Forced convection radiator

Abstract

The invention discloses a forced convection radiator. The forced convection radiator comprises a first radiating fin group, a second radiating fin group and a vapor chamber, the first chamber is located above the second chamber, and the first chamber and the second chamber are arranged at an interval; a first capillary layer is formed on the inner bottom wall of the first cavity, and second capillary layers are formed on the inner side walls of the first communication channel and the second communication channel; a third capillary layer is formed on the inner bottom wall of the second cavity, a heat source gathering position is arranged on the outer bottom wall, corresponding to the second cavity, of the vapor chamber, an evaporation part is arranged in the second cavity and corresponds to the heat source gathering position, a plurality of capillary convex columns are arranged on the upper end face of the evaporation part in an upward protruding mode, and all the capillary convex columns penetrate through the first communication channel to stretch into the first cavity; the first communication channel, the second communication channel and the second heat dissipation fin set are all located between the first cavity and the second cavity, and the first communication channel and the second communication channel are both located in the second heat dissipation fin set. The area of an evaporation area is greatly increased, and the heat dissipation efficiency and the heat dissipation effect of the high-power chip are greatly improved.

Description

Technical Field

[0001] This invention relates to the field of forced convection radiators, and more particularly to forced convection radiators. Background Technology

[0002] With the development of the electronics industry, electronic products are gradually evolving towards higher performance, higher frequency, higher speed, and thinner designs. As the performance of electronic products continues to improve and their processing speeds increase, the processing speed of their internal chipsets also increases, along with the number of chips. Consequently, the heat generated by these chips during operation also increases. If this heat is not dissipated in time, it will greatly affect the performance of electronic products, reducing their processing speed. With the continuous accumulation of heat, it may even burn out the electronic products. Therefore, it is essential to implement heat dissipation measures for electronic products.

[0003] Heat sinks were developed to dissipate the heat generated by the chip during operation, thereby improving chip performance and ensuring chip lifespan.

[0004] Current heat sinks typically consist of a heatsink block and fins mounted on it. During operation, the heatsink block adheres to the chip to absorb the heat generated during chip operation and transfers it to the fins for dissipation. However, the entire process relies solely on the fins for heat dissipation, resulting in low efficiency and effectiveness.

[0005] Therefore, a new technical solution needs to be researched to address the above problems. Summary of the Invention

[0006] In view of this, the present invention addresses the deficiencies of the existing technology, and its main objective is to provide a forced convection heat sink that greatly increases the evaporation area and significantly improves the heat dissipation efficiency and effect of high-power chips.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: A forced convection radiator includes a first heat dissipation fin group, a second heat dissipation fin group, and a heat spreader. The first heat dissipation fin group is disposed on the upper end surface of the heat exchange plate; The heat spreader has a first chamber, a second chamber, and a first connecting channel and a second connecting channel respectively connecting the first chamber and the second chamber; The first chamber is located above the second chamber and the two are spaced apart; a first capillary layer is formed on the inner bottom wall of the first chamber, and a second capillary layer is formed on the inner sidewalls of both the first and second connecting channels. A third capillary layer is formed on the inner bottom wall of the second chamber. The heat spreader is provided with a heat source convergence position for attaching and connecting the heat source on the outer bottom wall of the second chamber. An evaporator is provided in the second chamber corresponding to the heat source convergence position. Several capillary protrusions are provided on the upper end face of the evaporator. All capillary protrusions extend into the first chamber through the first connecting channel. The first connecting channel, the second connecting channel, and the second heat dissipation fin group are all located between the first chamber and the second chamber, and the first connecting channel and the second connecting channel are both located within the second heat dissipation fin group.

[0008] As a preferred embodiment, the first capillary layer is connected to the second capillary layer, and the lower end of the second capillary layer located on the inner sidewall of the second connecting channel extends downward and abuts against the third capillary layer.

[0009] As a preferred embodiment, the thickness of the first connecting channel is greater than the thickness of the second connecting channel.

[0010] As a preferred embodiment, the inner top wall of the first chamber is connected to a first top plate, and the first capillary layer is connected to the first top plate through a first support member.

[0011] As a preferred embodiment, the heat spreader includes a first cover plate, a first bottom plate, a second cover plate, and a second bottom plate arranged sequentially from top to bottom; The first heat dissipation fin assembly is disposed on the upper end face of the first cover plate, the first base plate has a first receiving cavity with an upper opening, the first cover plate and the first base plate are connected and the first cover plate is installed at the upper opening of the first receiving cavity to form a first chamber; the lower end face of the first base plate is provided with a first connecting protrusion and a second connecting protrusion, the first connecting channel extends upward from the lower end face of the first connecting protrusion through the first chamber, and the second connecting channel extends upward from the lower end face of the second connecting protrusion through the first chamber; The second heat dissipation fin group is located between the first base plate and the second cover plate. The second base plate has a second receiving cavity with an upper opening. The second cover plate is connected to the second base plate and is installed at the upper opening of the second receiving cavity to form a second chamber. The second cover plate has a first through hole and a second through hole, the first connecting protrusion is installed at the first through hole, and the second connecting protrusion is installed at the second through hole.

[0012] As a preferred embodiment, the first cover plate has a cavity extending along its width direction, the cavity being located beside the first receiving cavity.

[0013] As a preferred embodiment, the lower end face of the second cover plate is connected to a second top plate. The second top plate is provided with a third through hole and a fourth through hole corresponding to the first through hole and the second through hole, respectively. The third through hole is connected to the first through hole. The first connecting protrusion passes through the first through hole, abuts against the second top plate, and covers the third through hole. The third through hole is connected to the first connecting channel. The fourth through hole connects to the second through hole, the second connecting protrusion passes through the second through hole and abuts against the second top plate and covers the third through hole, and the fourth through hole connects to the second connecting channel.

[0014] As a preferred embodiment, the third capillary layer is connected to the second top plate via a second support member.

[0015] As a preferred embodiment, the second heat dissipation fin group is provided with a first clearance hole and a second clearance hole respectively corresponding to the first connecting protrusion and the second connecting protrusion. The first connecting protrusion passes through the first clearance hole and is installed at the first through hole, and the second connecting protrusion passes through the first clearance hole and is installed at the first through hole.

[0016] As a preferred embodiment, at least two heat source convergence points are provided, the number of both the evaporator and the first connecting channel is the same as the number of heat source convergence points, and at least two second connecting channels are provided.

[0017] Compared with the prior art, the present invention has obvious advantages and beneficial effects. Specifically, as can be seen from the above technical solution, it mainly increases the evaporation area by setting an evaporator at the heat source convergence position and having the capillary protrusions of the evaporator extend into the first chamber through the first connecting channel. This allows heat to be directly introduced into the first chamber, and the evaporating fluid in the first chamber is directly evaporated and conducted to the first heat dissipation fin group. The first heat dissipation fin group exchanges heat with the outside atmosphere. After the evaporating fluid is cooled, it returns to the third capillary layer through the first and second capillary layers, which greatly improves the heat dissipation efficiency and heat dissipation effect of high-power chips. Secondly, the first and second support components can achieve both support and heat conduction, further improving the heat dissipation effect. Furthermore, the combination of protrusions and concave areas allows for faster heat absorption.

[0018] To more clearly illustrate the structural features and effects of the present invention, the present invention will be described in detail below with reference to the accompanying drawings and specific embodiments. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the structure of an embodiment of the present invention; Figure 2 This is a schematic diagram of another aspect of an embodiment of the present invention; Figure 3 This is an exploded structural diagram of an embodiment of the present invention; Figure 4 This is a schematic diagram of the first cross-sectional structure of an embodiment of the present invention; Figure 5 This is an exploded structural diagram of a heat spreader according to an embodiment of the present invention; Figure 6 This is an exploded structural diagram of the evaporator component according to an embodiment of the present invention; Figure 7 This is a schematic diagram of the welding plate structure according to an embodiment of the present invention; Figure 8 This is a schematic diagram of the second cross-section structure of an embodiment of the present invention (showing the convergence point of three heat sources).

[0020] Explanation of reference numerals in the attached diagram: 10. First heat dissipation fin group; 11. First connecting plate; 12. Second connecting plate; 13. First heat dissipation fin; 20. Second heat dissipation fin assembly; 201. First clearance hole; 202. Second clearance hole; 21. Third connecting plate; 22. Fourth connecting plate; 23. Second heat dissipation fins; 30. Heat spreader; 301. First chamber; 302. Second chamber; 303, First connecting channel; 304, Second connecting channel; 305. First top plate; 306. First capillary layer; 307. Second capillary layer; 308. Third capillary layer; 309. Positioning hole; 31. First cover plate; 311. Cavity; 32. First base plate; 321. First receiving cavity 322. First connecting protrusion; 323. Second connecting protrusion; 33. Second cover plate; 331. First perforation; 332. Second perforation; 333. Second top plate; 34. Second base plate; 341. Second receiving cavity; 342. Protrusion; 343. Concave portion; 35. First support component; 351. First support portion; 352. First upper protrusion; 353. Lower convex part; 36. Second support member; 361. Second support section; 362. The second upper convex part; 363. Positioning part; 40. Evaporator; 401. Capillary protrusion; 41. Welding plate; 411. First evaporation protrusion; 412. Groove; 413. Through hole; 42. Capillary base plate 421. Second evaporation protrusion. Detailed Implementation

[0021] Please refer to Figures 1 to 8 As shown, it illustrates the specific structure of an embodiment of the present invention. A forced convection heat sink includes a first heat dissipation fin group 10, a second heat dissipation fin group 20, and a heat spreader 30.

[0022] The first heat dissipation fin assembly 10 is disposed on the upper end surface of the heat spreader 30. In this embodiment, the first heat dissipation fin assembly 10 includes a first connecting plate 11, a second connecting plate 12, and a plurality of first heat dissipation fins 13 spaced apart between the first connecting plate 11 and the second connecting plate 12. The first connecting plate 11 and the second connecting plate 12 are spaced apart, and the upper and lower ends of each first heat dissipation fin 13 are integrally connected to the first connecting plate 11 and the second connecting plate 12, respectively.

[0023] The heat spreader 30 has a first chamber 301, a second chamber 302, and a first connecting channel 303 and a second connecting channel 304 respectively connecting the first chamber 301 and the second chamber 302; The first chamber 301 is located above the second chamber 302, and the two are spaced apart. A first top plate 305 is connected to the inner top wall of the first chamber 301, and a first capillary layer 306 is formed on the inner bottom wall of the first chamber 301. The first capillary layer 306 is connected to the first top plate 305 via a first support member 35. The first support member 35 can improve the stability between the first capillary layer 306 and the first top plate 305.

[0024] In this embodiment, the first support member 35 is made of a material with good thermal conductivity. The first support member 35 has both support and thermal conductivity. Heat can be quickly transferred through the first support member 35 to the inner top wall of the first chamber 301 via the first top plate 305 and then to the first heat dissipation fin group 10, thereby improving the thermal conductivity efficiency.

[0025] Preferably, the first top plate 305 and the first support member 35 are both metal parts, and the heat spreader 30 is also a metal part. Optionally, the first top plate 305, the first support member 35, and the heat spreader 30 are all copper parts. Of course, in addition to copper, other metals with good thermal conductivity can also be used to make the first top plate 305 and the first support member 35.

[0026] Preferably, a plurality of first support members 35 are provided, and each first support member 35 is spaced apart. Preferably, the plurality of first support members 35 are arranged in rows and columns within the first chamber 301. Of course, in addition to being arranged in rows and columns, other arrangements such as ring distribution or radial arrangement can also be adopted, which are not limited here.

[0027] In this embodiment, the first support member 35 includes a first support portion 351 and a first upper protrusion 352 and a lower protrusion 353 located on the upper and lower end faces of the first support portion 351, respectively. The first upper protrusion 352 abuts against the first top plate 305, and the lower protrusion 353 abuts against the first capillary layer 306.

[0028] The thickness of the first connecting channel 303 is greater than the thickness of the second connecting channel 304. A second capillary layer 307 is formed on the inner sidewall of both the first connecting channel 303 and the second connecting channel 304; the first capillary layer 306 connects to the second capillary layer 307. In this embodiment, the first capillary layer 306 is a first planar wire mesh, and the second capillary layer 307 is a tubular wire mesh.

[0029] A third capillary layer 308 is formed on the inner bottom wall of the second chamber 302. The lower end of the second capillary layer 307 located on the inner side wall of the second connecting channel 304 extends downward and abuts against the third capillary layer 308.

[0030] The heat spreader 30 is provided with a heat source convergence position on the outer bottom wall of the second chamber 302 for attaching and connecting the heat source. An evaporator 40 is provided in the second chamber 302 corresponding to the heat source convergence position. A plurality of capillary protrusions 401 are provided on the upper end surface of the evaporator 40. All capillary protrusions 401 extend into the first chamber 301 through the first connecting channel 303.

[0031] In this embodiment, the evaporation component 40 includes a welding plate 41 and a capillary base plate 42; the upper end surface of the welding plate 41 is provided with a plurality of first evaporation protrusions 411 protruding upward, and the lower end surface of the welding plate 41 is provided with a groove 412 recessed upward; each first evaporation protrusion 411 is provided with a through hole 413 recessed upward, and each through hole 413 connects to the groove 412. The upper end face of the capillary base plate 42 is provided with a plurality of second evaporation protrusions 421. The capillary base plate 42 is installed in the groove 412 from bottom to top. The capillary base plate 42 is connected to the inner bottom wall of the second chamber 302. The second evaporation protrusions 421 are adapted to the through hole 413. The first evaporation protrusions 411 and the second evaporation protrusions 421 together form a capillary protrusion 401.

[0032] The first connecting channel 303, the second connecting channel 304, and the second heat dissipation fin group 20 are all located between the first chamber 301 and the second chamber 302, and the first connecting channel 303 and the second connecting channel 304 are both located within the second heat dissipation fin group 20.

[0033] In this embodiment, the heat spreader 30 includes a first cover plate 31, a first bottom plate 32, a second cover plate 33, and a second bottom plate 34 arranged sequentially from top to bottom; The first heat dissipation fin group 10 is disposed on the upper end surface of the first cover plate 31, and the first cover plate 31 has a cavity 311 extending along its width direction.

[0034] The first base plate 32 has a first receiving cavity 321 with an opening at the upper end, and the cavity 311 is located on the side of the first receiving cavity 321.

[0035] The first cover plate 31 and the first bottom plate 32 are connected, and the first cover plate 31 is installed at the upper opening of the first receiving cavity 321 to form a first chamber 301; the lower end surface of the first bottom plate 32 is provided with a first connecting protrusion 322 and a second connecting protrusion 323 protruding downwards; the first connecting channel 303 extends upwards from the lower end surface of the first connecting protrusion 322 through the first chamber 301; the second connecting channel 304 extends upwards from the lower end surface of the second connecting protrusion 323 through the first chamber 301. The second base plate 34 has a second receiving cavity 341 with an upper opening, and the second cover plate 33 is connected to the second base plate 34 and is installed at the upper opening of the second receiving cavity 341 to form a second chamber 302. The second cover plate 33 has a first through hole 331 and a second through hole 332. The first connecting protrusion 322 is installed at the first through hole 331, and the second connecting protrusion 323 is installed at the second through hole 332.

[0036] The second heat dissipation fin assembly 20 is located between the first base plate 32 and the second cover plate 33. In this embodiment, the second heat dissipation fin assembly 20 has a first clearance hole 201 and a second clearance hole 202 respectively corresponding to the first connecting protrusion 322 and the second connecting protrusion 323. The first connecting protrusion 322 passes through the first clearance hole 201 and is installed at the first through hole 331, and the second connecting protrusion 323 passes through the first clearance hole 201 and is installed at the first through hole 331.

[0037] In this embodiment, the second heat dissipation fin assembly 20 includes a third connecting plate 21, a fourth connecting plate 22, and a plurality of second heat dissipation fins 23 spaced apart between the third connecting plate 21 and the fourth connecting plate 22. The third connecting plate 21 and the fourth connecting plate 22 are spaced apart, and the third connecting plate 21, the fourth connecting plate 22, and all the second heat dissipation fins 23 together form a first clearance hole 201 and a second clearance hole 202. The upper and lower ends of each second heat dissipation fin 23 are integrally connected to the third connecting plate 21 and the fourth connecting plate 22, respectively.

[0038] In this embodiment, the lower end face of the second cover plate 33 is connected to the second top plate 333, and the third capillary layer 308 is connected to the second top plate 333 via the second support member 36. In this embodiment, the third capillary layer 308 is a second planar wire mesh. The second support member 36 can improve the stability between the third capillary layer 308 and the second top plate 333.

[0039] The second support member 36 is made of a material with good thermal conductivity, so that the second support member 36 has both support and thermal conductivity. Heat can be quickly transferred through the second top plate 333 to the inner top wall of the second chamber 302 and then to the second heat dissipation fin group 20 via the second support member 36, thereby improving the thermal conductivity efficiency.

[0040] In this embodiment, the second support member 36 and the second top plate 333 are both metal parts, and the third capillary layer 308 is also a metal part. Optionally, the second support member 36, the second top plate 333, and the third capillary layer 308 are all copper parts. Of course, in addition to copper, other metals with good thermal conductivity can also be used to make the second support member 36, the second top plate 333, and the third capillary layer 308.

[0041] Preferably, a plurality of second support members 36 are provided, and each second support member 36 is spaced apart. Optionally, the plurality of second support members 36 are arranged in rows and columns within the second chamber 302. Of course, in addition to being arranged in rows and columns, the plurality of second support members 36 can also be arranged in other forms such as a ring distribution or a radial arrangement, which is not limited here.

[0042] In this embodiment, the second support member 36 includes a second support portion 361 and a second upper protrusion 362 and a positioning portion 363 located on the upper and lower end faces of the second support portion 361, respectively. The second upper protrusion 362 abuts against the second top plate 333. The upper end face of the third capillary layer 308 has a plurality of positioning holes 309, and the positioning portion 363 is inserted into a corresponding positioning hole 309.

[0043] In this embodiment, both the first upper protrusion 352 and the positioning part 363 are cylinders, and the positioning hole 309 is a round hole; or, both the first upper protrusion 352 and the positioning part 363 are square prisms, and the positioning hole 309 is a square hole. It should be noted that the shapes of the first upper protrusion 352 and the positioning part 363 can be the same or different; as long as the shapes of the positioning part 363 and the positioning hole 309 are compatible.

[0044] The second top plate 333 is provided with a third through hole 413 and a fourth through hole 413 respectively corresponding to the first through hole 331 and the second through hole 332. The third through hole 413 is connected to the first through hole 331. The first connecting protrusion 322 passes through the first through hole 331 and abuts against the second top plate 333 and covers the third through hole 413. The third through hole 413 is connected to the first connecting channel 303. The fourth through hole 413 connects to the second through hole 332, the second connecting protrusion 323 passes through the second through hole 332 and abuts against the second top plate 333 and covers the top of the third through hole 413, and the fourth through hole 413 connects to the second connecting channel 304.

[0045] The lower end face of the second base plate 34 has a protrusion 342 that protrudes downward to form a heat source gathering position. The second chamber 302 has a concave inner position 343 corresponding to the inner bottom wall of the protrusion 342, and the evaporator 40 is installed in the concave inner position 343. The second chamber 302 is used to inject evaporating fluid, and the evaporating fluid gathers in the concave inner position 343.

[0046] Taking the injection of evaporating fluid into the second chamber 302 and the installation of a single heat source at the heat source convergence position as an example, the general working principle will be explained below: The heat source convergence position of the second chamber 302 of the heat spreader 30 absorbs the heat generated by the heat source. The evaporator 40 evaporates the evaporating fluid in the first chamber 301 into saturated steam, and transfers it to the first chamber 301 through the first connecting channel 303 and the second connecting channel. At the same time, the heat of the first chamber 301 is also conducted to the second heat dissipation fin group 20 and the first heat dissipation fin group 10 respectively. When the wind blows through the second heat dissipation fin group 20 and the first heat dissipation fin group 10, it can carry away the heat. After the saturated vapor evaporates, the cooled evaporated fluid is replenished into the second chamber 302 through the first capillary layer 306 and the second capillary layer 307.

[0047] To target at least two heat sources, in this embodiment, at least two heat source convergence points are provided. The number of evaporators 40 and first connecting channels 303 are both consistent with the number of heat source convergence points, and at least two second connecting channels 304 are provided. Taking three heat sources as an example, three heat source convergence points, three evaporators 40, and three first connecting channels 303 are provided, and four second connecting channels 304 are provided. The three heat source convergence points, evaporators 40, and first connecting channels 303 are spaced apart in the left-right direction, and the four second connecting channels 304 are spaced apart in the left-right direction. A heat source convergence point, an evaporator 40, and a first connecting channel 303 are provided between two adjacent second connecting channels 304.

[0048] The key design feature of this invention is that it mainly increases the evaporation area by setting an evaporator at the heat source convergence position and having the capillary protrusions of the evaporator extend into the first chamber through the first connecting channel. This allows heat to be directly introduced into the first chamber, and the evaporating fluid in the first chamber is directly evaporated and conducted to the first heat dissipation fin group. The first heat dissipation fin group exchanges heat with the outside atmosphere. After the evaporating fluid cools down, it returns to the third capillary layer through the first and second capillary layers, greatly improving the heat dissipation efficiency and effect of high-power chips. Secondly, the first and second support components can achieve both support and heat conduction, further improving the heat dissipation effect. Furthermore, the combination of protrusions and concave areas allows for faster heat absorption.

[0049] The above description is merely a preferred embodiment of the present invention and does not constitute any limitation on the technical scope of the present invention. Therefore, any minor modifications, equivalent changes, and alterations made to the above embodiments based on the technical essence of the present invention shall still fall within the scope of the technical solution of the present invention.

Claims

1. A forced convection radiator, characterized in that: It includes a first heat dissipation fin assembly, a second heat dissipation fin assembly, and a heat spreader; The first heat dissipation fin group is disposed on the upper end surface of the heat exchange plate; The heat spreader has a first chamber, a second chamber, and a first connecting channel and a second connecting channel respectively connecting the first chamber and the second chamber; The first chamber is located above the second chamber and the two are spaced apart; a first capillary layer is formed on the inner bottom wall of the first chamber, and a second capillary layer is formed on the inner sidewalls of both the first and second connecting channels. A third capillary layer is formed on the inner bottom wall of the second chamber. The heat spreader is provided with a heat source convergence position for attaching and connecting the heat source on the outer bottom wall of the second chamber. An evaporator is provided in the second chamber corresponding to the heat source convergence position. Several capillary protrusions are provided on the upper end face of the evaporator. All capillary protrusions extend into the first chamber through the first connecting channel. The first connecting channel, the second connecting channel, and the second heat dissipation fin group are all located between the first chamber and the second chamber, and the first connecting channel and the second connecting channel are both located within the second heat dissipation fin group.

2. The forced convection radiator according to claim 1, characterized in that: The first capillary layer is connected to the second capillary layer, and the lower end of the second capillary layer, located on the inner sidewall of the second connecting channel, extends downward and abuts against the third capillary layer.

3. The forced convection radiator according to claim 1, characterized in that: The thickness of the first connecting channel is greater than the thickness of the second connecting channel.

4. The forced convection radiator according to claim 1, characterized in that: The inner top wall of the first chamber is connected to a first top plate, and the first capillary layer is connected to the first top plate through a first support member.

5. The forced convection radiator according to claim 1, characterized in that: The heat spreader includes a first cover plate, a first bottom plate, a second cover plate, and a second bottom plate arranged sequentially from top to bottom; The first heat dissipation fin assembly is disposed on the upper end face of the first cover plate, the first base plate has a first receiving cavity with an upper opening, the first cover plate and the first base plate are connected and the first cover plate is installed at the upper opening of the first receiving cavity to form a first chamber; the lower end face of the first base plate is provided with a first connecting protrusion and a second connecting protrusion, the first connecting channel extends upward from the lower end face of the first connecting protrusion through the first chamber, and the second connecting channel extends upward from the lower end face of the second connecting protrusion through the first chamber; The second heat dissipation fin group is located between the first base plate and the second cover plate. The second base plate has a second receiving cavity with an upper opening. The second cover plate is connected to the second base plate and is installed at the upper opening of the second receiving cavity to form a second chamber. The second cover plate has a first through hole and a second through hole, the first connecting protrusion is installed at the first through hole, and the second connecting protrusion is installed at the second through hole.

6. The forced convection radiator according to claim 5, characterized in that: The first cover plate has a cavity extending along its width direction, the cavity being located beside the first receiving cavity.

7. The forced convection radiator according to claim 5, characterized in that: The lower end face of the second cover plate is connected to a second top plate. The second top plate is provided with a third through hole and a fourth through hole respectively corresponding to the first through hole and the second through hole. The third through hole is connected to the first through hole. The first connecting protrusion passes through the first through hole, abuts against the second top plate, and covers the third through hole. The third through hole is connected to the first connecting channel. The fourth through hole connects to the second through hole, the second connecting protrusion passes through the second through hole and abuts against the second top plate and covers the third through hole, and the fourth through hole connects to the second connecting channel.

8. The forced convection radiator according to claim 7, characterized in that: The third capillary layer is connected to the second top plate via the second support member.

9. The forced convection radiator according to claim 5, characterized in that: The second heat dissipation fin group has a first clearance hole and a second clearance hole respectively corresponding to the first connecting protrusion and the second connecting protrusion. The first connecting protrusion passes through the first clearance hole and is installed at the first through hole, and the second connecting protrusion passes through the first clearance hole and is installed at the first through hole.

10. The forced convection radiator according to claim 1, characterized in that: At least two heat source convergence points are provided, and the number of both the evaporator and the first connecting channel is the same as the number of heat source convergence points. At least two second connecting channels are provided.

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