Method of forming fine pitch vertical lead interconnect structure

Abstract

A wire bonding method for forming a vertical wire interconnect structure includes the steps of: forming a wire bond at a bonding pad on a substrate using a wire bonding tool; removing the wire bonding tool from the bonding pad to extend a segment of bonding wire between the wire bonding tool and the wire bond; pressing a point on the section of the bonding wire between the capillary tube and the spherical wire bonding against a part of the wire bonding by using a wire bonding tool so as to form a weakened part of the bonding wire; and straightening the section of bonding wire by moving the wire bonding tool, and enabling the bonding wire to be broken at the weakening part to form the vertical wire interconnection structure.

Description

Technical Field

[0001] The present invention generally relates to techniques for forming lead interconnect structures for semiconductor packaging, and particularly to forming lead interconnect structures with vertical orientation. Background Technology

[0002] Wire bonding equipment can be used to form bonded via array (BVA) vertical wire interconnect structures at different locations on a substrate or on bonding pads. Various methods have been employed to form vertical interconnect structures on substrates. Typically, the process of forming a vertical interconnect structure at bonding pads on a substrate includes the following steps: transporting the bonding wire using a wire bonding tool such as a capillary tube; forming a weakening region on the bonding wire before or after bonding the free end of the bonding wire to the bonding pad; and breaking the bonding wire at the weakening region.

[0003] However, in existing technologies, weakened regions are typically formed by pressing a portion of the bonding wire against the surface of another location on the substrate. Therefore, these methods are less efficient in terms of manufacturing, as they require moving the wire bonding tool a considerable distance to form the weakened region. Consequently, these methods are unsuitable for applications with high manufacturing efficiency requirements, such as memory packaging and wafer-level bonding. Furthermore, pressing the bonding wire against the substrate surface can unintentionally cause dents, marks, or damage. Moreover, this pressing action requires leaving space on the substrate surface, which may be scarce and / or unavailable in small packages.

[0004] Therefore, it would be beneficial to provide an improved method for forming vertical lead interconnect structures on a substrate while avoiding the aforementioned drawbacks. Summary of the Invention

[0005] Therefore, the object of the present invention is to provide a wire bonding method for forming a vertical lead interconnect structure on a substrate, so as to overcome at least one of the above-mentioned problems in the prior art.

[0006] According to a first aspect of the present invention, a method for forming a vertical lead interconnect structure is provided. The method includes the steps of: forming a ball-shaped wire bond at a bonding pad on a substrate using a capillary; removing the capillary from the bonding pad to extend a section of the bonding lead located between the capillary and the ball-shaped wire bond; pressing a point on the section of the bonding lead between the capillary and the ball-shaped wire bond against a portion of the ball-shaped wire bond using the capillary to form a weakened portion of the bonding lead; and straightening the section of the bonding lead by moving the capillary and causing the bonding lead to break at the weakened portion to form the vertical lead interconnect structure.

[0007] According to a second aspect of the present invention, a wire bonding method is provided. The method includes the following steps: forming a wire bond at a bonding pad on a substrate using a wire bonding tool; removing the wire bonding tool from the bonding pad to extend a section of bonding wire located between the wire bonding tool and the wire bond; bending the section of bonding wire between the wire bonding tool and the wire bond into a loop structure; pressing a point on the section of bonding wire between the wire bonding tool and the wire bond adjacent to the loop structure against a portion of the wire bond using the wire bonding tool, thereby forming a weakened portion of the bonding wire at that point; and straightening the section of bonding wire by moving the wire bonding tool and causing the bonding wire to break at the weakened portion to form a vertical wire interconnect structure.

[0008] These and other features, aspects and advantages will be better understood in relation to the specification, the appended claims and the drawings. Attached Figure Description

[0009] Embodiments of the invention will now be described by way of example only with reference to the accompanying drawings, wherein...

[0010] Figures 1A to 1J The operation of a wire bonding apparatus used in a wire bonding method for forming a vertical lead interconnect structure at a bonding pad on a substrate, according to some embodiments of the present invention, is illustrated.

[0011] Figure 2 Some operations of forming bonding balls in a wire bonding apparatus according to some embodiments of the present invention are illustrated.

[0012] Figure 3A The wire bonding device is shown being manipulated to Figure 1D The location shown; Figure 3B An alternative method of manipulating the wire bonding device is shown to facilitate subsequent bending of the bonding wires.

[0013] Figure 4A Some embodiments of the invention are shown for use in, such as Figure 1D After the operation shown, as follows Figure 1E Operation of the wire bonding apparatus that forms a bend in the bonding wire shown; Figure 4B It shows that in such Figure 1E An enlarged view of the capillary tip of the wire bonding device when a bend is formed in the bonding wire.

[0014] Figure 5 It shows that in such Figure 1F The image shows an enlarged view of the capillary tip of the wire bonding apparatus when the bonding wire is bent and the capillary is lowered to create a weakened portion at a point on the bonding wire.

[0015] Figure 6An enlarged view of the bonding lead and the capillary tip is shown when the capillary causes the bonding lead to contact the neck of the ball lead bond according to some embodiments of the present invention.

[0016] Figure 7 An enlarged view of the bonding lead and capillary tip is shown when the bonding lead is pressed against the spherical portion of the ball-shaped lead bonding according to some embodiments of the present invention.

[0017] Figure 8 The illustration shows a method provided in an embodiment of the invention for forming a plurality of vertical lead interconnect structures on a substrate using a wire bonding apparatus.

[0018] In the accompanying drawings, similar parts are indicated by similar reference numerals. Detailed Implementation

[0019] Before discussing embodiments of the invention in more detail, an overview will first be provided. To improve the productivity of wire bonding methods for forming vertical lead interconnect structures and to improve the quality of the formed vertical lead interconnect structures, some embodiments of the invention provide a wire bonding method in which, after forming a wire bond by bonding a bonding wire to a bonding site on a substrate, a weakened portion of the bonding wire is formed by pressing a point on the bonding wire against a portion of the wire bond. The bonding wire may then break at the weakened portion to form a vertical lead interconnect structure.

[0020] According to some embodiments of the present invention, the wire bonding method includes the following steps:

[0021] Step 10: Form wire bonds at bonding pads on the substrate using a wire bonding tool. In some embodiments, the wire bonding includes ball wire bonding or wedge wire bonding. When the wire bonding includes ball wire bonding, the wire bonding tool is in the form of a capillary tube.

[0022] Step 11: Remove the wire bonding tool from the bond pad along the bond lead to extend a section of the bond lead between the wire bonding tool and the wire bond.

[0023] In this step, the length of the bonding lead located between the wire bonding tool and the wire bonding can be less than or substantially equal to the predetermined height of the vertical wire interconnect structure to be formed.

[0024] Step 12: Manipulate the wire bonding tool to form a weakened portion of the bonded wire by pressing a portion or point of the bonded wire between the wire bonding tool and the bonded wire against a portion of the bonded wire.

[0025] In some embodiments, the wire bonding tool is operated to bend the section of bond wire located between the wire bonding tool and the wire bond, thereby forming a ring structure between the wire bonding tool and the wire bond before pressing the portion or point of the bond wire against the portion of the formed spherical wire bond. The portion or point to be pressed is adjacent to the formed ring structure.

[0026] Before the section of bonded wire between the bending wire bonding tool and the wire bond, the wire bonding tool can move in a direction transverse to the axis of the wire bonding tool to form a bend point on the section of bonded wire, which facilitates the bending of the bonded wire and the formation of a ring structure. The bend point can be formed between the point to be weakened and the formed wire bond.

[0027] After the bend point is formed, if the length of the bonding lead between the wire bonding tool and the wire bond is less than the predetermined height of the vertical wire interconnect structure to be formed, the wire bonding tool can be moved to further extend the bonding lead between them before constructing the ring structure, so that the part or point to be pressed is located at the tip of the wire bonding tool.

[0028] If the wire bond is a ball wire bond, then this portion of the ball wire bond may include its spherical portion or neck. The spherical portion of the ball wire bond may include the side portion of the bond ball attached to the bond pad, while the neck of the ball wire bond may include the portion of the bond lead located above the bond ball.

[0029] Step 13: Use a wire bonding tool to pull the bonding wire, straighten it and break it at the weakened part to form a vertical wire interconnect structure.

[0030] In some embodiments of the present invention, the weakened portion of the bonding wire can be formed by a two-step weakening process. In the first weakening step, when the bonding wire is clamped by a wire clamp positioned at a fixed height relative to the bonding pad, the bonding wire is bent by moving a wire bonding tool, and the tip of the wire bonding tool is pressed against a portion or point of the bonding wire to weaken the bonding wire; then, in the second weakening step (i.e., the weakening step described in step 12 above), the wire bonding tool is further moved to construct a ring structure of the bonding wire, such that the portion or point on the bonding wire is pressed against a portion of the wire bond to further weaken it.

[0031] Figures 1A to 1J Operation of a wire bonding apparatus 100 used in a wire bonding method for forming a vertical lead interconnect structure 20 at a bonding pad 202 on a substrate 201, according to some embodiments of the present invention, is illustrated. See also Figure 1AThe wire bonding apparatus 100 includes a lead holding mechanism and a capillary tube 101 positioned axially aligned with the lead holding mechanism. The lead holding mechanism includes a proximal lead clamp 102 and a distal lead clamp 103 relative to the capillary tube 101. The two lead clamps 102 and 103 are operable separately to independently clamp or release the bonding lead 104. The distal lead clamp 103 has a generally fixed height, while the proximal lead clamp 102 is independently movable along the axial direction of the bonding lead 104, as explained in more detail below. Other components of the wire bonding apparatus 100 are omitted for clarity.

[0032] Figure 1A and Figure 1B The operation of the wire bonding apparatus 100 for forming a ball-shaped wire bond is shown, as described with respect to step 10. Figure 1A As shown, a continuous length of bonding lead 104, provided by a spool (not shown) of bonding leads, passes through distal lead clamp 103, proximal lead clamp 102, and then reaches capillary 101. Bonding ball 106 is first formed at the free end of bonding lead 104 and is located at the tip 105 of capillary 101.

[0033] See Figure 1A To form the bond ball 106, the bonding apparatus 100 is positioned above the bonding location where the vertical lead interconnect structure is to be formed, such as above the bonding pad 202 on the substrate 201. The distal lead clamp 103 is in an open state (i.e., it does not clamp the bond lead 104) to allow the bond lead 104 to move up and down relative to the distal lead clamp 103. Simultaneously, the proximal lead clamp 102 is in a closed state, clamping the bond lead 104 to prevent the capillary 101 from moving along the bond lead 104. A section of the bond lead 104 has been passed through the capillary 101 (at a predetermined level) such that the required length of the bond lead 104 protrudes from the tip 105 of the capillary 101 to form the bond ball 106 at the free end of the bond lead 104 using conventional techniques such as an electron flame extinguishing (“EFO”) torch. The bonding ball 106 is positioned above the bonding pad 202 for transport along direction A to the bonding pad 202.

[0034] Figure 2Some operations of forming a bonding ball 106 in a wire bonding apparatus 100 according to some embodiments of the present invention are shown. First, a portion of a bonding lead 104 is extended from a capillary 101 to form a lead tail with a free end (S101). Then, a bonding ball 106 is formed at the free end of the bonding lead 104 using an EFO soldering torch (S102). Subsequently, a proximal lead clamp 102 is operated to release the bonding lead 104, thereby moving the capillary 101 downward along the bonding lead 104 together with the proximal lead clamp 102 to position the bonding ball 106 at the tip 105 of the capillary 101. Once the bonding ball 106 is in place, the proximal lead clamp 102 is operated to clamp and secure the position of the bonding lead 104 (S103).

[0035] See Figure 1B After the bonding ball 106 is formed and positioned at the tip 105 of the capillary 101, the capillary 101 and the proximal lead clamp 102 move toward the bonding pad 202 until the bonding ball 106 contacts the bonding pad 202 to form a ball-shaped wire bond 108. Once the ball-shaped wire bond 108 is formed, the proximal lead clamp 102 releases the bonding lead 104, causing the capillary 101 and the proximal lead clamp 102 to move upward along the bonding lead 104.

[0036] Figure 1C The movement of the wire bonding apparatus 100 for positioning a section of bonding wire 104 between the capillary 101 and the ball-shaped wire bond 108 is shown, as described with respect to step 11. See also Figure 1C The proximal lead clip 102, together with the capillary 101, moves upward from the bonding pad 202 along the bonding lead 104 in the A' direction until the capillary 101 is at a predetermined level. At this point, the bonding lead 104 of the desired length will protrude from the tip 105 of the capillary 101. The desired length can be determined based on the height of the vertical lead interconnect structure to be formed. In some embodiments, the desired length may be less than or substantially equal to the height of the vertical lead interconnect structure to be formed. In one example, the desired length may be greater than one-third and less than two-thirds of the predetermined height of the vertical lead interconnect structure.

[0037] Figures 1D to 1G Operation of a wire bonding apparatus 100 according to some embodiments of the present invention for forming a weakened portion of a bonding lead 104 is shown.

[0038] refer to Figure 1D The capillary 101, together with the proximal lead clamp 102 and the distal lead clamp 103, moves in a direction transverse to direction A to form a bend point K on the bonding lead 104, thereby promoting the subsequent formation of a ring structure. During this process, both the proximal lead clamp 102 and the distal lead clamp 103 remain unclamped.

[0039] Figure 3A This illustrates manipulating the wire bonding device 100 to... Figure 1D The location shown. As indicated. Figure 3A As shown, the capillary 101 and the proximal lead clamp 102 move together toward the substrate 201 along the bending trajectory T, such that the capillary 101, the proximal lead clamp 102, and the distal lead clamp 103 are all translated a certain distance in a direction perpendicular to direction A. Alternatively, the capillary 101, together with the two lead clamps 102 and 103, can be translated along a straight trajectory T' substantially perpendicular to direction A to facilitate subsequent bending of the bonding wire 104, such as... Figure 3B As shown.

[0040] In these embodiments of the invention, directions A and A' are both approximately parallel to the axial direction of capillary 101.

[0041] refer to Figure 1E ,exist Figure 1D Following the operation shown, the capillary 101 moves downward to lower the bonding lead 104 toward the bonding pad 202, thereby forming a bend in the bonding lead 104 between the capillary 101 and the ball wire bond 108. Once the tip 105 of the capillary 101 is located at point 104a on the bonding lead 104 (at which point the bonding lead 104 will be weakened), the proximal lead clamp 102 is operated to clamp the bonding lead 104.

[0042] Figure 4A Some embodiments of the present invention are shown in, for example Figure 1D After the operation shown, the wire bonding apparatus 100 is used to form, as shown, on the bonding leads 104. Figure 1E The operation of the curved section is shown. (Refer to...) Figure 4A In order to form a bend on the bonding wire 104, Figure 1D After the bend point K is formed, the capillary 101, together with the proximal lead clamp 102 and the distal lead clamp 103, can move back to a position directly above the bonding pad 202 or the ball lead bond 108. Simultaneously, the section of bonding wire 104 between the capillary 101 and the ball lead bond 108 can be further extended until the tip 105 of the capillary 101 reaches point 104a. Then, the proximal lead clamp 102 is operated to clamp the bonding wire 104, and subsequently, the capillary 101 moves downward along direction A, lowering the bonding wire 104 toward the bonding pad 202 to form a bend in the bonding wire 104. In these embodiments, as... Figure 4A As shown, a bend point K is formed between the point to be weakened 104a and the spherical lead bond 108.

[0043] It should be noted that Figure 4AThe operations shown are for illustrative purposes only and are not intended to limit the scope of the invention. In other embodiments of the invention, various possible operations and movement paths can be used to form the bend in the bonding wire 104. For example, the capillary 101 can be moved upward away from the bonding pad 202 in any direction until point 104a is located at the tip 105 of the capillary 101, and then moved downward toward the bonding pad 202 to form the bend in the bonding wire 104.

[0044] Figure 4B This illustrates the formation of bonding leads 104 as shown in the diagram. Figure 1E The enlarged view of the tip 105 of the capillary 101 when the bend is shown. Figure 4B As shown, the inner wall 107 of the capillary 101 contacts a point 104a on the bonding wire 104. The tip 105 of the capillary 101 is chamfered and shaped to define the inner wall 107, which is used to form a fold 104b in the bonding wire 104.

[0045] Reference Figure 1F After the bend in the bonding wire 104 is formed, the proximal lead clamp 102 releases the bonding wire 104 while the distal lead clamp 103 clamps and holds the bonding wire 104, allowing the capillary 101 to move downward toward the bonding pad 202. The movement of the capillary 101 pulls the bonding wire 104 between the distal lead clamp 103 and the ball-shaped wire bond 108, allowing the capillary 101 to press against point 104a of the bonding wire, thereby weakening that point.

[0046] Specifically, when the bonding wire 104 is clamped by the distal lead clamp 103, a section of the bonding wire between the distal lead clamp 103 and the ball-shaped wire bond 108 is fixed. When the proximal lead clamp 102 is released, this section of the bonding wire can move along direction A with the capillary 101 between the distal lead clamp 103 and the ball-shaped wire bond 108. The function of the distal lead clamp 103 is to clamp the bonding wire 104 while the proximal lead clamp 102 and the capillary 101 are axially lowered away from the distal lead clamp 103 along direction A. As the capillary 101 is lowered, the bonding wire 104 between the distal lead clamp 103 and the ball-shaped wire bond 108 is tightened, causing the capillary 101 to press against the bonding wire 104 and form a weakened portion at point 104a.

[0047] Figure 5 This shows that when capillary 101 is reduced to weaken Figure 1F The image shows an enlarged view of the tip 105 of the capillary 101 at point 104a of the bonding wire 104. As the capillary 101 moves downward, the bonding wire 104 is tightened, allowing the fold 104b to contact another point or portion of the tip 105 of the capillary 101. Figure 5As shown, both the inner wall 107 and the outer wall 107' at the tip 105 of the capillary 101 are in contact with the bonding wire 104. This further promotes the formation of the weakened portion of the bonding wire 104a.

[0048] Reference Figure 1G The capillary 101, together with the proximal lead clamp 102, moves further downward until the bonding lead 104 protruding from the tip 105 of the capillary 101 contacts a portion of the spherical lead bond 108, thereby forming a ring structure. Therefore, pressure is further applied to the point 104a of the bonding lead 104 adjacent to the constructed ring structure to further weaken that point.

[0049] This portion of the ball wire bond 108 may include a ball portion 108a or a neck 108b of the ball wire bond 108. Figure 6 An enlarged view of the bonding lead 104 and the tip 105 of the capillary 101 is shown when the capillary 101 causes the bonding lead 104 to contact the neck 108b of the ball lead bond 108. Figure 6 As shown, point 104a is further pressed by the inner wall 107, thereby promoting the formation of the weakened portion. When the bonding wire 104 contacts the neck 108b, the capillary 101 can be located directly above the spherical portion 108a. Specifically, the center line C of the capillary 101 can be positioned approximately aligned with the center line of the spherical wire bond 108.

[0050] Figure 7 An enlarged view of the bonding lead 104 and the tip 105 of the capillary 101 is shown when the bonding lead 104 is pressed onto the spherical portion 108a of the spherical wire bond 108 to compress it and increase the deformation of the weakened portion.

[0051] To avoid damaging the ball wire bond 108, the capillary 101 can be configured and operated to move within a predetermined range, thereby pressing a suitable portion of the ball wire bond 108. The predetermined range of motion of the capillary 101 can be determined based on at least one of the following parameters: the diameter of the bonding lead 104, the size of the spherical portion 108a, and the size of the tip 105 of the capillary 101. In some embodiments, the capillary 101 can be configured to move within a predetermined range such that the distance between the centerline C of the capillary 101 and the centerline of the ball wire bond 108 is in the range of 0 to (R1+r1) / 2, where R1 represents the size of the spherical portion 108a and r1 represents the tip size of the capillary 101. Figure 7 As shown, the size of the spherical portion 108a refers to its maximum diameter. The tip size r1 of the capillary 101 refers to the distance between the centerline C of the capillary 101 and the inner wall 107.

[0052] Figure 1F and Figure 1G The two-step weakening process for forming the weakened portion of the bonding lead 104 is shown. Specifically, Figure 1F The first weakening step is shown, wherein the point 104a of the bonding wire 104 is weakened by pressing the capillary 101 against the point 104a with the tip 105 of the capillary 101 by bending the section of the bonding wire or forming a bend between the capillary 101 and the ball wire bond 108. Figure 1G The second weakening step is shown, wherein the weakened portion formed at point 104a of the bonding lead 104 is further weakened by pressing point 104a against a portion of the spherical lead bond 108 with capillary 101.

[0053] Those skilled in the art will understand that, using the method provided in the embodiments of the present invention, the weakened portion can be formed on the portion of the bonding lead 104a near point 104a, rather than precisely at point 104a. For example, the weakened portion can be formed on the portion of the fold 104b near point 104a.

[0054] Figures 1H to 1J The operation of the wire bonding device 100 during the formation of the vertical lead interconnect structure 20 (i.e., step 13) is illustrated. By pulling the capillary 101 away from the ball wire bond 108, the bond wire 104 is straightened and broken at the weakened portion to form the vertical lead interconnect structure 20.

[0055] exist Figure 1H In the process, the proximal lead clamp 102 is operated to clamp the bonding lead 104, and the distal lead clamp 103 now releases the bonding lead 104 so that the proximal lead clamp 102 and the capillary 101 can move together in a direction A' away from the bonding pad 202 to straighten the bonding lead 104 connected to the ball wire bond 108.

[0056] exist Figure 1I In this process, the proximal lead clamp 102 releases the bonding lead 104, and the distal lead clamp 103 now clamps the bonding lead 104 so that the capillary 101 and the proximal lead clamp 102 can move upward along the bonding lead 104, such that the weakened portion at point 104a is located between the tip 105 of the capillary 101 and the ball-shaped wire bond 108. The length of the bonding lead 104 between the tip 105 and the ball-shaped wire bond 108 is determined based on the required tail length of the bonding lead 104 to remain after the weakened portion breaks.

[0057] exist Figure 1JIn the process, the proximal lead clamp 102 is closed to clamp the bonding lead 104, and the distal lead clamp 103 is opened to release the bonding lead 104. Subsequently, the capillary 101 rises along the A' direction together with the proximal lead clamp 102. This movement causes the bonding lead 104 to break at the weakened portion at point 104a, leaving the required length of bonding lead 104 in situ in a vertical orientation to form the vertical lead interconnect structure 20.

[0058] Figure 8 A plurality of vertical lead interconnect structures 90 formed on a substrate 901 using a wire bonding apparatus 100 is illustrated according to an embodiment of the present invention. Repeat as... Figures 1A to 1J The wire bonding apparatus 100 shown is operated to form adjacent vertical wire interconnect structures 90 at different locations on the substrate 901 or at bonding pads.

[0059] Using the method provided in this invention, the wire bonding cycle time is more than 50% faster than existing methods, thereby significantly improving the productivity and efficiency of the wire bonding process for forming vertical wire interconnect structures. Furthermore, the proposed method provides a highly flexible solution for fine-pitch devices in system-in-package (SIP) and memory packages, and ensures higher productivity compared to existing technologies.

[0060] Although the invention has been described in considerable detail with reference to certain embodiments, other embodiments are also possible. For example, the methods provided in the embodiments of the invention can also be used to form vertical lead interconnect structures by other bonding methods. Thus, lead bonds formed by lead bonding equipment can include lead bonding tools for forming other types of lead bonds formed on bonding pads. Therefore, the spirit and scope of the appended claims should not be limited to the description of the embodiments contained herein.

Claims

1. A method for forming a vertical lead interconnect structure, comprising the following steps: Ball-shaped wire bonding is formed at the bonding pads on the substrate via capillary action; Remove the capillary from the bonding pad to extend a section of bonding wire between the capillary and the ball wire bond; By using the capillary tube to press a point on a section of the bonding lead between the capillary tube and the spherical lead bond against a portion of the spherical lead bond, a weakened portion of the bonding lead is formed. as well as The bonding wire segment is straightened by moving the capillary away from the spherical lead bonding and breaking the bonding wire at the weakened portion to form the vertical lead interconnect structure.

2. The method of claim 1, wherein the step of forming the spherical wire bond comprises: The capillary tube is used to form a bonding ball at the free end of the bonding lead, and the bonding ball is bonded to the bonding pad to form a spherical wire bond.

3. The method of claim 1, wherein the step of forming the weakened portion comprises: After bending a section of the bonding wire between the capillary and the spherical wire bond to form a ring structure between the capillary and the spherical wire bond, the point on the section of the bonding wire adjacent to the ring structure is pressed against a portion of the formed spherical wire bond.

4. The method of claim 3, wherein the step of forming the weakened portion comprises: By bending the section of the bonding wire, the capillary tip is used to press the point on the section of the bonding wire between the capillary and the ball-shaped lead bond, thereby weakening the point.

5. The method of claim 4, wherein the step of bending the section of bonding wire comprises: The capillary is moved in a direction transverse to the axial direction of the capillary to form a bend point on the bonding wire between the capillary and the spherical lead, so as to facilitate the bending.

6. The method according to claim 5, wherein, The bend point is formed between the point to be weakened and the spherical lead bond.

7. The method of claim 5, wherein the step of bending the section of bonding wire further comprises: After the bend point is formed, the capillary is moved to position the point to be weakened at the tip of the capillary, and the capillary is moved toward the spherical lead bonding to bend the section of the bonded lead.

8. The method of claim 7, wherein the step of moving the capillary includes: Move the capillary tube to a position directly above the spherical lead bond.

9. The method of claim 4, wherein the step of bending the section of bonding wire comprises: The bonding wire is clamped with a first lead clamp, which is located at a fixed height relative to the bonding pad. And move the capillary toward the spherical lead bonding to form a fold at the point on the bonding lead around the tip of the capillary, thereby weakening the point on the bonding lead.

10. The method of claim 9, further comprising: Before the first wire clamp holds the bonding wire, when bending a section of the bonding wire, the second wire clamp holds the bonding wire to prevent the capillary from moving along the bonding wire, wherein the second wire clamp is positioned closer to the wire bonding tool than the first wire clamp.

11. The method of claim 10, further comprising: After the first lead clamp is used to clamp the bonding lead to weaken the point on the bonding lead segment, the second lead clamp is released.

12. The method according to claim 1, wherein, The portion of the spherical wire bond includes either the spherical portion of the spherical wire bond or the neck of the spherical wire bond.

13. The method of claim 12, further comprising: When the point is pressed against the portion of the spherical wire bond, the range of motion of the capillary is determined according to at least one parameter, including: the diameter of the bonding wire, the size of the spherical portion of the spherical wire bond, and the size of the tip of the capillary.

14. A wire bonding method, comprising the following steps: Wire bonding is formed at bonding pads on the substrate using a wire bonding tool; Remove the wire bonding tool from the bonding pad to extend a section of bonding wire between the wire bonding tool and the wire bond; The section of bonding wire between the wire bonding tool and the wire bonding is bent into a ring structure; Using the wire bonding tool, press a point on the bonding wire adjacent to the annular structure against a portion of the wire bond, thereby forming a weakened portion of the bonding wire at that point. as well as The bonding tool is used to straighten a section of bonding wire and break the bonding wire at the weakened portion to form a vertical lead interconnect structure.

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