Wafer spin-drying support and spin-drying device

Abstract

The invention discloses a wafer spin-drying support and a spin-drying device, and relates to the technical field of semiconductor preparation, the wafer spin-drying support comprises a support body, a mounting groove is formed in the support body, a wafer box is mounted in the mounting groove, the external size of the support body is matched with the size of a spin-drying groove of the spin-drying device, and the wafer box is arranged in the mounting groove. One side of the support body is provided with an opening used for enabling the wafer box to enter the mounting groove, and the two sides, perpendicular to the mounting direction of the wafer box, of the support body are each provided with a limiting assembly so that the position of the wafer box can be limited after the wafer box enters the mounting groove. According to the wafer spin-drying support and the spin-drying device, the spin-drying device can be applied to cleaning and spin-drying of wafers of various sizes.

Description

Technical Field

[0001] This application relates to the field of semiconductor fabrication technology, and more specifically, to a wafer spin dryer and spin dryer. Background Technology

[0002] With the increasing demands for crystal integration and advancements in semiconductor manufacturing technology, large integrated circuits often contain extremely small electronic components. During manufacturing, contaminants such as dust particles, metal particles, or oil can easily adhere to these components, damaging the circuitry within the chip, causing short circuits or open circuits, and ultimately leading to the failure of the entire integrated circuit. Therefore, wafer cleaning is a crucial step in the process.

[0003] In typical wafer cleaning processes, wet cleaning is a commonly used method because it does not damage the wafer surface and effectively removes contaminants. As the name suggests, wet cleaning involves placing the wafer in a cleaning tank containing a chemical solution. The interaction between the chemical solution and oil or dust particles on the wafer surface removes the contaminants, achieving a cleaning effect. In this process, multiple wafers are often placed in a wafer cassette, which is then immersed in a cleaning tank containing a chemical solution, combined with an ultrasonic oscillation process to achieve the cleaning effect. After cleaning, the wafer cassette needs to be placed in a spin-drying device to remove the chemical solution from the wafer surface. Existing technology offers a wide variety of wafer types and sizes, corresponding to various wafer cassette sizes. The high-speed rotation during spin-drying necessitates that the size of the spin-drying device match the external dimensions of the wafer cassette. Therefore, different specifications of spin-drying devices are required to spin-dry wafers of different sizes. Summary of the Invention

[0004] The purpose of this application is to provide a wafer spin dryer and spin dryer, which enables the spin dryer to be applied to the cleaning and spin drying of wafers of various sizes.

[0005] One embodiment of this application provides a wafer spin dryer bracket, including a bracket body, an internal mounting groove for mounting a wafer cassette, the external dimensions of the bracket body matching the dimensions of the spin dryer groove, an opening on one side of the bracket body for allowing the wafer cassette to enter the mounting groove, and limit components on both sides of the bracket body perpendicular to the wafer cassette mounting direction to limit the position of the wafer cassette after it enters the mounting groove.

[0006] As one feasible approach, the limiting component includes a limiting rod, and the wafer cassette is provided with a limiting groove corresponding to the limiting rod. When the wafer cassette is placed in the mounting groove, the limiting rod extends into the limiting groove, and both ends of the limiting rod are respectively connected to the bracket body.

[0007] As one feasible approach, one end of the limiting rod is rotatably connected to the bracket body, and when the limiting rod rotates to extend into the limiting groove, the other end of the limiting rod extends into the slot provided on the bracket body.

[0008] As an feasible approach, when the limiting rod is engaged in the limiting groove, the limiting rod abuts against the side wall of the limiting groove.

[0009] As one feasible approach, the limiting rod is connected to the bracket body via a pivot.

[0010] As one feasible approach, the bracket body includes two oppositely arranged perforated plates and a connecting block connecting the same side ends of the perforated plates. The ends of the two perforated plates extend toward the middle with protrusions, and the perforated plates, protrusions, and connecting blocks enclose and form an installation groove.

[0011] As one feasible approach, two limiting rods are respectively set at both ends of the perforated plate, and two connecting blocks are respectively set at both ends of the perforated plate.

[0012] As one feasible approach, the support body has a rectangular cross-section perpendicular to the wafer box mounting direction, and multiple wafer placement positions are arranged sequentially along the long side of the rectangle on the wafer box.

[0013] As one feasible approach, the wafer placement position is used to place 3-inch wafers, and the external dimensions of the support body are matched with the spin dryer of the 5-inch wafer spin dryer.

[0014] Another embodiment of this application provides a spin-drying device, including a spin-drying device body and the aforementioned wafer spin-drying bracket. The spin-drying device has a spin-drying groove inside, and the wafer spin-drying bracket is placed in the spin-drying groove to spin-dry the wafers in the wafer cassette during spin-drying.

[0015] The beneficial effects of the embodiments of this application include:

[0016] The wafer spin dryer bracket provided in this application includes a bracket body with an internal mounting groove for mounting wafer cassettes. Each wafer cassette contains multiple wafers to be spin-dried. The external dimensions of the bracket body match the dimensions of the spin dryer's trough, allowing the wafer spin dryer bracket to be placed within the trough. One side of the bracket body has an opening for the wafer cassettes to enter the mounting groove. Limiting components are provided on both sides of the bracket body perpendicular to the wafer cassette mounting direction to restrict the position of the wafer cassettes after they enter the mounting groove. Once the wafer cassettes enter the mounting groove through the opening, the limiting components restrict their position, fixing the relative position between the wafer cassettes and the bracket body. This allows wafer cassettes of different sizes to be placed in the spin dryer for spin drying, enabling the spin dryer to be applied to the cleaning and drying of wafers of various sizes. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of this application and should not be regarded as a limitation of the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 A structural diagram of a wafer spin dryer provided in an embodiment of this application;

[0019] Figure 2 This is one of the usage state diagrams of a wafer spin dryer provided in the embodiments of this application;

[0020] Figure 3 This is the second usage diagram of a wafer spin dryer provided in the embodiments of this application;

[0021] Figure 4 An exploded view of a wafer spin dryer in use, provided in an embodiment of this application;

[0022] Figure 5 A partial enlarged view of a wafer spin dryer provided in an embodiment of this application;

[0023] Figure 6 A partially enlarged view of a wafer spin dryer in use, provided in an embodiment of this application;

[0024] Figure 7 This is a partial enlarged view of a wafer cassette provided in an embodiment of this application.

[0025] Icons: 100-Wafer spin dryer; 110-Stander body; 111-Perforated plate; 112-Connecting block; 113-Protrusion; 120-Opening; 130-Limiting component; 131-Limiting rod; 132-Slot; 133-Hinge; 210-Wafer box; 211-Limiting groove; 310-Wafer. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of the embodiments of this application clearer, the technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. The components of the embodiments of this application described and shown in the accompanying drawings can generally be arranged and designed in various different configurations.

[0027] Therefore, the following detailed description of the embodiments of this application provided in the accompanying drawings is not intended to limit the scope of the claimed application, but merely to illustrate selected embodiments of the application. All other embodiments obtained by those skilled in the art based on the embodiments of this application without inventive effort are within the scope of protection of this application.

[0028] It should be noted that similar labels and letters in the following figures indicate similar items. Therefore, once an item is defined in one figure, it does not need to be further defined and explained in subsequent figures.

[0029] This application provides a wafer spin dryer 100, such as... Figure 1 and Figure 2 As shown, the device includes a support body 110, with a mounting groove formed inside the support body 110 for mounting a wafer cassette 210. The external dimensions of the support body 110 match the dimensions of the spin-drying groove of the spin-drying device. An opening 120 is provided on one side of the support body 110 for the wafer cassette 210 to enter the mounting groove. Limiting components 130 are provided on both sides of the support body 110 perpendicular to the mounting direction of the wafer cassette 210 to limit the position of the wafer cassette 210 after it enters the mounting groove.

[0030] The wafer spin dryer 100 provided in this embodiment is used in a spin dryer. Specifically, the external dimensions of the wafer spin dryer 100 match the dimensions of the spin dryer's spin dryer groove, allowing the wafer spin dryer 100 to be placed in the spin dryer for rotational spin drying. An installation groove is formed inside the support body 110, which is used to install a wafer cassette 210. The wafer cassette 210 is used to hold a wafer 310. Thus, when the wafer 310 is placed in the wafer cassette 210, and the wafer cassette 210 is placed in the wafer spin dryer 100, the wafer spin dryer 100 is then placed inside the spin dryer, allowing the wafer 310 within the wafer spin dryer 100 to be spin-dried.

[0031] Specifically, the external dimensions of the support body 110 match the dimensions of the spin-drying trough of the spin-drying device, allowing the wafer spin-drying support 100 to be placed in the spin-drying device for rotational spin-drying. An installation groove is formed inside the support body 110 for mounting the wafer cassette 210, so that the internal dimensions of the support body 110 match the external dimensions of the wafer cassette 210. In this way, the internal dimensions of the support body 110 can be set according to the dimensions of the wafer cassette 210, so that different support bodies 110 can be adapted to the cleaning and spin-drying of wafer cassettes 210 with wafers 310 of different sizes. Therefore, the wafer spin-drying support 100 provided in this application embodiment enables the spin-drying device to be applied to the cleaning and spin-drying of wafers 310 of various sizes.

[0032] To prevent relative movement between the wafer cassette 210 and the support body 110 during the spin-drying process, limiting components 130 are respectively provided on both sides of the support body 110 along the mounting direction perpendicular to the wafer cassette 210. After the wafer cassette 210 enters the mounting slot, the limiting components 130 restrict the position of the wafer cassette 210, thereby fixing the relative position between the wafer cassette 210 and the support body 110.

[0033] Understandably, the external dimensions of the support body 110 indicate the size of the spin dryer that it can be used with. Due to the limitation of the external dimensions of the support body 110, the wafer spin dryer 100 is used for cleaning wafers 310 that are smaller than the external dimensions of the support body 110, that is, the spin dryer is used for spin drying wafers 310 that are smaller than its working size.

[0034] The wafer spin dryer 100 provided in this embodiment includes a 110 body, with a mounting groove formed inside the 110 body for mounting a wafer cassette 210. The wafer cassette 210 contains a plurality of wafers 310 to be spin-dried. The external dimensions of the 110 body match the dimensions of the spin dryer's trough, allowing the 100 to be placed within it. One side of the 110 body has an opening 120 for the wafer cassette 210 to enter the mounting groove. The 110 body extends perpendicularly to the wafer cassette 210. On both sides of the 0 installation direction, limit components 130 are respectively provided to limit the position of the wafer cassette 210 after it enters the mounting slot. After the wafer cassette 210 enters the mounting slot through the opening 120, the limit components 130 limit the position of the wafer cassette 210, so that the relative position of the wafer cassette 210 and the support body 110 is fixed. In this way, wafer cassettes 210 of different sizes can be placed into the spin dryer for spin drying under the support of the wafer spin dryer bracket 100, so that the spin dryer can be applied to the cleaning and spin drying of wafers 310 of various sizes.

[0035] In addition, the wafer spin dryer 100 provided in this application embodiment includes only one component. That is, only one component is needed to enable the spin dryer to be applied to the spin dryer of wafers 310 of various sizes, which simplifies the structure of the wafer spin dryer 100 and makes it easy to operate.

[0036] Optional, such as Figure 2 , Figure 3 and Figure 4 As shown, the limiting component 130 includes a limiting rod 131. The wafer box 210 is provided with a limiting groove 211 corresponding to the limiting rod 131. When the wafer box 210 is placed in the mounting groove, the limiting rod 131 extends into the limiting groove 211, and both ends of the limiting rod 131 are connected to the bracket body 110 respectively.

[0037] The limiting component 130 is set as the limiting rod 131, and the wafer box 210 is provided with a limiting groove 211 corresponding to the limiting rod 131, such as Figure 7 As shown, the limiting rod 131 cooperates with the limiting groove 211 to restrict the position of the wafer box 210. Specifically, when the wafer box 210 is placed in the mounting groove, the limiting rod 131 extends into the limiting groove 211, so that the limiting rod 131 blocks the movement of the wafer box 210 in the axial direction perpendicular to the limiting rod 131.

[0038] It is understandable that the wafer box 210 enters the mounting slot from top to bottom through the opening 120. At this time, the wafer box 210 has the vertical degree of freedom, and the limiting rod 131 restricts the vertical movement of the wafer box 210, that is, the axis of the limiting rod 131 is the horizontal direction.

[0039] When the axial direction of the limiting rod 131 is the first direction, the two limiting components 130 are arranged at both ends of the bracket body 110 along the second direction, wherein the first direction and the second direction are perpendicular to each other and form a horizontal plane.

[0040] In one possible implementation of the embodiments of this application, such as Figure 3 , Figure 4 and Figure 5 As shown, one end of the limiting rod 131 is rotatably connected to the bracket body 110. When the limiting rod 131 rotates to extend into the limiting groove 211, the other end of the limiting rod 131 extends into the slot 132 provided on the bracket body 110.

[0041] In this embodiment, one end of the limiting rod 131 is rotatably connected to the support body 110. When the wafer cassette 210 is installed inside the support body 110, rotating the limiting rod 131 causes it to engage with the limiting groove 211 on the side wall of the wafer cassette 210, thus achieving a limiting position. After spin-drying, rotating the limiting rod 131 disengages it from the limiting groove 211, thereby releasing the limiting effect on the wafer cassette 210. Rotating the limiting rod 131 to the support body 110 makes them an integral unit, facilitating operation and preventing loss.

[0042] Optionally, when the limiting rod 131 is engaged in the limiting groove 211, the limiting rod 131 abuts against the side wall of the limiting groove 211.

[0043] When the limiting rod 131 is engaged in the limiting groove 211 of the wafer box 210, the limiting rod 131 abuts against the side wall of the limiting groove 211, so that the limiting rod 131 and the wafer box 210 are interference connected. In this way, the limiting rod 131 can improve the limiting effect in the vertical direction and prevent the wafer box 210 from shifting in the horizontal direction.

[0044] In one possible implementation of the embodiments of this application, such as Figure 5 and Figure 6 As shown, the limiting rod 131 is connected to the bracket body 110 via a rotating shaft 133.

[0045] The limiting rod 131 is rotatably connected to the bracket body 110 via the rotating shaft 133, which is convenient to operate and has a simple structure.

[0046] In practical applications, the rotating shaft 133 is set in the recessed structure of the support body 110, so that when the limiting rod 131 is limited, it does not protrude from the side of the support body 110 and matches the spin-drying groove of the spin-drying device.

[0047] Optionally, the bracket body 110 includes a hollow plate 111 disposed opposite to each other, and a connecting block 112 connecting the same side ends of the hollow plate 111. The ends of the two hollow plates 111 extend toward the middle with a protrusion 113. The hollow plate 111, the protrusion 113 and the connecting block 112 surround and form an installation groove.

[0048] Based on the spin-drying principle of the spin-drying device, during rotation, centrifugal force is used to detach the chemical solution from the surface of the wafer 310. In this embodiment, the support body 110 is configured to include two oppositely arranged perforated plates 111 and a connecting block 112 connecting the same side ends of the perforated plates 111. The ends of the two perforated plates 111 extend with protrusions 113 towards the middle of the two perforated plates 111. The protrusions 113, the perforated plates 111, and the connecting block 112 enclose a mounting groove. This provides the support body 110 with a large number of through holes communicating with the outside, facilitating the ejection of the chemical solution. Specifically, elongated holes can be formed on the perforated plates 111 along the wafer 310 arrangement direction, so that the sidewalls of each wafer 310 correspond to the elongated holes, facilitating the ejection of the chemical solution.

[0049] In one possible implementation of the embodiments of this application, such as Figure 4 As shown, two limiting rods 131 are respectively disposed at both ends of the hollow plate 111, and two connecting blocks 112 are respectively disposed at both ends of the hollow plate 111.

[0050] The limiting rods 131 are located at both ends of the hollow plate 111, respectively limiting the two ends of the wafer box 210, thereby improving the positional stability of the wafer box 210 during the spin-drying process.

[0051] Connecting blocks 112 are respectively disposed at both ends of the hollow plate 111. While supporting the wafer box 210, the connecting blocks 112 minimize the coverage of the bottom and sides of the wafer box 210, resulting in more through holes in the bracket body 110.

[0052] Optional, such as Figure 2 , Figure 3 and Figure 4As shown, the cross-section of the support body 110 along the mounting direction perpendicular to the wafer box 210 is rectangular, and multiple wafer 310 placement positions are arranged sequentially along the long side of the rectangle on the wafer box 210.

[0053] Multiple wafer 310 placement positions are arranged sequentially along the long side of the rectangle on the wafer box 210, so that multiple wafers 310 can be spun dry in one spin-drying process, thereby improving the spin-drying efficiency.

[0054] In one possible implementation of this application embodiment, the wafer 310 placement position is used to place a 3-inch wafer 310, and the external dimensions of the support body 110 are matched with the spin-drying groove of the 5-inch wafer 310 spin-drying device.

[0055] The wafer 310 placement position is used to place 3-inch wafers 310. The external dimensions of the support body 110 are matched with the spin-drying tank of the 5-inch wafer 310 spin-drying device, so that the 5-inch wafer 310 spin-drying device can be used not only for spin-drying 5-inch wafers 310, but also for spin-drying 3-inch wafers 310, thereby enabling the spin-drying device to be used for spin-drying wafers 310 of various sizes.

[0056] It should be noted that the placement of a 3-inch wafer 310 in the wafer 310 placement position and the matching of the external dimensions of the support body 110 with the spin-drying tank of the 5-inch wafer 310 spin-drying device are merely one embodiment of this application and do not constitute a limitation on the internal and external dimensions of the support body 110. Those skilled in the art can make specific settings based on the specific dimensions of the spin-drying device and the dimensions of the wafer 310 to be cleaned. Furthermore, for the same external dimension, multiple support bodies 110 with different internal dimensions can be provided. For example, when the spin-drying device is 8 inches, the external dimension of the support body 110 is 8 inches, and the internal dimension can be 5 inches or 3 inches.

[0057] This application also discloses a spin-drying device, including a spin-drying device body and the aforementioned wafer spin-drying bracket 100. The spin-drying device has a spin-drying groove inside, and the wafer spin-drying bracket 100 is placed in the spin-drying groove to spin-dry the wafers 310 in the wafer cassette 210 during spin-drying. This spin-drying device has the same structure and beneficial effects as the wafer spin-drying bracket 100 in the foregoing embodiments. The structure and beneficial effects of the wafer spin-drying bracket 100 have been described in detail in the foregoing embodiments and will not be repeated here.

[0058] The above description is merely a preferred embodiment of this application and is not intended to limit this application. Various modifications and variations can be made to this application by those skilled in the art. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.

Claims

1. A wafer spin dryer, characterized in that, The device includes a support body with an internal mounting groove for mounting a wafer cassette. The external dimensions of the support body match the dimensions of the spin-drying groove of the spin-drying device. One side of the support body has an opening for the wafer cassette to enter the mounting groove. Limiting components are provided on both sides of the support body perpendicular to the mounting direction of the wafer cassette to limit the position of the wafer cassette after it enters the mounting groove.

2. The wafer spin dryer according to claim 1, characterized in that, The limiting component includes a limiting rod, and the wafer box is provided with a limiting groove corresponding to the limiting rod. When the wafer box is placed in the mounting groove, the limiting rod extends into the limiting groove, and both ends of the limiting rod are respectively connected to the bracket body.

3. The wafer spin dryer according to claim 2, characterized in that, One end of the limiting rod is rotatably connected to the bracket body. When the limiting rod rotates to extend into the limiting groove, the other end of the limiting rod extends into the slot provided on the bracket body.

4. The wafer spin dryer according to claim 2, characterized in that, When the limiting rod is engaged in the limiting groove, the limiting rod abuts against the side wall of the limiting groove.

5. The wafer spin dryer according to claim 3, characterized in that, The limiting rod is connected to the bracket body via a rotating shaft.

6. The wafer spin dryer according to claim 2, characterized in that, The bracket body includes two hollow plates arranged opposite each other and a connecting block connecting the same side of the hollow plates. The ends of the two hollow plates extend outward toward the middle with protrusions. The hollow plates, the protrusions and the connecting block surround and form the mounting groove.

7. The wafer spin dryer according to claim 6, characterized in that, The two limiting rods are respectively disposed at both ends of the hollow plate, and the two connecting blocks are respectively disposed at both ends of the hollow plate.

8. The wafer spin dryer according to claim 1, characterized in that, The support body has a rectangular cross-section perpendicular to the wafer box mounting direction, and multiple wafer placement positions are arranged sequentially along the long side of the rectangle on the wafer box.

9. The wafer spin dryer according to claim 8, characterized in that, The wafer placement position is used to place 3-inch wafers, and the external dimensions of the support body are matched with the spin-drying tank of the 5-inch wafer spin-drying device.

10. A spin-drying device, characterized in that, Includes the wafer spin dryer as described in any one of claims 1-9.

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