Test method and test system

Abstract

The invention relates to the technical field of sensors, and discloses a test method and a test system. The test system comprises a rotating device, a clamping device and a processing device, the rotating device is used for driving a magnetic pole arranged on the rotating device to rotate around a first shaft, and the clamping device is used for installing a calibration chip or a sensor chip. When the calibration chip is installed on the clamping device, the processing device controls the rotating device to rotate to a first angle. When the rotating device rotates to a first angle, the calibration chip outputs a first signal which indicates that the first area of the magnetic pole is matched with the center of the calibration chip. The calibration chip is replaced by a sensor chip, and the rotating device is controlled to drive the magnetic pole to vibrate circumferentially around the first shaft. And acquiring a vibration angle of the rotating device relative to the first angle when the sensor chip outputs the effective signal, so as to determine a test result of the sensor chip based on the vibration angle. In this way, the function performance of the sensor chip in the tremor environment can be tested, and the testing efficiency and the testing precision are high.

Description

Technical Field

[0001] This application relates to the field of sensor technology, and in particular to a testing method and testing system. Background Technology

[0002] During intelligent driving, the performance of the vehicle's speed sensor chip in a vibration environment will affect the vehicle's intelligent driving decisions, which in turn will affect driving convenience, vehicle stability, or driving safety.

[0003] Specifically, the magnetic toothed ring on the wheel consists of multiple alternating N and S poles. As the wheel rotates, it generates a changing magnetic field. The speed sensor chip detects this magnetic field and outputs a corresponding signal. Upon receiving the signal from the speed sensor chip, the vehicle's control system assumes the vehicle is in motion and makes a driving decision. However, vibrations that occur when the vehicle is stationary (such as the vibration caused by forcefully closing a door) can also cause wheel vibrations (such as slight left-right swaying), resulting in slight swaying of the toothed ring. If the speed sensor chip still transmits the same signal to the vehicle control system as when the vehicle is in motion, the control system will mistakenly interpret the stationary vibration as the vehicle being in motion and make a driving decision, thus affecting driving convenience or vehicle stability.

[0004] Therefore, how to test the performance of a vehicle's speed sensor chip in a vibration environment in advance is an urgent problem to be solved. Summary of the Invention

[0005] This application provides a testing method and testing system for testing the functional performance of a sensor chip under vibration conditions.

[0006] Firstly, this application provides a testing method applied to a testing system. The testing system includes a rotating device, a clamping device, and a processing device. The rotating device drives at least one magnetic pole disposed on the rotating device to rotate about a first axis, and the clamping device is used to mount a calibration chip or a sensor chip. Furthermore, when the calibration chip is mounted on the clamping device, the first position where the centerline of the calibration chip is located matches the second position where the centerline of the sensor chip is located when the sensor chip is mounted on the clamping device, and the accuracy of the calibration chip is higher than the accuracy of the sensor chip.

[0007] Furthermore, the testing method includes: with the calibration chip mounted on the clamping device, the processing device controls the rotating device to rotate to a first angle. When the rotating device rotates to the first angle, the calibration chip outputs a first signal, indicating that a first region of a first magnetic pole among at least one magnetic pole matches the center of the calibration chip. With the rotating device rotated to the first angle and the sensor chip mounted on the clamping device, the processing device controls the rotating device to drive the first magnetic pole to vibrate circumferentially around a first axis, and acquires at least one first vibration angle of the rotating device relative to the first angle when the output signal of the sensor chip is a valid signal. The processing device determines the test result of the sensor chip based on the at least one first vibration angle.

[0008] Therefore, based on the aforementioned testing system and methods, the functional performance of sensor chips (such as vehicle speed sensor chips) under vibration conditions can be tested, which helps improve vehicle safety or stability. Furthermore, when testing the sensor chip, the vibration of the first magnetic pole can be controlled by a computer or other processing device, improving testing efficiency and allowing for more precise adjustment of the vibration angle, thus meeting customers' customized testing accuracy or range requirements. Moreover, by controlling the vibration of the first magnetic pole through a computer or other processing device, the vibration angle of the first magnetic pole can be adjusted to the same angle during different rounds of testing, thereby improving the repeatability of the test.

[0009] In one possible implementation of the first aspect above, the processing device determines the test result of the sensor chip based on at least one first vibration angle, including: if at least one first vibration angle satisfies at least one of the following conditions, the processing device determines that the performance of the sensor chip does not meet the performance requirements: one or more of the at least one first vibration angles have an amplitude of less than a first vibration angle threshold; the average value of the amplitudes of each of the at least one first vibration angles relative to the first angle is less than a second vibration angle threshold.

[0010] In this way, it is possible to determine whether the performance of the sensor chip meets the performance requirements based on at least one first vibration angle.

[0011] In one possible implementation of the first aspect described above, the first region of the first magnetic pole is the center of the first magnetic pole; and the first region of the first magnetic pole in at least one magnetic pole matches the center of the calibration chip, including: a voltage signal with a first signal of 0V.

[0012] In some implementations, the calibration chip can output voltage signals of different magnitudes based on different magnetic flux quantities. For example, the calibration chip could be an OH191 model chip. This allows for higher precision (e.g., output signal precision up to 10).-6 The calibration chip (V) can make the center of the first magnetic pole more accurately found.

[0013] In one possible implementation of the first aspect above, during the process of the processing device controlling the rotating device to drive the first magnetic pole to vibrate circumferentially around the first axis, the first magnetic pole vibrates circumferentially with a first amplitude in a first time period, and the first magnetic pole vibrates circumferentially with a second amplitude in a second time period, the second time period being the time period after the first time period, and the second amplitude being greater than the first amplitude.

[0014] In this way, by gradually increasing the vibration angle, the minimum first vibration angle at which the sensor chip outputs a valid signal can be determined.

[0015] In one possible implementation of the first aspect above, the first magnetic pole oscillates circumferentially with a first amplitude during a first time period, including: during a first sub-time period within the first time period, the first magnetic pole oscillates circumferentially within a range from a first angle to a second angle, where the second angle is the sum of the first angle and the first amplitude; during a second sub-time period within the first time period, the first magnetic pole oscillates circumferentially within a range from a first angle to a third angle, where the third angle is the difference between the first angle and the first amplitude.

[0016] In this way, the performance of the sensor chip can be tested when the first magnetic pole vibrates in different directions with the first amplitude.

[0017] In one possible implementation of the first aspect described above, during the process of the processing device rotating the device relative to at least one first vibration angle when the output signal of the sensor chip is a valid signal, the radial distance between the sensor chip and the first magnetic pole on the first axis is a first distance.

[0018] Furthermore, the testing method also includes: the processing device adjusting the radial distance between the sensor chip and the first magnetic pole on the first axis to a second distance based on the clamping device; the processing device controlling the rotating device to drive the first magnetic pole to vibrate circumferentially around the first axis, and acquiring at least one second vibration angle of the rotating device relative to the first angle when the output signal of the sensor chip is a valid signal; and the processing device determining the test result of the sensor chip based on the at least one second vibration angle.

[0019] This allows for testing the sensor chip's performance when the radial distance between the sensor chip and the first magnetic pole along the first axis varies. Furthermore, this testing system and method can improve testing efficiency and accuracy.

[0020] In one possible implementation of the first aspect described above, at least one magnetic pole further includes a second magnetic pole and a third magnetic pole, wherein the first magnetic pole, the second magnetic pole and the third magnetic pole are arranged sequentially along the circumference of the first axis, the first magnetic pole and the third magnetic pole have the same magnetism, and the first magnetic pole and the second magnetic pole have opposite magnetism.

[0021] The method further includes: a processing device controlling a rotating device to rotate to a fourth angle, wherein the interval between the fourth angle and the first angle is k times the fifth angle, and k is an integer greater than or equal to 1. The fourth angle is between the first angle and a sixth angle, where the sixth angle is the angle at which the center of the third magnetic pole is located when the rotating device rotates to the first angle; the processing device controlling the rotating device to drive the device composed of the first magnetic pole, the second magnetic pole, and the third magnetic pole to vibrate circumferentially around the first axis; the processing device acquiring at least one third vibration angle of the rotating device relative to the fourth angle when the output signal of the sensor chip is a valid signal; and the processing device determining the test result of the sensor chip based on at least one third vibration angle.

[0022] This allows for testing the sensor chip's performance when its center matches different magnetic pole regions of the magnetic pole pair. Furthermore, this testing system and method can improve testing efficiency and accuracy.

[0023] In one possible implementation of the first aspect described above, the output signal of the sensor chip is a valid signal, including: when the communication protocol of the sensor chip is the wheel speed sensor to ECU standard interface protocol (AK protocol) and the output signal of the sensor chip is a high-level signal, the output signal of the sensor chip is a valid signal. Alternatively, when the communication protocol of the sensor chip is the pulse width modulation (PWM) protocol and the pulse width of the output signal of the sensor chip is within a preset pulse width range, the output signal of the sensor chip is a valid signal.

[0024] In this way, corresponding test standards can be set for sensor chips with different communication protocols.

[0025] In one possible implementation of the first aspect described above, the first region of the first magnetic pole of at least one magnetic pole is matched with the center of the calibration chip, including: the straight line connecting the first region of the first magnetic pole and the center of the calibration chip extends radially along the first axis; the first position where the center line of the calibration chip is located when the calibration chip is mounted on the clamping device is matched with the second position where the center line of the sensor chip is located when the sensor chip is mounted on the clamping device, including: the first position where the center line of the calibration chip is located coincides with the second position where the center line of the sensor chip is located.

[0026] Secondly, this application provides a testing system, including the rotating device, clamping device, and processing device mentioned in the first aspect and any possible implementation of the first aspect. The beneficial effects of the second aspect can be found in the relevant descriptions in the first aspect and any possible implementation of the first aspect, and will not be repeated here. Attached Figure Description

[0027] Figure 1A According to some embodiments of this application, a schematic diagram of the structure of a testing system is shown;

[0028] Figure 1B According to some embodiments of this application, a schematic diagram showing the matching of the center point of a sensor chip with the center point of a calibration chip is shown;

[0029] Figure 2 A flowchart of a first testing method is shown according to some embodiments of this application;

[0030] Figure 3 According to some embodiments of this application, a schematic diagram of a visual interface during a testing process is shown;

[0031] Figure 4 According to some embodiments of this application, a vibration diagram is shown;

[0032] Figure 5 According to some embodiments of this application, a flowchart of a second testing method is shown;

[0033] Figure 6 According to some embodiments of this application, a flowchart of a third testing method is shown;

[0034] Figure 7 According to some embodiments of this application, a schematic diagram of the hardware structure of a processing device is shown. Detailed Implementation

[0035] The illustrative embodiments of this application include, but are not limited to, a test method and a test system.

[0036] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions in the embodiments of this application will be described in detail below with reference to the accompanying drawings and specific implementation methods.

[0037] As mentioned earlier, the performance of a vehicle's speed sensor chip in a vibration environment can affect the vehicle's intelligent driving decisions. Therefore, testing the performance of the vehicle's speed sensor chip in a vibration environment in advance can help identify speed sensor chips that perform poorly in vibration environments, allowing them to be eliminated or adjusted to improve vehicle safety or stability.

[0038] Currently, manual testing methods are commonly used to test speed sensor chips. For example, the wheel tooth ring can be fixed on a test bench. Then, the vibration of the wheel tooth ring is manually controlled, and the presence of a valid signal output from the speed sensor is detected. This allows the determination of the minimum vibration angle of the tooth ring when the speed sensor chip has a valid signal output, thereby determining whether the speed sensor chip's performance under vibration conditions meets expectations.

[0039] However, the aforementioned manual testing method has low testing efficiency. Furthermore, because this method involves manually controlling the gear ring vibration angle, it's difficult to maintain the same angle across different test runs, resulting in low repeatability. Additionally, the manual control of the vibration angle makes precise adjustment insufficient, failing to meet customers' customized testing accuracy or range requirements.

[0040] To address the aforementioned problems, this application provides a testing system and a testing method. The testing system may include a rotating device, a clamping device, and a processing device. The rotating device may have at least one magnetic pole, which is used to drive the at least one magnetic pole to rotate about a first axis. The clamping device may be used to mount a calibration chip or a sensor chip (such as a speed sensor chip). The calibration chip may have a higher accuracy than the sensor chip to help locate a first region of the magnetic pole (such as the center of the magnetic pole). Furthermore, when the calibration chip is mounted on the clamping device, the first position where the centerline of the calibration chip is located matches the second position where the centerline of the sensor chip is located when the sensor chip is mounted on the clamping device; for example, the first position coincides with the second position. Thus, based on this testing system, the testing method shown below can be performed.

[0041] Specifically, when a calibration chip is mounted on the clamping device, the processing device can control the rotating device to rotate to a first angle. When the rotating device rotates to the first angle, the calibration chip outputs a first signal. This first signal indicates that a first region (e.g., the center) of the first magnetic pole matches the center of the calibration chip, such that the straight line connecting the first region of the first magnetic pole and the center of the calibration chip extends radially along the first axis. At this time, the calibration chip can be replaced with a sensor chip to be tested (e.g., a speed sensor chip) mounted on the clamping device so that the center of the sensor chip matches the first region of the first magnetic pole. Next, the processing device can control the rotating device to drive the first magnetic pole to vibrate circumferentially around the first axis. Furthermore, the processing device can acquire at least one first vibration angle of the rotating device relative to the first angle when the output signal of the sensor chip is a valid signal, in order to determine the test result of the sensor chip based on this at least one first vibration angle.

[0042] For example, if in at least one first vibration angle the amplitude of one or more of the first vibration angles relative to the first angle is less than a first vibration angle threshold, and / or, the average amplitude of each of the first vibration angles relative to the first angle in at least one first vibration angle is less than a second vibration angle threshold, it indicates that the sensor chip may still transmit the same signal to the vehicle control system as when the vehicle is moving, even when the vehicle is vibrating. The control system may mistake the stationary vibration of the vehicle for the vehicle being in motion and make driving decisions, thereby affecting driving convenience or vehicle stability. Therefore, if in at least one first vibration angle the amplitude of one or more of the first vibration angles relative to the first angle is less than a first vibration angle threshold, and / or, the average amplitude of each of the first vibration angles relative to the first angle in at least one first vibration angle is less than a second vibration angle threshold, it can be determined that the performance of the sensor chip does not meet the performance requirements.

[0043] It should be noted that the circumferential vibration mentioned in this application can refer to back-and-forth vibration within an angle. For example, back-and-forth vibration within a range of 0.0036°.

[0044] Therefore, based on the aforementioned testing system and methods, the functional performance of sensor chips (such as vehicle speed sensor chips) under vibration environments can be tested to determine whether the vibration angle of the sensor chip when outputting a valid signal meets the requirements, thereby helping to improve vehicle safety or stability. Furthermore, during sensor chip testing, the vibration of the first magnetic pole can be controlled by a computer or other processing device, improving testing efficiency and allowing for more precise adjustment of the vibration angle. This can meet customers' customized testing accuracy or range requirements (e.g., the range of vibration angles input or configured by the user). Moreover, by controlling the vibration of the first magnetic pole through a computer or other processing device, the vibration angle of the first magnetic pole can be adjusted to the same angle during different rounds of testing, thereby improving test repeatability.

[0045] The following is a combination of... Figure 1A The test system provided in this application is described.

[0046] For example, refer to Figure 1A As shown, the test system 00 provided in this application may include a rotating device 10, a clamping device 20, and a processing device 30.

[0047] The rotating device 10 may be provided with at least one magnetic pole. For example, the first magnetic pole 10b may be directly mounted on the rotating device 10 or a gear ring with the first magnetic pole 10b may be mounted on the rotating device 10. Furthermore, when at least one magnetic pole is provided on the rotating device 10, the rotating device 10 may also be used to drive the at least one magnetic pole provided on the rotating device 10 to rotate around the first axis 10a.

[0048] Continue to refer to Figure 1A As shown, the test system 00 may also include a clamping device 20, which can be used to mount a calibration chip (such as calibration chip 20a) or a sensor chip (such as a vehicle speed sensor chip).

[0049] It can be understood that when the calibration chip 20a is mounted on the clamping device 20, the first position where the center line of the calibration chip is located matches the first position where the center line of the sensor chip is located when the sensor chip is mounted on the clamping device 20. For example, when the calibration chip 20a or the sensor chip is of any size, the first position where the center line of the calibration chip 20a is located can coincide with the second position where the center line of the sensor chip is located. For another example, such as... Figure 1B As shown, when the calibration chip 20a or the sensor chip 20b is of any size, the center point of the calibration chip 20a and the center point of the sensor chip 20b can coincide.

[0050] For example, the sensor chip can be a speed sensor chip. The calibration chip can output voltage signals of different magnitudes according to different magnetic flux magnitudes; for example, the calibration chip can be an OH191 model chip. The accuracy of the calibration chip 20a can be higher than that of the sensor chip to help find the first region (such as the center of the first magnetic pole 10b) disposed on the rotating device 10, so that the center of the calibration chip 20a can match the first region of the first magnetic pole 10b.

[0051] When the rotating device 10 rotates to different angles, different magnetic pole regions of the magnetic poles disposed on the rotating device will match the center of the calibration chip. That is, when the rotating device 10 rotates to different angles, the straight line connecting the different magnetic pole regions to the center of the calibration chip will extend radially along the first axis 10a of the rotating device 10. At this time, when different magnetic pole regions match the center of the calibration chip, the calibration chip can output a voltage signal of corresponding strength according to the detected magnetic flux intensity.

[0052] Thus, after determining the first region of the first magnetic pole 10b disposed on the rotating device 10 using the calibration chip 20a, the calibration chip 20a can be replaced with a sensor chip and mounted on the clamping device 20. Furthermore, since the first position where the center line of the calibration chip 20a is located matches the first position where the center line of the sensor chip is located, after replacing the calibration chip 20a with the sensor chip, the center of the sensor chip can also match the first region of the first magnetic pole 10b.

[0053] Continue to refer to Figure 1A As shown, the test system 00 may further include a processing unit 30. The processing unit 30 can control the rotation of the rotating device 10. Furthermore, during the rotation of the rotating device 10, the processing unit 30 can also acquire the vibration angle of the rotating device 10 when the output signal of the sensor chip is a valid signal, and determine the test result of the sensor chip based on this vibration angle. Specifically, the test method implemented by the processing unit 30 can be referred to as follows: Figure 2 As stated above.

[0054] The following is based on Figure 2 The flowchart shown illustrates the test methods mentioned in the embodiments of this application. Figure 2 As shown, specifically, the method is as follows:

[0055] S201: When the calibration chip is mounted on the clamping device 20, the processing device 30 controls the rotating device 10 to rotate to a first angle. When the rotating device 10 rotates to the first angle, the calibration chip outputs a first signal.

[0056] In some embodiments, the calibration chip can output voltage signals of different magnitudes based on different magnetic flux quantities. For example, the calibration chip can be an OH191 model chip.

[0057] In some embodiments, when the rotating device 10 rotates to different angles, different magnetic pole regions of the magnetic poles disposed on the rotating device will match the center of the calibration chip. That is, when the rotating device 10 rotates to different angles, the straight line connecting the different magnetic pole regions to the center of the calibration chip will extend radially along the first axis 10a of the rotating device 10. At this time, when different magnetic pole regions match the center of the calibration chip, the calibration chip can output a voltage signal of corresponding strength according to the detected magnetic flux intensity.

[0058] Specifically, when the rotating device 10 rotates to a first angle, if the signal output by the calibration chip is detected to be a preset first signal, it indicates that at that first angle, the center of the calibration chip matches the first region of the first magnetic pole among at least one magnetic pole. That is, at that first angle, the straight line connecting the first region of the first magnetic pole and the center of the calibration chip can extend radially along the first axis 10a of the rotating device 10. For example, the first region of the first magnetic pole can be the center of the first magnetic pole, and the preset first signal can be a 0V voltage signal (also known as a zero-point voltage).

[0059] In some embodiments, such as Figure 3 As shown, the processing device 30 (such as a computer) can also display a test interface U1 to the user. The test interface U1 may include an operation element U11 for determining a first area. When the processing device 30 detects that the user clicks on the operation element U11, the processing device 30 may display an interface U2. The interface U2 includes an output signal display element U21 for calibrating the chip, a voltage signal value accuracy adjustment element U22, and a range adjustment element U23 for the first area.

[0060] Among them, the output signal display element U21 is used to display the voltage signal value currently output by the calibration chip.

[0061] Furthermore, the user can set an angle range parameter (e.g., 7.5°) in the adjustment element U23 for the first region. This angle range parameter can be the angle range occupied by a single magnetic pole or the angle range occupied by a pair of magnetic poles (including two magnetic poles with opposite magnetic properties). In other words, when searching for the first region of a certain magnetic pole, the rotating device 10 can rotate at most an angle range parameter (e.g., 7.5°), and the angle traversed can form a single magnetic pole or a pair of magnetic poles. Within this single magnetic pole or pair, the first region must exist. Thus, when multiple magnetic poles are provided on the rotating device 10, setting the angle range parameter can prevent the rotating device 10 from rotating at excessively large angles, thereby allowing the first region to be found more quickly.

[0062] Furthermore, the user can set the voltage precision (e.g., -0.01V and +0.01V) in the voltage signal value precision adjustment element U22. This voltage signal value precision means that during the rotation of the rotating device 10, the voltage signal value output by the calibration chip is updated in the output signal display element U21 every time the voltage signal value precision increases or decreases (e.g., every 0.01V increase or decrease). This avoids the output signal display element U21 displaying frequently and rapidly changing voltage signal values, making it easier for the user to view.

[0063] Thus, through Figure 3The graphical settings shown allow users to customize and adjust parameters related to finding the first region, and also make the output signals of the calibration chip during the search process visible.

[0064] S202: When the rotating device 10 is rotated to the first angle and the sensor chip is installed in the clamping device 20, the processing device 30 can control the rotating device 10 to drive the first magnetic pole disposed on the rotating device 10 to vibrate circumferentially around the first axis 10a.

[0065] In some embodiments, during the process of the rotating device 10 controlling the first magnetic pole to vibrate circumferentially around the first axis 10a, the first magnetic pole can circumferentially move with a first amplitude within a first time period. Exemplarily, the first amplitude can be an integer multiple of the minimum vibration amplitude (e.g., 0.0036°) achievable by the control system of the rotating device 10. For example, if the first time period is immediately after entering the test process, the first amplitude can be the minimum vibration amplitude (e.g., 0.0036°); or, if the first time period is the i-th (i is a positive integer) time period after entering the test process, the first amplitude can be i times the minimum vibration amplitude (e.g., 0.0036° × i). It is understood that if the minimum vibration amplitude achievable by the structure of the rotating device 10 is another value, such as 0.005 or 0.01, the first amplitude can also be an integer multiple of that minimum vibration amplitude. The first magnetic pole can vibrate multiple times with the first amplitude within the first time period; this application does not limit this.

[0066] Within the first time period, in the first sub-time period, the first magnetic pole can oscillate circumferentially within a range from a first angle to a second angle, where the second angle can be the sum of the first angle and the first amplitude. In the second sub-time period, the first magnetic pole can oscillate circumferentially within a range from the first angle to a third angle, where the third angle can be the difference between the first angle and the first amplitude. That is, within the first time period, the first magnetic pole can oscillate in two opposite directions relative to the first angle. For example, starting from the first angle, it can oscillate clockwise to the first amplitude to the second angle, then oscillate back to the first angle from the second angle; then, it can oscillate counterclockwise to the first amplitude to the third angle, then oscillate back to the first angle from the third angle. This allows for testing the performance of the sensor chip when the first magnetic pole oscillates to the first amplitude in different directions.

[0067] For example, Figure 4 A schematic diagram of the vibration process of the first magnetic pole 10b is shown. (Reference) Figure 4As shown, if the first time period is the second time period after entering the test process, within the first sub-time period of the first time period, the first magnetic pole 10b can vibrate instantaneously to the second angle with a first amplitude (e.g., twice the minimum vibration amplitude, e.g., 0.0072°) relative to the first angle, and then return to the first angle from the second angle. Within the second sub-time period of the first time period, the first magnetic pole 10b can vibrate counterclockwise to the third angle with a first amplitude (e.g., twice the minimum vibration amplitude, e.g., 0.0072°) relative to the first angle, and then return to the first angle from the third angle. In this way, the performance of the sensor chip can be tested when the first magnetic pole 10b vibrates to the first amplitude in different directions.

[0068] In some embodiments, during the process of controlling the rotating device 10 to drive the first magnetic pole to vibrate circumferentially around the first axis 10a, the processing device 30 can also detect in real time whether the output signal of the sensor chip is a valid signal. If the output signal of the sensor chip is detected to be invalid under the current vibration amplitude, the processing device 30 can also control the rotating device 10 to increase the vibration amplitude.

[0069] For example, if the processing device 30 detects that the output signal of the sensor chip is not a valid signal during the first time period when the first magnetic pole vibrates circumferentially with a first amplitude in the first time period, the processing device 30 can also control the rotating device 10 to increase the vibration amplitude in the second time period, so that the first magnetic pole can vibrate circumferentially with a second amplitude in the second time period. Here, the second time period is the time period following the first time period, and the second amplitude is greater than the first amplitude. Exemplarily, the first magnetic pole can vibrate multiple times with a second amplitude in the second time period; this application does not limit this.

[0070] For example, the second amplitude can also be an integer multiple of the minimum vibration amplitude (e.g., 0.0036°) achievable by the structure of the rotating device 10. That is, the processing device 30 can control the vibration amplitude of the rotating device 10 to be the minimum vibration amplitude achievable by the structure of the rotating device 10 each time it increases.

[0071] Within the second time period, the first magnetic pole can also vibrate in opposite directions with a second amplitude relative to the first angle. For example, in the first sub-time period of the second time period, the first magnetic pole can vibrate instantaneously clockwise with a second amplitude (e.g., 3 times the minimum vibration amplitude, e.g., 0.0108°) relative to the first angle, and then return to the first angle after the second clockwise vibration amplitude. Similarly, in the second sub-time period of the second time period, the first magnetic pole can vibrate counterclockwise with a second amplitude (e.g., 3 times the minimum vibration amplitude, e.g., 0.0108°) relative to the first angle, and then return to the first angle after the second counterclockwise vibration amplitude. This allows testing the sensor chip's performance when the first magnetic pole vibrates in different directions with a second amplitude. See the above for details. Figure 4 The relevant description of the vibration of the first magnetic pole 10b shown in the first time period will not be repeated here.

[0072] In some embodiments, refer to the above. Figure 3 As shown, the test interface U1 can also display test parameter adjustment element U12, vibration amplitude display element U13, angle display element U14, and interval distance (also known as air gap distance) display element U15, etc.

[0073] The vibration amplitude display element U13 can be used to display the vibration amplitude of the first magnetic pole (e.g., first amplitude or second amplitude). The angle display element U14 can be used to display the current angle of the rotating device 10 (e.g., first angle, second angle or third angle). The gap distance display element U15 can be used to display the radial distance (which can be called the air gap distance) between the sensor chip and the first magnetic pole on the first axis 10a.

[0074] Furthermore, when the processing device detects that the user clicks on the test parameter adjustment element U12, the processing device 30 can also display a test parameter adjustment interface U3, so that the user can set test parameters in the test parameter adjustment interface U3. For example, the test parameters may include, but are not limited to, one or more of the following parameters: minimum vibration amplitude (e.g., 0.0036°), maximum vibration amplitude, minimum air gap distance, maximum air gap distance, and number of magnetic pole pairs, etc.

[0075] The minimum vibration amplitude ensures that when the processing device 30 controls the rotating device 10 to drive the first magnetic pole to vibrate circumferentially, the vibration amplitude of the first magnetic pole in each time period is an integer multiple of the minimum vibration amplitude (e.g., the first amplitude or the second amplitude, etc.). The maximum vibration amplitude can be used to limit the maximum amplitude of the first magnetic pole's vibration. The minimum and maximum air gap distances allow the processing device to control the clamping device 20 to adjust the radial distance between the sensor chip and the first magnetic pole on the first axis 10a, in order to determine the test results of the sensor chip when the sensor chip and the first magnetic pole have different air gap distances. See the following text for details. Figure 5 As shown, details will not be elaborated here. The number of magnetic pole pairs allows the processing device 30 to control the rotating device 10 to drive the magnetic poles to rotate circumferentially, in order to determine the test results of the sensor chip when the center of the sensor chip is matched with different magnetic pole regions. For details, please refer to the following text. Figure 6 As shown, details will not be elaborated here.

[0076] In this way, by setting the test parameter adjustment interface U3, users can customize and adjust the relevant parameters during the test process, thereby enabling the test system to test the sensor chip based on the parameters adjusted by the user.

[0077] S203: When the processing device 30 obtains that the output signal of the sensor chip is a valid signal, the rotating device 10 has at least one first vibration angle relative to the first angle.

[0078] In some embodiments, during the process of the rotating device 10 driving the first magnetic pole disposed on the rotating device 10 to vibrate circumferentially around the first axis 10a, different magnetic pole regions of the first magnetic pole can be matched with the center of the sensor chip, and the sensor chip can output corresponding signals based on different magnitudes of magnetic flux. Wherein, when the output signal of the sensor chip is a valid signal, the processing device 30 can determine the test result of the sensor chip based on the first vibration angle corresponding to the valid signal.

[0079] In some embodiments, whether the output signal of the sensor chip is valid can be determined based on the communication protocol of the sensor chip. For example, if the communication protocol of the sensor chip is the wheel speed sensor to ECU standard interface protocol (AK), and the processing device 30 detects that the output signal of the sensor chip is a high-level signal, it can be considered that the sensor chip has output a valid signal. As another example, if the communication protocol of the sensor chip is a pulse width modulation (PWM) protocol, and the processing device 30 detects that the pulse width of the output signal of the sensor chip is within a preset pulse width range, it can be considered that the sensor chip has output a valid signal. The minimum value of the preset pulse width range can be 70ms to 90ms, and the maximum value can be 150ms to 180ms.

[0080] In some embodiments, refer to the above. Figure 3 As shown, the test interface U1 can display a communication protocol adjustment element U16. When the processing device detects that the user clicks on the communication protocol adjustment element U16, the processing device 30 can also display a communication protocol adjustment interface U4, allowing the user to set communication protocol-related data in the communication protocol adjustment interface U4. For example, selecting either the AK protocol or the PWM protocol, or, if the PWM protocol is selected, setting the minimum and maximum values ​​within a preset signal pulse width range. In this way, corresponding test standards can be set for sensor chips with different communication protocols.

[0081] In some embodiments, refer to the above. Figure 3 As shown, the test interface U1 can display a real-time test status display area U17. The real-time test status display area U17 can be used to display information such as test time, vibration amplitude, and the output signal of the sensor chip. In this way, the signal output of the sensor chip during the test can be visualized in terms of vibration.

[0082] S204: The processing device 30 determines the test results of the sensor chip based on at least one first vibration angle.

[0083] In some embodiments, if, in at least one first vibration angle, the amplitude of one or more first vibration angles relative to a first angle is less than a first vibration angle threshold, the processing device 30 may determine that the performance of the sensor chip does not meet the performance requirements. And / or, if the average amplitude of each of the first vibration angles relative to the first angle in at least one first vibration angle is less than a second vibration angle threshold, the processing device 30 may determine that the performance of the sensor chip does not meet the performance requirements. The first vibration angle threshold and / or the second vibration angle threshold may be the chip manufacturer's expected vibration threshold, for example, the maximum vibration angle of a vehicle when vibrated, determined based on experience or experimentation.

[0084] Thus, using the aforementioned testing system and methods, the functional performance of sensor chips (such as vehicle speed sensor chips) under vibration conditions can be tested, contributing to improved vehicle safety and stability. Furthermore, during sensor chip testing, the vibration of the first magnetic pole can be controlled by a computer or other processing device 30, improving testing efficiency and allowing for more precise adjustment of the vibration angle, thereby meeting customers' customized testing accuracy or range requirements. Moreover, by controlling the vibration of the first magnetic pole through the computer or other processing device 30, the vibration angle of the first magnetic pole can be adjusted to the same angle during different rounds of testing, thereby improving test repeatability.

[0085] It is understandable that, depending on the vehicle model or brand, the radial distance between the sensor chip and the first magnetic pole on the wheel axle may differ when the first magnetic pole is actually installed on the wheel's gear ring and when the sensor chip is actually installed on the vehicle. Therefore, in this application, the first axle 10a can be considered as the wheel axle; the radial distance between the sensor chip and the first magnetic pole on the first axle 10a can be used as the radial distance between the sensor chip and the first magnetic pole on the wheel axle. Furthermore, by adjusting the radial distance between the sensor chip and the first magnetic pole on the first axle 10a, the radial distance between the sensor chip and the first magnetic pole on the wheel axle can be simulated, thereby testing the performance of the sensor chip when the radial distance between the sensor chip and the first magnetic pole on the wheel axle is different. See below for details. Figure 5 As shown.

[0086] The following is based on Figure 5 The flowchart shown illustrates a method for testing the performance of a sensor chip when the radial distance between the sensor chip and the first magnetic pole on the first axis 10a differs, as mentioned in the embodiments of this application. Exemplarily, in the process of... Figure 2 After determining the test results of the sensor chip at a first radial distance between the sensor chip and the first magnetic pole on the first axis using the method shown, it can also be done through... Figure 5The method shown determines the test results of the sensor chip at a second radial distance between the sensor chip and the first magnetic pole on the first axis.

[0087] like Figure 5 As shown, specifically, the method is as follows:

[0088] S501: The processing device 30 adjusts the radial distance between the sensor chip and the first magnetic pole on the first axis 10a to a second distance based on the clamping device 20.

[0089] In some embodiments, the above Figure 2 As shown, during the process of obtaining a valid output signal from the sensor chip and rotating the device 10 relative to at least one first vibration angle relative to a first angle, the radial distance between the sensor chip and the first magnetic pole on the first axis 10a can be a first distance. At this first distance, the processing device 30 can determine the test result of the sensor chip at the first radial distance between the sensor chip and the first magnetic pole on the first axis based on at least one first vibration angle.

[0090] Next, the processing device 30 can also control the clamping device 20 to move so as to adjust the radial distance between the sensor chip and the first magnetic pole on the first axis 10a to a second distance, thereby determining the test result of the sensor chip at the second radial distance between the sensor chip and the first magnetic pole on the first axis.

[0091] In some embodiments, when adjusting the radial distance between the sensor chip and the first magnetic pole on the first shaft 10a, the adjustment range can be the minimum radial distance between the sensor chip and the first magnetic pole on the wheel axle in existing vehicles (e.g., 2 mm). That is, the difference between the second distance and the first distance can be an integer multiple of this minimum distance.

[0092] In some embodiments, as described above Figure 3 As shown, users can set the minimum distance (also known as the minimum air gap distance) and the maximum distance (also known as the maximum air gap distance) in the test parameter adjustment interface U3. The minimum distance determines the magnitude of each adjustment, while the maximum distance determines the radial distance between the sensor chip and the first magnetic pole along the first axis 10a. This allows users to customize the radial distance between the sensor chip and the first magnetic pole along the first axis 10a according to specific needs, thereby determining the test results of the sensor chip when the sensor chip and the first magnetic pole have different air gap distances.

[0093] S502: The processing device 30 controls the rotating device 10 to drive the first magnetic pole to vibrate circumferentially around the first axis, and obtains at least one second vibration angle of the rotating device relative to the first angle when the output signal of the sensor chip is a valid signal.

[0094] In some embodiments, as described above Figure 2 As shown, after adjusting the radial distance between the sensor chip and the first magnetic pole on the first axis 10a to a second distance, the first magnetic pole can be controlled to vibrate circumferentially around the first axis, and the output signal of the sensor chip can be detected as a valid signal. See the above for details. Figure 2 As described in S202 and S203, they will not be repeated here.

[0095] S503: The processing device 30 determines the test results of the sensor chip based on at least one second vibration angle.

[0096] In some embodiments, based on at least one second vibration angle, the processing device 30 can determine the performance of the sensor chip at a second radial distance between the sensor chip and the first magnetic pole on the first axis 10a. See the above for details. Figure 2 As described in S204, it will not be repeated here.

[0097] Thus, using the aforementioned testing system and method, the performance of the sensor chip can be tested when the radial distance between the sensor chip and the first magnetic pole on the first axis varies. Furthermore, this testing system and method can improve testing efficiency and accuracy.

[0098] In some embodiments, in an actual wheel tooth ring, the magnetic poles on the tooth ring are multiple N-pole and S-pole poles arranged alternately circumferentially, such as N-pole, S-pole, N-pole, S-pole, etc. Due to factors such as different magnetic properties and potentially uneven magnetization, the sensor chip may exhibit different performance when its center matches different magnetic pole regions on a magnetic pole pair (including one N-pole and one S-pole). Therefore, in this embodiment, the matching of different magnetic pole regions of a magnetic pole pair with the center of the sensor chip can be simulated to test the sensor chip's performance when its center matches different magnetic pole regions of the magnetic pole pair. See below for details. Figure 6 As stated above.

[0099] The following is based on Figure 6 The flowchart shown illustrates the testing method for determining the sensor chip performance when different magnetic pole regions of the magnetic pole pair match, as mentioned in the embodiments of this application. Exemplarily, in the process of... Figure 2 or Figure 5 After determining the test results of the sensor chip when the rotating device 10 rotates to the first angle using the method shown, it can also be done through the following... Figure 6 The method shown determines the test results of the sensor chip when the rotating device 10 rotates to the fourth angle.

[0100] like Figure 6 As shown, specifically, the method is as follows:

[0101] S601: The processing device 30 controls the rotating device 10 to rotate to the fourth angle. The interval between the fourth angle and the first angle is k times the fifth angle, where k is an integer greater than or equal to 1.

[0102] In other words, when controlling the rotation of the rotating device 10, the angular increment of each rotation can be a fifth angle. This fifth angle can be determined based on experience or experimentation, ensuring that the number of tests is not excessive while still allowing testing of the sensor chip across multiple magnetic pole regions of the magnetic pole pair. For example, the fifth angle can be between 0.15° and 0.45°.

[0103] In some embodiments, the magnetic poles disposed on the rotating device 10 may include a first magnetic pole, a second magnetic pole, and a third magnetic pole. The first, second, and third magnetic poles are arranged sequentially along the circumference of the first axis 10a. The first and third magnetic poles have the same magnetic properties (e.g., both are N poles or both are S poles), while the first and second magnetic poles have opposite magnetic properties (e.g., one is an N pole and the other is an S pole).

[0104] In some embodiments, the fourth angle is between the first angle and the sixth angle, where the sixth angle is the angle at which the center of the third magnetic pole is located when the rotating device 10 rotates to the first angle. That is, when the rotating device 10 is rotated to its maximum angle, the increase in angle between the maximum angle and the first angle is the difference between the sixth angle and the first angle. Furthermore, when the rotating device 10 is rotated to this maximum angle, the center of the sensor chip matches the center of the third magnetic pole. Thus, by rotating from the center of the first magnetic pole corresponding to the first angle, passing through the second magnetic pole to the center of the third magnetic pole corresponding to the maximum angle, the sensor chip performance when the center of the sensor chip matches different magnetic pole regions of the entire magnetic pole pair can be tested. Moreover, the magnetic field is symmetrically distributed from the center of the first magnetic pole to the center of the third magnetic pole, allowing observation of the sensor chip's output signal under a symmetrically distributed magnetic field.

[0105] In some embodiments, as described above Figure 3 As shown, users can also set the number of magnetic pole pairs in the test parameter adjustment interface U3. Based on the ratio of the angle occupied by a magnetic pole pair to the number of magnetic pole pairs, the angle increment (i.e., the fifth angle) for each rotation when controlling the rotating device 10 to rotate can be determined. Alternatively, in other instances, users can directly set the value of the fifth angle in the test parameter adjustment interface U3; this application does not limit this. In this way, the rotating device 10 can be controlled to rotate based on user-defined parameters, thereby determining the sensor chip performance when the sensor chip center matches different magnetic pole regions of the magnetic pole pair.

[0106] S602: The processing device 30 controls the rotating device 10 to drive the device composed of the first magnetic pole, the second magnetic pole, and the third magnetic pole to vibrate circumferentially around the first axis 10a. Furthermore, the processing device 30 acquires at least one third vibration angle of the rotating device 10 relative to the fourth angle when the output signal of the sensor chip is a valid signal.

[0107] In some embodiments, when the processing device 30 controls the rotating device 10 to rotate to the fourth angle, the magnetic pole region of a certain magnetic pole disposed on the rotating device 10 matches the center of the sensor chip. At this time, the vibration of the magnetic pole matching the center of the sensor chip can be controlled, and whether the output signal of the sensor chip is a valid signal can be detected, thereby determining the performance of the sensor chip when the center of the sensor matches the magnetic pole region corresponding to the fourth angle. See the above for details. Figure 2 As described in S202 and S203, they will not be repeated here.

[0108] S603: The processing device 30 determines the test results of the sensor chip based on at least one third vibration angle.

[0109] In some embodiments, based on at least one third vibration angle, the processing device 30 can determine the performance of the sensor chip when the center of the sensor chip matches the magnetic pole region corresponding to the fourth angle. See the above for details. Figure 2 As described in S204, it will not be repeated here.

[0110] Based on the above process, the processing device 30 can sequentially control the sensor chip to obtain the test results from the first angle to the maximum rotation angle when the fourth angle is the first angle + fifth angle, the first angle + 2*fifth angle, the first angle + 3*fifth angle, etc., based on S601 to S603.

[0111] Thus, the aforementioned testing system and method can be used to test the performance of a sensor chip when its center matches different magnetic pole regions of the magnetic pole pair. Furthermore, this testing system and method can improve testing efficiency and accuracy.

[0112] Furthermore, in other embodiments, the testing system and method provided in this application can also be used to test the performance of the sensor chip when the wheel tooth ring containing the magnetic pole experiences vibration (such as vertical vibration). That is, the processing device 30 can also control the rotating device 10 to cause the wheel tooth ring to vibrate (such as vertically), for example, with any amplitude such as 0.001 mm. The processing device 30 can obtain the vibration amplitude of the wheel tooth ring caused by the rotating device 10 when the output signal of the sensor chip is valid, so as to determine the test result of the sensor chip based on at least one vibration amplitude. In this way, the performance of the sensor chip when the wheel tooth ring vibrates can be simulated using the testing system provided in this application. Furthermore, when testing the sensor chip, the vibration amplitude can be controlled by the processing device 30, such as a computer, improving testing efficiency and making the adjustment of the vibration amplitude more precise.

[0113] It should be noted that the processing device 30 mentioned in this application may include, but is not limited to, a mobile station (MS) or a mobile terminal (MT). For example, the processing device 30 may be a laptop computer, a desktop computer, a laptop computer, or a terminal in industrial control. The embodiments of this application do not limit the specific form of the processing device 30.

[0114] like Figure 7 The diagram illustrates the hardware structure of a processing apparatus 30 according to an embodiment of this application. Figure 7 As shown, the processing device 30 may include one or more processors 302, a system control logic unit 301 connected to at least one of the processors 302, a system memory 305 connected to the system control logic unit 301, a memory 303 connected to the system control logic unit 301, and a network interface 307 connected to the system control logic unit 301.

[0115] It is understood that the structures illustrated in the embodiments of this application do not constitute a limitation on the only possible implementation of the processing device 30. In other embodiments of this application, the processing device 30 may include more or fewer components than illustrated, or combine some components, or split some components, or have different component arrangements. The illustrated components may be implemented in hardware, software, or a combination of software and hardware.

[0116] Processor 302 may include one or more single-core or multi-core processors. In some embodiments, processor 302 may include any combination of general-purpose processors and special-purpose processors (e.g., application processors, baseband processors, etc.). It is understood that in this embodiment, processor 302 may be configured to execute executable instructions 304 stored in memory 303 to implement the test method of this embodiment. When at least one instruction is executed in processor 302, processing device 30 implements the test method of this embodiment.

[0117] System control logic unit 301 may include any suitable interface controller to provide any suitable interface to at least one of the processors 302 and / or any suitable device or component communicating with system control logic unit 301. System control logic unit 301 may include one or more memory controllers to provide an interface to system memory 305. System memory 305 may be used to load and store data and / or instructions. In some embodiments, system memory 305 of processing device 30 may include any suitable volatile memory, such as suitable dynamic random access memory.

[0118] Memory 303 may include one or more tangible, non-transitory computer-readable media for storing data and / or instructions. In some embodiments, memory 303 may include any suitable volatile memory and / or any suitable non-volatile storage device, such as memory 303 may include: random access memory (RAM) and / or cache memory cells, and may further include read-only memory (ROM).

[0119] The memory 303 may include a portion of the storage resources on the device on which the processing device 30 is mounted, or it may be accessible by the device, but is not necessarily part of the device. For example, the memory 303 may be accessed over a network via the network interface 307.

[0120] Specifically, system memory 305 and memory 303 may each include a temporary copy and a permanent copy of instruction 304. Instruction 304 may include, when executed by at least one of processors 302, causing processing device 30 to implement the test method of the embodiments of this application. In some embodiments, instruction 304, hardware, firmware and / or its software components may additionally / alternatively be located in system control logic unit 301, network interface 307 and / or processor 302.

[0121] Network interface 307 may include a transceiver for providing a radio interface to processing device 30, thereby enabling communication with any other suitable device (such as a front-end module, antenna, etc.) via one or more networks. In some embodiments, network interface 307 may be integrated into other components of processing device 30. For example, network interface 307 may be integrated into at least one of processor 302, system memory 305, memory 303, and firmware device (not shown) with instructions.

[0122] Network interface 307 may further include any suitable hardware and / or firmware to provide a multiple-input multiple-output radio interface. For example, network interface 307 may be a network adapter, a wireless network adapter, a telephone modem, and / or a wireless modem.

[0123] The processing device 30 may further include an input / output (I / O) device 306. The input / output device 306 enables a user to interact with the processing device 30.

[0124] In some embodiments, the processing device 30 may further include, but is not limited to, a display (e.g., a liquid crystal display, a touch screen display, etc.), a speaker, a microphone, one or more cameras (e.g., a still image camera and / or a video camera), a flashlight (e.g., a light-emitting diode flash) and a keyboard.

[0125] In some embodiments, the processing device 30 further includes a sensor for determining at least one of environmental conditions or location information associated with the processing device 30.

[0126] In some embodiments, the sensor may include, but is not limited to, a gyroscope sensor, an accelerometer, a proximity sensor, an ambient light sensor, and a positioning unit. The positioning unit may also be part of or interact with the network interface 307 to communicate with components of the positioning network, such as global positioning system (GPS) satellites.

[0127] The embodiments disclosed in this application can be implemented in hardware, software, firmware, or a combination of these implementation methods. Embodiments of this application can be implemented as computer programs or program code executable on a programmable system, the programmable system including at least one processor, a storage system (including volatile and non-volatile memory and / or storage elements), at least one input device, and at least one output device.

[0128] Program code can be applied to input instructions to execute the functions described in this application and generate output information. The output information can be applied to one or more output devices in a known manner. For the purposes of this application, the processing system includes any system having a processor such as, for example, a digit gate processor, a microcontroller, an application-specific integrated circuit, or a microprocessor.

[0129] The program code can be implemented using a high-level procedural language or an object-oriented programming language to communicate with the processing system. Assembly language or machine language can also be used when needed. In fact, the mechanisms described in this application are not limited to any particular programming language. In either case, the language can be a compiled language or an interpreted language.

[0130] In some cases, the disclosed embodiments may be implemented in hardware, firmware, software, or any combination thereof. The disclosed embodiments may also be implemented as instructions carried or stored thereon on one or more temporary or non-temporary machine-readable (e.g., computer-readable) storage media, which may be read and executed by one or more processors. For example, the instructions may be distributed via a network or through other computer-readable media. Therefore, machine-readable media may include any mechanism for storing or transmitting information in a machine-readable (e.g., computer-readable) form, including but not limited to floppy disks, optical disks, optical discs, magneto-optical disks, ROM, RAM, magnetic cards or optical cards, or tangible machine-readable memories for transmitting information using electrical, optical, acoustic, or other forms of propagation signals via the Internet (e.g., carrier waves, infrared signal digit gating, etc.). Therefore, machine-readable media include any type of machine-readable medium suitable for storing or transmitting electronic instructions or information in a machine-readable (e.g., computer-readable) form.

[0131] In the accompanying drawings, some structural or methodological features may be shown in a specific arrangement and / or order. However, it should be understood that such a specific arrangement and / or order may not be necessary. Rather, in some embodiments, these features may be arranged in a manner and / or order different from that shown in the illustrative drawings. Furthermore, including structural or methodological features in a particular figure does not imply that such features are required in all embodiments, and in some embodiments, these features may be omitted or may be combined with other features.

[0132] It should be noted that all units / modules mentioned in the device embodiments of this application are logical units / modules. Physically, a logical unit / module can be a physical unit / module, a part of a physical unit / module, or a combination of multiple physical units / modules. The physical implementation of these logical units / modules themselves is not the most important factor; the combination of functions implemented by these logical units / modules is the key to solving the technical problems proposed in this application. Furthermore, to highlight the innovative aspects of this application, the above-described device embodiments of this application have not introduced units / modules that are not closely related to solving the technical problems proposed in this application. This does not mean that the above-described device embodiments do not contain other units / modules.

[0133] It should be noted that in the examples and description of this application, relational terms such as "first" and "second" are used only to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one" does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes said element.

[0134] Although this application has been illustrated and described with reference to certain preferred embodiments thereof, those skilled in the art will understand that various changes in form and detail may be made thereto without departing from the scope of this application.

Claims

1. A testing method, characterized in that, The invention is applied to a testing system, which includes a rotating device, a clamping device, and a processing device. The rotating device is used to drive at least one magnetic pole disposed on the rotating device to rotate around a first axis. The clamping device is used to mount a calibration chip or a sensor chip. When the calibration chip is mounted on the clamping device, the first position where the center line of the calibration chip is located matches the second position where the center line of the sensor chip is located when the sensor chip is mounted on the clamping device. The accuracy of the calibration chip is higher than that of the sensor chip. Furthermore, the method includes: When the calibration chip is mounted on the clamping device, the processing device controls the rotating device to rotate to a first angle, wherein when the rotating device rotates to the first angle, the calibration chip outputs a first signal, and when the calibration chip outputs the first signal, it indicates that the first region of the first magnetic pole among the at least one magnetic pole matches the center of the calibration chip. When the rotating device rotates to the first angle and the sensor chip is mounted on the clamping device, the processing device controls the rotating device to drive the first magnetic pole to vibrate circumferentially around the first axis, and obtains at least one first vibration angle of the rotating device relative to the first angle when the output signal of the sensor chip is a valid signal. The processing device determines the test result of the sensor chip based on the at least one first vibration angle.

2. The method according to claim 1, characterized in that, The processing device determines the test result of the sensor chip based on the at least one first vibration angle, including: If at least one of the following conditions is met at the at least one first vibration angle, the processing device determines that the performance of the sensor chip does not meet the performance requirements: Among the at least one first vibration angle, one or more of the first vibration angles have an amplitude relative to the first angle that is less than a first vibration angle threshold. The average value of the amplitude of each of the at least one first vibration angles relative to the first angle is less than the second vibration angle threshold.

3. The method according to claim 1, characterized in that, The first region of the first magnetic pole is the center of the first magnetic pole; and, The first region of the first magnetic pole in the at least one magnetic pole matches the center of the calibration chip, including: The first signal is a 0V voltage signal.

4. The method according to any one of claims 1 to 3, characterized in that, During the process of the processing device controlling the rotating device to drive the first magnetic pole to vibrate circumferentially around the first axis, the first magnetic pole vibrates circumferentially with a first amplitude in a first time period and with a second amplitude in a second time period. The second time period is the time period after the first time period, and the second amplitude is greater than the first amplitude.

5. The method according to claim 4, characterized in that, The first magnetic pole vibrates circumferentially with a first amplitude during a first time period, including: During the first sub-time period of the first time period, the first magnetic pole vibrates circumferentially within the range of the first angle to the second angle, where the second angle is the sum of the first angle and the first amplitude. During the second sub-time period of the first time period, the first magnetic pole vibrates circumferentially within the range of the first angle to the third angle, wherein the third angle is the difference between the first angle and the first amplitude.

6. The method according to any one of claims 1 to 3, characterized in that, When the processing device obtains that the output signal of the sensor chip is a valid signal, during the process of the rotating device undergoing at least one first vibration angle relative to the first angle, the radial distance between the sensor chip and the first magnetic pole on the first axis is a first distance. Furthermore, the method also includes: The processing device adjusts the radial distance between the sensor chip and the first magnetic pole on the first axis to a second distance based on the clamping device; The processing device controls the rotating device to drive the first magnetic pole to vibrate circumferentially around the first axis, and obtains at least one second vibration angle of the rotating device relative to the first angle when the output signal of the sensor chip is a valid signal. The processing device determines the test result of the sensor chip based on the at least one second vibration angle.

7. The method according to claim 3, characterized in that, The at least one magnetic pole further includes a second magnetic pole and a third magnetic pole, wherein the first magnetic pole, the second magnetic pole and the third magnetic pole are arranged sequentially along the circumference of the first axis, the first magnetic pole and the third magnetic pole have the same magnetism, and the first magnetic pole and the second magnetic pole have opposite magnetism. The method further includes: The processing device controls the rotating device to rotate to a fourth angle, wherein the interval between the fourth angle and the first angle is k times the fifth angle, where k is an integer greater than or equal to 1, the fourth angle is between the first angle and the sixth angle, and the sixth angle is the angle at which the center of the third magnetic pole is located when the rotating device rotates to the first angle; The processing device controls the rotating device to drive the device composed of the first magnetic pole, the second magnetic pole and the third magnetic pole to vibrate circumferentially around the first axis; When the processing device obtains that the output signal of the sensor chip is a valid signal, the rotating device has at least one third vibration angle relative to the fourth angle; The processing device determines the test result of the sensor chip based on the at least one third vibration angle.

8. The method according to claim 1, characterized in that, The output signal of the sensor chip is a valid signal, including: When the communication protocol of the sensor chip is the standard interface AK protocol between the wheel speed sensor and the electronic control unit, and the output signal of the sensor chip is a high-level signal, the output signal of the sensor chip is a valid signal. or, When the communication protocol of the sensor chip is a pulse width modulation (PWM) protocol, and the pulse width of the output signal of the sensor chip is within a preset pulse width range, the output signal of the sensor chip is a valid signal.

9. The method according to claim 1, characterized in that, The first region of the first magnetic pole in the at least one magnetic pole matches the center of the calibration chip, including: the straight line connecting the first region of the first magnetic pole and the center of the calibration chip extends radially along the first axis; When the calibration chip is installed in the clamping device, the first position where the center line of the calibration chip is located matches the second position where the center line of the sensor chip is located when the sensor chip is installed in the clamping device, including: the first position where the center line of the calibration chip is located coincides with the second position where the center line of the sensor chip is located.

10. A testing system, characterized in that, It includes the rotating device, clamping device, and processing device as described in any one of claims 1 to 9.

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