Method for manufacturing semiconductor device

Abstract

The present invention prevents positional displacement and missed configuration of electrode terminals in insert molding of a case of a semiconductor device. A case (1) of a semiconductor device has a plurality of electrode terminal blocks (20) formed from a set of electrode terminals (10). In the forming step of the case (1), a connecting electrode terminal block (30) formed by connecting a plurality of electrode terminal blocks (20) through a connecting rod (11) is prepared. The housing (1) is insert-molded by disposing the connection electrode terminal block (30) in a mold and filling the mold with a resin. Then, the connection rod (11) is cut off from the connection electrode terminal block (30), and the connection electrode terminal block (30) is divided into respective electrode terminals (10).

Description

Technical Field

[0001] This disclosure relates to a method for manufacturing a semiconductor device. Background Technology

[0002] As a method for forming a housing used in semiconductor devices for power control, for example, embedding molding is known. In embedding molding, a housing with inserted electrode terminals is formed by arranging electrode terminals in a mold and filling the mold with resin. For example, Patent Document 1 below shows a housing formed by embedding molding having a plurality of blocks formed by a set of electrode terminals (hereinafter referred to as "electrode terminal blocks").

[0003] Existing technical documents

[0004] Patent documents

[0005] Patent Document 1: Japanese Patent Application Publication No. 2022-82033 Summary of the Invention

[0006] The technical problem that the invention aims to solve

[0007] Since the placement of electrode terminals within the mold is typically done manually, there is a concern about misalignment or omission of the electrode terminals. This concern is exacerbated, especially when forming a housing with multiple electrode terminal blocks, where numerous electrode terminals need to be spaced at narrow intervals.

[0008] This disclosure was made to solve the above-mentioned problems, and its purpose is to prevent the positional misalignment and misalignment of electrode terminals in the embedded molding of a housing having multiple electrode terminal blocks.

[0009] Technical means for solving technical problems

[0010] The semiconductor device manufacturing method disclosed herein includes a semiconductor device manufacturing method comprising a housing having a plurality of electrode terminal blocks formed by a set of electrode terminals, comprising: (a) a step of preparing a connecting electrode terminal block formed by connecting the plurality of electrode terminal blocks via connecting rods; (b) a step of embedding the housing by disposing the connecting electrode terminal blocks in a mold and filling the mold with resin; and (c) a step of dividing the connecting electrode terminal block into individual electrode terminals by cutting the connecting rods from the connecting electrode terminal block after step (b).

[0011] Invention Effects

[0012] According to this disclosure, in the embedding molding of a housing having multiple electrode terminal blocks, it is possible to prevent the positional misalignment and misalignment of the electrode terminals. Attached Figure Description

[0013] Figure 1 This is a diagram showing the structure of the housing of the semiconductor device according to Embodiment 1.

[0014] Figure 2 This is a diagram showing the structure of the ladder-shaped connecting electrode terminals according to Embodiment 1.

[0015] Figure 3 This is a diagram showing the structure of the connecting electrode terminal block according to Embodiment 1.

[0016] Figure 4 This is a diagram showing the shell after it has been embedded and shaped.

[0017] Figure 5 This is a diagram showing the shell after it has been embedded and shaped.

[0018] Figure 6 This is a diagram showing the structure of the ladder-shaped connecting electrode terminals according to Embodiment 2.

[0019] Figure 7 This is a diagram showing the structure of the connecting electrode terminal block according to Embodiment 2. Detailed Implementation

[0020] <Implementation Method 1>

[0021] Figure 1 This is a diagram showing the structure of the housing 1 included in the semiconductor device according to Embodiment 1. (As shown...) Figure 1 As shown, the housing 1 includes a plurality of electrode terminal blocks 20 formed by a set of electrode terminals 10. In this embodiment, an example is shown in which three electrode terminal blocks 20 formed by four electrode terminals 10 are arranged within the housing 1. However, the arrangement and number of electrode terminals 10 and electrode terminal blocks 20 are not limited to this example.

[0022] The manufacturing method of the semiconductor device according to Embodiment 1, particularly the method of forming the housing 1, will be described. First, as Figure 2 As shown, a ladder-shaped connecting electrode terminal 40 is prepared, which is formed by connecting multiple electrode terminals 10 in a ladder-like manner between two connecting rods 11. That is, in the ladder-shaped connecting electrode terminal 40, each of the two ends of the multiple electrode terminals 10 is connected by a connecting rod 11. Figure 2 In the ladder-shaped connecting electrode terminal 40, the electrode terminals 10 of the two housings 1 (i.e., six electrode terminal blocks 20) are connected by two connecting rods 11.

[0023] Next, as Figure 3As shown, two connecting electrode terminals 30 are formed by cutting the ladder-shaped connecting electrode terminal 40 into two. Each connecting electrode terminal block 30 is formed by connecting electrode terminal blocks 20 corresponding to a housing 1 via a connecting rod 11. Here, one of the two connecting electrode terminal blocks 30 cut from the ladder-shaped connecting electrode terminal 40 is defined as "connecting electrode terminal block 30a", and the other is defined as "connecting electrode terminal block 30b". Figure 3 As shown, electrode terminal blocks 20 belonging to connecting electrode terminal block 30a and connecting electrode terminal block 30b are complementaryly arranged in the ladder-shaped connecting electrode terminal 40. This arrangement allows for the generation of two connecting electrode terminal blocks 30 from a single ladder-shaped connecting electrode terminal 40. Furthermore, it has the advantage of utilizing the electrode terminals 10 included in the ladder-shaped connecting electrode terminal 40 without waste.

[0024] Next, while maintaining the connecting rod 11, the connecting electrode terminal block 30 is positioned within the mold. Then, the housing 1 is embedded and formed by filling the mold with resin. Figure 4 and Figure 5 The image shows the shell 1 after it has been embedded and shaped. Figure 4 It is a housing 1 into which the connecting electrode terminal block 30a is inserted. Figure 5 It is a housing 1 into which the connecting electrode terminal block 30b is inserted.

[0025] Subsequently, the connecting rod 11 is cut from the connecting electrode terminal block 30 inserted into the housing 1. This divides the connecting electrode terminal block 30 into individual electrode terminals 10. Figure 1 The housing 1 shown is now complete.

[0026] Although the illustration is omitted, a semiconductor device is manufactured by housing the semiconductor element, the substrate on which the semiconductor element is mounted, wiring, etc. inside the completed housing 1.

[0027] As described above, in the semiconductor device manufacturing method of Embodiment 1, the step of placing the electrode terminals 10 in the mold for embedding the housing 1 is performed by placing the connecting electrode terminal block 30, which is held in a state with the connecting rod 11, in the mold. Since a number of electrode terminal blocks 20 corresponding to one housing 1 are connected to one connecting electrode terminal block 30 via the connecting rod 11, positional misalignment and omission of the electrode terminals 10 are prevented. Furthermore, the effect of simplifying the quantity management of the electrode terminals 10 is also expected.

[0028] In this embodiment, the ladder-shaped connecting electrode terminal 40 includes electrode terminals 10 corresponding to the number of two connecting electrode terminal blocks 30, and two connecting electrode terminal blocks 30 are obtained from one ladder-shaped connecting electrode terminal 40. However, the number of electrode terminals 10 included in the ladder-shaped connecting electrode terminal 40 may be increased, and more than three connecting electrode terminal blocks 30 may be obtained from one ladder-shaped connecting electrode terminal 40.

[0029] Furthermore, the ladder-shaped connecting electrode terminal 40 has the same structure in which multiple electrode terminals 10 are connected at certain intervals. Therefore, by changing the cut position of the connecting rod 11, the same ladder-shaped connecting electrode terminal 40 can be used to obtain a different number of electrode terminals 10 and configure different connecting electrode terminal blocks 30.

[0030] <Implementation Method 2>

[0031] Figure 6 This is a diagram showing the structure of the ladder-shaped connecting electrode terminal 40 in Embodiment 2. Figure 7 It shows from Figure 6 A diagram showing two connecting electrode terminal blocks 30 (connecting electrode terminal blocks 30a and 30b) cut out from the ladder-shaped connecting electrode terminal 40.

[0032] like Figure 6 and Figure 7 As shown, in Embodiment 2, a mark 12 is provided on the connecting rod 11 of the ladder-shaped connecting electrode terminal 40 to distinguish each electrode terminal block 20. Figure 6 and Figure 7 The mark 12 shown is a raised shape, but the mark 12 can be any shape.

[0033] By setting a mark 12 on the connecting rod 11 of the ladder-shaped connecting electrode terminal 40, the position where the connecting rod 11 should be cut when cutting out the connecting electrode terminal block 30 from the ladder-shaped connecting electrode terminal 40 can be clearly identified, thereby preventing incorrect cutting position. This further improves the effectiveness in preventing positional misalignment and omission of the electrode terminal 10.

[0034] Furthermore, the various implementation methods can be freely combined, and each implementation method can be appropriately modified or omitted.

[0035] <Postscript>

[0036] The various methods disclosed herein are summarized and recorded below as appendices.

[0037] (Note 1)

[0038] A method for manufacturing a semiconductor device, the semiconductor device including a housing having a plurality of electrode terminal blocks formed by a set of electrode terminals, comprising:

[0039] (a) A process of preparing a connecting electrode terminal block formed by connecting multiple said electrode terminal blocks via a connecting rod;

[0040] (b) The process of embedding and molding the housing by placing the connecting electrode terminal block within a mold and filling the mold with resin; and

[0041] (c) A process following step (b) of dividing the connecting electrode terminal block into individual electrode terminals by cutting the connecting rod from the connecting electrode terminal block.

[0042] (Note 2)

[0043] In the method for manufacturing a semiconductor device as described in Appendix 1, step (a) includes:

[0044] The process of preparing a ladder-shaped connecting electrode terminal by connecting electrode terminals corresponding to at least two of the connecting electrode terminal blocks in a ladder-like manner between two connecting rods; and

[0045] The process of cutting the ladder-shaped connecting electrode terminal into at least two connecting electrode terminal blocks.

[0046] (Note 3)

[0047] In the method of manufacturing a semiconductor device as described in Appendix 2, of the at least two connecting electrode terminal blocks cut from the ladder-shaped connecting electrode terminal, the electrode terminal block belonging to one of them and the electrode terminal block belonging to the other are complementaryly arranged in the ladder-shaped connecting electrode terminal.

[0048] (Note 4)

[0049] In the method of manufacturing a semiconductor device as described in Appendix 2 or Appendix 3, a mark is provided on the connecting rod of the ladder-shaped connecting electrode terminals to distinguish each of the electrode terminal blocks.

[0050] Label Explanation

[0051] 1. Housing; 10. Electrode terminals; 11. Connecting rod; 12. Marking; 20. Electrode terminal block; 30, 30a, 30b. Connecting electrode terminal blocks; 40. Ladder-shaped connecting electrode terminals.

Claims

1. A method for manufacturing a semiconductor device, the semiconductor device comprising a housing having a plurality of electrode terminal blocks formed by a set of electrode terminals, the method for manufacturing the semiconductor device being characterized in that it comprises: (a) A process of preparing a connecting electrode terminal block formed by connecting multiple said electrode terminal blocks via a connecting rod; (b) The process of embedding and molding the housing by placing the connecting electrode terminal block within a mold and filling the mold with resin; and (c) A process following step (b) of dividing the connecting electrode terminal block into individual electrode terminals by cutting the connecting rod from the connecting electrode terminal block.

2. The method for manufacturing a semiconductor device as claimed in claim 1, characterized in that, The process (a) includes: The process of preparing a ladder-shaped connecting electrode terminal by connecting electrode terminals corresponding to at least two of the connecting electrode terminal blocks in a ladder-like manner between two connecting rods; and The process of cutting the ladder-shaped connecting electrode terminal into at least two connecting electrode terminal blocks.

3. The method for manufacturing a semiconductor device as described in claim 2, characterized in that, Of the at least two connecting electrode terminal blocks cut from the ladder-shaped connecting electrode terminal, the electrode terminal block belonging to one of them and the electrode terminal block belonging to the other are complementaryly arranged in the ladder-shaped connecting electrode terminal.

4. The method for manufacturing a semiconductor device as described in claim 2 or 3, characterized in that, The connecting rod of the ladder-shaped connecting electrode terminals is provided with a mark that can distinguish each of the electrode terminal blocks.

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