Battery pack circuit breaking unit insulation film sticking method and system

Abstract

This invention relates to a method and system for bonding insulating film to a battery pack circuit breaker unit, relating to the field of battery pack manufacturing. The method includes: collecting material distribution data and material property parameters; determining the temperature of the copper busbar region and the plastic region based on the material distribution data and material property parameters; performing differentiated preheating of the product surface in response to the region temperature, and collecting three-dimensional morphological data; calculating a morphological complexity index based on the three-dimensional morphological data; when the morphological complexity index does not exceed a complexity threshold, adsorbing the insulating film onto a bonding fixture, controlling the bonding fixture to move at a bonding angle, and using a roller device located at the rear of the bonding fixture to roll and press the insulating film onto the product surface; when the morphological complexity index exceeds the complexity threshold, immersing the bonding fixture with the adsorbed insulating film and the product in a liquid medium for bonding using a liquid-phase bonding method. This application has the effect of improving the bonding quality of the insulating film.

Description

Technical Field

[0001] This invention relates to the field of battery pack manufacturing, and in particular to a method and system for bonding insulating film to a battery pack circuit breaker unit. Background Technology

[0002] Battery pack circuit breaker insulation film refers to the insulating protective film used to cover the surface of the circuit breaker unit (including copper busbar connecting pieces, plastic shell, etc.) inside the battery pack, to prevent high voltage short circuits and provide electrical insulation and protection.

[0003] The insulating film of the battery pack circuit breaker unit is typically adhered to the flat surface of the insert-molded housing. The insert-molded housing consists of copper busbars and plastic, and the product surface is flat. When applying the insulating film, the product surface is first cleaned, and then the insulating film is directly placed over the housing surface. Pressure is applied manually or using simple tooling to ensure adhesion.

[0004] However, due to limitations in the insert injection molding process, the copper busbar and the plastic have different thermal shrinkage rates, inevitably resulting in a microscopic height difference between their surfaces after molding. When the insulating film is directly pasted onto the surface of a product with such surface differences, wrinkles are easily generated at the interface. At the same time, air is trapped in the pits formed by the height difference, forming bubbles, which reduces the quality of the insulating film application and needs improvement. Summary of the Invention

[0005] To improve the quality of insulating film application, this invention provides a method and system for applying insulating film to the circuit breaker unit of a battery pack.

[0006] In a first aspect, the present invention provides a method for bonding an insulating film to a battery pack circuit breaker unit, employing the following technical solution:

[0007] A method for attaching insulating film to a battery pack circuit breaker unit includes:

[0008] Collect material distribution data of the surface of the product to be pasted and material property parameters of the insulating film;

[0009] The temperatures of the copper busbar region and the plastic region are determined based on material distribution data and material property parameters.

[0010] The product surface is preheated in a zoned manner in response to the temperature of the copper busbar area and the temperature of the plastic area, and three-dimensional morphology data of the surface of the product to be pasted are collected.

[0011] The surface morphology complexity index of the product is calculated based on three-dimensional morphology data.

[0012] When the morphological complexity index does not exceed the preset complexity threshold, the insulating film is adsorbed onto the pasting fixture, the pasting fixture is controlled to move at a preset pasting angle, and the insulating film is rolled by the roller device set at the rear of the pasting fixture so that the insulating film is adhered to the product surface.

[0013] When the morphological complexity index exceeds the preset complexity threshold, the bonding fixture and product with the adsorbed insulating film are immersed in the liquid medium and bonded using the preset liquid phase bonding method.

[0014] By adopting the above technical solution, the differentiated preheating temperatures of the copper busbar and plastic areas are obtained by understanding the material distribution, thereby eliminating the bonding stress caused by differences in thermal shrinkage. Then, the bonding method is selected based on the morphology complexity index: simple morphologies are bonded using roller pressing for high efficiency, while complex morphologies are bonded using liquid phase bonding to eliminate wrinkles and bubbles, thus improving the bonding quality of the insulating film and the reliability of the product.

[0015] Optionally, a method for determining the pasting angle is also included:

[0016] Collect local curvature data of the product surface along the rolling path;

[0017] The optimal cutting angle of the roller assembly at each rolling position is calculated based on local curvature data.

[0018] Angle adjustment trajectory is generated based on the optimal entry angle;

[0019] In response to the angle adjustment trajectory, the angle between the bonding tool and the product surface is adjusted in real time during the rolling process.

[0020] By adopting the above technical solution, the optimal cutting angle at each position is calculated by collecting local curvature data of the roller pressing path, generating an angle adjustment trajectory, and adjusting the angle between the pasting fixture and the product surface in real time, so that the roller always cuts into the bonding surface at the optimal angle, avoiding local indentations or poor bonding caused by angle deviation, and improving the uniformity and consistency of the bonding of the insulating film in the curved area.

[0021] Optionally, a method for dynamically adjusting the roller pressure is also included:

[0022] Collect the current temperature value of the insulating film adhesive layer;

[0023] Determine the viscosity of the adhesive layer based on the current temperature value;

[0024] The target roller pressure value is calculated based on the adhesive layer viscosity value;

[0025] The actual rolling pressure value applied by the roller device during the rolling process is collected;

[0026] When the actual roller pressure value deviates from the target roller pressure value, the pressurizing mechanism of the control roller device adjusts the roller pressure to make the actual roller pressure value approach the target roller pressure value.

[0027] By adopting the above technical solution, the viscosity value is determined by collecting the temperature of the adhesive layer and the target roller pressure is calculated. The actual pressure is monitored in real time and dynamically adjusted to ensure that the roller pressure always matches the current viscosity state of the adhesive layer. This avoids damage to the insulating film due to excessive pressure caused by temperature changes or poor adhesion due to insufficient pressure, thereby improving the stability of the bonding quality.

[0028] Optionally, the liquid phase bonding method includes:

[0029] Collect the medium type parameters and current status parameters of the liquid medium;

[0030] Pretreatment parameters for liquid media are determined based on media type parameters and current state parameters;

[0031] The liquid medium is pre-treated in response to the pre-treatment parameters to achieve the preset standard bonding state, and the adhesive properties of the insulating film layer are collected.

[0032] The initial operating parameters of the ultrasonic transducer are determined based on the adhesive layer characteristic parameters.

[0033] The ultrasonic transducer is activated in response to the initial operating parameters, generating a cavitation effect in the liquid medium. The microjets generated by the collapse of cavitation bubbles press the insulating film against the product surface to achieve initial bonding.

[0034] By adopting the above technical solution, the liquid medium is pretreated to achieve a standard bonding state. The initial operating parameters of the ultrasonic transducer are determined based on the characteristics of the adhesive layer. The micro-jet generated by the collapse of cavitation bubbles is used to press the insulating film onto the product surface, realizing the initial bonding in the liquid phase environment. This allows the insulating film to be uniformly bonded to complex morphological surfaces, improving the bonding quality.

[0035] Optionally, the liquid phase bonding method further includes:

[0036] During the initial bonding process, a probe signal is emitted to the interface between the insulating film and the product surface, and the reflected signal after being reflected by the interface is collected.

[0037] The unattached area and unattached size are determined based on the reflected signal.

[0038] The compensation operating parameters of the ultrasonic transducer are determined based on the unbonded area and the unbonded area.

[0039] In response to the compensation operating parameters, directional cavitation enhancement processing is performed on the non-fitted area until the reflected signal shows complete fit;

[0040] After bonding is completed, the residual liquid parameters on the product and insulating film surfaces are collected;

[0041] Drying process parameters are determined based on residual liquid parameters;

[0042] The product and insulating film are dried in response to the drying process parameters.

[0043] By adopting the above technical solution, the unbonded area is detected in real time by reflecting signals and its area is determined. The unbonded area is then subjected to directional cavitation enhancement treatment until it is fully bonded. After completion, the drying process parameters are determined based on the residual liquid parameters for drying. This achieves closed-loop control of the bonding process and management of residual liquid, ensuring bonding quality and product cleanliness.

[0044] Optionally, auxiliary methods for actively removing bubbles may also be included:

[0045] During the directional cavitation enhancement process, gap feature detection signals of the non-adhesive area are collected;

[0046] Based on gap feature detection signals, the gap depth and gas residue in the unfitted area can be determined;

[0047] The amplitude and timing of the negative pressure pulse are determined based on the gap depth and residual gas content.

[0048] In response to the amplitude and timing of the negative pressure pulse, a momentary negative pressure is applied to the bonding cavity containing the product and the insulating film, causing the bubbles trapped in the unbonded area to expand and burst. After the negative pressure pulse ends, the liquid medium refills the gaps left after the bubbles burst.

[0049] By adopting the above technical solution, the gap depth and gas residue in the unbonded area are determined by the detection signal. A matching instantaneous negative pressure is applied to cause the bubbles to expand and burst. The liquid medium refills the gaps, realizing the active discharge of trapped bubbles. This solves the problem that bubbles are difficult to escape naturally under complex morphologies and improves the bonding density.

[0050] Optionally, a micro-vibration-assisted exhaust step may also be included:

[0051] Collect the location and outline features of the non-fitted areas;

[0052] The location of vibration impact points is determined based on the regional distribution.

[0053] Based on the regional contour characteristics, calculate the required vibration frequency and vibration amplitude at each point of action;

[0054] Micro-vibration excitation parameters are generated based on vibration frequency, vibration amplitude, and vibration point of application.

[0055] In response to the micro-vibration excitation parameters, low-frequency micro-vibrations are applied to the product, causing the air bubbles trapped in the unbonded area to gradually migrate into the liquid medium;

[0056] During the application of micro-vibration, update reflection signals from the non-adhesive areas are collected;

[0057] The updated reflected signal is used to determine whether the bubbles have been completely expelled.

[0058] When it is determined that the bubbles have been completely expelled, the micro-vibration excitation is stopped, and the cavitation micro-jet fills the gaps left after expulsion.

[0059] By adopting the above technical solution, targeted low-frequency micro-vibrations are applied according to the distribution location and contour characteristics of the unbonded area, so that the air bubbles gradually migrate into the liquid medium under the action of vibration. The discharge status is monitored in real time by reflecting the signal, so as to achieve gentle and assisted discharge of air bubbles, avoid strong cavitation from damaging the adhesive layer or product, and improve the bonding yield.

[0060] Optionally, a dual-frequency composite cavitation control method may also be included:

[0061] Collect the current viscosity value of the insulating film adhesive layer and the real-time temperature distribution on the product surface;

[0062] The power ratio between low-frequency and high-frequency modes is determined based on the current viscosity value and real-time temperature distribution.

[0063] Based on the power ratio, dual-frequency composite cavitation parameters are generated;

[0064] Responding to dual-frequency composite cavitation parameters to operate low-frequency ultrasound mode and high-frequency ultrasound mode simultaneously or alternately;

[0065] In low-frequency ultrasonic mode, low-frequency ultrasound is used to generate the main driving force for cavitation bonding.

[0066] In high-frequency ultrasonic mode, the liquid medium is stirred by microfluids generated by high-frequency ultrasound, so that cavitation nuclei are evenly distributed in the bonding cavity.

[0067] By adopting the above technical solution, the dual-frequency power ratio is determined according to the viscosity and temperature distribution of the adhesive layer. Low-frequency ultrasound provides the main driving force for cavitation bonding, while high-frequency ultrasound generates microfluidic stirring to make the cavitation nuclei evenly distributed, thereby achieving synergistic enhancement of the cavitation effect and control of spatial uniformity, and improving bonding efficiency and consistency.

[0068] Optionally, a spatial correction method for dual-frequency composite cavitation parameters is also included:

[0069] Based on three-dimensional topography data, the key bonding areas and key area locations on the product surface are determined;

[0070] Determine the required local correction coefficients for each key fitting area based on the location of the key areas;

[0071] Spatial correction of the dual-frequency composite cavitation parameters is performed based on local correction coefficients to obtain the corrected dual-frequency composite cavitation parameters;

[0072] The output power of each transducer in the phased array ultrasonic transducer array is controlled by the modified dual-frequency composite cavitation parameters, thereby enhancing the cavitation intensity in the key bonding area.

[0073] By adopting the above technical solution, key bonding areas are identified based on three-dimensional topography data, the required local correction coefficients for each area are determined, the dual-frequency composite cavitation parameters are spatially corrected, and the power output of the phased array transducer array is controlled, so that key areas in complex topography can obtain directional cavitation enhancement, achieve precise delivery of bonding energy, and improve the overall bonding quality.

[0074] Secondly, this application provides a battery pack circuit breaker unit insulating film bonding system, which adopts the following technical solution:

[0075] A battery pack circuit breaker unit insulating film bonding system, comprising:

[0076] The data acquisition module is used to acquire material distribution data, material property parameters, and three-dimensional morphology data.

[0077] The memory is used to store a program that implements a method for pasting insulating film on a battery pack circuit breaker unit;

[0078] The processor is used to load and execute programs stored in memory.

[0079] In summary, this application includes at least one of the following beneficial technical effects:

[0080] 1. By understanding the material distribution, differentiated preheating temperatures are obtained for the copper busbar and plastic areas to eliminate adhesive stress caused by differences in thermal shrinkage. Then, the bonding method is selected based on the morphology complexity index: simple morphologies are bonded using roller pressing for high efficiency, while complex morphologies are bonded using liquid phase bonding to eliminate wrinkles and bubbles, thereby improving the bonding quality of the insulating film and product reliability.

[0081] 2. By pre-treating the liquid medium to achieve a standard bonding state, the initial operating parameters of the ultrasonic transducer are determined based on the characteristics of the adhesive layer. The micro-jet generated by the collapse of cavitation bubbles is used to press the insulating film onto the product surface, achieving initial bonding in a liquid environment. This allows the insulating film to be uniformly bonded to complex morphological surfaces, improving the bonding quality.

[0082] 3. The dual-frequency power ratio is determined based on the viscosity and temperature distribution of the adhesive layer. Low-frequency ultrasound provides the main driving force for cavitation bonding, while high-frequency ultrasound generates microfluidic stirring to ensure uniform distribution of cavitation nuclei, thereby achieving synergistic enhancement of the cavitation effect and control of spatial uniformity, and improving bonding efficiency and consistency. Attached Figure Description

[0083] Figure 1 This is a flowchart of a method for pasting insulating film on a battery pack circuit breaker unit. Detailed Implementation

[0084] The present invention will now be described in further detail with reference to the accompanying drawings and embodiments.

[0085] Reference Figure 1 This application discloses a method for pasting insulating film on a battery pack circuit breaker unit, comprising the following steps:

[0086] S10: Collect material distribution data and material property parameters of the insulating film on the surface of the product to be pasted.

[0087] Material distribution data refers to the set of information obtained through a visual recognition system to identify the distribution location of copper busbar and plastic areas on the product surface. Specifically, the data is collected by taking pictures of the product surface with an industrial camera set up at the loading station and extracting the edge contours of the copper busbar and plastic through image recognition algorithms.

[0088] Material property parameters refer to physical characteristics of the insulating film, such as the activation temperature range of the adhesive layer, the viscosity coefficient of the adhesive layer, and the temperature resistance limit. These parameters are obtained by reading the material code on the insulating film roll and retrieving the corresponding material specification data from the production management system. The production management system stores the property parameters corresponding to each material.

[0089] S11: Determine the temperature of the copper busbar region and the temperature of the plastic region based on material distribution data and material property parameters.

[0090] The copper busbar area temperature refers to the target temperature value required to preheat the copper busbar area on the product surface. The target preheating temperature for the copper busbar area is automatically calculated by the controller's internal temperature calculation model, using the activation temperature range of the insulating film adhesive layer obtained from the material property parameters collected by S10, the thermal conductivity coefficient of the copper busbar material retrieved from the controller's pre-stored material database, and the ambient temperature value collected in real time by a temperature sensor. The temperature calculation model includes a temperature compensation coefficient pre-set by those skilled in the art based on the thermal conductivity characteristics of the copper busbar material.

[0091] The plastic area temperature refers to the target temperature value required to preheat the plastic area on the product surface. The controller automatically calculates the target preheating temperature of the plastic area by reading the activation temperature range of the insulating film adhesive layer from the material property parameters collected by S10, retrieving the heat resistance limit parameters of the plastic material from the pre-stored material database, and combining this with the ambient temperature value collected in real time by the temperature sensor. The temperature calculation model includes a safety margin factor pre-set by those skilled in the art based on the temperature resistance characteristics of the plastic material, and the calculated plastic area temperature is lower than the copper busbar area temperature.

[0092] S12: Responds to the temperature of the copper busbar area and the plastic area to perform zoned differential preheating of the product surface and collects three-dimensional morphology data of the surface of the product to be pasted.

[0093] Differentiated preheating in zones refers to applying different target temperatures to the copper busbar area and the plastic area through an array of heating units. Specifically, the controller sends the temperature values ​​of the copper busbar area and the plastic area determined by S11 to the corresponding heating unit drive circuits, and the drive circuits control the heating units to heat at the specified temperatures.

[0094] Three-dimensional topography data refers to a set of point cloud data collected by a laser contour scanner to describe the spatial coordinates of various points on the product surface. The specific collection method is as follows: after the product has been preheated, a laser contour scanner set behind the preheating station performs a line scan along the product surface to obtain the three-dimensional coordinate information of various points on the product surface.

[0095] S13: Calculate the surface morphology complexity index of the product based on three-dimensional morphology data.

[0096] The morphological complexity index refers to a comprehensive feature value generated by performing surface curvature analysis and material interface region identification on the three-dimensional morphological data to quantify the surface undulation and structural complexity of the product. The specific calculation method is as follows: the controller processes the three-dimensional morphological data collected by S12, extracts the maximum height difference, curvature change rate, and edge steepness of the interface region between the copper busbar and the plastic on the product surface, and obtains a quantitative complexity score by weighted fusion of these feature values. The specific weighted fusion coefficients are preset by those skilled in the art based on empirical data.

[0097] S14: When the morphological complexity index does not exceed the preset complexity threshold, the insulating film is adsorbed onto the pasting fixture, the pasting fixture is controlled to move at a preset pasting angle, and the insulating film is rolled by the roller device set at the rear of the pasting fixture so that the insulating film adheres to the product surface.

[0098] The complexity threshold refers to the upper limit of the morphological complexity used to determine whether the product surface is suitable for bonding by roll forming. This threshold is set in advance by those skilled in the art based on the equipment capabilities and process requirements and stored in the controller.

[0099] The bonding fixture refers to a mobile bonding actuator used to adsorb and fix the insulating film, specifically including a vacuum adsorption plate, a moving guide rail, and a drive motor.

[0100] The pasting angle refers to the angle between the central axis of the pasting fixture and the normal to the product surface during the movement of the pasting fixture. The determination of this angle value will be explained in detail in S20 to S23, and will not be repeated here.

[0101] The roller device refers to a rotary pressure assembly located at the rear of the pasting fixture, used to apply roller pressure to the insulating film. Specifically, it includes the roller body, pressure sensor, and pressure drive mechanism.

[0102] When the morphological complexity index does not exceed the complexity threshold, it indicates that the product surface is relatively flat overall, without obvious undulations or complex structures, making it suitable for bonding using conventional roller pressing methods. This requires adsorbing the insulating film onto the bonding fixture, controlling the fixture to move at the bonding angle, and using a roller device located at the rear of the bonding fixture to roll and press the insulating film, thus bonding it to the product surface.

[0103] S15: When the morphological complexity index exceeds the preset complexity threshold, the adhesive tool and product with the adsorbed insulating film are immersed in the liquid medium and bonded using the preset liquid phase bonding method.

[0104] Liquid medium refers to a special liquid that fills the bonding cavity to transmit ultrasonic energy and assist in bonding. Its selection is determined in advance by those skilled in the art based on the compatibility of the insulating film material and process requirements.

[0105] The liquid phase bonding method refers to a series of operations that achieve the bonding of insulating films in a liquid medium through the ultrasonic cavitation effect. The specific steps of this method are explained in detail in subsequent steps S40 to S44 and S50 to S56, and will not be repeated here.

[0106] It also includes a method for determining the pasting angle:

[0107] S20: Collect local curvature data of the product surface along the rolling path.

[0108] Local curvature data refers to a data sequence acquired by a three-dimensional contour measuring device, used to describe the degree of curvature of the product surface at various points along the rolling path. From the three-dimensional topography data collected in S12, the spatial coordinates of each sampling point along a preset rolling path (pre-set by those skilled in the art, and not elaborated here) are extracted. Curvature calculations are performed on the arc formed by three adjacent points to obtain a sequence of curvature values ​​for each point on the path. A larger curvature value indicates more severe surface curvature at that location, while a smaller curvature value indicates a smoother surface.

[0109] S21: Calculate the optimal cutting angle of the roller assembly at each rolling position based on local curvature data.

[0110] The optimal entry angle refers to the target angle between the center axis of the adhesive fixture and the normal to the product surface, set at a specific rolling position to maximize the contact area and minimize sliding friction between the roller and the product surface. The controller has a pre-stored curvature angle mapping table, which contains recommended entry angle values ​​corresponding to different curvature ranges. Based on the curvature values ​​obtained in S20, the optimal entry angle for each rolling position can be matched by consulting the curvature angle mapping table. The curvature angle mapping table is pre-set by those skilled in the art based on roller diameter, adhesive layer characteristics, and process test data.

[0111] S22: Generate an angle adjustment trajectory based on the optimal entry angle.

[0112] An angle adjustment trajectory refers to a continuous control curve describing the change in the angle between the pasting fixture and the product surface over time as the pasting fixture moves along the roller path. The controller uses the optimal entry angle calculated in step S21 for each roller position as the target value. Combining this with the length of the roller path and the moving speed of the pasting fixture, it generates a continuous and smooth angle adjustment trajectory using an interpolation algorithm. This ensures that the pasting fixture adjusts to the corresponding optimal entry angle precisely upon reaching each position. The interpolation algorithm is pre-selected by those skilled in the art based on the control accuracy requirements.

[0113] S23: In response to the angle adjustment trajectory, the angle between the bonding tool and the product surface is adjusted in real time during the rolling process.

[0114] The controller converts the angle adjustment trajectory generated by S22 into real-time angle control commands and sends them to the angle adjustment drive mechanism of the pasting fixture. The drive mechanism adjusts the posture of the pasting fixture in real time according to the commands, ensuring that the angle between the fixture's central axis and the normal to the product surface always follows the angle adjustment trajectory. This guarantees that the roller assembly rolls the insulating film at the optimal entry angle at each rolling position, facilitating subsequent steps.

[0115] It also includes a method for dynamically adjusting the roller pressure:

[0116] S30: Collect the current temperature value of the insulating film adhesive layer.

[0117] The current temperature value refers to the temperature value of the insulating film adhesive layer at the current moment, which is obtained in real time by a non-contact infrared temperature sensor placed near the pasting fixture.

[0118] S31: Determine the viscosity value of the adhesive layer based on the current temperature value.

[0119] The adhesive layer viscosity value refers to the dynamic viscosity of the insulating film adhesive layer at the current temperature. The controller has a pre-stored temperature-viscosity mapping table, which contains the adhesive layer viscosity values ​​corresponding to different temperatures. Based on the current temperature value collected by S30, the adhesive layer viscosity value at the current temperature can be obtained by querying the temperature-viscosity mapping table. The temperature-viscosity mapping table is pre-set by those skilled in the art based on experimental measurements of the material properties of the insulating film adhesive layer.

[0120] S32: Calculate the target roller pressure value based on the adhesive layer viscosity value.

[0121] The target rolling pressure value refers to the ideal rolling pressure value set to ensure that the adhesive layer can flow fully and fill the microscopic gaps on the product surface. The controller has a pre-stored viscosity-pressure mapping table, which contains recommended rolling pressure values ​​corresponding to different adhesive layer viscosities. Based on the adhesive layer viscosity value determined in S31, the target rolling pressure value required for the current adhesive layer state can be obtained by consulting the viscosity-pressure mapping table. The viscosity-pressure mapping table is pre-set by those skilled in the art based on process test data on the relationship between adhesive layer flow characteristics and pressure response.

[0122] S33: Collect the actual rolling pressure value applied by the roller device during the rolling process.

[0123] The actual rolling pressure value refers to the value that reflects the pressure currently applied by the rollers to the insulating film, which is collected in real time by a pressure sensor installed in the roller assembly. During the rolling process, the pressure sensor continuously detects the pressure value of the contact surface between the rollers and the insulating film at a preset sampling frequency (set in advance by those skilled in the art, which will not be elaborated here), and sends the measured pressure data to the controller in real time, thus obtaining the actual rolling pressure value.

[0124] S34: When the actual roller pressure value deviates from the target roller pressure value, the pressurization mechanism of the control roller device adjusts the roller pressure to make the actual roller pressure value approach the target roller pressure value.

[0125] The controller compares the actual roller pressure value collected by S33 with the target roller pressure value calculated by S32 in real time and calculates the deviation between the two. When the absolute value of the deviation exceeds the allowable deviation threshold set by those skilled in the art, the controller sends a pressure adjustment command to the pressurization drive mechanism of the roller device. The drive mechanism increases or decreases the pressure applied to the roller according to the command, so that the actual roller pressure value is adjusted towards the target roller pressure value until the deviation value falls back to the allowable deviation threshold range for subsequent steps.

[0126] Liquid phase bonding methods include:

[0127] S40: Collect the medium type parameters and current status parameters of the liquid medium.

[0128] Medium type parameters refer to the inherent properties of a liquid medium, such as its chemical composition, density, viscosity, and surface tension. By scanning the material code on the liquid medium's storage container, the corresponding specification data for that liquid medium is retrieved from the production management system. The production management system stores the physical property parameters of various liquid media.

[0129] Current status parameters refer to the dynamic changes in real-time temperature, dissolved gas content, and impurity concentration of the liquid medium. The temperature of the liquid medium is collected in real-time by a temperature sensor installed within the fitted cavity; the dissolved gas content in the liquid medium is collected in real-time by a dissolved gas sensor; and the impurity concentration in the liquid medium is collected in real-time by a turbidity sensor.

[0130] S41: Determine the pretreatment parameters for the liquid medium based on the medium type parameters and the current state parameters.

[0131] Pretreatment parameters refer to the heating temperature and degassing time required to bring the liquid medium to a suitable working state for ultrasonic cavitation. The controller has a pre-stored media pretreatment mapping table, which contains recommended pretreatment parameters for different media types under different current conditions. Based on the media type parameters and current state parameters collected by S40, the required target heating temperature and degassing time can be obtained by querying the media pretreatment mapping table. The media pretreatment mapping table is pre-set by those skilled in the art through experimental determination based on the characteristics and process requirements of various liquid media.

[0132] S42: In response to the preprocessing parameters, preprocess the liquid medium to achieve a preset standard bonding state, and collect the adhesive layer characteristic parameters of the insulating film adhesive layer.

[0133] The standard fit condition refers to the optimal operating state in which the temperature, dissolved gas content, and cleanliness of the liquid medium all meet the requirements of ultrasonic cavitation. The corresponding temperature range, upper limit of dissolved gas content, and upper limit of impurity concentration are preset in advance by those skilled in the art based on the ultrasonic cavitation efficiency and equipment capabilities and stored in the controller.

[0134] The adhesive layer characteristic parameters refer to the real-time viscosity value and thickness distribution information of the insulating film adhesive layer at the current temperature. The adhesive layer temperature is collected by an infrared temperature sensor, and the viscosity value of the adhesive layer at the current temperature is obtained by looking up a temperature-viscosity mapping table; the thickness distribution data of the adhesive layer is obtained by scanning the surface of the insulating film with a laser thickness gauge set at the bonding station.

[0135] S43: Determine the initial operating parameters of the ultrasonic transducer based on the adhesive layer characteristic parameters.

[0136] An ultrasonic transducer is an energy conversion device that converts electrical energy into mechanical vibration energy and generates an ultrasonic field in a liquid medium. Specifically, it includes piezoelectric ceramic oscillators and amplitude transformers.

[0137] Initial operating parameters refer to the initial frequency and power values ​​when the ultrasonic transducer starts up. The controller has a pre-stored ultrasonic mapping table for the adhesive layer, which contains recommended ultrasonic frequencies and powers corresponding to different adhesive layer viscosities and thicknesses. Based on the adhesive layer characteristic parameters collected by S42, the required initial frequency and power values ​​can be obtained by querying the ultrasonic mapping table. The ultrasonic mapping table for the adhesive layer is pre-set by those skilled in the art through process experiments based on the relationship between adhesive layer flow characteristics and ultrasonic cavitation efficiency.

[0138] S44: The ultrasonic transducer is activated in response to the initial operating parameters to generate a cavitation effect in the liquid medium. The micro-jet generated by the collapse of cavitation bubbles presses the insulating film against the product surface to achieve initial bonding.

[0139] The initial frequency and initial power values ​​determined by S43 are sent to the drive circuit of the ultrasonic transducer. The drive circuit drives the ultrasonic transducer to operate according to the specified parameters. The ultrasonic transducer generates high-frequency vibrations in the liquid medium, causing a large number of cavitation bubbles to form in the liquid medium. These bubbles collapse instantaneously after growing to a critical size. The micro-jet generated during collapse impacts the back of the insulating film at extremely high speed, uniformly pressing the insulating film against the product surface, so that the insulating film and the product surface form an initial adhesion state for subsequent steps.

[0140] Liquid phase bonding methods also include:

[0141] S50: During the initial bonding process, a detection signal is emitted to the interface between the insulating film and the product surface, and the reflected signal after being reflected by the interface is collected.

[0142] Reflected signals refer to the echo signals that are reflected back after the probe signal encounters the interface between the insulating film and the product surface and are collected by the receiving device. During the gaps or intervals in the operation of the ultrasonic transducer, the controller sends a low-energy probe pulse command to the transducer. The transducer then emits a short-duration low-frequency probe signal towards the interface and simultaneously switches to receiving mode to collect signals reflected back from various locations on the interface. The collected reflected signals are then converted into electrical signals and sent to the controller for analysis and processing.

[0143] S51: Determine the unattached area and unattached region based on the reflected signal.

[0144] Unbonded areas refer to the areas where the insulating film has not yet made effective contact with the product surface, and where gaps or air bubbles exist.

[0145] The unattached area refers to the sum of the projected areas of all unattached regions in three-dimensional space.

[0146] The reflected signals collected by the S50 are analyzed. Based on the intensity attenuation characteristics or time-of-flight differences of the reflected signals, the locations of reflection anomalies are identified. These anomaly points are spatially clustered to generate the contours and boundaries of the non-fitted areas. The area value of each non-fitted area is obtained by calculating the number of pixels inside the contour. Finally, the area values ​​of all areas are summed to obtain the total non-fitted area.

[0147] S52: Determine the compensation operating parameters of the ultrasonic transducer based on the unbonded area and the unbonded area.

[0148] The compensation operating parameters refer to the ultrasonic power boost and duration required for localized cavitation enhancement treatment of the unbonded area. The controller has a pre-stored area compensation mapping table, which contains the power compensation coefficients and durations corresponding to different unbonded area ranges. Based on the unbonded area determined in S51, the required compensation power value and duration can be obtained by querying the area compensation mapping table. The area compensation mapping table is pre-set by those skilled in the art through process experiments based on the relationship between the cavitation range and the area size.

[0149] S53: In response to the compensation operating parameters, directional cavitation enhancement processing is performed on the non-fitted area until the reflected signal shows complete fit.

[0150] The compensation power value and compensation duration determined in S52 are sent to the drive circuit of the ultrasonic transducer. Simultaneously, by controlling the phase of each transducer in the phased array ultrasonic transducer array, the cavitation effect is focused on the unfitted area identified in S51. The transducer performs enhanced cavitation in the designated area according to the compensation parameters, repeatedly impacting the unfitted area with a stronger cavitation microjets. During the process, the detection signal acquisition in S50 is repeated, and changes in the interface reflection signal are monitored in real time. When the reflection signal shows that the reflection characteristics of all areas have returned to normal and there are no longer any abnormal reflection points, it is determined to be a complete fit, and the compensation process is stopped.

[0151] S54: After bonding is completed, collect the residual liquid parameters on the product and insulating film surfaces.

[0152] The residual liquid parameter refers to the amount of liquid medium remaining on the surface of the product and the insulating film. After the bonded product and insulating film are removed from the liquid medium, the thickness of the liquid film on the product surface and the insulating film surface is measured by a laser displacement sensor set at the unloading station to obtain the residual liquid amount data.

[0153] S55: Determine drying process parameters based on residual liquid parameters.

[0154] The drying process parameters refer to the drying temperature and duration required to remove residual liquid from the product and insulating film surfaces. The controller has a pre-stored residual liquid drying mapping table, which contains recommended drying temperatures and durations for different amounts of residual liquid. Based on the residual liquid parameters collected by S54, the required drying temperature and duration values ​​can be obtained by querying the residual liquid drying mapping table. The residual liquid drying mapping table is pre-set by those skilled in the art based on experimental determination of the liquid medium's volatility characteristics and the product's heat resistance requirements.

[0155] S56: Dry the product and insulating film in response to drying process parameters.

[0156] The drying temperature and drying time determined in S55 are sent to the heating device controller at the drying station. The heating device starts heating at the specified temperature, while the conveyor transports the product and insulating film to the drying area (pre-set by those skilled in the art, and not described in detail here) for the specified time to allow residual liquid to fully evaporate. The evaporated liquid medium is collected by a condensation recovery device located above the drying area for recycling.

[0157] It also includes auxiliary methods for the active removal of bubbles:

[0158] S60: During the directional cavitation enhancement process, the gap feature detection signal of the unfitted area is collected.

[0159] The gap feature detection signal refers to the high-resolution detection signal emitted and received for measuring the internal structure of the non-bonded area. During the interval of the directional cavitation enhancement process, the controller sends a high-frequency, low-energy fine detection pulse command to the ultrasonic transducer. The transducer emits a focused detection signal to the non-bonded area identified by S51 and receives the high-resolution echo signal reflected from the internal interface of the area. The acquired signal is then sent to the controller for fine analysis.

[0160] S61: Based on the gap feature detection signal, determine the gap depth value and gas residue in the unfitted area.

[0161] The gap depth value refers to the maximum vertical distance between the insulating film and the product surface in the unbonded area. The controller analyzes the gap characteristic detection signal collected by S60, calculates the gap height at each point in the unbonded area based on the time-of-flight difference of the reflected signal, and takes the maximum value as the gap depth value. The larger the time-of-flight difference, the deeper the gap. The specific conversion relationship is pre-calibrated by those skilled in the art based on the propagation speed of the detection signal in the liquid medium.

[0162] The residual gas volume refers to the total volume of gas trapped in the unbonded area. Based on the attenuation characteristics and phase changes of the gap feature detection signal acquired in S60, and combined with the gap depth value and unbonded area determined in S61, the controller automatically estimates the total volume of gas trapped in the unbonded area using a pre-stored gas volume calculation model. This gas volume calculation model is pre-set by those skilled in the art based on the attenuation characteristics of the gas on the detection signal, after fitting experimental data.

[0163] S62: Determine the amplitude of the negative pressure pulse and the timing of its application based on the gap depth and residual gas amount.

[0164] The negative pressure pulse amplitude refers to the instantaneous negative pressure value applied to the fitted cavity to induce bubble expansion and rupture. The controller has a pre-stored depth negative pressure mapping table, which contains recommended negative pressure amplitudes corresponding to different gap depths. Based on the gap depth value determined in S61, the required negative pressure pulse amplitude can be obtained by consulting the depth negative pressure mapping table. The depth negative pressure mapping table is pre-set by those skilled in the art based on experimental measurements of the bubble expansion characteristics and pressure relationship.

[0165] The timing of application refers to the point at which the negative pressure pulse is inserted within the time series of the directional cavitation enhancement treatment. Based on the gas residual amount determined in S61 and combined with the current ultrasonic compensation treatment progress, the controller calculates the critical time point at which the gas residual amount begins to show a decreasing trend. This time point is taken as the optimal timing for applying the negative pressure pulse to ensure that the negative pressure effect is best when the bubbles are about to be expelled but have not yet completely moved.

[0166] S63: In response to the amplitude and timing of the negative pressure pulse, an instantaneous negative pressure is applied to the bonding cavity containing the product and the insulating film, causing bubbles trapped in the unbonded area to expand and rupture. After the negative pressure pulse ends, the liquid medium refills the gaps left after the bubbles rupture.

[0167] The negative pressure pulse amplitude and application timing determined by S62 are sent to the pressure control valve of the bonding cavity. When the application timing is reached, the pressure control valve instantaneously opens the channel connected to the negative pressure source, causing the internal pressure of the cavity to drop to the target negative pressure amplitude in a very short time. Bubbles trapped deep in the non-bonded area or in complex pits rapidly expand and increase in volume under the action of negative pressure. When the bubbles expand to a critical size, they rupture. After the negative pressure pulse ends, the pressure control valve closes the negative pressure channel and restores the cavity to normal pressure. The surrounding liquid medium flows naturally into the gaps left by the ruptured bubbles under the drive of the pressure difference, achieving complete filling of the microscopic gaps for subsequent steps.

[0168] It also includes the step of micro-vibration assisted exhaust:

[0169] S70: Collect the location and outline features of the non-fitted areas.

[0170] The regional distribution location refers to the set of position coordinates of the non-fitted areas in a three-dimensional spatial coordinate system. The controller extracts the center point coordinates of each non-fitted area from the non-fitted area data determined by S51 to form the spatial distribution location information of each area.

[0171] Region contour features refer to the characteristic parameters describing the geometry of the non-fitted region, including region area, edge length, aspect ratio, and contour complexity. The controller performs image analysis on the non-fitted region boundaries determined by S51, calculates the area value, perimeter value, and shape factor of each region, and obtains the contour feature data of each non-fitted region.

[0172] S71: Determine the location of vibration action points based on the regional distribution.

[0173] The vibration application point refers to the specific coordinates of the location where micro-vibration excitation needs to be applied on the back of the product. Based on the area distribution data collected by the S70, the controller maps the projection of each unbonded area on the front of the product to the same coordinate area on the back of the product, and uses these mapped coordinate points as the vibration application points. For multiple adjacent unbonded areas, a clustering algorithm is used to merge them into the same application point to reduce the number of vibrators required.

[0174] S72: Calculate the required vibration frequency and amplitude at each point of action based on the region's contour characteristics.

[0175] Vibration frequency refers to the number of vibrations per second when micro-vibrations are applied to a product. The controller has a pre-stored contour frequency mapping table, which contains recommended vibration frequencies corresponding to different area sizes and contour complexities. Based on the contour characteristics of the area determined in S70, the required vibration frequency value for each application point can be matched by consulting the contour frequency mapping table. The contour frequency mapping table is pre-set by those skilled in the art based on experimental measurements of the migration characteristics of bubbles in liquids.

[0176] Vibration amplitude refers to the maximum displacement amplitude of micro-vibration. The controller has a pre-stored area amplitude mapping table, which contains recommended vibration amplitudes corresponding to different non-adhesive area areas. Based on the area determined in S70, the required vibration amplitude for each point of action can be matched by consulting the area amplitude mapping table. The area amplitude mapping table is pre-set by those skilled in the art based on experimental measurements of the relationship between vibration energy transfer efficiency and amplitude.

[0177] S73: Generate micro-vibration excitation parameters based on vibration frequency, vibration amplitude, and vibration application point.

[0178] Micro-vibration excitation parameters refer to the complete set of parameters controlling the operation of the micro-vibrator array, including the number of each application point, the corresponding vibration frequency value, vibration amplitude, and excitation start and end time. The controller combines the vibration application point determined by S71, the corresponding vibration frequency and vibration amplitude determined by S72 to form independent control parameters for each vibrator, and sets the excitation start time and duration according to the current cavitation processing progress, ultimately generating a set of time-sequential micro-vibration excitation parameters.

[0179] S74: In response to the micro-vibration excitation parameters, low-frequency micro-vibration is applied to the product, causing bubbles trapped in the unbonded area to gradually migrate into the liquid medium.

[0180] The controller sends the micro-vibration excitation parameters generated by S73 to an array of miniature vibrators located on the back of the product. Each vibrator starts according to the specified frequency and amplitude, applying low-frequency micro-vibrations to the corresponding points on the back of the product. The vibration energy is transmitted through the product shell to the unbonded areas, causing bubbles trapped in micro-gaps or pits to resonate or be forced to move, gradually detaching from the gaps and floating to the surrounding liquid medium for subsequent steps.

[0181] S75: During the application of micro-vibration, acquire the update reflection signal of the non-adhesive area.

[0182] The updated reflection signal refers to the interface reflection signal that is re-acquired during the application of micro-vibration to monitor the bubble removal effect. During or simultaneously with the application of micro-vibration, the controller sends a detection command to the ultrasonic transducer. The transducer emits a detection signal to the previously unbonded area and receives the signal reflected back from that area, sending the updated reflection signal to the controller for real-time analysis.

[0183] S76: Determine whether the bubble has been completely expelled based on the updated reflected signal.

[0184] The controller analyzes the updated reflection signal collected in S75 and compares it with the original gap feature detection signal determined in S61. If the feature values ​​reflecting gap depth and gas residue in the updated reflection signal have both decreased to below the exhaust completion threshold set in advance by those skilled in the art, and the signal characteristics are close to the standard reflection signal of a fully fitted state, then it is determined that the bubbles have been completely expelled; otherwise, it is determined that there are still residual bubbles, and micro-vibration needs to be applied again.

[0185] S77: When it is determined that the bubbles have been completely expelled, stop the micro-vibration excitation and allow the cavitation micro-jet to fill the gaps left after expulsion.

[0186] When S76 determines that the bubble has been completely expelled, the controller immediately sends a stop command to the micro-vibrator array to terminate the micro-vibration excitation. At the same time, the controller sends a brief enhanced cavitation command to the ultrasonic transducer, causing the cavitation microjets to act on the void area where the bubble has just been expelled. The microjets use the surrounding liquid medium to fill these voids, ensuring that cavities do not reform after the bubble is expelled, thus facilitating subsequent steps.

[0187] It also includes a dual-frequency composite cavitation control method:

[0188] S80: Collects the current viscosity value of the insulating film adhesive layer and the real-time temperature distribution of the product surface.

[0189] The current viscosity value refers to the dynamic viscosity of the insulating film adhesive layer at the current moment. An infrared temperature sensor installed within the bonding cavity collects the adhesive layer temperature in real time. The controller then queries a pre-stored temperature-viscosity mapping table based on the collected temperature value to obtain the adhesive layer viscosity value corresponding to the current temperature. This temperature-viscosity mapping table is pre-set by those skilled in the art based on experimental measurements of the rheological properties of the insulating film adhesive layer material.

[0190] Real-time temperature distribution refers to the set of temperature values ​​at various locations on the product surface at the current moment. An infrared thermal imager installed inside the bonding cavity scans the product surface, acquiring temperature data at various points on the surface to form a thermal image reflecting the spatial distribution of temperature. This image data is then transmitted to the controller for analysis and processing.

[0191] S81: Determine the power ratio between low-frequency and high-frequency modes based on the current viscosity value and real-time temperature distribution.

[0192] Power ratio refers to the proportional relationship of power allocated to low-frequency and high-frequency ultrasonic modes within the same time interval. The controller has a pre-stored viscosity-temperature ratio mapping table, which contains recommended power ratios corresponding to different adhesive layer viscosities and temperature distribution characteristics. Based on the current viscosity value collected by S80 and the average temperature value and temperature uniformity index extracted from the real-time temperature distribution, the required power ratios for the low-frequency and high-frequency modes can be matched by querying the viscosity-temperature ratio mapping table. The viscosity-temperature ratio mapping table is pre-set by those skilled in the art based on process test data of the dual-frequency cavitation synergistic effect.

[0193] S82: Generate dual-frequency composite cavitation parameters based on power ratio.

[0194] Dual-frequency composite cavitation parameters refer to a complete set of parameters for controlling the simultaneous or alternating operation of the ultrasonic transducer in low-frequency and high-frequency modes. Specifically, this includes the operating frequency and power values ​​for both low-frequency and high-frequency modes, as well as the switching sequence between the two modes. Based on the power ratio determined by S81 and the rated power range of the ultrasonic transducer, the controller calculates the actual output power values ​​for both low-frequency and high-frequency modes. It then reads the low-frequency and high-frequency operating frequencies from a pre-stored frequency configuration table within the controller and sets the switching sequence according to the current bonding progress, ultimately generating a complete set of dual-frequency composite cavitation parameters.

[0195] S83: Responds to dual-frequency composite cavitation parameters to operate low-frequency ultrasound mode and high-frequency ultrasound mode simultaneously or alternately.

[0196] Low-frequency ultrasonic mode refers to the operation of an ultrasonic transducer in a lower frequency range (20kHz-40kHz). At this frequency, the cavitation effect is strong, and the generated cavitation bubbles are larger in size and have higher collapse energy.

[0197] High-frequency ultrasonic mode refers to the operating state of the ultrasonic transducer in a higher frequency range (40kHz-100kHz). At this frequency, the cavitation effect is weak, but the generated acoustic flow effect is significant, which can stir the liquid medium.

[0198] The controller sends the dual-frequency composite cavitation parameters generated by S82 to the drive circuit of the ultrasonic transducer. The drive circuit controls the transducer to output low-frequency and high-frequency ultrasonic energy simultaneously, or to quickly switch between the two modes according to the set timing sequence, according to the parameter requirements.

[0199] S84: In low-frequency ultrasonic mode, low-frequency ultrasound is used to generate the main driving force for cavitation bonding.

[0200] When the ultrasonic transducer operates in low-frequency mode, the low-frequency ultrasonic energy generates a strong cavitation effect in the liquid medium. A large number of cavitation bubbles grow and collapse periodically. The microjets generated during collapse form the main driving force that presses the insulating film against the product surface, achieving macroscopic adhesion between the insulating film and the product surface.

[0201] S85: In high-frequency ultrasonic mode, the liquid medium is stirred by microfluids generated by high-frequency ultrasound, so that cavitation nuclei are evenly distributed in the bonding cavity.

[0202] When the ultrasonic transducer operates in high-frequency mode, the high-frequency ultrasonic energy generates a stable acoustic flow effect in the liquid medium. Under the action of sound pressure, the liquid medium forms directional microflows. These microflows stir the liquid in the bonding cavity, so that the cavitation bubble generation nuclei are evenly distributed in the liquid, avoiding the cavitation effect from being concentrated in local areas and causing uneven bonding, thereby improving the overall bonding uniformity for subsequent steps.

[0203] It also includes a spatial correction method for dual-frequency composite cavitation parameters:

[0204] S90: Based on three-dimensional topographic data, determine the key bonding areas and key area locations on the product surface.

[0205] Key bonding areas refer to areas on the product surface with complex topography that are prone to poor bonding, including the interface between the copper busbar and the plastic, as well as areas with drastic curvature changes. The controller extracts the curvature values ​​and material property information of each location point from the three-dimensional topography data collected by S12. Areas with curvature values ​​exceeding the curvature threshold preset by those skilled in the art are marked as curvature complex areas, and the interface between the copper busbar and the plastic is marked as a material interface area. The set of key bonding areas is obtained by merging these two types of areas.

[0206] The key area location refers to the specific coordinate range of each key fitting area in the three-dimensional spatial coordinate system. The controller extracts the boundaries of each key fitting area determined by S90, records the center point coordinates and boundary point coordinates of each area, and forms a data set of key area locations.

[0207] S91: Determine the required local correction coefficients for each key fitting area based on the location of the key area.

[0208] The local correction factor refers to the power amplification factor applied to a key bonding region to enhance its cavitation intensity. The controller has a pre-stored region correction factor mapping table, which contains recommended correction factors for different region characteristics (such as curvature magnitude and whether it is a boundary region). Based on the characteristic type of the key bonding region determined in S90, the required local correction factor for each key bonding region can be matched by querying the region correction factor mapping table. The region correction factor mapping table is pre-set by those skilled in the art through process experiments based on the attenuation characteristics of cavitation energy in different morphological regions.

[0209] S92: Spatial correction of the dual-frequency composite cavitation parameters is performed based on local correction coefficients to obtain the corrected dual-frequency composite cavitation parameters.

[0210] The revised dual-frequency composite cavitation parameters refer to a new set of parameters obtained by spatially weighting and adjusting the original dual-frequency composite cavitation parameters by incorporating local correction coefficients for each key bonding area. Specifically, it includes the low-frequency power distribution value and high-frequency power distribution value corresponding to each spatial location. Based on the dual-frequency composite cavitation parameters generated in S82, the controller multiplies the local correction coefficients for each key bonding area determined in S91 with the base power value of the corresponding area to obtain the enhanced power value for these areas. For non-key areas, the base power value remains unchanged. The power values ​​of all spatial locations are integrated to form a power distribution map corresponding to the spatial coordinates of the product surface, which serves as the revised dual-frequency composite cavitation parameters.

[0211] S93: The output power of each transducer in the phased array ultrasonic transducer array is controlled in response to the modified dual-frequency composite cavitation parameters, thereby enhancing the cavitation intensity in the key bonding area.

[0212] The controller sends the corrected dual-frequency composite cavitation parameters generated by S92 to each transducer drive unit of the phased array ultrasonic transducer array. Each transducer independently adjusts its output power according to the power value corresponding to its location, and simultaneously controls the phase of each transducer to achieve a spatial focusing effect on the ultrasonic energy. Ultimately, the key bonding area receives enhanced ultrasonic energy, increasing the cavitation intensity in that area, while non-key areas maintain the normal cavitation intensity. This ensures overall bonding uniformity while providing enhanced bonding treatment for complex areas, facilitating subsequent steps.

[0213] Based on the same inventive concept, embodiments of the present invention provide a battery pack circuit breaker unit insulating film bonding system, comprising:

[0214] The data acquisition module is used to acquire material distribution data, material property parameters, three-dimensional morphology data, local curvature data, current temperature value, actual rolling pressure value, medium type parameters, current state parameters, adhesive layer characteristic parameters, reflection signals, residual liquid parameters, gap feature detection signals, area distribution location, area contour features, update reflection signals, current viscosity value, and real-time temperature distribution.

[0215] The memory is used to store a program that implements a method for pasting insulating film on a battery pack circuit breaker unit;

[0216] The processor is used to load and execute programs stored in memory.

[0217] Those skilled in the art will clearly understand that, for the sake of convenience and brevity, the above-described division of functional modules is used as an example. In practical applications, the above functions can be assigned to different functional modules as needed, that is, the internal structure of the device can be divided into different functional modules to complete all or part of the functions described above. The specific working process of the system, device, and unit described above can be referred to the corresponding process in the foregoing method embodiments, and will not be repeated here.

[0218] The above description is merely a preferred embodiment of the present invention. The scope of protection of the present invention is not limited to the above embodiments. All technical solutions falling within the scope of the present invention's concept are within the scope of protection of the present invention. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principles of the present invention should also be considered within the scope of protection of the present invention.

Claims

1. A method for pasting insulating film on a battery pack circuit breaker unit, characterized in that, include: Collect material distribution data of the surface of the product to be pasted and material property parameters of the insulating film; The temperatures of the copper busbar region and the plastic region are determined based on material distribution data and material property parameters. The product surface is preheated in a zoned manner in response to the temperature of the copper busbar area and the temperature of the plastic area, and three-dimensional morphology data of the surface of the product to be pasted are collected. The surface morphology complexity index of the product is calculated based on three-dimensional morphology data. When the morphological complexity index does not exceed the preset complexity threshold, the insulating film is adsorbed onto the pasting fixture, the pasting fixture is controlled to move at a preset pasting angle, and the insulating film is rolled by the roller device set at the rear of the pasting fixture so that the insulating film is adhered to the product surface. When the morphological complexity index exceeds the preset complexity threshold, the adhesive tooling and product with the adsorbed insulating film are immersed in the liquid medium and bonded using the preset liquid phase bonding method. The liquid phase bonding method includes: Collect the medium type parameters and current status parameters of the liquid medium; Pretreatment parameters for liquid media are determined based on media type parameters and current state parameters; The liquid medium is pre-treated in response to the pre-treatment parameters to achieve the preset standard bonding state, and the adhesive properties of the insulating film layer are collected. The initial operating parameters of the ultrasonic transducer are determined based on the adhesive layer characteristic parameters. The ultrasonic transducer is activated in response to the initial operating parameters, generating a cavitation effect in the liquid medium. The micro-jet generated by the collapse of cavitation bubbles presses the insulating film against the product surface to achieve initial bonding. It also includes a dual-frequency composite cavitation control method: Collect the current viscosity value of the insulating film adhesive layer and the real-time temperature distribution on the product surface; The power ratio between low-frequency and high-frequency modes is determined based on the current viscosity value and real-time temperature distribution. Based on the power ratio, dual-frequency composite cavitation parameters are generated; Responding to dual-frequency composite cavitation parameters to operate low-frequency ultrasound mode and high-frequency ultrasound mode simultaneously or alternately; In low-frequency ultrasonic mode, low-frequency ultrasound is used to generate the main driving force for cavitation bonding. In high-frequency ultrasonic mode, the liquid medium is stirred by microfluids generated by high-frequency ultrasound, so that cavitation nuclei are evenly distributed in the bonding cavity.

2. The method for pasting insulating film on a battery pack circuit breaker unit according to claim 1, characterized in that, It also includes a method for determining the pasting angle: Collect local curvature data of the product surface along the rolling path; The optimal cutting angle of the roller assembly at each rolling position is calculated based on local curvature data. Angle adjustment trajectory is generated based on the optimal entry angle; In response to the angle adjustment trajectory, the angle between the bonding tool and the product surface is adjusted in real time during the rolling process.

3. The method for pasting insulating film on a battery pack circuit breaker unit according to claim 1, characterized in that, It also includes a method for dynamically adjusting the roller pressure: Collect the current temperature value of the insulating film adhesive layer; Determine the viscosity of the adhesive layer based on the current temperature value; The target roller pressure value is calculated based on the adhesive layer viscosity value; The actual rolling pressure value applied by the roller device during the rolling process is collected; When the actual roller pressure value deviates from the target roller pressure value, the pressurizing mechanism of the control roller device adjusts the roller pressure to make the actual roller pressure value approach the target roller pressure value.

4. The method for pasting insulating film on a battery pack circuit breaker unit according to claim 1, characterized in that, The liquid phase bonding method further includes: During the initial bonding process, a probe signal is emitted to the interface between the insulating film and the product surface, and the reflected signal after being reflected by the interface is collected. The unattached area and unattached size are determined based on the reflected signal. The compensation operating parameters of the ultrasonic transducer are determined based on the unbonded area and the unbonded area. In response to the compensation operating parameters, directional cavitation enhancement processing is performed on the non-fitted area until the reflected signal shows complete fit; After bonding is completed, the residual liquid parameters on the product and insulating film surfaces are collected; Drying process parameters are determined based on residual liquid parameters; The product and insulating film are dried in response to the drying process parameters.

5. The method for pasting insulating film on a battery pack circuit breaker unit according to claim 4, characterized in that, It also includes auxiliary methods for the active removal of bubbles: During the directional cavitation enhancement process, gap feature detection signals of the non-adhesive area are collected; Based on gap feature detection signals, the gap depth and gas residue in the unfitted area can be determined; The amplitude and timing of the negative pressure pulse are determined based on the gap depth and residual gas content. In response to the amplitude and timing of the negative pressure pulse, a momentary negative pressure is applied to the bonding cavity containing the product and the insulating film, causing the bubbles trapped in the unbonded area to expand and burst. After the negative pressure pulse ends, the liquid medium refills the gaps left after the bubbles burst.

6. The method for pasting insulating film on a battery pack circuit breaker unit according to claim 4, characterized in that, It also includes a step of micro-vibration-assisted exhaust: Collect the location and outline features of the non-fitted areas; The location of vibration impact points is determined based on the regional distribution. Based on the regional contour characteristics, calculate the required vibration frequency and vibration amplitude at each point of action; Micro-vibration excitation parameters are generated based on vibration frequency, vibration amplitude, and vibration point of application. In response to the micro-vibration excitation parameters, low-frequency micro-vibrations are applied to the product, causing the air bubbles trapped in the unbonded area to gradually migrate into the liquid medium; During the application of micro-vibration, update reflection signals from the non-adhesive areas are collected; The updated reflected signal is used to determine whether the bubbles have been completely expelled. When it is determined that the bubbles have been completely expelled, the micro-vibration excitation is stopped, and the cavitation micro-jet fills the gaps left after expulsion.

7. The method for pasting insulating film on a battery pack circuit breaker unit according to claim 1, characterized in that, It also includes a spatial correction method for dual-frequency composite cavitation parameters: Based on three-dimensional topography data, the key bonding areas and key area locations on the product surface are determined; Determine the required local correction coefficients for each key fitting area based on the location of the key areas; Spatial correction of the dual-frequency composite cavitation parameters is performed based on local correction coefficients to obtain the corrected dual-frequency composite cavitation parameters; In response to the modified dual-frequency composite cavitation parameters, the output power of each transducer in the phased array ultrasonic transducer array is controlled to enhance the cavitation intensity in the key bonding area.

8. A battery pack circuit breaker unit insulating film bonding system, characterized in that, include: The data acquisition module is used to acquire material distribution data, material property parameters, and three-dimensional morphology data. A memory for storing a program that implements a method for pasting an insulating film on a battery pack circuit breaker unit as described in any one of claims 1 to 7; The processor is used to load and execute programs stored in memory.

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