Sample processing device and sample processing method

Abstract

Provided is a sample processing device capable of reducing cuttings scattered into a sample chamber. A sample processing device (100) for processing a sample (S) by irradiating the sample (S) disposed in a sample chamber (12) with a processing beam, a laser processing apparatus includes a laser device (30) as a processing beam source for irradiating a processing beam to a sample (S), a sample holder (50) for holding the sample (S), a sample stage (40) on which the sample holder (50) is mounted, and a shield (60) disposed in a sample chamber (12), the sample holder (50) and the shield (60) constituting a container for accommodating the sample (S). The container is provided with a window part for guiding the processing beam into the container.

Description

Technical Field

[0001] This invention relates to a sample processing apparatus and a sample processing method. Background Technology

[0002] In analytical apparatus such as scanning electron microscopes and transmission electron microscopes, the specimens that are to be observed or analyzed are processed into shapes suitable for observation or analysis using specimen processing equipment. Examples of such specimen processing equipment include cross-section polishers (registered trademark) that use ion beams, focused ion beam devices that use focused ion beams, and laser processing devices that use lasers.

[0003] In sample processing apparatus, the chips generated during processing can sometimes cause adverse effects. For example, Patent Document 1 discloses a processing apparatus that uses a laser beam to process a sample in a vacuum chamber, wherein a protective screen is provided between the sample and the objective lens to protect the objective lens from the chips generated during processing. Existing technical documents Patent documents

[0004] Patent Document 1: Japanese Patent Application Publication No. 2013-214513 Summary of the Invention The problem the invention aims to solve

[0005] However, the chips generated during processing can scatter in various directions from the laser beam's irradiation point. Therefore, for example, in the device disclosed in Patent Document 1, the chips generated during processing can sometimes scatter into the vacuum chamber and adhere to optical systems other than the objective lens, detectors, the inner surface of the vacuum chamber, etc. Solution for solving the problem

[0006] One embodiment of the sample processing apparatus of the present invention is a sample processing apparatus that processes a sample by irradiating a sample processing beam disposed in a sample chamber, comprising: A processing beam source that irradiates the sample with the processing beam; A sample holder for holding the sample; A sample stage on which the sample holder is mounted; and A shielding element, which is disposed in the sample chamber. The sample holder and the shielding member constitute a container for holding the sample. The container is provided with a window for guiding the processing beam into the container.

[0007] In such a sample processing device, the sample can be processed inside the container, thus reducing the amount of chips flying into the sample chamber.

[0008] One embodiment of the sample processing method of the present invention includes: The process of installing a sample holder to hold the sample in the sample stage of the sample chamber of the sample processing device. The process of using an observation beam to observe the sample and determine the processing area of ​​the sample; The process of placing the sample into a container consisting of a shield and a sample holder; and The process of guiding a processing beam from a window provided in the container into the container and processing the sample contained in the container with the processing beam.

[0009] In this sample processing method, the sample can be processed inside the container, thus reducing the amount of chips flying into the sample chamber. Attached Figure Description

[0010] Figure 1 This is a perspective view schematically showing the sample processing apparatus of this embodiment. Figure 2 This is a schematic top view of the sample processing apparatus of this embodiment. Figure 3 It is a schematic perspective view of the sample holder and shielding. Figure 4 It is a schematic perspective view of the sample holder and shielding. Figure 5 It is a schematic perspective view of the sample holder and shielding. Figure 6 It is a schematic three-dimensional view of the shielding component. Figure 7 It is a schematic three-dimensional view of the shielding component. Figure 8 It is a schematic three-dimensional view of the container. Figure 9 This is a flowchart illustrating an example of a measurement method that includes a sample preparation method using a sample preparation apparatus. Figure 10 It is a diagram used to illustrate the steps of a test method that includes a sample processing method using a sample processing device. Figure 11 It is a diagram used to illustrate the steps of a test method that includes a sample processing method using a sample processing device. Figure 12 It is a perspective view schematically showing a modified example of the sample holder and shield. Figure 13 It is a perspective view schematically showing a modified example of the shielding component. Figure 14 It is a perspective view schematically showing a modified example of the shielding component. Figure 15 It is a perspective view schematically showing a modified example of the shielding component. Figure 16 It is a perspective view schematically showing a modified example of the shielding component. Figure 17 It is a perspective view schematically showing a modified example of the sample holder and shield. Figure 18 It is a perspective view schematically showing a modified example of the sample holder and shield. Figure 19 It is a perspective view schematically showing a modified example of the container. Figure 20 It is a schematic cross-sectional view showing the connection between the sample holder and the shield. Figure 21 This is a diagram used to illustrate a variation of the container. Figure 22 This is a diagram used to illustrate a variation of the container. Figure 23 This is a diagram used to illustrate a variation of the container. Figure 24 This is a diagram used to illustrate a variation of the container. Figure 25 It is a perspective view schematically showing a modified example of the sample holder and shield. Figure 26 It is a perspective view schematically showing a modified example of the sample holder and shield. Explanation of reference numerals in the attached figures 2… Container, 10… Shell, 12… Sample Chamber, 14… Door, 16a… Connection Port, 16b… Connection Port, 16c… Connection Port, 20… SEM Tube, 22… Objective Lens, 30… Laser Device, 40… Sample Stage, 50… Sample Holder, 52… Matrix, 54… Tilting Mechanism, 56a… First Component, 56b… Second Component, 58… Sample Stage, 59… Protrusion, 60… Shielding Component, 62a… Third Component, 62b… Fourth Component, 62c… Fifth Component Component, 62d…6th component, 64…window, 66…recess, 70…EBSD detector, 80…EDS detector, 90…support component, 100…sample processing device, 500…bottom, 540…base, 542…protrusion, 544…connection, 602…cover, 603…shaft component, 604…upper surface, 606…side surface, 610…moving wall, 620…moving mechanism, 622…track, 630…cover, 632…hing. Detailed Implementation

[0011] The preferred embodiments of the present invention will now be described in detail using the accompanying drawings. Furthermore, the embodiments described below are not intended to unduly limit the scope of the invention as defined in the claims. Additionally, not all of the components described below are necessarily essential elements of the present invention.

[0012] 1. Sample processing device First, a sample processing apparatus according to one embodiment of the present invention will be described with reference to the accompanying drawings. Figure 1 This is a schematic perspective view of the sample processing apparatus 100 according to this embodiment. Furthermore, in Figure 1 The illustration of a portion of the housing 10 is omitted. Figure 2 This is a schematic top view of the sample processing apparatus 100 according to this embodiment. Figure 1 and Figure 2 In the diagram, the X-axis, Y-axis, and Z-axis are shown as three mutually orthogonal axes.

[0013] like Figure 1 and Figure 2 As shown, the sample processing apparatus 100 includes: a housing 10 having a sample chamber 12; an SEM (scanning electron microscope) tube 20 serving as a beam source for observation; a laser device 30 serving as a beam source for processing; a sample stage 40; a sample holder 50; a shield 60; a backscattered electron diffraction detector (EBSD detector) 70; and an energy dispersive X-ray spectrometer (EDS detector) 80.

[0014] The housing 10 has a sample chamber 12 for receiving the sample S. An SEM tube 20, a laser device 30, an EBSD detector 70, and an EDS detector 80 are mounted on the housing 10. The SEM tube 20 is mounted on the face of the housing 10 facing the +Z direction. A connection port 16a is provided on the face of the housing 10 facing the +X direction, and a connection port 16b is provided on the face of the housing 10 facing the +Y direction. The laser device 30 is mounted on the connection port 16a. The EBSD detector 70 is mounted on the connection port 16b. A further connection port 16c is provided on the housing 10, and the EDS detector 80 is mounted on the connection port 16c.

[0015] The sample S, which is to be processed and observed, is stored in the sample chamber 12. The sample chamber 12 is maintained at a vacuum (depressurized state) by a vacuum exhaust device (not shown). A door 14 is provided in the housing 10. The sample S held in the sample holder 50 is introduced into the sample chamber 12 through the door 14.

[0016] The SEM tube 20 irradiates the sample S with an electron beam. The electron beam irradiates the sample S along the Z-axis. The SEM tube 20 includes: an electron gun that emits an electron beam; and an electron optics system for focusing the electron beam to form an electron probe, which scans the sample S. The electron optics system includes an objective lens 22. The objective lens 22 is a lens placed closest to the sample S, causing the electron probe to focus on the surface of the sample S.

[0017] In the sample processing apparatus 100, an SEM image can be obtained by scanning the sample S with an electron probe and detecting the electrons emitted from the sample S with an electron detector (not shown).

[0018] The laser device 30 irradiates the sample S with a laser beam for processing. This allows the sample S to be processed. The laser device 30 can also process the sample S by scanning it with a laser. For example, in processing the cross-section of the sample S, by using a laser as the processing beam, a large area can be processed in a shorter time compared to using a focused ion beam (FIB).

[0019] A sample stage 40 is disposed in the sample chamber 12. A sample holder 50 is placed on the sample stage 40. The sample stage 40 is capable of moving the sample holder 50 in the horizontal and vertical directions. That is, the sample stage 40 is capable of moving the sample holder 50 along the X-axis, Y-axis, and Z-axis. Moreover, the sample stage 40 is capable of tilting the sample holder 50.

[0020] The sample holder 50 holds the sample S. The sample holder 50 is mounted to the sample stage 40. The sample holder 50 is detachable from the sample stage 40.

[0021] A shielding member 60 is disposed in the sample chamber 12. The shielding member 60 is supported by a support member 90. The shielding member 60 is fixed to the housing 10 via the support member 90. As described later, the shielding member 60 is used to reduce the amount of chips flying into the sample chamber 12.

[0022] The EBSD detector 70 acquires the electron diffraction pattern obtained using backscattered electron diffraction. For example, when an electron beam is incident on the surface of sample S from an angle of approximately 70°, electrons are diffracted and emitted from sample S as reflected electrons. The electron diffraction pattern that appears at this time is acquired by the EBSD detector 70. By scanning sample S with an electron beam to obtain the electron diffraction pattern, an EBSD mapping image can be obtained. In the EBSD mapping image, the orientation of grains, grain boundaries, and differences in crystal phases can be visualized.

[0023] The EDS detector 80 distinguishes X-rays emitted from the sample S by irradiating it with an electron beam, thereby obtaining an X-ray spectrum. The compositional information of the sample S can be obtained from the X-ray spectrum.

[0024] In the sample processing apparatus 100, SEM observation, EBSD measurement, and EDS measurement are performed at the observation position located below the objective lens 22 (in the -Z direction). With the sample holder 50 holding the sample S in the observation position, an electron beam is irradiated onto the sample S from the SEM tube 20 to capture an SEM image. Similarly, with the sample holder 50 holding the sample S in the observation position, an electron beam is irradiated onto the sample S from the SEM tube 20 to perform EBSD and EDS measurements. Furthermore, Figure 1 The figure shows the sample holder 50 in the observation position.

[0025] Furthermore, in the sample processing apparatus 100, laser processing is performed at a processing position located in front of (-X direction) the connection port 16a to which the laser device 30 is connected. With the sample holder 50 holding the sample S in the processing position, laser light is irradiated onto the sample S from the laser device 30 to perform laser processing on the sample S.

[0026] When the sample S is laser-processed, chips from the sample S are generated. These chips scatter in various directions. With the sample holder 50 in the processing position, the sample S is collected in a container formed by the sample holder 50 and the shielding member 60. Therefore, in the sample processing apparatus 100, the amount of chips scattering into the sample chamber 12 can be reduced.

[0027] As described above, the EBSD measurement was performed with the sample S tilted at 70°. Therefore, the sample S was laser-processed while tilted at 70°. Thus, as... Figure 1 As shown, the shielding member 60 is fixed to the sample chamber 12 at a 70° angle to match the sample holder 50 which is tilted at a 70° angle.

[0028] The processing position is located in the +X direction of the observation position, and the observation position and the processing position are arranged along the X-axis. Therefore, the sample holder 50 can be moved between the observation position and the processing position simply by moving the sample stage 40 along the X-axis. Thus, in the sample processing apparatus 100, the positional deviation of the sample S caused by movement between the observation position and the processing position can be reduced. Furthermore, the positional relationship between the observation position and the processing position is not limited to this.

[0029] 2. Sample holder and shielding components Figures 3-5 This is a schematic perspective view of the sample holder 50 and the shield 60. Figure 3 The figure shows the sample holder 50 in the observation position. Figure 4 The figure shows the state in which the sample stage 58 is tilted. Figure 5 The diagram shows the sample holder 50 in the machining position. Furthermore, as... Figure 1 As shown, the shielding member 60 is fixed to the sample chamber 12 at a 70° angle, but... Figures 3-5 For convenience, the diagram shows that the shielding element 60 is not tilted.

[0030] like Figures 3-5 As shown, the sample holder 50 has a base 52, a tilting mechanism 54, a first member 56a, a second member 56b, a sample stage 58, and a protrusion 59.

[0031] The substrate 52 is mounted onto the sample stage 40. A tilting mechanism 54 is provided on the substrate 52.

[0032] The tilting mechanism 54 tilts the sample stage 58 at any angle. Thus, as... Figure 4 As shown, the specimen S placed on the specimen stage 58 can be tilted. The tilting mechanism 54 has: a base 540; a protrusion 542 that protrudes vertically relative to the base 540; and a connecting portion 544 that is connected to the first member 56a.

[0033] The base 540 is fixed to the base 52. The protrusion 542 and the connecting part 544 are connected by an inclined shaft T. The inclined mechanism 54 has a drive unit that rotates the connecting part 544 about the inclined shaft T. The drive unit rotates the connecting part 544 by power, for example, from a motor or the like. By rotating the connecting part 544 about the inclined shaft T by the drive unit, as... Figure 4 As shown, the first component 56a, the second component 56b, and the sample stage 58 can be tilted as a whole.

[0034] Furthermore, the configuration of the tilting mechanism 54 is not particularly limited as long as it can tilt the sample stage 58.

[0035] like Figure 5 As shown, the sample holder 50 and the shielding member 60 form a container 2 for receiving the sample S at the machining position. The first member 56a and the second member 56b are components used to construct the container 2. The first member 56a defines the bottom surface of the container 2. The second member 56b defines one of the four sides of the container 2.

[0036] The sample stage 58 is disposed on the first member 56a. The sample S is placed on the sample stage 58. The sample S can be tilted by using the tilting mechanism 54 to tilt the sample stage 58.

[0037] A protrusion 59 is provided at the connection between the sample holder 50 and the shielding member 60. The protrusion 59 is provided on the first member 56a and the second member 56b of the sample holder 50. The protrusion 59 is provided in a manner that surrounds the sample stage 58.

[0038] Figure 6 and Figure 7 This is a schematic perspective view of the shielding element 60.

[0039] The shielding member 60 has a third member 62a, a fourth member 62b, a fifth member 62c, a sixth member 62d, a window 64, and a recess 66. The third member 62a defines one of the four sides of the container 2. The fourth member 62b defines one of the four sides of the container 2. The fifth member 62c defines one of the four sides of the container 2. The sixth member 62d defines the upper surface of the container 2.

[0040] Container 2 is composed of component 1 56a, component 2 56b, component 3 62a, component 4 62b, component 5 62c, and component 6 62d. Component 1 56a, component 2 56b, component 3 62a, component 4 62b, component 5 62c, and component 6 62d form six surfaces surrounding the sample S. The sample S is housed within the space enclosed by these six surfaces (the inner surface of container 2). Container 2 utilizes these six surfaces to completely surround the sample S.

[0041] The inner surface of container 2 has fine irregularities to prevent chips adhering to it due to laser processing from easily peeling off. For example, irregularities of several hundred μm to about 1 mm are formed on the inner surface of container 2. For instance, these irregularities can be formed on the inner surface of container 2 by forming a film of metal, ceramic, or cermet on the inner surface using a spray process. This makes it difficult for chips adhering to it due to laser processing to peel off from the inner surface of container 2. Furthermore, the components constituting the inner surface of container 2, namely the first component 56a, the second component 56b, the third component 62a, the fourth component 62b, the fifth component 62c, and the sixth component 62d, can be made of a material that prevents chips adhering to it due to laser processing from easily peeling off from the inner surface of container 2.

[0042] Window 64 guides the laser into container 2. Window 64 allows the laser to pass through. Window 64 is made of, for example, glass. Window 64 is disposed on the fifth member 62c having a surface facing the laser device 30. Window 64 is replaceable relative to container 2. Window 64 is detachable relative to the fifth member 62c.

[0043] A recess 66 is provided at the connection between the shielding member 60 and the sample holder 50. For example... Figure 7 As shown, a recess 66 is provided on the inner surface of the shield 60. When the sample holder 50 is in the machined position, the protrusion 59 is inserted into the recess 66.

[0044] Figure 8 This is a schematic three-dimensional view of container 2.

[0045] like Figure 8 As shown, when the container 2 is formed by the sample holder 50 and the shielding member 60, the protrusion 59 is inserted into the recess 66. Therefore, at the connection between the sample holder 50 and the shielding member 60, the path connecting the inside and outside of the container 2 can be bent. Thus, for example, compared to the case where the path connecting the inside and outside of the container 2 is straight, the possibility of chips escaping from the connection between the sample holder 50 and the shielding member 60 to the outside of the container 2 can be reduced.

[0046] Furthermore, in the above Figures 3-8 The example shown illustrates a case where the sample holder 50 has a protrusion 59 and the shielding member 60 has a recess 66. However, although not shown, it is also possible to have a protrusion in the shielding member 60 and a recess in the sample holder 50 for the protrusion to be inserted. In this case, the same effect can be achieved.

[0047] 3. Sample preparation method Next, we will discuss the sample processing method using the sample processing apparatus 100 and the measurement method for measuring the sample processed by the sample processing method. Figure 9 This is a flowchart illustrating an example of a measurement method that includes a sample processing method using a sample processing apparatus 100. Figure 10 and Figure 11 This is a diagram illustrating the steps of a measurement method that includes a sample processing method using a sample processing device 100.

[0048] First, such as Figure 1 As shown, the sample holder 50, which holds the sample S, is installed onto the sample stage 40 (step S100).

[0049] First, the sample chamber 12 is ventilated, and the sample holder 50, which holds the sample S, is introduced into the sample chamber 12 through the door 14. Next, the sample holder 50 is installed onto the sample stage 40. After the sample holder 50 is installed on the sample stage 40, the door 14 is closed, and the sample chamber 12 is evacuated. Thus, the sample chamber 12 becomes a vacuum state. At this time, the sample holder 50 is in the observation position.

[0050] Next, as Figure 10 As shown, SEM images are used to determine the processing area (process S102).

[0051] First, the sample holder 50 is tilted 70° using the sample stage 40. This allows the incident angle of the electron beam relative to the surface of the sample S to be 70°. Next, the EBSD detector 70 is inserted and positioned near the sample S. This establishes a state where EBSD measurements can be performed. Next, an electron beam is irradiated onto the sample S through the SEM tube 20 to obtain a SEM image of the sample S. This SEM image of the sample S is used to determine the processing area of ​​the sample S.

[0052] Next, as Figure 11 As shown, sample S is placed into container 2 (step S104).

[0053] First, the sample holder 50 is moved from the observation position to the processing position using the sample stage 40. Specifically, the sample holder 50, located at the observation position, is moved a predetermined distance in the +X direction using the sample stage 40. This allows the sample holder 50 to be moved from the observation position to the processing position. Here, since the shielding member 60 is fixed at the processing position, by moving the sample holder 50 to the processing position, the sample holder 50 and the shielding member 60 together form a container 2 for holding the sample S.

[0054] Next, the sample S is laser-processed (process S106).

[0055] First, the processed area of ​​the sample S inside the container 2 is examined through the window 64 using an optical microscope (not shown) mounted on the housing 10. Next, the laser device 30 emits a laser beam. The laser beam passes through the window 64 and is irradiated onto the sample S inside the container 2. This allows laser processing of the processed area of ​​the sample S, creating a cross-section of the sample S. Through the above steps, a cross-section of the processed area of ​​the sample S can be created.

[0056] Next, as Figure 10 As shown, the processing area of ​​the laser-processed sample S is measured (process S108).

[0057] First, the sample holder 50 is moved from the machining position to the observation position using the sample stage 40. Specifically, the sample holder 50, located in the machining position, is moved a predetermined distance in the -X direction using the sample stage 40. This allows the sample holder 50 to be moved from the machining position to the observation position. Since the shielding member 60 is fixed to the machining position, the sample S is exposed by moving the sample holder 50 from the machining position to the observation position.

[0058] Next, an electron beam is irradiated onto sample S to obtain a SEM image of sample S. The SEM image of sample S is used to confirm that an electron beam has been irradiated onto the laser-processed area. Then, an electron beam is irradiated onto the processed area of ​​sample S to perform EBSD and EDS measurements.

[0059] Here, depending on the laser processing conditions, the cross-section of the processed area may sometimes be tilted. In this case, at the observation position, the cross-section of the processed area of ​​sample S may not be oriented towards the EBSD detector 70. In such cases, as... Figure 4 As shown, the tilting mechanism 54 of the sample holder 50 is used to tilt the sample S so that the cross-section of the processed area of ​​the sample S faces the direction of the EBSD detector 70. Therefore, the cross-section of the processed area of ​​the sample S faces the direction of the EBSD detector 70, thus enabling EBSD measurements with good accuracy.

[0060] Through the above procedures, the laser-processed area of ​​sample S can be measured.

[0061] Furthermore, by repeatedly processing the sample S including the aforementioned steps S102, S104, and S106, and measuring the sample S including step S108, multiple cross-sectional images are obtained. By reconstructing the obtained multiple cross-sectional images, the three-dimensional information of the sample S can be obtained. In this way, the three-dimensional measurement of the sample S can be easily performed in the sample processing apparatus 100.

[0062] 4. Effects The sample processing apparatus 100 includes a laser device 30 that serves as a processing beam source for irradiating the sample S, a sample holder 50 for holding the sample S, a sample stage 40 on which the sample holder 50 is mounted, and a shielding member 60 disposed in the sample chamber 12. Furthermore, in the sample processing apparatus 100, the sample holder 50 and the shielding member 60 constitute a container 2 for holding the sample S, and the container 2 is provided with a window 64 for guiding the laser beam, which serves as the processing beam, into the container 2.

[0063] Therefore, in the sample processing apparatus 100, with the sample S housed in the container 2, laser processing of the sample S is possible, reducing the amount of chips flying into the sample chamber 12. This reduces the likelihood of chips adhering to the SEM lens barrel 20, EBSD detector 70, EDS detector 80, and other components constituting the sample processing apparatus 100. Furthermore, it reduces the likelihood of chips adhering to the inner surface of the sample chamber 12. As a result, in the sample processing apparatus 100, laser processing of the sample S can be performed without degrading the performance of the apparatus.

[0064] Furthermore, in the sample processing apparatus 100, sample S can be processed, observed, and analyzed without removing the sample holder 50 from the sample stage 40. Therefore, the sample processing apparatus 100 improves the processing capabilities for analysis and observation, and enables measurements with high positional accuracy. Consequently, in the sample processing apparatus 100, three-dimensional measurements can be easily performed to obtain three-dimensional information of the sample S by repeatedly processing, observing, and analyzing the sample S.

[0065] The sample processing apparatus 100 includes an observation beam source, namely a SEM tube 20, which irradiates the sample S with an electron beam used for observation. Furthermore, in the sample processing apparatus 100, the sample stage 40 moves the sample holder 50 between an observation position where the sample S is irradiated with an electron beam and a processing position where the sample S is irradiated with a laser. By moving the sample holder 50 to the processing position, the sample S is housed in the container 2. Thus, in the sample processing apparatus 100, by moving the sample holder 50 from the observation position to the processing position using the sample stage 40, the sample S can be housed in the container 2. Therefore, in the sample processing apparatus 100, the amount of chips flying into the sample chamber 12 can be easily reduced.

[0066] In the sample processing apparatus 100, the shielding member 60 is fixed at the processing position. Therefore, in the sample processing apparatus 100, by moving the sample holder 50 to the processing position, the sample S can be stored in the container 2.

[0067] In the sample processing apparatus 100, a protrusion 59 is provided in the sample holder 50, and a recess 66 is provided in the shielding member 60 for the protrusion 59 to be inserted. Therefore, in the sample processing apparatus 100, the possibility of chips escaping from the connection between the sample holder 50 and the shielding member 60 to the outside of the container 2 can be reduced.

[0068] In the sample processing apparatus 100, the sample holder 50 has a sample stage 58 for holding the sample S, and a protrusion 59 surrounds the sample stage 58. Therefore, in the sample processing apparatus 100, the possibility of chips escaping from the connection between the sample holder 50 and the shield 60 to the outside of the container 2 can be reduced.

[0069] In the sample processing apparatus 100, the sample holder 50 has a tilting mechanism 54 that tilts the sample S. Therefore, in the sample processing apparatus 100, the cross-section of the processing area of ​​the sample S can be oriented toward the EBSD detector 70.

[0070] In the sample processing apparatus 100, the processing beam is a laser, and the material of the window 64 allows the laser to pass through. Therefore, in the sample processing apparatus 100, the sample S can be laser-processed inside the container 2.

[0071] In the sample processing apparatus 100, the window 64 is replaceable. Therefore, in the sample processing apparatus 100, if the window 64 has chips attached to it, the window 64 can be replaced. In addition, for example, if the window 64 has chips attached to it, the window 64 can be cleaned.

[0072] The sample processing method using the sample processing apparatus 100 includes: a step of installing a sample holder 50 for holding the sample S onto a sample stage 40 disposed in the sample chamber 12; a step of observing the sample S using an observation beam and determining the processing area of ​​the sample S; a step of storing the sample S in a container 2 consisting of a shield 60 and the sample holder 50; and a step of guiding a processing beam into the container 2 from a window 64 provided in the container 2 and processing the sample S stored in the container 2 with the processing beam.

[0073] Therefore, in the sample processing method using the sample processing device 100, the sample S can be processed inside the container 2, thereby reducing the amount of chips flying into the sample chamber 12.

[0074] 5. Variations 5.1. First Variation Figure 12 This is a perspective view schematically showing a modified example of the sample holder 50 and the shield 60. Figure 13 This is a perspective view schematically showing a modified example of the shielding member 60.

[0075] like Figure 12 and Figure 13 As shown, the sample holder 50 may not have a protrusion, and the shielding member 60 may not have a recess. In this case, by storing the sample S in the container 2, the amount of chips flying into the sample chamber 12 can be reduced. In addition, compared with the case where the sample holder 50 has a protrusion 59 and the shielding member 60 has a recess 66, the configuration of the sample holder 50 and the shielding member 60 can be simplified.

[0076] 5.2. Second variation Figure 14 and Figure 15 This is a perspective view schematically showing a modified example of the shielding member 60. In the above... Figure 6 and Figure 7 In the example shown, window 64 is glass through which the laser light passes, but as... Figure 14 and Figure 15 As shown, window 64 can also be a through hole through container 2.

[0077] exist Figure 14 and Figure 15In the example shown, window 64 is a through hole in the fifth member 62c of the shielding member 60. When laser processing is performed on the sample S, the laser emitted from the laser device 30 passes through the through hole, which serves as window 64, and is irradiated onto the sample S housed in the container 2. The diameter of the through hole is, for example, larger than the diameter of the laser.

[0078] When the window 64 is a through hole, the processing beam can be a laser, ion beam, focused ion beam (FIB), plasma focused ion beam, electron beam, etc.

[0079] When the window 64 is a through hole, similar to when the window 64 is glass, by storing the sample S in the container 2, it is also possible to reduce the amount of chips flying into the sample chamber 12.

[0080] Figure 16 This is a perspective view schematically showing a modified example of the shielding member 60. For example... Figure 16 As shown, when window 64 is a through hole, and... Figure 12 and Figure 13 Similarly, the example shown could also have no recess 66 in the shielding member 60 and no protrusion in the sample holder 50. Figure 16 In the example shown, by storing the sample S in container 2, it is also possible to reduce the amount of chips flying into the sample chamber 12.

[0081] 5.3. Third Variation Figure 17 This is a perspective view schematically showing a modified example of the sample holder 50 and the shielding member 60. (See diagram below.) Figure 17 As shown, the specimen holder 50 may also not have a tilting mechanism 54 for tilting the specimen S. In this case, for example, the tilting mechanism of the specimen stage 40 can be used to tilt the specimen S.

[0082] Figure 18 This is a perspective view schematically showing a modified example of the sample holder 50 and the shielding member 60. (See diagram below.) Figure 18 As shown, the sample holder 50 may also lack the tilting mechanism 54 that tilts the sample S. Figure 18 In the example shown, the sample holder 50 has no protrusion, and the shield 60 has no recess.

[0083] 5.4. Fourth Variation Figure 19 This is a perspective view schematically showing a modified example of container 2. Figure 20 This is a schematic cross-sectional view showing the connection between the sample holder 50 and the shield 60. Furthermore, Figure 20 yes Figure 19 Cross-sectional view of line XX-XX.

[0084] like Figure 20 As shown, the protrusion 59 of the sample holder 50 and the recess 66 of the shield 60 may not be in contact. Since the protrusion 59 is inserted into the recess 66, even if the protrusion 59 and the recess 66 are not in contact, the path connecting the inside and outside of the container 2 can be bent. Therefore, the possibility of chips escaping from the connection between the sample holder 50 and the shield 60 to the outside of the container 2 can be reduced.

[0085] In the sample holder 50 and the shielding member 60, since the protrusion 59 and the recess 66 are not in contact, the sample holder 50 does not contact the shielding member 60 when the sample holder 50 is moved from the observation position to the processing position. This reduces positional deviation of the sample holder 50. For example, if the sample holder 50 contacts the shielding member 60, the impact generated by the contact may sometimes cause positional deviation of the sample holder 50. By preventing the sample holder 50 from contacting the shielding member 60, positional deviation of the sample can be reduced.

[0086] exist Figure 20 In the example shown, the width A of the recess 66 is greater than the width B of the protrusion 59. A gap is formed between the recess 66 and the protrusion 59. Therefore, when the sample holder 50 is moved to the machining position to insert the protrusion 59 into the recess 66, the position of the sample holder 50 can be allowed to deviate by the amount of the gap.

[0087] Furthermore, although not shown in the figure, an impact-absorbing member can be disposed within the recess 66 to absorb the impact when the protrusion 59 comes into contact with the recess 66. For example, as an impact-absorbing member, an elastic member that elastically deforms when the protrusion 59 collides can be disposed within the recess 66. This reduces the positional deviation of the sample holder 50. Rubber, springs, resin, etc., can be used as such an elastic member.

[0088] 5.5. Fifth Variation Figure 21 This is a diagram used to illustrate a modified example of container 2. Figure 21 The figure shows the case where the tilt angle θ of the sample stage 58 is 10° and the case where the tilt angle θ of the sample stage 58 is 40°. Figure 21 As shown, the height of container 2 can also be variable.

[0089] The shielding member 60 has a cover portion 602, which forms the upper part of the container 2. The cover portion 602 is disposed on the members constituting the three sides of the container 2. Figure 7 The inner sides of the third member 62a, the fourth member 62b, and the fifth member 62c shown.

[0090] The cover 602 is configured to be movable. The cover 602 is supported by the sample holder 50. In the illustrated example, the cover 602 is supported by the second member 56b constituting the container 2. Therefore, by tilting the sample stage 58 using the tilting mechanism 54, the cover 602 will move in the vertical direction. Furthermore, although not illustrated, the cover 602 may also be supported by the sample stage 58, or by other members tilted by the tilting mechanism 54.

[0091] exist Figure 21 In the example shown, the height of the cover 602 with an inclination angle θ = 40° is greater than the height of the cover 602 with an inclination angle θ = 10°. The larger the inclination angle θ of the sample stage 58, the greater the height of the cover 602. Thus, as the height of the cover 602 changes, the height of the container 2 also changes.

[0092] By varying the height of container 2 in accordance with the tilt angle θ, the sample S can be tilted during laser processing. Therefore, in Figure 21 In the example shown, the sample S can be tilted at various angles for laser processing.

[0093] If the height of the cover 602 is fixed at a height corresponding to the maximum tilt angle of the sample stage 58, the gap between the sample holder 50 and the cover 602 will increase when the tilt angle θ is decreased. In contrast, by changing the height of the container 2 in accordance with the tilt angle θ, the gap between the sample holder 50 and the cover 602 can be kept constant even if the tilt angle θ changes.

[0094] Furthermore, the shielding member 60 may also have a drive unit that moves the cover 602. For example, the drive unit may move the cover 602 using power from a motor or the like. The drive unit moves the cover 602 in conjunction with the tilting of the sample stage 58, for example. Thus, the height of the container 2 can be changed accordingly with the tilt angle θ.

[0095] 5.6. Sixth Variation Figure 22 This is a diagram used to illustrate a modified example of container 2. Figure 22 In the example shown, with Figure 21 Similarly, in the example shown, the lid 602 is movable, and the height of the container 2 is variable.

[0096] like Figure 22 As shown, the cover 602 has: an upper surface portion 604, which constitutes the upper part of the container 2; and a side portion 606, which connects with the members constituting the three sides of the container 2 (i.e., Figure 7The third member 62a, the fourth member 62b, and the fifth member 62c shown overlap. The side portion 606 is in contact with the outer surface of the fifth member 62c. Although not shown, the side portion 606 is in contact with the outer surfaces of the third member 62a and the fourth member 62b.

[0097] Cover 602 and Figure 21 The example shown is also supported by the sample holder 50. By using the tilting mechanism 54 to tilt the sample stage 58, the cover 602 will move in the vertical direction.

[0098] exist Figure 22 In the example shown, compared with the above Figure 21 Similarly, in the example shown, since the height of container 2 is variable, it can function as described above. Figure 21 The example shown has the same effect.

[0099] 5.7. Seventh Variation Figure 23 This is a diagram used to illustrate a modified example of container 2. Figure 23 In the example shown, the sample holder 50 has a movable wall 610 that moves in accordance with the tilt of the sample stage 58.

[0100] The movable wall 610, together with the first member 56a and the second member 56b, constitutes the container 2. The movable wall 610 seals the gap G between the second member 56b, which defines the side of the container 2, and the sixth member 62d, which defines the upper surface of the container 2.

[0101] The movable wall 610 is configured to be movable. The movable wall 610 is supported by the second member 56b. Therefore, by tilting the sample stage 58 using the tilting mechanism 54, the movable wall 610 will move in the vertical direction. In addition, although not shown, the movable wall 610 can also be supported by the sample stage 58, or by other members that are tilted by the tilting mechanism 54.

[0102] Since the position of the second member 56b changes accordingly with the tilt angle θ, the size of the gap G between the second member 56b and the sixth member 62d also changes accordingly with the tilt angle θ. Figure 23 In the example shown, the size of the gap G when the tilt angle θ = 10° is greater than the size of the gap G when the tilt angle θ = 40°.

[0103] Mobile wall 610 Figure 23 As shown, it moves accordingly with the tilt angle θ, sealing the gap G between the second member 56b and the sixth member 62d. Therefore, it is possible to tilt the sample S during laser processing.

[0104] Furthermore, the sample holder 50 may also have a drive unit for moving the movable wall 610. For example, the drive unit can move the movable wall 610 using power from a motor or the like. The drive unit may also move the movable wall 610 in conjunction with the tilting of the sample stage 58, for example.

[0105] 5.8. Eighth Variation Figure 24 This is a diagram used to illustrate a modified example of container 2. Figure 24 In the example shown, with Figure 21 Similarly, in the example shown, the lid 602 is movable, and the height of the container 2 is variable.

[0106] The cover 602 is connected to the shaft member 603. The shaft member 603 is fixed to the fifth member 62c. The shaft member 603 functions as the rotation axis of the cover 602. Therefore, the cover 602 can rotate about the shaft member 603.

[0107] One end of the cover 602 is connected to the shaft member 603, and the other end of the cover 602 is supported by the sample holder 50. Figure 24 In the example shown, the other end of the cover 602 is supported by the second member 56b of the sample holder 50. Therefore, by tilting the sample stage 58 using the tilting mechanism 54, the cover 602 will rotate about the shaft member 603 as the axis of rotation and move in the vertical direction.

[0108] exist Figure 24 In the example shown, compared with the above Figure 21 Similarly, in the example shown, since the height of container 2 is variable, it can function as described above. Figure 21 The example shown has the same effect. Furthermore, the shielding member 60 may also have a drive unit that moves the cover portion 602.

[0109] 5.9. 9th Variation Figure 25 This is a perspective view schematically showing a modified example of the sample holder 50 and the shielding member 60. Figure 25 The figure shows the state of the shielding member 60 in the first position P1, the state of the shielding member 60 moving between the first position P1 and the second position P2, and the state of the shielding member 60 in the second position P2.

[0110] The sample processing apparatus 100 has a moving mechanism 620 for moving the shielding member 60. The moving mechanism 620 has two tracks 622. Although not shown, the moving mechanism 620 has a drive unit that moves the shielding member 60 by power from a motor or the like.

[0111] Two tracks 622 support the shielding member 60 so that it can move. The shielding member 60 slides horizontally via the two tracks 622. The shielding member 60 moves between a first position P1 and a second position P2.

[0112] Position P1 is the position where the shielding member 60 does not overlap with the sample holder 50. When the shielding member 60 is in position P1, since the sample S is not contained in the container 2 but exposed, an electron beam can be irradiated onto the sample S for SEM observation, EBSD measurement, and EDS measurement.

[0113] Position P2 is the position where the shielding member 60 overlaps with the sample holder 50. With the shielding member 60 in position P2, the sample holder 50 and the shielding member 60 together form the container 2. That is, the sample S is housed in the container 2. Therefore, with the shielding member 60 in position P2, laser processing of the sample S is possible.

[0114] exist Figure 25 In the example shown, by moving the shielding member 60, the state in which the sample S is contained in the container 2 and the state in which the sample S is exposed can be switched. Therefore, for example, the observation position and the processing position can be made to be the same position. That is, even without using the sample stage 40 to move the sample holder 50, the observation and analysis of the sample S, as well as the laser processing of the sample S, can be performed in the same position.

[0115] 5.10. Example of the 10th variation Figure 26 This is a perspective view schematically showing a modified example of the sample holder 50 and the shielding member 60. Figure 26 The figure shows the state in which the shielding member 60 is open and the sample S is exposed, the state in which the shielding member 60 is being opened and closed, and the state in which the shielding member 60 is closed and the sample S is stored in the container 2.

[0116] The shielding member 60 includes a cover 630 and a hinge 632 that supports the cover 630 so that it can be opened and closed. Although not shown, the shielding member 60 further includes a drive unit that opens and closes the cover 630 by means of a motor or the like. The cover 630 is connected to the sample holder 50 via the hinge 632. The cover 630 defines the four sides of the container 2 and the upper surface of the container 2. A window is provided in the cover 630 through which a laser beam can pass.

[0117] The sample holder 50 has a bottom 500, which defines the bottom surface of the container 2. By closing the lid 630, the lid 630 and the bottom 500 constitute the container 2 for receiving the sample S.

[0118] exist Figure 26In the example shown, for instance, by opening and closing the cover 630, it is possible to switch between the state where the sample S is contained in the container 2 and the state where the sample S is exposed. Therefore, for example, it is possible to make the observation position and the processing position the same. That is, even without using the sample stage 40 to move the sample holder 50, it is possible to observe and analyze the sample S, as well as to perform laser processing on the sample S, in the same position.

[0119] 5.11. Example of Variation No. 11 The above Figure 5 The container 2 shown uses six faces to surround the square of the sample S, but the container 2 may not surround the square of the sample S. For example, the container 2 may also use five faces to surround the sample S, with one face being open. In addition, the container 2 may also be dome-shaped, that is, a hemispherical or hemispherical convex structure.

[0120] 5.12. Example of Variation No. 12 In the above embodiments, the case where the observation beam is an electron beam and the processing beam is a laser was described, but the observation beam is not limited to an electron beam. For example, a focused ion beam, a plasma focused ion beam, etc., can also be used as the observation beam. Furthermore, for example, a focused ion beam, a plasma focused ion beam, or a wide ion beam with a diameter of about a few millimeters can also be used as the processing beam. Additionally, for example, a focused ion beam can be used as both the observation beam and the processing beam. That is, the observation beam and the processing beam can be the same.

[0121] Furthermore, the above-described embodiments and modifications are examples and are not limited to them. For example, the various embodiments and modifications can be appropriately combined.

[0122] This invention is not limited to the embodiments described above and can be further modified in various ways. For example, this invention includes configurations that are substantially the same as those described in the embodiments. A substantially similar configuration refers to a configuration with the same function, method, and result, or a configuration with the same purpose and effect. Furthermore, this invention includes configurations in which non-essential parts of the configurations described in the embodiments are replaced. Additionally, this invention includes configurations that have the same effect or purpose as those described in the embodiments. Furthermore, this invention includes configurations in which known techniques are added to the configurations described in the embodiments.

Claims

1. A sample processing apparatus, which processes a sample by irradiating a sample disposed in a sample chamber with a processing beam, characterized in that... Include: A processing beam source that irradiates the sample with the processing beam; A sample holder for holding the sample; A sample stage on which the sample holder is mounted; and A shielding element, which is disposed in the sample chamber. The sample holder and the shielding member constitute a container for holding the sample. The container is provided with a window for guiding the processing beam into the container.

2. The sample processing apparatus according to claim 1, wherein, An observation beam source includes a beam used to irradiate the sample for observation. The sample stage allows the sample holder to move between an observation position where the observation beam irradiates the sample and a processing position where the processing beam irradiates the sample. By moving the sample holder to the processing position, the sample is housed in the container.

3. The sample processing apparatus according to claim 2, wherein, The shielding component is fixed at the processing position.

4. The sample processing apparatus according to claim 1, wherein, The sample holder is provided with a protrusion. The shielding member is provided with a recess for the protrusion to be inserted.

5. The sample processing apparatus according to claim 4, wherein, The sample holder has a sample stage for holding the sample. The protrusion surrounds the sample stage.

6. The sample processing apparatus according to claim 4, wherein, When the sample holder and the shielding member constitute the container, the protrusion and the recess do not contact each other.

7. The sample processing apparatus according to claim 1, wherein, The shielding member is provided with a protrusion. The sample holder is provided with a recess for inserting the protrusion.

8. The sample processing apparatus according to claim 1, wherein, The sample holder has a tilting mechanism that tilts the sample.

9. The sample processing apparatus according to claim 8, wherein, The height of the container is variable.

10. The sample processing apparatus according to claim 9, wherein, The shielding member has a cover portion that forms the upper part of the container. The cover is movable.

11. The sample processing apparatus according to any one of claims 1 to 10, wherein, The processing beam is a laser. The window allows the laser to pass through.

12. The sample processing apparatus according to claim 11, wherein, The window is replaceable.

13. The sample processing apparatus according to any one of claims 1 to 10, wherein, The window is a through hole that passes through the container.

14. A sample processing method, characterized in that, Include: The process of installing a sample holder to hold the sample in the sample stage of the sample chamber of the sample processing device. The process of using an observation beam to observe the sample and determine the processing area of ​​the sample; The process of placing the sample into a container consisting of a shield and a sample holder; and The process of guiding a processing beam from a window provided in the container into the container and processing the sample contained in the container with the processing beam.

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