Temperature control display system, driving method thereof and display equipment

Abstract

The invention discloses a temperature control display system, a driving method thereof and display equipment, and relates to the technical field of display, in the temperature control display system, a display module is divided into a plurality of display light-emitting areas, and a thermoelectric refrigeration array is provided with thermoelectric refrigeration units corresponding to the display light-emitting areas; the signal acquisition module is electrically connected with a display driving chip of the driving display module so as to obtain multiple display driving signals output to a target display area (namely a certain display light-emitting area) by the display driving chip, and a thermal load voltage signal of the target display area is determined according to all the multiple display driving signals; the control driving module is electrically connected with the signal acquisition module and the thermoelectric refrigeration array so as to determine a temperature control enabling signal of the target display area according to the thermal load voltage signal, and activate a thermoelectric refrigeration unit corresponding to the target display area in the thermoelectric refrigeration array to execute temperature control adjustment operation according to the temperature control enabling signal; the invention aims to improve the temperature control capability of the display module so as to ensure the uniformity of picture display.

Description

Technical Field

[0001] This application relates to the field of display technology, and in particular to a temperature control display system, its driving method, and a display device. Background Technology

[0002] With the continuous development of display technology, display devices integrating COB LED (Chip-on-Board Light Emitting Diode) display modules are widely used in high-end display fields. However, when displaying high dynamic range images, the instantaneous heat generation power of the LED chips in the COB LED display module fluctuates rapidly with drastic changes in screen brightness, easily forming rapidly changing local hot spots on the module surface, which seriously affects display quality.

[0003] Currently, the industry commonly uses a passive cooling architecture combining a metal substrate, TIM (Thermal Interface Material), and a heat sink to dissipate heat from COB LED display modules. The metal substrate acts as the primary heat conduction channel, responsible for lateral heat dissipation, while the TIM material fills the gaps to reduce thermal resistance. However, this passive cooling method is primarily designed for average heat loads under long-term operation. The thermal response speed of this passive cooling architecture is limited by the thermal resistance and heat capacity of the materials themselves, exhibiting significant thermal inertia and making it difficult to respond promptly to transient heat load changes on the microsecond to millisecond scale. This results in the passive cooling architecture being unable to match instantaneous power changes under high dynamic range conditions, leading to localized temperature overshoot and overall temperature gradients. Consequently, visible brightness and color unevenness appear on the screen, affecting the uniformity of the display.

[0004] Therefore, improving the temperature control capability of display modules to ensure uniformity of image display is a technical problem that urgently needs to be solved. Summary of the Invention

[0005] The main objective of this application is to provide a temperature-controlled display system, its driving method, and a display device, which aims to improve the temperature control capability of the display module to ensure the uniformity of the image display.

[0006] To achieve the above objectives, this application provides a temperature control display system, the temperature control display system comprising: The display module is disposed on the display substrate and is divided into multiple display light-emitting areas; A thermoelectric cooling array is disposed on the side of the display substrate away from the display module. The thermoelectric cooling array includes multiple thermoelectric cooling units, and one thermoelectric cooling unit corresponds to one display light-emitting area. A signal acquisition module is electrically connected to a display driver chip that drives the display module. The signal acquisition module is configured to acquire multiple display driver signals output by the display driver chip to the target display area, and determine the thermal load voltage signal of the target display area based on all the multiple display driver signals. The target display area is any one of the display light-emitting areas. The control drive module is electrically connected to the signal acquisition module and the thermoelectric cooling array, respectively. The control drive module is configured to determine the temperature control enable signal of the target display area based on the heat load voltage signal, and activate the thermoelectric cooling unit in the thermoelectric cooling array corresponding to the target display area to perform temperature control adjustment operation based on the temperature control enable signal.

[0007] In one embodiment, the signal acquisition module includes: Multiple signal filtering units, the input terminal of one of the signal filtering units is connected to one of the display driving signals output by the display driver chip to the target display area, and each of the signal filtering units is configured to generate a DC voltage component according to the corresponding display driving signal; The summing unit has its inverting input terminal electrically connected to the output terminal of each of the signal filtering units, its non-inverting input terminal grounded, and its output terminal electrically connected to the control drive module. The summing unit is configured to perform a weighted summation based on all the DC voltage components to obtain the thermal load voltage signal of the target display area.

[0008] In one embodiment, the control drive module includes: A feedforward decision circuit is electrically connected to the signal acquisition module. The feedforward decision circuit is configured to generate a temperature control voltage signal for the target display area based on the heat load voltage signal sent by the signal acquisition module and a preset reference voltage signal, compare the temperature control voltage signal with a preset voltage threshold signal, and generate a temperature control enable signal for the target display area based on the voltage comparison result. A signal modulation circuit, wherein the input terminal of the signal modulation circuit is electrically connected to the temperature control voltage terminal of the feedforward decision circuit, and the signal modulation circuit is configured to convert the temperature control voltage signal into a temperature control square wave signal. A drive execution circuit is electrically connected to the enable output terminal of the feedforward decision circuit, the output terminal of the signal modulation circuit, and the thermoelectric cooling array. The drive execution circuit is configured to provide a temperature control drive current under the drive of the temperature control square wave signal, and control the temperature control drive current to flow through the thermoelectric cooling unit corresponding to the target display area along the current flow direction indicated by the temperature control enable signal, so that the thermoelectric cooling unit corresponding to the target display area performs a temperature control adjustment operation.

[0009] In one embodiment, the drive execution circuit includes: A current modulation unit, wherein the control terminal of the current modulation unit is electrically connected to the output terminal of the signal modulation circuit, and the current modulation unit is configured to generate a temperature control drive current in response to the temperature control square wave signal; A direction control unit is included, wherein its signal enable terminal is electrically connected to the enable output terminal of the feedforward decision circuit, the midpoint of its bridge arm is electrically connected to the thermoelectric cooling unit corresponding to the target display area, and its path terminal is electrically connected to the path terminal of the current modulation unit. The direction control unit is configured to drive the temperature control drive current output by the current modulation unit to flow along a first direction through the thermoelectric cooling unit corresponding to the target display area when the temperature control enable signal represents a cooling enable signal, thereby causing the thermoelectric cooling unit corresponding to the target display area to perform a cooling operation; or... When the temperature control enable signal represents a heating enable signal, the temperature control drive current output by the current modulation unit flows through the thermoelectric cooling unit corresponding to the target display area in a second direction opposite to the first direction, so that the thermoelectric cooling unit corresponding to the target display area performs a heating operation.

[0010] In one embodiment, the voltage threshold signal includes an upper voltage threshold signal and a lower voltage threshold signal, and the feedforward decision circuit includes: A differential amplifier unit is provided, wherein the non-inverting input terminal of the differential amplifier unit is connected to the heat load voltage signal sent by the signal acquisition module, and the inverting input terminal of the differential amplifier unit is connected to the reference voltage signal. The differential amplifier unit is configured to amplify the voltage difference signal between the heat load voltage signal and the reference voltage signal according to a preset feedforward gain to generate the temperature control voltage signal. The comparison and determination unit has its input terminal electrically connected to the output terminal of the differential amplifier unit, and its output terminal forms the enable output terminal of the feedforward decision circuit and is electrically connected to the drive execution circuit. The comparison and determination unit is configured to compare the temperature control voltage signal with the upper limit voltage threshold signal and the lower limit voltage threshold signal respectively. When the temperature control voltage signal is greater than the upper limit voltage threshold signal, a temperature control enable signal representing a cooling enable signal is generated. When the temperature control voltage signal is less than the preset lower limit voltage threshold signal, a temperature control enable signal representing a heating enable signal is generated.

[0011] In one embodiment, the differential amplification unit includes: a differential amplifier, a first resistor, a second resistor, a third resistor, a fourth resistor, a fifth resistor, and a first capacitor; The non-inverting input terminal of the differential amplifier constitutes the non-inverting input terminal of the differential amplification unit, and is electrically connected to the first terminal of the first resistor and the first terminal of the second resistor respectively. The second terminal of the first resistor is connected to the thermal load voltage signal sent by the signal acquisition module, and the second terminal of the second resistor is grounded. The inverting input terminal of the differential amplifier constitutes the inverting input terminal of the differential amplifier unit, which is electrically connected to the first terminal of the fourth resistor and the first terminal of the fifth resistor respectively. The first terminal of the fourth resistor is connected to the reference voltage signal. The positive power supply terminal of the differential amplifier is connected to the power supply terminal, and the negative power supply terminal of the differential amplifier is grounded. The output terminal of the differential amplifier forms the output terminal of the differential amplification unit, which is electrically connected to the first terminal of the third resistor and the second terminal of the fifth resistor. The second terminal of the third resistor is electrically connected to the first terminal of the first capacitor and the input terminal of the comparison determination unit. The second terminal of the first capacitor is grounded.

[0012] In one embodiment, the output terminal of the comparison and determination unit includes a cooling output terminal and a heating output terminal, and the comparison and determination unit includes a first comparator, a second comparator, a sixth resistor, and a seventh resistor; The non-inverting input terminal of the first comparator is electrically connected to the first terminal of the sixth resistor and the non-inverting input terminal of the second comparator, respectively; the non-inverting input terminal of the second comparator is electrically connected to the first terminal of the seventh resistor. The connection point where the non-inverting input terminal of the first comparator is electrically connected to the non-inverting input terminal of the second comparator is the input terminal of the comparison determination unit and is electrically connected to the output terminal of the differential amplifier unit; The inverting input of the first comparator is connected to the upper limit voltage threshold signal, the inverting input of the second comparator is connected to the lower limit voltage threshold signal, the positive power supply terminals of the first comparator and the second comparator are respectively connected to the power supply terminal, and the negative power supply terminals of the first comparator and the second comparator are respectively grounded. The output terminal of the first comparator is the cooling output terminal, which is electrically connected to the second terminal of the sixth resistor and the drive execution circuit, respectively; the output terminal of the second comparator is the heating output terminal, which is electrically connected to the second terminal of the seventh resistor and the drive execution circuit, respectively.

[0013] In one embodiment, the signal modulation circuit includes a third comparator, a fourth comparator, an eighth resistor, a ninth resistor, a tenth resistor, an eleventh resistor, a twelfth resistor, a thirteenth resistor, and a second capacitor; The non-inverting input terminal of the third comparator is electrically connected to the first terminal of the eighth resistor, the first terminal of the ninth resistor, and the first terminal of the tenth resistor, respectively. The second terminal of the eighth resistor and the positive power supply terminal of the third comparator are respectively connected to the power supply terminal. The inverting input terminal of the third comparator is electrically connected to the first terminal of the second capacitor and the inverting input terminal of the fourth comparator, respectively. The output terminal of the third comparator is electrically connected to the second terminal of the tenth resistor and the first terminal of the eleventh resistor, respectively. The second terminal of the second capacitor, the negative power supply terminal of the third comparator, the second terminal of the ninth resistor, and the second terminal of the eleventh resistor are respectively grounded. The non-inverting input terminal of the fourth comparator is electrically connected to the first terminal of the twelfth resistor and the first terminal of the thirteenth resistor, respectively. The second terminal of the twelfth resistor forms the input terminal of the signal modulation circuit and is electrically connected to the temperature control voltage terminal of the feedforward decision circuit. The second terminal of the thirteenth resistor is grounded. The positive and negative power supply terminals of the fourth comparator are respectively set to empty. The output terminal of the fourth comparator forms the output terminal of the signal modulation circuit and is electrically connected to the drive execution circuit.

[0014] Furthermore, this application also provides a driving method for a temperature control display system, the driving method being applied to the temperature control display system described above, the driving method comprising: The signal acquisition module acquires multiple display driving signals output from the display driver chip to the target display area, and determines the thermal load voltage signal of the target display area based on all the multiple display driving signals. The target display area is any one of the display light-emitting areas. The enable control drive module determines the temperature control enable signal of the target display area based on the heat load voltage signal, and activates the thermoelectric cooling unit in the thermoelectric cooling array corresponding to the target display area to perform temperature control adjustment operation based on the temperature control enable signal.

[0015] In addition, this application also provides a display device, the display device including the temperature control display system described above; and / or, a memory, a processor and a computer program stored in the memory and executable on the processor, wherein the computer program, when executed by the processor, implements the steps of the driving method of the temperature control display system described above.

[0016] This application significantly improves the temperature control capability of display devices integrating display modules, thermoelectric cooling arrays, signal acquisition modules, and control and drive modules by setting up a temperature control display system. This ensures the uniformity of the displayed image. Specifically, the signal acquisition module is electrically connected to the display driver chip that drives the display module. This allows the signal acquisition module to directly acquire multiple display drive signals output by the display driver chip to a specific display light-emitting area (i.e., the target display area) in the display module in real time. Based on all the display drive signals, a heat load voltage signal can be accurately generated, achieving zero-delay perception of instantaneous heat generation power from the heat source. This effectively overcomes the problem that traditional passive cooling architectures cannot match transient heat load changes due to thermal inertia. It provides real-time and accurate heat load characterization for the feedforward control of the subsequent control and drive module, significantly improving the temperature control response speed of the display device. Furthermore, based on the electrical connection between the control and drive module and the signal acquisition module, the control and drive module can... The temperature control enable signal for the target display area is determined based on the heat load voltage signal. The thermoelectric cooling unit corresponding to the target display area in the thermoelectric cooling array is activated according to the temperature control enable signal to perform temperature control adjustment operation. Since one thermoelectric cooling unit corresponds to one display light-emitting area, and the temperature control enable signal of each display light-emitting area is directly determined by the real-time display drive signal of the display light-emitting area itself, the temperature control adjustment operation of each display light-emitting area can be synchronized with the instantaneous screen load of the display light-emitting area. This achieves rapid response and precise control of local hot spots, significantly improves the temperature control capability of the display module in the display device, fundamentally eliminates the uneven brightness and color caused by temperature gradient, and ensures that the display device can still present a uniform display effect under high dynamic screen conditions. Attached Figure Description

[0017] The accompanying drawings, which are incorporated in and form part of this specification, illustrate embodiments consistent with this application and, together with the description, serve to explain the principles of this application.

[0018] To more clearly illustrate the technical solutions in the embodiments of this application or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, for those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0019] Figure 1 This is a structural block diagram of the first embodiment of the temperature control display system of this application; Figure 2 This is a schematic diagram of the stacked structure of the display module to the thermoelectric cooling array in the temperature control display system involved in the embodiments of this application; Figure 3 This is a schematic diagram of the control flow of the temperature control display system involved in the embodiments of this application; Figure 4 This is a schematic diagram of the signal acquisition module involved in the embodiment of this application; Figure 5 This is a schematic diagram of the control flow of the control drive module involved in the embodiments of this application; Figure 6 This is a schematic diagram of the drive execution circuit involved in the embodiments of this application; Figure 7 This is a schematic diagram of the differential amplification unit involved in the embodiments of this application; Figure 8 This is a schematic diagram of the comparison and determination unit involved in the embodiment of this application; Figure 9 This is a schematic diagram of the signal modulation circuit involved in the embodiments of this application; Figure 10 This is a waveform diagram of the temperature control voltage signal and the temperature control square wave signal involved in the embodiments of this application; Figure 11 This is a schematic diagram of the structure of the display device involved in the embodiments of this application.

[0020] Explanation of icon numbers: 100. Temperature control display system; 200. Display driver chip; 10. Display module; Ai. Display light-emitting area; 20. Thermoelectric cooling array; Bi. Thermoelectric cooling unit; 30. Signal acquisition module; 40. Control drive module; PWM. Display drive signal; 41. Feedforward decision circuit; 411. Differential amplifier unit; 412. Comparison and judgment unit; 42. Signal modulation circuit; 43. Drive execution circuit; 431. Current modulation unit; 432. Direction control unit; U1B. Differential amplifier; R1. First resistor; R2. Second resistor; R3. Third resistor; R4. Fourth resistor; R5. 5. Resistor; R6, 6th resistor; R7, 7th resistor; R8, 8th resistor; R9, 9th resistor; R10, 10th resistor; R11, 11th resistor; R12, 12th resistor; R13, 13th resistor; C1, 1st capacitor; C2, 2nd capacitor; U1, 1st comparator; U2, 2nd comparator; U3, 3rd comparator; U4, 4th comparator; Cooling_EN, cooling enable signal; Heating_EN, heating enable signal; 1001, processor; 1002, communication bus; 1003, user interface; 1004, network interface; 1005, memory.

[0021] The realization of the purpose, functional features and advantages of this application will be further explained in conjunction with the embodiments and with reference to the accompanying drawings. Detailed Implementation

[0022] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of this application, and not all of the embodiments. Based on the embodiments of this application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of this application.

[0023] It should be noted that if the embodiments of this application involve directional indicators (such as up, down, left, right, front, back, etc.), the directional indicators are only used to explain the relative positional relationship and movement of each component in a certain specific posture (as shown in the figure). If the specific posture changes, the directional indicators will also change accordingly.

[0024] Furthermore, if the embodiments of this application involve descriptions such as "first" or "second," these descriptions are for descriptive purposes only and should not be construed as indicating or implying their relative importance or implicitly specifying the number of technical features indicated. Therefore, features defined with "first" or "second" may explicitly or implicitly include at least one of those features. Additionally, the technical solutions of various embodiments can be combined with each other, but this must be based on the ability of those skilled in the art to implement them. If the combination of technical solutions is contradictory or impossible to implement, it should be considered that such a combination of technical solutions does not exist and is not within the scope of protection claimed in this application.

[0025] Exemplary embodiments will now be described in detail, examples of which are illustrated in the accompanying drawings. When the following description relates to the drawings, unless otherwise indicated, the same numbers in different drawings represent the same or similar elements. The embodiments described in the following exemplary embodiments do not represent all embodiments consistent with this application.

[0026] COB LED (Chip-on-Board Light Emitting Diode) display modules, due to their extremely high pixel density and drive current, generate a large heat flux density that changes rapidly with the displayed content. Especially when displaying HDR (High Dynamic Range) images, the instantaneous heat generation of the LED fluctuates drastically in real time with the duty cycle of the PWM (Pulse Width Modulation) drive signal, easily forming rapidly changing localized hot spots on the surface of the COB LED display module, severely impacting display quality and device reliability.

[0027] Currently, the industry commonly uses a passive cooling architecture combining a metal substrate, TIM (Thermal Interface Material), and a heat sink to dissipate heat from COB LED display modules. However, the heat transfer rate of this traditional cooling method is limited by the thermal resistance and thermal capacity of the TIM material itself, exhibiting significant thermal inertia. This makes it difficult to respond promptly to sudden changes in thermal load on a microsecond to millisecond scale, resulting in a severe lag in chip junction temperature control. In other words, the temperature control technology using a passive cooling architecture to dissipate heat from COB LED display modules has the following technical drawbacks.

[0028] First, traditional passive cooling architectures are primarily designed for average accumulated heat and lack effective suppression of instantaneous power pulses caused by high-frequency PWM drives. When the display brightness changes abruptly, heat cannot be dissipated in time, leading to transient temperature overshoot and affecting the operational stability and lifespan of the LED chips. Second, the peak wavelength and brightness characteristics of LED chips are highly sensitive to temperature. In COB display modules, the difference in heat generation between bright and dark areas creates a significant temperature gradient on the board surface. Existing cooling technologies lack regional bidirectional adjustment capabilities (they can only cool in one direction and cannot compensate for heating in low-temperature areas), causing LEDs in different areas of the module to operate at different temperatures. This results in inconsistent color across the entire screen, localized color shifts, and other image quality issues, severely hindering the improvement of display uniformity. Finally, existing active temperature control solutions (such as fan speed control) mostly rely on negative temperature coefficient thermistors or infrared sensors to collect temperature data. However, sensors can only measure the temperature results that have already occurred and cannot reflect the instantaneous heat source changes represented by the LED drive signal. This control logic based on post-event feedback means that the adjustment signal always lags behind the actual heat load changes, making it difficult to achieve accurate and real-time control of the LED chip junction temperature. Therefore, improving the temperature control capability of display modules to ensure uniformity of image display is a technical problem that urgently needs to be solved.

[0029] To address the aforementioned technical deficiencies, this application provides a temperature control display system, its driving method, and a display device.

[0030] This application provides a temperature control display system, referring to... Figure 1 As shown, Figure 1 This is a structural block diagram of the first embodiment of the temperature control display system of this application. The temperature control display system 100 provided in this application includes: The display module 10 is disposed on the display substrate and is divided into multiple display light-emitting areas Ai.

[0031] In this embodiment, refer to Figure 1 By dividing the display module 10, which is located on the front side of the display substrate, into multiple display light-emitting areas Ai, the heat load changes of the display module 10 can be managed in a refined zonal manner. This provides a physical basis for subsequent independent temperature control of each zone, enabling the heat load voltage signal of each display light-emitting area Ai to be independently sensed and precisely controlled. This ensures that subsequent temperature control adjustments can accurately match the instantaneous heat demand of different display light-emitting areas Ai, thereby effectively avoiding local overcooling or overheating of the surface of the display module 10 caused by traditional integrated temperature control strategies. This significantly improves the temperature uniformity of the surface of the display module 10, thereby effectively improving the brightness and color uniformity problems caused by temperature gradients, and ultimately ensuring the overall uniformity of the display and the visual experience.

[0032] It should be noted that the display module 10 is an LED chip array, that is, the display module 10 refers to a light-emitting component formed by integrating multiple light-emitting chips (such as COB LED chips) distributed in an array on a display substrate; a display light-emitting area Ai includes several light-emitting chips.

[0033] For example, refer to Figure 2 The light-emitting chips in this application employ COB integrated packaging technology, allowing multiple light-emitting chips to be directly bonded to the front side of the display substrate in a high-density array. The light-emitting state of each light-emitting chip is controlled by an independent display driving signal PWM. In other words, the instantaneous heat load of each display light-emitting area Ai is determined by the display driving signal PWM corresponding to each light-emitting chip within that display light-emitting area Ai.

[0034] The thermoelectric cooling array 20 is disposed on the side of the display substrate away from the display module 10. The thermoelectric cooling array 20 includes a plurality of thermoelectric cooling units Bi, and one thermoelectric cooling unit Bi corresponds to one display light-emitting area Ai.

[0035] In this embodiment, refer to Figure 1 The thermoelectric cooling array 20 is disposed on the side of the display substrate away from the display module 10. The thermoelectric cooling array 20 includes multiple thermoelectric cooling units Bi, each thermoelectric cooling unit Bi corresponding to a display light-emitting area Ai, so that each display light-emitting area Ai has an independent thermoelectric cooling unit Bi to achieve bidirectional temperature control (cooling mode and heating mode). The cooling mode of the thermoelectric cooling unit Bi can quickly suppress local hot spots generated by high brightness screens in the corresponding display light-emitting area Ai, avoiding the adverse effects of transient temperature rise overshoot on the photoelectric characteristics of the light-emitting chip, and preventing brightness decay and color shift. The heating mode of the thermoelectric cooling unit Bi can actively compensate for the heat of low brightness or low temperature display light-emitting areas Ai, maintaining the light-emitting chip in the display light-emitting area Ai within the optimal operating temperature range, maintaining the temperature uniformity of the entire display module 10, and fundamentally eliminating the brightness and color unevenness caused by temperature gradient.

[0036] It should be noted that the thermoelectric cooling array 20 is a component consisting of multiple TECs (Thermoelectric Coolers, Thermoelectric Cooling Units Bi) arranged in an array on the back of the display substrate.

[0037] In one embodiment, reference is made to Figure 2The display substrate, in the direction of heat dissipation, comprises, in sequence, a thermally conductive adhesive layer, a thermoelectric cooling array 20, a thermally conductive diffusion layer, and a heat sink. The thermally conductive diffusion layer, acting as an interface coupling layer, is coated on the back side of the display substrate to fill the microscopic gaps between the display substrate and the thermoelectric cooling unit Bi, reducing interfacial contact thermal resistance. The thermally conductive adhesive layer uses an interface material with high thermal conductivity (such as thermally conductive silicone grease, thermally conductive gel, or phase change material) to ensure that the heat generated by each light-emitting chip in each display light-emitting area Ai can be transferred from the display substrate to the corresponding thermoelectric cooling unit Bi without delay, providing a physical guarantee for achieving zero-delay response of feedforward control.

[0038] Next, Figure 2 Multiple thermoelectric cooling units Bi, as shown, are mounted in an array beneath the thermally conductive adhesive layer, forming a thermoelectric cooling array 20. Each thermoelectric cooling unit Bi includes a TEC cold junction, a TEC semiconductor structure, and a TEC hot junction. Specifically, the TEC cold junction faces the display substrate and is in close contact with the thermally conductive adhesive layer. When a thermoelectric cooling unit Bi operates in cooling mode, the TEC cold junction absorbs heat transferred from the corresponding display light-emitting area Ai via the display substrate, thereby cooling the corresponding display light-emitting area Ai. When this thermoelectric cooling unit Bi operates in heating mode, the TEC cold junction releases heat in the opposite direction, providing heating compensation to the display light-emitting area Ai corresponding to the thermoelectric cooling unit Bi.

[0039] The TEC semiconductor structure consists of alternating P-type and N-type semiconductors, where holes are the primary charge carriers in the P-type semiconductors and electrons are the primary charge carriers in the N-type semiconductors. This TEC semiconductor structure achieves active heat pumping through the Peltier effect. When a direct current flows through the TEC semiconductor structure, the charge carriers (electrons and holes) carry heat during transport, causing a directional transfer of heat from the cold end to the hot end of the TEC. When the current direction is reversed, the heat transfer direction is also reversed, thus achieving bidirectional temperature control for both cooling and heating. This solid-state heat pump mechanism based on current direction switching allows the thermoelectric cooling unit Bi to quickly switch between cooling and heating modes according to the temperature control enable signal, providing precise and real-time bidirectional thermal management for each display light-emitting area Ai.

[0040] The TEC hot end is positioned facing the heat dissipation direction and is in conjunction with... Figure 2The heat-dissipating diffusion layer shown is tightly bonded. This layer is made of a high thermal conductivity metal material (such as copper or aluminum), which can laterally diffuse and homogenize the heat output from the TEC hot end of each thermoelectric cooling unit Bi. Because the instantaneous heat load of different display light-emitting areas Ai differs, the heat flux density discharged from the TEC hot end of each thermoelectric cooling unit Bi may not be uniform. Direct connection to the heat sink would lead to localized heat flux concentration, reducing heat dissipation efficiency. The heat-dissipating diffusion layer in this application, through its high lateral thermal conductivity, rapidly diffuses and merges the dispersed and uneven heat flux, forming a uniform heat flux distribution before transferring it to the heat sink, thereby significantly improving the overall heat exchange efficiency of the heat dissipation system. Simultaneously, as a mechanical transition structure between the TEC hot end and the heat sink, the heat-dissipating diffusion layer can also absorb stress caused by differences in thermal expansion, ensuring the mechanical stability of the multi-layer structure under thermal cycling conditions. Finally, the uniformly diffused heat is transferred to… Figure 2 The heat sink shown serves as the final heat sink, dissipating heat to the surrounding environment, thus completing the closed loop of the entire thermal management path. This ensures that the hot end of the thermoelectric cooling unit Bi is always maintained within the effective operating temperature range, providing a reliable guarantee for the long-term stable operation of the feedforward temperature control system.

[0041] The signal acquisition module 30 is electrically connected to the display driver chip 200 that drives the display module 10. The signal acquisition module 30 is configured to acquire multiple display drive signals PWM output by the display driver chip 200 to the target display area, and determine the thermal load voltage signal of the target display area based on all the multiple display drive signals PWM. The target display area is any one of the display light-emitting areas Ai.

[0042] In this embodiment, the signal acquisition module 30 is electrically connected to the display driver chip 200 of the drive display module 10. When the display driver chip 200 outputs multiple display drive signals PWM to the target display area, the signal acquisition module 30 can directly obtain the multiple display drive signals PWM of the target display area from the display driver chip 200. Then, it can determine the heat load voltage signal of the target display area based on all the display drive signals PWM, realizing zero-delay perception of instantaneous heat generation power from the heat source, avoiding the lag of traditional temperature sensor feedback, providing real-time and accurate heat load characterization for feedforward control, and significantly improving the temperature control response speed.

[0043] It should be noted that the signal acquisition module 30 is a module that connects the display driver chip 200 and the control driver module 40. The signal acquisition module 30 is used to acquire the multiple display drive signals PWM output by the display driver chip 200 to each display light-emitting area Ai, and convert all the display drive signals PWM in each display light-emitting area Ai into an analog voltage signal (i.e., heat load voltage signal) representing the instantaneous total heat load of this display light-emitting area Ai through signal filtering and summation processing.

[0044] At least one display driver chip 200 is included that acts on each display light-emitting area Ai. The display driver chip 200 can output one or more display driver signals PWM, and each display driver signal PWM corresponds to one LED channel in the display light-emitting area Ai. In addition, the display driver signal PWM can be understood as a PWM (Pulse Width Modulation) signal.

[0045] In a specific embodiment, refer to Figure 3 The signal acquisition module 30 receives multiple high-frequency display drive signals (PWM) output from the display driver chip 200 to the target display area (i.e., any display light-emitting area Ai). These multiple high-frequency display drive signals (PWM) correspond to the LED channels of all light-emitting chips within the target display area. The output of the signal acquisition module 30 represents the analog voltage signal (i.e., the heat load voltage signal) of the instantaneous total heat load of the target display area. For example, in the signal acquisition module 30, one display drive signal (PWM) is input to a signal filtering unit. The cutoff frequency of this filter is set much lower than the driving frequency of the display drive signal (PWM), so that after the high-frequency carrier of the display drive signal (PWM) is filtered out, the signal filtering unit outputs a smooth DC voltage component proportional to the duty cycle of the display drive signal (PWM). ( =1,2,3,...,n), thus realizing the conversion of discrete digital display drive signals PWM into continuous analog thermal load components. Subsequently, all DC voltage components... The DC voltage components are input to the summing unit in the signal acquisition module 30, and the summing unit processes these DC voltage components. Signal aggregation is performed because the instantaneous total heat load of a single target display area is equal to the sum of the power consumption of all light-emitting chips in that area. The heat load voltage signal output by the summing unit is... The duty cycle of each display drive signal PWM within the target display area The sum is directly proportional, that is Where N is the total number of LED channels in the target display area. In other words, the signal acquisition module 30 uses a combination of a signal filtering unit and a summing unit to ensure the thermal load voltage signal... The change in the driving power of the light-emitting chip is strictly synchronized, providing a high-bandwidth, zero-delay input signal for the feedforward control of the subsequent control drive module 40. This fundamentally avoids the measurement lag problem in the feedback path of traditional temperature sensors and significantly improves the response speed of the temperature control system.

[0046] The control drive module 40 is electrically connected to the signal acquisition module 30 and the thermoelectric cooling array 20. The control drive module 40 is configured to determine the temperature control enable signal of the target display area based on the heat load voltage signal, and activate the thermoelectric cooling unit Bi in the thermoelectric cooling array 20 corresponding to the target display area to perform temperature control adjustment operation based on the temperature control enable signal.

[0047] In this embodiment, the control drive module 40 generates a temperature control enable signal based on the heat load voltage signal and activates the thermoelectric cooling unit Bi in the thermoelectric cooling array 20 corresponding to the target display area to perform temperature control adjustment, thereby achieving feedforward precise control of the instantaneous heat load of the target display area. Since the temperature control enable signal is directly determined by the multi-channel display drive signal PWM of the target display area, that is, after the signal acquisition module 30 aggregates the multi-channel display drive signal PWM of the target display area into a heat load voltage signal, the control drive module generates a temperature control enable signal for the target display area based on the heat load voltage signal. This allows the temperature control adjustment operation (i.e., cooling operation or heating operation) for the target display area to be strictly synchronized with the instantaneous screen load of the target display area, significantly improving the temperature control capability of the display module 10, thereby ensuring the uniformity of the screen display of the display device.

[0048] It should be noted that the control drive module 40 may include a feedforward decision circuit 41, a signal modulation circuit 42, and a drive execution circuit 43.

[0049] In a specific embodiment, refer to Figure 3 The input to the control drive module 40 is the heat load voltage signal output by the signal acquisition module 30. This heat load voltage signal is differentially processed by the feedforward decision circuit 41 and then amplified according to the offline calibrated feedforward gain K to generate a feedforward control voltage (i.e., temperature control voltage signal V) for the target display area. TEC Next, the temperature control voltage signal V TEC It is divided into two paths, one of which is the temperature control voltage signal V. TEC The signal is then compared with a preset voltage threshold signal via the feedforward decision circuit 41 to generate a temperature control enable signal representing either the cooling enable signal Cooling_EN or the heating enable signal Heating_EN; another temperature control voltage signal V... TEC The signal is fed into the modulation circuit 42 and converted into a duty cycle and the temperature control voltage signal V.TEC A high-frequency square wave signal whose magnitude is linearly proportional to its value (i.e., temperature control square wave signal D). TEC Subsequently, the temperature control enable signal output by the feedforward decision circuit 41 and the temperature control square wave signal D output by the signal modulation circuit 42 are... TEC The common input is sent to the drive execution circuit 43, which responds to the temperature control square wave signal D. TEC The current amplitude is adjusted by LC filtering to generate a temperature-controlled drive current synchronized with the real-time load of the target display area. H-bridge commutation control ensures the temperature-controlled drive current flows along the direction indicated by the temperature control enable signal through the corresponding thermoelectric cooling unit Bi of the target display area, thereby activating the corresponding thermoelectric cooling unit Bi to perform cooling or heating operations. In other words, the control drive module 40 of this application adopts a feedforward control mechanism based on the PWM source of the display drive signal, fundamentally eliminating the inherent measurement and response lag of traditional temperature feedback control. This ensures that the temperature control adjustment operation of each display light-emitting area Ai is precisely synchronized with the real-time load of that area, effectively suppressing the formation of local hot spots and compensating for low-temperature areas. This eliminates the brightness and color unevenness caused by temperature gradients at the source, significantly improving the overall temperature uniformity and image quality consistency of the display module 10.

[0050] Furthermore, in some other feasible embodiments, reference is made to... Figure 4 The signal acquisition module 30 includes: Multiple signal filtering units are provided, and the input terminal of one of the signal filtering units is connected to one of the display driving signals PWM output by the display driver chip 200 to the target display area. Each of the signal filtering units is configured to generate a DC voltage component based on the corresponding display driving signal PWM.

[0051] In this embodiment, for a single temperature control area (i.e., the target display area), the signal acquisition module 30 uses a pure analog circuit composed of multiple signal filtering units and summing units to convert the display drive signal PWM connected to the LED channels of each light-emitting chip in the target display area into an analog voltage signal (i.e., heat load voltage signal V) representing the instantaneous total heat load of the target display area. load For details, please refer to... Figure 4 Multiple signal filtering units correspond one-to-one with multiple display drive signals (PWM) within the target display area. The input of each signal filtering unit is connected to one of the display drive signals (PWM) output from the display driver chip 200 to the target display area. The multiple display drive signals (PWM) of this target display area can be used... Figure 4 The signals PWM1, PWM2, ..., PWM are shown. nTo represent. Each display drive signal PWM first passes through an independent RC (resistor R0_i - capacitor C0_i) low-pass filter, the value of the RC component ( and The cutoff frequency of the low-pass filter is set to be... Much lower than the drive frequency of the display drive signal PWM This ensured Figure 2 The DC voltage component V output by each signal filtering unit shown is shown. D1 DC voltage component V D2 ... and DC voltage component V Dn， It can smoothly and without ripple follow the duty cycle of signal PWM1, the duty cycle of signal PWM2, ..., and signal PWM. n The change in duty cycle allows for the rapid conversion of discrete digital display drive signals (PWM) into continuous analog heat load components. This enables precise quantization of the instantaneous heat generation power represented by each PWM signal, ensuring strict synchronization between each DC voltage component and the corresponding COB LED chip's instantaneous heat generation power. Subsequently, the summing unit calculates the heat load voltage signal V based on the weighted summation of these DC voltage components. load The heat load voltage signal V load The amplitude change is completely consistent with the instantaneous total driving power change of all COB LED chips in the target display area, thus providing a high-bandwidth, zero-delay input signal for the feedforward control of the subsequent control drive module 40.

[0052] It should be noted that the cutoff frequency The expression is ;in, This represents the resistance value of resistor R0_i. This represents the capacitance value of capacitor C0_i.

[0053] The summing unit has its inverting input terminal electrically connected to the output terminal of each of the signal filtering units, its non-inverting input terminal grounded, and its output terminal electrically connected to the control drive module 40. The summing unit is configured to perform a weighted summation based on all the DC voltage components to obtain the thermal load voltage signal of the target display area.

[0054] In this embodiment, refer to Figure 4 The summation unit uses an inverting adder circuit composed of operational amplifier U1A. The inverting input terminal of operational amplifier U1A is connected to the input resistor in each signal filtering unit (i.e., Figure 4As shown, Rin_1, Rin_2, ..., Rin_n are electrically connected. The non-inverting input of operational amplifier U1A is grounded. The feedback resistor Rf in the summing unit is connected between the inverting input and output of operational amplifier U1A. This allows the summing unit to perform a weighted summation operation on the DC voltage components input from all signal filtering units. That is, by adjusting the ratio of each input resistor to the feedback resistor, different weighting coefficients can be set for each DC voltage component to match the differences in thermal contribution of different light-emitting chips. Subsequently, the thermal load voltage signal V of the target display area is output by the summing unit. load As the core input signal of the feedforward decision circuit 41 in the subsequent control and drive module 40, the thermal load voltage signal V load The amplitude is proportional to the sum of the duty cycles of all display drive signals PWM in the target display area, accurately quantifying the instantaneous total heat load of the target display area.

[0055] It should be noted that the expression for the weighted summation operation is: ,in, Indicates the heat load voltage signal; This represents the resistance value of the feedback resistor Rf in the summation unit; , as well as V represents the DC voltage component respectively. D1 DC voltage component V D2 and DC voltage component V Dn ; , as well as These represent the resistance values ​​of input resistors Rin_1, Rin_2, and Rin_n, respectively.

[0056] For example, the gain of operational amplifier U1A can be set by adjusting the ratio of the feedback resistor to each input resistor. The gain A is used to match the voltage range of the input signal (the DC voltage component after conversion of each PWM) with the input voltage range required by the subsequent feedforward decision circuit 41, ensuring the thermal load voltage signal V. load The amplitude can be accurately received and processed by the feedforward decision circuit 41, avoiding signal distortion or quantization error caused by voltage mismatch.

[0057] Furthermore, in some feasible embodiments, the control drive module 40 includes: The feedforward decision circuit 41 is electrically connected to the signal acquisition module 30. The feedforward decision circuit 41 is configured to generate a temperature control voltage signal for the target display area based on the heat load voltage signal sent by the signal acquisition module 30 and a preset reference voltage signal, compare the temperature control voltage signal with a preset voltage threshold signal, and generate a temperature control enable signal for the target display area based on the voltage comparison result.

[0058] In this embodiment, refer to Figure 5 The feedforward decision circuit 41 serves as the decision core of the control drive module 40, by controlling the thermal load voltage signal V. load The temperature control voltage signal V is generated by performing differential operation and gain amplification (i.e., amplification through feedforward gain K) with the preset reference voltage signal Vref to generate a temperature control voltage signal V that reflects the degree of heat load deviation. TEC Simultaneously, the temperature control voltage signal V TEC With the preset voltage threshold signal (i.e. Figure 5 The upper voltage threshold signal Vmax and the lower voltage threshold signal Vmin are compared to generate a precise temperature control enable signal (i.e., Figure 5 The Cooling_EN or Heating_EN indicator enables a rapid transition from heat load sensing to temperature control commands, ensuring that the operating mode (cooling, heating, or idle mode) of each thermoelectric cooling unit Bi can be precisely matched with the instantaneous heat load demand of the corresponding display light-emitting area Ai, thus fundamentally eliminating the lag problem in traditional temperature feedback control.

[0059] It should be noted that the preset reference voltage signal, the preset voltage threshold signal, and the feedforward gain K need to be based on the regional thermal capacity of the display module 10. Offline calibration was performed at the thermal equilibrium point to ensure that the dynamic response characteristics of the temperature control system matched the thermal inertia of the display module 10. Additionally, the regional heat capacity was calculated. The expression is:

[0060] in, This indicates the heat capacity of the area displaying the light-emitting region Ai; Indicates the first The regional quality of a display light-emitting area Ai includes, but is not limited to, the light-emitting chip within the display light-emitting area Ai, the display substrate located within the display light-emitting area Ai, the thermally conductive adhesive layer, and the cold end structure of the thermoelectric cooling unit Bi, etc. Indicates the first The specific heat capacity of the display light-emitting area Ai.

[0061] The signal modulation circuit 42 is electrically connected to the temperature control voltage terminal of the feedforward decision circuit 41. The signal modulation circuit 42 is configured to convert the temperature control voltage signal into a temperature control square wave signal.

[0062] In this embodiment, refer to Figure 5 The signal modulation circuit 42 serves as an intermediate conversion unit between the feedforward decision circuit 41 and the drive execution circuit 43. The signal modulation circuit 42 receives the continuous analog temperature control voltage signal V output by the feedforward decision circuit 41. TEC And continuously simulate the temperature control voltage signal V TEC Converted into a high-frequency square wave signal with adjustable duty cycle (i.e., temperature control square wave signal D). TEC ), ensuring the temperature control voltage signal V TEC The continuous information is precisely converted into time-proportional information, providing a high-linearity power control reference for the current modulation unit 431 in the subsequent drive execution circuit 43, so that the current modulation unit 431 responds to the temperature control square wave signal D. TEC The duty cycle is adjusted by LC filter current to generate a smooth DC drive current (i.e., temperature control drive current) with an amplitude that is linearly proportional to it, thereby achieving precise and continuous adjustment of the drive power of the thermoelectric refrigeration unit Bi.

[0063] The drive execution circuit 43 is electrically connected to the enable output terminal of the feedforward decision circuit 41, the output terminal of the signal modulation circuit 42, and the thermoelectric cooling array 20. The drive execution circuit 43 is configured to provide a temperature control drive current under the drive of the temperature control square wave signal, and control the temperature control drive current to flow through the thermoelectric cooling unit Bi corresponding to the target display area along the current flow direction indicated by the temperature control enable signal, so that the thermoelectric cooling unit Bi corresponding to the target display area performs a temperature control adjustment operation.

[0064] In this embodiment, the drive execution circuit 43 is a power stage circuit in the control drive module 40 that is directly connected to the thermoelectric cooling array 20. The current modulation unit 431 in the drive execution circuit 43 is in response to the temperature control square wave signal D. TEC Driven by the current source, the internally integrated constant current source is converted into an adjustable pulsating current. After being smoothed by the LC low-pass filter integrated in the current modulation unit 431, a temperature control square wave signal D is generated. TECA high-quality, smooth DC current with a linear duty cycle is used as the temperature control drive current. In other words, the current modulation unit 431 adopts a circuit architecture of constant current modulation followed by LC filtering, which effectively eliminates the transient thermal shock of high-frequency pulsating current to the internal PN junction (i.e., P-type semiconductor and N-type semiconductor) of the thermoelectric cooling unit Bi, avoids the accumulation of local thermal stress caused by drastic current changes, and thus significantly extends the service life of the thermoelectric cooling unit Bi and improves its thermoelectric conversion efficiency.

[0065] Simultaneously, the directional control unit 432 in the drive execution circuit 43 responds to the temperature control enable signal output by the feedforward decision circuit 41, precisely controlling the temperature control drive current to flow along the current direction indicated by the temperature control enable signal through the thermoelectric cooling unit Bi corresponding to the target display area. This allows the thermoelectric cooling unit Bi to quickly and accurately switch between cooling and heating modes according to the instantaneous heat load demand of the target display area, avoiding the limitations of traditional unidirectional heat dissipation solutions that can only cool but not heat to compensate, as well as heat accumulation or temperature overshoot caused by response lag. In other words, through the rapid and precise switching between cooling and heating modes by the directional control unit 432, the temperature of each display light-emitting area Ai is always dynamically maintained within the optimal operating range. This allows for rapid heat extraction to suppress local hot spots during high-brightness scenes, and active heat injection to compensate for temperature drops during low-brightness or low-temperature environments. This ensures high uniformity of the surface temperature of the entire display module 10, eliminating brightness and color unevenness caused by temperature gradients at the source, and significantly improving display quality and long-term reliability.

[0066] Furthermore, in some other feasible embodiments, reference is made to... Figure 6 The drive execution circuit 43 includes: A current modulation unit 431 is provided, the control terminal of which is electrically connected to the output terminal of the signal modulation circuit 42. The current modulation unit 431 is configured to generate a temperature control drive current in response to the temperature control square wave signal.

[0067] In this embodiment, the current modulation unit 431 serves as the power regulation core in the drive execution circuit 43, by modulating the temperature control square wave signal D output by the signal modulation circuit 42. TEC This is converted into a smooth DC current with adjustable amplitude, enabling precise and linear control of the drive power of the thermoelectric cooling unit Bi. Specifically, the current modulation unit 431 employs... Figure 6 The circuit architecture shown, consisting of a constant current source, PWM modulation, and LC filtering, not only ensures the amplitude of the temperature control drive current is consistent with the temperature control square wave signal D... TECThe duty cycle is strictly linearly proportional, and the transient thermal shock of high-frequency pulsating current to the internal PN junction of the thermoelectric cooling unit Bi is completely eliminated through an LC low-pass filter, significantly extending the service life of the thermoelectric cooling unit Bi and improving its thermoelectric conversion efficiency. At the same time, the constant current source design ensures that the output current is not affected by changes in load impedance and power supply voltage fluctuations, providing a stable and high-quality current input for the subsequent direction control unit 432.

[0068] It should be noted that the current modulation unit 431 includes Figure 6 The constant current source, power switch Q5, LC low-pass filter, and freewheeling diode D1 are shown.

[0069] In a specific embodiment, refer to Figure 6 As shown, the constant current source provides a stable current reference, and its output terminal is electrically connected to the first path terminal of the power switch Q5. The gate of the power switch Q5 serves as the control terminal of the current modulation unit 431, and is connected to the temperature control square wave signal D output by the signal modulation circuit 42. TEC The second terminal of the power switch Q5 is electrically connected to the first terminal of inductor L1 and the anode of freewheeling diode D1, respectively; the second terminal of inductor L1 is connected to the first terminal of output capacitor C7 and serves as the path terminal of current modulation unit 431, outputting temperature control drive current to direction control unit 432; the cathode of freewheeling diode D1 and the second terminal of output capacitor C7 are both grounded. In other words, Figure 6 The circuit connection structure of the current modulation unit 431 shown is equivalent to a Buck converter topology, so that the power switch Q5 is in the temperature control square wave signal D TEC When the signal is high, the circuit is turned on. At this time, the current output from the constant current source charges the output capacitor C7 through the power switch Q5 and inductor L1, and simultaneously flows to the direction control unit 432 in the subsequent stage, where inductor L1 stores energy. When the temperature control square wave signal D... TEC When switching from high to low level, power switch Q5 is turned off. At this time, inductor L1 continues to supply current to the subsequent direction control unit 432 through freewheeling diode D1, and inductor L1 releases energy. Furthermore, inductor L1 and output capacitor C7 form an LC low-pass filter, smoothing the high-frequency pulsating current output by power switch Q5 into a temperature-controlled drive current with extremely low ripple. Figure 6 The circuit architecture shown, consisting of a constant current source, PWM modulation, and LC filtering, ensures that the amplitude of the temperature control drive current output by the current modulation unit 431 is synchronized with the temperature control square wave signal D. TEC The duty cycle is in a strictly linear proportional relationship and is a high-quality smooth DC, which fundamentally eliminates the transient thermal shock of high-frequency pulsating current to the internal PN junction of the thermoelectric cooling unit Bi, significantly extending the service life of the thermoelectric cooling unit Bi and improving the thermoelectric conversion efficiency of the thermoelectric cooling unit Bi.

[0070] A direction control unit 432 is configured such that its signal enable terminal is electrically connected to the enable output terminal of the feedforward decision circuit 41, the midpoint of the bridge arm of the direction control unit 432 is electrically connected to the thermoelectric cooling unit Bi corresponding to the target display area, and the path terminal of the direction control unit 432 is electrically connected to the path terminal of the current modulation unit 431. The direction control unit 432 is configured to drive the temperature control drive current output by the current modulation unit 431 to flow along a first direction through the thermoelectric cooling unit Bi corresponding to the target display area when the temperature control enable signal represents the cooling enable signal Cooling_EN, so that the thermoelectric cooling unit Bi corresponding to the target display area performs a cooling operation; or, when the temperature control enable signal represents the heating enable signal Heating_EN, drive the temperature control drive current output by the current modulation unit 431 to flow along a second direction opposite to the first direction through the thermoelectric cooling unit Bi corresponding to the target display area, so that the thermoelectric cooling unit Bi corresponding to the target display area performs a heating operation.

[0071] In this embodiment, the direction control unit 432, as the commutation core in the drive execution circuit 43, precisely controls the direction of the temperature control drive current flowing through the thermoelectric cooling unit Bi by responding to the temperature control enable signal output by the feedforward decision circuit 41, which is either the cooling enable signal Cooling_EN or the heating enable signal Heating_EN. This enables rapid and precise switching between cooling and heating modes, allowing each display light-emitting area Ai to suppress local hot spots through cooling mode and compensate for low-temperature areas through heating mode, completely breaking the limitation of traditional heat dissipation solutions that can only cool in one direction. Simultaneously, the direction control unit 432 adopts an H-bridge topology and integrates dead-time control logic, ensuring electrical safety during the commutation process, avoiding the risk of shoot-through short circuits, and providing a reliable guarantee for the long-term stable operation of the system.

[0072] It should be noted that the direction control unit 432 is the circuit module in the drive execution circuit 43 responsible for switching the current direction. This direction control unit 432 is implemented using a full-bridge power topology (H-bridge), and consists of four power switching transistors (i.e., Figure 6 The circuit consists of Q1, Q2, Q3, and Q4, and the current direction is controlled by turning on and off the diagonal power switches. Furthermore, the upper and lower power switches on the same bridge arm will not be turned on simultaneously, preventing a direct short circuit. In addition, the power switches used in this application can be MOSFETs, IGBTs, or electronic switches with switching characteristics.

[0073] For example, refer to Figure 6The first-path terminals of power switches Q1 and Q2 are connected to the path terminal of the current modulation unit 431 (i.e., the connection node V0 where the output capacitor C7 is electrically connected to the inductor L1), for receiving the temperature control drive current provided by the current modulation unit 431. The second-path terminal of power switch Q1 is electrically connected to the first-path terminal of power switch Q3, forming the midpoint H1 of the first bridge arm; the second-path terminal of power switch Q3 is grounded. The second-path terminal of power switch Q2 is electrically connected to the first-path terminal of power switch Q4, forming the midpoint H2 of the second bridge arm; the second-path terminal of power switch Q4 is grounded. The thermoelectric cooling unit Bi corresponding to the target display area is connected between the midpoint of the first bridge arm and the midpoint of the second bridge arm. The cooling enable signal Cooling_EN provided by the feedforward decision circuit 41 is connected to the gates of power switches Q1 and Q4, and the heating enable signal Heating_EN provided by the feedforward decision circuit 41 is connected to the gates of power switches Q2 and Q3.

[0074] Specifically, when the temperature control enable signal provided by the feedforward decision circuit 41 is the cooling enable signal Cooling_EN, that is, when the cooling enable signal Cooling_EN is valid (high level), power switches Q1 and Q4 are turned on, and power switches Q2 and Q3 are turned off. The temperature control drive current flows from the connection node V0 through power switch Q1 → the midpoint H1 of the first bridge arm → thermoelectric cooling unit Bi → the midpoint H2 of the second bridge arm → power switch Q4 to ground. This current flow direction is defined as the first direction, that is, the direction in which the current flows from the midpoint H1 of the first bridge arm through the thermoelectric cooling unit Bi to the midpoint H2 of the second bridge arm. At this time, the thermoelectric cooling unit Bi performs a cooling operation under the action of the temperature control drive current flowing along the first direction, actively absorbing the heat of the corresponding display light-emitting area Ai, and realizing the rapid suppression of local hot spots.

[0075] When the temperature control enable signal provided by the feedforward decision circuit 41 is the heating enable signal Heating_EN, that is, when the heating enable signal Heating_EN is valid (high level), power switches Q2 and Q3 are turned on, and power switches Q1 and Q4 are turned off. The temperature control drive current flows from the connection node V0 through power switch Q2 → the midpoint H2 of the second bridge arm → thermoelectric cooling unit Bi → the midpoint H1 of the second bridge arm → power switch Q3 to ground. This current flow direction is positioned as a second direction opposite to the first direction, that is, the second direction refers to the direction in which the current flows from the midpoint H2 of the second bridge arm through the thermoelectric cooling unit Bi to the midpoint H1 of the first bridge arm. At this time, the thermoelectric cooling unit Bi performs a heating operation under the action of the temperature control drive current flowing along the second direction, actively injecting heat into the corresponding display light-emitting area Ai, realizing rapid heating compensation for the low-temperature area, thereby maintaining the light-emitting chip in this area within the optimal operating temperature range, ensuring that the temperature of each display zone is uniform, and fundamentally eliminating the brightness and color unevenness caused by temperature gradient.

[0076] In addition, when both the cooling enable signal Cooling_EN and the heating enable signal Heating_EN are invalid (low level), Figure 6 With all power switches Q1, Q2, Q3, and Q4 turned off, the temperature control drive current path is cut off, and the thermoelectric cooling unit Bi is in a high-resistance idle state with no current flowing through it. At this time, the display light-emitting area Ai corresponding to the thermoelectric cooling unit Bi relies on passive heat dissipation (i.e., Figure 2 The heat sink (as shown) naturally dissipates heat, and the system enters a low-power standby mode, which effectively reduces the working energy consumption of the thermoelectric cooling unit Bi while meeting the allowable temperature fluctuation range, thus extending the service life of the thermoelectric cooling unit Bi.

[0077] In one embodiment, refer to Figure 6A capacitor filter assembly can also be connected between the direction control unit 432 and the current modulation unit 431. This capacitor filter assembly consists of multiple decoupling capacitors connected in parallel between the path terminal of the current modulation unit 431 (i.e., the connection node where the output capacitor C7 is electrically connected to the inductor L1) and ground. These include large-capacity energy storage capacitors C3 to C4 (such as electrolytic capacitors) and small-capacity high-frequency filter capacitors C5 to C6 (such as ceramic capacitors). The energy storage capacitors C3 to C4 are used to stabilize the power supply voltage, filter low-frequency ripple, and provide instantaneous current compensation during high-frequency switching of the power switching transistors to prevent power supply voltage drops. The high-frequency filter capacitors C5 to C6 are used to bypass high-frequency noise and suppress electromagnetic interference generated by switching actions. The capacitor filter assembly ensures that the current modulation unit 431 and the direction control unit 432 obtain a clean and stable power supply environment during dynamic operation, improving the anti-interference capability and operational reliability of the drive execution circuit 43, while reducing the potential interference of high-frequency noise to other sensitive modules in the temperature control system (such as the signal acquisition module 30 and the feedforward decision circuit 41).

[0078] In another embodiment, reference is made to Figure 6 The drive execution circuit 43 also includes capacitors C'1 and C'2, and resistor R'1. Capacitor C'1 is connected between the gate of power switch Q3 and the second path terminal, and capacitor C'2 is connected between the gate of power switch Q4 and the second path terminal. These capacitors are used to slow down the turn-on and turn-off speeds of the power switches in the direction control unit 432, reducing electromagnetic interference during switching transients. The first end of resistor R'1 is connected to the second path terminals of power switches Q3 and Q4, and the second end of resistor R'1 is grounded. Resistor R'1 serves as a current sampling resistor, which can detect the temperature control drive current in real time, triggering a protection action when the temperature control drive current is abnormal.

[0079] Furthermore, in some feasible embodiments, the voltage threshold signal includes an upper voltage threshold signal and a lower voltage threshold signal, and the feedforward decision circuit 41 includes: The differential amplifier unit 411 has its non-inverting input terminal connected to the heat load voltage signal sent by the signal acquisition module 30, and its inverting input terminal connected to the reference voltage signal. The differential amplifier unit 411 is configured to amplify the voltage difference signal between the heat load voltage signal and the reference voltage signal according to a preset feedforward gain to generate the temperature control voltage signal.

[0080] In this embodiment, refer to Figure 5 The differential amplifier unit 411, as the core component of the feedforward decision circuit 41, transmits the thermal load voltage signal V. loadPerforms a differential operation with a preset reference voltage signal Vref and amplifies it by a preset feedforward gain K to generate a temperature control voltage signal . That is, the present application accurately quantifies the deviation degree between the actual instantaneous thermal load of the target display area and the thermal equilibrium point (i.e., the equilibrium thermal load represented by the reference voltage signal Vref) through differential amplification by the differential amplification unit 411. That is, the differential amplification unit 411 is implemented by a pure analog circuit, and there is no analog-to-digital conversion and software algorithm delay in the entire operation process, ensuring that the temperature control voltage signal changes strictly synchronously with the heat load voltage signal . It provides a high-bandwidth and zero-delay linear input signal for the subsequent comparison and determination unit 412, fundamentally avoiding the hysteresis problem in traditional feedback control, and laying a solid foundation for the entire feedforward temperature control display system 100 to achieve precise adjustment synchronized with the screen load.

[0081] It should be noted that the expression of the feedforward gain K is:

[0082] Where, represents the voltage amplitude corresponding to the maximum thermoelectric conversion power of the thermoelectric cooling unit Bi; represents the voltage amplitude corresponding to the minimum thermoelectric conversion power of the thermoelectric cooling unit Bi; represents the voltage corresponding to the maximum heat load of the LED in the corresponding display light-emitting area Ai.

[0083] In a specific embodiment, when V load > Vref, the voltage difference signal is positive, indicating that active cooling is required; when V load < Vref, the voltage difference signal is negative, indicating that active heating is required. Subsequently, the voltage difference signal is linearly amplified by the preset feedforward gain K, so that the amplitude of the temperature control voltage signal is proportional to the degree of heat load deviation, and the change range of the temperature control voltage signal matches the driving requirements of the thermoelectric cooling unit Bi. Among them, the feedforward gain K is calibrated offline based on the regional heat capacity of the display module 10 and the maximum adjustment ability of the thermoelectric cooling unit Bi, ensuring that the cooling / heating power of the thermoelectric cooling unit Bi can dynamically match the change of the instantaneous heat load of the LED light-emitting chip. That is, for the display light-emitting area Ai with a larger heat capacity, a smaller gain can avoid over-adjustment; for the display light-emitting area Ai with a smaller heat capacity, a larger gain can achieve a fast response.

[0084] The comparison and determination unit 412 is electrically connected to the output of the differential amplifier unit 411. The output of the comparison and determination unit 412 forms the enable output of the feedforward decision circuit 41 and is electrically connected to the drive execution circuit 43. The comparison and determination unit 412 is configured to compare the temperature control voltage signal with the upper limit voltage threshold signal and the lower limit voltage threshold signal respectively. When the temperature control voltage signal is greater than the upper limit voltage threshold signal, a temperature control enable signal representing the cooling enable signal Cooling_EN is generated. When the temperature control voltage signal is less than the preset lower limit voltage threshold signal, a temperature control enable signal representing the heating enable signal Heating_EN is generated.

[0085] In this embodiment, refer to Figure 5 The comparison and determination unit 412 is an important component of the feedforward decision circuit 41. The input terminal of the comparison and determination unit 412 is electrically connected to the output terminal of the differential amplifier unit 411, and receives the temperature control voltage signal V output by the differential amplifier unit 411. TEC The output of the comparison and determination unit 412 constitutes the enable output of the feedforward decision circuit 41 and is electrically connected to the drive execution circuit 43. The comparison and determination unit 412 is configured to process the temperature control voltage signal V... TEC The voltage is compared with the preset upper limit voltage threshold signal Vmax and lower limit voltage threshold signal Vmin respectively, and a corresponding temperature control enable signal is generated based on the comparison result. In other words, the comparison and determination unit 412 converts the continuously changing temperature control voltage signal into discrete mode commands (cooling mode, heating mode, or idle mode) with clear physical meaning, providing a clear and stable control basis for the subsequent drive execution circuit 43.

[0086] It should be noted that the upper limit voltage threshold signal Vmax and the lower limit voltage threshold signal Vmin are calibrated offline based on the regional heat capacity of the display light-emitting area Ai and the allowable temperature fluctuation range. This ensures that the trigger point of the comparison and determination unit 412 is precisely matched with the thermal inertia of each display light-emitting area Ai, which not only ensures the sensitivity of temperature control, but also avoids the frequent start-stop of the thermoelectric cooling unit Bi due to small fluctuations, thus achieving a balance between temperature control accuracy and energy consumption optimization.

[0087] In a specific embodiment, when V TEC When Vmax > Vmax, it indicates that the heat load of the target display area has exceeded the allowable upper limit deviation range, and active cooling is required. The comparison and determination unit 412 generates a high-level cooling enable signal Cooling_EN; when Vmax > ... TEC When Vmin < V, it indicates that the heat load of the target display area is below the allowable lower limit deviation range, requiring active heating. The comparison and determination unit 412 generates a high-level heating enable signal Heating_EN; when Vmin ≤ VTEC When the temperature load deviation of the target display area is within the allowable range, the temperature control display system 100 does not need to actively intervene. The comparison and judgment unit 412 does not output the temperature control enable signal, that is, the cooling enable signal Cooling_EN and the heating enable signal Heating_EN have no effective output and are both in a low level state. This causes the thermoelectric cooling unit Bi corresponding to the target display area to enter the idle mode and maintain thermal balance naturally by passive heat dissipation.

[0088] Furthermore, in some other feasible embodiments, reference is made to... Figure 7 The differential amplifier unit 411 includes: a differential amplifier U1B, a first resistor R1, a second resistor R2, a third resistor R3, a fourth resistor R4, a fifth resistor R5, and a first capacitor C1; the non-inverting input terminal of the differential amplifier U1B constitutes the non-inverting input terminal of the differential amplifier unit 411, which is electrically connected to the first terminal of the first resistor R1 and the first terminal of the second resistor R2, respectively; the second terminal of the first resistor R1 is connected to the thermal load voltage signal sent by the signal acquisition module 30, and the second terminal of the second resistor R2 is grounded; the inverting input terminal of the differential amplifier U1B constitutes the inverting input terminal of the differential amplifier unit 411. The first terminal of the fourth resistor R4 and the first terminal of the fifth resistor R5 are electrically connected to the reference voltage signal. The positive power supply terminal of the differential amplifier U1B is connected to the power supply terminal, and the negative power supply terminal of the differential amplifier U1B is grounded. The output terminal of the differential amplifier U1B forms the output terminal of the differential amplifier unit 411, which is electrically connected to the first terminal of the third resistor R3 and the second terminal of the fifth resistor R5. The second terminal of the third resistor R3 is electrically connected to the first terminal of the first capacitor C1 and the input terminal of the comparison determination unit 412, and the second terminal of the first capacitor C1 is grounded.

[0089] In this embodiment, refer to Figure 7 The differential amplifier unit 411 is composed of a differential amplifier U1B and an external resistor-capacitor network (i.e., the first resistor R1 to the fifth resistor R5 and the first capacitor C1) to realize the processing of the thermal load voltage signal V. load With reference voltage signal V ref The difference is amplified, and the signal quality is improved by RC filtering at the output of differential amplifier U1B, providing a clean and accurate temperature control voltage signal V for subsequent comparison and judgment unit 412. TEC .

[0090] Specifically, the non-inverting input of differential amplifier U1B constitutes the non-inverting input of differential amplifier unit 411, and is electrically connected to the first terminal of the first resistor R1 and the first terminal of the second resistor R2, respectively; wherein, the second terminal of the first resistor R1 is connected to the thermal load voltage signal V sent by the signal acquisition module 30. TEC Adjust the amplitude to ensure the thermal load voltage signal V TEC The input common-mode voltage range of the differential amplifier U1B is matched. The inverting input of the differential amplifier U1B forms the inverting input of the differential amplifier unit 411, and is electrically connected to the first terminals of the fourth resistor R4 and the fifth resistor R5, respectively. The second terminal of the fourth resistor R4 is connected to a preset reference voltage signal Vref, and the fifth resistor R5 acts as a feedback resistor between the inverting input and output of the differential amplifier U1B. The positive power supply terminal of the differential amplifier U1B is connected to the power supply terminal VCC, and the negative power supply terminal is grounded, using a single power supply. The output of the differential amplifier U1B forms the output of the differential amplifier unit 411, and is electrically connected to the first terminal of the third resistor R3 and the second terminal of the fifth resistor R5, respectively. The second terminal of the third resistor R3 is electrically connected to the first terminal of the first capacitor C1 and the input terminal of the comparison and determination unit 412, and the second terminal of the first capacitor C1 is grounded. The third resistor R3 and the first capacitor C1 form a first-order low-pass filter, used to filter the temperature control voltage signal Vref output by the differential amplifier U1B. TEC Smoothing filters are applied to eliminate high-frequency noise interference in the circuit.

[0091] It should be noted that the core function of the differential amplifier unit 411 is to achieve The precise calculation involves the feedforward gain K, which is determined by the ratio of the fifth resistor R5 to the fourth resistor R4 (i.e., the input resistance of the differential amplifier unit 411) (i.e., K = R5 / R4). This feedforward gain K needs to be calibrated offline based on the regional heat capacity of the COB display module 10 and the maximum cooling power of the thermoelectric cooling unit Bi to ensure the temperature control voltage signal V... TEC The amplitude range can linearly cover the maximum heat load fluctuation of the LED light-emitting chip in the corresponding display light-emitting area Ai, so that the full power adjustment range of the thermoelectric cooling unit Bi is precisely matched with the heat load change.

[0092] The voltage divider network formed by the first resistor R1 and the second resistor R2 serves to adapt the signal amplitude, that is, when the thermal load voltage signal V... load When the original amplitude exceeds the linear input range of the differential amplifier U1B, the thermal load voltage signal V can be adjusted by changing the ratio of the first resistor R1 to the second resistor R2. load Apply appropriate attenuation to ensure that the differential amplifier U1B operates in the linear region.

[0093] Furthermore, in some feasible embodiments, reference is made to Figure 8 The comparison and determination unit 412 includes a cooling output terminal and a heating output terminal. The comparison and determination unit 412 includes a first comparator U1, a second comparator U2, a sixth resistor R6, and a seventh resistor R7. The non-inverting input terminal of the first comparator U1 is electrically connected to the first terminal of the sixth resistor R6 and the non-inverting input terminal of the second comparator U2, respectively. The non-inverting input terminal of the second comparator U2 is electrically connected to the first terminal of the seventh resistor R7. The connection point between the non-inverting input terminal of the first comparator U1 and the non-inverting input terminal of the second comparator U2 is the input terminal of the comparison and determination unit 412 and is electrically connected to the output terminal of the differential amplifier unit 411. The inverting input of the first comparator U1 is connected to the upper limit voltage threshold signal, and the inverting input of the second comparator U2 is connected to the lower limit voltage threshold signal. The positive power supply terminals of the first comparator U1 and the second comparator U2 are respectively connected to the power supply terminal, and the negative power supply terminals of the first comparator U1 and the second comparator U2 are respectively grounded. The output terminal of the first comparator U1 is the cooling output terminal, which is electrically connected to the second terminal of the sixth resistor R6 and the drive execution circuit 43. The output terminal of the second comparator U2 is the heating output terminal, which is electrically connected to the second terminal of the seventh resistor R7 and the drive execution circuit 43.

[0094] In this embodiment, refer to Figure 8 The circuit shown includes a comparison and determination unit 412 comprising a first comparator U1, a second comparator U2, a sixth resistor R6, and a seventh resistor R7. The connection point between the non-inverting input of the first comparator U1 and the non-inverting input of the second comparator U2 serves as the input of the comparison and determination unit 412, and is electrically connected to the output of the differential amplifier unit 411, receiving the temperature control voltage signal V. TECThe inverting input of the first comparator U1 is connected to a preset upper limit voltage threshold signal Vmax, and the inverting input of the second comparator U2 is connected to a preset lower limit voltage threshold signal Vmin. The positive power supply terminals of the first and second comparators U1 and U2 are respectively connected to the power supply terminal VCC, and the negative power supply terminals of the first and second comparators U1 and U2 are respectively grounded, using a single power supply. The output terminal of the first comparator U1 serves as the cooling output terminal, and is electrically connected to the second terminal of the sixth resistor R6 and the drive execution circuit 43. The output terminal of the second comparator U2 serves as the heating output terminal, and is electrically connected to the second terminal of the seventh resistor R7 and the drive execution circuit 43. The first terminal of the sixth resistor R6 is electrically connected to the non-inverting input terminal of the first comparator U1, and the first terminal of the seventh resistor R7 is electrically connected to the non-inverting input terminal of the second comparator U2. That is, the sixth resistor R6 and the seventh resistor R7 form a positive feedback loop, introducing hysteresis characteristics to the comparators (i.e., the first comparator U1 and the second comparator U2).

[0095] In a specific embodiment, when V TEC When the voltage is greater than Vmax, the first comparator U1 outputs a high level as the cooling enable signal Cooling_EN. Simultaneously, positive feedback is introduced through the sixth resistor R6, giving the flip point of the first comparator U1 a certain hysteresis width to prevent frequent output jumps due to small signal fluctuations. When the temperature control voltage signal Vmax is high... TEC When Vmin < V, the second comparator U2 outputs a high level as the heating enable signal Heating_EN, and similarly, hysteresis is introduced through the seventh resistor R7 to enhance anti-interference capability; when Vmin ≤ V TEC When Vmax is less than or equal to 0, both the first comparator U1 and the second comparator U2 output a low level, resulting in no temperature control enable signal output, which in turn causes the thermoelectric refrigeration unit Bi to enter an idle mode. In other words, through the circuit structure described above, this application enables the comparison determination unit 412 to convert the continuously changing temperature control voltage signal into a stable, hysteresis-characteristic discrete enable signal, providing a clear and reliable operating mode instruction for the drive execution circuit 43. This effectively avoids oscillations near the threshold point and improves the anti-interference capability and control stability of the temperature control display system 100.

[0096] Furthermore, in some other feasible embodiments, reference is made to... Figure 9The signal modulation circuit 42 includes a third comparator U3, a fourth comparator U4, an eighth resistor R8, a ninth resistor R9, a tenth resistor R10, an eleventh resistor R11, a twelfth resistor R12, a thirteenth resistor R13, and a second capacitor C2. The non-inverting input of the third comparator U3 is electrically connected to the first terminals of the eighth resistor R8, the ninth resistor R9, and the tenth resistor R10. The second terminal of the eighth resistor R8 and the positive power supply terminal of the third comparator U3 are connected to a power supply terminal. The inverting input of the third comparator U3 is electrically connected to the first terminal of the second capacitor C2 and the inverting input of the fourth comparator U4. The output of the third comparator U3 is connected to the second terminal of the tenth resistor R10 and... The first end of the eleventh resistor R11 is electrically connected, the second end of the second capacitor C2, the negative power supply terminal of the third comparator U3, the second end of the ninth resistor R9, and the second end of the eleventh resistor R11 are respectively grounded; the non-inverting input terminal of the fourth comparator U4 is electrically connected to the first end of the twelfth resistor R12 and the first end of the thirteenth resistor R13, the second end of the twelfth resistor R12 forms the input terminal of the signal modulation circuit 42 and is electrically connected to the temperature control voltage terminal of the feedforward decision circuit 41, the second end of the thirteenth resistor R13 is grounded, the positive and negative power supply terminals of the fourth comparator U4 are respectively empty, and the output terminal of the fourth comparator U4 forms the output terminal of the signal modulation circuit 42 and is electrically connected to the drive execution circuit 43.

[0097] In this embodiment, the signal modulation circuit 42 uses a PWM modulator composed of a third comparator U3, a fourth comparator U4, and peripheral resistor-capacitor components to modulate the temperature control voltage signal V output by the feedforward decision circuit 41. TEC Converted into a high-frequency square wave signal with a duty cycle linearly proportional to it (i.e., temperature control square wave signal D). TEC Specifically, the third comparator U3, together with its peripheral resistors R8, R9, R10, R11, and C2, forms a triangular wave generator. The second terminal of resistor R8 is connected to the power supply, and the second terminal of resistor R9 is grounded. Together with resistor R10, these two resistors provide a voltage divider bias for the non-inverting input of the third comparator U3. The output of the third comparator U3 is fed back to the non-inverting input through resistor R10 and grounded through resistor R11. The inverting input of the third comparator U3 is connected to the first terminal of capacitor C2, and the second terminal of capacitor C2 is grounded. This triangular wave generator utilizes the hysteresis characteristic of the third comparator U3 and the RC charging and discharging mechanism to generate a linearly strong high-frequency triangular wave voltage Vtri across capacitor C2.

[0098] Next, the fourth comparator U4 is used as a high-frequency comparator. The non-inverting input of the fourth comparator U4 is connected to the temperature control voltage signal V through a voltage divider network composed of the twelfth resistor R12 and the thirteenth resistor R13. TEC The inverting input of the fourth comparator U4 is connected to the first terminal of the second capacitor C2, and a high-frequency triangular wave voltage Vtri is applied. The fourth comparator U4 will... Figure 10 The temperature control voltage signal V shown TEC Compared with the high-frequency triangular wave voltage Vtri, when the temperature control voltage signal V... TEC When the voltage is higher than the high-frequency triangular wave voltage Vtri, the fourth comparator U4 outputs a high level; when the temperature control voltage signal V... TEC When the voltage is below the high-frequency triangular wave voltage Vtri, the fourth comparator U4 outputs a low level. Therefore, the output of the fourth comparator U4 receives a signal with the same frequency as the triangular wave and a duty cycle as the temperature control voltage V. TEC Linearly proportional, such as Figure 10 The temperature control square wave signal D shown TEC In other words, the signal modulation circuit 42 in this application is implemented using a pure analog comparator, requiring no software intervention, thus ensuring the smooth transition from the temperature control voltage signal VTEC to the temperature control square wave signal D. TEC The conversion has extremely low latency and high bandwidth, providing a precise power control reference for the subsequent drive execution circuit 43.

[0099] In summary, by setting up a temperature control display system 100 integrating a display module 10, a thermoelectric cooling array 20, a signal acquisition module 30, and a control drive module 40, this application significantly improves the temperature control capability of the display device integrating the temperature control display system 100 for the display module 10, thereby ensuring the uniformity of the display screen. Specifically, the signal acquisition module 30 is electrically connected to the display driver chip 200 that drives the display module 10, enabling the signal acquisition module 30 to directly acquire in real time multiple display drive signals PWM output from the display driver chip 200 to a certain display light-emitting area Ai (i.e., the target display area) in the display module 10. Based on all the display drive signals PWM, a heat load voltage signal can be accurately generated, achieving zero-delay perception of instantaneous heat generation power from the heat source. This effectively overcomes the problem that traditional passive cooling architectures cannot match transient heat load changes due to thermal inertia, providing real-time and accurate heat load characterization for the subsequent feedforward control of the control drive module 40, significantly improving the temperature control response speed of the display device. Next, based on the electrical connection between the control drive module 40 and the signal acquisition module 30, the control drive module... Block 40 can determine the temperature control enable signal of the target display area based on the heat load voltage signal, and activate the thermoelectric cooling unit Bi in the thermoelectric cooling array 20 corresponding to the target display area to perform temperature control adjustment operation based on the temperature control enable signal. Since one thermoelectric cooling unit Bi corresponds to one display light-emitting area Ai, and the temperature control enable signal of each display light-emitting area Ai is directly determined by the real-time display drive signal PWM of the display light-emitting area Ai itself, the temperature control adjustment operation of each display light-emitting area Ai can be synchronized with the instantaneous screen load of the display light-emitting area Ai, realizing rapid response and precise control of local hot spots, significantly improving the temperature control capability of the display module 10 in the display device, fundamentally eliminating the uneven brightness and color caused by temperature gradient, and ensuring that the display device can still present a uniform display effect under high dynamic screen.

[0100] Furthermore, based on the first embodiment of the temperature control display system of this application, a second embodiment of the driving method of the temperature control display system of this application is proposed.

[0101] The driving method of the temperature control display system of this application is applied to the temperature control display system described above. The driving method of the temperature control display system of this application is executed by the display device applied to the temperature control display system. The driving method of the temperature control display system of this application includes the following implementation steps S10 to S20.

[0102] Step S10: Obtain multiple display driving signals output from the display driver chip to the target display area through the signal acquisition module, and determine the thermal load voltage signal of the target display area based on all the multiple display driving signals. The target display area is any one of the display light-emitting areas among all the display light-emitting areas.

[0103] In this embodiment, the signal acquisition module is electrically connected to the display driver chip of the display module. When the display driver chip outputs multiple display driver signals to the target display area (i.e., any display light-emitting area), the signal acquisition module can directly obtain the multiple display driver signals of the target display area from the display driver chip. Then, it can determine the heat load voltage signal of the target display area based on all the display driver signals, realizing zero-delay perception of instantaneous heating power from the heat source, avoiding the lag of traditional temperature sensor feedback, providing real-time and accurate heat load characterization for feedforward control, and significantly improving the temperature control response speed.

[0104] Step S20: The enable control drive module determines the temperature control enable signal of the target display area based on the heat load voltage signal, and activates the thermoelectric cooling unit in the thermoelectric cooling array corresponding to the target display area to perform temperature control adjustment operation based on the temperature control enable signal.

[0105] In this embodiment, the control drive module generates a temperature control enable signal based on the heat load voltage signal and activates the thermoelectric cooling unit corresponding to the target display area in the thermoelectric cooling array to perform temperature control adjustment operations, thereby achieving feedforward precise control of the instantaneous heat load of the target display area. Since the temperature control enable signal is directly determined by the multi-channel display drive signals of the target display area, that is, after the signal acquisition module aggregates the multi-channel display drive signals of the target display area into a heat load voltage signal, the control drive module generates a temperature control enable signal for the target display area based on the heat load voltage signal. This ensures that the temperature control adjustment operation (i.e., cooling operation or heating operation) for the target display area can be strictly synchronized with the instantaneous screen load of the target display area, significantly improving the temperature control capability of the display module and thus ensuring the uniformity of the display device's screen display.

[0106] In addition, this application also provides a display device. Please refer to... Figure 11 , Figure 11 This is a schematic diagram of the display device involved in the embodiments of this application. Specifically, the display device in the embodiments of this application may be a device for driving a locally running temperature control display system.

[0107] The display device includes the temperature control display system described above, and / or a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the computer program, when executed by the processor, implements the steps of the driving method for the temperature control display system described above.

[0108] like Figure 11As shown, the display device in this embodiment may include: a temperature control display system, a processor 1001 (e.g., a CPU), a communication bus 1002, a user interface 1003, a network interface 1004, and a memory 1005. The communication bus 1002 is used to enable communication between these components. The user interface 1003 may include a display screen and an input unit such as a keyboard; optionally, the user interface 1003 may also include a standard wired interface or a wireless interface. The network interface 1004 may optionally include a standard wired interface or a wireless interface (e.g., a Wi-Fi interface).

[0109] The memory 1005 is disposed on the main body of the display device. The memory 1005 stores a program that performs corresponding operations when executed by the processor 1001. The memory 1005 is also used to store parameters used by the display device. The memory 1005 can be a high-speed RAM or a stable, non-volatile memory, such as a disk drive. Optionally, the memory 1005 can also be a storage device independent of the aforementioned processor 1001.

[0110] Those skilled in the art will understand that Figure 11 The display device structure shown does not constitute a limitation on the display device and may include more or fewer components than shown, or combine certain components, or have different component arrangements.

[0111] like Figure 11 As shown, the memory 1005, which serves as a storage medium, may include an operating system, a network communication module, a user interface module, and a driver for a temperature control display system.

[0112] exist Figure 11 In the display device shown, the processor 1001 can be used to call the driver program of the temperature control display system stored in the memory 1005 and execute the steps of the temperature control display system driver method as described above.

[0113] It should be noted that, in this document, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or system that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or system. Unless otherwise specified, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or system that includes that element.

[0114] The sequence numbers of the embodiments in this application are for descriptive purposes only and do not represent the superiority or inferiority of the embodiments.

[0115] Through the above description of the embodiments, those skilled in the art can clearly understand that the methods of the above embodiments can be implemented by means of software plus necessary general-purpose hardware platforms. Of course, they can also be implemented by hardware, but in many cases the former is a better implementation method. Based on this understanding, the technical solution of this application, in essence, or the part that contributes to the prior art, can be embodied in the form of a software product. This computer software product is stored in a storage medium (such as ROM / RAM, magnetic disk, optical disk) as described above, and includes several instructions to cause a display device (which may be a mobile phone, computer, server, or network device, etc.) to execute the methods described in the various embodiments of this application.

[0116] The above are merely preferred embodiments of this application and do not limit the patent scope of this application. Any equivalent structural or procedural transformations made using the content of this application's specification and drawings, or direct or indirect applications in other related technical fields, are similarly included within the patent protection scope of this application.

Claims

1. A temperature control display system, characterized in that, The temperature control display system includes: The display module is disposed on the display substrate and is divided into multiple display light-emitting areas; A thermoelectric cooling array is disposed on the side of the display substrate away from the display module. The thermoelectric cooling array includes multiple thermoelectric cooling units, and one thermoelectric cooling unit corresponds to one display light-emitting area. A signal acquisition module is electrically connected to a display driver chip that drives the display module. The signal acquisition module is configured to acquire multiple display driver signals output by the display driver chip to the target display area, and determine the thermal load voltage signal of the target display area based on all the multiple display driver signals. The target display area is any one of the display light-emitting areas. The control drive module is electrically connected to the signal acquisition module and the thermoelectric cooling array, respectively. The control drive module is configured to determine the temperature control enable signal of the target display area based on the heat load voltage signal, and activate the thermoelectric cooling unit in the thermoelectric cooling array corresponding to the target display area to perform temperature control adjustment operation based on the temperature control enable signal.

2. The temperature control display system as described in claim 1, characterized in that, The signal acquisition module includes: Multiple signal filtering units, the input terminal of one of the signal filtering units is connected to one of the display driving signals output by the display driver chip to the target display area, and each of the signal filtering units is configured to generate a DC voltage component according to the corresponding display driving signal; The summing unit has its inverting input terminal electrically connected to the output terminal of each of the signal filtering units, its non-inverting input terminal grounded, and its output terminal electrically connected to the control drive module. The summing unit is configured to perform a weighted summation based on all the DC voltage components to obtain the thermal load voltage signal of the target display area.

3. The temperature control display system as described in claim 1, characterized in that, The control drive module includes: A feedforward decision circuit is electrically connected to the signal acquisition module. The feedforward decision circuit is configured to generate a temperature control voltage signal for the target display area based on the heat load voltage signal sent by the signal acquisition module and a preset reference voltage signal, compare the temperature control voltage signal with a preset voltage threshold signal, and generate a temperature control enable signal for the target display area based on the voltage comparison result. A signal modulation circuit, wherein the input terminal of the signal modulation circuit is electrically connected to the temperature control voltage terminal of the feedforward decision circuit, and the signal modulation circuit is configured to convert the temperature control voltage signal into a temperature control square wave signal. A drive execution circuit is electrically connected to the enable output terminal of the feedforward decision circuit, the output terminal of the signal modulation circuit, and the thermoelectric cooling array. The drive execution circuit is configured to provide a temperature control drive current under the drive of the temperature control square wave signal, and control the temperature control drive current to flow through the thermoelectric cooling unit corresponding to the target display area along the current flow direction indicated by the temperature control enable signal, so that the thermoelectric cooling unit corresponding to the target display area performs a temperature control adjustment operation.

4. The temperature control display system as described in claim 3, characterized in that, The drive execution circuit includes: A current modulation unit, wherein the control terminal of the current modulation unit is electrically connected to the output terminal of the signal modulation circuit, and the current modulation unit is configured to generate a temperature control drive current in response to the temperature control square wave signal; A direction control unit is included, wherein its signal enable terminal is electrically connected to the enable output terminal of the feedforward decision circuit, the midpoint of its bridge arm is electrically connected to the thermoelectric cooling unit corresponding to the target display area, and its path terminal is electrically connected to the path terminal of the current modulation unit. The direction control unit is configured to drive the temperature control drive current output by the current modulation unit to flow along a first direction through the thermoelectric cooling unit corresponding to the target display area when the temperature control enable signal represents a cooling enable signal, thereby causing the thermoelectric cooling unit corresponding to the target display area to perform a cooling operation; or... When the temperature control enable signal represents a heating enable signal, the temperature control drive current output by the current modulation unit flows through the thermoelectric cooling unit corresponding to the target display area in a second direction opposite to the first direction, so that the thermoelectric cooling unit corresponding to the target display area performs a heating operation.

5. The temperature control display system as described in claim 3, characterized in that, The voltage threshold signal includes an upper voltage threshold signal and a lower voltage threshold signal, and the feedforward decision circuit includes: A differential amplifier unit is provided, wherein the non-inverting input terminal of the differential amplifier unit is connected to the heat load voltage signal sent by the signal acquisition module, and the inverting input terminal of the differential amplifier unit is connected to the reference voltage signal. The differential amplifier unit is configured to amplify the voltage difference signal between the heat load voltage signal and the reference voltage signal according to a preset feedforward gain to generate the temperature control voltage signal. The comparison and determination unit has its input terminal electrically connected to the output terminal of the differential amplifier unit, and its output terminal forms the enable output terminal of the feedforward decision circuit and is electrically connected to the drive execution circuit. The comparison and determination unit is configured to compare the temperature control voltage signal with the upper limit voltage threshold signal and the lower limit voltage threshold signal respectively. When the temperature control voltage signal is greater than the upper limit voltage threshold signal, a temperature control enable signal representing a cooling enable signal is generated. When the temperature control voltage signal is less than the preset lower limit voltage threshold signal, a temperature control enable signal representing a heating enable signal is generated.

6. The temperature control display system as described in claim 5, characterized in that, The differential amplifier unit includes: a differential amplifier, a first resistor, a second resistor, a third resistor, a fourth resistor, a fifth resistor, and a first capacitor; The non-inverting input terminal of the differential amplifier constitutes the non-inverting input terminal of the differential amplification unit, and is electrically connected to the first terminal of the first resistor and the first terminal of the second resistor respectively. The second terminal of the first resistor is connected to the thermal load voltage signal sent by the signal acquisition module, and the second terminal of the second resistor is grounded. The inverting input terminal of the differential amplifier constitutes the inverting input terminal of the differential amplifier unit, which is electrically connected to the first terminal of the fourth resistor and the first terminal of the fifth resistor respectively. The first terminal of the fourth resistor is connected to the reference voltage signal. The positive power supply terminal of the differential amplifier is connected to the power supply terminal, and the negative power supply terminal of the differential amplifier is grounded. The output terminal of the differential amplifier forms the output terminal of the differential amplification unit, which is electrically connected to the first terminal of the third resistor and the second terminal of the fifth resistor. The second terminal of the third resistor is electrically connected to the first terminal of the first capacitor and the input terminal of the comparison determination unit. The second terminal of the first capacitor is grounded.

7. The temperature control display system as described in claim 5, characterized in that, The output terminals of the comparison and determination unit include a cooling output terminal and a heating output terminal, and the comparison and determination unit includes a first comparator, a second comparator, a sixth resistor, and a seventh resistor; The non-inverting input terminal of the first comparator is electrically connected to the first terminal of the sixth resistor and the non-inverting input terminal of the second comparator, respectively; the non-inverting input terminal of the second comparator is electrically connected to the first terminal of the seventh resistor. The connection point where the non-inverting input terminal of the first comparator is electrically connected to the non-inverting input terminal of the second comparator is the input terminal of the comparison determination unit and is electrically connected to the output terminal of the differential amplifier unit; The inverting input of the first comparator is connected to the upper limit voltage threshold signal, the inverting input of the second comparator is connected to the lower limit voltage threshold signal, the positive power supply terminals of the first comparator and the second comparator are respectively connected to the power supply terminal, and the negative power supply terminals of the first comparator and the second comparator are respectively grounded. The output terminal of the first comparator is the cooling output terminal, which is electrically connected to the second terminal of the sixth resistor and the drive execution circuit, respectively; the output terminal of the second comparator is the heating output terminal, which is electrically connected to the second terminal of the seventh resistor and the drive execution circuit, respectively.

8. The temperature control display system as described in claim 3, characterized in that, The signal modulation circuit includes a third comparator, a fourth comparator, an eighth resistor, a ninth resistor, a tenth resistor, an eleventh resistor, a twelfth resistor, a thirteenth resistor, and a second capacitor; The non-inverting input terminal of the third comparator is electrically connected to the first terminal of the eighth resistor, the first terminal of the ninth resistor, and the first terminal of the tenth resistor, respectively. The second terminal of the eighth resistor and the positive power supply terminal of the third comparator are respectively connected to the power supply terminal. The inverting input terminal of the third comparator is electrically connected to the first terminal of the second capacitor and the inverting input terminal of the fourth comparator, respectively. The output terminal of the third comparator is electrically connected to the second terminal of the tenth resistor and the first terminal of the eleventh resistor, respectively. The second terminal of the second capacitor, the negative power supply terminal of the third comparator, the second terminal of the ninth resistor, and the second terminal of the eleventh resistor are respectively grounded. The non-inverting input terminal of the fourth comparator is electrically connected to the first terminal of the twelfth resistor and the first terminal of the thirteenth resistor, respectively. The second terminal of the twelfth resistor forms the input terminal of the signal modulation circuit and is electrically connected to the temperature control voltage terminal of the feedforward decision circuit. The second terminal of the thirteenth resistor is grounded. The positive and negative power supply terminals of the fourth comparator are respectively set to empty. The output terminal of the fourth comparator forms the output terminal of the signal modulation circuit and is electrically connected to the drive execution circuit.

9. A driving method for a temperature control display system, characterized in that, The driving method is applied to the temperature control display system according to any one of claims 1 to 8, and the driving method includes: The signal acquisition module acquires multiple display driving signals output from the display driver chip to the target display area, and determines the thermal load voltage signal of the target display area based on all the multiple display driving signals. The target display area is any one of the display light-emitting areas among all the display light-emitting areas. The enable control drive module determines the temperature control enable signal of the target display area based on the heat load voltage signal, and activates the thermoelectric cooling unit in the thermoelectric cooling array corresponding to the target display area to perform temperature control adjustment operation based on the temperature control enable signal.

10. A display device, characterized in that, The display device includes the temperature control display system according to any one of claims 1 to 8; and / or, The system includes a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the computer program, when executed by the processor, implements the steps of the driving method for the temperature control display system as described in claim 9.

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