Building equipment with embedded connectivity

Abstract

A water chilling unit comprises a shell; the water chilling unit main control board is positioned in the shell; a communication board positioned in the housing; the first communication channel is arranged between the water chilling unit main control board and the communication board; and a second communication channel between the chiller main control board and the communication board, where the second communication channel provides a higher bandwidth communication than the first communication channel.

Description

Cross-reference to related applications

[0001] This application claims the benefit and priority of U.S. Patent Application No. 18 / 373,041, filed September 26, 2023; U.S. Provisional Application No. 63 / 540,530, filed September 26, 2023; and U.S. Provisional Application No. 63 / 540,527, filed September 26, 2023, the entire disclosures of which are incorporated herein by reference. Background Technology

[0002] This disclosure generally pertains to the field of building equipment used in buildings, specifically chillers and other units of building equipment. Conventionally, chillers and other equipment include control circuitry systems that control the internal operation of the chiller or other equipment but are not designed for direct communication with external networks. Therefore, if connectivity between the chiller and a building management system or smart building platform (e.g., a cloud-based management platform) is desired, field technicians need to install additional controllers, gateways, etc., at the building site. However, such additional installation and configuration is time-consuming and error-prone, and provides only limited data transfer between the chiller's (or other equipment's) onboard control hardware and external computing systems. Summary of the Invention

[0003] Some aspects of this disclosure relate to a chiller unit comprising: a housing; a chiller unit main control board positioned within the housing; a communication board positioned within the housing; a first communication channel between the chiller unit main control board and the communication board; and a second communication channel between the chiller unit main control board and the communication board. The second communication channel provides higher bandwidth communication compared to the first communication channel.

[0004] The chiller unit may include a compressor, wherein a main control board of the chiller unit is configured to provide control signals to the compressor. A communication board may be configured to provide communication between the chiller unit and a network external to the chiller unit, wherein the communication board includes network circuitry adapted to connect to the network external to the chiller unit via Ethernet, Wi-Fi, and cellular connections.

[0005] The first communication channel can use a building network protocol, and the second communication channel can use Ethernet. The communication board is further configured to provide wireless communication between the second communication board and a network external to the chiller unit. This communication board can provide stronger processing capabilities compared to the chiller unit's main control board.

[0006] In some embodiments, the communication board is programmed to execute an algorithm to determine control settings to be used by the main control board, and the chiller main control board does not have sufficient computing resources to execute the algorithm. The communication board is configured to receive over-the-air updates from an external source and to install those updates on the chiller main control board via the second communication channel. The communication board may be configured to provide cellular communications, and these cellular communications may be configured prior to delivery of the chiller to the building site.

[0007] The chiller unit may further include: an antenna positioned outside the housing; an antenna mount fastened to a plurality of mounting points on the communication board such that the antenna mount is disposed on a portion of the communication board; and a cable extending from the antenna mount to the antenna via a hole in the housing. The antenna mount is positioned in a central region of the circuit board, the central region being spaced apart from the edge of the circuit board. The main control board is spaced apart from the communication board.

[0008] This disclosure also relates to a method. The method includes: providing a communication board to a chiller unit prior to delivery to a building, enabling the communication board to electronically communicate with the chiller unit's main control board; configuring remote connectivity of the communication board prior to delivery of the chiller unit to the building; and automatically using the remote connectivity of the communication board to establish a connection between the chiller unit and a remote server in response to installation of the chiller unit at the building.

[0009] The method may include configuring the remote connectivity of the communication board by configuring a secure overlay network that utilizes secure programming natively running on the communication board. The communication board may include a general-purpose data bus and may be programmed to provide containerized applications configured to exchange data with the general-purpose data bus.

[0010] The method may include: attaching the antenna mount to multiple mounting points on the communication board before delivering the chiller unit to the building; and connecting the antenna mount to an antenna included within the chiller unit using a cable. Automatically establishing the connection using the remote connectivity of the communication board may include: connecting the board to a wireless communication network at the building site via the antenna. The method may include: establishing communication between the communication board and multiple sensors and devices at the building site using multiple communication protocols and wired and wireless communication modes.

[0011] Those skilled in the art will recognize that the invention is illustrative only and not intended to be limiting in any way. Other aspects of the apparatus and / or process described herein, as defined only by the claims, inventive features, and advantages will become clear from the detailed description set forth herein and taken in conjunction with the accompanying drawings. Attached Figure Description

[0012] The various objects, aspects, features, and advantages of this disclosure will become clearer and better understood through detailed description with reference to the accompanying drawings, in which the same reference numerals identify corresponding elements. In the drawings, the same reference numerals generally indicate identical, functionally similar, and / or structurally similar elements.

[0013] Figure 1 This is an illustration of a building equipped with an HVAC system according to some embodiments.

[0014] Figure 2 According to some embodiments, it can be used to serve Figure 1 A block diagram of a water-side system for heating or cooling loads in a building.

[0015] Figure 3 According to some embodiments, it can be used to serve Figure 1 A block diagram of the air-side system for heating or cooling loads of a building.

[0016] Figure 4 According to some embodiments, it can be used for monitoring and control Figure 1 A block diagram of the building management system (BMS) of the building.

[0017] Figure 5 According to some embodiments, it can be used for monitoring and control Figure 1 A block diagram of another BMS for the building.

[0018] Figure 6 Based on some embodiments and Figure 1 A diagram of the chiller unit components associated with the HVAC system.

[0019] Figure 7 This is a block diagram of a chiller unit according to some embodiments.

[0020] Figure 8 Based on some embodiments and Figure 7 A block diagram of the systems related to the chiller unit.

[0021] Figure 9 According to some embodiments Figure 7 Block diagram of the communication board of the chiller unit.

[0022] Figure 10This is a flowchart of a process for providing a chiller unit according to some embodiments.

[0023] Figure 11 This is a diagram of a control panel for a chiller unit according to some embodiments.

[0024] Figure 12 This is a block diagram of the architecture of a communication board for a chiller unit according to some embodiments. Detailed Implementation

[0025] Overview Referring generally to the accompanying drawings, systems and methods for embedded connectivity for chiller units (or other building equipment) according to various embodiments are illustrated.

[0026] Building HVAC systems and building management systems Now for reference Figures 1 to 5 This document illustrates several building management systems (BMS) and HVAC systems in which the present disclosure can be implemented, according to some embodiments. In summary, Figure 1 A building 10 equipped with an HVAC system 100 is shown. Figure 2 This is a block diagram that can be used to serve the waterside system 200 of building 10. Figure 3 This is a block diagram of an air-side system 3000 that can be used to serve building 10. Figure 4 This is a block diagram of a BMS that can be used to monitor and control building 10. Figure 5 This is a block diagram of another BMS that can be used to monitor and control building 10.

[0027] Buildings and HVAC systems For details, please refer to the following: Figure 1 The diagram shows a perspective view of building 10. Building 10 is served by a Building Management System (BMS). A BMS is typically a system configured to control, monitor, and manage equipment within or around a building or building area. A BMS may include, for example, HVAC systems, security systems, lighting systems, fire alarm systems, any other systems capable of managing building functions or installations, or any combination thereof.

[0028] The BMS serving building 10 includes HVAC system 100. HVAC system 100 may include multiple HVAC units (e.g., heaters, chillers, air handling units, pumps, fans, thermal storage devices, etc.) configured to provide heating, cooling, ventilation, or other services to building 10. For example, HVAC system 100 is shown as including a water-side system 120 and an air-side system 130. Water-side system 120 may supply heating or cooling fluid to the air handling units of air-side system 130. Air-side system 130 may use heating or cooling fluid to heat or cool the airflow supplied to building 10. Reference Figure 2 and Figure 3 Exemplary water-side and air-side systems that can be used in HVAC system 100 are described in more detail.

[0029] HVAC system 100 is shown as including chiller 102, boiler 104, and roof air handling unit (AHU) 106. Water-side system 120 can use boiler 104 and chiller 102 to heat or cool working fluids (e.g., water, glycol, etc.) and can circulate the working fluids to AHU 106. In different embodiments, the HVAC unit of water-side system 120 may be located within or around building 10 (e.g., Figure 1 (As shown) or at off-site locations such as central facilities (e.g., chiller facilities, steam facilities, heating facilities, etc.). The working fluid can be heated in boiler 104 or cooled in chiller 102, depending on whether heating or cooling is required in building 10. Boiler 104 can add heat to the circulating fluid, for example by burning a flammable material (e.g., natural gas) or using an electric heating element. Chiller 102 can allow the circulating fluid to exchange heat with another fluid (e.g., refrigerant) in a heat exchanger (e.g., evaporator) to absorb heat from the circulating fluid. The working fluid from chiller 102 and / or boiler 104 can be delivered to AHU 106 via piping 108.

[0030] AHU 106 allows for heat exchange between the working fluid and an airflow passing through it (e.g., via one or more cooling and / or heating coils). The airflow can be, for example, outside air, return air from within building 10, or a combination of both. AHU 106 can transfer heat between the airflow and the working fluid, thereby heating or cooling the airflow. For example, AHU 106 may include one or more fans or blowers configured to direct the airflow across or through the heat exchanger containing the working fluid. The working fluid can then be returned to chiller 102 or boiler 104 via piping 110.

[0031] Air-side system 130 can deliver airflow (i.e., supply airflow) supplied by AHU 106 to building 10 via air supply duct 112, and can supply return air from building 10 to AHU 106 via air return duct 114. In some embodiments, air-side system 130 includes a plurality of variable air volume (VAV) units 116. For example, air-side system 130 is shown as including a separate VAV unit 116 on each floor or zone of building 10. VAV unit 116 may include airlocks or other flow control elements that can be operated to control the amount of supply airflow supplied to individual zones of building 10. In other embodiments, air-side system 130 delivers supply airflow to one or more zones of building 10 (e.g., via supply duct 112) without using intermediate VAV units 116 or other flow control elements. AHU 106 may include various sensors (e.g., temperature sensors, pressure sensors, etc.) configured to measure properties of the supply airflow. The AHU106 can receive input from sensors located within the AHU106 and / or within a building area, and can adjust the flow rate, temperature, or other properties of the supply airflow passing through the AHU106 to achieve setpoint conditions for the building area.

[0032] Waterside system Now for reference Figure 2 The diagram illustrates a block diagram of a water-side system 200 according to some embodiments. In different embodiments, the water-side system 200 may supplement or replace the water-side system 120 in the HVAC system 100, or it may be implemented separately from the HVAC system 100. When implemented in the HVAC system 100, the water-side system 200 may include a subset of the HVAC devices in the HVAC system 100 (e.g., boiler 104, chiller 102, pumps, valves, etc.) and may be operable to provide heating or cooling fluid to the AHU 106. The HVAC devices of the water-side system 200 may be located within the building 10 (e.g., as part of the water-side system 120) or at a non-field location, such as a central facility.

[0033] exist Figure 2In this embodiment, the water-side system 200 is shown as a central facility having multiple sub-facilities 202 to 212. Sub-facilities 202 to 212 are shown to include: a heater sub-facility 202, a heat recovery chiller sub-facility 204, a chiller sub-facility 206, a cooling tower sub-facility 208, a high-temperature thermal energy storage (TES) sub-facility 210, and a low-temperature thermal energy storage (TES) sub-facility 212. Sub-facilities 202 to 212 consume resources from public utilities (e.g., water, natural gas, electricity, etc.) to serve the building or campus's thermal load (e.g., hot water, cold water, heating, cooling, etc.). For example, heater sub-facility 202 may be configured to heat water in a hot water loop 214 that circulates hot water between heater sub-facility 202 and building 10. Chiller sub-facilities 206 can be configured to cool water in a chilled water loop 216, which circulates chilled water between chiller sub-facilities 206 and building 10. Heat recovery chiller sub-facilities 204 can be configured to transfer heat from chilled water loop 216 to hot water loop 214 to provide additional heating for hot water and additional cooling for chilled water. Condensate loop 218 can absorb heat from the chilled water in chiller sub-facilities 206 and discharge the absorbed heat into cooling tower sub-facilities 208 or transfer the absorbed heat to hot water loop 214. High-temperature TES sub-facilities 210 and low-temperature TES sub-facilities 212 can store high-temperature and low-temperature thermal energy, respectively, for subsequent use.

[0034] Hot water loop 214 and cold water loop 216 can deliver heated and / or cooled water to an air handling unit (e.g., AHU 106) located on the roof of building 10 or to individual floors or areas of building 10 (e.g., VAV unit 116). The air handling unit pushes air through heat exchangers (e.g., heating coils or cooling coils), through which water flows to provide heating or cooling to the air. Heated or cooled air can be delivered to individual areas of building 10 to serve the thermal load of building 10. The water then returns to sub-facilities 202 to 212 to receive further heating or cooling.

[0035] Although sub-facilities 202 to 212 are shown and described as heating and cooling water for circulation to the building, it should be understood that any other type of working fluid (e.g., ethylene glycol, CO2, etc.) can be used instead of water to serve the thermal load. In other embodiments, sub-facilities 202 to 212 may provide heating and / or cooling directly to the building or campus without the need for an intermediate heat transfer fluid. These and other variations of the water-side system 200 are within the teachings of this disclosure.

[0036] Each of sub-facilities 202 to 212 may include various devices configured to facilitate the function of the sub-facility. For example, heater sub-facility 202 is shown as including a plurality of heating elements 220 (e.g., boilers, electric heaters, etc.) configured to add heat to hot water in hot water loop 214. Heater sub-facility 202 is also shown as including a plurality of pumps 222 and 224 configured to circulate hot water in hot water loop 214 and control the flow rate of hot water through the individual heating elements 220. Chiller sub-facility 206 is shown as including a plurality of chillers 232 configured to remove heat from chilled water in chilled water loop 216. Chiller sub-facility 206 is also shown as including a plurality of pumps 234 and 236 configured to circulate chilled water in chilled water loop 216 and control the flow rate of chilled water through the individual chiller 232.

[0037] The heat recovery chiller sub-facility 204 is shown as including a plurality of heat recovery heat exchangers 226 (e.g., refrigeration loops) configured to transfer heat from the chilled water loop 216 to the hot water loop 214. The heat recovery chiller sub-facility 204 is also shown as including a plurality of pumps 228 and 230 configured to circulate hot and / or chilled water through the heat recovery heat exchangers 226 and to control the flow rate of water through each heat recovery heat exchanger 226. The cooling tower sub-facility 208 is shown as including a plurality of cooling towers 238 configured to remove heat from the condensate in the condensate loop 218. The cooling tower sub-facility 208 is also shown as including a plurality of pumps 240 configured to circulate condensate in the condensate loop 218 and to control the flow rate of condensate through each cooling tower 238.

[0038] High-temperature TES sub-facilities 210 are shown as including a high-temperature TES tank 242 configured to store hot water for later use. High-temperature TES sub-facilities 210 may also include one or more pumps or valves configured to control the flow rate of hot water into or out of the high-temperature TES tank 242. Low-temperature TES sub-facilities 212 are shown as including a low-temperature TES tank 244 configured to store cold water for later use. Low-temperature TES sub-facilities 212 may also include one or more pumps or valves configured to control the flow rate of cold water into or out of the low-temperature TES tank 244.

[0039] In some embodiments, one or more pumps in the water-side system 200 (e.g., pumps 222, 224, 228, 230, 234, 236, and / or 240) or the flow line in the water-side system 200 includes an associated isolation valve. The isolation valve may be integrated with the pump or located upstream or downstream of the pump to control fluid flow in the water-side system 200. In various embodiments, the water-side system 200 may include more, fewer, or different types of devices and / or sub-facilities based on the specific configuration of the water-side system 200 and the type of load served by the water-side system 200.

[0040] air-side system Now for reference Figure 3 A block diagram of an air-side system 3000 according to some embodiments is shown. In different embodiments, the air-side system 3000 may supplement or replace the air-side system 130 in the HVAC system 100 or may be implemented separately from the HVAC system 100. When implemented in the HVAC system 100, the air-side system 3000 may include a subset of the HVAC devices in the HVAC system 100 (e.g., AHU 106, VAV unit 116, ducts 112 to 114, fans, airlocks, etc.) and may be located within or around the building 10. The air-side system 3000 can be operated to heat or cool the airflow supplied to the building 10 using heating or cooling fluid provided by the water-side system 200.

[0041] exist Figure 3 In this embodiment, the air-side system 3000 is shown to include an energy-efficient air handling unit (AHU) 3002. The energy-efficient AHU alters the amount of outside air and return air used by the air handling unit for heating or cooling. For example, the AHU 3002 may receive return air 3004 from building area 3006 via return air duct 3008 and may deliver supply air 3010 to building area 3006 via supply air duct 3012. In some embodiments, the AHU 3002 is located on the roof of building 10 (e.g., as shown in the image). Figure 1 The AHU 106 shown, or otherwise positioned, is a roof unit that receives both return air 3004 and outside air 3014. The AHU 3002 can be configured to operate the exhaust damper 3016, the mixing damper 3018, and the outside air damper 3020 to control the amount of outside air 3014 and return air 3004 combined to form the supply air 3010. Any return air 3004 that does not pass through the mixing damper 3018 can be discharged from the AHU 3002 as exhaust gas 3022 through the exhaust damper 3016.

[0042] Each of the airlocks 3016 to 3020 can be operated by an actuator. For example, the exhaust airlock 3016 can be operated by actuator 3024, the mixing airlock 3018 can be operated by actuator 3026, and the external airlock 3020 can be operated by actuator 3028. Actuators 3024 to 3028 can communicate with the AHU controller 3030 via communication link 3032. Actuators 3024 to 3028 can receive control signals from the AHU controller 3030 and can provide feedback signals to the AHU controller 3030. Feedback signals may include, for example, an indication of the current actuator or airlock position, the amount of torque or force applied by the actuator, diagnostic information (e.g., the results of diagnostic tests performed by actuators 3024 to 3028), status information, commissioning information, configuration settings, calibration data, and / or other types of information or data that can be acquired, stored, or used by actuators 3024 to 3028. The AHU controller 3030 may be an energy-saving controller configured to control actuators 3024 to 3028 using one or more control algorithms, such as state-based algorithms, extreme value search control (ESC) algorithms, proportional-integral (PI) control algorithms, proportional-integral-derivative (PID) control algorithms, model predictive control (MPC) algorithms, feedback control algorithms, etc.

[0043] Still referencing Figure 3 AHU 3002 is shown as including a cooling coil 3034, a heating coil 3036, and a fan 3038 located within a supply air duct 3012. The fan 3038 can be configured to force supply air 3010 through the cooling coil 3034 and / or the heating coil 3036 and to supply air 3010 to building area 3006. AHU controller 3030 can communicate with fan 3038 via communication link 3040 to control the flow rate of supply air 3010. In some embodiments, AHU controller 3030 controls the amount of heating or cooling applied to supply air 3010 by adjusting the speed of fan 3038.

[0044] Cooling coil 3034 can receive cooling fluid from water-side system 200 (e.g., from chilled water loop 216) via conduit 3042 and can return cooling fluid to water-side system 200 via conduit 3044. Valve 3046 can be positioned along conduit 3042 or conduit 3044 to control the flow rate of cooling fluid through cooling coil 3034. In some embodiments, cooling coil 3034 includes a multi-stage cooling coil that can be independently activated and deactivated (e.g., by AHU controller 3030, by BMS controller 3066, etc.) to regulate the amount of cooling applied to supply air 3010.

[0045] Heating coil 3036 can receive heated fluid from water-side system 200 (e.g., from hot water loop 214) via conduit 3048 and can return heated fluid to water-side system 200 via conduit 3050. Valve 3052 can be positioned along conduit 3048 or conduit 3050 to control the flow rate of heated fluid through heating coil 3036. In some embodiments, heating coil 3036 includes a multi-stage heating coil that can be independently activated and deactivated (e.g., by AHU controller 3030, by BMS controller 3066, etc.) to regulate the amount of heating applied to supply air 3010.

[0046] Each of valves 3046 and 3052 can be controlled by an actuator. For example, valve 3046 can be controlled by actuator 3054, and valve 3052 can be controlled by actuator 3056. Actuators 3054 to 3056 can communicate with AHU controller 3030 via communication links 3058 to 3060. Actuators 3054 to 3056 can receive control signals from AHU controller 3030 and can provide feedback signals to controller 3030. In some embodiments, AHU controller 3030 receives a measurement of the supply air temperature from temperature sensor 3062 located in supply air duct 3012 (e.g., downstream of cooling coil 3034 and / or heating coil 3036). AHU controller 3030 can also receive a temperature measurement of building area 3006 from temperature sensor 3064 located in building area 3006.

[0047] In some embodiments, the AHU controller 3030 operates valves 3046 and 3052 via actuators 3054 to 3056 to regulate the amount of heating or cooling supplied to the supply air 3010 (e.g., to achieve a setpoint temperature for the supply air 3010 or to maintain the temperature of the supply air 3010 within a setpoint temperature range). The positions of valves 3046 and 3052 affect the amount of heating or cooling supplied to the supply air 3010 by the cooling coil 3034 or the heating coil 3036, and may be related to the amount of energy consumed to achieve the desired supply air temperature. The AHU controller 3030 can control the temperature of the supply air 3010 and / or building area 3006 by activating or deactivating coils 3034 to 3036, adjusting the speed of fan 3038, or a combination of both.

[0048] Still referencing Figure 3The air-side system 3000 is shown as including a building management system (BMS) controller 3066 and a client device 3068. The BMS controller 3066 may include one or more computer systems (e.g., a server, supervisory controller, subsystem controller, etc.) that act as a system-level controller, application or data server, head node, or master controller for the air-side system 3000, water-side system 200, HVAC system 100, and / or other controllable systems serving the building 10. The BMS controller 3066 may communicate with multiple downstream building systems or subsystems (e.g., HVAC system 100, security system, lighting system, water-side system 200, etc.) via communication link 3070 according to similar or different protocols (e.g., LON, BACnet, etc.). In different embodiments, the AHU controller 3030 and the BMS controller 3066 may be separate (e.g., ...). Figure 3 (As shown) or integrated. In an integrated implementation, the AHU controller 3030 may be a software module configured for execution by the processor of the BMS controller 3066.

[0049] In some embodiments, the AHU controller 3030 receives information (e.g., commands, setpoints, operating boundaries, etc.) from the BMS controller 3066 and provides information (e.g., temperature measurements, valve or actuator positions, operating status, diagnostics, etc.) to the BMS controller 3066. For example, the AHU controller 3030 may provide the BMS controller 3066 with temperature measurements from temperature sensors 3062 to 3064, equipment on / off status, equipment operational capabilities, and / or any other information that the BMS controller 3066 may use to monitor or control variable states or conditions within building area 3006.

[0050] Client device 3068 may include one or more human-machine interfaces or client interfaces (e.g., graphical user interface, reporting interface, text-based computer interface, client-oriented web service, web server providing pages to web clients, etc.) for controlling, viewing, or otherwise interacting with HVAC system 100, its subsystems, and / or devices. Client device 3068 may be a computer workstation, client terminal, remote or local interface, or any other type of user interface device. Client device 3068 may be a fixed terminal or a mobile device. For example, client device 3068 may be a desktop computer, a computer server with a user interface, a laptop computer, a tablet computer, a smartphone, a PDA, or any other type of mobile or non-mobile device. Client device 3068 may communicate with BMS controller 3066 and / or AHU controller 3030 via communication link 3072.

[0051] Building Management System Now for reference Figure 4 A block diagram of a building management system (BMS) 400 according to some embodiments is shown. The BMS 400 can be implemented in building 10 to automatically monitor and control various building functions. The BMS 400 is shown as including a BMS controller 3066 and multiple building subsystems 428. The building subsystems 428 are shown as including a building electrical subsystem 434, an information and communication technology (ICT) subsystem 436, a security subsystem 438, an HVAC subsystem 440, a lighting subsystem 442, an elevator / escalator subsystem 432, and a fire safety subsystem 430. In different embodiments, the building subsystems 428 may include fewer, additional, or alternative subsystems. For example, the building subsystems 428 may also include, or alternatively include, a refrigeration subsystem, an advertising or signage subsystem, a cooking subsystem, a vending subsystem, a printer or copy service subsystem, or any other type of building subsystem using controllable devices and / or sensors to monitor or control building 10. In some embodiments, as referenced... Figure 2 and Figure 3 As described, building subsystem 428 includes water-side system 200 and / or air-side system 3000.

[0052] Each of the building subsystems 428 may include any number of devices, controllers, and connections for performing its individual functions and control activities. (See reference...) Figures 1 to 3 As described, HVAC subsystem 440 may include many of the same components as HVAC system 100. For example, HVAC subsystem 440 may include chillers, boilers, any number of air handling units, energy savers, field controllers, monitoring controllers, actuators, temperature sensors, and other devices for controlling temperature, humidity, airflow, or other variable conditions within building 10. Lighting subsystem 442 may include any number of luminaires, ballasts, lighting sensors, dimmers, or other devices configured to controllably adjust the amount of light provided to the building space. Security subsystem 438 may include occupancy sensors, video surveillance cameras, digital video recorders, video processing servers, intrusion detection devices, access control devices and servers, or other security-related devices.

[0053] Still referencing Figure 4The BMS controller 3066 is shown as including a communication interface 407 and a BMS interface 409. Interface 407 facilitates communication between the BMS controller 3066 and external applications (e.g., monitoring and reporting application 422, enterprise control application 426, remote systems and applications 444, applications residing on client devices 448, etc.) to allow users to control, monitor, and adjust the BMS controller 3066 and / or subsystem 428. Interface 407 also facilitates communication between the BMS controller 3066 and client devices 448. BMS interface 409 facilitates communication between the BMS controller 3066 and building subsystems 428 (e.g., HVAC, lighting safety, elevators, power distribution, services, etc.).

[0054] Interfaces 407 and 409 may be or include wired or wireless communication interfaces (e.g., sockets, antennas, transmitters, receivers, transceivers, wire terminals, etc.) for data communication with building subsystem 428 or other external systems or devices. In various embodiments, communication via interfaces 407 and 409 may be direct (e.g., local wired or wireless communication) or via a communication network 446 (e.g., a WAN, the Internet, a cellular network, etc.). For example, interfaces 407 and 409 may include Ethernet cards and ports for sending and receiving data via an Ethernet-based communication link or network. In another example, interfaces 407 and 409 may include Wi-Fi transceivers for communication via a wireless communication network. In yet another example, one or both interfaces 407 and 409 may include cellular or mobile phone communication transceivers. In one embodiment, communication interface 407 is a powerline communication interface, and BMS interface 409 is an Ethernet interface. In other embodiments, both communication interface 407 and BMS interface 409 are Ethernet interfaces or the same Ethernet interface.

[0055] Still referencing Figure 4 The BMS controller 3066 is shown as including processing circuitry 404, which includes a processor 406 and a memory 408. Processing circuitry 404 can be communicatively connected to BMS interface 409 and / or communication interface 407, thereby enabling processing circuitry 404 and its various components to send and receive data via interfaces 407, 409. Processor 406 can be implemented as a general-purpose processor, application-specific integrated circuit (ASIC), one or more field-programmable gate arrays (FPGAs), a set of processing units, or other suitable electronic processing units.

[0056] Memory 408 (e.g., memory, memory cell, storage device, etc.) may include one or more means (e.g., RAM, ROM, flash memory, hard disk storage device, etc.) for storing data and / or computer code used to perform or facilitate the various processes, layers, and modules described herein. Memory 408 may be or include volatile or non-volatile memory. Memory 408 may include database components, object code components, script components, or any other type of information structure for supporting the various activities and information structures described herein. According to some embodiments, memory 408 is communicatively connected to processor 406 via processing circuitry 404 and includes computer code for performing (e.g., by processing circuitry 404 and / or processor 406) one or more processes described herein.

[0057] In some embodiments, the BMS controller 3066 is implemented within a single computer (e.g., a server, a enclosure, etc.). In various other embodiments, the BMS controller 3066 may be distributed across multiple servers or computers (e.g., it may reside in a distributed location). Further, although Figure 4 Applications 422 and 426 are shown as existing outside of BMS controller 3066, but in some embodiments, applications 422 and 426 may be hosted within BMS controller 3066 (e.g., within memory 408).

[0058] Still referencing Figure 4 The memory 408 is shown as including an enterprise integration layer 410, an automated measurement and verification (AM&V) layer 412, a demand response (DR) layer 414, a fault detection and diagnosis (FDD) layer 416, an integrated control layer 418, and a building subsystem integration layer 420. Layers 410 to 420 can be configured to receive input from building subsystem 428 and other data sources, determine optimal control actions for building subsystem 428 based on these inputs, generate control signals based on these optimal control actions, and provide the generated control signals to building subsystem 428. The following paragraphs describe some of the common functions performed by each of the layers 410 to 420 in the BMS 400.

[0059] Enterprise integration layer 410 can be configured to provide information and services to client or local applications to support a variety of enterprise-level applications. For example, enterprise control application 426 can be configured to provide cross-subsystem control to a graphical user interface (GUI) or to any number of enterprise-level business applications (e.g., accounting systems, user identification systems, etc.). Enterprise control application 426 can also, or alternatively, be configured to provide a configuration GUI for configuring BMS controller 3066. In yet another embodiment, enterprise control application 426 can work with layers 410 to 420 to optimize building performance (e.g., efficiency, energy use, comfort, or security) based on input received at interface 407 and / or BMS interface 409.

[0060] The building subsystem integration layer 420 can be configured to manage communication between the BMS controller 3066 and the building subsystem 428. For example, the building subsystem integration layer 420 can receive sensor data and input signals from the building subsystem 428 and provide output data and control signals to the building subsystem 428. The building subsystem integration layer 420 can also be configured to manage communication between the building subsystems 428. The building subsystem integration layer 420 translates communications (e.g., sensor data, input signals, output signals, etc.) across multiple multi-vendor / multi-protocol systems.

[0061] The demand response layer 414 can be configured to optimize resource use (e.g., electricity use, natural gas use, water use, etc.) and / or the monetary cost of such resource use in response to meeting the needs of building 10. Optimization can be based on time-of-use pricing, reduction signals, energy availability, or other data received from utility providers, distributed energy generation systems 424, energy storage devices 427 (e.g., high-temperature TES 242, low-temperature TES 244, etc.), or other sources. The demand response layer 414 can receive inputs from other layers of the BMS controller 3066 (e.g., building subsystem integration layer 420, integrated control layer 418, etc.). Inputs received from other layers may include environmental or sensor inputs (such as temperature, carbon dioxide levels, relative humidity levels, air quality sensor outputs, occupancy sensor outputs, room assignments, etc.). Inputs may also include, for example, electricity usage (e.g., expressed in kWh), heat load measurements, pricing information, projected pricing, smoothed pricing, reduction signals from utilities, etc.

[0062] According to some embodiments, the demand response layer 414 includes control logic for responding to data and signals it receives. These responses may include communicating with control algorithms in the integrated control layer 418, changing control strategies, changing setpoints, or activating / deactivating building equipment or subsystems in a controlled manner. The demand response layer 414 may also include control logic configured to determine when to utilize stored energy. For example, the demand response layer 414 may determine to begin using energy from energy storage device 427 just before the start of peak usage time.

[0063] In some embodiments, the demand response layer 414 includes a control module configured to proactively initiate control actions (e.g., automatically changing setpoints) to minimize energy costs based on one or more inputs representing or based on demand (e.g., price, reduction signals, demand levels, etc.). In some embodiments, the demand response layer 414 uses an equipment model to determine the optimal set of control actions. The equipment model may include, for example, thermodynamic models describing inputs, outputs, and / or functions performed by various building equipment groups. The equipment model may represent a building equipment group (e.g., sub-facilities, chiller arrays, etc.) or individual devices (e.g., individual chillers, heaters, pumps, etc.).

[0064] The demand response layer 414 may further include or utilize one or more demand response policy definitions (e.g., database, XML file, etc.). Policy definitions can be edited or adjusted by the user (e.g., via a graphical user interface) to customize control actions initiated in response to demand inputs, tailored to the user's application, desired comfort level, specific building equipment, or other concerns. For example, demand response policy definitions may specify which devices can be turned on or off, for how long a system or device should be turned off, what setpoints can be changed, what the permissible range of setpoint adjustments is, how long a high demand setpoint is maintained before returning to the normally scheduled setpoint, how close to capacity limits, which device mode should be used, the rate of energy transfer to and from energy storage devices (e.g., thermal storage tanks, battery packs, etc.) (e.g., maximum rate, alarm rate, other rate boundary information, etc.), and when field energy generation (e.g., via fuel cells, electric generator sets, etc.) should be dispatched.

[0065] The integrated control layer 418 can be configured to make control decisions using data inputs or outputs from the building subsystem integration layer 420 and / or the demand response layer 414. Since subsystem integration is provided by the building subsystem integration layer 420, the integrated control layer 418 can integrate the control activities of subsystem 428, making subsystem 428 behave as a single integrated supersystem. In some embodiments, the integrated control layer 418 includes control logic that uses inputs and outputs from multiple building subsystems to provide greater comfort and energy savings than each individual subsystem could provide individually. For example, the integrated control layer 418 can be configured to make energy-saving control decisions for a second subsystem using inputs from a first subsystem. The results of these decisions can be relayed back to the building subsystem integration layer 420.

[0066] The integrated control layer 418 is shown as logically subordinate to the demand response layer 414. The integrated control layer 418 can be configured to enhance the effectiveness of the demand response layer 414 by enabling it to cooperate with the demand response layer 414 in controlling the building subsystem 428 and its corresponding control loop. This configuration can advantageously reduce disruptive demand response behavior compared to conventional systems. For example, the integrated control layer 418 can be configured to ensure that demand-response driven upward adjustments to the chilled water temperature setpoint (or another component that directly or indirectly affects the temperature) do not result in an increase in fan energy (or other energy used for cooling the space) that would cause the total building energy usage to exceed the energy savings at the chiller unit.

[0067] The integrated control layer 418 can be configured to provide feedback to the demand response layer 414, enabling the demand response layer 414 to check that constraints (e.g., temperature, lighting levels, etc.) are properly maintained even when required load shedding is in progress. Constraints may also include setpoints or sensed boundaries related to safety, equipment operating limits and performance, comfort, fire codes, electrical codes, energy codes, etc. The integrated control layer 418 is also logically lower than the fault detection and diagnostic layer 416 and the automatic measurement and verification layer 412. The integrated control layer 418 can be configured to provide calculated inputs (e.g., summaries) to these higher layers based on outputs from more than one building subsystem.

[0068] The Automated Measurement and Validation (AM&V) layer 412 can be configured to verify that control strategies commanded by the Integrated Control layer 418 or the Demand Response layer 414 are functioning appropriately (e.g., using data aggregated by the AM&V layer 412, Integrated Control layer 418, Building Subsystem Integration layer 420, FDD layer 416, or others). Calculations performed by the AM&V layer 412 can be based on building system energy models and / or equipment models for individual BMS units or subsystems. For example, the AM&V layer 412 can compare the model's predicted output with the actual output from building subsystem 428 to determine the model's accuracy.

[0069] The Fault Detection and Diagnosis (FDD) layer 416 can be configured to provide continuous fault detection for building subsystem 428, building subsystem devices (i.e., building equipment), and control algorithms used by the demand response layer 414 and the integrated control layer 418. The FDD layer 416 can receive data input from the integrated control layer 418, directly from one or more building subsystems or devices, or from another data source. The FDD layer 416 can automatically diagnose and respond to detected faults. Responses to detected or diagnosed faults may include providing alert messages to users, maintenance scheduling systems, or control algorithms configured to attempt to repair or resolve the fault.

[0070] FDD layer 416 can be configured to output a specific identifier of the faulty component or cause of failure (e.g., a loose airlock connection) using detailed subsystem inputs available at building subsystem integration layer 420. In other exemplary embodiments, FDD layer 416 is configured to provide a “fault” event to integrated control layer 418, which executes control strategies and policies in response to the received fault event. According to some embodiments, FDD layer 416 (or policies executed by the integrated control engine or business rules engine) can shut down the system or directly control activities around the faulty device or system to reduce energy waste, extend equipment life, or ensure appropriate control response.

[0071] FDD layer 416 can be configured to store or access various system data storage devices (or data points for real-time data). FDD layer 416 can use some content from the data storage devices to identify device-level faults (e.g., specific chiller unit, specific AHU, specific terminal unit, etc.) and other content to identify component or subsystem-level faults. For example, building subsystem 428 can generate time-series data indicating the performance of BMS 400 and its various components. The data generated by building subsystem 428 can include measured or calculated values ​​that exhibit statistical characteristics and provide information about how the corresponding system or process (e.g., temperature control process, flow control process, etc.) performs with respect to errors from its setpoint. FDD layer 416 can examine these processes to expose when system performance begins to degrade and alert users to repair faults before they become more severe.

[0072] Now for reference Figure 5 The diagram illustrates a block diagram of another building management system (BMS) 500 according to some embodiments. The BMS 500 can be used to monitor and control devices of the HVAC system 100, water-side system 200, air-side system 3000, building subsystem 428, and other types of BMS devices (e.g., lighting equipment, security equipment, etc.) and / or HVAC equipment.

[0073] The BMS 500 provides a system architecture that facilitates automated device discovery and device model distribution. Device discovery can occur at multiple levels of the BMS 500 across multiple different communication buses (e.g., system bus 554, area buses 556 to 560 and 564, and sensor / actuator bus 566, etc.) and across multiple different communication protocols. In some embodiments, device discovery is accomplished using an active node table that provides status information for devices connected to each communication bus. For example, for a new device, each communication bus can be monitored by monitoring the corresponding active node table of the new node. When a new device is detected, the BMS 500 can begin interacting with the new device (e.g., sending control signals, using data from the device) without user intervention.

[0074] Some devices in BMS 500 use device models to present themselves to the network. Device models define device object attributes, view definitions, schedules, trends, and associated BACnet value objects (e.g., analog values, binary values, multi-state values, etc.) for integration with other systems. Some devices in BMS 500 store their own device models. Other devices in BMS 500 have device models stored externally (e.g., within other devices). For example, area coordinator 508 may store a device model for bypass airlock 528. In some embodiments, area coordinator 508 automatically creates device models for bypass airlock 528 or other devices on area bus 558. Other area coordinators may also create device models for devices connected to their area buses. Device models for devices may be automatically created based on the type of data points exposed by the device on the area bus, device type, and / or other device attributes. Several examples of automatic device discovery and device model distribution are discussed in more detail below.

[0075] Still referencing Figure 5 BMS 500 is shown as including: a system manager 502; several area coordinators 506, 508, 510, and 518; and several area controllers 524, 530, 532, 536, 548, and 550. System manager 502 can monitor data points in BMS 500 and report the monitored variables to various monitoring and / or control applications. System manager 502 can communicate with client device 504 (e.g., user device, desktop computer, laptop computer, mobile device, etc.) via data communication link 574 (e.g., BACnet IP, Ethernet, wired or wireless communication, etc.). System manager 502 can provide a user interface to client device 504 via data communication link 574. The user interface allows users to monitor and / or control BMS 500 via client device 504.

[0076] In some embodiments, system manager 502 is connected to zone coordinators 506 to 510 and 518 via system bus 554. System manager 502 can be configured to communicate with zone coordinators 506 to 510 and 518 via system bus 554 using Master-Slave Token Passing (MSTP) protocol or any other communication protocol. System bus 554 can also connect system manager 502 to other devices, such as constant capacity (CV) rooftop units (RTUs) 512, input / output modules (IOMs) 514, thermostat controllers 516 (e.g., TEC5000 series thermostat controllers), and network automation engines (NAEs) or third-party controllers 520. RTU 512 can be configured to communicate directly with system manager 502 and can be directly connected to system bus 554. Other RTUs can communicate with system manager 502 via intermediate devices. For example, wired input 562 can connect a third-party RTU 542 to thermostat controller 516, which is connected to system bus 554.

[0077] System Manager 502 can provide a user interface for any device that includes a device model. Devices such as Zone Coordinators 506 to 510 and 518 and Thermostat Controller 516 can provide their device models to System Manager 502 via System Bus 554. In some embodiments, System Manager 502 automatically creates device models for connected devices that do not include a device model (e.g., IOM 514, Third-Party Controller 520, etc.). For example, System Manager 502 can create a device model for any device responding to a device tree request. The device models created by System Manager 502 can be stored within System Manager 502. System Manager 502 can then use the device models created by System Manager 502 to provide a user interface for devices that do not include their own device models. In some embodiments, System Manager 502 stores view definitions for each type of device connected via System Bus 554 and uses the stored view definitions to generate a user interface for that device.

[0078] Each area coordinator 506 to 510 and 518 can be connected to one or more of the area controllers 524, 530 to 532, 536, and 548 to 550 via area buses 556, 558, 560, and 564. Area coordinators 506 to 510 and 518 can communicate with area controllers 524, 530 to 532, 536, and 548 to 550 via area buses 556 to 560 and 564 using the MSTP protocol or any other communication protocol. Area buses 556 to 560 and 564 can also connect area coordinators 506 to 510 and 518 to other types of devices, such as variable air volume (VAV) RTUs 522 and 540, switched bypass (COBP) RTUs 526 and 552, bypass airlocks 528 and 546, and PEAK controllers 534 and 544.

[0079] Region coordinators 506 to 510 and 518 can be configured to monitor and command different zoning systems. In some embodiments, each region coordinator 506 to 510 and 518 monitors and commands a separate zoning system and is connected to the zoning system via a separate region bus. For example, region coordinator 506 can be connected to VAV RTU 522 and region controller 524 via region bus 556. Region coordinator 508 can be connected to COBP RTU 526, bypass airlock 528, COBP region controller 530, and VAV region controller 532 via region bus 558. Region coordinator 510 can be connected to PEAK controller 534 and VAV region controller 536 via region bus 560. Region coordinator 518 can be connected to PEAK controller 544, bypass airlock 546, COBP region controller 548, and VAV region controller 550 via region bus 564.

[0080] Individual models of zone coordinators 506 through 510 and 518 can be configured to handle multiple different types of zone systems (e.g., VAV zone systems, COBP zone systems, etc.). Each zone system may include an RTU, one or more zone controllers, and / or a bypass airlock. For example, zone coordinators 506 and 510 are shown as Verasys VAV engines (VVEs) connected to VAV RTUs 522 and 540, respectively. Zone coordinator 506 is directly connected to VAV RTU 522 via zone bus 556, while zone coordinator 510 is connected to a third-party VAV RTU 540 via a wired input 568 provided to PEAK controller 534. Zone coordinators 508 and 518 are shown as Verasys COBP engines (VCEs) connected to COBP RTUs 526 and 552, respectively. The regional coordinator 508 is directly connected to the COBP RTU 526 via the regional bus 558, while the regional coordinator 518 is connected to the third-party COBP RTU 552 via a wired input 570 provided to the PEAK controller 544.

[0081] Area controllers 524, 530 to 532, 536, and 548 to 550 can communicate with individual BMS devices (e.g., sensors, actuators, etc.) via a sensor / actuator (SA) bus. For example, VAV area controller 536 is shown connected to networked sensor 538 via SA bus 566. Area controller 536 can communicate with networked sensor 538 using the MSTP protocol or any other communication protocol. Although in Figure 5 Only one SA bus 566 is shown, but it should be understood that each area controller 524, 530 to 532, 536 and 548 to 550 can be connected to a different SA bus. Each SA bus can connect the area controller to different sensors (e.g., temperature sensors, humidity sensors, pressure sensors, light sensors, occupancy sensors, etc.), actuators (e.g., airlock actuators, valve actuators, etc.) and / or other types of controllable devices (e.g., chillers, heaters, fans, pumps, etc.).

[0082] Each area controller 524, 530 to 532, 536, and 548 to 550 can be configured to monitor and control different building areas. Area controllers 524, 530 to 532, 536, and 548 to 550 can use inputs and outputs provided via their SA buses to monitor and control individual building areas. For example, area controller 536 can use temperature input (e.g., the measured temperature of the building area) received from networked sensor 538 via SA bus 566 as feedback in a temperature control algorithm. Area controllers 524, 530 to 532, 536, and 548 to 550 can use various types of control algorithms (e.g., state-based algorithms, extreme value search control (ESC) algorithms, proportional-integral (PI) control algorithms, proportional-integral-derivative (PID) control algorithms, model predictive control (MPC) algorithms, feedback control algorithms, etc.) to control variable states or conditions (e.g., temperature, humidity, airflow, lighting, etc.) in or around building 10.

[0083] Chiller Unit Components Now go to Figure 6 This illustration shows an example embodiment of a chiller assembly 600 according to some embodiments. The chiller assembly 600 may be identical or similar to the chiller 102 described above. The chiller assembly 600 is shown as including a compressor 602 driven by a motor 604, a condenser 606, and an evaporator 608. A refrigerant may circulate through the chiller assembly 600 in a vapor compression cycle or an absorption refrigeration cycle. The refrigerant may be, for example, a low-pressure refrigerant with an operating pressure less than 400 kPa. The chiller assembly 600 may also include a control panel 614 configured to control the operation of the vapor compression cycle within the chiller assembly 600. The control panel 614 may be connected to various sensors (e.g., pressure sensors, temperature sensors) and electronic networks (e.g., network 446) to transmit various data related to maintenance, analysis, performance, etc. Sensors may additionally or alternatively communicate directly with a controller (e.g., BMS controller 3066) and / or BMS 400.

[0084] Motor 604 is powered by variable speed drive (VSD) 610. In some embodiments, VSD 610 receives AC power with a fixed line voltage and a fixed line frequency from an AC power source (not shown) and supplies power with a variable voltage and frequency to motor 604. Motor 604 can be any type of electric motor that can be powered by VSD 610.

[0085] For example, motor 604 may be a high-speed induction motor. Compressor 602 may be driven by motor 604 to compress refrigerant vapor received from evaporator 608 via suction line 612. For example, compressor 602 may include an impeller comprising a plurality of blades configured to rotate at high speed to compress the refrigerant vapor. Compressor 602 then delivers the compressed refrigerant vapor to condenser 606 via discharge line. Compressor 602 may be a centrifugal compressor, screw compressor, scroll compressor, turbo compressor, or any other suitable type of compressor.

[0086] Evaporator 608 may include an internal tube bundle (not shown) and supply lines 620 and return lines 622 for supplying and removing process fluid to and from the internal tube bundle. Supply lines 620 and return lines 622 may be in fluid communication with components within the HVAC system (e.g., air handling unit 106) via conduits that circulate the process fluid. In some embodiments, the process fluid is a cooling liquid used to cool a building and may be, but is not limited to, water, ethylene glycol, calcium chloride brine, sodium chloride brine, or any other suitable liquid. Evaporator 608 may be configured to reduce the temperature of the process fluid as it passes through the tube bundle of evaporator 608 and exchanges heat with a refrigerant. Refrigerant vapor is formed in evaporator 608 from a refrigerant liquid that is delivered to evaporator 608, exchanges heat with the process fluid, and undergoes a phase change to become refrigerant vapor.

[0087] Refrigerant vapor delivered by compressor 602 to condenser 606 transfers heat to the fluid. Due to heat transfer with the fluid, the refrigerant vapor condenses into refrigerant liquid in condenser 606. The refrigerant liquid from condenser 606 can flow through an expansion device and return to evaporator 608 to complete the refrigerant cycle of chiller unit assembly 600. Condenser 606 includes a supply line 616 and a return line 618 for circulating fluid between condenser 606 and external components of the HVAC system (e.g., a cooling tower). Fluid supplied to condenser 606 via return line 618 can exchange heat with the refrigerant in condenser 606 and can be removed from condenser 606 via supply line 616 to complete the cycle. The fluid circulating through condenser 606 can be water or any other suitable liquid.

[0088] In some embodiments, chiller assembly 600 illustrates an example building installation for monitoring vibration data. Sensors can be mounted to the outer housing of chiller assembly 600. Specifically, sensors can be mounted at support locations on drive lines across chiller assembly 600. In this case, the support location can be the location where forces are transmitted from chiller assembly 600 to its outer housing. Sensors can be mounted to measure three-dimensional vibration data of chiller assembly 600. In other words, sensors can measure how chiller assembly 600 and / or associated components vibrate in three-dimensional space. For example only, sensors for measuring vibration data can be mounted at locations within chiller assembly 600 (such as motor 604, VSD 610, compressor 602, suction line 612, etc.). In this way, vibration data can be acquired at different locations within chiller assembly 600. Depending on the various embodiments within the scope of this disclosure, different other measurable characteristics of equipment operation can be measured using sensors included in chiller assembly 600 or other equipment units.

[0089] The chiller unit assembly 600 includes a housing and a circuit system for controlling the various refrigeration components described above, which is positioned within the housing together with the refrigeration components of the chiller unit (e.g., compressor 602, VSD 610, motor 604, etc.). Figure 7 As shown and described in more detail below, such components may include a chiller control board and a communication board, both of which can be located in Figure 6 The chiller unit assembly 600 shown is housed within its enclosure (e.g., near VSD 610). Multiple communication channels between the chiller control board and the communication board may also be located within the chiller unit assembly 600 (e.g., inside the enclosure), for example, via Ethernet cables and Modbus cables (or other sets of different cables or wiring that provide different bandwidths or types of data transmission).

[0090] In some embodiments, this circuitry of the chiller assembly 600 includes an antenna for receiving and transmitting signals, for example, via Wi-Fi or a cellular network, to enable wireless communication. In some embodiments, the housing of the chiller assembly 600 includes a panel or window (e.g., panel 624) made of a transmissive material that allows such signals to be transmitted to and from the antenna through the panel or window. Other elements, components, and structures of the chiller assembly 600 may be predominantly metallic, allowing wireless signals to be blocked by such other portions of the chiller assembly 600. By providing panel 624 (or other portions of the housing of the chiller assembly 600) as a portion of the different transmissive materials (e.g., plastics, polymers, organic materials, etc.) through which electromagnetic waves (e.g., radio frequencies) at frequencies suitable for wireless communication can easily pass, the antenna can be located inside the chiller assembly 600. In various embodiments, this arrangement can reduce installation time, protect the antenna from damage, reduce installation errors, etc. In other embodiments, panel 624 acts as an antenna and / or is integrated within an antenna to enable the transmission of wireless signals to and from the chiller assembly 600. In other embodiments, the housing is provided with a port through which cables can be connected from an antenna located outside the housing to a communication board located inside the circuitry of the chiller assembly 600. These various embodiments are all within the scope of this disclosure.

[0091] Embedded connectivity Now for reference Figure 7 A block diagram is shown illustrating a chiller unit 700 connected to a network 702 according to some embodiments. The chiller unit 700 may be the same as or similar to chiller unit 600, or it may be a different type or design of chiller unit. In alternative embodiments, the teachings herein are applied to devices other than chiller units, including those referenced above. Figures 1 to 5 The various devices and systems described (e.g., air handling units, rooftop units, cooling towers, boilers, variable air volume boxes, variable refrigerant flow systems, etc.).

[0092] like Figure 7 As shown, the chiller unit 700 includes electromechanical components 703 configured to operate for cooling fluids (e.g., compressor, motor, variable speed drive, refrigeration cycle components, etc., as per [reference]). Figure 6 The chiller unit 600 described in the text, or other components included in various types of chiller units, main control board 704, and communication board 706.

[0093] The main control board 704 is configured to control the electromechanical component 703, for example, by providing control signals that cause the electromechanical component 703 to perform specific operations according to the control signals. In some embodiments, the electromechanical component 703 includes additional circuitry associated with a particular device (e.g., circuitry for a motor, circuitry for a variable speed drive, circuitry for an actuator, etc.), and this additional circuitry is adapted to implement such control signals within the electromechanical component 703. The main control board 704 can receive measurement results or other feedback from the electromechanical component (e.g., sensor measurements, digital or analog signals from sensors) and provide a feedback control loop to adjust the control signals provided to the electromechanical component 703 based on such feedback. For example, the main control board 704 can control the electromechanical component 703 based on a comparison of a setpoint, such as the supply water temperature output from the chiller unit 700, with a measurement of said water temperature. The main control board 704 controls the operation of the chiller unit 700 when serving a cooling load (i.e., when generating cooling fluid). Various simple wired connections (e.g., analog wiring) can be provided between the main control board 704 and various electromechanical components 703 to facilitate signal transmission between them.

[0094] Communication board 706 is configured to enable communication between chiller unit 700 and network 702, which may be an information technology (IT) network such as the Internet. Communication board 706 may include elements that enable selection between one or more wired (e.g., Ethernet) communication modes and one or more wireless (e.g., Wi-Fi, cellular) communication modes for establishing communication between communication board 706 and network 702, thereby providing flexible deployment options for chiller unit 700. Communication board 706 can also be configured to enable communication between chiller unit 700 and other building equipment, monitoring controllers, sensors, etc., via building networks (e.g., networks using BACnet, Modbus, etc.). See below for example. Figures 8 to 9 The different features of the communication board 706 are described in more detail.

[0095] like Figure 7As shown, multiple communication channels are provided between the main control board 704 and the communication board 706, which are shown as a first communication channel 708 and a second communication channel 710. As illustrated, the first communication channel 708 and the second communication channel 710 are different types of communication channels, for example, providing communication channels for different bandwidths, such that the second communication channel 710 provides higher bandwidth, higher speed, etc., communication between the communication board 706 and the main control board 704 compared to the first communication channel 708. In some embodiments, the first communication channel 708 is provided via a Modbus cable or a cable suitable for other building communication protocols, and the first communication channel 708 provides communication using building equipment communication protocols (e.g., Modbus, BACnet), while the second communication channel 710 is provided via Ethernet or a USB cable or connection suitable for providing higher bandwidth communication (e.g., via IT protocols).

[0096] The first communication channel 708 and the second communication channel 710 can be used to transmit different types of information and to achieve different interoperability between the main control board 704 and the communication board 706. For example, the first communication channel 708 can be used to transmit and receive data points to the main control board 704 using the native data protocol commonly used for data points (e.g., measurement results, operation points, setpoints, etc.) in building automation systems, thereby enabling simple integration and implementation without translating to different protocols or data formats for transmission via different types of communication channels (e.g., via the second communication channel 710). The second communication channel 710 can be used for other functions, such as enabling over-the-air software updates of the main control board 704 via the communication board 706 and the second communication channel 710 (an operation that may not be feasible via the first communication channel 708 in some embodiments), or enabling high-speed access to information about the main control board 704 via a user interface provided by the chiller unit 700. This disclosure envisions different functionalities achieved by the combination of the first communication channel 708 and the second communication channel 710.

[0097] Now for reference Figure 8 The diagram shows a block diagram of a system 800 including a communication board 706 according to some embodiments. Figure 8 Different systems, devices, apparatuses, etc., according to different embodiments, can communicate with chiller unit 700 via communication board 706 to provide, for example, interoperability with main control board 704.

[0098] like Figure 8 As shown, system 800 includes a display screen 802 that communicates with communication board 706. Display screen 802 is a component of chiller unit 700 (e.g., connected to the housing of chiller unit 700, from...). Figure 6The display screen 802 can be a viewing angle visible on the chiller unit assembly 600, or it can be a separate device (e.g., a personal computing device, smartphone, tablet computer, head-mounted display, etc.). The display screen 802 can be configured to display various content related to the operation of the chiller unit 700, for example, in a graphical user interface generated by the communication board 706, and can include elements for receiving input to interact with the graphical user interface (e.g., it can be configured as a touchscreen). The graphical user interface presented at the display screen 802 can include data from the main control board 704 or enable communication via the communication board 706 (e.g., via...). Figure 7 The first communication channel 708 and / or the second communication channel 710 shown and described above interact with the main control board.

[0099] Figure 8 System 800 is also shown as including other devices 804. Other devices 804 may include other building equipment, such as other chillers in a chiller facility including chiller 700, and / or other equipment such as an air handling unit that receives chilled fluid from chiller 700. As shown, communication board 706 may include direct communication between chiller 700 and other devices 804, for example, via BACnet, Modbus, Zigbee, or other communication modes. In some embodiments, the communication board 706 facilitates the coordination of operation of chiller 700 and other devices 804 via this directional communication between chiller 700 and other devices 804, and / or facilitates the transmission of data from other devices 804 to other elements of system 800, and vice versa.

[0100] System 800 is also shown as including building management system 806. Building management system 806 can be configured according to the description above. Figures 1 to 5 The communication board 706 can be configured according to the instructions of the building management system 806 (e.g., it can be the same as or similar to BMS 500). In different embodiments, the communication board 706 can communicate with the building management system 806 via different communication modes, including building communication protocols (Modbus, BACnet, etc.) or IT protocols that may be appropriate depending on the configuration of the building management system 806. The communication board 706 can be configured to flexibly connect to the building management system 806 in the field via appropriate modes (e.g., when installed at a building), so that the chiller unit 700 can be easily installed at different buildings served by different types of building management systems 806 without reconfiguration during the manufacture and production of the communication board 706. The building management system 806 can receive and use data related to the operation of the chiller unit 700 from the communication board 706, and provide the communication board 706 with control decisions and / or other operating instructions for the chiller unit 700.

[0101] Figure 8 The system 800 is further illustrated as including a cellular and / or information technology network 808, which enables communication between the communication board 706 and the remote computing system 810. Network 808 may be... Figure 7 Network 702. The remote computing system 810 can be any computing system located remotely from the chiller unit 700 (located at a distance from the chiller unit), such as a computing system located off-site in the building served by the chiller unit 700 (e.g., a cloud computing system). The remote computing system 810 can provide various smart building features, enterprise management features, data storage devices, etc., associated with the operation of the chiller unit 700. In some embodiments, the remote computing system 810 provides fault detection, fault prediction, predictive optimization, supervisory control, or other operations associated with the operation of the chiller unit 700. In some embodiments, the remote computing system 810 determines control settings or logic to be executed by the main control board 704 and provides such control settings or logic to the communication board 706 for deployment on the main control board 704. Figure 8 The system 800 combines different other features of this paper to achieve different interoperability.

[0102] Now for reference Figure 9 A block diagram of a communication board 706 according to some embodiments is shown. Figure 9 As shown, the communication board 706 includes a processing circuitry system 900 implemented, for example, using one or more computer memory devices and one or more processors, which provides a communication bridge 902, an air wall gateway 904, an edge machine learning (ML) engine 906, an update engine 908, a supervisory control engine 910, a modular extension 912, a data bus 914, a protocol proxy 916, an interface generator 917, and an object and point manager 918. The communication board 706 is also shown to include an Ethernet port 920 for communicating with the main control board 704 via a second communication channel 710, a building protocol port 922 for communicating with the main control board 704 via a first communication channel 708, an Ethernet port 924 for communicating with network 702 (or network 808), a cellular modem and / or SIM card 926 for communicating with network 702 (or network 808), a Wi-Fi card 930 for communicating with network 702 (or network 808), a wireless transceiver 932 for communicating with other devices 804 (e.g., via Zigbee), and a wired port 934 for communicating with other devices 804. Figure 9 Further shown are a first antenna 936 for facilitating cellular communication, a second antenna 938 for facilitating Wi-Fi communication, and a third antenna 940 for facilitating wireless device communication (e.g., Zigbee), coupled to or serving as a component of the communication board 706. In some embodiments, Figure 9Some or all of the Ethernet ports shown are alternatively implemented as USB ports. Figure 9 Different embodiments of any combination or sub-combination of the components shown are within the scope of this disclosure.

[0103] Communication bridge 902 is configured to provide data processing and management to facilitate communication between communication board 706 and remote computing system 810. For example, communication bridge 902 can ingest data into a digital twin of chiller unit 700 and / or a digital twin of the building served by chiller unit 700, and use digital twin information to facilitate connecting such data to appropriate destinations in remote computing system 810. In some embodiments, communication bridge 902 provides features of Johnson Controls' Open Blue Bridge. In some embodiments, communication bridge 902 is configured in accordance with the teachings of PCT application No. PCT / US2022 / 054323, filed December 30, 2022, the entire disclosure of which is incorporated herein by reference.

[0104] The air-wall gateway 904 is configured to facilitate secure network communication between the communication board 706 and other destinations on the remote computing system 810, network 808, or network 702. For example, the air-wall gateway may be an endpoint in a zero-trust overlay network. The air-wall gateway may provide communication over an air-gap communication channel, for example, as described in U.S. Patent No. 10,038,725, issued July 31, 2018; U.S. Patent No. 10,178,133, issued January 8, 2019; U.S. Patent No. 9,621,514, issued April 11, 2017; U.S. Patent No. 10,797,993, issued October 6, 2020; U.S. Patent No. 10,911,418, issued February 2, 2021; or U.S. Patent No. 10,999,154, issued May 4, 2021, the entire disclosure of which is incorporated herein by reference.

[0105] Edge ML engine 906 is configured to provide at least one artificial intelligence operation that is executed locally on communication board 706. The at least one artificial intelligence operation can be trained using a machine learning model, for example, remotely from the communication board (e.g., in remote computing system 810), and then transformed into a hardware-specific format suitable for execution at the edge (i.e., on communication board 706) by edge ML engine 906 and provided to communication board 706. Edge ML engine 906 can provide fault detection, fault prediction, predictive control, automatic configuration, real-time data stream processing, and various other features in different embodiments. In some embodiments, the edge ML engine 906 is configured in accordance with the teachings described in U.S. Patent Publication No. 2020 / 0327371, filed April 9, 2019; U.S. Patent No. 10,977,0101, filed April 21, 2020; U.S. Patent No. 11,272,011, filed May 19, 2021; and / or U.S. Patent No. 10,127,022, filed March 23, 2017, the entire disclosure of which is incorporated herein by reference.

[0106] Update engine 908 is configured to facilitate over-the-air updates to main control board 704, enabling updates provided by remote computing system 810 to be installed on main control board 704. Updates may be software and / or firmware updates that can be associated with changes to control logic executed by main control board 704, improving the efficiency of chiller unit 700, extending the service life of chiller unit 700, or improving the network security of main control board 704. Update engine 908 is configured to receive software packages from remote computing system 701 via network 808 and Ethernet port 924, determine that the software packages are intended for installation on the main control board, and install the software packages on main control board 704 (e.g., via second communication channel 710 and Ethernet port 920). In some embodiments, update engine 908 may identify code to be removed, uninstalled, etc., from main control board 704 so as to be replaced by an update reflected in the software package, and may enable the removal of existing programming from main control board 704 in this way. In some embodiments, the update engine 908 is configured to monitor the operation of the chiller unit 700 (e.g., via data from the main control board 704) so ​​that an update installation is performed at an appropriate time (e.g., when the chiller unit 700 is in a shut-off state), so that the update engine 908 can update the main control board 704 without interrupting the operation of the chiller unit when serving a cooling load.

[0107] The supervisory control engine 910 is configured to provide supervisory control of the chiller unit 700 (via the main control board 704) and / or to provide supervisory control of other devices 804. In some embodiments, the supervisory control engine 910 executes algorithms (e.g., predictive control algorithms and / or optimization processes) configured to determine the amount of cooling to be provided by the chiller unit 700 at an upcoming time step or to determine other control decisions or settings for use by the main control board 704. The communication board 706 may have more computing resources (e.g., processing power, memory, etc.) than the main control board 704, for example, such that algorithms executed by the supervisory control engine 910 can be executed on the communication board 706 but not on the main control board 704.

[0108] Modular extension 912 is configured to accept any expansions to the functionality of communication board 706 in a modular manner. Modular extension 912 may include programming interfaces, data processing functions, etc., for efficiently accepting modular (e.g., Docker containerization) extensions that provide additional analytics, control, data processing, security, or other functionality to communication board 706, as may be expected in different use cases and implementations. The inclusion of modular extension 912 demonstrates the adaptability and flexibility of the architecture disclosed herein.

[0109] Data bus 914 is configured to receive, hold, and provide data for consumption, transmission to, and transmission from the various other elements described herein. In some embodiments, data bus 914 is implemented as a broker in accordance with the teachings of U.S. Provisional Patent Application No. 63 / 537,993, filed September 12, 2023, the entire disclosure of which is incorporated herein by reference.

[0110] Protocol proxy 916 is configured to manage different building network protocols and information technology protocols used by different communication modes to and from communication board 706. For example, protocol proxy 916 can automatically detect the protocol used by the destination of incoming and / or outgoing messages. Protocol proxy 916 can then provide automatic translation between protocols to enable the different communication paths described herein.

[0111] Interface generator 917 is configured to generate a graphical user interface for display on display screen 802. Interface generator 917 can acquire data from various internal operations and functions of main control board 704, remote computing system 810, and communication board 706 (e.g., via data bus 914) to be included together in the graphical user interface. Interface generator 917 can provide display screen 802 with substantially real-time data that might otherwise be unavailable in the absence of a high-speed (e.g., Ethernet) communication channel between main control board 704 and communication board 706. In some embodiments, interface generator 917 is also configured to process user input received via display screen 802 or other user input devices and provide such user input to appropriate elements of communication board 706 (e.g., supervisory control engine 910) to influence the control and operation of chiller unit 700.

[0112] The Object and Point Manager 918 is configured to manage various points (e.g., measurement results, settings, on / off decisions, etc.) being processed or otherwise processed by the Communication Board 706, as well as data objects (e.g., device objects) associated with the Chiller Unit 700 and / or other equipment 804. The Object and Point Manager 918 can provide sorting, normalization, or other processing of incoming and outgoing data, such that raw values ​​are associated with their corresponding points and objects. The Object and Point Manager 918 can thus provide various functions that enable data processing and labeling within the Communication Board 706 (i.e., on the Chiller Unit 700).

[0113] Different combinations (and omissions) of the features described above as characteristics of communication board 706 are within the scope of this disclosure. Therefore, communication board 706 can be provided with the functionality that may be desired in different embodiments as taught herein.

[0114] Now for reference Figure 10 The illustration shows a process 1000 for deploying a chiller unit (e.g., chiller unit 700) at a building, according to some embodiments.

[0115] At step 1002, the cooling components of the chiller unit are installed in the hose. Step 1002 may include physically manufacturing the chiller unit, for example, assembling it. Figure 6 The chiller unit component 600 shown is shown.

[0116] At step 1004, the main control board (e.g., main control board 704) is installed in the housing. Step 1004 may include a structure for connecting the main control board to the interior of the housing and wiring the main control board to various cooling components of the chiller unit (e.g., variable speed drives, actuators, motors, valves, compressors, etc.), such that the main control board is arranged to provide control over such components. Step 1004 may also include wiring the main control board to the power supply of the chiller unit (e.g., providing electrical power input for the operation of the chiller unit's cooling components and the main control board).

[0117] At step 1006, a communication board (e.g., communication board 706) is mounted in the housing. Step 1006 may include another structure connecting the communication board to the interior of the housing. Step 1006 may also include wiring the communication board to the power supply of the chiller unit, such that power is supplied to the communication board 706 during manufacturing.

[0118] At step 1008, multiple communication channels are installed between the main control board and the communication board. For example, a first type of cable or wiring (e.g., Modbus cable) can be used to install a first lower bandwidth connection, and a second type of cable or wiring (e.g., USB, Ethernet) can be used to install a second higher bandwidth connection. As part of step 1008, the cable connecting the communication board and the main control board can be positioned within a housing. Various other manufacturing steps may also be performed as part of process 1000.

[0119] At step 1010, the chiller unit is positioned in the building to be served by the chiller unit. Step 1010 may include transporting the chiller unit from the manufacturing site to the building site, wherein the communication board has been installed in the chiller unit according to step 1008. Step 1010 may also include connecting the chiller unit to a power source (e.g., the building's electrical system) and connecting the chiller unit to various piping systems for the flow of cooling fluid generated by the chiller unit. Therefore, in step 1010, the chiller unit can be physically installed in the building.

[0120] At step 1012, a network connection is established between the chiller unit's communication board and an external network without the need for additional communication devices separate from the chiller unit. This network connection can be established by connecting the chiller unit's communication board to the building's existing IT infrastructure via an Ethernet cable (or other type of cable). It can also be established by connecting the chiller unit to the building's Wi-Fi network. Furthermore, it can be established by connecting the chiller unit to a cellular network available at the building location (e.g., a 5G network specifically provided within the building; or, for example, an available cellular network provided by a telecommunications provider in a specific area of ​​the building). Step 1012 may include providing options for any such communication devices, as may be suitable given the existing building infrastructure, the availability of wireless networks at the chiller unit's location, etc. Advantageously, because the communication board is already included in the chiller unit during manufacturing, step 1012 does not involve adding any internal wiring to the chiller unit, interaction with the main control board, etc., which would otherwise require detailed domain expertise from installation technicians and consume significant time and resources during installation (e.g., additional devices, etc.). The teachings in this article make it easy to install chillers or other equipment adapted to the teachings in this article.

[0121] Now for reference Figure 11 The illustration shows a control panel 1100 (e.g., control panel 614) of a building equipment unit (such as a chiller unit (e.g., chiller unit 600)) according to some embodiments. The control panel 1100 is shown as including a housing 1102, which includes a door 1104, wherein the door 1104 is shown open to allow access to the interior of the housing 1102. The door 1104 can be closed and locked to define an enclosed internal volume within the housing 1102.

[0122] like Figure 11 As shown, circuit board 1106 is positioned within housing 1102. Circuit board 1106 is shown attached to the rear wall of housing 1102 and / or attached to a mounting plate, heat sink, or other structure disposed within housing 1102. In some embodiments, circuit board 1106 is the communication board 706 described above. Circuit board 1106 is also shown to include an additional circuit system 1108, which may correspond to main control board 704 and / or other electronics, power supplies, components, etc., as may be appropriate for the operation of chillers or other types of equipment in different embodiments.

[0123] Circuit board 1106 is shown to include various processing, power, and memory components (e.g., adapted to perform the functions of a communication board 706 as described herein), and various ports and pins (e.g., Ethernet port 1110) for providing signals to and from circuit board 1106. Circuit board 1106 includes a physical board structure that includes mounting infrastructure for attaching such components to circuit board 1106. For example, circuit board 1106 may include various mounting points (e.g., screw holes, stud holes, sockets, slots, etc.) configured to receive one or more fasteners to allow components to be attached to circuit board 1106.

[0124] like Figure 11 As shown, antenna mount 1112 is connected to circuit board 1106 via fasteners (e.g., screws, bolts, pins, etc.) 1114 that mate with mounting points on circuit board 1106. Antenna mount 1112 is positioned in the central region of circuit board 1106, spaced apart from the edges of circuit board 1106. Multiple cables are connected to antenna mount 1112, shown as first cable 1116, second cable 1118, third cable 1120, and fourth cable 1122. Different additional wiring, leads, pins, conductive paths, etc., can be used to electrically connect first cable 1116, second cable 1118, third cable 1120, and fourth cable 1122 to different parts of circuit board 1106.

[0125] By positioning it on the central region of circuit board 1106, antenna mount 1112 is arranged such that at least the proximal portion of each of cables 1116 to 1122 extends on circuit board 1106, for example, in a direction substantially parallel to circuit board 1106. This arrangement allows cables 1116 to 1122 to extend from circuit board 1106 without laterally occupying additional space above the edges of circuit board 1106 (e.g., as shown for other ports, such as Ethernet port 1110, which uses space beyond the edges of circuit board 1106 to allow Ethernet cables to be connected to Ethernet port 1110, as illustrated). The illustrated configuration of antenna mount 1112 on circuit board 1106 allows circuit board 1106 to be positioned such that one or more edges abut or are close to the walls of the housing. In some embodiments, antenna mount 1112 also functions as a heat sink configured to facilitate heat dissipation from circuit board 1106.

[0126] like Figure 12As shown, a first antenna 1124 and a second antenna 1126 are coupled to and positioned on the exterior of a housing 1102. The first antenna 1124 is conductively connected to at least one of cables 1116 to 1122, while the second antenna 1126 is conductively connected to the other cable 1116 to 1122. For example, the housing 1102 may include one or more apertures through which one or more cables 1116 to 1122 may extend to reach the first antenna 1124 and / or the second antenna 1126. In different embodiments, the first antenna 1124 and the second antenna 1126 may be... Figure 9 Antennas 936, 938, and / or 940. In some embodiments, the first antenna 1124 is configured to receive and / or broadcast a first type of wireless communication (e.g., cellular communication), while the second antenna 1126 is configured to receive and / or broadcast a second type of wireless communication (e.g., Wi-Fi, Bluetooth, other radio communications, etc.) (e.g., different frequencies physically suited to the antenna and associated with different types of communication modes). The control panel 1100 is thus adapted to communicate via a variety of wireless communication types and channels, and in some embodiments, is adapted to communicate via one or more wired communication channels (e.g., via Ethernet port 1110), while being physically arranged as a component of a chiller unit (e.g., manufactured with the chiller unit so as part of the chiller unit at the factory). Figure 11 The different components are supplied together inside the housing.

[0127] Now for reference Figure 12 This illustrates a detailed view of the interaction between a communication board 706 and a cloud layer 1200 according to some embodiments. In some embodiments, Figure 12 It can be used to implement the above Figure 9 Example architectures of different features and components. Communication board 706 is shown as including a data ingestion layer 300, an analysis layer 302, and a data publishing layer 304. Cloud layer 1200 is shown as including an analysis management section 306 and a cloud processing section 308. The analysis management section 306 interoperates with the analysis layer 302 of communication board 706, while the cloud processing section 308 interoperates with the data publishing layer 304.

[0128] Data ingestion layer 300 is configured to ingest data from multiple sources received from sources in various data formats and using various data protocols, translate the data into a common data format, and provide the data in the common data format to a common data bus 310 (e.g., data bus 914) of analysis layer 302. In some embodiments, data ingestion layer 300 and its elements may be implemented using features for ingesting and processing streaming data and / or datasets, as described in U.S. Patent No. 10,007,513, filed August 29, 2016; U.S. Patent No. 11,048,498, filed August 13, 2019; U.S. Patent No. 10,572,230, filed March 23, 2017; and / or U.S. Patent No. 10,564,941, filed March 23, 2017, the disclosures of which are incorporated herein by reference in their entirety. The common data format may be, for example, Brick format, or any other type of common data model. The data ingestion layer can apply tags to the data, such as tags indicating the type of entity and the relationships between entities, for example, location tags, event tags, asset tags, and place tags. The data ingestion layer 300 can also provide various preprocessing steps, including normalizing, aligning (e.g., arranging data from multiple sources into discrete values ​​with common frequency / time step intervals), filtering, and cleaning the data received at the data ingestion layer 300 before it is provided to the data bus 310.

[0129] like Figure 12 As shown, the data ingestion layer 300 includes multiple inputs 307 (ports, pins, wireless receivers, etc.) that receive signals (data, etc.) from source 312 and provide such signals to MQTT agent 314, OPCUA agent 316, Modbus agent 318, DDS agent 320, and BACnet agent 322 (e.g., Figure 9Protocol agent 916). MQTT agent 314 is configured to translate data from the MQTT protocol into a common data format used by data bus 310 (e.g., data from IoT sensors). OPCUA agent 316 is configured to translate data from the OPCUA protocol into a common data format. Modbus agent 318 is configured to translate data from the Modbus protocol (e.g., from building sensors) into a common data format. DDS agent 320 is configured to translate data from the DDS protocol into a common data format. BACnet agent 322 is configured to translate data from the BACnet protocol (e.g., internal data of building equipment units, data from other building equipment) into a common data format. Agents 314 to 322 can be selectively included and excluded based on the data protocol of the data source communicatively connected to communication board 706, including in some examples, adding agents for new protocols via over-the-air updates when connecting data sources using new protocols. Agents 314 to 322 can translate data in real time (e.g., as a substantially continuous stream), enabling real-time data to be provided to the data bus 310. This local data translation avoids the latency issues that may occur in alternative embodiments where such data translation is performed at an off-site server. While agents 314 to 322 may be implemented using software agents in some embodiments, it should be understood that in other embodiments, the protocol mediation / translation layer may be implemented using methods other than software agents.

[0130] The data ingestion layer 706 is further shown as including communication hardware 1202. In various embodiments, the communication hardware 1202 may include electronic components (e.g., transceivers, receivers, modems, high-speed peripheral interconnects, M.2, antennas 1124 and / or 1126, etc.) adapted for electronic communication via Wi-Fi, Bluetooth, Ethernet, radio, cellular, or other digital or analog communication modes. The communication hardware 1202 enables the data ingestion layer 300 to be quickly and easily connected to any number of sensors or other devices, for example, via various types of wireless and / or wired communication (e.g., via Bluetooth and / or Wi-Fi in addition to communication with ports associated with Modbus agent 320, WiFi card 930, wireless transceiver 932, wired port 934, OPCUA agent 316, MQTT agent 314, etc.). This provides a highly scalable architecture for acquiring data from different types of sensors, which can be integrated with the chiller, added later during chiller upgrades and enhancements, associated with other equipment in the building system, associated with different zones of the building, etc., as may be desired in different scenarios. The communication board 706 is thus configured to easily sense the chiller unit using different sensors (e.g., vibration, temperature, humidity, flow rate, power) via the modular edge capabilities of the communication board 706.

[0131] Analysis layer 302 is configured to execute one or more of various types of logic, including control logic (e.g., a PID feedback control loop), expression-based event processing and / or pattern recognition, and / or one or more machine learning or artificial intelligence algorithms / routines (e.g., machine learning algorithms specifically modified to have a smaller memory footprint for edge execution). This logic is executed using data in a common data format from data bus 310 and may include sending control signals to chiller unit 700 (i.e., sending control signals to electromechanical components that operate according to such control signals to influence building conditions), or transmitting results to cloud layer 1200 via cloud connector 323 of data publishing layer 304. Analysis layer 302 may include the edge ML engine 906, supervisory control engine 910, update engine 908, object and point manager 918, etc., as described above.

[0132] The analytics layer 302 is shown as including a data bus 310, an edge manager 324, a configurator 326, a metric 328, an analytics domain-specific language 330, an analytics engine 332, a software development kit 334, a product application 336, and other applications 338. In the illustration, the data bus 310, edge manager 324, configurator 326, metric 328, analytics domain-specific language 330, analytics engine 332, and software development kit 334 are shown exchanging information with the data bus 310, while the other applications 338 and product application 336 interoperate with the data bus 310 via the software development kit 334.

[0133] Edge Manager 324 interoperates with Cloud Manager 340 of the Analytics Management Section 306 of Cloud Layer 1200. Cloud Manager 340 provides information and receives input from User Interface Console 342 (e.g., a browser-based interface hosted by Cloud Manager 340 and accessible from a personal computing device via the Internet). Cloud Manager 340 and User Interface Console 342 interact with Access Management System 344, which determines whether a user has permission to manage Communication Board 706 (e.g., based on login credentials, etc.) and, in response to determining that the user has permission to manage Communication Board 706, allows the user to access User Interface Console 342 and interact with Cloud Manager 340. User Interface Console 342 can display an interface that provides interaction with Cloud Manager 340 to manage analytics performed by Analytics Layer 302. New or updated expression-based logic can be remotely transmitted to Communication Board 706 to enable over-the-air updates to Communication Board 706, and in some scenarios, over-the-air updates to other similar edge circuit systems with similar edge devices in the network.

[0134] Cloud Manager 340 provides a means for creating and modifying different logics executed by Analysis Layer 302. As an example, Cloud Manager 340 allows a user (via user interface console 342) to select or create expression-based logic for Analysis Layer 302 to execute. For instance, Cloud Manager 340 can provide tools and methods for real-time datastream programming languages, as described in U.S. Patent No. 10,977,0101, filed April 21, 2020, and / or U.S. Patent No. 10,127,022, filed March 23, 2017, the entire disclosure of which is incorporated herein by reference. Expression-based logic can enable complex event processing that performs real-time analysis on different data streams (e.g., acquired on data bus 310), performs complex pattern recognition on high-frequency and asynchronous stream data, detects events in real time (enabling immediate responses such as closed-loop control actions), and handles machine learning preprocessing and post-processing. For example, expression-based logic can be selected or customized via cloud manager 340 to define fault diagnosis rules based on trends in data on data bus 310 (e.g., comparing the rates of change of different variables from different data sources). This expression-based logic can be stored at analysis expression DSL 330 and executed by analysis engine 332 of analysis layer 302 of communication board 706.

[0135] As another example, cloud manager 340 is configured to train a neural network (or other machine learning or artificial intelligence model) based, for example, historical data on the configuration, events, performance, etc., of chiller unit 700 and / or other equipment units (e.g., similar equipment units serving a similar building). Cloud manager 340 may provide the trained neural network to edge manager 324. In some embodiments, cloud manager 340 modifies the model in a manner that reduces the memory and computing resources required to run the algorithm using the trained model and provides the modified model to communication board 706. The model may be edge-transformed (“edge-modified”), as described in U.S. Patent Publication No. 2020 / 0327371, filed April 9, 2019, the entire disclosure of which is incorporated herein by reference. The modified (edge-transformed, edge-modified, etc.) model may be used by communication board 706, using a continuous data stream from data bus 310 as input, and producing inferences (predictions, diagnostics, control outputs) without communicating with cloud layer 1200. For example, the cloud manager 340 can periodically update the edge-transformed model in a closed-loop manner by interoperating with the edge manager 324. The edge-transformed model can be stored by the edge manager 324 on the communication board 706 and used in one or more machine learning algorithms, such as those executed by the analysis engine 332 of the analysis layer 302. In some embodiments, the edge-transformed model is provided to the data bus 310 via the SDK 334, making the edge-transformed model available for use by application 338 and product application 336.

[0136] The cloud manager 340 and the user interface console 342 can also enable various automated or user-selected adjustments to settings and control logic. For example, users can select temperature setpoints, desired temperature ranges, preferences for comfort versus cost, energy, or carbon reduction, etc., which can be used by different control logics (e.g., PID feedback controllers, extreme value search controllers, etc.), analysis, or model-based processes (e.g., model predictive control, predictive maintenance, etc.) executed by the communication board 706.

[0137] The configurator 326 of the analysis layer 302 is configured to automatically determine the configuration of the communication board 706 and the chiller unit 700. This configuration may include multiple parameters for tuning the communication board 706 and the chiller unit 700 to or towards ideal performance. In some embodiments, the configurator 326 uses expression-based event processing logic to evaluate data from the data bus 310 and uses the results of this expression-based event processing logic to determine the configuration parameters. In some embodiments, the configurator 326 uses a machine learning model (e.g., an edge-transformed machine learning model trained based on historical configurations of similar device units) to determine the configuration. In some embodiments, the configurator 326 interoperates with the cloud manager 340 to determine the configuration in a hybrid cloud / edge manner, for example, where the configurator 326 and the cloud manager 340 determine different subsets of the configuration parameters. In some embodiments, the configurator 326 and / or the cloud manager 340 (e.g., in conjunction with the user interface console 342) perform operations for automatic configuration as described in U.S. Patent No. 11,272,011, filed May 19, 2021, the entire disclosure of which is incorporated herein by reference.

[0138] Analysis layer 302 is also shown to include a positioning application, shown as a Global Positioning System (GPS) application 1206. GPS application 1206 may be implemented using a GPS chip included within communication board 706 and adapted to determine the geographic location of communication board 706 (and the chiller unit) based on signals from GPS satellites. In some embodiments, GPS application 1206 determines location data based on cellular network data, IP address data, and / or other data sources that can provide location-related information for GPS application 1206. GPS application 1206 may be executed when the chiller unit is installed at a building site to confirm the chiller unit's location, and in some embodiments, confirmation of the chiller unit's location is provided, which may be used to facilitate the configuration and commissioning of the chiller unit and / or building management systems associated with the chiller unit. In various embodiments, location information may be provided from GPS application 1206 to data bus 310 for use by various applications 338 and product application 336, for use by analysis engine 332, for example, for use when selecting or executing one or more artificial intelligence models, for display on user interface, etc. (e.g., for executing applications that pull weather data based on device location, for applying artificial intelligence with regional intelligence, such as in U.S. Patent Publication No. 2023 / 0417439, published December 28, 2023, the entire disclosure of which is incorporated herein by reference). For example, physical location data from GPS application 1206 can be used in analysis layer 302 (or cloud layer 1200) to verify that communication board 706 is at the intended customer location (e.g., verifying warehouse logistics and the delivery of chiller units to the correct site), and / or to automatically associate communication board 706 with other devices and systems serving the same location, for example, in a way that can be used to optimize device control and telemetry use cases (e.g., to enable control of chiller units including communication board 706 in a manner coordinated with the availability of certain devices at the detected location and / or otherwise based on the availability of those devices).

[0139] like Figure 12 As shown, the analysis layer 302 is containerized with Docker, allowing different applications 338 and product applications 336 (as well as analytical expressions, machine learning models, etc.) (e.g., interface generator 917) to be modularly added to or removed from the analysis layer 302, for example, via over-the-air updates. Applications 338 and product applications 336 may include, for example, different control logic for the chiller unit 700. Applications 338 and product applications 336 may also include different other programs, analyses, measurement calculators, visualization generators, etc., that implement different capabilities of the chiller unit 700.

[0140] Communication board 706 is further shown as including a data publishing layer 304. Data publishing layer 304 includes a cloud connector 323 and a connected device gateway hardware (CEG HW) 339. Cloud connector 323 is configured to provide a bridge between communication board 706 (e.g., data bus 310) and cloud layer 1200 (e.g., cloud processing section 308), for example, as described in U.S. Provisional Patent Application No. 63 / 296,078, filed January 3, 2022, the entire disclosure of which is incorporated herein by reference. CEG HW 339 provides data updates to and from cloud layer 1200, for example, via SDK 334. Cloud connector 323 may include, for example, Figure 11 Antennas 1124 and / or 1126, and / or different cellular modem hardware and / or other communication hardware, are shown. As illustrated, communication board 706 includes a cellular connector, shown as a Subscriber Identity Module (SIM) 1204. SIM 1204 can be a physical SIM card and / or a virtual (software-implemented SIM). In some embodiments, SIM 1204 is configured before delivery of communication board 706 (and associated chiller unit) to the building site (e.g., in a factory, warehouse, or other delivery and logistics location), such that SIM 1204 is associated with an account (e.g., a customer account) associated with the building site before communication board 706 arrives at the building site. This pre-association allows communication board 706 to automatically connect to cloud 1200, specifically to a particular account within cloud 1200, to provide plug-and-play connectivity without requiring field technicians to configure SIM 1204 and / or other aspects of secure communication between communication board 706 and cloud 1200.

[0141] The cloud processing portion 308 of the cloud layer is shown as including an event processor 346, a message pipeline / storage device 348, and an enterprise application 350. The event processor 346 can be configured to receive data and analyze output from the communication board 706 and store such output. The event processor 346 can also be configured to perform additional (e.g., more advanced) analysis and processing on this information to generate additional insights and actionable steps or recommendations related to the chiller unit 700. The message pipeline / storage device 348 provides communication between the event processor 346 and the enterprise application 350. The enterprise application 350 may include various cloud-based capabilities associated with managing, tracking, and / or influencing the operation of the chiller unit 700, and, in some scenarios, other building equipment that can communicate with the cloud layer 1200. For example, the enterprise application 350 may provide a dealer dashboard that enables comparisons of equipment performance, events, etc., across numerous equipment units, different facilities, different customers, different equipment owners, different technicians or sales representatives, etc. As another example, Enterprise Application 350 can provide a user interface that allows users to view events, failures, etc. (e.g., via a mobile application, via a webpage hosted by Enterprise Application 350, etc.).

[0142] Based on the above description, one embodiment of this disclosure is a chiller unit. The chiller unit includes: a housing; a chiller unit main control board positioned within the housing; a communication board positioned within the housing; a first communication channel between the chiller unit main control board and the communication board; and a second communication channel between the chiller unit main control board and the communication board. The second communication channel provides higher bandwidth communication compared to the first communication channel.

[0143] The chiller unit may include a compressor, and the chiller unit main control board may be configured to control the compressor. In some embodiments, the communication board is configured to provide communication between the chiller unit and a network external to the chiller unit. In some embodiments, the communication board includes network circuitry adapted to connect to the network external to the chiller unit via Ethernet, Wi-Fi, and cellular connections.

[0144] In some embodiments, the first communication channel uses a building network protocol, and the second communication channel uses Ethernet. The communication board may include a wireless card configured to provide wireless communication between the second communication board and a network external to the chiller unit. This communication board can provide greater processing power compared to the chiller unit's main control board.

[0145] In some embodiments, the communication board is programmed to execute an algorithm to determine control settings to be used by the main control board, wherein the chiller main control board does not have sufficient computing resources to execute the algorithm. In some embodiments, the communication board is configured to receive over-the-air updates from an external source and to install the over-the-air updates on the chiller main control board via the second communication channel.

[0146] In some embodiments, the chiller unit includes a screen. The communication board can be configured to control the screen based on first data from the main control board and second data from a source outside the chiller unit.

[0147] Another embodiment of this disclosure is a system including a chiller unit and a computing system remotely located from the chiller unit. The chiller unit includes: a housing; a chiller unit main control board positioned within the housing; a communication board positioned within the housing and configured to enable communication between the chiller unit and the computing system; a first communication channel between the chiller unit main control board and the communication board; and a second communication channel between the chiller unit main control board and the communication board. The second communication channel provides higher bandwidth communication compared to the first communication channel.

[0148] In some embodiments, the chiller main control board is spaced apart from the chiller main control board. In some embodiments, the communication board selectively enables communication between the chiller and the computing system via Ethernet, Wi-Fi, and cellular connections.

[0149] In some embodiments, the chiller main control board is configured to control the cooling components of the chiller. The communication board may be configured to receive over-the-air updates from an external source, and to install the over-the-air updates on the chiller main control board via the second communication channel.

[0150] In some embodiments, the chiller unit further includes a screen. The communication board can be configured to control the screen based on first data from the main control board and second data from the computing system. In some embodiments, the communication board is programmed to execute an algorithm to determine control settings to be used by the main control board. The chiller unit's main control board does not have sufficient computing resources to execute this algorithm.

[0151] Another embodiment of this disclosure is a method of providing a chiller unit. The method includes: mounting cooling components of the chiller unit in a housing; mounting a main control board in the housing; mounting a communication board in the housing; and installing a plurality of communication channels between the main control board and the communication board.

[0152] In some embodiments, the method further includes: positioning the chiller unit within a building and establishing a network connection between the communication board and an external network without installing additional communication devices separate from the chiller unit. In some embodiments, establishing the network connection includes: the communication board providing options for providing the network connection via wired, Wi-Fi, and cellular connections. Establishing the plurality of communication channels between the main control board and the communication board may include: connecting an Ethernet cable between the main control board and the communication board, and connecting a Modbus cable between the main control board and the communication board.

[0153] One embodiment of this disclosure is a chiller unit. The chiller unit includes: a housing; cooling components located within the housing and configured to cool fluid; a control circuitry system located within the housing and configured to control the cooling components; and an antenna electrically connected to the control circuitry system and configured to receive and transmit wireless communication. The housing is configured to allow wireless communication to reach the antenna.

[0154] One embodiment of this disclosure is a chiller unit. The chiller unit includes an onboard communication circuitry system. This onboard communication circuitry system includes a gateway for a secure overlay network, an edge-adaptive artificial intelligence engine, and a communication bridge suitable for integrating data from the chiller unit with a digital twin.

[0155] Another embodiment of this disclosure is a method comprising: providing a communication board to a chiller unit prior to delivery to a building, such that the communication board is capable of electronic communication with a main control board of the chiller unit; configuring remote connectivity of the communication board prior to delivery of the chiller unit to the building; and automatically using the remote connectivity of the communication board to establish a connection between the chiller unit and a remote server in response to installation of the chiller unit at the building.

[0156] Configuring the remote connectivity of this communication board may include configuring a secure overlay network utilizing secure programming natively running on the communication board. The communication board may include a general-purpose data bus, wherein the communication board is programmed to provide containerized applications configured to exchange data with the general-purpose data bus. These containerized applications may include edge-adapted artificial intelligence agents.

[0157] The method may include: providing the chiller unit with multiple modular communication interfaces, adapted for various types of electronic communication and connected to a communication board, prior to delivery of the chiller unit to the building; and connecting the communication board to multiple sensors at the building via the multiple modular communication interfaces using the various types of electronic communication. The various types of electronic communication may include Bluetooth and Modbus or BACNet communication. The method may also include: automatically detecting other devices installed at the building by the communication board; and changing the settings of the main control board based on the other devices installed at the building by the communication board.

[0158] The method may include providing the communication board to the chiller unit by: wiring the serial port of the communication board to the main control board and connecting the Ethernet port of the communication board to the main control board, securing the antenna mount to the mounting point of the communication board, and providing a cable from the antenna mount to an antenna connected to the exterior of the chiller unit housing.

[0159] The method may include: detecting the location of the chiller unit by the communication board; and providing the location of the chiller unit to a computing system via the remote connectivity. In some embodiments, configuring the remote connectivity of the communication board before delivering the chiller unit to the building includes: associating the subscriber identity module of the communication board with an account associated with the building.

[0160] The method may include: providing data related to the chiller unit to a technician application running on the remote server via the remote connectivity; and changing the operation of the main control board via the remote connectivity and the communication board in response to user input to the technician application.

[0161] Another embodiment of this disclosure is a method comprising: when a chiller unit is installed at a building, establishing connectivity between a communication board of the chiller unit and a remote server using communication settings established prior to the installation of the chiller unit at the building. The method may further include: receiving, at the chiller unit, a software update for a main control board of the chiller unit, separate from the communication board, from the remote server via the connectivity; and providing the software update to the main control board via the communication board. The method may further include: operating the chiller unit to cool fluids used for cooling the building via the main control board in accordance with the software update. In some embodiments, the method includes: establishing communication between the communication board and a plurality of sensors and devices using a plurality of communication protocols, such that the plurality of sensors and devices provide data to a common data bus on the communication board.

[0162] In some embodiments, the method includes providing the communication board with a plurality of modular applications that exchange data with the general-purpose data bus and include an artificial intelligence engine. In some embodiments, establishing the connectivity includes establishing a secure overlay network that natively interacts with the general-purpose data bus. The plurality of communication protocols may include Wi-Fi and Bluetooth. The plurality of communication protocols may include an OPC unified architecture.

[0163] In some embodiments, the software update is provided to the main control board by the communication board using a first communication channel between the communication board and the main control board. The method may further include exchanging data between the communication board and the main control board using a second communication channel, wherein the first communication channel has a higher bandwidth than the second communication channel.

[0164] The method may further include establishing communication settings by creating an association between the chiller unit's subscriber identity module and an account associated with the building before delivering the chiller unit to the building. The method may also include executing a program on the communication board to determine settings for use by the main control board, wherein the main control board does not have sufficient processing power to execute the program.

[0165] One embodiment of this disclosure is a chiller unit. The chiller unit includes: cooling components configured for cooling fluid; a housing coupled to the cooling components; an antenna positioned outside the housing; a circuit board positioned within the housing and including a plurality of mounting points; an antenna mount fastened to the plurality of mounting points such that the antenna mount is disposed on a portion of the circuit board; and a cable extending from the antenna mount to the antenna via a hole in the housing.

[0166] In some embodiments, the chiller unit includes: an additional antenna positioned outside the housing; and an additional cable extending from the antenna mount to the additional antenna via the hole or an additional hole in the housing. In some embodiments, the antenna provides for cellular communication, and the additional antenna provides for WiFi communication.

[0167] In some embodiments, the antenna mount is positioned in a central region of the circuit board spaced apart from the edges of the circuit board. The cable may be coupled to the antenna mount at its proximal end, such that the proximal end of the cable is substantially parallel to the circuit board in the central region of the circuit board. The proximal end of the cable may extend from the antenna mount along a first direction toward a first edge of the circuit board, and the first edge of the circuit board is positioned along the wall of the housing.

[0168] In some embodiments, the chiller unit further includes a control board spaced apart from the circuit board. The control board can output control signals to the cooling components of the chiller unit, while the circuit board enables communication between the chiller unit and an external network. The circuit board can receive updates from the control board via the network and install the updates on the control board. The chiller unit may include a first communication channel between the control board and the circuit board, and a second communication channel between the control board and the circuit board, wherein the second communication channel provides higher bandwidth communication compared to the first communication channel.

[0169] In some embodiments, the housing includes a door that can be opened to allow access to the circuit board from outside the housing. In some embodiments, the chiller unit includes an Ethernet port coupled to the circuit board.

[0170] Another embodiment of this disclosure is a system. The system includes a chiller unit. The chiller unit includes: cooling components configured to cool fluid; a housing coupled to the cooling components; a first antenna and a second antenna positioned externally to the housing; a circuit board positioned within the housing and including a plurality of mounting points; an antenna mount fastened to the plurality of mounting points such that the antenna mount is disposed on a portion of the circuit board; and a first cable extending from the antenna mount to the first antenna, and a second cable extending from the antenna mount to the second antenna. The system further includes: a first device separate from the chiller unit and capable of communicating with the circuit board via the first antenna using a first type of wireless communication; and a second device separate from the chiller unit and capable of communicating with the circuit board via the second antenna using a second type of wireless communication.

[0171] In some embodiments, the first type of communication is cellular communication, and the second type of communication is WiFi communication. In some embodiments, the first type of communication is cellular communication, and the second type of communication is Bluetooth communication. In some embodiments, an Ethernet port is connected to the circuit board.

[0172] In some embodiments, the antenna mount is positioned in a central region of the circuit board spaced apart from the edges of the circuit board. The first cable may be coupled to the antenna mount at its proximal end, such that the proximal end of the first cable is substantially parallel to the circuit board in the central region of the circuit board. The proximal end of the first cable may extend from the antenna mount along a first direction toward a first edge of the circuit board, and the first edge of the circuit board is positioned along the wall of the housing.

[0173] In some embodiments, the chiller unit further includes a control board spaced apart from the circuit board. The circuit board is programmed to execute an algorithm to determine control settings to be used by the control board, and the control board does not have sufficient computing resources to execute the algorithm.

[0174] Another embodiment of this disclosure is a method. The method includes: installing a circuit board in a chiller unit at a factory; connecting an antenna mount to a plurality of mounting points on the circuit board at the factory; connecting the antenna mount to an antenna included in the chiller unit using a cable; delivering the chiller unit to a building site; and connecting the circuit board to a wireless communication network at the building site via the antenna.

[0175] Another embodiment of this disclosure is a chiller unit that includes a circuit board and an antenna mount, the antenna mount being connected to the circuit board such that the antenna mount is disposed on the circuit board and spaced apart from the periphery of the circuit board.

[0176] The hardware and data processing components described in conjunction with the embodiments disclosed herein for implementing various processes, operations, illustrative logic, logic blocks, modules, and circuits may be implemented or performed using any of the following: a general-purpose single-chip processor or multi-chip processor, a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a field-programmable gate array (FPGA), or other programmable logic devices, discrete gate or transistor logic, discrete hardware components, or any combination thereof. A general-purpose processor may be a microprocessor, or any conventional processor, controller, microcontroller, or state machine. A processor may also be implemented as a combination of computing devices, such as a combination of a DSP and a microprocessor, multiple microprocessors, one or more microprocessors incorporating a DSP core, or any other such configuration. In some embodiments, specific processes and methods may be performed by a circuit system specific to a given function. Memory (e.g., memory, memory cell, storage device) may include one or more means (e.g., RAM, ROM, flash memory, hard disk storage devices) for storing data and / or computer code used to perform or facilitate the various processes, layers, and modules described in this disclosure. The memory may be or include volatile or non-volatile memory, and may include database components, object code components, script components, or any other type of information structure for supporting the various activities and information structures described herein. According to an exemplary embodiment, the memory is communicatively connected to a processor via processing circuitry and includes computer code for (e.g., by the processing circuitry or the processor) performing one or more of the processes described herein.

[0177] This disclosure contemplates methods, systems, and program products on any machine-readable medium for performing various operations. Embodiments of this disclosure may be implemented using existing computer processors or by a dedicated computer processor combined with a suitable system for this or another purpose, or by a hard-wired system. Embodiments within the scope of this disclosure include program products comprising machine-readable media for carrying or having machine-executable instructions or data structures stored thereon. Such machine-readable media can be any available medium accessible by a general-purpose or special-purpose computer or other machine having a processor. For example, such machine-readable media may include RAM, ROM, EPROM, EEPROM, or other optical disc storage devices, disk storage devices, or other magnetic storage devices, or any other medium that can be used to carry or store desired program code in the form of machine-executable instructions or data structures and accessible by a general-purpose or special-purpose computer or other machine having a processor. Combinations of the foregoing are also included within the scope of machine-readable media. Machine-executable instructions include, for example, instructions and data that cause a general-purpose computer, special-purpose computer, or special-purpose processing machine to perform a function or a set of functions.

[0178] Although the accompanying drawings and descriptions may show a specific order of method steps, the order of these steps may differ from the order depicted and described unless otherwise stated above. Two or more steps may also be performed simultaneously or partially simultaneously unless otherwise stated above. Such variations may depend on, for example, the selected software and hardware system and the designer's choices. All such variations are within the scope of this disclosure. Similarly, the software implementation of the described methods can be implemented using standard programming techniques with rule-based logic and other logic for implementing various connection steps, processing steps, comparison steps, and decision steps.

Claims

1. A water chiller unit, comprising: case; The main control board of the chiller unit is located in this housing; A communication board, which is positioned within the housing; The first communication channel between the main control board of the chiller unit and the communication board; as well as The second communication channel between the main control board of the chiller unit and the communication board provides higher bandwidth communication compared to the first communication channel.

2. The chiller unit according to claim 1, further comprising a compressor, wherein, The chiller unit's main control board is configured to provide control signals to the compressor.

3. The chiller unit according to any one of the preceding claims, wherein, The communication board is configured to provide communication between the chiller unit and a network outside the chiller unit, wherein the communication board includes network circuitry adapted to connect to the network outside the chiller unit via Ethernet, Wi-Fi and cellular connections.

4. The chiller unit according to any one of the preceding claims, wherein, The first communication channel uses a building network protocol, and the second communication channel uses Ethernet, wherein the communication board is further configured to provide wireless communication between the second communication board and a network outside the chiller unit.

5. The chiller unit according to any one of the preceding claims, wherein, This communication board offers greater processing power compared to the main control board of the chiller unit.

6. The chiller unit according to any one of the preceding claims, wherein, The communication board is programmed to execute an algorithm to determine the control settings that will be used by the main control board, where the chiller main control board does not have sufficient computing resources to execute the algorithm.

7. The chiller unit according to any one of the preceding claims, wherein, The communication board is configured to receive over-the-air updates from an external source and to install the over-the-air updates on the chiller unit's main control board via the second communication channel.

8. The chiller unit according to any one of the preceding claims, wherein, The communication board is configured to provide cellular communications, which are configured prior to the delivery of the chiller unit to the building site.

9. The chiller unit according to any one of the preceding claims, further comprising: An antenna, which is positioned outside the housing; An antenna mount is fastened to multiple mounting points on the communication board, such that the antenna mount is positioned on a portion of the communication board; as well as A cable that extends from the antenna mount to the antenna through a hole in the housing; The antenna mount is positioned in the central region of the circuit board, which is spaced apart from the edge of the circuit board.

10. The chiller unit according to claim 9, wherein, The main control board is separated from the communication board.

11. A method comprising: A communication board is provided to the chiller unit before it is delivered to the building, enabling the communication board to communicate electronically with the chiller unit's main control board. Configure the remote connectivity of the communication board before delivering the chiller unit to the building; as well as In response to the installation of the chiller unit at the building, the remote connectivity of the communication board is automatically used to establish a connection between the chiller unit and the remote server.

12. The method according to claim 11, wherein, Configuring the remote connectivity of this communication board includes configuring a secure overlay network that utilizes secure programming natively running on the communication board.

13. The method according to claim 11 or 12, wherein, The communication board includes a general-purpose data bus, wherein the communication board is programmed to provide containerized applications configured to exchange data with the general-purpose data bus.

14. The method according to any one of claims 11 to 13, comprising: Before delivering the chiller unit to the building, the antenna mounts are connected to multiple mounting points on the communication board; The antenna mounting component is connected to the antenna included in the chiller unit using a cable; The automatic use of the communication board's remote connectivity to establish the connection includes connecting the board to the wireless communication network at the building site via the antenna.

15. The method according to any one of claims 11 to 14, further comprising using multiple communication protocols and wired and wireless communication modes to establish communication between the communication board and multiple sensors and devices at the building.

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