Liquid cooling structure and server with same

Abstract

The invention relates to a liquid cooling structure and a server with the liquid cooling structure, and the liquid cooling structure comprises a main liquid inlet, a main liquid outlet, a water collection and distribution device, and a first heat dissipation part. The main liquid inlet and the main liquid outlet are suitable for being communicated with an external cooling liquid pump and conveying cooling liquid. The water collecting and distributing device is provided with a water distributing cavity, a water collecting cavity, a water distributing port, a water collecting port, a first liquid inlet and a second liquid outlet; the first liquid inlet and the water distribution port are both communicated with the water distribution cavity, the second liquid outlet and the water collection port are both communicated with the water collection cavity, the first liquid inlet is communicated with the main liquid inlet, and the second liquid outlet is communicated with the main liquid outlet; the number of the water collecting ports is consistent with that of the water distribution ports; a first heat exchange channel is arranged in the first heat dissipation piece, and the two ends of the first heat exchange channel communicate with the water distribution opening and the water collection opening correspondingly. The number of the first heat dissipation pieces is more than two. And by arranging the water collecting and distributing device, the use of pipelines for conveying the cooling liquid in the server is effectively reduced.

Description

Technical Field

[0001] This application relates to the field of server heat dissipation technology, and in particular to a liquid cooling structure and a server having the same. Background Technology

[0002] Currently, the main heat dissipation methods for data center servers are air cooling and liquid cooling. Air cooling uses air as the heat dissipation medium, with fans, heat sinks, and other devices carrying away the heat generated by the server. Liquid cooling uses water or other liquids as the coolant to dissipate heat from the server. However, air cooling has drawbacks such as low heat dissipation efficiency, high energy consumption, and high noise, leading to an increasing number of servers choosing liquid cooling.

[0003] For servers with many internal electronic components, a large number of liquid cooling heat dissipation components need to be installed inside. This requires a large number of coolant pipelines to transport coolant to each liquid cooling heat dissipation component. A large number of coolant pipelines not only take up a lot of internal space of the server, but also make it inconvenient to maintain and replace the equipment.

[0004] Therefore, how to design the liquid cooling structure of a server to reduce the space occupied by the piping has become a problem that urgently needs to be solved by those skilled in the art. Summary of the Invention

[0005] In view of this, this application proposes a liquid cooling structure and a server having the same.

[0006] According to another aspect of this application, a liquid cooling structure is provided, comprising: a main liquid inlet, a main liquid outlet, a water manifold, and a first heat dissipation component;

[0007] The main inlet and the main outlet are respectively adapted to be connected to an external coolant pump to deliver coolant;

[0008] The water collector is provided with a water distribution chamber, a water collection chamber, a water distribution port, a water collection port, a first liquid inlet, and a second liquid outlet;

[0009] The main body of the water collector is plate-shaped. The first liquid inlet and the water distribution outlet are both connected to the water distribution cavity. The second liquid outlet and the water collection outlet are both connected to the water collection cavity. The first liquid inlet is connected to the main liquid inlet, and the second liquid outlet is connected to the main liquid outlet.

[0010] There are two or more water distribution outlets, and the number of water collection outlets is the same as the number of water distribution outlets. The water distribution outlets and water collection outlets are set in a one-to-one correspondence.

[0011] The first heat sink has a first heat exchange channel inside, and the two ends of the first heat exchange channel are respectively connected to the water outlet and the water collection outlet;

[0012] There are two or more heat sinks.

[0013] In one possible implementation, the main body of the water distribution device is a long strip-shaped structure;

[0014] Both the first liquid inlet and the second liquid outlet are located on one side of the water collector;

[0015] Both the water inlet and the water collection inlet are located on the other side of the water distribution device.

[0016] In one possible implementation, two or more of the water distribution outlets are arranged along the length of the water collector;

[0017] Two or more of the water collection inlets are arranged along the length of the water collector.

[0018] One possible implementation also includes a quick-swap interface;

[0019] There are two or more quick-connect couplings, and the water outlet and the water collection outlet are respectively connected to the first heat exchange channel of the first heat sink through quick-connect couplings.

[0020] In one possible implementation, a second heat sink is also included, wherein the second heat sink has a second heat exchange channel inside;

[0021] The water collector is also provided with a first liquid outlet and a second liquid inlet. The water distribution chamber and the water collection chamber are respectively connected to the two ends of the second heat exchange channel through the first liquid outlet and the second liquid inlet.

[0022] In one possible implementation, the number of water-dividing cavities is two or more;

[0023] The number of water collection cavities is two or more.

[0024] According to another aspect of this application, a server is provided, comprising: a chassis and any of the liquid cooling structures described above;

[0025] Both the main liquid inlet and the main liquid outlet are located on the side wall of the chassis, and the interior of the chassis is equipped with baffles and connectors.

[0026] Two or more of the first heat sinks are connected to the baffle.

[0027] The water distribution unit is connected to the chassis via the connector.

[0028] In one possible implementation, the main body of the baffle is in the shape of a long strip;

[0029] Two or more of the first heat dissipation components are arranged along the length of the baffle.

[0030] In one possible implementation, the main body of the connector is plate-shaped, and the connector has clearance holes.

[0031] In one possible implementation, the chassis is also equipped with a fan;

[0032] The fan is located inside the cavity of the chassis, and the first heat sink and the fan are located on opposite sides of the water manifold.

[0033] This application relates to liquid cooling for servers. An external coolant pump pumps coolant into a manifold through a main inlet. The coolant enters the distribution chamber through a first inlet, and then is distributed to corresponding first heatsinks through various outlets. The coolant flows through the heat exchange pipes of the first heatsinks, exchanging heat with them. The first heatsinks are used to cool the server's GPU (Graphics Processing Unit), with one side attached to the upper side of the GPU. After heat exchange with each first heatsink, the coolant flows into the collection chamber through its respective outlet, and then exits sequentially through the second outlet and the main outlet, thus achieving server cooling. Compared to traditional coolant delivery methods, this application, by using a manifold, places both the outlets and the collection ports close to their respective first heatsinks, effectively reducing the number of pipes used for coolant delivery in the server.

[0034] Other features and aspects of this application will become clear from the following detailed description of exemplary embodiments with reference to the accompanying drawings. Attached Figure Description

[0035] The accompanying drawings, which are included in and form part of this specification, illustrate exemplary embodiments, features, and aspects of this application together with the specification and serve to explain the principles of this application.

[0036] Figure 1 This diagram illustrates a liquid cooling structure according to an embodiment of the present application and the main structural diagram of a server having the same structure.

[0037] Figure 2 A top view of the water distribution device according to an embodiment of this application is shown;

[0038] Figure 3 This diagram shows the internal structure of the water distribution device according to an embodiment of this application;

[0039] Figure 4 Show Figure 1 Sectional view of AA in the middle;

[0040] Figure 5 This diagram shows the internal structure of the first heat sink according to an embodiment of the present application;

[0041] Figure 6 This diagram shows the main structure of the third heat sink according to an embodiment of this application. Detailed Implementation

[0042] Various exemplary embodiments, features, and aspects of this application will now be described in detail with reference to the accompanying drawings. The same reference numerals in the drawings denote elements that have the same or similar functions. Although various aspects of the embodiments are shown in the drawings, they are not necessarily drawn to scale unless specifically indicated otherwise.

[0043] It should be understood that the terms "center," "longitudinal," "lateral," "length," "width," "upper," "lower," "front," "rear," "left," "right," "vertical," "horizontal," "top," "bottom," "inner," "outer," "clockwise," "counterclockwise," "axial," "radial," and "circumferential" indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. They are used only for the convenience of describing the present invention or simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, or be constructed and operated in a specific orientation. Therefore, they should not be construed as limitations on the present invention.

[0044] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of technical features indicated. Thus, a feature defined as "first" or "second" may explicitly or implicitly include one or more of that feature. In the description of this invention, "a plurality of" means two or more, unless otherwise explicitly specified.

[0045] The term “exemplary” as used herein means “serving as an example, embodiment, or illustration.” Any embodiment illustrated herein as “exemplary” is not necessarily to be construed as superior to or better than other embodiments.

[0046] Furthermore, to better illustrate this application, numerous specific details are provided in the following detailed embodiments. Those skilled in the art should understand that this application can be implemented without certain specific details. In some instances, methods, means, components, and circuits well-known to those skilled in the art have not been described in detail in order to highlight the main points of this application.

[0047] Figure 1 This diagram illustrates a liquid cooling structure according to an embodiment of this application and the main structural diagram of a server having the same structure. Figure 1As shown, the liquid cooling structure includes: a main inlet 140, a main outlet, a manifold 200, and a first heat sink 300; the main inlet 140 and the main outlet are respectively adapted to connect with an external coolant pump to deliver coolant; the manifold 200 is provided with a water distribution chamber 270, a water collection chamber 280, a water distribution port 220, a water collection port 210, a first inlet 230, and a second outlet 240; the main body of the manifold 200 is plate-shaped, and both the first inlet 230 and the water distribution port 220 are connected to the water distribution chamber 270, the second outlet 240, and the first inlet 230. Both the liquid outlet 240 and the water collection port 210 are connected to the water collection cavity 280. The first liquid inlet 230 is connected to the main liquid inlet 140, and the second liquid outlet 240 is connected to the main liquid outlet. There are two or more water distribution ports 220, and the number of water collection ports 210 is the same as that of the water distribution ports 220. The water distribution ports 220 and the water collection ports 210 are set in a one-to-one correspondence. The first heat dissipation component 300 is provided with a first heat exchange channel 310 inside. The two ends of the first heat exchange channel 310 are connected to the water distribution port 220 and the water collection port 210 respectively. There are two or more first heat dissipation components 300.

[0048] This application applies to liquid cooling of servers. An external coolant pump pumps coolant into the manifold 200 through the main inlet 140. The coolant enters the distribution chamber 270 through the first inlet 230, and then is delivered to the corresponding first heat sink 300 through each distribution port 220. The coolant flows through the heat exchange pipes of the first heat sink 300, exchanging heat with it. The first heat sink 300 is used to dissipate heat from the server's GPU (Graphics Processing Unit), and one side of the first heat sink 300 is attached to the upper side of the GPU. After heat exchange with each of the first heat sinks 300, the coolant flows into the collection chamber 280 through each collection port 210, and then is discharged sequentially through the second outlet 240 and the main outlet, thereby achieving heat dissipation for the server. Compared to traditional coolant delivery methods, this application, by setting up a manifold 200, ensures that both the water outlet 220 and the water collector 210 are close to their respective first heat sink 300, effectively reducing the number of pipes used for delivering coolant in the server.

[0049] In one possible implementation, the main body of the water collector 200 is a long strip-shaped structure; the first inlet 230 and the second outlet 240 are both located on one side of the water collector 200; the distributor 220 and the collector 210 are both located on the other side of the water collector 200. For example... Figure 1 As shown, two or more first heat dissipation components 300 are located on the side of the water distribution unit 200 where the water distribution port 220 is provided, and are matched with the water distribution port 220 and the water collection port 210 that are provided one-to-one.

[0050] Furthermore, such as Figure 4As shown, two or more water outlets 220 are arranged along the length of the water collector 200; two or more water collection outlets 210 are arranged along the length of the water collector 200.

[0051] In other words, the water inlet 220 is the water inlet 210 in the width direction of the water collector 200. As the corresponding water inlet 210, the pair of water inlets 220 and water inlets 210 are matched with a first heat sink 300 to input and output coolant to the first heat sink 300.

[0052] In one possible implementation, the first heat sink 300 is arranged in a straight line along the length of the manifold 200, and the first heat sink 300 is correspondingly set with the water outlet 220. The two ends of the first heat exchange channel 310 of the first heat sink 300 are located on the same side of the first heat sink 300 and face the manifold 200. Thus, the two ends of the first heat exchange channel 310 of the first heat sink 300 face the corresponding water outlet 220 and water collection port 210, which further reduces the coolant delivery path and thus reduces the use of pipelines.

[0053] For further details, please refer to [link / reference]. Figure 5 , Figure 5 A schematic diagram of the internal structure of the first heat sink 300 is shown, where the arrows indicate the direction of coolant flow in the first heat exchange channel 310. The main body of the first heat sink 300 has a plate-like structure, and the first heat exchange channel 310 is located inside the first heat sink 300. Both ends of the first heat exchange channel 310 are suitable for the input of coolant, and both ends of the first heat exchange channel 310 are located at the same end of the first heat sink 300.

[0054] In one possible implementation, the first heat exchange channel 310 is arranged in a tortuous pattern inside the first heat sink 300, thereby increasing the flow area of ​​the coolant and enhancing the heat exchange effect. The first heat sink 300 also includes a heat dissipation plate 320, located in the middle of the first heat sink 300. The heat dissipation plate 320 is disposed inside the cavity of the heat exchange pipe, with one end connected to the inner wall of the heat exchange pipe. The main body of the heat dissipation plate 320 has a long, strip-like structure, and the length direction of the heat dissipation plate 320 is in the same direction as the coolant flow at its location. By providing the heat dissipation plate 320, the contact area with the coolant is further increased, enhancing the heat exchange effect.

[0055] Among them, there are two or more heat sinks 320, which are arranged parallel to each other in the length direction and face each other on the sides.

[0056] Furthermore, the first heat sink 300 is also provided with a mounting portion 330, which facilitates the installation of the first heat sink 300 on the side wall of the adapted chassis 100. The mounting portion 330 is a groove structure, which is opened on the end face of the first heat sink 300 and close to the port of the first heat exchange channel 310.

[0057] In one possible implementation, a quick-connect interface is also included; there are two or more quick-connect connectors 400, with the water inlet 220 and the water outlet 210 respectively connected to the first heat exchange channel 310 of the first heat sink 300 via the quick-connect connectors 400. By providing quick-connect interfaces, it is convenient to disassemble the first heat sink 300 during equipment maintenance and replacement. One end of the quick-connect connector 400 is detachably connected to the water inlet 220 or the water outlet 210, and the other end of the quick-connect connector 400 is connected to one end of the heat exchange pipeline via a pipe.

[0058] It should be noted that the specific model of the quick-connect coupling 400 is not limited here. Those skilled in the art can set it according to the actual situation to achieve detachable connection between the pipeline and the water outlet 220 or the water collection outlet 210.

[0059] In one possible implementation, the heat exchange pipe of the first heat sink 300 is provided with straight-through pagoda heads at both ends, and the straight-through pagoda heads are connected to the quick-connect joint 400 through pipelines.

[0060] Preferably, EPDM water pipes are used for the pipeline.

[0061] In one possible implementation, a second heat sink 500 is further included, with a second heat exchange channel inside. The water distribution unit 200 also has a first outlet 250 and a second inlet 260. The water distribution chamber 270 and the water collection chamber 280 are connected to the two ends of the second heat exchange channel through the first outlet 250 and the second inlet 260, respectively. After the coolant enters the water distribution chamber 270 of the water distribution unit 200 through the first inlet 230, it flows into the first heat sink 300 and the second heat sink 500 through the water distribution port 220 and the first outlet 250, respectively. After heat exchange, the coolant then flows into the water collection chamber 280 of the water distribution unit 200 through the water collection port 210 and the second inlet 260, respectively. The second heat sink 500 is suitable for cooling the CPU of a server. One side of the second heat sink 500 is attached to the side of the CPU, and the coolant flows through the second heat exchange channel to exchange heat with the second heat sink 500.

[0062] like Figure 4The first liquid inlet 230, the second liquid outlet 240, the first liquid outlet 250 and the second liquid inlet 260 are all located on the same side of the water collector 200, and the other side of the water collector 200 faces the first heat sink 300. The layout is more reasonable and effectively saves space inside the service area.

[0063] Preferred, such as Figure 2 and Figure 4 As shown, the water collector 200 has eight water distribution ports 220 and eight water collection ports 210 on one side, and two first liquid inlets 230, two second liquid outlets 240, two first liquid outlets 250, and two second liquid inlets 260 on the other side. Correspondingly, there are eight first heat dissipation components 300, two second heat dissipation components 500, two main liquid inlets 140, and two main liquid outlets.

[0064] Furthermore, the first inlet 230, the second outlet 240, the first outlet 250, the second inlet 260, and the second heat exchange channel are each equipped with a straight-through pagoda head or a right-angle pagoda head for connecting the pipeline. The main inlet 140 and the main outlet are each equipped with a quick-connect fitting 400. One end of the quick-connect fitting 400 is detachably connected to the main inlet 140 or the main outlet, and the other end is connected to the pipeline. The quick-connect fitting 400 facilitates the disassembly, maintenance, and replacement of the manifold 200. Preferably, the pipeline is made of EPDM water pipe.

[0065] like Figure 3 As shown, in one possible implementation, the number of water distribution cavities 270 is two or more; the number of water collection cavities 280 is two or more.

[0066] Furthermore, corresponding to the two first liquid inlets 230, the two second liquid outlets 240, the two first liquid outlets 250 and the two second liquid inlets 260, there are two water distribution chambers 270 and two water collection chambers 280.

[0067] Among them, two water distribution chambers 270 are arranged along the length of the water distribution device 200 and correspond to eight water outlets 220; two water collection chambers 280 are arranged along the length of the water distribution device 200 and correspond to eight water collection outlets 210.

[0068] Furthermore, a water distribution chamber 270 is connected to four water distribution ports 220, and similarly, a water collection chamber 280 is connected to four water collection ports 210. Two first liquid inlets 230, two second liquid outlets 240, two first liquid outlets 250 and two second liquid inlets 260 are respectively set near the two ends of the water collector 200.

[0069] Among them, such as Figure 4As shown, a first liquid inlet 230, a second liquid outlet 240, a first liquid outlet 250 and a second liquid inlet 260 are arranged in a rectangular shape near one end of the water collector 200, and another first liquid inlet 230, another second liquid outlet 240, another first liquid outlet 250 and another second liquid inlet 260 are arranged in a rectangular shape near the other end of the water collector 200.

[0070] In one possible implementation, the water distributor 200 includes a top plate and a bottom plate; the water distribution chamber 270, the water collection chamber 280, the first liquid inlet 230, the second liquid outlet 240, the first liquid outlet 250, and the second liquid inlet 260 are all located on the bottom plate; the water distribution port 220 and the water collection port 210 are both located on the top plate; the top plate and the bottom plate are interlocked. (See reference...) Figure 2 and Figure 3 , Figure 2 The diagram shows a top view of the manifold of an embodiment of this application, i.e., a front view of the top plate. Figure 3 The diagram shows the internal structure of the water distribution device according to an embodiment of this application, namely the front view of the base plate. The overall structure is relatively simple and easy to process and manufacture.

[0071] In one possible implementation, both the top plate and the bottom plate are provided with mounting holes, which are suitable for connecting the top plate and the bottom plate with assembly bolts.

[0072] The mounting holes are further divided into three groups, each group including multiple mounting holes. The mounting holes in each group are arranged along the length of the water collector 200. Two groups are located near the two ends of the width of the shell, and the other group is located in the middle of the shell, thus ensuring the stability of the installation of the top plate and the bottom plate.

[0073] In one possible implementation, a third heat sink 600 is also included, such as... Figure 6 As shown, the third heat dissipation component 600 includes: a water distribution device 610 and a heat pipe 620; there are two water distribution devices 610, one of which has an inlet 640 and the other has an outlet 650; both ends of the heat pipe 620 are connected to the two water distribution devices 610 respectively, and the heat pipe 620 is provided with heat dissipation fins; one side of the heat dissipation fins is connected to the side of the heat pipe 620, and one end of the heat dissipation fins protrudes from the heat pipe 620 along the radial direction; there are two or more heat pipes 620, and the two or more heat pipes 620 are arranged parallel to each other in the axial direction.

[0074] The third heat sink 600 is used to dissipate heat from multiple memory modules. By setting two or more heat pipes 620, memory modules can be placed between two adjacent heat pipes 620, with the two adjacent heat pipes 620 attached to opposite sides of the memory module. The inlet 640 and outlet 650 of the two water distribution devices 610 are designed to connect to an external coolant pump. Coolant enters one of the water distribution devices 610 through the inlet 640, and the water distribution device 610 guides the coolant into the heat pipes 620 connected to it. The coolant exchanges heat within the heat pipes 620, thus dissipating heat from the memory modules. By installing heat sinks on the heat pipes 620, the contact area with the memory modules is increased, further improving heat exchange efficiency. This achieves liquid cooling for the memory modules.

[0075] In one possible implementation, the main bodies of both water distribution devices 610 are tubular structures, and the axial directions of the two water distribution devices 610 are parallel to each other.

[0076] Furthermore, the two ends of the heat pipe 620 are respectively connected to the sides of two water distribution devices 610, so that the two water distribution devices 610 and two or more heat pipes 620 form a grid structure. Multiple memory modules are located at the gaps in the grid structure, that is, between any two adjacent heat pipes 620. Figure 2 As shown. The overall structure is relatively simple, effectively reducing production costs and saving internal server space.

[0077] In one possible implementation, the inlet 640 and the outlet 650 are located at the end faces of the two water distribution devices 610, respectively.

[0078] Furthermore, such as Figure 6 As shown, the inlet 640 and outlet 650 are located at opposite ends of the two water distribution devices 610, allowing two or more heat dissipation devices of this application embodiment to be arranged adjacently and connected to accommodate a larger number of memory modules.

[0079] In other words, two or more heat dissipation devices are arranged adjacent to each other. The outlet 650 of the first heat dissipation device faces the inlet 640 of the second heat dissipation device. The outlet 650 of the second heat dissipation device faces the inlet 640 of the third heat dissipation device, and so on. This allows the coolant to flow through each heat dissipation device in sequence, and multiple third heat dissipation components 600 can be connected in series to further improve the compatibility.

[0080] It should be noted that the inlet 640 and outlet 650 are equipped with straight-through pagoda heads or right-angle pagoda heads for connecting to the pipeline used to transport coolant.

[0081] In one possible implementation, a connecting plate 630 is also included; both ends of the connecting plate 630 are connected to two water distribution devices 610 respectively. By providing the connecting plate 630, the structural strength between the water distribution device 610 and the heat-conducting pipe 620 is strengthened, thereby improving its service life.

[0082] In one possible implementation, there are two connecting plates 630, with two or more heat pipes 620 located between the two connecting plates 630. The overall structure is relatively simple, effectively reducing production costs.

[0083] In one possible implementation, a filling section is also provided. The filling section is located between any two adjacent heat pipes 620 or between the connecting plate 630 and an adjacent heat pipe 620. The filling section is located between the inlet pipe and the memory module, and the filling section is made of thermally conductive silicone. By providing the filling section, the contact between the heat pipe 620 and the memory module is made tighter, thereby improving the heat conduction efficiency.

[0084] Furthermore, the filling part has a groove structure, and the internal cavity of the filling part matches the adapted memory module. The outer wall of the filling part abuts against two adjacent heat pipes 620 or adjacent heat pipes 620 and connecting plate 630 respectively. The internal cavity of the filling part is suitable for embedding the adapted memory module.

[0085] In one possible implementation, the heat sink's main body is shaped like a long strip, with its length aligned with the axial direction of the heat pipe 620. One end of the heat sink extends out of the heat pipe 620 along its width. The side of the heat sink matches the side of the compatible memory module. By providing the heat sink, the contact area with the memory module's side is further increased, thereby improving heat dissipation efficiency.

[0086] Furthermore, the heat sink, which is in the shape of a long strip, is connected to the heat pipe 620 at one end in the width direction, and the two ends in the length direction are respectively facing the two water distribution devices 610. A preset gap is provided between the two ends in the length direction of the heat sink and the adjacent water distribution device 610.

[0087] In one possible implementation, the heat pipe 620 is provided with two heat sinks; the two heat sinks are located on opposite sides of the heat pipe 620, with their sides facing each other. This allows the two sides of the adapted memory module to contact the adjacent heat pipe 620 and the corresponding heat dissipation surface, respectively.

[0088] It should be noted that the distance between the two heat sinks located on the same heat pipe 620 and the two opposite sides is the same as the diameter of the heat pipe 620. In other words, one side of the memory module can simultaneously contact the heat pipe 620 and the heat sinks on the heat pipe 620.

[0089] In one possible implementation, the sides of each heatsink are arranged parallel to each other to facilitate installation with parallel memory modules.

[0090] Preferably, the main bodies of the two water distribution devices 610 are both regular square prisms, the main body of the heat pipe 620 is cylindrical, the axial direction of the heat pipe 620 is perpendicular to the axis of the water distribution device 610, and there are three heat pipes 620.

[0091] In one possible implementation, there are three third heat sinks 600, which are arranged alternately with two second heat sinks 500.

[0092] It should be noted that those skilled in the art can separately set the main inlet 140 and main outlet for supplying coolant to the third heat sink 600, or add a multi-port connector to the existing main inlet 140 and main outlet, depending on the actual situation.

[0093] See Figure 1 According to another aspect of this application, a server is provided, comprising: a chassis 100 and any of the above-mentioned liquid cooling structures; a main liquid inlet 140 and a main liquid outlet are both disposed on the side wall of the chassis 100, and a baffle 110 and a connector 120 are provided inside the cavity of the chassis 100; two or more first heat sinks 300 are all connected to the baffle 110; and a water manifold 200 is connected to the chassis 100 through the connector 120.

[0094] The main liquid inlet 140 and the main liquid outlet are both located on the same side wall of the chassis 100, which facilitates communication with the external coolant pump. By setting baffle 110 and connector 120 inside the chassis 100, an installation base is provided for the first heat sink 300 and the water manifold 200. The overall structure is relatively simple and effectively reduces production costs.

[0095] In one possible implementation, the main body of the baffle 110 is in the shape of a long strip; two or more first heat dissipation components 300 are arranged along the length of the baffle 110.

[0096] In one possible implementation, the main body of the connector 120 has a plate-like structure, and the connector 120 has a clearance hole. For example... Figure 4 As shown, by setting clearance holes, the pipelines inside the chassis 100 are arranged more reasonably through the pipelines that connect to the main inlet 140 or the main outlet through the first liquid inlet 230 or the second liquid outlet 240.

[0097] Furthermore, there are two connectors 120, which are located at opposite ends of the length of the water manifold 200, making the installation of the water manifold 200 more stable.

[0098] The baffle 110 and the water manifold 200 are arranged opposite to each other, and the first heat sink 300 is located between the baffle 110 and the water manifold 200.

[0099] In one possible implementation, the chassis 100 is further equipped with a fan 130. The fan 130 is located inside the cavity of the chassis 100. The first heat sink 300 and the fan 130 are located on opposite sides of the manifold 200. One end of the fan 130 faces the inside of the cavity of the chassis 100, and the other end communicates with the outside of the chassis 100, suitable for blowing outside air into the chassis 100 for heat dissipation. By setting the fan 130, the remaining electrical components inside the chassis 100 are cooled by air. There may be two or more fans 130. The fans 130 and the main liquid inlet 140 are located on opposite sides of the chassis 100.

[0100] In one possible implementation, the main body of the chassis 100 is rectangular, the first heat sink 300 is disposed near one side wall of the chassis 100, the first heat sink 300 is located on one side of the fan 130, and the second heat sink 500 and the third heat sink 600 are located on the other side of the fan 130.

[0101] Furthermore, such as Figure 4 As shown, the manifold 200 is connected to two opposite inner walls of the rectangular chassis 100 via two connectors 120 at opposite ends along its length. The second heat sink 500 and the third heat sink 600 are located on one side of the manifold 200 along its width, thereby making the first heat sink 300 close to one side wall of the chassis 100, and the second heat sink 500 and the third heat sink 600 close to the opposite side wall.

[0102] Among them, the three third heat dissipation components 600 and the two second heat dissipation components 500 arranged at intervals are arranged in the same direction as the length of the water distribution unit 200.

[0103] The various embodiments of this application have been described above. These descriptions are exemplary and not exhaustive, nor are they limited to the disclosed embodiments. Many modifications and variations will be apparent to those skilled in the art without departing from the scope and spirit of the described embodiments. The terminology used herein is chosen to best explain the principles, practical application, or improvement of the technology in the market, or to enable others skilled in the art to understand the embodiments disclosed herein.

Claims

1. A liquid-cooled structure, characterized in that, include: Main liquid inlet, main liquid outlet, water distribution unit and first heat dissipation component; The main inlet and the main outlet are respectively adapted to be connected to an external coolant pump to deliver coolant; The water collector is provided with a water distribution chamber, a water collection chamber, a water distribution port, a water collection port, a first liquid inlet, and a second liquid outlet; The main body of the water collector is plate-shaped. The first liquid inlet and the water distribution outlet are both connected to the water distribution cavity. The second liquid outlet and the water collection outlet are both connected to the water collection cavity. The first liquid inlet is connected to the main liquid inlet, and the second liquid outlet is connected to the main liquid outlet. There are two or more water distribution outlets, and the number of water collection outlets is the same as the number of water distribution outlets. The water distribution outlets and water collection outlets are set in a one-to-one correspondence. The first heat sink has a first heat exchange channel inside, and the two ends of the first heat exchange channel are respectively connected to the water outlet and the water collection outlet; There are two or more heat sinks.

2. The liquid cooling structure according to claim 1, characterized in that, The main body of the water collector is a long strip-shaped structure; Both the first liquid inlet and the second liquid outlet are located on one side of the water collector; Both the water inlet and the water collection inlet are located on the other side of the water distribution device.

3. The liquid cooling structure according to claim 2, characterized in that, Two or more of the water distribution outlets are arranged along the length of the water collector; Two or more of the water collection inlets are arranged along the length of the water collector.

4. The liquid-cooled structure according to claim 1, characterized in that, It also includes quick-switch interfaces; There are two or more quick-connect couplings, and the water outlet and the water collection outlet are respectively connected to the first heat exchange channel of the first heat sink through quick-connect couplings.

5. The liquid-cooled structure according to any one of claims 1 to 4, characterized in that, It also includes a second heat sink, the second heat sink having a second heat exchange channel inside; The water collector is also provided with a first liquid outlet and a second liquid inlet. The water distribution chamber and the water collection chamber are respectively connected to the two ends of the second heat exchange channel through the first liquid outlet and the second liquid inlet.

6. The liquid-cooled structure according to claim 5, characterized in that, The number of the water distribution chambers is two or more; The number of water collection cavities is two or more.

7. A server, characterized in that, include: The chassis and the liquid cooling structure according to any one of claims 1 to 6; Both the main liquid inlet and the main liquid outlet are located on the side wall of the chassis, and the interior of the chassis is equipped with baffles and connectors. Two or more of the first heat sinks are connected to the baffle. The water distribution unit is connected to the chassis via the connector.

8. The server according to claim 7, characterized in that, The main body of the baffle is in the shape of a long strip; Two or more of the first heat dissipation components are arranged along the length of the baffle.

9. The server according to claim 7, characterized in that, The main body of the connector is plate-shaped, and the connector has clearance holes.

10. The server according to claim 7, characterized in that, The chassis is also equipped with a fan; The fan is located inside the cavity of the chassis, and the first heat sink and the fan are located on opposite sides of the water manifold.

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