Dust removal method of chip test equipment and chip test equipment

Abstract

The invention discloses a dust removal method of chip testing equipment and the chip testing equipment. The dust removal method of the chip testing equipment comprises the following steps: monitoring air pressure in a dust removal cover; judging whether the air pressure is higher than a set air pressure threshold value or not; if yes, the state of the air suction valve is judged; if the state of the air suction valve is closed, an air exhaust starting signal is sent out; if the air suction valve is opened, an alarm signal is sent out; if not, no action exists. The chip testing equipment comprises a movement mechanism, a dust removal cover is arranged on the outer side of the movement mechanism, the dust removal cover is communicated with a suction nozzle and an air pressure monitoring component, the suction nozzle is communicated with a suction valve, and the dust removal method is applied. Whether the air suction action is normal or not is judged by monitoring the air pressure change in the dust removal cover; by arranging the dust removal cover and the corresponding air suction nozzle, dust generated by the chip testing equipment is sucked away in time, and the influence of the dust generated by the chip testing equipment on testing is avoided.

Description

Technical Field

[0001] This invention relates to the field of chip testing, and in particular to a dust removal method and chip testing equipment for chip testing. Background Technology

[0002] Chip testing equipment, as high-precision testing devices, has extremely high requirements for dust-free environments. Even minute dust particles can cause testing anomalies or even damage the equipment and chips. Current technologies typically place testing equipment in cleanrooms to control airborne dust levels. However, in reality, dust can still be present in the testing equipment, affecting testing accuracy and causing some degree of damage to both the chips and the equipment. Therefore, how to address the impact of dust on chip testing equipment has been a persistent challenge for those skilled in the art. Summary of the Invention

[0003] One of the objectives of this invention is to provide a dust removal method for chip testing equipment to address the impact of dust on testing.

[0004] To achieve the above objectives, the technical solution of the present invention is as follows: A dust removal method for a chip testing device is provided, comprising a chip testing device including a motion mechanism, a dust removal hood disposed on the outer side of the motion mechanism, the dust removal hood being connected to an air intake nozzle and an air pressure monitoring component, and the air intake nozzle being connected to an air intake valve, comprising the following steps:

[0005] Monitor the air pressure inside the dust collector hood;

[0006] Determine whether the air pressure is higher than the set air pressure threshold;

[0007] If so, determine the status of the intake valve; if the intake valve is closed, issue a suction start signal; if the intake valve is open, issue an alarm signal.

[0008] If not, no action is taken.

[0009] The dust removal method of the chip testing equipment of the present invention monitors the air pressure inside the dust hood outside the moving mechanism to determine whether the air extraction action inside the dust hood is working properly. At the same time, it combines the status of the suction valve to determine whether the problem is with the suction itself or with other parts, including the dust hood and the suction pipe. If the suction valve is closed, the suction action is initiated to open the suction valve. If the air pressure inside the hood is too high even with the suction valve open, it is considered that there is a problem elsewhere, and an alarm is triggered so that people can deal with it in time. This avoids the problem of suction going unnoticed, which could lead to dust affecting the chip and the testing equipment during the chip testing process, damaging the chip and the testing equipment, and affecting the testing accuracy.

[0010] Preferably, the above-mentioned air pressure threshold is between -95KPa and -5KPa. When the air pressure threshold is set higher than -5KPa, no alarm will be triggered regardless of whether air is inhaled, making it difficult to provide a warning. When the air pressure threshold is set lower than -95KPa, it is not easy for the air pressure inside the hood to fall below the air pressure threshold during inhalation, which will frequently cause false alarms and affect the testing work.

[0011] Another objective of this invention is to provide a chip testing device to address the impact of dust on testing.

[0012] To achieve the above objectives, the technical solution of the present invention is: to provide a chip testing device, including a motion mechanism, a dust removal hood is provided on the outside of the motion mechanism, the dust removal hood is connected to an air intake nozzle and an air pressure monitoring component, the air intake nozzle is connected to an air intake valve, and the chip testing device applies any of the above-mentioned dust removal methods for chip testing devices.

[0013] The chip testing equipment of this invention, by adding a dust hood to the outside of the moving mechanism and incorporating suction action and air pressure monitoring within the dust hood, ensures that debris and dust generated by the moving mechanism during operation are promptly removed by the suction action, preventing dust generated by the chip testing equipment itself from affecting the testing. Simultaneously, an alarm mechanism allows for timely detection of the suction action's status, preventing abnormal suction that could hinder the timely removal of dust generated by the moving mechanism and thus impact the testing process.

[0014] Preferably, the aforementioned motion mechanism includes a belt drive component, and a first dust removal hood is provided on the outer side of the belt drive component. The first dust removal hood is connected to a first air intake nozzle and a first air pressure monitoring component, and the first air intake nozzle is connected to a first air intake valve. The aforementioned first dust removal hood and related components can promptly remove the dust generated by the belt drive mechanism. Since the belt drive mechanism itself generates dust due to wear and is also prone to electrostatic adsorption of dust, the first dust removal hood and related components can effectively and promptly remove dust, preventing the dust generated by the belt drive mechanism itself from affecting the test.

[0015] More preferably, the first dust hood includes a first opening, and the belt drive component includes a side plate. The first opening is fixed to the side plate. The first dust hood is laterally fixed to the side plate of the belt drive component, which can prevent the first dust hood from interfering with the transmission connection of the drive component, and also helps to stabilize the first dust hood and avoid affecting the transmission of the drive component.

[0016] More preferably, the top of the first dust collector hood is provided with a strip-shaped opening, which allows at least a portion of the belt-driven component to extend outside the first dust collector hood. This strip-shaped opening provides air intake space for the first dust collector hood, preventing excessive negative pressure inside the hood from affecting dust extraction efficiency. Furthermore, the strip-shaped opening allows the belt-driven component to extend outside the first dust collector hood, enabling it to transport the chip. Finally, the air intake at the top allows dust around the transported chip to be drawn into the first dust collector hood and then removed, further providing a clean environment around the chip.

[0017] More preferably, the first air intake nozzle and the first air pressure monitoring component are fixed to the side plate. Fixing the first air intake nozzle and the first air pressure monitoring component to the side plate ensures that their weight does not affect the shape and position of the first dust collector hood, thus preventing the first dust collector hood from interfering with the belt drive components.

[0018] Preferably, the aforementioned motion mechanism includes a cam mechanism, with a second dust hood disposed on its outer side. The second dust hood is connected to a second air intake nozzle and a second air pressure monitoring component, and the second air intake nozzle is connected to a second air intake valve. The second dust hood and related components can promptly remove dust generated by the cam mechanism, preventing debris and dust generated by gear wear in the cam mechanism from drifting upwards and contaminating the chip-related areas.

[0019] More preferably, the second dust cover includes a second opening, and the cam mechanism includes a base plate, with the second opening facing the base plate to fix the second dust cover. The second opening is pressed downward onto the cam mechanism, which can effectively prevent dust generated by the cam mechanism from flying upward and contaminating the chip-related area.

[0020] More preferably, the second dust hood is provided with an air inlet at the top. The air inlet can prevent the air pressure inside the second dust hood from being too low, which would affect the dust collection effect; at the same time, it can also draw dust near the chip into the second dust hood and then remove it, further creating a dust-free environment around the chip.

[0021] More preferably, the second suction nozzle is provided on the side of the second dust hood, and the second suction nozzle is connected to the second suction pipe, on which the second air pressure monitoring component is provided. The suction nozzle and suction pipe are provided on the side of the second dust hood to avoid affecting the space below the cam mechanism and interfering with the arrangement of other components.

[0022] Preferably, the aforementioned motion mechanism includes a lifting mechanism, with a third dust hood installed on its outer side. This third dust hood connects to a third air intake nozzle and a third air pressure monitoring component, and the third air intake nozzle connects to a third air intake valve. The third dust hood and its related components can promptly remove dust generated by the lifting mechanism. Since the lifting mechanism involves significant movement and numerous moving parts, it is prone to generating debris and dust during the lifting process due to wear and tear on these parts. The third dust hood and its related components can control the dust within a certain range, preventing it from scattering and ensuring timely removal.

[0023] More preferably, the aforementioned third dust hood includes a first hood and a second hood. The lifting mechanism includes a lifting component and a static component. The first hood is fixed to the lifting component, and the second hood is fixed to the static component. The first hood includes a third opening, and the second hood includes a fourth opening. The third and fourth openings are arranged opposite to each other, and the first and second hoods partially overlap when the lifting component is not raised. The arrangement of the two hoods in the third dust hood allows the lifting mechanism to be covered by the third dust hood to the greatest extent possible during movement, thus effectively controlling the dust generated during the movement of the lifting mechanism.

[0024] More preferably, when the first and second covers partially overlap, the lateral distance between the sidewall of the first cover and the sidewall of the second cover ranges from 0.1mm to 10mm. If this distance exceeds 10mm, the air intake range is too large, resulting in relatively high air pressure inside the third dust collector, affecting air pressure monitoring. If the distance is less than 0.1mm, on the one hand, the air pressure inside the third dust collector will be relatively low, affecting the dust collection effect; on the other hand, it is also prone to collision or friction when the first and second covers are inserted, causing damage to the third dust collector.

[0025] More preferably, the bottom of the second cover is provided with the third air intake, which is connected to a third air intake pipe, and the third air intake pipe is provided with the third air pressure monitoring component. The third air intake and related components are located on the second cover, which can suck away the dust generated by the lifting mechanism from below, which is more conducive to the collection and removal of dust. Attached Figure Description

[0026] Figure 1 This is a partial structural schematic diagram of the chip testing equipment 100 of the present invention;

[0027] Figure 2 This is a partial structural schematic diagram of the chip testing equipment 100 of the present invention;

[0028] Figure 3 This is a logic diagram of the dust removal method for the chip testing equipment of the present invention;

[0029] Legend:

[0030] 100 - Chip testing equipment; 110 - Belt drive component; 111 - First dust hood; 112 - First air intake nozzle; 113 - First air intake pipe; 114 - First air pressure monitoring component; 115 - First air intake valve; 116 - First hood opening; 117 - Side plate; 118 - Strip opening; 120 - Cam mechanism; 121 - Second dust hood; 122 - Second air intake nozzle; 123 - Second air intake pipe; 124 - Second air pressure monitoring component; 125 - Second air intake valve; 126 - Second hood opening; 127 - Base plate; 128 - Air inlet; 130 - Lifting mechanism; 131 - Third dust hood; 132 - Third air intake nozzle; 134 - Third air pressure monitoring component; 135 - Third air intake valve; 31 - First hood body; 32 - Second hood body; 33 - Lifting component; 34 - Static component; 35 - Third hood opening. Detailed Implementation

[0031] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present invention.

[0032] It should be noted that if the embodiments of the present invention involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of the components in a specific posture. If the specific posture changes, the directional indicators will also change accordingly.

[0033] Furthermore, if the embodiments of this invention involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the use of "and / or" or "and / or" throughout the text includes three parallel solutions. For example, "A and / or B" includes solution A, solution B, or a solution where both A and B are satisfied simultaneously. Furthermore, the technical solutions of the various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. When the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed by this invention.

[0034] This invention proposes a chip testing device 100. For example... Figure 1 and Figure 2 As shown, where Figure 1 This is a partial structural schematic diagram of the chip testing equipment 100 of the present invention; Figure 2 This is a partial structural schematic diagram of the chip testing equipment 100 of the present invention from another angle.

[0035] The chip testing equipment 100 of the present invention includes a motion mechanism, which comprises a belt drive component 110, a cam mechanism 120, and a lifting mechanism 130. The belt drive component 110 is used for laterally transporting a tray carrying chips, and one belt drive component 110 is arranged on each side of the chip testing equipment 100 in the figure. The cam mechanism 120 is used to provide various transmissions to the testing equipment 100, and includes various gears and transmission components. In the figure, the cam mechanism 120 is located below the middle of the two belt drive components 110. The lifting mechanism 130 is used to lift the upper part of the testing equipment 100, and the lifting mechanism 130 is located below the testing equipment 100 in the figure.

[0036] A first dust collector hood 111 is provided on the outer side of the belt drive component 100, and a side plate 117 is provided on the side of the belt drive component 100. The first dust collector hood 111 is fixed to the side plate 117. The first dust collector hood 111 is provided with a first hood opening 116, which faces the side plate 117. A first suction nozzle 112 is provided on the side plate 117, which connects to the interior of the first dust collector hood 111. The first suction nozzle 112 is connected to a first suction pipe 113, and a first suction valve 115 is connected to the first suction pipe 113. The first suction valve 115 is used to control the suction action of the first suction pipe 113. A first air pressure monitoring component 114 is fixed next to the first suction nozzle 112, which is used to monitor the air pressure inside the first dust collector hood 111. The top of the first dust collector 111 is provided with a strip-shaped opening 118, which allows part of the structure of the belt drive component 110 to be exposed or extended outside the first dust collector 111.

[0037] A second dust collector hood 121 is provided outside the cam mechanism 120, which includes a base plate 127 at the bottom. The second dust collector hood 121 includes a downward-facing second opening 126 and is fastened to the base plate 127. A second suction nozzle 122 is provided on the side of the second dust collector hood, which is connected to a second suction pipe 123. A second air pressure monitoring component 124 is provided on the second suction pipe 123, which is also connected to a second suction valve 125. The second suction valve 125 is used to control the air suction action in the second suction pipe 123. The second air pressure monitoring component 124 is used to monitor the air pressure in the second suction pipe 123 and the second dust collector hood 121. Two air inlets 128 are provided on the top of the second dust collector hood 121. The air inlets 128 are used to increase the air pressure in the second dust collector hood 121 and to suck in the dust above the second dust collector hood 121.

[0038] A third dust hood 131 is provided outside the lifting mechanism 130. The lifting mechanism 130 includes a lifting component 33 and a static component 34. The third dust hood 131 includes a first hood body 31 and a second hood body 32. The first hood body 31 includes a third hood opening 35. The first hood body 31 is fixed to the lifting component 33, and the third hood opening 35 faces downward. The second hood body 32 includes a fourth hood opening (not shown). The second hood body 32 is fixed to the static component 34, and the fourth hood opening (not shown) faces upward. When the lifting component 33 is not raised, the side walls of the first hood body 31 and the second hood body 32 partially overlap, and the second hood body 32 is inserted into the first hood body 31. When the second hood body 32 is inserted into the first hood body 31, the distance between the side walls of the two is 0.5 mm. In other embodiments, when the second hood body and the first hood body overlap, the lateral distance between the side walls can also be 10 mm or 0.1 mm. The bottom of the second hood 32 is provided with a third air intake 132, which is connected to a third air intake pipe (not shown). The third air intake pipe (not shown) is provided with a third air pressure monitoring component 134 and a third air intake valve 135. The third air pressure monitoring component 134 is used to monitor the air pressure in the third air intake pipe (not shown) and the third dust removal hood 131, and the third air intake valve 135 is used to control the air extraction action in the third dust removal hood 131.

[0039] like Figure 3 The diagram shows the logical steps of the dust removal method for the chip testing equipment of the present invention. The first air pressure monitoring component 114, the second air pressure monitoring component 124, and the third air pressure monitoring component 134 of the chip testing equipment 100 in this embodiment monitor the air pressure, and the first suction valve 115, the second suction valve 125, and the third suction valve 135 control the suction action of the three dust removal hoods respectively.

[0040] The dust removal method of the chip testing equipment of the present invention includes the following steps:

[0041] 101. The air pressure inside the first dust collector 111, the second dust collector 121, and the third dust collector 131 is monitored by the first air pressure monitoring component 114, the second air pressure monitoring component 124, and the third air pressure monitoring component 134, respectively, to obtain the first air pressure value, the second air pressure value, and the third air pressure value. In this embodiment, there are two first dust collectors 111, therefore there are also two first air pressure values.

[0042] 102. Determine whether the first, second, and third air pressure values ​​are higher than a set air pressure threshold. In this embodiment, the air pressure threshold is -20 kPa. In other embodiments, the air pressure threshold can be -5 kPa or -95 kPa. In this embodiment, the air pressure threshold for comparing the four air pressure values ​​is the same; in other embodiments, the air pressure thresholds for comparing the four air pressure values ​​can be different. If yes, proceed to step 103; otherwise, no action is taken, and the real-time monitoring in step 101 continues.

[0043] 103. Determine the status of the corresponding suction valve connected to the dust collector hood. Assuming that the first and second air pressure values ​​determined in step 102 of this embodiment are both higher than the air pressure threshold, and the third air pressure value is lower than the air pressure threshold, this step determines the status of the first suction valve 115 and the second suction valve 125. In this embodiment, the valve status is inferred by checking whether a suction start signal has been sent to the first suction valve 115 and the second suction valve 125 since the current power-on. Assuming that a suction start signal has been sent to the first suction valve 115, but not to the second suction valve 125, then the first suction valve 115 is determined to be open, and the second suction valve 125 is determined to be closed. Next, step 105 is executed for the first suction valve 115, and step 104 is executed for the second suction valve 125.

[0044] 104. Send a suction start signal to the corresponding suction valve. In this embodiment, a suction start signal is sent to the second suction valve 125. And repeat the monitoring steps in step 101.

[0045] 105. Issue an alarm signal for the corresponding dust collector hood. In this embodiment, an alarm signal is issued for the first dust collector hood 111.

[0046] The dust removal method of the chip testing equipment in this embodiment monitors whether the air pressure in each dust hood exceeds the air pressure threshold, and judges whether the air intake is working normally by combining the status of the intake valve. It provides timely warnings to prevent dust from affecting the test and causing damage to the chip or the testing equipment when the air intake is not working properly.

[0047] The chip testing equipment 100 in this embodiment uses a dust cover to remove dust generated by the moving parts in a timely manner, preventing dust generated by the chip testing equipment 100 itself from polluting the environment, causing problems in chip testing, or even damaging the chip or testing equipment.

[0048] The above description is merely an exemplary embodiment of the present invention and does not limit the patent scope of the present invention. Any equivalent structural transformations made using the contents of the present invention's specification and drawings under the technical concept of the present invention, or direct / indirect applications in other related technical fields, are included within the patent protection scope of the present invention.

Claims

1. A dust removal method for a chip testing device, characterized in that: A chip testing device is provided, the chip testing device including a motion mechanism, a dust removal hood is provided on the outside of the motion mechanism, the dust removal hood is connected to an air suction nozzle and an air pressure monitoring component, and the air suction nozzle is connected to an air suction valve, comprising the following steps: Monitor the air pressure inside the dust collector hood; Determine whether the air pressure is higher than the set air pressure threshold; If so, determine the status of the intake valve; if the intake valve is closed, issue a suction start signal; if the intake valve is open, issue an alarm signal. If not, no action is taken.

2. The dust removal method for the chip testing equipment according to claim 1, characterized in that: The pressure threshold is from -95 kPa to -5 kPa.

3. A chip testing device, characterized in that: The device includes a motion mechanism, with a dust removal hood on its outer side. The dust removal hood is connected to an air intake nozzle and an air pressure monitoring component. The air intake nozzle is connected to an air intake valve. The chip testing equipment uses the dust removal method for chip testing equipment as described in any one of claims 1 or 2.

4. The chip testing equipment according to claim 3, characterized in that: The motion mechanism includes a belt drive component, and a first dust removal hood is provided on the outside of the belt drive component. The first dust removal hood is connected to a first air intake nozzle and a first air pressure monitoring component. The first air intake nozzle is connected to a first air intake valve.

5. The chip testing equipment according to claim 4, characterized in that: The first dust collector hood includes a first hood opening, and the belt drive component includes a side plate. The first dust collector hood is fixed with the first hood opening facing the side plate.

6. The chip testing equipment according to claim 5, characterized in that: The top of the first dust collector hood is provided with a strip-shaped opening, which allows at least a portion of the belt drive component to extend out of the first dust collector hood.

7. The chip testing equipment according to claim 5, characterized in that: The first air intake nozzle and the first air pressure monitoring component are fixed on the side plate.

8. The chip testing equipment according to claim 3, characterized in that: The motion mechanism includes a cam mechanism, and a second dust cover is provided on the outside of the cam mechanism. The second dust cover is connected to a second air intake nozzle and a second air pressure monitoring component. The second air intake nozzle is connected to a second air intake valve.

9. The chip testing equipment according to claim 8, characterized in that: The second dust hood includes a second hood opening, and the cam mechanism includes a base plate, with the second hood opening facing the base plate to fix the second dust hood.

10. The chip testing equipment according to claim 9, characterized in that: The second dust collector is provided with an air inlet at the top.

11. The chip testing equipment according to claim 9, characterized in that: The second dust removal hood has a second air intake nozzle on its side, which is connected to a second air intake pipe. The second air intake pipe is equipped with a second air pressure monitoring component.

12. The chip testing equipment according to claim 3, characterized in that: The motion mechanism includes a lifting mechanism, and a third dust removal hood is provided on the outside of the lifting mechanism. The third dust removal hood is connected to a third air intake and a third air pressure monitoring component. The third air intake is connected to a third air intake valve.

13. The chip testing equipment according to claim 12, characterized in that: The third dust removal hood includes a first hood and a second hood. The lifting mechanism includes a lifting component and a static component. The first hood is fixed to the lifting component, and the second hood is fixed to the static component. The first hood includes a third hood opening, and the second hood includes a fourth hood opening. The third hood opening and the fourth hood opening are arranged opposite to each other. The first hood and the second hood partially overlap when the lifting component is not raised.

14. The chip testing equipment according to claim 13, characterized in that: When the first cover and the second cover partially overlap, the lateral distance between the side wall of the first cover and the side wall of the second cover ranges from 0.1mm to 10mm.

15. The chip testing equipment according to claim 13, characterized in that: The third air intake is provided at the bottom of the second cover, the third air intake is connected to the third air intake pipe, and the third air pressure monitoring component is provided on the third air intake pipe.

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