SMT surface solder paste mounting machine

Abstract

The invention discloses an SMT surface solder paste placement machine, and belongs to the technical field of circuit board processing equipment.The SMT surface solder paste placement machine comprises a mounting frame and a solder paste printing mechanism which are slidably mounted on a workbench, and the solder paste printing mechanism comprises a net scraping assembly, two fixing frames, two sets of blowing assemblies, a ventilation pipe, a driven piece, a driving piece, a gas conveying assembly and an adjusting assembly. During printing, air is supplied to a ventilation pipe through an air conveying assembly, the air enters a second hollow plate through a hose and a fixing pipe, pulse airflow is formed to impact shifting plates on the two sides of a scraper through periodic alignment and staggering of a second through groove and a second air nozzle of a fixing frame, and the scraper is driven to vibrate in cooperation with elastic restoring force of a plate spring; vibration energy of the scraper can directly act on the solder paste, so that molecular cohesion in the solder paste is broken to reduce viscosity, meanwhile, agglomerated particles of the solder paste are scattered by mechanical impact force, and the particles are prevented from blocking tiny meshes of the steel mesh.

Description

Technical Field

[0001] This invention belongs to the technical field of circuit board processing equipment, and particularly relates to an SMT surface solder paste mounting machine. Background Technology

[0002] As a core process in the electronics manufacturing industry, surface mount technology (SMT) has become a key technology system supporting the assembly of microelectronic components with dimensions of 01005 and below, driven by the continuous upgrading of demands for miniaturization, high density, and high reliability in industries such as consumer electronics and new energy vehicle electronics. SMT surface mount machines, as the core equipment connecting solder paste printing and component placement, directly determine the soldering yield and production cycle of finished electronic products based on their solder paste printing accuracy and stencil maintenance efficiency. Currently, the lead pitch of electronic components has been reduced from 0.3mm to below 0.15mm, and the stencil mesh diameter has decreased to 0.1mm or even smaller, placing stringent requirements on the solder paste filling capability and printing consistency of the mounting machine.

[0003] While existing SMT surface mount solder paste machines have achieved basic automation functions such as automatic substrate feeding, servo adjustment of squeegee position, and automatic solder paste feeding, they still have the following shortcomings:

[0004] First, the filling of fine-mesh solder paste relies on increasing the pressure of the squeegee, which can easily lead to wear of the stencil mesh and deformation of the substrate. It also cannot disperse the agglomerated particles of high-viscosity solder paste, resulting in a high rate of clogging.

[0005] Secondly, the cleaning efficiency of steel mesh is low. Manual cleaning requires downtime of more than 30 minutes and is prone to damaging the steel mesh. Independent mechanical cleaning components require an additional power source, increasing the size and cost of the equipment. Summary of the Invention

[0006] The purpose of this invention is to provide an SMT surface solder paste mounting machine to solve the technical problems in the prior art where filling fine-mesh solder paste relies on increasing the squeegee pressure, which easily leads to stencil mesh wear, substrate deformation, and inability to disperse high-viscosity solder paste agglomerates, resulting in a high clogging rate.

[0007] To achieve the above objectives, the present invention adopts the following technical solution:

[0008] An SMT surface mount solder paste machine includes a mounting frame and a solder paste printing mechanism mounted on a workbench. Multiple carrier plates are mounted on the mounting frame. The solder paste printing mechanism includes: a squeegee assembly comprising a second mounting plate and a blade holder; the second mounting plate is connected to the blade holder via multiple leaf springs; a squeegee is mounted on the blade holder, and a lever plate is mounted on both sides of the squeegee; two mounting brackets, both mounted on the bottom surface of the second mounting plate, each mounting bracket having multiple second through slots equidistantly spaced; and two sets of blowing assemblies, each blowing assembly including a fixed tube, the upper part of the fixed tube... A second hollow plate and a first hollow plate are respectively installed at the upper and lower ends. Multiple second air nozzles and first air nozzles are respectively installed on the opposite sides of the second and first hollow plates. The second air nozzles are located directly below the actuating plate and slide in contact with the fixing frame. A vent pipe is connected to the fixing pipe through a flexible hose. A driven member is fixedly connected to the first hollow plate. A driving member is used to drive the driven member to reciprocate horizontally using the airflow in the vent pipe. An adjusting assembly is used to drive the second mounting plate to move horizontally and vertically. An air supply assembly is used to supply air into the two vent pipes.

[0009] Preferably, the adjustment assembly includes: two hydraulic cylinders, both mounted on the top surface of the worktable; two mounting seats, respectively fixedly connected to the extension ends of the two hydraulic cylinders, with a second motor mounted on each mounting seat; a second lead screw, rotatably connected to the two mounting seats, one end of which is fixedly connected to the power output shaft of the second motor, with a second lead screw nut mounted on it, a second fixing plate mounted on the second lead screw nut, and the second fixing plate fixedly connected to the second mounting plate; and two sliding rods, fixedly connected to the two mounting seats.

[0010] Preferably, the gas delivery assembly includes: a gas storage tank, installed on the top surface of the second mounting plate, and fixedly connected to and communicating with the two vent pipes; and a gas pump, installed on the top surface of the second mounting plate, for delivering gas into the gas storage tank.

[0011] Preferably, the driving component includes: a vertical rod that passes through the bottom surface of the vent pipe and is rotatably connected to the vent pipe; a fan blade located inside the vent pipe and fixedly connected to the vertical rod; and a half gear installed at the lower end of the vertical rod.

[0012] Preferably, the driven member includes: a connecting frame with a plurality of teeth matching the half gear installed on its inner wall; and two connecting plates, both fixedly connected to the connecting frame and both fixedly connected to the first hollow plate.

[0013] Preferably, a set of PCB board brackets and a set of steel mesh brackets are installed on the top surface of the carrier plate.

[0014] Preferably, the solder paste printing mechanism further includes: a recycling box, installed on the top surface of the workbench, the recycling box having a groove for supporting the stencil; and an adsorption assembly connected to the second lead screw.

[0015] Preferably, the adsorption assembly includes: a first fixing plate on which a third lead screw nut is mounted, the third lead screw nut being sleeved on the second lead screw; a first mounting plate fixedly connected to the first fixing plate; and a plurality of electric push rods, all mounted on the bottom surface of the first mounting plate, the extension ends of the electric push rods being equipped with electric suction cups.

[0016] Preferably, the system further includes a moving mechanism, which comprises: two slide rails, both mounted on the top surface of the worktable; multiple sliders, each slidably connected to the two slide rails, with their tops fixedly connected to the mounting frame; two mounting blocks, each fixedly connected to the two slide rails; two bearing seats, each mounted on the top surface of the two mounting blocks; a first lead screw, rotatably connected to the two bearing seats, with a first lead screw nut mounted on it; a first motor, mounted on the bottom surface of the mounting blocks, and connected to the first lead screw via a transmission belt; and a moving seat, fixedly connected to the first lead screw nut and fixedly connected to the mounting frame.

[0017] Preferably, it further includes: a protective shell, installed on the top surface of the workbench; and a patching mechanism, installed on the top surface of the workbench and located inside the protective shell.

[0018] In summary, due to the adoption of the above technical solution, the beneficial effects of the present invention are:

[0019] 1. The solder paste printing mechanism of the present invention is provided with a squeegee assembly, two fixed frames, two sets of blowing assemblies, a vent pipe, a driven component, a driving component, an air supply assembly, and an adjustment assembly. During printing, air is supplied to the vent pipe through the air supply assembly. The gas enters the second hollow plate through the hose and the fixed pipe. The periodic alignment and misalignment of the second through slot of the fixed frame and the second air nozzle form a pulse airflow that impacts the actuating plates on both sides of the squeegee. The elastic restoring force of the leaf spring drives the squeegee to vibrate. The vibration energy of the squeegee can directly act on the solder paste, thereby breaking the molecular cohesion of the solder paste to reduce viscosity. At the same time, the mechanical impact force can also disperse the solder paste agglomerates and prevent the particles from clogging the tiny mesh of the stencil.

[0020] 2. The solder paste printing mechanism of the present invention, by setting a driven member and a driving member, when in use, the airflow in the vent pipe drives the fan blade to rotate, which is transmitted to the half gear through the vertical rod. The half gear intermittently meshes with the teeth on both sides of the driven member, thereby driving the connecting frame and the connecting plate to move the first hollow plate and the second hollow plate back and forth horizontally along the scraper, so that the pulse airflow of the second air nozzle acts on the scraper, avoiding insufficient vibration intensity; and increasing the air blowing coverage of the first air nozzle to avoid cleaning dead corners.

[0021] 3. The gas delivery component in this invention, by setting up a gas storage tank and a gas pump, can deliver gas during use, which can not only achieve scraper vibration, break the cohesion of solder paste and reduce the viscosity of solder paste, but also achieve cleaning of stencil. This design does not require an additional power source, simplifies the structure, and at the same time improves printing yield and stencil reuse rate, and reduces consumable costs and maintenance time. Attached Figure Description

[0022] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the drawings used in the description of the embodiments or the prior art will be briefly introduced below. Obviously, the drawings described below are only some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0023] Figure 1 This is a perspective view of the SMT surface solder paste mounting machine in this invention;

[0024] Figure 2 This is a schematic diagram of the assembly structure of the workbench, mounting frame, moving mechanism, solder paste printing mechanism and chip placement mechanism in this invention;

[0025] Figure 3 This is a schematic diagram of the assembly structure of the workbench, mounting frame, moving mechanism, and solder paste printing mechanism in this invention.

[0026] Figure 4 This is a schematic diagram of the assembly structure of the worktable, the moving mechanism, and the solder paste printing mechanism in this invention.

[0027] Figure 5 In this invention Figure 4 Enlarged schematic diagram of part A;

[0028] Figure 6 This is a perspective view of the solder paste printing mechanism in this invention;

[0029] Figure 7 This is a schematic diagram of the assembly structure of the scraper assembly and the fixing frame in this invention;

[0030] Figure 8 This is a schematic diagram of the assembly structure of the scraping mesh assembly, the fixing frame, and the blowing assembly in this invention;

[0031] Figure 9 This is a right view of the second mounting plate, leaf spring, blade holder, and scraper in this invention;

[0032] Figure 10 This is a perspective view of the second mounting plate, leaf spring, blade holder, and scraper in this invention;

[0033] Figure 11This is a schematic diagram of the assembly structure of the scraper, the fixing frame, and the blowing assembly in this invention;

[0034] Figure 12 In this invention Figure 11 Enlarged schematic diagram of part B;

[0035] Figure 13 This is a schematic diagram of the assembly structure of the scraper and the drive component in this invention;

[0036] Reference numerals: 100, workbench; 101, protective shell; 201, mounting frame; 202, carrier plate; 203, PCB board bracket; 204, stencil bracket; 300, moving mechanism; 301, slide rail; 302, slider; 303, mounting block; 304, bearing seat; 305, first lead screw; 306, first motor; 307, transmission belt; 308, moving seat; 309, first lead screw nut; 400, solder paste printing mechanism; 401, hydraulic cylinder; 402, mounting seat; 403, second motor; 404, second lead screw; 405, slide bar; 406, recycling box; 410, adsorption assembly; 411, first fixing plate; 412, third lead screw nut; 413, first mounting plate; 414, electric push rod; 415, electric suction cup; 420, scraper assembly; 4 21. Second fixed plate; 422. Second lead screw nut; 423. Second mounting plate; 424. Leaf spring; 425. Tool holder; 426. Scraper; 4261. Guide plate; 4262. Actuating plate; 431. Air tank; 432. Air pump; 433. Fixing frame; 434. Second through slot; 440. Blowing assembly; 441. Air pipe; 442. Hose; 443. Fixing pipe; 4431. First solenoid valve; 4432. Second solenoid valve; 444. First hollow plate; 445. Second hollow plate; 446. First air nozzle; 447. Second air nozzle; 448. Driving component; 4481. Vertical rod; 4482. Fan blade; 4483. Half gear; 449. Follower; 4491. Connecting frame; 4492. Tooth; 4493. Connecting plate; 500. Patch mechanism. Detailed Implementation

[0037] To make the above-mentioned objects, features, and advantages of the present invention more apparent and understandable, specific embodiments of the present invention will be described in detail below with reference to the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present invention, and not all of them. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort should fall within the protection scope of the present invention.

[0038] Many specific details are set forth in the following description in order to provide a full understanding of the invention. However, the invention may also be practiced in other ways different from those described herein, and those skilled in the art can make similar extensions without departing from the spirit of the invention. Therefore, the invention is not limited to the specific embodiments disclosed below.

[0039] Secondly, the term "one embodiment" or "embodiment" as used herein refers to a specific feature, structure, or characteristic that may be included in at least one implementation of the present invention. The phrase "in one embodiment" appearing in different places in this specification does not necessarily refer to the same embodiment, nor is it a single or selective embodiment that is mutually exclusive with other embodiments.

[0040] This invention is described in detail with reference to the accompanying drawings. When detailing the embodiments of this invention, for ease of explanation, the cross-sectional views illustrating the device structure may be partially enlarged, not to scale. Furthermore, the accompanying drawings are merely examples and should not be construed as limiting the scope of protection of this invention. In actual fabrication, the three-dimensional spatial dimensions of length, width, and depth should be included.

[0041] Furthermore, it should be noted in the description of this invention that the terms "first," "second," or "third" are used for descriptive purposes only and should not be construed as indicating or implying relative importance.

[0042] Unless otherwise explicitly specified and limited, the terms "installation," "connection," and "joining" in this invention should be interpreted broadly. For example, they can refer to fixed connections, detachable connections, or integral connections; similarly, they can refer to mechanical connections, electrical connections, or direct connections, or indirect connections through an intermediate medium, or internal connections between two components. Those skilled in the art can understand the specific meaning of the above terms in this invention based on the specific circumstances.

[0043] Example 1: As Figures 1-3 and Figures 6-13 As shown, an SMT surface mount solder paste machine includes a mounting frame 201 and a solder paste printing mechanism 400 that are slidably mounted on a worktable 100. Multiple carrier boards 202 are mounted on the mounting frame 201. A set of PCB board brackets 203 and a set of stencil brackets 204 are mounted on the top surface of the carrier boards 202. The set of PCB board brackets 203 includes four PCB board brackets 203 arranged along the four corners of the top surface of the carrier board 202, and the set of stencil brackets 204 includes four stencil brackets 204 arranged along the four corners of the top surface of the carrier board 202. The PCB board brackets 203 are used to support PCB boards, and the stencil brackets 204 are used to support stencils.

[0044] The solder paste printing mechanism 400 includes a squeegee assembly 420, two fixed frames 433, two sets of blowing assemblies 440, a vent pipe 441, a driven component 449, a driving component 448, an air supply assembly, and an adjustment assembly.

[0045] The scraper assembly 420 includes a second mounting plate 423 and a cutter holder 425. The second mounting plate 423 is connected to the cutter holder 425 by multiple leaf springs 424. The multiple leaf springs 424 are all made of phosphor bronze with a thickness of 0.3 to 0.5 mm and an elastic coefficient of 200 to 300 N / mm, and are evenly arranged along the length of the cutter holder 425.

[0046] A scraper 426 is mounted on the blade holder 425, and a toggle plate 4262 is mounted on both sides of the scraper 426; two fixing brackets 433 are mounted on the bottom surface of the second mounting plate 423, and multiple second through slots 434 are equidistantly opened on the fixing brackets 433.

[0047] The blowing assembly 440 includes a fixed tube 443, with a second hollow plate 445 and a first hollow plate 444 respectively mounted on the upper and lower ends of the fixed tube 443. Both the second hollow plate 445 and the first hollow plate 444 are slidably connected to the scraper 426. Multiple second air nozzles 447 and first air nozzles 446 are respectively mounted on the opposite side of the second hollow plate 445 and the first hollow plate 444. The second air nozzles 447 are located directly below the actuating plate 4262 and are in contact with the fixing frame 433. A first solenoid valve 4431 and a second solenoid valve 4432 are installed on the fixed pipe 443. When the first solenoid valve 4431 is closed, air in the fixed pipe 443 cannot flow into the first hollow plate 444; when the second solenoid valve 4432 is closed, air in the fixed pipe 443 cannot flow into the second hollow plate 445. Two guide plates 4261 are installed on both sides of the scraper 426, and the first hollow plate 444 and the second hollow plate 445 are slidably connected to the guide plates 4261. A one-way valve is installed inside the fixed pipe 443 to prevent gas in the first hollow plate 444 and the second hollow plate 445 from entering the fixed pipe 443.

[0048] Ventilation pipe 441 is fixedly connected to the fixing frame 433, and ventilation pipe 441 is connected to fixing pipe 443 through hose 442; driven member 449 is fixedly connected to the first hollow plate 444; driving member 448 is installed on ventilation pipe 441, and driving member 448 is used to drive driven member 449 to reciprocate horizontally through airflow; adjusting component is used to drive second mounting plate 423 to move horizontally and vertically; air supply component is used to supply air into the two ventilation pipes 441.

[0049] The second air nozzle 447 has an orifice diameter of 0.5 to 1 mm, and the air supply assembly provides an air pressure of 0.4 to 0.6 MPa. When the second air nozzle 447 is blocked by the fixing bracket 433, the pressure inside the cavity can instantly rise to 0.8 to 1.0 MPa.

[0050] The spacing between adjacent second through slots 434 is the same as the spacing between second air nozzles 447 (both are 10-15mm), ensuring that the second air nozzles 447 can be periodically aligned with the second through slots 434 when they reciprocate.

[0051] Specifically, the PCB board to be processed is placed on a set of PCB board holders 203 located directly below the solder paste printing mechanism 400, and then a stencil matching the PCB board is placed on a set of stencil holders 204, and then solder paste is applied to the stencil.

[0052] Then, by activating the adjustment mechanism, the position of the scraper 426 is adjusted so that the scraper 426 contacts the stencil. Then, the scraper 426 is moved to scrape the solder paste on the stencil so that the solder paste passes through the mesh of the stencil and contacts the PCB.

[0053] When the scraper 426 scrapes the solder paste on the stencil, the first solenoid valve 4431 is closed and the second solenoid valve 4432 is opened. Then, air is supplied to the vent pipe 441 through the air supply assembly. The air in the vent pipe 441 will enter the fixed pipe 443 through the hose 442 and then enter the second hollow plate 445. When the second through slot 434 on the fixed bracket 433 is misaligned with the second air nozzle 447 on the second hollow plate 445, the gas in the second hollow plate 445 cannot be discharged, which will increase the pressure of the gas in the second hollow plate 445, thereby increasing the impact force when the second air nozzle 447 blows out the gas.

[0054] When the second through slot 434 on the fixing frame 433 is connected to the second air nozzle 447 on the second hollow plate 445, the gas blown out by the second air nozzle 447 will blow towards the actuating plate 4262. Under the combined influence of the airflow impact force and the leaf spring 424, the actuating plate 4262 will vibrate, which in turn will cause the scraper 426 to vibrate. The vibrating scraper 426 can break the cohesion inside the solder paste, reduce the viscosity of the solder paste to improve its fluidity, thereby making it easier for the solder paste to pass through the tiny mesh of the stencil, which helps to reduce the occurrence of open solder joints during subsequent soldering. At the same time, the vibrating scraper 426 can also break up the solder paste agglomerates, significantly reducing the clogging rate of the stencil mesh.

[0055] like Figure 6 As shown, the adjustment assembly includes two hydraulic cylinders 401, two mounting seats 402, a second lead screw 404, and two sliding rods 405. Both hydraulic cylinders 401 are mounted on the top surface of the worktable 100; the two mounting seats 402 are fixedly connected to the extension ends of the two hydraulic cylinders 401 respectively, and a second motor 403 is mounted on either mounting seat 402; the second lead screw 404 is rotatably connected to the two mounting seats 402, one end of the second lead screw 404 is fixedly connected to the power output shaft of the second motor 403, a second lead screw nut 422 is mounted on the second lead screw 404, a second fixing plate 421 is mounted on the second lead screw nut 422, and the second fixing plate 421 is fixedly connected to the second mounting plate 423; the two sliding rods 405 are fixedly connected to the two mounting seats 402. The second fixing plate 421 is slidably connected to the two sliding rods 405.

[0056] Specifically, by activating the two hydraulic cylinders 401, the two mounting seats 402 can be moved vertically, which in turn moves the second lead screw 404 and slide rod 405 vertically, thereby adjusting the height of the second fixed plate 421 and the second mounting plate 423.

[0057] By starting the second motor 403, the second lead screw 404 is driven to rotate, which in turn drives the second fixed plate 421 to move through the second lead screw nut 422, and in turn drives the second mounting plate 423 to move horizontally.

[0058] like Figure 7 As shown, the gas delivery assembly includes a gas storage tank 431 and a gas pump 432. The gas storage tank 431 is installed on the top surface of the second mounting plate 423 and is fixedly connected to and communicates with two vent pipes 441. The gas pump 432 is installed on the top surface of the second mounting plate 423 and is used to deliver gas into the gas storage tank 431.

[0059] Specifically, by starting the air pump 432, air is injected into the air storage tank 431, and the gas in the air storage tank 431 can flow into the vent pipe 441.

[0060] like Figure 13 As shown, the drive component 448 includes a vertical rod 4481, a fan blade 4482, and a half gear 4483. The vertical rod 4481 passes through the bottom surface of the vent pipe 441 and is rotatably connected to the vent pipe 441; the fan blade 4482 is located inside the vent pipe 441 and is fixedly connected to the vertical rod 4481; the half gear 4483 is installed at the lower end of the vertical rod 4481.

[0061] Specifically, when the gas in the vent pipe 441 flows towards the hose 442, it will drive the fan blade 4482 to rotate, which in turn drives the vertical rod 4481 to rotate, which in turn drives the half gear 4483 to rotate.

[0062] like Figure 12 and Figure 13 As shown, the driven member 449 includes a connecting frame 4491 and two connecting plates 4493. Multiple teeth 4492 that match the half gear 4483 are installed on the inner walls of both sides of the connecting frame 4491; both connecting plates 4493 are fixedly connected to the connecting frame 4491 and both connecting plates 4493 are fixedly connected to the first hollow plate 444.

[0063] Specifically, when the half gear 4483 rotates, it intermittently meshes with the teeth 4492 on both sides of the inner wall of the connecting frame 4491, thereby driving the connecting frame 4491 to reciprocate horizontally, which in turn drives the first hollow plate 444 to reciprocate horizontally through the two connecting plates 4493. When the first hollow plate 444 reciprocates horizontally, it drives the second hollow plate 445 to reciprocate horizontally through the fixed tube 443.

[0064] like Figures 3-5 As shown, the SMT surface solder paste mounting machine also includes a moving mechanism 300, which includes two slide rails 301, multiple sliders 302, two mounting blocks 303, two bearing seats 304, a first lead screw 305, a first motor 306, and a moving base 308.

[0065] Both slide rails 301 are mounted on the top surface of the workbench 100; multiple sliders 302 are slidably connected to the two slide rails 301 respectively, and the tops of the multiple sliders 302 are fixedly connected to the mounting frame 201; both mounting blocks 303 are fixedly connected to the two slide rails 301; two bearing seats 304 are respectively mounted on the top surfaces of the two mounting blocks 303; the first lead screw 305 is rotatably connected to the two bearing seats 304, and a first lead screw nut 309 is mounted on the first lead screw 305;

[0066] The first motor 306 is mounted on the bottom surface of the mounting block 303 and connected to the first lead screw 305 via a transmission belt 307. Both the power output shaft of the first motor 306 and the first lead screw 305 are equipped with pulleys, and the transmission belt 307 is sleeved on the two pulleys.

[0067] The movable seat 308 is fixedly connected to the first lead screw nut 309, and the movable seat 308 is fixedly connected to the mounting frame 201.

[0068] Specifically, when the first motor 306 is running, it will drive the first lead screw 305 to rotate through the transmission belt 307. When the first lead screw 305 rotates, it will drive the movable seat 308 to move through the first lead screw nut 309, which in turn drives the mounting frame 201 to move, and then drives the multiple load plates 202 to move.

[0069] Furthermore, when the mounting frame 201 moves, it will cause multiple sliders 302 to move along the slide rail 301.

[0070] like Figure 1 and Figure 2 As shown, the SMT surface mount solder paste machine also includes a protective housing 101 and a placement mechanism 500. The protective housing 101 is mounted on the top surface of the worktable 100; the placement mechanism 500 is mounted on the top surface of the worktable 100 and is located inside the protective housing 101. The placement mechanism 500 is used to place chips on the PCB coated with solder paste. The placement mechanism 500 is a mature existing technology and can adopt existing technologies and solutions.

[0071] Working principle: In actual use, the PCB board to be processed is placed on a set of PCB board brackets 203 located directly below the solder paste printing mechanism 400, and then the stencil matching the PCB board is placed on a set of stencil brackets 204, and then solder paste is applied to the stencil.

[0072] By activating the two hydraulic cylinders 401, the two mounting seats 402 can be moved vertically, which in turn moves the second lead screw 404 and slide rod 405 vertically, thereby adjusting the height of the second fixed plate 421 and the second mounting plate 423, and thus adjusting the height of the scraper 426, so that the scraper 426 contacts the steel mesh.

[0073] Then, by starting the second motor 403, the second lead screw 404 is driven to rotate, which in turn drives the second fixed plate 421 to move through the second lead screw nut 422, which in turn drives the second mounting plate 423 to move horizontally, which in turn drives the scraper 426 to move, so that the scraper 426 scrapes the solder paste on the stencil, so that the solder paste passes through the mesh of the stencil and comes into contact with the PCB.

[0074] When the scraper 426 scrapes the solder paste on the stencil, the first solenoid valve 4431 is closed and the second solenoid valve 4432 is opened. Then, air is supplied to the vent pipe 441 through the air tank 431. The air in the vent pipe 441 will enter the fixed pipe 443 through the hose 442 and then enter the second hollow plate 445. When the second through slot 434 on the fixed bracket 433 is misaligned with the second air nozzle 447 on the second hollow plate 445, the pressure of the gas in the second hollow plate 445 will be increased, thereby increasing the impact force when the second air nozzle 447 blows out the gas.

[0075] When the second through slot 434 on the fixing frame 433 is connected to the second air nozzle 447 on the second hollow plate 445, the gas blown out by the second air nozzle 447 will blow towards the actuating plate 4262. Under the combined influence of the airflow impact force and the leaf spring 424, the actuating plate 4262 will vibrate, which in turn will cause the scraper 426 to vibrate. The vibrating scraper 426 can break the cohesion inside the solder paste, reduce the viscosity of the solder paste to improve its fluidity, thereby making it easier for the solder paste to pass through the tiny mesh of the stencil, which helps to reduce the occurrence of open solder joints during subsequent soldering. At the same time, the vibrating scraper 426 can also break up the solder paste agglomerates, significantly reducing the clogging rate of the stencil mesh.

[0076] Then, by activating the two hydraulic cylinders 401, the two mounting seats 402 are moved vertically, which in turn moves the second lead screw 404 and slide rod 405 vertically, thereby adjusting the height of the second fixed plate 421 and the second mounting plate 423, and then adjusting the height of the scraper 426, so that the scraper 426 is separated from the steel mesh, and then the steel mesh is removed from the steel mesh bracket 204.

[0077] Then, by starting the first motor 306, the first lead screw 305 is driven to rotate through the transmission belt 307. When the first lead screw 305 rotates, it will drive the moving seat 308 to move through the first lead screw nut 309, which in turn drives the mounting frame 201 to move, which in turn drives multiple carrier boards 202 to move, which in turn drives the PCB coated with solder paste to move towards the protective shell 101, so that the PCB with solder paste enters the protective shell 101.

[0078] Then, the chip is attached to the corresponding position on the PCB by the chip placement mechanism 500. After completion, the first motor 306 is started again to move the mounting frame 201, which in turn moves the multiple carrier boards 202, which in turn moves the PCB with the chip attached, thereby removing the PCB with the chip attached from the protective shell 101.

[0079] Example 2: As Figure 6 As shown, while all other parts are the same as in Example 1, the difference between this example and Example 1 is that:

[0080] The solder paste printing mechanism 400 also includes a recycling box 406 and an adsorption assembly 410. The recycling box 406 is mounted on the top surface of the workbench 100 and has grooves for supporting the stencil; the adsorption assembly 410 is connected to the second lead screw 404.

[0081] The adsorption assembly 410 includes a first fixing plate 411, a first mounting plate 413, and a plurality of electric actuators 414. A third lead screw nut 412 is mounted on the first fixing plate 411, and the third lead screw nut 412 is sleeved on the second lead screw 404; the first fixing plate 411 is slidably connected to the slide rod 405. The first mounting plate 413 is fixedly connected to the first fixing plate 411; the plurality of electric actuators 414 are all mounted on the bottom surface of the first mounting plate 413, and an electric suction cup 415 is mounted on the extended end of the electric actuator 414.

[0082] Working principle: In actual use, when it is necessary to clean the mesh of the steel mesh, the second motor 403 is started, which drives the second lead screw 404 to rotate, thereby driving the third lead screw nut 412 to move, which in turn drives the first fixed plate 411 and the first mounting plate 413 to move, which in turn drives multiple electric push rods 414 to move, thereby moving the multiple electric push rods 414 to the steel mesh. Then, by starting the multiple electric push rods 414, multiple electric suction cups 415 are driven to move downward and contact the steel mesh, and the steel mesh is then adsorbed by the multiple electric suction cups 415.

[0083] Then, the second motor 403 is started to move the steel mesh directly above the recycling box 406. Then, by starting multiple electric push rods 414, the electric suction cups 415 and the steel mesh are moved downwards so that the steel mesh is placed inside the recycling box 406. Then, the multiple electric suction cups 415 are controlled to release the steel mesh.

[0084] Then, by starting the second motor 403, the position of the scraper 426 is adjusted. When the scraper 426 moves directly above the steel mesh, the first solenoid valve 4431 is opened by closing the second solenoid valve 4432.

[0085] Then, air is supplied to the vent pipe 441 through the air storage tank 431. The air in the vent pipe 441 will enter the fixed pipe 443 through the hose 442, and then enter the first hollow plate 444. The air in the first hollow plate 444 will be blown out through multiple first air nozzles 446. The air blown out by the first air nozzles 446 will blow towards the stencil, thereby blowing the solder paste in the stencil mesh into the recycling box 406.

[0086] Furthermore, when the gas in the vent pipe 441 flows towards the hose 442, it will drive the fan blade 4482 to rotate, which in turn drives the vertical rod 4481 to rotate, which in turn drives the half gear 4483 to rotate. When the half gear 4483 rotates, it will intermittently mesh with the teeth 4492 on both sides of the inner wall of the connecting frame 4491, thereby driving the connecting frame 4491 to move back and forth horizontally. In turn, through the two connecting plates 4493, the first hollow plate 444 and multiple first air nozzles 446 will move back and forth horizontally, thereby increasing the coverage of the gas blown out by the first air nozzles 446, which can more comprehensively blow the solder paste in the stencil mesh into the recycling box 406.

[0087] The above description is only a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any equivalent substitutions or modifications made by those skilled in the art within the scope of the technology disclosed in the present invention, based on the technical solution and inventive concept of the present invention, should be covered within the scope of protection of the present invention.

[0088] The preferred embodiments of the present invention disclosed above are merely illustrative of the invention. These preferred embodiments do not exhaustively describe all details, nor do they limit the invention to specific implementations. Clearly, many modifications and variations can be made based on the content of this specification. This specification selects and specifically describes these embodiments to better explain the principles and practical applications of the invention, thereby enabling those skilled in the art to better understand and utilize the invention. The invention is limited only by the claims and their full scope and equivalents.

Claims

1. An SMT surface mount solder paste machine, comprising a mounting frame and a solder paste printing mechanism mounted on a workbench, wherein a plurality of carrier boards are mounted on the mounting frame, characterized in that, The solder paste printing mechanism includes: A scraper assembly includes a second mounting plate and a blade holder. The second mounting plate is connected to the blade holder via multiple leaf springs. A scraper is mounted on the blade holder, and actuating plates are mounted on both sides of the scraper. Two fixing brackets are installed on the bottom surface of the second mounting plate, and multiple second through slots are equally spaced on the fixing brackets; Two sets of blowing components, the blowing components including: A fixed tube is provided with a second hollow plate and a first hollow plate installed at its upper and lower ends, respectively. Multiple second air nozzles and first air nozzles are installed on the opposite sides of the second hollow plate and the first hollow plate, respectively. The second air nozzles are located directly below the actuating plate and slide in contact with the fixed frame. The ventilation tube is connected to the fixed tube via a flexible hose; The driven member is fixedly connected to the first hollow plate; A driving component is used to drive a driven component to reciprocate horizontally using the airflow in the vent pipe; An adjustment component is used to move the second mounting plate horizontally and vertically; An air delivery assembly for supplying air into the two said vent pipes.

2. The SMT surface solder paste mounting machine according to claim 1, characterized in that, The adjustment component includes: Both hydraulic cylinders are mounted on the top surface of the worktable; Two mounting bases are fixedly connected to the extension ends of the two hydraulic cylinders respectively, and a second motor is mounted on either of the mounting bases; The second lead screw is rotatably connected to the two mounting seats. One end of the lead screw is fixedly connected to the power output shaft of the second motor. A second lead screw nut is mounted on the lead screw nut. A second fixing plate is mounted on the second lead screw nut. The second fixing plate is fixedly connected to the second mounting plate. Two sliding rods are fixedly connected to the two mounting bases.

3. The SMT surface solder paste mounting machine according to claim 2, characterized in that, The gas delivery assembly includes: A gas storage tank is installed on the top surface of the second mounting plate and is fixedly connected to and communicates with the two vent pipes; An air pump, installed on the top surface of the second mounting plate, is used to deliver gas into the air storage tank.

4. The SMT surface solder paste mounting machine according to claim 3, characterized in that, The driving component includes: A vertical rod passes through the bottom surface of the vent pipe and is rotatably connected to the vent pipe; The fan blades are located inside the vent pipe and are fixedly connected to the vertical rod. A half-gear is installed at the lower end of the vertical rod.

5. The SMT surface solder paste mounting machine according to claim 4, characterized in that, The driven member includes: The connecting frame has multiple teeth on its inner wall that match the half gear; Both connecting plates are fixedly connected to the connecting frame and to the first hollow plate.

6. The SMT surface solder paste mounting machine according to claim 1, characterized in that, The top surface of the carrier plate is equipped with a set of PCB board brackets and a set of steel mesh brackets.

7. The SMT surface solder paste mounting machine according to claim 2, characterized in that, The solder paste printing mechanism also includes: A recycling box is installed on the top surface of the workbench, and the recycling box is provided with a groove for supporting the steel mesh; The adsorption component is connected to the second lead screw.

8. The SMT surface solder paste mounting machine according to claim 7, characterized in that, The adsorption component includes: A first fixed plate is mounted on which a third lead screw nut is fitted onto the second lead screw; The first mounting plate is fixedly connected to the first fixing plate; Multiple electric actuators are mounted on the bottom surface of the first mounting plate, and an electric suction cup is mounted on the extended end of each electric actuator.

9. The SMT surface solder paste mounting machine according to claim 1, characterized in that, It also includes a moving mechanism, which comprises: Both slide rails are mounted on the top surface of the worktable; Multiple sliders are slidably connected to two slide rails, and their tops are fixedly connected to the mounting frame. Both mounting blocks are fixedly connected to the two slide rails; Two bearing housings are respectively installed on the top surfaces of the two mounting blocks; The first lead screw is rotatably connected to the two bearing seats, and a first lead screw nut is installed on it. The first motor is mounted on the bottom surface of the mounting block and is connected to the first lead screw via a transmission belt; The movable seat is fixedly connected to the first lead screw nut and to the mounting frame.

10. The SMT surface solder paste mounting machine according to claim 1, characterized in that, Also includes: A protective shell is installed on the top surface of the workbench; The patch assembly is installed on the top surface of the workbench and located inside the protective housing.

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