Display panel, display device and preparation method of display panel

Abstract

The invention provides a display panel, a display device and a preparation method of the display panel, the display panel comprises an array substrate, an isolation structure and a plurality of light emitting devices, the isolation structure defines a plurality of isolation openings, and the isolation structure comprises a first isolation layer, a second isolation layer and a third isolation layer which are sequentially stacked, the third isolation layer comprises a first end part and a second end part, the first end part and the second end part are arranged on the two opposite sides of the isolation opening in the second direction, and the second end part protrudes towards the center close to the isolation opening; the light-emitting device comprises a light-emitting layer and a first electrode which are stacked, and the first electrode is arranged on the side, away from the array substrate, of the light-emitting layer; corresponding to the same isolation opening, the midpoint from the first end to the second end is located on the side, close to the first end, of the center axis of the light-emitting layer, the edge of the light-emitting layer and the isolation structure are arranged at intervals, and the edge of the first electrode is electrically connected with the second end. The display panel can reduce or avoid electric leakage of the light-emitting layer to the isolation structure, and the display effect of the display panel is improved.

Description

Technical Field

[0001] This application relates to the field of display technology, and more specifically, to a display panel, a display device, and a method for manufacturing the display panel. Background Technology

[0002] Organic light-emitting diode (OLED) display technology is considered the most promising next-generation display technology. Compared with liquid crystal display technology, OLED display technology has advantages such as low energy consumption, low cost, self-emissiveness, wide viewing angle, and fast response speed.

[0003] In the traditional OLED display panel manufacturing process, a fine metal mask (FMM) is typically used to pattern the light-emitting pixels. FMM technology is mature and has extensive mass production experience. However, FMM technology also suffers from limitations in precision and high cost. Fine metal mask-less technology eliminates the limitations of traditional OLED processes on display size, resolution, and other screen performance characteristics, offering advantages such as high performance, full-size display, and agile delivery. Related descriptions of fine metal mask-less technology can be found in patents CN118251982A, 202410864269.8, PCT / CN2024 / 098407, PCT / CN2024 / 102783, PCT / CN2024 / 098217, PCT / CN2024 / 099419, and PCT / CN2024 / 099072, provided for reference.

[0004] The display panel has an isolation structure spaced between adjacent light-emitting devices. Each light-emitting device includes a light-emitting layer and a first electrode. The first electrode can overlap with the isolation structure to achieve electrical connection. In the fabricated display panel, the light-emitting layer is prone to overlapping with the isolation structure, causing the first electrode to leak current through the light-emitting layer to the isolation structure, thus affecting the display effect of the display panel. Summary of the Invention

[0005] To overcome the technical problems mentioned in the background, this application provides a display panel, which includes: Array substrate; An isolation structure is disposed on one side of an array substrate along a first direction. The isolation structure forms multiple isolation openings. The isolation structure includes a first isolation layer, a second isolation layer, and a third isolation layer stacked sequentially. The first isolation layer is disposed on the side of the second isolation layer away from the array substrate. The orthographic projection of the second isolation layer on the array substrate is located within the orthographic projection of the first isolation layer on the array substrate. The third isolation layer includes a first end and a second end. The first end and the second end are disposed on opposite sides of the isolation openings along a second direction. The second end protrudes towards the center of the isolation opening. Multiple light-emitting devices, at least a portion of which are disposed within an isolation opening, each light-emitting device including a stacked light-emitting layer and a first electrode, the first electrode being disposed on the side of the light-emitting layer facing away from the array substrate; In this configuration, corresponding to the same isolation opening, along the second direction, the midpoint between the first end and the second end is located on the side of the central axis of the light-emitting layer near the first end, the edge of the light-emitting layer is spaced apart from the isolation structure, the edge of the first electrode is electrically connected to the second end, and the first direction intersects the second direction.

[0006] According to an embodiment of the first aspect of this application, the maximum distance by which the first end protrudes toward the center of the isolation opening relative to the second isolation layer is H1, and the maximum distance by which the second end protrudes toward the center of the isolation opening is H2, where H1 < H2. According to an embodiment of the first aspect of this application, the area of ​​the second end facing away from the array substrate and in contact with the first electrode is S1, and the area of ​​the first electrode facing away from the array substrate is S2, where S1 = (8%~12%)*S2.

[0007] According to an embodiment of the first aspect of this application, the edge of the first electrode is spaced apart from the first end.

[0008] According to an embodiment of the first aspect of this application, the light-emitting layer includes a hole injection layer, which is spaced apart from the isolation structure.

[0009] According to an embodiment of the first aspect of this application, the orthographic projection of the first end on the array substrate is located within the orthographic projection of the second isolation layer on the array substrate; According to an embodiment of the first aspect of this application, the edge of the first electrode is spaced apart from the first end.

[0010] According to an embodiment of the first aspect of this application, the light-emitting layer includes a hole injection layer, which is spaced apart from the isolation structure.

[0011] According to an embodiment of the first aspect of this application, the display panel further includes: A pixel definition layer is disposed on the side of the isolation structure close to the array substrate. The pixel definition layer includes multiple pixel openings, which are connected to corresponding isolation openings. At least a portion of the light-emitting device is disposed within the pixel opening. According to an embodiment of the first aspect of this application, the second isolation layer extends from the surface of the first end away from the array substrate to the surface of the pixel definition layer away from the array substrate; Alternatively, the pixel definition layer, the first end, and the second isolation layer can be combined to form a groove.

[0012] According to an embodiment of the first aspect of this application, the edge of the first electrode also overlaps with the second insulating layer; According to an embodiment of the first aspect of this application, the first electrode includes a third end and a fourth end disposed along a second direction, the fourth end overlapping the second end, the maximum thickness of the third end along the first direction being H3, the maximum thickness of the fourth end along the first direction being H4, and H3 < H4.

[0013] According to an embodiment of the first aspect of this application, H4 > 150 angstroms.

[0014] According to an embodiment of the first aspect of this application, the third end is spaced apart from the third isolation layer.

[0015] According to an embodiment of the first aspect of this application, the display panel further includes: A pixel definition layer is disposed on the side of the isolation structure close to the array substrate. The pixel definition layer includes multiple pixel openings, which are connected to corresponding isolation openings. At least a portion of the light-emitting device is disposed within the pixel opening. The fourth end self-emissive layer extends sequentially along the pixel definition layer, the second end, and the second isolation layer on the side away from the array substrate.

[0016] According to an embodiment of the first aspect of this application, the display panel further includes: The first encapsulation layer includes a plurality of encapsulation portions, at least a portion of which is located within an isolation opening. The encapsulation portions are disposed on the side of the light-emitting device away from the array substrate. The orthographic projection of the encapsulation portion on the array substrate covers the orthographic projection of the light-emitting device on the array substrate. The encapsulation portion overlaps with the isolation structure. According to an embodiment of the first aspect of this application, the package portion is in contact with the surface of the first end facing away from the array substrate, and / or, a portion of the package portion is located between the first end and the first electrode.

[0017] According to an embodiment of the first aspect of this application, the third isolation layer includes a fifth end and a sixth end, which are disposed on opposite sides of the isolation opening along a third direction, and the midpoint between the fifth end and the sixth end is located on the central axis of the isolation opening; the first direction, the second direction and the third direction intersect each other; According to an embodiment of the first aspect of this application, the orthographic projection of the fifth end on the array substrate is located within the orthographic projection of the second isolation layer on the array substrate, and the orthographic projection of the sixth end on the array substrate is located within the orthographic projection of the second isolation layer on the array substrate. According to an embodiment of the first aspect of this application, the first electrode is spaced apart from the fifth end, and the first electrode is spaced apart from the sixth end.

[0018] According to an embodiment of the first aspect of this application, Multiple light-emitting devices include a first light-emitting device and a second light-emitting device. The light-emitting layer of the first light-emitting device is used to emit light of a first color, and the light-emitting layer of the second light-emitting device is used to emit light of a second color. The first color light and the second color light have different wavelengths. The plurality of first electrodes include a first sub-electrode in contact with a first light-emitting device and a second sub-electrode in contact with a second light-emitting device. Along the second direction, the midpoint between the first end and the second end is located on the side of the central axis of the light-emitting layer of the first light-emitting device near the first end, and the edge of the first sub-electrode overlaps with the second end. The third isolation layer includes a seventh end and an eighth end, which are disposed on opposite sides of the isolation opening along the fourth direction. The eighth end protrudes towards the center of the isolation opening relative to the second isolation layer. Along the fourth direction, the midpoint between the seventh end and the eighth end is located on the side of the central axis of the light-emitting layer of the second light-emitting device near the seventh end. The edge of the second sub-electrode overlaps with the eighth end. The first direction, the second direction, and the fourth direction intersect each other.

[0019] According to an embodiment of the first aspect of this application, the orthographic projection of the second end on the array substrate is located within the orthographic projection of the first isolation layer on the array substrate; Alternatively, the orthographic projection of the second end onto the array substrate overlaps with the orthographic projection of the first isolation layer onto the array substrate.

[0020] According to an embodiment of the first aspect of this application, the third insulating layer comprises at least one of molybdenum, titanium, titanium nitride, molybdenum-tungsten alloy, and molybdenum-niobium alloy; According to an embodiment of the first aspect of this application, the second insulating layer comprises at least one of aluminum, aluminum-neodymium alloy, aluminum-yttrium alloy, and aluminum-silicon alloy.

[0021] A second aspect of this application provides a display panel, the display panel comprising: Array substrate; An isolation structure is disposed on one side of an array substrate. The isolation structure forms multiple isolation openings. The isolation structure includes a first isolation layer, a second isolation layer, and a third isolation layer stacked sequentially. The first isolation layer is disposed on the side of the second isolation layer away from the array substrate. The orthographic projection of the second isolation layer on the array substrate is located within the orthographic projection of the first isolation layer on the array substrate. The third isolation layer includes a support portion and an overlapping portion connected along a second direction. The orthographic projection of the support portion on the array substrate is located within the orthographic projection of the second isolation layer on the array substrate. The overlapping portion is located on one side of the isolation opening and extends from one end of the isolation opening toward the central axis near the isolation opening. The orthographic projection of the overlapping portion on the array substrate does not overlap with the orthographic projection of the second isolation layer on the array substrate. Multiple light-emitting devices, at least a portion of which are disposed within an isolation opening, each light-emitting device including a stacked light-emitting layer and a first electrode, the first electrode being disposed on the side of the light-emitting layer facing away from the array substrate; The edge of the light-emitting layer is spaced apart from the isolation structure, one end of the first electrode along the second direction overlaps with the overlapping part, and the other end along the second direction is spaced apart from the support part.

[0022] An embodiment of the third aspect of this application provides a method for manufacturing a display panel, comprising: Provide array substrate; An isolation structure is formed on one side of the array substrate in the first direction. The isolation structure surrounds a plurality of isolation openings. The isolation structure includes a first isolation layer, a second isolation layer and a third isolation layer stacked in sequence. The first isolation layer is disposed on the side of the second isolation layer away from the array substrate. The orthographic projection of the second isolation layer on the array substrate is located within the orthographic projection of the first isolation layer on the array substrate. The third isolation layer includes a first end and a second end. The first end and the second end are disposed on opposite sides of the isolation openings along the second direction. The second end protrudes toward the center of the isolation opening. The evaporation source is controlled to sequentially evaporate a light-emitting material and a first conductive material layer. The light-emitting material located in the isolation opening forms a light-emitting layer, and the first conductive material layer located in the isolation opening forms a first electrode. Along the second direction, the midpoint between the first end and the second end is located on the side of the central axis of the light-emitting layer near the first end. The edge of the light-emitting layer is spaced apart from the isolation structure. The edge of the first electrode is electrically connected to the second end. The first direction intersects the second direction.

[0023] According to an embodiment of the third aspect of this application, controlling the evaporation source to sequentially deposit a luminescent material and a first conductive material layer includes: The vapor deposition source and the array substrate are controlled to move relative to each other along the second direction, and the vapor deposition source vapor deposits the light-emitting material onto the array substrate. The vapor deposition source and the array substrate are controlled to move relative to each other along the second direction. A first conductive material layer is vapor deposited onto the array substrate. The first conductive material layer falling into the isolation opening forms a first electrode. The first electrode includes a third end and a fourth end disposed along the second direction. The fourth end overlaps with the second end. The maximum thickness of the third end along the first direction is H3, and the maximum thickness of the fourth end along the first direction is H4, where H3 < H4.

[0024] An embodiment of the fourth aspect of this application provides a display device, which includes a display panel of any of the above embodiments, or a display panel prepared by any of the above embodiments.

[0025] According to the display panel, display device, and display panel fabrication method of the embodiments of this application, by setting the edge of the light-emitting layer to be spaced apart from the isolation structure, leakage of the light-emitting layer to the isolation structure is reduced or avoided, and crosstalk between adjacent light-emitting devices is avoided; by setting the second end to protrude towards the center of the isolation opening, and the midpoint between the first end and the second end being located on the side of the central axis of the light-emitting layer near the first end, the edge of the fabricated light-emitting layer is reduced or avoided from overlapping with the isolation structure, ensuring that the edge of the first electrode is effectively overlapped with the second end, so that the first electrode can be connected to the power through the isolation structure, thereby improving the display effect of the display panel. Attached Figure Description

[0026] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0027] Figure 1 This is a plan view of a display panel provided in an embodiment of this application; Figure 2 This is a partial cross-sectional view of a display panel provided in an embodiment of this application; Figure 3 This is a partial cross-sectional view of a display panel provided in an embodiment of this application; Figure 4 This is a partial cross-sectional view of a display panel provided in an embodiment of this application; Figure 5 This is a partial cross-sectional view of a display panel provided in an embodiment of this application; Figure 6 This is a partial circuit structure diagram of a display panel provided in an embodiment of this application; Figure 7 This is a partial cross-sectional view of a light-emitting layer provided in an embodiment of this application; Figure 8 This is a partial cross-sectional view of a display panel provided in an embodiment of this application; Figure 9 This is a partial cross-sectional view of a display panel provided in an embodiment of this application; Figure 10 This is a partial cross-sectional view of a display panel provided in an embodiment of this application; Figure 11 This is a partial cross-sectional view of a display panel provided in an embodiment of this application; Figure 12 This is a partial cross-sectional view of a display panel provided in an embodiment of this application; Figure 13 This is a partial planar schematic diagram of a display panel provided in an embodiment of this application; Figure 14 This is a three-dimensional structural diagram of a display device provided in an embodiment of this application.

[0028] Explanation of reference numerals in the attached figures: 10. Display panel; AA, display area; NA, non-display area; 1. Array substrate; 11. Transistor; 12. Planarization layer; SPX, sub-pixel; SPX1, first sub-pixel; SPX2, second sub-pixel; SPX3, third sub-pixel; 2. Isolation structure; 21. Second isolation layer; 22. First isolation layer; 23. Third isolation layer; 231. First end; 232. Second end; 233. Fifth end; 234. Sixth end; 235. Seventh end; 236. Eighth end; 237. Groove; 24. Isolation opening; 24a. First isolation opening; 24b. Second isolation opening; 24c. Third isolation opening; 3. Light-emitting device; 32. First electrode; 311. Third end; 312. Fourth end; 31. Light-emitting layer; 33. Second electrode; 3a. First light-emitting device; 3b. Second light-emitting device; 3c. Third light-emitting device; 4. Encapsulation section; 4a. First encapsulation section; 4b. Second encapsulation section; 4c. Third encapsulation section; 5. Second encapsulation layer; 6. Third encapsulation layer; 7. Pixel definition layer; 71. Pixel opening; Z, first direction; X, second direction; Y, third direction; V, fourth direction; W, fifth direction. Detailed Implementation

[0029] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0030] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0031] It should be noted that similar reference numerals and letters in the following figures indicate similar items; therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures. It should be noted that, unless otherwise specified, different features in the embodiments of this application can be combined with each other.

[0032] For ease of understanding, the accompanying diagram shows the mutually orthogonal X-axis, Y-axis, and Z-axis. The direction along the X-axis is called the X-direction, the direction along the Y-axis is called the Y-direction, and the direction along the Z-axis is called the Z-direction. The Z-direction is the normal direction relative to the plane containing the X and Y directions. Furthermore, a view where various elements are observed parallel to the plane containing the X and Y directions is called a top view. Alternatively, the planes in the X and Y directions can be planes parallel to the display surface of the display panel, and the Z-direction can be a direction parallel to the thickness direction of the display panel.

[0033] For certain elements, terms like "above" or "overhead" are sometimes used when describing the position of an element in the Z direction, and "below" or "under" are used when describing the position of an element in the opposite direction. Furthermore, when using terms like "above," "overhead," "below," "under," or "relative" to define the positional relationship between two elements, this includes not only the state where the two elements are directly adjacent, but also the state where the two elements are separated by gaps or other elements. Additionally, terms like "first," "second," and "third" are used only for distinguishing descriptions and should not be interpreted as indicating or implying relative importance.

[0034] Through long-term research, the inventors discovered that in related technologies, display panels often include isolation structures spaced between adjacent light-emitting devices. Each light-emitting device comprises a light-emitting layer and a first electrode, which can overlap with the isolation structure to achieve electrical connection. In the fabricated display panel, the light-emitting layer and the first electrode can be prepared using vapor deposition technology. However, while ensuring the first electrode overlaps with the isolation structure, the prepared light-emitting layer is prone to overlapping with the isolation structure. This can cause leakage current from the first electrode through the light-emitting layer to the isolation structure, affecting the display panel's display performance.

[0035] To address the aforementioned issues, this application provides a display panel, a method for manufacturing the display panel, and a display device. The following description, in conjunction with the accompanying drawings, will illustrate various embodiments of the display panel, the method for manufacturing the display panel, and the display device.

[0036] Please see Figure 1 , Figure 2 and Figure 3The display panel 10 includes an array substrate 1, an isolation structure 2, and multiple light-emitting devices 3. The isolation structure 2 is disposed on one side of the array substrate 1 along a first direction Z, and forms multiple isolation openings 24. The isolation structure 2 includes a first isolation layer 22, a second isolation layer 21, and a third isolation layer 23 stacked sequentially. The first isolation layer 22 is disposed on the side of the second isolation layer 21 facing away from the array substrate 1, and the orthographic projection of the second isolation layer 21 on the array substrate 1 is located within the orthographic projection of the first isolation layer 22 on the array substrate 1. The third isolation layer 23 includes a first end 231 and a second end 232, which are disposed along a second direction Z. The light-emitting device 3 is disposed on opposite sides of the isolation opening 24 in the direction X, and the second end 232 protrudes towards the center of the isolation opening 24; at least a portion of the light-emitting device 3 is disposed within the isolation opening 24, and the light-emitting device 3 includes a light-emitting layer 31 and a first electrode 32 stacked together, the first electrode 32 being disposed on the side of the light-emitting layer 31 away from the array substrate 1; wherein, the edge of the light-emitting layer 31 is spaced apart from the isolation structure 2, and along the second direction X, the midpoint between the first end 231 and the second end 232 is located on the side of the central axis L1 of the light-emitting layer 31 near the first end 231, the edge of the first electrode 32 is electrically connected to the second end 232, and the first direction Z intersects the second direction X.

[0037] The display panel 10 can be an organic light-emitting diode (OLED) display panel 10 or a quantum dot light-emitting diode (QLED) display panel 10. The display panel 10 includes a display area AA with display function and a non-display area NA.

[0038] The display area AA of the display panel 10 can be rectangular, square, circular, oval, or other shapes.

[0039] The display area AA includes a plurality of pixels PX arranged in the X and Y directions. Each pixel PX includes a plurality of sub-pixels SPX displaying different colors. In some embodiments, a pixel PX includes a first sub-pixel SPX1, a second sub-pixel SPX2, and a third sub-pixel SPX3. For example, the first sub-pixel SPX1 is a blue sub-pixel SPX2, the second sub-pixel SPX2 is a green sub-pixel SPX2, and the third sub-pixel SPX3 is a red sub-pixel SPX3. In some embodiments, in addition to sub-pixels SPX1, SPX2, and SPX3, a pixel PX also includes sub-pixels SPX that emit white or other colors of light.

[0040] Sub-pixels (SPX) include pixel circuits and light-emitting devices (3) driven by the pixel circuits to emit light of the corresponding color. First sub-pixel SPX1 includes a first light-emitting device (3a), second sub-pixel SPX2 includes a second light-emitting device (3b), and third sub-pixel SPX3 includes a third light-emitting device (3c). One pixel circuit drives at least one light-emitting device (3) to emit light. For example, display area AA includes a normal display area AA and a light-transmitting display area AA. The light-transmitting display area AA is a display area AA that corresponds to a sensor and has light-transmitting properties, while the normal display area AA is a display area AA that does not correspond to a sensor. In the normal display area AA, one pixel circuit drives one light-emitting device (3) to emit light, and in the light-transmitting display area AA, one pixel circuit drives one or more light-emitting devices (3) to emit light.

[0041] Please see Figure 4 and Figure 5 The array substrate 1 includes a pixel circuit layer and a planarization layer 12. The pixel circuit layer includes pixel circuits for driving the light-emitting device 3 to emit light. Figure 5 A transistor 11 in a pixel circuit is shown. A via is provided in the planarization layer 12, and a second electrode 33 is electrically connected to the transistor 11 in the pixel circuit layer through the via. Furthermore, the pixel circuit layer includes at least one insulating layer, which may include at least one of an inorganic layer and an organic layer. Additionally, the array substrate 1 includes scan lines providing the scan signal Scan and data lines providing the data signal Data to the pixel circuit.

[0042] Please refer to the following: Figure 6 The pixel circuit includes a driving transistor T1 and a data transistor T2. The source of the data transistor T2 is connected to the data line that provides the data signal Data, the gate of the data transistor T2 is connected to the scan line that provides the scan signal Scan, and the drain of the data transistor T2 is connected to the gate of the driving transistor T1. The two ends of the storage capacitor C1 are respectively connected to the gate and the source of the driving transistor T1, and the drain of the driving transistor T1 is connected to the light-emitting device 3. Figure 5 This is one implementation of a pixel circuit; the pixel circuit described in this application is not limited to... Figure 6 The 2T1C pixel circuit shown can also be other pixel circuits, such as 7T1C, 8T1C pixel circuits, etc.

[0043] Please see Figure 4An isolation structure 2 is located on one side of the array substrate 1 and encloses multiple isolation openings 24, including multiple first isolation openings 24a, multiple second isolation openings 24b, and multiple third isolation openings 24c. Multiple light-emitting devices 3 are located on one side of the array substrate 1, and include multiple first light-emitting devices 3a, multiple second light-emitting devices 3b, and multiple third light-emitting devices 3c. First light-emitting devices 3a are positioned corresponding to first isolation openings 24a, second light-emitting devices 3b are positioned corresponding to second isolation openings 24b, and third light-emitting devices 3c are positioned corresponding to third isolation openings 24c. In one embodiment, one light-emitting device 3 is corresponding to one isolation opening 24. For example, one-to-one correspondence between first light-emitting devices 3a and first isolation openings 24a, one-to-one correspondence between second light-emitting devices 3b and second isolation openings 24b, and one-to-one correspondence between third light-emitting devices 3c and third isolation openings 24c. At least a portion of the first light-emitting device 3a is disposed within a corresponding first isolation opening 24a, at least a portion of the second light-emitting device 3b is disposed within a corresponding second isolation opening 24b, and at least a portion of the third light-emitting device 3c is disposed within a corresponding third isolation opening 24c. In another embodiment, multiple light-emitting devices 3 are correspondingly disposed with one isolation opening 24; for example, multiple light-emitting devices 3 with the same emitting color are corresponding to one isolation opening 24.

[0044] The isolation structure 2 includes a third isolation layer 23, a second isolation layer 21, and a first isolation layer 22 stacked along a direction away from the array substrate 1 (i.e., the Z direction). The orthographic projection of the second isolation layer 21 onto the array substrate 1 lies within the orthographic projection of the first isolation layer 22 onto the array substrate 1, meaning the width of the first isolation layer 22 is greater than the width of the second isolation layer 21. Consequently, the two ends of the first isolation layer 22 protrude relative to the sides of the second isolation layer 21, and this shape of the isolation structure 2 is also referred to as a hanging shape. The first isolation layer 22 and the second isolation layer 21, which form the sidewalls of the isolation opening 24, can be symmetrically arranged with respect to the central axis L1 of the light-emitting layer 31. The third isolation layer 23 includes a first end 231 and a second end 232, which are disposed along the second direction X on opposite sides of the isolation opening 24, meaning the first end 231 and the second end 232 enclose a portion of the isolation opening 24.

[0045] The first light-emitting device 3a, the second light-emitting device 3b, and the third light-emitting device 3c emit light of different colors. Each of these devices includes a second electrode 33, a light-emitting layer 31, and a first electrode 32 stacked together. The first electrode 32 and the second electrode 33 work together to power the light-emitting device 3. The orthographic projection of the light-emitting device 3 onto the array substrate 1 lies within the orthographic projection of the first electrode 32 onto the array substrate 1. The first electrodes 32 of the first light-emitting device 3a, the second light-emitting device 3b, and the third light-emitting device 3c respectively cover the corresponding light-emitting layer 31. The first electrode 32 is electrically connected to the isolation structure 2. For example, the first electrode 32 is connected to the third isolation layer 23 of the isolation structure 2. The second electrode 33 can be an anode, and the first electrode 32 can be a cathode. The second electrode 33 of each light-emitting device 3 can be connected to the pixel circuit through vias, so that the pixel circuit drives the light-emitting device 3 to emit light.

[0046] Figure 7 This is a schematic diagram of the light-emitting layer 31 according to one embodiment of this application. The light-emitting layer 31 of at least one of the first light-emitting device 3a, the second light-emitting device 3b, and the third light-emitting device 3c includes a hole injection layer HIL, a hole transport layer HTL, an electron blocking layer EBL, a light-emitting material layer EML, a hole blocking layer HBL, an electron transport layer ETL, and an electron injection layer EIL stacked along a direction away from the array substrate 1 (i.e., the Z direction). The light-emitting layer 31 may include a single light-emitting material layer EML, or a stacked light-emitting layer 31 including multiple light-emitting material layers EML.

[0047] In order for the light-emitting layer 31 to emit light, a pixel voltage is provided to the second electrode 33 and a common voltage is provided to the first electrode 32, respectively, forming a potential difference between the second electrode 33 and the first electrode 32, so that the light-emitting layer 31 disposed between the second electrode 33 and the first electrode 32 emits light. In one embodiment, if a potential difference is formed between the second electrode 33 and the first electrode 32 of the first light-emitting device 3a, the light-emitting material layer EML of the light-emitting layer 31 emits blue light; if a potential difference is formed between the second electrode 33 and the first electrode 32 of the second light-emitting device 3b, the light-emitting material layer EML of the light-emitting layer 31 emits green light; and if a potential difference is formed between the second electrode 33 and the first electrode 32 of the third light-emitting device 3c, the light-emitting material layer EML of the light-emitting layer 31 emits red light.

[0048] In this configuration, the pixel voltage of the second electrode 33 is provided by the pixel circuit, while the common voltage of the first electrode 32 is provided by the isolation structure 2. Specifically, the first electrode 32 is electrically connected to the isolation structure 2, and the common voltage is supplied to the first electrode 32 by providing the isolation structure 2. That is, the isolation structure 2 has the function of supplying a common voltage to the first electrode 32.

[0049] The display panel 10 may also include at least one film layer such as a polarizer, a color filter array substrate 1, and a protective cover. This film layer may also be bonded to the display panel 10 via an adhesive layer such as OCA (Optical Clear Adhesive).

[0050] The portion formed by the first end 231 to the second end 232 along the second direction X together encloses the same isolation opening 24, that is, the first end 231 to the second end 232 along the second direction X correspond to the same isolation opening 24. The light-emitting device 3 corresponds to the isolation opening 24 in which it is located.

[0051] When fabricating the display panel 10, during the deposition of the light-emitting material used to prepare the light-emitting layer 31 onto the array substrate 1, the light-emitting material is suspended and broken as described above. Part of the light-emitting material falls onto the first isolation layer 22, and part falls into the isolation opening 24. The light-emitting material falling into the isolation opening 24 forms the light-emitting layer 31. The central axis L1 of the formed light-emitting layer 31 can be coaxial with the central axis of the sidewall of the third isolation layer 23 forming the isolation opening 24. In a cross-section of the display panel 10 along the second direction X, the central axis L1 of the light-emitting layer 31 is an axis along the first direction Z passing through the midpoint between the two ends of the light-emitting layer 31. The central axis of the sidewall of the third isolation layer 23 forming the isolation opening 24 is an axis along the first direction Z passing through the midpoint between the two ends of the third isolation layer 23 forming the isolation opening 24. The midpoint between the first end 231 and the second end 232 is located on the side of the central axis L1 of the light-emitting layer 31 closer to the first end 231. Figure 3 The diagram shows an axis L2 extending along the first direction Z past the midpoint. The midpoint between the first end 231 and the second end 232 is located on the side of the central axis L1 of the light-emitting layer 31 near the first end 231. This facilitates the spacing between the light-emitting material falling within the isolation opening 24 and the second end 232. This spacing between the light-emitting material and the isolation structure 2 ensures that the edge of the prepared light-emitting layer 31 is spaced apart from the isolation structure 2, thus eliminating direct connection between the light-emitting layer 31 and the isolation structure 2. During the fabrication of the display panel 10, when the first conductive material used to prepare the first electrode 32 is deposited onto the array substrate 1, the first conductive material is suspended as described above. Part of the first conductive material falls onto the first isolation layer 22, and part falls into the isolation opening 24. The first conductive material falling into the isolation opening 24 forms the first electrode 32. Since the second end 232 protrudes towards the central axis L1 of the light-emitting layer 31 relative to the second isolation layer 21, it ensures that the first conductive material falling into the isolation opening 24 falls on the second end 232, so that the edge of the formed first electrode 32 overlaps with the second end 232.

[0052] In the display panel 10 provided in this application, by setting the edge of the light-emitting layer 31 to be spaced apart from the isolation structure 2, leakage of the light-emitting layer 31 to the isolation structure 2 is reduced or avoided, and crosstalk between adjacent light-emitting devices 3 is avoided. By setting the second end 232 to protrude towards the center of the isolation opening 24, and the midpoint between the first end 231 and the second end 232 is located on the side of the central axis L1 of the light-emitting layer 31 near the first end 231, the edge of the prepared light-emitting layer 31 is reduced or avoided from overlapping with the isolation structure 2, ensuring that the edge of the first electrode 32 is effectively overlapped with the second end 232, so that the first electrode 32 can be connected to the power through the isolation structure 2, thereby improving the display effect of the display panel 10.

[0053] The position of the midpoint between the first end 231 and the second end 232 is related to the position of the second end 232. The greater the length of the second end 232 protruding into the isolation opening 24, the greater the distance from the midpoint between the first end 231 and the second end 232 to the central axis L1 of the light-emitting layer 31. The position of the midpoint between the first end 231 and the second end 232 is also related to the position of the first end 231. The first end 231 may protrude towards the center of the isolation opening 24 relative to the second isolation layer 21, be flush with the second isolation layer 21, or be recessed towards the center of the isolation opening 24 relative to the second isolation layer 21.

[0054] Please see Figure 8 In some embodiments, the maximum distance by which the first end 231 protrudes toward the center of the isolation opening 24 relative to the second isolation layer 21 is H1, and the maximum distance by which the second end 232 protrudes toward the center of the isolation opening 24 is H2, where H1 < H2.

[0055] By setting H1 < H2, that is, by setting the distances at which the first end 231 and the second end 232 protrude toward the center of the isolation opening 24 to be different, the midpoint between the first end 231 and the second end 232 is located on the side of the central axis L1 of the light-emitting layer 31 closer to the first end 231, so as to ensure that the second end 232 is effectively connected to the first electrode 32.

[0056] In some embodiments, the area of ​​the second end 232 facing away from the array substrate 1 and in contact with the first electrode 32 is S1, and the area of ​​the first electrode 32 facing away from the array substrate 1 is S2, where S1 = (8%~12%)*S2. Setting S1 = (8%~12%)*S2 ensures that there is sufficient contact area between the second end 232 and the first electrode 32 to ensure a stable electrical connection between them.

[0057] In some embodiments, the edge of the first electrode 32 is spaced from the first end 231 to ensure that the light-emitting layer 31 is spaced from the first end 231.

[0058] In some embodiments, the light-emitting layer 31 includes a hole injection layer HIL, which is spaced apart from the isolation structure 2.

[0059] Please see Figure 9 In other embodiments, the orthographic projection of the first end 231 on the array substrate 1 is located within the orthographic projection of the second isolation layer 21 on the array substrate 1.

[0060] The first end 231 can be recessed relative to the second isolation layer 21 in a direction away from the center of the isolation opening 24, or the wall surface of the first end 231 forming the isolation opening 24 can be flush with the wall surface of the second isolation layer 21 forming the isolation opening 24. Setting the orthogonal projection of the first end 231 on the array substrate 1 to be within the orthogonal projection of the second isolation layer 21 on the array substrate 1 is beneficial for achieving a spaced arrangement between the light-emitting layer 31 and the first end 231.

[0061] Optionally, the edge of the first electrode 32 is spaced from the first end 231.

[0062] In one embodiment, the display panel 10 may further include a pixel definition layer 7, which is disposed on the side of the isolation structure 2 near the array substrate 1. The pixel definition layer 7 includes a plurality of pixel openings 71, which are connected to corresponding isolation openings 24. At least a portion of the light-emitting device 3 is disposed within the pixel openings 71.

[0063] The isolation structure 2 is disposed on the pixel definition layer 7. The pixel definition layer 7 has pixel openings 71 communicating with the isolation openings 24. Specifically, the pixel definition layer 7 has a first pixel opening 71a communicating with the first isolation opening 24a, a second pixel opening 71b communicating with the second isolation opening 24b, and a third pixel opening 71c communicating with the third isolation opening 24c. The areas of the orthographic projections of the first pixel opening 71a, the second pixel opening 71b, and the third pixel opening 71c on the array substrate 1 may be the same or different. The shapes of the orthographic projections of the pixel openings 71 and the corresponding isolation openings 24 on the array substrate 1 may be the same or different. Generally, the area of ​​the orthographic projection of the isolation opening 24 on the array substrate 1 is located within the orthographic projection of the pixel opening 71 communicating with the isolation opening 24 on the array substrate 1. The orthographic projections of the pixel openings 71 of the light-emitting device 3 on the array substrate 1 overlap with the orthographic projections of the isolation openings 24 on the array substrate 1. The pixel definition layer 7 is made of inorganic materials, such as inorganic insulating materials made of at least one of silicon nitride (SiNx), silicon oxide (SiOx), and silicon oxynitride (SiON).

[0064] In another embodiment, a portion of the isolation structure 2 is disposed within a groove in the pixel definition layer 7.

[0065] In some embodiments, the second electrode 33 is disposed on the array substrate 1, and the pixel definition layer 7 covers the end of the second electrode 33. The pixel definition layer 7 has a pixel opening 71 through which the second electrode 33 is exposed. The light-emitting layers 31 of the first light-emitting device 3a, the second light-emitting device 3b, and the third light-emitting device 3c cover the sidewall of the pixel opening 71 of the pixel definition layer 7 and the side of the pixel definition layer 7 facing away from the array substrate 1. Each light-emitting layer 31 is located within the pixel opening 71 and is in contact with the second electrode 33.

[0066] The second electrode 33 may include a multilayer structure, such as a reflective layer and a pair of conductive oxide layers covering the upper and lower surfaces of the reflective layer, respectively. The reflective layer can be formed, for example, using silver, a metallic material with excellent light reflectivity. Each conductive oxide layer can be formed, for example, from a transparent conductive oxide such as ITO (Indium Tin Oxide), IZO (Indium Zinc Oxide), or IGZO (Indium Gallium Zinc Oxide). The second electrode 33 can be formed, for example, from a metallic material such as an alloy of magnesium and silver (MgAg).

[0067] In some embodiments, the second isolation layer 21 extends from the surface of the first end 231 away from the array substrate 1 to the surface of the pixel definition layer 7 away from the array substrate 1.

[0068] A patterned third isolation layer 23 can be prepared first, and then a second isolation material can be placed on the third isolation layer 23. The second isolation material can be etched to obtain a patterned second isolation layer 21. The second isolation layer 21 covers the surface of the first end 231 facing away from the array substrate 1, and also covers the sidewall of the first end 231 near the isolation opening 24. A portion of the second isolation layer 21 is in contact with the pixel definition layer 7.

[0069] Please see Figure 10 In other embodiments, the pixel definition layer 7, the first end 231, and the second isolation layer 21 enclose and form a groove 237.

[0070] During the fabrication of the display panel 10, the groove 237 is connected to the isolation opening 24, and the encapsulation layer fabricated later can fill or seal the groove 237.

[0071] In some embodiments, the edge of the first electrode 32 overlaps with the second isolation layer 21, that is, the first electrode 32 overlaps not only with the second end 232, but also with the second isolation layer 21, thereby improving the stability of the electrical connection between the first electrode 32 and the isolation structure 2.

[0072] In some embodiments, the first electrode 32 includes a third end 311 and a fourth end 312 disposed along the second direction X, the fourth end 312 overlapping the second end 232, the maximum thickness of the third end 311 along the first direction Z is H3, the maximum thickness of the fourth end 312 along the first direction Z is H4, and H3 < H4.

[0073] Setting H3 < H4 ensures sufficient first conductive material to form a connection between the fourth end 312 and the second end 232, preventing or reducing the risk of breakage at the fourth end 312. The area where the first electrode 32 connects to the second end 232 is smaller than the area around the first electrode 32 connected to the isolation structure 2. Setting H3 < H4 increases the connection area between the first electrode 32 and the isolation structure 2, reducing impedance. Optionally, both the third end 311 and the fourth end 312 are located on the side of the pixel definition layer 7 facing away from the array substrate 1.

[0074] In some embodiments, H4 > 150 angstroms to ensure that the fourth end 312 has sufficient thickness to reduce the impedance between the fourth end 312 and the second end 232.

[0075] In some embodiments, the third end 311 is spaced apart from the third isolation layer 23 to ensure that the light-emitting layer 31 is spaced apart from the first end 231.

[0076] In some embodiments, the self-emissive layer 31 of the fourth end 312 extends sequentially along the pixel definition layer 7, the second end 232, and the second isolation layer 21 on the side opposite to the array substrate 1.

[0077] The first conductive material falls within the isolation opening 24. The first conductive material falls on the side of the light-emitting layer 31 away from the array substrate 1, the pixel definition layer 7, the second end 232, and the second isolation layer 21. The first electrode 32 formed by the self-emitting layer 31 extends sequentially along the pixel definition layer 7, the second end 232, and the second isolation layer 21 on the side of the self-emitting layer 31 away from the array substrate 1.

[0078] Please see Figure 11 In some embodiments, the display panel 10 further includes a first encapsulation layer, which includes a plurality of encapsulation portions 4. At least a portion of the encapsulation portions 4 are located within the isolation opening 24. The encapsulation portions 4 are disposed on the side of the light-emitting device 3 away from the array substrate 1. The orthographic projection of the encapsulation portions 4 on the array substrate 1 covers the orthographic projection of the light-emitting device 3 on the array substrate 1. The encapsulation portions 4 overlap with the isolation structure 2.

[0079] The encapsulation portion 4 includes a first extension, an encapsulation sub-portion, and a second extension sequentially connected along the second direction X. The encapsulation sub-portion is located on the side of the light-emitting device 3 facing away from the array substrate 1. The first extension is located on the side of the first end 231 facing away from the array substrate 1 and overlaps with the isolation structure 2. The second extension is located on the side of the second end 232 facing away from the array substrate 1 and overlaps with the isolation structure 2. Optionally, at least a portion of the encapsulation portion 4 is located on the side of the isolation structure 2 facing away from the array substrate 1. The encapsulation portion 4 extends through the sidewall of the isolation structure 2 to the side of the isolation structure 2 facing away from the array substrate 1. The plurality of encapsulation portions 4 include a plurality of first encapsulation portions 4a corresponding to a plurality of first light-emitting devices 3a, a plurality of second encapsulation portions 4b corresponding to a plurality of second light-emitting devices 3b, and a plurality of third encapsulation portions 4c corresponding to a plurality of third light-emitting devices 3c. The first encapsulation portion 4a is disposed on the side of the corresponding first light-emitting device 3a that is away from the array substrate 1, the second encapsulation portion 4b is disposed on the side of the corresponding second light-emitting device 3b that is away from the array substrate 1, and the third encapsulation portion 4c is disposed on the side of the corresponding third light-emitting device 3c that is away from the array substrate 1.

[0080] The display panel 10 also includes a second encapsulation layer 5 and a third encapsulation layer 6. The second encapsulation layer 5 covers the isolation structure 2 and the encapsulation portion 4, and the third encapsulation layer 6 covers the second encapsulation layer 5. Both the first encapsulation layer and the third encapsulation layer 6 are inorganic materials, and the materials of the first encapsulation layer and the third encapsulation layer 6 include at least one of silicon nitride (SiN), silicon oxide (SiO), and silicon oxynitride (SiON). The second encapsulation layer 5 is an organic insulating material, such as epoxy resin, acrylic resin, or other resin materials. The second encapsulation layer 5 and the third encapsulation layer 6 are continuously disposed at least over the entire display area AA, with a portion of them also disposed in the bezel area NA.

[0081] In some embodiments, the encapsulation portion 4 contacts the surface of the first end portion 231 away from the array substrate 1, and a portion of the encapsulation portion 4 is located between the first end portion 231 and the first electrode 32.

[0082] When the first end 231 and the first electrode 32 are spaced apart, the encapsulation portion 4, which is then prepared, can be filled between the first end 231 and the first electrode 32 to encapsulate the first end 231 and the first electrode 32.

[0083] In some embodiments, the third isolation layer 23 includes a fifth end 233 and a sixth end 234, which are disposed on opposite sides of the isolation opening 24 along a third direction Y. The midpoint between the fifth end 233 and the sixth end 234 is located on the central axis of the isolation opening 24. The first direction Z, the second direction X, and the third direction Y intersect each other.

[0084] In some embodiments, the orthographic projection of the fifth end 233 on the array substrate 1 is located within the orthographic projection of the second isolation layer 21 on the array substrate 1, and the orthographic projection of the sixth end 234 on the array substrate 1 is located within the orthographic projection of the second isolation layer 21 on the array substrate 1.

[0085] In some embodiments, the first electrode 32 is spaced apart from the fifth end 233, and the first electrode 32 is spaced apart from the sixth end 234.

[0086] In some embodiments, the first electrodes 32 corresponding to the first light-emitting device 3a, the second light-emitting device 3b, and the third light-emitting device 3c are all connected to the second end 232. Optionally, the isolation structure 2 is in the form of a mesh, and the isolation openings 24 are arranged in an array to improve the light emission uniformity of the light-emitting devices 3. In the third isolation layer 23 between adjacent light-emitting devices 3 along the second direction X, a portion is the first end 231 corresponding to one of the light-emitting units, and a portion is the second end 232 corresponding to another light-emitting unit.

[0087] In other embodiments, at least one of the first electrodes 32 corresponding to the first light-emitting device 3a, the second light-emitting device 3b, and the third light-emitting device 3c overlaps with the third isolation layer 23 on its periphery, and at least one of the edges overlaps with the third isolation layer 23 and is spaced apart from the isolation structure 2.

[0088] Please see Figure 12 and Figure 13 In other embodiments, the plurality of light-emitting devices 3 include a first light-emitting device 3a and a second light-emitting device 3b. The light-emitting layer 31 of the first light-emitting device 3a is used to emit a first color light, and the light-emitting layer 31 of the second light-emitting device 3b is used to emit a second color light. The first color light and the second color light have different wavelengths. The plurality of first electrodes 32 include a first sub-electrode that contacts the first light-emitting device 3a and a second sub-electrode that contacts the second light-emitting device 3b. The midpoint between the first end 231 and the second end 232 is located on the side of the central axis of the light-emitting layer 31 of the first light-emitting device 3a that is close to the first end 231. The edge of the first sub-electrode overlaps with the second end 232. The third isolation layer 23 includes a seventh end 235 and an eighth end 236. The seventh end 235 and the eighth end 236 are disposed on opposite sides of the isolation opening 24 along the fourth direction V. The eighth end 236 protrudes towards the center of the isolation opening 24 relative to the second isolation layer 21. Along the fourth direction V, the midpoint between the seventh end 235 and the eighth end 236 is located on the side of the central axis L1 of the light-emitting layer 31 of the second light-emitting device 3b near the seventh end 235. The edge of the second sub-electrode overlaps with the eighth end 236. The first direction Z, the second direction X and the fourth direction V intersect each other.

[0089] The second direction X and the fourth direction V can be located in the same plane perpendicular to the first direction Z. Since the light-emitting device 3 emitting the same color of light and the corresponding first electrode 32 can be fabricated simultaneously, and the light-emitting devices 3 emitting different colors of light can be fabricated stepwise, the morphology of the third isolation layer 23 corresponding to different light-emitting devices 3 can be differentiated. The different directional ends of the first electrode 32 corresponding to the first light-emitting device 3a and the second light-emitting device 3b overlap with the end of the third isolation layer 23 that protrudes more from the light-emitting layer 31.

[0090] Please see Figure 10 In some embodiments, the surface of the first isolation layer 22 facing away from the array substrate 1 has a smaller projected area on the array substrate 1 than the surface of the first isolation layer 22 facing the array substrate 1.

[0091] The first isolation layer 22 extends outward by a predetermined distance relative to the second isolation layer 21. That is, the orthogonal projection area of ​​the surface of the first isolation layer 22 away from the array substrate 1 on the array substrate 1 is smaller than the orthogonal projection area of ​​the surface of the first isolation layer 22 close to the array substrate 1 on the array substrate 1, so that the first isolation layer 22 has an inclined ramp structure, so as to define the pattern of the light-emitting device 3 through the first isolation layer 22.

[0092] In some embodiments, the cross-sectional area of ​​the first isolation layer 22 gradually decreases in the direction away from the array substrate 1.

[0093] Optionally, the cross-section of the first isolation layer 22 is a trapezoid with the bottom edge facing the array substrate 1, so that the first isolation layer 22 has a sloping surface, which is beneficial to the material being prepared being broken at the partition edge, forming a state in which part of the material is prepared on the first isolation layer 22 and part of the material is prepared in the isolation opening 24.

[0094] In some embodiments, the surface of the second isolation layer 21 facing away from the array substrate 1 has a smaller projected area on the array substrate 1 than the surface of the first isolation layer 22 facing the array substrate 1.

[0095] That is, the first isolation layer 22 extends outward relative to the second isolation layer 21 to constrain the pattern of the light-emitting device 3. The area of ​​the first isolation layer 22 is larger than that of the second isolation layer 21, and it is completely covered by the second isolation layer 21. At this time, the second isolation layer 21 is recessed relative to the first isolation layer 22 in a direction away from the isolation opening 24. When the light-emitting device 3 is fabricated, at least part of the material used to fabricate the light-emitting device 3 has a large drop at the edge of the isolation structure 2, and the second isolation layer 21 is recessed. The material used to fabricate the light-emitting device 3 is difficult to connect on the outside of the isolation structure 2, resulting in breakage and forming mutually isolated light-emitting devices 3.

[0096] In some embodiments, the orthographic projection of the second end 232 on the array substrate 1 is located within the orthographic projection of the first isolation layer 22 on the array substrate 1, so as to reduce the possibility of the light-emitting layer 31 contacting the second end 232.

[0097] In other embodiments, the orthographic projection of the second end 232 on the array substrate 1 overlaps with the orthographic projection of the first isolation layer 22 on the array substrate 1, so as to increase the contact area between the first electrode 32 and the second end 232.

[0098] In some embodiments, the material of the third insulating layer 23 may include at least one of molybdenum (Mo), titanium (Ti), titanium nitride (TiN), molybdenum-tungsten alloy (MoW), or molybdenum-niobium alloy (MoNb).

[0099] The second isolation layer 21 and the first isolation layer 22 are made of different materials, and the etching rate of the first isolation layer 22 is lower than that of the second isolation layer 21. The material of the second isolation layer 21 includes conductive materials, specifically including at least one of aluminum (Al) and aluminum alloys, and the aluminum alloys may include at least one of aluminum-neodymium alloy (AlNd), aluminum-yttrium alloy (AlY), or aluminum-silicon alloy (AlSi). The first isolation layer 22 can be a single-layer structure or a multi-layer structure. When the first isolation layer 22 is a single-layer structure, the material of the first isolation layer 22 may include at least one of titanium, titanium nitride, molybdenum, tungsten, molybdenum-tungsten alloy, or molybdenum-niobium alloy. When the first isolation layer 22 is a multi-layer structure, one layer of the first isolation layer 22 may be made of at least one of titanium, titanium nitride, molybdenum, tungsten, molybdenum-tungsten alloy, or molybdenum-niobium alloy, and the other layer of the first isolation layer 22 may be made of conductive oxides or inorganic insulating materials, such as indium tin oxide (ITO) or indium zinc oxide (IZO).

[0100] Please see Figures 1 to 13The second aspect also provides a display panel 10, which includes an array substrate 1, an isolation structure 2, and a plurality of light-emitting devices 3. The isolation structure 2 is disposed on one side of the array substrate 1 along a first direction Z, and forms a plurality of isolation openings 24. The isolation structure 2 includes a first isolation layer 22, a second isolation layer 21, and a third isolation layer 23 stacked sequentially. The first isolation layer 22 is disposed on the side of the second isolation layer 21 away from the array substrate 1, and the orthographic projection of the second isolation layer 21 on the array substrate 1 is located within the orthographic projection of the first isolation layer 22 on the array substrate 1. The third isolation layer 23 includes a support portion and an overlapping portion connected along a second direction X, and the orthographic projection of the support portion on the array substrate 1 is located within the second isolation layer 23. Within the orthographic projection of the release layer 21 on the array substrate 1, the overlapping portion is located on one side of the isolation opening 24 and extends from one end of the isolation opening 24 toward the central axis near the isolation opening 24. The orthographic projection of the overlapping portion on the array substrate 1 does not overlap with the orthographic projection of the second isolation layer 21 on the array substrate. At least a portion of a plurality of light-emitting devices 3 are disposed within the isolation opening 24. The light-emitting device 3 includes a stacked light-emitting layer 31 and a first electrode 32. The first electrode 32 is disposed on the side of the light-emitting layer 31 away from the array substrate. The edge of the light-emitting layer 31 is spaced apart from the isolation structure 2. One end of the first electrode 32 along the second direction X overlaps with the overlapping portion, and the other end of the first electrode 32 along the second direction X is spaced apart from the support portion.

[0101] The overlapping portion can be set with reference to the second end 232 in the display panel 10 provided in the first aspect.

[0102] In some embodiments, the support portion may be provided with reference to the first end portion 231 of the display panel 10 provided in the first aspect.

[0103] In other embodiments, the third isolation layer 23 further includes a protrusion, and the protrusion, support portion, and overlapping portion are sequentially connected along the second direction X. The protrusion is located on one side of the isolation opening 24 and extends from one end of the isolation opening 24 toward the central axis near the isolation opening 24. The maximum distance by which the protrusion protrudes relative to the second isolation layer 21 toward the center of the isolation opening 24 is less than the maximum distance by which the overlapping portion protrudes relative to the second isolation layer 21 toward the center of the isolation opening 24. The protrusion may be provided with reference to the first end portion 231 in the display panel 10 provided in the first aspect.

[0104] The manufacturing method of the display panel 10 according to the embodiments of this application will be described below.

[0105] The manufacturing method of the display panel 10 includes: S100 provides an array substrate 1.

[0106] S200, an isolation structure 2 is formed on one side of the array substrate 1 in the first direction Z. The isolation structure 2 surrounds a plurality of isolation openings 24. The isolation structure 2 includes a first isolation layer 22, a second isolation layer 21 and a third isolation layer 23 stacked in sequence. The first isolation layer 22 is disposed on the side of the second isolation layer 21 away from the array substrate 1. The orthographic projection of the second isolation layer 21 on the array substrate 1 is located within the orthographic projection of the first isolation layer 22 on the array substrate 1. The third isolation layer 23 includes a first end 231 and a second end 232. The first end 231 and the second end 232 are disposed on opposite sides of the isolation openings 24 along the second direction X and protrude toward the center of the isolation openings 24. S300, control the evaporation source to sequentially evaporate luminescent material and first conductive material layer, luminescent material located in isolation opening 24 forms luminescent layer 31, first conductive material layer located in isolation opening 24 forms first electrode 32, the midpoint between the first end 231 and the second end 232 is located on the side of the central axis L1 of luminescent layer 31 near the first end 231, the edge of luminescent layer 31 is spaced apart from isolation structure 2, the edge of first electrode 32 is electrically connected to second end 232, the first direction Z intersects the second direction X; In S200, an isolation structure 2 is formed on one side of the array substrate 1. The isolation structure 2 is provided with a plurality of isolation openings 24, including a plurality of first isolation openings 24a, a plurality of second isolation openings 24b and a plurality of third isolation openings 24c.

[0107] In step S300, a first light-emitting material and a first conductive material layer are sequentially deposited using a vapor deposition source to fabricate the light-emitting layer 31 and the first electrode 32 of the first light-emitting device 3a. A corresponding encapsulation portion 4 for the first light-emitting device 3a is then fabricated. Since the film layer and the first encapsulation layer of the first light-emitting device 3a are fabricated as a single layer, the film layer and the first encapsulation layer of the first light-emitting device 3a are present at the locations of the multiple first isolation openings 24a, the multiple second isolation openings 24b, and the multiple third isolation openings 24c. The film layer and the first encapsulation layer of the first light-emitting device 3a at the locations of the multiple second isolation openings 24b and the multiple third isolation openings 24c are etched away, thereby forming the light-emitting layer 31 and the first electrode 32 of the first light-emitting device 3a, as well as the first encapsulation portion 4a of the first light-emitting device 3a, only at the locations of the multiple first isolation openings 24a. Based on the aforementioned steps, the light-emitting layer 31 and the first electrode 32 of the second light-emitting device 3b, as well as the second encapsulation part 4b of the second light-emitting device 3b, are respectively provided at the positions of the multiple second isolation openings 24b. The light-emitting layer 31 and the first electrode 32 of the third light-emitting device 3c, as well as the third encapsulation part 4c of the third light-emitting device 3c, are respectively provided at the positions of the multiple third isolation openings 24c.

[0108] In some embodiments, S300 includes: S310, control the evaporation source and the array substrate 1 to move relative to each other along the second direction X, and the evaporation source evaporates the light-emitting material onto the array substrate; S320, control the vapor deposition source and the array substrate 1 to move relative to each other along the second direction X, vapor deposit a first conductive material layer onto the array substrate 1, and the first conductive material layer falling into the isolation opening 24 forms a first electrode 32. The first electrode 32 includes a third end 311 and a fourth end 312 disposed along the second direction X. The fourth end 312 overlaps with the second end 232. The maximum thickness of the third end 311 along the first direction Z is H3, and the maximum thickness of the fourth end 312 along the first direction Z is H4, where H3 < H4.

[0109] The vapor deposition source and the array substrate 1 are positioned to move relative to each other along the second direction X, thereby improving the bonding stability between the vapor-deposited first conductive material layer and the third isolation layer 23. In some embodiments, the first conductive material layer also overlaps with the second isolation layer 21 to reduce the bonding impedance.

[0110] In some possible implementations, refer to Figure 14 This application also provides a display device, which includes the display panel 10 described in this application. This display device may include devices with image processing capabilities, such as mobile phones, desktop computers, laptops, tablets, in-vehicle displays, wearable devices, etc. Because this display device includes the display panel 10 described in this application, the reliability of this electronic device is higher.

[0111] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0112] The above embodiments merely illustrate several implementation methods of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A display panel, characterized in that, The display panel includes: Array substrate; An isolation structure is disposed on one side of the array substrate along a first direction. The isolation structure forms a plurality of isolation openings. The isolation structure includes a first isolation layer, a second isolation layer, and a third isolation layer stacked sequentially. The first isolation layer is disposed on the side of the second isolation layer away from the array substrate. The orthographic projection of the second isolation layer on the array substrate is located within the orthographic projection of the first isolation layer on the array substrate. The third isolation layer includes a first end and a second end. The first end and the second end are disposed on opposite sides of the isolation openings along a second direction. The second end protrudes toward the center of the isolation opening. Multiple light-emitting devices, at least a portion of which are disposed within the isolation opening, each light-emitting device comprising a stacked light-emitting layer and a first electrode, the first electrode being disposed on the side of the light-emitting layer facing away from the array substrate; In this context, corresponding to the same isolation opening, along the second direction, the midpoint between the first end and the second end is located on the side of the central axis of the light-emitting layer near the first end, the edge of the light-emitting layer is spaced apart from the isolation structure, the edge of the first electrode is electrically connected to the second end, and the first direction intersects the second direction.

2. The display panel according to claim 1, characterized in that, The maximum distance by which the first end protrudes toward the center of the isolation opening relative to the second isolation layer is H1, and the maximum distance by which the second end protrudes toward the center of the isolation opening is H2, where H1 < H2; Preferably, the area of ​​the second end facing away from the array substrate and in contact with the first electrode is S1, and the area of ​​the first electrode facing away from the array substrate is S2, where S1 = (8%~12%)*S2. Preferably, the edge of the first electrode is spaced apart from the first end; Preferably, the light-emitting layer includes a hole injection layer, which is spaced apart from the isolation structure.

3. The display panel according to claim 1, characterized in that, The orthographic projection of the first end on the array substrate is located within the orthographic projection of the second isolation layer on the array substrate; Preferably, the edge of the first electrode is spaced apart from the first end; Preferably, the light-emitting layer includes a hole injection layer, which is spaced apart from the isolation structure; Preferably, the display panel further includes: A pixel definition layer is disposed on the side of the isolation structure close to the array substrate. The pixel definition layer includes a plurality of pixel openings, which are connected to the corresponding isolation openings. At least a portion of the light-emitting device is disposed within the pixel opening. Preferably, the second isolation layer extends from the surface of the first end away from the array substrate to the surface of the pixel definition layer away from the array substrate; Alternatively, the pixel definition layer, the first end, and the second isolation layer may be combined to form a groove.

4. The display panel according to claim 1, characterized in that, The edge of the first electrode also overlaps with the second insulating layer.

5. The display panel according to claim 1, characterized in that, The first electrode includes a third end and a fourth end disposed along the second direction, the fourth end overlapping the second end, the maximum thickness of the third end along the first direction being H3, the maximum thickness of the fourth end along the first direction being H4, and H3 < H4; Preferably, H4 > 150 angstroms; Preferably, the third end is spaced apart from the third isolation layer.

6. The display panel according to claim 5, characterized in that, The display panel also includes: A pixel definition layer is disposed on the side of the isolation structure close to the array substrate. The pixel definition layer includes a plurality of pixel openings, which are connected to the corresponding isolation openings. At least a portion of the light-emitting device is disposed within the pixel opening. The fourth end extends sequentially from the side of the light-emitting layer away from the array substrate along the pixel definition layer, the second end, and the second isolation layer.

7. The display panel according to claim 2, characterized in that, The display panel also includes: The first encapsulation layer includes a plurality of encapsulation portions, at least a portion of which is located within the isolation opening. The encapsulation portion is disposed on the side of the light-emitting device facing away from the array substrate. The orthographic projection of the encapsulation portion on the array substrate covers the orthographic projection of the light-emitting device on the array substrate. The encapsulation portion overlaps with the isolation structure. Preferably, the encapsulation portion contacts the surface of the first end facing away from the array substrate, and / or a portion of the encapsulation portion is located between the first end and the first electrode.

8. The display panel according to claim 1, characterized in that, The third isolation layer includes a fifth end and a sixth end, which are disposed on opposite sides of the isolation opening along a third direction. The midpoint between the fifth end and the sixth end is located on the central axis of the isolation opening. The first direction, the second direction, and the third direction intersect each other. Preferably, the orthographic projection of the fifth end on the array substrate is located within the orthographic projection of the second isolation layer on the array substrate, and the orthographic projection of the sixth end on the array substrate is located within the orthographic projection of the second isolation layer on the array substrate; Preferably, the first electrode is spaced apart from the fifth end and the first electrode is spaced apart from the sixth end.

9. The display panel according to claim 1, characterized in that, The plurality of light-emitting devices include a first light-emitting device and a second light-emitting device. The light-emitting layer of the first light-emitting device is used to emit light of a first color, and the light-emitting layer of the second light-emitting device is used to emit light of a second color. The first color light and the second color light have different wavelengths. The plurality of first electrodes include a first sub-electrode in contact with the first light-emitting device and a second sub-electrode in contact with the second light-emitting device. Along the second direction, the midpoint between the first end and the second end is located on the side of the central axis of the light-emitting layer of the first light-emitting device near the first end, and the edge of the first sub-electrode overlaps with the second end. The third isolation layer includes a seventh end and an eighth end, which are disposed on opposite sides of the isolation opening along a fourth direction. The eighth end protrudes towards the center of the isolation opening relative to the second isolation layer. Along the fourth direction, the midpoint between the seventh end and the eighth end is located on the side of the central axis of the light-emitting layer of the second light-emitting device near the seventh end. The edge of the second sub-electrode overlaps with the eighth end. The first direction, the second direction, and the fourth direction intersect each other.

10. The display panel according to claim 1, characterized in that, The orthographic projection of the second end on the array substrate is located within the orthographic projection of the first isolation layer on the array substrate; Alternatively, the orthographic projection of the second end on the array substrate overlaps with the orthographic projection of the first isolation layer on the array substrate.

11. The display panel according to claim 1, characterized in that, The third isolation layer comprises at least one of molybdenum, titanium, titanium nitride, molybdenum-tungsten alloy, and molybdenum-niobium alloy; Preferably, the second insulating layer comprises at least one of aluminum, aluminum-neodymium alloy, aluminum-yttrium alloy, and aluminum-silicon alloy.

12. A display panel, characterized in that, The display panel includes: Array substrate; An isolation structure is disposed on one side of the array substrate, the isolation structure forming multiple isolation openings, the isolation structure including a first isolation layer, a second isolation layer and a third isolation layer stacked sequentially, the first isolation layer being disposed on the side of the second isolation layer away from the array substrate, the orthographic projection of the second isolation layer on the array substrate being located within the orthographic projection of the first isolation layer on the array substrate, the third isolation layer including a support portion and an overlapping portion connected along a second direction, the orthographic projection of the support portion on the array substrate being located within the orthographic projection of the second isolation layer on the array substrate, the overlapping portion being located on one side of the isolation opening and extending from one end of the isolation opening towards the central axis near the isolation opening, the orthographic projection of the overlapping portion on the array substrate not overlapping with the orthographic projection of the second isolation layer on the array substrate; Multiple light-emitting devices, at least a portion of which are disposed within the isolation opening, each light-emitting device comprising a stacked light-emitting layer and a first electrode, the first electrode being disposed on the side of the light-emitting layer facing away from the array substrate; The edge of the light-emitting layer is spaced apart from the isolation structure, one end of the first electrode along the second direction overlaps with the overlapping portion, and the other end along the second direction is spaced apart from the support portion.

13. A method for manufacturing a display panel, characterized in that, include: Provide array substrate; An isolation structure is formed on one side of the array substrate in a first direction. The isolation structure forms a plurality of isolation openings. The isolation structure includes a first isolation layer, a second isolation layer and a third isolation layer stacked sequentially. The first isolation layer is disposed on the side of the second isolation layer away from the array substrate. The orthographic projection of the second isolation layer on the array substrate is located within the orthographic projection of the first isolation layer on the array substrate. The third isolation layer includes a first end and a second end. The first end and the second end are disposed on opposite sides of the isolation openings along a second direction. The second end protrudes toward the center of the isolation opening. A light-emitting material and a first conductive material layer are sequentially deposited by a controlled evaporation source. The light-emitting material located within the isolation opening forms a light-emitting layer, and the first conductive material layer located within the isolation opening forms a first electrode. Along the second direction, the midpoint between the first end and the second end is located on the side of the central axis of the light-emitting layer near the first end. The edge of the light-emitting layer is spaced apart from the isolation structure. The edge of the first electrode is electrically connected to the second end. The first direction intersects the second direction.

14. The preparation method according to claim 13, characterized in that, The controlled evaporation source sequentially evaporates a luminescent material and a first conductive material layer, including: The vapor deposition source and the array substrate are controlled to move relative to each other along a second direction, and the vapor deposition source vapor deposits the light-emitting material onto the array substrate; The vapor deposition source and the array substrate are controlled to move relative to each other along the second direction, and the first conductive material layer is vapor deposited onto the array substrate. The first conductive material layer falling into the isolation opening forms a first electrode. The first electrode includes a third end and a fourth end disposed along the second direction. The fourth end overlaps with the second end. The maximum thickness of the third end along the first direction is H3, and the maximum thickness of the fourth end along the first direction is H4, where H3 < H4.

15. A display device, characterized in that, The display panel includes any one of claims 1 to 12, or a display panel prepared by the method of preparing a display panel as described in claim 13 or 14.

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