Coaxial contact, high-frequency signal connector and semiconductor testing device

Abstract

The invention provides a coaxial contact, a high-frequency signal connector and a semiconductor testing device. The coaxial contact comprises: a first inner conductor; the first annular dielectric body is formed on the outer wall of the first inner conductor; the first outer conductor sleeves the outer wall of the first annular dielectric body, and a first sleeving ring groove is formed in the outer peripheral wall of the first outer conductor; the first outer conductor and the first inner conductor are coaxially arranged; the first floating elastic ring comprises a first elastic ferrule and a first floating clamping piece, the first elastic ferrule is located in the first sleeving ring groove and connected to the first outer conductor in a sleeving mode, the first floating clamping piece is arranged on the peripheral wall of the first elastic ferrule in a protruding mode, and the first floating clamping piece is used for being clamped into the clamping groove of the first shell when the coaxial contact piece is installed in the first shell; therefore, the coaxial contact element has good floating performance in the first shell, and the butt-joint fault-tolerant capability of the coaxial contact element is improved.

Description

Technical Field

[0001] This invention relates to the technical field of semiconductor testing, and in particular to a coaxial contact, a high-frequency signal connector, and a semiconductor testing apparatus. Background Technology

[0002] With the development of semiconductor testing equipment, the performance requirements for high-frequency signal connectors within systems are constantly increasing. Existing high-frequency signal connectors use surface-mount pins or differential pair wiring. When the contact spacing decreases and the signal rate increases, high-frequency signal connectors are prone to crosstalk and impedance discontinuities.

[0003] Furthermore, the aforementioned high-frequency signal connectors, when densely arranged, suffer from increased coupling between contacts, resulting in bandwidth limitations and making it difficult to operate stably in frequency bands above 10GHz. Summary of the Invention

[0004] The purpose of this invention is to overcome the shortcomings of the prior art and provide a coaxial contact, a high-frequency signal connector, and a semiconductor testing device that are less prone to crosstalk and impedance discontinuity problems and can operate stably in the frequency band above 10 GHz.

[0005] The objective of this invention is achieved through the following technical solution: A coaxial contact element, comprising: First inner conductor; A first annular dielectric body formed on the outer wall of the first inner conductor; A first outer conductor is sleeved on the outer wall of the first annular dielectric body, and a first sleeve groove is formed on the outer peripheral wall of the first outer conductor; the first outer conductor and the first inner conductor are coaxially arranged. The first floating elastic ring includes a first elastic collar and a first floating clip. The first elastic collar is located in the first sleeve ring groove and sleeved on the first outer conductor. The first floating clip protrudes from the outer peripheral wall of the first elastic collar. The first floating clip is used to be engaged in the clip groove of the first housing when the coaxial contact is installed in the first housing.

[0006] In one embodiment, the material of the first annular medium is at least one of PEI, PTFE, or PFA.

[0007] In one embodiment, the outer peripheral wall of the first inner conductor is formed with a first limiting step, which abuts against one end of the first annular dielectric body.

[0008] In one embodiment, the inner peripheral wall of the first outer conductor is formed with a second limiting step, which abuts against the other end of the first annular dielectric body.

[0009] In one embodiment, the first floating card and the first elastic collar are integrally formed; and / or, In one embodiment, the first floating elastic ring is a ring-shaped metal elastomer.

[0010] In one embodiment, the first elastic collar has a clearance notch, and the first floating card protrudes from the inner wall of the clearance notch; and / or, In one embodiment, the number of floating springs is plurality of them, and the plurality of floating springs are spaced apart along the outer peripheral wall of the first elastic collar; and / or, In one embodiment, the first elastic collar is wound into the first collar groove.

[0011] In one embodiment, the insertion end of the first outer conductor has a plurality of opening slots, and the plurality of opening slots are distributed at intervals along the circumference of the first outer conductor.

[0012] A high-frequency signal connector includes a first housing and a plurality of coaxial contacts as described in any of the above embodiments. The first housing has a plurality of first mounting holes, and the plurality of coaxial contacts are disposed one-to-one in the plurality of first mounting holes. The inner wall of each first mounting hole has a slot, and a first floating card of each coaxial contact is inserted into the slot. The frequency of the high-frequency signal connector is greater than or equal to 20 GHz.

[0013] In one embodiment, a plurality of the coaxial contacts are arranged side by side, and the distance between two adjacent coaxial contacts is 4mm to 4.2mm.

[0014] A semiconductor testing apparatus includes the high-frequency signal connector described in any of the above embodiments.

[0015] Compared with the prior art, the present invention has at least the following advantages: 1. In the coaxial contact described above, since the first annular dielectric body is formed on the outer wall of the first inner conductor, and the first outer conductor is sleeved on the outer wall of the first annular dielectric body, and the outer peripheral wall of the first outer conductor is formed with a first sleeve groove; the first outer conductor and the first inner conductor are coaxially arranged, so that the impedance of the signal path of the coaxial contact is relatively constant and has good shielding performance. Even when densely arranged, it can still ensure extremely low crosstalk and is not prone to crosstalk and impedance discontinuity problems. 2. Since the first elastic collar is located in the first sleeve groove and sleeved on the first outer conductor, and the first floating card protrudes from the outer peripheral wall of the first elastic collar, when the coaxial contact is installed into the first housing, the first floating card is inserted into the slot of the first housing, so that the coaxial contact has good floating performance in the first housing and improves the docking fault tolerance of the coaxial contact.

[0016] 3. High-frequency signal connectors using the coaxial contacts described above can operate stably in frequency bands above 10GHz because the coaxial connectors can still ensure extremely low crosstalk even when densely arranged. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of the present invention, the accompanying drawings used in the embodiments will be briefly introduced below. It should be understood that the following drawings only show some embodiments of the present invention and should not be regarded as a limitation on the scope. For those skilled in the art, other related drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 An exploded view of a semiconductor testing apparatus according to an embodiment. Figure 2 for Figure 1 A schematic diagram of the semiconductor testing device from another perspective; Figure 3 for Figure 2 A schematic diagram showing the insertion of the coaxial contact of the high-frequency signal connector of the semiconductor testing device into the female contact of the female connector. Figure 4 for Figure 3 A schematic diagram of the coaxial contact shown; Figure 5 To adopt Figure 1 A schematic diagram of the return loss test of the coaxial contact of the high-frequency signal connector of the semiconductor test apparatus shown. Figure 6 for Figure 2 A schematic diagram of the female contact of the female connector of the semiconductor testing device shown. Figure 7 for Figure 3 A partial schematic diagram of the connection shown; Figure 8 for Figure 2 A schematic diagram of the first elastic collar of the coaxial contact of the high-frequency signal connector of the semiconductor testing device shown. Detailed Implementation

[0019] To facilitate understanding of the present invention, a more complete description will be given below with reference to the accompanying drawings. Preferred embodiments of the invention are shown in the drawings. However, the invention can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of the invention.

[0020] It should be noted that when an element is referred to as being "fixed to" another element, it can be directly attached to the other element or there may be an intervening element. When an element is referred to as being "connected to" another element, it can be directly connected to the other element or there may be an intervening element. The terms "vertical," "horizontal," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only possible implementation.

[0021] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. The terminology used herein in the description of the invention is for the purpose of describing particular embodiments only and is not intended to be limiting of the invention. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0022] This application provides a coaxial contact, comprising: a first inner conductor; and / or, a first annular dielectric body formed on the outer wall of the first inner conductor; and / or, a first outer conductor sleeved on the outer wall of the first annular dielectric body; and / or, a first sleeve groove formed on the outer peripheral wall of the first outer conductor; and / or, the first outer conductor and the first inner conductor being coaxially disposed; and / or, a first floating elastic ring, including a first elastic collar and a first floating clip; and / or, the first elastic collar being located in the first sleeve groove and sleeved on the first outer conductor; and / or, the first floating clip protruding from the outer peripheral wall of the first elastic collar; and / or, the first floating clip being used to engage with a slot in the first housing when the coaxial contact is installed in the first housing.

[0023] The aforementioned coaxial contact, with the first annular dielectric body formed on the outer wall of the first inner conductor and the first outer conductor sleeved on the outer wall of the first annular dielectric body, and the outer peripheral wall of the first outer conductor forming a first socket groove; the first outer conductor and the first inner conductor are coaxially arranged, making the impedance of the signal path of the coaxial contact relatively constant and having good shielding performance. Even with dense arrangement, it can still ensure extremely low crosstalk and is less prone to crosstalk and impedance discontinuity problems. Since the first elastic collar is located in the first socket groove and sleeved on the first outer conductor, and the first floating card protrudes from the outer peripheral wall of the first elastic collar, when the coaxial contact is installed in the first housing, the first floating card engages in the slot of the first housing, giving the coaxial contact good floating performance within the first housing and improving the mating tolerance of the coaxial contact. High-frequency signal connectors using the aforementioned coaxial contact can operate stably in frequency bands above 10GHz because the coaxial connector can still ensure extremely low crosstalk even with dense arrangement.

[0024] To better understand the technical solution and beneficial effects of this application, the following detailed description is provided in conjunction with specific embodiments: like Figures 1 to 7 As shown, a high-frequency signal connector 100 of one embodiment includes a first housing 110 and a plurality of coaxial contacts 120. The first housing 110 has a plurality of first mounting holes 102, and the plurality of coaxial contacts 120 are disposed one-to-one within the plurality of first mounting holes 102. The frequency of the high-frequency signal connector 100 is greater than or equal to 20 GHz.

[0025] In one embodiment, the coaxial contact 120 includes a first inner conductor 121, a first annular dielectric body 122, a first outer conductor 123, and a first floating elastic ring 124. The first annular dielectric body 122 is formed on the outer wall of the first inner conductor 121; the first outer conductor 123 is sleeved on the outer wall of the first annular dielectric body 122; and the first outer conductor 123 is coaxially arranged with the first inner conductor 121.

[0026] Furthermore, the first floating elastic ring 124 includes a first elastic collar 1242 and a first floating clip 1244. A first connecting ring groove 1232 is formed on the outer peripheral wall of the first outer conductor 123. The first elastic collar 1242 is located within the first connecting ring groove 1232 and is sleeved on the first outer conductor 123. The first floating clip 1244 protrudes from the outer peripheral wall of the first elastic collar 1242.

[0027] Furthermore, the first floating card 1244 is used to engage with the slot 103 of the first housing 110 when the coaxial contact 120 is installed into the first housing 110. In this embodiment, the first housing 110 has a plurality of first mounting holes 102, and the inner wall of each first mounting hole 102 has a slot 103, into which the first floating card 1244 of each coaxial contact 120 engages.

[0028] The aforementioned high-frequency signal connector 100 and its coaxial contact 120, since the first annular dielectric 122 is formed on the outer wall of the first inner conductor 121, and the first outer conductor 123 is sleeved on the outer wall of the first annular dielectric 122, and the outer peripheral wall of the first outer conductor 123 has a first sleeve groove 1232; the first outer conductor 123 and the first inner conductor 121 are coaxially arranged, so that the impedance of the signal path of the coaxial contact 120 is relatively constant and has good shielding performance. Even when densely arranged, it can still ensure extremely low crosstalk and is not prone to crosstalk and impedance discontinuity problems; since the first elastic collar 1242 is located in the first sleeve groove 1232 and sleeved on the first outer conductor 123, the first floating card 1244 The first floating clip 1244, protruding from the outer peripheral wall of the first elastic ring 1242, engages with the slot 103 of the first housing 110 when the coaxial contact 120 is installed in the first housing 110. This allows the coaxial contact 120 to have good floating performance within the first housing 110, enabling it to float in both radial and lateral directions. When the coaxial contact 120 is plugged into or unplugged from the female connector 200 of the semiconductor testing device 10, even if a certain amount of lateral or axial deviation occurs, the floating provided by the first floating elastic ring 124 can automatically compensate, allowing the first inner conductor 121 to smoothly align with the corresponding hole, thus improving the mating tolerance and reliability of the coaxial contact 120. The high-frequency signal connector 100 using the aforementioned coaxial contact 120 can maintain extremely low crosstalk even when the coaxial connectors are densely arranged, enabling stable operation in frequency bands above 10 GHz.

[0029] Furthermore, after return loss testing, the results were as follows: Figure 5 The diagram shown illustrates the return loss test. (Combined with...) Figure 5 It can be seen that by the dense arrangement of coaxial contacts 120, the signal crosstalk between any adjacent coaxial contacts 120 is less than -60dB, thereby enabling the overall bandwidth of the high-frequency signal connector 100 to reach 20GHz.

[0030] like Figures 1 to 2 As shown, in one embodiment, the high-frequency signal connector 100 is a male connector, and the high-frequency signal connector 100 is plugged into and detached from the female connector 200 of the semiconductor testing device 10 to enable the high-frequency signal connector 100 to transmit signals. See also... Figure 6 and Figure 7 In this embodiment, the female connector 200 includes a second housing 210 and a plurality of female contacts 220. The second housing 210 forms a plurality of second mounting holes 202, and the plurality of female contacts 220 are fitted one-to-one into the plurality of second mounting holes 202. When the high-frequency signal connector 100 is plugged into the female connector 200 of the semiconductor test device 10, the plurality of female contacts 220 are plugged into the plurality of coaxial contacts 120 one-to-one. Conversely, when the high-frequency signal connector 100 is disconnected from the female connector 200 of the semiconductor test device 10, the plurality of female contacts 220 are disconnected from the plurality of coaxial contacts 120 one-to-one.

[0031] See also Figure 6 and Figure 7 Furthermore, each female contact 220 includes a second inner conductor 221, a second annular dielectric 222, and a second outer conductor 223. The second annular dielectric 222 is formed on the outer peripheral wall of the second inner conductor 221, and the second outer conductor 223 is sleeved on the outer wall of the second annular dielectric 222. One end of the second outer conductor 223 has a plug-in port 2231, and the end of the second inner conductor 221 extends into the plug-in port 2231. The end of the second inner conductor 221 has a signal socket 2211. The plug-in port 2231 is used to insert the plug-in end of the first outer conductor 123 when it is plugged into the coaxial contact 120. The first inner conductor 121 is inserted into the signal socket 2211, so that the high-frequency signal connector 100 is plugged into and plugged into the female connector 200 of the semiconductor test device 10.

[0032] like Figure 3 and Figure 4 As shown, furthermore, the first inner conductor 121, i.e. the center pin, of each coaxial contact 120 is made of gold-plated beryllium copper material to ensure the elasticity and conductivity of the first inner conductor 121.

[0033] like Figure 3 and Figure 4 , Figure 6 As shown, in one embodiment, a first limiting step 1211 is formed on the outer peripheral wall of the first inner conductor 121. The first limiting step 1211 abuts against one end of the first annular dielectric 122 to prevent the first annular dielectric 122 from detaching from the first inner conductor 121 in the direction of the first limiting step 1211 when the high-frequency signal connector 100 is plugged into the female connector 200 of the semiconductor test device 10, so that the first annular dielectric 122 is reliably limited and assembled in the first inner conductor 121.

[0034] like Figure 3 and Figure 4 , Figure 6As shown, in one embodiment, a second limiting step 1233 is formed on the inner peripheral wall of the first outer conductor 123. The second limiting step 1233 abuts against the other end of the first annular dielectric 122 to prevent the first annular dielectric 122 from detaching from the first inner conductor 121 and the outer conductor in the direction of the second limiting step 1233 when the high-frequency signal connector 100 is disconnected from the female connector 200 of the semiconductor test device 10. In addition, the first limiting step 1211 abuts against one end of the first annular dielectric 122, thereby making the first annular dielectric 122 more reliably limited and assembled to the first inner conductor 121.

[0035] like Figure 3 and Figure 4 As shown, in one embodiment, the first floating card 1244 and the first elastic collar 1242 are integrally formed, making the structure of the first floating elastic collar 1244 more compact, while also firmly connecting the first floating card 1244 and the first elastic collar 1242 together. In this embodiment, the first floating elastic collar 124 is an integrally stamped structure. And / or, like Figure 3 and Figure 4 As shown, in one embodiment, the first floating elastic ring 124 is an annular metal elastomer, which gives the first floating elastic ring 124 better strength, and at the same time allows the first floating card 1244 of the first floating elastic ring 124 to be better elastically engaged in the card slot 103.

[0036] like Figure 4 and Figure 8 As shown, in one embodiment, the first elastic collar 1242 has a clearance notch 1243, and the first floating card 1244 protrudes from the inner wall of the clearance notch 1243. When the first floating card 1244 is pressed and deforms within the space corresponding to the clearance notch 1243, the first floating card 1244 deforms relative to the first elastic collar 1242 and is engaged in the slot 103. In this embodiment, the projection of the first floating card 1244 onto the outer peripheral wall of the first elastic collar 1242 is located within the clearance notch 1243, so that the first floating card 1244 will not interfere with the first elastic collar 1242 when deforming within the space corresponding to the clearance notch 1243, thereby improving the reliability of the deformation of the first floating card 1244 and thus improving the floating performance of the coaxial contact 120. And / or, like Figure 4 As shown, in one embodiment, the number of the first floating cards is multiple, and the multiple first floating cards are spaced apart along the outer peripheral wall of the first elastic collar 1242. This not only ensures that the coaxial contact 120 has good floating performance in at least multiple directions, but also ensures that the coaxial contact 120 is well installed into the first mounting hole 102. And / or, like Figure 4 and Figure 8 As shown, in one embodiment, the first elastic collar 1242 is wound and formed within the first sleeve groove 1232, so that the first elastic collar 1242 is well installed within the first sleeve groove 1232 and sleeved with the first outer conductor 123. In this embodiment, the first elastic collar 1242 is wound and formed within the first sleeve groove 1232, and there is a gap between the head end and the tail end of the first elastic collar 1242.

[0037] In one embodiment, the material of the first annular dielectric 122 is at least one of PEI (Polyethyleneimine), PTFE (Polytetrafluoroethylene), or PFA (Polyfluoroalkoxy), so that the dielectric constant of the first annular dielectric 122 is well adapted to the frequency requirements of the transmission signal of the high-frequency signal connector 100, while ensuring good insulation between the first inner conductor 121 and the outer conductor.

[0038] Furthermore, the characteristic impedance of the high-frequency signal connector 100 The formula is: ; in, The speed of light in a vacuum is given by a value of ; The permeability of free space, d is the relative permittivity of the material of the first annular dielectric 122 of the coaxial contact 120, D is the diameter of the first outer conductor 123 of the coaxial contact 120 in mm; d is the diameter of the first inner conductor 121 of the coaxial contact 120 in mm.

[0039] Furthermore, the first annular dielectric body 122 of each coaxial contact 120 is in close contact with the corresponding first outer conductor 123, and the characteristic impedance of each coaxial contact 120 is 50Ω, so that each coaxial contact 120 has good impedance characteristics.

[0040] Furthermore, the highest cutoff frequency of the signal that the high-frequency signal connector 100 can transmit is... The formula is: ; in, The speed of light in a vacuum is given by a value of ; d is the relative permittivity of the material of the first annular dielectric 122 of the coaxial contact 120; D is the diameter of the first outer conductor 123 of the coaxial contact 120 in mm; d is the diameter of the first inner conductor 121 of the coaxial contact 120 in mm. The highest cutoff frequency is expressed in GHz. As can be seen from the above formula, the range of the highest cutoff frequency of the signal that the high-frequency signal connector 100 can transmit mainly depends on the diameter of the first inner conductor 121 and the diameter of the first outer conductor 123 of the coaxial contact 120, as well as the relative permittivity of the material of the first annular dielectric 122 of the coaxial contact 120.

[0041] It can be understood that, under the condition that the relative permittivity of the first annular dielectric 122 material is constant, that is, under the condition that the first annular dielectric 122 material is the same, the smaller the diameter of the first inner conductor 121 and the diameter of the first outer conductor 123 of the coaxial contact 120, the higher the highest cutoff frequency of the signal that the high-frequency signal connector 100 can transmit.

[0042] In this embodiment, the material of the first annular dielectric body 122 is PTFE, which makes the relative permittivity of the material of the first annular dielectric body 122 of the coaxial contact 120 relatively low.

[0043] Furthermore, the diameter of the first outer conductor 123 is 1.3mm to 1.8mm, and the diameter of the first inner conductor 121 is 0.5mm to 0.7mm. This makes both the diameter of the first inner conductor 121 and the diameter of the first outer conductor 123 of the coaxial contact 120 relatively small. Under the condition of the same first annular dielectric 122 material, this simultaneously increases the highest cutoff frequency of the signal that the high-frequency signal connector 100 can transmit, while reducing the insertion and extraction force required for the high-frequency signal connector 100 to connect with the female connector 200 of the semiconductor testing device 10. For example, when the diameter of the first inner conductor 121 is 0.58mm, the highest cutoff frequency of the signal that the high-frequency signal connector 100 can transmit reaches 56GHz.

[0044] like Figure 4As shown, in one embodiment, the insertion end of the first outer conductor 123 is provided with a plurality of opening slots 1235. The plurality of opening slots 1235 are distributed circumferentially at intervals along the first outer conductor 123. In addition, the diameter of the first outer conductor 123 is small, and the coaxial contact 120 is floatingly connected within the first housing 110, which further reduces the insertion and extraction force required for the high-frequency signal connector 100 to be inserted and extracted with the female connector 200 of the semiconductor testing device 10, while improving the contact life of the coaxial contact 120. Through experiments, the provision of a plurality of opening slots 1235 at the insertion end of the first outer conductor 123 makes the insertion and extraction force of the insertion end of the first outer conductor 123 of a single coaxial contact 120 less than 1.5N, thereby making the combined insertion and extraction force of the multi-channel high-frequency signal connector 100 less than 100N. In this embodiment, each opening slot 1235 extends along the axial direction of the first outer conductor 123, which can better reduce the insertion and extraction force required for the high-frequency signal connector 100 to be inserted and removed from the female connector 200 of the semiconductor test device 10.

[0045] Furthermore, a gold-plated layer is formed on the outer peripheral wall of the first outer conductor 123, which reduces the contact resistance and high-frequency loss of the first outer conductor 123.

[0046] However, when the diameters of the first inner conductor 121 and the first outer conductor 123 of the coaxial contact 120 are both small, especially when the diameter of the first inner conductor 121 is small, it poses a significant challenge to the insertion and removal of the high-frequency signal connector 100, particularly during the alignment and insertion process with the female connector 200, which increases the difficulty of aligning the high-frequency signal connector 100.

[0047] like Figure 4 As shown, to reduce the difficulty of insertion and removal alignment of the high-frequency signal connector 100, the insertion end of the first outer conductor 123 of each coaxial contact 120 is a insertion flange 126, which provides better guidance and alignment for the insertion end of the first outer conductor 123 into the insertion port 2231, thereby ensuring reliable insertion of the insertion end of the first outer conductor 123 into the corresponding female contact 220. In this embodiment, the insertion end of the first outer conductor 123 of each coaxial contact 120 is a crown spring structure.

[0048] like Figure 4 and Figure 7 As shown, further, an external guide slope 2233 is formed at the opening of the plug-in port 2231. The plug-in flange 126 is inserted into the plug-in port 2231 along the external guide slope 2233, which improves the efficiency of the plug-in end of the first outer conductor 123 in plugging into the corresponding female contact 220 and the required plugging force.

[0049] like Figure 2As shown, in one embodiment, multiple coaxial contacts 120 are arranged side by side, and the distance between two adjacent coaxial contacts 120 is 4mm to 4.2mm, so that the spacing between two adjacent coaxial contacts 120 is small, and multiple coaxial contacts 120 are arranged in a better dense manner.

[0050] like Figure 1 and Figure 2 As shown, this application also provides a semiconductor testing apparatus 10, including the high-frequency signal connector 100 described in any of the above embodiments.

[0051] The aforementioned semiconductor testing device 10, because the high-frequency signal connector 100 can still ensure extremely low crosstalk even when densely arranged, is less prone to crosstalk and impedance discontinuity problems, thus improving the testing reliability of the semiconductor testing device 10; moreover, because the mating fault tolerance and reliability of the coaxial contact 120 are improved, the coaxial contact 120 and the female contact 220 of the female connector 200 have better tolerance when plugged and unplugged, improving the convenience and applicability of testing; because the coaxial connector can still ensure extremely low crosstalk even when densely arranged, it can operate stably in the frequency band above 10 GHz, avoiding problems such as test interruption or low test accuracy.

[0052] like Figures 1 to 3 , Figure 7 As shown, the semiconductor testing apparatus 10 further includes a female connector 200, which includes a second housing 210 and a plurality of female contacts 220. The second housing 210 forms a plurality of second mounting holes 202, and the plurality of female contacts 220 are fitted one-to-one into the plurality of second mounting holes 202. When the high-frequency signal connector 100 is plugged into the female connector 200 of the semiconductor testing apparatus 10, the plurality of female contacts 220 are plugged into the plurality of coaxial contacts 120 one-to-one. Conversely, when the high-frequency signal connector 100 is disconnected from the female connector 200 of the semiconductor testing apparatus 10, the plurality of female contacts 220 are disconnected from the plurality of coaxial contacts 120 one-to-one.

[0053] like Figures 1 to 3 , Figure 7As shown, each female contact 220 further includes a second inner conductor 221, a second annular dielectric body 222, and a second outer conductor 223. The second annular dielectric body 222 is formed on the outer peripheral wall of the second inner conductor 221, and the second outer conductor 223 is sleeved on the outer wall of the second annular dielectric body 222. One end of the second outer conductor 223 has a plug-in port 2231, and the end of the second inner conductor 221 extends into the plug-in port 2231. The end of the second inner conductor 221 has a signal socket 2211. The plug-in port 2231 is used to insert the plug-in end of the first outer conductor 123 when it is plugged into the coaxial contact 120. The first inner conductor 121 is inserted into the signal socket 2211, so that the high-frequency signal connector 100 is plugged into and plugged into the female connector 200 of the semiconductor test device 10. In this embodiment, the second inner conductor 221 and the second outer conductor 223 are coaxially arranged. Signal socket 2211 is formed at the end of the second inner conductor 221 adjacent to the first inner conductor 121.

[0054] like Figure 6 , Figure 7 As shown, each female contact 220 further includes a second floating elastic ring 225. The second floating elastic ring 225 includes a second elastic collar 2252 and a second floating clip 2254. The second outer conductor 223 forms a second sleeve groove 2231. The second elastic collar is located in the second sleeve groove and sleeved on the second outer conductor 223. The second floating clip protrudes from the outer peripheral wall of the second elastic collar. The second floating clip is inserted into the slot 103 of the second mounting hole 202, so that the female contact 220 has good floating performance when assembled in the second housing 210. In addition, the coaxial contact 120 has good floating performance in the first housing 110, which further improves the convenience and applicability of testing. In this embodiment, the end of the first inner conductor 121 away from the second inner conductor 221 is connected to the first external cable 20, and the end of the second inner conductor 221 away from the first inner conductor 121 is connected to the second external cable 30.

[0055] In one embodiment, the structure of the second floating elastic ring 225 is the same as that of the first floating elastic ring, the only difference being the size, which will not be described in detail here.

[0056] Compared with the prior art, the present invention has at least the following advantages: 1. In the coaxial contact 120 described above, since the first annular dielectric body 122 is formed on the outer wall of the first inner conductor 121, and the first outer conductor 123 is sleeved on the outer wall of the first annular dielectric body 122, and the outer peripheral wall of the first outer conductor 123 has a first sleeve groove 1232; the first outer conductor 123 and the first inner conductor 121 are coaxially arranged, so that the impedance of the signal path of the coaxial contact 120 is relatively constant and has good shielding performance. Even when densely arranged, it can still ensure extremely low crosstalk and is not prone to crosstalk and impedance discontinuity problems. 2. Since the first elastic collar 1242 is located in the first sleeve groove 1232 and sleeved on the first outer conductor 123, and the first floating card 1244 protrudes from the outer peripheral wall of the first elastic collar 1242, when the coaxial contact 120 is installed into the first housing 110, the first floating card 1244 is inserted into the slot 103 of the first housing 110, so that the coaxial contact 120 has good floating performance in the first housing 110, and improves the docking fault tolerance of the coaxial contact 120.

[0057] 3. The high-frequency signal connector 100 using the coaxial contact 120 described above can operate stably in the frequency band above 10GHz because the coaxial connector can still ensure extremely low crosstalk even when densely arranged.

[0058] The embodiments described above are merely illustrative of several implementations of the present invention, and while the descriptions are relatively specific and detailed, they should not be construed as limiting the scope of the invention patent. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention. Therefore, the protection scope of this invention patent should be determined by the appended claims.

Claims

1. A coaxial contact element, characterized in that, include: First inner conductor; A first annular dielectric body formed on the outer wall of the first inner conductor; A first outer conductor is sleeved on the outer wall of the first annular dielectric body, and a first sleeve groove is formed on the outer peripheral wall of the first outer conductor; the first outer conductor and the first inner conductor are coaxially arranged. The first floating elastic ring includes a first elastic collar and a first floating clip. The first elastic collar is located in the first sleeve ring groove and sleeved on the first outer conductor. The first floating clip protrudes from the outer peripheral wall of the first elastic collar. The first floating clip is used to be engaged in the clip groove of the first housing when the coaxial contact is installed in the first housing.

2. The coaxial contact element according to claim 1, characterized in that, The material of the first annular medium is at least one of PEI, PTFE or PFA.

3. The coaxial contact element according to claim 1, characterized in that, The outer peripheral wall of the first inner conductor is formed with a first limiting step, which abuts against one end of the first annular dielectric body.

4. The coaxial contact element according to claim 3, characterized in that, The inner peripheral wall of the first outer conductor is formed with a second limiting step, which abuts against the other end of the first annular dielectric body.

5. The coaxial contact element according to claim 1, characterized in that, The first floating card and the first elastic collar are integrally molded structures; and / or, The first floating elastic ring is a ring-shaped metallic elastomer.

6. The coaxial contact element according to claim 1, characterized in that, The first elastic collar has a clearance notch, and the first floating card protrudes from the inner wall of the clearance notch; and / or, The number of floating spring pieces is multiple, and the multiple floating spring pieces are spaced apart along the outer peripheral wall of the first elastic collar; and / or, The first elastic collar is wound and formed in the first collar groove.

7. The coaxial contact element according to claim 1, characterized in that, The first outer conductor has multiple opening slots at its insertion end, and these opening slots are spaced apart along the circumference of the first outer conductor.

8. A high-frequency signal connector, characterized in that, The device includes a first housing and a plurality of coaxial contacts as described in any one of claims 1 to 7. The first housing has a plurality of first mounting holes, and the plurality of coaxial contacts are disposed in the plurality of first mounting holes in a one-to-one correspondence. The inner wall of each first mounting hole has a slot, and the first floating card of each coaxial contact is inserted into the slot. The frequency of the high-frequency signal connector is greater than or equal to 20 GHz.

9. The high-frequency signal connector according to claim 8, characterized in that, Multiple coaxial contacts are arranged side by side, and the distance between two adjacent coaxial contacts is 4mm to 4.2mm.

10. A semiconductor testing apparatus, characterized in that, Includes the high-frequency signal connector as described in claim 8 or 9.

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