Infrared temperature measurement method, device and system and electronic equipment

Abstract

The invention discloses an infrared temperature measurement method, device and system and electronic equipment, and belongs to the technical field of infrared temperature measurement. The method is used for detecting a temperature value of a component in a first wall of a nuclear fusion device, and comprises the following steps: acquiring a mapping relation between a colorimetric value and the temperature value of a first component in the first wall; the colorimetric value of a second part in the first wall is obtained, the colorimetric value of the second part is substituted into the mapping relation, the temperature value of the second part is obtained, and the first part and the second part are parts with the same components and the same treatment process. The accuracy of temperature measurement of the first wall of the nuclear fusion device can be improved.

Description

Technical Field

[0001] This application belongs to the field of infrared temperature measurement technology, and particularly relates to an infrared temperature measurement method, device, system and electronic equipment. Background Technology

[0002] In nuclear fusion devices, the first wall components need to operate in extreme environments such as high temperatures and strong radiation, making accurate temperature monitoring crucial. Traditional contact temperature measurement is unsuitable, not only due to limited installation space but also because it is susceptible to strong electromagnetic interference and material temperature resistance limitations. Conventional infrared temperature measurement calibrated by blackbody is significantly affected by differences in material emissivity, thus impacting measurement accuracy. Summary of the Invention

[0003] This invention aims to at least solve one of the technical problems existing in the prior art. To this end, this invention proposes an infrared temperature measurement method, apparatus, system, and electronic equipment, which can improve the accuracy of temperature measurement of the first wall of a nuclear fusion device.

[0004] In a first aspect, this application provides an infrared temperature measurement method for detecting the temperature value of a product in a component of a first wall of a nuclear fusion device, the method comprising: Obtain the mapping relationship between the colorimetric value and temperature value of the first component in the first wall; Obtain the colorimetric value of the second component in the first wall, and substitute the colorimetric value of the second component into the mapping relationship to obtain the temperature value of the second component, wherein the first component and the second component are components with the same composition and the same processing technology.

[0005] According to the infrared temperature measurement method of this application, by directly using a first component with the same composition and processing technology as the second component being measured, a mapping relationship between colorimetric value and temperature value is established, avoiding the temperature measurement error introduced by the blackbody calibration method due to the non-graybody characteristics of the actual component, thereby improving the accuracy of the temperature measurement of the first wall of the nuclear fusion device.

[0006] According to one embodiment of this application, the colorimetric value of the component in the first wall is used to characterize the ratio between the response value of the component in the first wall to the response value of the component in the second band of infrared light, wherein the wavelengths of the first band of infrared light and the second band of infrared light are determined based on the spectral emission characteristics and temperature measurement range of the component in the first wall.

[0007] According to one embodiment of this application, obtaining the mapping relationship between the colorimetric value and the temperature value of the first component in the first wall includes: The mapping relationship is obtained when the first component is in a vacuum chamber.

[0008] According to one embodiment of this application, obtaining the mapping relationship when the first component is in a vacuum cavity includes: With the first component inside the vacuum chamber, an infrared image is obtained by taking a picture of the first component through the viewing window of the vacuum chamber; The mapping relationship is obtained based on the infrared image and the infrared transmittance of the viewport.

[0009] According to one embodiment of this application, obtaining the mapping relationship between the colorimetric value and the temperature value of the first component in the first wall includes: Under multiple preset temperature values, the response values ​​of the first component to the first band of infrared light and the response values ​​to the second band of infrared light are obtained; The colorimetric value of the first component is calculated based on the response value of the first component to infrared light in the first band and the response value of the first component to infrared light in the second band. The mapping relationship is established based on the multiple preset temperature values ​​and their corresponding colorimetric values.

[0010] According to one embodiment of this application, obtaining the response value of the first component to a first band of infrared light and the response value to a second band of infrared light includes: Acquire a first infrared image of the first component under the first band of infrared light, and acquire a second infrared image of the first component under the second band of infrared light, wherein the first infrared image and the second infrared image are acquired by the same image acquisition device; The step of calculating the colorimetric value of the first component based on its response value to infrared light in the first band and its response value to infrared light in the second band includes: The colorimetric value of the first component is obtained by calculating the ratio of the pixel values ​​of corresponding pixels in the first infrared image to those in the second infrared image.

[0011] Secondly, this application provides an infrared temperature measuring device for detecting the temperature value of a component in the first wall of a nuclear fusion device, the device comprising: The acquisition module is used to acquire the mapping relationship between the colorimetric value and the temperature value of the first component in the first wall; The processing module is used to obtain the colorimetric value of the second component in the first wall, and substitute the colorimetric value of the second component into the mapping relationship to obtain the temperature value of the second component, wherein the first component and the second component are components with the same composition and the same processing technology.

[0012] According to the infrared temperature measuring device of this application, by directly using a first component with the same composition and processing technology as the second component being measured to establish a mapping relationship between colorimetric value and temperature value, the temperature measurement error introduced by the blackbody calibration method due to the non-graybody characteristics of the actual component can be avoided, thereby improving the accuracy of the temperature measurement of the first wall of the nuclear fusion device.

[0013] Thirdly, this application provides an infrared temperature measurement system, comprising: Image acquisition equipment used to detect infrared images of components in the first wall of a nuclear fusion device; An infrared temperature measuring device, connected to the image acquisition device, is used to perform the infrared temperature measuring method according to any one of claims 1-6.

[0014] According to the infrared temperature measurement system of this application, by directly using a first component with the same composition and processing technology as the second component being measured to establish a mapping relationship between colorimetric value and temperature value, the temperature measurement error introduced by the blackbody calibration method due to the non-graybody characteristics of the actual component can be avoided, thereby improving the accuracy of the temperature measurement of the first wall of the nuclear fusion device.

[0015] According to one embodiment of this application, the image acquisition device includes: A beam splitter is used to split the infrared radiation from the component in the first wall into two beams; A filter group, disposed on one side of the output end of the beam splitter, includes a first filter and a second filter. The first filter is used to output infrared light in a first band, and the second filter is used to output infrared light in a second band. An image acquisition module is located on one side of the output end of the filter group. The image acquisition device is used to acquire infrared images of the component in the first wall under the first band of infrared light and infrared images under the second band of infrared light. The infrared temperature measuring device is used to calculate the ratio of the pixel value of the corresponding pixel in the infrared image of the product in the first wall under the first band of infrared light to the pixel value of the infrared image under the second band of infrared light, so as to obtain the colorimetric value of the component in the first wall.

[0016] Fourthly, this application provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the infrared temperature measurement method as described in the first aspect above.

[0017] Fifthly, this application provides a non-transitory computer-readable storage medium having a computer program stored thereon, which, when executed by a processor, implements the infrared temperature measurement method as described in the first aspect above.

[0018] In a sixth aspect, this application provides a computer program product, including a computer program that, when executed by a processor, implements the infrared temperature measurement method as described in the first aspect above.

[0019] Additional aspects and advantages of this application will be set forth in part in the description which follows, and in part will be obvious from the description, or may be learned by practice of this application. Attached Figure Description

[0020] The above and / or additional aspects and advantages of this application will become apparent and readily understood from the description of the embodiments taken in conjunction with the following drawings, in which: Figure 1 This is one of the flowcharts of the infrared temperature measurement method provided in the embodiments of this application; Figure 2 This is a second schematic flowchart of the infrared temperature measurement method provided in the embodiments of this application; Figure 3 This is a schematic diagram of the infrared temperature measurement system provided in the embodiments of this application; Figure 4 This is a schematic diagram of the infrared temperature measuring device provided in the embodiments of this application; Figure 5 This is a schematic diagram of the structure of the electronic device provided in the embodiments of this application. Detailed Implementation

[0021] The technical solutions of the embodiments of this application will be clearly described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of this application. All other embodiments obtained by those skilled in the art based on the embodiments of this application are within the scope of protection of this application.

[0022] The terms "first," "second," etc., used in the specification and claims of this application are used to distinguish similar objects and not to describe a specific order or sequence. It should be understood that such use of data can be interchanged where appropriate so that embodiments of this application can be implemented in orders other than those illustrated or described herein, and the objects distinguished by "first," "second," etc., are generally of the same class and the number of objects is not limited; for example, a first object can be one or more. Furthermore, in the specification and claims, "and / or" indicates at least one of the connected objects, and the character " / " generally indicates that the preceding and following objects are in an "or" relationship.

[0023] The infrared temperature measurement method, infrared temperature measurement device, infrared temperature measurement system, electronic device, and readable storage medium provided in this application will be described in detail below with reference to the accompanying drawings and through specific embodiments and application scenarios.

[0024] Infrared temperature measurement can be applied to terminals, specifically by hardware or software within the terminal.

[0025] The infrared temperature measurement method provided in this application can be executed by an electronic device or a functional module or entity in an electronic device that can implement the infrared temperature measurement method. The electronic devices mentioned in this application include, but are not limited to, mobile phones, tablets, computers, cameras, and wearable devices. The infrared temperature measurement method provided in this application will be described below using an electronic device as the execution subject.

[0026] The infrared thermometry method provided in this application is used to detect the temperature value of a component in the first wall of a nuclear fusion device.

[0027] like Figure 1 As shown, the infrared temperature measurement method includes steps 110 and 120.

[0028] Step 110: Obtain the mapping relationship between the colorimetric value and temperature value of the first component in the first wall.

[0029] The first wall of the nuclear fusion device is a key lining structure that directly faces the high-temperature plasma and withstands strong heat loads and particle irradiation. It is used to protect external equipment and maintain the stable operation of the device.

[0030] The first wall can include high-temperature resistant metal materials such as tungsten and molybdenum. The first wall of a nuclear fusion device, such as a tokamak, is made of high-temperature resistant metals. For example, it can be spliced ​​together from multiple tungsten tiles or molybdenum tiles. The infrared thermometry method provided in this application is used to measure the temperature of the first wall when the nuclear fusion device is running. The mapping relationship between the colorimetric values ​​and temperature values ​​of various components is measured in advance on an offline experimental platform, and the mapping relationship is used for temperature measurement on the fusion device.

[0031] For example, tungsten material components manufactured using the same process correspond to one mapping relationship, while molybdenum material components manufactured using the same process correspond to another mapping relationship.

[0032] The first component and the second component are components with the same composition and the same processing technology. For example, the first component and the second component can be tungsten material components made by the same process, or the first component and the second component can be molybdenum material components made by the same process.

[0033] The first component serves as a calibration sample for temperature measurement of the components in the first wall.

[0034] In this step, at a known temperature, the radiation signals of the first component in two or more infrared bands are collected, the corresponding colorimetric values ​​are calculated, and multiple sets of data are repeated. The mapping relationship can be constructed by looking up tables, polynomial fitting, and neural networks.

[0035] Step 120: Obtain the colorimetric value of the second component in the first wall, and substitute the colorimetric value of the second component into the mapping relationship to obtain the temperature value of the second component.

[0036] The second component is the actual component whose temperature is to be measured.

[0037] In this step, the colorimetric value of the second component is obtained, and then the colorimetric value is input into the mapping relationship to calculate the current actual temperature value of the second component.

[0038] It should be noted that the first component and the second component should have the same composition and the same processing technology to ensure consistent emissivity characteristics.

[0039] For example, the first wall includes tungsten material component a, tungsten material component b, and tungsten material component c, as well as molybdenum material component a and molybdenum material component b.

[0040] The tungsten material components a, b, and c are processed using the same techniques, as are the molybdenum material components a and b. This identical processing indicates a high degree of consistency in microstructure, surface condition, and physical properties, ensuring consistent emissivity characteristics and thus guaranteeing accurate temperature inversion and mapping relationship transfer during colorimetric thermometry.

[0041] In the experimental environment, using tungsten material component d with the same processing technology as tungsten material component a, tungsten material component b, and tungsten material component c, or any one of tungsten material component a, tungsten material component b, and tungsten material component c, the mapping relationship A between the corresponding colorimetric value and temperature value is obtained.

[0042] During the operation of the nuclear fusion device, the colorimetric values ​​of tungsten material components a, b, and c are directly substituted into mapping relationship A to obtain the corresponding temperature values.

[0043] In the experimental environment, using molybdenum material component c, which has the same processing technology as molybdenum material component a and molybdenum material component b, or any one of molybdenum material component a and molybdenum material component b, the mapping relationship B between the corresponding colorimetric value and temperature value is obtained.

[0044] During the operation of the nuclear fusion device, the colorimetric values ​​of molybdenum material component a and molybdenum material component b are directly substituted into the mapping relationship B to obtain the corresponding temperature values.

[0045] According to the infrared temperature measurement method provided in the embodiments of this application, by directly using a first component with the same composition and processing technology as the second component being measured to establish a mapping relationship between colorimetric value and temperature value, the temperature measurement error introduced by the blackbody calibration method due to the non-graybody characteristics of the actual component can be avoided, thereby improving the accuracy of the temperature measurement of the first wall of the nuclear fusion device.

[0046] In some embodiments, the colorimetric value of the component in the first wall is used to characterize the ratio between the response value of the component in the first wall to the response value of the component in the first band infrared light and the response value of the component in the second band infrared light, wherein the wavelengths of the first band infrared light and the second band infrared light are determined based on the spectral emission characteristics and temperature measurement range of the component in the first wall.

[0047] Among them, spectral emission characteristics refer to the emissivity distribution of a material at different wavelengths, reflecting the change of its radiation capacity with wavelength; temperature measurement range refers to the temperature range that needs to be measured.

[0048] In this embodiment, the wavelengths of the first and second infrared light bands are determined through collaborative optimization based on the spectral emission characteristics of the components in the first wall and the temperature measurement range. On the one hand, bands with strong radiation energy and good detection response within the temperature measurement range are selected; on the other hand, two bands with similar and stable emissivity are preferentially selected to reduce errors. At the same time, it ensures that the colorimetric value has high sensitivity and good monotonicity to temperature changes, and avoids bands with strong atmospheric absorption or environmental interference, thereby improving the temperature measurement accuracy and robustness.

[0049] In some embodiments, obtaining the mapping relationship between the colorimetric value and the temperature value of the first component in the first wall includes: The mapping relationship is obtained when the first component is in a vacuum chamber.

[0050] In this embodiment, when establishing the mapping relationship between the colorimetric value and temperature value of the first component, the first component is calibrated in a vacuum chamber environment to eliminate interference factors such as absorption, scattering and oxidation of infrared radiation by air, thereby obtaining a purer and more accurate radiation signal and temperature correspondence, and improving the accuracy and reliability of subsequent temperature measurement.

[0051] In some embodiments, when the first component is in a vacuum cavity, obtaining the mapping relationship includes: With the first component in a vacuum chamber, an infrared image is obtained by taking a picture of the first component through the viewing window of the vacuum chamber; The mapping relationship is obtained based on the infrared image and the infrared transmittance of the window.

[0052] Infrared transmittance is the ratio of the intensity of transmitted light to the intensity of incident light when infrared light passes through the window, reflecting the window's ability to transmit infrared radiation of a specific wavelength.

[0053] In this embodiment, the first component is imaged in infrared through the window of the vacuum cavity, and the infrared transmittance of the window is combined to perform radiometric correction on the acquired infrared image, thereby eliminating the influence of the window material on the measurement, accurately extracting the true colorimetric value of the first component, and establishing a high-precision mapping relationship.

[0054] In some embodiments, obtaining the mapping relationship between the colorimetric value and the temperature value of the first component in the first wall includes: Under multiple preset temperature values, the response values ​​of the first component to the first band of infrared light and the response values ​​to the second band of infrared light are obtained; The colorimetric value of the first component is calculated based on its response value to infrared light in the first band and its response value to infrared light in the second band. A mapping relationship is established based on multiple preset temperature values ​​and their corresponding colorimetric values.

[0055] In this embodiment, within the controllable temperature range of the first wall, a set of representative discrete temperature points are selected as preset temperature values.

[0056] Infrared radiation response values ​​in the first and second bands are collected at each preset temperature value. The ratio between the response value of the first component to infrared light in the first band and the response value to infrared light in the second band is calculated to obtain the colorimetric value.

[0057] By pairing multiple preset temperature values ​​with their corresponding colorimetric values, a mapping relationship is established using fitting or interpolation methods.

[0058] In some embodiments, obtaining the response value of the first component to a first band of infrared light and the response value to a second band of infrared light includes: A first infrared image of the first component under a first band of infrared light is acquired, and a second infrared image of the first component under a second band of infrared light is acquired. The first infrared image and the second infrared image are acquired by the same image acquisition device. Based on the response values ​​of the first component to infrared light in the first band and to infrared light in the second band, the colorimetric value of the first component is calculated, including: The colorimetric value of the first component is obtained by calculating the ratio of the pixel values ​​of corresponding pixels in the first infrared image to those in the second infrared image.

[0059] In this embodiment, firstly, using the same image acquisition device, a first infrared image of the first component under the first band infrared light and a second infrared image under the second band infrared light are acquired under the same imaging conditions to ensure that the two images have good spatial alignment and comparability. Subsequently, for the pixels corresponding to the positions in the first infrared image and the second infrared image, their pixel values ​​are extracted respectively, and the ratio of the response values ​​of the first band and the second band is calculated pixel by pixel. Alternatively, the pixel values ​​of the first infrared image are averaged, the pixel values ​​of the second infrared image are averaged, and the ratio of the two averages is calculated to obtain the colorimetric value.

[0060] This application also provides an infrared temperature measurement system.

[0061] An infrared temperature measurement system includes image acquisition equipment and infrared temperature measurement equipment.

[0062] The image acquisition equipment is used to detect infrared images of components in the first wall of a nuclear fusion device.

[0063] The infrared temperature measurement device is connected to the image acquisition device to perform the infrared temperature measurement method described above.

[0064] According to the infrared temperature measurement system provided in the embodiments of this application, by directly using a first component with the same composition and processing technology as the second component being measured to establish a mapping relationship between colorimetric values ​​and temperature values, the temperature measurement error introduced by the blackbody calibration method due to the non-graybody characteristics of the actual component can be avoided, thereby improving the accuracy of the temperature measurement of the first wall of the nuclear fusion device.

[0065] In some embodiments, the image acquisition device includes: A beam splitter is used to split the infrared radiation from the components in the first wall into two beams. A filter group, located on one side of the output end of the beam splitter, includes a first filter and a second filter. The first filter is used to output infrared light in the first band, and the second filter is used to output infrared light in the second band. The image acquisition module is located on one side of the output end of the filter group. The image acquisition device is used to acquire infrared images of the components in the first wall under the first band of infrared light and infrared images under the second band of infrared light. The infrared thermometer is used to calculate the ratio of the pixel values ​​of the corresponding pixels of the infrared image of the component in the first wall under the first band of infrared light to the infrared image of the component under the second band of infrared light, and to obtain the colorimetric value of the component in the first wall.

[0066] In this embodiment, the image acquisition device adopts a beam splitting structure design. First, the infrared radiation from the component in the first wall is split into two beams by a beam splitter. Then, these two beams pass through a first filter and a second filter in a filter group set at the output end of the beam splitter, where the first filter only allows infrared light of the first band to pass through, and the second filter only transmits infrared light of the second band. Next, the two specific band infrared beams after filtering are guided to the same image acquisition module (such as an infrared camera) for synchronous imaging, thereby obtaining two infrared images of the component in the first and second bands. Finally, the two images are pixel-level registered by an infrared temperature measurement device or a supporting processing system, and the ratio of the pixel values ​​of corresponding pixels is calculated to generate a colorimetric value reflecting the material properties or temperature distribution characteristics of the component surface.

[0067] The following is a specific embodiment of an infrared temperature measurement method.

[0068] The principle of the infrared temperature measurement method provided in this application embodiment is: to use the ratio of radiance to indicate temperature.

[0069] According to Wien's formula:

[0070] in, -wavelength; -wavelength ,temperature The radiance below; -wavelength ,temperature Emission rate at the following levels; -Planck's first radiation constant; -Planck's second radiation constant.

[0071] Let the temperature be The surface of the object at wavelength , The spectral radiance is as follows: and Colorimetric value Then there is

[0072] After sorting, we get:

[0073] Therefore:

[0074] because , Since these are fixed parameters, temperature T is only related to the colorimetric value R and the emissivity ratio. Variable correlation. When the object being measured is a black body or a gray body. The formula is simplified to:

[0075] This shows the temperature of blackbody and graybody. It is only related to the variable R, and not to the emissivity.

[0076] However, since the actual components are not gray bodies, the emissivity ratio Therefore, the emissivity factor cannot be ignored. Traditional colorimetric thermometry methods are established using a blackbody furnace for calibration. A mapping table will introduce errors when measuring actual objects.

[0077] To address this issue, the infrared thermometry method provided in this application directly calibrates the sample to be tested, i.e., the component in the first wall, and establishes an RT mapping table for the sample. Substituting T and R into the above formula, the emissivity ratio can be obtained. It is evident that the RT mapping relationship established by this calibration method implicitly contains emissivity ratio information, and the temperature measurement results no longer depend on the emissivity assumption, significantly improving the temperature measurement accuracy of non-gray body objects.

[0078] like Figure 2 As shown, in step one, sample selection and preparation, select a sample that is identical in material and surface condition to the object to be tested. The sample size should meet the requirements of the calibration scenario, and the surface should be clean and free of contamination. For example, for metallic materials, a metal sheet with the same composition and surface treatment should be selected as the sample; for ceramic materials, a ceramic sheet with the same composition and sintering process should be selected as the sample.

[0079] Step 2: Vacuum Platform Setup. A high vacuum level must be established to prevent surface oxidation of the sample during heating. The vacuum platform should be equipped with a material heating and temperature feedback control system capable of precisely controlling and maintaining the sample temperature stably. The vacuum chamber walls should be water-cooled to prevent background radiation from affecting the calibration.

[0080] Step 3: Sample Calibration Process On a vacuum platform, the sample is heated to different temperature points. Multiple dual-band radiance ratios are measured at each temperature point using a colorimetric thermometer, and the average value is taken as the colorimetric value R for that temperature point. The correspondence between sample temperature T and colorimetric value R is recorded, establishing a colorimetric value-temperature curve RT. The calibration temperature range should cover the possible temperature range of the object under test. Samples of various objects to be measured are calibrated sequentially to establish a multi-object sample calibration database.

[0081] Step 4: Temperature measurement process of the test object The dual-band colorimetric value R of the analyte inside a vacuum (such as a tokamak) is measured using a colorimetric thermometer. The corresponding sample calibration RT mapping table for the analyte is then called up, and the corresponding temperature value T is determined using the measured R value through interpolation methods (such as linear interpolation or polynomial fitting).

[0082] In related technologies, colorimetric thermometry typically uses a blackbody radiation source for calibration, assuming the object being measured is a gray body (i.e., its emissivity does not change with wavelength). Under this assumption, the ratio of emissivity at two wavelengths, ε1 / ε2 ≈ 1, so the influence of emissivity can be canceled out when calculating the radiance ratio, resulting in relatively accurate temperature measurements. However, in practical applications, many objects are not ideal gray bodies, and their emissivity varies with the spectrum and temperature. When the emissivity at the two selected wavelengths is not exactly equal, the emissivity cannot be divided and canceled out in the colorimetric value calculation, leading to inaccurate temperature measurements. Moreover, the emissivity-spectral curve characteristics of different materials vary, making it difficult for traditional colorimetric thermometry methods based on blackbody furnace calibration to cover the temperature measurement needs of all materials.

[0083] Traditional blackbody calibration colorimetric thermometry involves measuring the ratio of the two-band radiance of a blackbody radiation source at different temperatures to establish a colorimetric-temperature curve, which is then used to measure the temperature of an actual object. This method is accurate when the object being measured is a gray body (whose emissivity is independent of wavelength). However, real objects are not gray bodies, and differences in spectral emissivity can lead to measurement errors.

[0084] The infrared thermometry method provided in this application can eliminate the influence of emissivity differences and improve the temperature measurement accuracy. By measuring the colorimetric values ​​of the sample under test at different temperatures in a vacuum environment, a colorimetric value-temperature curve is established, so that the temperature measurement results no longer depend on the emissivity assumption, significantly improving the temperature measurement accuracy of non-gray body objects.

[0085] The traditional blackbody calibration method requires complex processing to correct for the influence of emissivity during temperature measurement, which simplifies the data processing. However, this method directly measures the RT curve of the sample, and the accurate temperature can be obtained by data interpolation, making the processing simpler and more direct.

[0086] A sample with the same material and surface condition as the test object is selected for calibration. The colorimetric value-temperature mapping table of the test object sample is measured in a vacuum environment. The calibration curve implies the emissivity ratio information of the test object itself, thereby avoiding the error caused by the emissivity assumption in traditional methods and improving the temperature measurement accuracy.

[0087] The colorimetric values ​​of the sample under test are measured at different temperatures in a vacuum environment to establish a colorimetric value-temperature curve. Then, this curve is used to measure the dual-band colorimetric value of the sample under test inside the vacuum, and the true surface temperature of the sample under test is obtained by interpolation.

[0088] The following describes a specific embodiment of an infrared temperature measurement system.

[0089] like Figure 3 As shown, the first component B is located in the vacuum chamber G, the heating device A is located near the first component B, and a temperature sensor C, such as a standard thermocouple, is located at the first component B.

[0090] The vacuum chamber is equipped with a viewing window D, the image acquisition module E is aligned with the viewing window D, and the colorimetric thermometer F is connected to the image acquisition module E.

[0091] The infrared temperature measurement method provided in this application can be executed by an infrared temperature measurement device. This application uses an infrared temperature measurement device to execute the infrared temperature measurement method as an example to illustrate the infrared temperature measurement device provided in this application.

[0092] This application also provides an infrared temperature measuring device.

[0093] The device is used to detect the temperature of components in the first wall of a nuclear fusion device.

[0094] like Figure 4 As shown, the infrared temperature measuring device includes: The acquisition module 410 is used to acquire the mapping relationship between the colorimetric value and the temperature value of the first component in the first wall; The processing module 420 is used to obtain the colorimetric value of the second component in the first wall, and substitute the colorimetric value of the second component into the mapping relationship to obtain the temperature value of the second component. The first component and the second component are components with the same composition and the same processing technology.

[0095] The infrared temperature measuring device provided in the embodiments of this application establishes a mapping relationship between colorimetric values ​​and temperature values ​​by directly utilizing a first component with the same composition and processing technology as the second component being measured. This avoids the temperature measurement error introduced by the blackbody calibration method due to the non-graybody characteristics of the actual component, thereby improving the accuracy of the temperature measurement of the first wall of the nuclear fusion device.

[0096] In some embodiments, the colorimetric value of the component in the first wall is used to characterize the ratio between the response value of the component in the first wall to the response value of the component in the first band infrared light and the response value of the component in the second band infrared light, wherein the wavelengths of the first band infrared light and the second band infrared light are determined based on the spectral emission characteristics and temperature measurement range of the component in the first wall.

[0097] In some embodiments, the acquisition module 410 is used to acquire the mapping relationship when the first component is in a vacuum chamber.

[0098] In some embodiments, the acquisition module 410 is used to capture an infrared image of the first component through a window of the vacuum chamber when the first component is in a vacuum chamber. The mapping relationship is obtained based on the infrared image and the infrared transmittance of the window.

[0099] In some embodiments, the acquisition module 410 is used to acquire the response value of the first component to the first band of infrared light and the response value to the second band of infrared light under multiple preset temperature values. The colorimetric value of the first component is calculated based on its response value to infrared light in the first band and its response value to infrared light in the second band. A mapping relationship is established based on multiple preset temperature values ​​and their corresponding colorimetric values.

[0100] In some embodiments, the acquisition module 410 is used to acquire a first infrared image of the first component under a first band of infrared light and to acquire a second infrared image of the first component under a second band of infrared light. The first infrared image and the second infrared image are acquired by the same image acquisition device. Based on the response values ​​of the first component to infrared light in the first band and to infrared light in the second band, the colorimetric value of the first component is calculated, including: The colorimetric value of the first component is obtained by calculating the ratio of the pixel values ​​of corresponding pixels in the first infrared image to those in the second infrared image.

[0101] The infrared temperature measurement device in this application embodiment can be an electronic device or a component within an electronic device, such as an integrated circuit or a chip. The electronic device can be a terminal or other devices besides a terminal. For example, the electronic device can be a mobile phone, tablet computer, laptop computer, PDA, in-vehicle electronic device, mobile internet device (MID), augmented reality (AR) / virtual reality (VR) device, robot, wearable device, ultra-mobile personal computer (UMPC), netbook, or personal digital assistant (PDA), etc. It can also be a server, network attached storage (NAS), personal computer (PC), television set (TV), ATM, or self-service machine, etc. This application embodiment does not specifically limit the specific type of device.

[0102] The infrared temperature measuring device in this application embodiment can be a device with an operating system. This operating system can be Microsoft (Windows), Android, iOS, or other possible operating systems; this application embodiment does not specifically limit it.

[0103] The infrared temperature measurement device provided in this application embodiment can achieve... Figure 1 and Figure 2 The various processes implemented in the method implementation examples will not be described again here to avoid repetition.

[0104] In some embodiments, such as Figure 5 As shown, this application embodiment also provides an electronic device 500, including a processor 501, a memory 502, and a computer program stored in the memory 502 and executable on the processor 501. When the program is executed by the processor 501, it implements the various processes of the above-described infrared temperature measurement method embodiment and can achieve the same technical effect. To avoid repetition, it will not be described again here.

[0105] It should be noted that the electronic devices in the embodiments of this application include the mobile electronic devices and non-mobile electronic devices described above.

[0106] This application also provides a non-transitory computer-readable storage medium storing a computer program. When the computer program is executed by a processor, it implements the various processes of the above-described infrared temperature measurement method embodiments and achieves the same technical effect. To avoid repetition, it will not be described again here.

[0107] The processor is the processor in the electronic device described in the above embodiments. The readable storage medium includes computer-readable storage media, such as computer read-only memory (ROM), random access memory (RAM), magnetic disk, or optical disk.

[0108] This application also provides a computer program product, including a computer program that, when executed by a processor, implements the above-described infrared temperature measurement method.

[0109] The processor is the processor in the electronic device described in the above embodiments. The readable storage medium includes computer-readable storage media, such as computer read-only memory (ROM), random access memory (RAM), magnetic disk, or optical disk.

[0110] This application embodiment also provides a chip, which includes a processor and a communication interface. The communication interface is coupled to the processor. The processor is used to run programs or instructions to implement the various processes of the above-described infrared temperature measurement method embodiments and can achieve the same technical effect. To avoid repetition, it will not be described again here.

[0111] It should be understood that the chip mentioned in the embodiments of this application may also be referred to as a system-on-a-chip, system chip, chip system, or system-on-a-chip, etc.

[0112] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes that element. Furthermore, it should be noted that the scope of the methods and apparatuses in the embodiments of this application is not limited to performing functions in the order shown or discussed, but may also include performing functions substantially simultaneously or in the reverse order, depending on the functions involved. For example, the described methods may be performed in a different order than described, and various steps may be added, omitted, or combined. Additionally, features described with reference to certain examples may be combined in other examples.

[0113] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the related technology, can be embodied in the form of a computer software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) and includes several instructions to cause a terminal (which may be a mobile phone, computer, server, or network device, etc.) to execute the methods described in the various embodiments of this application.

[0114] The embodiments of this application have been described above with reference to the accompanying drawings. However, this application is not limited to the specific embodiments described above. The specific embodiments described above are merely illustrative and not restrictive. Those skilled in the art can make many other forms under the guidance of this application without departing from the spirit and scope of the claims, and all of these forms are within the protection scope of this application.

[0115] In the description of this specification, the references to terms such as "one embodiment," "some embodiments," "illustrative embodiment," "example," "specific example," or "some examples," etc., indicate that a specific feature, structure, material, or characteristic described in connection with that embodiment or example is included in at least one embodiment or example of this application. In this specification, the illustrative expressions of the above terms do not necessarily refer to the same embodiment or example. Furthermore, the specific features, structures, materials, or characteristics described may be combined in any suitable manner in one or more embodiments or examples.

[0116] Although embodiments of this application have been shown and described, those skilled in the art will understand that various changes, modifications, substitutions and alterations can be made to these embodiments without departing from the principles and spirit of this application, the scope of which is defined by the claims and their equivalents.

Claims

1. An infrared temperature measurement method, characterized in that, The method is used to detect the temperature value of a component in the first wall of a nuclear fusion device. The method includes: Obtain the mapping relationship between the colorimetric value and temperature value of the first component in the first wall; Obtain the colorimetric value of the second component in the first wall, and substitute the colorimetric value of the second component into the mapping relationship to obtain the temperature value of the second component, wherein the first component and the second component are components with the same composition and the same processing technology.

2. The infrared temperature measurement method according to claim 1, characterized in that, The colorimetric value of the first component in the wall is used to characterize the ratio between the response value of the first component in the wall to the response value of the first component in the infrared light in the first band and the response value of the first component in the infrared light in the second band. The wavelengths of the first and second infrared light are determined based on the spectral emission characteristics and temperature range of the first component in the wall.

3. The infrared temperature measurement method according to claim 1, characterized in that, The step of obtaining the mapping relationship between the colorimetric value and the temperature value of the first component in the first wall includes: The mapping relationship is obtained when the first component is in a vacuum chamber.

4. The infrared temperature measurement method according to claim 3, characterized in that, The process of obtaining the mapping relationship when the first component is in a vacuum cavity includes: With the first component inside the vacuum chamber, an infrared image is obtained by taking a picture of the first component through the viewing window of the vacuum chamber; The mapping relationship is obtained based on the infrared image and the infrared transmittance of the viewport.

5. The infrared temperature measurement method according to claim 1, characterized in that, The step of obtaining the mapping relationship between the colorimetric value and the temperature value of the first component in the first wall includes: Under multiple preset temperature values, the response values ​​of the first component to the first band of infrared light and the response values ​​to the second band of infrared light are obtained; The colorimetric value of the first component is calculated based on the response value of the first component to infrared light in the first band and the response value of the first component to infrared light in the second band. The mapping relationship is established based on the multiple preset temperature values ​​and their corresponding colorimetric values.

6. The infrared temperature measurement method according to claim 5, characterized in that, The step of obtaining the response value of the first component to the first band of infrared light and the response value to the second band of infrared light includes: Acquire a first infrared image of the first component under the first band of infrared light, and acquire a second infrared image of the first component under the second band of infrared light, wherein the first infrared image and the second infrared image are acquired by the same image acquisition device; The step of calculating the colorimetric value of the first component based on its response value to infrared light in the first band and its response value to infrared light in the second band includes: The colorimetric value of the first component is obtained by calculating the ratio of the pixel values ​​of corresponding pixels in the first infrared image to those in the second infrared image.

7. An infrared temperature measuring device, characterized in that, The device is used to detect the temperature value of a component in the first wall of a nuclear fusion device, and the device includes: The acquisition module is used to acquire the mapping relationship between the colorimetric value and the temperature value of the first component in the first wall; The processing module is used to obtain the colorimetric value of the second component in the first wall, and substitute the colorimetric value of the second component into the mapping relationship to obtain the temperature value of the second component, wherein the first component and the second component are components with the same composition and the same processing technology.

8. An infrared temperature measurement system, characterized in that, include: Image acquisition equipment used to detect infrared images of components in the first wall of a nuclear fusion device; An infrared temperature measuring device, connected to the image acquisition device, is used to perform the infrared temperature measuring method according to any one of claims 1-6.

9. The infrared temperature measurement system according to claim 8, characterized in that, The image acquisition device includes: A beam splitter is used to split the infrared radiation from the component in the first wall into two beams; A filter group, disposed on one side of the output end of the beam splitter, includes a first filter and a second filter. The first filter is used to output infrared light in a first band, and the second filter is used to output infrared light in a second band. An image acquisition module is located on one side of the output end of the filter group. The image acquisition device is used to acquire infrared images of the component in the first wall under the first band of infrared light and infrared images under the second band of infrared light. The infrared temperature measurement device is used to calculate the ratio of the pixel value of the corresponding pixel in the infrared image of the component in the first wall under the first band of infrared light to the pixel value of the infrared image under the second band of infrared light, so as to obtain the colorimetric value of the component in the first wall.

10. An electronic device comprising a memory, a processor, and a computer program stored in the memory and executable on the processor, characterized in that, When the processor executes the program, it implements the infrared temperature measurement method as described in any one of claims 1-6.

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