Electroplating flow control device and electroplating equipment

Abstract

The invention discloses an electroplating flow control device and electroplating equipment. The device comprises a controller which is used for controlling the flow of liquid when an initial signal indicating that an electroplating process starts to be executed is received; the PID program module is embedded in the controller, is started in response to the initial signal received by the controller, acquires a flow feedback value based on the scanning frequency of the controller, and calculates an intermediate output quantity based on the flow feedback value; the controller is further used for judging a target flow interval where the intermediate output quantity is located, determining a flow increase value corresponding to the target flow interval, and increasing flow output based on the flow increase value and a flow feedback value; the target flow interval is one of the flow intervals, and the flow interval is formed by dividing a single flow interval limited from zero to a target value into a plurality of continuous N flow intervals. The problem that hardware equipment is abnormal due to the fact that a control algorithm is long in scanning period and flow output of the control algorithm is rapidly and frequently switched is solved.

Description

Technical Field

[0001] This invention relates to the field of industrial equipment technology, and in particular to an electroplating flow control device and an electroplating equipment. Background Technology

[0002] In semiconductor manufacturing, the precision of electroplating liquid flow control by electroplating equipment plays a crucial role in the performance of the electroplated products. Taking electroplating as an example, it is a critical process step in forming key structures such as metal interconnect layers, bumps, and redistribution layers. Flow control of the electroplating liquid is a vital aspect of the electroplating equipment's performance. Specifically, the flow of the electroplating liquid is driven by a liquid flow output pump, which utilizes the centrifugal force generated by the impeller rotation to transport the liquid. A frequency converter is the drive unit for an asynchronous motor, and the controller uses a control algorithm to control the frequency converter, thereby controlling the asynchronous motor's speed and ultimately controlling the flow rate of the electroplating liquid. However, existing control algorithms suffer from problems such as long scan cycles and rapid, frequent switching of the control algorithm's flow output, leading to hardware malfunctions. Summary of the Invention

[0003] This invention provides an electroplating flow control device and electroplating equipment to improve the problems of long scanning cycles and rapid and frequent switching of flow output caused by control algorithms, which lead to hardware malfunctions.

[0004] According to one aspect of the present invention, an electroplating flow control device is provided, comprising:

[0005] The controller is communicatively connected to the electroplating process module and is used to control the flow of liquid when it receives an initial signal from the electroplating process module to start the electroplating process. The initial signal is used to indicate that flow control is required before the electroplating process starts and to indicate the target value that the flow control needs to achieve when the electroplating process starts. The target value is the volume of liquid passing tangentially through the wafer surface to be electroplated per unit time.

[0006] A PID program module, which is embedded in the controller, is activated in response to the initial signal received by the controller. It is used to obtain a flow feedback value based on the scanning frequency of the controller and to calculate an intermediate output value based on the flow feedback value.

[0007] The controller is also used to determine the target flow range in which the intermediate output is located, determine the flow increase value corresponding to the target flow range based on the target flow range, increase the flow output based on the flow increase value and the flow feedback value, and cyclically transmit the flow feedback value to the PID program module.

[0008] The target flow range is one of the flow ranges. The flow range is a single flow range defined by zero to the target value divided into multiple consecutive N flow ranges, where N is an integer greater than 1. The flow increase values ​​corresponding to different flow ranges are the same or different, and the N flow ranges correspond to at least two different flow increase values.

[0009] Optionally, the electroplating flow control device further includes: a liquid sensor, which is installed on the liquid pump or a pipeline connected to the liquid pump and is communicatively connected to the controller, for feeding back the monitored liquid flow rate or flow rate to the controller, so that the controller generates a flow feedback value and transmits it to the PID program module.

[0010] Optionally, the electroplating flow control device further includes: a frequency converter and a liquid pump connected to the frequency converter, wherein the liquid pump controls the output flow rate or flow rate of the liquid by controlling the frequency of the frequency converter, thereby controlling the flow rate or flow rate of the liquid in the pipeline, and the time interval of the frequency change of the frequency converter is greater than the scanning time interval of the controller.

[0011] Optionally, after obtaining the traffic feedback value, the method further includes:

[0012] The PID program module determines whether the absolute value of the difference between the received flow feedback value and the target value is greater than the dead zone value in the PID program module;

[0013] If so, the PID program module calculates the product of the first difference and the second difference and zero. The first difference is the difference between the flow feedback value received at the current frequency and the target value calculated by the PID program module. The second difference is the difference between the flow feedback value received at a frequency prior to the current frequency and the target value calculated by the PID program module.

[0014] When the product is greater than zero, the integral value in the PID program module is increased;

[0015] The step of the PID program module calculating an intermediate output based on the flow feedback value is as follows:

[0016] The PID program module calculates an intermediate output based on the integral of the flow feedback value.

[0017] Optionally, when the absolute value is less than the dead zone value, the magnitude of the flow feedback value received by the PID program module and the target value are determined.

[0018] When the flow feedback value is greater than the target value, flow control is performed to change the flow output to the target value;

[0019] When the traffic feedback value is less than the target value, the current traffic feedback value is kept unchanged and traffic is output.

[0020] Optionally, the N flow intervals are divided using the following method:

[0021] Based on the usage environment and flow control accuracy, plan the number N of flow intervals to be divided between 0 and the target value;

[0022] Based on the quantity N, N interconnected flow intervals are divided from 0 to the target value, and the N flow intervals are divided at equal or unequal intervals.

[0023] Each of the N flow intervals is assigned a corresponding flow increment value. The flow increment value is used to limit the flow value that needs to be increased next time based on the current flow feedback value received by the PID program module, and the flow increment value has at least two different values.

[0024] The set flow increase value is adjusted so that in N consecutive flow intervals, according to the sequence number of the flow interval, the smaller the sequence number, the larger the corresponding flow increase value, and the larger the sequence number, the smaller the corresponding flow increase value.

[0025] Optionally, the N flow intervals are all set with different flow increment values, and the difference between the flow increment values ​​of any two adjacent flow intervals is the same.

[0026] According to another aspect of the present invention, an electroplating apparatus is provided, comprising a control module and an electroplating process module connected to the control module, the electroplating process module being used to perform an electroplating process on a wafer under the control of the control module;

[0027] The control module includes a controller as described in any embodiment of the present invention, and the controller is embedded with a PID program module as described in any embodiment of the present invention. The control module controls the electroplating process module to perform the electroplating process through the controller and the PID program module.

[0028] Optionally, the electroplating process module includes at least an electroplating chamber and a pipe directly or indirectly connected to the electroplating chamber. The pipe is used to supply electroplating liquid to the electroplating chamber, and when the electroplating chamber is in the electroplating process state, the flow rate of the electroplating liquid supplied by the pipe to the electroplating chamber is a fixed target value.

[0029] The pipeline is equipped with a liquid sensor that is communicatively connected to the controller. The controller controls the flow rate or flow rate of the pipeline based on the PID program module, using the flow rate or flow rate feedback from the liquid sensor.

[0030] Optionally, the pipeline is connected to a liquid flow output pump and a frequency converter, and the frequency converter controls the flow rate output by the liquid flow output pump to the pipeline based on the set frequency of the liquid flow output pump under the action of the controller.

[0031] Optionally, the electroplating process module includes at least an electroplating chamber and a fixture; wherein, the electroplating liquid flows in the electroplating chamber, and the fixture is used to hold the wafer; the control module is used to control the fixture to sink the wafer into the electroplating liquid for electroplating after detecting that the flow rate of the electroplating liquid is stable.

[0032] The electroplating flow control device provided in this embodiment of the invention utilizes a scanning cycle set within the controller to cyclically feed back the changed flow value to the PID program module according to the scanning frequency. This helps ensure that the flow feedback value enters the PID program module stably and quickly, thereby enabling flow control through the PID algorithm and achieving rapid response to flow fluctuations. Simultaneously, the controller provided in this embodiment of the invention employs segmented control for flow control, dividing a single flow range defined from zero to the target value into N consecutive flow ranges. Based on the target flow range where the intermediate output value calculated by the PID program module falls, the flow increase value is determined. Finally, based on the flow increase value and the flow feedback value, the flow output is increased. This limits the increase in flow output during the flow increase process, thereby reducing the rate of increase in liquid flow velocity and minimizing the impact on hardware caused by excessively rapid increases in liquid flow velocity.

[0033] It should be understood that the description in this section is not intended to identify key or essential features of the embodiments of the present invention, nor is it intended to limit the scope of the invention. Other features of the invention will become readily apparent from the following description. Attached Figure Description

[0034] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0035] Figure 1 This is a schematic diagram of the structure of an electroplating flow control device provided in an embodiment of the present invention;

[0036] Figure 2 A schematic flowchart of a flow control method executed by an electroplating flow control device is provided for an embodiment of the present invention;

[0037] Figure 3 This is a schematic diagram of another electroplating flow control device provided in an embodiment of the present invention;

[0038] Figure 4 A schematic flowchart of another flow control method using an electroplating flow control device provided in an embodiment of the present invention;

[0039] Figure 5 A schematic flowchart of another flow control method using an electroplating flow control device provided in an embodiment of the present invention;

[0040] Figure 6 A schematic flowchart of another flow control method using an electroplating flow control device provided in an embodiment of the present invention;

[0041] Figure 7 A schematic flowchart of another flow control method using an electroplating flow control device provided in an embodiment of the present invention;

[0042] Figure 8 A schematic flowchart of another flow control method using an electroplating flow control device provided in an embodiment of the present invention;

[0043] Figure 9 A schematic flowchart of another flow control method using an electroplating flow control device provided in an embodiment of the present invention;

[0044] Figure 10 This is a schematic diagram of the structure of an electroplating device provided in an embodiment of the present invention;

[0045] Figure 11 This is a schematic diagram of another electroplating device provided in an embodiment of the present invention. Detailed Implementation

[0046] To enable those skilled in the art to better understand the present invention, the technical solutions of the present invention will be clearly and completely described below with reference to the accompanying drawings of the embodiments of the present invention. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the scope of protection of the present invention.

[0047] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this invention are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of the invention described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover a non-exclusive inclusion; for example, a process, method, system, product, or apparatus that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or apparatus.

[0048] This invention provides an electroplating flow control device, which can be a controller for a semiconductor device, such as a PLC (Industrial Logic Controller). The device is applied to electroplating equipment, which includes at least an electroplating process module. Exemplarily, the electroplating process module includes a fixture and an electroplating chamber, which can be separate or combined. The fixture can move up and down and rotate. During electroplating, the fixture holds the wafer and lowers it into the electroplating liquid within the electroplating chamber. The electroplating liquid is in a circulating state, flowing tangentially across the front side of the wafer. The electroplating liquid contains metal cations. During electroplating, the wafer acts as a cathode, and copper ions in the electroplating liquid are converted into copper metal atoms through the cathode, which adhere to the wafer surface to achieve copper electroplating. The flow rate of the electroplating liquid needs to be constant at a target value, for example, 50L, 60L, 70L per minute, etc., referring to the volume of liquid flowing tangentially across the wafer surface per minute. The electroplating liquid flows into the electroplating chamber through pipes. The flow rate varies depending on the pipe diameter, but the target flow rate per minute must be maintained. Specifically, the narrower the pipe, the higher the flow rate; the wider the pipe, the lower the flow rate.

[0049] It should be noted that the target value can be the flow rate of liquid flowing through a pipe per unit time, the flow rate of liquid output from a flow output pump per unit time, or the flow rate of liquid flowing through a specific object per unit time, such as the tangential flow rate through a wafer surface. Specifically, these flow rates can be controlled using a PID program, and in a relatively gentle manner.

[0050] Figure 1 This is a schematic diagram of an electroplating flow control device provided in an embodiment of the present invention. See also... Figure 1 The electroplating flow control device includes:

[0051] The controller 10 is connected in communication with the electroplating process module and is used to control the flow of liquid when it receives the initial signal from the electroplating process module to start the electroplating process. The initial signal is used to indicate that flow control is required before the electroplating process starts and to indicate the target value that the flow control needs to achieve when the electroplating process starts. The target value is the volume of liquid passing tangentially through the wafer surface to be electroplated per unit time.

[0052] The PID program module 110 is embedded in the controller 10 and is started in response to the initial signal received by the controller 10. It is used to obtain the flow feedback value based on the scanning frequency of the controller 10 and calculate an intermediate output value based on the flow feedback value.

[0053] The controller 10 is also used to determine the target flow range where the intermediate output is located, and based on the target flow range, determine the flow increase value corresponding to the target flow range. Based on the flow increase value and the flow feedback value, the flow output is increased, and the flow feedback value is cyclically transmitted to the PID program module 110.

[0054] The target flow range is one of the flow ranges. A flow range is a single flow range defined by zero to the target value that is divided into multiple consecutive N flow ranges, where N is an integer greater than 1. Different flow ranges may correspond to the same or different flow increase values, and the N flow ranges correspond to at least two different flow increase values.

[0055] The PID program module 110 is internal software code of the controller 10 to implement the PID function, eliminating the need for separate PID hardware. Whether the PID program module 110 needs to be enabled depends on whether precise control of the liquid flow rate is required. In some embodiments, the PID program module 110 is enabled during wafer electroplating. The scanning frequency of the controller 10 is determined internally, and the scanning frequency f is the reciprocal of the scanning period T, i.e., T = 1 / f. For example, the controller 10 is a PLC with a scanning period of 1 ms.

[0056] The setting of N flow ranges limits the increase in flow output during the flow increase process when the wet scrubbing equipment starts up, thereby reducing the rate of increase in liquid flow velocity and minimizing the impact on the hardware caused by excessively rapid liquid flow velocity increases. For example, a smaller flow feedback value indicates a larger gap between the current liquid flow rate and the target value. Selecting a target flow range with a larger flow increase value helps ensure a rapid increase in liquid flow while minimizing impact on the hardware. Conversely, a larger flow feedback value indicates a smaller gap between the current liquid flow rate and the target value. Selecting a target flow range with a smaller flow increase value improves the accuracy of liquid flow control and further reduces the impact of the liquid on the hardware.

[0057] Figure 2 This is a schematic flowchart illustrating a flow control method executed by an electroplating flow control device, provided as an embodiment of the present invention. See also... Figure 2 The flow control method executed by the electroplating flow control device provided in this embodiment of the invention includes the following steps:

[0058] S110. In response to receiving the initial signal for flow control, start the PID program module in the controller;

[0059] The initial signal is used to indicate that flow control is required before the electroplating process begins, and to indicate the target value that the flow control needs to achieve at the start of the electroplating process. The target value is the volume of liquid passing through per unit time.

[0060] During electroplating, the fixture carries the wafer and rotates it in the electroplating chamber. The electroplating solution can only flow over the surface of the wafer to be electroplated. In order to ensure the electroplating effect, the flow rate of the electroplating solution flowing through the surface of the wafer to be electroplated per unit time needs to meet the requirements. The target value is set to meet the requirements. Different electroplating processes can have different target values.

[0061] The S120 and PID program modules obtain the flow feedback value received at the current scanning frequency based on the current scanning frequency.

[0062] S130, the PID program module calculates an intermediate output based on the flow feedback value;

[0063] S140. Determine the target flow range where the intermediate output quantity is located. The target flow range is one of the flow ranges.

[0064] The flow range is defined as dividing a single flow range from zero to the target value into N consecutive flow ranges, where N is an integer greater than 1; specifically, target flow range 1, target flow range 2, target flow range 3, ..., target flow range N.

[0065] S150. Based on the target flow range, determine the flow increase value corresponding to the target flow range, wherein the flow increase values ​​corresponding to different flow ranges are the same or different, and the N flow ranges correspond to at least two different flow increase values.

[0066] S160: Based on the increase in flow rate and the flow rate feedback value, increase the flow rate output; and generate a new flow rate feedback value that is cyclically passed to the PID program module.

[0067] The electroplating flow control device provided in this embodiment of the invention utilizes a scanning cycle set within the controller to cyclically feed back the changed flow value to the PID program module according to the scanning frequency. This helps ensure that the flow feedback value enters the PID program module stably and quickly, thereby enabling flow control through the PID algorithm and achieving rapid response to flow fluctuations. Simultaneously, the controller provided in this embodiment of the invention employs segmented control for flow control, dividing a single flow range defined from zero to the target value into N consecutive flow ranges. Based on the target flow range where the intermediate output value calculated by the PID program module falls, the flow increase value is determined. Finally, based on the flow increase value and the flow feedback value, the flow output is increased. This limits the increase in flow output during the flow increase process, thereby reducing the rate of increase in liquid flow velocity and minimizing the impact on hardware caused by excessively rapid increases in liquid flow velocity.

[0068] See also Figure 1 Based on the above embodiments, optionally, the electroplating flow control device further includes: a liquid sensor 20, which is installed on the liquid pump or the pipeline connected to the liquid pump and is communicatively connected to the controller 10, for feeding back the monitored liquid flow rate or flow rate to the controller 10, so that the controller 10 generates a flow feedback value and transmits it to the PID program module 110.

[0069] The liquid pump delivers liquid into the cavity through a pipeline to maintain a stable flow rate within the cavity. The faster the liquid pump rotates, the faster the liquid flows; conversely, the slower the liquid pump rotates, the slower the liquid flows. Placing the liquid sensor 20 on the liquid pump or the pipeline connected to it facilitates accurate detection of the liquid's flow rate or velocity.

[0070] Figure 3 This is a schematic diagram of another electroplating flow control device provided in an embodiment of the present invention. See also... Figure 3 Based on the above embodiments, optionally, the electroplating flow control device further includes: a frequency converter 30 and a liquid pump 40 connected to the frequency converter 30. The liquid pump 40 controls the flow rate or flow of its output by controlling the frequency of the frequency converter 30, thereby controlling the flow rate or flow of the liquid in the pipe 50. The time interval of the frequency change of the frequency converter 30 is greater than the scanning time interval of the controller 10.

[0071] Liquid pump 40 delivers liquid to cavity 60 through pipe 50 to maintain a stable flow rate in cavity 60. Inverter 30, controlled by controller 10, changes the frequency of its output voltage, thereby controlling the rotational speed of liquid pump 40. For example, the inverter 30 outputs a voltage at a frequency of 50Hz, and liquid pump 40 outputs liquid at a flow rate of 30L per minute.

[0072] The change in the output frequency of inverter 30 affects the change in the output flow rate of liquid pump 40, but there is a minimum time limit for the time interval between the output frequency changes of inverter 30. For example, if the output frequency of inverter 30 needs to change, inverter 30 needs to wait 2 seconds. That is, 2 seconds after receiving the command to change the output frequency, inverter 30 changes the output frequency from 50Hz to 56Hz. Because the output frequency of inverter 30 increases to 56Hz, the output flow rate of liquid pump 40 increases, for example, from 30L per minute to 40L per minute.

[0073] In this embodiment, the time interval for the frequency change of the inverter 30 is the control cycle of the inverter 30, and the scan time interval for the controller 10 to receive the flow feedback value and execute the PID program module is the scan cycle of the controller 10. Typically, the scan cycle of the controller 10 is much shorter than the control cycle of the inverter 30; for example, the scan cycle of the controller 10 is 1ms, and the control cycle of the inverter 30 is 2s. This configuration in this embodiment of the invention allows sufficient time for the inverter 30 to respond to control commands, ensuring the stability and lifespan of the hardware.

[0074] exist Figure 3 In the example shown, a liquid sensor 20 is disposed on a pipe 50 connected to a liquid pump 40; in other embodiments, the liquid sensor 20 may also be disposed on the liquid pump 40 to monitor the flow rate or flow rate of the liquid, and can be configured as needed in practical applications.

[0075] Figure 4 A schematic flowchart illustrating another flow control method executed by an electroplating flow control device, provided as an embodiment of the present invention. See also... Figure 4 Based on the above embodiments, optionally, in S120, the flow feedback value received at the current scanning frequency is obtained, and then the flow control method further includes the following steps:

[0076] S170, compare dead zone; specifically, the PID program module determines whether the absolute value of the difference between the received flow feedback value and the target value is greater than the dead zone value in the PID program module; if so, execute S180.

[0077] S180. Calculate the first difference and the second difference; wherein, the first difference is the difference between the flow feedback value received at the current frequency and the target value calculated by the PID program module, and the second difference is the difference between the flow feedback value received at a frequency prior to the current frequency and the target value calculated by the PID program module.

[0078] S190, compare the product of the first difference and the second difference with zero; specifically, the PID program module calculates the product of the first difference and the second difference with zero;

[0079] S1A0: When the product is greater than zero, increase the integral value in the PID program module;

[0080] S1B0: When the product is less than or equal to zero, the integral value in the PID program module is cleared to zero.

[0081] Correspondingly, the step of S130 and the PID program module calculating an intermediate output based on the flow feedback value is as follows: the PID program module calculates an intermediate output based on the integral value calculated by the flow feedback value.

[0082] The dead zone value is set to prevent constant adjustments to the controller's output. In practical applications, the dead zone value can be understood as a tolerance range. For example, the dead zone value is set to 1; in other embodiments, the dead zone value can be other values, depending on the controller's control precision. Specifically, if the calculated absolute value is less than the dead zone value, the process terminates without further calculation; if the calculated absolute value is greater than the dead zone value, it indicates that the flow control precision requirements have not been met, and the PID algorithm needs to continue execution.

[0083] In this embodiment of the invention, flow control is only performed to change the flow output when the absolute value of the difference between the flow feedback value received at the current scanning frequency and the target value is greater than the dead zone value. This helps to avoid rapid and frequent switching of the flow output of the control algorithm, thereby contributing to the stable operation of the hardware device.

[0084] Here, Ek represents the first difference and Ek1 represents the second difference. The product of the first and second differences is represented as Ek·Ek1. The comparison of Ek·Ek1 with zero has two possible outcomes. For example, with a target value of 60L, one outcome is that one of the traffic feedback values ​​received at the current frequency and at a previous frequency is greater than or equal to 60L, while the other is less than or equal to 60L. In this case, Ek≥0 and Ek1≤0, or Ek≤0 and Ek1≥0, then Ek·Ek1≤0. The second outcome is that both the traffic feedback values ​​received at the current frequency and at a previous frequency are less than 60L. In this case, Ek<0 and Ek1<0, then Ek·Ek1>0.

[0085] The first case (i.e., Ek·Ek1≤0) indicates that the output flow rate is near the target value, and no increase in output flow rate is needed. Therefore, the integral quantity in the PID program module is cleared to zero. In one embodiment, clearing the integral quantity to zero indicates that the output flow rate has reached the target value, and the liquid is output at a stable flow rate. At this time, the liquid flow output pump will output the flow rate according to the target value. In another embodiment, taking an electroplating device as an example, when the electroplating process ends, the current state is exited, the liquid stops flowing, and it waits for the initial signal of the next electroplating process, until the liquid flow rate stabilizes, and then the integral quantity is cleared to zero. The second case (i.e., Ek·Ek1>0) indicates that the output flow rate is insufficient and needs to be increased. Therefore, the integral quantity in the PID program module is increased. Optionally, the integral quantity Ej=Ej+Ej·Ki; where Ki is the integral gain.

[0086] It should be noted that since the flow rate is not allowed to exceed the target value after comparing the flow feedback value with the target value, situations where Ek > 0 or Ek1 > 0 generally will not occur. For example, if the target value is 60L, and the flow feedback value received at the current frequency is 60.2, the PID program module will reduce the flow output through flow control. The flow feedback value received at a frequency after the current frequency will be 60 or less. Therefore, a situation where the flow feedback value received at the current frequency is 60.2 and the flow feedback value received at a frequency after the current frequency is 60.5 will not occur.

[0087] Optionally, the intermediate output quantity is calculated using the formula: Intermediate Output Quantity = Ek Kp+Ej+(Ek1-Ek) Kd; where Ej is the integral quantity, Kp is the proportional gain, Kd is the derivative gain, Ek is the first difference, and Ek1 is the second difference. Specifically, the larger the integral quantity, the larger the intermediate output quantity, thereby achieving rapid control of body fluid flow.

[0088] Figure 5 A schematic flowchart illustrating another flow control method executed by an electroplating flow control device, provided as an embodiment of the present invention. See also... Figure 5 Optionally, based on the above embodiments, the flow control method further includes the following steps:

[0089] S1C0, compare the target value; specifically, when the absolute value is less than the dead zone value, determine the magnitude of the flow feedback value received by the PID program module and the target value.

[0090] S1D0: When the flow feedback value is greater than the target value, flow control is performed to change the flow output to the target value.

[0091] S1E0: When the flow feedback value is less than the target value, maintain the current flow feedback value and output flow.

[0092] The process involves comparing the flow feedback value with the target value, ensuring that the flow rate does not exceed the target value. Therefore, when the flow feedback value is detected to be greater than the target value (e.g., a flow rate of 60L per minute), flow control is implemented to reduce the flow output and bring it back to the target value.

[0093] Based on the above embodiments, optionally, the N traffic intervals are divided using the following method:

[0094] Based on the usage environment and flow control accuracy, plan the number N of flow intervals to be divided between 0 and the target value;

[0095] Based on the quantity N, N interconnected flow intervals are divided from 0 to the target value. The N flow intervals are divided at equal or unequal intervals.

[0096] Set corresponding flow increment values ​​for each of the N flow ranges. The flow increment value is used to limit the flow value that needs to be increased next time based on the current flow feedback value received by the PID program module, and the flow increment value must have at least two different values.

[0097] The set traffic increase value is adjusted so that in N consecutive traffic intervals, the traffic increase value is larger for smaller numbers and smaller for larger numbers.

[0098] The better the usage environment or the higher the flow control accuracy, the more flow intervals are divided; the worse the usage environment or the lower the flow control accuracy, the fewer flow intervals are divided.

[0099] Dividing N flow ranges into equal intervals means dividing the value from 0 to the target value evenly, with each interval having the same span. For example, if the target value is 60 and N=6, then each flow range has a span of 10, and the flow ranges are 0-10, 10-20, 20-30, 30-40, 40-50, and 50-60. Dividing N flow ranges into unequal intervals means dividing the value from 0 to the target value unevenly, with each flow range having a span that is not exactly equal. For example, if the target value is 60 and N=6, the flow ranges have spans of 20, 10, 10, 10, 5, and 5, and the corresponding flow ranges are 0-20, 20-30, 30-40, 40-50, 50-55, and 55-60.

[0100] Furthermore, the flow intervals are labeled. Taking N equally spaced flow intervals as an example, the intervals 0-10, 10-20, 20-30, 30-40, 40-50, and 50-60 are numbered 1, 2, 3, 4, 5, and 6 respectively. From flow interval 1 to flow interval 6, the corresponding flow increase gradually decreases. Flow interval 1 has the largest flow increase, for example, a flow increase of 6; flow interval 6 has the smallest flow increase, for example, a flow increase of 1.

[0101] Based on the above embodiments, optionally, the corresponding flow increase values ​​for the N flow intervals are all different, and the difference between the flow increase values ​​corresponding to any two adjacent flow intervals is the same.

[0102] like Figure 6 As shown, for example, the target value is 60, N=6, and the flow rate is divided into 6 equally spaced intervals. The flow rate increment values ​​for each of the 6 intervals are different, and the difference between the flow rate increment values ​​of any two adjacent intervals is 1. Specifically, the 6 flow rate intervals are labeled as Flow Rate Interval 1, Flow Rate Interval 2, Flow Rate Interval 3, Flow Rate Interval 4, Flow Rate Interval 5, and Flow Rate Interval 6. Flow Rate Interval 1 represents the range 0-10, with a corresponding flow rate increment of 6; Flow Rate Interval 2 represents the range 10-20, with a corresponding flow rate increment of 5; Flow Rate Interval 3 represents the range 20-30, with a corresponding flow rate increment of 4; Flow Rate Interval 4 represents the range 30-40, with a corresponding flow rate increment of 3; Flow Rate Interval 5 represents the range 40-50, with a corresponding flow rate increment of 2; and Flow Rate Interval 6 represents the range 50-60, with a corresponding flow rate increment of 1.

[0103] Figure 7 A schematic flowchart illustrating another flow control method executed by an electroplating flow control device, provided as an embodiment of the present invention. See also... Figure 7 Based on the above embodiments, optionally, before adding flow output in S160, the method further includes:

[0104] S1F0: Determine whether the flow control frequency for controlling the change in flow output has been reached; if so, execute S160: Output flow based on the flow increase value and flow feedback value; otherwise, continue executing S1F0.

[0105] The flow control frequency for changing the flow output is a control frequency that the controlled hardware device can adapt to. For example, if the flow control frequency for changing the flow output is 2 seconds, then it is necessary to wait 2 seconds before executing S160. For example, the time required for the liquid flow rate to increase from 0 to the target value of 60 is 30 seconds. For electroplating equipment, electroplating is only started after the flow rate of the electroplating liquid has increased to the target value of 60 and remained stable.

[0106] Optionally, the flow control frequency includes the control frequency of the liquid flow output pump, and a flow velocity sensor is installed on the liquid flow output pump or the pipeline connected to the liquid flow output pump. S160, Flow output is performed based on the flow increase value and the flow feedback value, specifically including: changing the flow output by changing the flow rate of the liquid flow output pump or by changing the flow velocity in the pipeline through the liquid flow output pump; wherein, the scanning frequency is less than the control frequency of the liquid flow output pump. That is, in this embodiment of the invention, the frequency of receiving the flow feedback value and executing the PID program module is less than the frequency of the control signal received by the liquid flow output pump. For example, the scanning period at the frequency of receiving the flow feedback value and executing the PID program module is 1ms, and the control period at the frequency of the control signal received by the liquid flow output pump is 2s. This setting in this embodiment of the invention helps to reserve sufficient time for the liquid flow output pump to respond to the control command, ensuring the stability and service life of the hardware device.

[0107] Figure 8 A schematic flowchart illustrating another flow control method executed by an electroplating flow control device, provided as an embodiment of the present invention. See also... Figure 8 Based on the above embodiments, optionally, before determining the target flow range where the intermediate output quantity is located in S140, the method further includes:

[0108] S1G0, determine the sensitivity of the system;

[0109] S1H0: If the system supports fast response, multiply the increase value of the flow corresponding to the target flow range by an integer multiple, and continue to execute the step of S140, which determines the target flow range where the intermediate output is located, with the updated increase value of the flow.

[0110] S140. If the system does not support fast response, continue to execute the step of determining the target flow range where the intermediate output is located.

[0111] System sensitivity characterizes the system's responsiveness. Here, "system" can refer to the drive and control system of the liquid flow output pump. If the system does not support rapid response, its responsiveness is poor; a large increase in flow rate will impact the system or cause it to fail to respond, requiring a smaller flow rate increase value to be set. If the system supports rapid response, its responsiveness is strong, capable of responding to larger flow rate increases. Therefore, the flow rate increase value in each flow range can be increased to achieve the target flow control value more quickly.

[0112] Figure 9 A schematic flowchart illustrating another flow control method executed by an electroplating flow control device, provided as an embodiment of the present invention. See also... Figure 9Based on the above embodiments, the flow control method may optionally include the following steps:

[0113] S210. In response to receiving the initial signal for flow control, start the PID program module in the controller;

[0114] The initial signal is used to indicate that flow control is required before the electroplating process begins, and to indicate the target value that the flow control needs to achieve at the start of the electroplating process. The target value is the volume of liquid passing through per unit time.

[0115] The S220 and PID program modules obtain the flow feedback value received at the current scanning frequency based on the current scanning frequency.

[0116] The S330 and PID program modules calculate an intermediate output based on the flow feedback value.

[0117] S240. Determine the system sensitivity level; if the system does not support fast response, then execute S250.

[0118] S250. Determine the target flow range where the intermediate output quantity is located. The target flow range is one of the flow ranges.

[0119] Here, the flow range is defined as dividing a single flow range from zero to the target value into N consecutive flow ranges, where N is an integer greater than 1; specifically, target flow range 1, target flow range 2, target flow range 3, ..., target flow range N;

[0120] S260. If the system supports fast response, multiply the traffic increase value corresponding to the target traffic range by an integer multiple, and continue to execute S250 with the updated traffic increase value.

[0121] S270. Based on the target flow range, determine the flow increase value corresponding to the target flow range, wherein the flow increase values ​​corresponding to different flow ranges are the same or different, and the N flow ranges correspond to at least two different flow increase values.

[0122] S280. Determine whether the flow control frequency required to change the flow output has been reached; if yes, proceed to S290; otherwise, continue with S280.

[0123] S290: Based on the increase in flow rate and the flow rate feedback value, increase the flow rate output; and generate a new flow rate feedback value that is cyclically passed to the PID program module.

[0124] This invention utilizes a scan cycle set within the controller to cyclically feed back the changed flow rate value to the PID program module according to the scan frequency. This ensures that the flow feedback value enters the PID program module stably and quickly, enabling flow control through the PID algorithm. This achieves rapid response of the liquid flow output pump speed to flow fluctuations. Furthermore, this invention proposes a piecewise control theory, dividing a single flow range defined from zero to the target value into N consecutive flow ranges. Based on the target flow range where the intermediate output value calculated by the PID program module falls, the flow increase value is determined. Finally, based on the flow increase value and the flow feedback value, the flow output is increased. This limits the increase in flow output during the flow increase process, thereby reducing the rate of increase in liquid flow velocity and minimizing the impact on hardware caused by excessively rapid increases in liquid flow velocity.

[0125] This invention also provides an electroplating device. Figure 10 This is a schematic diagram of an electroplating device provided in an embodiment of the present invention. See also... Figure 10 The electroplating equipment includes:

[0126] The control module 1 and the electroplating process module 2 connected to the control module 1 are used to perform an electroplating process on the wafer under the control of the control module 1.

[0127] The control module 1 includes a controller 10 as in any embodiment of the present invention. The controller 10 is embedded with a PID program module as in any embodiment of the present invention. The control module 1 controls the electroplating process module 2 to perform the electroplating process through the controller 10 and the PID program module, and has corresponding beneficial effects.

[0128] Figure 11 This is a schematic diagram of another electroplating device provided in an embodiment of the present invention. See also... Figure 11 Based on the above embodiments, optionally, the electroplating process module 2 includes at least an electroplating chamber 21 and a pipe 22 connected to the electroplating chamber 21. The pipe 22 is used to provide electroplating liquid to the electroplating chamber 21, and when the electroplating chamber 21 is in the electroplating process state, the flow rate of the electroplating liquid provided by the pipe 22 to the electroplating chamber 21 is a fixed target value. A liquid sensor 3 is provided on the pipe 22 and is communicatively connected to the controller 10. The controller 10 controls the flow rate or flow of the pipe 22 based on the flow rate or flow rate fed back by the liquid sensor 3 and the PID program module.

[0129] For example, the working principle of the electroplating equipment is as follows: the pipe 22 provides electroplating liquid to the electroplating chamber 21, the liquid sensor 3 monitors the flow rate or flow of the electroplating liquid in the pipe 22 in real time, and feeds back the detected data to the controller 10 in the control device 1; the controller 10 receives the data fed back by the liquid sensor 3, and uses the flow control method provided in any embodiment of the present invention to control the flow rate or flow of the pipe 22 based on the PID program module so that the flow rate of the electroplating liquid is maintained at the target value.

[0130] In other embodiments, the liquid sensor 3 may be disposed on a pipe indirectly connected to the electroplating chamber 21. Alternatively, the liquid sensor 3 may be disposed on the liquid flow output pump 4.

[0131] The electroplating liquid flows into the electroplating chamber 21 through pipe 22. The flow rate varies depending on the diameter of pipe 22, but a fixed flow rate (e.g., 60L per minute) must be ensured. Specifically, the narrower the pipe 22, the higher the flow rate; the wider the pipe 22, the lower the flow rate.

[0132] See also Figure 11 Based on the above embodiments, optionally, the pipeline 22 is connected to a liquid flow output pump 4 and a frequency converter 5. The frequency converter 5 controls the flow rate output by the liquid flow output pump 4 to the pipeline 22 based on the set frequency of the liquid flow output pump 4 under the action of the controller 10.

[0133] The liquid flow output pump 4, also known as a liquid pump, is located between the liquid flow output pump 4 and the control module 1. The frequency converter 5 provides voltage to the liquid flow output pump 4, and the control module 1 indirectly controls the output flow rate or velocity of the liquid flow output pump 4 by directly controlling the working state of the frequency converter 5. For example, the working principle of this electroplating equipment is as follows: the pipe 22 provides electroplating liquid to the electroplating chamber 21; the liquid sensor 3 monitors the flow rate or velocity of the electroplating liquid in the pipe 22 in real time and feeds back the detected data to the controller 10 in the control device 1; the controller 10 receives the data from the liquid sensor 3 and uses the flow control method provided in any embodiment of the present invention, based on the PID program module, to control the working state of the frequency converter 5. The frequency converter 5 adjusts its output voltage to adjust the output flow rate of the liquid flow output pump 4, thereby adjusting the flow rate or velocity of the pipe 22, so that the flow rate of the electroplating liquid is maintained at the target value.

[0134] See also Figure 9Based on the above embodiments, optionally, the electroplating process module 2 includes at least an electroplating chamber 21 and a clamp 23; wherein, the electroplating liquid flows in the electroplating chamber 21, and the clamp 23 is used to hold the wafer; the control module 1 is used to control the clamp 23 to sink the wafer into the electroplating liquid for electroplating after detecting that the flow rate of the electroplating liquid is stable.

[0135] For example, the fixture 23 and the electroplating chamber 21 can be separate or combined. The fixture 23 can move up and down and rotate. During electroplating, the fixture 23 holds the wafer and lowers it into the electroplating liquid inside the electroplating chamber 21. The electroplating liquid is in a state of circulation and can flow tangentially over the front side of the wafer. The electroplating liquid contains metal cations. The wafer acts as a cathode during the electroplating process, and the copper ions in the electroplating liquid are converted into copper metal atoms through the cathode and adhere to the surface of the wafer to achieve copper electroplating.

[0136] It should be understood that the various forms of processes shown above can be used, with steps reordered, added, or deleted. For example, the steps described in this invention can be executed in parallel, sequentially, or in different orders, as long as the desired result of the technical solution of this invention can be achieved, and this is not limited herein.

[0137] The specific embodiments described above do not constitute a limitation on the scope of protection of this invention. Those skilled in the art should understand that various modifications, combinations, sub-combinations, and substitutions can be made according to design requirements and other factors. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of this invention should be included within the scope of protection of this invention.

Claims

1. An electroplating flow control device, characterized in that, Applied to electroplating equipment, the electroplating equipment includes at least an electroplating process module, including: The controller is communicatively connected to the electroplating process module and is used to control the flow of liquid when it receives an initial signal from the electroplating process module to start the electroplating process. The initial signal is used to indicate that flow control is required before the electroplating process starts and to indicate the target value that the flow control needs to achieve when the electroplating process starts. The target value is the volume of liquid passing tangentially through the wafer surface to be electroplated per unit time. A PID program module, which is embedded in the controller, is activated in response to the initial signal received by the controller. It is used to obtain a flow feedback value based on the scanning frequency of the controller and to calculate an intermediate output value based on the flow feedback value. The controller is also used to determine the target flow range in which the intermediate output is located, determine the flow increase value corresponding to the target flow range based on the target flow range, increase the flow output based on the flow increase value and the flow feedback value, and cyclically transmit the flow feedback value to the PID program module. The target flow range is one of the flow ranges. The flow range is a single flow range defined by zero to the target value divided into multiple consecutive N flow ranges, where N is an integer greater than 1. The flow increase values ​​corresponding to different flow ranges are the same or different, and the N flow ranges correspond to at least two different flow increase values.

2. The electroplating flow control device as described in claim 1, characterized in that, Also includes: A liquid sensor is installed on a liquid pump or a pipe connected to the liquid pump and communicates with the controller to feed back the monitored liquid flow rate or volume to the controller, so that the controller generates a flow feedback value and transmits it to the PID program module.

3. The electroplating flow control device as described in claim 2, characterized in that, Also includes: A frequency converter and a liquid pump connected to the frequency converter, wherein the liquid pump controls the flow rate or flow rate of the liquid in the pipeline by controlling the frequency of the frequency converter, and the time interval of the frequency change of the frequency converter is greater than the scanning time interval of the controller.

4. The electroplating flow control device as described in claim 1, characterized in that, After obtaining the traffic feedback value, the process further includes: The PID program module determines whether the absolute value of the difference between the received flow feedback value and the target value is greater than the dead zone value in the PID program module; If so, the PID program module calculates the product of the first difference and the second difference and zero. The first difference is the difference between the flow feedback value received at the current frequency and the target value calculated by the PID program module. The second difference is the difference between the flow feedback value received at a frequency prior to the current frequency and the target value calculated by the PID program module. When the product is greater than zero, the integral value in the PID program module is increased; The step of the PID program module calculating an intermediate output based on the flow feedback value is as follows: The PID program module calculates an intermediate output based on the integral of the flow feedback value.

5. The electroplating flow control device as described in claim 4, characterized in that, When the absolute value is less than the dead zone value, the magnitude of the flow feedback value received by the PID program module and the target value are determined. When the flow feedback value is greater than the target value, flow control is performed to change the flow output to the target value; When the traffic feedback value is less than the target value, the current traffic feedback value is kept unchanged and traffic is output.

6. The electroplating flow control device as described in claim 1, characterized in that, The N flow ranges are divided using the following method: Based on the usage environment and flow control accuracy, plan the number N of flow intervals to be divided between 0 and the target value; Based on the quantity N, N interconnected flow intervals are divided from 0 to the target value, and the N flow intervals are divided at equal or unequal intervals. Each of the N flow intervals is assigned a corresponding flow increment value. The flow increment value is used to limit the flow value that needs to be increased next time based on the current flow feedback value received by the PID program module, and the flow increment value has at least two different values. The set flow increase value is adjusted so that in N consecutive flow intervals, according to the sequence number of the flow interval, the smaller the sequence number, the larger the corresponding flow increase value, and the larger the sequence number, the smaller the corresponding flow increase value.

7. The electroplating flow control device as described in claim 6, characterized in that, The N flow ranges are all set with different flow increase values, and the difference between the flow increase values ​​of any two adjacent flow ranges is the same.

8. An electroplating device, characterized in that, It includes a control module and an electroplating process module connected to the control module, wherein the electroplating process module is used to perform an electroplating process on the wafer under the control of the control module; The control module includes a controller as described in any one of claims 1-7, wherein the controller is embedded with a PID program module as described in any one of claims 1-7, and the control module controls the electroplating process module to perform the electroplating process through the controller and the PID program module.

9. The electroplating equipment as described in claim 8, characterized in that, The electroplating process module includes at least an electroplating chamber and a pipe directly or indirectly connected to the electroplating chamber. The pipe is used to supply electroplating liquid to the electroplating chamber, and when the electroplating chamber is in the electroplating process state, the flow rate of the electroplating liquid supplied by the pipe to the electroplating chamber is a fixed target value. The pipeline is equipped with a liquid sensor that is communicatively connected to the controller. The controller controls the flow rate or flow rate of the pipeline based on the PID program module, using the flow rate or flow rate feedback from the liquid sensor.

10. The electroplating equipment as described in claim 9, characterized in that, The pipeline is connected to a liquid flow output pump and a frequency converter. The frequency converter controls the flow rate output by the liquid flow output pump to the pipeline based on the set frequency of the liquid flow output pump under the action of the controller.

11. The electroplating equipment as described in claim 8, characterized in that, The electroplating process module includes at least an electroplating chamber and a fixture; wherein, the electroplating liquid flows in the electroplating chamber, and the fixture is used to hold the wafer; the control module is used to control the fixture to sink the wafer into the electroplating liquid for electroplating after detecting that the flow rate of the electroplating liquid is stable.

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