Material taking position dynamic allocation method and device, electronic equipment and storage medium

Abstract

The invention relates to the technical field of electronic manufacturing automation, in particular to a material taking position dynamic allocation method and device, electronic equipment and a storage medium, whether materials picked up by material taking equipment are in a mechanical reachable range or not is judged, if not, a state MAP graph is created according to the equipment specification, and an optimal material taking sequence is dynamically generated according to the graph; and material taking equipment is controlled to execute operation according to the optimal material taking sequence. According to the invention, the equipment utilization rate and the production efficiency of the SMT production line are improved.

Description

Technical Field

[0001] This application relates to the field of electronic manufacturing automation technology, and in particular to a method, apparatus, electronic device and storage medium for dynamic allocation of material picking positions. Background Technology

[0002] In actual SMT equipment production, when using tray feeders to supply components, the physical layout of the equipment limits the tray loading area to the far left or far right of the workbench. This mechanical structure leads to several technical drawbacks. Firstly, travel is limited. The X-axis travel of multi-nozzle placement heads is restricted by the mechanical structure. When the tray is placed at the edge of the equipment, the first and last nozzles of the nozzle array may exceed the motor's travel limit, failing to reach the material position at the tray edge and triggering a pick-up over-limit alarm. Secondly, there is a risk of production interruption. Existing fixed feeding strategies easily trigger pick-up over-limit alarms, causing equipment shutdown and requiring manual intervention. Thirdly, efficiency is lost. Traditional solutions often reduce placement head utilization by reserving safety gaps, resulting in a decrease in the number of placement cycles per unit time. Especially in high-density feeding scenarios, existing rigid pick-up allocation schemes are insufficient to meet the stringent requirements of modern SMT production lines for equipment uptime and production cycle time. Therefore, it is necessary to develop an intelligent pick-up system with real-time dynamic allocation and optimization capabilities. Summary of the Invention

[0003] To overcome the shortcomings of the prior art, the present invention provides a method, device, electronic device and storage medium for dynamic allocation of material picking position, which improves the equipment uptime and production efficiency of SMT production line.

[0004] A first aspect of this application provides a method for dynamically allocating material picking positions, the method comprising: Determine whether the material picked up by the current material handling equipment is within the mechanical reach range; When it is detected that the material picked up by the current material handling equipment is not within the mechanical reach range, a status MAP is created according to the equipment specifications of the material handling equipment; Based on the material status in the state MAP, the optimal material picking sequence is dynamically generated; The material picking device is controlled to perform material picking operations according to the optimal material picking sequence.

[0005] In an optional implementation, dynamically generating the optimal material taking sequence based on the material state in the state MAP diagram includes: The set of prohibited material collection points is determined based on the material status; Remove the disabled material picking points from the historical material picking sequence according to the set of disabled material picking points, so as to divide the historical material picking sequence into multiple non-disabled material picking path segments and obtain a new material picking path; Calculate the path cost increment for inserting an unassigned point into the new material picking path; The position corresponding to the minimum cost increment in the path cost increment is determined as the optimal insertion point of the unassigned point, and the optimal material picking sequence is generated.

[0006] In an optional implementation, calculating the path cost increment for inserting an unassigned point into the new material picking path includes: For each insertion point of the unassigned points, the path cost increment is determined by the following formula: ; in, C For the path cost increment, For the material handling equipment from the material level Move to material position distance, The material handling equipment k Number of switching times The material handling equipment k Total homework time , and These are weighting coefficients that are dynamically adjusted based on production needs.

[0007] In an optional implementation, determining whether the material picked up by the current material handling device is within mechanically reachable range includes: Obtain the material position coordinates of the material picked up by the current material handling device; Determine whether the material's location coordinates are within the mechanically accessible range, wherein the mechanically accessible range includes the minimum to maximum physical coordinate interval; When the material location coordinates are determined to be within the mechanical reach range, the material picking device is controlled to move to the reachable target point corresponding to the material location coordinates to perform a picking operation, and the reachable target point is marked as having been picked up.

[0008] In an optional implementation, creating a status MAP based on the equipment specifications of the material handling equipment includes: Read the specification programming file of the material handling device and extract the size information of the material handling device from the specification programming file; Based on the stated size information, and using the formula and Calculate the MAP canvas size; where The length of the MAP drawing canvas. The width of the MAP drawing canvas. Starting coordinates The row number in the size information. The number of columns for the size information. For horizontal spacing, L represents the longitudinal spacing, W represents the component length of the material, and L represents the component width of the material. A grid is constructed to dynamically generate a uniform matrix grid of the MAP drawing canvas, and a spatial index structure is established for each grid cell to generate the state MAP drawing.

[0009] In an optional implementation, the method further includes: When an operator is received to select a region of failed material in the status MAP, the coordinates of the selected region corresponding to the failed material region are determined. Based on the selected area coordinates, a command is sent to the material handling device to prohibit material handling operations in the area of ​​failed materials.

[0010] In an optional implementation, the method further includes: When a component malfunction command is received for the material, the material handling device is controlled to perform a material throwing operation; In the status MAP, the corresponding point of the abnormal component is marked as to be replenished, and the corresponding point of the abnormal component is inserted into the head of the task queue of the next production cycle. When a replenishment command is received, an image of the actual position of the replenishment element is obtained; The system determines whether the feeding element is abnormal based on the actual location image, and updates the status MAP based on the material status of the feeding element.

[0011] A second aspect of this application provides a dynamic material feeding position allocation device, the device comprising: The judgment module is used to determine whether the material picked up by the current material handling equipment is within the mechanical reach range; A creation module is used to create a status MAP diagram based on the equipment specifications of the material picking device when it is detected that the material picked up by the current material picking device is not within the mechanical reach range. The optimization module is used to dynamically generate the optimal material taking sequence based on the material status in the state MAP diagram; The control module is used to control the material picking device to perform material picking operations according to the optimal picking sequence.

[0012] A third aspect of this application provides an electronic device, including a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the steps of the dynamic allocation method for material picking position.

[0013] A fourth aspect of this application provides a computer-readable storage medium having a computer program stored thereon, wherein the computer program, when executed by a processor, implements the steps of the above-described dynamic allocation method for material picking positions.

[0014] In summary, the dynamic material handling location allocation method, apparatus, electronic device, and storage medium provided in this application have at least one of the following beneficial effects: 1. Determine whether the material being picked up by the current material handling equipment is within its mechanical reach. This step is a preliminary screening of the relationship between the material's location and the equipment's mechanical reach, and can quickly identify materials that may have travel limitations.

[0015] 2. Dynamically generate the optimal material picking sequence based on the material status in the status MAP. Dynamically generating the optimal material picking sequence means abandoning the existing fixed material feeding strategy and adjusting the picking order in real time according to the actual situation. This dynamic adjustment avoids material over-limit alarms caused by a fixed strategy. Furthermore, by dynamically generating the optimal material picking sequence, the picking path can be replanned, bypassing potentially problematic material locations or picking materials sequentially in a more rational manner. This reduces the possibility of equipment downtime requiring manual intervention, effectively addressing the risk of production interruptions.

[0016] 3. By dynamically generating the optimal material picking sequence, without considering safety spacing, the placement head can work efficiently within a reasonable stroke range to the maximum extent, improving the utilization rate of the placement head and thus increasing the number of placement cycles per unit time. This solves the efficiency loss problem and meets the stringent requirements of modern SMT production lines for equipment uptime and production cycle time. Attached Figure Description

[0017] Figure 1 This is a flowchart illustrating a method for dynamically allocating material picking positions according to an embodiment of this application; Figure 2 This is an example diagram of a state MAP diagram shown in an embodiment of this application; Figure 3 This is a functional block diagram of a material picking position dynamic allocation device shown in an embodiment of this application; Figure 4 This is a schematic diagram of the structure of an electronic device shown in an embodiment of this application. Detailed Implementation

[0018] The present invention will be further described below with reference to the accompanying drawings and embodiments.

[0019] The following will clearly and completely describe the concept, specific structure, and technical effects of the present invention in conjunction with embodiments and accompanying drawings, so as to fully understand the purpose, features, and effects of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, not all of them. Other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative effort are all within the scope of protection of the present invention. Furthermore, all connections / linkages involved in the patent do not simply refer to direct contact between components, but rather to the ability to form a better connection structure by adding or reducing connecting accessories according to specific implementation conditions. The various technical features in this invention can be combined interactively without contradicting each other.

[0020] Reference Figure 1 The diagram shown is a flowchart illustrating a dynamic material picking position allocation method according to an embodiment of this application. The dynamic material picking position allocation method includes the following steps.

[0021] S11, determine whether the material picked up by the current material handling equipment is within the mechanical reach range.

[0022] In some embodiments, when the component to be picked up is a thin, smooth, and densely packed chip component (such as a resistor, capacitor, QFP, or QFN), the component picking device can be a vacuum chuck / nozzle. This picking method relies on negative pressure adsorption and has the advantages of high speed and low pressure on the material surface. In other embodiments, when the material to be picked up is a component with a heat sink (such as a MOS or transistor) and is irregularly shaped, multi-pin, or has an uneven surface, the component picking device can be a mechanical gripper. Mechanical grippers can reliably hold objects that cannot be stably adsorbed by a chuck through precise force and angle control. To facilitate understanding of the inventive concept of the embodiments of this application, the following embodiments illustrate the use of a chuck as a picking device and a placement head as the material in the pick-and-place machine production process.

[0023] The mechanical reachable range (also known as the mechanical travel range) typically refers to a three-dimensional spatial area defined by the device's hardware parameters and the control system (located within the electronic device). Specifically, this involves obtaining the device's hardware parameters, including the minimum distance the suction cup's nozzle can currently move in the X direction. and maximum distance And the minimum distance that the suction cup nozzle can move in the Y direction. and maximum distance The data is then entered into the control system. Based on the device's hardware parameters, the control system automatically defines the mechanical reachability range of the nozzle, forming a three-dimensional spatial region model for subsequent target location reachability determination. Therefore, the mechanical travel range includes the current movable interval of the nozzle along the X-axis. and the current movable range of the suction nozzle on the Y-axis This refers to the limitation of the suction mouthpiece travel.

[0024] In some embodiments, at the beginning of each picking cycle, the electronic device first obtains the current placement head position that the nozzle needs to pick up via a sensor (e.g., an encoder) or host computer software, in order to calculate the material position coordinates. Next, the obtained material position coordinates are compared with the preset mechanical reachable range. Specifically, it is checked whether the X-coordinate is within the minimum to maximum physical coordinate range, and simultaneously verified whether the Y-coordinate is also within the minimum to maximum physical coordinate range. If the material position coordinates meet the nozzle stroke limit, that is... ,and If the target point is reached, the nozzle will be immediately moved to the reachable target point to perform the material picking operation, and the position will be marked as picked up. If the reachable target point is outside the mechanical travel range, the current point will be skipped automatically, and the subsequent points to be picked up will be traversed in sequence according to the global optimal picking sequence calculated by the host computer software, until the first reachable point is found and the nozzle is controlled to perform the picking operation.

[0025] The next reachable point is determined using the following formula: ; in, i This is the index of the currently unreachable material picking location. n This represents the total number of material collection points.

[0026] S12, when it is detected that the material picked up by the current material handling device is not within the mechanical reach range, a status MAP is created according to the equipment specifications of the material handling device.

[0027] When it is determined that the current material handling equipment cannot directly pick up the target material, further planning of the material handling path is required. In some embodiments, the control system can read the pallet programming file through a host computer and automatically extract the pallet specification parameters from the pallet programming file, including the number of rows, columns, starting coordinates, component sizes, and other information. Then, based on the extracted pallet dimensions, the MAP drawing canvas size is automatically calculated, and an R-tree spatial indexing algorithm is used to construct a grid, dynamically generating a uniform matrix grid corresponding to the MAP drawing canvas. An efficient spatial index structure is established for each grid cell, enabling rapid response and precise positioning when the operator clicks anywhere on the screen, thereby achieving the function of rapid area selection.

[0028] Specifically, the MAP canvas size is calculated using the following formula: ; ; in, The length of the MAP drawing canvas. The width of the MAP drawing canvas. Starting coordinates The row number in the size information. The number of columns for the size information. For horizontal spacing, L represents the longitudinal spacing, W represents the component length of the material, and W represents the component width of the material.

[0029] After the MAP map is constructed, it is automatically initialized by setting all elements to 0 and all grid points to gray to indicate that all materials on the pallet are ready to be picked up. During the material picking process, once the nozzle successfully picks up the material, the system immediately updates the matrix element value at the corresponding coordinate to 1 and updates the corresponding color block to white in the graphical interface to indicate that the material at that location has been picked up. This allows operators to monitor the picking progress in real time through the interface, ensuring transparency and traceability of the production process. (Refer to...) Figure 2 This is a binary status map of a 35-row × 14-column pallet. The status of the materials is represented in binary (0 indicates pending pickup, 1 indicates picked up), so that operators can intuitively observe the changes of 0 and 1 in the map in real time and understand the material picking progress and distribution.

[0030] In some embodiments, the control system may also provide a MAP export function, allowing operators to save the current or historical MAP to external storage; at the same time, it provides a historical status backtracking function, enabling operators to view the material picking status at any point in time during the material picking process.

[0031] S13, dynamically generate the optimal material taking sequence based on the material status in the state MAP diagram.

[0032] During production, operators can use the area selection tool to select material picking locations on the Map interface, thus reversing the status of the picking locations. Selection can be done by clicking on the picking location to modify its status, or by using Alt+drag to select multiple areas. Alternatively, operators can use the area selection tool to dynamically block non-target picking areas; the control system will then automatically trigger a dynamic path planning algorithm to re-optimize the paths for the remaining valid picking points and update the picking queue (also known as the picking sequence) in real time.

[0033] In an optional implementation, dynamically generating the optimal material taking sequence based on the material state in the state MAP diagram includes: The set of prohibited material collection points is determined based on the material status; Remove the disabled material picking points from the historical material picking sequence according to the set of disabled material picking points, so as to divide the historical material picking sequence into multiple non-disabled material picking path segments and obtain a new material picking path; Calculate the path cost increment for inserting an unassigned point into the new material picking path; The position corresponding to the minimum cost increment in the path cost increment is determined as the optimal insertion point of the unassigned point, and the optimal material picking sequence is generated.

[0034] The prohibited pick-up points can be selected by the operator or points already marked as "picked up". Before the next pick-up cycle, the control system first determines the set of prohibited pick-up points, treats the original globally optimal path as a historical pick-up sequence, and removes prohibited pick-up points from the historical pick-up sequence. After removal, the historical pick-up sequence is divided into multiple continuous, non-prohibited path segments, which are connected in their original order to form a new pick-up path p that does not contain prohibited points. For unassigned points r missing due to prohibition, the path cost increment brought by inserting them into each possible position in the new pick-up path p is calculated. Specifically, using a tabu search algorithm, two points are randomly selected in the new pick-up path p to swap positions, the path cost change is evaluated, and the position with the smallest cost increment is selected to insert the unassigned point r. The algorithm iterates from the initial path, and in each iteration, the feasible move with the smallest cost increment or the greatest path efficiency improvement is selected from the candidate solutions to update the current path. To avoid loops, the algorithm uses a taboo list to temporarily prohibit repetitive recent operations, and a pardon criterion to allow taboo moves that could lead to breakthrough improvements, ensuring the globality of the search. When the iteration termination condition is met (such as reaching the optimal solution or the iteration limit), the algorithm outputs the historical best path, which finds the shortest or optimal pick-up sequence for all remaining available pick-up points. The algorithm records the pick-up points assigned in the most recent optimization and adds manually modified component positions to the taboo list.

[0035] For each insertion point of each unassigned point r, the path cost increment C is calculated using the following formula: ; in, C For the path cost increment, For the material handling equipment from the material level Move to material position distance, The material handling equipment k Number of switching times The material handling equipment k Total homework time , and The weighting coefficients are dynamically adjusted according to production demand. .For example, , , .

[0036] In some embodiments, the control system can calculate the suction nozzle's position from the material level. Move to material position Euclidean distance as .

[0037] In some embodiments, when it is detected that the material handling device needs to execute the next material handling cycle, the material status in the state MAP is also obtained, and the set of prohibited material handling points is re-determined based on the material status in the state MAP. The original globally optimal path is regarded as a historical material handling sequence, and the prohibited material handling points in the historical material handling sequence are removed. After removal, the historical material handling sequence is divided into multiple continuous, non-prohibited path segments. These segments are connected in their original order to form a new material handling path p that does not contain prohibited points. For unassigned points r that are missing due to prohibition, the path cost increment caused by inserting them into each possible position in the new material handling path p is calculated. By evaluating the path cost change, the position with the smallest cost increment is selected to insert the unassigned point r, thus obtaining the optimal material handling sequence for this material handling cycle.

[0038] S14, control the material picking device to perform material picking operation according to the optimal material picking sequence.

[0039] After generating the optimal material picking sequence, the system needs to convert this sequence into specific control commands and send them to the picking equipment. This allows the equipment to perform material picking operations according to the optimal order and path, completing the production task. Specifically, the robotic arm of the picking equipment can automatically control the nozzle to find the appropriate picking point on the tray for rapid placement. Real-time material picking position detection ensures that the current nozzle can find a suitable picking position in each cycle, avoiding over-limit alarms.

[0040] In an optional implementation, the method further includes: When an operator is received to select a region of failed material in the status MAP, the coordinates of the selected region corresponding to the failed material region are determined. Based on the selected area coordinates, a command is sent to the material handling device to prohibit material handling operations in the area of ​​failed materials.

[0041] In some embodiments, during the SMT placement machine production process, situations often arise where the tray is not full or some materials in a tray are of substandard quality. Operators can view the material map in real time through a graphical interface. When, based on experience and visual inspection or the placement results of the previous board, a specific area of ​​material is found to have quality problems (such as damage, oxidation, incorrect polarity) or has been exhausted, the operator can select a designated area in the status map as the failed material area through the graphical interface and determine its corresponding coordinates. Then, the failed material area and its corresponding selected area coordinates are synchronously updated to the equipment control center and the material database. Simultaneously, a command to prohibit material handling is sent to the picking device, i.e., the suction cup, such as a material exhaustion command, prohibiting the nozzle from picking materials in the failed material area.

[0042] Furthermore, following the same implementation method as step S13 above, a candidate path set is generated using a tabu search algorithm. The efficiency of each path is evaluated, and the optimal solution is selected to refresh the material picking path in real time, ensuring that the equipment executes the picking action in the optimized order. This intelligent dynamic adjustment mechanism not only achieves efficient material scheduling and accurate placement.

[0043] In an optional implementation, the method further includes: When a component malfunction command is received for the material, the material handling device is controlled to perform a material throwing operation; In the status MAP, the corresponding point of the abnormal component is marked as to be replenished, and the corresponding point of the abnormal component is inserted into the head of the task queue of the next production cycle. When a replenishment command is received, an image of the actual position of the replenishment element is obtained; The system determines whether the feeding element is abnormal based on the actual location image, and updates the status MAP based on the material status of the feeding element.

[0044] A vision inspection system (such as a Mark camera, paired with image processing software) is installed above the production line. The Mark camera detects abnormalities in material components, such as cracks, missing corners, breakage, severe oxidation of leads, bending, or components standing upright. The Mark camera sends the corresponding abnormality command to the control system, which then instructs the material handling equipment to perform a discard operation and automatically triggers a compensation mechanism. In the next production cycle, the material handling equipment precisely replenishes the placement points that were not completed in the previous cycle, ensuring production continuity and placement integrity. Specifically, while performing the discard operation, the control system accurately locates the placement point corresponding to the abnormal component in the status MAP and marks this point as "pending replenishment." After marking, the control system inserts this "pending replenishment" point information at the head of the task queue for the next production cycle. The task queue is a list of pending placement tasks arranged in a certain order; inserting it at the head ensures that the equipment prioritizes processing this replenishment task at the start of the next production cycle. For example, if there are 10 placement points in the task queue, the "pending replenishment" point is now inserted at the front of the queue, becoming the first task to be executed. Upon entering the next production cycle, the equipment begins refilling tasks according to the task queue order. The nozzle picks up a new qualified component from the material tray and moves it above the placement position to be replenished. After the replenishment is completed, the control system immediately calls the head camera (Mark camera) mounted on the pick-and-place machine to quickly photograph the component at the placement position, capturing the component's actual position image. When the captured image is obtained, the control system uses an edge detection algorithm (such as the Canny edge detection algorithm) to process the image and accurately identify the component's edge contour. The identified component edge contour is compared with a standard component template pre-stored in the system to further determine the overall shape of the component. Then, the center coordinates of the component, i.e., the actual placement coordinates, are accurately calculated using a center moment calculation method. Simultaneously, the system obtains the theoretical target coordinates of the component from the design file. The deviation between the actual placement coordinates and the theoretical target coordinates is calculated. If the calculated placement accuracy is within the tolerance range set in the program (for example, if the tolerance range is set to ±0.05mm and the calculated deviation is ±0.03mm), the placement at that point is considered successful. If the deviation exceeds the allowable tolerance range (e.g., a deviation of ±0.08mm), it is considered a placement defect, and a new component exception command is generated. Simultaneously, the control system still marks the point as "pending replenishment" in the status MAP and records the placement defect information (such as deviation value, defect type, etc.). At the same time, the replenishment task is re-inserted into a suitable position in the task queue (this can be set according to actual conditions, such as prioritizing insertion at the beginning), so that replenishment operations can be performed again later until placement is successful.

[0045] If the mounting is determined to be successful, the control system will update the status of that point in the status MAP to "mounted" and simultaneously update the status of that task in the task queue to "completed".

[0046] Through the above optional implementation methods, with the help of visual inspection and intelligent control, the production line discards components upon receiving abnormal component commands, marks the locations awaiting replenishment, and prioritizes their handling. After replenishment, accurate judgment is made, and the status and task queue are updated based on the results, ensuring continuous and complete production and improving placement accuracy and efficiency.

[0047] This application can be applied to the field of automated precision placement, especially the multi-nozzle pick-and-place system of SMT pick-and-place machines, particularly for the pick-and-place of multi-nozzle placement heads during the placement of high-density integrated circuit boards.

[0048] Reference Figure 3 The diagram shown is a functional block diagram of the material picking position dynamic allocation device according to an embodiment of this application.

[0049] In some embodiments, the dynamic material handling position allocation device 30 may include multiple functional modules composed of computer program segments. The computer programs for each program segment of the dynamic material handling position allocation device 30 may be stored in the memory of an electronic device and executed by at least one processor to perform (see details). Figure 1 (Description) The function of dynamically allocating material picking positions. Based on its function, it can be divided into multiple functional modules. These functional modules may include: a judgment module 301, a creation module 302, an optimization module 303, and a control module 304. The module referred to in this application is a series of computer program segments that can be executed by at least one processor and perform a fixed function, stored in memory. In this embodiment, the functions of each module will be detailed in subsequent embodiments.

[0050] The judgment module 301 is used to determine whether the material picked up by the current material handling equipment is within the mechanically reachable range.

[0051] The creation module 302 is used to create a status MAP diagram based on the equipment specifications of the material picking device when it is detected that the material picked up by the current material picking device is not within the mechanical reach range.

[0052] The optimization module 303 is used to dynamically generate the optimal material taking sequence based on the material status in the state MAP diagram.

[0053] The control module 304 is used to control the material picking device to perform material picking operations according to the optimal material picking sequence.

[0054] The optimization module 303 is further specifically configured to: determine a set of disabled material collection points based on the material status; remove disabled material collection points from the historical material collection sequence based on the set of disabled material collection points, so as to divide the historical material collection sequence into multiple non-disabled material collection path segments to obtain a new material collection path; calculate the path cost increment for inserting an unassigned point into the new material collection path; determine the position corresponding to the minimum cost increment among the path cost increments as the optimal insertion point of the unassigned point, and generate the optimal material collection sequence.

[0055] The judgment module 301 is further specifically used for: obtaining the material position coordinates of the material picked up by the current picking device; determining whether the material position coordinates are within the mechanical reachable range, wherein the mechanical reachable range includes the minimum to maximum physical coordinate interval; when it is determined that the material position coordinates are within the mechanical reachable range, controlling the picking device to move to the reachable target point corresponding to the material position coordinates to perform the picking operation, and marking the reachable target point as picked up.

[0056] The creation module 302 is further specifically configured to: read the specification programming file of the material handling equipment, and extract the size information of the material handling equipment from the specification programming file; and, based on the size information, formulate... and Calculate the MAP canvas size; where The length of the MAP drawing canvas. The width of the MAP drawing canvas. Starting coordinates The row number in the size information. The number of columns for the size information. For horizontal spacing, L is the vertical spacing, W is the element length of the material, and W is the element width of the material. A grid is constructed to dynamically generate a uniform matrix grid of the MAP drawing canvas, and a spatial index structure is established for each grid cell to generate the state MAP drawing.

[0057] The control module 304 is further configured to: when receiving an operator's instruction to select a failed material area in the status MAP, determine the coordinates of the selected area corresponding to the failed material area; and send an instruction to the material handling device to prohibit material handling in the failed material area based on the selected area coordinates.

[0058] The control module 304 is further configured to: when receiving a component abnormality instruction for materials, control the material handling device to perform a material throwing operation; mark the corresponding point of the abnormal component in the status MAP as to be replenished, and insert the corresponding point of the abnormal component into the head of the task queue of the next production cycle; when receiving a replenishment instruction, acquire an image of the actual position of the replenishment component; determine whether the replenishment component is abnormal based on the actual position image, and update the status MAP according to the material status of the replenishment component.

[0059] It should be understood that the various variations and specific embodiments of the material picking position dynamic allocation method provided in the above embodiments are also applicable to the material picking position dynamic allocation device of this embodiment. Through the foregoing detailed description of the material picking position dynamic allocation method, those skilled in the art can clearly understand the implementation method of the material picking position dynamic allocation device in this embodiment. For the sake of brevity, it will not be described in detail here.

[0060] See Figure 4 The diagram shown is a schematic representation of the structure of an electronic device according to an embodiment of this application. In a preferred embodiment of this application, the electronic device 4 includes a memory 41, at least one processor 42, and at least one communication bus 43.

[0061] Those skilled in the art should understand that Figure 4 The structure of the electronic device shown does not constitute a limitation of the embodiments of this application. It can be a bus structure or a star structure. The electronic device 4 may also include more or fewer other hardware or software than shown, or different component arrangements.

[0062] In some embodiments, the electronic device 4 is a device capable of automatically performing numerical calculations and / or information processing according to pre-set or stored instructions. Its hardware includes, but is not limited to, microprocessors, application-specific integrated circuits (ASICs), programmable gate arrays (FPGAs), digital processors, and embedded devices. The electronic device 4 may also include user equipment, which includes, but is not limited to, any electronic product capable of human-computer interaction with a user via a keyboard, mouse, remote control, touchpad, or voice control device, such as a personal computer, tablet computer, smartphone, or digital camera.

[0063] In the embodiments provided in this application, it should be understood that the disclosed methods, apparatuses, computer-readable storage media, and electronic devices can be implemented in other ways. For example, the apparatus embodiments described above are merely illustrative. For instance, the division of modules is only a logical functional division, and in actual implementation, there may be other division methods. For example, multiple components or modules may be combined or integrated into another device, or some features may be ignored or not executed. Furthermore, the coupling or direct coupling or communication connection shown or discussed may be through some interfaces; the indirect coupling or communication connection between devices, components, or modules may be electrical, mechanical, or other forms.

[0064] The components described as separate parts may or may not be physically separate. The components shown as components may or may not be physical modules; that is, they may be located in one place or distributed across multiple network modules. Some or all of the components can be selected to achieve the purpose of this embodiment according to actual needs.

[0065] Furthermore, the functional modules in the various embodiments of the present invention can be integrated into one processing module, or each component can exist physically separately, or two or more modules can be integrated into one module. The integrated modules described above can be implemented in hardware or as software functional modules.

[0066] If the integrated module is implemented as a software functional module and sold or used as an independent product, it can be stored in a computer-readable storage medium. Based on this understanding, the technical solution of the present invention, in essence, or the part that contributes to the prior art, or all or part of the technical solution, can be embodied in the form of a software product. This computer software product is stored in a storage medium and includes several instructions to cause a computer device (which may be a personal computer, server, or network device, etc.) to execute all or part of the steps of the methods described in the various embodiments of the present invention. The aforementioned storage medium includes various media capable of storing program code, such as USB flash drives, portable hard drives, read-only memory (ROM), random access memory (RAM), magnetic disks, or optical disks.

[0067] It should be noted that, for the sake of simplicity, the foregoing method embodiments are all described as a series of actions. However, those skilled in the art should understand that the present invention is not limited to the described order of actions, because according to the present invention, some steps can be performed in other orders or simultaneously. Furthermore, those skilled in the art should also understand that the embodiments described in the specification are preferred embodiments, and the actions and modules involved are not necessarily essential to the present invention.

[0068] In the above embodiments, the descriptions of each embodiment have different focuses. For parts not described in detail in a certain embodiment, please refer to the relevant descriptions of other embodiments.

[0069] The above is a detailed description of the preferred embodiments of the present invention. However, the present invention is not limited to the embodiments described. Those skilled in the art can make various equivalent modifications or substitutions without departing from the spirit of the present invention. All such equivalent modifications or substitutions are included within the scope defined by the claims of this application.

Claims

1. A method for dynamically allocating material picking positions, characterized in that, The method includes: Determine whether the material picked up by the current material handling equipment is within the mechanical reach range; When it is detected that the material picked up by the current material handling equipment is not within the mechanical reach range, a status MAP is created according to the equipment specifications of the material handling equipment; Based on the material status in the state MAP, the optimal material picking sequence is dynamically generated; The material picking device is controlled to perform material picking operations according to the optimal material picking sequence.

2. The method for dynamically allocating material picking positions according to claim 1, characterized in that, The step of dynamically generating the optimal material taking sequence based on the material state in the state MAP diagram includes: The set of prohibited material collection points is determined based on the material status; Remove the disabled material picking points from the historical material picking sequence according to the set of disabled material picking points, so as to divide the historical material picking sequence into multiple non-disabled material picking path segments and obtain a new material picking path; Calculate the path cost increment for inserting an unassigned point into the new material picking path; The position corresponding to the minimum cost increment in the path cost increment is determined as the optimal insertion point of the unassigned point, and the optimal material picking sequence is generated.

3. The method for dynamically allocating material picking positions according to claim 2, characterized in that, The path cost increment for inserting an unassigned point into the new material picking path includes: For each insertion point of the unassigned points, the path cost increment is determined by the following formula: ； in, C For the path cost increment, For the material handling equipment from the material level Move to material position distance, The material handling equipment k Number of switching times The material handling equipment k Total homework time , and These are weighting coefficients that are dynamically adjusted based on production needs.

4. The method for dynamically allocating material picking positions according to claim 1, characterized in that, The determination of whether the material picked up by the current material handling equipment is within the mechanically reachable range includes: Obtain the material position coordinates of the material picked up by the current material handling device; Determine whether the material's location coordinates are within the mechanically accessible range, wherein the mechanically accessible range includes the minimum to maximum physical coordinate interval; When the material location coordinates are determined to be within the mechanical reach range, the material picking device is controlled to move to the reachable target point corresponding to the material location coordinates to perform a picking operation, and the reachable target point is marked as having been picked up.

5. The method for dynamically allocating material picking positions according to claim 1, characterized in that, The process of creating a status MAP based on the equipment specifications of the material handling equipment includes: Read the specification programming file of the material handling device and extract the size information of the material handling device from the specification programming file; Based on the stated size information, and using the formula and Calculate the MAP canvas size; where The length of the MAP drawing canvas is given by [the given canvas length], and the total dimension is given along the X-axis. The width of the MAP drawing canvas is the total dimension along the Y-axis. The starting coordinates are [starting coordinates], and the dimensions are [dimensions]. The number of lines in the information The number of columns for the size information. For horizontal spacing, L represents the longitudinal spacing, W represents the component length of the material, and L represents the component width of the material. A grid is constructed to dynamically generate a uniform matrix grid of the MAP drawing canvas, and a spatial index structure is established for each grid cell to generate the state MAP drawing.

6. The method for dynamically allocating material picking positions according to any one of claims 1 to 5, characterized in that, The method further includes: When an operator is received to select a region of failed material in the status MAP, the coordinates of the selected region corresponding to the failed material region are determined. Based on the selected area coordinates, a command is sent to the material handling device to prohibit material handling operations in the area of ​​failed materials.

7. The method for dynamically allocating material picking positions according to any one of claims 1 to 5, characterized in that, The method further includes: When a component malfunction command is received for the material, the material handling device is controlled to perform a material throwing operation; In the status MAP, the corresponding point of the abnormal component is marked as to be replenished, and the corresponding point of the abnormal component is inserted into the head of the task queue of the next production cycle. When a replenishment command is received, an image of the actual position of the replenishment element is obtained; The system determines whether the feeding element is abnormal based on the actual location image, and updates the status MAP based on the material status of the feeding element.

8. A dynamic material feeding position allocation device, characterized in that, The device includes: The judgment module is used to determine whether the material picked up by the current material handling equipment is within the mechanical reach range; A creation module is used to create a status MAP diagram based on the equipment specifications of the material picking device when it is detected that the material picked up by the current material picking device is not within the mechanical reach range. The optimization module is used to dynamically generate the optimal material taking sequence based on the material status in the state MAP diagram; The control module is used to control the material picking device to perform material picking operations according to the optimal picking sequence.

9. An electronic device, characterized in that, It includes a memory, a processor, and a computer program stored in the memory and executable on the processor, wherein the processor executes the computer program to implement the steps of the material handling position dynamic allocation method according to any one of claims 1 to 7.

10. A computer-readable storage medium having a computer program stored thereon, characterized in that, When the computer program is executed by the processor, it implements the steps of the dynamic allocation method for material picking position as described in any one of claims 1 to 7.

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