Double-temperature-zone evaporation source
By using the stirring and cooling mechanisms of the dual-temperature zone evaporation source, the problem of incomplete material evaporation in the evaporation source is solved, achieving uniform vapor deposition and multi-target coating, thereby improving production efficiency and equipment utilization.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- 国成仪器(常州)有限公司
- Filing Date
- 2024-10-22
- Publication Date
- 2026-04-24
AI Technical Summary
In existing evaporation sources, the coating material does not evaporate completely in the crucible, leading to material waste and cleaning difficulties.
A dual-temperature zone evaporation source is adopted. By setting up a stirring mechanism and a cooling mechanism, the material in the crucible is stirred by the wall rod on the rotating shaft driven by the drive motor, so that the material is heated more evenly. The uniform distribution of the vapor deposition gas and multi-target coating are achieved by connecting pipe and discharge mechanism.
It improves the efficiency and quality of vapor deposition, avoids material accumulation, achieves uniform surface source vapor deposition, improves equipment utilization, and reduces production costs.
Smart Images
Figure CN121915364A_ABST
Abstract
Description
Technical Field
[0001] This invention relates to the field of vacuum coating technology, and in particular to a dual-temperature zone evaporation source. Background Technology
[0002] The evaporation source is one of the key components of vacuum coating equipment. It mainly consists of a crucible containing the evaporation material and a heating device. The evaporation source heats the material in the crucible to sublimate or vaporize, forming vapor. This vapor migrates to the substrate surface and deposits under vacuum, thus forming a thin film. Common evaporation sources include resistance evaporation sources and electron beam evaporation sources. Resistance evaporation sources use an electric current through a resistance wire to heat the material; they have a simple structure but relatively low temperature control precision. Electron beam evaporation sources, on the other hand, bombard the material with an electron beam to cause evaporation, achieving high-purity evaporation and are widely used in semiconductor, optics, and other fields. In conclusion, the evaporation source plays a crucial role in the quality and performance of the thin film.
[0003] During the coating process, existing coating materials sometimes fail to evaporate completely in the crucible, leaving some residue. This not only wastes material but also affects subsequent coating operations. Furthermore, the residue is difficult to clean, increasing operational difficulty and time costs. Summary of the Invention
[0004] To solve the above-mentioned technical problems, the present invention provides a dual-temperature zone evaporation source.
[0005] The present invention is achieved by the following technical solution: a dual-temperature zone evaporation source, comprising a material discharge mechanism fixedly connected to the top of a stirring mechanism, and a cooling mechanism fixedly connected inside the stirring mechanism;
[0006] The stirring mechanism includes a support cylinder, a crucible is snapped into the inside of the support cylinder, a first heating wire is provided on the surface of the crucible, a second heating wire is provided on the surface of the crucible, a heat shield layer is fixedly connected inside the support cylinder, a connecting conduit is fixedly connected to the top of the support cylinder, a drive motor is fixedly connected to the top of the connecting conduit, a rotating shaft is fixedly connected to the output end of the drive motor, a wall rod is fixedly connected to the surface of the rotating shaft, a guide plate is fixedly connected inside the connecting conduit, and a guide hole is opened inside the guide plate.
[0007] By using the above technical solution, the drive motor is started, which drives the wall rod on the rotating shaft surface to stir the vapor-deposited material in the crucible, making it more uniformly heated, improving the efficiency and quality of vapor deposition, helping to accelerate the vaporization or sublimation process of the material, making the vapor deposition gas generate faster and enter the connecting pipe, and also preventing the vapor deposition material from accumulating at the bottom of the crucible.
[0008] As a further improvement to the above solution, a through groove is provided at the top of the connecting conduit, and the surface of the rotating shaft penetrates the interior of the connecting conduit.
[0009] As a further improvement to the above scheme, the wall rod is located inside the crucible.
[0010] As a further improvement to the above solution, the discharge mechanism includes a connecting pipe, an empty chamber is fixedly connected to the top of the connecting pipe, a discharge pipe is fixedly connected to the top of the empty chamber, and a pressure sensor is fixedly connected to the front end of the empty chamber.
[0011] The above technical solution involves placing the vapor-deposited material into a crucible, activating the first and second heating wires to heat the material, causing it to vaporize or sublimate. The vapor-deposited gas enters the connecting pipe through the guide holes of the guide plate, then flows into the empty chamber, and is subsequently ejected from the outlet to coat the material. By setting up two connecting pipes, an empty chamber, and an outlet, the vapor-deposited gas can be ejected simultaneously, enabling simultaneous coating of multiple objects. This improves production efficiency, ensures a more uniform distribution of the vapor-deposited gas on the object surface, achieves uniform surface-source vapor deposition, improves coating quality, and increases equipment utilization.
[0012] As a further improvement to the above solution, the connecting tube is located at the top of the connecting conduit, and the number of connecting tubes is set to two.
[0013] As a further improvement to the above solution, the cooling mechanism includes a cooling pipe, a cooling water inlet pipe is fixedly connected to the bottom of the support cylinder, and a cooling water outlet pipe is fixedly connected to the bottom of the support cylinder.
[0014] As a further improvement to the above solution, the cooling pipe is located inside the support cylinder and is connected to the cooling water inlet pipe and the cooling water outlet pipe.
[0015] Compared with the prior art, the beneficial effects of the present invention are as follows:
[0016] This invention, by setting up a wall rod and starting a drive motor, drives the wall rod on the surface of the rotating shaft to stir the vapor-deposited material in the crucible, making it heat more evenly, improving the efficiency and quality of vapor deposition, helping to accelerate the vaporization or sublimation process of the material, allowing the vapor deposition gas to be generated more quickly and enter the connecting pipe, and also preventing the vapor deposition material from accumulating at the bottom of the crucible.
[0017] This invention, through the configuration of a connecting pipe, an empty chamber, and a discharge port, places the material to be vaporized into a crucible. Activating the first and second heating wires heats the material in the crucible, causing it to vaporize or sublimate. The vaporization gas enters the connecting pipe through the guide holes of the guide plate, then flows into the empty chamber, and is subsequently ejected from the discharge port to coat the material. By using two connecting pipes, an empty chamber, and a discharge port, the vaporization gas can be ejected simultaneously, enabling simultaneous coating of multiple objects. This improves production efficiency, ensures a more uniform distribution of the vaporization gas on the object surface, achieving uniform surface-source vapor deposition, improving coating quality, and increasing equipment utilization. Attached Figure Description
[0018] Figure 1 This is a schematic diagram of the overall structure of the present invention;
[0019] Figure 2 This is a schematic diagram of the heat shielding layer structure of the present invention;
[0020] Figure 3 This is a schematic diagram of the first heating wire structure of the present invention;
[0021] Figure 4 This is a schematic diagram of the wall rod structure of the present invention;
[0022] Figure 5 For the present invention Figure 1 Schematic diagram of cross-section structure.
[0023] Explanation of key symbols:
[0024] 1. Stirring mechanism; 101. Support cylinder; 102. Crucible; 103. First heating wire; 104. Second heating wire; 105. Heat shielding layer; 106. Connecting conduit; 107. Drive motor; 108. Rotating shaft; 109. Wall rod; 110. Guide plate; 111. Guide hole; 2. Discharge mechanism; 201. Connecting pipe; 202. Empty chamber; 203. Discharge pipe; 204. Pressure sensor; 3. Cooling mechanism; 301. Cooling pipe; 302. Cooling water inlet pipe; 303. Cooling water outlet pipe. Detailed Implementation
[0025] The present invention will now be further described in conjunction with the accompanying drawings and specific embodiments. It should be noted that, without conflict, the various embodiments or technical features described below can be arbitrarily combined to form new embodiments.
[0026] Example:
[0027] Please combine Figure 1-5 A dual-temperature zone evaporation source according to this embodiment includes a stirring mechanism 1 with a discharge mechanism 2 fixedly connected to the top, and a cooling mechanism 3 fixedly connected inside the stirring mechanism 1.
[0028] The stirring mechanism 1 includes a support cylinder 101, a crucible 102 is snapped into the inside of the support cylinder 101, a first heating wire 103 and a second heating wire 104 are disposed on the surface of the crucible 102, a heat shielding layer 105 is fixedly connected inside the support cylinder 101, a connecting conduit 106 is fixedly connected to the top of the support cylinder 101, a drive motor 107 is fixedly connected to the top of the connecting conduit 106, and a rotating shaft 108 is fixedly connected to the output end of the drive motor 107. A wall rod 109 is fixedly connected to the surface of the crucible 102, and a guide plate 110 is fixedly connected inside the connecting conduit 106. The guide plate 110 has a guide hole 111 inside. When the drive motor 107 is started, the wall rod 109 on the surface of the rotating shaft 108 is driven to stir the vapor-deposited material in the crucible 102, so that it is heated more evenly, improving the efficiency and quality of vapor deposition, helping to accelerate the vaporization or sublimation process of the material, so that the vapor deposition gas is generated faster and enters the connecting pipe 201, and also preventing the vapor deposition material from accumulating at the bottom of the crucible 102.
[0029] A through groove is provided at the top of the connecting conduit 106, and the surface of the rotating shaft 108 penetrates the interior of the connecting conduit 106.
[0030] The wall rod 109 is located inside the crucible 102.
[0031] The discharge mechanism 2 includes a connecting pipe 201, an empty chamber 202 is fixedly connected to the top of the connecting pipe 201, a discharge pipe 203 is fixedly connected to the top of the empty chamber 202, and a pressure sensor 204 is fixedly connected to the front end of the empty chamber 202.
[0032] The connecting tube 201 is located at the top of the connecting conduit 106, and there are two connecting tubes 201.
[0033] The cooling mechanism 3 includes a cooling pipe 301, a cooling water inlet pipe 302 fixedly connected to the bottom of the support cylinder 101, and a cooling water outlet pipe 303 fixedly connected to the bottom of the support cylinder 101.
[0034] The cooling pipe 301 is located inside the support cylinder 101 and is connected to the cooling water inlet pipe 302 and the cooling water outlet pipe 303.
[0035] The implementation principle of a dual-temperature zone evaporation source in this embodiment is as follows: First, the material to be vaporized is placed in the crucible 102. The first heating wire 103 and the second heating wire 104 are activated to heat the material in the crucible 102, causing the material to vaporize or sublimate. The vaporized gas enters the connecting pipe 201 through the guide hole 111 of the guide plate 110, then enters the empty chamber 202, and is subsequently ejected from the discharge port to coat the material. By setting two connecting pipes 201, an empty chamber 202, and a discharge port, the vaporized gas can be ejected simultaneously, thereby enabling the simultaneous coating of multiple objects, improving production efficiency, and making the vaporized gas more evenly distributed on the object surface, thus achieving uniform surface source vaporization and improving the coating quality. This increases the utilization rate of the equipment and reduces production costs. Then, the drive motor 107 is started, which drives the wall rod 109 on the surface of the rotating shaft 108 to stir the vapor-deposited material in the crucible 102, making the heating more uniform, improving the efficiency and quality of vapor deposition, helping to accelerate the vaporization or sublimation process of the material, allowing the vapor deposition gas to be generated more quickly and enter the connecting pipe 201, and also preventing the vapor deposition material from accumulating at the bottom of the crucible 102. Finally, cooling water flows from the cooling water inlet pipe 302 to the cooling pipe 301 to alleviate the problem of the support cylinder 101 overheating, and then exits from the cooling water outlet pipe 303.
[0036] The above embodiments are merely preferred embodiments of the present invention and should not be construed as limiting the scope of protection of the present invention. Any non-substantial changes and substitutions made by those skilled in the art based on the present invention shall fall within the scope of protection claimed by the present invention.
Claims
1. A dual-temperature zone evaporation source, characterized in that, It includes a stirring mechanism (1), a discharge mechanism (2) is fixedly connected to the top of the stirring mechanism (1), and a cooling mechanism (3) is fixedly connected inside the stirring mechanism (1); The stirring mechanism (1) includes a support cylinder (101), a crucible (102) is snapped into the inside of the support cylinder (101), a first heating wire (103) is provided on the surface of the crucible (102), a second heating wire (104) is provided on the surface of the crucible (102), a heat shield layer (105) is fixedly connected inside the support cylinder (101), a connecting conduit (106) is fixedly connected to the top of the support cylinder (101), a drive motor (107) is fixedly connected to the top of the connecting conduit (106), a rotating shaft (108) is fixedly connected to the output end of the drive motor (107), a wall rod (109) is fixedly connected to the surface of the rotating shaft (108), a guide plate (110) is fixedly connected inside the connecting conduit (106), and a guide hole (111) is opened inside the guide plate (110).
2. The dual-temperature zone evaporation source as described in claim 1, characterized in that: The top of the connecting conduit (106) is provided with a through groove, and the surface of the rotating shaft (108) penetrates the interior of the connecting conduit (106).
3. The dual-temperature zone evaporation source as described in claim 1, characterized in that: The wall rod (109) is located inside the crucible (102).
4. The dual-temperature zone evaporation source as described in claim 1, characterized in that: The discharge mechanism (2) includes a connecting pipe (201), an empty chamber (202) is fixedly connected to the top of the connecting pipe (201), a discharge pipe (203) is fixedly connected to the top of the empty chamber (202), and a pressure sensor (204) is fixedly connected to the front end of the empty chamber (202).
5. The dual-temperature zone evaporation source as described in claim 4, characterized in that: The connecting tube (201) is located at the top of the connecting conduit (106), and there are two connecting tubes (201).
6. The dual-temperature zone evaporation source as described in claim 1, characterized in that: The cooling mechanism (3) includes a cooling pipe (301), a cooling water inlet pipe (302) is fixedly connected to the bottom of the support cylinder (101), and a cooling water outlet pipe (303) is fixedly connected to the bottom of the support cylinder (101).
7. The dual-temperature zone evaporation source as described in claim 6, characterized in that: The cooling pipe (301) is located inside the support cylinder (101), and the cooling pipe (301) is connected to the cooling water inlet pipe (302) and the cooling water outlet pipe (303).