Display apparatus and electronic apparatus

Abstract

The invention relates to a display apparatus and an electronic apparatus. The display apparatus includes: a display module emitting visible light; a window member opposed to one surface of the display module; and an adhesive layer between the display module and the window member, in which the adhesive layer is formed by curing an adhesive, the adhesive layer after curing comprising at least a high molecular weight acrylic polymer having a first weight average molecular weight of at least 700,000 Daltons and a high molecular weight acrylic polymer having a second weight average molecular weight of less than 500,000 Daltons. The adhesive layer has a stress relaxation value of 0.01 to 0.4 before curing and has a stress relaxation value of 0.20 to 0.70 after curing, and the amount of the adhesive layer is less than or equal to 100 parts by weight of the sum of the amount of the high molecular weight acrylic polymer and the amount of the low molecular weight acrylic polymer, with respect to 100 parts by weight of the sum of the amount of the high molecular weight acrylic polymer and the amount of the low molecular weight acrylic polymer. The amount of the high molecular weight acrylic polymer is at least 30 parts by weight.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2024-0150094, filed on October 29, 2024, with the Korean Intellectual Property Office, the entire contents of which are incorporated herein by reference. Technical Field

[0003] One or more embodiments of this disclosure relate to display devices and electronic devices. Background Technology

[0004] Electronic devices that provide images to users (such as smartphones, tablet computers, digital cameras, laptops, navigators, and / or smart TVs) include display devices that display images. Display devices include display modules that generate and display images, as well as various suitable input devices.

[0005] An electronic device including a light-emitting element may include: a display module comprising a light-emitting display area and a non-light-emitting bezel area; a window member protecting the display module; and an adhesive layer between the display module and the window member. When a penetrating bubble (generated during a bubble removal process after the display module and window member are adhered) moves beyond the bezel area into the display area, the product may be deemed defective, and this defect may affect the yield (e.g., the yield may be reduced). Summary of the Invention

[0006] One or more embodiments of this disclosure provide a method for minimizing or reducing a border area by reducing air bubbles in the adhesive layer between the display area and window components of a display device, and provide a display device, electronic device, and method of manufacturing the display device in relation to the method of minimizing or reducing the border area.

[0007] According to one or more embodiments, a display device includes: a display module emitting visible light; a window member opposite to a surface of the display module; and a first adhesive layer between the display module and the window member, wherein the first adhesive layer is formed by curing the adhesive, and after curing, the first adhesive layer includes at least a high molecular weight acrylic polymer having a first weight-average molecular weight of at least 700,000 (i.e., 700,000 Daltons or greater) and a low molecular weight acrylic polymer having a second weight-average molecular weight of less than 500,000 (i.e., less than 500,000 Daltons), the first adhesive layer having a stress relaxation value of 0.01 to 0.4 before curing and a stress relaxation value of 0.20 to 0.70 after curing, and the amount of the high molecular weight acrylic polymer is at least 30 parts by weight relative to the sum of 100 parts by weight of the high molecular weight acrylic polymer and the low molecular weight acrylic polymer.

[0008] In an embodiment, the first weight-average molecular weight may be from 700,000 Daltons to 3,000,000 Daltons.

[0009] In an embodiment, the second weight-average molecular weight can be from 50,000 Daltons to 490,000 Daltons.

[0010] In this implementation, the stress relaxation value can be measured at 70°C.

[0011] In one embodiment, the first adhesive layer may include a transparent polymer that allows at least some of visible light to pass through.

[0012] In one embodiment, a second adhesive layer with a different stress relaxation value may be further included between the first adhesive layer and the display module or between the first adhesive layer and the window member.

[0013] In this embodiment, the second adhesive layer may have a stress relaxation value of 0.4 to 0.6 both before and after curing.

[0014] In an embodiment, a third adhesive layer may be further included, having a stress relaxation value smaller than that of the second adhesive layer, and the second adhesive layer may be located between the first adhesive layer and the third adhesive layer.

[0015] In an embodiment, the first adhesive layer and / or the third adhesive layer may have a stress relaxation value of 0.01 to 0.4 before curing and a stress relaxation value of 0.20 to 0.70 after curing.

[0016] In this embodiment, after curing, the first adhesive layer may have a creep value of at least 4% at 50°C, a modulus of 0.04 MPa to 0.70 MPa at 25°C, and a strength of at least 0.5 kgf / in. 2 The second adhesive layer has good adhesion, and after curing, it may have a creep value of at least 4% at 50°C and a modulus of 0.04 MPa to 0.70 MPa at 25°C.

[0017] According to one or more embodiments, a display device includes: a display module that emits visible light; a window member opposite to a surface of the display module; and a first adhesive layer between the display module and the window member, wherein the first adhesive layer has a stress relaxation value of 0.01 to 0.4 before curing, a stress relaxation value of 0.20 to 0.70 after curing, a creep value of at least 4% at 50°C after curing, and a modulus of 0.04 MPa to 0.70 MPa at 25°C after curing.

[0018] In one embodiment, a first adhesive layer can be formed by curing the adhesive, and after curing, the first adhesive layer comprises at least a high molecular weight acrylic polymer having a first weight average molecular weight of at least 700,000 (i.e., 700,000 Daltons or greater) and a low molecular weight acrylic polymer having a second weight average molecular weight of less than 500,000 (i.e., less than 500,000 Daltons), and the amount of the high molecular weight acrylic polymer may be at least 30 parts by weight relative to the sum of 100 parts by weight of the high molecular weight acrylic polymer and the low molecular weight acrylic polymer.

[0019] In an embodiment, the first weight-average molecular weight may be from 700,000 Daltons to 3,000,000 Daltons.

[0020] In an embodiment, the second weight-average molecular weight can be from 50,000 Daltons to 490,000 Daltons.

[0021] In this implementation, the stress relaxation value can be measured at 70°C.

[0022] In one embodiment, the first adhesive layer may include a transparent polymer that allows at least some of visible light to pass through.

[0023] In one embodiment, a second adhesive layer with a different stress relaxation value may be further included between the first adhesive layer and the display module or between the first adhesive layer and the window member.

[0024] In this embodiment, the second adhesive layer may have a stress relaxation value of 0.4 to 0.6 both before and after curing.

[0025] In an embodiment, a third adhesive layer may be further included, having a stress relaxation value smaller than that of the second adhesive layer, and the second adhesive layer may be located between the first adhesive layer and the third adhesive layer.

[0026] In an embodiment, the first adhesive layer and / or the third adhesive layer may have a stress relaxation value of 0.01 to 0.4 before curing and a stress relaxation value of 0.20 to 0.70 after curing.

[0027] According to one or more embodiments, an electronic device includes: a controller configured to generate a scan input signal; a power module configured to generate a scan input voltage; a display module including a display panel divided into a display area in which pixel circuitry is provided and a non-display area surrounding (e.g., around) the display area; a display module emitting visible light; a window member opposite to one surface of the display module; an adhesive layer between the display module and the window member; and a scan driver provided in the non-display area and configured to receive the scan input signal and the scan input voltage and output the scan signal to the pixel circuitry, wherein the adhesive layer is formed by curing the adhesive, and after curing, the first adhesive layer includes at least a high molecular weight acrylic polymer having a first weight-average molecular weight of at least 700,000 (i.e., 700,000 Daltons or greater) and a polymer having a weight-average molecular weight of less than 500,000. The second weight average molecular weight is a low molecular weight acrylic polymer (i.e., less than 500,000 Daltons), the adhesive layer has a stress relaxation value of 0.01 to 0.4 before curing and a stress relaxation value of 0.20 to 0.70 after curing, and the amount of high molecular weight acrylic polymer is at least 30 parts by weight relative to the sum of 100 parts by weight of high molecular weight acrylic polymer and low molecular weight acrylic polymer. Attached Figure Description

[0028] The above and other aspects and features of specific embodiments of this disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, wherein:

[0029] Figure 1 This is a schematic cross-sectional view of a display device according to an embodiment;

[0030] Figure 2 for Figure 1 A schematic magnified view of an example of area A;

[0031] Figure 3 for Figure 2 A cross-sectional view of the modified example;

[0032] Figure 4A graph showing the temperature and pressure changes over time in the autoclave process of the display device according to the embodiment;

[0033] Figure 5 To show in Figure 4 A cross-sectional view of air movement in the adhesive layer during time period a to b;

[0034] Figure 6 To show in Figure 4 A cross-sectional view of air movement in the adhesive layer during time period b to c;

[0035] Figure 7 To illustrate the curve showing how the bubble penetration distance changes with the stress relaxation (SR) value of the adhesive layer;

[0036] Figure 8 A graph showing the movement of air inside the adhesive layer as a function of the SR value of the adhesive layer;

[0037] Figure 9 This is a schematic cross-sectional view of the adhesive layer according to the embodiment;

[0038] Figure 10 This is a schematic cross-sectional view of an adhesive layer according to another embodiment;

[0039] Figure 11 This is a schematic cross-sectional view of the adhesive layer according to yet another embodiment;

[0040] Figure 12 This is a plan view of a display device according to another embodiment;

[0041] Figure 13 For including Figure 12 A schematic cross-sectional view of the area at the edge;

[0042] Figure 14 This is a schematic cross-sectional view of a display device according to yet another embodiment; and

[0043] Figure 15 This is a block diagram of an electronic device according to an embodiment. Detailed Implementation

[0044] Because this disclosure allows for various suitable modifications and numerous embodiments, specific embodiments will be illustrated in the accompanying drawings and described in more detail in the written description. The effects and features of the embodiments of this disclosure, as well as the methods of implementing them, will become apparent from the embodiments described below in more detail and the accompanying drawings. However, the subject matter of this disclosure can be embodied in many different forms and should not be construed as limited to the embodiments set forth herein.

[0045] In the following embodiments, the terms "first" and "second," etc., are not used in a limiting sense and are used to distinguish one element from another.

[0046] Unless the context clearly indicates otherwise, the singular form as used herein is intended to include the plural form as well.

[0047] It will be further understood that the terms “include” and / or “comprise” as used herein indicate the presence of a feature or element of the description, but do not preclude the presence or addition of one or more other features or elements.

[0048] In the embodiments disclosed below, when a component (e.g., a unit, region, or element) is described as being on another component (e.g., a unit, region, or element), it will include not only embodiments in which the component (e.g., a unit, region, or element) is directly on another component (e.g., a unit, region, or element), but also embodiments in which there are other intervening units, regions, or elements between them.

[0049] In the following embodiments, unless otherwise indicated in the context, terms such as “connection” or “linkage” do not necessarily mean “two components are directly and / or fixedly connected or linked”, and do not exclude the involvement of other components between the two components.

[0050] For ease of explanation, the dimensions of the elements in the accompanying drawings may be enlarged. For example, because the dimensions (e.g., thickness) of the elements in the accompanying drawings may be interpreted arbitrarily for ease of explanation, the following embodiments are not limited thereto.

[0051] The subject matter of this disclosure will now be described more fully with reference to the accompanying drawings, in which exemplary embodiments of this disclosure are illustrated. In the description with reference to the drawings, the same or similar elements will be given the same reference numerals, and redundant descriptions will not be repeated.

[0052] Figure 1 This is a schematic cross-sectional view of a display device according to an embodiment.

[0053] refer to Figure 1 According to the embodiment, the display device 1 can be implemented in one direction, for example, in Figure 1 The light emitted in the upward direction (i.e., the z-axis direction).

[0054] Display device 1 may have a variety of suitable shapes. For example, display device 1 may have a flat plate shape, or as another example, display device 1 may be a bendable type or bendable variety and / or a flexible type or flexible variety.

[0055] Display device 1 can be one of a variety of suitable types or categories. For example, display device 1 can be an organic light-emitting display device, an inorganic light-emitting display device, and / or a quantum dot light-emitting display device. Organic light-emitting display devices will be described below as examples. Display device 1 can be implemented as a variety of suitable types or categories of electronic devices (e.g., mobile phones, laptop computers, and / or smartwatches).

[0056] The display device 1 may include: a display module 10 that emits visible light; a window member 20 on the surface of the display module 10 that emits visible light; and an adhesive layer 40 between the display module 10 and the window member 20.

[0057] For example, display device 1 may include: from the upper surface of display module 10 (e.g., based on...) Figure 1 The upper surface) in one direction (in Figure 1 The display module 10 emits visible light in the upward direction; the window member 20 transmits visible light in a region of the upper surface of the display module 10; and the adhesive layer 40 between the display module 10 and the window member 20.

[0058] The adhesive layer 40 to which the display module 10 and window member 20 are adhered may include multiple layers with different stress relaxation values. Specifically, the adhesive layer 40 may include at least one layer having a stress relaxation value that changes before and after curing.

[0059] The display device 1, including the adhesive layer 40, reduces the introduction of external air into the adhesive layer 40, which improves (e.g., reduces) the bubble penetration distance and ensures a narrow bezel area BZA (see...). Figure 12 It can be applied to curved surfaces and can provide improved adhesion and ink step coverage.

[0060] Figure 2 for Figure 1 A schematic enlarged view of an example of area A, and Figure 3 for Figure 2 A cross-sectional view of the modified example.

[0061] like Figure 2 As illustrated herein, the display module 10 may include a display element 150 capable of emitting visible light for a user. The display element 150 may be implemented in various suitable types or kinds, and the embodiments disclosed herein describe an example embodiment in which the display element 150 is an organic light-emitting element.

[0062] The display module 10 will be described in more detail. The display module 10 may include a substrate 110, a display element 150, a packaging component 160, and an optical functional layer 190.

[0063] Various suitable materials can be used to form the substrate 110. For example, the substrate 110 may include a transparent glass material containing SiO2 as the main component. For example, the substrate 110 may include a polymer material (e.g., a transparent plastic).

[0064] The display element 150 may be on the substrate 110 and may include a first electrode 151, a second electrode 152 and an intermediate layer 153. For example, the first electrode 151 may be on the substrate 110, the second electrode 152 may be on the first electrode 151, and the intermediate layer 153 may be between the first electrode 151 and the second electrode 152.

[0065] In an embodiment, the display device 1 may further include a buffer layer between the first electrode 151 and the substrate 110. The buffer layer may provide a flat surface on the top of the substrate 110 and may block or reduce the penetration of impurity elements, moisture and / or gases through the substrate 110.

[0066] The first electrode 151 can be used as an anode and the second electrode 152 can be used as a cathode. In embodiments, the order of these polarities can be reversed. In embodiments where the first electrode 151 is used as an anode, the first electrode 151 may contain ITO, IZO, ZnO, and / or In2O3, etc., which have high work function. For example, depending on the purpose and design conditions, the first electrode 151 may further include a reflective film, which may include Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, Yb, and / or Ca.

[0067] In embodiments where the second electrode 152 serves as a cathode, the second electrode 152 may comprise a metal (e.g., Ag, Mg, Al, Pt, Pd, Au, Ni, Nd, Ir, Cr, Li, and / or Ca). In some embodiments, the second electrode 152 may contain ITO, IZO, ZnO, and / or In2O3 to ensure light transmission.

[0068] Intermediate layer 153 may include at least an organic light-emitting layer. In some embodiments, in addition to the organic light-emitting layer, intermediate layer 153 may optionally include at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer. In embodiments in which a voltage is applied to the first electrode 151 and the second electrode 152, visible light may be generated from intermediate layer 153 (e.g., from the organic light-emitting layer of intermediate layer 153).

[0069] The encapsulation component 160 may be on the display element 150 to protect the display element 150. The encapsulation component 160 can protect the display element 150 from external impacts and reduce or prevent the penetration of external foreign objects and / or moisture.

[0070] The encapsulation member 160 can be formed in various suitable types or varieties. As an optional embodiment, the encapsulation member 160 may comprise a transparent glass material containing SiO2 as a primary component. As another optional embodiment, the encapsulation member 160 may comprise a polymer material (e.g., a transparent plastic material). As yet another optional embodiment, the encapsulation member 160 may be formed using inorganic and / or organic films. As yet still another optional embodiment, the encapsulation member 160 may be formed by stacking one or more organic layers and one or more inorganic layers. In this embodiment, optionally, the organic and inorganic layers may be stacked alternately.

[0071] As an optional implementation, the display module 10 may further include an optical functional layer 190. The optical functional layer 190 may include layers for improving, modifying, and implementing various other suitable controls on the characteristics of the light emitted from the display element 150.

[0072] As an optional implementation, the display module 10 may include thin-film transistors that transmit signals used or required for the operation of the display element 150 to the display element 150. This will be referenced. Figure 3 To provide a more detailed explanation.

[0073] Figure 3 for Figure 2 A cross-sectional view of the modified example. (Reference) Figure 3 The display module 10' may include a substrate 110', a display element 150', a thin film transistor 130', a packaging component 160', and an optical functional layer 190'.

[0074] The thin-film transistor 130' may include an active layer 133', a gate electrode 135', a source electrode 137', and a drain electrode 138'. This will be explained in more detail later. A buffer layer 131' may be on the substrate 110'. The buffer layer 131' may prevent or reduce the penetration of impurity elements, moisture, and / or gases through the substrate 110' and provide a flat surface on top of the substrate 110', and may include various suitable materials capable of performing this function. The buffer layer 131' may also be omitted, as it is an optional component.

[0075] The active layer 133' may be provided with a predefined pattern or a specific pattern on the buffer layer 131'. The active layer 133' may include inorganic semiconductor materials (e.g., silicon semiconductor materials and / or oxide semiconductor materials) and / or, as an optional implementation, may include organic semiconductor materials.

[0076] The gate insulating layer 136' may be on the active layer 133'. The gate insulating layer 136' may include various suitable insulating materials (e.g., electrical insulating materials) and may be formed using, for example, oxides and / or nitrides.

[0077] The gate electrode 135' may be located on the gate insulating layer 136' to correspond to a set region or specific region of the active layer 133'. The gate electrode 135' may comprise a material having high conductivity (e.g., high electrical conductivity). For example, the gate electrode 135' may contain Au, Ag, Cu, Ni, Pt, Pd, Al, or Mo, and may contain alloys (e.g., Al:Nd and / or Mo:W, etc.). However, this is merely an example. This disclosure is not limited thereto, and the gate electrode 135' may comprise a variety of suitable materials.

[0078] An interlayer insulating layer 139' (e.g., an interlayer electrical insulating layer) may cover the gate electrode 135'. The source electrode 137' and the drain electrode 138' may be on the interlayer insulating layer 139'. The source electrode 137' and the drain electrode 138' may contact a set area or a specific area of ​​the active layer 133'.

[0079] The passivation layer 132' may cover the source electrode 137' and the drain electrode 138'. In an embodiment, a separate insulating layer (e.g., an electrically insulating layer) may be further applied to the passivation layer 132' to planarize the thin-film transistor 130'.

[0080] The display module 10' may include one or more thin-film transistors 130' electrically connected to the display element 150', and in embodiments, may further include one or more capacitors electrically connected to the display element 150' or the thin-film transistors 130'.

[0081] The first electrode 151' may be on the passivation layer 132'. The first electrode 151' may be electrically connected to one of the source electrode 137' and the drain electrode 138'. For example, the first electrode 151' may be connected to the drain electrode 138'.

[0082] The pixel defining layer 155' may be on the first electrode 151' and may expose the defined area or specific area of ​​the first electrode 151'.

[0083] The intermediate layer 153' may be on the first electrode 151'. The intermediate layer 153' may include an organic light-emitting layer. As an optional embodiment, in addition to the organic light-emitting layer, the intermediate layer 153' may further include at least one of a hole injection layer, a hole transport layer, an electron transport layer, and an electron injection layer.

[0084] The second electrode 152' may be on the intermediate layer 153'.

[0085] The encapsulation component 160' may be on the display element 150' to protect the display element 150'.

[0086] As an optional implementation, the display module 10' may further include an optical functional layer 190'. The optical functional layer 190' may further include a layer for improving, modifying, and implementing various other suitable controls on the characteristics of the light emitted from the display element 150'.

[0087] Figure 4 A graph showing the temperature and pressure changes over time in the autoclave process of the display device according to the embodiment; Figure 5 To show in Figure 4 A cross-sectional view of air movement in the adhesive layer during time period a to b; and Figure 6 To show in Figure 4 A cross-sectional view of air movement in the adhesive layer during time period b to c.

[0088] Display device 1 (see) Figure 1 It may include a display area DA in which images are displayed and pixel circuitry is provided (see...) Figure 13 ) and the border area BZA where no image is displayed (see Figure 12 Technology has been developing towards reducing the bezel area (BZA) of the display device 1. This is achieved by removing the display module 10 (see...). Figure 1 ) and window component 20 (see Figure 1 Adhesive bubbles formed after adhesion are a side effect of the process and can generate permeating bubbles. Products with bubbles in area DA are defective. This is because adhesive layer 40 (see...) Figure 1 The bubble penetration distance affects the width of the border area BZA, so it may be necessary to reduce the bubble penetration distance by improving the material properties of the adhesive layer 40.

[0089] Autoclave processing can be performed to remove impurities from display module 10 (see...) Figure 1 ) and window component 20 (see Figure 1 Adhesive bubbles are generated after the adhesion process. Under high temperature and high pressure conditions, the autoclave process can improve the removal of adhesive bubbles with longer processing time. In some embodiments, with a longer autoclave process under high temperature and high pressure conditions, more permeable bubbles may be generated as a side effect due to the introduction of external air. When permeable bubbles permeate the border area BZA (see...) Figure 12 When the permeating bubbles permeate the display area DA (see...), the display device 1 can be considered good, but when permeating bubbles permeate the display area DA (see...), the display device 1 can be considered good. Figure 13 When this occurs, display device 1 can be considered defective.

[0090] Reference Figure 4 Describe the mechanism of autoclave process as temperature and pressure change. Under high temperature and high pressure conditions, the binder layer 40 (see...) Figure 1The adhesive can be softened, and the adhesive bubbles can be better discharged to the outside of the adhesive layer 40. For example, during time period 0 to a, temperature and pressure can be increased to create favorable conditions for removing permeating bubbles. During time period a to b, high temperature and high pressure conditions can be maintained to discharge the adhesive bubbles to the outside. During time period b to c, the autoclave process can be completed by reducing pressure and temperature.

[0091] Figure 5 Explained in Figure 4 During time period a to b, adhesive layer 40 (see Figure 1 The flow of bubbles in the adhesive layer 40, with time periods a to b corresponding to the holding time (or holding period) of the autoclave process. During time periods a to b, adhesive bubbles inside the adhesive layer 40 can be removed, but as a side effect of the autoclave process, external air can permeate the adhesive layer 40.

[0092] It can be maintained (continued) at a relatively high temperature for a period of time (e.g., time period a to b) to increase the adhesive layer 40 (see Figure 1 The adhesive layer 40 is designed to have sufficient elasticity to allow adhesive bubbles to be fully discharged from it. For example, a holding period can be maintained (continued) under high pressure to allow adhesive bubbles to be discharged to the outside of the adhesive layer 40. However, as a side effect, outside air can easily penetrate the softened adhesive layer 40 under conditions exceeding the set temperature and pressure or specific temperature and pressure. During the holding period, the temperature and pressure can be set to allow adhesive bubbles to be fully discharged from the adhesive layer 40 and to prevent the introduction of outside air. As an example, a holding period (e.g., time period a to b) of an autoclave process can be maintained at a pressure of 5 bar and a temperature of 50°C.

[0093] Figure 6 Explained in Figure 4 During time periods b to c, adhesive layer 40 (see Figure 1 The flow of bubbles in the time period b to c corresponds to the discharge time period of the autoclave process. During time period b to c, both adhesive bubbles inside the adhesive layer 40 and permeating bubbles that have already permeated the adhesive layer 40 during the holding time period can be discharged.

[0094] The venting period can be the final stage of the autoclave process, during which temperature and pressure can decrease again. During periods b to c (as the venting period), the temperature can decrease at a constant (e.g., substantially constant) level, but the pressure can decrease rapidly due to the rapid venting. This rapid pressure drop can cause the binder layer 40 (see...) Figure 1 The permeable air bubbles inside are trapped inside the adhesive layer 40 and do not escape to the outside.

[0095] Among them, adhesive layer 40 (see) Figure 1 The trapped bubbles are located in the display area DA (see) Figure 13 Display device 1 in ) (see Figure 1 This can be defective. Therefore, this document will give a description of adhesive layer 40, which has improved bubble penetration distance to ensure narrow border area BZA (see Figure 12 ), and in display module 10 (see Figure 1 ) and window component 20 (see Figure 1 They exhibit enhanced adhesion between each other.

[0096] Figure 7 To illustrate the curve showing how the bubble penetration distance changes with the stress relaxation value of the adhesive layer, and Figure 8 A graph showing the movement of air inside the adhesive layer as a function of the stress relaxation value of the adhesive layer.

[0097] refer to Figure 7 The bubble penetration distance can be related to the stress relaxation value. When the stress relaxation value is less than about 0.2, the bubble penetration distance tends to decrease, and when the stress relaxation value is at least about 0.4, permeable bubbles may not be generated.

[0098] Stress relaxation refers to the phenomenon that the internal stress of a viscoelastic object decreases over time while the object maintains a constant (e.g., substantially constant) strain.

[0099] The stress relaxation value represents the degree to which an object returns to its original state after being relaxed or compressed, and hereinafter, it can be defined as the value obtained by dividing the stress value 300 seconds after strain by the stress value 0.01 seconds after strain while maintaining 25% strain. That is, the stress relaxation value can be obtained by dividing the stress value after applying 25% strain for 300 seconds by the stress value after applying 25% strain for 0.01 seconds. According to embodiments, the stress values ​​can each be measured at 70°C. For example, the stress relaxation value can be measured at approximately 70°C.

[0100] When the stress relaxation value is close to 0, the viscoelastic object is close to a liquid and does not easily recover; when the stress relaxation value is close to 1, the viscoelastic object is close to a solid and recovers easily.

[0101] Crosslinking density refers to the ratio of crosslinked structural units to total structural units in a crosslinked polymer, and stress relaxation value can be used as a measure of crosslinking density. Stress relaxation value and crosslinking density value are directly proportional to each other, such that crosslinking density value increases with increasing stress relaxation value and decreases with decreasing stress relaxation value.

[0102] When the adhesive layer is 40 (see) Figure 1When the stress relaxation value is too small (low), the adhesive layer 40 may have a small (low) crosslinking density value, and the display module 10 (see...) Figure 1 ) and window component 20 (see Figure 1 The adhesion between them can be reduced accordingly. This can cause the window component 20 to detach from the display module 10, and cause the display device 1 (see...) Figure 1 The reliability of ) deteriorates.

[0103] When the adhesive layer is 40 (see) Figure 1 When the stress relaxation value is too high, the adhesive layer 40 can have a high crosslinking density value. This can prevent or reduce the penetration of external air and remove adhesive bubbles. However, because the adhesive layer 40 is rigid, ink step coverage and adhesion can be degraded, and the display module 10 can be difficult to apply to curved surfaces. In some embodiments, the window member 20 (see...) Figure 1 The light-shielding component 1220 on the ) (see Figure 13 The ink step coverage and adhesion of the display module 10 (see) may deteriorate, thereby affecting the display module 10 (see) Figure 1 This causes difficulties when applied to curved surfaces.

[0104] Adhesive layer 40 (see) Figure 1 This may include a display module 10 (see...) Figure 1 A material with a curved surface, high adhesion, and a stress relaxation value suitable for removing adhesive bubbles while reducing the infiltration of external air.

[0105] Adhesive layer 40 (see) Figure 1 It may include a transparent polymer that allows at least some of visible light to pass through, and as an example, it may include a transparent acrylic polymer. In other embodiments, adhesive layer 40 may be an optically transparent adhesive (OCA) layer and / or a pressure-sensitive adhesive (PSA) layer in which low molecular weight polymers and high molecular weight polymers are mixed.

[0106] Adhesive layer 40, referred to as the OCA layer (see...) Figure 1 OCAs can be manufactured by coating and curing the monomer solution using ultraviolet light (hereinafter referred to as UV curing). OCAs can be classified as UV-curable OCAs or UV-non-curable OCAs, etc.

[0107] For example, display module 10 (see [link]) can be initially cured with UV-cured monomer solution. Figure 1 ), the pre-cured UV film and window components 20 (see Figure 1The process involves bonding (lamination of the display module 10, the pre-cured UV film, and the window component 20) and then performing a second UV curing of the pre-cured UV film to create an adhesive layer 40 from the UV-curable OCA (see...). Figure 1 The pre-cured UV film can have a low stress relaxation value, exhibiting excellent ink step coverage and adhesion. Therefore, even when the pre-cured UV film has a high stress relaxation value and thus becomes hard due to secondary UV curing, UV-curable OCA can be formed with properties that can reduce the display device's performance (see [reference]). Figure 1 The weight of the relatively small thickness.

[0108] Adhesive layer 40 (see) Figure 1 At least 30% by weight of the composition may be a polymer having a molecular weight of at least 700,000 (i.e., 700,000 Daltons or greater). In some embodiments, an adhesive layer 40 may be formed by initially curing the composition, which includes a corresponding oligomer / monomer, crosslinking agent, photoinitiator, molecular weight modifier, or any combination thereof. The amount of high molecular weight acrylic polymer may be at least 30 parts by weight relative to the sum of 100 parts by weight of high molecular weight acrylic polymer and low molecular weight acrylic polymer.

[0109] After curing, adhesive layer 40 (see) Figure 1 It may have a creep value of at least about 4% at about 50°C and a modulus of about 0.04 MPa to about 0.70 MPa at about 25°C.

[0110] According to the embodiment, after curing, the adhesive layer 40 (see...) Figure 1 The creep value at about 50°C can be about 4% to about 100%, about 5% to about 90%, about 6% to about 80%, about 7% to about 70%, about 8% to about 60%, about 9% to about 50%, about 10% to about 40%, about 5% to about 20%, about 5% to about 19%, about 5% to about 18%, about 5% to about 17%, about 5% to about 16%, about 5% to about 15%, about 5% to about 14%, about 5% to about 13%, about 5% to about 12%, about 5% to about 11%, about 5% to about 10%, about 6% to about 14%, about 7% to about 13%, about 8% to about 12%, or about 9% to about 11%.

[0111] According to an embodiment, adhesive layer 40 (see...) Figure 1The modulus at about 25°C can be about 0.04 MPa to about 0.70 MPa, about 0.08 MPa to about 0.60 MPa, about 0.12 MPa to about 0.50 MPa, about 0.15 MPa to about 0.40 MPa, about 0.18 MPa to about 0.30 MPa or about 0.20 MPa.

[0112] After measuring the modulus at various temperatures using a rheometer, the modulus can be expressed as the modulus value at room temperature (25°C), which is the actual operating temperature.

[0113] According to an embodiment, adhesive layer 40 (see...) Figure 1 The adhesion force of the adhesive layer 40 can be approximately at least 300 gf / 28 mm. The adhesion force can be the average value calculated by measuring the adhesion force of the adhesive layer 40 multiple times. For example, the adhesion force of the adhesive layer 40 can be at least about 310 gf / 28 mm, at least about 320 gf / 28 mm, about 300 gf / 28 mm to about 500 gf / 28 mm, about 310 gf / 28 mm to about 400 gf / 28 mm, or about 320 gf / 28 mm to about 390 gf / 28 mm.

[0114] Forming adhesive layer 40 (see) Figure 1 The adhesive may include at least the following: oligomer, monomer, photoinitiator, crosslinking agent, and / or molecular weight regulator. The monomer may be an acrylic monomer and may contain at least one of, for example, 2-ethylhexyl acrylate (2-EHA), ethylhexyl acrylate (EHA), hydroxyethyl acrylate (HEA), and isobornyl acrylate (IBOA). As an example, adhesive layer 40 may contain a photoinitiator to have the properties of a UV-curable OCA.

[0115] Examples of adhesives may include 2-ethylhexyl acrylate (2-EHA), and the amount thereof may be 75 wt% to 85 wt% of the adhesive. Monomers may include 2-hydroxyethyl acrylate (2-HEA), and the amount thereof may be 15 wt% to 25 wt% of the adhesive. Photoinitiators may include (1-hydroxycyclohexyl)(phenyl) methyl ketone (Irgacure 184), and the amount thereof may be 0.1 wt% to 0.4 wt% of the adhesive. Crosslinking agents may include 1,6-hexanediol diacrylate (HDDA) and / or polyethylene glycol diacrylate (PEGDA), and the amount thereof may be 0.1 wt% to 0.5 wt% of the adhesive. Molecular weight modifiers may include n-dodecyl mercaptan, and the amount thereof may be 0.1 wt% to 0.2 wt% of the adhesive.

[0116] The photoinitiator of the adhesive can form free radicals via UV radiation, and these free radicals can attack the double bonds of the monomers, causing polymer chains to grow through chain reactions, thereby forming the adhesive layer 40 (see...). Figure 1 ).

[0117] An example of adhesive can be applied to display module 10 via a coating device (see example). Figure 1 ), and then UV cured into a film or membrane type, thereby forming an adhesive layer 40 (see Figure 1 As another example, the steps of preparing a film-type or film-like adhesive can be performed, and can be carried out in the manufacture of display device 1 (see...). Figure 1 The process involves using a film-type or film-based adhesive. First, as a step in preparing the film-type or film-based adhesive, the adhesive can be formed into a film-type or film-based adhesive by UV curing, and then a release film can be attached to both surfaces of the film-type or film-based adhesive. In the subsequent process of manufacturing the display device 1, the release film on one surface of the film-type or film-based adhesive can be removed, causing that one surface to adhere to the window member 20 (see...). Figure 1 Furthermore, the release film on the other surface of the film-type or film-like adhesive can be removed, allowing the other surface to adhere to the display module 10, thereby forming an adhesive layer 40.

[0118] Subsequently, the adhesive layer 40 (see...) can be applied. Figure 1 The autoclave process and optional aging process are performed to remove air bubbles adhering to the adhesive layer 40.

[0119] In some implementations, reference Figure 8 It can be seen that when the stress relaxation value is in the range of 0.06 to 0.36, the adhesive layer 40 is increased (see...). Figure 1 The amount of permeable bubbles generated and the bubble penetration distance in the data.

[0120] In adhesive layer 40 (see) Figure 1 During a time period when the stress relaxation value is 0.06 or less, bubbles can smoothly flow into and out of the adhesive layer 40 due to the low stress relaxation value, thereby reducing the bubble penetration distance and improving ink step coverage.

[0121] In adhesive layer 40 (see) Figure 1 When the stress relaxation value is in the range of 0.06 to 0.36, cross-linking of the polymer in the adhesive layer 40 can occur. When the set stress relaxation value or a specific stress relaxation value is exceeded, the movement of bubbles can be restricted, and thus the bubbles may not be able to be smoothly discharged from the adhesive layer 40, resulting in the formation of permeable bubbles.

[0122] In adhesive layer 40 (see) Figure 1During a period of time when the stress relaxation value is 0.36 or greater, a strong network may form between the polymers in the adhesive layer 40, which can prevent or reduce air penetration into the adhesive layer 40, thereby reducing the chance of generating permeable bubbles.

[0123] According to an embodiment, adhesive layer 40 (see...) Figure 1 The adhesive layer 40 can have a stress relaxation value of 0.01 to 0.07 before curing and 0.30 to 0.50 after curing. It is formed by curing the adhesive and, after curing, comprises at least: a high molecular weight acrylic polymer having a first weight-average molecular weight of at least 700,000 (i.e., 700,000 Daltons or greater), a low molecular weight acrylic polymer having a second weight-average molecular weight of less than 500,000 (i.e., less than 500,000 Daltons), a crosslinking agent, a photoinitiator, a molecular weight modifier, or any combination thereof. The amount of the high molecular weight acrylic polymer can be at least 30 parts by weight relative to the sum of 100 parts by weight of the high molecular weight acrylic polymer and the low molecular weight acrylic polymer. The adhesive layer 40 can include a UV-curable OCA and its weight-average molecular weight can be measured using gel permeation chromatography (GPC).

[0124] According to adhesive layer 40 (see) Figure 1 In the embodiments of the invention, the amount of high molecular weight acrylic polymer may be about 30 parts by weight to about 99 parts by weight, about 30 parts by weight to about 95 parts by weight, about 30 parts by weight to about 90 parts by weight, about 30 parts by weight to about 85 parts by weight, about 30 parts by weight to about 80 parts by weight, about 30 parts by weight to about 75 parts by weight, about 30 parts by weight to about 70 parts by weight, about 30 parts by weight to about 65 parts by weight, about 30 parts by weight to about 60 parts by weight, about 30 parts by weight to about 55 parts by weight, about 30 parts by weight to about 50 parts by weight, about 30 parts by weight to about 45 parts by weight, about 30 parts by weight to about 40 parts by weight, or about 30 parts by weight to about 35 parts by weight, relative to the sum of 100 parts by weight of high molecular weight acrylic polymer and low molecular weight acrylic polymer.

[0125] According to adhesive layer 40 (see) Figure 1In some embodiments, the stress relaxation value of the adhesive layer 40 before curing may be approximately 0.01 to approximately 0.40, approximately 0.01 to approximately 0.30, approximately 0.01 to approximately 0.20, approximately 0.01 to approximately 0.12, approximately 0.01 to approximately 0.11, approximately 0.01 to approximately 0.10, approximately 0.01 to approximately 0.09, approximately 0.01 to approximately 0.08, approximately 0.01 to approximately 0.05, approximately 0.02 to approximately 0.40, approximately 0.02 to approximately 0.30, approximately 0.02 to approximately 0.20, or approximately 0.02 to approximately 0.12. About 0.02 to about 0.11, about 0.02 to about 0.10, about 0.02 to about 0.09, about 0.02 to about 0.08, about 0.02 to about 0.05, about 0.03 to about 0.40, about 0.03 to about 0.30, about 0.03 to about 0.20, about 0.03 to about 0.15, about 0.03 to about 0.12, about 0.03 to about 0.11, about 0.03 to about 0.10, about 0.03 to about 0.09, about 0.03 to about 0.08 or about 0.03 to about 0.05.

[0126] According to adhesive layer 40 (see) Figure 1 In this embodiment, the stress relaxation value of the adhesive layer 40 after curing can be from about 0.20 to about 0.70, and can be, for example, from about 0.20 to about 0.65, from about 0.20 to about 0.60, from about 0.20 to about 0.55, from about 0.20 to about 0.50, from about 0.20 to about 0.45, from about 0.20 to about 0.40, from about 0.20 to about 0.35, from about 0.20 to about 0.30, from about 0.20 to about 0.25, from about 0.25 to about 0.65, from about 0.25 to about 0.60, from about 0.25 to about 0.55, from about 0.25 to about 0.50, from about 0.25 to about 0.45, from about 0.25 to about 0.40, from about 0.25 to about 0.35, or from about 0.25 to about 0.30. The adhesive can be cured by irradiating it with ultraviolet light in an amount from about 500 mJ to about 1500 mJ.

[0127] According to adhesive layer 40 (see) Figure 1 In this embodiment, the stress relaxation value of the cured adhesive layer 40 can be greater than the stress relaxation value of the adhesive layer 40 before curing. The range of stress relaxation value can be from about 50% to about 600%, for example, from about 70% to about 560%.

[0128] According to adhesive layer 40 (see) Figure 1 In some embodiments, the first weight-average molecular weight may be about 700,000 Daltons to about 3,000,000 Daltons. For example, the first weight-average molecular weight may be about 700,000 Daltons to about 1,500,000 Daltons or about 700,000 Daltons to about 1,000,000 Daltons.

[0129] According to adhesive layer 40 (see) Figure 1 In some embodiments, the second weight-average molecular weight can be about 50,000 Daltons to about 490,000 Daltons. For example, the second weight-average molecular weight can be about 70,000 Daltons to about 400,000 Daltons or about 100,000 Daltons to about 300,000 Daltons.

[0130] According to adhesive layer 40 (see) Figure 1 In the embodiments of the invention, each of the high molecular weight acrylic polymer and the low molecular weight acrylic polymer may be a polymer of the first compound 2-ethylhexyl acrylate and the second compound 2-hydroxyethyl acrylate.

[0131] According to adhesive layer 40 (see) Figure 1 In an embodiment where the high molecular weight acrylic polymer is a polymer of the first compound and the second compound, the amount of the first compound may be about 75 parts by weight to about 85 parts by weight relative to a total of 100 parts by weight of the high molecular weight acrylic polymer, and the amount of the second compound may be about 15 parts by weight to about 25 parts by weight.

[0132] According to adhesive layer 40 (see) Figure 1 In another embodiment, when the low molecular weight acrylic polymer is a polymer of the first compound and the second compound, the amount of the first compound may be about 75 parts by weight to about 85 parts by weight relative to a total of 100 parts by weight of the low molecular weight acrylic polymer, and the amount of the second compound may be about 15 parts by weight to about 25 parts by weight.

[0133] Adhesive layer 40 (see) Figure 1 The crosslinking agent included in the adhesive layer 40 may be 1,6-hexanediol diacrylate and / or polyethylene glycol diacrylate. According to an embodiment, the adhesive layer 40 may further include a crosslinking agent, and the amount of the crosslinking agent may be from about 0.01 parts by weight to about 0.5 parts by weight relative to the sum of 100 parts by weight of high molecular weight acrylic polymer and low molecular weight acrylic polymer.

[0134] Adhesive layer 40 (see) Figure 1 The photoinitiator included in the adhesive layer 40 may be (1-hydroxycyclohexyl)(phenyl) methyl ketone. According to an embodiment, the adhesive layer 40 may further include a photoinitiator, and the amount of the photoinitiator may be from about 0.01 parts by weight to about 0.4 parts by weight relative to the sum of 100 parts by weight of the high molecular weight acrylic polymer and the low molecular weight acrylic polymer.

[0135] Adhesive layer 40 (see) Figure 1The molecular weight regulator included in the adhesive layer 40 may be n-dodecyl mercaptan. According to an embodiment, the adhesive layer 40 may further include a molecular weight regulator, and the amount of the molecular weight regulator may be from about 0.01 parts by weight to about 0.2 parts by weight relative to the sum of 100 parts by weight of high molecular weight acrylic polymer and low molecular weight acrylic polymer.

[0136] With adhesive layer 40 (see) Figure 1 Unlike other adhesive layers, as another example of having the advantage of having a stress relaxation value of 0.06 or less in the case where the stress relaxation value is 0.36 or greater in the case where the stress relaxation value is 0.36 or greater, adhesive layers with different stress relaxation values ​​before and after curing can be introduced, i.e., multiple adhesive layers with different stress relaxation values ​​can be introduced.

[0137] Figure 9 This is a schematic cross-sectional view of the adhesive layer according to an embodiment.

[0138] The adhesive layer 70 may include a first adhesive layer 410 and a second adhesive layer 420. The first adhesive layer 410 may be on the second adhesive layer 420. Based on the z-axis, the first adhesive layer 410 may be on the second adhesive layer 420.

[0139] The first adhesive layer 410 may have a stress relaxation value smaller than that of the second adhesive layer 420. The first adhesive layer 410 may have a stress relaxation value of 0.01 to 0.07 before curing and a stress relaxation value of 0.30 to 0.50 after curing.

[0140] The first adhesive layer 410 is accessible to the window component 20 (see...) Figure 1 The first adhesive layer 410 may have a relatively low stress relaxation value of 0.01 to 0.07 before curing to ensure adequate adhesion to the window member 20, and a suitably or sufficiently low crosslinking density value to reduce permeable bubbles, allowing for smooth airflow and outflow. In this embodiment, the first adhesive layer 410 with a relatively low stress relaxation value before curing exhibits good ink step coverage and ensures application to curved structures (e.g., curved surfaces).

[0141] The adhesive in the first adhesive layer 410 can adhere to the window member 20 (see...). Figure 1 After curing, it adheres fully to the window member 20. This increases the stress relaxation value of the first adhesive layer 410 and reduces the formation of permeable bubbles.

[0142] The first adhesive layer 410 may have a relatively high stress relaxation value of 0.30 to 0.50 after curing, and a suitable or sufficiently high crosslinking density value to reduce permeable bubbles, thereby preventing or reducing air permeation.

[0143] The second adhesive layer 420 may have a stress relaxation value of 0.4 to 0.6 both before and after curing. The second adhesive layer 420 may have a stress relaxation value higher than that of the first adhesive layer 410 before and after curing, and appropriately or sufficiently high to reduce permeable air bubbles. Accordingly, the second adhesive layer 420 may block or reduce the introduction of external air and reduce the permeation of air bubbles.

[0144] The first adhesive layer (410) may be adopted as a reference. Figure 7 and Figure 8 The adhesive layer 40 described (see Figure 1 As long as it does not conflict with the description above, it is acceptable.

[0145] Figure 10 This is a schematic cross-sectional view of an adhesive layer according to another embodiment.

[0146] The adhesive layer 50 may include a first adhesive layer 510 and a second adhesive layer 520 on the first adhesive layer 510. Based on the z-axis, the second adhesive layer 520 may be on the first adhesive layer 510.

[0147] The first adhesive layer 510 may have a stress relaxation value smaller than that of the second adhesive layer 520. The first adhesive layer 510 may have a stress relaxation value of 0.01 to 0.07 before curing and a stress relaxation value of 0.30 to 0.50 after curing.

[0148] The first adhesive layer 510 is accessible to the display module 10 (see...) Figure 1 The first adhesive layer 510 may have a relatively low stress relaxation value of 0.01 to 0.07 before curing to ensure adequate adhesion to the display module 10, and a suitably or sufficiently low crosslinking density value to reduce permeable bubbles, allowing for smooth airflow and outflow. In this embodiment, the first adhesive layer 510 with a relatively low stress relaxation value before curing exhibits good ink step coverage and ensures application to curved structures (e.g., curved surfaces).

[0149] The adhesive in the first adhesive layer 510 can adhere to the display module 10 (see...). Figure 1 After curing, it fully adheres to the display module 10. This increases the stress relaxation value of the first adhesive layer 410 and reduces the formation of permeable bubbles.

[0150] The first adhesive layer 510 may have a relatively high stress relaxation value of 0.30 to 0.50 after curing, and a suitable or sufficiently high crosslinking density value to reduce permeable bubbles, thereby preventing or reducing air permeation.

[0151] The second adhesive layer 520 may have a stress relaxation value of 0.4 to 0.6 both before and after curing. The second adhesive layer 520 may have a higher stress relaxation value than the first adhesive layer 510 before and after curing, and appropriately or sufficiently high, to reduce permeable air bubbles. Accordingly, the second adhesive layer 520 may block or reduce the introduction of external air and reduce the permeation of air bubbles.

[0152] The first adhesive layer 510 may be adopted as referenced. Figure 7 and Figure 8 The adhesive layer 40 described (see Figure 1 As long as it does not conflict with the description above, it is acceptable.

[0153] Figure 11 This is a schematic cross-sectional view of an adhesive layer according to yet another embodiment.

[0154] The adhesive layer 60 may include a first adhesive layer 610, a second adhesive layer 620 on the first adhesive layer 610, and a third adhesive layer 630 on the second adhesive layer 620. Based on the z-axis, the second adhesive layer 620 may be on the first adhesive layer 610, and the third adhesive layer 630 may be on the second adhesive layer 620.

[0155] The first adhesive layer 610 and the third adhesive layer 630 may have stress relaxation values ​​smaller than those of the second adhesive layer 620. The first adhesive layer 610 and the third adhesive layer 630 may have stress relaxation values ​​of 0.01 to 0.07 before curing and 0.30 to 0.50 after curing. In an optional embodiment, the first adhesive layer 610 and the third adhesive layer 630 may have the same stress relaxation value.

[0156] The first adhesive layer 610 is accessible to the display module 10 (see...) Figure 1 ), and the third adhesive layer 630 is accessible to the window member 20 (see Figure 1The first adhesive layer 610 and the third adhesive layer 630 may have a relatively low stress relaxation value of 0.01 to 0.07 before curing, so that the first adhesive layer 610 adheres sufficiently to the display module 10 and the third adhesive layer 630 adheres sufficiently to the window member 20, and may have an appropriately or sufficiently low crosslinking density value to reduce permeable bubbles, allowing air to flow in and out smoothly. In some embodiments, the first adhesive layer 610 and the third adhesive layer 630 having a relatively low stress relaxation value before curing can exhibit good ink step coverage and ensure application to curved structures (e.g., curved surfaces).

[0157] The adhesive in adhesive layer 60 can adhere to display module 10 (see...) Figure 1 After curing, the first adhesive layer 610 is fully adhered to the display module 10, and the third adhesive layer 630 is fully adhered to the window member 20 (see...). Figure 1 This increases the stress relaxation value of the adhesive layer 60 and reduces the formation of permeable bubbles.

[0158] The first adhesive layer 610 and the third adhesive layer 630 may have a relatively high stress relaxation value of 0.30 to 0.50 after curing, and a suitable or sufficiently high crosslinking density value to reduce permeable bubbles, thereby preventing or reducing air permeation.

[0159] The second adhesive layer 620 may be located between the first adhesive layer 610 and the third adhesive layer 630. The second adhesive layer 620 may have a stress relaxation value of 0.4 to 0.6 both before and after curing, and the stress relaxation value may be appropriately or sufficiently high to reduce permeable air bubbles. Accordingly, the second adhesive layer 620 may block or reduce the introduction of external air and reduce the permeation of air bubbles.

[0160] In one embodiment, a second adhesive layer 620 may be located between a first adhesive layer 610 and a third adhesive layer 630, the first adhesive layer 610 and the third adhesive layer 630 having a lower stress relaxation value than the second adhesive layer 620. Accordingly, the second adhesive layer 620, which has relatively low adhesion due to its relatively high stress relaxation value, may be supplemented by the first adhesive layer 610 and the third adhesive layer 630, which have relatively high adhesion due to their relatively low stress relaxation value, acting as an outer layer. By sequentially stacking the second adhesive layer 620 on the first adhesive layer 610 and the third adhesive layer 630 on the second adhesive layer 620, the display device 1 (see [reference]) can be improved. Figure 1 Structural stability.

[0161] The first adhesive layer 610 and the third adhesive layer 630 may each adopt a reference. Figure 7 and Figure 8 The adhesive layer 40 described (see Figure 1 As long as it does not conflict with the description above, it is acceptable.

[0162] Figure 12 This is a plan view of a display device according to another embodiment, and Figure 13 For including Figure 12 A schematic cross-sectional view of the edge region.

[0163] refer to Figure 12 The display device 1000 can display an image that is parallel to each of the x-axis and y-axis and oriented towards the z-axis. The display area DA for displaying the image may correspond to the front surface of the display device 1000. The image may include still images and moving images.

[0164] In an implementation, the front (or upper) and rear (or lower) surfaces of each component can be defined based on the orientation in which the image is displayed. The front and rear surfaces can be opposite to each other in the z-axis direction, and the normal directions of the corresponding front and rear surfaces can be parallel (e.g., substantially parallel to) the z-axis direction.

[0165] The front surface of the display device 1000 can be divided into a display area DA and a border area BZA, which serves as a non-display area.

[0166] The display area DA can be the area in which an image is displayed. A user can view the image through the display area DA. In one embodiment, the display area DA is depicted as a rectangular shape with rounded vertices. However, this is merely an example, and the display area DA can have various suitable shapes and is not limited to any one embodiment.

[0167] The border area BZA, which is a non-display area, may be adjacent to the display area DA. The border area BZA may have a set color or a specific color. The border area BZA may surround the display area DA (e.g., encircle the display area DA). Accordingly, the shape of the display area DA may be substantially defined by the border area BZA. However, this is only an example, and the border area BZA may only be adjacent to one side of the display area DA, or the border area BZA may be omitted.

[0168] Figure 13 This is a cross-sectional view of the display module 1010 and window member 1020 at the unbent edge of the display device 1000 according to the embodiment.

[0169] The display device 1000 may include a display module 1010 and a window component 1020 on the display module 1010.

[0170] Display module 1010 may include components related to the above-described display module 10 (see...). Figure 2) and display module 10' (see Figure 3 The configuration is the same as or similar to that of the display module 1010. In embodiments with the same or similar configuration, the display panel 1100 of the display module 1010 can be used as is. Figure 2 or Figure 3 The structure.

[0171] The display module 1010 may include a display panel 1100, an optical functional layer 1190 on the display panel 1100, and a patterned film layer 1170 under the display panel 1100.

[0172] Display panel 1100 can display images based on electrical signals. For example, display panel 1100 may be a panel that displays images by inputting data signals, and examples of display panel 1100 may include organic light-emitting display panels, liquid crystal display panels, plasma display panels, electrophoretic display panels, electrowetting display panels, quantum dot light-emitting display panels, and / or micro light-emitting diode (LED) display panels, etc. In the illustrated embodiments, examples in which an organic light-emitting display panel is used as display panel 1100 will be described.

[0173] In this implementation, the display area DA is depicted as a rectangular shape, but this is merely an example. For instance, the display area DA can have various suitable shapes and is not limited to any one implementation.

[0174] Display panel 1100 may be a display panel of a light-emitting type or category. For example, display panel 1100 may be an organic light-emitting display panel and / or a quantum dot light-emitting display panel. The emitting layer of an organic light-emitting display panel may include organic light-emitting materials. The emitting layer of a quantum dot light-emitting display panel may include quantum dots and / or quantum rods, etc. Hereinafter, display panel 1100 will be described as an organic light-emitting display panel.

[0175] As an optional implementation, the optical functional layer 1190 may be located on the upper surface of the display panel 1100. The optical functional layer 1190 may include, but is not limited to, a polarizing layer, a microlens film, and / or a prism film.

[0176] The optical functional layer 1190 may be attached to the upper surface of the display panel 1100. In one embodiment, an adhesive layer including an adhesive material may be on the lower surface of the optical functional layer 1190. The optical functional layer 1190 may be attached to the upper surface of the display panel 1100 via the adhesive layer. The adhesive layer including the adhesive material may include an optically transparent adhesive layer and / or a transparent resin adhesive layer, etc. For example, the adhesive material may include an optically transparent pressure-sensitive adhesive (PSA).

[0177] As an optional embodiment, the patterned film layer 1170 may be on the lower surface of the display panel 1100. In embodiments, the patterned film layer 1170 may include polyethylene terephthalate (PET), polyimide (PI), polycarbonate (PC), polyethylene (PE), polypropylene (PP), polysulfone (PSF), polymethyl methacrylate (PMMA), triacetyl cellulose (TAC), and / or cyclic olefins, etc.

[0178] Window component 1020 may be on display module 1010. For example, window component 1020 may be on the front surface of display module 1010, for example, on a surface in the z-axis direction. In an embodiment, window component 1020 may contact the front surface of display module 1010.

[0179] Window component 1020 may include window 1210 and light-shielding component 1220.

[0180] Window component 1020 may be on display module 1010. Window 1210 may be attached to display module 1010 via adhesive layer 1040. Window 1210 may protect display module 1010 from external impacts and provide an input surface and / or display surface for the user. Window 1210 may include a transparent material capable of transmitting images. For example, window 1210 may include glass, sapphire, and / or polymers (e.g., plastic).

[0181] Although window 1210 is illustrated as a single layer, it is not limited to this and may have a multi-layer structure. The multi-layer structure can be formed by a continuous process (e.g., a substantially continuous process) or by an adhesion process using adhesive layers. In embodiments, window 1210 may be wholly or partially resilient.

[0182] Window component 1020 may include light-shielding component 1220 to prevent or reduce the visibility of the attached material provided in the border area BZA to the user.

[0183] The light-shielding member 1220 may be an organic film comprising a colored organic material. For example, the light-shielding member 1220 may be a black organic film. The light-shielding member 1220 may be formed by coating a colored organic material onto the rear surface of the window 1210 in the region of the edge of the window 1210.

[0184] A light-shielding member 1220 may be provided in a region of window 1210. For example, the light-shielding member 1220 may be located in a corresponding region on the lower side of window 1210. The lower surface of the light-shielding member 1220 may be aligned with the lower surface of window 1210.

[0185] The light-shielding member 1220 may be formed around the outer periphery of the window 1210 (e.g., around the outer periphery of the window 1210). In an embodiment, the light-shielding member 1220 may be provided substantially in the border region BZA.

[0186] Adhesive layer 1040 may be located between display module 1010 and window member 1020. Adhesive layer 1040 may include adhesive layer 40 as described above (see...). Figure 9 ), Adhesive layer 50 (see) Figure 10 ) and adhesive layer 60 (see Figure 11 The configuration is the same as or similar to that of the other party. In embodiments with the same or similar configuration, the adhesive layer 1040 may be used as is. Figures 9 to 11 The structure.

[0187] At least one area of ​​the adhesive layer 1040 is accessible to the window 1210, and at least another area of ​​the adhesive layer 1040 is accessible to the light-shielding member 1220.

[0188] In embodiments where the light-shielding member 1220 is provided below the edge of the window 1210, the adhesive layer 1040 may extend from the bottom of the window 1210 to cover the area below the light-shielding member 1220. In embodiments where the light-shielding member 1220 is located in a corresponding area on the lower side of the window 1210, the adhesive layer 1040 may extend from the bottom of the window 1210 to the area below the light-shielding member 1220.

[0189] The adhesive layer 1040 can contact both the window 1210 and the light-shielding member 1220 to ensure that the window 1210 and the light-shielding member 1220 are stably stacked on the display module 1010, thereby achieving the structural stability of the display device 1000.

[0190] The adhesive layer 1040 may include multiple layers with different stress relaxation values, and among the multiple layers, the layer with a relatively small stress relaxation value before curing may have an improved degree of adhesion to the structure in contact with the layer.

[0191] In some embodiments, the adhesive layer 1040 may have a stress relaxation value that allows for the release of adhesive bubbles and improves bubble penetration distance. This can improve ink step coverage of the display device 1000 and reduce the defect rate.

[0192] Figure 14 This is a schematic cross-sectional view of a display device according to yet another embodiment.

[0193] Figure 14 This is a cross-sectional view of the display module 1010', window member 1020', and lower module 1030' at the bent edge of the display device 1000' according to the embodiment.

[0194] Display device 1000' may include display module 1010', lower module 1030' below display module 1010', and window component 1020' on display module 1010'.

[0195] Display module 1010' may include the same display module 10 as described above (see...). Figure 2 ) and display module 10' (see Figure 3 The configuration is the same as or similar to that of the display module 1010'. In embodiments with the same or similar configuration, the display panel 1100' of the display module 1010' can be used as is. Figure 2 or Figure 3 The structure.

[0196] The display module 1010' may include a display panel 1100', an optical functional layer 1190' on the display panel 1100', a patterned film layer 1170' under the display panel 1100', and a bending protection layer 1180' providing bending protection in the bending area.

[0197] The display panel 1100', the patterned film layer 1170', and the optical functional layer 1190' can each have the same characteristics as... Figure 13 The display panel 1100, the patterned film layer 1170, and the optical functional layer 1190 have the same configuration and effect.

[0198] The display panel 1100' may further include a flexible substrate comprising a flexible polymer material (e.g., polyimide). Accordingly, the display panel 1100' may be bendable, foldable, and / or rollable.

[0199] In some embodiments, the display panel 1100' may further include: a bending region BA, which is flexible and folded in one direction; and a flat region FA, which is continuous with at least one side of the bending region BA and is flat and not bent. The flat region FA may be flexible or not.

[0200] In one embodiment, the bent region BA may be provided in the non-display region NDA. However, the bent region BA is not limited thereto and may also be provided in the display region DA. The flat region FA may include a first flat region FA1 and a second flat region FA2 spaced apart from each other, with the bent region BA between the first flat region FA1 and the second flat region FA2. The first flat region FA1 may be provided in the display region DA and at least a portion of the non-display region NDA. The bent region BA may be continuous with the first flat region FA1 and may be provided in the non-display region NDA. The second flat region FA2 may be continuous with the bent region BA and may be provided in the non-display region NDA. The bent region BA and the second flat region FA2 may be provided in at least a portion of the protruding area of ​​the non-display region NDA.

[0201] Within the bending region BA, the display panel 1100' is bendable and has curvature in the downward direction, for example, in the direction opposite to the display surface. The bending region BA may have a constant (e.g., substantially constant) radius of curvature, but is not limited to this, and may have different radii of curvature for each portion. For example, the display panel 1100' may have a semi-circular or semi-elliptical shape within the bending region BA.

[0202] A patterned film layer 1170' may be present on the lower surface of the display panel 1100'. The patterned film layer 1170' may be present between the display panel 1100' and the upper adhesive layer included in the cover panel 1310' to prevent or reduce contact between the display panel 1100' and the lower module 1030' disposed below the display panel 1100'.

[0203] The patterned film layer 1170' may include a first patterned film 1171' and a second patterned film 1172' spaced apart from each other along a direction perpendicular to (e.g., substantially perpendicular to) the z-axis. The patterned film layer 1170' may be provided in at least a portion of the flat region FA. The patterned film layer 1170' may not be provided in the bending region BA. For example, the first patterned film 1171' may be provided in at least a portion of the first flat region FA1, and the second patterned film 1172' may be provided in at least a portion of the second flat region FA2. Accordingly, the inner surface of the display panel 1100' may be exposed to the cover panel 1310'.

[0204] The bending protective layer 1180' may be on a portion of the display panel 1100'. In one embodiment, the bending protective layer 1180' may be on a portion of the bending area BA of the display panel 1100'. However, it is not limited thereto, and the bending protective layer 1180' may also be on a portion of the non-display area NDA in addition to being on a portion of the bending area BA.

[0205] The bending protection layer 1180' may include a polymer compound (e.g., polyimide, acrylate, and / or epoxy resin). The bending protection layer 1180' can minimize or reduce the occurrence of cracks caused by the stress applied to the display panel 1100' when the display panel 1100' is bent, and prevent or reduce the propagation of cracks. Accordingly, the display module 1010' can achieve improved durability.

[0206] The lower module 1030' may be located below the display module 1010'. For example, the lower module 1030' may be located on the rear surface of the display module 1010', that is, on the surface opposite to the z-axis direction. In an embodiment, the lower module 1030' may contact the rear surface of the display module 1010'.

[0207] With the display module 1010' bent, the lower module 1030' can be located between the various parts of the display module 1010' in the z-axis direction. For example, in the z-axis direction, the lower module 1030' can be located between the first patterned film 1171' and the second patterned film 1172'.

[0208] The lower module 1030' may include a cover panel 1310' and a cover spacer 1320'.

[0209] Cover panel 1310' may be on the lower surface of the first patterned film 1171'. Cover panel 1310' may be attached to the patterned film layer 1170' below display panel 1100' via an upper adhesive layer included in cover panel 1310'.

[0210] The cover panel 1310' can implement functions such as heat dissipation, electromagnetic interference shielding, buffering, and / or strength enhancement.

[0211] When the display panel 1100' is bent, the cover spacer 1320' can control the degree (or curvature) of the bending of the display panel 1100' by maintaining a constant (e.g., substantially constant) distance between the cover panel 1310' and the display panel 1100'.

[0212] In an embodiment, the cover spacer 1320' may comprise an elastic material and / or a material capable of providing support that is suitable for the design requirements of the display panel 1100'. For example, the cover spacer 1320' may comprise a thermoplastic elastomer (e.g., polyurethane thermoplastic elastomer), polystyrene, and / or polyolefins, etc. As another example, the cover spacer 1320' may comprise polycarbonate (PC), polyimide (PI), and / or polyethylene terephthalate (PET), etc.

[0213] The window 1210' and the light-shielding member 1220' included in the window member 1020' may have the same characteristics as... Figure 13 The configuration and effect of window 1210 and light-blocking component 1220 are the same.

[0214] Window 1210' can be attached to display module 1010' via adhesive layer 1040'. At least one area of ​​adhesive layer 1040' is in contact with window 1210', and at least another area of ​​adhesive layer 1040' is in contact with light-shielding member 1220'.

[0215] Adhesive layer 1040' may be located between display module 1010' and window member 1020'. Adhesive layer 1040' may include adhesive layer 40 as described above (see...). Figure 9 ), Adhesive layer 50 (see) Figure 10 ) and adhesive layer 60 (see Figure 11 The configuration is the same as or similar to that of the other party. In embodiments with the same or similar configuration, the adhesive layer 1040' may be used as is. Figures 9 to 11 The structure.

[0216] In an embodiment where the light-shielding member 1220' is below the edge of the window 1210', the adhesive layer 1040' may extend from the bottom of the window 1210' to cover the area below the light-shielding member 1220'. In an embodiment where the light-shielding member 1220' is located in the corresponding area on the lower side of the window 1210', the adhesive layer 1040' may extend from the bottom of the window 1210' to the area below the light-shielding member 1220'.

[0217] The adhesive layer 1040' can contact both the window 1210' and the light-shielding member 1220' to ensure that the window 1210' and the light-shielding member 1220' are stably stacked on the display module 1010', thereby achieving the structural stability of the display device 1000'.

[0218] The adhesive layer 1040' may include at least one layer having a stress relaxation value of 0.01 to 0.07 before curing and a stress relaxation value of 0.3 to 0.5 after curing, and another layer having a stress relaxation value greater than that of the at least one layer before and after curing. By including layers with relatively low stress relaxation values, the display module 1010' can be easily formed into a curved shape.

[0219] The adhesive layer 1040' may include multiple layers with different stress relaxation values, and among the multiple layers, the layer with a relatively small stress relaxation value before curing may have a degree of improved adhesion to the configuration in contact with the layer.

[0220] In some embodiments, the adhesive layer 1040' may be configured with a stress relaxation value that allows for the release of adhesive bubbles and improves bubble penetration distance. This can improve ink step coverage of the display device 1000 and reduce the defect rate.

[0221] Each of the above embodiments can be implemented independently, but in the embodiments, the structure of each embodiment can be combined with other embodiments.

[0222] Therefore, the subject matter of this disclosure has been described with reference to embodiments illustrated in the accompanying drawings; however, these are merely examples, and those skilled in the art will understand that various suitable modifications and variations can be made to the embodiments. Thus, the true scope of protection of this disclosure should be defined by the scope of the claims and their equivalents.

[0223] The specific embodiments described herein in conjunction with implementation methods are merely examples and do not limit the scope of this disclosure in any way. Furthermore, unless otherwise indicated by terms such as "essential" and "important," components may not be necessary for the application of this disclosure.

[0224] In the description of the embodiments (e.g., in the claims), the term "described" and similar reference terms may refer to both the singular and the plural. Furthermore, when a scope is described in an embodiment, this includes embodiments applying individual values ​​that fall within the scope (unless otherwise described in the opposite way), and each individual value constituting the scope is described in a specific embodiment. Finally, unless otherwise expressly indicated herein or otherwise obviously contradicted by the context, the processes of the method according to the embodiments may be performed in any suitable order. The embodiments are not necessarily limited to the order of the processes described above. The use of any illustrative or explanatory terms in the embodiments is solely for the purpose of describing the embodiments in more detail, and the scope of the embodiments is not limited by illustrative or explanatory terms unless limited by the claims. Furthermore, those skilled in the art will understand that various suitable modifications, combinations, and changes may be made within the scope of the claims or their equivalents, depending on design conditions and factors.

[0225] Figure 15 This is a block diagram of an electronic device according to an embodiment.

[0226] Electronic device 101 can output various appropriate types or categories of information via display module 10 in the operating system. In an embodiment where processor 1800 executes an application stored in memory 1200, display module 10 can provide application information to the user via display panel 1100.

[0227] The processor 1800 can obtain external input through the input module 1300 and / or the sensor module 1610, and execute an application corresponding to the external input. For example, when a user selects the camera icon displayed on the display panel 1100, the processor 1800 can obtain user input through the input sensor 1610-2 and activate the camera module 1710. The processor 1800 can transmit image data corresponding to the captured image obtained by the camera module 1710 to the display module 10. The display module 10 can display the image corresponding to the captured image through the display panel 1100.

[0228] As another example, in an implementation where personal information authentication is performed in the display module 10, the fingerprint sensor 1610-1 can acquire the input fingerprint information as input data. The processor 1800 can compare the input data acquired by the fingerprint sensor 1610-1 with the authentication data stored in the memory 1200, and execute the application based on the comparison result. The display module 10 can display information executed according to the logic of the application through the display panel 1100.

[0229] As another example, in an embodiment where a music stream icon is selected to be displayed on display module 10, processor 1800 obtains user input via input sensor 1610-2 and activates a music stream application stored in memory 1200. In an embodiment where a music execution command is entered into the music stream application, processor 1800 can activate audio output module 1630 to provide the user with audio information corresponding to the music execution command.

[0230] The operation of electronic device 101 has been briefly described so far. The configuration of electronic device 101 will be described in more detail below. Some of the corresponding components of electronic device 101 described below may be provided as an integrated component, and a component may be provided as two or more components.

[0231] refer to Figure 15 Electronic device 101 can communicate with external electronic device 102 via a network (e.g., a short-range wireless communication network and / or a long-range wireless communication network). According to embodiments, electronic device 101 may include a processor 1800, a memory 1200, an input module 1300, a display module 10, a power module 1500, an internal module 1600, and an external module 1700. According to embodiments, electronic device 101 may exclude at least one of the components, or may additionally include at least one component. In embodiments, some of the aforementioned components (e.g., sensor module 1610, antenna module 1620, and / or audio output module 1630) may be integrated into another component (e.g., display module 10).

[0232] Processor 1800 executes software to control at least one other component (e.g., hardware and / or software components) of electronic device 101 connected to processor 1800, and performs various appropriate data processing and / or operations. According to embodiments, as at least some of the data processing and / or operations, processor 1800 may store commands and / or data received from another component (e.g., input module 1300, sensor module 1610, and / or communication module 1730) in volatile memory 1201, process the commands and / or data stored in volatile memory 1201, and store the result data in non-volatile memory 1202.

[0233] Processor 1800 may include a main processor 1810 and an auxiliary processor 1820. Main processor 1810 may include one or more of a central processing unit (CPU) 1810-1 and an application processor (AP). Main processor 1810 may further include one or more of a graphics processing unit (GPU) 1810-2, a communication processor (CP), and an image signal processor (ISP). Main processor 1810 may further include a neural processing unit (NPU) 1810-3. The NPU may be a processor dedicated to processing an artificial intelligence model, and the artificial intelligence model may be created through machine learning. The artificial intelligence model may include multiple layers of artificial neural networks. The artificial neural network may be one of a deep neural network (DNN), a convolutional neural network (CNN), a recurrent neural network (RNN), a restricted Boltzmann machine (RBM), a deep belief network (DBN), a bidirectional recurrent deep neural network (BRDNN), and a deep Q-network, or a combination of two or more of these networks, but is not limited to the examples above. In addition to the hardware architecture, the artificial intelligence model may additionally or optionally include a software architecture. At least two of the aforementioned processing units and processors may be implemented as a single integrated configuration (e.g., a single chip), or the respective processing units and processors may be implemented as independent components (e.g., multiple chips).

[0234] The auxiliary processor 1820 may include a controller 1820-1. The controller 1820-1 may include interface conversion circuitry and timing control circuitry. The controller 1820-1 may receive image signals from the main processor 1810 and output image data by converting the data format of the image signals to conform to the interface specifications with the display module 10. The controller 1820-1 may output various appropriate control signals used or required for the operation of the display module 10.

[0235] The auxiliary processor 1820 may further include a data conversion circuit 1820-2, a gamma correction circuit 1820-3, and a rendering circuit 1820-4, etc. The data conversion circuit 1820-2 may receive image data from the controller 1820-1 and compensate the image data according to the characteristics of the electronic device 101 and / or user settings to display the image with appropriate or desired brightness; and / or may convert the image data to reduce power consumption and / or compensate for afterimages. The gamma correction circuit 1820-3 may convert the image data and / or gamma reference voltage so that the image displayed on the electronic device 101 has appropriate or desired gamma characteristics. The rendering circuit 1820-4 may receive image data from the controller 1820-1 and render the image data by taking into account the pixel arrangement of the display panel 1100 applied to the electronic device 101. At least one of the data conversion circuit 1820-2, gamma correction circuit 1820-3, and rendering circuit 1820-4 may be integrated into another component (e.g., the main processor 1810 and / or the controller 1820-1). At least one of the data conversion circuit 1820-2, gamma correction circuit 1820-3, and rendering circuit 1820-4 may be integrated into the data driver 1430, which will be described herein.

[0236] The memory 1200 may store various suitable types of data used by at least one component of the electronic device 101 (e.g., processor 1800 and / or sensor module 1610), as well as input data and / or output data for commands associated with the various suitable types of data. The memory 1200 may include at least one of volatile memory 1201 or non-volatile memory 1202.

[0237] The input module 1300 can receive commands and / or data for components of the electronic device 101 (e.g., processor 1800, sensor module 1610, and / or audio output module 1630) from outside the electronic device 101 (e.g., user and / or external electronic device 102).

[0238] Input module 1300 may include a first input module 1310 into which a user inputs commands and / or data; and a second input module 1320 into which commands and / or data are input from an external electronic device 102. The first input module 1310 may include a microphone, mouse, keyboard, buttons (e.g., keypads), and / or a pen (e.g., a passive pen and / or an active pen). The second input module 1320 may support specified protocols for wired and / or wireless connection to the external electronic device 102. According to embodiments, the second input module 1320 may include an High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) card interface, and / or an audio interface. The second input module 1320 may include connectors for physical connection to the external electronic device 102, such as an HDMI connector, a USB connector, an SD card connector, and / or an audio connector (e.g., a headphone connector).

[0239] Display module 10 provides visual information to the user. Display module 10 may include display panel 1100, scan driver 1420, and data driver 1430. Display module 10 may further include a window, chassis, and bracket for protecting display panel 1100.

[0240] The display panel 1100 may include a liquid crystal display panel, an organic light-emitting display panel, and / or an inorganic light-emitting display panel, and is not specifically limited to any particular type or category of display panel 1100. The display panel 1100 may be a rigid type or a flexible type or a rollable and / or foldable type. The display module 10 may further include a support member, a bracket, and / or a heat dissipation component to support the display module 10.

[0241] The scan driver 1420 can be mounted as a driver chip in the display panel 1100. In some embodiments, the scan driver 1420 can be integrated into the display panel 1100. For example, the scan driver 1420 may include an amorphous silicon TFT gate (ASG) driver circuit, a low-temperature polycrystalline silicon (LTPS) TFT gate driver circuit, or an oxide semiconductor TFT gate (OSG) driver circuit embedded in the display panel 1100. The scan driver 1420 can receive control signals from the controller 1820-1 (e.g., scan input signals generated by the controller 1820-1) and scan input voltages generated by the power module 1500, and output scan signals to the pixel circuits of the display panel 1100 in response to the control signals.

[0242] The display panel 1100 may further include a transmitter driver. The transmitter driver can output a transmitter control signal to the display panel 1100 in response to a control signal received from the controller 1820-1. The transmitter driver may be formed separately from the scan driver 1420, or the transmitter driver may be integrated into the scan driver 1420.

[0243] The data driver 1430 can receive control signals from the controller 1820-1, convert image data into analog voltages (e.g., data voltages) in response to the control signals, and output the data voltages to the display panel 1100.

[0244] The data driver 1430 can be integrated into another component (e.g., the controller 1820-1). The interface conversion circuitry and timing control circuitry of the controller 1820-1 can also be integrated into the data driver 1430.

[0245] The display module 10 may further include a transmitter driver and / or a voltage generation circuit, etc. The voltage generation circuit can output various appropriate voltages used or required to drive the display panel 1100.

[0246] Power module 1500 can supply power to corresponding components of electronic device 101. Power module 1500 may include a battery that supplies power voltage. The battery may include a non-rechargeable primary battery, a rechargeable secondary battery, and / or a fuel cell. Power module 1500 may include a power management integrated circuit (PMIC). The PMIC can supply optimized or improved power to each of the modules described herein. Power module 1500 may include wireless power transmission and reception components electrically connected to the battery. The wireless power transmission and reception components may include multiple coil-shaped antenna radiators.

[0247] The electronic device 101 may further include an internal module 1600 and an external module 1700. The internal module 1600 may include a sensor module 1610, an antenna module 1620, and an audio output module 1630. The external module 1700 may include a camera module 1710, an optical module 1720, and a communication module 1730.

[0248] Sensor module 1610 can detect input via the user's body and / or via a pen from first input module 1310, and generate electrical signals and / or data values ​​in response to the input. Sensor module 1610 may include at least one of fingerprint sensor 1610-1, input sensor 1610-2, and digitizer 1610-3.

[0249] The fingerprint sensor 1610-1 can generate data values ​​corresponding to a user's fingerprint. The fingerprint sensor 1610-1 may include any one of an optical fingerprint sensor and a capacitive fingerprint sensor.

[0250] The input sensor 1610-2 can generate data values ​​corresponding to coordinate information about input from the user's body or through a pen. The input sensor 1610-2 can generate data values ​​based on changes in capacitance caused by the input. The input sensor 1610-2 can detect input through a passive pen and / or transmit and receive data from an active pen.

[0251] The input sensor 1610-2 can also measure biosignals (e.g., blood pressure, water content, and / or body fat). For example, when a user touches a part of his or her body to the sensor layer and / or sensing panel and remains stationary for a set or specific time period, the input sensor 1610-2 can detect biosignals based on changes in the electric field caused by his or her body and can output the information desired by the user to the display module 10.

[0252] The digitizer 1610-3 can generate data values ​​corresponding to coordinate information input via a pen. The digitizer 1610-3 can generate data values ​​based on electromagnetic changes caused by the input. The digitizer 1610-3 can detect input via a passive pen and / or transmit and receive data from an active pen.

[0253] At least one of the fingerprint sensor 1610-1, the input sensor 1610-2, and the digitizer 1610-3 may be implemented as a sensor layer on the display panel 1100 via a continuous (e.g., substantially continuous) process. The fingerprint sensor 1610-1, the input sensor 1610-2, and the digitizer 1610-3 may be on the display panel 1100, and any one of the fingerprint sensor 1610-1, the input sensor 1610-2, and the digitizer 1610-3 (e.g., the digitizer 1610-3) may be under the display panel 1100.

[0254] At least two of the fingerprint sensor 1610-1, input sensor 1610-2, and digitizer 1610-3 can be integrated into a single sensing panel using the same process. When integrated into a single sensing panel, the sensing panel can be located between the display panel 1100 and a window on the display panel 1100. According to an embodiment, the sensing panel can be on the window, and the location of the sensing panel is not specifically limited.

[0255] At least one of the fingerprint sensor 1610-1, the input sensor 1610-2, and the digitizer 1610-3 may be embedded in the display panel 1100. For example, at least one of the fingerprint sensor 1610-1, the input sensor 1610-2, or the digitizer 1610-3 may be formed simultaneously (e.g., synchronously) by the process of forming the elements (e.g., light-emitting elements and / or transistors, etc.) included in the display panel 1100.

[0256] In some embodiments, sensor module 1610 may generate electrical signals and / or data values ​​corresponding to the internal and / or external states of electronic device 101. Sensor module 1610 may further include, for example, a gesture sensor, a gyroscope sensor, a barometric pressure sensor, a magnetic sensor, an accelerometer, a grip sensor, a proximity sensor, a color sensor, an infrared (IR) sensor, a biometric sensor, a temperature sensor, a humidity sensor, and / or an illuminance sensor.

[0257] Antenna module 1620 may include one or more antennas for transmitting and / or receiving signals and / or power to and / or from external sources. According to embodiments, antenna module 1620 may transmit signals to and / or receive signals from external electronic device 102 via antennas suitable for communication methods. The antenna pattern of antenna module 1620 may be integrated into a component of display module 10 (e.g., display panel 1100) and / or input sensor 1610-2.

[0258] The audio output module 1630 may be a device that outputs audio signals to the outside of the electronic device 101, and may include, for example, a speaker for general purposes (e.g., playing multimedia and / or playing recordings) and a receiver specifically for answering incoming calls. According to embodiments, the receiver may be integrated with the speaker or formed separately from the speaker. The audio output mode of the audio output module 1630 may also be integrated into the display module 10.

[0259] Camera module 1710 can capture still images and / or moving images (video). According to embodiments, camera module 1710 may include one or more lenses, an image sensor, and / or an image signal processor. Camera module 1710 may further include an infrared camera capable of sensing the presence or absence of a user, the user's position, and / or the user's gaze, etc.

[0260] The optical module 1720 can provide light. The optical module 1720 may include a light-emitting diode and / or a xenon lamp. The optical module 1720 can operate in conjunction with the camera module 1710 or operate independently.

[0261] Communication module 1730 supports the establishment of wired and / or wireless communication channels between electronic device 101 and external electronic device 102, and communication via the established communication channels. Communication module 1730 may include one or all of the following: wireless communication modules (e.g., cellular communication modules, short-range wireless communication modules, and / or Global Navigation Satellite System (GNSS) communication modules) and wired communication modules (e.g., local area network (LAN) communication modules and / or power line communication modules). Communication module 1730 may communicate with external electronic device 102 via short-range communication networks (e.g., Bluetooth, WiFi Direct, and / or Infrared Data Association (IrDA) standards) and / or long-range communication networks (e.g., cellular networks, the Internet, and / or computer networks (e.g., LANs and / or wide area networks (WANs))). The various suitable types or categories of modules included in communication module 1730 may be implemented as a single chip or a separate chip.

[0262] Input module 1300, sensor module 1610 and / or camera module 1710, etc., can be used in conjunction with processor 1800 to control the operation of display module 10.

[0263] The processor 1800 can output commands and / or data to the display module 10, audio output module 1630, camera module 1710, and / or optical module 1720 based on input data received from the input module 1300. For example, the processor 1800 can generate image data in response to input data received via a mouse and / or an active pen, and output the generated image data to the display module 10, and / or generate command data in response to input data, and output the generated command data to the camera module 1710 or optical module 1720. In embodiments where no input data is received from the input module 1300 during a set time period or a specific time period, the processor 1800 can switch the operating mode of the electronic device 101 to a low-power mode or a sleep mode to reduce the power consumption of the electronic device 101.

[0264] The processor 1800 can output commands and / or data to the display module 10, audio output module 1630, camera module 1710, and / or optical module 1720 based on sensing data received from the sensor module 1610. For example, the processor 1800 can compare authentication data applied by the fingerprint sensor 1610-1 with authentication data stored in the memory 1200 and execute an application based on the comparison result. The processor 1800 can execute commands and / or output corresponding image data to the display module 10 based on sensing data detected by the input sensor 1610-2 or the digitizer 1610-3. In embodiments where a temperature sensor is included in the sensor module 1610, the processor 1800 can receive temperature data about the measured temperature from the sensor module 1610 and further perform brightness correction, etc., on the image data based on the temperature data.

[0265] The processor 1800 can receive measurement data from the camera module 1710 regarding the presence or absence of a user, the user's position, and / or the user's gaze. The processor 1800 can further perform brightness correction and other adjustments on the image data based on the measured data. For example, the processor 1800, having determined the presence or absence of a user through input from the camera module 1710, can output image data whose brightness has been corrected by the data conversion circuit 1820-2 and / or the gamma correction circuit 1820-3 to the display module 10.

[0266] Some of the components can be connected to each other via peripheral communication methods (e.g., bus, general purpose input / output (GPIO), serial peripheral interface (SPI), mobile industrial processor interface (MIPI), and / or ultrapath interconnect (UPI) links) to exchange signals (e.g., commands or data). The processor 1800 can communicate with the display module 10 through a mutually agreed interface, and for example, any of the aforementioned communication methods can be used, and the communication methods are not limited to those described above.

[0267] The electronic device 101 according to the various embodiments disclosed herein may be a device of various suitable types or kinds. The electronic device 101 may include at least one of, for example, portable communication devices (e.g., smartphones), computer devices, portable multimedia devices, portable medical devices, cameras, wearable devices, and home appliance devices. The electronic device 101 according to the embodiments is not limited to the devices described above.

[0268] The display device and the method of manufacturing the display device according to one or more embodiments can reduce the defect rate of the product.

[0269] It should be understood that the embodiments described herein are for descriptive purposes only and are not intended to be limiting. The description of features or aspects in each embodiment should generally be considered in light of other similar features or aspects that may be applicable to other embodiments.

[0270] Although one or more embodiments have been described with reference to the accompanying drawings, those skilled in the art will understand that various suitable changes in form and detail may be made therein without departing from the spirit and scope of this disclosure as defined by the claims and their equivalents.

Claims

1. A display device, comprising: Display module, emits visible light; A window component, opposite to one surface of the display module; as well as A first adhesive layer is placed between the display module and the window component. The first adhesive layer is formed by curing the adhesive, and After curing, the first adhesive layer comprises at least a high molecular weight acrylic polymer having a first weight average molecular weight of at least 700,000 Daltons and a low molecular weight acrylic polymer having a second weight average molecular weight of less than 500,000 Daltons. The first adhesive layer has a stress relaxation value of 0.01 to 0.4 before curing and a stress relaxation value of 0.20 to 0.70 after curing. The amount of the high molecular weight acrylic polymer is at least 30 parts by weight relative to the sum of 100 parts by weight of the high molecular weight acrylic polymer and the low molecular weight acrylic polymer.

2. The display device according to claim 1, wherein: The first weight-average molecular weight is between 700,000 Daltons and 3,000,000 Daltons.

3. The display device according to claim 1, wherein: The second average molecular weight is between 50,000 Daltons and 490,000 Daltons.

4. The display device according to claim 1, wherein: The stress relaxation value was measured at 70°C.

5. The display device according to claim 1, wherein: The first adhesive layer comprises a transparent polymer that allows at least some of the visible light to pass through.

6. The display device according to claim 1, wherein: A second adhesive layer with a different stress relaxation value is further included between the first adhesive layer and the display module or between the first adhesive layer and the window member.

7. The display device according to claim 6, wherein: The second adhesive layer has a stress relaxation value of 0.4 to 0.6 both before and after curing.

8. The display device according to claim 6, wherein: It further includes a third adhesive layer having a stress relaxation value smaller than that of the second adhesive layer, and The second adhesive layer is located between the first adhesive layer and the third adhesive layer.

9. The display device according to claim 8, wherein: The first adhesive layer and / or the third adhesive layer have a stress relaxation value of 0.01 to 0.4 before curing and a stress relaxation value of 0.20 to 0.70 after curing.

10. The display device according to claim 6, wherein: After curing, the first adhesive layer has a creep value of at least 4% at 50°C, a modulus of 0.04 MPa to 0.70 MPa at 25°C, and a strength of at least 0.5 kgf / in. 2 The adhesion force, and After curing, the second adhesive layer has a creep value of at least 4% at 50°C and a modulus of 0.04 MPa to 0.70 MPa at 25°C.

11. A display device, comprising: Display module, emits visible light; A window component, opposite to one surface of the display module; as well as A first adhesive layer is placed between the display module and the window component. The first adhesive layer has a stress relaxation value of 0.01 to 0.4 before curing, a stress relaxation value of 0.20 to 0.70 after curing, a creep value of at least 4% at 50°C after curing, and a modulus of 0.04 MPa to 0.70 MPa at 25°C after curing.

12. The display device according to claim 11, wherein: The first adhesive layer is formed by curing the adhesive, and After curing, the first adhesive layer comprises at least a high molecular weight acrylic polymer having a first weight-average molecular weight of at least 700,000 Daltons and a low molecular weight acrylic polymer having a second weight-average molecular weight of less than 500,000 Daltons. The amount of the high molecular weight acrylic polymer is at least 30 parts by weight relative to the sum of 100 parts by weight of the high molecular weight acrylic polymer and the low molecular weight acrylic polymer.

13. The display device according to claim 12, wherein: The first weight-average molecular weight is between 700,000 Daltons and 3,000,000 Daltons.

14. The display device according to claim 12, wherein: The second average molecular weight is between 50,000 Daltons and 490,000 Daltons.

15. The display device according to claim 11, wherein: The first adhesive layer comprises a transparent polymer that allows at least some of the visible light to pass through.

16. The display device according to claim 11, wherein: A second adhesive layer with a different stress relaxation value is further included between the first adhesive layer and the display module or between the first adhesive layer and the window member.

17. The display device according to claim 16, wherein: The second adhesive layer has a stress relaxation value of 0.4 to 0.6 both before and after curing.

18. The display device according to claim 16, wherein: It further includes a third adhesive layer having a stress relaxation value smaller than that of the second adhesive layer, and The second adhesive layer is located between the first adhesive layer and the third adhesive layer.

19. The display device according to claim 18, wherein: The first adhesive layer and / or the third adhesive layer have a stress relaxation value of 0.01 to 0.4 before curing and a stress relaxation value of 0.20 to 0.70 after curing.

20. An electronic device comprising: The controller is configured to generate scan input signals; The power module is configured to generate a scanning input voltage; and The display device according to any one of claims 1 to 19.

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