Non-disassembly modification method, medium and equipment for optical element
By using in-situ full-aperture surface shape measurement and error component separation, the problem of inconsistency between measurement and processing states in optical component manufacturing was solved. This enabled online imaging performance evaluation and shape correction termination determination for high-precision optical components, thereby improving the imaging quality of optical components.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- NINGBO INST OF MATERIALS TECH & ENG CHINESE ACAD OF SCI
- Filing Date
- 2026-03-18
- Publication Date
- 2026-04-24
AI Technical Summary
In existing optical component manufacturing, offline measurement methods lead to repeated clamping, introducing positioning errors and changes in clamping stress. This results in inconsistencies between the measurement state and the processing state, increasing process uncertainty and making it difficult to meet the imaging quality requirements of high-precision optical systems.
An in-situ full-aperture surface shape measurement method is used to acquire surface height data sets, and low-frequency and mid-frequency error components are separated. Online evaluation is achieved through low-frequency and mid-frequency imaging performance indicators, and a further shaping signal is output to ensure that the imaging performance meets the standards.
It achieves a high degree of consistency between the measurement state and the processing state, reduces the shape springback and stress redistribution caused by clamping, significantly improves the accuracy and reliability of the shaping process, and ensures the manufacturing of optical components with high imaging quality.
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Figure CN121916795A_ABST
Abstract
Description
[0001] Methods, media, and equipment for non-removable shaping of optical components Technical Field
[0002] This application relates to the field of optical element shaping technology, and in particular to a method, medium, and apparatus for non-removable shaping of optical elements. Background Technology
[0003] In the manufacturing process of precision optical components, surface shaping is a crucial step in ensuring the imaging quality of optical systems. Existing surface shaping processes typically obtain the surface shape error of optical components through methods such as interferometry, deflection measurement, or contour measurement, and use peak-to-valley value (PV), root mean square error (RMS), and low-order aberration coefficients (such as low-order Zernike terms) as the main criteria for evaluating processing quality and determining termination. These indicators can reflect the overall amplitude or low-frequency trend of surface shape error, and are therefore widely used in the manufacturing of general optical components.
[0004] However, existing manufacturing processes often employ a "staged processing, workpiece removal, transfer to measurement station, measurement and evaluation, re-clamping and continued processing" approach for quality control. This offline measurement method not only increases manufacturing cycle time and frequency, but repeated clamping can also introduce positioning errors, changes in clamping stress, and changes in workpiece posture, leading to inconsistencies between the measurement and processing states and resulting in deviations in termination decisions. For large-diameter or high-precision optical components, repeated clamping may also cause morphological springback or stress redistribution, causing differences between the measurement results and the actual morphological state during processing, thus increasing process uncertainty. Especially in the manufacturing of space optical systems that require strict control over imaging sharpness and halo scattering, these inconsistencies may be further amplified, resulting in an increased frequency of over-work, under-work, or rework.
[0005] To address the aforementioned issues, several similar technical directions have emerged in this field: Existing research and engineering practice have indicated that intermediate frequency errors affect MTF, PSF, and scattering characteristics, but these are mostly used for offline tolerance analysis, index setting, or performance prediction, without combining in-situ measurements during the shaping process for online judgment. There have also been explorations of in-situ measurements or closed-loop polishing, but the termination and control objectives often still revolve around process indicators such as PV, RMS, processing time, or removal function matching, making it difficult to directly guarantee that the target system meets the requirements for MTF, PSF energy concentration, or halo scattering at a specified spatial frequency. Summary of the Invention
[0006] To address the aforementioned technical problems, this application provides a method, medium, and apparatus for non-removable shaping of optical elements, which at least partially solves the problems existing in the prior art.
[0007] In a first aspect of this application, a method for non-removable shaping of an optical element is provided; the method includes: During the shaping process of the optical element under test, an in-situ full-aperture surface shape measurement is performed on the optical element under test to obtain the surface height dataset of the optical element under test; wherein, the optical element under test is not removed when performing the in-situ full-aperture surface shape measurement. Based on the surface height dataset of the optical element under test, the low-frequency error component and the mid-frequency error component corresponding to the optical element under test are obtained; Based on the low-frequency error component or mid-frequency error component of the optical element under test, the low-frequency imaging performance index or mid-frequency imaging performance index of the optical element under test is obtained. If any enabled low-frequency imaging performance indicator does not meet the corresponding standard low-frequency imaging performance indicator, or if any enabled mid-frequency imaging performance indicator does not meet the corresponding standard mid-frequency imaging performance indicator, then a continuing shaping signal will be output.
[0008] In a second aspect of this application, a non-transitory computer-readable storage medium is provided, wherein at least one instruction or at least one program is stored in the storage medium, and the at least one instruction or at least one program is loaded and executed by a processor to implement the aforementioned method for non-removing and reshaping optical elements.
[0009] In a third aspect of this application, an electronic device is provided, including a processor and the aforementioned non-transitory computer-readable storage medium.
[0010] This application has at least the following beneficial effects: The non-removable surface shaping method for optical components provided in this application firstly employs in-situ full-aperture surface shape measurement and acquires surface height datasets during the shaping process of the optical component under test. This addresses the core pain point of offline measurement: full-aperture surface shape inspection can be completed without removing the optical component under test. This not only eliminates the cumbersome processes of workpiece disassembly, transfer, and secondary clamping, significantly shortening the manufacturing cycle and time, but also fundamentally avoids positioning errors, clamping stress changes, and workpiece posture deviations caused by repeated clamping. It ensures a high degree of consistency between the measurement state and the processing state, effectively eliminating the deviation between the measurement results and the actual morphology during processing caused by inconsistent states in offline measurement. This is particularly crucial for large-aperture or high-precision optical components, as it avoids morphology springback and stress redistribution caused by clamping, reduces process uncertainty, and minimizes the risks of over-repair, under-repair, and rework. It is especially suitable for the stringent control requirements of space optical systems for imaging clarity and halo scattering. Building upon this foundation, low-frequency and mid-frequency error components are further separated using surface height datasets. This overcomes the limitations of existing in-situ measurement or closed-loop polishing technologies that rely solely on process indicators such as PV, RMS, and processing time as control targets, precisely focusing on the core error dimensions that directly impact imaging performance. Low-frequency and mid-frequency imaging performance indicators are obtained based on these two error components. The low-frequency component reflects aberration-type degradation, while the mid-frequency component reflects mid-to-high frequency MTF attenuation, PSF sidelobes, halo enhancement, and scattering changes, achieving an online evaluation closer to the final imaging effect. Finally, a continuing reshaping signal is output based on the comparison of these performance indicators with standard values, directly linking the reshaping process to imaging performance requirements. This ensures that the reshaping termination judgment better aligns with practical application needs, effectively avoiding the negative impact of mid-frequency errors on imaging quality caused by focusing only on overall error amplitude or low-frequency trends. This significantly improves the accuracy and reliability of the reshaping process, providing a strong guarantee for manufacturing optical components that meet high imaging quality requirements. Attached Figure Description
[0011] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0012] Figure 1 A flowchart of a non-removable shaping method for optical elements provided in an embodiment of this application; Figure 2 A flowchart of a non-removable shaping method for the core optical element of the 266 nm ultraviolet band three-mirror focusing system provided in this application embodiment; Figure 3This is a schematic diagram of the online performance evaluation and termination determination device for body modification provided in an embodiment of this application; Figure 4 A schematic diagram of frequency decomposition of full-aperture surface shape error based on Zernike polynomial fitting provided for embodiments of this application; Figure 5 This is a schematic diagram illustrating the termination signal and termination of the shaping process provided in the embodiments of this application. Detailed Implementation
[0013] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.
[0014] It should be noted that the terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish similar objects and are not necessarily used to describe a specific order or sequence. It should be understood that such data can be interchanged where appropriate so that the embodiments of this application described herein can be implemented in orders other than those illustrated or described herein. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion; for example, a process, method, system, product, or server that comprises a series of steps or units is not necessarily limited to those steps or units explicitly listed, but may include other steps or units not explicitly listed or inherent to such processes, methods, products, or devices.
[0015] It should be noted that the following description covers various aspects of embodiments within the scope of the appended claims. It will be apparent that the aspects described herein can be embodied in a wide variety of forms, and any particular structure and / or function described herein is merely illustrative. Based on this application, those skilled in the art will understand that one aspect described herein can be implemented independently of any other aspect, and two or more of these aspects can be combined in various ways. For example, any number of aspects set forth herein can be used to implement the device and / or practice the method. Additionally, this device and / or method can be implemented using structures and / or functionalities other than one or more of the aspects set forth herein.
[0016] Please refer to Figure 1 As shown, embodiments of this application provide a method for non-removable shaping of an optical element, including: S100, during the shaping process of the optical element under test, an in-situ full-aperture surface shape measurement is performed on the optical element under test to obtain a dataset of the surface height of the optical element under test; wherein, the optical element under test is not removed when performing the in-situ full-aperture surface shape measurement on the optical element under test.
[0017] Specifically, in-situ full-aperture surface shape measurement can be performed using interferometry, deflection measurement, contour measurement, or structured light measurement methods. Preferably, in-situ full-aperture surface shape measurement is performed using deflection measurement.
[0018] Here, "not removing the optical element under test" means that the blank remains in the fixture or tooling clamping state when switching between shaping and measurement, thereby reducing positioning errors and clamping stress variations introduced by repeated clamping. Shaping includes at least one of chemical mechanical polishing, ion beam shaping, laser beam shaping, magnetorheological polishing, small grinding head polishing, or elastic emission polishing.
[0019] It should be noted that the surface height dataset of the optical element under test includes every coordinate point on the surface of the optical element under test and the height data corresponding to each coordinate point.
[0020] S200: Based on the surface height dataset of the optical element under test, obtain the low-frequency error component and the mid-frequency error component corresponding to the optical element under test.
[0021] Specifically, step S200 also includes: S210, the difference between the surface height dataset of the optical element under test and the standard surface height dataset corresponding to the optical element under test is determined as the topography deviation dataset; wherein, the standard surface height data is the design surface shape data of the optical element under test or the reference surface shape data obtained by polynomial fitting based on the surface height dataset of the optical element under test.
[0022] Here, the polynomial fitting employs one or any combination of two-dimensional polynomials, Zernike polynomials, Legendre polynomials, Chebyshev polynomials, or Q-type polynomials. Furthermore, the order of the polynomial fitting is determined based on a root mean square threshold of the fitting residuals and / or a goodness-of-fit threshold.
[0023] In this process, if the optical element under test has design surface shape data, it is used as the standard surface height dataset. If no design surface shape data exists, a polynomial fitting is performed on the surface height dataset of the optical element under test to obtain reference surface shape data, which is then used as the standard surface height dataset. This is because polynomial fitting can characterize smooth, large-scale, and slowly changing surface shape trends, but it cannot fit local small fluctuations. Therefore, by performing polynomial fitting on the measured surface height dataset, mid-to-high frequency errors can be effectively filtered out, and a trend surface that can represent the overall surface shape of the element can be extracted. Thus, the trend surface obtained by this fitting is used as the reference surface shape data.
[0024] It should be noted that, compared to existing technologies that directly rely on instrument output deviation data, this embodiment can eliminate interference from design surface or reference surface error analysis at the source, obtaining a pure error signal that only reflects the actual processing deviation. This method does not rely on the inherent deviation output mode of the measuring instrument and is compatible with various optical 3D topography measurement devices such as interferometry, deflection measurement, and structured light measurement, effectively improving the method's versatility and cross-device adaptability. Furthermore, when design surface data is unavailable, a reference surface can be constructed through polynomial fitting as a standard reference, significantly broadening the applicable scenarios and ensuring stable and reliable deviation data can be obtained under different components and measurement conditions, laying a true and accurate data foundation for subsequent error decomposition and imaging performance evaluation.
[0025] S220, based on the topography deviation dataset, obtain the low-frequency error component and the mid-frequency error component corresponding to the optical element under test; wherein, the low-frequency error component is obtained by polynomial fitting of the topography deviation dataset; the mid-frequency error component is obtained by processing the difference between the topography deviation dataset and the low-frequency error component.
[0026] Specifically, the polynomial fitting employs one or any combination of two-dimensional polynomials, Zernike polynomials, Legendre polynomials, Chebyshev polynomials, or Q-type polynomials. Furthermore, the order of the polynomial fitting is determined based on a root mean square threshold of the fitting residuals and / or a goodness-of-fit threshold.
[0027] The mid-frequency error component is obtained by interpolation, resampling, and coordinate registration based on the difference between the topography deviation dataset and the low-frequency error component.
[0028] It should be noted that the purpose of separating the low-frequency error component and the mid-frequency error component in the topography deviation dataset in this application is to analyze the differences in the impact of errors in different frequency bands on the imaging performance of the optical element under test.
[0029] Under the imaging system and preset imaging performance indicators targeted in this application, when using the surface dataset and the obtained topography deviation dataset of this application, the high-frequency error component has a smaller impact on the target imaging performance indicators or is below the preset threshold compared to the low-frequency and mid-frequency error components, and the high-frequency error component is not easily isolated. Therefore, this application does not focus on evaluating the high-frequency error component. Preferably, the preset threshold can be preset according to the sensitivity of the target imaging performance indicators to errors in different spatial frequency bands. Based on this, this application determines the difference between the topography deviation dataset and the low-frequency error component as the mid-frequency error component for subsequent imaging performance evaluation.
[0030] This embodiment addresses the varying sensitivity of different frequency band errors to target imaging performance indicators, eliminating the complex processes of traditional filter splitting or multi-frequency separation. This effectively avoids error distortion and information loss caused by frequency domain transformation, filter parameter selection, and boundary effects. The method is computationally simple, yields stable results, and is highly reproducible. It does not rely on complex algorithms such as neural network training or multi-scale data fusion, significantly reducing implementation complexity and engineering deployment costs.
[0031] Meanwhile, this application incorporates deviation information that has a significant impact on target imaging performance indicators, except for low-frequency error components, into the mid-frequency error components. This allows for the more complete preservation of error information that has a significant impact on imaging quality, facilitating further quantitative analysis of the independent contributions of low-frequency and mid-frequency error components to the system's imaging performance.
[0032] In one exemplary embodiment of this application, the low-frequency error component can also be obtained through spatial filtering, wherein the spatial filtering includes at least one of Gaussian filtering, spline filtering, morphological filtering, empirical mode decomposition filtering, or wavelet decomposition filtering. Furthermore, the mid-frequency error component is obtained through at least one of the following methods: spatial filtering extraction; frequency domain bandpass filtering extraction; or wavelet decomposition extraction.
[0033] S300 obtains the low-frequency imaging performance index or mid-frequency imaging performance index of the optical element under test based on the low-frequency error component or mid-frequency error component of the optical element under test.
[0034] Specifically, step S300 also includes: S310 fuses the low-frequency error component or the mid-frequency error component with the standard surface height data to obtain the low-frequency surface height data or the mid-frequency surface height data. S320 inputs low-frequency or mid-frequency surface height data into a preset optical system model to obtain low-frequency or mid-frequency imaging performance indicators.
[0035] S400: If any enabled low-frequency imaging performance indicator fails to meet the corresponding standard low-frequency imaging performance indicator, or if any enabled mid-frequency imaging performance indicator fails to meet the corresponding standard mid-frequency imaging performance indicator, a continued image correction signal is output. Specifically, the low-frequency imaging performance indicators include system wavefront aberration indicators, modulation transfer function (MTF) values in the low spatial frequency band, point spread function peak energy, and overall image quality score; the mid-frequency imaging performance indicators include MTF values at a specified spatial frequency, point spread function sidelobe energy integral, ring energy distribution function, optical transfer function, and / or scattering energy ratio.
[0036] In some embodiments, the aforementioned low-frequency imaging performance indicators and mid-frequency imaging performance indicators do not necessarily all need to be used as the judgment criteria simultaneously. Instead, one or more indicators can be selected from the corresponding indicator set for evaluation based on the application scenario, processing stage, optical system type, error-sensitive frequency band, and target imaging performance requirements of the optical element under test. That is, the low-frequency imaging indicator or the mid-frequency imaging indicator that is enabled can be selected. In other words, this application can use all low-frequency imaging performance indicators and all mid-frequency imaging performance indicators for comprehensive judgment, or it can enable only some of the indicators for targeted judgment.
[0037] For example, in the rough shaping stage or in scenarios where greater emphasis is placed on large-scale surface shape deviations and low-order wavefront errors, low-frequency imaging performance indicators can be prioritized for evaluation. Specifically, when it is necessary to characterize the overall wavefront quality of the system, system wavefront aberration indicators can be selected; when it is necessary to characterize the contrast transfer capability in the low spatial frequency band, modulation transfer function values in the low spatial frequency band can be selected; when it is necessary to characterize the degree of energy concentration, the point spread function peak energy indicator can be selected; when it is necessary to uniformly evaluate multiple low-frequency imaging factors, a comprehensive image quality score indicator can be selected, or a combination of the above low-frequency imaging performance indicators can be used as the judgment criterion.
[0038] Furthermore, in the refinement stage or in scenarios where more attention is paid to small-to-medium scale ripple, processing texture, periodic residual errors, and their impact on resolution, sidelobe energy, and stray light, mid-frequency imaging performance indicators can be prioritized for evaluation. Specifically, when controlling imaging transfer capability at a specified spatial frequency is required, the modulation transfer function (MTF) value at that frequency can be selected; when evaluating the overall transfer capability within a specific mid-frequency band, the MTF band integral value can be selected; when suppressing point spread function (PSF) sidelobe energy leakage is needed, the PSF sidelobe energy integral value can be selected; when evaluating the energy distribution characteristics around the image spot is required, the ring energy distribution function (ROC) can be selected; when evaluating optical transfer characteristics from a holistic frequency domain perspective, the optical transfer function (OPF) can be selected; and when the system is more sensitive to stray light or scattered background, the scattering energy ratio can be selected. In practical applications, one or more mid-frequency imaging performance indicators can also be combined as needed.
[0039] In some embodiments, the continued shaping signal can be a unified continued shaping control signal; or it can be a differentiated continued shaping signal that distinguishes between low-frequency error correction and mid-frequency error correction. Specifically, when the low-frequency imaging performance index fails to meet the standard, a continued shaping signal targeting the low-frequency error component can be output to instruct subsequent processes to prioritize large-scale surface shape correction; when the mid-frequency imaging performance index fails to meet the standard, a continued shaping signal targeting the mid-frequency error component can be output to instruct subsequent processes to prioritize mid-frequency ripple or local residual error suppression; when both the low-frequency and mid-frequency imaging performance indices fail to meet the standard, a joint continued shaping signal can be output. Optionally, the continued shaping signal may also include at least one of the following information: type of non-compliant index, corresponding frequency band, deviation amount, priority, and / or recommended shaping strategy, to guide subsequent shaping processes.
[0040] Conversely, when all enabled low-frequency imaging performance indicators meet their corresponding standard low-frequency imaging performance indicators, and all enabled mid-frequency imaging performance indicators meet their corresponding standard mid-frequency imaging performance indicators, a stop-correction signal is output. That is, in determining whether to terminate correction, both the enabled low-frequency and mid-frequency indicators must simultaneously meet the standards for the surface shape error of the optical element under test to be considered to have met the requirements for impacting imaging performance, thus stopping the correction.
[0041] Optionally, in other embodiments, a phased determination method may also be adopted, that is, in a certain processing stage, only the set of indicators enabled in that stage are judged to meet the standards; when all enabled indicators in that stage meet the corresponding standards, a stage stop shaping signal or a stage switching signal is output to enter the next processing stage; when finally stopping shaping, the low-frequency imaging performance indicators and mid-frequency imaging performance indicators enabled in the final stage are still judged to meet the corresponding standards.
[0042] The following specific embodiment illustrates the non-removable shaping method for optical elements provided in this application, such as... Figure 2 As shown, this embodiment is applicable to the manufacturing process control of core optical components (such as off-axis freeform surface mirrors) in a 266 nm ultraviolet band three-mirror focusing system; as Figure 3 As shown, the online performance evaluation and termination determination device corresponding to this embodiment includes a CMP freeform surface polishing machine (or robotic arm polishing machine), a linear slide, and a phase measurement deflection measurement system.
[0043] (1) Workpiece clamping and shaping.
[0044] An off-axis freeform surface mirror blank is clamped onto a fixed fixture, which ensures the consistency of the blank's posture and positioning during the switching process between the shaping station and the measurement station. Subsequently, a robotic arm polishing machine is controlled to shape the blank according to preset process parameters (including but not limited to pressure, speed, trajectory, and dwell time).
[0045] (2) In-situ full-diameter measurement without removing the workpiece.
[0046] After completing one shaping process, without removing the workpiece, the blank and fixture are moved together to the phase measurement and deflection measurement station via a linear slide. The full-aperture surface shape measurement data of the mirror to be shaped is obtained, and the topographic deviation dataset is calculated. "Without removing the workpiece" means that the blank remains in the fixture or tooling clamping state when switching between shaping and measurement, thereby reducing positioning errors and clamping stress variations introduced by repeated clamping.
[0047] (3) Surface error frequency decomposition and low / medium frequency extraction.
[0048] like Figure 4 As shown, the frequency band decomposition module is invoked to perform spatial frequency decomposition on the topography deviation dataset. This embodiment uses Zernike standard polynomials for fitting: 50 Zernike standard polynomials are selected to fit the topography deviation dataset to obtain low-frequency surface shape terms, and the fitted low-frequency error component terms are denoted as e. LF (x,y), and subtract e from the topography deviation dataset. LF After (x,y), the residual term is obtained as the mid-frequency error component e. MF (x,y). Among them, the low-frequency error component is used to characterize the overall shape and low-order aberration trend, and the mid-frequency error component is used to characterize the mid-frequency fluctuation error that has a significant impact on the high-frequency attenuation of MTF and the sidelobes / halos of PSF.
[0049] (4) System-level image quality calculation and termination determination.
[0050] The low-frequency error component eLF (x,y) and / or the intermediate frequency error component e MF Inputting (x,y) into the target optical system model (e.g., a 266 nm ultraviolet three-mirror focusing system model) yields system-level imaging performance evaluation metrics. I The target optical system model can be implemented using optical design / simulation software or a self-built computing module, such as Zemax, CodeV, OSLO, etc. The imaging performance evaluation index includes at least one of the following: point spread function (PSF) curve or its main peak energy, modulation transfer function (MTF) value or band integral value at a specified spatial frequency, PSF sidelobe energy integral, ring energy distribution function, optical transfer function (OTF), or scattering / halo related index.
[0051] like Figure 5 As shown, this embodiment uses the performance index corresponding to the PSF curve as the termination criterion: when the intermediate frequency error PV value of the reflector decreases from 180 nm after the first correction to 50 nm after the second correction, the evaluation value of the system's PSF curve reaches 0.7 or higher (i.e., I ≥ I target ,in I target =0.7), meeting the preset performance requirements, outputting a termination signal and terminating the shaping process; when I < I target The system outputs a continuing reshaping signal and proceeds to the next round of reshaping, in-situ measurement, frequency band decomposition, and system image quality evaluation.
[0052] In this embodiment, the preset spatial frequency range can be determined based on the cutoff frequency or Nyquist frequency of the target system, so that the frequency band corresponding to the intermediate frequency error component matches the system's imaging resolution frequency band. The termination signal can also be used to adjust the processing parameters of the robotic arm polishing machine to form closed-loop control, thereby reducing the risk of over-work and under-work and improving manufacturing consistency.
[0053] Those skilled in the art will understand that various aspects of this application can be implemented as apparatus, method, or program product. Therefore, various aspects of this application can be specifically implemented in the following forms: a completely hardware implementation, a completely software implementation (including firmware, microcode, etc.), or a combination of hardware and software aspects, collectively referred to herein as a "circuit," "module," or "apparatus."
[0054] An electronic device according to this embodiment of the present application. The electronic device is merely an example and should not be construed as limiting the functionality and scope of use of the embodiments of this application.
[0055] Electronic devices are manifested in the form of general-purpose computing devices. The components of an electronic device may include, but are not limited to: at least one processor, at least one memory, and a bus connecting different device components (including memory and processor).
[0056] The memory stores program code that can be executed by a processor, causing the processor to perform the steps described in the "Exemplary Methods" section above, according to various exemplary embodiments of this application.
[0057] The storage may include readable media in the form of volatile storage, such as random access memory (RAM) and / or cache memory, and may further include read-only memory (ROM).
[0058] The storage device may also include a program / utility having a set (at least one) of program modules, including but not limited to: operating device, one or more application programs, other program modules, and program data, each or some combination of these examples may include an implementation of a network environment.
[0059] A bus can represent one or more of several bus architectures, including a memory bus or memory controller, a peripheral bus, a graphics acceleration port, a processor, or a local bus that uses any of the various bus architectures.
[0060] The electronic device can also communicate with one or more external devices (such as keyboards, pointing devices, Bluetooth devices, etc.), one or more devices that enable a user to interact with the electronic device, and / or any device that enables the electronic device to communicate with one or more other computing devices (such as routers, modems, etc.). This communication can be performed via input / output (I / O) interfaces. Furthermore, the electronic device can communicate with one or more networks (such as local area networks (LANs), wide area networks (WANs), and / or public networks, such as the Internet) via a network adapter. As shown in the figure, the network adapter communicates with other modules of the electronic device via a bus. It should be understood that, although not shown in the figure, other hardware and / or software modules can be used in conjunction with the electronic device, including but not limited to: microcode, device drivers, redundant processors, external disk drive arrays, RAID devices, tape drives, and data backup storage devices.
[0061] Through the above description of the embodiments, those skilled in the art will readily understand that the exemplary embodiments described herein can be implemented by software or by combining software with necessary hardware. Therefore, the technical solutions according to the embodiments of this application can be embodied in the form of a software product, which can be stored in a non-volatile storage medium (such as a CD-ROM, USB flash drive, external hard drive, etc.) or on a network, including several instructions to cause a computing device (such as a personal computer, server, terminal device, or network device, etc.) to execute the methods according to the embodiments of this application.
[0062] In exemplary embodiments of this application, a computer-readable storage medium is also provided, on which a program product capable of implementing the methods described above is stored. In some possible implementations, various aspects of this application may also be implemented as a program product including program code, which, when the program product is run on a terminal device, causes the terminal device to perform the steps of the various exemplary embodiments of this application described in the "Exemplary Methods" section above.
[0063] The program product may employ any combination of one or more readable media. A readable medium may be a readable signal medium or a readable storage medium. A readable storage medium may be, for example, but not limited to, an electrical, magnetic, optical, electromagnetic, infrared, or semiconductor device, apparatus, or device, or any combination thereof. More specific examples of readable storage media (a non-exhaustive list) include: an electrical connection having one or more wires, a portable disk, a hard disk, random access memory (RAM), read-only memory (ROM), erasable programmable read-only memory (EPROM or flash memory), optical fiber, portable compact disk read-only memory (CD-ROM), optical storage devices, magnetic storage devices, or any suitable combination thereof.
[0064] Computer-readable signal media may include data signals propagated in baseband or as part of a carrier wave, carrying readable program code. Such propagated data signals may take various forms, including but not limited to electromagnetic signals, optical signals, or any suitable combination thereof. A readable signal medium may also be any readable medium other than a readable storage medium, capable of sending, propagating, or transmitting a program for use by or in connection with an instruction execution device, apparatus, or apparatus.
[0065] The program code contained on the readable medium may be transmitted using any suitable medium, including but not limited to wireless, wired, optical fiber, RF, etc., or any suitable combination thereof.
[0066] Program code for performing the operations of this application can be written in any combination of one or more programming languages, including object-oriented programming languages such as Java and C++, and conventional procedural programming languages such as C or similar languages. The program code can execute entirely on the user's computing device, partially on the user's computing device, as a standalone software package, partially on the user's computing device and partially on a remote computing device, or entirely on a remote computing device or server. In cases involving remote computing devices, the remote computing device can be connected to the user's computing device via any type of network, including a local area network (LAN) or a wide area network (WAN), or it can be connected to an external computing device (e.g., via the Internet using an Internet service provider).
[0067] Furthermore, the above figures are merely illustrative of the processes included in the method according to exemplary embodiments of this application, and are not intended to be limiting. It is readily understood that the processes shown in the above figures do not indicate or limit the temporal order of these processes. Additionally, it is readily understood that these processes may be executed synchronously or asynchronously, for example, in multiple modules.
[0068] It should be noted that although several modules or units for the device used to perform actions have been mentioned in the detailed description above, this division is not mandatory. In fact, according to the embodiments of this application, the features and functions of two or more modules or units described above can be embodied in one module or unit. Conversely, the features and functions of one module or unit described above can be further divided and embodied by multiple modules or units.
[0069] The above are merely specific embodiments of this application, but the scope of protection of this application is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in this application should be included within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.
Claims
1. A method for non-removable shaping of an optical element, characterized in that, The method includes: During the shaping process of the optical element under test, an in-situ full-aperture surface shape measurement is performed on the optical element under test to obtain the surface height dataset of the optical element under test; wherein, the optical element under test is not removed when performing the in-situ full-aperture surface shape measurement. Based on the surface height dataset of the optical element under test, the low-frequency error component and the mid-frequency error component corresponding to the optical element under test are obtained; Based on the low-frequency error component or mid-frequency error component of the optical element under test, the low-frequency imaging performance index or mid-frequency imaging performance index of the optical element under test is obtained. If any enabled low-frequency imaging performance indicator does not meet the corresponding standard low-frequency imaging performance indicator, or if any enabled mid-frequency imaging performance indicator does not meet the corresponding standard mid-frequency imaging performance indicator, then a continuing shaping signal will be output.
2. The method for non-removable shaping of optical elements according to claim 1, characterized in that, In-situ full-diameter surface shape measurement was performed using the deflection measurement method.
3. The method for non-removable shaping of optical elements according to claim 1, characterized in that, The step of obtaining the low-frequency error component and mid-frequency error component corresponding to the optical element under test based on the surface height dataset of the optical element under test includes: The difference between the surface height dataset of the optical element under test and the standard surface height dataset corresponding to the optical element under test is determined as the topography deviation dataset; wherein, the standard surface height data is the design surface shape data of the optical element under test or the reference surface shape data obtained by polynomial fitting based on the surface height dataset of the optical element under test. Based on the topography deviation dataset, the low-frequency error component and the mid-frequency error component corresponding to the optical element under test are obtained. The low-frequency error component is obtained by polynomial fitting of the topography deviation dataset. The mid-frequency error component is obtained by processing the difference between the topography deviation dataset and the low-frequency error component.
4. The method for non-removable shaping of optical elements according to claim 3, characterized in that, Polynomial fitting employs one or any combination of two-dimensional polynomials, Zernike polynomials, Legendre polynomials, Chebyshev polynomials, or Q-type polynomials.
5. The method for non-removable shaping of optical elements according to claim 4, characterized in that, The order of the polynomial fit is determined based on the root mean square value threshold of the fit residuals and / or the goodness-of-fit threshold.
6. The method for non-removable shaping of optical elements according to claim 3, characterized in that, The mid-frequency error component is obtained by interpolation, resampling, and coordinate registration based on the difference between the topography deviation dataset and the low-frequency error component.
7. The method for non-removable shaping of optical elements according to claim 1, characterized in that, The step of obtaining the low-frequency imaging performance index or mid-frequency imaging performance index corresponding to the optical element under test based on the low-frequency error component or mid-frequency error component includes: The low-frequency error component or the mid-frequency error component is fused with the standard surface height data to obtain the low-frequency surface height data or the mid-frequency surface height data. Input low-frequency or mid-frequency surface height data into a preset optical system model to obtain low-frequency or mid-frequency imaging performance indicators.
8. The method for non-removable shaping of optical elements according to claim 1, characterized in that, Low-frequency imaging performance indicators include system wavefront aberration indicators, modulation transfer function (MTF) values in the low spatial frequency band, point spread function peak energy indicators, and overall image quality score indicators; mid-frequency imaging performance indicators include MTF values at a specified spatial frequency, MTF band integral values, point spread function sidelobe energy integral indicators, ring energy distribution function indicators, optical transfer function indicators, and / or scattering energy ratio indicators.
9. A non-transitory computer-readable storage medium, characterized in that, The storage medium stores at least one instruction or at least one program segment, which is loaded and executed by a processor to implement the method as described in any one of claims 1-8.
10. An electronic device, characterized in that, Includes a processor and the non-transitory computer-readable storage medium as described in claim 9.