is not limited to the number of bosses. Please refer to [link / reference]. Figure 13 and Figure 14 . Figure 13 This is a side view of the heat source and the heat dissipation assembly according to the fourth embodiment of the present invention. Figure 14 for Figure 13The image shows a bottom view of the heat source and heat dissipation components. The difference between the heat dissipation component 10c in this embodiment and the heat dissipation component 10 in the first embodiment lies only in the number of bosses 112c. Specifically, in this embodiment, there are multiple bosses 112c. These bosses 112c may also be provided with... Figure 3 The bottom cover plate 130 and the second heat dissipation fin assembly 140 are used to cool multiple heat sources 20c. Furthermore, these bosses 112c have different protrusion lengths L relative to the body portion 111 to accommodate heat sources 20c of different heights. Additionally, these bosses 112c are arranged along the connecting cavity 200 in the direction B (parallel to the X-axis) and the connecting channel (not shown, see reference). Figure 5 The arrangement direction A (parallel to the Y-axis direction) of the connecting channels 210 in the middle is staggered with each other, so that it can be used for heat sources 20c arranged in a specific way.

[0109] The base of this invention is not limited to including a boss portion, and this invention is not limited to the form of a bottom support structure and a top support structure. Please refer to [link / reference]. Figure 15 and Figure 16 , Figure 15 This is a cross-sectional schematic diagram of a heat source and a heat dissipation assembly according to a fifth embodiment of the present invention. Figure 16 for Figure 15 The image shows a bottom view of the heat source and heat dissipation components. The difference between the heat dissipation component 10d in this embodiment and the heat dissipation component 10 in the first embodiment lies only in the structure of the first cavity 100d and the structure of the second cavity 500d. Specifically, in this example, the base 110d only includes the body portion 111 and does not include the boss portion 112, bottom cover plate 130, and second heat dissipation fin group 140 as in the first embodiment, and the bottom support structure 150d includes a plurality of support columns 153d that are separated from each other. The opposite ends of these support columns 153d are respectively fixed to the body portion 111 and the bottom connecting plate 120. These support columns 153d can be made of thermally conductive materials such as copper or aluminum, replacing the second heat dissipation fin group 140 in the first embodiment as the heat conduction medium. Similarly, in this embodiment, the top support structure 530d includes a plurality of support columns 531d that are separated from each other. The opposite ends of these support columns 531d are respectively fixed to the top connecting plate 510 and the top cover plate 520. Support columns 153d and 531d will actually separate from each other along the X-axis and Y-axis directions without affecting the flow of the working fluid.

[0110] Furthermore, in this embodiment, the thermal contact surface 131d is located on the body portion 111 and is used for thermal contact with a plurality of heat sources 20d. These heat sources 20d are, for example, arranged along the arrangement direction B (parallel to the X-axis direction) of the communicating cavity 200 and the communicating flow channel (not shown, but can be referenced). Figure 5 The directions A (parallel to the Y-axis) of the connecting channels 210 in the middle are misaligned.

[0111] According to the heat dissipation assembly disclosed in the above embodiments, since the first heat dissipation fins are respectively disposed between the connecting cavities, and the connecting channel is connected to the first chamber, the working fluid can circulate between the first chamber and the connecting channel through the thermosiphon principle, thus omitting the capillary structure in the first chamber and the connecting channel. In this way, more working fluid can be accommodated in the heat dissipation assembly, significantly improving the maximum heat transfer capacity and heat dissipation capacity per unit volume of the heat dissipation assembly. Furthermore, the connecting cavities omitting the capillary structure can have a smaller volume, allowing the cooling airflow to be evenly distributed to the first heat dissipation fins. Therefore, the heat dissipation assembly can cool the heat source more effectively.

[0112] Furthermore, since the connecting cavity omits the capillary structure, there is more flexibility in the choice of materials for the connecting cavity, and lower density materials can be used to further reduce the weight of the heat dissipation components.

[0113] Furthermore, since the second chamber is connected to the first chamber through at least one of the connecting channels of the connecting chamber, the second chamber can achieve a pressure equalization effect, thus distributing the working fluid more evenly into the connecting channel. In this way, the working fluid can circulate more effectively between the first chamber, the connecting channel, and the second chamber, thereby enabling the heat dissipation component to cool the heat source more effectively.

Claims

1. A heat dissipation component for thermal contact with at least one heat source and comprising: The first cavity has a thermal contact surface and a first chamber, the thermal contact surface being used to make thermal contact with the at least one heat source; At least three interconnected cavities, each having at least one interconnected flow channel connected to the first cavity; At least two first heat dissipation fin groups are respectively disposed between the at least three interconnecting cavities; and The second cavity has a second chamber, which is connected to the first chamber through at least one of the communicating cavities via at least one communicating flow channel of the communicating cavity; in, The normal direction of the thermal contact surface is generally parallel to the extension direction of the at least one connecting flow channel of each of the at least three connecting cavities. In this configuration, at least one connecting channel of each of the at least three interconnecting cavities is entirely located between the first chamber and the second chamber; and The arrangement direction of the at least three interconnected cavities is approximately perpendicular to the normal direction of the thermal contact surface.

2. The heat dissipation assembly as claimed in claim 1, wherein the number of at least one connecting channel in each of the at least three connecting cavities is multiple, the connecting channels in each of the at least three connecting cavities are arranged along an arrangement direction and separated from each other, and the second chamber is connected to the first chamber through the connecting channels of the at least three connecting cavities.

3. The heat dissipation assembly as claimed in claim 2, wherein the second cavity further has a bottom surface, the second chamber includes a plurality of top connecting holes, the top connecting holes extending along the arrangement direction and located on the bottom surface, and the top connecting holes respectively connecting to the connecting channels of the at least three connecting cavities.

4. The heat dissipation assembly as claimed in claim 3, wherein the second cavity includes a top connecting plate, a top cover plate, and a top support structure, the second cavity further includes a top connecting groove, the bottom surface and the top connecting holes are located on the top connecting plate, the top connecting plate also has a top surface facing away from the bottom surface, the top connecting groove is recessed inward from the top surface and communicates with the top connecting holes, the top cover plate is disposed on the mounting groove on the top surface and covers the top connecting groove, and the top support structure is fixed to the top connecting plate and located in the top connecting groove.

5. The heat dissipation assembly as claimed in claim 4, wherein the opposite sides of the top support structure are respectively fixed to the top connecting plate and the top cover plate.

6. The heat dissipation assembly as claimed in claim 4, wherein the top connecting plate further has a plurality of top mounting slots located on the bottom surface, the top connecting holes respectively penetrating the bottom surfaces of the plurality of slots of the top mounting slots and the bottom surface of the top connecting groove, and one side of the at least three connecting cavities is respectively fixed in the top mounting slots.

7. The heat dissipation assembly as claimed in claim 2, wherein the first cavity includes a base, a bottom connecting plate, a bottom cover plate, a second heat dissipation fin assembly, and a bottom support structure; the first cavity includes a bottom connecting groove and a plurality of bottom connecting holes; the base has a top surface and a bottom surface facing each other; the bottom connecting groove is recessed inward from the top surface; the bottom connecting plate is disposed in the bottom connecting groove and the bottom connecting holes are located on the bottom connecting plate; the bottom connecting holes extend along the arrangement direction; the bottom connecting holes respectively connect the connecting channels of the at least three connecting cavities to the bottom connecting groove; the bottom cover plate is disposed on the bottom surface and is used for thermal contact with the at least one heat source; the second heat dissipation fin assembly is disposed on the bottom cover plate and is located in the bottom connecting groove; and the bottom support structure is fixed to the base and is located in the bottom connecting groove.

8. The heat dissipation assembly as claimed in claim 7, wherein the base of the first cavity includes a body portion and at least one boss portion, the top surface and the bottom surface are located on the body portion, the at least one boss portion protrudes outward from the bottom surface, and the bottom cover plate is disposed on the side of the at least one boss portion away from the body portion.

9. The heat dissipation assembly as claimed in claim 8, wherein the at least one boss has an opening located on the side of the at least one boss away from the body portion, and the bottom cover is disposed at the opening.

10. The heat dissipation assembly of claim 8, wherein the number of the at least one boss is a plurality of bosses, and the bosses are staggered with each other.

11. The heat dissipation assembly of claim 8, wherein the number of the at least one boss portion is multiple, and the boss portions have different protrusion lengths relative to the body portion.

12. The heat dissipation assembly as claimed in claim 7, wherein the bottom support structure is a fin structure.

13. The heat dissipation assembly of claim 12, wherein the bottom support structure has a clearance space and two return channels, the two return channels are connected to the clearance space and are respectively located on opposite sides of the clearance space, the two return channels extend along the arrangement direction, and the second heat dissipation fin group is located between the clearance space and the bottom cover plate.

14. The heat dissipation assembly of claim 7, wherein the thermal conductivity of the materials of the bottom cover plate and the second heat dissipation fin group is higher than that of the materials of the base, the bottom connecting plate, the bottom support structure, the at least three connecting cavities, the at least two first heat dissipation fin groups and the second cavity.

15. The heat dissipation assembly of claim 14, wherein the bottom cover and the second heat dissipation fin assembly are made of copper.

16. The heat dissipation assembly of claim 7, wherein the density of the materials of the base, the bottom connecting plate, the bottom support structure, the at least three connecting cavities, the at least two first heat dissipation fin groups, and the second cavity is lower than the density of the materials of the bottom cover plate and the second heat dissipation fin groups.

17. The heat dissipation assembly of claim 16, wherein the base, the bottom connecting plate, the bottom support structure, the at least three connecting cavities, the at least two first heat dissipation fin groups, and the second cavity are made of aluminum.

18. The heat dissipation assembly of claim 2, wherein each of the at least two first heat dissipation fin groups comprises a plurality of fin portions separated from each other along the arrangement direction.

19. The heat dissipation assembly of claim 1, further comprising two baffles, the number of the at least two first heat dissipation fin groups being at least four, the at least three connecting cavities being respectively located between the at least four first heat dissipation fin groups, the two baffles being respectively disposed on two of the first heat dissipation fin groups, and the at least three connecting cavities and the at least four first heat dissipation fin groups being located between the two baffles.

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