Lamp panel and display equipment
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- BOE TECHNOLOGY GROUP CO LTD
- Filing Date
- 2024-08-30
- Publication Date
- 2026-05-01
AI Technical Summary
LED light boards are prone to incomplete soldering during the welding process, which affects the yield of the light boards and is difficult to detect and solve effectively with existing technologies.
A cutout area is designed on the electrode pads to observe the flatness of the electrode connection. Combined with optical back inspection and electrical testing methods, cold solder joint problems can be detected in time and repaired.
This improved the yield of the lamp board, reduced the manufacturing cost, and ensured the stable connection and normal function of the light-emitting units.
Smart Images
Figure CN121970100A_ABST
Abstract
Description
Light panels and display devices Technical Field
[0001] This application relates to the field of display technology, and in particular to a light panel and a display device. Background Technology
[0002] LED light panels made using light-emitting diodes (LEDs) can achieve local dimming, thereby greatly improving the display quality of display devices. The LEDs can be mini LEDs or micro LEDs.
[0003] Summary of the Invention
[0004] This application provides a light panel and a display device, the technical solution of which is as follows:
[0005] On one hand, a light panel is provided, the light panel comprising:
[0006] substrate;
[0007] A conductive layer is located on one side of the substrate, and the conductive layer includes signal lines and electrode pads connected to the signal lines. The electrode pads have a cutout area for exposing a portion of the substrate.
[0008] A light-emitting unit, the light-emitting unit including a light-emitting part and an electrode electrically connected to the light-emitting part, the electrode being closer to the substrate relative to the light-emitting part;
[0009] The electrode connection portion is located between the electrode and the electrode pad, and the electrode and the electrode pad are electrically connected through the electrode connection portion. The electrode is used to receive a drive signal transmitted by the signal line through the electrode connection portion and the electrode pad. The orthographic projection of the electrode connection portion on the substrate and the orthographic projection of the cutout area on the substrate overlap.
[0010] Optionally, the area of the hollowed-out region projected onto the substrate is less than 20% of the area of the electrode pad projected onto the substrate.
[0011] Optionally, the hollowed-out area includes at least one strip-shaped sub-hollowed-out area;
[0012] Wherein, at least one of the sub-cutout areas extends from the edge or corner of the electrode pad to at least the interior of the electrode pad.
[0013] Optionally, the electrode pad includes a first edge, a second edge, a third edge, and a fourth edge connected in sequence, wherein the first edge and the third edge are disposed opposite to each other, and the second edge and the fourth edge are disposed opposite to each other;
[0014] The sub-cutout area extends from the first edge of the electrode pad to the third edge of the electrode pad; or, the sub-cutout area extends from the second edge of the electrode pad to the fourth edge of the electrode pad.
[0015] Optionally, the hollowed-out area includes a strip-shaped first sub-hollowed-out area and a strip-shaped second sub-hollowed-out area, and the electrode pad includes a first edge, a second edge, a third edge and a fourth edge connected in sequence, wherein the first edge and the third edge are arranged opposite to each other, and the second edge and the fourth edge are arranged opposite to each other;
[0016] The first sub-cutout area extends from the first edge to at least the interior of the electrode pad, and the extending direction of the first sub-cutout area intersects with the first edge;
[0017] The second sub-cutout area extends from the third edge to at least the interior of the electrode pad, and the extension direction of the second sub-cutout area intersects with the third edge.
[0018] Optionally, the first edge and the third edge are arranged in parallel, and both the first edge and the third edge extend along a first direction;
[0019] The extension direction of the first sub-cutout area is parallel to the extension direction of the second sub-cutout area, and the first sub-cutout area and the second sub-cutout area are spaced apart in the first direction.
[0020] Optionally, the second edge and the fourth edge are arranged parallel to each other, and both the second edge and the fourth edge extend along a second direction, which is perpendicular to the first direction; the hollow area also includes a strip-shaped third sub-hollow area and a strip-shaped fourth sub-hollow area;
[0021] The third sub-cutout area extends from the second edge to at least the interior of the electrode pad, and the extending direction of the third sub-cutout area intersects with the second edge;
[0022] The fourth sub-cutout area extends from the fourth edge to at least the interior of the electrode pad, and the extending direction of the fourth sub-cutout area intersects with the fourth edge;
[0023] The third sub-cutout area and the fourth sub-cutout area are spaced apart in the second direction.
[0024] Optionally, the first sub-cutout area and the second sub-cutout area both extend along the second direction, and the third sub-cutout area and the fourth sub-cutout area both extend along the first direction.
[0025] Optionally, the first sub-cutout area extends from the first edge to the second edge, and either the third edge or the fourth edge;
[0026] The second sub-cutout area extends from the third edge to the first edge, and to either the second edge or the fourth edge;
[0027] Wherein, the orthographic projection of the first sub-cutout area on the substrate and the orthographic projection of the second sub-cutout area on the substrate overlap, and the overlapping position of the first sub-cutout area and the second sub-cutout area is closer to the center of the electrode pad than the edge of the electrode pad.
[0028] Optionally, the overlapping position of the first sub-cutout area and the second sub-cutout area is located in the middle of the electrode pad.
[0029] Optionally, the angle between the extension direction of the sub-cutout area included in the cutout area and the starting edge of the extension of the sub-cutout area is an acute angle or an obtuse angle.
[0030] The starting edge of the sub-cutout area refers to the edge at which the sub-cutout area begins to extend.
[0031] Optionally, the hollowed-out area includes a strip-shaped first sub-hollowed-out area and a strip-shaped second sub-hollowed-out area; the electrode pad includes a first edge, a second edge, a third edge, and a fourth edge connected in sequence, with the first edge and the third edge facing each other, and the second edge and the fourth edge facing each other; and the electrode pad includes a first corner formed by connecting the first edge and the second edge, a second corner formed by connecting the second edge and the third edge, a third triangle formed by connecting the third edge and the fourth edge, and a fourth corner formed by connecting the fourth edge and the first edge.
[0032] The first sub-cutout area starts from the first corner and extends along the space between the first edge and the second edge, and extends at least into the interior of the electrode pad;
[0033] The second sub-cutout area starts from the second corner and extends between the second edge and the third edge, and extends at least into the interior of the electrode pad.
[0034] Optionally, the first sub-cutout area extends from the first corner to the third corner, and the second sub-cutout area extends from the second corner to the fourth corner.
[0035] Optionally, the hollowed-out area further includes a strip-shaped third sub-hollowed-out area and a strip-shaped fourth sub-hollowed-out area;
[0036] The third sub-cutout area starts from the third corner and extends along the space between the third edge and the fourth edge into the interior of the electrode pad;
[0037] The fourth sub-cutout area starts from the fourth corner and extends along the space between the fourth edge and the first edge into the interior of the electrode pad;
[0038] The hollowed-out area also includes a hollowed-out pattern located in the center of the electrode pad, the hollowed-out pattern being circular, polygonal, or two intersecting stripes.
[0039] Optionally, the hollowed-out area includes at least one sub-hollowed-out area;
[0040] The sub-cutout area is annular in shape, and the distance between the cutout edge of at least one sub-cutout area and the edge of the electrode pad is less than the distance between the cutout edge and the center of the electrode pad.
[0041] Optionally, the width of the sub-cutout area ranges from 5 micrometers to 30 micrometers.
[0042] Optionally, the hollowed-out area includes multiple sub-hollowed-out areas;
[0043] The sub-cutout areas are circular, elliptical, or polygonal in shape, and the orthographic projections of multiple sub-cutout areas on the substrate are evenly distributed within the orthographic projections of the electrode pads on the substrate.
[0044] Optionally, the sub-cutout area is circular in shape, and the diameter of the sub-cutout area ranges from 5 micrometers to 30 micrometers.
[0045] Optionally, the light panel further includes:
[0046] A protective layer is located on the side of the conductive layer away from the substrate, the protective layer covers the signal line, and the protective layer has an opening for exposing the electrode pads.
[0047] Optionally, the protective layer includes at least one of an inorganic material layer composed of inorganic materials and an organic material layer composed of organic materials.
[0048] Optionally, the conductive layer includes a plurality of first pad groups, each first pad group including two electrode pads, and the two electrode pads included in each first pad group have different polarities;
[0049] The light-emitting unit includes a first electrode and a second electrode electrically connected to the light-emitting part. The electrode connection part includes a first electrode connection part located between the first electrode and one of the electrode pads, and a second electrode connection part located between the second electrode and the other electrode pad. The first electrode and one of the electrode pads are electrically connected through the first electrode connection part, and the second electrode and the other electrode pad are electrically connected through the second electrode connection part.
[0050] The orthographic projection of the first electrode connection portion on the substrate and the orthographic projection of the cutout area of one of the electrode pads on the substrate overlap; the orthographic projection of the second electrode connection portion on the substrate and the orthographic projection of the cutout area of the other electrode pad on the substrate overlap.
[0051] Optionally, the conductive layer further includes a plurality of second pad groups, each second pad group including a driving pad, the driving pad being connected to the signal line, and the driving pad also having the cutout area; the lamp board further includes: a driving chip and a driving connection portion;
[0052] The driving connection portion is located between the driving chip and the driving pad, and the driving chip and the driving pad are electrically connected through the driving connection portion. The orthographic projection of the driving connection portion on the substrate and the orthographic projection of the cutout area on the substrate overlap.
[0053] On the other hand, a display device is provided, the display device comprising: a power supply component and a lamp panel as described above;
[0054] The power supply component is connected to the lamp board and is used to supply power to the lamp board. Attached Figure Description
[0055] To more clearly illustrate the technical solutions in the embodiments of this application, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0056] Figure 1 is a schematic diagram of the structure of a lamp panel provided in an embodiment of this application;
[0057] Figure 2 is a schematic diagram of an electrode pad provided in an embodiment of this application;
[0058] Figure 3 is a schematic diagram of another electrode pad provided in an embodiment of this application;
[0059] Figure 4 is a schematic diagram of another electrode pad provided in an embodiment of this application;
[0060] Figure 5 is a schematic diagram of another electrode pad provided in an embodiment of this application;
[0061] Figure 6 is a schematic diagram of another electrode pad provided in an embodiment of this application;
[0062] Figure 7 is a schematic diagram of another electrode pad provided in an embodiment of this application;
[0063] Figure 8 is a schematic diagram of another electrode pad provided in an embodiment of this application;
[0064] Figure 9 is a schematic diagram of another electrode pad provided in an embodiment of this application;
[0065] Figure 10 is a schematic diagram of another electrode pad provided in an embodiment of this application;
[0066] Figure 11 is a schematic diagram of another electrode pad provided in an embodiment of this application;
[0067] Figure 12 is a schematic diagram of another electrode pad provided in an embodiment of this application;
[0068] Figure 13 is a schematic diagram of another electrode pad provided in an embodiment of this application;
[0069] Figure 14 is a schematic diagram of another electrode pad provided in an embodiment of this application;
[0070] Figure 15 is a schematic diagram of another lamp panel provided in an embodiment of this application;
[0071] Figure 16 is a schematic diagram of a substrate, conductive layer, electrode connection portion and protective layer provided in an embodiment of this application.
[0072] Figure 17 is a schematic diagram of another substrate, conductive layer, electrode connection portion and protective layer provided in an embodiment of this application.
[0073] Figure 18 is a schematic diagram of a first pad group provided in an embodiment of this application;
[0074] Figure 19 is a schematic diagram of another first pad group provided in an embodiment of this application;
[0075] Figure 20 is a schematic diagram of yet another first pad group provided in an embodiment of this application;
[0076] Figure 21 is a schematic diagram of another first pad group provided in an embodiment of this application;
[0077] Figure 22 is a schematic diagram of another first pad group provided in an embodiment of this application;
[0078] Figure 23 is a schematic diagram of another first pad group provided in an embodiment of this application;
[0079] Figure 24 is a schematic diagram of another first pad group provided in an embodiment of this application;
[0080] Figure 25 is a schematic diagram of a light-emitting unit and a driving chip provided in an embodiment of this application;
[0081] Figure 26 is a schematic diagram of an electrode connection portion and the side of the electrode pad away from the substrate provided in an embodiment of this application;
[0082] Figure 27 is a schematic diagram of a side of a substrate away from the electrode connection portion and the electrode pad provided in an embodiment of this application;
[0083] Figure 28 is a schematic diagram of another electrode connection portion and the side of the electrode pad away from the substrate provided in an embodiment of this application;
[0084] Figure 29 is a schematic diagram of another electrode connection portion and the side of the electrode pad away from the substrate provided in an embodiment of this application;
[0085] Figure 30 is an electron microscope schematic diagram of an electrode connection provided in an embodiment of this application;
[0086] Figure 31 is a schematic diagram of the structure of a display device provided in an embodiment of this application. Detailed Implementation
[0087] To make the objectives, technical solutions, and advantages of this application clearer, the embodiments of this application will be described in further detail below with reference to the accompanying drawings.
[0088] In some embodiments, the LED light board may include a pad substrate and a plurality of LEDs. The pad substrate includes a plurality of pad groups corresponding to the plurality of LEDs, and each LED may be connected to two pads of different polarities in a corresponding pad group, thereby enabling the pad substrate to provide a driving signal to the LED to make the LED emit light.
[0089] However, there may be poor solder joints when connecting LEDs and pads, which may affect the yield of the LED board.
[0090] Figure 1 is a schematic diagram of a lamp panel structure provided in an embodiment of this application. Referring to Figure 1, the lamp panel 100 includes: a substrate 101, a conductive layer 102, a light-emitting unit 103, and an electrode connection portion 104. The substrate 101 can be a glass substrate. Glass substrates have lower costs and are ultra-thin, thus lamp panels using glass substrates can achieve ultra-thin designs. Furthermore, the flatness of the glass substrate is good, which can reduce the possibility of warping and improve the stability of the lamp panel. The glass substrate has high thermal conductivity, which is beneficial for heat dissipation, thus ensuring stable operation of the lamp panel.
[0091] The conductive layer 102 is located on one side of the substrate 101 and includes signal lines 1021 and electrode pads 1022 (the electrode pads 1022 can be referred to as electrode pads). The electrode pads 1022 are connected to the signal lines 1021, and the signal lines 1021 are used to transmit drive signals to the electrode pads 1022. The electrode pads 1022 have a cutout area M, which exposes a portion of the substrate 101. Optionally, the conductive layer 102 including signal lines 1021 and electrode pads 1022 can mean that the signal lines 1021 and electrode pads 1022 can be made of the same material and fabricated using the same single fabrication process.
[0092] The light-emitting unit 103 includes a light-emitting part 1031 and an electrode 1032 electrically connected to the light-emitting part 1031. The electrode 1032 is closer to the substrate 101 than the light-emitting part 1031.
[0093] An electrode connection portion 104 is located between an electrode 1032 and an electrode pad 1022, and the electrode 1032 and the electrode pad 1022 are electrically connected through the electrode connection portion 104, so that the electrode 1032 can receive a drive signal transmitted by a signal line 1021 through the electrode connection portion 104 and the electrode pad 1022. The orthographic projection of the electrode connection portion 104 on the substrate 101 overlaps with the orthographic projection of the cutout region M on the substrate 101.
[0094] Before the light-emitting unit 103 is connected to the electrode pad 1022, the connecting material of the electrode connection portion 104 can be formed on the surface of the electrode 1032 of the light-emitting unit 103 or on the surface of the electrode pad 1022. During the process of connecting the light-emitting unit 103 to the electrode pad 1022, the connecting material of the electrode connection portion 104 gradually spreads (or creeps) based on its own wettability, thereby stably connecting the electrode 1032 and the electrode pad 1022.
[0095] If the wettability of the bonding material in the electrode connection portion 104 is poor, or if foreign matter is present during the die bonding process, the bonding material in the electrode connection portion 104 may not melt sufficiently. This could lead to poor flattening of the bonding material in the electrode connection portion 104, resulting in poor soldering between the electrode 1032 and the electrode pad 1022. Consequently, a stable IMC connection layer cannot be formed between the light-emitting unit 103 and the electrode pad 1022, potentially causing device malfunction. The IMC connection layer is the connection portion. IMC (interconnect metalization coating) is a metallization cover layer used to achieve electrical connection and signal transmission functions.
[0096] To ensure the smooth progress of subsequent manufacturing processes, the connection between electrode 1032 and electrode pad 1022 needs to be inspected after die bonding. If an abnormal overlap is detected between electrode 1032 and electrode pad 1022, the abnormal light-emitting unit 103 can be directly removed, and a new light-emitting unit 103 can be die bonded to ensure the yield of the final product.
[0097] The simplest method to test the connection effect between electrode 1032 and electrode pad 1022 is to observe the flattening state of electrode connection portion 104 from the back side of substrate 101 using a microscope. If the flattening state of electrode connection portion 104 is good, the connection effect between electrode 1032 and electrode pad 1022 can be considered good; if the flattening state of electrode connection portion 104 is poor, the connection effect between electrode 1032 and electrode pad 1022 can be considered poor. Here, the back side of substrate 101 can refer to the side of substrate 101 where no light-emitting unit 103 is provided.
[0098] Since the conductive layer 102 has a certain thickness, and the electrode connection portion 104 is located on the side of the conductive layer 102 away from the substrate 101, the electrode pad 1022 in this embodiment is provided with a cutout area M. This cutout area M can be used to observe the flattening state of the electrode connection portion 104. For example, after the light-emitting unit 103 is die-bonded, a microscope is used to observe the flattening state of the electrode connection portion 104 through the cutout area M from the back of the substrate 101, thereby detecting the overlap state between the electrode pad 1022 and the electrode 1032. This facilitates timely detection of light-emitting units 103 with poor connection yield, allowing for timely replacement and improving the yield of the lamp board. Furthermore, the problem of poor soldering of the light-emitting unit 103 is eliminated at the lamp board stage, thus avoiding the abnormal increase in manufacturing costs caused by discovering poor soldering in subsequent processes.
[0099] In summary, this application provides a lamp board including a substrate, a conductive layer, light-emitting units, and electrode connection portions. The electrode pads in the conductive layer are electrically connected to the electrodes of the light-emitting units via the electrode connection portions. Furthermore, the electrode pads have a cutout area that exposes a portion of the substrate, allowing observation of the flatness of the electrode connection portions from the back of the substrate, thereby detecting the overlap between the electrode pads and the electrodes. This facilitates timely detection of light-emitting units with poor connection yield, enabling timely replacement and improving the yield rate of the lamp board.
[0100] Optionally, if no cutout area M is provided on the electrode pad 1022, then if the thickness of the conductive layer 102 is relatively small (e.g., less than 0.9 μm), it may be possible to determine the flattening state of the electrode connection portion 104 by observing from the back of the substrate 101 using a microscope, which may also be able to determine the die-bonding effect of the light-emitting unit 103. However, such inspection is more difficult.
[0101] Furthermore, due to the voltage drop (IR drop) on the signal lines, it is necessary to reduce the resistance of the signal lines. To avoid affecting the wiring design of the signal lines, the thickness of the conductive layer 102 where the signal lines are located can usually be set to be relatively thick. If no cutout area M is provided on the electrode pads 1022, then when the thickness of the conductive layer 102 is relatively thick (e.g., greater than 1.8 μm), it is completely impossible to determine the flatness of the electrode connection portion 104 by observing from the back of the substrate 101.
[0102] Considering the above aspects, the electrode pad 1022 in this embodiment is designed with a hollow area M. Regardless of the thickness of the conductive layer 102, the flattening state of the electrode connection 104 can be observed through the hollow area M, which facilitates the detection of the die bonding effect of the light-emitting unit 103.
[0103] Optionally, the light-emitting unit 103 can be a light-emitting diode (LED), such as a mini LED or a micro LED.
[0104] The electrode connection portion 104 can be made of tin (Sn). Before die bonding the light-emitting unit 103 to the electrode pad 1022, tin (Sn) paste can be applied to the surface of the electrode 1032 of the light-emitting unit 103, or it can be applied to the surface of the electrode pad 1022. During the die bonding process of the light-emitting unit 103 to the electrode pad 1022, the tin paste can be melted and gradually spread, thereby forming a stable IMC connection layer between the electrode 1032 and the electrode pad 1022, ensuring the normal function of the light-emitting unit 103.
[0105] The material of electrode pad 1022 may include at least one of copper (Cu) and electroless nickel / immersion gold (ENIG).
[0106] In this embodiment, in addition to observing the flattening state of the electrode connection portion 104 through the cutout area M from the back of the substrate 101 (referred to as optical back inspection) to detect the overlap state of the electrode 1032 and the electrode pad 1022, the yield of the light-emitting unit 103 can also be detected by electrical detection. For example, the light-emitting unit 103 can be powered on to emit light for detection.
[0107] If the light-emitting unit 103 fails to emit light properly, it may be due to a poor solder joint between electrode 1032 and electrode pad 1022, or it may be due to a quality problem with the light-emitting unit 103 itself. If the problem is with the light-emitting unit 103, it needs to be removed and a new light-emitting unit 103 re-die-bonded. If the problem is a poor solder joint between electrode 1032 and electrode pad 1022, the light-emitting unit 103 can be removed and re-die-bonded. This reduces the cost of using the light-emitting unit 103.
[0108] In other words, it is necessary to set a hollow area M on the electrode pad 1022 for optical back inspection in this embodiment of the application. When the light-emitting unit 103 has no quality problems but only has poor soldering problems, the light-emitting unit 103 can be repaired and die bonded without replacing the light-emitting unit 103, which can save certain costs.
[0109] In this embodiment, in order to ensure that after the light-emitting unit 103 is die-bonded to the electrode pad 1022, the electrode pad 1022 has a certain fixing pull on the electrode 1032 of the light-emitting unit 103, so as to ensure the connection effect between the electrode 1032 and the electrode pad 1022, the area of the orthogonal projection of the hollow area M on the substrate 101 is less than 20% of the area of the orthogonal projection of the electrode pad 1022 on the substrate 101.
[0110] Optionally, referring to FIG2, the cutout area M may include at least one strip-shaped sub-cutout area Ma. The at least one sub-cutout area Ma extends from the edge or corner of the electrode pad 1022 to at least the interior of the electrode pad 1022.
[0111] Typically, the bonding material of the electrode connection portion 104 is gradually laid flat from the center of the electrode pad 1022 towards its edges and corners. Therefore, if the sub-cutout area Ma extends from the edge or corner of the electrode pad 1022 into its interior, the electrode connection portion 104 can be easily observed at the edge or corner of the electrode pad 1022 to determine the flattening effect of the bonding material. If the electrode connection portion 104 can be observed from the edge or corner of the electrode 1032, it indicates that the flattening effect of the bonding material is good; if the electrode connection portion 104 cannot be observed from the edge or corner of the electrode 1032, it indicates that the flattening effect of the bonding material is poor.
[0112] In this embodiment of the application, referring to FIG2, the electrode pad 1022 includes a first edge b1, a second edge b2, a third edge b3, and a fourth edge b4 connected in sequence. The first edge b1 and the third edge b3 are arranged opposite to each other, and the second edge b2 and the fourth edge b4 are arranged opposite to each other.
[0113] For example, the electrode pad 1022 can be rectangular in shape, with the first edge b1 and the third edge b3 arranged parallel to each other, and both the first edge b1 and the third edge b3 extending along a first direction X. The second edge b2 and the fourth edge b4 are arranged parallel to each other, and both the second edge b2 and the fourth edge b4 extend along a second direction Y. The second direction Y is perpendicular to the first direction X.
[0114] Optionally, referring to Figure 2, the sub-cutout region Ma extends from the first edge b1 of the electrode pad 1022 to the third edge b3 of the electrode pad 1022. Alternatively, referring to Figure 3, the sub-cutout region Ma extends from the second edge b2 of the electrode pad 1022 to the fourth edge b4 of the electrode pad 1022. That is, the sub-cutout region Ma can penetrate through the two opposite edges of the electrode pad 1022. This facilitates observation of the electrode connection portion 104 at the positions of the two penetrated edges, thereby determining the overlap state of the electrode 1032 and the electrode pad 1022.
[0115] For example, Figure 2 includes a sub-cutout region Ma, which extends from the first edge b1 of the electrode pad 1022 to the third edge b3 of the electrode pad 1022. The extension direction of the sub-cutout region Ma is parallel to the extension directions of the second edge b2 and the fourth edge b4 of the electrode pad 1022.
[0116] Figure 3 includes four sub-cutout regions Ma, which extend from the second edge b2 of the electrode pad 1022 to the fourth edge b4 of the electrode pad 1022. The extension direction of the sub-cutout regions Ma is inclined relative to the extension directions of the first edge b1 and the third edge b3 of the electrode pad 1022.
[0117] For example, the angle α between the extending direction of the sub-cutout area Ma, which includes the cutout area M, and the starting edge of the extending sub-cutout area Ma is an acute or obtuse angle. This design allows the sub-cutout area Ma to cover a larger detection range, thereby improving the accuracy of back inspection. Here, the starting edge of the extending sub-cutout area Ma refers to the edge from which the sub-cutout area Ma begins to extend, or in other words, the sub-cutout area Ma extends from its starting edge.
[0118] In this embodiment of the application, referring to FIG4, the cutout region M includes a strip-shaped first sub-cutout region Ma1 and a strip-shaped second sub-cutout region Ma2. The first sub-cutout region Ma1 extends from the first edge b1 to at least the interior of the electrode pad 1022, and the extension direction of the first sub-cutout region Ma1 intersects with the first edge b1. The second sub-cutout region Ma2 extends from the third edge b3 to at least the interior of the electrode pad 1022, and the extension direction of the second sub-cutout region Ma2 intersects with the third edge b3.
[0119] Alternatively, referring to Figure 5, the cutout area M includes a strip-shaped first sub-cutout area Ma1 and a strip-shaped second sub-cutout area Ma2. The first sub-cutout area Ma1 extends from the second edge b2 at least into the interior of the electrode pad 1022, and the extension direction of the first sub-cutout area Ma1 intersects with the second edge b2. The second sub-cutout area Ma2 extends from the fourth edge b4 at least into the interior of the electrode pad 1022, and the extension direction of the second sub-cutout area Ma2 intersects with the fourth edge b4.
[0120] That is, the first sub-cutout area Ma1 and the second sub-cutout area Ma2 can each start from two opposite edges and extend into the interior of the electrode pad 1022.
[0121] Optionally, the extension direction of the first sub-cutout region Ma1 can be parallel to the extension direction of the second sub-cutout region Ma2. Alternatively, the extension direction of the first sub-cutout region Ma1 can also be non-parallel to the extension direction of the second sub-cutout region Ma2. This application does not limit this aspect.
[0122] For example, referring to Figures 4 and 5, the extension directions of the first sub-cutout region Ma1 and the second sub-cutout region Ma2 intersect with each edge of the electrode pad 1022. Alternatively, the extension directions of the first sub-cutout region Ma1 and the second sub-cutout region Ma2 are arranged parallel to the second edge b2 and the first edge b1.
[0123] In this embodiment of the application, in Figure 4, the first sub-cutout area Ma1 and the second sub-cutout area Ma2 are spaced apart by h1 in the first direction X. This allows the first sub-cutout area Ma1 and the second sub-cutout area Ma2 to cover a larger detection range in the first direction X, thereby improving the detection accuracy of back inspection. In Figure 5, the first sub-cutout area Ma1 and the second sub-cutout area Ma2 are spaced apart by h2 in the second direction Y. This allows the first sub-cutout area Ma1 and the second sub-cutout area Ma2 to cover a larger detection range in the second direction Y, thereby improving the detection accuracy of back inspection.
[0124] Referring to Figure 6, it can be seen that the hollow area M can include a first sub-hollow area Ma1 in the shape of a strip, a second sub-hollow area Ma2 in the shape of a strip, a third sub-hollow area Ma3 in the shape of a strip, and a fourth sub-hollow area Ma4 in the shape of a strip.
[0125] The first sub-cutout region Ma1 extends from the first edge b1 to at least the interior of the electrode pad 1022, and the extension direction of the first sub-cutout region Ma1 intersects with the first edge b1. The second sub-cutout region Ma2 extends from the third edge b3 to at least the interior of the electrode pad 1022, and the extension direction of the second sub-cutout region Ma2 intersects with the third edge b3.
[0126] The third sub-cutout region Ma3 extends from the second edge b2 to at least the interior of the electrode pad 1022, and the extension direction of the third sub-cutout region Ma3 intersects with the second edge b2. The fourth sub-cutout region Ma4 extends from the fourth edge b4 to at least the interior of the electrode pad 1022, and the extension direction of the fourth sub-cutout region Ma4 intersects with the fourth edge b4.
[0127] By setting four sub-cutout areas, the fourth sub-cutout area can extend from the four edges of the electrode pad 1022 into the interior of the electrode pad 1022. This facilitates back inspection at the four edges, improving the accuracy of back inspection.
[0128] The first sub-cutout area Ma1 and the second sub-cutout area Ma2 are spaced apart in the first direction X. The third sub-cutout area Ma3 and the fourth sub-cutout area Ma4 are spaced apart in the second direction Y. This arrangement allows the four sub-cutout areas to cover a larger detection range, thereby improving the accuracy of back inspection.
[0129] Referring to Figure 6, the first sub-cutout area Ma1 and the second sub-cutout area Ma2 can both extend along the second direction Y. The third sub-cutout area Ma3 and the fourth sub-cutout area Ma4 both extend along the first direction X. That is, the extension direction of each sub-cutout area Ma can be perpendicular to the extension direction of the starting edge of the extension of that sub-cutout area Ma.
[0130] In Figure 6, the starting edge of the first sub-cutout area Ma1 is the first edge b1, the starting edge of the second sub-cutout area Ma2 is the second edge b2, the starting edge of the third sub-cutout area Ma3 is the third edge b3, and the starting edge of the fourth sub-cutout area Ma4 is the fourth edge b4.
[0131] In this embodiment, the extension direction of each sub-cutout region Ma may not be perpendicular to the extension direction of the starting edge of the sub-cutout region Ma. This embodiment does not specifically limit the extension direction of the sub-cutout region Ma.
[0132] In this embodiment, the first sub-cutout region Ma1 can extend from the first edge b1 to any one of the second edge b2, the third edge b3, and the fourth edge b4. The second sub-cutout region Ma2 can extend from the third edge b3 to any one of the first edge b1, the second edge b2, and the fourth edge b4.
[0133] The orthographic projection of the first sub-cutout region Ma1 on the substrate 101 and the orthographic projection of the second sub-cutout region Ma2 on the substrate 101 overlap, and the overlapping position of the first sub-cutout region Ma1 and the second sub-cutout region Ma2 is located at the edge of the electrode pad 1022, closer to the middle of the electrode pad 1022.
[0134] The center of electrode pad 1022 can refer to the central position of electrode pad 1022. If electrode pad 1022 is rectangular or square, then the center of electrode pad 1022 can refer to the intersection of the diagonals of electrode pad 1022. If electrode pad 1022 is circular, then the center of electrode pad 1022 can refer to the center of the circle.
[0135] For example, the overlap of the first sub-cutout area Ma1 and the second sub-cutout area Ma2 is located in the middle of the electrode pad 1022.
[0136] By setting two overlapping sub-cutout areas Ma, the two sub-cutout areas Ma can cover a larger area of the electrode pad 1022, thereby improving the detection accuracy of back inspection.
[0137] For example, referring to Figure 7, the first sub-cutout region Ma1 extends from the side of the first edge b1 near the fourth edge b4 to the side of the third edge b3 near the second edge b2. The second sub-cutout region Ma2 extends from the side of the third edge b3 near the fourth edge b4 to the side of the first edge b1 near the second edge b2.
[0138] Alternatively, referring to Figure 8, the first sub-cutout region Ma1 extends from the side of the first edge b1 near the fourth edge b4 to the side of the second edge b2 near the third edge b3. The second sub-cutout region Ma2 extends from the side of the third edge b3 near the fourth edge b4 to the side of the second edge b2 near the first edge b1.
[0139] In this embodiment, the two edges through which the first sub-cutout area Ma1 and the second sub-cutout area Ma2 pass can be any two edges, as long as the first sub-cutout area Ma1 and the second sub-cutout area Ma2 can cover a large area of the electrode pad 1022 to achieve back inspection.
[0140] In this embodiment of the application, referring to FIG9, the electrode pad 1022 includes a first corner J1 formed by connecting the first edge b1 and the second edge b2, a second corner J2 formed by connecting the second edge b2 and the third edge b3, a third corner J3 formed by connecting the third edge b3 and the fourth edge b4, and a fourth corner J4 formed by connecting the fourth edge b4 and the first edge b1.
[0141] The cutout area M includes a first sub-cutout area Ma1 and a second sub-cutout area Ma2. The first sub-cutout area Ma1 starts from the first corner J1 and extends along the space between the first edge b1 and the second edge b2, extending at least into the interior of the electrode pad 1022. The second sub-cutout area Ma2 starts from the second corner J2 and extends along the space between the second edge b2 and the third edge b3, extending at least into the interior of the electrode pad 1022.
[0142] For example, referring to Figure 9, the first sub-cutout area Ma1 can extend from the first corner J1 to the third corner J3, and the second sub-cutout area Ma2 can extend from the second corner J2 to the fourth corner J4.
[0143] In this embodiment, the cutout region M further includes a third sub-cutout region Ma3 and a fourth sub-cutout region Ma4. The third sub-cutout region Ma3 starts from the third corner J3 and extends along the space between the third edge b3 and the fourth edge b4 into the interior of the electrode pad 1022. The fourth sub-cutout region Ma4 starts from the fourth corner J4 and extends along the space between the fourth edge b4 and the first edge b1 into the interior of the electrode pad 1022. That is, the first sub-cutout region Ma1, the second sub-cutout region Ma2, the third sub-cutout region Ma3, and the fourth sub-cutout region Ma4 start from the corner and extend without penetrating the electrode pad 1022.
[0144] In this case, in order to ensure the back inspection effect of the center of the electrode pad 1022, referring to Figure 10, the hollow area M may also include a hollow pattern Mb located in the center of the electrode pad 1022. The shape of the hollow pattern can be a circle, a polygon, or two intersecting stripes, etc.
[0145] In this embodiment, the hollowed-out area M may include multiple strip-shaped sub-hollowed-out areas Ma, which form a grid-like structure. Referring to Figure 11, the hollowed-out area M may include five strip-shaped sub-hollowed-out areas Ma.
[0146] Since the sub-cutout area Ma can extend from the edge or corner of the electrode pad 1022, even if the creep distance of the bonding material of the electrode connection portion 104 is large during the process of die bonding of the light-emitting unit 103 to the electrode pad 1022, the creep of the electrode connection portion 104 can be observed from the back of the substrate 101.
[0147] Optionally, the sub-cutout areas Ma included in the cutout area M are symmetrical with respect to the center of the electrode pad 1022. This ensures that the flow of the connecting material of the electrode connection portion 104 remains consistent on both sides of the center of the electrode pad 1022, which is beneficial to improving the die bonding effect of the light-emitting unit 103. Of course, the sub-cutout areas Ma included in the cutout area M can also be asymmetrical with respect to the center of the electrode pad 1022. This application embodiment does not specifically limit this.
[0148] In this embodiment, referring to FIG12, the cutout area M includes at least one sub-cutout area Ma. The sub-cutout area Ma can be annular in shape, and the distance d1 between the cutout edge of at least one sub-cutout area Ma and the edge of the electrode pad 1022 is less than the distance d2 between the cutout edge and the middle of the electrode pad 1022. Although the sub-cutout area Ma does not start from the edge of the electrode pad 1022, it can still cover a large area of the electrode pad 1022, thus maximizing the accuracy of back inspection.
[0149] When the sub-cutout region Ma is strip-shaped or annular, its width can range from 5 μm to 30 μm. For example, widths of 10 μm, 15 μm, 20 μm, and 25 μm, etc. The length of the sub-cutout region Ma can range from 20 μm to 50 μm. For example, lengths of 30 μm and 40 μm, etc.
[0150] Optionally, if the shape of the sub-cutout area Ma is a strip, the size of the sub-cutout area Ma can be 10μm×50μm or 20μm×50μm.
[0151] In this embodiment, referring to Figures 13 and 14, the cutout region M may include multiple sub-cutout regions Ma. The shape of the sub-cutout regions Ma can be circular, elliptical, or polygonal. The orthographic projections of the multiple sub-cutout regions Ma on the substrate 101 are evenly arranged within the orthographic projections of the electrode pads 1022 on the substrate 101. In Figure 13, the cutout region M may include four circular sub-cutout regions Ma. In Figure 14, the cutout region M includes four square sub-cutout regions Ma.
[0152] Optionally, if the sub-cutout region Ma is circular, its diameter can range from 5 μm to 30 μm. If the sub-cutout region Ma is polygonal, its maximum width can range from 5 μm to 30 μm.
[0153] It should be noted that the shape and arrangement of the hollow area M are not specifically limited in this application embodiment. As long as the following two conditions are met as much as possible: 1. The orthographic projection of the hollow area M on the substrate 101 covers the edge of the electrode pad 1022, which makes it easy to observe the creep distance of the connecting material of the electrode connection part 104 (if the overlap is poor, the creep distance will be relatively small); 2. The area of the orthographic projection of the hollow area M on the substrate 101 can be greater than a certain area threshold, which makes it easy to observe the flattening state of the electrode connection part 104 from the back of the substrate 101.
[0154] Optionally, the area threshold can be 5% to 10% of the area of the orthographic projection of the electrode pad 1022 onto the substrate 101. For example, the area of the orthographic projection of the cutout region M onto the substrate 101 is greater than 5% and less than 20%. This not only facilitates observation of the flattened state of the electrode connection portion 104 from the back of the substrate 101, but also allows the electrode pad 1022 to exert a certain fixing pull on the electrode 1032 of the light-emitting unit 103, thereby ensuring the connection effect between the electrode 1032 and the electrode pad 1022.
[0155] In addition, although the orthographic projection of the cutout area M on the substrate 101 in Figures 12 to 14 does not cover the edge of the electrode pad 1022, the area of the orthographic projection of the cutout area Ma on the substrate 101 can be set to be larger so that the cutout area Ma covers a larger area of the electrode pad 1022, thereby ensuring the accuracy of back inspection as much as possible.
[0156] In this embodiment, referring to Figures 15 and 16, the lamp board 100 further includes a protective layer 105. The protective layer 105 is located on the side of the conductive layer 102 away from the substrate 101. The protective layer 105 can cover the signal lines 1021, and has an opening K for exposing the electrode pads 1022. Thus, by providing the protective layer 105, the signal lines 1021 in the conductive layer 102 can be protected, preventing the signal lines 1021 from being affected by the external environment and ensuring the yield of the signal lines 1021. Figure 16 is a schematic diagram of the light-emitting unit 103 before die bonding.
[0157] Optionally, the protective layer 105 may include at least one layer selected from an inorganic material layer composed of inorganic materials and an organic material layer composed of organic materials. Referring to FIG16, the protective layer 105 may include an inorganic material layer, which may also be referred to as a passivation layer (PVX). Alternatively, referring to FIG17, the protective layer 105 may include an inorganic material layer 1051 and an organic material layer 1052 stacked in a direction away from the substrate 101. The inorganic material layer 1051 may also be referred to as a passivation layer (PVX). The organic material layer 1052 may be referred to as an optical adhesive (OC). Alternatively, the protective layer 105 may include an organic material layer, which may be referred to as an optical adhesive (OC).
[0158] In this embodiment, the conductive layer 102 may include a plurality of first pad groups Z1. Referring to Figures 18 to 24, each first pad group Z1 includes two electrode pads 1022, and the two electrode pads 1022 in each first pad group Z1 have different polarities. Furthermore, each of the two electrode pads 1022 in each first pad group Z1 may have a cutout area M.
[0159] Correspondingly, the lamp board 100 may include a plurality of light-emitting units 103, and the plurality of light-emitting units 103 may correspond one-to-one with a plurality of first pad groups Z1. Referring to FIG15, each light-emitting unit 103 includes a first electrode 10321 and a second electrode 10322 electrically connected to the light-emitting part 1031. The electrode connection part 104 includes a first electrode connection part 1041 located between the first electrode 10321 and one of the electrode pads 1022a, and a second electrode connection part 1042 located between the second electrode 10322 and another electrode pad 1022b. The first electrode 10321 and one of the electrode pads 1022a are electrically connected through the first electrode connection part 1041, and the second electrode 10322 and the other electrode pad 1022b are electrically connected through the second electrode connection part 1042.
[0160] The orthographic projection of the first electrode connection portion 1041 on the substrate 101 overlaps with the orthographic projection of the cutout area M of one of the electrode pads 1022a on the substrate 101. Similarly, the orthographic projection of the second electrode connection portion 1042 on the substrate 101 overlaps with the orthographic projection of the cutout area M of the other electrode pad 1022b on the substrate 101. That is, the flattening state of the first electrode connection portion 1041 can be observed through the cutout area M of one of the electrode pads 1022a in the first pad group Z1, and the flattening state of the second electrode connection portion 1042 can be observed through the cutout area M of the other electrode pad 1022b in the first pad group Z1.
[0161] In this embodiment of the application, referring to FIG25, multiple light-emitting units 103 can constitute multiple groups of light-emitting units 103a, and each group of light-emitting units 103a may include one or more light-emitting units 103. The lamp board 100 may also include multiple driving chips 106, and each driving chip 106 may be connected to the light-emitting units 103 included in a group of light-emitting units 103a for controlling the light emission of the light-emitting units 103 included in the group of light-emitting units 103a.
[0162] The conductive layer 102 also includes a plurality of second pad groups (not shown in the figure), each second pad group including a drive pad, which is also connected to the signal line 1021 and also has a cutout area M. The setting of the cutout area M in the drive pad can be similar to the setting of the cutout area M in the electrode pad 1022 in the above embodiment, and will not be described again in this application embodiment.
[0163] The lamp board 100 also includes a drive connection part (not shown in the figure), which is located between the driver chip 106 and the driver pad, and the driver chip 106 and the driver pad are electrically connected through the drive connection part. The driver chip can be used to receive signals provided by an external power supply to control the light-emitting unit to emit light.
[0164] The orthographic projection of the drive connection portion on the substrate 101 overlaps with the orthographic projection of the cutout area M on the substrate 101. Therefore, the flattening state of the drive connection portion can be observed through the cutout area M of the drive pad, thereby determining the overlap state between the drive chip 106 and the drive pad. Furthermore, it facilitates the timely detection of drive chips 106 with poor connection yield, allowing for timely replacement and improving the yield of the lamp board 100.
[0165] In this embodiment, the area where a group of light-emitting units 103a connected to each driver chip 106 is located can be referred to as a light-emitting area. The light-emitting units 103 within each light-emitting area can emit light simultaneously or not emit light simultaneously. The light-emitting units 103 within each light-emitting area are connected via signal lines 1021 to achieve signal transmission. Furthermore, different light-emitting areas can be connected via signal lines 1021 between light-emitting areas for signal transmission.
[0166] Optionally, referring to Figure 25, the lamp board 100 also includes multiple signal interfaces 107. One end of each signal interface 107 can be connected to a signal line 1021, and the other end is used to connect to an external power supply. The external power supply can transmit signals to the signal line 1021 through the signal interface 107.
[0167] Optionally, the conductive layer 102 may include a thin film transistor (TFT). The substrate 101, conductive layer 102, and protective layer 105 in the lamp board 100 provided in this application embodiment may also be collectively referred to as an array substrate.
[0168] In this embodiment, the lamp board 100 may further include a buffer layer located between the substrate 101 and the conductive layer 102 to ensure the fabrication yield of the conductive layer 102. Optionally, the fabrication process of the lamp board may include: 1. depositing a buffer layer on one side of the substrate 101; 2. forming a conductive film on the side of the buffer layer away from the substrate 101; 3. patterning the conductive film to form signal lines 1021, electrode pads 1022, and drive pads. The patterning process includes photoresist coating, exposure, development, etching, and photoresist removal. 4. A protective film is formed on the side of the signal line 1021, electrode pad 1022, and drive pad away from the substrate 101; 5. The protective film is patterned to form openings that expose the electrode pad 1022 and drive pad; 6. The light-emitting unit 103 is fixed on the electrode pad 1022 and the drive chip 106 is fixed on the drive pad through processes such as solder paste printing, die bonding, and reflow soldering; 7. The die bonding effect is tested through electrical and / or optical back inspection, and defective light-emitting units 103 and drive chips 106 are reworked.
[0169] In this embodiment, taking the electrode pad 1022 shown in FIG. 5 as an example, the flattening state of the electrode connection portion 104 is detected. FIG. 26 is a schematic diagram of the electrode connection portion and the electrode pad away from the substrate provided in this embodiment. FIG. 27 is a schematic diagram of the substrate away from the electrode connection portion and the electrode pad provided in this embodiment. Combining FIG. 26 and FIG. 27, it can be seen that the flattening state of the first electrode connection portion 1041 and the second electrode connection portion 1042 is good. Furthermore, when the flattening state of the electrode connection portion 104 is good, the electrode connection portion 104 can be seen through most of the area of the cutout region M from the side of the substrate 101 away from the electrode connection portion 104 and the electrode pad 1022.
[0170] Figure 28 is a schematic diagram of another electrode connection portion and electrode pad on the side away from the substrate provided in an embodiment of this application. Figure 29 is a schematic diagram of another electrode connection portion and electrode pad on the side away from the substrate provided in an embodiment of this application. Referring to Figures 28 and 29, it can be seen that the flattening state of the first electrode connection portion 1041 is better, while the flattening state of the second electrode connection portion 1042 is worse. Furthermore, when the flattening state of the electrode connection portion 104 is poor, the electrode connection portion 104 can only be seen through a small portion of the cutout area M from the side of the substrate 101 away from the electrode connection portion 104 and the electrode pad 1022.
[0171] Furthermore, referring to Figure 30, it can be seen that when the flatness of the second electrode connection portion 1042 is poor, there is an abnormal overlap problem at the location of the second electrode connection portion 1042. Therefore, after the light-emitting unit 103 is die-bonded to the electrode pad 1022, the flatness of the electrode connection portion 104 can be observed from the back of the substrate 101 using a microscope, thereby determining the overlap state between the light-emitting unit 103 and the electrode pad 1022. This allows for the timely detection of light-emitting units with poor connection yield, enabling rework of these units and improving the yield of the lamp board.
[0172] In summary, this application provides a lamp board including a substrate, a conductive layer, light-emitting units, and electrode connection portions. The electrode pads in the conductive layer are electrically connected to the electrodes of the light-emitting units via the electrode connection portions. Furthermore, the electrode pads have a cutout area that exposes a portion of the substrate, allowing observation of the flatness of the electrode connection portions from the back of the substrate, thereby detecting the overlap between the electrode pads and the electrodes. This facilitates timely detection of light-emitting units with poor connection yield, enabling timely replacement and improving the yield rate of the lamp board.
[0173] Figure 31 is a schematic diagram of a display device provided in an embodiment of this application. Referring to Figure 31, it can be seen that the display device may include a power supply component 200 and a lamp board 100 as provided in the above embodiment. The power supply component 200 is connected to the lamp board 100 and is used to supply power to the lamp board 100.
[0174] Optionally, the display device can be any product or component with display function, such as an LCD panel, electronic paper, organic light-emitting diode (OLED) panel, active-matrix organic light-emitting diode (AMOLED) panel, passive-matrix organic light-emitting diode (AMOLED) panel, mobile phone, tablet computer, television, monitor, laptop computer, digital photo frame or navigator.
[0175] Since the display device can have essentially the same technical effect as the lamp panel described in the previous embodiments, for the sake of brevity, the technical effect of the display device will not be described again here.
[0176] The terminology used in the embodiments section of this application is for explaining the embodiments of this application only and is not intended to limit this application. Unless otherwise defined, the technical or scientific terms used in the embodiments of this application should have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains.
[0177] The terminology used in the embodiments section of this application is for illustrative purposes only and is not intended to limit the application. Unless otherwise defined, the technical or scientific terms used in the embodiments of this application should have the ordinary meaning understood by one of ordinary skill in the art to which this application pertains. The terms "first," "second," "third," and similar terms used in the patent application specification and claims of this application do not indicate any order, quantity, or importance, but are merely used to distinguish different components. Similarly, the terms "a" or "one," and similar terms do not indicate a quantity limitation, but rather indicate the presence of at least one. The terms "comprising" or "including," and similar terms mean that the elements or objects preceding "comprising" or "including" encompass the elements or objects listed following "comprising" or "including" and their equivalents, and do not exclude other elements or objects. The terms "connected," "linked," and similar terms are not limited to physical or mechanical connections, but can include electrical connections, whether direct or indirect. "Up," "down," "left," "right," etc., are used only to indicate relative positional relationships; when the absolute position of the described object changes, the relative positional relationship may also change accordingly.
[0178] The above description is merely an optional embodiment of this application and is not intended to limit this application. Any modifications, equivalent substitutions, improvements, etc., made within the spirit and principles of this application should be included within the protection scope of this application.
Claims
1. A light panel, characterized in that, The light panel includes: substrate; A conductive layer is located on one side of the substrate, and the conductive layer includes signal lines and electrode pads connected to the signal lines. The electrode pads have a cutout area for exposing a portion of the substrate. A light-emitting unit, the light-emitting unit including a light-emitting part and an electrode electrically connected to the light-emitting part, the electrode being closer to the substrate relative to the light-emitting part; The electrode connection portion is located between the electrode and the electrode pad, and the electrode and the electrode pad are electrically connected through the electrode connection portion. The electrode is used to receive a drive signal transmitted by the signal line through the electrode connection portion and the electrode pad. The orthographic projection of the electrode connection portion on the substrate and the orthographic projection of the cutout area on the substrate overlap.
2. The lamp panel according to claim 1, characterized in that, The area of the hollowed-out region projected onto the substrate is less than 20% of the area of the electrode pad projected onto the substrate.
3. The lamp panel according to claim 2, characterized in that, The hollowed-out area includes at least one strip-shaped sub-hollowed-out area; Wherein, at least one of the sub-cutout areas extends from the edge or corner of the electrode pad to at least the interior of the electrode pad.
4. The lamp panel according to claim 3, characterized in that, The electrode pad includes a first edge, a second edge, a third edge, and a fourth edge connected in sequence, wherein the first edge and the third edge are arranged opposite to each other, and the second edge and the fourth edge are arranged opposite to each other. The sub-cutout area extends from the first edge of the electrode pad to the third edge of the electrode pad; or, the sub-cutout area extends from the second edge of the electrode pad to the fourth edge of the electrode pad.
5. The lamp panel according to claim 3, characterized in that, The hollow area includes a strip-shaped first sub-hollow area and a strip-shaped second sub-hollow area. The electrode pad includes a first edge, a second edge, a third edge and a fourth edge connected in sequence. The first edge and the third edge are arranged opposite to each other, and the second edge and the fourth edge are arranged opposite to each other. The first sub-cutout area extends from the first edge to at least the interior of the electrode pad, and the extending direction of the first sub-cutout area intersects with the first edge; The second sub-cutout area extends from the third edge to at least the interior of the electrode pad, and the extension direction of the second sub-cutout area intersects with the third edge.
6. The lamp panel according to claim 5, characterized in that, The first edge and the third edge are parallel, and both the first edge and the third edge extend along a first direction; The extension direction of the first sub-cutout area is parallel to the extension direction of the second sub-cutout area, and the first sub-cutout area and the second sub-cutout area are spaced apart in the first direction.
7. The lamp panel according to claim 6, characterized in that, The second edge and the fourth edge are parallel, and both the second edge and the fourth edge extend along a second direction, which is perpendicular to the first direction; the hollow area also includes a strip-shaped third sub-hollow area and a strip-shaped fourth sub-hollow area; The third sub-cutout area extends from the second edge to at least the interior of the electrode pad, and the extending direction of the third sub-cutout area intersects with the second edge; The fourth sub-cutout area extends from the fourth edge to at least the interior of the electrode pad, and the extending direction of the fourth sub-cutout area intersects with the fourth edge; The third sub-cutout area and the fourth sub-cutout area are spaced apart in the second direction.
8. The lamp panel according to claim 7, characterized in that, The first sub-cutout area and the second sub-cutout area both extend along the second direction, while the third sub-cutout area and the fourth sub-cutout area both extend along the first direction.
9. The lamp panel according to claim 5, characterized in that, The first sub-cutout area extends from the first edge to the second edge, and either the third edge or the fourth edge; The second sub-cutout area extends from the third edge to the first edge, and to either the second edge or the fourth edge; Wherein, the orthographic projection of the first sub-cutout area on the substrate and the orthographic projection of the second sub-cutout area on the substrate overlap, and the overlapping position of the first sub-cutout area and the second sub-cutout area is closer to the center of the electrode pad than the edge of the electrode pad.
10. The lamp panel according to claim 9, characterized in that, The overlapping position of the first sub-cutout area and the second sub-cutout area is located in the middle of the electrode pad.
11. The lamp panel according to claim 4, characterized in that, The angle between the extension direction of the sub-cutout areas included in the cutout area and the starting edge of the extension of the sub-cutout areas is an acute angle or an obtuse angle. The starting edge of the sub-cutout area refers to the edge at which the sub-cutout area begins to extend.
12. The lamp panel according to claim 3, characterized in that, The hollowed-out area includes a strip-shaped first sub-hollowed-out area and a strip-shaped second sub-hollowed-out area. The electrode pad includes a first edge, a second edge, a third edge, and a fourth edge connected in sequence. The first edge and the third edge are arranged opposite to each other, and the second edge and the fourth edge are arranged opposite to each other. Furthermore, the electrode pad includes a first corner formed by connecting the first edge and the second edge, a second corner formed by connecting the second edge and the third edge, a third triangle formed by connecting the third edge and the fourth edge, and a fourth corner formed by connecting the fourth edge and the first edge. The first sub-cutout area starts from the first corner and extends along the space between the first edge and the second edge, and extends at least into the interior of the electrode pad; The second sub-cutout area starts from the second corner and extends between the second edge and the third edge, and extends at least into the interior of the electrode pad.
13. The lamp panel according to claim 12, characterized in that, The first sub-cutout area extends from the first corner to the third corner, and the second sub-cutout area extends from the second corner to the fourth corner.
14. The lamp panel according to claim 12, characterized in that, The hollowed-out area also includes a strip-shaped third sub-hollowed-out area and a strip-shaped fourth sub-hollowed-out area; The third sub-cutout area starts from the third corner and extends along the space between the third edge and the fourth edge into the interior of the electrode pad; The fourth sub-cutout area starts from the fourth corner and extends along the space between the fourth edge and the first edge into the interior of the electrode pad; The hollowed-out area also includes a hollowed-out pattern located in the center of the electrode pad, the hollowed-out pattern being circular, polygonal, or two intersecting stripes.
15. The lamp panel according to claim 2, characterized in that, The hollowed-out area includes at least one sub-hollowed-out area; The sub-cutout area is annular in shape, and the distance between the cutout edge of at least one sub-cutout area and the edge of the electrode pad is less than the distance between the cutout edge and the center of the electrode pad.
16. The lamp panel according to any one of claims 3 to 15, characterized in that, The width of the sub-cutout area ranges from 5 micrometers to 30 micrometers.
17. The lamp panel according to claim 2, characterized in that, The hollowed-out area includes multiple sub-hollowed-out areas; The sub-cutout areas are circular, elliptical, or polygonal in shape, and the orthographic projections of multiple sub-cutout areas on the substrate are evenly distributed within the orthographic projections of the electrode pads on the substrate.
18. The lamp panel according to claim 17, characterized in that, The sub-cutout area is circular in shape, and the diameter of the sub-cutout area ranges from 5 micrometers to 30 micrometers.
19. The lamp panel according to any one of claims 1 to 15 and 17 to 18, characterized in that, The light panel also includes: A protective layer is located on the side of the conductive layer away from the substrate, the protective layer covers the signal line, and the protective layer has an opening for exposing the electrode pads.
20. The lamp panel according to claim 19, characterized in that, The protective layer includes at least one of an inorganic material layer composed of inorganic materials and an organic material layer composed of organic materials.
21. The lamp panel according to any one of claims 1 to 15 and 17 to 18, characterized in that, The conductive layer includes a plurality of first pad groups, each first pad group including two electrode pads, and the two electrode pads included in each first pad group have different polarities. The light-emitting unit includes a first electrode and a second electrode electrically connected to the light-emitting part. The electrode connection part includes a first electrode connection part located between the first electrode and one of the electrode pads, and a second electrode connection part located between the second electrode and the other electrode pad. The first electrode and one of the electrode pads are electrically connected through the first electrode connection part, and the second electrode and the other electrode pad are electrically connected through the second electrode connection part. The orthographic projection of the first electrode connection portion on the substrate and the orthographic projection of the cutout area of one of the electrode pads on the substrate overlap; the orthographic projection of the second electrode connection portion on the substrate and the orthographic projection of the cutout area of the other electrode pad on the substrate overlap.
22. The lamp panel according to any one of claims 1 to 15 and 17 to 18, characterized in that, The conductive layer further includes a plurality of second pad groups, each second pad group including a driving pad, the driving pad being connected to the signal line, and the driving pad also having the cutout area; the lamp board further includes: a driving chip and a driving connection part; The driving connection portion is located between the driving chip and the driving pad, and the driving chip and the driving pad are electrically connected through the driving connection portion. The orthographic projection of the driving connection portion on the substrate and the orthographic projection of the cutout area on the substrate overlap.
23. A display device, characterized in that, The display device includes: a power supply component and a lamp panel as described in any one of claims 1 to 22; The power supply component is connected to the lamp board and is used to supply power to the lamp board.