Splicing low-light-storage integrated power supply module

Abstract

The invention discloses a splicable low-light-storage integrated power supply module, and belongs to the technical field of new energy and microelectronics. The module adopts a three-dimensional heterogeneous integrated stacking framework, and an optical window layer, a photoelectric conversion layer, a signal processing and power management layer and an energy storage layer are vertically integrated in a single packaging body. High-density vertical interconnection among the functional layers is realized through a system-level packaging technology, and a standardized interface is arranged on the side wall of the module, so that mechanical splicing and electrical interconnection among a plurality of modules are supported. Extreme miniaturization, high reliability and intelligent expandability of the optical storage power supply system are achieved, the problems that an existing discrete power supply scheme is low in space utilization rate, damaged in system efficiency, poor in reliability and the like are solved, and the optical storage power supply system is particularly suitable for application scenes such as Internet of Things equipment, portable electronic equipment and distributed sensing networks.

Description

Technical Field

[0001] This invention relates to the fields of new energy and microelectronics technology, specifically to a miniaturized and integrated photovoltaic power storage device, and more particularly to a modular micro-photovoltaic power storage integrated power module using three-dimensional heterogeneous integrated packaging technology. Background Technology

[0002] With the rapid development of the Internet of Things, portable electronic devices, wearable devices, and distributed sensor networks, extremely high demands are placed on the continuity, autonomy, lightweight design, and space utilization of device power supply. Currently, conventional solutions for powering such devices typically employ discrete components: photovoltaic panels, rechargeable batteries (such as lithium batteries), and power management circuit boards are spatially arranged and electrically connected within the device via wires, connectors, and other means.

[0003] For example, CN20181011610492.0 discloses a method for fabricating a micro power system, mainly employing PCB-level interconnection and electrical connection methods such as flying wires. It can realize functions such as photovoltaic power generation, lithium battery energy storage, and power management control output.

[0004] This discrete approach has many inherent drawbacks: 1. Low space utilization: The three-dimensional space is not effectively utilized, resulting in bulky equipment; 2. Reduced system efficiency: Cable connections between components introduce additional parasitic resistance and power loss; 3. Reliability challenges: With numerous solder joints and connectors, failures are prone to occur under stresses such as vibration and temperature changes; 4. Complex design and production: Terminal equipment manufacturers need to procure, test and integrate multiple heterogeneous energy components separately, resulting in long design cycles and complex supply chain management; 5. Lack of intelligence and scalability: Individual power supply units typically operate independently and are difficult to intelligently collaborate with other similar units to expand power or capacity.

[0005] Therefore, there is an urgent need in this field for a standardized, integrated micro-energy supply solution that can fundamentally solve the above problems. Summary of the Invention

[0006] The technical problem to be solved by the present invention is to overcome the above-mentioned defects in the prior art and provide a highly integrated, plug-and-play, intelligent networking-supporting splicable micro-photovoltaic energy storage integrated power module.

[0007] To achieve the above objectives, the present invention adopts the following technical solution: a modular micro-optical energy storage integrated power module, which uses a three-dimensional heterogeneous integrated stacking architecture and system-level packaging technology to vertically integrate multiple heterogeneous functional units such as optical acquisition, photoelectric conversion, energy storage, power management and signal processing into a standardized single package.

[0008] Furthermore, the stacked architecture, from the light incident surface to the backlight surface, includes, in sequence: an optical window layer, a photoelectric conversion layer, a signal processing and power management layer, and an energy storage layer.

[0009] Furthermore, the optical window layer comprises chemically strengthened glass, sapphire, or optical-grade polymer material with high light transmittance, and its surface is functionalized, including one or more combinations of anti-reflective film, micro / nano light-trapping structure, or self-cleaning coating.

[0010] Furthermore, the photoelectric conversion layer includes a III-V group multi-junction solar cell chip, which is directly bonded to the lower surface of the optical window layer through a transparent dielectric material with high refractive index and high thermal conductivity.

[0011] Furthermore, the signal processing and power management layer includes an ultra-thin flexible or rigid integrated circuit board or silicon interposer, on which a customized power management ASIC, a microcontroller unit, and miniaturized passive devices are integrated.

[0012] Furthermore, the energy storage layer includes a sheet-like, thin all-solid-state lithium battery or lithium polymer battery, which is fixed to the back of the signal processing and power management layer by thermally conductive adhesive.

[0013] Furthermore, the functional units are electrically connected through a high-density vertical interconnect structure, which employs a through-silicon via combined with a microbump structure, a wire bonding structure, or an anisotropic conductive adhesive / film structure.

[0014] Furthermore, the module is externally provided with an integrated package and a standardized external interface. The integrated package is formed by transfer molding or potting process using a high thermal conductivity, low stress molding compound. The standardized external interface is located on the side wall of the package and includes a tenon-and-mortise composite structure and / or magnetic alignment structure for mechanical splicing, as well as a spring pin array or metallized pads for electrical interconnection.

[0015] Furthermore, when multiple modules are physically connected through standardized interfaces, their communication buses automatically connect in parallel to form a distributed network. After the modules are powered on, a master coordinating module is dynamically elected through a preset negotiation algorithm to achieve distributed intelligent power supply.

[0016] Preferably, the overall dimensions of the module are 15mm×15mm×2.0mm to 25mm×25mm×3.0mm, the maximum output power is 250mW to 1W, and the rated energy storage capacity is 185mWh to 740mWh.

[0017] Compared with the prior art, the beneficial effects of the present invention include: 1. Extreme miniaturization and high integration: Through three-dimensional heterogeneous stacking and wafer-level packaging, the complete photovoltaic energy storage system is condensed into a chip-level size, which greatly saves internal space of the device; 2. Performance optimization: Direct bonding and short-pitch vertical interconnection between functional layers significantly reduce losses in optical, electrical, and thermal transmission paths, and improve overall energy conversion efficiency; 3. High reliability and long lifespan: The integrated packaging eliminates most external connection points, effectively resisting environmental stresses such as vibration, humidity, and temperature differences; the self-cleaning optical window ensures long-term stable power generation capability; 4. Plug and play and modularity: Standardized interfaces and packaging allow terminal manufacturers to use it directly without having in-depth energy knowledge, which greatly reduces the application threshold and development cycle; 5. Intelligence and Scalability: The embedded distributed control algorithm enables power and capacity to be "stacked" on demand, and the system has the ability to self-manage and self-repair, making it extremely robust. Attached Figure Description

[0018] Figure 1 This is a structural schematic diagram of the modular micro-light energy storage integrated power module of the present invention.

[0019] Figure 2 This is a schematic diagram of the splicable interface structure of the splicable micro-light energy storage integrated power module of the present invention.

[0020] Figure 3 This is a block diagram of the power management logic inside the module of this invention.

[0021] In the figure, 1 is the optical window layer; 2 is the photoelectric conversion layer; 3 is the signal processing and power management layer; 4 is the energy storage layer; 5 is the modular outer shell; and 501 is the magnetic electrode. Detailed Implementation

[0022] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0023] In the description of this invention, it should be noted that the terms "upper", "middle", "lower", "inner", "outer", "both sides", etc., indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are only for the purpose of simplifying the description of this invention and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on this invention.

[0024] like Figure 1 As shown, the core of the modular micro-optical energy storage integrated power module of the present invention lies in the use of a three-dimensional heterogeneous integrated stacking architecture and system-level packaging technology to vertically integrate multiple heterogeneous functional units such as optical acquisition, photoelectric conversion, energy storage, power management and signal processing into a standardized single package (modular shell 5).

[0025] Furthermore, the stacked architecture comprises, from the light incident surface to the backlight surface, the following in sequence: The optical window layer 1 not only serves as physical protection, but also maximizes light energy capture efficiency through functional treatments (such as anti-reflection, light trapping, and self-cleaning). The photoelectric conversion layer 2 is a III-V compound multi-junction solar cell chip, which is directly bonded to the optical window layer through a transparent dielectric material with high refractive index and high thermal conductivity (such as silicone, epoxy resin or their composite materials) to achieve the shortest optical path and optimized thermal management. The signal processing and power management layer 3 is carried by an ultra-thin printed circuit board or a silicon interposer, on which a customized application-specific integrated circuit is integrated to realize maximum power point tracking, battery charging management, voltage conversion and system protection, as well as a microcontroller unit for running control algorithms. The energy storage layer 4 uses a thin, sheet-like all-solid-state battery or a lithium polymer battery, which is attached to the back of the signal processing and power management layer through a thermal interface material.

[0026] As one of the key innovations of this invention, the functional layers are electrically connected through a high-density vertical interconnect structure. The vertical interconnect structure can be selected from: through-silicon vias combined with microbump structures, wire bonding structures, or anisotropic conductive adhesive / film structures. Preferably, through-silicon vias combined with microbump structures are used to achieve minimal interconnect parasitic parameters, the highest integration density, and optimal electrothermal performance.

[0027] As another key innovation of this invention, the module is externally equipped with an integrated package and standardized external interfaces. The integrated package is formed using a high thermal conductivity, low stress molding compound through transfer molding or potting processes, providing robust protection and efficient heat dissipation for the internal precision structure. The standardized external interfaces are located on the sidewalls of the package and include a tenon-and-mortise composite structure and / or a magnetic alignment structure (e.g., magnetic electrode 501) for mechanical splicing, and a spring pin array or metallized pads for electrical interconnection. The electrical interfaces define at least a power bus, a communication bus, and a system management line.

[0028] Furthermore, the module of this invention incorporates intelligent collaboration logic. When multiple modules are physically connected through the standardized interface, their communication buses automatically connect in parallel to form a distributed network. After the modules are powered on, a master coordinating module is dynamically elected through a preset negotiation algorithm. The master coordinating module is responsible for collecting system status and issuing global optimal operating point suggestions. Each slave module then makes autonomous decisions and responds collaboratively based on its own status to jointly supply power to the load, thereby realizing a distributed intelligent power supply system with no single point of failure and elastic scalability.

[0029] The present invention will now be described in further detail with reference to specific embodiments.

[0030] Example 1: Ultra-thin standard module (MIPS-S1) This embodiment provides an ultra-thin standard module suitable for devices such as micro IoT sensors and electronic tags.

[0031] Structure and Materials: Overall dimensions: a flat cuboid with length × width × height of 15mm × 15mm × 2.0mm.

[0032] Optical window layer 1: Made of chemically strengthened glass with a thickness of 0.3 mm, its inner surface facing the photoelectric conversion layer is coated with a broadband antireflection film by magnetron sputtering, which increases the light transmittance to over 99.5%.

[0033] Photoelectric conversion layer 2: The core is a 5mm×5mm triple-junction gallium arsenide flip chip. This chip is directly bonded to the lower surface of the optical window layer using transparent silicone with a refractive index of 1.51 and a thermal conductivity of 0.8W / m·K.

[0034] Signal Processing and Power Management Layer 3: The carrier is a 0.2mm thick flexible polyimide circuit board. A custom power management ASIC (designed using a 40nm CMOS process, see...) is integrated on it. Figure 3 It contains a microcontroller with an ARM Cortex-M0 core. All passive components are packaged in a 008004 package.

[0035] Energy storage layer 4: It is a solid-state lithium battery with a thickness of 1.0mm and a capacity of 50mAh. Its positive and negative electrodes are connected to the corresponding pads on the flexible circuit board through an anisotropic conductive film.

[0036] Interlayer interconnection and packaging: The photoelectric conversion layer is interconnected with the circuit board through copper pillar bumps with a diameter of 80μm. After stacking, the entire assembly is vacuum encapsulated using black epoxy molding compound with a thermal conductivity of 1.5W / m·K through a transfer molding process, and the sidewalls are ground to expose the pre-embedded electrical contact points.

[0037] Performance metrics:

[0038] Example 2: High-power modules that can be spliced ​​together (MIPS-P1) This embodiment provides a module specifically designed for scenarios where power and capacity can be expanded through splicing, such as outdoor monitoring equipment and portable drone base stations.

[0039] Structure and Materials: Overall dimensions: 25mm × 25mm × 3.0mm. Neodymium iron boron permanent magnets are precisely embedded on one pair of opposite sidewalls of the package to form a magnetic alignment mechanism; the other pair of sidewalls is provided with an interface array containing 8 gold-plated spring pins.

[0040] Internal structure: The basic structure is similar to that of Example 1, but the specifications of key components are improved: the photoelectric conversion layer uses a larger area (10mm×10mm) of a III-V group multi-junction solar cell chip; the energy storage layer uses a thin lithium polymer battery with a capacity of 200mAh; the ASIC of the signal processing and power management layer enhances the multi-module communication and synchronization algorithm.

[0041] Interconnection scheme: In this embodiment, silicon interposer and TSV technology are preferred to achieve interlayer vertical interconnection to obtain better high-frequency characteristics and heat dissipation capabilities.

[0042] System operating modes: When four MIPS-P1 modules are connected in a 2×2 array via magnetic interfaces, their communication bus (using the I2C protocol) automatically forms a network. Upon power-up, the module with the highest hardware address is elected as the master coordinating module. It periodically queries the battery state of charge and instantaneous power output of each slave module. The master module calculates the optimal output voltage and current based on global information and broadcasts this calculation via the communication bus. Upon receiving the command, each slave module independently adjusts the operating point of its internal DC-DC converter to share power to the load. If a module fails due to obstruction, the system automatically isolates it, and the remaining modules seamlessly take over the load, ensuring continuous system operation.

[0043] Performance metrics:

[0044] Technical advantages of the present invention: 1. Innovative stacked architecture: Through three-dimensional heterogeneous integration technology, the optimal spatial layout of the four functional units of light, electricity, storage and pipe is achieved, breaking through the spatial limitations of traditional planar layout.

[0045] 2. Advanced interconnect technology: Employing wafer-level interconnect technology significantly reduces interconnect parasitic parameters and improves system efficiency and reliability.

[0046] 3. Intelligent distributed control: The embedded distributed algorithm enables autonomous negotiation and collaborative work among multiple modules, and the system has self-optimization and fault tolerance capabilities.

[0047] 4. Standardization and modularization: Unified interface specifications and packaging forms enable products to have high versatility and scalability, reducing the application threshold.

[0048] The above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Any modifications, equivalent substitutions, and improvements made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A modular micro-light energy storage integrated power module, characterized in that, The three-dimensional heterogeneous integration stacking architecture and system-level packaging technology are used to vertically integrate multiple heterogeneous functional units, including optical acquisition, photoelectric conversion, energy storage, power management and signal processing, into a standardized single package.

2. The modular micro-light energy storage integrated power module according to claim 1, characterized in that, The stacked architecture, from the light incident surface to the backlight surface, includes, in sequence: an optical window layer, a photoelectric conversion layer, a signal processing and power management layer, and an energy storage layer.

3. The modular micro-light energy storage integrated power module according to claim 2, characterized in that, The optical window layer comprises high-transmittance chemically strengthened glass, sapphire, or optical-grade polymer material, and its surface is functionalized, including one or more combinations of anti-reflective film, micro / nano light-trapping structure, or self-cleaning coating.

4. The modular micro-light energy storage integrated power module according to claim 2, characterized in that, The photoelectric conversion layer includes a group III-V multi-junction solar cell chip, which is directly bonded to the lower surface of the optical window layer through a transparent dielectric material with high refractive index and high thermal conductivity.

5. The modular micro-light energy storage integrated power module according to claim 2, characterized in that, The signal processing and power management layer includes an ultra-thin flexible or rigid integrated circuit board or silicon interposer, on which a customized power management ASIC, microcontroller unit and miniaturized passive devices are integrated.

6. The modular micro-light energy storage integrated power module according to claim 2, characterized in that, The energy storage layer comprises a sheet-like, thin all-solid-state lithium battery or lithium polymer battery, which is fixed to the back of the signal processing and power management layer by thermally conductive adhesive.

7. The modular micro-light energy storage integrated power module according to claim 1, characterized in that, The functional units are electrically connected through a high-density vertical interconnect structure, which adopts a through-silicon via combined with a microbump structure, a wire bonding structure, or an anisotropic conductive adhesive / film structure.

8. The modular micro-light energy storage integrated power module according to claim 1, characterized in that, The module is externally equipped with an integrated package and standardized external interfaces. The integrated package is formed by transfer molding or potting process using a high thermal conductivity and low stress molding compound. The standardized external interfaces are located on the sidewall of the package and include a tenon-and-mortise composite structure and / or magnetic alignment structure for mechanical splicing, as well as a spring pin array or metallized pads for electrical interconnection.

9. The modular micro-light energy storage integrated power module according to claim 8, characterized in that, When multiple modules are physically connected through a standardized interface, their communication buses automatically connect in parallel to form a distributed network. After the modules are powered on, a master coordinating module is dynamically elected through a preset negotiation algorithm to achieve distributed intelligent power supply.

10. The modular micro-light energy storage integrated power module according to claim 1, characterized in that, The module has an overall size of 15mm×15mm×2.0mm to 25mm×25mm×3.0mm, a maximum output power of 250mW to 1W, and a rated energy storage capacity of 185mWh to 740mWh.

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