Large-current impact test method and device for copper bar energy storage connector

By constructing a temperature response factor and a multi-frequency correction model, the resistance measurement error caused by the skin effect in the high-current impulse test of copper busbar energy storage connectors was solved, and the performance of copper busbar energy storage connectors was accurately evaluated.

CN121933889APending Publication Date: 2026-04-28金锚电力控股有限公司
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
金锚电力控股有限公司
Filing Date
2026-02-06
Publication Date
2026-04-28

AI Technical Summary

Technical Problem

Existing technologies fail to effectively correct for resistance measurement errors caused by the skin effect in high-current surge tests of copper busbar energy storage connectors, leading to non-conforming products being mistakenly judged as qualified, thus affecting the accuracy of test results.

Method used

By acquiring real-time input current, contact resistance, and temperature data of the copper busbar energy storage connector, discrimination factors such as temperature response factor, peak factor, and average rise time are constructed. Combined with a multi-frequency correction model, the contact resistance value is corrected to eliminate the influence of the skin effect.

Benefits of technology

This improves the accuracy of high-current surge test results and ensures the accuracy of electrical performance and thermal stability assessments for copper busbar energy storage connectors.

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Abstract

The invention relates to the technical field of electrical variable measurement, in particular to a large-current impact test method and device for a copper bar energy storage connector, and the method comprises the steps: obtaining the input current, contact resistance and temperature of each connector in the whole test process in real time; according to the temperature change speed, the temperature peak value and the average power of each connector in the whole test process and the current rise time of each connector influenced by each preset impact current, obtaining a discrimination factor of each connector, and further obtaining each connector influenced by the skin effect; the correction coefficient of each connector influenced by the skin effect is obtained according to a pre-constructed multi-frequency correction model, then the contact resistance is corrected, and whether the performance of each connector is qualified or not is judged. According to the invention, each connector influenced by the skin effect is more accurately obtained, so that the correction accuracy of the contact resistance is improved, and the accuracy of a large-current impact test result is improved.
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Description

Technical Field

[0001] This application relates to the field of electrical variable measurement technology, specifically to a method and apparatus for testing high current impulses in copper busbar energy storage connectors. Background Technology

[0002] Copper busbar energy storage connectors are electrical connection devices used in energy storage equipment, such as battery packs for new energy vehicles, inverters in power generation and energy storage devices, and motors. Their rectangular cross-section copper conductor structure can carry large currents in the thousands of amperes, ensuring efficient and safe current flow between battery packs or power devices. In energy storage scenarios, short-circuit faults, surges, and unexpected start-ups and shutdowns inevitably lead to short-term transient high-current impacts. Whether the copper busbar energy storage connector can maintain good conductivity and thermal stability after undergoing extreme high-current impacts to maintain normal equipment operation is one of the important tests for judging the electrical performance of copper busbar energy storage connectors.

[0003] In high-current surge tests of copper busbar energy storage connectors, a high-current generator is typically used for performance testing. The high-current generator amplifies the output current through current amplification circuits or devices and applies it to the copper busbar energy storage connector to simulate abnormal high-current surges in real-world scenarios. However, when the current in the copper busbar energy storage connector suddenly increases, the skin effect occurs, causing the current in the copper busbar to tend to flow towards the surface of the conductor. This results in the copper busbar not being fully utilized, leading to a measured resistance value that is much larger than the actual resistance of the conductor. Current technology, when correcting for resistance measurement errors caused by the skin effect, does not adequately consider the interference of resistance values ​​from substandard copper busbar energy storage connectors. This can easily lead to misinterpreting the resistance values ​​of substandard copper busbar energy storage connectors as resistance values ​​caused by the skin effect, resulting in biased resistance correction results and making it difficult to accurately assess the electrical performance of the copper busbar energy storage connector under high-current surges. Summary of the Invention

[0004] To address the aforementioned technical problems, the purpose of this application is to provide a high-current impulse testing method and apparatus for copper busbar energy storage connectors. The specific technical solution adopted is as follows: In a first aspect, embodiments of this application provide a high-current impulse test method for copper busbar energy storage connectors, the method comprising the following steps: Real-time acquisition of input current, contact resistance, and temperature for each connector throughout the entire testing process; The temperature response factor of each connector is obtained based on the temperature difference between all adjacent moments during the entire test process; the temperature peak factor of each connector is obtained based on the difference between the temperature peak and the average temperature level during the entire test process. Based on the duration of the rising edge of the input current of each connector when it is affected by each preset surge current, the average rise time of each connector is obtained. Combined with the average power of each connector throughout the test process, as well as the temperature response factor and temperature peak factor of each connector, the discrimination factor of each connector is obtained, and then the connectors affected by the skin effect are obtained. The correction coefficients of each connector affected by the skin effect are obtained based on a pre-built multi-frequency correction model. Then, the contact resistance of each connector affected by the skin effect is corrected, and the performance of each connector is judged to be qualified.

[0005] Preferably, the temperature response factor of each connector refers to the sum of the absolute differences between the temperatures of each connector at all adjacent moments throughout its entire testing process.

[0006] Preferably, the temperature peak factor of each connector refers to the ratio of the peak temperature to the average temperature of each connector throughout the entire testing process.

[0007] Preferably, the method for obtaining the average rise time of each connector is as follows: The peak values ​​of each preset impact current experienced by each connector during the entire test are obtained, and the time corresponding to each peak value is recorded as the peak time. The current amplitude closest to the peak value of each connector's input current is... and The time interval between these moments is denoted as the current rise time of each connector at each peak moment; where, This represents the input current of each connector at each peak time. The average rise time of the current at all peak times for each connector is recorded as the average rise time of each connector.

[0008] Preferably, the method for obtaining the discrimination factor of each connector is as follows: Obtain the average power of each connector throughout the entire testing process; Normalize the temperature response factor, temperature peak factor, average rise time and average power of all connectors respectively. Calculate the discrimination factor for each connector: In the formula, Let be the discriminant factor for the nth connector; For the normalized first Temperature response factor of each connector; For the normalized first Temperature peak factor of each connector; For the normalized first Average rise time of each connector; For the normalized first Average power of each connector.

[0009] Preferably, the method for obtaining each connector affected by the skin effect is as follows: the discriminant factors of all connectors are divided into two clusters, and each connector corresponding to the cluster with the largest discriminant factor mean is taken as each connector affected by the skin effect.

[0010] Preferably, the method for obtaining the correction coefficients of each connector affected by the skin effect is as follows: Calculate the loop impedance of each connector affected by the skin effect under each preset inrush current; Substitute the loop impedance of each connector affected by the skin effect under all preset inrush currents into the pre-built multi-frequency correction model to obtain the correction coefficient of each connector affected by the skin effect.

[0011] Preferably, the calculation formula for correcting the contact resistance of each connector affected by the skin effect is as follows: In the formula, This represents the corrected contact resistance of the i-th connector affected by the skin effect at time v during the k-th preset surge current period. This represents the measured contact resistance of the i-th connector affected by the skin effect at time v during the k-th preset surge current period. The correction coefficient for the i-th connector affected by the skin effect; Let be the current rise time of the i-th connector affected by the skin effect at the k-th peak moment.

[0012] Preferably, the specific process for determining whether the performance of each connector is qualified is as follows: if the corrected contact resistance values ​​of each connector are all less than the preset contact resistance threshold, then the performance of each corresponding connector is determined to be qualified; otherwise, the performance of each corresponding connector is determined to be unqualified.

[0013] Secondly, embodiments of this application also provide a high-current impulse testing device for a copper busbar energy storage connector, including a memory, a processor, and a computer program stored in the memory and running on the processor. When the processor executes the computer program, it implements the steps of any of the above-described high-current impulse testing methods for a copper busbar energy storage connector.

[0014] This application has at least the following beneficial effects: This application addresses the problem that when correcting contact resistance measurements caused by the skin effect, the error caused by substandard copper busbar energy storage connectors is not considered, leading to misjudgments of their electrical performance. By analyzing the conductor temperature change characteristics and current data characteristics of qualified and unqualified copper busbar energy storage connectors, a temperature response factor, temperature peak factor, average rise time, and average power are constructed, and then a discrimination factor is constructed to determine whether each connector has experienced the skin effect during high-current surge testing. Based on a pre-constructed multi-frequency correction model, the correction coefficients of each connector exhibiting the skin effect are calculated, and the contact resistance measurements of each connector are corrected, thereby obtaining test results after eliminating skin effect interference and improving the accuracy of high-current surge test results. Attached Figure Description

[0015] To more clearly illustrate the technical solutions and advantages in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 A flowchart illustrating the steps of a high-current impulse test method for a copper busbar energy storage connector, as provided in one embodiment of this application; Figure 2 This is a flowchart illustrating the process of obtaining the discrimination factors for each connector according to one embodiment of this application. Detailed Implementation

[0017] To further illustrate the technical means and effects adopted by this application to achieve the intended purpose of the invention, the following, in conjunction with the accompanying drawings and preferred embodiments, details the specific implementation, structure, features, and effects of a high-current impulse testing method and apparatus for a copper busbar energy storage connector proposed in this application. In the following description, different "one embodiment" or "another embodiment" do not necessarily refer to the same embodiment. Furthermore, specific features, structures, or characteristics in one or more embodiments can be combined in any suitable form.

[0018] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains.

[0019] The following description, in conjunction with the accompanying drawings, details the specific scheme of the high-current impulse test method and apparatus for a copper busbar energy storage connector provided in this application.

[0020] Please see Figure 1The diagram illustrates a flowchart of a high-current surge test method for a copper busbar energy storage connector according to an embodiment of this application. The method includes the following steps: Step 1: Real-time acquisition of input current, contact resistance, and temperature for each connector throughout the entire testing process.

[0021] The copper busbar energy storage connectors produced in the same batch are individually connected to a high-current generator for testing. The testing time for a single copper busbar energy storage connector is u minutes, which is 10 in this embodiment. During the test, the input current applied to the copper busbar energy storage connector is the current generated by the high-current generator. Based on different preset parameters, the high-current generator produces currents with different waveforms and amplitudes to simulate the inrush current generated in the energy storage device scenario. The specific parameter settings of the high-current generator can be set by the implementer according to the implementation scenario and the standard of the copper busbar energy storage connector; this application does not impose special restrictions. However, to meet the requirements of the subsequent skin effect multi-frequency correction method, the generated inrush current must contain at least three different frequencies and current amplitudes. The various inrush currents generated by the high-current generator are denoted as various preset inrush currents.

[0022] For ease of description, the copper busbar energy storage connector will be referred to as the connector below. Current transformers and voltage transformers are used to collect the input current and voltage of each connector in real time throughout the entire testing process. Based on the current and voltage of each connector at each moment, the contact resistance data of each connector at each sampling moment is measured using the voltage drop method. The voltage drop method for measuring resistance is a well-known technique, and its specific process will not be elaborated further. The temperature of the conductor surface of each connector is collected in real time throughout the entire testing process using thermocouple temperature sensors.

[0023] In this embodiment, the sampling frequency of the connector's input current and input voltage is set to FkHz. The specific sampling frequency setting is not subject to special restrictions and can be set according to the implementation scenario, but it should satisfy the Nyquist sampling theorem. In this embodiment, F is set to 100. The temperature data is collected once every 1 second.

[0024] Step 2: Obtain the temperature response factor of each connector based on the temperature difference at all adjacent moments during the entire test process; obtain the temperature peak factor of each connector based on the difference between the temperature peak and the average temperature level during the entire test process.

[0025] When a high-current generator amplifies the output current, the millisecond-level transient surge current includes a large number of high-frequency components in the rising edge from the normal current amplitude to the current peak. This can cause the skin effect, where the current concentrates on the surface of the copper busbar, with almost no conductivity within the busbar itself. This results in a measured contact resistance value that is proportionally higher than the actual value. The increased resistance causes localized overheating on the surface of the copper busbar, distorting the temperature rise result. Furthermore, the localized high temperature of the copper busbar further increases its resistance, inevitably leading to a deviation in the contact resistance test results, resulting in a measured contact resistance value that is artificially higher than the actual contact resistance value of the connector. Therefore, it is necessary to correct for the contact resistance measurement error caused by the skin effect. However, during correction, since defective connectors can also increase the contact resistance value, it is easy to mistake the contact resistance of defective connectors for the contact resistance caused by the skin effect, thus leading to deviations in the contact resistance correction results. Therefore, it is necessary to analyze the measurement data of each connector specifically to distinguish whether the high contact resistance value is caused by the skin effect or by defective connectors.

[0026] Specifically, the first The connector in the first The temperature data at each moment is recorded as follows: , will the The connector in the first The input current and contact resistance data at each moment are respectively expressed as follows: Because the time intervals for collecting conductor temperature data differ from those for collecting input current and contact resistance data, the time units for different data points also differ. The sampling time is divided in seconds. The sampling time is divided in milliseconds.

[0027] As mentioned above, the skin effect can cause connector contact resistance test results to be higher than normal, and unqualified connectors will have contact resistance higher than the standard. The interference from the skin effect can make the contact resistance test results of standard connectors and unqualified connectors quite similar. Although both copper busbars experiencing the skin effect and unqualified copper busbars will exhibit abnormal temperature rises, the skin effect interference caused by transient current surges is short-lived, with rapid temperature rise and fall, and does not affect the electrical performance of the copper busbar itself. In contrast, unqualified copper busbars with inherently high contact resistance exhibit slower temperature rises, and due to the thermal conduction effect of the entire conductor, the subsequent cooling rate is also slow. Therefore, the contact resistance test results of each connector can be analyzed based on its temperature change characteristics to determine whether the skin effect interferes with their performance.

[0028] With the first Taking a connector as an example, we first analyze the real-time temperature change characteristics of the connector's conductor throughout the entire test process.

[0029] When the current in the conductor of a connector suddenly increases, due to the skin effect, the current tends to flow towards the surface of the conductor, while no current flows through the middle part of the conductor. This results in a rapid transient temperature rise on the conductor surface. Since the middle part of the conductor is not heated by the current, the conductor cools down quickly after a large current surge. In contrast, substandard connectors have higher overall contact resistance. When subjected to a large current surge, the work done by the current on the conductor is applied to the entire conductor, resulting in a slower temperature rise. After the current returns to normal, the cooling rate of the conductor is also relatively gradual.

[0030] As a preferred implementation, the temperature response factor of each connector is obtained based on the temperature difference of each connector at all adjacent moments throughout its entire test process, which is used to characterize the response speed of the temperature data of each connector.

[0031] The first The temperature response factor of each connector is denoted as . Its specific expression is: In the formula, For the first Temperature response factor of each connector This represents the total number of temperature data sampling points throughout the entire testing process. , The first The connector was the [number]th ... The, the Temperature data at each moment.

[0032] when The larger the value, the faster the conductor surface temperature of the nth connector responds during the entire test. There may be a rapid heating and cooling process on the conductor surface, so the connector is more likely to have a skin effect.

[0033] On the other hand, due to the skin effect, the current acts on the surface of the conductor. The power on the surface of the conductor is relatively large in a short period of time, so the maximum temperature of the conductor exhibits extreme fluctuation characteristics throughout the temperature change process.

[0034] The first The ratio of the peak temperature to the average temperature of each connector during its entire testing process is denoted as the [number]th [connector]. The temperature peak factor of each connector is denoted as , used to indicate the first The temperature peak of each connector fluctuates relative to the entire temperature change process.

[0035] The larger the temperature peak factor, the more obvious the temperature fluctuation when the corresponding connector reaches the peak temperature during the entire measurement process, and the more likely the connector is to have skin effect.

[0036] Step 3: Based on the duration of the rising edge of the input current when each connector is affected by each preset surge current, obtain the average rise time of each connector. Combine this with the average power of each connector throughout the entire test process, as well as the temperature response factor and temperature peak factor of each connector, to obtain the discrimination factor of each connector, and thus obtain the connectors affected by the skin effect.

[0037] Furthermore, while the temperature change characteristics of a connector can reflect its operating status, the actual temperature change process is affected by the current data during the testing process. The current affects the long-term average power acting on the conductor, which directly affects the temperature change of the conductor. Therefore, it is necessary to comprehensively evaluate the status of the connector based on the current data.

[0038] Specifically, abnormal contact resistance in a connector affects the changes in the current flowing through it. Standard connectors have extremely low contact resistance, resulting in minimal impedance limitation as the input current increases, allowing them to reach the target current peak in a very short time with a short rise time. In contrast, substandard connectors have higher actual contact resistance. This additional resistance causes voltage division during the current rise process, prolonging the rise time. A shorter rise time indicates a faster periodic change in the current within that time, leading to a higher frequency and affecting the significance of the skin effect. Therefore, the magnitude of the current rise time is directly related to the current change characteristics caused by the skin effect on the conductor.

[0039] Typically, the rise time is the time it takes for the current to increase from 10% to 90% of the peak current amplitude. The peak values ​​of each preset inrush current emitted by the high-current generator during the entire test process are obtained for the nth connector, and the corresponding times of each peak value are recorded as the peak times. The closest current amplitude before the j-th peak time in the input current of each connector is... and The times are recorded as follows: and ,in, Let the input current at the j-th peak time be... and The difference is denoted as the first. The current rise time of a connector at the j-th peak moment is denoted as . ; will the first The average current rise time of each connector at all peak times is denoted as the nth. The average rise time of each connector is denoted as . The result The smaller the value, the more likely it is to be the first... The more likely the contact resistance measurement deviation of a connector is to be caused by the skin effect.

[0040] Furthermore, average power reflects the energy dissipation of current flowing through the conductor during testing. The skin effect causes an instantaneous increase in contact resistance, which decreases after a large current surge, resulting in relatively low energy dissipation throughout the test. In contrast, substandard connectors, due to their inherently higher contact resistance, experience higher energy dissipation during the test. Therefore, the average power of connectors affected by the skin effect is relatively smaller compared to substandard connectors. Thus, the average power indicator can serve as one of the characteristic indicators for distinguishing between substandard connectors and connectors affected by the skin effect.

[0041] Then calculate the th The average power of each connector is calculated using the following formula: In the formula, For the first Average power of each connector; This represents the total number of sampling moments for the input current throughout the entire test process; For the first The connector was the [number]th ... Input current at a given moment; For the first The connector was the [number]th ... The contact resistance at a given moment. (The result is...) The smaller the value, the higher the value. The more likely the contact resistance measurement deviation of a connector is to be caused by the skin effect.

[0042] Furthermore, the temperature response factor, peak temperature factor, average rise time, and average power of all connectors are obtained using the above method. Then, the temperature response factor, peak temperature factor, average rise time, and average power of all connectors are normalized using the maximum-minimum-value normalization method, and a discriminant factor for each connector is constructed. In the formula, Let be the discriminant factor for the nth connector; For the normalized first Temperature response factor of each connector; For the normalized first Temperature peak factor of each connector; For the normalized first Average rise time of each connector; For the normalized first The average power of each connector. (Result) The larger the value, the greater the likelihood that the nth connector will exhibit skin effect during testing. The flowchart for obtaining the discrimination factor for each connector is shown below. Figure 2 As shown.

[0043] Then, the discriminant factors of all connectors are used as input to the K-means clustering algorithm. The value of is 2, and the number of iterations is 50. The discriminant factors of all connectors are divided into two clusters. The clustering process of the K-means clustering algorithm is a current technique, and its specific process will not be elaborated further. The connectors corresponding to the cluster with the largest final discriminant factor mean are considered as connectors affected by the skin effect.

[0044] Step 4: Obtain the correction coefficients of each connector affected by the skin effect based on the pre-built multi-frequency correction model, and then correct the contact resistance of each connector affected by the skin effect to determine whether the performance of each connector is qualified.

[0045] Furthermore, the multi-frequency correction method in the invention patent "CN109782359B Multi-frequency correction method based on micro-resistivity scanning imaging of oil-based mud environment" is used to correct the contact resistance measurement value of the connector affected by the skin effect obtained in this application.

[0046] The specific steps are as follows: based on the input current and input voltage data of each connector affected by the skin effect when subjected to each preset impact current, Ohm's law is used to calculate the loop impedance of each connector under each preset impact current. The method of calculating loop impedance using Ohm's law is existing technology, and its specific process will not be elaborated here.

[0047] The multi-frequency correction method in the above invention patent is denoted as a pre-constructed multi-frequency correction model. Then, the loop impedance of each connector affected by the skin effect under all preset inrush currents is substituted into the pre-constructed multi-frequency correction model to obtain the correction coefficient of each connector affected by the skin effect.

[0048] Based on the correction coefficients of each connector affected by the skin effect, the contact resistance measurement value under a preset surge current is corrected. The specific formula is as follows: In the formula, This represents the corrected contact resistance of the i-th connector affected by the skin effect at time v during the k-th preset surge current period. This represents the measured contact resistance of the i-th connector affected by the skin effect at time v during the k-th preset surge current period. The correction coefficient for the i-th connector affected by the skin effect; Let be the current rise time of the i-th connector affected by the skin effect at the k-th peak moment.

[0049] After correcting the contact resistance test results of each connector according to the above method, the electrical performance of each connector is analyzed using the corrected contact resistance.

[0050] Specifically, based on the production execution standards of each connector model measured, when each connector is subjected to a preset inrush current, if the calibrated contact resistance values ​​of each connector are all less than the preset contact resistance threshold, then the electrical performance and thermal stability of the corresponding connector are deemed to meet the qualified standards; otherwise, the electrical performance and thermal stability of the corresponding connector are deemed to be unqualified. The preset contact resistance threshold can be set by the implementer according to the connector model in the implementation scenario. For example, the preset contact resistance threshold for a 350A connector is... .

[0051] Based on the same inventive concept as the above method, this application embodiment also provides a high-current impulse testing device for a copper busbar energy storage connector, including a memory, a processor, and a computer program stored in the memory and running on the processor. When the processor executes the computer program, it implements the steps of any one of the above-described methods for high-current impulse testing of a copper busbar energy storage connector.

[0052] It should be noted that the order of the embodiments described above is merely for descriptive purposes and does not represent the superiority or inferiority of the embodiments. Furthermore, specific embodiments of this specification have been described above. Additionally, the processes depicted in the accompanying drawings do not necessarily require a specific or sequential order to achieve the desired results. In some implementations, multitasking and parallel processing are possible or may be advantageous.

[0053] The various embodiments in this specification are described in a progressive manner. The same or similar parts between the various embodiments can be referred to each other. Each embodiment focuses on describing the differences from other embodiments.

[0054] The above description is only a preferred embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the principles of this application should be included within the protection scope of this application.

Claims

1. A high-current impulse test method for copper busbar energy storage connectors, characterized in that, The method includes the following steps: Real-time acquisition of input current, contact resistance, and temperature for each connector throughout the entire testing process; The temperature response factor of each connector is obtained based on the temperature difference between all adjacent moments during the entire test process; the temperature peak factor of each connector is obtained based on the difference between the temperature peak and the average temperature level during the entire test process. Based on the duration of the rising edge of the input current of each connector when it is affected by each preset surge current, the average rise time of each connector is obtained. Combined with the average power of each connector throughout the test process, as well as the temperature response factor and temperature peak factor of each connector, the discrimination factor of each connector is obtained, and then the connectors affected by the skin effect are obtained. The correction coefficients of each connector affected by the skin effect are obtained based on a pre-built multi-frequency correction model. Then, the contact resistance of each connector affected by the skin effect is corrected, and the performance of each connector is judged to be qualified.

2. The high-current impulse test method for a copper busbar energy storage connector as described in claim 1, characterized in that, The temperature response factor of each connector refers to the sum of the absolute differences between the temperatures of each connector at all adjacent moments during its entire testing process.

3. The high-current impulse test method for a copper busbar energy storage connector as described in claim 1, characterized in that, The temperature peak factor of each connector refers to the ratio of the peak temperature to the average temperature of each connector during the entire testing process.

4. The high-current impulse test method for a copper busbar energy storage connector as described in claim 1, characterized in that, The method for obtaining the average rise time of each connector is as follows: The peak values ​​of each preset impact current experienced by each connector during the entire test are obtained, and the time corresponding to each peak value is recorded as the peak time. The current amplitude closest to the peak value of each connector's input current is... and The time interval between these moments is denoted as the current rise time of each connector at each peak moment; where, This represents the input current of each connector at each peak time. The average rise time of the current at all peak times for each connector is recorded as the average rise time of each connector.

5. The high-current impulse test method for a copper busbar energy storage connector as described in claim 1, characterized in that, The method for obtaining the discrimination factor of each connector is as follows: Obtain the average power of each connector throughout the entire testing process; Normalize the temperature response factor, temperature peak factor, average rise time and average power of all connectors respectively. Calculate the discrimination factor for each connector: In the formula, Let be the discriminant factor for the nth connector; For the normalized first Temperature response factor of each connector; For the normalized first Temperature peak factor of each connector; For the normalized first Average rise time of each connector; For the normalized first Average power of each connector.

6. The high-current impulse test method for a copper busbar energy storage connector as described in claim 1, characterized in that, The method for obtaining each connector affected by the skin effect is as follows: the discriminant factors of all connectors are divided into two clusters, and each connector corresponding to the cluster with the largest discriminant factor mean is taken as each connector affected by the skin effect.

7. The high-current impulse test method for a copper busbar energy storage connector as described in claim 1, characterized in that, The method for obtaining the correction coefficients of each connector affected by the skin effect is as follows: Calculate the loop impedance of each connector affected by the skin effect under each preset inrush current; Substitute the loop impedance of each connector affected by the skin effect under all preset inrush currents into the pre-built multi-frequency correction model to obtain the correction coefficient of each connector affected by the skin effect.

8. The high-current impulse test method for a copper busbar energy storage connector as described in claim 4, characterized in that, The calculation formula for correcting the contact resistance of each connector affected by the skin effect is as follows: In the formula, This represents the corrected contact resistance of the i-th connector affected by the skin effect at time v during the k-th preset surge current period. This represents the measured contact resistance of the i-th connector affected by the skin effect at time v during the k-th preset surge current period. The correction coefficient for the i-th connector affected by the skin effect; Let be the current rise time of the i-th connector affected by the skin effect at the k-th peak moment.

9. The high-current impulse test method for a copper busbar energy storage connector as described in claim 1, characterized in that, The specific process for determining whether the performance of each connector is qualified is as follows: if the corrected contact resistance values ​​of each connector are all less than the preset contact resistance threshold, then the performance of each corresponding connector is determined to be qualified; otherwise, the performance of each corresponding connector is determined to be unqualified.

10. A high-current impulse testing device for a copper busbar energy storage connector, comprising a memory, a processor, and a computer program stored in the memory and running on the processor, characterized in that, When the processor executes the computer program, it implements the steps of the high-current impulse test method for a copper busbar energy storage connector as described in any one of claims 1-9.

Citation Information

Patent Citations

  • A Multi-Frequency Correction Method Based on Microresistivity Scanning Imaging of Oil-Based Mud Environment

    CN109782359B