Heatable cup stand

Abstract

The invention provides a heatable cup stand, which relates to the technical field of polymer-based composite materials and sequentially comprises a heating layer, a heat insulation layer and a heat dissipation layer from top to bottom, the heating layer is made of a cashew nut shell oil epoxy resin CNSL-based conductive composite material; the CNSL-based conductive composite material is prepared from the following components in percentage by mass: 40 to 60 percent of CNSL, 15 to 25 percent of carbon fiber chopped strands, 5 to 20 percent of nano tin antimony oxide and 3 to 15 percent of flame retardant. A heating layer is prepared from a cashew nut shell oil epoxy resin (CNSL)-based conductive composite material, phenolic hydroxyl groups and long aliphatic chains in CNSL in the CNSL-based conductive composite material are filled with carbon fibers and nano tin antimony oxide (ATO) to form a conductive net, the surface resistivity is smaller than or equal to 103 omega.cm, and direct electrifying heating can be achieved; the CNSL used in the invention can prevent benzene substances from being released at high temperature, so that the VOC emission is less than or equal to 50 mu g / m < 3 >; the heating layer is prepared from the CNSL-based conductive composite material, so that the mass of the heatable cup stand can be remarkably reduced, and the energy consumption is reduced.

Description

Technical Field

[0001] This invention relates to the field of polymer-based composite materials technology, and specifically to a heatable cup holder. Background Technology

[0002] Existing heated cup holders are generally metal / PTC ceramic heated cup holders. However, metal / PTC ceramic heated cup holders are heavy and energy-intensive, affecting the range of electric vehicles; moreover, the plastic parts used in them easily release VOCs when heated, which does not comply with the relevant standards of GB / T 27630-2023 "Guidelines for Air Quality Assessment in Passenger Cars". Summary of the Invention

[0003] In view of the shortcomings of the existing technology, the present invention provides a heatable cup holder that can solve the technical problems of large weight, high energy consumption and high VOC emissions of existing heatable cup holders.

[0004] To achieve the above objectives, the present invention provides a heating layer, a heat insulation layer, and a heat dissipation layer, which are arranged from top to bottom; the heating layer is made of cashew nut shell oil epoxy resin CNSL-based conductive composite material; By mass fraction, the CNSL-based conductive composite material comprises: 40-60% CNSL, 15-25% chopped carbon fiber filaments, 5-20% nano-tin antimony oxide, and 3-15% flame retardant.

[0005] Preferably, the average particle size of the nano-tin antimony oxide is 15-25 nm.

[0006] Preferably, the length of the chopped carbon fiber filaments is 1-5 mm.

[0007] Preferably, the flame retardant is selected from one or more of aluminum diethylphosphonate, 9,10-dioxo-9-oxa-10-phosphaphenanthrene, and modified magnesium hydroxide.

[0008] Preferably, the surface of the CNSL-based conductive composite material layer is engraved with heating circuitry.

[0009] Preferably, the heat insulation layer is an aerogel heat insulation layer; the aerogel is a superhydrophobic silica aerogel.

[0010] Preferably, the heat dissipation layer is an aluminum alloy heat dissipation substrate, and the aluminum alloy comprises the following elements by weight percentage: Al: 97.38-98.75%, Mg: 0.8-1.2wt%, Si: 0.4-0.8wt%, Cu: 0.15-0.4wt%, Zr: 0.10-0.12wt%.

[0011] Preferably, the thickness of the heating layer is 0.7-0.9 mm.

[0012] Preferably, the thickness of the insulation layer is 0.3-0.6 mm.

[0013] Preferably, the thickness of the heat dissipation layer is 0.3-0.6 mm.

[0014] Compared with the prior art, the advantages of the present invention are: (1) The present invention uses cashew nut shell oil epoxy resin (CNSL) based conductive composite material to prepare the heating layer. The phenolic hydroxyl groups and long aliphatic chains in CNSL in the CNSL based conductive composite material are filled with carbon fiber and nano antimony tin oxide (ATO) to form a conductive network, thereby achieving a surface resistivity ≤10. 3 Ω·cm, can be directly heated by electricity; (2) Compared with traditional bisphenol A epoxy resin, the CNSL used in this invention can avoid the release of benzene substances at high temperature, so that VOC emissions are ≤50μg / m 3 (3) Compared with the traditional use of PCT ceramic as heating layer, the present invention uses CNSL-based conductive composite material to prepare heating layer, which can significantly reduce the mass of the heatable cup holder and reduce energy consumption. Attached Figure Description

[0015] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0016] Figure 1 This is a schematic diagram of the structure of the heatable cup holder according to an embodiment of the present invention; 1-Heating layer; 2-Insulation layer; 3-Heat dissipation layer. Detailed Implementation

[0017] To make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present invention, not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0018] This invention provides a heatable cup holder. The heating layer is prepared using a cashew nut shell oil epoxy resin (CNSL)-based conductive composite material. The phenolic hydroxyl groups and long aliphatic chains in the CNSL-based conductive composite material are filled with carbon fibers and nano-antimony tin oxide (ATO) to form a conductive mesh, achieving a surface resistivity ≤10. 3Ω·cm, can be directly heated by electricity; the CNSL used in this invention can avoid the release of benzene compounds at high temperatures, keeping VOC emissions ≤50μg / m³. 3 Meanwhile, the present invention uses CNSL-based conductive composite material to prepare the heating layer, which can significantly reduce the mass of the heatable cup holder and reduce energy consumption, thus solving the technical problems of large mass, high energy consumption and high VOC emissions of existing heatable cup holders.

[0019] To achieve the above-mentioned technical effects, the overall concept of this invention is as follows: This invention provides a heatable cup holder, which includes a heating layer, a heat insulation layer and a heat dissipation layer from top to bottom; the heating layer is made of cashew nut shell oil epoxy resin (CNSL) based conductive composite material; wherein, by mass fraction, the CNSL based conductive composite material includes: CNSL 40-60%, carbon fiber short chopped filaments 15-25%, nano antimony tin oxide (ATO) 5-20%, and flame retardant 3-15%.

[0020] During the research and development process, it was discovered that traditional materials could not simultaneously meet the three major requirements of conductive heating, environmental protection, and lightweighting. After extensive experimental research, a CNSL-based conductive composite material was proposed, and the heating layer was prepared using the CNSL-based conductive composite material. The components in the composite material work synergistically to solve the above problems.

[0021] This invention organically combines CNSL, chopped carbon fiber filaments, and nano-ATO, allowing the chopped carbon fiber filaments and nano-ATO to fill the spaces between the phenolic hydroxyl groups and long aliphatic chains in the CNSL molecule, forming a conductive network and achieving a surface resistivity ≤10. 3 With a strength of Ω·cm, it can be directly heated by electricity. Meanwhile, CNSL is an epoxy resin modified with cashew nut shell oil, a recycled agricultural waste. Its carbon footprint is 62% lower than that of petroleum-based epoxy resins, achieving not only sustainability for bio-based materials but also avoiding the release of benzene compounds at high temperatures, making it environmentally friendly. CNSL can achieve VOC emissions ≤50μg / m³. 3 It meets national standards. CNSL has a density of only 1.2 g / cm³. 3 It is 60% lighter than metal, enabling a lightweight design for heated cup holders, thereby reducing energy consumption.

[0022] In addition, CNSL exhibits excellent heat resistance and toughness balance, with a glass transition temperature (Tg) of 120℃, while maintaining 8KJ / m². 2 CNSL has high impact strength. It has good processability and is suitable for injection molding complex cup holder structures. Moreover, CNSL molecular chains contain high-density phenolic hydroxyl groups, and its curing temperature is 40°C lower than that of traditional bisphenol A epoxy resins, which can reduce processing energy consumption by 32%.

[0023] Therefore, in the above-mentioned CNSL-based conductive composite materials, CNSL has the triple function of conductive matrix, environmentally friendly binder, and structural reinforcement.

[0024] The present invention discovered that although metal fibers are conductive, they also have a high density (e.g., the density of copper fibers is 8.9 g / cm³). 3 The present invention does not conform to the lightweight design concept of this invention, and metal fibers are easily oxidized and not corrosion-resistant; while carbon nanotubes (CNTs) are expensive and difficult to disperse. Therefore, after extensive experimental research, this invention has discovered that chopped carbon fiber filaments can bring unexpected technical effects to CNSL-based conductive composite materials. Chopped carbon fiber filaments in CNSL-based conductive composite materials perform a dual function of conductivity enhancement and structural strengthening: on the one hand, the addition of 15-25% of chopped carbon fiber filaments forms a three-dimensional conductive network, which, in synergy with nano-ATO, reduces the surface resistivity to ≤10. 3 Ω·cm; on the other hand, chopped carbon fiber filaments have a high modulus (230 GPa), which can suppress material expansion during heating (the coefficient of thermal expansion CET is reduced to 28 × 10⁻⁶). -6 The carbon fiber short filaments ( / K) can prevent deformation of laser-engraved circuits. In addition, the three-dimensional conductive network constructed from carbon fiber short filaments has a high electro-thermal energy conversion efficiency (experimental data shows that the conversion efficiency can be as high as 92%), which can reduce energy consumption.

[0025] In the aforementioned CNSL-based conductive composite material, nano-ATO serves a dual function of light transmission and electrical conductivity as well as thermal radiation regulation: On the one hand, this invention uses nano-sized antimony tin oxide, with an addition amount of 5-20% filling the gaps between the short carbon fiber filaments, to uniformize the composite resistivity distribution and avoid local overheating; on the other hand, nano-ATO has unique optical properties, with an infrared reflectivity of >80%, which can quantitatively radiate heat to the cup body, improving the thermal efficiency to 72%.

[0026] In the aforementioned CNSL-based conductive composite material, the addition of flame retardants can improve the flame retardant properties of the heatable cup holder.

[0027] The heatable cup holder of the present invention comprises, from top to bottom, a heating layer, a heat insulation layer and a heat dissipation layer. When energized, the heating layer can achieve efficient directional heating, transferring 80% of the heat upward to the cup body. Meanwhile, the heat insulation layer located below the heating layer prevents heat loss by reflecting a portion of the heat lost from the heating layer upward to the cup body, while the heat dissipation layer is used to evenly transfer the remaining heat lost from the heating layer to the cold end of the cup holder.

[0028] Preferably, the thickness of the heating layer is 0.7-0.9 mm; the thickness of the heat insulation layer is 0.3-0.6 mm; and the thickness of the heat dissipation layer is 0.3-0.6 mm.

[0029] The present invention first disperses short carbon fiber filaments, nano-ATO, and flame retardant in CNSL, and then injection molds a heating layer with a thickness of 0.7-0.9 mm; and then forms a sandwich structure with an overall thickness of 1.3-2.1 mm by hot pressing (120℃, 5MPa) with a heat insulation layer with a thickness of 0.3-0.6 mm and a heat dissipation layer with a thickness of 0.3-0.6 mm.

[0030] Preferably, the average particle size of the nano-tin antimony oxide is 15-25 nm. The present invention uses nano-tin antimony oxide with an average particle size of 15-25 nm to match the fiber gaps of chopped carbon fiber filaments, forming a "micro-nano" two-dimensional conductive network. This significantly improves the conductivity, uniformity, and mechanical properties of the composite material, reduces the percolation threshold, and enhances electromagnetic shielding and static dissipation capabilities.

[0031] Preferably, the aspect ratio of the carbon fiber chopped strands is (140-160):1, and more preferably, the aspect ratio of the carbon fiber chopped strands is 150:1.

[0032] Preferably, the length of the chopped carbon fiber filaments is 1-5 mm. Tests show that when the length of the chopped carbon fiber filaments is too short (<1 mm), it will cause discontinuity in the conductive network, and when the length is too long (>5 mm), it will affect the flowability of the injection molding.

[0033] Preferably, the flame retardant is selected from one or more of aluminum diethylphosphonate (DEPAL), 9,10-dioxo-9-oxa-10-phosphaphenanthrene (DOPO), and modified magnesium hydroxide (Mg(OH)2@SiO2 core-shell).

[0034] Preferably, a heating circuit is engraved on the surface of the CNSL-based conductive composite material layer. The heating circuit is laser-engraved. This invention uses a 1064nm fiber laser (20W power, 300mm / s scanning speed) to engrave a serpentine heating circuit on the surface of the CNSL-based conductive composite material layer, with a linewidth of 0.25-0.35mm. Laser engraving removes the surface resin, exposing the short-cut carbon fiber filaments and nano-tin antimony oxide, forming a continuous conductive path. Lasers can precisely remove surface resin, exposing the conductive material to form the circuit without damaging the internal structure, making it suitable for fabricating precise and complex circuit patterns.

[0035] Preferably, the heat insulation layer is an aerogel heat insulation layer, wherein the aerogel is a superhydrophobic silica aerogel. The aerogel heat insulation layer of the present invention uses a superhydrophobic silica aerogel with a density of 0.06-0.1 g / cm³. 3 The preferred value is 0.08 g / cm³. 3The thermal conductivity of the heating layer is >180 W / (m·K), while that of the aerogel insulation layer is <0.02 W / (m·K). The thermal conductivity of the heating layer differs from that of the insulation layer by more than 100 times. Therefore, when the heating and insulation layers are stacked, 90% of the heat can be radiated upwards into the cup. The core function of the aerogel insulation layer is to achieve efficient thermal management through a dual mechanism of "nanopore insulation + infrared reflection": on the one hand, the aerogel traps air within its nanopores, blocking molecular collision heat transfer and thus achieving insulation; on the other hand, the nanoparticles within the aerogel act like mirrors, reflecting thermal radiation (infrared rays) back. This combination of mechanisms ensures that almost no heat passes through the insulation layer.

[0036] Preferably, the heat dissipation layer is an aluminum alloy heat dissipation substrate. The aluminum alloy comprises the following elements by weight percentage: Al: 97.38-98.75%, Mg: 0.8-1.2wt%, Si: 0.4-0.8wt%, Cu: 0.15-0.4wt%, Zr: 0.10-0.12wt%. The aluminum alloy of the present invention contains trace amounts of Zr, forming Al3Zr dispersed particles, which increases the recrystallization temperature to 550°C. This increased recrystallization temperature prevents the material from deforming and failing at high temperatures, ensuring that the structural strength and stability are maintained in high-temperature environments (e.g., 550°C).

[0037] Furthermore, the aluminum alloy of this invention, through T6 aging treatment (i.e., heating the aluminum alloy at 175°C for 8 hours), achieves a thermal conductivity as high as 180 W / (m·K), which is 12.5% ​​higher than that of ordinary aluminum alloys (<160 W / (m·K)). The core function of the aluminum alloy heat dissipation substrate of this invention is heat flow guidance and structural support. On the one hand, it can transfer heat from the heating layer to the cold end of the cup holder through "longitudinal heat conduction and lateral diffusion." The longitudinal heat conduction refers to the ability to transfer a portion of the heat from the heating layer downwards to the cold end of the cup holder, achieving a heat flux density as high as 5.2 kW / m². 2 On the other hand, its yield strength is as high as 275MPa, which can resist vehicle vibration and impact.

[0038] Preferably, the aluminum alloy heat dissipation substrate has holes with a diameter of 0.1-0.3 mm and a density of 400-600 holes / cm³. 2 This can increase the heat dissipation area and improve heat dissipation efficiency.

[0039] Preferably, the heatable cup holder also includes a thermocouple, preferably a K-type thermocouple. The K-type thermocouple can control the temperature accuracy within ±0.5℃, avoiding the overshoot loss caused by the traditional ±5℃ temperature control accuracy. Data shows that it can save at least 19% of energy.

[0040] Preferably, the thermocouple includes a primary thermocouple and a secondary thermocouple. The primary thermocouple is disposed on the surface of the heating layer and is used to accurately measure the surface temperature T1 of the heating layer in real time. The secondary thermocouple is fixedly connected to the edge of the aluminum alloy heat dissipation substrate (approximately 15 mm from the heating area) and is used to monitor the temperature T2 of the cold end of the heatable cup holder in real time. The thermocouple is also used to feed back the measured temperatures T1 and T2 to the battery management system (BMS). By monitoring the surface temperature T1 of the heating layer in real time, the power of the heating circuit is controlled by the BMS, thereby allowing the heatable cup holder to enter different operating modes. By monitoring the cold end temperature T in real time and feeding back the power of the heating circuit, overheat protection can be achieved. For example, when the temperature exceeds a certain threshold (e.g., 80°C), power-off protection is triggered or a forced switch to a constant temperature mode is implemented.

[0041] The operating modes include: rapid heating mode and constant temperature maintenance mode. When the thermocouple detects that T1 is less than T01 (for example, detecting a low temperature of 15℃), the heating circuit power is controlled to P1, entering rapid heating mode. When the thermocouple detects that T1 has reached the set temperature T02, the heating circuit power is controlled to P2. Users can set the desired temperature (e.g., 40℃, 55℃, or 70℃), and the system will automatically adjust to maintain the beverage at its optimal drinking state. P1 > P2. Precise data acquisition from the thermocouples and precise linkage with the BMS enable rapid fulfillment of user needs while minimizing energy loss.

[0042] Preferably, the heated cup holder also includes a pressure sensor, which is used to detect whether there is a load on the heated cup holder (i.e. whether a cup is placed on it). Once the no-load time exceeds a certain time threshold (t), a signal will be transmitted to the vehicle's control system, which will then feed back to the BMS, thereby reducing the power supply of the power battery to the standby power. The present invention also includes an off-seat energy-saving mode.

[0043] For example, embodiments of the present invention can have the following operating modes. The heated cup holder with the above-described structure combined with the following operating modes can reduce energy loss and improve the range of electric vehicles, as shown in Table 1 below: Table 1. Working modes of the heatable cup holder in the embodiments of the present invention.

[0044] On the other hand, the present invention also provides an application of a heatable cup holder in intelligent temperature control. The present invention does not limit the specific intelligent temperature control method; conventional control methods in the art can be used to achieve intelligent temperature control of the heatable cup holder.

[0045] The following specific embodiments illustrate a heatable cup holder of the present invention.

[0046] Example 1 First, 3mm long chopped carbon fiber filaments with an aspect ratio of 150:1 and nano-ATO and DEPAL with an average particle size of 15mm are dispersed in CNSL. A heating layer with a thickness of 0.8mm is then injection molded. The composition by mass percentage is 60% CNSL, 25% chopped carbon fiber filaments, 10% nano-ATO, and 5% DEPAL. A 1064nm fiber laser (power 20W, scanning speed 300mm / s) is used to engrave a serpentine circuit on the surface of the heating layer with a line width of 0.3mm to form a continuous conductive path. A 0.5 mm heat insulation layer was prepared using superhydrophobic silica aerogel with a density of 0.08 g / cm³. A 0.5mm heat dissipation layer was prepared using aluminum alloy that had undergone T6 aging treatment. The specific composition of the aluminum alloy was: Al: 98.28%, Mg: 0.8wt%, Si: 0.4wt%, Cu: 0.4wt%, Zr: 0.12wt%. The aluminum alloy heat dissipation substrate had holes with a diameter of 0.3mm and a density of 500 holes / cm³. 2 ; The heating layer, insulation layer, and heat dissipation layer are hot-pressed (120℃, 5MPa) to form a heatable cup holder with an overall thickness of about 2mm.

[0047] Example 2 First, 4mm long chopped carbon fiber filaments with an aspect ratio of 150:1 and nano-ATO and DOPO with an average particle size of 20mm are dispersed in CNSL. A heating layer with a thickness of 0.8mm is then injection molded. By mass percentage, CNSL accounts for 40%, chopped carbon fiber filaments for 25%, nano-ATO for 20%, and DOPO for 15%. A 1064nm fiber laser (power 20W, scanning speed 300mm / s) is used to engrave a serpentine circuit on the surface of the heating layer with a line width of 0.3mm to form a continuous conductive path. A 0.5 mm heat insulation layer was prepared using superhydrophobic silica aerogel with a density of 0.08 g / cm³. A 0.5mm heat dissipation layer was prepared using aluminum alloy that had undergone T6 aging treatment. The specific composition of the aluminum alloy was: Al: 98.28%, Mg: 0.8wt%, Si: 0.4wt%, Cu: 0.4wt%, Zr: 0.12wt%. The aluminum alloy heat dissipation substrate had holes with a diameter of 0.3mm and a density of 600 holes / cm³. 2 ; The heating layer, insulation layer, and heat dissipation layer are hot-pressed (120℃, 5MPa) to form a heatable cup holder with an overall thickness of about 2mm.

[0048] Example 3 First, 2mm long chopped carbon fiber filaments with an aspect ratio of 150:1 are dispersed in CNSL along with nano-ATO and modified magnesium oxide (Mg(OH)2@SiO2 core-shell) with an average particle size of 25mm. A heating layer with a thickness of 0.8mm is then injection molded. The composition by mass percentage is 60% CNSL, 15% chopped carbon fiber filaments, 15% nano-ATO, and 10% DEPAL. A serpentine circuit with a line width of 0.3mm is then engraved on the surface of the heating layer using a 1064nm fiber laser (20W power, 300mm / s scanning speed) to form a continuous conductive path. A 0.5 mm heat insulation layer was prepared using superhydrophobic silica aerogel with a density of 0.08 g / cm³. A 0.5mm heat dissipation layer was prepared using aluminum alloy that had undergone T6 aging treatment. The specific composition of the aluminum alloy was: Al: 98.28%, Mg: 0.8wt%, Si: 0.4wt%, Cu: 0.4wt%, Zr: 0.12wt%. The aluminum alloy heat dissipation substrate had holes with a diameter of 0.2mm and a density of 500 holes / cm³. 2 ; The heating layer, insulation layer, and heat dissipation layer are hot-pressed (120℃, 5MPa) to form a heatable cup holder with an overall thickness of about 2mm.

[0049] Example 4 First, 0.5 mm long chopped carbon fiber filaments with an aspect ratio of 150:1 and a length of 0.5 mm are dispersed in CNSL with nano-ATO and DEPAL with an average particle size of 15 mm. A heating layer with a thickness of 0.8 mm is then injection molded. The composition, by mass percentage, is 60% CNSL, 25% chopped carbon fiber filaments, 10% nano-ATO, and 5% DEPAL. A 1064 nm fiber laser (power 20 W, scanning speed 300 mm / s) is used to engrave a serpentine circuit on the surface of the heating layer with a line width of 0.3 mm to form a continuous conductive path. A 0.5 mm heat insulation layer was prepared using superhydrophobic silica aerogel with a density of 0.08 g / cm³. A 0.5mm heat dissipation layer was prepared using aluminum alloy that had undergone T6 aging treatment. The specific composition of the aluminum alloy was: Al: 98.28%, Mg: 0.8wt%, Si: 0.4wt%, Cu: 0.4wt%, Zr: 0.12wt%. The aluminum alloy heat dissipation substrate had holes with a diameter of 0.3mm and a density of 500 holes / cm³. 2 ; The heating layer, insulation layer, and heat dissipation layer are hot-pressed (120℃, 5MPa) to form a heatable cup holder with an overall thickness of about 2mm.

[0050] Example 5 First, 3mm long chopped carbon fiber filaments with an aspect ratio of 150:1 and nano-ATO and DEPAL with an average particle size of 15mm are dispersed in CNSL. A heating layer with a thickness of 0.8mm is then injection molded. The composition by mass percentage is 60% CNSL, 25% chopped carbon fiber filaments, 10% nano-ATO, and 5% DEPAL. A 1064nm fiber laser (power 20W, scanning speed 300mm / s) is used to engrave a serpentine circuit on the surface of the heating layer with a line width of 0.3mm to form a continuous conductive path. A 0.5 mm heat insulation layer was prepared using superhydrophobic silica aerogel with a density of 0.08 g / cm³. A 0.5mm heat dissipation layer is fabricated using aluminum alloy, with the following composition: Al: 98.28%, Mg: 0.8wt%, Si: 0.4wt%, Cu: 0.4wt%, Zr: 0.12wt%. The aluminum alloy heat dissipation substrate has holes with a diameter of 0.3mm and a density of 500 holes / cm³. 2 ; The heating layer, insulation layer, and heat dissipation layer are hot-pressed (120℃, 5MPa) to form a heatable cup holder with an overall thickness of about 2mm.

[0051] Example 6 First, 3mm long chopped carbon fiber filaments with an aspect ratio of 150:1 and nano-ATO and DEPAL with an average particle size of 15mm are dispersed in CNSL. A heating layer with a thickness of 0.8mm is then injection molded. The composition, by mass percentage, is 60% CNSL, 25% chopped carbon fiber filaments, 10% nano-ATO, and 5% DEPAL. A 0.5 mm heat insulation layer was prepared using superhydrophobic silica aerogel with a density of 0.08 g / cm³. A 0.5mm heat dissipation layer was prepared using aluminum alloy that had undergone T6 aging treatment. The specific composition of the aluminum alloy was: Al: 98.28%, Mg: 0.8wt%, Si: 0.4wt%, Cu: 0.4wt%, Zr: 0.12wt%. The aluminum alloy heat dissipation substrate had holes with a diameter of 0.3mm and a density of 500 holes / cm³. 2 ; The heating layer, insulation layer, and heat dissipation layer are hot-pressed (120℃, 5MPa) to form a heatable cup holder with an overall thickness of about 2mm.

[0052] Example 7 First, 3mm long chopped carbon fiber filaments with an aspect ratio of 150:1 and nano-ATO and DEPAL with an average particle size of 15mm are dispersed in CNSL. A heating layer with a thickness of 0.8mm is then injection molded. The composition by mass percentage is 60% CNSL, 25% chopped carbon fiber filaments, 10% nano-ATO, and 5% DEPAL. A 1064nm fiber laser (power 20W, scanning speed 300mm / s) is used to engrave a serpentine circuit on the surface of the heating layer with a line width of 0.3mm to form a continuous conductive path. A 0.5 mm heat insulation layer was prepared using superhydrophobic silica aerogel with a density of 0.08 g / cm³. A 0.5mm heat dissipation layer is fabricated using aluminum alloy, with the following composition: Al: 98.40%, Mg: 0.8wt%, Si: 0.4wt%, Cu: 0.4wt%. The aluminum alloy heat dissipation substrate has holes with a diameter of 0.3mm and a density of 500 holes / cm³. 2 ; The heating layer, insulation layer, and heat dissipation layer are hot-pressed (120℃, 5MPa) to form a heatable cup holder with an overall thickness of about 2mm.

[0053] Example 8 First, 3mm long chopped carbon fiber filaments with an aspect ratio of 150:1 and nano-ATO and DEPAL with an average particle size of 15mm are dispersed in CNSL. A heating layer with a thickness of 0.8mm is then injection molded. The composition by mass percentage is 60% CNSL, 25% chopped carbon fiber filaments, 10% nano-ATO, and 5% DEPAL. A 1064nm fiber laser (power 20W, scanning speed 300mm / s) is used to engrave a serpentine circuit on the surface of the heating layer with a line width of 0.3mm to form a continuous conductive path. A 0.5 mm heat insulation layer was prepared using superhydrophobic silica aerogel with a density of 0.08 g / cm³. A 0.5mm heat dissipation layer was prepared using aluminum alloy that had undergone T6 aging treatment. The specific composition of the aluminum alloy was: Al: 98.28%, Mg: 0.8wt%, Si: 0.4wt%, Cu: 0.4wt%, Zr: 0.12wt%. The heating layer, insulation layer, and heat dissipation layer are hot-pressed (120℃, 5MPa) to form a heatable cup holder with an overall thickness of about 2mm.

[0054] Example 9 First, 3mm long chopped carbon fiber filaments with an aspect ratio of 150:1 and nano-ATO and DEPAL with an average particle size of 50nm are dispersed in CNSL. A heating layer with a thickness of 0.8mm is then injection molded. By mass percentage, CNSL accounts for 60%, chopped carbon fiber filaments for 25%, nano-ATO for 10%, and DEPAL for 5%. A 1064nm fiber laser (power 20W, scanning speed 300mm / s) is used to engrave a serpentine circuit on the surface of the heating layer with a line width of 0.3mm to form a continuous conductive path. A 0.5 mm heat insulation layer was prepared using superhydrophobic silica aerogel with a density of 0.08 g / cm³. A 0.5mm heat dissipation layer was prepared using aluminum alloy that had undergone T6 aging treatment. The specific composition of the aluminum alloy was: Al: 98.28%, Mg: 0.8wt%, Si: 0.4wt%, Cu: 0.4wt%, Zr: 0.12wt%. The aluminum alloy heat dissipation substrate had holes with a diameter of 0.3mm and a density of 500 holes / cm³. 2 ; The heating layer, insulation layer, and heat dissipation layer are hot-pressed (120℃, 5MPa) to form a heatable cup holder with an overall thickness of about 2mm.

[0055] Comparative Example 1 First, 3mm long, carbon fiber short filaments with an aspect ratio of 150:1 and nano-ATO and DEPAL with an average particle size of 15mm are dispersed in bisphenol A epoxy resin. A heating layer with a thickness of 0.8mm is then injection molded. The composition by mass percentage is 60% bisphenol A epoxy resin, 25% carbon fiber short filaments, 10% nano-ATO, and 5% DEPAL. A 1064nm fiber laser (power 20W, scanning speed 300mm / s) is used to engrave a serpentine circuit on the surface of the heating layer with a line width of 0.3mm to form a continuous conductive path. A 0.5 mm heat insulation layer was prepared using superhydrophobic silica aerogel with a density of 0.08 g / cm³. A 0.5mm heat dissipation layer was prepared using aluminum alloy that had undergone T6 aging treatment. The specific composition of the aluminum alloy was: Al: 98.28%, Mg: 0.8wt%, Si: 0.4wt%, Cu: 0.4wt%, Zr: 0.12wt%. The aluminum alloy heat dissipation substrate had holes with a diameter of 0.3mm and a density of 500 holes / cm³. 2 ; The heating layer, insulation layer, and heat dissipation layer are hot-pressed (120℃, 5MPa) to form a sandwich structure with an overall thickness of about 2mm.

[0056] Comparative Example 2 First, copper fibers with an aspect ratio of 150:1 and a length of 3 mm, along with nano-ATO and DEPAL with an average particle size of 15 mm, are dispersed in CNSL. A heating layer with a thickness of 0.8 mm is then injection molded. By mass percentage, CNSL accounts for 60%, copper fibers for 25%, nano-ATO for 10%, and DEPAL for 5%. A 1064 nm fiber laser (power 20 W, scanning speed 300 mm / s) is used to engrave a serpentine circuit on the surface of the heating layer, with a line width of 0.3 mm, forming a continuous conductive path. A 0.5 mm heat insulation layer was prepared using superhydrophobic silica aerogel with a density of 0.08 g / cm³. A 0.5mm heat dissipation layer was prepared using aluminum alloy that had undergone T6 aging treatment. The specific composition of the aluminum alloy was: Al: 98.28%, Mg: 0.8wt%, Si: 0.4wt%, Cu: 0.4wt%, Zr: 0.12wt%. The aluminum alloy heat dissipation substrate had holes with a diameter of 0.3mm and a density of 500 holes / cm³. 2 ; The heating layer, insulation layer, and heat dissipation layer are hot-pressed (120℃, 5MPa) to form a heatable cup holder with an overall thickness of about 2mm.

[0057] Comparative Example 3 First, carbon fiber short filaments with an aspect ratio of 150:1 and a length of 3mm, DEPAL, and CNSL are dispersed in the heating layer. A heating layer with a thickness of 0.8mm is then injection molded. By mass percentage, CNSL accounts for 60%, carbon fiber short filaments for 35%, and DEPAL for 5%. A 1064nm fiber laser (power 20W, scanning speed 300mm / s) is used to engrave a serpentine circuit on the surface of the heating layer with a line width of 0.3mm to form a continuous conductive path. A 0.5 mm heat insulation layer was prepared using superhydrophobic silica aerogel with a density of 0.08 g / cm³. A 0.5mm heat dissipation layer was prepared using aluminum alloy that had undergone T6 aging treatment. The specific composition of the aluminum alloy was: Al: 98.28%, Mg: 0.8wt%, Si: 0.4wt%, Cu: 0.4wt%, Zr: 0.12wt%. The aluminum alloy heat dissipation substrate had holes with a diameter of 0.3mm and a density of 500 holes / cm³. 2 ; The heating layer, insulation layer, and heat dissipation layer are hot-pressed (120℃, 5MPa) to form a heatable cup holder with an overall thickness of about 2mm.

[0058] Comparative Example 4 First, nano-ATO and DEPAL with an average particle size of 15mm are dispersed in CNSL, and a heating layer with a thickness of 0.8mm is injection molded. The mass percentages are 60% CNSL, 35% nano-ATO, and 5% DEPAL. A serpentine circuit with a line width of 0.3mm is engraved on the surface of the heating layer using a 1064nm fiber laser (power 20W, scanning speed 300mm / s) to form a continuous conductive path. A 0.5 mm heat insulation layer was prepared using superhydrophobic silica aerogel with a density of 0.08 g / cm³. A 0.5mm heat dissipation layer was prepared using aluminum alloy that had undergone T6 aging treatment. The specific composition of the aluminum alloy was: Al: 98.28%, Mg: 0.8wt%, Si: 0.4wt%, Cu: 0.4wt%, Zr: 0.12wt%. The aluminum alloy heat dissipation substrate had holes with a diameter of 0.3mm and a density of 500 holes / cm³. 2 ; The heating layer, heat insulation layer, and heat dissipation layer are hot-pressed (120℃, 5MPa) to form a heated cup holder with an overall thickness of 1.5mm.

[0059] Comparative Example 5 First, 3mm long chopped carbon fiber filaments with an aspect ratio of 150:1 and nano-ATO and DEPAL with an average particle size of 15mm are dispersed in CNSL. A heating layer with a thickness of 0.8mm is then injection molded. The composition by mass percentage is 80% CNSL, 10% chopped carbon fiber filaments, 5% nano-ATO, and 5% DEPAL. A 1064nm fiber laser (power 20W, scanning speed 300mm / s) is used to engrave a serpentine circuit on the surface of the heating layer with a line width of 0.3mm to form a continuous conductive path. A 0.5 mm heat insulation layer was prepared using superhydrophobic silica aerogel with a density of 0.08 g / cm³. A 0.5mm heat dissipation layer was prepared using aluminum alloy that had undergone T6 aging treatment. The specific composition of the aluminum alloy was: Al: 98.28%, Mg: 0.8wt%, Si: 0.4wt%, Cu: 0.4wt%, Zr: 0.12wt%. The aluminum alloy heat dissipation substrate had holes with a diameter of 0.3mm and a density of 500 holes / cm³. 2 ; The heating layer, insulation layer, and heat dissipation layer are hot-pressed (120℃, 5MPa) to form a heatable cup holder with an overall thickness of about 2mm.

[0060] Comparative Example 6 First, 3mm long chopped carbon fiber filaments with an aspect ratio of 150:1 and nano-ATO and DEPAL with an average particle size of 15mm are dispersed in CNSL. A heating layer with a thickness of 0.8mm is then injection molded. The composition by mass percentage is 35% CNSL, 30% chopped carbon fiber filaments, 30% nano-ATO, and 5% DEPAL. A 1064nm fiber laser (power 20W, scanning speed 300mm / s) is used to engrave a serpentine circuit on the surface of the heating layer with a line width of 0.3mm to form a continuous conductive path. A 0.5 mm heat insulation layer was prepared using superhydrophobic silica aerogel with a density of 0.08 g / cm³. A 0.5mm heat dissipation layer was prepared using aluminum alloy that had undergone T6 aging treatment. The specific composition of the aluminum alloy was: Al: 98.28%, Mg: 0.8wt%, Si: 0.4wt%, Cu: 0.4wt%, Zr: 0.12wt%. The aluminum alloy heat dissipation substrate had holes with a diameter of 0.3mm and a density of 500 holes / cm³. 2 ; The heating layer, insulation layer, and heat dissipation layer are hot-pressed (120℃, 5MPa) to form a heatable cup holder with an overall thickness of about 2mm.

[0061] The performance of the heatable cup holders obtained in the above embodiments and comparative examples was tested. Specific data are shown in Table 2. (1) Weighing the heating layer: electronic balance.

[0062] (2) Test surface resistivity: Four-probe method (electrode spacing 1mm) to measure the surface resistance of the heating layer.

[0063] (3) Mechanical property testing: The reliability under the coupling effect of mechanical load and thermal stress is tested using a material testing machine, specifically the bending strain of the material.

[0064] (4) VOC emission detection: Gas chromatography-mass spectrometry (GC-MS) was used to collect gas samples for 4 hours in a 65°C sealed chamber.

[0065] (5) Thermal response time: The time required for the surface temperature to rise to 50°C under 5V power supply was recorded using an infrared thermal imager (FLIR A35).

[0066] (6) Energy consumption: Power is measured by a high-precision power meter (Keysight N6705C).

[0067] Table 2 Test data for the examples and comparative examples

[0068] As can be seen from the data in Table 2, the heating layer of this invention is prepared using cashew nutshell oil epoxy resin (CNSL) based conductive composite material. The CNSL-based conductive composite material is prepared by using 40-60% CNSL, 15-25% chopped carbon fiber filaments, 5-20% nano-tin antimony oxide, and 3-15% flame retardant, and can achieve a surface resistivity ≤10. 3 Ω·cm, enabling direct electric heating; compared to the traditional bisphenol A epoxy resin used to prepare the heating layer, the CNSL used in this invention can avoid the release of benzene compounds at high temperatures, resulting in VOC emissions ≤50μg / m³. 3 Compared with the traditional use of PCT ceramic as the heating layer, the present invention uses CNSL-based conductive composite material to prepare the heating layer, which can significantly reduce the mass of the heatable cup holder and reduce energy consumption.

[0069] It should be noted that, in this invention, relational terms such as "first" and "second" are used merely to distinguish one entity or operation from another, and do not necessarily require or imply any such actual relationship or order between these entities or operations. Furthermore, the terms "comprising," "including," or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such a process, method, article, or apparatus. Without further limitations, an element defined by the phrase "comprising one..." does not exclude the presence of other identical elements in the process, method, article, or apparatus that includes the element.

[0070] This invention is not limited to the embodiments described above. Those skilled in the art can make various improvements and refinements without departing from the principles of this invention, and these improvements and refinements are also considered within the scope of protection of this invention. Contents not described in detail in this specification are prior art known to those skilled in the art.

Claims

1. A heatable cup holder, characterized in that, From top to bottom, it includes a heating layer, a heat insulation layer, and a heat dissipation layer; the heating layer is made of cashew nut shell oil epoxy resin CNSL-based conductive composite material. By mass fraction, the CNSL-based conductive composite material comprises: 40-60% CNSL, 15-25% chopped carbon fiber filaments, 5-20% nano-tin antimony oxide, and 3-15% flame retardant.

2. The heatable cup holder as described in claim 1, characterized in that, The average particle size of the nano-tin antimony oxide is 15-25 nm.

3. The heatable cup holder as described in claim 1, characterized in that, The length of the chopped carbon fiber filaments is 1-5 mm.

4. The heatable cup holder as described in claim 1, characterized in that, The flame retardant is selected from one or more of aluminum diethylphosphonate, 9,10-dioxo-9-oxa-10-phosphaphenanthrene, and modified magnesium hydroxide.

5. The heatable cup holder as described in claim 1, characterized in that, Heating circuits are engraved on the surface of the CNSL-based conductive composite material layer.

6. The heatable cup holder as described in claim 1, characterized in that, The heat insulation layer is an aerogel heat insulation layer; the aerogel is a superhydrophobic silica aerogel.

7. The heatable cup holder as described in claim 1, characterized in that, The heat dissipation layer is an aluminum alloy heat dissipation substrate, and the aluminum alloy comprises the following elements by weight percentage: Al: 97.38-98.75%, Mg: 0.8-1.2wt%, Si: 0.4-0.8wt%, Cu: 0.15-0.4wt%, Zr: 0.10-0.12wt%.

8. The heatable cup holder as described in claim 1, characterized in that, The thickness of the heating layer is 0.7-0.9 mm.

9. The heatable cup holder as described in claim 1, characterized in that, The thickness of the insulation layer is 0.3-0.6 mm.

10. The heatable cup holder as described in claim 1, characterized in that, The thickness of the heat dissipation layer is 0.3-0.6 mm.

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