Self-seeking flexible fitting chamfering device

Abstract

The application discloses a self-seeking edge flexible fitting chamfering device, which comprises a plate material support and a displacement carrier. A follow-up abutting mechanism is arranged on the displacement carrier. The follow-up abutting mechanism comprises a floating base, a floating carrier and an elastic floating assembly connecting the floating base and the floating carrier. The floating base is provided with a horizontal limiting part for limiting the displacement of the floating carrier in a horizontal plane. When the floating carrier is subjected to an abutting force in any horizontal direction, the elastic floating assembly generates an elastic restoring force on the floating carrier. The floating carrier is provided with a chamfering main shaft mechanism, and the axis of the chamfering main shaft is perpendicular. The application can realize omnidirectional horizontal flexible follow-up abutting without steering adjustment, and the chamfering fitting degree and uniformity are greatly improved. The tool posture is stable, and tilting deviation is avoided, and the chamfering surface is flat and consistent. The application has vertical bidirectional floating compensation, avoids overcutting and missing cutting, and guarantees uniform cutting depth. The trajectory planning precision requirement is reduced, high-precision scanning is not needed, the operation is simplified, and the machining efficiency is significantly improved.

Description

Technical Field

[0001] This invention relates to a self-finding flexible bonding and chamfering device, belonging to the technical field of metal sheet processing equipment. Background Technology

[0002] In industries such as shipbuilding, steel structure processing, and pressure vessel manufacturing, edge treatment of sheet metal is a critical process before welding. High-quality chamfering not only removes burrs and stress concentrations generated during cutting but also creates specific chamfer shapes, thereby significantly improving paint adhesion and weld quality.

[0003] The mainstream sheet metal chamfering device usually adopts a processing mode that combines linear feed and fixed cutting tool. That is, the sheet metal is conveyed in a straight line by a conveyor device, and the chamfering tool fixed on one side cuts the side edge of the sheet metal.

[0004] While such devices can meet basic processing requirements for straight edges of regular rectangular sheets, their inherent limitations become particularly pronounced under complex conditions. For sheets with curved contours or irregular edges, the fixed cutting tool cannot adapt to the continuous changes in edge curvature, resulting in poor tool-to-sheet edge contact, uneven chamfer width, missed chamfers, or even damage to the sheet surface, making it difficult to guarantee processing accuracy. To complete multi-sided processing of sheets, manual flipping or multiple clamping operations are usually required, which not only leads to low production efficiency but also increases the labor intensity and safety risks for operators.

[0005] In response to this situation, the utility model patent with authorization announcement number CN216680551U discloses an automated chamfering device, which adopts a method of fixing one side and floating and attaching the other side, which can achieve chamfering of one set of opposite end faces, while the chamfering of the other set of opposite end faces still requires turning operation, and is not suitable for round, elliptical and other plates.

[0006] Currently, to meet the requirement of chamfering the outer perimeter in a single clamping operation, chamfering machines have emerged that can chamfer along the outer perimeter contour of the sheet metal. These machines can generate a chamfering spindle travel path based on the sheet metal contour and perform chamfering operations along the contour line. However, the outer perimeter contour of the sheet metal is uneven, especially the top and bottom edges, which may have relative tilts, concavities, etc. Therefore, it is difficult to accurately determine the top and bottom edge contours, making it difficult to accurately plan the spindle travel path. Generally, only a chamfering path that conforms to the general contour of the sheet metal is provided. As a result, the edge uniformity processed by traditional outer perimeter chamfering machines is poor, which cannot meet the requirements of subsequent processing such as welding of the sheet metal.

[0007] To improve this situation, some existing equipment has introduced a unidirectional floating compensation mechanism, which can achieve unidirectional floating contact of the chamfering spindle, thus improving the chamfering quality to some extent. However, such mechanisms can only adapt to small deviations in a single direction. When dealing with multi-dimensional contour changes or large curvature arcs, frequent turning control is required. At the same time, the milling cone surface of the chamfering spindle may also be tilted, so it is impossible to achieve stable contact between the tool and the edge of the sheet metal. Moreover, the dynamic response is lagging, which can easily cause fluctuations in processing quality. Summary of the Invention

[0008] The purpose of this invention is to address the shortcomings of the prior art. In response to the numerous problems of traditional peripheral chamfering, such as the single floating direction, the need for frequent turning control, and the impact of dynamic response lag on processing quality and efficiency, this invention proposes a self-finding flexible chamfering device.

[0009] To achieve the above objectives, the technical solution adopted by the present invention is as follows:

[0010] The self-finding flexible bonding and chamfering device includes a plate platform for supporting and locking the plate to be processed, and a displacement carrier disposed on the top of the plate platform, which is capable of displacement in the horizontal plane.

[0011] The displacement carrier is provided with a follow-up abutment mechanism, which includes a floating base, a floating carrier movably connected to the floating base, and an elastic floating component connecting the floating base and the floating carrier.

[0012] The floating base is provided with a horizontal limiting part for restricting the floating seat to displacement in the horizontal plane. When the floating seat is subjected to an abutment force in any horizontal direction, the elastic floating component generates an elastic restoring force on the floating seat.

[0013] The floating carrier is equipped with a chamfering spindle mechanism, the axis of which is perpendicular, and the chamfering spindle and the plate carrier have vertical relative adjustment displacement.

[0014] Preferably, the floating carrier includes a mating floating shaft for movably engaging with the floating base, and a mating carrier disposed on the mating floating shaft for mounting the chamfered spindle mechanism;

[0015] The elastic floating component is disposed between the mating floating shaft and the floating base.

[0016] Preferably, the elastic floating assembly includes a plurality of radially arranged radial elastic members disposed on the outer periphery of the mating floating shaft, wherein both ends of any radial elastic member are respectively connected to the mating floating shaft and the floating base.

[0017] Preferably, the mating floating shaft is provided with a flange ring for cooperating with the horizontal limiting part, and the horizontal limiting part has two limiting ring seats for limiting the two axial surfaces of the flange ring respectively.

[0018] Preferably, the contact surface of any of the limiting ring seats is provided with a plurality of balls.

[0019] Preferably, the follow-up abutment mechanism has a lifting displacement relative to the displacement carrier, the chamfered spindle mechanism has a lifting displacement relative to the floating carrier, and a bidirectional floating elastic part in the vertical direction is provided between the chamfered spindle mechanism and the floating carrier.

[0020] Preferably, the chamfered spindle mechanism includes a spindle carrier that is slidably coupled to the floating carrier. The spindle carrier is provided with a plate pressing plate for pressing the plate with lifting displacement and the chamfered spindle with lifting displacement. The plate pressing plate is provided with an opening for the chamfered end of the chamfered spindle to pass through.

[0021] Preferably, it includes a grinding and cleaning mechanism, and the top of the plate platform is provided with a cleaning seat for mounting the grinding and cleaning mechanism, which is displaceable in the horizontal plane;

[0022] The polishing and cleaning mechanism includes a polishing spindle with lifting displacement and an axially vertical orientation, and the free end of the polishing spindle is provided with a polishing end.

[0023] Preferably, the polishing and cleaning mechanism includes an outer perimeter surrounding the polishing end and a dust extraction section disposed within the outer perimeter.

[0024] The grinding head is a steel wire grinding head, and a cleaning brush is provided on the outer perimeter.

[0025] Preferably, the plate carrier has a base body, and a displacement frame with horizontal linear displacement is slidably connected to the base body. The displacement frame is provided with a horizontal frame for slidably connecting the displacement seat and the cleaning seat. The horizontal orientation of the horizontal frame is perpendicular to the horizontal linear displacement direction of the displacement frame.

[0026] The displacement carrier and the cleaning carrier are each equipped with an independent walking drive source.

[0027] The beneficial effects of this invention are mainly reflected in:

[0028] 1. It can achieve omnidirectional horizontal flexible follow-up bonding without the need for steering adjustment, and can adapt to the edges of curved, irregular and irregular boards, greatly improving the chamfer bonding degree and uniformity.

[0029] 2. The chamfering spindle always maintains a vertical axis, ensuring stable tool posture, avoiding tilting or deviation, resulting in a straight and consistent chamfered surface and high machining accuracy.

[0030] 3. It has vertical bidirectional floating compensation, which can adapt to the surface undulations and thickness deviations of the board, prevent overcutting and undercutting, and ensure uniform cutting depth.

[0031] 4. Integrates pre-grinding, cleaning and dust removal to remove edge burrs and simultaneously remove debris, improving the quality of chamfering and the cleanliness of the equipment.

[0032] 5. Reduced trajectory planning accuracy requirements, eliminating the need for high-precision scanning, allowing for full circumferential chamfering to be completed in a single clamping operation, simplifying operations and improving processing efficiency. Attached Figure Description

[0033] Other features, objects, and advantages of this application will become more apparent from the following detailed description of non-limiting embodiments with reference to the accompanying drawings:

[0034] Figure 1 This is a schematic diagram of the self-finding flexible bonding chamfering device of the present invention.

[0035] Figure 2 This is a schematic diagram of the self-finding flexible bonding chamfering device of the present invention in use.

[0036] Figure 3 This is a schematic diagram of the displacement carrier in the self-finding flexible bonding chamfering device of the present invention.

[0037] Figure 4 This is a schematic diagram of the displacement carrier in the self-finding flexible bonding chamfering device of the present invention from another perspective.

[0038] Figure 5 This is a schematic diagram of the chamfering spindle mechanism in the self-finding flexible bonding chamfering device of the present invention.

[0039] Figure 6 This is a schematic diagram of the chamfering spindle mechanism in the self-finding flexible bonding chamfering device of the present invention from another perspective.

[0040] Figure 7 This is a partial default structural diagram of the chamfering spindle mechanism in the self-finding flexible bonding chamfering device of the present invention.

[0041] Figure 8 This is a partial default structural diagram of the chamfering spindle mechanism in the self-finding flexible bonding chamfering device of the present invention from another perspective.

[0042] Figure 9 This is a schematic diagram of the follow-up bonding mechanism in the self-finding flexible bonding chamfering device of the present invention.

[0043] Figure 10 This is a cross-sectional structural schematic diagram of the follow-up bonding mechanism in the self-finding flexible bonding chamfering device of the present invention.

[0044] Figure 11 This is an exploded structural diagram of the follow-up bonding mechanism in the self-finding flexible bonding chamfering device of the present invention.

[0045] Figure 12 This is an exploded view of the follow-up bonding mechanism in the self-finding flexible bonding chamfering device of the present invention.

[0046] Figure 13 This is a partial default structural diagram of the follow-up bonding mechanism in the self-finding flexible bonding chamfering device of the present invention.

[0047] Figure 14 This is a schematic diagram of the chamfering spindle mechanism in the self-finding flexible bonding chamfering device of the present invention.

[0048] Figure 15 This is a cross-sectional structural diagram of the chamfering spindle mechanism in the self-finding flexible bonding chamfering device of the present invention.

[0049] Figure 16 This is a schematic diagram of the grinding and cleaning mechanism in the self-finding flexible bonding chamfering device of the present invention. Detailed Implementation

[0050] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0051] The present application will now be described in further detail with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative of the invention and not intended to limit it. Furthermore, it should be noted that, for ease of description, only the parts relevant to the invention are shown in the accompanying drawings. It should be noted that, unless otherwise specified, the embodiments and features described in the present application can be combined with each other.

[0052] This invention provides a self-finding flexible bonding and chamfering device, such as... Figure 1 and Figure 2 As shown, it includes a plate platform 1 for supporting and locking the plate to be processed 100, and a displacement seat 2 disposed on the top of the plate platform 1, which is capable of displacement in the horizontal plane.

[0053] Specifically, the plate carrier 1 is used to support and lock the plate 100 to be processed. Generally, a negative pressure adsorption carrier or a magnetic adsorption carrier is used for locking. After the plate 100 to be processed is mounted and locked, its outer peripheral wall will be exposed relative to the carrier, which satisfies the requirement of chamfering without dead corners on the outer perimeter. Any locking mechanism that can mount and lock the plate 100 to be processed without obstruction on the outer perimeter is within the scope of protection of this case.

[0054] The displacement carrier 2 is set on top of the plate platform 1. The chamfering of the outer perimeter of the plate is achieved by placing the plate horizontally. Therefore, the displacement carrier 2 has displacement in the horizontal plane and can move around the chamfered trajectory around the outer perimeter of the plate. This type of displacement in the horizontal plane is existing technology. It is generally achieved by combining the X-axis and Y-axis of the gantry frame, or by using a robotic arm to mount the displacement carrier 2. As long as the power source that can drive the relative displacement of the displacement carrier 2 in the horizontal plane meets its displacement drive control requirements, it is sufficient.

[0055] The above describes the existing technology for achieving peripheral chamfering. It only requires setting a chamfering spindle 3 on the displacement carrier 2 to achieve peripheral chamfering with relative displacement. The displacement carrier 2 moves along a corresponding trajectory according to the outer perimeter contour of the plate, thereby achieving peripheral chamfering. The peripheral wall chamfering includes chamfering along both the upper and lower edges of the peripheral wall. For example... Figure 15 As shown, the chamfering spindle 3's tool 30 has a top chamfered cone wall 301 and a bottom chamfered cone wall 302. The relative position is adjusted by its height displacement, thereby achieving chamfering by contacting the upper and lower edges.

[0056] Traditional chamfering machines rely on a rigid running trajectory. However, sheet metal often exhibits tolerances, edge burrs, curved surfaces, rounded corners, and irregular concavities. Since chamfering is done in batches, it's difficult to perform high-precision scanning on individual sheets to determine complex track alignments, especially for the upper and lower edges of the outer perimeter. This cannot be achieved with ordinary online vision scanning equipment and requires additional high-precision scanning equipment, which is very expensive. Furthermore, there are turnover costs and frequent calibration difficulties. Rigid contact can also cause stiff transitions at the chamfered edges, leading to irregularities in the chamfered area. Simultaneously, turnover and scanning operations significantly impact processing efficiency.

[0057] To address this issue, a floating contact solution for the outer periphery of the board has emerged. This solution uses unidirectional floating displacement for contact. In the specific design, when the chamfering spindle 3 contacts the outer periphery of the board, a rotating mounting frame with rotational displacement is required to mount the floating mechanism and the chamfering spindle 3. The unidirectional floating displacement direction is adjusted by the rotational displacement of the mounting frame to conform to the outer periphery of the board. Adjustments are made in the corresponding direction at curved surfaces and R-corner transitions to achieve floating contact. However, this involves high-frequency rotational direction adjustments, making programming and control very cumbersome and affecting chamfering efficiency. There are also issues with dynamic response lag and the floating displacement causing offset of the chamfering spindle's conical wall position, affecting chamfering formation. Furthermore, for irregular concave and convex situations, there is no data on the chamfering trajectory, and the rotating mounting frame will not make corresponding floating contact adjustments. Therefore, the chamfering formation regularity is still insufficient.

[0058] In this case, if Figures 1 to 16 As shown, the displacement carrier 2 is provided with a follow-up attachment mechanism 4. The follow-up attachment mechanism 4 includes a floating base 41, a floating carrier 42 that is movably connected to the floating base 41, and an elastic floating component 43 that connects the floating base 41 and the floating carrier 42.

[0059] The floating base 41 is provided with a horizontal limiting part 44 for limiting the displacement of the floating carrier in the horizontal plane. When the floating carrier 42 is subjected to an abutment force in any horizontal direction, the elastic floating component 43 generates an elastic restoring force on the floating carrier 42.

[0060] The floating carrier 42 is equipped with a chamfering spindle mechanism 5 with a chamfering spindle 3. The axis of the chamfering spindle 3 is vertical, and there is a vertical relative adjustment displacement between the chamfering spindle 3 and the plate carrier 1.

[0061] Detailed implementation process and principle explanation:

[0062] When performing chamfering on the outer perimeter of the sheet metal, the displacement carrier 2 will run along the predetermined chamfering trajectory. The chamfering trajectory is existing technology. In this case, the accuracy requirement for the chamfering trajectory is low. It is only necessary to input the predetermined specifications of the sheet metal for batch processing to achieve spatial displacement in the horizontal plane along the chamfering trajectory.

[0063] When performing chamfering operations on the upper or lower edge of the board, the vertical relative displacement between the chamfering spindle 3 and the board platform 1 is adjusted. This adjustment is existing technology, and the relative position can be adjusted by utilizing the lifting displacement of the chamfering spindle 3 and / or the lifting displacement of the board platform 1.

[0064] After the relative position is adjusted, the displacement carrier 2 moves along the chamfering trajectory. The displacement carrier 2 is equipped with the follow-up contact mechanism 4 for displacement. When the chamfering spindle 3 of the chamfering spindle mechanism 5 is in contact with the edge of the plate, it will be subjected to the resistance force of the edge. This resistance force will be transmitted to the floating carrier 42. The floating carrier 42 is restricted by the horizontal plane of the horizontal limiting part 44. Therefore, the elastic floating component 43 will generate an elastic restoring force on the floating carrier 42, realizing the floating contact of the chamfering spindle 3 with the outer periphery of the plate in any contact direction, while always ensuring that the axial direction of the chamfering spindle 3 is perpendicular. The cutter 30 forms a relatively neat chamfering structure on the edge of the plate.

[0065] In the horizontal direction, the cutter is subjected to lateral pressure due to the potential for curved, wavy, or irregular protrusions at the edge of the sheet metal. At this point, the horizontal elastic component comes into play, pushing the floating carrier to produce a slight displacement within the allowable range of the horizontal limit. This displacement is not a passive swaying, but an active edge-finding process. Regardless of the curvature direction of the sheet metal edge, the device responds instantaneously, maintaining a constant contact pressure between the cutter and the sheet metal edge. Crucially, this process relies entirely on the elastic deformation of the internal structure, eliminating the need for angle adjustments through rotating the carrier as in traditional technologies, thus avoiding the complexity of the mechanical structure and response lag.

[0066] It should be noted that, referring to Figures 6 to 10 As shown, the chamfered spindle 3 is mounted on the floating base 42. The chamfered spindle 3 is located outside the projection area of ​​the floating base 41, so as not to affect the arrangement of the spindle drive source of the chamfered spindle 3. Extending it outward also facilitates the mounting of the expansion mechanism.

[0067] Additionally, refer to Figures 6 to 10 As shown in the attached figure, in the embodiment, the floating base 41 is located on top of the floating carrier 42, and the elastic floating component 43 is located on top of the horizontal limiting part 44. This is a specific embodiment of the present invention. In this invention, the relative positions of the floating base 41, the floating carrier 42, the elastic floating component 43, and the horizontal limiting part 44 are not restricted. As long as the cooperative structure of the elastic floating component 43 and the horizontal limiting part 44 acting on the floating carrier 42 can be realized, it is within the protection scope of this invention.

[0068] In one specific embodiment, such as Figures 7 to 13 As shown, the floating carrier 42 includes a mating floating shaft 421 for movably engaging with the floating base 41, and a mating carrier 422 disposed on the mating floating shaft 421 for mounting the chamfered spindle mechanism 5. An elastic floating assembly 43 is disposed between the mating floating shaft and the floating base.

[0069] Specifically, the floating carrier 42 includes a mating floating shaft 421 located within the floating base 41 for achieving floating and horizontal limiting cooperation, and a mating carrier 422 extending outside the floating base 41. This satisfies both floating and limiting cooperation while facilitating the mounting of the chamfered spindle mechanism 5.

[0070] By designing the floating shaft 421, it is easy to arrange the elastic floating component 43 between the outer periphery of the floating shaft 421 and the floating base 42, thereby achieving a floating and restoring force in any direction. This arrangement is only a preferred solution in this case; other feasible solutions exist, such as using a bushing-tube structure, where the floating base 41 has a mandrel extending into the bushing-tube, and the elastic floating component 43 is disposed between the inner wall of the bushing-tube and the mandrel. Any scheme or mechanism that only requires the connection of the elastic floating component 43 to form a universal floating structure is within the protection scope of this case.

[0071] In one specific embodiment, the elastic floating assembly 43 includes a plurality of radially arranged radial elastic members 430 disposed on the outer periphery of the mating floating shaft, with both ends of any radial elastic member connected to the mating floating shaft and the floating base, respectively. The elastic floating assembly 43 is configured to achieve omnidirectional elastic floating, including but not limited to at least one of a plurality of radially arranged springs, torsion springs, elastic damping elements, disc springs, elastic diaphragms, or rubber elastomers.

[0072] This achieves elastic restoring force in any direction, thus realizing omnidirectional elastic conforming and following motion. (Refer to...) Figures 11 to 13 As shown, it adopts a vertical two-layer structure, with each layer having several circumferentially distributed radial elastic elements 430, thus meeting the requirement of relatively reliable elastic restoring force.

[0073] Furthermore, the elastic floating component in this case can be a torsion spring disposed between the outer periphery of the mating floating shaft and the floating base. The torsion spring can also achieve elastic restoring force in any direction.

[0074] In one specific embodiment, the mating floating shaft 421 is provided with a flange ring 4210 for cooperating with the horizontal limiting part, and the horizontal limiting part 44 is provided with two limiting ring seats 440 for limiting the two annular surfaces of the flange ring body in the axial direction respectively.

[0075] Specifically, the horizontal limiting part 44 clamps and limits the flange ring body 4210 at both ends in the axial direction, and the limiting ring seat 440 can limit the mating floating shaft 421 in the horizontal plane. Due to this design, the force exerted by the mating floating shaft 421 on the elastic floating component 43 is horizontal, and the direction of the elastic restoring force of the elastic floating component on the mating floating shaft 421 is also horizontal. This ensures that the axial verticality of the chamfering spindle is maintained and the tool will not deviate.

[0076] In one specific embodiment, the mating floating shaft 421 passes through two limiting ring seats 440, and the flange ring body 4210 is limited between the two limiting ring seats. Therefore, the horizontal displacement of the mating floating shaft 421 is restricted by the inner ring wall of the limiting ring seat 440, preventing trajectory errors that could lead to excessive pressure on the elastic floating component and protecting the elastic floating component.

[0077] In one specific embodiment, a plurality of abutting balls 441 are provided on the abutting ring surface of any limiting ring seat 440.

[0078] The abutting ball 441 is used to reduce friction, so that the flange ring 4210 can smoothly respond to horizontal displacement between the two limit ring seats 440. While ensuring the follow-up sensitivity, it also ensures the accuracy and reliability of axial verticality.

[0079] In one specific embodiment, the follow-up abutment mechanism 4 has a lifting displacement relative to the displacement carrier 2, the chamfered spindle mechanism 5 has a lifting displacement relative to the floating carrier 42, and a bidirectional floating elastic part 6 in the vertical direction is provided between the chamfered spindle mechanism 5 and the floating carrier 42.

[0080] Specifically, the outer perimeter of the board has multi-dimensional tolerances and irregular structures. The follow-up bonding mechanism 4 is used to ensure the axial verticality of the chamfered spindle while achieving floating bonding in the horizontal dimension.

[0081] In this embodiment, vertical floating bonding is introduced. A bidirectional floating elastic part 6 is set between the chamfered spindle mechanism 5 and the floating carrier 42 in the vertical direction, which can satisfy the elastic pressing floating for the upper edge of the outer peripheral wall of the plate and the lifting and abutting floating for the lower edge.

[0082] During the chamfering process, the cone wall of the chamfering spindle tool will correspond to the upper or lower edge. Whether floating vertically or horizontally, the chamfering spindle will always maintain its axial verticality, and the tool will maintain a stable chamfering tilt. The horizontal contact force it receives is transmitted to the elastic floating component 43, and the vertical contact force it receives is transmitted to the bidirectional floating elastic part 6. The floating recovery force of both is transmitted unidirectionally to the chamfering spindle. This satisfies the multi-dimensional follow-up contact and ensures the stability of the tool's posture, and the chamfering forming regularity is significantly improved.

[0083] In the vertical direction, the surface of the sheet metal often exhibits flatness errors or thickness fluctuations. The bidirectional floating elastic section 6 allows the chamfering spindle mechanism to float up and down relative to the floating carrier. When encountering a protrusion on the sheet metal surface, the spindle automatically rises; when encountering a depression, the spindle automatically presses down. This vertical bidirectional floating ensures consistent cutting depth and avoids overcutting or undercutting caused by sheet metal warping.

[0084] Regardless of how the cutting tool follows and conforms to the edge of the board, the rotation axis of the chamfering spindle remains perpendicular, ensuring extremely high positional accuracy of the milling conical surface. The resulting chamfered surface is straight, uniform, and free of tilting deviation.

[0085] To elaborate further, before performing the chamfering operation, the lifting position of the follow-up contact mechanism 4 is adjusted so that the initial position of the chamfering spindle mechanism 5 is aligned with the edge of the board to be processed. Then, the feed stroke of the corresponding chamfering part is controlled by adjusting the lifting height of the chamfering spindle mechanism 5 itself.

[0086] In one specific embodiment, such as Figure 8 and Figure 9 As shown, the bidirectional floating elastic part 6 includes a guide shaft disposed on the floating carrier 42. The two ends of the guide shaft are equipped with limiting platforms. The chamfered main shaft mechanism 5 is equipped with a bidirectional slide on the guide shaft for sliding engagement. A floating spring sleeved on the guide shaft is provided between the bidirectional slide and any limiting platform, thus realizing vertical floating engagement. The structure and principle of the bidirectional floating elastic part 6 itself belong to the prior art. As long as the structure of vertical bidirectional floating elastic engagement is satisfied, it is within the protection scope of this case.

[0087] In one specific embodiment, such as Figure 14 and Figure 15 As shown, the chamfering spindle mechanism 5 includes a spindle carrier 51 that is vertically and slidably coupled to the floating carrier 42. The spindle carrier 51 is provided with a board pressing plate 7 with vertical displacement for pressing the board and a chamfering spindle 3 with vertical displacement. The board pressing plate 7 is provided with an opening 71 through which the chamfered end of the chamfering spindle passes.

[0088] Specifically, the sheet metal pressing plate 7 and the chamfering spindle 3 employ an independent lifting and displacement drive design. The sheet metal pressing plate 7 is equipped with an independent drive assembly, allowing it to move up and down relative to the spindle carrier 51. The chamfering spindle 3 also achieves lifting and displacement through an independent spindle drive mechanism. When the device is processing, the sheet metal pressing plate 7 presses against the sheet metal surface, providing stable support for the chamfering process. The chamfering spindle 3 passes through the opening 71 to adjust the alignment of the upper or lower edge and to regulate the chamfering specification stroke. Since the floating carrier 42 is restricted to moving in the horizontal direction, its horizontal posture remains stable. This stability is transmitted to the spindle carrier 51 and the sheet metal pressing plate 7, ensuring the horizontal fit between the pressing surface of the sheet metal pressing plate 7 and the sheet metal surface.

[0089] In one specific embodiment, the pressing surface of the board pressing plate is provided with a plurality of bonding ball bearings 72 distributed around the window.

[0090] The bonding ball 72 of the board pressing plate 7 converts sliding friction into rolling friction, reduces displacement resistance, and enables the board pressing plate 7 to sensitively follow the undulations of the board surface, thus playing a role in pressing and holding the board with the spindle. This eliminates the influence of external vibration on the chamfering accuracy during processing, ensures the stability of the chamfering spindle 3, and improves the surface quality and accuracy of chamfering.

[0091] In one specific embodiment, such as Figure 3 , Figure 4 , Figure 16 As shown, it includes a grinding and cleaning mechanism 8, and the top of the plate platform is provided with a cleaning seat 80 for mounting the grinding and cleaning mechanism, which is capable of displacement in the horizontal plane.

[0092] The polishing and cleaning mechanism 8 includes a polishing spindle 81 with lifting displacement and vertical axis, and a polishing end 82 is provided at the free end of the polishing spindle.

[0093] Detailed implementation process and principle explanation:

[0094] During the initial cutting process of sheet metal, burrs and other irregular structures may remain on the outer perimeter. These burrs directly affect the neatness of the upper and lower edges of the outer perimeter. Traditional rigid chamfering has a fixed feed rate, so there is no need to remove these small structures.

[0095] In this case, a combination of vertical bidirectional floating and horizontal floating was used for follow-up bonding. These irregular structures, such as burrs, also participated in the action of resisting force. During the chamfering process, the chamfering spindle has a certain travel speed. When the speed is high, these irregular structures will generate a certain difference in resisting force while being milled, which will have a certain impact on the regularity.

[0096] Therefore, in this embodiment, a cleaning carrier 80 is used to mount the grinding spindle 81. The cleaning carrier 80 can remove burrs and other residual microstructures that are attached to the outer periphery of the plate by the grinding end 82, thus ensuring the chamfering degree of the rear chamfering spindle.

[0097] In one specific embodiment, the grinding and cleaning mechanism 8 includes an outer perimeter baffle 83 surrounding the grinding end and a suction dust removal part 84 disposed within the outer perimeter baffle; the grinding end is a steel wire grinding head, and a cleaning brush 85 is provided on the outer perimeter baffle.

[0098] Specifically, when the grinding and cleaning mechanism 8 is driven, the cleaning brush 85 on the outer perimeter will form a moving isolation space on the outer perimeter wall of the plate. At this time, the dust and debris generated by the wire grinding head will be in this isolation space and will be promptly removed by the suction dust removal unit 84. This ensures the cleanliness of the outer perimeter wall and prevents residual dust and debris from affecting the equipment.

[0099] In one specific embodiment, the plate platform 1 has a base body 10, and a displacement frame 11 with horizontal linear displacement is slidably connected to the base body 10. The displacement frame 11 is provided with a horizontal frame 12 for slidingly connecting the displacement seat and the cleaning seat. The horizontal orientation of the horizontal frame is perpendicular to the horizontal linear displacement direction of the displacement frame. The displacement seat and the cleaning seat are each provided with an independent walking drive source.

[0100] like Figures 1 to 8 As shown, in this embodiment, the displacement carrier and the cleaning carrier share a horizontal displacement drive structure, and each controls its own displacement stroke through its own independent walking drive source.

[0101] Of course, this embodiment is only a specific application of this case. The grinding and cleaning mechanism 8 can also be directly mounted on the displacement carrier and driven by the displacement carrier. Considering energy consumption and cleaning options, a design scheme with separate independent walking mechanisms is more reasonable.

[0102] As described above, it can be seen that it can achieve omnidirectional horizontal flexible follow-up bonding without the need for steering adjustment, and can adapt to the edges of curved, irregular, and non-standard materials, significantly improving the beveling fit and uniformity. The beveling spindle always maintains a vertical axis, ensuring stable tool posture, avoiding tilting and deviation, and resulting in a straight and consistent beveling surface with high processing accuracy. It has vertical bidirectional floating compensation, which can adapt to the surface undulations and thickness deviations of the material, preventing overcutting and undercutting, and ensuring uniform cutting depth. It integrates pre-grinding cleaning and dust removal, removing edge burrs and simultaneously removing debris, improving the beveling quality and equipment cleanliness. It reduces the accuracy requirements of trajectory planning, eliminating the need for high-precision scanning, and completing the full circumferential beveling in a single clamping, simplifying operation and improving processing efficiency.

[0103] The term "comprising" or any other similar term is intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus / device that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent in such process, method, article, or apparatus / device.

[0104] The technical solution of the present invention has been described above with reference to the preferred embodiments shown in the accompanying drawings. However, it will be readily understood by those skilled in the art that the scope of protection of the present invention is obviously not limited to these specific embodiments. Without departing from the principles of the present invention, those skilled in the art can make equivalent changes or substitutions to the relevant technical features, and the technical solutions after such changes or substitutions will all fall within the scope of protection of the present invention.

Claims

1. A self-aligning flexible bonding and chamfering device, comprising a plate platform for supporting and locking the plate to be processed, and a displacement seat disposed on top of the plate platform, capable of displacement in a horizontal plane; characterized in that: The displacement carrier is provided with a follow-up abutment mechanism, which includes a floating base, a floating carrier movably connected to the floating base, and an elastic floating component connecting the floating base and the floating carrier. The floating base is provided with a horizontal limiting part for restricting the floating seat to displacement in the horizontal plane. When the floating seat is subjected to an abutment force in any horizontal direction, the elastic floating component generates an elastic restoring force on the floating seat. The floating carrier is equipped with a chamfered spindle mechanism, the axis of which is perpendicular, and the chamfered spindle and the plate carrier have vertical relative adjustment displacement. The floating carrier includes a mating floating shaft for movably engaging with the floating base, and a mating carrier disposed on the mating floating shaft for mounting the chamfered spindle mechanism; The elastic floating component is disposed between the mating floating shaft and the floating base; The elastic floating assembly includes a plurality of radially arranged radial elastic elements disposed on the outer periphery of the mating floating shaft, wherein both ends of any radial elastic element are respectively connected to the mating floating shaft and the floating base; The mating floating shaft is provided with a flange ring body for cooperating with the horizontal limiting part, and the horizontal limiting part has two limiting ring seats for limiting the two annular surfaces of the flange ring body in the axial direction respectively. The contact ring surface of any of the aforementioned limiting ring seats is provided with a plurality of contact balls.

2. The self-finding flexible bonding chamfering device according to claim 1, characterized in that: The follow-up contact mechanism has a lifting displacement relative to the displacement carrier, the chamfered spindle mechanism has a lifting displacement relative to the floating carrier, and a bidirectional floating elastic part in the vertical direction is provided between the chamfered spindle mechanism and the floating carrier.

3. The self-finding flexible bonding and chamfering device according to claim 2, characterized in that: The chamfered spindle mechanism includes a spindle carrier that is slidably and vertically connected to the floating carrier. The spindle carrier is provided with a plate pressing plate for pressing the plate with lifting displacement and the chamfered spindle with lifting displacement. The plate pressing plate is provided with an opening for the chamfered end of the chamfered spindle to pass through.

4. The self-finding flexible bonding and chamfering device according to any one of claims 1 to 3, characterized in that: Includes a grinding and cleaning mechanism, wherein the top of the plate platform is provided with a cleaning seat for mounting the grinding and cleaning mechanism, which is capable of displacement in a horizontal plane; The polishing and cleaning mechanism includes a polishing spindle with lifting displacement and an axially vertical orientation, and the free end of the polishing spindle is provided with a polishing end.

5. The self-finding flexible bonding chamfering device according to claim 4, characterized in that: The grinding and cleaning mechanism includes an outer perimeter surrounding the outer circumference of the grinding end and a dust extraction section disposed within the outer perimeter. The grinding head is a steel wire grinding head, and a cleaning brush is provided on the outer perimeter.

6. The self-finding flexible bonding chamfering device according to claim 4, characterized in that: The plate carrier has a base body, and a displacement frame with horizontal linear displacement is slidably connected to the base body. The displacement frame is provided with a horizontal frame for slidably connecting the displacement seat and the cleaning seat. The horizontal orientation of the horizontal frame is perpendicular to the horizontal linear displacement direction of the displacement frame. The displacement carrier and the cleaning carrier are each equipped with an independent walking drive source.

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