Light-emitting device and preparation method thereof as well as reflective sighting telescope and sighting method thereof

Abstract

The invention discloses a light-emitting device and a preparation method thereof, and a reflective sighting telescope and a sighting method thereof, relates to the technical field of reflective sighting telescopes, and solves the technical problems of high cost and tedious replacement and correction steps caused by a single light source in the prior art. The technical key points are as follows: the light-emitting device comprises a first substrate, and a first light-emitting element, a second light-emitting element and a diaphragm which are arranged in a die bonding area of the first substrate, wherein the first light-emitting element and the second light-emitting element are connected with the first light-emitting element in parallel to the first substrate; the second light-emitting element and the first light-emitting element are arranged along a first direction; the lens is arranged on the light-emitting side of the first light-emitting element and the light-emitting side of the second light-emitting element and focuses light emitted by the first light-emitting element or the second light-emitting element; the diaphragm is arranged on the light-emitting sides of the first light-emitting element and the second light-emitting element. The diaphragm enables light emitted by the first light-emitting element and the second light-emitting element to pass through light through holes of the diaphragm after being focused.

Description

Technical Field

[0001] This invention relates to the field of reflex sight technology, specifically to a light-emitting device and a reflex sight. Background Technology

[0002] A reflex sight is a common type of sight, consisting of a reflecting lens and a light source. The light source, also known as the aiming dot, is located at the focal point of the reflecting lens. It is typically a red or green dot. A red aiming dot uses a red-emitting point light source, while a green aiming dot uses a green-emitting point light source. Users choose different colored aiming dots depending on the application. A red aiming dot is suitable for backgrounds with a distinct color contrast to red light, such as cool-toned environments like forests or oases; a green aiming dot is suitable for backgrounds with a distinct color contrast to green light, such as warm-toned environments like deserts or Gobi. Red and green aiming dots can essentially cover all application scenarios.

[0003] The light-emitting devices in reflex sights in related technologies are usually monochromatic, meaning a reflex sight either has a red or a green aiming dot, limiting its application scenarios. If a user wants to use a reflex sight in different environments, they need to purchase an additional light-emitting device of a different color. This not only increases costs but also requires recalibrating the aiming point of the reflex sight relative to the bullet's impact point after each replacement, making the calibration process cumbersome and complex. Summary of the Invention

[0004] The purpose of this invention is to provide: A light-emitting device and related technologies are disclosed to solve the technical problems of high cost and cumbersome replacement and calibration steps caused by a single light source in the prior art.

[0005] Terminology Explanation: Unless otherwise defined, all technical terms used herein have the same meanings as commonly understood by one of ordinary skill in the art to which this subject matter pertains. Unless otherwise stated, all patents, patent inventions, and disclosures cited throughout this document are incorporated herein by reference in their entirety. Where multiple definitions exist for terms herein, the definitions provided in this chapter shall prevail.

[0006] It should be understood that the above brief description and the following detailed description are exemplary and for illustrative purposes only, and do not limit the subject matter of the invention in any way. In this invention, the singular is used in conjunction with the plural unless otherwise specifically stated. It should also be noted that, unless otherwise stated, the use of “or” or “or” means “and / or”. Furthermore, the use of the term “comprising” and other forms such as “including,” “containing,” and “contains” are not limiting.

[0007] Unless specifically defined herein, the use of various commercially available products herein employs standard techniques. For example, they may be implemented using the manufacturer's instructions for use, or in accordance with methods known in the art or the description of this invention. The techniques and methods described herein can generally be implemented according to conventional methods well known in the art, based on the descriptions in the various general and more specific documents cited and discussed in this specification.

[0008] The terms “optional / arbitrary” or “optionally / arbitrarily” mean that the event or situation described below may or may not occur, including both the occurrence and non-occurrence of the event or situation.

[0009] In a first aspect, the present invention provides: a light-emitting device for a reflective sight, comprising: A first substrate, the first substrate including a die-bonding region; A first light-emitting element is disposed inside the die-bonding region, and the first light-emitting element is electrically connected to the first substrate; A second light-emitting element is disposed inside the die-bonding region, and the second light-emitting element is electrically connected to the first substrate so that the second light-emitting element is connected in parallel with the first light-emitting element. The second light-emitting element and the first light-emitting element are arranged along a first direction, and in the first direction, the distance between the side of the first light-emitting element closer to the second light-emitting element and the second light-emitting element is 1 micrometer to 50 micrometers; An aperture is disposed on the light-emitting side of the first light-emitting element and the second light-emitting element. The orthographic projection of the light-transmitting hole of the aperture on the first substrate is located at the adjacent center of the first light-emitting element and the second light-emitting element, so that the light emitted by the first light-emitting element and the second light-emitting element can both pass through after being focused. A lens is disposed on the light-emitting side of the first light-emitting element and the second light-emitting element, and the lens is capable of focusing the light emitted by the first light-emitting element or the second light-emitting element; Wherein, the first direction is perpendicular to the thickness direction of the first substrate.

[0010] Furthermore, the lens is a condenser lens, and the light-emitting sides of the first light-emitting element and the second light-emitting element are located on the side close to the reflective lens in the reflective sight; the condenser lens converges the light emitted by the first light-emitting element and / or the second light-emitting element to the focal point of the condenser lens.

[0011] Furthermore, the lens is a concave mirror, and the light-emitting sides of the first light-emitting element and the second light-emitting element are located on the side away from the reflective lens in the reflective sight; the concave mirror converges the light emitted by the first light-emitting element and / or the second light-emitting element to the focal point of the concave mirror.

[0012] Furthermore, the first light-emitting element is capable of emitting a first light signal, and the second light-emitting element is capable of emitting a second light signal, wherein the wavelength of the second light signal is different from the wavelength of the first light signal.

[0013] Furthermore, the first light-emitting element is soldered to the first substrate via a first bonding wire, and the second light-emitting element is soldered to the first substrate via a second bonding wire. The first substrate is also provided with a protective adhesive, which is used to completely cover the solder joints at both ends of the first bonding wire, the second bonding wire, and the solder joints at both ends of the first bonding wire and the second bonding wire.

[0014] Furthermore, the first light-emitting element includes a first LED chip, which is a single-electrode chip or a dual-electrode chip; The second light-emitting element includes a second LED chip, which is a single-electrode chip or a dual-electrode chip.

[0015] Secondly, the present invention also provides a reflective sight, including a reflective lens and the aforementioned light-emitting device, wherein the light-transmitting aperture of the light-emitting device is located at the focal point of the reflective lens; the focal point of the lens in the light-emitting device coincides with the focal point of the reflective lens.

[0016] Furthermore, the reflective surface of the reflective lens is provided with a high-reflectivity coating.

[0017] Furthermore, the light-emitting device is electrically connected to a power supply and a push-button switch via a control unit. The push-button switch is used by the controller to control the opening and closing of at least one of the first light-emitting element and the second light-emitting element in the light-emitting device. Alternatively, the light-emitting device is connected to a power source via a rotary switch, and by rotating the rotary switch, at least one of the first and second light-emitting elements can be turned on and off.

[0018] Thirdly, the present invention also provides a method for preparing a light-emitting device, for preparing the above-mentioned light-emitting device, the method comprising: S100. An outer frame and a cutting channel are provided around the periphery of the substrate, and multiple die-bonding areas are provided on the substrate within the outer frame. S200: In each die-bonding region, a first light-emitting element and a second light-emitting element are prepared along a first direction, and the die-bonding adhesive is baked. S300, Weld the first light-emitting element to the substrate, and weld the second light-emitting element to the substrate; S400: Apply adhesive to the solder joints and connecting wires, and then dry them. S500: Inject transparent protective adhesive into the outer frame and dry it to form a transparent encapsulation layer on the substrate surface; S600, install aperture and lens; S700, cut along the cutting path; obtain the light-emitting device.

[0019] Fourthly, a method for adjusting the aiming point of a reflex sight, comprising: Obtain the brightness of the environment around the reflex sight ; Acquire an image of the target area, and based on the target area image, obtain the grayscale difference between the target area and the surrounding environment; The brightness of the light emitted by the light-emitting device is adjusted based on the grayscale difference.

[0020] Furthermore, based on the grayscale difference, the brightness of the emitted light from the light-emitting device is adjusted, specifically including: Convert the target region image into a grayscale image and obtain the grayscale value of each pixel; Then, draw a circle with radius R centered at the center of the target region image. Calculate the average grayscale value of all pixels within the circle with radius R, denoted as . ; Using the edges of the target region image as boundaries, extend a region of width W from the edges towards the center of the target region image. Calculate the average grayscale value of all pixels within this region of width W, denoted as . ; according to and as well as Calculate the target brightness at the aiming point:

[0021] in, This indicates the brightness of the target at the aiming point.

[0022] Furthermore, obtain the brightness of the environment surrounding the reflex sight. When using a periodic acquisition method, the sampling period is set to the basic period, and a new sampling point is set after the sampling point of each basic period; the time interval between the new sampling point and the sampling point of the previous basic period is less than the time interval of the basic period. The brightness of the environment surrounding the reflex sight is calculated based on the brightness of the sampling points of the basic period and the brightness of the new sampling points. .

[0023] Furthermore, the brightness values ​​collected from all sampling points belonging to the basic period within a given time period are recorded as follows: The brightness values ​​of all newly sampled points within the same time period are recorded as follows: Find each The difference between the brightness value collected by the next adjacent sampling point and the value collected by the new sampling point is denoted as . The difference is compared with the judgment threshold to obtain... The number of items exceeding the judgment threshold is denoted as ;but:

[0024] in, This indicates the number of sampling points belonging to the basic period within the time period. for The average value, for The average value.

[0025] Compared with the prior art, the present invention has at least the following beneficial effects: This invention uses a lens to focus the light from the light-emitting element, effectively forming a brighter circular light spot, which is then projected onto a reflecting lens. This effectively solves the problem of insufficient brightness at the aiming point or energy waste in reflective sights.

[0026] This invention focuses the light from the light-emitting element and then passes it through an aperture, resulting in a brighter light spot. Furthermore, the circular light spot formed after being blocked by the aperture has a more uniform brightness, without the problems of halo or blurred edges. This effectively solves the technical problem of uneven brightness at the aiming point of a reflex sight.

[0027] This invention calculates the final target brightness at the aiming point by combining the ambient brightness with the grayscale difference between the aiming area and the surrounding environment obtained from the image, thus creating a clear difference between the aiming point and the aiming area and improving the accuracy of aiming point recognition and aiming.

[0028] This invention employs a periodic sampling method, which is applicable not only to situations where the surrounding environment changes periodically, but also to situations where the surrounding environment changes non-periodically. It can accurately monitor the brightness of the surrounding environment, and is therefore suitable for aiming when there are changes in the ambient light. Attached Figure Description

[0029] Figure 1 This is a schematic diagram of the structure of the light-emitting device in some embodiments of this application, wherein the lens is not shown; Figure 2 for Figure 1 A cross-sectional view of the light-emitting device AA in the image, where the lens is not shown; Figure 3This is a schematic diagram of the optical principle of Embodiment 1 of this application; Figure 4 This is a top view schematic diagram of the light-transmitting aperture of the aperture and the first and second light-emitting elements in the light-emitting device in some embodiments of this application; Figure 5 This is a schematic diagram of a light-emitting device in some embodiments where the first light-emitting element is a dual-electrode chip and the second light-emitting element is a single-electrode chip. Figure 6 This is a schematic diagram of a light-emitting device in some embodiments where both the first and second light-emitting elements are dual-electrode chips. Figure 7 This is a schematic diagram of a light-emitting device in some other embodiments where both the first and second light-emitting elements are dual-electrode chips. Figure 8 This is a schematic diagram of the optical principle of Embodiment 2 of this application; Figure 9 This is a schematic diagram of light focusing according to Embodiment 2 of this application; Figure 10 This is a schematic diagram of the electric control connection of the light-emitting device in some embodiments of this application; Figure 11 This is a schematic diagram of the manual control connection of the light-emitting device in some embodiments of this application; Figure 12 for Figure 1 A diagram showing the semi-finished structure of the finished light-emitting device during the manufacturing process; Figure 13 for Figure 1 Flowchart of the manufacturing process of the finished light-emitting device; Figure 14 This is a flowchart illustrating the fabrication process of the finished light-emitting device in some embodiments; Figure 15 This is a flowchart illustrating the fabrication process of the finished light-emitting device in some other embodiments.

[0030] Explanation of reference numerals in the attached figures: 100, substrate; 200, outer frame; 300, cutting groove; 1. First solder joint; 2. Second solder joint; 3. Third solder joint; 4. Fourth solder joint; 10. First substrate; 101. Die-bonding region; 11. First light-emitting element; 12. Second light-emitting element; 13. First bonding wire; 14. Second bonding wire; 15. Transparent encapsulation layer; 201. Light-transmitting aperture; 30. Reflecting lens; 301. Reflecting surface; 40. Power supply; 41. Control unit; 42. Push-button switch; 43. Rotary switch; 5. Lens; 6. Aperture. Detailed Implementation

[0031] The following non-limiting embodiments are intended to enable those skilled in the art to gain a more comprehensive understanding of the present invention, but do not limit the invention in any way. The following content is merely an exemplary description of the scope of protection claimed by the present invention, and those skilled in the art can make various changes and modifications to the present invention based on the disclosed content, and such changes should also fall within the scope of protection claimed by the present invention.

[0032] Example 1 A reflex sight is a common type of sight, consisting of a reflecting lens and a light source. The light source, also known as the aiming dot, is located at the focal point of the reflecting lens. It is typically a red or green dot. A red aiming dot uses a red-emitting point light source, while a green aiming dot uses a green-emitting point light source. Users choose different colored aiming dots depending on the application. A red aiming dot is suitable for backgrounds with a distinct color contrast to red light, such as cool-toned environments like forests or oases; a green aiming dot is suitable for backgrounds with a distinct color contrast to green light, such as warm-toned environments like deserts or Gobi. Red and green aiming dots can essentially cover all application scenarios.

[0033] The light-emitting devices in reflex sights in related technologies are usually monochromatic, meaning a reflex sight either has a red or a green aiming dot, limiting its application scenarios. If a user wants to use a reflex sight in different environments, they need to purchase an additional light-emitting device of a different color. This not only increases costs but also requires recalibrating the aiming point of the reflex sight relative to the bullet's impact point after each replacement, making the calibration process cumbersome and complex.

[0034] To address the aforementioned problems, this application provides a light-emitting device and its manufacturing method, as well as a reflex sight and its aiming method. The reflex sight includes a reflecting lens and a light-emitting device. Typically, the light-emitting device provides a point light source for the reflex sight.

[0035] This embodiment provides a light-emitting device, such as... Figure 1As shown, the system includes a first substrate 10, a first light-emitting element 11, a second light-emitting element 12, and an aperture 6. The first substrate 10 includes a die-bonding region 101. The first light-emitting element 11 is disposed inside the die-bonding region 101 and is electrically connected to the first substrate 10. The second light-emitting element 12 is disposed inside the die-bonding region 101 and is electrically connected to the first substrate 10, so that the second light-emitting element 12 is connected in parallel with the first light-emitting element 11. The second light-emitting element 12 and the first light-emitting element 11 are arranged along a first direction. In the first direction, the distance between the side of the first light-emitting element 11 closest to the second light-emitting element 12 and the second light-emitting element 12 is (…). Figure 1 The distance t in the middle is 1 micrometer to 50 micrometers; the aperture 6 is disposed on the light-emitting side of the first light-emitting element 11 and the second light-emitting element 12, and the orthogonal projection of the light-transmitting hole 201 of the aperture 6 on the first substrate 10 is located at the adjacent center of the first light-emitting element 11 and the second light-emitting element 12, so that the light emitted by the first light-emitting element 11 and the second light-emitting element 12 can be focused before passing through; wherein, the first direction ( Figure 1 The horizontal direction is perpendicular to the thickness direction of the first substrate 10.

[0036] In addition, the light-emitting device also includes a lens 5, which is disposed on the light-emitting side of the first light-emitting element 11 and the second light-emitting element 12. The lens 5 is capable of focusing the light emitted by the first light-emitting element 11 or the second light-emitting element 12.

[0037] In this embodiment, as Figure 3 As shown, lens 5 is a condenser lens, and the light-emitting sides of the first light-emitting element 11 and the second light-emitting element 12 are located on the side close to the reflective lens 30 in the reflective sight; the condenser lens converges the light emitted by the first light-emitting element 11 and / or the second light-emitting element 12 to the focal point of the condenser lens.

[0038] Lens 5 can be a spherical lens, an aspherical lens, or a diffractive lens, as long as it can achieve focusing.

[0039] The aforementioned aperture 6 is an aperture plate, with a light-passing hole 201 at its center for light to pass through. The light-passing hole 201 of the aperture 6 can be, but is not limited to, a circular hole. This allows the area light source, line light source, or point light source emitted by the light-emitting device to be converted into a point light source the size of a target. When used in conjunction with the reflecting lens 30, it forms a reflective sight. The orthographic projection of the light-passing hole 201 of the aperture 6 onto the first substrate 10 is located at the adjacent center of the first light-emitting element 11 and the second light-emitting element 12. Figure 3 As shown.

[0040] The first light-emitting element 11 is used to emit a first light signal, and the second light-emitting element 12 is used to emit a second light signal. The center wavelengths of the first light signal and the second light signal may be the same or different. The first light-emitting element 11 can be any one of a surface light source, a line light source, and a point light source. The structure of the second light-emitting element 12 is the same as that of the first light-emitting element 11, and it can also be any one of a surface light source, a line light source, and a point light source. Figure 1 The shapes and outlines of the first light-emitting element 11 and the second light-emitting element 12 are merely illustrated as examples; the specific dimensions of the first light-emitting element 11 and the second light-emitting element 12 are not specifically limited. Furthermore, Figure 1 The image shows the first light-emitting element 11, which includes a first LED chip, and the second light-emitting element 12, which includes a second LED chip. Figure 1 The diagram shows a connection schematic where both the first LED chip and the second LED chip are dual-electrode chips, meaning both the first light-emitting element 11 and the second light-emitting element 12 are dual-electrode chips. Alternatively, both the first LED chip and the second LED chip can be single-electrode chips, or the first LED chip can be a dual-electrode chip and the second LED chip a single-electrode chip; or the first LED chip can be a single-electrode chip and the second LED chip a dual-electrode chip. For details on the connection methods of the first light-emitting element 11 and the second light-emitting element 12 to the first substrate 10, please refer to the following text. Figures 5 to 7 As shown. The structures of the first LED chip and the second LED chip in the first light-emitting element 11 and the second light-emitting element 12 can be the same or different. The number of chips included in the first light-emitting element 11 and the second light-emitting element 12 can be the same or different. This application describes an example where the first light-emitting element 11 includes one first LED chip, the second light-emitting element 12 includes one second LED chip, and the first LED chip and the second LED chip are dual-electrode chips of a small surface light source. The dual-electrode chip has two connection solder joints, while the single-electrode chip has one connection solder joint, and the other connection solder joint is located on the die-bonding region 101.

[0041] By arranging a first light-emitting element 11 and a second light-emitting element 12 inside the die-bonding region 101 of the first substrate 10, and by adjusting the spacing between the first light-emitting element 11 and the second light-emitting element 12 in the first direction to satisfy a range of 1 to 50 micrometers, the orthogonal projection of the light-transmitting aperture 201 of the aperture 6 on the first substrate 10 is located at the adjacent center of the first light-emitting element 11 and the second light-emitting element 12. This adjacent center of the first light-emitting element 11 and the second light-emitting element 12 refers to the geometric center region of the two adjacent sides between the first light-emitting element 11 and the second light-emitting element 12. This allows the light emitted by the first light-emitting element 11 and the second light-emitting element 12 to simultaneously pass through the light-transmitting hole 201 of the aperture 6, thereby converting multiple light sources into a point light source. At the same time, the first light-emitting element 11 and the second light-emitting element 12 are electrically connected to the first substrate 10, realizing the parallel connection of the first light-emitting element 11 and the second light-emitting element 12. That is, the first light-emitting element 11 and the second light-emitting element 12 can be controlled individually. In other words, by controlling the first light-emitting element 11 and the second light-emitting element 12, the brightness or color of the light emitted through the light-transmitting hole 201 of the aperture 6 can be different.

[0042] When the wavelengths of the light emitted by the first light-emitting element 11 and the second light-emitting element 12 are the same, compared to setting a light-emitting element inside the die-bonding region 101 of the first substrate 10, this light-emitting element has the same structure as one of the first light-emitting elements 11 and the second light-emitting element 12. When controlling the first light-emitting element 11 and the second light-emitting element 12 to emit light, the brightness of the light-emitting device is increased. When controlling the first light-emitting element 11 or the second light-emitting element 12 to emit light, one of the first light-emitting element 11 and the second light-emitting element 12 can be used as the main light-emitting element and the other as the backup light-emitting element. This not only achieves different brightness adjustments, but also improves the service life of the light-emitting device and reduces the frequency of replacement. When the wavelengths of the light emitted by the first light-emitting element 11 and the second light-emitting element 12 are not the same, this provides a light-emitting device that can achieve dual-color light emission, which is suitable for a variety of different scenarios and has a wide range of applications.

[0043] The aforementioned light-emitting device can be applied to, but is not limited to, reflective sights, as well as to lamps or light-emitting devices with multiple brightness adjustments or dual or multiple color adjustments.

[0044] The following explanation uses the application of a light-emitting device in a reflex sight as an example.

[0045] When this light-emitting device is applied to a reflex sight, the light-passing aperture 201 of the aperture 6 is positioned at the focal point of the reflex lens 30 of the reflex sight. The light emitted by the light-emitting device shines onto the reflex lens 30, and after being converged and reflected by the reflecting surface 301 of the reflex lens 30, it enters the human eye as parallel light, forming an image on the retina. The optical path diagram is as follows: Figure 3 As shown. Figure 3 This is merely an example illustrating the positional relationship between the reflecting lens 30, the focal point, and the focal length.

[0046] In some embodiments, the first light signal and the second light signal have the same wavelength. For example, the center wavelength of the first light signal and the second light signal is 650nm, that is, the first light signal and the second light signal are red light. Or, the center wavelength of the first light signal and the second light signal is 525nm, that is, the first light signal and the second light signal are green light. In this way, by controlling the switching of the first light-emitting element 11 and the second light-emitting element 12, a point light source with different brightness adjustment of red or green light can be provided for the reflective sight.

[0047] In other embodiments, the wavelengths of the first light signal and the second light signal are different. For example, the center wavelength of the first light signal is 650nm, that is, the first light signal is red light, and the center wavelength of the second light signal is 525nm, that is, the second light signal is green light. In this way, by controlling the switching of the first light-emitting element 11 and the second light-emitting element 12, a point light source with different color adjustment of red and green light can be provided for the reflective sight.

[0048] In summary, when the light-emitting device of this application is used in a reflex sight, if the wavelengths of the first light signal and the second light signal are the same, the light-emitting device can serve as a point light source for the reflex sight that can achieve multiple brightness adjustments; if the wavelengths of the first light signal and the second light signal are different, for example, the first light-emitting element 11 emits red light and the second light-emitting element 12 emits green light, the device can be used as a point light source for the reflex sight with different colors of red and green light by switching the switches of the first light-emitting element 11 and the second light-emitting element 12. In this way, users can avoid purchasing a reflex sight of other colors and also avoid the calibration operation caused by replacing the reflex sight, which brings great convenience to users.

[0049] like Figures 1 to 4 As shown, a transparent encapsulation layer 15 is provided on one side of the first substrate 10. In this embodiment, the transparent encapsulation layer 15 is located on the light-emitting side of the first light-emitting element 11 and the second light-emitting element 12. The orthogonal projection of the transparent encapsulation layer 15 on the first substrate 10 completely covers the first substrate 10. The aperture 6 is fixed on the side of the transparent encapsulation layer 15 away from the first substrate 10. That is, the aperture 6 is fixed on the transparent encapsulation layer 15.

[0050] In this embodiment, the lens 5 is also fixed inside the transparent encapsulation layer 15 to ensure that the lens 5 and the first light-emitting element 11 and the second light-emitting element 12 have a certain distance.

[0051] The transparent encapsulation layer 15 is formed of a transparent protective adhesive, which gives the transparent encapsulation layer 15 high transparency. For example, epoxy resin can be used to make the transparent encapsulation layer 15.

[0052] By providing a transparent encapsulation layer 15 on the first substrate 10, the orthographic projection of the transparent encapsulation layer 15 completely covers the first substrate 10, thus covering the first light-emitting element 11, the second light-emitting element 12, the first bonding wire 13, and the second bonding wire 14, forming an effective sealing layer. This encapsulates the entire light-emitting device, preventing external factors from affecting the internal structure and circuitry of the first light-emitting element 11, the second light-emitting element 12, and other components on the first substrate 10, thereby improving the reliability and durability of the light-emitting device. Furthermore, by directly fixing the aperture 6 to the transparent encapsulation layer 15, the aperture 6 is firmly connected to the first substrate 10, eliminating the need for additional adhesive layers to fix the aperture 6. This reduces the thickness of the light-emitting device and simplifies the manufacturing process, resulting in lower costs.

[0053] It should be noted that, after multiple experiments, the spacing t between the first light-emitting element 11 and the second light-emitting element 12 in the first direction can be 1 micrometer, 2 micrometer, 3 micrometer, 4 micrometer, 5 micrometer, 6 micrometer, 7 micrometer, 8 micrometer, 9 micrometer, 10 micrometer, 11 micrometer, 12 micrometer, 13 micrometer, 14 micrometer...19 micrometer, 20 micrometer,...25 micrometer,...30 micrometer,...35 micrometer,...40 micrometer,...45 micrometer,...50 micrometer.

[0054] In the design of a reflex sight, the position and diameter of the aperture 201 of the aperture 6 are also important parameters.

[0055] When the diameter of the light-transmitting aperture 201 is small, it hinders light transmission, making the aiming point indistinct and resulting in a poor user experience. Conversely, when the diameter of the light-transmitting aperture 201 is large, the aiming point range is larger, leading to lower aiming accuracy and increased risk of misaiming under the same light transmission conditions. Through repeated testing, it was found that when the diameter of the light-transmitting aperture 201 can be 5 micrometers, 6 micrometers, 7 micrometers, 8 micrometers, 9 micrometers, 10 micrometers, 11 micrometers, 12 micrometers, 13 micrometers, 14 micrometers, 15 micrometers, 16 micrometers, 17 micrometers, 18 micrometers, 19 micrometers, 20 micrometers, ... 30 micrometers, ... 40 micrometers, ... 50 micrometers, ... 60 micrometers, ... 70 micrometers, ... 80 micrometers, etc., the aiming point meets optical requirements when the diameter is between 5 and 80 micrometers.

[0056] Figure 3The diameter of the light-transmitting aperture 201 shown is greater than the distance t between the first light-emitting element 11 and the second light-emitting element 12 in the first direction. This further ensures that as much of the light from the first light-emitting element 11 and the second light-emitting element 12 as possible is emitted through the light-transmitting aperture 201, thereby improving the brightness of the aiming point.

[0057] like Figure 2 As shown, in some embodiments, the first light-emitting element 11 is soldered to the first substrate 10 via the first bonding wire 13, and the second light-emitting element 12 is soldered to the first substrate 10 via the second bonding wire 14. The first substrate 10 is also provided with protective adhesive, which is used to completely cover the solder joints at both ends of the first bonding wire 13, the second bonding wire 14, and the solder joints at both ends of the first bonding wire 13 and the second bonding wire 14.

[0058] With the above settings, the protective adhesive can completely cover the solder joints at both ends of the first bonding wire 13, the second bonding wire 14, and the solder joints at both ends of the first bonding wire 13 and the second bonding wire 14. This avoids the influence of dust and impurities on the first bonding wire 13 and the second bonding wire 14, which helps to improve the reliability of the light-emitting device.

[0059] like Figure 1 As shown, the first substrate 10 has a first solder joint 1 and a second solder joint 2 on one side of the die bonding region 101. The first solder joint 1 and the second solder joint 2 are located outside the die bonding region 101. The first light-emitting element 11 has a third solder joint 3 corresponding to the first solder joint 1, and the second light-emitting element 12 has a fourth solder joint 4 corresponding to the second solder joint 2. One end of the first bonding wire 13 is soldered to the first solder joint 1, and the other end is soldered to the third solder joint 3. One end of the second bonding wire 14 is soldered to the second solder joint 2, and the other end is soldered to the fourth solder joint 4.

[0060] With the above arrangement, the arrangement of the solder joints is staggered from the arrangement of the two light-emitting elements, which not only facilitates the electrical connection between the two light-emitting elements and the first substrate 10, but also helps to improve the space utilization of electrical components on the first substrate 10, thereby facilitating the miniaturization of the light-emitting device.

[0061] Specifically, when both the first light-emitting element 11 and the second light-emitting element 12 are dual-electrode chips, the electrical connection between the first light-emitting element 11 and the second light-emitting element 12 and the first substrate 10 is as follows: Figure 1 As shown. The first light-emitting element 11 is in the second direction ( Figure 1 Both ends of the second light-emitting element 12 in the vertical direction are provided with third solder points 3, and there are two first solder points 1, with one-to-one correspondence between the two first solder points 1 and the two third solder points 3; both ends of the second light-emitting element 12 in the second direction are provided with fourth solder points 4, and there are two second solder points 2, with one-to-one correspondence between the two second solder points 2 and the two fourth solder points 4; in the second direction, on one side of the die-bonding region 101 ( Figure 1 As shown on the upper side, a first solder point 1 and a second solder point 2 are a single integrated structure, that is, located on the upper side. Figure 1 A first solder joint 1 and a second solder joint 2 above the die-bonding region 101 share a single solder joint, which can serve as the positive electrode of the light-emitting device; located on the other side of the die-bonding region 101 ( Figure 1 The other first solder point 1 and the other second solder point 2 (shown on the lower side) are spaced apart, that is, located on the lower side. Figure 1 Another first solder joint 1 below the die-bonding region 101 serves as the negative electrode of the first light-emitting element 11, and another second solder joint 2 serves as the negative electrode of the second light-emitting element 12, thereby realizing the parallel connection of the first light-emitting element 11 and the second light-emitting element 12; wherein, the second direction, the first direction and the thickness direction of the substrate 100 are perpendicular to each other.

[0062] The above settings reduce the number of solder joints, lower the positioning accuracy and welding difficulty of the first light-emitting element 11 and the second light-emitting element 12 to the first solder joint 1 and the second solder joint 2 respectively, and facilitate welding.

[0063] When the first light-emitting element 11 is a dual-electrode chip and the second light-emitting element 12 is a single-electrode chip, the electrical connection between the first light-emitting element 11 and the second light-emitting element 12 and the first substrate 10 is as follows: Figure 5 As shown.

[0064] exist Figure 5 The light-emitting device shown is Figure 1 The main difference in the light-emitting device shown is that the second light-emitting element 12 is a single-electrode chip. In this case, one of the fourth solder points 4 corresponding to the two second solder points 2 is disposed on the second light-emitting element 12, and the other fourth solder point 4 is disposed on the die-bonding region 101, thereby realizing the parallel connection of the first light-emitting element 11 and the second light-emitting element 12. Figure 5 Other structures in the light-emitting device shown are as follows: Figure 1 The light-emitting device shown is the same, so it will not be described again here.

[0065] When both the first light-emitting element 11 and the second light-emitting element 12 are single-electrode chips, there are two different ways to electrically connect the first light-emitting element 11 and the second light-emitting element 12 to the first substrate 10, such as... Figure 6 and Figure 7 As shown.

[0066] exist Figure 6 The light-emitting device shown is Figure 1The main difference in the light-emitting device shown is that the first light-emitting element 11 and the second light-emitting element 12 are single-electrode chips. In this case, one of the third solder points 3 corresponding to the two first solder points 1 is disposed on the first light-emitting element 11, and the other third solder point 3 is disposed on the die-bonding region 101; one of the fourth solder points 4 corresponding to the two second solder points 2 is disposed on the second light-emitting element 12, and the other fourth solder point 4 is disposed on the die-bonding region 101. Since one third solder point 3 and one fourth solder point 4 need to be disposed on the die-bonding region 101, the two first solder points 1 and the two second solder points 2 disposed on the first substrate 10 are arranged alternately, thereby realizing the parallel connection of the first light-emitting element 11 and the second light-emitting element 12. Figure 6 Other structures in the light-emitting device shown are as follows: Figure 1 The light-emitting device shown is the same, so it will not be described again here.

[0067] exist Figure 7 The light-emitting device shown is Figure 6 The main difference in the illustrated light-emitting device is that the die-bonding region 101 is divided into two parts. Specifically, the die-bonding region 101 includes a first region 101a connected to the first light-emitting element 11 and a second region 101b connected to the second light-emitting element 12. The first region 101a and the second region 101b are spaced apart along a first direction. Thus, a first solder joint 1 on one side of the first region 101a and a second solder joint 2 on the same side of the second region 101b are integrally formed. Another first solder joint 1 on the other side of the first region 101a and another second solder joint 2 on the same side of the second region 101b are spaced apart, thereby achieving parallel connection of the first light-emitting element 11 and the second light-emitting element 12. Figure 7 Other structures in the light-emitting device shown are as follows: Figure 1 The light-emitting device shown is the same, so it will not be described again here.

[0068] Example 2 This embodiment provides a light-emitting device. The difference between this embodiment and Embodiment 1 lies in the lens arrangement, specifically: Figure 8 and Figure 9 As shown, the lens 5 is a concave mirror, and the light-emitting sides of the first light-emitting element 11 and the second light-emitting element 12 are located on the side away from the reflective lens 30 in the reflective sight; the concave mirror converges the light emitted by the first light-emitting element 11 and / or the second light-emitting element 12 to the focal point of the concave mirror.

[0069] Lens 5 can be a spherical lens, an aspherical lens, or a diffractive lens, as long as it can achieve focusing.

[0070] In this embodiment, when the light-emitting device is applied to the reflective sight, the substrate 100 and the first light-emitting element 11 and the second light-emitting element 12 are arranged facing away from the aperture 6 and the reflective lens 30 of the reflective sight.

[0071] In addition, in this embodiment, the transparent encapsulation layer 15 is located on the back side of the substrate 100. The orthographic projection of the transparent encapsulation layer 15 on the first substrate 10 completely covers the first substrate 10. The aperture 6 is fixed on the side of the transparent encapsulation layer 15 away from the first substrate 10. That is, the aperture 6 is fixed on the transparent encapsulation layer 15.

[0072] Apart from this, the rest of the structure is the same as in Example 1.

[0073] Example 3 This embodiment provides a reflective sight, including a reflective lens and a light-emitting device provided in Embodiment 1 or Embodiment 2. The light-transmitting aperture 201 of the aperture 6 in the light-emitting device is located at the focal point of the reflective lens 30; the focal point of the lens 5 in the light-emitting device coincides with the focal point of the reflective lens 30.

[0074] By aligning the focal point of the lens 5 with the focal point of the reflecting lens 30, the light from the first light-emitting element 11 or the second light-emitting element 12 is first focused, and then the light-passing aperture 201 of the aperture 6 is positioned at the focal point of the reflecting lens 30 of the reflective sight. Figure 3 and Figure 8 As shown, this allows the reflex sight to freely switch between aiming points of different brightness or color, making it suitable for various application scenarios and with a wide range of applications. Furthermore, users avoid purchasing a separate set of reflex sights in different colors and are spared the correction work required when replacing reflex sights, greatly enhancing user convenience. Additionally, the lens and aperture 6 ensure uniform brightness and sharp edges within the beam.

[0075] In the design of a reflex sight, the closer the center of the aperture 201 is to the focal point of the reflective lens 30, the better the aiming effect will be. The aiming effect will be even better when the center of the aperture 201 coincides with the focal point of the reflective lens 30.

[0076] The structure of the light-emitting device in this reflex sight is the same as that in the above embodiment, and will not be described again here.

[0077] To further improve the reflection effect, the reflecting surface 301 of the reflecting lens 30 is provided with a high-reflection coating, and at the same time, an anti-reflection coating is deposited on the side of the reflecting lens 30 that faces away from the reflecting surface 301. For example... Figure 3As shown, by setting a high-reflectivity film on the reflective surface 301 of the reflective lens 30, the light energy utilization rate of the light-emitting device illuminating the reflective lens 30 is improved, the light energy loss during the reflection process is reduced, and the brightness of the aiming point is higher; the setting of the anti-reflection film further improves the light transmittance, which is beneficial to balance the brightness of the aiming point and the positioning accuracy.

[0078] The aforementioned high-reflectivity coating refers to an optical thin film that enhances reflectivity. The working principle of a high-reflectivity coating is based on thin-film interference. When light shines on the thin film, it is reflected at both the upper and lower surfaces, and these two reflected beams interfere with each other. By adjusting the thickness and refractive index of the thin film, the optical path difference between these two reflected beams can be made to meet specific conditions, thereby enhancing the reflectivity in a certain wavelength band. Specifically, the design of the high-reflectivity coating ensures that the interference of the two reflected beams is additive, thus significantly improving reflectivity.

[0079] During the design of the high-reflectivity film, the reflective surface 301 of the reflective lens 30 needs to be coated with high-reflectivity films of different wavelength ranges. If the wavelengths of the first light signal emitted by the first light-emitting element 11 and the second light signal emitted by the second light-emitting element 12 are the same, the wavelength range of the high-reflectivity film is set with an error of ±10nm based on the center wavelength of the first light signal emitted by the first light-emitting element 11. For example, if the center wavelength of the first light signal is 650nm, i.e., the first light signal is red light, then the wavelength requirement of the high-reflectivity film is to have high reflectivity within the wavelength range of 650nm ± 10nm and high transmittance outside the above wavelength range. If the wavelengths of the first light signal emitted by the first light-emitting element 11 and the second light signal emitted by the second light-emitting element 12 are not the same, the wavelength range of the high-reflectivity film needs to simultaneously satisfy the range of the center wavelengths of the first and second light signals. For example, if the center wavelength of the first light signal is 650nm (i.e., the first light signal is red light), and the center wavelength of the second light signal is 525nm (i.e., the second light signal is green light), then the high-reflectivity film must have high reflectivity within the wavelength ranges of 650nm ± 10nm and 525nm ± 10nm, and high transmittance outside these wavelength ranges. In other words, these two wavelength ranges are mutually exclusive and must be satisfied simultaneously. This allows the first and second light signals emitted by the light-emitting device to be utilized as much as possible, resulting in higher brightness at the aiming point, while not affecting the transmission of light in other wavelength bands through the reflective lens 30, and thus not affecting the user's observation of the target through the reflective lens 30.

[0080] In the light source device of the above-mentioned reflective sight, the control and switching of the first light-emitting element 11 and the second light-emitting element 12 can be electrically controlled by the electric push-button switch 42, or the user can manually control them by rotating the knob switch 43.

[0081] like Figure 10As shown, in some embodiments, the light-emitting device is electrically connected to the power supply 40 and the push-button switch 42 via the control unit 41 (MCU of Figure 10). The push-button switch 42 is used by the control unit 41 to control the opening and closing of the first light-emitting element 11 and the second light-emitting element 12 in the light-emitting device.

[0082] The above settings enable the electric switching of the first light-emitting element 11 and the second light-emitting element 12, which is suitable for some scenarios that require electric control operation to switch the light-emitting device.

[0083] like Figure 11 As shown, in some embodiments, the light-emitting device is connected to the power supply 40 via a rotary switch 43, and the first light-emitting element 11 and the second light-emitting element 12 are turned on and off by rotating the rotary switch 43.

[0084] With the above settings, users can manually switch between the first light-emitting element 11 and the second light-emitting element 12 by rotating the knob switch 43, which is suitable for some scenarios that require manual control to switch the light-emitting device.

[0085] It should be noted that the light-emitting device needs to have the following modes: first light-emitting element 11 on, first light-emitting element 11 off, second light-emitting element 12 on, second light-emitting element 12 off, first light-emitting element 11 on and second light-emitting element 12 on, and first light-emitting element 11 off and second light-emitting element 12 off. Alternatively, only three modes are required: first light-emitting element 11 on, second light-emitting element 12 on, and first light-emitting element 11 off and second light-emitting element 12 off.

[0086] The two control modes of the light-emitting device can be selected according to different customer requirements or application scenarios, and no specific limitations are made here.

[0087] Example 4 This embodiment provides a method for preparing a light-emitting device, which is used to prepare the above-mentioned light-emitting device. The preparation method includes: Step S100: An outer frame 200 and a dicing channel 300 are formed around the periphery of the substrate 100. Multiple die-bonding regions 101 are formed on the substrate 100 within the outer frame 200, such as... Figure 12 As shown.

[0088] The aforementioned substrate 100 requires pretreatment to replace the expensive mold used to process the frame on the substrate 100, so that the pretreated substrate 100 is provided with an outer frame 200, a cutting channel 300 and multiple arrayed die-bonding regions 101; the cutting channel 300 includes descaled marks and labels provided at the outer peripheral edge of the substrate 100; that is, the substrate 100 in this invention is provided with only a large outer frame 200 on the outer periphery, and then a number of die-bonding regions 101 are provided in the outer frame 200, so that the outer periphery of the fixed region is no longer provided with a frame structure, effectively solving the problem of halo caused by the frame reflecting the light of the light-emitting device, and effectively reducing the production cost of the light-emitting device.

[0089] like Figure 13 As shown, after step S100, step S200 is also included: a first light-emitting element 11 and a second light-emitting element 12 are disposed in each die-bonding region 101 along the first direction, and die-bonding adhesive is baked.

[0090] The first light-emitting element 11 and the second light-emitting element 12 are arranged along a first direction inside the die-bonding region 101, and the distance between the two adjacent sides of the first light-emitting element 11 and the second light-emitting element 12 in the first direction is 1 micrometer to 50 micrometers.

[0091] The aforementioned die-bonding region 101 is provided with die-bonding adhesive. By placing the first light-emitting element 11 and the second light-emitting element 12 inside the die-bonding region 101 and baking the die-bonding adhesive to melt it, and then cooling and solidifying it, the first light-emitting element 11 and the second light-emitting element 12 are fixed inside the die-bonding region 101. This is possible.

[0092] In some embodiments, the die bonding process in step S200 above is performed using an ASM862 die bonder, and the die bonding and baking process specifically includes the following two stages: The baking temperature for the first stage die bond adhesive is 140℃-150℃, and the baking time for the first stage die bond adhesive is 55-65 minutes. The second stage die bonding baking temperature is 170℃-180℃, and the second stage die bonding adhesive baking time is 235-245min; so that the first light-emitting element 11 and the second light-emitting element 12 are fixed in the die bonding region 101.

[0093] In summary, during the first stage of baking at 150°C for 1 hour, the die bond adhesive can be effectively softened and initially flowed; during the second stage of baking at 180°C for 240 minutes, the first light-emitting element 11 and the second light-emitting element 12 can be fixed in the die bond region 101, thereby improving the die bond effect of the first light-emitting element 11 and the second light-emitting element 12.

[0094] like Figure 13As shown, after step S200, step S300 is also included: welding the first light-emitting element 11 to the substrate 100 through the first bonding wire 13, and welding the second light-emitting element 12 to the substrate 100 through the second bonding wire 14.

[0095] It should be noted that before step S300 above, step S110 is also included: a first solder joint 1 and a second solder joint 2 are provided on the substrate 100, a third solder joint 3 corresponding to the first solder joint 1 is provided on the first light-emitting element 11, and a fourth solder joint 4 corresponding to the second solder joint 2 is provided on the second light-emitting element 12.

[0096] It should be noted that step S110 above refers to... Figure 1 The electrical connection method between the first light-emitting element 11 and the second light-emitting element 12 and the first substrate 10 in the light-emitting device shown. When the light-emitting device is as follows... Figures 5 to 7 When preparing the light-emitting device shown, it is only necessary to set the positions of one of the third solder points 3 and the fourth solder point 4. The preparation steps are similar to those in step S110 and will not be described in detail here.

[0097] The above step S110 only needs to be set before step S300, and can be set between step S200 and step S300, such as... Figure 14 As shown; it can also be set between step S100 and step S200, such as Figure 15 As shown. That is, after setting the die-bonding region 101 on the substrate 100, the positions of the first solder joint 1 and the second solder joint 2 can be set. Then, based on the positions of the first solder joint 1 and the second solder joint 2, the first light-emitting element 11 and the second light-emitting element 12 can be set in the die-bonding region 101. Finally, the third solder joint 3 can be set on the first light-emitting element 11 and the fourth solder joint 4 can be set on the second light-emitting element 12. Alternatively, after setting the die-bonding region 101 on the substrate 100, the first light-emitting element 11 and the second light-emitting element 12 can be set in the die-bonding region 101 first. Then, according to the positions of the first light-emitting element 11 and the second light-emitting element 12, and the positions of the third solder joint 3 on the first light-emitting element 11 and the fourth solder joint 4 on the second light-emitting element 12, the first solder joint 1 and the second solder joint 2 can be set outside the die-bonding region 101 of the substrate 100. Step S110 only needs to be completed before step S300. The specific details are not limited here.

[0098] Based on this, in step S300, the first light-emitting element 11 is soldered to the substrate 100 through the first bonding wire 13, and the second light-emitting element 12 is soldered to the substrate 100 through the second bonding wire 14.

[0099] In some embodiments, step S300 specifically includes: S310: one end of the first bonding wire 13 is welded to the first solder joint 1, and the other end is welded to the third solder joint 3; S320: one end of the second bonding wire 14 is welded to the second solder joint 2, and the other end is welded to the fourth solder joint 4.

[0100] It should be noted that the structures obtained after steps S310 and S320 are the same, and there is no requirement for the order of steps S310 and S320.

[0101] like Figure 13 As shown, after step S300, step S400 is also included: applying wire protective adhesive to the first bonding wire 13 and the second bonding wire 14 and drying them.

[0102] In the preparation process of step S400 above, it is necessary not only to apply wire protective adhesive to the first bonding wire 13 and the second bonding wire 14, but also to apply wire protective adhesive to the first solder joint 1, the second solder joint 2, the third solder joint 3 and the fourth solder joint 4, so as to protect the first bonding wire 13 and the second bonding wire 14.

[0103] It should be noted that the above-mentioned wire protective adhesive is a light-absorbing adhesive.

[0104] like Figure 13 As shown, after step S400, step S500 is also included: injecting transparent protective adhesive into the outer frame 200 and drying it to obtain a transparent encapsulation layer 15.

[0105] In some embodiments, step S500 specifically includes: for the light-emitting device of Embodiment 1, facing the front side of the substrate 100, injecting transparent protective adhesive into the outer frame 200 until the transparent protective adhesive covers the surface of the substrate 100, and then drying the transparent protective adhesive to form a transparent encapsulation layer 15.

[0106] For the light-emitting device of Embodiment 2, facing the back side of the substrate 100, a transparent protective adhesive is injected into the outer frame 200 until the transparent protective adhesive covers the surface of the substrate 100, and then the transparent protective adhesive is dried to form a transparent encapsulation layer 15.

[0107] When drying the above-mentioned transparent protective adhesive, it is not a one-time direct drying process, but rather requires three stages and multiple drying steps, specifically: The first stage of drying involves controlling the drying temperature at 75℃-80℃ and the drying time at 28min-32min (specifically 30min). The second stage of drying involves controlling the drying temperature at 125℃-130℃ and the drying time at 28min-32min. The third stage of drying involves controlling the drying temperature at 145℃-150℃ and the drying time at 235min-245min.

[0108] In summary, the first drying stage, at 80°C for 30 minutes, effectively softens the die-attach adhesive and allows it to initially flow; the second drying stage, at 130°C for 30 minutes, and the third drying stage, at 150°C for 240 minutes, ensures that the transparent protective adhesive is effectively melted while drying out its moisture. This allows the transparent protective adhesive to flow fully and evenly cover the first light-emitting element 11, the second light-emitting element 12, and other components on the substrate 100, thereby effectively controlling the thickness of the transparent encapsulation layer 15.

[0109] After step S500, step S600 is also included: For the light-emitting device of Embodiment 1, an aperture 6 and a lens 5 are provided in the transparent encapsulation layer 15, and the orthogonal projection of the light-transmitting hole 201 of the aperture 6 on the first substrate 10 is located at the adjacent center of the first light-emitting element 11 and the second light-emitting element 12.

[0110] By setting an aperture 6 and a lens 5 inside the transparent encapsulation layer 15, the light-emitting device of Embodiment 1 specifically adopts an aperture 6 and a lens directly embedded inside the transparent encapsulation layer 15.

[0111] The aperture 6 and the lens can be directly fixed on the first substrate 10 through the transparent encapsulation layer 15. In this way, the aperture 6 is firmly connected to the first substrate 10, and no other layers are needed. This helps to reduce the thickness of the light-emitting device. In addition, the processing steps are simple and the cost is low.

[0112] For the light-emitting device in Embodiment 2, the aperture 6 is directly embedded in the transparent encapsulation layer 15, while the reflective concave mirror is a large-area reflective concave mirror that cannot be embedded in the transparent encapsulation layer 15. The reflective concave mirror is installed and fixed using other independent structural components, such as a mirror tube, but the mirror tube and the substrate are not connected.

[0113] The process includes step S700 after step S600: cutting along the cutting path 300 to obtain a light-emitting device.

[0114] By cutting along the pre-set cutting path 300, damage to the structure of the light-emitting device can be effectively avoided during cutting and blanking. This solves the halo problem while ensuring the structural integrity of the light-emitting device and the efficiency of cutting and blanking.

[0115] The light-emitting device obtained through the above-described fabrication process, by surrounding the substrate 100 with an outer frame 200 and a cutting channel 300, not only eliminates the need for a frame corresponding to each die-bonding region 101, thus avoiding the use of molds and reducing costs, but also eliminates the need for a frame in the finished light-emitting device. When this product light-emitting device is used in a reflective sight, it effectively avoids the problem of halos around the light source caused by light reflected from the frame, improving the aiming accuracy of the reflective sight. In addition, by directly injecting transparent protective adhesive into the outer frame 200, all adhesive application can be completed in one injection, eliminating the need for expensive special molds for sealing, further reducing the production cost of the finished light-emitting device and greatly improving the production efficiency of the light-emitting device.

[0116] Example 5 This embodiment provides a method for adjusting the aiming point of a reflex sight, including: The brightness of the environment surrounding the reflex sight is obtained and denoted as . ; Acquire an image of the target area, and based on the target area image, obtain the grayscale difference between the target area and the surrounding environment; The brightness of the light emitted by the light-emitting device is adjusted based on the grayscale difference.

[0117] The process involves acquiring the brightness of the environment surrounding the reflex sight. This is achieved using an environmental sensor to monitor the brightness of the surrounding environment, which refers to the surrounding area where the reflex sight is located. However, because there is a certain distance between the aiming position and the reflex sight itself, the brightness of the aiming area and the brightness of the surrounding environment are not necessarily the same; they may differ significantly. Therefore, determining the brightness of the light source based solely on the ambient brightness may result in insufficient visibility of the aiming point. Thus, it is necessary to further acquire the brightness within the aiming area.

[0118] The aiming area here refers to the area that needs to be aimed at, where the brightness of each position within it is roughly the same. The target area refers to the region encompassing the aiming area and part of the surrounding environment. Typically, the aiming area is located at or approximately the center of the entire target area image. The brightness of the surrounding environment within the target area image is compared to the brightness of the initially acquired surrounding environment. If the difference is small, for example, less than 5 lux, it can be determined based on the brightness of the surrounding environment within the target area image and the brightness of the initially acquired surrounding environment. The size of the target region image is adjusted to account for the difference, ultimately making the difference less than 5 lux.

[0119] Based on the target region image, the brightness at the center can be obtained. Specifically, the target region image is converted into a grayscale image, and the grayscale value of each pixel is obtained, with the grayscale value ranging from 0 to 255. Then, a circle with radius R is drawn with the center of the target region image as the center, and the average grayscale value of all pixels within the circle with radius R is calculated, denoted as . The radius R ranges from 50 to 100 pixels.

[0120] Using the edges of the target region image as boundaries, extend a region of width W from the edges towards the center of the target region image. Calculate the average grayscale value of all pixels within this region of width W, denoted as . The width W ranges from 50 to 100 pixels.

[0121] according to and as well as Calculate the target brightness at the aiming point:

[0122] in, This indicates the brightness of the target at the aiming point.

[0123] Based on the target brightness at the aiming point, adjust the light output brightness of the light-emitting device. Specifically, adjust the power of the first or second light-emitting element in the light-emitting device so that the brightness of the first or second light-emitting element after illuminating the aiming point is equal to the target brightness at the aiming point.

[0124] The power of the first or second light-emitting element in the light-emitting device can be adjusted automatically or manually. Automatic adjustment uses an automatic regulator, while manual adjustment uses a knob or similar mechanism.

[0125] If the brightness of the surrounding environment changes, the brightness of the surrounding environment may be obtained inaccurately. Therefore, as a preferred embodiment, when obtaining the brightness of the surrounding environment... A periodic acquisition method is adopted. Two sampling periods are set: a basic period and an interleaved period. That is, a new sampling point is set after the sampling point of each basic period, and the time interval between the new sampling point and the sampling point of the previous basic period is less than the time interval of the basic period. For example, the sampling interval of the basic period is set to be within the range of 500ms to 1s, and the time interval between the new sampling point and the sampling point of the previous basic period is between 100ms and 200ms. Meanwhile, the time interval between all new sampling points and the sampling points of the previous basic period is set to a constant value, which can also be set to a variable value, but a constant value is preferred.

[0126] The brightness values ​​collected from all sampling points belonging to the basic period within a time period (e.g., 2 seconds) are denoted as... The brightness values ​​of all newly sampled points within the same time period are recorded as follows: Find each The difference between the brightness value collected by the next adjacent sampling point and the value collected by the new sampling point is denoted as . The difference is compared with the judgment threshold to obtain... The number of items exceeding the judgment threshold is denoted as .but:

[0127] in, This indicates the number of sampling points belonging to the basic period within the time period. for The average value, for The average value.

[0128] In addition, the threshold value is set according to actual needs; for example, it can be set to 5 to 7 lux. The smaller the value, the better. The more complex the calculation, the higher the accuracy.

[0129] Similarly, if the brightness within the target area varies, the same principle as acquiring the ambient brightness can be used. That is, the target area image is acquired periodically, with two sampling periods: a basic period and an interleaved period. Specifically, a new sampling point is set after each sampling point in the basic period, and the time interval between the new sampling point and the sampling point of the previous basic period is less than the time interval of the basic period. For example, the sampling interval of the basic period is set to be within the range of 500ms to 1s, and the time interval between the new sampling point and the sampling point of the previous basic period is between 100ms and 200ms. Simultaneously, the time interval between all new sampling points and the sampling points of the previous basic period is set to a constant value, although it can also be set to a variable value, but a constant value is preferred.

[0130] The average grayscale value of all pixels within a circle of radius R, obtained from all sampling points belonging to the basic period within a time period (e.g., 2 seconds), is denoted as... The average grayscale value of all pixels within a circle of radius R, acquired at the new sampling point within the same time period, is denoted as: Find each The difference between the brightness value collected by the next adjacent sampling point and the value collected by the new sampling point is denoted as . Record the difference. The number of grayscale values ​​greater than 10 is denoted as ,but:

[0131] in, This indicates the number of sampling points belonging to the basic period within the time period. for The average value, for The average value.

[0132] The average grayscale value of all pixels within a region of width W, obtained from all sampling points belonging to the basic period within a time period (e.g., 2 seconds), is denoted as The average grayscale value of all pixels within a region of width W, acquired at the new sampling point within the same time period, is denoted as: Find each The difference between the brightness value collected by the next adjacent sampling point and the value collected by the new sampling point is denoted as . Record the difference. The number of grayscale values ​​greater than 10 is denoted as ,but:

[0133] in, This indicates the number of sampling points belonging to the basic period within the time period. for The average value, for The average value.

[0134] Then according to the new and as well as Calculate the target brightness at the aiming point.

[0135] The above specific embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to examples, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the protection scope of the present invention.

Claims

1. A light-emitting device for a reflective sight, characterized in that, include: A first substrate, the first substrate including a die-bonding region; A first light-emitting element is disposed inside the die-bonding region, and the first light-emitting element is electrically connected to the first substrate; A second light-emitting element is disposed inside the die-bonding region, and the second light-emitting element is electrically connected to the first substrate so that the second light-emitting element is connected in parallel with the first light-emitting element. The second light-emitting element and the first light-emitting element are arranged along a first direction, and in the first direction, the distance between the side of the first light-emitting element closer to the second light-emitting element and the second light-emitting element is 1 micrometer to 50 micrometers; An aperture is disposed on the light-emitting side of the first light-emitting element and the second light-emitting element. The orthographic projection of the light-transmitting hole of the aperture on the first substrate is located at the adjacent center of the first light-emitting element and the second light-emitting element, so that the light emitted by the first light-emitting element and the second light-emitting element can both pass through after being focused. A lens is disposed on the light-emitting side of the first light-emitting element and the second light-emitting element, and the lens is capable of focusing the light emitted by the first light-emitting element or the second light-emitting element; Wherein, the first direction is perpendicular to the thickness direction of the first substrate.

2. The light-emitting device according to claim 1, characterized in that, The lens is a condenser lens, and the light-emitting sides of the first light-emitting element and the second light-emitting element are located on the side close to the reflective lens in the reflective sight; the condenser lens converges the light emitted by the first light-emitting element and / or the second light-emitting element to the focal point of the condenser lens.

3. The light-emitting device according to claim 1, characterized in that, The lens is a concave mirror, and the light-emitting sides of the first light-emitting element and the second light-emitting element are located on the side away from the reflective lens in the reflective sight; the concave mirror converges the light emitted by the first light-emitting element and / or the second light-emitting element to the focal point of the concave mirror.

4. A reflective sight, comprising a reflective lens and a light-emitting device as described in claim 2 or 3, characterized in that, The aperture of the aperture in the light-emitting device is located at the focal point of the reflecting lens; the focal point of the lens in the light-emitting device coincides with the focal point of the reflecting lens.

5. The reflex sight according to claim 4, characterized in that, The reflective surface of the reflective lens is provided with a high-reflectivity coating.

6. A method for preparing a light-emitting device, used to prepare the light-emitting device according to claim 2 or 3, characterized in that, Preparation methods include: S100. An outer frame and a cutting channel are provided around the periphery of the substrate, and multiple die-bonding areas are provided on the substrate within the outer frame. S200: In each die-bonding region, a first light-emitting element and a second light-emitting element are prepared along a first direction, and the die-bonding adhesive is baked. S300, Weld the first light-emitting element to the substrate, and weld the second light-emitting element to the substrate; S400: Apply adhesive to the solder joints and connecting wires, and then dry them. S500: Inject transparent protective adhesive into the outer frame and dry it to form a transparent encapsulation layer on the substrate surface; S600, install aperture and lens; S700, cut along the cutting path; obtain the light-emitting device.

7. A method for adjusting the aiming point of a reflex sight as described in claim 4, characterized in that, include: Obtain the brightness of the environment around the reflex sight ; Acquire an image of the target area, and based on the target area image, obtain the grayscale difference between the target area and the surrounding environment; The brightness of the light emitted by the light-emitting device is adjusted based on the grayscale difference.

8. The aiming point adjustment method according to claim 7, characterized in that, Adjusting the light output brightness of the light-emitting device based on grayscale differences specifically includes: Convert the target region image into a grayscale image and obtain the grayscale value of each pixel; Then, draw a circle with radius R centered at the center of the target region image. Calculate the average grayscale value of all pixels within the circle with radius R, denoted as . ; Using the edges of the target region image as boundaries, extend a region of width W from the edges towards the center of the target region image. Calculate the average grayscale value of all pixels within this region of width W, denoted as . ; according to and as well as Calculate the target brightness at the aiming point: in, This indicates the brightness of the target at the aiming point.

9. The aiming point adjustment method according to claim 8, characterized in that, Obtain the brightness of the environment around the reflex sight When using a periodic acquisition method, the sampling period is set to the basic period, and a new sampling point is set after the sampling point of each basic period; the time interval between the new sampling point and the sampling point of the previous basic period is less than the time interval of the basic period. The brightness of the environment surrounding the reflex sight is calculated based on the brightness of the sampling points of the basic period and the brightness of the new sampling points. .

10. The aiming point adjustment method according to claim 9, characterized in that, The brightness values ​​collected from all sampling points belonging to the basic period within a given time period are denoted as... The brightness values ​​of all newly sampled points within the same time period are recorded as follows: Find each The difference between the brightness value collected by the next adjacent sampling point and the value collected by the new sampling point is denoted as . The difference is compared with the judgment threshold to obtain... The number of items exceeding the judgment threshold is denoted as ;but: in, This indicates the number of sampling points belonging to the basic period within the time period. for The average value, for The average value.

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