Wafer processing equipment

Abstract

The invention relates to the field of semiconductor manufacturing, and discloses wafer processing equipment which comprises a base and a first motor and further comprises a sliding seat, a containing groove and a negative pressure groove which are concentrically distributed inside and outside are formed in the front face of the sliding seat, a wafer body is placed in the containing groove, and a through opening is formed in the bottom of the negative pressure groove. An annular cavity communicating with the through opening is formed in the sliding base, and a communicating hole communicating with the annular cavity is formed in the left side of the sliding base. According to the device, air is pumped into the communicating hole and the annular cavity through the fan and the communicating pipe, negative pressure is generated in the through hole, air in a contact gap between the film material pressed by the pressing blocks and the connecting plate is pumped away until the upper surface of the whole wafer body is fully paved with the pressing blocks, at the moment, the cutter wheel just enters the negative pressure groove, and the outer side of the film material is rotationally cut; by means of the design, it can be guaranteed that all parts are evenly stressed when the wafer body is subjected to film pasting, and the possibility of bubble generation is reduced.

Description

A wafer processing equipment Technical Field

[0001] This application relates to the field of semiconductor manufacturing technology, and more particularly to a wafer processing equipment. Background Technology

[0002] Wafers are the fundamental material in semiconductor manufacturing processes. The core manufacturing processes typically include wafer preparation, oxidation, thin film deposition, photolithography, etching, ion implantation, annealing, chemical mechanical planarization, metallization, and interconnection. These steps need to be repeated multiple times to build complex circuits. In the wafer production process, after the wafer ingot undergoes operations such as outer diameter submersion and slicing, it needs to be coated with a film. This involves attaching thin film materials (such as blue film, UV film, PET substrate film, etc.) to the wafer surface to protect it from contamination, oxidation, or other damage. These films can cover the wafer and adhere tightly to it, providing a protective barrier. Current coating machines mainly rely on linear motors to move the wafer carrier back and forth to the coating area. Regarding the position and feeding position, when the thin film material moves above the wafer through the roller structure, the pressure roller makes the thin film material and the wafer surface contact and bond together, then the edge of the film is cut, and finally the rolling is performed again. However, when the film first contacts the wafer surface, gaps and bubbles can easily appear between the thin film material and the wafer. This is because the rolling process needs to move horizontally from one side of the wafer surface to the other, and the film contacts the wafer surface linearly. The rolling process can easily cause uneven force between the film and the wafer surface, resulting in gaps and bubbles. Therefore, the film application method and corresponding structure of the thin film material need to be changed. This application aims to solve the above defects and redesign a wafer processing equipment. Summary of the Invention

[0003] This application proposes a wafer processing equipment with the advantage of good film coating effect, which solves the problem of unsatisfactory film coating effect caused by uneven roller pressure in the prior art.

[0004] To achieve the above objectives, this application adopts the following technical solution: A wafer processing equipment, comprising a base and a motor, further comprising: a feeding mechanism mounted on the front of the base, and comprising a guide roller, a discharge roller, a guide roller 2, and a recovery roller, wherein a thin film material is mounted on the outer side of the guide roller 1, the discharge roller, the guide roller 2, and the recovery roller; a slide, wherein the front of the slide has concentrically distributed placement grooves and negative pressure grooves, wherein a wafer body is placed inside the placement grooves, and an opening is provided at the bottom of the negative pressure grooves; the interior of the slide has... The system includes an annular cavity communicating with a passageway. A connecting hole communicating with the annular cavity is provided on the left side of the slide block, and a fan is connected to the left side of the slide block. A telescopic rod is installed on the rear side of the base. A top plate is installed at the telescopic end of the telescopic rod. A connecting plate is rotatably installed inside the top plate. A second motor is installed on the top of the top plate. A connecting column is fixedly connected to the bottom of the connecting plate. A limit ring is fixedly installed on the outer surface of the connecting column. A cutter wheel is installed at the bottom of the connecting column. A sliding mechanism located at the top of the limit ring is movably sleeved on the outer surface of the connecting column. The slide plate has a pressure block fixedly connected to its bottom. This device achieves efficient and bubble-free wafer lamination by incorporating the pressure block. To achieve this, the device features concentrically distributed placement slots and negative pressure slots on the top of the slide base. The wafer is placed in the placement slots, and the negative pressure slots have an annular cavity connected to the inside of the slide base. Connecting posts and limiting rings provide limiting support for the slide plate. When the telescopic rod moves the top plate and connecting posts downwards, the pressure block automatically moves downwards under its own weight. When the pressure block contacts the thin film material... The design of its bottom arc ensures that the thin film material, located directly above the wafer body, is applied evenly from the center outwards. Then, air is drawn into the connecting hole and annular cavity through a fan and connecting pipe, generating negative pressure in the opening. This pressure block presses the thin film material and removes the air from the gap between the contact plate and the connecting plate until the pressure block covers the entire upper surface of the wafer body. At this point, the cutting wheel enters the negative pressure groove and rotates to cut the outer side of the thin film material. This design ensures that the wafer body is subjected to balanced force on all parts during film application and reduces the possibility of air bubbles.

[0005] Then, the device uses a rubber ring to support the film material directly below, forming a seal. When the fan starts, the sealing ring and the connecting pipe are squeezed and deformed to form a seal, and negative pressure is generated in the annular cavity, the port and the negative pressure groove. When the pressure block moves down synchronously, the negative pressure will continue to act on the annular gap formed between the film material and the upper surface of the wafer body after being pressed by the pressure block, and will continue to suck up the remaining air in the gap. As the pressure block continues to press the film material down, the diameter of the annular gap will become larger and larger until it completely covers the upper surface of the wafer body. At this time, the film material forms a highly efficient film-applying function by utilizing the seal formed between the rubber ring and the slide. It can complete the film-applying operation without roller pressing, and the working efficiency is high.

[0006] Preferably, the top of the base is provided with a slide rail and a linear motor, and the slide block is driven to slide by the slide rail and the linear motor. The fan is installed on the left side of the base, and the exhaust end of the fan is fixedly connected to a connecting pipe. A sealing ring is fixedly connected inside the connecting hole, and the right end of the connecting pipe is inserted into the inside of the connecting hole and presses against the sealing ring. As shown in Figures 1 and 2, the slide block is driven by a linear motor and is slidably supported by the slide rail, driving the slide block to move horizontally and slide back and forth between the film application position and the material feeding position.

[0007] Preferably, the film material passes downward along the outer surface of the discharge roller, through guide roller one, and horizontally to the left, passing the top of the slide block. The film material then passes through guide roller two and finally wraps upward around the outer surface of the recovery roller. A rubber ring is glued to the top of the slide block, and the bottom of the slide block abuts against the rubber ring. As shown in Figure 1, this device uses the rubber ring to abut and support the film material directly below, forming a seal. When the fan starts, the sealing ring and the connecting pipe are squeezed and deformed to form a seal, and negative pressure is generated in the annular cavity, the through-hole, and the negative pressure groove. When the pressure block moves down synchronously, the negative pressure will continue to act on the annular gap formed between the film material and the upper surface of the wafer body after being pressed by the pressure block, and will continue to suck up the remaining air in the gap. As the pressure block continues to press the film material downward, the diameter of the annular gap will become larger and larger until it completely covers the upper surface of the wafer body. At this time, the film material forms a highly efficient film-applying function by utilizing the seal formed between the rubber ring and the slide block. It can complete the film-applying operation without roller pressing, resulting in high work efficiency.

[0008] Preferably, the bottom of the pressing block is arc-shaped, the pressing block is made of silicone rubber, and the pressing block is soft in nature. The soft silicone rubber properties of the pressing block enable it to uniformly generate outward expansion deformation when pressing the thin film material onto the upper surface of the wafer body, and gradually cover the entire upper surface of the wafer body. This allows the thin film material to diffuse uniformly outward from the center of the wafer body during the process of being pressed and adhered to the upper surface of the wafer body, thereby significantly improving the film adhesion quality of the wafer body.

[0009] Preferably, the connecting columns are configured in two sets and symmetrically distributed on both sides of the bottom of the connecting plate. The sliding plate abuts against the top of the limiting ring, and a counterweight is installed on the top of the sliding plate. As shown in Figure 3, the connecting columns are configured in two sets. When the cutting wheel installed at the bottom of the column enters the negative pressure groove, it can rotate under the drive of motor 2 and complete the cutting operation of the film material. The limiting ring set on the outer surface of the connecting column will limit and support the sliding plate, so that the sliding plate can move downward synchronously with the connecting column and the pressing block completes the pressing and film application operation of the film material before the cutting wheel enters the negative pressure groove.

[0010] Preferably, a guide post is installed on the top of the base in front of the telescopic rod, and the top plate is adapted to be connected to the outer surface of the guide post; as shown in Figure 5, the top plate is adapted to be connected to the outer surface of the guide post and is driven by the telescopic rod. The function of the guide post is to provide guidance for the top plate and ensure that the telescopic rod keeps the top plate stable when it moves up and down.

[0011] Preferably, the output shaft of the second motor is connected to the connecting plate for transmission, and the bottom of the cutting wheel is vertically opposite to the negative pressure groove. As shown in Figure 5, when the top plate and the cutting wheel move downward to the negative pressure groove under the drive of the telescopic rod, they need to cut the film material by rotation. Therefore, the second motor is set on the top of the top plate so that it can drive the connecting plate, the connecting column and the cutting wheel to revolve and complete the cutting action.

[0012] Preferably, the first motor is located on the back of the base, and the output shaft of the first motor is connected to the recycling roller. As shown in Figure 5, the first motor is located on the left side of the back of the base. It is used to drive the recycling roller to rotate and drive the entire film material to move to the left. This design allows the film waste that has been cut and laminated to be wound around the outer surface of the recycling roller to complete the recycling.

[0013] Preferably, the number of ports is at least twelve, and the ports are distributed circumferentially and equally at intervals inside the negative pressure groove; as shown in Figure 5, the ports distributed circumferentially and equally at intervals can output uniform negative pressure from the outside of the wafer body to uniformly adsorb the annular gap formed between the thin film material and the wafer body.

[0014] The beneficial effects of this invention are as follows: 1. This device achieves efficient and bubble-free wafer body film application by setting up a pressure block. To achieve this, the device has concentrically distributed placement slots and negative pressure slots on the top of the slide. The wafer body is placed in the placement slots, and an annular cavity connected to the inside of the slide is opened in the negative pressure slot. The sliding plate is limited and supported by the connecting column and the limiting ring. When the telescopic rod drives the top plate and the connecting column to move downward, the pressure block moves down automatically by its own weight. When the pressure block contacts the film material, the arc design of its bottom ensures that the film material on the part directly above the wafer body contacts the material evenly from the middle to the outside. Then, the fan and the connecting pipe draw air into the connecting hole and the annular cavity, generating negative pressure in the opening. This draws away the air in the gap between the pressure block and the film material and the connecting plate until the pressure block covers the entire upper surface of the wafer body. At this time, the cutting wheel enters the negative pressure slot and rotates to cut the outer side of the film material. This design ensures that the wafer body is subjected to balanced force during film application and reduces the possibility of bubble formation.

[0015] 2. Then, the device uses a rubber ring to support the film material directly below, forming a seal. When the fan starts, the sealing ring and the connecting pipe are squeezed and deformed to form a seal, and negative pressure is generated in the annular cavity, the port and the negative pressure groove. When the pressure block moves down synchronously, the negative pressure will continue to act on the annular gap formed between the film material and the upper surface of the wafer body after being pressed by the pressure block, and will continue to draw in the remaining air in the gap. As the pressure block continues to press the film material down, the diameter of the annular gap will become larger and larger until it completely covers the upper surface of the wafer body. At this time, the film material forms a highly efficient film-applying function by utilizing the seal formed between the rubber ring and the slide. It can complete the film-applying operation without roller pressing, and the working efficiency is high. Attached Figure Description

[0016] The accompanying drawings, which form part of this specification, illustrate embodiments disclosed in this application and, together with the specification, serve to explain the principles of this application in a clear and understandable manner.

[0017] Referring to the accompanying drawings and the following detailed description, this disclosure can be more clearly understood, wherein: Figure 1 is a front view of the overall structure of the present invention; Figure 2 is a front perspective view of the overall structure of the present invention; Figure 3 is a front sectional view of the overall structure of the present invention; Figure 4 is an enlarged view of the structure at point A in Figure 3 of the present invention; Figure 5 is a side sectional view of the overall structure of the present invention; Figure 6 is an enlarged view of the structure at point B in Figure 5 of the present invention; Figure 7 is a separation diagram of the telescopic rod, top plate, guide column, motor II, connecting plate, sliding plate and pressure block of the present invention; Figure 8 is a partial separation diagram of the slide, rubber ring, fan, connecting pipe and wafer body of the present invention; Figure 9 is a schematic diagram of the wafer body surface film application sequence of the present invention.

[0018] The components are as follows: 1. Base; 2. Slide; 3. Rubber ring; 4. Fan; 5. Connecting pipe; 6. Guide roller one; 7. Discharge roller; 8. Guide roller two; 9. Recycling roller; 10. Motor one; 11. Telescopic rod; 12. Top plate; 13. Guide column; 14. Motor two; 15. Connecting plate; 16. Connecting column; 17. Limiting ring; 18. Cutter wheel; 19. Slide plate; 20. Pressure block; 21. Counterweight block; 22. Placement slot; 23. Negative pressure slot; 24. Through port; 25. Wafer body; 26. Annular cavity; 27. Connecting hole; 28. Sealing ring. Detailed Implementation

[0019] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, and not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0020] Please refer to Figures 1-9. This embodiment discloses a wafer processing equipment, including a base 1 and a motor 10, and further including: a material conveying mechanism, which is installed on the front of the base 1 and includes a guide roller 6, a discharge roller 7, a guide roller 8, and a recovery roller 9. Thin film material is installed on the outer sides of the guide roller 6, the discharge roller 7, the guide roller 8, and the recovery roller 9; a slide 2, on the front of which are concentrically distributed placement grooves 22 and negative pressure grooves 23. A wafer body 25 is placed inside the placement groove 22, and an opening 24 is opened at the bottom of the negative pressure groove 23. An annular groove communicating with the opening 24 is opened inside the slide 2. The annular cavity 26 has a connecting hole 27 on the left side of the slide 2, which communicates with the annular cavity 26. A fan 4 is connected to the left side of the slide 2. A telescopic rod 11 is installed on the rear side of the base 1. A top plate 12 is installed at the telescopic end of the telescopic rod 11. A connecting plate 15 is rotatably installed inside the top plate 12. A motor 14 is installed on the top of the top plate 12. A connecting column 16 is fixedly connected to the bottom of the connecting plate 15. A limit ring 17 is fixedly installed on the outer surface of the connecting column 16. A cutter wheel 18 is installed at the bottom of the connecting column 16. A sliding plate 19 located on the top of the limit ring 17 is movably sleeved on the outer surface of the connecting column 16. The bottom of the sliding plate 19 is fixed. The device is equipped with a pressure block 20. This device achieves efficient and bubble-free film application to the wafer body 25 by using the pressure block 20. To achieve this, the device has concentrically distributed placement slots 22 and negative pressure slots 23 on the top of the slide 2. The wafer body 25 is placed in the placement slots 22, and the negative pressure slots 23 have an annular cavity 26 connected to the inside of the slide 2. The sliding plate 19 is supported and limited by the connecting post 16 and the limiting ring 17. When the telescopic rod 11 moves the top plate 12 and the connecting post 16 downwards, the pressure block 20 automatically moves downwards by its own weight. When the pressure block 20 contacts the thin film material... The design of its bottom arc ensures that the thin film material on the part directly above the wafer body 25 is evenly applied from the center outwards. Then, the fan 4 and the connecting pipe 5 draw air into the connecting hole 27 and the annular cavity 26, generating negative pressure in the through-hole 24. This pressure block 20 presses the thin film material and removes the air from the gap between it and the connecting plate 15 until the pressure block 20 covers the entire upper surface of the wafer body 25. At this time, the cutting wheel 18 enters the negative pressure groove 23 and rotates to cut the outer side of the thin film material. This design ensures that the wafer body 25 is subjected to balanced force during film application and reduces the possibility of air bubbles.

[0021] Then, the device uses the rubber ring 3 to abut and support the film material directly below to form a seal. When the fan 4 is started, the sealing ring 28 and the connecting pipe 5 are squeezed and deformed to form a seal, and negative pressure is generated in the annular cavity 26, the through 24 and the negative pressure groove 23. When the pressure block 20 moves down synchronously, the negative pressure will continue to act on the annular gap formed between the film material after it is pressed by the pressure block 20 and the upper surface of the wafer body 25, and will continue to suck up the remaining air in the gap. As the pressure block 20 continues to press the film material down, the diameter of the annular gap will become larger and larger until it completely covers the upper surface of the wafer body 25. At this time, the film material forms a highly efficient film-applying function by utilizing the seal formed between the rubber ring 3 and the slide 2. It can complete the film-applying operation without roller pressing, and the working efficiency is high.

[0022] In this embodiment, a slide rail and a linear motor are provided on the top of the base 1, and the slide block 2 is driven to slide by the slide rail and the linear motor. The fan 4 is installed on the left side of the base 1. The exhaust end of the fan 4 is fixedly connected to a connecting pipe 5. A sealing ring 28 is fixedly connected inside the connecting hole 27. The right end of the connecting pipe 5 is inserted into the inside of the connecting hole 27 and presses against the sealing ring 28. As shown in Figures 1 and 2, the slide block 2 is driven by a linear motor and is slidably supported by the slide rail, which drives the slide block 2 to move horizontally and slide back and forth between the film application position and the material feeding position.

[0023] In this embodiment, the film material passes downward along the outer surface of the discharge roller 7, then passes horizontally to the left, over the top of the slide block 2. After passing the second guide roller 8, the film material finally wraps upward around the outer surface of the recovery roller 9. A rubber ring 3 is glued to the top of the slide block 2, and the bottom of the slide block 2 abuts against the rubber ring 3. As shown in Figure 1, this device utilizes the rubber ring 3 to abut and support the film material directly below, forming a seal. When the blower 4 starts, the sealing ring 28 and the connecting pipe 5 are squeezed and deformed to form a seal, and this seal is achieved in the annular cavity 26, the opening 24, and the negative... A negative pressure is generated in the pressure groove 23. When the pressure block 20 moves down synchronously, the negative pressure will continue to act on the annular gap formed between the thin film material after it is pressed by the pressure block 20 and the upper surface of the wafer body 25, and will continue to draw out the remaining air in the gap. As the pressure block 20 continues to press the thin film material down, the diameter of the annular gap will become larger and larger until it completely covers the upper surface of the wafer body 25. At this time, the thin film material forms a highly efficient film application function by utilizing the seal formed between the rubber ring 3 and the slide 2. It can complete the film application operation without roller pressing, and the working efficiency is high.

[0024] In this embodiment, the bottom of the pressure block 20 is arc-shaped and made of silicone rubber. The pressure block 20 is soft and specially designed. The soft silicone rubber properties of the pressure block 20 enable it to uniformly generate outward expansion deformation when pressing the thin film material onto the upper surface of the wafer body 25, and gradually cover the entire upper surface of the wafer body 25. This allows the thin film material to diffuse uniformly outward from the center of the wafer body 25 during the process of being pressed and adhered to the upper surface of the wafer body 25 by the pressure block 20, thereby significantly improving the film adhesion quality of the wafer body 25.

[0025] In this embodiment, the connecting posts 16 are set in two groups and symmetrically distributed on both sides of the bottom of the connecting plate 15. The sliding plate 19 abuts against the top of the limiting ring 17, and a counterweight block 21 is installed on the top of the sliding plate 19. As shown in Figure 3, the connecting posts 16 are set in two groups. When the cutting wheel 18 installed at the bottom of the connecting posts enters the negative pressure groove 23, it can rotate under the drive of the motor 14 and complete the cutting operation of the film material. The limiting ring 17 set on the outer surface of the connecting posts 16 will limit and support the sliding plate 19, so that the sliding plate 19 can move downward synchronously with the connecting posts 16, and the pressing block 20 completes the pressing and film application operation of the film material before the cutting wheel 18 enters the negative pressure groove 23.

[0026] In this embodiment, a guide post 13 located in front of the telescopic rod 11 is installed on the top of the base 1, and the top plate 12 is adapted to be connected to the outer surface of the guide post 13. As shown in Figure 5, the top plate 12 is adapted to be connected to the outer surface of the guide post 13 and is driven by the telescopic rod 11. The function of the guide post 13 is to provide guidance for the top plate 12 and ensure that the telescopic rod 11 maintains its stability when it drives the top plate 12 to move up and down.

[0027] In this embodiment, the output shaft of motor 14 is connected to the connecting plate 15 for transmission, and the bottom of the cutter wheel 18 is vertically opposite to the negative pressure groove 23. As shown in Figure 5, when the top plate 12 and the cutter wheel 18 move downward to the negative pressure groove 23 under the drive of the telescopic rod 11, they need to cut the film material by rotation. Therefore, motor 14 is set on the top of the top plate 12 so that it can drive the connecting plate 15, the connecting column 16 and the cutter wheel 18 to revolve and complete the cutting action.

[0028] In this embodiment, motor 10 is located on the back of base 1, and the output shaft of motor 10 is connected to the recycling roller 9. As shown in Figure 5, motor 10 is located on the left side of the back of base 1. It is used to drive the recycling roller 9 to rotate and drive the entire film material to move to the left. This design allows the film waste that has been cut and laminated to be wound around the outer surface of the recycling roller 9 to complete the recycling.

[0029] In this embodiment, the number of ports 24 is set to at least twelve, and the ports 24 are distributed circumferentially and equally at intervals inside the negative pressure groove 23. As shown in Figure 5, the ports 24 distributed circumferentially and equally at intervals can output uniform negative pressure from the outside of the wafer body 25 to uniformly adsorb the annular gap formed between the thin film material and the wafer body 25.

[0030] Working principle: When this device is working, firstly, the slide block 2 moves to the right and enters the loading position. When the wafer body 25 is installed inside the placement slot 22, the slide block 2 moves to the left until it is directly below the pressure block 20, entering the film application position. At this time, the connecting pipe 5 is inserted into the connecting hole 27 and is pressed against the sealing ring 28 to form a seal. At this time, the recovery roller 9 is started and drives the entire film material to move to the left. At this time, the film material abuts against the rubber ring 3. Then, the telescopic rod 11 is started and drives the top plate 12 and the connecting plate 1 to move to the left. 5. The cutting wheel 18 and the pressure block 20 move downwards, as shown in Figure 1. The pressure block 20 contacts the thin film material first. Due to the structural characteristics of the pressure block 20, its middle part contacts the thin film material first, located in the middle position above the slide block 2. At this time, the fan 4 is started, and air is drawn into the connecting hole 27 and the annular cavity 26 through the connecting pipe 5, as shown in Figure 3. The negative pressure inside the annular cavity 26 acts on the negative pressure groove 23 through the through port 24, thereby drawing in the air between the thin film material and the wafer body 25. As the pressure block 20 moves downwards... Its surface is evenly spread outwards, and the outer thin film material is continuously pressed. The thin film material located directly above the wafer body 25 is evenly pressed from the center outwards. During the pressing process, air is drawn in through the port 24 until the pressing block 20 is pressed between the placement groove 22 and the negative pressure groove 23. At this time, the fan 4 is stopped, and the connecting column 16 drives the cutting wheel 18 downwards to move into the negative pressure groove 23 and cut the thin film material. At this time, the connecting column 16, the limiting ring 17 and the pressing block 20 are all at the lowest point. The motor is started. 14. The connecting plate 15, connecting column 16, cutting wheel 18 and pressure block 20 are driven to make circular motion. The cutting wheel 18 cuts the film material from the negative pressure groove 23 during rotation, completing the film application of the wafer body 25. Finally, the telescopic rod 11 drives the top plate 12, cutting wheel 18 and pressure block 20 to move upward and reset. The motor 10 drives the recovery roller 9 to rotate and drives the film material to the left, so that the cut film material leaves the slide 2 directly above and is ready to be applied to the next set of wafer bodies 25.

[0031] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit it. Although the present invention has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of the present invention without departing from the spirit and scope of the technical solutions of the present invention, and all such modifications or substitutions should be covered within the scope of the claims of the present invention.

Claims

1. A wafer processing device, comprising a base (1) and a motor (10), characterized in that, Also includes: The feeding mechanism is installed on the front of the base (1) and includes a guide roller (6), a discharge roller (7), a guide roller (8), and a recovery roller (9). Thin film material is installed on the outside of the guide roller (6), the discharge roller (7), the guide roller (8), and the recovery roller (9). The slide (2) has a placement groove (22) and a negative pressure groove (23) with concentric distribution on the front. The wafer body (25) is placed inside the placement groove (22). The bottom of the negative pressure groove (23) has a through-hole (24). The slide (2) has an annular cavity (26) communicating with the through-hole (24) inside. The left side of the slide (2) has a connecting hole (27) communicating with the annular cavity (26). A fan (4) is connected to the left side of the slide (2); a telescopic rod (11) is installed on the rear side of the base (1), a top plate (12) is installed at the telescopic end of the telescopic rod (11), a connecting plate (15) is rotatably installed inside the top plate (12), a motor (14) is installed on the top of the top plate (12), a connecting column (16) is fixedly connected to the bottom of the connecting plate (15), a limit ring (17) is fixedly installed on the outer surface of the connecting column (16), a cutter wheel (18) is installed at the bottom of the connecting column (16), a sliding plate (19) located on the top of the limit ring (17) is movably sleeved on the outer surface of the connecting column (16), and a pressure block (20) is fixedly connected to the bottom of the sliding plate (19).

2. The wafer processing equipment according to claim 1, characterized in that, The top of the base (1) is provided with a slide rail and a linear motor, and the slide block (2) is driven to slide by the slide rail and the linear motor. The fan (4) is installed on the left side of the base (1). The exhaust end of the fan (4) is fixedly connected to a connecting pipe (5). A sealing ring (28) is fixedly connected inside the connecting hole (27). The right end of the connecting pipe (5) is inserted into the inside of the connecting hole (27) and presses against the sealing ring (28).

3. The wafer processing equipment according to claim 2, characterized in that, The film material passes downward along the outer surface of the discharge roller (7) and then horizontally to the left and passes over the top of the slide block (2). The film material passes through the second guide roller (8) and finally wraps upward around the outer surface of the recycling roller (9). A rubber ring (3) is glued to the top of the slide block (2), and the bottom of the slide block (2) abuts against the rubber ring (3).

4. The wafer processing equipment according to claim 3, characterized in that, The bottom of the pressure block (20) is arc-shaped, the pressure block (20) is made of silicone rubber, and the pressure block (20) is soft and specially made.

5. The wafer processing equipment according to claim 4, characterized in that, The connecting columns (16) are set in two groups and symmetrically distributed on both sides of the bottom of the connecting plate (15). The sliding plate (19) abuts against the top of the limiting ring (17). A counterweight (21) is installed on the top of the sliding plate (19).

6. A wafer processing equipment according to claim 5, characterized in that, The top of the base (1) is equipped with a guide post (13) located in front of the telescopic rod (11), and the top plate (12) is adapted to fit the outer surface of the guide post (13).

7. A wafer processing equipment according to claim 6, characterized in that, The output shaft of the second motor (14) is connected to the connecting plate (15) for transmission, and the bottom of the cutter wheel (18) is vertically opposite to the negative pressure groove (23).

8. A wafer processing equipment according to claim 7, characterized in that, The motor (10) is located on the back of the base (1), and the output shaft of the motor (10) is connected to the recycling roller (9) via a transmission.

9. A wafer processing equipment according to claim 8, characterized in that, The opening (24) is set to at least twelve groups, and multiple groups of the opening (24) are distributed circumferentially and equally at intervals inside the negative pressure groove (23).

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