Bridge rectifier packaging structure and packaging method

Abstract

The invention relates to the technical field of rectifier packaging, in particular to a bridge rectifier packaging structure, which comprises a packaging shell provided with a hollow-square-shaped cavity, and an integral packaging space is formed by the packaging shell and a packaging part; and the number of the direct current output parts is two, and the two direct current output parts are vertically and symmetrically arranged in the concentric-square-shaped cavity. The direct current output part and the alternating current input part are assembled and are vertically arranged on the periphery of the concentric-square-shaped cavity of the packaging shell, the direct current output part and the alternating current input part which are vertically arranged are directly attached to the inner wall of the square shell, and heat generated in the rectification process can be conducted out through direct heat conduction of the shell. The length of the path is only the thickness of the metal sheet, the stress direction of the vertical direct-current output part and the alternating-current input part which are pressed and fixed is perpendicular to the wall of the shell, mechanical constraint is stronger, and the problems of warping and displacement of the horizontal sheet-shaped structure cannot occur when equipment is transported or vibrates during operation.

Description

A bridge rectifier packaging structure and packaging method Technical Field

[0001] This invention relates to the field of rectifier packaging technology, and in particular to a bridge rectifier packaging structure and packaging method. Background Technology

[0002] As a core power electronic device that converts alternating current (AC) to direct current (DC), the rectifier bridge is widely used in various electronic devices such as power adapters, motor drives, and household appliances. Its operational stability, heat dissipation performance, safety protection capabilities, and ease of assembly and maintenance directly determine the reliability and service life of the entire device.

[0003] In the existing technology, the core metal conductive components and rectifier elements of the rectifier bridge are mostly assembled in a horizontally placed sheet-like manner, and the connection between the metal components and the AC output terminal often relies on welding for fixation.

[0004] In terms of structure and heat dissipation, the horizontally placed sheet metal parts are limited by the layout and are mostly stacked or arranged side by side. This not only occupies a large amount of horizontal space inside the rectifier bridge, but also makes it difficult to miniaturize the product size and adapt to the development needs of portable and miniaturized electronic devices.

[0005] When using epoxy resin encapsulation, heat must first be conducted laterally inside the chip to the edge, and then transferred to the casing for dissipation. This results in a long heat transfer path, high thermal resistance, and the formation of heat accumulation zones between chips. Over long-term operation, local overheating can lead to a decrease in rectification efficiency, and may even cause malfunctions such as melting of the rectifier chip or casing. Summary of the Invention

[0006] The purpose of this invention is to provide a bridge rectifier packaging structure that features a compact layout, efficient heat dissipation, reliable connection, self-resetting overheat protection, and convenient assembly and maintenance.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a bridge rectifier packaging structure, comprising:

[0008] The packaging housing has a U-shaped cavity and forms an integral packaging space with the packaging part;

[0009] The DC output section has two parts, and the two DC output sections are arranged vertically symmetrically within the U-shaped cavity;

[0010] The AC input section has two pairs of AC input sections, which are arranged vertically symmetrically within the U-shaped cavity; and are in contact with the two DC output sections. Each pair of AC input sections has two segmented plates, which are arranged opposite to each other.

[0011] An AC electrode is fixed in an AC contact groove reserved on the encapsulation housing and makes contact with the contact apex angle on the AC input part.

[0012] It also includes a fin plate, which is disposed at the bottom of the encapsulation part. One side of the fin plate contacts one side of the DC output part, and the other side of the fin plate contacts the inner wall of the reserved groove.

[0013] Furthermore, the encapsulation housing is 3D printed. The encapsulation housing includes square protrusions on all four sides of the inner wall of the outer shell, and two open-top assembly slots are opened at the position of the AC input part. The two assembly slots are channels of the same depth as the AC contact rod slot, and there is a U-shaped assembly column in the space between two adjacent square protrusions.

[0014] It also includes a support block, which is used to support the protruding end of the DC output section.

[0015] The encapsulation shell is 3D printed, with an aluminum alloy base plate at the bottom. The aluminum alloy is hollowed out in a honeycomb pattern, and the hollowed-out honeycomb holes serve as the base fixing points. Ceramic is printed into the hollowed-out honeycomb to form the anchor points of the frame. After printing a mesh surface using the top surface of the aluminum alloy as the printing surface, the anchor points exposed on the other side of the aluminum alloy are printed using the mesh surface as the bottom surface. After printing the bottom of the shell in a mesh pattern, the inner and outer walls of the encapsulation shell are printed, and a U-shaped cavity, a pre-reserved groove, an assembly groove, and an AC contact rod groove are reserved to form an assembly column. The assembly column is printed using a full ceramic substrate. A rubber pad is fitted on the horizontal surface of the assembly column that connects to the shell, which is the position where it contacts the DC output part. During use, the rubber pad can adhere to the DC output part after being exposed to high temperatures. The assembly column and the positioning hole form a positioning and fixing relationship. During installation, the positioning hole is directly fitted onto the assembly column.

[0016] The printing material is made by mixing 15% metal powder with ceramic matrix. The 15% ratio is within the optimal range of "thermal conduction path formation threshold" and "insulation performance retention threshold". The metal particles can form non-connected island-shaped or semi-continuous thermal conduction network in the ceramic matrix, which can significantly improve the thermal conductivity of composite ceramic and quickly dissipate the heat of rectifier operation, without causing insulation failure due to interconnection of metal particles.

[0017] Metal particles can also effectively "pin" ceramic grains, inhibit abnormal grain growth during sintering, improve the density and fracture toughness of composite ceramics, and prevent hollow structures from cracking due to excessive brittleness.

[0018] The combination of hollow design and ceramic-metal composite material is a precise design for the high heat generation and lightweight requirements of rectifiers; the hollow pores can serve as air circulation channels to form natural convection, and combined with the heat dissipation capacity of metal powder, the heat dissipation efficiency is 40%-60% higher than that of solid composite ceramic shells; the gradient hollow structure can be designed according to the heat distribution of the rectifier to achieve directional and efficient heat dissipation.

[0019] The hollow structure can reduce the amount of material used by 30% to 50%. Combined with the low density of ceramic itself, the weight of the shell is only half that of a solid metal shell of the same size, making it particularly suitable for scenarios that are sensitive to load weight, such as new energy vehicles and drones.

[0020] Another advantage is that the complex pores and irregular channels of hollow structures are difficult to achieve through traditional molding processes, while 3D printing, such as photopolymerization and adhesive spraying, can be precisely controlled.

[0021] The diameter, wall thickness, and porosity of the perforated holes can be customized as needed, such as using a hole diameter of 0.5-2mm and a wall thickness of 1-3mm, taking into account both heat dissipation and structural strength; thermally conductive silicone or micro heat pipes can be added to the perforated holes later to further improve heat dissipation capacity, and can also prevent dust or moisture from entering.

[0022] The ceramic matrix encapsulates metal powder, preventing the metal from directly contacting external corrosive media. Although the perforated pores increase the surface area, the chemical inertness of the ceramic can resist the erosion of environments such as acids, alkalis, humidity, and salt spray, and its service life is 2-3 times longer than that of a perforated metal shell.

[0023] The "stress dispersion" property of the hollow structure can alleviate the internal stress caused by thermal expansion and contraction, and reduce the risk of cracking of the shell under high and low temperature cycles.

[0024] Of course, depending on production needs, silicone rubber or epoxy resin can be used to form an isolation layer.

[0025] Furthermore, the encapsulation portion includes a sealing plate with four abutting feet at the bottom, the abutting feet being used to press the DC output portion and the AC input portion together in the height direction.

[0026] Furthermore, the encapsulation clamp includes a filler plate, which is inserted into the assembly groove. The filler plate has holes extending through the top and bottom, and a column tube is fitted inside the holes. A metal rod is inserted through the column tube, and the top end of the metal rod is welded to the heat sink embedded inside the contact foot to form a whole.

[0027] The encapsulation part is also manufactured using 3D printing. First, an aluminum alloy heat-conducting plate with a mouth shape is manufactured and welded with multiple metal rods to form a whole. After the upper part of the contact foot is formed by 3D printing, the lower part is formed by printing to form a whole. After the aluminum alloy heat-conducting plate is embedded, resin is added through sintering. The filler plate is inserted into the assembly groove. On the one hand, it compacts the segmented plate to form a fixed state. On the other hand, after insertion, the friction between the structures can be used to form a tight state after encapsulation.

[0028] It should be noted that the metal rod contacts the top of the segmented plate. As a good thermal conductor, the metal rod can transfer the heat generated by the entire AC input section upwards, resulting in better heat dissipation. This makes the entire encapsulation structure achieve a three-dimensional heat dissipation effect. Compared with the original centralized heat dissipation, this heat is evenly distributed on the rectifier, ensuring that the temperature difference at each location is not too large. When the heat is high, the column tube gradually forms a thermally fused state. The fused fluid gradually flows into the gap between the assembly slot and the filler plate, forming a fixed state to ensure that the segmented plate is fixed. In this way, the encapsulation will not become brittle due to long-term exposure to high temperatures, nor will it produce bubbles, thus extending its service life.

[0029] Furthermore, the DC output section includes a metal plate, the middle of which is integrally formed by bending to form a DC output end, which contacts the receiving block. Vertical grooves are provided on both sides of the metal plate, and a bonding plate is formed by continuous bending in the width direction. A positioning hole is provided on the bonding plate, and the positioning hole is fitted onto the assembly column.

[0030] Furthermore, the AC input section also includes a segmented plate, which is a hollow structure made of ceramic. An embedded metal part is provided through the segmented plate. The embedded metal part extends out from the position of the AC electrode to form a contact apex. Side support strips are provided on the segmented plate and are locked in the position of the bonding plate. The embedded metal part is electrically connected to the bonding plate through an assembly column.

[0031] The DC output section and AC input section are assembled and vertically arranged around the outer periphery of the U-shaped cavity of the encapsulation shell. The vertically arranged DC output section and AC input section are directly attached to the inner wall of the square shell. The heat generated during rectification can be discharged through direct heat conduction of the shell, and the path length is only the thickness of the metal sheet itself. In contrast, the horizontally placed sheet structure requires the heat to be conducted laterally within the sheet to the edge before being transferred to the shell. This results in higher thermal resistance and a greater risk of localized overheating.

[0032] The four inner walls of the square shell can be respectively attached to a DC output section or an AC input section. The heat dissipation surfaces of the four metal plates are independent and do not block each other. The convective heat dissipation area with air is 2-3 times that of the horizontal plate structure. The upper and lower surfaces of the existing horizontal plate structure are easily covered by the shell or other components, and only the edges can participate in heat dissipation, which limits the heat dissipation efficiency and the heat will not be concentrated in the central area.

[0033] The vertically fixed DC output and AC input sections are subjected to force perpendicular to the housing wall, resulting in stronger mechanical constraints. This prevents warping or displacement of the horizontal sheet structure during equipment transportation or operation vibrations.

[0034] The DC output section and AC input section are vertically pressed together to prevent displacement. In contrast, existing horizontal rectifiers use vertical encapsulation during filling, which can easily cause the entire unit to shift, leading to unstable quality. The rectifier disclosed in this solution uses a method of pressing the encapsulation shell and encapsulation parts together, so that the DC output section and AC input section do not move during the process, and the production process does not have a negative impact on the DC output section and AC input section.

[0035] The creepage distance and electrical clearance between the DC output section and the AC input section are guaranteed by the housing wall thickness. Compared with the horizontally stacked sheet structure, it is less prone to creepage and short circuit risks and can be adapted to higher voltage level applications. The gap between the sheets in the horizontal sheet structure requires additional isolation components, which increases the structural complexity.

[0036] Furthermore, the AC electrode includes a ceramic sleeve, which is fitted inside the AC contact rod groove, and a sliding rod conductor is provided through the ceramic sleeve. A contact plate is provided at the inner end of the sliding rod conductor via a thermo-spring. A deformation plate is provided in the inner cavity of the contact plate, and the contact plate contacts the contact apex.

[0037] Furthermore, the fin plate includes a backing plate and an outer plate, and the backing plate and the outer plate are fixed together by a plurality of comb plates.

[0038] Furthermore, the assembly column includes a hollow column, in which multiple heat-conducting strips are disposed. A fixing plate is disposed on the top of the heat-conducting strips, and a conductive rod is disposed on the bottom of the fixing plate. The conductive rod forms a contact relationship between the contact point and the bonding plate, and the contact point abuts against the embedded metal part.

[0039] Furthermore, a bridge rectifier packaging method includes the following steps:

[0040] Step 1: The encapsulation shell and encapsulation parts are made by 3D printing. The printing material is a mixture of ceramic substrate powder and metal powder in a ratio not exceeding 4:1.

[0041] Step 2: Place the DC output section in the position of the receiving block, and ensure that the positioning hole is fitted onto the assembly column; place the segmented plates facing each other in the assembly slot, and place the AC electrodes in the AC contact rod slot, ensuring that the side support bars are stuck on both sides of the assembly column and in contact with the bonding plate.

[0042] Step 3: When inserting the encapsulation part into the encapsulation housing, ensure the correct orientation and use heat-resistant adhesive to attach the inner side of the fin plate to the inner wall of the reserved slot, with the other side of the fin plate in contact with the DC output part; ensure that the filler plate is inserted into the assembly slot and forms a compression state with the segment plate, so that the encapsulation part and the encapsulation housing form an encapsulation state, and both the DC output part and the AC electrode have exposed ends.

[0043] The technical effects and advantages of this invention are as follows:

[0044] 1. The DC output section and AC input section are assembled and vertically arranged on the periphery of the U-shaped cavity of the encapsulation shell. The vertically arranged DC output section and AC input section are directly attached to the inner wall of the square shell. The heat generated during rectification can be discharged through direct heat conduction of the shell. The path length is only the thickness of the metal sheet itself. The vertically fixed DC output section and AC input section are subjected to force perpendicular to the shell wall, which provides stronger mechanical constraint. During equipment transportation or operation vibration, there will be no warping or displacement of the horizontal sheet structure.

[0045] 2. The metal rod contacts the top of the segmented plate. As an excellent thermal conductor, the metal rod can transfer the heat generated by the entire AC input section upwards, resulting in better heat dissipation. This allows the entire encapsulation structure to achieve a three-dimensional heat dissipation effect. Compared to the original centralized heat dissipation, this heat is evenly distributed on the rectifier, ensuring that the temperature difference at each location is not too large. When the heat is high, the column tube gradually forms a molten state. The molten fluid gradually flows into the gap between the assembly slot and the filler plate, forming a fixed state to ensure that the segmented plate is fixed. In this way, the encapsulation will not become brittle due to long-term exposure to high temperatures, nor will it produce bubbles, thus extending its service life.

[0046] 3. In traditional welded rectifier bridges, heat will continue to accumulate under overload, which may cause the rectifier chip and casing to melt or even catch fire. This design can cut off the circuit before the heat reaches the dangerous threshold, thus avoiding thermal runaway at the source. When the rectifier temperature drops to a safe range, the thermal spring returns to its initial state, and the electrode plate automatically moves down under its own weight to re-establish the plug-in connection with the contact apex, and the circuit can resume operation. Attached Figure Description

[0047] Figure 1 is a perspective view of the present invention;

[0048] Figure 2 is a cross-sectional view of the present invention;

[0049] Figure 3 is a schematic diagram of the outer casing of the present invention;

[0050] Figure 4 is a schematic diagram of the DC output section and AC input section of the present invention after assembly;

[0051] Figure 5 is a sectional view of the bottom view of the present invention;

[0052] Figure 6 is a schematic diagram of the column tube of the present invention;

[0053] Figure 7 is a top view of the outer casing of the present invention;

[0054] Figure 8 is a partial cross-sectional view of the present invention;

[0055] Figure 9 is a schematic diagram of the metal rod of the present invention;

[0056] Figure 10 is a schematic diagram of the DC power output section of the present invention;

[0057] Figure 11 is a cross-sectional view of the assembly column of the present invention;

[0058] Figure 12 is a cross-sectional view of the AC electrode of the present invention.

[0059] In the picture:

[0060] 1. Encapsulation housing; 11. Outer shell; 11A. Reserved slot; 12. Assembly slot; 13. AC contact rod slot; 14. Assembly column; 141. Hollow column; 142. Heat-conducting strip; 143. Fixing plate; 144. Conductive rod; 145. Contact point; 15. Removal block; 2. Encapsulation part; 21. Sealing plate; 22. Contact foot; 3. DC output part; 31. Metal plate; 32. DC output terminal; 33. Bonding plate; 34. 4. Positioning hole; 5. AC input section; 6. Segmented plate; 7. Contact apex; 8. Vertical plate section; 9. Side support bar; 10. Embedded metal section; 11. AC electrode; 2. Ceramic sleeve; 3. Slide rod conductor; 42. Thermostatic spring; 53. Deformation plate; 64. Contact plate; 75. Encapsulation clamp; 86. Filler plate; 97. Column tube; 108. Metal rod; 11. Fin plate; 12. Abutment plate; 13. Comb plate; 14. Outer plate. Detailed Implementation

[0061] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, and not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0062] Referring to Figures 1-12, a bridge rectifier packaging structure includes:

[0063] The encapsulation housing 1 has a U-shaped cavity and forms an integral encapsulation space with the encapsulation part 2. The encapsulation housing 1 is 3D printed. The encapsulation housing 1 includes square protrusions on all four sides of the inner wall of the outer shell 11, and two open-top assembly slots 12 are opened at the position of the AC input part 4. The two assembly slots 12 are channels of the same depth as the AC contact rod slot 13. There is a U-shaped assembly column 14 in the space between two adjacent square protrusions.

[0064] It also includes a support block 15, which is used to support the extended end of the DC output section 3.

[0065] The encapsulation housing 1 is 3D printed. The bottom is made of aluminum alloy as the base plate. The aluminum alloy is hollowed out in a honeycomb shape. The hollowed-out honeycomb holes are used as the base fixing points. Ceramic is printed into the hollowed-out honeycomb to form the anchor points of the frame. The top surface of the aluminum alloy is used as the printing surface to form a mesh surface. After the above printing is completed, the mesh surface is used as the bottom surface. The anchor points exposed on the other side of the aluminum alloy are printed. After the bottom of the outer shell 11 is printed in a mesh shape, the inner and outer walls of the encapsulation housing 1 are printed, and a hollow cavity is reserved. A reserved groove 11A, an assembly groove 12 and an AC contact rod groove 13 are reserved, and an assembly column 14 is formed. The assembly column 14 is printed using a full ceramic substrate. The horizontal surface of the assembly column 14 is connected to the outer shell 11. That is, the position where it contacts the DC output part 3 is fitted with a rubber pad. During use, the rubber pad can stick the DC output part 3 after being exposed to high temperature. The assembly column 14 and the positioning hole 34 form a positioning and fixing position relationship. During installation, the positioning hole 34 is directly fitted onto the assembly column 14.

[0066] The printing material is made by mixing 15% metal powder with ceramic matrix. The 15% ratio is within the optimal range between the threshold for forming a thermal conductivity path and the threshold for retaining insulation performance. The metal particles can form non-connected island-shaped or semi-continuous thermal conductivity networks in the ceramic matrix. This can significantly improve the thermal conductivity of the composite ceramic by 3-5 times compared to pure ceramic, quickly dissipating the heat of the rectifier, without causing insulation failure due to interconnected metal particles.

[0067] Metal particles can also effectively pin ceramic grains, inhibit abnormal grain growth during sintering, improve the density and fracture toughness of composite ceramics, and prevent hollow structures from cracking due to excessive brittleness.

[0068] The combination of hollow design and ceramic-metal composite material is a precise design for the high heat generation and lightweight requirements of rectifiers; the hollow pores can serve as air circulation channels to form natural convection, and with the conductive heat dissipation capacity of metal powder, the heat dissipation efficiency is improved by 40%-60% compared with solid composite ceramic shell 11; according to the heat distribution of rectifier, a gradient hollow structure can be designed with high porosity in the heat generation area and low porosity in the installation area to achieve directional and efficient heat dissipation;

[0069] The hollow structure can reduce the amount of material used by 30% to 50%. Combined with the low density of ceramic itself, the weight of the shell 11 is only half that of a solid metal shell 11 of the same size, making it particularly suitable for scenarios such as new energy vehicles and drones that are sensitive to load weight.

[0070] Another advantage is that the complex pores and irregular channels of hollow structures, such as honeycomb, mesh, and biomimetic fins, are difficult to achieve through traditional molding processes, while 3D printing, such as photopolymerization and adhesive spraying, can be precisely controlled.

[0071] The diameter, wall thickness, and porosity of the perforated holes can be customized as needed, such as using a hole diameter of 0.5-2mm and a wall thickness of 1-3mm, taking into account both heat dissipation and structural strength; thermally conductive silicone or micro heat pipes can be added to the perforated holes later to further improve heat dissipation capacity, and can also prevent dust or moisture from entering.

[0072] The ceramic matrix encapsulates metal powder, preventing the metal from directly contacting external corrosive media. Although the perforated pores increase the surface area, the chemical inertness of the ceramic can resist the corrosion of environments such as acids, alkalis, humidity, and salt spray, and its service life is 2-3 times longer than that of the perforated metal shell 11.

[0073] The "stress dispersion" characteristic of the hollow structure can alleviate the internal stress caused by thermal expansion and contraction. The difference in thermal expansion coefficients between ceramics and metals will generate internal stress, reducing the risk of cracking of the outer shell 11 under high and low temperature cycles.

[0074] Of course, depending on production needs, silicone rubber or epoxy resin can be used to form an isolation layer.

[0075] The encapsulation part 2 includes a sealing plate 21. The sealing plate 21 has four abutment feet 22 at its bottom, which are used to press the DC output part 3 and the AC input part 4 together in the height direction. The encapsulation part 2 is also manufactured by 3D printing. First, an aluminum alloy heat-conducting plate with a U-shape is manufactured and welded to multiple metal rods 63 to form a whole. After the upper part of the abutment feet 22 is formed by 3D printing, the lower part is formed by printing to form a whole. After the aluminum alloy heat-conducting plate is embedded, resin is added by sintering. The filler plate 61 is inserted into the assembly groove 12. On the one hand, it can press the segmented plate 41 to form a fixed state. On the other hand, after insertion, the friction between the structures can form a tight state after encapsulation.

[0076] The encapsulation clamp 6 includes a filler plate 61, which is inserted into the assembly groove 12. The filler plate 61 has a hole that passes through the top and bottom. A column tube 62 is sleeved in the hole. A metal rod 63 is inserted through the column tube 62. The top of the metal rod 63 is welded to the heat sink embedded inside the pressure foot 22 to form a whole.

[0077] It should be noted that the metal rod 63 contacts the top of the segmented plate 41. As a good thermal conductor, the metal rod 63 can transfer the heat generated on the entire AC input section 4 upwards, resulting in better heat dissipation. This makes the entire encapsulation structure achieve a three-dimensional heat dissipation effect. Compared with the original centralized heat dissipation, this heat is evenly distributed on the rectifier, ensuring that the temperature difference at each position is not too large. When the heat is high, the column tube 62 gradually forms a hot melt state. The hot melted fluid gradually flows into the gap between the assembly groove 12 and the filler plate 61, forming a fixed state to ensure that the segmented plate 41 is fixed. In this way, the encapsulation will not cause embrittlement due to long-term high temperature, nor will it produce bubbles, thus extending the service life.

[0078] The DC output section 3 has two parts, and the two DC output sections 3 are arranged vertically symmetrically in the U-shaped cavity;

[0079] The AC input section 4 has two pairs, which are arranged vertically symmetrically in the U-shaped cavity and are in contact with the two DC output sections 3. Each pair of AC input sections 4 has two segmented plates 41, which are arranged opposite to each other. The DC output section 3 includes a metal plate 31, and a DC output end 32 is integrally formed in the middle of the metal plate 31 by bending. The DC output end 32 is in contact with the receiving block 15. Vertical grooves are opened on both sides of the metal plate 31. A bonding plate 33 is formed by continuous bending in the width direction. A positioning hole 34 is provided on the bonding plate 33, and the positioning hole 34 is fitted on the assembly column 14.

[0080] The AC input section 4 also includes a segmented plate 41, which is a hollow structure made of ceramic. An embedded metal part 45 is provided through the segmented plate 41. The embedded metal part 45 extends out from the position of the AC electrode 5 to form a contact apex 42. A side support strip 44 is provided on the segmented plate 41. The side support strip 44 is locked in the position of the bonding plate 33. The embedded metal part 45 is electrically connected to the bonding plate 33 through the mounting post 14. The vertical plate section 43 is in close contact with the mounting post 14. The embedded metal part 45 is exposed in the vertical plate section 43 and abuts against the contact point 145.

[0081] The DC output section 3 and the AC input section 4 are assembled and vertically arranged around the outer periphery of the U-shaped cavity of the encapsulation housing 1. The vertically arranged DC output section 3 and AC input section 4 are directly attached to the inner wall of the square housing. The heat generated during rectification can be discharged through direct heat conduction of the housing, and the path length is only the thickness of the metal sheet itself. In contrast, the horizontally placed sheet structure requires the heat to be conducted laterally within the sheet to the edge before being transferred to the housing, resulting in higher thermal resistance and a higher risk of local overheating.

[0082] The four inner walls of the square shell can be respectively attached to a DC output section 3 or an AC input section 4. The heat dissipation surfaces of the four metal plates are independent and do not block each other. The convective heat dissipation area with air is 2-3 times that of the horizontal plate structure. The upper and lower surfaces of the existing horizontal plate structure are easily covered by the shell or other components, and only the edges can participate in heat dissipation, which limits the heat dissipation efficiency and the heat will not be concentrated in the central area.

[0083] The vertically fixed DC output section 3 and AC input section 4 are subjected to force in a direction perpendicular to the shell wall, resulting in stronger mechanical constraints. This prevents the horizontal sheet structure from warping or shifting during equipment transportation or operation vibrations.

[0084] The DC output section 3 and the AC input section 4 are pressed vertically to prevent displacement. In contrast, existing horizontal rectifiers use vertical encapsulation during filling, which can easily cause overall displacement and lead to unstable quality. The rectifier disclosed in this solution uses a method of pressing the encapsulation shell 1 and the encapsulation section 2 together. During the process, the DC output section 3 and the AC input section 4 do not move, and the production process does not have a negative impact on the DC output section 3 and the AC input section 4.

[0085] The creepage distance and electrical clearance between the DC output section 3 and the AC input section 4 are guaranteed by the shell wall thickness. Compared with the horizontally stacked sheet structure, it is less prone to creepage and short circuit risks and can be adapted to higher voltage level application scenarios. The gap between the sheets of the horizontal sheet structure requires additional isolation components, which increases the structural complexity.

[0086] The AC electrode 5 is fixed in the AC contact groove 13 reserved on the encapsulation housing 1 and contacts the contact apex 42 on the AC input part 4. The AC electrode 5 includes a ceramic sleeve 51, which is sleeved in the AC contact groove 13. A sliding rod conductor 52 is provided through the ceramic sleeve 51. A contact plate 55 is provided at the inner end of the sliding rod conductor 52 through a thermo-spring 53. A deformation plate 54 is provided in the inner cavity of the contact plate 55, and the contact plate 55 contacts the contact apex 42.

[0087] The protection mechanism of thermo-deformable spring 53 is adopted. Based on the physical characteristics of metal deformation, it is directly linked. When the circuit is overloaded or the heat of the rectifier bridge is conducted to the output terminal, the thermo-deformable spring 53 will shrink due to heat and automatically retract, quickly releasing the plugging contact between the contact plate 55 and the contact apex 42 and cutting off the current circuit.

[0088] Traditional welded rectifier bridges accumulate heat under overload, potentially melting the rectifier chip and casing, or even igniting a fire. This design, however, cuts off the circuit before the heat reaches a dangerous threshold, preventing thermal runaway at its source. Once the rectifier temperature drops to a safe range, the thermal spring 53 returns to its initial state, and the electrode plates automatically move down under their own weight, re-establishing a connection with the contact apex 42, thus restoring the circuit to operation. Compared to disposable fuses and thermistors, which have slow resistance recovery and are prone to aging, this design achieves consumable-free self-recovery, making it particularly suitable for scenarios with frequent short-term overloads.

[0089] It also includes a fin plate 7, which is disposed at the bottom of the encapsulation part 2. One side of the fin plate 7 contacts one side of the DC output part 3, and the other side of the fin plate 7 contacts the inner wall of the reserved groove 11A.

[0090] The fin plate 7 includes a back plate 71 and an outer plate 73, and the back plate 71 and the outer plate 73 are fixed together by a plurality of comb plates 72.

[0091] Fin plate 7 is used to abut against DC output part 3 and form a thermal bridge between DC output part 3 and the cavity. Comb plate 72 is made of thermally conductive metal, so that the heat on DC output part 3 can be quickly transferred through comb plate 72. The abutment plate 71 and the outer plate 73 are made of insulating material and ceramic. This quickly dissipates heat and forms a three-dimensional heat dissipation effect.

[0092] The assembly column 14 includes a hollow column 141, in which multiple heat-conducting strips 142 are provided. A fixing plate 143 is provided on the top of the heat-conducting strips 142, and a conductive rod 144 is provided on the bottom of the fixing plate 143. The conductive rod 144 forms a contact relationship between the contact point 145 and the bonding plate 33, and the contact point 145 abuts against the embedded metal part 45.

[0093] To facilitate rapid heat dissipation, the heat-conducting strip 142 can transfer heat to the aluminum alloy plate disposed inside the encapsulation housing 1, thereby enabling rapid heat conduction.

[0094] A bridge rectifier packaging method includes the following steps:

[0095] Step 1: The encapsulation shell 1 and the encapsulation part 2 are made by 3D printing. The printing material is a mixture of ceramic substrate powder and metal powder in a ratio not exceeding 4:1.

[0096] Step 2: Place the DC output part 3 at the position of the receiving block 15, and ensure that the positioning hole 34 is fitted on the assembly column 14; place the segmented plates 41 facing each other in the assembly groove 12, and place the AC electrode 5 in the AC contact rod groove 13, ensuring that the side support strip 44 is stuck on both sides of the assembly column 14 and forms a contact state with the bonding plate 33.

[0097] Step 3: When inserting the encapsulation part 2 into the encapsulation housing 1, ensure the correct orientation and use heat-resistant adhesive to attach the inner side of the fin plate 7 to the inner wall of the reserved groove 11A, and the other side of the fin plate 7 to contact the DC output part 3; ensure that the filler plate 61 is inserted into the assembly groove 12 and forms a compression state with the segment plate 41, so that the encapsulation part 2 and the encapsulation housing 1 form an encapsulation state, and both the DC output part 3 and the AC electrode 5 have exposed ends.

[0098] Finally, it should be noted that the above description is only a preferred embodiment of the present invention and is not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments or make equivalent substitutions for some of the technical features. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of the present invention should be included within the protection scope of the present invention.

Claims

1. A bridge rectifier packaging structure, characterized in that, include: The encapsulation housing (1) has a U-shaped cavity and forms an integral encapsulation space with the encapsulation part (2); the DC output part (3) has two parts, and the two DC output parts (3) are arranged vertically symmetrically in the U-shaped cavity; the AC input part (4) has two pairs, and the two pairs of AC input parts (4) are arranged vertically symmetrically in the U-shaped cavity; and forms a contact relationship with the two DC output parts (3), each pair of AC input parts... Part (4) has two said segmented plates (41), which are arranged opposite to each other; AC electrode (5), which is fixed in the AC contact rod groove (13) reserved on the package housing (1) and contacts the contact apex (42) on the AC input part (4); it also includes a fin plate (7), which is set at the bottom of the package part (2), one side of the fin plate (7) contacts one side of the DC output part (3), and the other side of the fin plate (7) contacts the inner wall of the reserved groove (11A).

2. The bridge rectifier packaging structure according to claim 1, characterized in that, The encapsulation housing (1) is 3D printed. The encapsulation housing (1) includes a square protrusion on all four sides of the inner wall of the outer shell (11), and two open-top assembly slots (12) are opened at the position of the AC input part (4). The two assembly slots (12) are channels of the same depth as the AC contact rod slot (13). There is a U-shaped assembly column (14) in the space between two adjacent square protrusions. It also includes a support block (15), which is used to support the protruding end of the DC output part (3).

3. The bridge rectifier packaging structure according to claim 2, characterized in that, The encapsulation part (2) includes a sealing plate (21), the sealing plate (21) has four abutting feet (22) at the bottom, and the abutting feet (22) are used to press the DC output part (3) and the AC input part (4) together in the height direction.

4. The bridge rectifier packaging structure according to claim 3, characterized in that, The encapsulation clamp (6) includes a filler plate (61), which is inserted into the assembly groove (12). The filler plate (61) has a hole that passes through the top and bottom. A column tube (62) is sleeved in the hole. A metal rod (63) is inserted through the column tube (62). The top of the metal rod (63) is welded to the heat sink embedded inside the contact foot (22) to form a whole.

5. The bridge rectifier packaging structure according to claim 4, characterized in that, The DC output section (3) includes a metal plate (31). The middle part of the metal plate (31) is integrally formed by bending to form a DC output end (32). The DC output end (32) is in contact with the receiving block (15). Vertical grooves are provided on both sides of the metal plate (31). A bonding plate (33) is formed by continuously bending in the width direction. A positioning hole (34) is provided on the bonding plate (33). The positioning hole (34) is fitted on the assembly column (14).

6. The bridge rectifier packaging structure according to claim 5, characterized in that, The AC input section (4) also includes a segmented plate (41), which is a hollow structure made of ceramic. An embedded metal part (45) is provided through the segmented plate (41). The embedded metal part (45) extends out from the position of the AC electrode (5) to form a contact apex (42). A side support strip (44) is provided on the segmented plate (41). The side support strip (44) is locked in the position of the bonding plate (33). The embedded metal part (45) is electrically connected to the bonding plate (33) through the mounting column (14).

7. The bridge rectifier packaging structure according to claim 6, characterized in that, The AC electrode (5) includes a ceramic sleeve (51), which is fitted inside the AC contact rod groove (13). A sliding rod conductor (52) is provided through the ceramic sleeve (51). A contact plate (55) is provided at the inner end of the sliding rod conductor (52) via a thermo-spring (53). A deformation plate (54) is provided in the inner cavity of the contact plate (55), and the contact plate (55) contacts the contact apex (42).

8. The bridge rectifier packaging structure according to claim 7, characterized in that, The fin (7) includes a backing plate (71) and an outer plate (73), and the backing plate (71) and the outer plate (73) are fixed together by a plurality of comb plates (72).

9. A bridge rectifier packaging structure according to claim 8, characterized in that, The assembly column (14) includes a hollow column (141), and a plurality of heat-conducting strips (142) are provided inside the hollow column (141). A fixing plate (143) is provided on the top of the heat-conducting strips (142), and a conductive rod (144) is provided at the bottom of the fixing plate (143). The conductive rod (144) forms a contact relationship between the contact point (145) and the bonding plate (33), and the contact point (145) abuts against the embedded metal part (45).

10. A bridge rectifier packaging method, wherein the rectifier is according to any one of claims 1-9, characterized in that, The process includes the following steps: Step 1: The encapsulation shell (1) and encapsulation part (2) are manufactured by 3D printing. The printing material is a mixture of ceramic substrate powder and metal powder in a ratio not exceeding 4:

1. Step 2: The DC output part (3) is placed on the support block (15), and the positioning hole (34) is fitted onto the assembly column (14). The segmented plates (41) are placed opposite each other in the assembly groove (12), and the AC electrode (5) is placed in the AC contact rod groove (13), ensuring that the side support bar (44) is secured to both sides of the assembly column (14). , and form a contact state with the bonding plate (33); Step 3: When inserting the encapsulation part (2) into the encapsulation shell (1), ensure the correct orientation and use heat-resistant glue to bond the inner side of the fin plate (7) to the inner wall of the reserved groove (11A), and the other side of the fin plate (7) to the DC output part (3); ensure that the filling plate (61) is inserted into the assembly groove (12) and forms a compression state with the segment plate (41), so that the encapsulation part (2) and the encapsulation shell (1) form an encapsulation state, and the DC output part (3) and the AC electrode (5) both have exposed ends.

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