PCB spraying etching machine with spraying system

Abstract

The invention relates to a PCB spraying etching machine with a spraying system, and relates to the technical field of PCB spraying. Comprising a main body, an angle adjusting assembly is arranged on one side of a fixing plate, a plurality of nozzles are fixed to the bottom end of a spraying liquid conveying plate at equal intervals, a distance adjusting assembly is arranged at the bottom of an airflow supply box, a plurality of nozzles are slidably connected into a base in a limited mode, and a shaking assembly is arranged in a connecting base. The electric push rod is adopted as a power source, inclined plane transmission, sliding rail guiding and a rotating plate linkage structure are matched, synchronous adjustment of the nozzle height and the spraying angle is achieved, PCBs of different thicknesses and widths are automatically adapted, manual adjustment of nozzle parameters is not needed, and the problems that a traditional fixed nozzle cannot be adapted to PCBs of multiple specifications and spraying is uneven are solved; and hidden dangers of aggravation of lateral erosion, substandard circuit precision and the like caused by improper spraying angle and height are avoided.

Description

Technical Field

[0001] This invention relates to the field of PCB board spraying technology, specifically to a PCB board spray etching machine with a spraying system. Background Technology

[0002] PCB etching technology is a core process in PCB manufacturing. It is used to remove the copper layer on a copper-clad laminate that is not protected by the resist, forming the desired circuit pattern. After exposure and development, the resist pattern is cured, and the uncovered copper layer is exposed. The PCB board after exposure and development is placed at the feeding end of the equipment. The PCB board is centered and positioned by a correction mechanism to prevent deviation during transport. The conveyor rollers rotate under the drive mechanism, smoothly and uniformly feeding the PCB board into the sealed etching chamber. The spray device sprays the etching solution evenly onto the upper and lower surfaces of the PCB board through nozzles. The etching solution reacts chemically with the copper layer on the board that is not protected by the resist, completing the circuit etching. The etched solution falls into the bottom collection tank after spraying. After filtration to remove copper slag and other impurities, it is then transported back to the spray device after temperature and pressure control, realizing recycling. The etched PCB board is transported to the cleaning area, where it is sprayed with clean water and deionized water to remove residual etching solution and reaction impurities from the board surface.

[0003] However, most existing PCB board spray etching machines use a top-down vertical spraying method. After the etching solution is sprayed onto the PCB board surface, problems such as liquid film accumulation and slow flow are prone to occur. If the etching solution stays on the board surface for too long, it will erode laterally along the lines, thus forming side etching. This causes the PCB board lines to exceed the accuracy standards, and the sidewalls of the lines to be trapezoidal and not perpendicular, which cannot meet the design and usage requirements of precision circuits. Furthermore, the nozzle height and spraying angle are fixed structures, which cannot be adaptively adjusted according to changes in PCB board thickness and width. The spraying range and spraying effect cannot match the board specifications, resulting in uneven spraying of the etching solution, producing uneven etching. Insufficient spraying in some areas of the board surface leads to incomplete etching, residual copper, and can cause short circuits.

[0004] To address the aforementioned issues, there is an urgent need for innovative design based on existing PCB spray etching machines with spray systems. Summary of the Invention

[0005] The present invention addresses the problem that existing technical solutions are too simplistic by providing a solution that is significantly different from existing technologies. Specifically, the present invention aims to provide a PCB board spray etching machine with a spray system to solve the problems mentioned in the background.

[0006] To achieve the above objectives, the present invention provides the following technical solution: a PCB board spray etching machine with a spray system, comprising a main body, wherein multiple sets of delivery wheels are arranged inside the main body, a movable frame is arranged inside the main body, and an electric push rod is fixed at one end of the movable frame, a spray liquid supply box and an airflow supply box are respectively fixed at the bottom of the movable frame, a fixed plate is symmetrically fixed at the bottom of the spray liquid supply box, an angle adjustment component is arranged on one side of the fixed plate, multiple spray liquid conveying plates are fixed at equal distances on one side of the angle adjustment component, multiple nozzles are fixed at equal distances at the bottom of the spray liquid conveying plates, and the spray angle of the nozzles is adjusted by rotating the spray liquid conveying plates through the angle adjustment component, a spacing adjustment component is arranged at the bottom of the airflow supply box, multiple bases are arranged at the bottom of the spacing adjustment component, and the distance between the bases is adjusted by the spacing adjustment component, multiple nozzles are slidably connected in the base, a connecting seat is fixed on one side of the airflow supply box, a shaking component is arranged in the connecting seat, and the nozzles are reciprocated by the shaking component.

[0007] Preferably, the spray liquid conveying plate is connected to the spray liquid supply box via a hose, the nozzles are connected to each other via pipes, and one of the nozzles is connected to the air supply box via a hose.

[0008] Preferably, the angle adjustment assembly includes fixed rods fixed on both sides of the spray liquid conveying plate, a rotating plate fixed to the outer wall of the fixed rods, a guide rod slidably connected to the rotating plate, a movable plate fixed to one end of the guide rod, a push block fixed to one side of the movable plate, a first limiting plate slidably connected to the push block, and the first limiting plate fixedly connected to the main body.

[0009] Preferably, the fixing rod passes through the fixing plate, the rotating plate rotates on one side of the fixing plate, and the rotating plate has a cavity that moves in conjunction with the guide rod.

[0010] Preferably, the contact surfaces of the push block and the first limiting plate are both inclined surfaces, the movable plate is slidably connected to a slide rail, and the slide rail is fixedly connected to the spray liquid supply box.

[0011] Preferably, the spacing adjustment component includes a second limiting plate fixed inside the main body, a push plate slidably connected to the second limiting plate, a sliding plate fixed to the bottom end of the push plate, a plurality of connecting plates slidably connected at equal intervals inside the sliding plate, a movable seat fixed to the bottom end of the connecting plate, and the bottom end of the movable seat fixedly connected to the base.

[0012] Preferably, the contact surfaces of the second limiting plate and the push plate are both inclined surfaces. The push plate is slidably connected to the air supply box, and the movable seat is slidably connected to the protruding position at the bottom of the air supply box. The sliding plate has an inclined groove that cooperates with the connecting plate.

[0013] Preferably, the shaking component includes a turntable disposed in the connecting seat, a motor is fixed to one end of the turntable, an eccentric shaft is fixed to the other end of the turntable, a moving frame is slidably connected to the eccentric shaft, a connecting frame is fixed to one side of the moving frame, and a plurality of limiting rods are slidably connected to one side of the connecting frame, with one end of the limiting rods fixedly connected to the nozzle.

[0014] Preferably, the movable frame has a cavity that moves in conjunction with the eccentric shaft, and the connecting frame and the connecting seat are in a limited sliding connection.

[0015] Compared with the prior art, the beneficial effects of the present invention are:

[0016] 1. This invention uses an electric push rod as a power source, combined with a inclined plane transmission, slide rail guide, and rotating plate linkage structure to achieve synchronous adjustment of nozzle height and spray angle, automatically adapting to PCBs of different thicknesses and widths. It eliminates the need for manual adjustment of nozzle parameters, solving the problems of traditional fixed nozzles being unable to adapt to multiple PCB specifications and uneven spraying. It avoids hidden dangers such as aggravated side etching and substandard circuit accuracy caused by improper spray angle and height, ensuring that the etching solution evenly covers the board surface without spray blind spots, allowing every copper layer to be uniformly etched, effectively preventing problems such as incomplete local etching and residual copper.

[0017] 2. This invention relies on the linkage structure of the spraying device and the blowing device, sharing a power source for the moving frame. Through mechanical cooperation such as inclined plane transmission and sliding guide, it achieves synchronous adjustment of the blowing distance, height, and air volume, eliminating the need for additional power devices. This reduces the accumulation of etching solution on the board surface and avoids the problem of aggravated side etching caused by prolonged liquid film retention. The synchronous linkage between the blowing device and the spraying device ensures that the blowing range completely covers the PCB board surface without any blind spots. It can quickly disperse the liquid film on the board surface and accelerate the discharge of etching solution, while avoiding damage to delicate circuits due to excessive airflow or liquid film residue and aggravated side etching due to insufficient airflow. It achieves adaptive adjustment of air volume and blowing distance, adapting to PCB boards of different specifications. It eliminates the need for repeated manual adjustments to the air volume and blowing angle, improving production efficiency.

[0018] 3. This invention employs an eccentric wheel drive structure to drive the nozzle to reciprocate, which, combined with the uniform spraying of the spraying device, forms a synergistic mode of spray etching and dynamic purging. This breaks through the limitations of traditional fixed nozzle purging. By reciprocating the nozzle, the purging coverage area is expanded, ensuring that there is no liquid film accumulation on the PCB board surface and avoiding problems of insufficient or excessive etching in certain areas. Dynamic purging can accelerate the renewal of the etching solution and reduce the residence time of the etching solution on the board surface, inhibiting side etching from the root, making the circuit sidewalls more vertical and the line width more precise, meeting the production needs of precision PCBs. The synergistic work of dynamic spraying and purging can effectively avoid problems such as uneven etching and residual copper caused by single spraying or purging, significantly improving production yield. Attached Figure Description

[0019] Figure 1 This is a three-dimensional structural diagram of the present invention;

[0020] Figure 2 This is a schematic side sectional view of the three-dimensional structure of the present invention;

[0021] Figure 3 This is a schematic diagram showing the connection between the mobile frame and the spray liquid supply box of the present invention;

[0022] Figure 4 This is a three-dimensional structural schematic diagram of the angle adjustment component of the present invention;

[0023] Figure 5 This is a three-dimensional structural schematic diagram of the angle adjustment component of the present invention.

[0024] Figure 6 This is a three-dimensional structural schematic diagram of the spacing adjustment component of the present invention;

[0025] Figure 7 This is a three-dimensional structural schematic diagram of another viewing angle spacing adjustment component of the present invention;

[0026] Figure 8 This is a three-dimensional structural schematic diagram of the spacing adjustment component of the present invention;

[0027] Figure 9 This is a three-dimensional structural diagram of the shaking component of the present invention.

[0028] In the diagram: 1. Main body; 2. Delivery wheel; 3. Moving frame; 4. Spray liquid supply box; 5. Fixed plate; 601. Fixed rod; 602. Rotating plate; 603. Guide rod; 604. Moving plate; 605. Push block; 606. First limiting plate; 607. Slide rail; 7. Spray liquid conveying plate; 8. Nozzle; 9. Air supply box; 101. Second limiting plate; 102. Push plate; 103. Sliding plate; 104. Connecting plate; 105. Moving seat; 11. Base; 12. Nozzle; 13. Connecting seat; 141. Turntable; 142. Eccentric shaft; 143. Moving frame; 144. Connecting frame; 145. Limiting rod. Detailed Implementation

[0029] To further illustrate the technical means and effects of the present invention in achieving its intended purpose, the following detailed description of the specific implementation methods, structures, features, and effects of the present invention, in conjunction with the accompanying drawings and preferred embodiments, is provided below.

[0030] Please see Figures 1 to 9This invention provides a technical solution: a PCB board spray etching machine with a spray system, comprising a main body 1, multiple sets of delivery wheels 2 disposed within the main body 1, a movable frame 3 disposed within the main body 1, an electric push rod fixed to one end of the movable frame 3, a spray liquid supply box 4 and an airflow supply box 9 respectively fixed to the bottom end of the movable frame 3, a fixing plate 5 symmetrically fixed to the bottom end of the spray liquid supply box 4, an angle adjustment component disposed on one side of the fixing plate 5, and multiple spray liquid conveying plates 7 equidistantly fixed to one side of the angle adjustment component, the bottom end of the spray liquid conveying plate 7... Multiple nozzles 8 are fixed at equal intervals, and the spray angle of the nozzles 8 is adjusted by rotating the spray liquid conveying plate 7 through the angle adjustment component. A spacing adjustment component is provided at the bottom of the air supply box 9, and multiple bases 11 are provided at the bottom end of the spacing adjustment component. The distance between the bases 11 is adjusted by the spacing adjustment component. Multiple nozzles 12 are slidably connected in the base 11. A connecting seat 13 is fixed on one side of the air supply box 9. A shaking component is provided in the connecting seat 13, and the nozzles 12 are moved back and forth by the shaking component.

[0031] In practice, multiple sets of delivery wheels 2 inside the main body 1 are used to smoothly transport the PCB board. The electric push rod drives the moving frame 3 to move, which in turn drives the spray liquid supply box 4 and the airflow supply box 9 fixed at the bottom of the moving frame 3 to move. The angle adjustment component on one side of the bottom fixed plate 5 of the spray liquid supply box 4 drives the spray liquid conveying plate 7 to rotate, thereby adjusting the spray angle of the bottom nozzle 8 so as to spray the etching liquid evenly. The spacing adjustment component at the bottom of the airflow supply box 9 can adjust the distance between the bases 11. The nozzle 12, which is limited and slidably connected inside the base 11, is driven by the shaking component inside the connecting seat 13 on one side of the airflow supply box 9 to achieve reciprocating movement, thus completing the etching and anti-side corrosion purging operations.

[0032] As a further embodiment of the present invention, the spray liquid conveying plate 7 is connected to the spray liquid supply box 4 via a hose, the nozzles 12 are connected to each other via pipes, and one of the nozzles 12 is connected to the airflow supply box 9 via a hose.

[0033] In practice, the spray liquid conveying plate 7 is connected to the spray liquid supply box 4 via a hose to receive and deliver the etching liquid to the bottom nozzle 8 for spray etching. Multiple nozzles 12 are connected by pipes to achieve airflow communication. One of the nozzles 12 is connected to the airflow supply box 9 via a hose, so that the airflow supply box 9 provides the purging airflow to ensure the effective purging of the anti-side corrosion.

[0034] As a further embodiment of the present invention, the angle adjustment component includes a fixed rod 601 fixed on both sides of the spray liquid conveying plate 7, a rotating plate 602 fixed on the outer wall of the fixed rod 601, a guide rod 603 slidably connected to the rotating plate 602, a moving plate 604 fixed at one end of the guide rod 603, a push block 605 fixed on one side of the moving plate 604, a first limiting plate 606 slidably connected to the push block 605, and the first limiting plate 606 fixedly connected to the main body 1.

[0035] In specific implementation, the fixed rods 601 are fixed on both sides of the spray liquid conveying plate 7, and the rotating plate 602 fixed on the outer wall achieves basic positioning and rotation support. The guide rod 603 connects the rotating plate 602 and the moving plate 604, and is used to transmit the adjustment displacement and guide the movement direction. The push block 605 on one side of the moving plate 604 slides with the first limiting plate 606 fixed on the main body 1 to realize the limiting and guidance of the angle adjustment, ensuring that the angle adjustment of the spray liquid conveying plate 7 is stable and the displacement is accurate. The whole system ensures the reliable operation of the angle adjustment component and the accuracy of the angle adjustment through the coordination of fixed support and sliding guidance.

[0036] As a further embodiment of the present invention, the fixing rod 601 passes through the fixing plate 5, the rotating plate 602 rotates on one side of the fixing plate 5, and the rotating plate 602 has a cavity that cooperates with the guide rod 603.

[0037] In specific implementation, the fixed rod 601 passes through the fixed plate 5, the rotating plate 602 can rotate on one side of the fixed plate 5, and the rotating plate 602 has a cavity for the guide rod 603 to move and cooperate, so that the guide rod 603 can slide in the cavity and drive the rotating plate 602 to rotate, thereby driving the spray liquid conveying plate 7 to achieve angle adjustment through the fixed rod 601.

[0038] As a further embodiment of the present invention, the contact surfaces of the push block 605 and the first limiting plate 606 are both inclined surfaces, and the moving plate 604 is slidably connected to the slide rail 607, which is fixedly connected to the spray liquid supply box 4.

[0039] In specific implementation, the contact surfaces of the push block 605 and the first limiting plate 606 are both inclined surfaces. The moving plate 604 is slidably connected to the slide rail 607, and the slide rail 607 is fixed on the spray liquid supply box 4. When the spray liquid supply box 4 drives the moving plate 604 to move up and down, the push block 605 moves along the inclined surface of the first limiting plate 606, so that the moving plate 604 simultaneously generates horizontal displacement under the guidance of the slide rail 607, thereby providing transmission power for angle adjustment.

[0040] As a further embodiment of the present invention, the spacing adjustment component includes a second limiting plate 101 fixed inside the main body 1. The second limiting plate 101 is slidably connected to a push plate 102. A sliding plate 103 is fixed at the bottom of the push plate 102. Multiple connecting plates 104 are slidably connected at equal intervals inside the sliding plate 103. A movable seat 105 is fixed at the bottom of the connecting plate 104. The bottom of the movable seat 105 is fixedly connected to the base 11.

[0041] In specific implementation, the second limiting plate 101 fixed inside the main body 1 slides in cooperation with the push plate 102. The push plate 102 drives the sliding plate 103 at the bottom to move. Multiple connecting plates 104 inside the sliding plate 103 move with the displacement of the sliding plate 103, and drive the base 11 through the moving seat 105 at the bottom to realize the adjustment of the distance between the bases 11.

[0042] As a further embodiment of the present invention, the contact surfaces of the second limiting plate 101 and the push plate 102 are both inclined surfaces. The push plate 102 is slidably connected to the air supply box 9, and the moving seat 105 is slidably connected to the bottom protruding position of the air supply box 9. The sliding plate 103 is provided with an inclined groove that cooperates with the connecting plate 104.

[0043] In specific implementation, the contact surfaces of the second limiting plate 101 and the push plate 102 are both inclined surfaces. The push plate 102 is slidably connected to the air supply box 9, and the movable seat 105 is slidably connected to the protruding position at the bottom of the air supply box 9. The sliding plate 103 has an inclined groove for the connecting plate 104 to move and cooperate. When the air supply box 9 drives the push plate 102 to move up and down, the push plate 102 generates a horizontal displacement along the inclined surface of the second limiting plate 101, and drives the connecting plate 104 through the inclined groove of the sliding plate 103, so that the movable seat 105 opens and closes at the bottom of the air supply box 9, thereby realizing the adjustment of the nozzle 12 spacing.

[0044] As a further embodiment of the present invention, the shaking component includes a turntable 141 disposed in the connecting seat 13. A motor is fixed to one end of the turntable 141, and an eccentric shaft 142 is fixed to the other end of the turntable 141. A moving frame 143 is slidably connected to the eccentric shaft 142. A connecting frame 144 is fixed to one side of the moving frame 143. A plurality of limiting rods 145 are slidably connected to one side of the connecting frame 144. One end of the limiting rod 145 is fixedly connected to the nozzle 12.

[0045] In practice, the turntable 141 inside the connecting seat 13 is driven by the motor to rotate. The turntable 141 drives the eccentric shaft 142 to rotate. The eccentric shaft 142 slides in the moving frame 143 and drives the moving frame 143 to reciprocate. The moving frame 143 drives the limiting rod 145 to reciprocate through the connecting frame 144. Finally, the limiting rod 145 drives the nozzle 12 to achieve synchronous reciprocating swaying and blowing.

[0046] As a further embodiment of the present invention, the movable frame 143 has a cavity that moves in conjunction with the eccentric shaft 142, and the connecting frame 144 and the connecting seat 13 are in a limited sliding connection.

[0047] In specific implementation, the movable frame 143 has a cavity for the eccentric shaft 142 to move and cooperate. The connecting frame 144 and the connecting seat 13 are connected in a limited sliding connection. When the eccentric shaft 142 moves in the cavity of the movable frame 143, it can drive the movable frame 143 and the connecting frame 144 to move back and forth stably along the connecting seat 13, thereby driving the nozzle 12 to achieve a smooth reciprocating blowing action.

[0048] Working principle: When using this PCB board spray etching machine with a spray system, the PCB board that has been exposed and developed is placed at the feeding end of the equipment. The PCB board is centered and positioned by the correction mechanism to prevent the conveyor from deviating. The delivery wheel 2 rotates under the drive mechanism, and the PCB board is smoothly and uniformly fed into the working chamber of the main body 1. The spray device is started, and the spray liquid is delivered from the spray liquid supply tank 4 to the spray liquid delivery plate 7 through the hose. The spray liquid is sprayed onto the PCB board through the nozzle 8 fixed at the bottom of the spray liquid delivery plate 7 to complete the etching operation. After etching, the PCB board is delivered to the bottom of the air supply tank 9 through the delivery wheel 2. The purge air supply control device is started, and the airflow is delivered from the air supply tank 9 to the nozzle 12 through the hose. The airflow blows downwards onto the PCB board, and the downward blowing disperses the etching liquid film on the surface of the PCB board, inhibiting the formation of side etching.

[0049] When conveying PCBs of different specifications, the electric push rod is activated, which drives the moving frame 3 to adjust the distance between the nozzle 8 and the spray outlet 12 and the PCB. When the moving frame 3 moves with the spray liquid supply box 4 fixed at its bottom, it simultaneously drives the fixed plate 5 symmetrically fixed at the bottom of the spray liquid supply box 4 to move. Since the first limiting plate 606 is fixedly connected to the main body 1, the contact surfaces of the first limiting plate 606 and the push block 605 are both inclined surfaces. The push block 605 is fixedly connected to the moving plate 604, so that when the moving plate 604 moves vertically with the spray liquid supply box 4 via the slide rail 607, it moves horizontally within the slide rail 607. When the moving plate 604 moves, it drives the guide rod 603 fixed on one side to slide in the cavity opened in the rotating plate 602, so that the rotating plate 602 rotates on one side of the fixed plate 5. The rotating plate 602 is fixedly connected to the fixed rod 601, and the fixed rod 601 is fixedly connected to the spray liquid conveying plate 7, ultimately driving the spray liquid conveying plate 7. Synchronous deflection enables synchronous adaptive adjustment of the spray height and spray angle of nozzle 8 when the PCB board specifications change. It automatically adapts the spray height and angle to PCB boards of different thicknesses and widths, ensuring that the etching solution is always sprayed onto the board surface in the optimal posture, eliminating the problems of uneven spraying and aggravated side etching caused by improper spraying distance and angle.

[0050] Simultaneously, as the movable frame 3 moves with the air supply box 9 fixed at its bottom, it synchronously drives the push plate 102, which is slidably connected to the air supply box 9, to move. Since the second limiting plate 101 is fixedly connected to the main body 1, the contact surface between the push plate 102 and the second limiting plate 101 is inclined, allowing the push plate 102 to move horizontally while moving vertically. This, in turn, drives the sliding plate 103 fixed at its bottom to move. The sliding plate 103 has an inclined groove that moves in conjunction with the connecting plate 104. The movable seat 105 is slidably connected to the protruding part at the bottom of the air supply box 9, so that the movement of the sliding plate 103 causes the movable seat 105 fixed at the bottom of the connecting plate 104 to spread out at the bottom of the push plate 102. The bottom of the movable seat 105 is fixedly connected to the base 11, and the base 11 has a nozzle 12 slidably connected to it, enabling adjustment of the spacing between the nozzles 12. This allows for adjustment of the nozzles 12 when the PCB board specifications change. The blowing height and blowing distance are synchronously and adaptively adjusted; and while the spacing of the nozzles 12 is adjusted, the jet volume of the nozzles 12 is adjusted synchronously through the controller to adapt to PCBs of different widths and thicknesses, ensuring that the blowing range completely covers the board surface, with no blind spots and no airflow overflow; the spacing of the nozzles 12 and the jet volume are linked and adjusted, with a large opening and large volume for wide boards and a small opening and small volume for narrow boards, which ensures the purging and anti-side corrosion effect, while avoiding excessive airflow that damages delicate circuits and insufficient airflow that causes liquid film residue;

[0051] When the nozzle 12 blows air, the motor is started, which drives the turntable 141 to rotate, which in turn drives the eccentric shaft 142, which is eccentrically fixed at the top of the turntable 141, to rotate. Since the moving frame 143 has a cavity that moves in conjunction with the eccentric shaft 142, the rotation of the eccentric shaft 142 drives the moving frame 143 to move back and forth in the connecting seat 13, which in turn drives the connecting frame 144, which is fixedly connected to the moving frame 143, to move back and forth synchronously. The connecting frame 144 is connected to the nozzle 12 through the limiting rod 145, so that the nozzle 12 moves back and forth synchronously during the blowing process, realizing the dynamic reciprocating blowing of the nozzle 12, breaking the limitations of fixed blowing, expanding the blowing coverage area, and making the liquid film on the board surface more evenly dispersed and drained, further avoiding side etching and uneven etching caused by local liquid film accumulation.

[0052] The above description is merely a preferred embodiment of the present invention and is not intended to limit the present invention in any way. Although the present invention has been disclosed above with reference to preferred embodiments, it is not intended to limit the present invention. Any person skilled in the art can make some modifications or alterations to the above-disclosed technical content to create equivalent embodiments without departing from the scope of the present invention. Any simple modifications, equivalent changes and alterations made to the above embodiments based on the technical essence of the present invention without departing from the scope of the present invention are within the scope of the present invention.

Claims

1. A PCB board spray etching machine with a spray system, comprising a main body (1), characterized in that: The main body (1) is provided with multiple sets of delivery wheels (2), and the main body (1) is provided with a movable frame (3). One end of the movable frame (3) is fixed with an electric push rod. The bottom end of the movable frame (3) is respectively fixed with a spray liquid supply box (4) and an airflow supply box (9). The bottom end of the spray liquid supply box (4) is symmetrically fixed with a fixing plate (5). An angle adjustment component is provided on one side of the fixing plate (5). Multiple spray liquid conveying plates (7) are fixed at equal distances on one side of the angle adjustment component. Multiple nozzles (8) are fixed at equal distances at the bottom end of the spray liquid conveying plate (7). The spray angle of the nozzle (8) is adjusted by rotating the spray liquid conveying plate (7) driven by the angle adjustment component. The bottom of the air supply box (9) is provided with a spacing adjustment component. Multiple bases (11) are provided at the bottom of the spacing adjustment component. The distance between the bases (11) is adjusted by the spacing adjustment component. Multiple nozzles (12) are slidably connected in the base (11). A connecting seat (13) is fixed on one side of the air supply box (9). A shaking component is provided in the connecting seat (13). The nozzles (12) are moved back and forth by the shaking component.

2. The PCB board spray etching machine with a spray system according to claim 1, characterized in that: The spray liquid conveying plate (7) is connected to the spray liquid supply box (4) via a hose, the nozzles (12) are connected to each other via pipes, and one of the nozzles (12) is connected to the air supply box (9) via a hose.

3. The PCB board spray etching machine with a spray system according to claim 1, characterized in that: The angle adjustment assembly includes fixed rods (601) fixed on both sides of the spray liquid conveying plate (7). A rotating plate (602) is fixed on the outer wall of the fixed rod (601). A guide rod (603) is slidably connected to the rotating plate (602). A moving plate (604) is fixed at one end of the guide rod (603). A push block (605) is fixed on one side of the moving plate (604). A first limiting plate (606) is slidably connected to the push block (605). The first limiting plate (606) is fixedly connected to the main body (1).

4. A PCB board spray etching machine with a spray system according to claim 3, characterized in that: The fixed rod (601) passes through the fixed plate (5), and the rotating plate (602) rotates on one side of the fixed plate (5). The rotating plate (602) has a cavity that cooperates with the guide rod (603).

5. A PCB board spray etching machine with a spray system according to claim 3, characterized in that: The contact surfaces of the push block (605) and the first limiting plate (606) are both inclined surfaces. The moving plate (604) is slidably connected to the slide rail (607), and the slide rail (607) is fixedly connected to the spray liquid supply box (4).

6. A PCB board spray etching machine with a spray system according to claim 1, characterized in that: The spacing adjustment assembly includes a second limiting plate (101) fixed inside the main body (1), a push plate (102) slidably connected to the second limiting plate (101), a sliding plate (103) fixed at the bottom of the push plate (102), a plurality of connecting plates (104) slidably connected at equal intervals inside the sliding plate (103), a movable seat (105) fixed at the bottom of the connecting plate (104), and the bottom of the movable seat (105) fixedly connected to the base (11).

7. A PCB board spray etching machine with a spray system according to claim 6, characterized in that: The contact surfaces of the second limiting plate (101) and the push plate (102) are both inclined surfaces. The push plate (102) is slidably connected to the air supply box (9). The moving seat (105) is slidably connected to the bottom protruding position of the air supply box (9). The sliding plate (103) has an inclined groove that cooperates with the connecting plate (104) to move.

8. A PCB board spray etching machine with a spray system according to claim 1, characterized in that: The shaking assembly includes a turntable (141) disposed in the connecting seat (13). A motor is fixed at one end of the turntable (141), and an eccentric shaft (142) is fixed at the other end of the turntable (141). A moving frame (143) is slidably connected to the eccentric shaft (142). A connecting frame (144) is fixed on one side of the moving frame (143). A plurality of limiting rods (145) are slidably connected to one side of the connecting frame (144). One end of the limiting rod (145) is fixedly connected to the nozzle (12).

9. A PCB board spray etching machine with a spray system according to claim 8, characterized in that: The movable frame (143) has a cavity that moves in conjunction with the eccentric shaft (142), and the connecting frame (144) is slidably connected to the connecting seat (13).

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