Techniques for assembly, mounting and repair of power electronics including via semiconductor devices

Abstract

A method for providing a power electronic assembly includes mounting a packaged semiconductor device including a device via on a printed circuit board (PCB) including a board via to provide a board assembly with elements in which the PCB is mechanically and electrically coupled with the packaged semiconductor device and the device via is aligned with the board via; aligning the board assembly with the element with the heat sink such that the packaged semiconductor device contacts the heat sink and the board through-hole and the device through-hole are aligned with the screw hole of the heat sink; introducing a screw into the plate through-hole and the device through-hole; and rotating the screw into secure engagement with the screw hole of the heat sink to provide the power electronic assembly.

Description

Technical Field

[0001] This application relates to techniques for assembling, mounting, and repairing power electronic devices, including through-hole semiconductor devices. Background Technology

[0002] Semiconductor devices such as transistors, diodes, thyristors, and other power switches are used in power electronics. These devices can be configured as through-hole devices, where the semiconductor component is encapsulated in a package, electrical leads extend from the package to provide electrical connections to the semiconductor component, and the through-hole is formed through the package. An example of a through-hole device is the TO247 design, which includes a package with three electrical leads and through-holes for mounting on a heatsink. In conventional product assembly methods, through-hole devices are first mounted and secured to the heatsink by screws that pass through the through-holes in their packages and engage with the heatsink. Next, a printed circuit board (PCB) is laid out to engage the device's electrical leads, for example, by introducing the electrical leads into the through-holes formed in the PCB. The electrical leads are then soldered to the PCB. In such methods, connecting the PCB to the through-hole device mounted to the heatsink is a difficult operation, especially when several through-holes and several electrical leads need to be connected to the PCB. Furthermore, conventional product disassembly is difficult if the through-hole device is damaged or fails. First, the solder must be removed by suction, which is difficult because through-hole devices may have a large amount of copper or other conductors that absorb a significant amount of heat. As with assembly, the large number of through-hole devices and leads can further complicate this operation. Allowing the removal of the PCB from the through-hole devices to allow access to and removal of mounting screws, thus enabling the removal and replacement of the through-hole devices, requires a significant amount of work. Furthermore, the difficult product assembly process must then be repeated. There is a significant need for the unique devices, methods, and systems disclosed herein. Summary of the Invention

[0003] For the purpose of clearly, concisely, and accurately describing the exemplary embodiments of this disclosure, the ways and methods of making and using them, and for enabling the practice, making, and use of them, reference will now be made to certain exemplary embodiments, including those illustrated in the accompanying drawings, and they will be described using specific language. However, it should be understood that this does not constitute a limitation on the scope of the invention, and that the invention includes and protects such changes, modifications, and further applications of the exemplary embodiments that will conceive of those skilled in the art. Attached Figure Description

[0004] Figure 1 It is a schematic diagram depicting certain aspects of the example system in the example operating environment.

[0005] Figure 2A and Figure 2B These are top and side views of an example packaged semiconductor device.

[0006] Figure 3 This is a top view of an example populated printed circuit board (PCB) with components.

[0007] Figure 4 This is a side view of an example power electronics assembly.

[0008] Figures 5A to 5F This is a partial side view of several states of an example power electronic component.

[0009] Figure 6 It is a flowchart depicting certain aspects of the example method.

[0010] Figure 7 It is a flowchart depicting certain aspects of the example method.

[0011] Figure 8A and Figure 8B This is a side view of another example power electronics assembly in two assembly states. Detailed Implementation

[0012] refer to Figure 1 The illustration depicts an example asset 100 including a power system 110 (also referred to herein as system 110) configured to provide power to one or more loads 109. Asset 100 may be provided in many forms, including, for example, as a vehicle or vehicle powertrain system (e.g., a highway vehicle or vehicle powertrain system or an off-highway vehicle or vehicle powertrain system), a working machine or working machine powertrain system, a generator set or generator powertrain system, or a hydraulic fracturing rig or hydraulic fracturing rig powertrain system, to name just a few non-limiting examples. It should be appreciated that asset 100 may include and be configured and provided as many other industrial and transportation assets, as those skilled in the art will conceive of through the benefits and insights of this disclosure.

[0013] System 110 includes a power generation unit 114, which can be configured and provided in many forms, including, for example, a hydrogen fuel cell, a mechanically driven generator, or another type of power system. The power generation unit 114 is operatively coupled to and configured to provide power to power electronics 116. An energy storage system (ESS) 112 is also operatively coupled to and configured to receive power from and provide power to power electronics 116. Power electronics 116 can also be configured and operable to directly provide power to one or more loads 109 by providing electrical power to one or more loads 109, or indirectly by providing electrical power to a motor (which in turn mechanically drives one or more loads 109). An electronic control system (ECS) 130 is operatively coupled to and configured to control the operation of ESS 112, power electronics 116, and the power generation unit.

[0014] ECS 130 preferably includes one or more programmable microcontrollers of the solid-state integrated circuit type, and one or more non-transitory memory media configured to store instructions executable by the one or more microcontrollers. For the purposes of this application, the term "microcontroller" should be understood to also include microprocessors and other types of integrated circuit processors. ECS 130 operatively communicates with sensors or controllers of components, systems, and subsystems of asset 100, and is adapted and configured to control the operation of sensors or controllers of components, systems, and subsystems of asset 100 and / or receive input therefrom. ECS 130 operatively communicates with one or more sensors of asset 100, and is adapted and configured to control the operation of one or more sensors of asset 100 and / or receive input therefrom. It should be appreciated that... Figure 1 The control relationships between the aforementioned components are conceptually depicted using dashed arrows, and can be implemented using various communication hardware and protocols, such as one or more Controller Area Networks (CAN) or other communication components.

[0015] The ECS130 can be implemented in any of a number of ways, combining or distributing control functions across one or more control units. The ECS130 can execute operational logic defining various control, management, and / or regulation functions. This operational logic can take the form of dedicated hardware, such as a hardwired state machine, an analog computing machine, programmable instructions, and / or other forms as will be apparent to those skilled in the art. The ECS130 can be provided as a single component or a collection of operatively connected components; and can be constructed from digital circuitry, analog circuitry, or a hybrid of both. When in a multi-component form, the ECS130 may have one or more components remotely located relative to other components in a distributed arrangement. The ECS130 may include several processing units arranged to operate independently in a pipelined processing arrangement, a parallel processing arrangement, or the like. It should also be recognized that any component of the ECS130 and / or its constituent parts may include one or more signal conditioners, modulators, demodulators, arithmetic logic units (ALUs), central processing units (CPUs), limiters, oscillators, control clocks, amplifiers, signal conditioners, filters, format converters, communication ports, clamps, delay devices, memory devices, analog-to-digital (A / D) converters, digital-to-analog (D / A) converters, and / or various circuit systems or components as would be apparent to those skilled in the art for performing the desired communication.

[0016] refer to Figure 2A and Figure 2B The illustration depicts an example packaged semiconductor device 220. In the illustrated example, the packaged semiconductor device 220 includes a semiconductor device 226 encapsulated in a packaging material 223. In various embodiments, the packaging material may include resin, plastic, metal, glass, ceramic materials, or combinations thereof. A device via 224 is formed in the packaged semiconductor device 220 and extends through the packaged semiconductor device 220. A plurality of electrical leads 228 are electrically connected to the semiconductor device 226 and extend from the packaging material 223. In the illustrated example, the packaged semiconductor device 220 is configured and provided as a three-terminal device and electrical leads 228a, 228b, 228c electrically connected to corresponding terminals of the semiconductor device 226. In various forms, the three-terminal device may include a MOSFET, IGBT, thyristor, or various other power switches or other types of three-terminal devices. In some embodiments, the packaged semiconductor device 220 may be configured and provided as a device having more or fewer terminals. It should be appreciated that the packaged semiconductor device 220 is an example of a through-hole packaged semiconductor device according to the present disclosure. As those skilled in the art will appreciate from the benefits and insights of this disclosure, a number of other through-hole packaged semiconductor devices are also envisioned, including through-holes suitable for receiving fasteners or connecting components.

[0017] refer to Figure 3 The illustration shows an example board assembly 200 with components, which includes a combination of... Figure 4 The illustrated and described example power electronics assembly 300 includes numerous components. The board assembly with components includes a printed circuit board (PCB) 210 and a plurality of packaged semiconductor devices 222 mounted on the PCB 210. The packaged semiconductor devices 222 may be provided in any of the forms described in conjunction with packaged semiconductor devices 220. In the illustrated embodiment, the plurality of packaged semiconductor devices 222 includes packaged semiconductor devices 220a, 220b, 220c, 220d, 220e, and 220n mounted on the printed circuit board. In other embodiments, different numbers and arrangements of packaged semiconductor devices may be utilized.

[0018] The control circuitry system 230 is also mounted on the PCB 210. In other embodiments, different numbers and arrangements of control circuitry may be used. Multiple other components 235 are also mounted on the PCB 210. In the illustrated example, the multiple other components 235 include components 235a, 235b, 235c, and 235n. In other embodiments, different numbers and arrangements of components may be used. The interface 240 is also operatively coupled to the PCB 210 and provides electrical power connections between an external power source and the packaged semiconductor device 222, as well as electrical control connections between the electronic control components and the control circuitry system 230.

[0019] like Figure 4 The illustration depicts an example power electronics assembly 300. The power electronics assembly 300 includes a board assembly 200 with components and a heat sink 250. The board assembly 200 with components is operatively connected to the heat sink 250 by a plurality of screws 170 inserted through corresponding board through-holes formed in a PCB 210 and corresponding device through-holes formed in packaged semiconductor devices 222, and rotated to securely engage with corresponding screw holes in the heat sink 250 to provide the power electronics assembly 300. In the illustrated example, the plurality of screws 170 includes screws 170a, 170b, 170c, 170d, 170e, and 170n, which are inserted into the device through-holes of packaged semiconductor devices 220a, 220b, 220c, 220d, 220e, and 220n and the corresponding board through-holes of the PCB 210 and engage with corresponding screw holes in the heat sink 250.

[0020] like Figures 5A to 5D The illustration shows several assembly states of a PCB 210, a board assembly 200 with components, and a portion of a power electronics assembly 300. Figure 5AThe description focuses on a portion of PCB 210, board assembly 200 with components, and power electronics assembly 300, which includes or relates to packaged semiconductor devices 220a and screws 170a. It should be understood that the description of this portion also applies to other portions of PCB 210, board assembly 200 with components, and power electronics assembly 300, which respectively include packaged semiconductor devices 220b, 220c, 220d, 220e, 220n and screws 170a, 170b, 170c, 170d, 170e, 170n.

[0021] like Figure 5A As illustrated, the packaged semiconductor device 220a includes a plurality of electrical leads 228a, 228b, and 228c, which are alignable with corresponding plurality of device mounting vias 218a, 218b, and 218c formed in the PCB 210. Device via 129a is also aligned with board via 219a.

[0022] like Figure 5B As illustrated, multiple electrical leads 228a, 228b, and 228c of the packaged semiconductor device 220a can be introduced into corresponding multiple device mounting vias 218a, 218b, and 218c formed in the PCB 210 and advanced to the position where the packaged semiconductor device 220a contacts the PCB 210. The multiple electrical leads 228a, 228b, and 228c can then be soldered to the vias 218a, 218b, and 218c of the PCB 210. This soldering provides electrical and mechanical interconnection of the packaged semiconductor device 220a and its mounting on the PCB 210. In this state and configuration, the device via 129a is aligned with the board via 219a.

[0023] like Figure 5C As illustrated, a board assembly with components, including a PCB 210 and a packaged semiconductor device 220a, can be aligned with a heat sink 250 such that device vias 129a and board vias 219a are aligned with screw holes 259a in the heat sink 250. The board assembly can be pushed toward the heat sink 250 such that the packaged semiconductor device 220a contacts the heat sink 250, and the board vias 219a and device vias 229a are aligned. Figure 5D The configuration and positioning shown in the figure are aligned with screw hole 259a.

[0024] like Figure 5E As illustrated, screw 170a can be aligned with through-hole 219a and pushed toward the board assembly. Figure 5FAs illustrated, screw 170a can be inserted into and pushed through through-holes 219a and 229a until it encounters screw hole 259a, at which point screw 170a can be rotated to securely engage with screw hole 259a of heat sink 250 to provide power electronics 300. Through-hole 219a includes a first portion and a second portion, the first portion being configured to receive a portion of shaft 172b of screw 170a, and the second portion having a larger diameter than the first portion and being configured to receive head 172a of screw 170a.

[0025] refer to Figure 6 The illustration depicts an example method 600 for assembling and providing power electronic components. Method 600 begins at operation 602, in which a packaged semiconductor device including a device through-hole is provided in an assembly environment. The packaged semiconductor device may be configured and provided in the form of packaged semiconductor device 220, or may be configured and provided in the form of other semiconductor devices as would be conceived by those skilled in the art through the benefits and insights of this disclosure. Although method 600 is described in conjunction with a single packaged semiconductor device, it should be appreciated that method 600 may be performed with multiple packaged semiconductor devices that may undergo similar operations in conjunction with method 600. In such methods, operations described in conjunction with one packaged semiconductor device may also be performed in conjunction with several packaged semiconductor devices.

[0026] Method 600 proceeds from operation 602 to operation 604, in which a printed circuit board (PCB) including board through-holes and multiple device mounting through-holes is provided in an assembly environment. The PCB may be configured and provided in the form of PCB 210, or may be configured and provided in other forms of PCB as would be conceived by those skilled in the art through the benefits and insights of this disclosure.

[0027] Method 600 proceeds from operation 604 to operation 606, in which multiple electrical leads of the packaged semiconductor device are inserted into corresponding device mounting vias among multiple device mounting vias formed in the PCB. Method 600 proceeds from operation 606 to operation 608, in which the multiple electrical leads are soldered to the PCB, effectively mechanically and electrically connecting the packaged semiconductor device and the PCB to provide a board assembly with components. It should be appreciated that operations 604 and 606 include exemplary mounting operations by which a packaged semiconductor device including device vias can be mounted on a printed circuit board (PCB) including board vias to provide a board assembly with components in which the PCB is mechanically and electrically connected to the packaged semiconductor device.

[0028] Method 600 proceeds from operation 608 to operation 610, in which the board assembly with components is aligned with a heat sink such that the packaged semiconductor device contacts the heat sink, and the board vias and device vias are aligned with the screw holes of the heat sink. Such alignment may include directly aligning the device vias to the board vias using one or both of the device vias and board vias as reference points, or indirectly aligning the device vias to the board vias using one or more alternative reference points of the board assembly with components and / or the heat sink.

[0029] Method 600 proceeds from operation 610 to operation 612, in which a screw is inserted into a board through-hole and a device through-hole. Method 600 proceeds from operation 612 to operation 614, in which a screw is rotated to securely engage with a screw hole in a heat sink to provide power electronics components.

[0030] Method 600 proceeds from operation 614 to operation 616, in which power electronic components are deployed in the power system. Method 600 proceeds from operation 616 to operation 618, in which the deployed power electronic components are operated.

[0031] refer to Figure 7 The illustration depicts an example method 700 for performing maintenance and repair operations on power electronic components. Method 700 begins with operation 702, in which the power electronic components are provided in a maintenance or repair environment. The maintenance or repair environment may include a field maintenance or repair environment, a service center maintenance or repair environment, or a factory maintenance or repair environment, and method 700 can be performed in such a variety of environments.

[0032] The power electronic component undergoing method 700 may include a power electronic component provided or assembled according to method 600 or another method as would be conceived by those skilled in the art through the benefits and insights of this disclosure. The power electronic component includes screws that pass through board through-holes in a printed circuit board (PCB) of the power electronic component and through device through-holes of packaged semiconductor devices mounted on the PCB, and are engaged with screw holes in a heat sink of the power electronic component.

[0033] The packaged semiconductor device undergoing method 700 may be configured and provided in the form of packaged semiconductor device 220, or may be configured and provided in the form of other semiconductor devices as would be conceived by those skilled in the art through the benefits and insights of this disclosure. Although method 700 has been described in conjunction with a single packaged semiconductor device, it should be appreciated that method 700 may be performed with multiple packaged semiconductor devices that may undergo similar operations in conjunction with method 700. In such methods, operations described in conjunction with one packaged semiconductor device may also be performed in conjunction with several packaged semiconductor devices.

[0034] Method 700 proceeds from operation 702 to operation 704, in which the screw is rotated to loosen and disengage from the heat sink of the power electronic component and remove it from the board vias and device vias. Method 700 proceeds from operation 704 to operation 706, in which the board assembly with components, including the PCB and packaged semiconductor devices, is separated from the heat sink. Method 700 proceeds from operation 706 to operation 708, in which the solder that mechanically and electrically connects the packaged semiconductor devices to the PCB is reflowed and the packaged semiconductor devices are removed from the PCB.

[0035] Method 700 proceeds from operation 708 to operation 710, in which multiple electrical leads of a replacement packaged semiconductor device are inserted into corresponding device mounting vias formed in a plurality of device mounting vias in the PCB. The replacement packaged semiconductor device may have substantially the same form and configuration as the packaged semiconductor device removed from the PCB in operation 708. Although method 700 is described in conjunction with a single replacement packaged semiconductor device, it should be appreciated that method 700 may be performed with multiple replacement packaged semiconductor devices that may undergo similar operations in conjunction with method 700. In such methods, operations described in conjunction with one replacement packaged semiconductor device may also be performed in conjunction with several replacement packaged semiconductor devices.

[0036] Method 700 proceeds from operation 710 to operation 712, in which multiple electrical leads of a replacement packaged semiconductor device are soldered to a PCB, effectively mechanically and electrically connecting the replacement packaged semiconductor device and the PCB to provide a re-component board assembly. It should be appreciated that operations 710 and 712 include an example mounting operation by which a replacement packaged semiconductor device, including device through-holes, can be mounted on a printed circuit board (PCB) including board through-holes to provide a re-component board assembly in which the PCB is mechanically and electrically connected to the packaged semiconductor device.

[0037] Method 700 proceeds from operation 712 to operation 714, in which the board assembly with components is re-aligned with the heat sink such that the replacement packaged semiconductor device contacts the heat sink, and the board vias of the PCB and the device vias of the replacement packaged semiconductor device are aligned with the screw holes of the heat sink. Such alignment may include directly aligning the device vias to the board vias using one or both of the device vias and board vias as reference points, or indirectly aligning the device vias to the board vias using one or more alternative reference points of the board assembly with components and / or the heat sink.

[0038] Method 700 proceeds from operation 714 to operation 716, in which a screw is introduced into the board through-hole and the device through-hole. Method 700 proceeds from operation 716 to operation 718, in which the screw is rotated to securely engage with the screw hole of the heat sink to provide power electronics components.

[0039] Method 700 proceeds from operation 718 to operation 720, in which power electronic components are deployed in the power system. Method 700 proceeds from operation 720 to operation 722, in which the deployed power electronic components are operated.

[0040] Figure 8A and Figure 8B The illustration shows another example of a power electronics component 300' in two assembly states. The power electronics component 300' includes components that are coupled with... Figure 4 and Figures 5A to 5F The power electronic component 300 illustrated and described has many of the same features, and many of these features are used in Figure 4 and Figures 5A to 5F The same reference numerals used in its description are used to designate the power electronics assembly 300'. The power electronics assembly 300' differs from the power electronics assembly 300 in that the through-holes formed in the PCB 210' are sized and adapted to receive and allow the threaded shaft portions of a plurality of screws 170 to be inserted through the corresponding through-holes, but not the head portions of the plurality of screws 170 to pass through the corresponding through-holes. Instead, the head portions of the plurality of screws 170 contact the corresponding surfaces of the PCB 210'. When the plurality of screws 170 are rotated to securely engage with the corresponding screw holes of the heat sink 250 to provide the power electronics assembly 300', they secure the packaged semiconductor devices 220a, 220b, 220c, 220d, 220e, 220n to the heat sink 250, and also engage and secure the board 210' to the power electronics assembly 300'.

[0041] Although exemplary embodiments of the present disclosure have been illustrated and described in detail in the accompanying drawings and the foregoing description, these exemplary embodiments are considered illustrative in nature and not restrictive. It should be understood that only certain exemplary embodiments have been shown and described, and protection is intended for all changes and modifications falling within the spirit of the claimed invention. It should be understood that although the use of words such as “preferred,” “ideally,” “preferred,” or “more preferred” in the foregoing description indicates that a feature so described may be more desirable, it may not be necessary, and embodiments lacking such features may be contemplated as being within the scope of the invention, defined by the following claims. When reading the claims, it is intended that the use of words such as “a,” “an,” “at least one,” or “at least a portion” is not intended to limit the claims to only one item, unless expressly stated to the contrary in the claims. When the language “at least a portion” and / or “a portion” is used, the item may include a portion and / or the entire item, unless expressly stated to the contrary.

Claims

1. A method for assembling power electronic components, the method comprising: A packaged semiconductor device, including a device through-hole, is mounted on a printed circuit board (PCB) including a board through-hole, to provide a board assembly with components wherein the PCB is mechanically and electrically connected to the packaged semiconductor device. Align the board assembly with components with the heat sink such that the packaged semiconductor device contacts the heat sink, and align the board vias and the device vias with the screw holes of the heat sink; Insert screws into the through holes of the plate and the through holes of the device; and The screw is rotated to engage securely with the screw hole of the heat sink to provide the power electronics component.

2. The method according to claim 1, wherein, The mounting includes inserting a plurality of electrical leads of the packaged semiconductor device into a plurality of device mounting vias formed in the PCB, and soldering the plurality of electrical leads to the PCB.

3. The method according to claim 1, wherein, The alignment includes aligning the device via with the board via.

4. The method according to claim 1, wherein, The PCB includes multiple through-holes, and the mounting includes mounting multiple packaged semiconductor devices, each including a corresponding device through-hole, on the PCB to provide the board assembly with components in which the PCB is mechanically and electrically connected to the multiple packaged semiconductor devices.

5. The method according to claim 4, wherein, The alignment includes aligning the plurality of device vias with corresponding board vias among the plurality of board vias.

6. The method of claim 1, further comprising performing maintenance on the power electronics components, comprising: Rotate the screw out to engage securely with the screw hole of the radiator; Remove the screw from the through-hole of the plate and the through-hole of the device; The board assembly with components is moved away from the heat sink to expose the packaged semiconductor device, and the packaged semiconductor device is replaced with a second packaged semiconductor device.

7. The method according to claim 6, wherein, The replacement includes: The solder that connects the packaged semiconductor device to the PCB is reflowed. After the reflow, the packaged semiconductor device is removed from the PCB, and Mounting the second packaged semiconductor device, including a second device through-hole, to provide a board assembly with re-embedded components, wherein the PCB is mechanically and electrically connected to the second packaged semiconductor device.

8. The method according to claim 7, wherein, The replacement also includes: Align the re-integrated board assembly with the heat sink such that the second packaged semiconductor device contacts the heat sink, and align the board vias and the second device vias with the screw holes of the heat sink; Insert one of the existing screw and the new screw into the plate through-hole and the device through-hole; and Rotate one of the screws and the new screw to securely engage with the screw hole of the radiator.

9. A power electronic device, comprising: A printed circuit board (PCB), the PCB including through-holes and a plurality of device mounting through-holes formed therein; A packaged semiconductor device includes a device through-hole, the packaged semiconductor device is mounted on the PCB and mechanically and electrically connected to the PCB, wherein a plurality of leads of the packaged semiconductor device extend through and are soldered to the corresponding device mounting through-holes in the plurality of device mounting through-holes, and the board through-holes are aligned with the device through-holes; A heat sink that contacts the packaged semiconductor device and includes screw holes aligned with the aligned plate through-holes and the device through-holes; and A screw, which is inserted through the device through-hole and the board through-hole, and includes a screw thread that engages with the screw hole thread, to fasten the packaged semiconductor device and the PCB to the heat sink, the screw being accessible from the side of the PCB opposite to the packaged semiconductor device.

10. The power electronic device according to claim 9, wherein, The packaged semiconductor device includes a three-terminal power switch.

11. The power electronic device according to claim 9, wherein, The plate through-hole includes a first portion of a shaft configured to receive the screw.

12. The power electronic device according to claim 11, wherein, The through-hole in the plate includes a second portion configured to receive the head of the screw, the second portion having a larger diameter than the first portion.

13. The power electronic device according to claim 9, wherein, The PCB includes multiple through-holes, and multiple packaged semiconductor devices, including corresponding device through-holes, are mounted on the PCB and mechanically and electrically connected to the PCB.

14. The power electronic device according to claim 13, wherein, The corresponding device through-hole is aligned with the corresponding plate through-hole among the plurality of plate through-holes.

15. The power electronic device according to claim 13, wherein, Multiple screws are inserted through the respective device through-holes and the respective board through-holes, and engage the respective screw holes of the heat sink to secure the multiple packaged semiconductor devices to the heat sink. The multiple screws can be accessed from the side of the PCB opposite to the multiple packaged semiconductor devices.

16. A method for repairing power electronic components, the method comprising: A screw drive tool is introduced into a through-hole formed in a printed circuit board (PCB) and engages with a screw that passes through a device through-hole of a packaged semiconductor device mounted on the PCB and engages with a screw hole formed in a heat sink to secure the packaged semiconductor device and the PCB to the heat sink. The screw is rotated using the drive tool to disengage it from the screw hole formed in the heat sink; Separate the PCB and the packaged semiconductor device from the heat sink; as well as Replace the packaged semiconductor device with a replacement packaged semiconductor device.

17. The method according to claim 16, wherein, The replacement includes: Rotate the screw out to engage securely with the screw hole of the radiator; Remove the screw from the through-hole of the plate and the through-hole of the device; and Move the PCB away from the heat sink to expose the packaged semiconductor device.

18. The method according to claim 17, wherein, The replacement includes: Reflow the solder that connects the packaged semiconductor device to the PCB; and After the reflow, the packaged semiconductor device is removed from the PCB.

19. The method according to claim 18, wherein, The replacement includes: A second packaged semiconductor device, including a second device through-hole, is mounted to the PCB to provide a board assembly with re-embedded components; and Align the re-integrated board assembly with the heat sink such that the second packaged semiconductor device contacts the heat sink, and align the board vias and the second device vias with the screw holes of the heat sink.

20. The method according to claim 19, wherein, The replacement includes: Insert screws into the through-holes of the plate and the second device; and The screw is rotated to engage securely with the screw hole of the heat sink to provide the power electronics component.

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