Radar array plane cooling system

Abstract

The invention provides a radar array plane cooling system which comprises a plurality of cooling function modules integrated with T / R assemblies, a distributed heat sink and a pipeline system, and the distributed heat sink is connected with the plurality of cooling function modules through the pipeline system.

Description

Technical Field

[0001] This invention relates to the field of radar heat dissipation technology, and in particular to a radar array cooling system. Background Technology

[0002] The antenna array of an active phased array radar consists of thousands of high-power-density T / R (transmit / receive) components, which generate a large amount of heat during operation. If the heat cannot be dissipated in time, the junction temperature of the chip will rise, seriously affecting the performance, reliability, and lifespan of the radar.

[0003] Traditional cooling solutions are mainly divided into two types: 1. Centralized liquid cooling system: This system distributes coolant to each array unit through a central cooling unit and a complex network of main pipes. This system is susceptible to single-point-of-failure failure, and damage to the main pipes during combat will cause the entire system to lose cooling. Furthermore, the massive piping system is incompatible with the modular, highly integrated radar architecture, making maintenance and expansion difficult.

[0004] 2. Air-cooled system: For future T / R modules with higher power density, air cooling has gradually reached its heat dissipation bottleneck, and the system is noisy and difficult to meet the stringent heat dissipation requirements.

[0005] Loop heat pipes (LHPs), as passive heat dissipation devices driven by two-phase flow and capillary force, have advantages such as strong heat transfer capacity, long distance, no need for external pump driving force, and high reliability. However, their direct application to radar arrays with compact structures, high heat flux density, and high reliability requirements still faces challenges in many aspects, including startup characteristics, operational stability, system integration, and compatibility with modular architectures. Summary of the Invention

[0006] The technical problem to be solved by the present invention is to provide a radar array cooling system to address the shortcomings of the prior art.

[0007] The technical solution of the present invention to solve the above-mentioned technical problems is as follows: a radar array cooling system, comprising: multiple cooling functional modules integrated with T / R components, distributed heat sinks and a pipeline system, wherein the distributed heat sinks are respectively connected to the multiple cooling functional modules through the pipeline system.

[0008] The beneficial effects of adopting the technical solution of this invention are as follows: By decentralizing the cooling function to each module, the vulnerable main cooling network is eliminated. Even if a single or partial module fails due to combat damage, the coolant will not leak on a large scale, and the remaining modules can continue to operate normally, resulting in extremely high system survivability. The system has no central coolant main pipeline running through the entire array; each cooling module independently exchanges heat with distributed heat sinks through a piping system. This completely eliminates the traditional centralized cooling main pipeline network, achieving fully modular and distributed deployment of the cooling system. It possesses extremely high combat damage resistance, environmental adaptability, and ease of maintenance, making it particularly suitable for next-generation high-performance, high-reliability modular active phased array radars.

[0009] Furthermore, the cooling function module is provided with a loop heat pipe unit, in which a T / R component evaporator is provided. The loop heat pipe unit is connected to the distributed heat sink, and the T / R component evaporator is thermally coupled to the heating chip of the T / R component.

[0010] The beneficial effects of adopting the above-mentioned further technical solutions are as follows: Utilizing the efficient two-phase heat transfer capability of the loop heat pipe, heat from the core heat source is directly transferred over long distances to the edge heat sink, resulting in high heat dissipation efficiency and good temperature uniformity. It operates passively, with no moving parts, ensuring long lifespan and high reliability. Integrating the loop heat pipe with the radar array in a modular fashion achieves efficient heat dissipation without main pipelines and with high resistance to battle damage. Each cooling module incorporates a loop heat pipe, thermally coupling its evaporator to the heating chip, and then guiding the steam through flexible piping to a distributed heat sink for condensation and recirculation.

[0011] Furthermore, the vapor outlet of the loop heat pipe unit is connected to the inlet of the distributed heat sink through the piping system, and the liquid inlet of the loop heat pipe unit is connected to the outlet of the distributed heat sink through the piping system; the loop heat pipe unit is a dual-storage loop heat pipe unit.

[0012] The beneficial effects of adopting the above-mentioned further technical solutions are as follows: Utilizing the efficient two-phase flow heat transfer capability of the loop heat pipe, heat from the core heat source is directly transferred over long distances to the edge heat sink, resulting in high heat dissipation efficiency and good temperature uniformity. It operates passively, with no moving parts, offering long lifespan and high reliability. Integrating the loop heat pipe with the radar array in a modular fashion achieves efficient heat dissipation with no main pipeline and high resistance to battle damage. Each cooling module incorporates a loop heat pipe, thermally coupling its evaporator to the heating chip. Vapor is then guided to a distributed heat sink for condensation and recirculation via flexible piping. The loop heat pipe unit employs a dual-liquid reservoir design, symmetrically arranged on both sides of the evaporator to ensure reliable liquid supply to the evaporator under different azimuth and acceleration conditions. The dual-liquid reservoir design makes the system insensitive to attitude changes such as pitch and rotation of the radar array, providing excellent resistance to overload and vibration, making it suitable for airborne, shipborne, and other mobile platforms.

[0013] Furthermore, the loop heat pipe unit is provided with a pair of liquid reservoirs and a pair of evaporator channels. The pair of liquid reservoirs are symmetrically installed on both sides of the evaporator of the T / R component. One end of the pair of liquid reservoirs and one end of the pair of evaporator channels are connected to the piping system. The other end of the pair of liquid reservoirs is connected to the other end of the pair of evaporator channels.

[0014] The beneficial effects of adopting the above-mentioned further technical solutions are as follows: Utilizing the efficient two-phase flow heat transfer capability of the loop heat pipe, heat from the core heat source is directly transferred over long distances to the edge heat sink, resulting in high heat dissipation efficiency and good temperature uniformity. It operates passively, with no moving parts, offering long lifespan and high reliability. Integrating the loop heat pipe with the radar array in a modular fashion achieves efficient heat dissipation with no main pipeline and high resistance to battle damage. Each cooling module incorporates a loop heat pipe, thermally coupling its evaporator to the heating chip. Vapor is then guided to a distributed heat sink for condensation and recirculation via flexible piping. The loop heat pipe unit employs a dual-liquid reservoir design, symmetrically arranged on both sides of the evaporator to ensure reliable liquid supply to the evaporator under different azimuth and acceleration conditions. The dual-liquid reservoir design makes the system insensitive to attitude changes such as pitch and rotation of the radar array, providing excellent resistance to overload and vibration, making it suitable for airborne, shipborne, and other mobile platforms.

[0015] Furthermore, the T / R component evaporator is a flat plate evaporator, and the bottom surface of the T / R component evaporator is integrated with the metal shell of the T / R component or directly with the back of the heating chip by welding or by bonding with thermally conductive adhesive.

[0016] The advantages of adopting the above-mentioned further technical solution are: the evaporator is a flat-plate evaporator, and its bottom surface is integrated with the metal shell of the T / R component unit or directly with the back of the heating chip by welding or bonding with high thermal conductivity adhesive. This facilitates the selection of connection methods and connection positions according to the implementation, improves applicability, and facilitates installation and maintenance.

[0017] Furthermore, the piping system includes: multiple steam manifolds and multiple liquid manifolds, with both ends of the multiple steam manifolds connected to the steam outlets of the multiple cooling functional modules and the inlet of the distributed heat sink, respectively, and both ends of the multiple liquid manifolds connected to the liquid inlets of the multiple cooling functional modules and the outlet of the distributed heat sink, respectively.

[0018] The beneficial effects of adopting the above-mentioned further technical solution are: multiple steam collection hoses and liquid return hoses are used to connect the steam outlets of the loop heat pipe units in multiple cooling functional modules to the inlet of the distributed heat sink, and to send the condensed working fluid back from the outlet of the distributed heat sink to each loop heat pipe unit.

[0019] Furthermore, both the steam collecting pipe and the liquid collecting pipe are composite pipes made of corrugated metal or lined with metal mesh, and both are equipped with self-sealing quick connectors; each of the cooling functional modules is connected to a component evaporator outlet pipe and a component evaporator inlet pipe, the distributed heat sink is connected to a condenser inlet pipe and a condenser outlet pipe, both the component evaporator outlet pipe and the condenser inlet pipe are connected to the steam collecting pipe, and both the component evaporator inlet pipe and the condenser outlet pipe are connected to the liquid collecting pipe.

[0020] The beneficial effects of adopting the above-mentioned further technical solutions are: the steam collection hose and liquid return hose adopt flexible composite pipes with metal corrugated pipes or metal mesh lining, and are equipped with self-sealing quick couplings. The modular design, combined with quick couplings, allows individual cooling function modules to be quickly replaced in a "hot-swappable" manner, just like T / R components, simplifying the on-site maintenance process.

[0021] Furthermore, each of the cooling functional modules is integrated with one or more antenna array T / R component units; a temperature sensor or pressure sensor is mounted on the housing of the cooling functional module.

[0022] The beneficial effects of adopting the above-mentioned further technical solution are as follows: each cooling function module is integrated with one or more antenna array T / R component units to form an independent heat dissipation unit. By decentralizing the cooling function to each module, the vulnerable main network is eliminated. In the event of failure of a single or partial module due to combat damage, the coolant will not leak on a large scale, and the remaining modules can continue to operate normally, resulting in extremely high system survivability. Temperature or pressure sensors are installed on the housing of the cooling function module to monitor the module's operating status.

[0023] Furthermore, the number of distributed heat sinks is at least one, and the distributed heat sinks are installed around the antenna array or on the back of the antenna array; the distributed heat sinks include: a condenser and a condenser fan, and the condenser fan is located adjacent to the condenser.

[0024] The beneficial effect of adopting the above-mentioned further technical solution is that the distributed heat sink is set around or behind the antenna array, serving as the condensation end of the loop heat pipe unit.

[0025] Furthermore, the distributed heat sink is a liquid-cooled plate or an air-cooled fin, and the internal flow channel of the distributed heat sink is connected to the piping system.

[0026] The beneficial effects of adopting the above-mentioned further technical solutions are: the distributed heat sink is a liquid-cooled plate or air-cooled fin, and its internal flow channel is connected to the steam collection hose and the liquid return hose, forming a complete steam-condensation cycle loop.

[0027] The advantages of additional aspects of the invention will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of the invention. Attached Figure Description

[0028] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0029] Figure 1 This is one of the structural schematic diagrams of a radar array cooling system provided in an embodiment of the present invention.

[0030] Figure 2 This is a second schematic diagram of the radar array cooling system provided in an embodiment of the present invention.

[0031] The reference numerals in the attached diagram are as follows: 1. Condenser fan; 2. Condenser; 3. T / R module evaporator; 4. T / R module; 5. Steam manifold; 6. Module evaporator outlet pipe; 7. Liquid manifold; 8. Condenser inlet pipe; 9. Module evaporator liquid inlet pipe; 10. Condenser outlet pipe; 11. Liquid receiver; 12. Evaporator flow channel. Detailed Implementation

[0032] The principles and features of the present invention are described below with reference to the accompanying drawings. The embodiments described are only for explaining the present invention and are not intended to limit the scope of the present invention.

[0033] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. The components of the embodiments of the present invention described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0034] Therefore, the following detailed description of the embodiments of the invention provided in the accompanying drawings is not intended to limit the scope of the claimed invention, but merely to illustrate selected embodiments of the invention. All other embodiments obtained by those skilled in the art based on the embodiments of the invention without inventive effort are within the scope of protection of the invention.

[0035] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0036] In the description of the embodiments of the present invention, it should be noted that if terms such as "upper", "lower", "horizontal", "inner" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings, or the orientation or positional relationship in which the product of the invention is usually placed during use, they are only for the convenience of describing the present invention and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation, and therefore should not be construed as a limitation of the present invention.

[0037] In the description of the embodiments of the present invention, it should also be noted that, unless otherwise explicitly specified and limited, the terms "set," "install," "connect," and "link" should be interpreted broadly. For example, they can refer to a fixed connection, a detachable connection, or an integral connection; they can refer to a mechanical connection or an electrical connection; they can refer to a direct connection or an indirect connection through an intermediate medium; and they can refer to the internal connection of two components. Those skilled in the art can understand the specific meaning of the above terms in the present invention according to the specific circumstances.

[0038] like Figure 1 and Figure 2 As shown, this embodiment of the invention provides a radar array cooling system, including: multiple cooling functional modules integrated with the T / R component 4, a distributed heat sink, and a piping system, wherein the distributed heat sink is connected to the multiple cooling functional modules through the piping system.

[0039] The beneficial effects of adopting the technical solution of this invention are as follows: By decentralizing the cooling function to each module, the vulnerable main cooling network is eliminated. Even if a single or partial module fails due to combat damage, the coolant will not leak on a large scale, and the remaining modules can continue to operate normally, resulting in extremely high system survivability. The system has no central coolant main pipeline running through the entire array; each cooling module independently exchanges heat with distributed heat sinks through a piping system. This completely eliminates the traditional centralized cooling main pipeline network, achieving fully modular and distributed deployment of the cooling system. It possesses extremely high combat damage resistance, environmental adaptability, and ease of maintenance, making it particularly suitable for next-generation high-performance, high-reliability modular active phased array radars.

[0040] This invention relates to the field of radar heat dissipation technology, and in particular to a distributed array cooling system (radar array cooling system) based on loop heat pipes, used for efficient and reliable thermal management of active phased array radar antenna arrays.

[0041] like Figure 1 and Figure 2As shown, this invention discloses a distributed array cooling system (radar array cooling system) based on loop heat pipes, belonging to the field of radar heat dissipation technology. The system includes multiple cooling functional modules integrated with the T / R component unit (T / R component 4), distributed heat sinks arranged around the array surface, and a flexible connection and collection system (piping system) connecting the two. Each cooling functional module has a built-in loop heat pipe, thermally coupling its evaporator (T / R component evaporator 3) to the heat-generating chip. Steam is led to the distributed heat sink (condenser) through flexible pipes for condensation and then returned. This invention completely eliminates the traditional centralized cooling main pipeline network, achieving fully modular and distributed deployment of the cooling system. It possesses extremely high combat damage resistance, environmental adaptability, and ease of maintenance, making it particularly suitable for next-generation high-performance, high-reliability modular active phased array radars.

[0042] like Figure 1 and Figure 2 As shown, the cooling function module is further provided with a loop heat pipe unit, in which a T / R component evaporator 3 is provided. The loop heat pipe unit is connected to the distributed heat sink, and the T / R component evaporator 3 is thermally coupled to the heating chip of the T / R component 4.

[0043] The beneficial effects of adopting the above-mentioned further technical solutions are as follows: Utilizing the efficient two-phase heat transfer capability of the loop heat pipe, heat from the core heat source is directly transferred over long distances to the edge heat sink, resulting in high heat dissipation efficiency and good temperature uniformity. It operates passively, with no moving parts, ensuring long lifespan and high reliability. Integrating the loop heat pipe with the radar array in a modular fashion achieves efficient heat dissipation without main pipelines and with high resistance to battle damage. Each cooling module incorporates a loop heat pipe, thermally coupling its evaporator to the heating chip, and then guiding the steam through flexible piping to a distributed heat sink for condensation and recirculation.

[0044] like Figure 1 and Figure 2 As shown, further, the vapor outlet of the loop heat pipe unit is connected to the inlet of the distributed heat sink through the piping system, and the liquid inlet of the loop heat pipe unit is connected to the outlet of the distributed heat sink through the piping system; the loop heat pipe unit is a dual-storage loop heat pipe unit.

[0045] The beneficial effects of adopting the above-mentioned further technical solutions are as follows: Utilizing the efficient two-phase flow heat transfer capability of the loop heat pipe, heat from the core heat source is directly transferred over long distances to the edge heat sink, resulting in high heat dissipation efficiency and good temperature uniformity. It operates passively, with no moving parts, offering long lifespan and high reliability. Integrating the loop heat pipe with the radar array in a modular fashion achieves efficient heat dissipation with no main pipeline and high resistance to battle damage. Each cooling module incorporates a loop heat pipe, thermally coupling its evaporator to the heating chip. Vapor is then guided to a distributed heat sink for condensation and recirculation via flexible piping. The loop heat pipe unit employs a dual-liquid reservoir design, symmetrically arranged on both sides of the evaporator to ensure reliable liquid supply to the evaporator under different azimuth and acceleration conditions. The dual-liquid reservoir design makes the system insensitive to attitude changes such as pitch and rotation of the radar array, providing excellent resistance to overload and vibration, making it suitable for airborne, shipborne, and other mobile platforms.

[0046] like Figure 1 and Figure 2 As shown, the loop heat pipe unit is further provided with a pair of liquid reservoirs 11 and a pair of evaporator channels 12. The pair of liquid reservoirs 11 are symmetrically installed on both sides of the T / R component evaporator 3. One end of the pair of liquid reservoirs 11 and one end of the pair of evaporator channels 12 are connected to the piping system. The other end of the pair of liquid reservoirs 11 is connected to the other end of the pair of evaporator channels 12.

[0047] The beneficial effects of adopting the above-mentioned further technical solutions are as follows: Utilizing the efficient two-phase flow heat transfer capability of the loop heat pipe, heat from the core heat source is directly transferred over long distances to the edge heat sink, resulting in high heat dissipation efficiency and good temperature uniformity. It operates passively, with no moving parts, offering long lifespan and high reliability. Integrating the loop heat pipe with the radar array in a modular fashion achieves efficient heat dissipation with no main pipeline and high resistance to battle damage. Each cooling module incorporates a loop heat pipe, thermally coupling its evaporator to the heating chip. Vapor is then guided to a distributed heat sink for condensation and recirculation via flexible piping. The loop heat pipe unit employs a dual-liquid reservoir design, symmetrically arranged on both sides of the evaporator to ensure reliable liquid supply to the evaporator under different azimuth and acceleration conditions. The dual-liquid reservoir design makes the system insensitive to attitude changes such as pitch and rotation of the radar array, providing excellent resistance to overload and vibration, making it suitable for airborne, shipborne, and other mobile platforms.

[0048] like Figure 1 and Figure 2 As shown, the T / R component evaporator 3 is a flat plate evaporator, and the bottom surface of the T / R component evaporator 3 is integrated with the metal shell of the T / R component 4 or directly with the back of the heating chip by welding or by bonding with thermally conductive adhesive.

[0049] The advantages of adopting the above-mentioned further technical solution are: the evaporator is a flat-plate evaporator, and its bottom surface is integrated with the metal shell of the T / R component unit or directly with the back of the heating chip by welding or bonding with high thermal conductivity adhesive. This facilitates the selection of connection methods and connection positions according to the implementation, improves applicability, and facilitates installation and maintenance.

[0050] like Figure 1 and Figure 2 As shown, the piping system further includes: multiple steam manifolds 5 and multiple liquid manifolds 7. The two ends of the multiple steam manifolds 5 are respectively connected to the steam outlets of the multiple cooling functional modules and the inlet of the distributed heat sink. The two ends of the multiple liquid manifolds 7 are respectively connected to the liquid inlets of the multiple cooling functional modules and the outlet of the distributed heat sink.

[0051] The beneficial effects of adopting the above-mentioned further technical solution are: multiple steam collection hoses and liquid return hoses are used to connect the steam outlets of the loop heat pipe units in multiple cooling functional modules to the inlet of the distributed heat sink, and to send the condensed working fluid back from the outlet of the distributed heat sink to each loop heat pipe unit.

[0052] like Figure 1 and Figure 2 As shown, further, both the steam collecting pipe 5 and the liquid collecting pipe 7 are metal corrugated pipes or composite pipes lined with metal mesh, and both the steam collecting pipe 5 and the liquid collecting pipe 7 are equipped with self-sealing quick connectors; each of the cooling functional modules is connected to the component evaporator outlet pipe 6 and the component evaporator inlet pipe 9, and the distributed heat sink is connected to the condenser inlet pipe 8 and the condenser outlet pipe 10. The component evaporator outlet pipe 6 and the condenser inlet pipe 8 are both connected to the steam collecting pipe 5, and the component evaporator inlet pipe 9 and the condenser outlet pipe 10 are both connected to the liquid collecting pipe 7.

[0053] The beneficial effects of adopting the above-mentioned further technical solutions are: the steam collection hose and liquid return hose adopt flexible composite pipes with metal corrugated pipes or metal mesh lining, and are equipped with self-sealing quick couplings. The modular design, combined with quick couplings, allows individual cooling function modules to be quickly replaced in a "hot-swappable" manner, just like T / R components, simplifying the on-site maintenance process.

[0054] like Figure 1 and Figure 2 As shown, each of the cooling functional modules is further integrated with one or more antenna array T / R component units; a temperature sensor or pressure sensor is mounted on the housing of the cooling functional module.

[0055] The beneficial effects of adopting the above-mentioned further technical solution are as follows: each cooling function module is integrated with one or more antenna array T / R component units to form an independent heat dissipation unit. By decentralizing the cooling function to each module, the vulnerable main network is eliminated. In the event of failure of a single or partial module due to combat damage, the coolant will not leak on a large scale, and the remaining modules can continue to operate normally, resulting in extremely high system survivability. Temperature or pressure sensors are installed on the housing of the cooling function module to monitor the module's operating status.

[0056] like Figure 1 and Figure 2 As shown, further, the number of distributed heat sinks is at least one, and the distributed heat sinks are installed around the antenna array or on the back of the antenna array; the distributed heat sinks include: a condenser 2 and a condenser fan 1, and the condenser fan 1 is located adjacent to the condenser 2.

[0057] The beneficial effect of adopting the above-mentioned further technical solution is that the distributed heat sink is set around or behind the antenna array, serving as the condensation end of the loop heat pipe unit.

[0058] Furthermore, the distributed heat sink is a liquid-cooled plate or an air-cooled fin, and the internal flow channel of the distributed heat sink is connected to the piping system.

[0059] The beneficial effects of adopting the above-mentioned further technical solutions are: the distributed heat sink is a liquid-cooled plate or air-cooled fin, and its internal flow channel is connected to the steam collection hose and the liquid return hose, forming a complete steam-condensation cycle loop.

[0060] The purpose of this invention is to overcome the shortcomings of existing technologies and provide a distributed array cooling system (radar array cooling system) based on loop heat pipes. This system integrates loop heat pipes with the radar array in a modular manner, achieving efficient heat dissipation with no main pipeline and high resistance to battle damage.

[0061] To achieve the above objectives, the present invention adopts the following technical solution: a distributed array cooling system (radar array cooling system) based on a loop heat pipe, comprising: 1. Multiple cooling function modules, each of which is integrated with one or more antenna array T / R component units (T / R components) to form an independent heat dissipation unit; the cooling function module includes a loop heat pipe unit, the evaporator of which (T / R component evaporator) is thermally coupled to the heat-generating chip of the T / R component unit.

[0062] 2. One or more distributed heat sinks, which are located around or behind the antenna array, serve as the condensation end of the loop heat pipe unit.

[0063] 3. A flexible connection and collection system comprising multiple steam collection hoses (steam collection pipes) and liquid return hoses (liquid collection pipes) for connecting the steam outlets of the loop heat pipe units in multiple cooling functional modules to the inlet of the distributed heat sink, and for returning the condensed working fluid from the outlet of the distributed heat sink (condenser) to each loop heat pipe unit.

[0064] 4. The system (radar array cooling system) does not have a central coolant main pipeline that runs through the entire array. Each cooling functional module independently exchanges heat with the distributed heat sink through a flexible connection and collection system.

[0065] In particular, the loop heat pipe unit adopts a dual liquid reservoir design, with the two liquid reservoirs symmetrically arranged on both sides of the evaporator to ensure reliable liquid supply to the evaporator under different orientations and acceleration conditions.

[0066] Specifically, the evaporator (T / R module evaporator) is a flat-plate evaporator, whose bottom surface is integrated with the metal shell of the T / R module unit (T / R module) or directly with the back of the heating chip by welding or bonding with high thermal conductivity adhesive.

[0067] Specifically, the steam manifold (steam manifold) and liquid return manifold (liquid manifold) are made of flexible composite pipes with metal corrugations or metal mesh lining, and are equipped with self-sealing quick couplings.

[0068] Specifically, the distributed heat sink (condenser) is a liquid-cooled plate or air-cooled fin, and its internal flow channels are connected to the steam collection hose (steam collection pipe) and the liquid return hose (liquid collection pipe) to form a complete steam-condensation cycle loop.

[0069] Specifically, the housing of the cooling module is equipped with temperature or pressure sensors to monitor the module's operating status.

[0070] The beneficial effects of this invention are as follows: 1. High modularity and combat damage resistance: By decentralizing cooling functionality to each module (cooling function module), the vulnerable main network is eliminated. Even if a single or partial module fails due to combat damage, the coolant will not leak on a large scale, and the remaining modules can continue to operate normally, resulting in extremely high system survivability.

[0071] 2. Highly efficient and reliable heat dissipation: Utilizing the efficient two-phase heat transfer capability of the loop heat pipe, heat from the core heat source is directly transferred over long distances to the edge heat sink, resulting in high heat dissipation efficiency and good temperature uniformity. It operates passively with no moving parts, ensuring a long lifespan and high reliability.

[0072] 3. Excellent environmental adaptability: The dual liquid reservoir design makes the system insensitive to changes in the pitch and rotation of the radar array, and has good resistance to overload and vibration, making it suitable for mobile platforms such as airborne and shipborne systems.

[0073] 4. Easy maintenance: The modular design, combined with quick connectors, allows individual cooling modules to be quickly replaced in a "hot-swappable" manner, just like T / R components, greatly simplifying the on-site maintenance process.

[0074] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention, and not to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that modifications can still be made to the technical solutions described in the foregoing embodiments, or equivalent substitutions can be made to some or all of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present invention.

Claims

1. A radar array cooling system, characterized in that, include: The system includes multiple cooling functional modules integrated with the T / R component, a distributed heat sink, and a piping system. The distributed heat sink is connected to the multiple cooling functional modules through the piping system.

2. The radar array cooling system according to claim 1, characterized in that, The cooling module is equipped with a loop heat pipe unit, in which a T / R component evaporator is installed. The loop heat pipe unit is connected to the distributed heat sink, and the T / R component evaporator is thermally coupled to the heating chip of the T / R component.

3. The radar array cooling system according to claim 2, characterized in that, The vapor outlet of the loop heat pipe unit is connected to the inlet of the distributed heat sink through the piping system, and the liquid inlet of the loop heat pipe unit is connected to the outlet of the distributed heat sink through the piping system; the loop heat pipe unit is a dual-storage loop heat pipe unit.

4. A radar array cooling system according to claim 3, characterized in that, The loop heat pipe unit is provided with a pair of liquid reservoirs and a pair of evaporator channels. The pair of liquid reservoirs are symmetrically installed on both sides of the evaporator of the T / R component. One end of the pair of liquid reservoirs and one end of the pair of evaporator channels are connected to the piping system. The other end of the pair of liquid reservoirs is connected to the other end of the pair of evaporator channels.

5. A radar array cooling system according to claim 2, characterized in that, The T / R module evaporator is a flat plate evaporator. The bottom surface of the T / R module evaporator is integrated with the metal shell of the T / R module or directly with the back of the heating chip by welding or by bonding with thermally conductive adhesive.

6. A radar array cooling system according to claim 1, characterized in that, The piping system includes: multiple steam manifolds and multiple liquid manifolds. The two ends of the multiple steam manifolds are respectively connected to the steam outlets of the multiple cooling functional modules and the inlet of the distributed heat sink. The two ends of the multiple liquid manifolds are respectively connected to the liquid inlets of the multiple cooling functional modules and the outlet of the distributed heat sink.

7. A radar array cooling system according to claim 6, characterized in that, Both the steam collecting pipe and the liquid collecting pipe are metal corrugated pipes or composite pipes lined with metal mesh, and both are equipped with self-sealing quick connectors. Each cooling function module is connected to a component evaporator outlet pipe and a component evaporator inlet pipe. The distributed heat sink is connected to a condenser inlet pipe and a condenser outlet pipe. Both the component evaporator outlet pipe and the condenser inlet pipe are connected to the steam collecting pipe, and both the component evaporator inlet pipe and the condenser outlet pipe are connected to the liquid collecting pipe.

8. A radar array cooling system according to claim 1, characterized in that, Each of the cooling functional modules is integrated with one or more antenna array T / R component units; a temperature sensor or pressure sensor is mounted on the housing of the cooling functional module.

9. A radar array cooling system according to claim 1, characterized in that, The number of distributed heat sinks is at least one, and the distributed heat sinks are installed around the antenna array or on the back of the antenna array; the distributed heat sinks include: a condenser and a condenser fan, and the condenser fan is located adjacent to the condenser.

10. A radar array cooling system according to claim 1, characterized in that, The distributed heat sink is a liquid-cooled plate or an air-cooled fin, and the internal flow channel of the distributed heat sink is connected to the piping system.

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