Printing ink processing system for FPC (Flexible Printed Circuit) and use method of printing ink processing system

Abstract

The invention discloses an FPC flexible circuit board ink processing system and a use method thereof, and relates to the field of flexible circuit board ink processing. The FPC flexible circuit board ink processing system comprises an ink printing machine, a placing plate is slidably connected in the ink printing machine, a plurality of adsorption mechanisms are installed in the placing plate, the adsorption mechanisms are used for adsorbing flexible circuit boards, a calibration rod is tightly attached to the placing plate, and a special-shaped connecting rod is fixedly connected to the side wall of the calibration rod. A telescopic push rod is slidably connected into the special-shaped connecting rod. According to the FPC flexible circuit board ink processing system, the circuit board standing mechanism, the IR drying furnace and the automatic exposure machine are sequentially installed at the output end of the ink printing machine, devices needed for flexible circuit board ink processing form an automatic production line, coherence and collaboration among all the devices are guaranteed, and the production efficiency is improved. Full-automatic ink processing on the flexible circuit board is realized, and the labor cost is effectively reduced.

Description

Technical Field

[0001] This invention relates to the field of ink processing for flexible printed circuit boards (FPCs), and particularly to an ink processing system for FPCs and its usage method. Background Technology

[0002] Flexible printed circuit boards (FPCs) are widely used in consumer electronics, automotive electronics, and many other fields due to their lightweight, thinness, and flexibility. In their production process, the ink printing stage is crucial, requiring the formation of a precise solder mask layer to ensure stable and reliable circuit performance. To meet this production requirement and guarantee product quality, specialized ink processing equipment for FPCs has been developed.

[0003] Existing flexible circuit board (PCB) ink processing equipment includes devices for printing, drying, and exposing ink. The printing device is a specialized unit used to print ink onto the surface of the PCB to form key structures such as solder resist and character markings. The drying device removes solvents from the printed ink, allowing it to quickly solidify and set, preventing ink dripping and blurring, and ensuring the shape accuracy of the solder resist and character markings. The exposure device uses a specific light source to cause a chemical reaction in the photosensitive substances in the ink, further improving ink adhesion and graphic accuracy. However, in existing PCB ink processing equipment, the three devices for ink printing, drying, and exposure operate independently. After ink printing, the PCB needs to be left to stand. After standing, it needs to be transferred to the drying device for further processing, and then transferred to the exposure device after drying. Each device operates independently, lacking continuity and coordination. This results in high labor costs during PCB ink processing and is prone to errors introduced by multiple manual operations, affecting the final quality of the PCB ink processing. Summary of the Invention

[0004] The purpose of this invention is to provide an ink processing system for FPC flexible circuit boards and its usage method, so as to solve the problems mentioned in the background art.

[0005] To achieve the above objectives, the present invention provides the following technical solution: an FPC flexible circuit board ink processing system includes an ink printing machine, an adjustable frame arm installed on the ink printing machine, a placement plate slidably connected inside the ink printing machine, a plurality of adsorption mechanisms installed inside the placement plate, the adsorption mechanisms being used to adsorb flexible circuit boards, a calibration rod closely attached to the placement plate, a shaped connecting rod fixedly connected to the side wall of the calibration rod, a telescopic push rod slidably connected inside the shaped connecting rod, and a second electric push rod installed between the telescopic push rod and the shaped connecting rod; A monitoring probe is installed on the adjusting frame arm. An installation box is installed on one side of the ink printing machine. A circuit board stationary mechanism is installed inside the installation box. The circuit board stationary mechanism is used to station the printed flexible circuit board. A first driving mechanism and a second driving mechanism are installed inside the ink printing machine. The first driving mechanism is used to drive the placement board, and the second driving mechanism is used to drive the calibration rod. An IR drying oven is installed on one side of the mounting box, and an automatic exposure machine is installed on the other side of the IR drying oven.

[0006] The adsorption mechanism includes: A vacuum generator is installed inside the mounting plate; A flexible suction cup is mounted on a vacuum generator, with its upper end flush with the upper surface of the placement plate.

[0007] The circuit board stationary mechanism includes: The first electric actuator is installed inside the mounting box; An automatic static placement rack is fixedly connected to the output end of the first electric push rod; The connecting plate is fixedly connected to the side wall of the automatic static rack near the IR drying oven.

[0008] The ink printing machine is provided with a first track body and a second track body. The irregular connecting rod and the telescopic push rod are slidably connected in the first track body. A T-shaped track block is slidably connected in the second track body. The T-shaped track block is fixedly connected to the bottom of the placement plate.

[0009] The first driving mechanism includes: The first servo motor is mounted on the side wall of the ink printing machine; A threaded rod, one end of which is fixedly connected to the output end of the first servo motor, is rotatably connected inside the ink printing machine, and is threadedly connected to the T-shaped track block.

[0010] The second drive mechanism includes: The second servo motor is mounted on the back of the ink printer; A double-threaded screw, one end of which is fixedly connected to the output end of a second servo motor, is rotatably connected inside an ink printing machine, and is threadedly connected to a non-circular connecting rod.

[0011] A printing mechanism is installed on the adjusting frame arm, and a printing screen frame is installed at the bottom of the adjusting frame arm. A printing screen is installed inside the printing screen frame. The printing screen cooperates with the printing mechanism to print on the flexible circuit board. A mounting rod is fixedly connected to the adjusting frame arm, and the monitoring probe is installed on the mounting rod. A transmission mechanism is installed on the side wall of the monitoring probe. The transmission mechanism is used to transmit the detection data of the monitoring probe to the central controller.

[0012] The transmission mechanism includes: A transmission connector, which is fixedly connected to the side wall of the monitoring probe; The remote signal connector is mounted on the upper end of the transmission connector.

[0013] The automatic static placement rack is on the same horizontal plane as the ink printing machine table, and the connecting plate is on the same horizontal plane as the input end of the IR drying oven.

[0014] A flexible printed circuit board (FPC) ink processing system and its usage method include the following steps: Step 1: The flexible circuit board is placed on the placement plate through an external transmission device. Then, the monitoring probe identifies the size of the flexible circuit board, and the measurement results are transmitted to the central controller in real time through the transmission connector and the remote signal connector in the transmission mechanism.

[0015] Step 2: After analyzing the data, the central controller controls the second drive mechanism to drive the calibration rod to calibrate the position of the flexible circuit board. Then, the adsorption mechanism adsorbs the flexible circuit board, and the first drive mechanism drives the placement board to move the flexible circuit board to the center of the bottom of the printing mechanism for printing. After printing, the first drive mechanism drives the placement board to the output end of the ink printer. The second electric push rod drives the telescopic push rod to transfer the flexible circuit board to the automatic placement rack. After each board is transferred, the first electric push rod drives the automatic placement rack to rise in an orderly manner. When the board surface of the next layer of the automatic placement rack is flush with the ink printer, the second electric push rod drives the telescopic push rod to transfer the flexible circuit board to the automatic placement rack. The above operation is repeated to ensure that the flexible circuit boards do not stack on the automatic placement rack.

[0016] Step 3: The first electric push rod drives the automatic stationary frame to move downwards. The flexible circuit board that has been stationary is then transferred to the IR drying oven by the second electric push rod driven by the telescopic push rod. The dried flexible circuit board then enters the automatic exposure machine for exposure processing.

[0017] The technical effects and advantages of this invention are as follows: 1. This FPC flexible circuit board ink processing system adopts a mechanism in which a circuit board holding structure, an IR drying oven, and an automatic exposure machine are sequentially installed at the output end of the ink printing machine. This forms an automated production line with the equipment required for flexible circuit board ink processing. After ink printing, the flexible circuit board is automatically transferred to the circuit board holding structure, and then sequentially enters the IR drying oven and the automatic exposure machine. This ensures the continuity and coordination between the various devices, realizes fully automated ink processing of flexible circuit boards, effectively reduces labor costs, reduces the rate of human error, and ensures the final quality of flexible circuit board ink processing.

[0018] 2. The FPC flexible circuit board ink processing system and its usage method employ a monitoring probe installed on the adjusting frame arm. The monitoring probe can measure the size of the flexible circuit board through imaging technology and transmit the data to the central controller. The central controller controls the second drive mechanism to drive the calibration rod to accurately calibrate the flexible circuit board. Then, the adsorption mechanism steadily adsorbs the flexible circuit board. The first drive mechanism drives the placement board to the bottom of the printing mechanism for precise printing. The telescopic push rod corresponds to the position of the calibration rod. After printing, the second electric push rod drives the telescopic push rod to stably transition the flexible circuit board to the circuit board stationary mechanism, which facilitates the automatic identification and precise positioning of the flexible circuit board. Attached Figure Description

[0019] Figure 1 This is a schematic diagram of the overall structure of the present invention; Figure 2 This is a schematic diagram of the ink printing machine structure of the present invention; Figure 3 This is a schematic diagram of the second drive mechanism of the present invention; Figure 4 This is a schematic diagram of the second electric push rod structure of the present invention; Figure 5 This is a schematic diagram of the circuit board stationary mechanism of the present invention; Figure 6 This is a schematic diagram of the adsorption mechanism of the present invention; Figure 7 This is a schematic diagram of the IR drying furnace structure of the present invention; Figure 8 This is a flowchart of the method of using the present invention.

[0020] In the diagram: 1. Ink printing machine; 11. First track body; 12. Second track body; 13. Mounting box; 14. Adjusting frame arm; 15. Printing mechanism; 16. Printing screen frame; 2. IR drying oven; 3. Automatic exposure machine; 4. Monitoring probe; 41. Mounting rod; 42. Transmission mechanism; 421. Transmission connector; 422. Remote signal connector; 5. Placement plate; 51. T-shaped track block; 52. Adsorption mechanism; 521. Vacuum generator; 522. Flexible suction cup; 6. Circuit board stationary mechanism; 61. First electric push rod; 62. Automatic stationary frame; 63. Connecting plate; 7. First drive mechanism; 71. First servo motor; 72. Threaded rod; 8. Second drive mechanism; 81. Second servo motor; 82. Double threaded screw; 9. Calibration rod; 91. Irregular connecting rod; 92. Telescopic push rod; 93. Second electric push rod. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] This invention provides, for example Figure 1 - Figure 7 The illustrated FPC flexible circuit board ink processing system includes an ink printer 1, on which an adjustable frame arm 14 is installed. The ink printer 1 serves as the core of the entire ink processing system, providing operating space for ink printing of the flexible circuit board. During the production process, the flexible circuit board completes a series of initial operations from placement and calibration to printing within the ink printer 1. The adjustable frame arm 14 plays a supporting and adjusting role, supporting the monitoring probe 4 and the printing mechanism 15 on the one hand, and adjusting its position according to production needs on the other hand, to ensure the accuracy of monitoring and printing work.

[0023] A placement plate 5 is slidably connected inside the ink printing machine 1. The placement plate 5 is used to place flexible circuit boards. Several adsorption mechanisms 52 are installed inside the placement plate 5 to adsorb the flexible circuit boards. A calibration rod 9 is closely attached to the placement plate 5. Driven by the second drive mechanism 8, the calibration rod 9 can accurately calibrate the flexible circuit boards to ensure the accuracy of the printing position. A shaped connecting rod 91 is fixedly connected to the side wall of the calibration rod 9. A telescopic push rod 92 is slidably connected inside the shaped connecting rod 91. After the monitoring probe 4 completes the size measurement of the flexible circuit board through imaging technology, it transmits the data to the central controller through the transmission mechanism 42. The central controller controls the second drive mechanism 8 to drive the calibration rod 9 to accurately calibrate the flexible circuit board. The telescopic push rod 92 is positioned corresponding to the calibration rod 9. A second electric push rod 93 is installed between the telescopic push rod 92 and the shaped connecting rod 91. After printing, the second electric push rod 93 drives the telescopic push rod 92 to achieve accurate transition and can also complete the transition of the stationary flexible circuit board into the IR drying oven 2. A monitoring probe 4 is installed on the adjusting frame arm 14. The monitoring probe 4 completes the size measurement of the flexible circuit board through imaging technology. The detection data is transmitted to the central controller through the transmission mechanism 42 to provide a basis for the calibration operation of the calibration rod 9. A mounting box 13 is installed on one side of the ink printing machine 1. A circuit board stationary mechanism 6 is installed in the mounting box 13. The circuit board stationary mechanism 6 is used to station the printed flexible circuit board. A first drive mechanism 7 and a second drive mechanism 8 are installed in the ink printing machine 1. The first drive mechanism 7 is used to drive the placement plate 5, and the second drive mechanism 8 is used to drive the calibration rod 9. An IR drying oven 2 is installed on one side of the mounting box 13, and an automatic exposure machine 3 is installed on the other side of the IR drying oven 2. The core of the IR drying oven 2 lies in infrared radiation heating technology. It emits infrared rays with wavelengths between 0.7μm and 80μm, which directly act on the ink molecules. When the frequency of the infrared rays matches the vibration or rotational energy level of the ink molecules, the molecules absorb energy and jump to a higher energy level, triggering violent collisions and self-heating effects, which raises the temperature of the material. Mid- and long-wave infrared rays with wavelengths >3μm have weaker penetrating power and are more easily absorbed by the surface and internal moisture of the material, causing water molecules to vibrate and break free of their binding, achieving rapid evaporation. The automatic exposure machine 3 is controlled by a computer to convert the circuit pattern data into light signals. Using a high-precision optical system, the light beam is focused onto the surface of the circuit board coated with photoresist. After the photoresist absorbs the light energy of a specific wavelength, a photochemical reaction occurs, and the light-receiving part dissolves in the developing solution, forming a fine circuit pattern consistent with the original design. The automatic exposure machine 3 uses LDI technology, which eliminates the need for a film and can achieve micron-level precision directly through laser scanning. In contrast, traditional exposure machines rely on parallel light sources and ensure the accuracy of pattern transfer by controlling exposure time and light intensity. Both rely on the photosensitive properties of photoresist to complete the patterning process.

[0024] The adsorption mechanism 52 includes; Vacuum generator 521 is installed inside placement plate 5. Vacuum generator 521 generates negative pressure to make flexible suction cup 522 adsorb flexible circuit board. Vacuum generator 521 works based on the Venturi effect principle. When compressed air flows through the nozzle inside at high speed, a jet will be formed at the nozzle outlet, causing the surrounding air to be sucked in, resulting in a rapid decrease in pressure in the outlet area, thereby creating a vacuum at the inlet, thus realizing the adsorption of objects. The flexible suction cup 522 is mounted on the vacuum generator 521. The upper end of the flexible suction cup 522 is flush with the upper surface of the placement plate 5. The flexible suction cup 522 directly contacts the flexible circuit board and uses the negative pressure generated by the vacuum generator 521 to adsorb the circuit board, ensuring the stability of the circuit board during operation.

[0025] The circuit board stationary mechanism 6 includes: The first electric push rod 61 is installed in the mounting box 13. The first electric push rod 61 provides power for the movement of the automatic stationary rack 62, driving the automatic stationary rack 62 to move up and down, so as to facilitate the reception and transfer of flexible circuit boards. Automatic static placement rack 62 is fixedly connected to the output end of the first electric push rod 61. Each layer of the automatic static placement rack 62 can be on the same horizontal plane as the table of the ink printing machine 1. It is used to place the printed and calibrated flexible circuit board and keep it static. The connecting plate 63 is fixedly connected to the side wall of the automatic settling rack 62 near the IR drying oven 2. Each connecting plate 63 can be on the same horizontal plane as the input end of the IR drying oven 2, which facilitates the transfer of the settling circuit board from the automatic settling rack 62 into the IR drying oven 2.

[0026] The ink printing machine 1 is provided with a first track body 11 and a second track body 12. The irregular connecting rod 91 and the telescopic push rod 92 are slidably connected in the first track body 11. A T-shaped track block 51 is slidably connected in the second track body 12. The T-shaped track block 51 is fixedly connected to the bottom of the placement plate 5.

[0027] The first drive mechanism 7 includes: The first servo motor 71 is mounted on the side wall of the ink printing machine 1, and the first servo motor 71 provides power for the rotation of the threaded rod 72; The threaded rod 72 has one end fixedly connected to the output end of the first servo motor 71. The threaded rod 72 is rotatably connected inside the ink printing machine 1. The threaded rod 72 is threadedly connected to the T-shaped track block 51. Driven by the first servo motor 71, the threaded rod 72 drives the placement plate 5 to move horizontally within the second track body 12.

[0028] The second drive mechanism 8 includes: The second servo motor 81 is mounted on the back of the ink printing machine 1 and provides power for the rotation of the double-threaded screw 82. The double-threaded screw 82 has one end fixedly connected to the output end of the second servo motor 81. The double-threaded screw 82 is rotatably connected inside the ink printing machine 1. The double-threaded screw 82 is threadedly connected to the irregular connecting rod 91. Driven by the second servo motor 81, the double-threaded screw 82 drives the calibration rod 9 and the telescopic push rod 92 to move within the first track body 11.

[0029] An installation rod 41 is fixedly connected to the adjustment frame arm 14. The monitoring probe 4 is installed on the installation rod 41. A transmission mechanism 42 is installed on the side wall of the monitoring probe 4. The transmission mechanism 42 is used to transmit the detection data of the monitoring probe 4 to the central controller. The monitoring probe 4 performs an all-round scan of the circuit board surface and captures digital images containing key dimensional information such as edge contours and hole coordinates in real time. The built-in image processing algorithm module then preprocesses the original image, including noise reduction, contrast enhancement, and edge sharpening, to improve the accuracy of feature extraction. A sub-pixel-level edge detection algorithm is used to accurately locate the edge contour of the circuit board. Combined with geometric modeling technology, the two-dimensional image data is converted into actual dimensional parameters in a three-dimensional spatial coordinate system. Finally, the measurement results are transmitted to the central controller in real time through the transmission connector 421 and the remote signal connector 422 in the transmission mechanism 42.

[0030] Transmission mechanism 42 includes: The transmission connector 421 is fixedly connected to the side wall of the monitoring probe 4. The transmission connector 421 connects the monitoring probe 4 and the remote signal connector 422, ensuring stable data transmission. The transmission connector 421 has a specific circuit structure and a precise interface matching mechanism. When connected to the monitoring probe 4, it fits tightly against the probe's data output port, forming a stable electrical connection through physical contact. This connection method not only effectively prevents signal interference and loss due to poor contact during data transmission but also provides a reliable physical channel for data transmission. Furthermore, the transmission connector 421 possesses a certain degree of mechanical strength and stability, capable of withstanding a certain degree of vibration and external impact, ensuring a stable connection with the monitoring probe 4 even in complex working environments, laying the foundation for stable data transmission to the remote signal connector 422. The remote signal connector 422, installed on the upper end of the transmission connector 421, is used to remotely transmit the detection data of the monitoring probe 4 to the central controller, realizing real-time data transmission. The remote signal connector 422 is mainly responsible for remotely transmitting the detection data of the monitoring probe 4 to the central controller. The remote signal connector 422 integrates modules such as signal modulation, encoding, and wireless transmission. After receiving the data from the transmission connector 421, it first modulates the original signal to convert it into a signal form suitable for wireless transmission, and then assigns a specific identifier and format to the signal through encoding technology so that the central controller can accurately identify it. The remote signal connector 422 uses the wireless transmission module to transmit the processed signal in the form of electromagnetic waves, transmitting it across a certain distance to the central controller, realizing real-time and efficient data transmission, and enabling the central controller to obtain the detection information of the monitoring probe 4 in a timely manner.

[0031] A printing mechanism 15 is installed on the adjusting frame arm 14, and a printing screen frame 16 is installed at the bottom of the adjusting frame arm 14. A printing screen is installed inside the printing screen frame 16. The printing screen and the printing mechanism 15 work together to print ink on the calibrated and fixed flexible circuit board to form key structures such as solder resist layer and character marking.

[0032] The automatic placement rack 62 is on the same horizontal plane as the table of the ink printing machine 1, which can stably transfer the printed flexible circuit board from the ink printing machine 1 to the automatic placement rack 62. The connecting plate 63 is on the same horizontal plane as the input end of the IR drying oven 2, which can stably transfer the placed flexible circuit board from the automatic placement rack 62 to the IR drying oven 2.

[0033] The FPC flexible circuit board ink processing system and its usage method include the following steps: Step 1: The flexible circuit board is placed on the placement plate 5 through an external transmission device. Then, the monitoring probe 4 identifies the size of the flexible circuit board. The measurement results are transmitted to the central controller in real time through the transmission connector 421 and the remote signal connector 422 in the transmission mechanism 42.

[0034] Step 2: After analyzing the data, the central controller controls the second drive mechanism 8 to drive the calibration rod 9 to calibrate the position of the flexible circuit board. Then, the adsorption mechanism 52 adsorbs the flexible circuit board. The first drive mechanism 7 drives the placement plate 5 to move the flexible circuit board to the center of the bottom of the printing mechanism 15 for printing. After printing, the first drive mechanism 7 drives the placement plate 5 to the output end of the ink printer 1. The second electric push rod 93 drives the telescopic push rod 92 to transfer the flexible circuit board to the automatic placement rack 62. After each transfer, the first electric push rod 61 drives the automatic placement rack 62 to rise in an orderly manner. When the board surface of the next layer of the automatic placement rack 62 is flush with the ink printer 1, the second electric push rod 93 drives the telescopic push rod 92 to transfer the flexible circuit board to the automatic placement rack 62. The above operation is repeated to ensure that the flexible circuit boards do not stack on the automatic placement rack 62.

[0035] Step 3: The first electric push rod 61 drives the automatic stationary frame 62 to move downward. The flexible circuit board that has been stationary is transferred to the IR drying oven 2 by the second electric push rod 93 driving the telescopic push rod 92. The dried flexible circuit board enters the automatic exposure machine 3 for exposure processing.

[0036] Figure 8 The flowchart of the ink processing on the flexible circuit board of the present invention is as follows: First, the flexible circuit board is placed on the placement plate 5 through an external transmission device to facilitate the calibration rod 9 to calibrate the position of the flexible circuit board. Then, the monitoring probe 4 identifies the size of the flexible circuit board and performs a full-range scan of the circuit board surface to capture digital images containing key size information such as edge contours and hole coordinates in real time. The built-in image processing algorithm module then preprocesses the original image, including noise reduction, contrast enhancement and edge sharpening, to improve the accuracy of feature extraction. A sub-pixel-level edge detection algorithm is used to accurately locate the edge contour of the circuit board. Combined with geometric modeling technology, the two-dimensional image data is converted into actual size parameters in a three-dimensional spatial coordinate system. Finally, the measurement results are transmitted to the central controller in real time through the transmission connector 421 and the remote signal connector 422 in the transmission mechanism 42.

[0037] After analyzing the data, the central controller controls the second drive mechanism 8 to drive the calibration rod 9 to calibrate the position of the flexible circuit board. Then, the adsorption mechanism 52 fixes the flexible circuit board. The first drive mechanism 7 drives the placement plate 5 to move the flexible circuit board to the bottom of the printing mechanism 15 for printing. After printing, the first drive mechanism 7 drives the placement plate 5 to the output end of the ink printer. The second electric push rod 93 drives the telescopic push rod 92 to transfer the flexible circuit board to the automatic placement rack 62. After the transfer of a single board, the first electric push rod 61 drives the automatic placement rack 62 to rise in an orderly manner to ensure that the flexible circuit boards do not stack on the automatic placement rack 62.

[0038] After the flexible circuit board has been left to stand, the second electric push rod 93 drives the telescopic push rod 92 to transfer the flexible circuit board into the IR drying oven 2. After drying, the flexible circuit board enters the automatic exposure machine 3 for exposure treatment. The core of the IR drying oven 2 is infrared radiation heating technology. It emits infrared rays with wavelengths between 0.7μm and 80μm, which directly act on ink molecules. When the frequency of the infrared rays matches the vibrational or rotational energy level of the ink molecules, the molecules absorb energy and jump to a higher energy level, triggering violent collisions and a self-heating effect, which raises the temperature of the material. Mid-to-long-wave infrared rays with wavelengths >3μm have weaker penetrating power and are more easily absorbed by the surface and internal moisture of the material, causing water molecules to vibrate and break free of their binding, thus achieving rapid evaporation. The automatic exposure machine 3 is controlled by a computer to convert the circuit pattern data into light signals. A high-precision optical system focuses the light beam onto the surface of the circuit board coated with photoresist. After the photoresist absorbs light energy of a specific wavelength, a photochemical reaction occurs, and the light-receiving part dissolves in the developer, forming a fine circuit pattern consistent with the original design. The automatic exposure machine 3 uses LDI technology. LDI technology does not require a film and can directly achieve micron-level precision through laser scanning. In contrast, traditional exposure machines rely on parallel light sources and control the exposure time and light intensity to ensure the accuracy of pattern transfer. Both rely on the photosensitive properties of photoresist to complete the patterning process.

[0039] This FPC flexible circuit board ink processing system adopts a structure in which a circuit board holding mechanism 6, an IR drying oven 2, and an automatic exposure machine 3 are sequentially installed at the output end of the ink printing machine 1. This forms an automated production line with the necessary equipment for flexible circuit board ink processing. After ink printing, the flexible circuit boards are automatically transferred to the circuit board holding mechanism 6, and then sequentially enter the IR drying oven 2 and the automatic exposure machine 3. This ensures the continuity and coordination between the various devices, achieving fully automated ink processing of flexible circuit boards. This effectively reduces labor costs and the rate of human error, ensuring the final quality of the flexible circuit board ink processing. Additionally, an adjustment frame arm 14 is installed... The monitoring probe 4 can measure the size of the flexible circuit board through imaging technology and transmit the data to the central controller. The central controller controls the second drive mechanism 8 to drive the calibration rod 9 to accurately calibrate the flexible circuit board. The adsorption mechanism 52 then steadily adsorbs the flexible circuit board. The first drive mechanism 7 drives the placement plate 5 to the bottom of the printing mechanism 15 for accurate printing. The telescopic push rod 92 corresponds to the position of the calibration rod 9. After printing, the second electric push rod 93 drives the telescopic push rod 92 to stably transfer the flexible circuit board to the circuit board stationary mechanism 6, which facilitates the automatic identification and accurate positioning of the flexible circuit board.

[0040] Example 1: High-Precision Flexible Circuit Board Printing and Intelligent Calibration System; This example focuses on the core printing and calibration stages of the FPC flexible circuit board ink processing system. The system uses an ink printer 1 as its main body. An internally slidingly connected placement plate 5 achieves stable fixation of the flexible circuit board through a built-in adsorption mechanism 52—a vacuum generator 521 generates negative pressure, driving a flexible suction cup 522 to tightly adsorb the circuit board, ensuring no displacement risk during operation. The adjustable frame arm 14 serves as a multi-functional support structure, not only supporting the monitoring probe 4 and the printing mechanism 15, but also allowing for flexible position adjustment according to production needs, ensuring the accuracy of monitoring data and the stability of the printing process. The monitoring probe 4 measures the circuit board dimensions in real time using imaging technology. The data is rapidly transmitted to the central controller via the transmission mechanism 42 (including the transmission connector 421 and the remote signal connector 422), driving the second servo motor 81 in the second drive mechanism 8 to rotate the double-threaded screw 82. This, in turn, controls the calibration rod 9 to move precisely within the first track body 11, performing millimeter-level calibration of the circuit board. After calibration, the first servo motor 71 in the first drive mechanism 7 drives the threaded rod 72 to rotate, which, through the T-shaped track block 51, moves the placement plate 5 horizontally along the second track body 12. This, in conjunction with the printing screen frame 16 and printing mechanism 15 at the bottom of the adjusting frame arm 14, completes the ink printing of key structures such as the solder resist layer and character markings. This system, through the deep integration of mechanical transmission and intelligent control, achieves full-process automation from circuit board fixing, size monitoring, position calibration to ink printing, significantly improving printing accuracy and production efficiency. It is particularly suitable for the mass production of high-density, multi-layer flexible circuit boards.

[0041] Example 2: Flexible Circuit Board Static Transfer and Post-Processing Integration System; This example focuses on optimizing the static transfer of printed flexible circuit boards and the connection between post-printing drying and exposure processes. The printed circuit boards are transferred to the circuit board static mechanism 6 within the mounting box 13. This mechanism is driven by a first electric push rod 61 to move the automatic static rack 62 up and down. Each layer of its multi-layered structure can remain level with the ink printing machine 1 table, facilitating rapid reception and static placement of the circuit boards. The first electric push rod 61 within the circuit board static mechanism 6 is programmed with a first-in, first-out (FIFO) function to prevent printed products from remaining in place for extended periods while other products have insufficient static time. Each connecting plate 63 is at the same level as the input end of the IR drying oven 2. Combined with the telescopic push rod 92 (driven by a second electric push rod 93) slidably connected within the irregularly shaped connecting rod 91 on the side wall of the calibration rod 9, a seamless transition of the circuit board from the automatic static rack 62 to the IR drying oven 2 can be achieved, reducing manual intervention and transfer time. The IR drying oven 2 employs infrared radiation heating technology, emitting infrared rays with wavelengths from 0.7μm to 80μm to directly act on the ink molecules. The mid-to-long-wave infrared rays (>3μm) have moderate penetrating power, effectively exciting water molecule vibrations and promoting rapid evaporation. This increases drying efficiency by 30% compared to traditional hot air circulation, and achieves temperature uniformity of ±2℃, preventing localized overheating and deformation of the circuit board. After drying, the circuit board enters the automatic exposure machine 3. This equipment converts the circuit pattern data into optical signals using a computer and uses a high-precision optical system to focus the beam onto the photoresist-coated circuit board surface. LDI (Laser Direct Imaging) technology eliminates the need for a film, achieving 5μm-level precision directly through laser scanning, making it suitable for high-precision circuit fabrication. Traditional exposure machines rely on parallel light sources, controlling exposure time (accuracy ±0.1s) and light intensity (uniformity ±3%) to ensure accurate pattern transfer. Both rely on the photosensitive properties of the photoresist for patterning. This system, through the integrated design of the stationary transfer mechanism and subsequent process equipment, realizes the fully automated connection of the flexible circuit board from printing to drying and exposure, significantly shortening the production cycle, while ensuring the high precision and consistency of the circuit pattern, making it particularly suitable for the manufacturing of flexible circuit boards for high-end electronic products.

[0042] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. An ink processing system for flexible printed circuit boards (FPCs), comprising an ink printing machine (1), wherein an adjustable frame arm (14) is mounted on the ink printing machine (1), characterized in that, The ink printing machine (1) has a sliding plate (5) inside, and a number of adsorption mechanisms (52) are installed inside the plate (5). The adsorption mechanisms (52) are used to adsorb flexible circuit boards. A calibration rod (9) is attached to the plate (5). A shaped connecting rod (91) is fixedly connected to the side wall of the calibration rod (9). A telescopic push rod (92) is slidably connected inside the shaped connecting rod (91). A second electric push rod (93) is installed between the telescopic push rod (92) and the shaped connecting rod (91). A monitoring probe (4) is installed on the adjusting frame arm (14). An installation box (13) is installed on one side of the ink printing machine (1). A circuit board stationary mechanism (6) is installed inside the installation box (13). The circuit board stationary mechanism (6) is used to station the printed flexible circuit board. A first driving mechanism (7) and a second driving mechanism (8) are installed inside the ink printing machine (1). The first driving mechanism (7) is used to drive the placement plate (5), and the second driving mechanism (8) is used to drive the calibration rod (9). An IR drying oven (2) is installed on one side of the mounting box (13), and an automatic exposure machine (3) is installed on one side of the IR drying oven (2).

2. The FPC flexible circuit board ink processing system according to claim 1, characterized in that, The adsorption mechanism (52) includes: A vacuum generator (521) is installed inside the placement plate (5); A flexible suction cup (522) is mounted on a vacuum generator (521), with the upper end of the flexible suction cup (522) flush with the upper surface of the placement plate (5).

3. The FPC flexible circuit board ink processing system according to claim 1, characterized in that, The circuit board stationary mechanism (6) includes: The first electric push rod (61) is installed in the mounting box (13); An automatic static placement rack (62) is fixedly connected to the output end of the first electric push rod (61); The connecting plate (63) is fixedly connected to the side wall of the automatic static rack (62) near the IR drying oven (2).

4. The FPC flexible circuit board ink processing system according to claim 1, characterized in that, The ink printing machine (1) is provided with a first track body (11) and a second track body (12). The irregular connecting rod (91) and the telescopic push rod (92) are slidably connected in the first track body (11). A T-shaped track block (51) is slidably connected in the second track body (12). The T-shaped track block (51) is fixedly connected to the bottom of the placement plate (5).

5. The FPC flexible circuit board ink processing system according to claim 4, characterized in that, The first drive mechanism (7) includes: The first servo motor (71) is mounted on the side wall of the ink printing machine (1); A threaded rod (72) is fixedly connected at one end to the output end of the first servo motor (71). The threaded rod (72) is rotatably connected inside the ink printing machine (1). The threaded rod (72) is threadedly connected to the T-shaped track block (51).

6. The FPC flexible circuit board ink processing system according to claim 4, characterized in that, The second drive mechanism (8) includes: The second servo motor (81) is mounted on the back of the ink printing machine (1); A double-threaded screw (82) is fixedly connected at one end to the output end of a second servo motor (81). The double-threaded screw (82) is rotatably connected inside an ink printing machine (1). The double-threaded screw (82) is threadedly connected to a non-circular connecting rod (91).

7. The FPC flexible circuit board ink processing system according to claim 1, characterized in that, A printing mechanism (15) is installed on the adjusting frame arm (14), and a printing screen frame (16) is installed at the bottom of the adjusting frame arm (14). A printing screen is installed inside the printing screen frame (16). The printing screen and the printing mechanism (15) cooperate to print on the flexible circuit board. An installation rod (41) is fixedly connected to the adjusting frame arm (14). The monitoring probe (4) is installed on the installation rod (41). A transmission mechanism (42) is installed on the side wall of the monitoring probe (4). The transmission mechanism (42) is used to transmit the detection data of the monitoring probe (4) to the central controller.

8. The FPC flexible circuit board ink processing system according to claim 7, characterized in that, The transmission mechanism (42) includes: The transmission connector (421) is fixedly connected to the side wall of the monitoring probe (4); Remote signal connector (422) is mounted on the upper end of transmission connector (421).

9. The FPC flexible circuit board ink processing system according to claim 3, characterized in that, The automatic static placement rack (62) is on the same horizontal plane as the table of the ink printing machine (1), and the connecting plate (63) is on the same horizontal plane as the input end of the IR drying oven (2).

10. An ink processing system for flexible printed circuit boards (FPCs) and its method of use, wherein the ink processing system for FPCs according to any one of claims 1-9 is characterized in that, Includes the following steps: Step 1: Place the flexible circuit board on the placement plate (5) through an external transmission device. Then, the monitoring probe (4) identifies the size of the flexible circuit board. The measurement results are transmitted to the central controller in real time through the transmission connector (421) and the remote signal connector (422) in the transmission mechanism (42). Step 2: After analyzing the data, the central controller controls the second drive mechanism (8) to drive the calibration rod (9) to calibrate the position of the flexible circuit board. Then, the adsorption mechanism (52) adsorbs the flexible circuit board. The first drive mechanism (7) drives the placement plate (5) to move the flexible circuit board to the bottom center of the printing mechanism (15) for printing. After printing, the first drive mechanism (7) drives the placement plate (5) to the output end of the ink printer (1). The second electric push rod (93) drives the telescopic push rod (92) to transfer the flexible circuit board to the automatic placement rack (62). After the single-piece transfer, the first electric push rod (61) drives the automatic placement rack (62) to rise in an orderly manner. When the board surface of the next layer of the automatic placement rack (62) is flush with the ink printer (1), the second electric push rod (93) drives the telescopic push rod (92) to transfer the flexible circuit board to the automatic placement rack (62). The above operation is repeated to ensure that the flexible circuit boards do not stack on the automatic placement rack (62). Step 3: The first electric push rod (61) drives the automatic stationary frame (62) to move downward. The flexible circuit board that has been stationary is transferred to the IR drying oven (2) by the second electric push rod (93) driving the telescopic push rod (92). The dried flexible circuit board enters the automatic exposure machine (3) for exposure treatment.

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