Production method and device for removing surface defects of wires and application of abrasive belt
By using composite grit abrasive belts and closed-loop abrasive belt grinding devices, grinding parameters are controlled to remove microscopic defects on the wire surface, solving the problem that surface defects of wire affect the quality of reprocessed products, and achieving efficient wire processing and quality control.
Patent Information
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- JIANGSU JICUI METALLURGICAL TECH RES INST CO LTD
- Filing Date
- 2024-11-04
- Publication Date
- 2026-05-08
AI Technical Summary
Existing technologies are insufficient to effectively remove microscopic defects on the surface of wire, such as iron oxide scale, pits, and cracks, which affect the mechanical properties and fatigue life of steel wire products. At the same time, the removal of defects may lead to excessive ellipticity of the wire, affecting the quality of reprocessed products.
By employing composite-grit abrasive belts and a closed-loop abrasive belt grinding device, and by controlling the linear speed, tension, and wire feed rate of the abrasive belt, surface defects of the wire are removed within a limited time, and grinding marks are controlled to meet the ellipticity requirements of the wire.
Without affecting the ellipticity of the wire, it effectively removes microscopic defects on the surface of the wire, improving the efficiency of wire reprocessing and product quality.
Smart Images

Figure CN121989104A_ABST
Abstract
Description
Technical Field
[0001] This invention belongs to the field of wire processing technology in the metal products industry, and specifically relates to a production method and apparatus for removing surface defects of wires and the application of abrasive belts. Background Technology
[0002] In my country's current standards, hot-rolled round steel sections with diameters of 5–26 mm are generally referred to as wire rod. Because these wire rods, which require further processing, are produced through multiple high-temperature hot rolling processes, defects such as iron oxide scale, pits, tassels, folds, and cracks are easily generated on their surface. Some of these defects are quite obvious, see… Figure 1 Some microscopic defects (tens to hundreds of micrometers) that penetrate deep into the wire matrix are covered by iron oxide scale and can only be observed under a microscope after sampling. See [link to relevant documentation]. Figure 2 For a 2.0-ton coil of wire with varying diameters and lengths ranging from several thousand meters to over ten thousand meters, it is highly susceptible to missing micro-defects. If these micro-defects are not detected in time and are inherited by subsequent processing steps, they will affect the mechanical properties and fatigue life of the steel wire product, as well as the effectiveness of copper or zinc plating on the wire surface. Therefore, current national standards require that the depth (or height) of micro-defects on the surface of spring steel wire and cord steel wire should not exceed 0.10 mm; otherwise, wire breakage will occur during drawing or twisting. Production practice has shown that scratches larger than 0.10 mm on the surface of cold-heading steel wire often cause half of the cold-heading steel wire to crack during cold heading. To ensure that one-third of the cold heading is qualified, the depth of local scratches on the wire surface should not exceed 0.07 mm.
[0003] Currently, commonly used surface treatment technologies for steel wire include shot peening, bending roller technology, steel brush technology, and abrasive wheel and belt rust removal. These technologies are all surface rust removal or polishing techniques, which can effectively remove iron oxide scale and rust from the surface of the wire. However, existing surface rust removal or polishing technologies cannot remove defects within the steel matrix, such as protrusions, pits, and cracks. Therefore, how to remove microscopic defects within the steel matrix to improve product quality, while simultaneously facilitating smooth production and cost control, is a problem that wire reprocessing companies must address.
[0004] Abrasive belts are special-shaped, multi-bladed cutting tools whose cutting function is mainly accomplished by abrasive grains adhered to a substrate. They consist of three elements: abrasive, binder, and substrate material. On a flexible and extremely flat cloth or paper substrate surface, long-diameter abrasive grains are arranged flat, maintaining flexibility and elasticity through the binder and substrate material. The abrasive belt cutting process includes three stages: sliding, plowing, and cutting. Sliding: The abrasive grains induce elastic and plastic deformation on the workpiece without removing material. Plowing: The abrasive grains induce plastic flow in the workpiece material, causing the material to be squeezed out from below the abrasive grains forward and to the sides, simultaneously removing a small amount of material. Cutting: Fracture occurs in front of the sliding abrasive grains, forming chips with an extremely high material removal rate. A schematic diagram of the single-grain grinding process is shown (see...). Figure 3 As can be seen, elastic recovery occurs at the tip of the abrasive grain, wear debris is generated at the front end of the abrasive grain, and plastic bulges occur on both sides of the rear end of the abrasive grain, all accompanied by an increase in grinding depth. Because the wire is cylindrical, belt grinding of wire typically involves "flexible contact," see... Figure 4 .
[0005] If you want to remove microscopic defects from the surface of a wire by using a sanding belt on a wire reprocessing production line, it is different from polishing the surface of the wire to a smooth finish. There are three problems that need to be solved: (1) The hardness of the wire, the grinding pressure of the abrasive belt, and the grinding speed are extremely important parameters of the grinding process. At the same time, on the wire reprocessing production line, the wire moves at a speed that matches the preceding and following production processes. It is necessary to study and reveal the essence of various grinding processes and grinding phenomena, and find the optimal grinding process on the production line, so that when the wire is running on the reprocessing production line, micro-defects can be removed, unnecessary metal loss can be reduced, and production efficiency can be maintained.
[0006] (2) Grinding the micro-defects on the surface of the wire is also grinding the wire substrate, which will inevitably leave grinding marks on the wire substrate. Moreover, the larger the abrasive grain size, the higher the grinding removal rate of the wire substrate, and the deeper the grinding marks left. How to reduce the impact of grinding marks on the quality of reprocessed wire products is also a problem to be solved.
[0007] (3) Removing micro-defects in wire rod also involves removing the wire rod matrix. The contact surface between the abrasive belt and the wire rod is an arc surface, which affects the ellipticity of the wire rod. However, the national standard GB / T 702-2017 "Dimensions, Shape, Weight and Permissible Deviations of Hot-Rolled Steel Bars" has clear regulations on ellipticity. If the ellipticity of the wire rod is too large, it will affect the quality performance of the reprocessed products. How to remove micro-defects in wire rod while ensuring the ellipticity of the wire rod and improving the quality of the reprocessed products is a very practical problem that needs to be solved.
[0008] Currently, the application of abrasive belts in wire processing includes: Chinese Invention Patent Application CN108500794A, which describes a belt polishing machine and wire processing system. This belt polishing machine includes a frame and a drive unit, a transmission unit, and a main shaft, all mounted on the frame. The drive unit includes a drive motor fixedly connected to the frame and a rotating shaft rotatably connected to the frame. The drive motor is driven by the rotating shaft to rotate it. The transmission unit includes a driving gear and a driven gear. The driving gear meshes with the driven gear, and the driving gear is coaxially and fixedly connected to the rotating shaft. The driven gear is coaxially and fixedly connected to the main shaft. The power transmission from the rotating shaft to the main shaft is achieved through the engagement of the driving and driven gears, ultimately driving the main shaft to rotate. This gear transmission method solves the problems of belt breakage, cumbersome belt replacement, and high machine failure rate in existing technologies, thereby improving production efficiency. Summary of the Invention
[0009] To address the problems existing in the prior art, this invention proposes a production method and apparatus for removing surface defects of wires, as well as the application of abrasive belts, to overcome or at least partially solve the aforementioned problems.
[0010] This invention provides a production method for removing surface defects from wires, the method comprising: For the process flow of removing microscopic defects from the surface of hot-rolled wire rod, see [link to relevant documentation]. Figure 5 On the production line, one end of the wire is unwound by a motor and drawn into the abrasive cloth grinding area for surface grinding. The abrasive cloth grinding area uses a high-speed rotating, closed-loop abrasive belt to contact the wire for surface grinding. The closed-loop abrasive belt grinding device contains at least three sets of abrasive belts and corresponding auxiliary devices. A schematic diagram of the auxiliary devices is shown below. Figure 6 The abrasive belt is a composite-grit belt. During grinding, a tension wheel ensures close contact between the abrasive cloth and the wire surface. The belt tension controls the contact and grinding pressure, pressing the abrasive grains into the wire surface. The belt tension range is 100N to 300N. Driven by a drive wheel, the abrasive cloth moves rapidly, with a linear speed range of 5m / s to 50m / s. This ensures that the abrasive belt completes the grinding of surface defects within a limited time and that the ellipticity of the ground wire meets quality requirements.
[0011] Optionally, the wire is drawn and moved axially into a closed belt grinding device. The wire feed speed range is 5m / min to 60m / min. The smaller the diameter of the wire, the closer the wire feed speed is to the upper limit of the speed range; the larger the diameter of the wire, the closer the wire feed speed is to the lower limit of the speed range.
[0012] Based on the same inventive concept, this embodiment of the invention also provides a closed-loop belt grinding device, characterized in that at least three sets of sanding belts and corresponding supporting devices are sequentially arranged inside the closed-loop belt grinding device, and the sanding belts and corresponding supporting devices perform belt grinding treatment on the circumferential arc surface of the wire.
[0013] Optionally, the linear velocity range of the abrasive belt is 5 m / s to 50 m / s. The tension range of the abrasive belt is 100 N to 300 N.
[0014] Based on the same inventive concept, this invention also provides a sanding belt and corresponding supporting device, characterized in that the corresponding supporting device for the sanding belt includes: a support wheel, a drive wheel, a tension wheel and a tension mechanism, the sanding belt runs around the support wheel, the drive wheel, the tension wheel and the tension mechanism, the drive wheel ensures the running speed of the sanding belt, and the tension wheel and tension mechanism define the tension range of the sanding belt.
[0015] Optionally, the composite-grit abrasive belt has two grinding zones arranged parallel to each other along its long side. The abrasive grit size in the grinding zone in the direction the wire enters is 30-80 mesh. The greater the hardness and elastic modulus of the wire, the smaller the abrasive grit size should be, resulting in larger individual abrasive grains and ensuring sufficient grinding of surface defects. The abrasive grit size in the second grinding zone is 100-240 mesh, ensuring the grinding of the plastic bulges generated in the first grinding zone and reducing the depth of grinding marks in the first grinding zone.
[0016] Optionally, the corresponding accessories of the abrasive belts are arranged sequentially in the direction of wire feeding, and the grinding areas of each abrasive belt on the wire surface do not overlap.
[0017] Based on the same inventive concept, this embodiment of the invention also provides an application of abrasive belt, characterized in that the application includes: applying the abrasive belt to wire processing to complete the grinding of surface defects of the wire.
[0018] This invention provides a production method for removing surface defects from wire. The method includes: uncoiling the wire and drawing it into an abrasive cloth grinding zone for surface grinding. The abrasive cloth grinding zone uses a high-speed rotating, closed-loop abrasive belt to contact the wire for surface grinding. At least three sets of abrasive belts and corresponding supporting devices are sequentially placed within the closed-loop abrasive belt grinding device. The abrasive belts are composite-grit abrasive belts with a linear speed range of 5 m / s to 50 m / s. The tension of the abrasive belts ranges from 100 N to 300 N, ensuring that the abrasive belts complete the grinding of surface defects within a limited time and that the ellipticity of the wire after abrasive cloth grinding meets quality requirements. This improves the production efficiency of wire reprocessing, enhances the product quality of reprocessed wire, and increases market competitiveness.
[0019] The above description is merely an overview of the technical solution of the present invention. In order to better understand the technical means of the present invention and to implement it in accordance with the contents of the specification, and to make the above and other objects, features and advantages of the present invention more apparent and understandable, specific embodiments of the present invention are described below. Attached Figure Description
[0020] To more clearly illustrate the technical solutions in the embodiments of the present invention, the accompanying drawings used in the description of the embodiments will be briefly introduced below. Obviously, the accompanying drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.
[0021] Figure 1 This is a feature diagram of the wire pit morphology provided by the background technology; Figure 2 The background technology provides a characteristic image of wire crack morphology. Figure 3 This is a schematic diagram of a single-particle abrasive grinding process provided in an embodiment of the present invention; Figure 4 This is a schematic diagram of flexible belt grinding provided in an embodiment of the present invention; Figure 5 This is a schematic diagram of the closed-loop belt grinding process for wire provided in an embodiment of the present invention (taking 3 sets of belt grinding devices as an example). Figure 6 This is a schematic diagram of the interior of the closed-loop belt grinding device provided in an embodiment of the present invention; Figure 7 This is a diagram showing the effect of polishing wire with a 60-mesh abrasive belt according to an embodiment of the present invention; Figure 8 This is a diagram showing the effect of polishing wire with a 100-grit abrasive belt according to an embodiment of the present invention; Figure 9 This is a schematic diagram of the morphology of a single abrasive grain provided in an embodiment of the present invention; Figure 10 This is a schematic diagram of the contact between the top of the abrasive grain and the wire substrate provided in an embodiment of the present invention; Figure 11 This is a schematic diagram of a single abrasive grain cutting wire provided in an embodiment of the present invention; Figure 12 This is a schematic diagram of the force on a single abrasive grain provided in an embodiment of the present invention; Figure 13 This is a simulation diagram of the single abrasive grain cutting process provided in an embodiment of the present invention; Figure 14 This is a schematic diagram of the abrasive grain height distribution on the surface of the abrasive belt provided in an embodiment of the present invention; Reference numerals: 1—Support wheel; 2—Drive wheel; 3—Internal space of closed belt grinding device; 4—Cross section of wire; 5—Tensioning wheel; 6—Sand belt; n1—Direction of sand belt movement; n2—Direction of drive wheel rotation. Detailed Implementation
[0022] The process of the present invention will be further explained below with reference to the accompanying drawings: Example: The present invention will be described in detail below with reference to specific embodiments and examples, thereby making the advantages and various effects of the present invention more clearly apparent. Those skilled in the art should understand that these specific embodiments and examples are for illustrative purposes only and are not intended to limit the present invention.
[0023] Throughout this specification, unless otherwise specified, the terminology used herein should be understood as having the meaning commonly used in the art. Therefore, unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. In the event of any conflict, this specification shall prevail.
[0024] Unless otherwise specified, all raw materials, reagents, instruments and equipment used in this invention can be purchased from the market or prepared by existing methods.
[0025] The technical solution of this application embodiment is to solve the above-mentioned technical problems, and the general idea is as follows: (a) Morphological characteristics of abrasive particles The grinding of wire surfaces by abrasive belts is accomplished by the abrasive grains on the belt surface. Currently, scholars both domestically and internationally typically make certain assumptions about the abrasive grains, simplifying their shape to a single geometric form. Due to the characteristics of the "electrostatic abrasive coating" process in abrasive belts, the shape of the abrasive grains is more often somewhere between a sphere and a cone. Figure 9 When the abrasive grains are pressed in, their tops contact the wire substrate, see... Figure 10 As shown.
[0026] Studies indicate that when abrasive grains are pressed into the substrate, the conical surface of the abrasive grain contacts the top surface of the substrate. A simplified abrasive grain model is constructed using two parameters: the radius of curvature Ri at the cutting edge and the negative rake angle αi, where di represents the abrasive grain indentation depth.
[0027] When di≤Ri(1-cosαi), the spherical tip of the abrasive grain comes into contact with the substrate surface.
[0028] When di > Ri(1-cosαi), the conical surface of the abrasive grain comes into contact with the surface of the substrate (that is, the abrasive grain is pressed into the substrate).
[0029] (II) Single abrasive grain grinding contact theory Belt abrasive grinding of wire surfaces is essentially a microscopic contact process between the abrasive grains on the belt surface and the wire profile. Because the abrasive grains are relatively hard compared to the wire material, when there is a normal contact pressure Fn between the abrasive grains and the wire surface, the abrasive grains begin to penetrate the wire matrix surface. Due to the small penetration depth, only elastic deformation occurs on the wire surface. As the penetration depth gradually increases, the pressure of the abrasive grains on the wire surface gradually increases, and the wire surface begins to transition from elastic deformation to plastic deformation. At this point, the abrasive grain penetration depth di is the static depth of cut.
[0030] When a sufficiently large tangential force causes the abrasive grains to move, grooves are plowed into the wire surface, with prominent metal slippage bulges on both sides. As the cutting depth increases further, the pushed-out metal layer slips noticeably. When the pushing force exceeds the strength of the steel, chips are formed and detach from the wire substrate surface at the rake face position. Figure 11 As shown. At this point, a schematic diagram of the force on a single abrasive grain is shown. Figure 12 In the force diagram, Fn is the grinding pressure on the abrasive grain, Fr is the cutting resistance of the chip on the abrasive grain, and Frn and Frs are the vertical and horizontal components of this cutting resistance, respectively.
[0031] Since the magnitude of cutting resistance is mainly determined by the hardness of the wire, when the ratio of the fracture toughness to the shear yield strength of the wire remains constant, the ratio of the penetration depth to the indentation depth of the abrasive grain is only related to the rake angle of the abrasive grain. When the apex angle α of the abrasive grain is larger, the vertical component of the cutting resistance is larger, and the ratio of the penetration depth to the static indentation depth of the abrasive grain is smaller. According to equation (1), when there is a sufficiently large tangential force to make the abrasive grain move, the average depth of the groove (penetration depth of the abrasive grain) is not equal to the static indentation depth of the abrasive grain, and the ratio between them is λ.
[0032] F m =F r ·sinα (1) hm is the maximum depth to which a single abrasive grain penetrates the cross-section of the wire substrate. When the abrasive grain traverses the wire surface at a certain speed, it forms a groove; m is the depth of the groove after grinding the wire substrate surface. See the simulation diagram of the single abrasive grain cutting process. Figure 13 .
[0033] Based on the properties of the wire matrix material and the geometric relationship of the abrasive grains, the maximum indentation depth hm can be determined as:
[0034] (2) (2) In the formula, Fn,HV is the Vickers hardness of the wire; k is the interaction factor between the abrasive and the steel matrix, usually taken as 1.08. α is the cutting edge angle of the abrasive.
[0035] Equation (2) shows that the maximum depth of the indentation cross section is related to the normal contact pressure, the abrasive belt density, the abrasive cutting edge angle, and the hardness of the wire. When the contact pressure is greater, the maximum depth of the indentation cross section is also greater, and the amount of grinding is also greater.
[0036] (III) Theory of Static Wire Surface Contact in Abrasive Grinding with Belt During the process of grinding micro-defects on the surface of wire with abrasive belts, the actual number of effective abrasive grains participating in the grinding is only a portion of the total number of abrasive grains protruding at different heights on the surface of the abrasive belt. Figure 14 A schematic diagram of the distribution of abrasive grain protrusion height on the abrasive belt surface when in contact with the wire surface is given. The origin of the coordinate system is located at the position of the average height hm of all abrasive grains, and ±3σ are the highest and lowest positions of the abrasive grains, respectively.
[0037] like Figure 14 As shown in the figure, the lateral distance from the wire surface to the origin of the coordinate system is h0, and the depth of the highest abrasive grain indentation into the wire surface is m. As can be seen from the figure, m = 3σ - h0. At that time, the abrasive grain protrusion height distribution function can be expressed as:
[0038] (3) When the average pressure P0 reaches the Brinell hardness HB of the wire surface, some abrasive grains penetrate to a depth exceeding the maximum elastic deformation δmax, resulting in plastic deformation within the wire surface. If there is relative motion between the abrasive grains and the wire matrix and the tangential force is sufficiently large, the abrasive grains will plow or cut relative to the wire surface. In this case, the average pressure P0 is typically taken as HB / 2, and the cutting edge angle of most abrasive grains is between 50° and 80°.
[0039] The relationship between indentation depth and grinding pressure can be derived from the above analysis. The relationship between the pressure P generated by abrasive grains per unit area on the wire surface and the indentation depth m of the highest abrasive grain is expressed by formula (4):
[0040] (4) (4) In the formula, N0 is the number of abrasive particles per unit area (particles / mm). 2 The maximum elastic deformation δmax is related by equation (5):
[0041] (5) (5) In the formula, the tip of the abrasive grain is spherical and the radius of curvature of the cutting edge is R; E* is the contact elastic modulus between the abrasive grain and the wire, and E1 and E2 are the elastic moduli of the abrasive grain and the wire, respectively, and υ1 and υ2 are the Poisson's ratios of the abrasive grain and the wire, respectively. The relationship is (6).
[0042] (6) When the abrasive grains are ceramic, the elastic modulus E1 = 336 GPa, Poisson's ratio υ1 = 0.2, and density ρ = 4.6 g / cm³. When the wire is steel, the elastic modulus E2 = 196 GPa ~ 206 GPa, Poisson's ratio υ2 = 2.5 ~ 0.3, and density ρ = 7.8 g / cm³.
[0043] (iv) Contact theory of online wire surface grinding in belt grinding When grinding wire with a belt, the tangential velocity of the belt and the wire at the contact point and the feed rate of the wire are vs and vw, respectively, and vr is the relative velocity between the belt and the wire. Generally, the tangential velocity of the belt is much greater than the feed rate of the wire, vw, so vr ≈ vs.
[0044] (7) (7) In the formula, N0 is the number of abrasive grains per unit area (pieces / mm2); δmax is the maximum elastic deformation; b1 is the length from the center of the arc where the abrasive belt contacts the wire to the edge of the arc, which is πr / n, and n is the number of abrasive belts. For example, when using 3 abrasive belts to grind the wire, each abrasive belt grinds 1 / 3 of the circumference of the circular cross-section of the wire, in which case b1 is πr / 3, and r is the radius of the circular cross-section of the wire. When using 4 abrasive belts to grind the wire, each abrasive belt grinds 1 / 4 of the circumference of the circular cross-section of the wire, in which case b1 is πr / 4, and r is the radius of the circular cross-section of the wire.
[0045] Based on the above theory, a typical embodiment of the present invention provides a production method for online removal of microscopic defects on the surface of hot-rolled wire rod, the method comprising: After the wire is uncoiled, it is drawn into the abrasive cloth grinding area for surface grinding. This area uses a high-speed rotating, closed-loop abrasive belt to grind the wire. The closed-loop abrasive belt grinding device contains at least three sets of abrasive belts and corresponding accessories. The linear speed of the abrasive belt ranges from 5 m / s to 50 m / s, and the tension ranges from 100 N to 300 N. This ensures that the abrasive belt can complete the grinding of surface defects within a limited time and that the ellipticity of the wire after abrasive cloth grinding meets quality requirements. Furthermore, using multiple abrasive belts with composite grit reduces grinding marks, ensures the ellipticity of the wire, and further improves the surface quality of the wire.
[0046] The linear speed of the abrasive belt should be controlled within the range of 5 m / s to 50 m / s. Excessive speed reduces the grinding time between the abrasive grains and the wire substrate, resulting in a shallower grinding depth. Conversely, insufficient speed increases the grinding time, leading to deeper grooves on the wire substrate surface and causing excessive ellipticity in the wire.
[0047] The tension range of the abrasive belt should be controlled between 100N and 300N. Excessive tension means excessive grinding pressure on the abrasive grains, which negatively impacts the depth of the grooves formed on the wire substrate surface, causing excessive ellipticity in the wire. Insufficient tension results in a shallow grinding depth.
[0048] As an optional implementation, the wire feed speed is controlled within the range of 5 m / min to 60 m / min. This feed speed is related to the wire diameter: the smaller the wire diameter, the closer the feed speed is to the upper limit of the speed range; the larger the wire diameter, the closer the wire feed speed is to the lower limit of the speed range. Furthermore, an excessively high feed speed reduces the grinding time between the abrasive grains on the belt and the wire substrate, resulting in a smaller grinding depth. Conversely, an excessively low feed speed increases the grinding time between the abrasive grains on the belt and the wire substrate, leading to a larger groove depth on the surface of the wire substrate and causing the ellipticity of the wire to exceed the standard.
[0049] According to another typical embodiment of the present invention, a closed-loop belt grinding device is characterized in that at least three sets of abrasive belts and corresponding supporting devices are sequentially arranged inside the closed-loop belt grinding device, wherein the abrasive belts and corresponding supporting devices perform belt grinding treatment on the circumferential arc surface of the wire. It should be noted that the number of abrasive belts and corresponding supporting devices depends on the available equipment space on site; the overall objective is to ensure that the circumferential surface of the wire is within the range of belt grinding treatment.
[0050] As an optional implementation, the abrasive belt with composite grit has two parallel grinding zones. The abrasive grit size in the grinding zone in the wire entry direction is 30-80 mesh. The higher the hardness and elastic modulus of the wire, the smaller the grit size should be, resulting in larger individual abrasive grains and ensuring sufficient grinding of surface defects. The abrasive grit size in the second grinding zone is 100-240 mesh, ensuring the grinding of plastic bulges generated in the first grinding zone and reducing the depth of grinding marks in the first grinding zone.
[0051] The following will describe in detail the production method and apparatus for online removal of micro-defects on the surface of hot-rolled wire rod and the application of abrasive belts, in conjunction with embodiments, comparative examples and experimental data.
[0052] Example 1 A production apparatus for removing surface defects from wires, the apparatus comprising: at least three sets of abrasive belts and corresponding auxiliary devices sequentially arranged within a closed-loop abrasive belt grinding device; the abrasive belts and corresponding auxiliary devices being used to perform abrasive belt grinding on the wires within the closed-loop abrasive belt grinding device; the linear velocity of the abrasive belts being in the range of 5 m / s to 50 m / s; and the tension of the abrasive belts being in the range of 100 N to 300 N. The abrasive belts are composite-grit abrasive belts with two grinding zones; the abrasive grit size in the grinding zone in the direction of wire entry is 30 mesh to 80 mesh. Figure 7 The abrasive grit size for the second grinding zone is 100 mesh to 240 mesh, see... Figure 8 .
[0053] Example 2 A manufacturing method for removing surface defects from wire, the method comprising: The production apparatus provided in Example 1 is used; After the wire is uncoiled, it is drawn into the abrasive cloth grinding area; the wire feed speed range is 5m / min. After the wire enters the closed-loop belt grinding device, it undergoes belt grinding to ensure that the belt grinds away surface defects within a limited time.
[0054] Example 3 A manufacturing method for removing surface defects from wire, the method comprising: The production apparatus provided in Example 1 is used; After the wire is uncoiled, it is drawn into the abrasive cloth grinding area; the wire feed speed range is 60m / min. After the wire enters the closed-loop belt grinding device, it undergoes belt grinding to ensure that the belt grinds away surface defects within a limited time.
[0055] Example 4 A manufacturing method for removing surface defects from wire, the method comprising: The production apparatus provided in Example 1 is used; After the wire is uncoiled, it is drawn into the abrasive cloth grinding area; the wire feed speed range is 35m / min. After the wire enters the closed-loop belt grinding device, it undergoes belt grinding to ensure that the belt grinds away surface defects within a limited time.
[0056] Comparative Example 1 A production apparatus for removing surface defects from wires, the apparatus comprising: at least three sets of abrasive belts and corresponding auxiliary devices sequentially arranged within a closed-loop belt grinding device; the abrasive belts and auxiliary devices being used to perform belt grinding on the wires within the closed-loop belt grinding device; the linear velocity range of the abrasive belts being 3 m / s; the tension range of the abrasive belts being 100 N to 300 N; and a composite-grit abrasive belt with two grinding zones, wherein the abrasive grit size in the grinding zone in the wire entry direction is 30 mesh to 80 mesh, and the abrasive grit size in the second grinding zone is 100 mesh to 240 mesh.
[0057] A manufacturing method for removing surface defects from wire, the method comprising: The production equipment provided above is used; After the wire is uncoiled, it is drawn into the abrasive cloth grinding area; the wire feed speed range is 35m / min. After the wire enters the closed-loop belt grinding device, it undergoes belt grinding to ensure that the belt grinds away surface defects within a limited time.
[0058] Comparative Example 2 A production apparatus for removing surface defects from wires, the apparatus comprising: at least three sets of abrasive belts and corresponding supporting devices sequentially arranged within a closed-loop belt grinding device; the abrasive belts and corresponding supporting devices being used to perform belt grinding on the wires within the closed-loop belt grinding device; the linear velocity range of the abrasive belts being 60 m / s; the tension range of the abrasive belts being 100 N to 300 N; and a composite-grit abrasive belt with two grinding zones, wherein the abrasive grit size in the grinding zone in the wire entry direction is 30 mesh to 80 mesh, and the abrasive grit size in the second grinding zone is 100 mesh to 240 mesh.
[0059] A manufacturing method for removing surface defects from wire, the method comprising: The production equipment provided above is used; After the wire is uncoiled, it is drawn into the abrasive cloth grinding area; the wire feed speed range is 35m / min. After the wire enters the closed-loop belt grinding device, it undergoes belt grinding to ensure that the belt grinds away surface defects within a limited time.
[0060] Comparative Example 3 A production apparatus for removing surface defects from wires, the apparatus comprising: at least three sets of abrasive belts and corresponding auxiliary devices sequentially arranged within a closed-loop belt grinding device; the abrasive belts and auxiliary devices being used to perform belt grinding on the wires within the closed-loop belt grinding device; the linear velocity of the abrasive belts ranging from 5 m / s to 50 m / s; the tension of the abrasive belts ranging from 80 N; and a composite-grit abrasive belt with two grinding zones, wherein the abrasive grit size in the grinding zone in the wire entry direction is 30 mesh to 80 mesh, and the abrasive grit size in the second grinding zone is 100 mesh to 240 mesh.
[0061] A manufacturing method for removing surface defects from wire, the method comprising: The production equipment provided above is used; After the wire is uncoiled, it is drawn into the abrasive cloth grinding area; the wire feed speed range is 35m / min. After the wire enters the closed-loop belt grinding device, it undergoes belt grinding to ensure that the belt grinds away surface defects within a limited time.
[0062] Comparative Example 4 A production apparatus for removing surface defects from wire, the apparatus comprising: at least three sets of abrasive belts and corresponding supporting devices sequentially arranged within a closed-loop belt grinding device, wherein the abrasive belts and corresponding supporting devices are used to perform belt grinding treatment on the wire within the closed-loop belt grinding device; the linear velocity range of the abrasive belts is 5 m / s to 50 m / s; the tension range of the abrasive belts is 400 N; and the abrasive belts have a composite grit size with two grinding zones, wherein the abrasive grit size in the grinding zone in the direction of wire entry is 30 mesh to 80 mesh, and the abrasive grit size in the second grinding zone is 100 mesh to 240 mesh.
[0063] A manufacturing method for removing surface defects from wire, the method comprising: The production equipment provided above is used; After the wire is uncoiled, it is drawn into the abrasive cloth grinding area; the wire feed speed range is 35m / min. After the wire enters the closed-loop belt grinding device, it undergoes belt grinding to ensure that the belt grinds away surface defects within a limited time.
[0064] Comparative Example 5 A production apparatus for removing surface defects from wires, the apparatus comprising: at least three sets of abrasive belts and corresponding supporting devices sequentially arranged within a closed-loop belt grinding device; the abrasive belts and corresponding supporting devices being used to perform belt grinding on the wires within the closed-loop belt grinding device; the linear velocity of the abrasive belts being in the range of 5 m / s to 50 m / s; the tension of the abrasive belts being in the range of 100 N to 300 N; and a composite-grit abrasive belt with two grinding zones, wherein the abrasive grit size in the grinding zone in the direction of wire entry is 30 mesh to 80 mesh, and the abrasive grit size in the second grinding zone is 100 mesh to 240 mesh.
[0065] A manufacturing method for removing surface defects from wire, the method comprising: The production equipment provided above is used; After the wire is uncoiled, it is drawn into the abrasive cloth grinding area; the wire feed speed range is 3m / min. After the wire enters the closed-loop belt grinding device, it undergoes belt grinding to ensure that the belt grinds away surface defects within a limited time.
[0066] Comparative Example 6 A production apparatus for removing surface defects from wires, the apparatus comprising: at least three sets of abrasive belts and corresponding supporting devices sequentially arranged within a closed-loop belt grinding device; the abrasive belts and corresponding supporting devices being used to perform belt grinding on the wires within the closed-loop belt grinding device; the linear velocity of the abrasive belts being in the range of 5 m / s to 50 m / s; the tension of the abrasive belts being in the range of 100 N to 300 N; and a composite-grit abrasive belt with two grinding zones, wherein the abrasive grit size in the grinding zone in the direction of wire entry is 30 mesh to 80 mesh, and the abrasive grit size in the second grinding zone is 100 mesh to 240 mesh.
[0067] A manufacturing method for removing surface defects from wire, the method comprising: The production equipment provided above is used; After the wire is uncoiled, it is drawn into the abrasive cloth grinding area; the wire feed speed range is 60m / min. After the wire enters the closed-loop belt grinding device, it undergoes belt grinding to ensure that the belt grinds away surface defects within a limited time.
[0068] Experimental example: The steels obtained in Examples 2-4 and Comparative Examples 1-5 were tested, and the test results are shown in the table below.
[0069] Wire surface defects and ellipticity Example 2 The wire surface is free of defects and the ellipticity is within acceptable limits. Example 3 The wire surface is free of defects and the ellipticity is within acceptable limits. Example 4 The wire surface is free of defects and the ellipticity is within acceptable limits. Comparative Example 1 The wire surface is defective and the ellipticity is not up to standard. Comparative Example 2 The wire surface has defects, but the ovality is within acceptable limits. Comparative Example 3 The wire surface is defective and the ellipticity is not up to standard. Comparative Example 4 The wire surface has defects, but the ovality is within acceptable limits. Comparative Example 5 The wire surface is defective and the ellipticity is not up to standard. Comparative Example 5 The wire surface has defects, but the ovality is within acceptable limits. As shown in the table above, the method provided in this embodiment of the invention for processing wire yields wires with fewer surface defects and acceptable ellipticity, improving wire quality and providing a better quality foundation for subsequent production processes. Comparison of data from Comparative Examples 1, 2, and the embodiment shows that when the abrasive belt speed is below 5 m / s, the grinding time between the abrasive grains and the wire substrate increases, resulting in a larger groove depth on the wire substrate surface and causing the ellipticity of the wire to exceed the standard. When the abrasive belt speed is above 50 m / min, the grinding time between the abrasive grains and the wire substrate decreases, resulting in a smaller grinding depth. Even after grinding, surface defects remain on the wire, affecting the abrasive belt treatment effect. Comparison of data from Comparative Examples 3, 4, and the embodiment shows that when the tension of the abrasive belt is below 100 N, the abrasive grains on the abrasive belt surface have a smaller impact on the wire surface. When the pressure generated by the abrasive belt decreases, the penetration depth of the abrasive grains decreases, and surface defects still exist on the wire after grinding. When the tension of the abrasive belt exceeds 300N, the pressure exerted by the abrasive grains on the wire surface is greater, resulting in a larger groove depth on the wire substrate surface after grinding, causing the ellipticity of the wire to exceed the standard. By comparing the data of Comparative Examples 5, 6 and the embodiment, it can be seen that when the wire feed speed is not within the range provided in this embodiment, when it is lower than 5m / min, the grinding time between the abrasive grains on the abrasive belt and the wire substrate is increased, resulting in a larger groove depth on the wire substrate surface after grinding, causing the ellipticity of the wire to exceed the standard. When the wire feed speed is higher than 50m / min, the grinding time between the abrasive grains on the abrasive belt and the wire substrate is reduced, resulting in a smaller grinding depth, but surface defects still exist on the wire after grinding, which will affect the abrasive belt treatment effect.
[0070] One or more technical solutions in the embodiments of the present invention have at least the following technical effects or advantages: (1) The method provided in this embodiment of the invention has created a new environmentally friendly and safe method for wire processing, which completes the grinding of surface defects of wire within a limited time on the production line, while controlling grinding marks, thereby improving the quality of wire and the efficiency of reprocessing production. (2) The production device provided in the embodiments of the present invention rationally configures the belt grinding device and the wire reprocessing process, reducing or eliminating defects on the surface of the wire without affecting the ellipticity of the wire, thereby improving the performance of the subsequent wire reprocessing products.
[0071] Finally, it should be noted that the terms “comprising,” “including,” or any other variations thereof are intended to cover non-exclusive inclusion, such that a process, method, article, or apparatus that comprises a list of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article, or apparatus.
[0072] Although preferred embodiments of the invention have been described, those skilled in the art, upon learning the basic inventive concept, can make other changes and modifications to these embodiments. Therefore, the appended claims are intended to be interpreted as including both the preferred embodiments and all changes and modifications falling within the scope of the invention.
[0073] Obviously, those skilled in the art can make various modifications and variations to this invention without departing from its spirit and scope. Therefore, if these modifications and variations fall within the scope of the claims of this invention and their equivalents, this invention also intends to include these modifications and variations.
Claims
1. A production method and apparatus for removing surface defects from wires, and the application of abrasive belts, characterized in that, The method includes: After the wire is uncoiled, it is drawn into the abrasive cloth grinding area for surface grinding. The abrasive cloth grinding area uses a high-speed rotating, closed-loop abrasive belt to contact the wire for surface grinding. The closed-loop abrasive belt grinding device sequentially houses at least three sets of abrasive belts and corresponding supporting devices. The abrasive belts are composite-grit abrasive belts with a linear speed range of 5 m / s to 50 m / s. The tension of the abrasive belts ranges from 100 N to 300 N, ensuring that the abrasive belts complete the grinding of surface defects on the wire within a limited time and that the ellipticity of the wire after abrasive cloth grinding meets quality requirements.
2. The production method for removing surface defects of wire according to claim 1, characterized in that, The wire is drawn and moved axially into the closed belt grinding device. The wire feed speed range is 5m / min to 60m / min. The smaller the diameter of the wire, the closer the wire feed speed is to the upper limit of the speed range; the larger the diameter of the wire, the closer the wire feed speed is to the lower limit of the speed range.
3. The closed-loop belt grinding device according to claim 1, characterized in that, The closed-type belt grinding device contains at least three sets of abrasive belts and corresponding supporting devices, which perform belt grinding on the circumferential arc surface of the wire.
4. The production method for removing surface defects of wire according to claim 1, characterized in that, The linear velocity range of the abrasive belt is 5 m / s to 50 m / s. The tension range of the abrasive belt is 100 N to 300 N.
5. The sanding belt and corresponding supporting device according to claim 3, characterized in that, The corresponding accessories for the sanding belt include: a support wheel, a drive wheel, a tension wheel, and a tension mechanism. The sanding belt runs around the support wheel, drive wheel, tension wheel, and tension mechanism. The drive wheel ensures the running speed of the sanding belt, and the tension wheel and tension mechanism control the tension range of the sanding belt.
6. The sanding belt according to claim 5, characterized in that, The abrasive belt is a composite-grit belt with two grinding zones arranged parallel to each other along its long side. The abrasive grit size in the grinding zone in the direction the wire enters is 30-80 mesh. The higher the hardness and elastic modulus of the wire, the smaller the grit size should be, resulting in larger individual abrasive grains and ensuring sufficient removal of surface defects. The abrasive grit size in the second grinding zone is 100-240 mesh, ensuring the removal of plastic bulges created in the first grinding zone and reducing the depth of grinding marks in the first grinding zone.
7. The sanding belt and corresponding supporting device according to claim 3, characterized in that, The corresponding accessories of the abrasive belts are arranged sequentially in the direction of wire feeding, and the grinding areas of each abrasive belt on the wire surface do not overlap.
8. The application of a sanding belt according to claim 5, characterized in that, The applications include: applying abrasive belts to wire processing to grind away surface defects in the wire.
Citation Information
Patent Citations
Abrasive belt polishing machine and wire rod machining system
CN108500794A