Power generation and radiation refrigeration integrated system for high-power computing power satellite

Abstract

The invention discloses a power generation and radiation refrigeration integrated system for a high-power computing power satellite. The system comprises an integrated function panel, a photovoltaic power generation unit, an active radiation refrigeration unit and a closed pump drive heat transmission loop. The integrated function panel comprises a panel body, the panel body is provided with a first surface and a second surface which are opposite, and the panel body blocks heat conduction and heat radiation between the first surface and the second surface; the photovoltaic power generation unit is arranged on the first surface; the active radiation refrigeration unit is arranged on the second surface; the active radiation refrigeration unit is provided with an outer surface with spectral selective radiation refrigeration characteristics, and the active radiation refrigeration unit comprises an internal micro-channel structure thermally coupled with the outer surface; and the closed pump drive heat transmission loop is connected with a heating electronic element in the satellite body and the internal micro-channel structure. The power generation performance can be optimized while the satellite heat dissipation efficiency is improved, heat and electricity integrated management of a high-efficiency calculation satellite platform is achieved, the reliability and efficiency of the overall system are improved, and meanwhile the overall weight of an energy system is reduced.

Description

Technical Field

[0001] This invention relates to the field of spacecraft energy and thermal control technology, and more specifically to an integrated power generation and radiation cooling system for high-power computing satellites. Background Technology

[0002] With the deep integration of aerospace technology and artificial intelligence technology, the concept of space data centers is moving from theory to practice. Whether it's "orbital edge" computing satellites used for real-time Earth observation processing or "orbital clouds" composed of constellations of computing satellites, both place extremely high demands on the computing power of satellite platforms. To meet this demand, high-power graphics processors, general-purpose servers, and AI chips specifically designed for accelerating deep learning are being deployed on satellites. These devices consume hundreds or even thousands of watts of power, causing a sharp increase in local heat flux density within the satellite, posing a serious challenge to traditional spacecraft thermal control technologies.

[0003] In traditional spacecraft design, energy systems and thermal control systems are typically independent. Energy systems rely on solar panels to convert solar energy into electricity, while thermal control systems rely on radiators to dissipate waste heat into deep space. These two systems each occupy valuable space on the satellite's outer envelope, directly competing in terms of layout. For example, the active thermal control system of the International Space Station has a single radiator weighing 740.7 kg, with an unfolded area of ​​approximately 42.5 square meters, a heat dissipation power of only 14 kW, and a heat dissipation power density of approximately 312 W / m². Such an inefficient and bulky system clearly cannot meet the needs of the large-scale deployment of miniaturized, high-power computing satellites in the future. More importantly, traditional design suffers from a technological bias: solar panels need to absorb as much sunlight as possible, while radiators need to absorb as little sunlight as possible while efficiently emitting infrared radiation. Therefore, the industry generally believes that these two functions cannot be achieved in the same structure, leading to a long-standing compromise between "power generation area" and "heat dissipation area" in satellite design, severely restricting the improvement of satellite computing power. While the development of advanced materials and technologies, such as spectrally selective radiation cooling materials, has offered new possibilities for solving these problems, the main limitation in current applications lies in how to effectively integrate these new technologies into existing spacecraft designs. Most existing attempts remain at the laboratory stage or small-scale testing, lacking successful examples of large-scale practical applications.

[0004] Therefore, it is necessary to design a new system that can improve the heat dissipation efficiency of satellites while optimizing power generation performance, realize the thermoelectric integrated management of high-performance computing satellite platforms, improve the overall system reliability and efficiency, and reduce the overall weight of the energy system. Summary of the Invention

[0005] The purpose of this invention is to overcome the shortcomings of the prior art and provide an integrated power generation and radiation cooling system for high-power computing satellites.

[0006] To achieve the above objectives, the present invention adopts the following technical solution: an integrated power generation and radiative cooling system for high-power computing satellites, comprising an integrated functional panel, a photovoltaic power generation unit, an active radiative cooling unit, and a closed-loop pump-driven heat transfer circuit; wherein, the integrated functional panel comprises a panel body having opposing first and second surfaces, the panel body blocking heat conduction between the first and second surfaces; the photovoltaic power generation unit is disposed on the first surface; the active radiative cooling unit is disposed on the second surface;

[0007] The active radiation cooling unit has an outer surface with spectrally selective radiation cooling characteristics, and the active radiation cooling unit includes an internal microchannel structure thermally coupled to the outer surface; The closed-loop pump-driven heat transfer circuit connects the heat-generating electronic components inside the satellite body with the internal microfluidic structure, transferring heat from the heat-generating electronic components to the active radiative cooling unit, and dissipating it through the outer surface in the form of thermal radiation.

[0008] The further technical solution is that the area ratio of the first surface and the second surface is 0.8:1 to 1.2:1.

[0009] The further technical solution is as follows: the panel body is a heat insulation structure layer with a heat transfer coefficient of no more than 0.01 W / m·K.

[0010] The further technical solution is as follows: the panel body adopts an aerogel-reinforced honeycomb sandwich structure, and the core layer is filled with nanoporous silica aerogel with a thickness of 5mm.

[0011] The further technical solution is as follows: the outer surface of the active radiation cooling unit is a spectrally selective radiation cooling coating with a reflectivity ≥95% and an absorptivity ≤5% in the solar spectrum band of 0.2-2.5μm; and an emissivity ≥95% in the infrared thermal radiation band of 8-13μm.

[0012] The further technical solution is as follows: the outer surface of the active radiation cooling unit is a multilayer thin film interference structure or a multi-scale micro-nano porous alumina coating, wherein the multilayer thin film interference structure includes alternating SiO2 and Si3N4 layers; the multi-scale micro-nano porous alumina coating has a multi-level pore structure with a pore size distribution of 50nm-5μm on the surface.

[0013] The further technical solution is as follows: the internal microchannel structure includes several parallel microchannels, an inlet manifold, and an outlet manifold; wherein the width of the microchannel is 30-100μm and the depth is 150-300μm; The inlet manifold is connected to the microchannel and is used to evenly distribute the heat transfer medium to each of the microchannels. The outlet manifold, which is connected to the microchannel, is used to collect the heat transfer fluid flowing out from each of the microchannels.

[0014] The further technical solution is as follows: the internal microchannel structure is a jet-enhanced manifold microchannel structure, wherein the inlet manifold is provided with a jet nozzle, and the diameter of the jet nozzle is 20-100μm; the jet-enhanced manifold microchannel structure reduces the heat exchange temperature difference between the heat transfer medium and the radiating surface, thereby increasing the equivalent heat dissipation power density of the panel of the active radiative cooling unit.

[0015] The further technical solution is as follows: the closed-loop pump-driven heat transfer circuit is filled with FC-72 perfluorocarbon liquid as the heat transfer medium; the heat transfer medium is a dielectric coolant with a freezing point below -50°C and a boiling point above 100°C.

[0016] The present invention also provides a high-power computing satellite, including the satellite body and the above-mentioned integrated power generation and radiation cooling system for a high-power computing satellite.

[0017] The advantages of this invention compared to existing technologies are as follows: By integrating the photovoltaic power generation unit and the active radiative cooling unit onto the same panel and using a highly efficient heat-insulating panel body to block heat conduction, this invention ensures that the two functional units do not interfere with each other, while also achieving a lightweight structure. The photovoltaic power generation unit is located on the first surface of the panel, effectively capturing solar energy and converting it into electrical energy to provide power to the satellite; while the active radiative cooling unit is located on the second surface. Its unique spectrally selective radiative cooling outer surface can maintain a low temperature even under direct sunlight, and its internal microfluidic structure directly absorbs heat from the satellite's heat-generating electronic components through a closed-loop pump-driven heat transfer circuit and efficiently dissipates it into deep space. This design not only significantly improves the satellite's heat dissipation efficiency but also optimizes power generation performance, enabling power supply and heat dissipation to grow synergistically in high-power computing tasks. This achieves integrated thermoelectric management of the high-performance computing satellite platform, significantly improving the overall system's reliability and efficiency. This innovative solution fundamentally solves the problem of the imbalance between power supply and heat dissipation capabilities in traditional designs, providing strong support for high-performance satellites.

[0018] The present invention will be further described below with reference to the accompanying drawings and specific embodiments. Attached Figure Description

[0019] To more clearly illustrate the technical solutions of the embodiments of the present invention, the drawings used in the following description of the embodiments will be briefly introduced. Obviously, the drawings described below are some embodiments of the present invention. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0020] Figure 1 This is a schematic diagram of the structure of a high-power computing satellite provided in an embodiment of the present invention; Figure 2 This is a cross-sectional structural diagram of the integrated functional panel provided in an embodiment of the present invention; Figure 3 This is a schematic diagram of the internal microchannel structure provided in an embodiment of the present invention; Figure 4 A comparison curve of the power generation density of the photovoltaic power generation unit and the heat dissipation power density of the active radiative cooling unit as a function of temperature is provided for an embodiment of the present invention. Explanation of the markings in the image: 100. High-power computing satellite; 110. Satellite body; 120. Integrated functional panel; 160. Heating electronic components; 210. Panel body; 220. Photovoltaic power generation unit; 230. Active radiative cooling unit; 231. Outer surface; 232. Internal microfluidic structure; 250. Microchannel; 251. Inlet manifold; 252. Outlet manifold; 253. Jet nozzle; 300. Closed-loop pump-driven heat transfer circuit; 320. Micro-mechanical pump; 330. Piping. Detailed Implementation

[0021] The technical solutions of the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some, not all, of the embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of the present invention.

[0022] It should be understood that, when used in this specification and the appended claims, the terms "comprising" and "including" indicate the presence of the described features, integrals, steps, operations, elements and / or components, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components and / or collections thereof.

[0023] It should also be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the invention. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0024] It should also be further understood that the term "and / or" as used in this specification and the appended claims refers to any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0025] With the integration of aerospace and artificial intelligence technologies, space data centers have moved from theory to practice, placing extremely high demands on satellite computing power. This has spurred the deployment of high-power AI chips on satellites, but it has also led to a surge in localized heat flux density, which traditional spacecraft thermal control technologies struggle to handle. In traditional designs, energy systems and thermal control systems are independent and compete for the limited space of the satellite's outer envelope. For example, the thermal control system of the International Space Station is bulky and inefficient, unable to meet the needs of future miniaturized, high-power computing satellites. Furthermore, the industry's technological bias against the coexistence of solar panels and radiators limits the development of satellite design. Although new materials and technologies such as spectral selective radiative cooling offer potential solutions to these problems, effectively integrating these technologies into existing spacecraft designs remains a challenge. Currently, most of these technologies are still in the experimental or small-scale stages, lacking large-scale application examples.

[0026] Therefore, embodiments of the present invention provide a power generation and radiation cooling integrated system 100 for high-power computing satellites, which can improve the heat dissipation efficiency of the satellite while optimizing the power generation performance, realize the thermoelectric integrated management of the high-efficiency computing satellite platform, and greatly improve the reliability and efficiency of the overall system.

[0027] The aforementioned integrated power generation and active radiative cooling hybrid energy system simultaneously deploys a photovoltaic power generation unit 220 and an active radiative cooling unit 230 on the integrated functional panel 120 of the satellite body 110. Utilizing the spectrally selective radiative cooling characteristics of the outer surface 231 and the internal microfluidic structure 232, it achieves highly efficient thermoelectric integrated management. This system not only optimizes power generation performance but also significantly improves heat dissipation efficiency, particularly by efficiently transferring heat from the heat-generating electronic components 160 within the satellite body 110 to the active radiative cooling unit 230 via a closed-loop pump-driven heat transfer circuit 300, which then dissipates the heat through thermal radiation. Furthermore, the overall system efficiency is further enhanced by employing thermal insulation design, a specific ratio of first and second surface areas, and suitable materials and structures (such as aerogel-reinforced honeycomb sandwich structures, multilayer thin-film interference structures, or multi-scale micro-nano porous alumina coatings). Ultimately, this innovative design significantly improves the reliability and efficiency of the high-power computing satellite 100 platform, resolving the compromise between power generation area and heat dissipation area in traditional satellite designs.

[0028] To better understand the above technical solutions, the following will provide a detailed explanation of the technical solutions in conjunction with the accompanying drawings and specific implementation methods.

[0029] Please see Figure 1 An integrated power generation and radiative cooling system for high-power computing satellites is characterized by comprising an integrated functional panel 120, a photovoltaic power generation unit 220, an active radiative cooling unit 230, and a closed-loop pump-driven heat transfer circuit 300; wherein, the integrated functional panel 120 includes a panel body 210, the panel body 210 having opposing first and second surfaces, and the panel body 210 blocking heat conduction between the first and second surfaces; the photovoltaic power generation unit 220 is disposed on the first surface; and the active radiative cooling unit 230 is disposed on the second surface; The active radiation cooling unit 230 is provided with an outer surface 231 having spectrally selective radiation cooling characteristics, and the active radiation cooling unit 230 includes an internal microfluidic channel structure 232 that is thermally coupled to the outer surface 231. The closed-loop pump-driven heat transfer circuit 300 connects the heat-generating electronic component 160 inside the satellite body 110 with the internal microfluidic structure 232, and transfers heat from the heat-generating electronic component 160 to the active radiative cooling unit 230, and dissipates it through the outer surface 231 in the form of thermal radiation.

[0030] In this embodiment, the system aims to provide efficient power supply and thermal management for the high-power computing satellite 100. The system mainly includes the following key components: Integrated functional panel 120: This is the core component of the entire system, consisting of panel body 210, which has opposing first and second surfaces. Panel body 210 is designed to block heat conduction between the first and second surfaces, thereby ensuring that the system's two main functions—power generation and heat dissipation—can operate independently and efficiently.

[0031] Photovoltaic power generation unit 220: Located on the first surface of the integrated functional panel 120, it is used to convert solar energy into electrical energy to power various systems of the satellite body 110. This design enables the satellite body 110 to directly utilize sunlight for energy collection in orbit, greatly improving energy utilization efficiency.

[0032] Active radiative cooling unit 230: Located on the second surface of the integrated functional panel 120, it includes an outer surface 231 with spectrally selective radiative cooling characteristics and an internal microfluidic structure 232 thermally coupled thereto. This design allows the active radiative cooling unit 230 to achieve efficient heat dissipation even under direct sunlight through the high reflectivity (in the solar spectrum) and high emissivity (in the infrared thermal radiation band) of the outer surface 231 in specific wavelength bands.

[0033] Closed-loop pump-driven heat transfer circuit 300: This circuit connects the heat-generating electronic components 160 inside the satellite body 110 to the internal microfluidic structure 232 of the active radiative cooling unit 230. Its function is to effectively transfer the heat generated inside the satellite body 110 to the active radiative cooling unit 230 via pumping, and then dissipate it into deep space through its outer surface 231 in the form of thermal radiation. This process not only improves heat transfer efficiency but also ensures the stability of the internal environment of the satellite body 110 and the safety of the equipment.

[0034] In summary, by integrating photovoltaic power generation and active radiative cooling onto a single panel, this invention not only achieves the design goals of lightweight and high integration, but also ensures a natural match between the power supply area and the heat dissipation area through effective heat conduction blocking and precise control of heat and power output, thus solving the problem of imbalance between power supply and heat dissipation capacity in traditional designs. Furthermore, innovative designs in the system, such as the selection of the thermal insulation layer and the optimization of the microfluidic structure, further enhance overall performance, enabling the satellite to reduce energy consumption and weight while maintaining high efficiency, thereby improving the success rate and economic benefits of space missions.

[0035] In one embodiment, the area ratio of the first and second surfaces is between 0.8:1 and 1.2:1. This design takes into account the functional balance requirements of the photovoltaic power generation unit 220 and the active radiative cooling unit 230. By adjusting the area ratio of the two surfaces, it can be ensured that the satellite can obtain sufficient power supply and effectively dissipate heat under different operating conditions. Specifically, within the typical spacecraft operating temperature range (0°C to +50°C), the ratio of the power generation density of the photovoltaic power generation unit 220 to the heat dissipation power density of the active radiative cooling unit 230 is between 0.6 and 1.0. This means that the power supply capacity and heat dissipation capacity can be well matched, and there will be no situation of excess power and insufficient heat dissipation or vice versa.

[0036] In one embodiment, the panel body 210 is a heat-insulating structural layer with a heat transfer coefficient not exceeding 0.01 W / m·K. This design effectively blocks heat conduction between the first and second surfaces, thereby preventing the high temperatures (up to 80-100°C) of the photovoltaic power generation unit 220 under direct sunlight from negatively impacting the active radiative cooling unit 230. To achieve this goal, the panel body 210 employs an aerogel-reinforced honeycomb sandwich structure, with the core layer filled with nanoporous silica aerogel, the thickness of which is set to 5 mm. Aerogel, due to its extremely low thermal conductivity, is an ideal choice for heat insulation materials. Its nanoporous structure not only effectively suppresses gas convection heat transfer and solid-phase heat conduction but also provides the necessary mechanical strength to maintain the stability of the overall structure.

[0037] In one embodiment, please refer to Figure 2The panel body 210 adopts an aerogel-reinforced honeycomb sandwich structure, with the core layer filled with nanoporous silica aerogel, which is 5mm thick. Specifically, the panel body 210 adopts an aerogel-reinforced honeycomb sandwich structure. The upper and lower skins are 0.5mm thick aluminum alloy, and the middle honeycomb core layer is an aluminum foil welded structure, with nanoporous silica aerogel filling the honeycomb cells. The total thickness of the panel is 5mm, of which the aerogel layer is 4mm thick. Testing shows that the areal density of this structure is approximately 10kg / m², and the heat transfer coefficient is as low as 0.01W / m·K, effectively ensuring the working environment of the radiant cooling unit.

[0038] Please see Figure 2 The image showcases the cross-sectional structure and microchannel details of the integrated functional panel 120. As can be seen from the image, the panel body 210 not only includes a high-efficiency heat insulation layer but also integrates a photovoltaic power generation unit 220 and an active radiative cooling unit 230. In particular, the active radiative cooling unit 230 includes an outer surface 231 with spectrally selective radiative cooling characteristics and an internal microchannel structure 232. This microchannel structure employs a jet-enhanced manifold design, formed on an aluminum alloy plate through precision machining. Key geometric parameters such as the width and depth of the microchannels 250 have been optimized to maximize heat transfer efficiency. Furthermore, the selection of the heat transfer medium is also crucial, requiring low freezing point and high boiling point characteristics, as well as excellent electrical insulation and chemical stability, such as FC-72 perfluorocarbon liquid. This helps ensure stable operation of the system even in extreme space environments.

[0039] In summary, through a series of innovative designs, including precisely controlled first-to-second-surface area ratio, the application of high-efficiency thermal insulation materials, and advanced microfluidic structure design, this system achieves a lightweight, highly integrated power generation and heat dissipation solution, making it particularly suitable for meeting the needs of the high-power computing satellite 100. These features work together to enable the satellite to effectively manage its heat emissions while maintaining efficient energy harvesting, significantly improving the system's reliability and performance.

[0040] In one embodiment, the photovoltaic power generation unit 220220 described above is constructed using high-efficiency triple-junction gallium arsenide solar cells. This material is widely used in space environments due to its superior photoelectric conversion efficiency. Each cell is 40mm × 80mm in size, with a conversion efficiency of approximately 30%, meaning that under AMO spectral conditions (i.e., the intensity of solar radiation outside the Earth's atmosphere), the power density is approximately 300W / m². To ensure the stable and efficient operation of the entire photovoltaic power generation unit 220, these cells are interconnected via interconnects to form a complete circuit system. This not only optimizes the energy harvesting process but also improves the system's reliability and stability, enabling the satellite to effectively convert solar energy into electrical energy in the space environment for use by various loads. This design fully considers the performance and reliability requirements of space applications, ensuring stable power support even under extreme conditions.

[0041] In one embodiment, the outer surface 231 of the active radiation cooling unit 230 is a spectrally selective radiation cooling coating with a reflectivity ≥95% and an absorptivity ≤5% in the solar spectrum band of 0.2-2.5μm; and an emissivity ≥95% in the infrared thermal radiation band of 8-13μm.

[0042] In one embodiment, the outer surface 231 of the active radiation cooling unit 230 is a multilayer thin film interference structure or a multi-scale micro-nano porous alumina coating. The multilayer thin film interference structure includes alternating SiO2 and Si3N4 layers; the multi-scale micro-nano porous alumina coating has a multi-level pore structure with a pore size distribution of 50nm-5μm on the surface.

[0043] Specifically, the outer surface 231231 of the active radiative cooling unit 230230 employs a spectrally selective radiative cooling coating. This coating is specifically designed for the solar spectral band (0.2-2.5 μm) and the infrared thermal radiation band (8-13 μm) to achieve efficient solar energy reflection and heat dissipation.

[0044] Specifically, the coating exhibits ≥95% reflectivity and ≤5% absorptivity in the solar spectrum (0.2-2.5μm). This means that over 95% of solar radiation can be effectively reflected back, while less than 5% of the energy is absorbed, significantly reducing the panel's own heat absorption and helping to maintain a low operating temperature. This high reflectivity is crucial for ensuring the panel remains at a low temperature even under direct sunlight.

[0045] Meanwhile, the emissivity of the coating reaches ≥95% in the infrared thermal radiation band (8-13μm). This characteristic allows the material to dissipate internally generated heat in the form of infrared radiation very effectively, especially within the Earth's atmospheric window band. This allows heat to escape directly into the cold outer space, thus achieving a highly efficient passive cooling effect.

[0046] To achieve these superior optical properties, the spectrally selectively radiatively cooled coating is typically fabricated as a multilayer thin-film interference structure consisting of alternating layers of SiO2 (silicon dioxide) and Si3N4 (silicon nitride). By precisely controlling the thickness of each layer, the optical properties of the material, such as reflectivity and emissivity, can be tuned within specific wavelength ranges to meet the aforementioned requirements. Alternatively, multi-scale micro / nanoporous alumina coatings can also be used. These coatings are prepared by anodic oxidation of high-purity aluminum foil or by a sol-gel method combined with phase separation. Their microstructure features include hierarchical pores ranging from 50 nm to 5 μm, which not only enhance the scattering of the solar spectrum (i.e., increase reflectivity) but also improve the absorption / emission efficiency in the mid-infrared band.

[0047] Specifically, the outer surface 231 employs a multilayer thin-film interference structure, consisting of alternating layers of SiO2 and Si3N4, with a total thickness of approximately 1 μm. Spectroscopic measurements show that the coating exhibits an average reflectance of 0.95 (absorptivity 0.05) in the 0.2–2.5 μm wavelength range and an average emissivity of 0.97 in the 8–13 μm wavelength range. Based on thermal balance calculations, under conditions of a solar constant of 1360 W / m² and an absorptivity of 0.05, the equilibrium temperature of the radiative surface is approximately: Even under direct sunlight, the radiating surface can maintain a low temperature of -85°C, providing excellent cold-end conditions for efficient heat dissipation.

[0048] As an alternative to multilayer thin film structures, the spectrally selective radiation-cooling coating can be a multi-scale micro-nano porous alumina coating. This coating is formed by anodizing high-purity aluminum foil or by a sol-gel method combined with phase separation. The microstructure of the 500 μm coating is characterized by a multi-level distribution of pores with diameters ranging from 50 nm to 5 μm. Large pores provide strong scattering of the solar spectrum (reflectivity can reach above 0.95), while small pores and pore walls enhance absorption in the mid-infrared band (emissivity can reach 0.96). Compared to multilayer film structures, porous Al2O3 coatings exhibit stronger adhesion to the substrate, superior resistance to space environment aging, and lower preparation costs.

[0049] In summary, the design and application of this spectrally selective radiation-cooling coating enable the active radiation-cooling unit 230 to efficiently dissipate heat and maintain a low operating temperature even under intense solar radiation. Furthermore, its high-efficiency infrared emission capability ensures effective heat dissipation in all weather conditions, a crucial function for spacecraft, especially the high-power computing satellite 100. This technological advancement provides an innovative and effective solution to the heat dissipation problem of spacecraft without compromising the efficiency of the photovoltaic power generation unit 220, thus maximizing energy utilization.

[0050] In one embodiment, please refer to Figure 2 The aforementioned internal microchannel structure 232 includes several parallel microchannels 250, an inlet manifold 251, and an outlet manifold 252; wherein the width of the microchannels 250 is 30-100μm and the depth is 150-300μm. The inlet manifold 251 is connected to the microchannel 250 and is used to evenly distribute the heat transfer medium to each microchannel 250. The outlet manifold 252, which is connected to the microchannel 250, is used to collect the heat transfer medium flowing out from each microchannel 250.

[0051] In one embodiment, please refer to Figure 3 The aforementioned internal microchannel structure 232 is a jet-enhanced manifold microchannel 250 structure, wherein the inlet manifold 251 is provided with a jet nozzle 253, the diameter of which is 20-100μm; the jet-enhanced manifold microchannel 250 structure reduces the heat transfer temperature difference between the heat transfer medium and the radiating surface, thereby increasing the equivalent heat dissipation power density of the active radiative cooling unit 230 panel.

[0052] Specifically, these microchannels 250 have specific geometric parameters: a width of 30-100 μm and a depth of 150-300 μm. This design aims to optimize heat exchange efficiency while ensuring the mechanical stability of the structure. The inlet manifold 251 distributes the heat transfer medium evenly into each microchannel 250, ensuring that each microchannel 250 can effectively participate in the heat transfer process; while the outlet manifold 252 is responsible for collecting the heated heat transfer medium flowing out of each microchannel 250, so as to transport it to the heat dissipation unit or recycle it.

[0053] Furthermore, to improve heat exchange efficiency, the aforementioned internal microchannel structure 232 is designed as a jet-enhanced manifold microchannel 250 structure. In this structure, the inlet manifold 251 is equipped with jet nozzles 253, with diameters ranging from 20 to 100 μm. These jet nozzles 253 are designed to allow the heat transfer medium to directly impact the inner wall of the microchannel 250 at high speeds (e.g., 1-10 m / s), thereby effectively disrupting the thermal boundary layer and significantly improving the local heat transfer coefficient. In this way, the heat transfer temperature difference between the heat transfer medium and the radiating surface can be significantly reduced, thereby enabling the panel equivalent heat dissipation power density of the active radiative cooling unit 230 to reach 400 W / m² to 500 W / m². This design not only improves the overall cooling performance of the system but also ensures efficient heat dissipation even under extreme conditions, maintaining the system's operating temperature within an ideal range. Therefore, this jet-enhanced manifold microchannel 250 structure is crucial for improving the performance of the entire integrated power generation and active radiative cooling hybrid energy system.

[0054] In summary, the internal microchannel structure 232 is embedded within the second surface of the panel body 210 and is tightly fitted to the outer surface 231. In this embodiment, the internal microchannel structure 232 adopts a jet-enhanced manifold microchannel 250 design and is formed on an aluminum alloy plate through precision machining. Its key geometric parameters are as follows: Microchannel 250 width: 500μm; Microchannel 250 depth: 1000μm; Rib width: 500μm; Microchannel 250 length: Same as panel size, 2m in this embodiment; Inlet manifold 251 and outlet manifold 252: located at both ends of microchannel 250, with a width of 2mm and a depth of 1mm; Jet nozzle 253: 500μm in diameter, one nozzle per microchannel 250 inlet.

[0055] In one embodiment, please refer to Figure 1 The aforementioned closed-loop pump-driven heat transfer circuit 300 is filled with FC-72 perfluorocarbon liquid as the heat transfer medium; the heat transfer medium is a dielectric coolant with a freezing point below -50°C and a boiling point above 100°C. It has a specific heat capacity of 1100 J / kg·K and excellent electrical insulation properties. The micro-mechanical pump 320 is an aerospace-grade brushless DC centrifugal pump with a rated flow rate of 0.5 L / min, a head of 50 kPa, and a power consumption of 3 W.

[0056] In this embodiment, the closed-loop pump-driven heat transfer circuit 300300 is filled with FC-72 perfluorocarbon liquid as the heat transfer medium. This heat transfer medium is a dielectric coolant with the following excellent properties: Low freezing point: Its freezing point is below -50°C, which allows it to remain liquid in extreme low-temperature environments, avoiding the risk of system failure due to coolant freezing.

[0057] High boiling point: Boiling point above 100°C ensures that the system will not boil or evaporate in high-temperature environments, maintaining stable operation.

[0058] High specific heat capacity: The specific heat capacity is 1100 J / kg·K, which indicates that this medium can absorb a large amount of heat while its own temperature does not change much, making it very suitable for applications requiring efficient heat dissipation.

[0059] Excellent electrical insulation: As a dielectric coolant, FC-72 has excellent electrical insulation properties, allowing it to safely contact electronic components without causing short circuits or other electrical faults.

[0060] In addition, the closed-loop pump-driven heat transfer circuit 300 also includes a miniature mechanical pump 320, with the following specific parameters: Type: It adopts an aerospace-grade brushless DC centrifugal pump. This pump is designed specifically for space applications and features high reliability and long service life.

[0061] Rated flow rate: 0.5 liters / minute (L / min), ensuring sufficient flow rate to quickly remove the heat generated by the heating electronic component 160.

[0062] Head: 50 kPa, indicating that the pump can overcome certain resistance to deliver coolant to the entire circuit, including the internal microchannel structure 232.

[0063] Power consumption: With a power consumption of only 3 watts (W), it is a very important consideration for energy-sensitive satellite systems.

[0064] By using this specific type of heat transfer medium and a highly efficient micro-mechanical pump 320, the present invention achieves effective heat dissipation for the heat-generating electronic components 160 and ensures the reliability and stability of the entire system. Particularly in space environments, this design takes into account extreme temperature conditions and the physicochemical properties of the materials, thereby ensuring optimal performance of the integrated power generation and active radiative cooling hybrid energy system.

[0065] The entire system works as follows: When in orbit, the first surface of the integrated functional panel 120 faces the sun, and the photovoltaic power generation unit 220 uses high-efficiency triple-junction gallium arsenide solar cells to convert solar energy into electrical energy to power various systems on the satellite. This includes heat-generating electronic components 160, such as NPU chips and GPU chips, which generate a large amount of waste heat when performing high-speed computing tasks, with a heat flux density of 200-300 W / cm².

[0066] To effectively dissipate heat, the heat transfer medium (FC-72 perfluorocarbon liquid in this embodiment) in the closed-loop pump-driven heat transfer circuit 300 flows through a cold plate (not shown in the figure) mounted on the surface of the heat-generating electronic component 160, driven by a micro-mechanical pump 320, and its temperature rises to approximately 50°C after absorbing heat. This highly efficient heat transfer medium has a low freezing point, a high boiling point, and excellent electrical insulation properties, making it ideal for space applications requiring high reliability and stability.

[0067] Next, the high-temperature working fluid flows into the inlet manifold 251 of the active radiative cooling unit 230 through pipe 330, and is then injected into the microchannel 250 at a high speed of 3-5 m / s through jet nozzle 253. The jet impact effectively disrupts the thermal boundary layer, resulting in a convective heat transfer coefficient of over 50,000 W / m²·K, which greatly improves the heat transfer efficiency.

[0068] Heat is then conducted through the walls of the microchannel 250 to the spectrally selectively radiatively cooled outer surface 231. This outer surface 231 employs a multilayer thin-film interference structure design, consisting of alternating layers of SiO2 and Si3N4, exhibiting an infrared emissivity as high as 0.95. Its spectrally selective design enables it to maintain low temperatures under direct solar radiation (theoretical calculations show that, with a solar constant of 1360 W / m², its equilibrium temperature can be as low as -85°C). Therefore, heat can be efficiently dissipated into the deep space background near absolute zero (approximately 3 K) in the form of thermal radiation.

[0069] According to the Stefan-Boltzmann law, the net heat dissipation power density can be expressed as: ;in: (Infrared emissivity); (Stefant-Boltzmann constant); The radiant surface temperature (K); (Solar absorptivity); (Solar constant); Assume the working temperature of the radiating surface Calculate two operating conditions: Operating Condition 1: Radiation surface facing away from the sun (no sunlight exposure) ): ; Operating Condition 2: The radiating surface faces the sun (is exposed to sunlight). ): ; This means that, under the condition that the working temperature of the radiating surface is 45°C, the heat dissipation power density can reach about 500 W / m², whether facing away from or towards the sun, ensuring efficient heat dissipation.

[0070] Specifically, under the condition of a radiating surface operating temperature of 45°C, the heat dissipation power density is 550 W / m² when facing away from the sun and 482 W / m² when facing the sun. Both are within the range of 480-550 W / m². Considering the average operating conditions during the actual orbital period, the equivalent heat dissipation power density of the active radiative cooling unit 230 and the integrated functional panel 120 in this embodiment can stably reach about 500 W / m².

[0071] Finally, the cooled working fluid converges to the outlet manifold 252 and flows back to the chip-side cold plate through the pipe 330, completing the entire cycle.

[0072] It is worth noting that, such as Figure 3 As shown, within the typical spacecraft operating temperature range of 0°C to +50°C, the ratio of the power generation density curve 410 of the photovoltaic power generation unit 220220 to the heat dissipation power density curve 420 of the active radiative cooling unit 230230 remains between 0.6 and 1.0. This characteristic ensures that the ratio of the first surface area to the second surface area of ​​the integrated functional panel 120120 can be designed to be approximately 1:1, thereby achieving a synergistic match between power supply and heat dissipation capabilities and solving the power supply and heat dissipation imbalance problem that may occur in traditional designs.

[0073] In summary, the system of this embodiment aims to solve the problems of current spacecraft power generation and thermal control systems being independent, bulky, space-consuming, and unable to meet the heat dissipation requirements of high-power computing satellite 100. It provides a lightweight, high-efficiency, integrated power generation and active radiative cooling composite energy system that enables synergistic growth in power generation and heat dissipation capabilities. Compared to existing technologies, the system of this embodiment has the following significant advantages: By integrating the photovoltaic power generation unit 220 and the active radiative cooling unit 230 onto the same panel and sharing a support structure, the number of spacecraft components, total weight, and complexity are significantly reduced. Taking a typical 10kW-class computing satellite as an example, compared to traditional separate designs, the system provided in this embodiment can reduce the weight of the thermal management system by approximately 55%-65%, correspondingly lowering launch costs. This highly integrated design not only reduces the overall burden on the spacecraft but also simplifies the installation process and improves overall reliability.

[0074] Based on the principle that power generation density and heat dissipation power density are similar, the integrated panel in this embodiment achieves a natural match between power supply area and heat dissipation area. When computing tasks increase, leading to increased power consumption, the same panel can provide more power support while simultaneously enhancing heat dissipation performance. This fundamentally solves the problem of mismatch between power supply capacity and heat dissipation capacity in traditional designs, ensuring stable operation in high-performance computing scenarios.

[0075] By introducing an intermediate heat-insulating layer (with a heat transfer coefficient ≤0.01 W / m·K), this embodiment effectively isolates the impact of the high temperature of the photovoltaic panel on the active radiative cooling unit 230. Simulation results show that even if the temperature of the first surface reaches 100°C, the temperature rise of the second surface will not exceed 5°C, thus ensuring that the cooling unit is always in optimal operating condition. This characteristic is crucial for maintaining the efficient operation of the system.

[0076] This embodiment employs a spectrally selective radiation-cooling coating with ≥95% solar reflectivity and ≥95% infrared emissivity. Even under direct sunlight, it maintains a low operating temperature, achieving uninterrupted heat dissipation for 24 hours. Theoretical calculations show that, with a solar constant of 1360 W / m², the equilibrium temperature of the radiating surface can be as low as -30°C, demonstrating the system's excellent performance under extreme environmental conditions.

[0077] By utilizing the jet-enhanced manifold microchannel 250 structure, this embodiment controls the heat exchange temperature difference between the working fluid and the radiating surface to within 5°C, enabling the active radiative cooling unit 230 to achieve an equivalent heat dissipation power density of 400-500 W / m², which is 60%-100% higher than that of traditional radiators (approximately 300 W / m²). This improvement significantly enhances the system's heat dissipation efficiency and ensures the safe operation of the equipment.

[0078] The integrated design of this embodiment eliminates the need for complex fluid rotary joints and deployable heat pipes, allowing heat from inside the satellite body 110 to be transferred directly and efficiently to the external radiating surface, thereby enhancing the system's reliability and robustness. This design not only simplifies the spacecraft's internal layout but also reduces maintenance costs and extends its service life.

[0079] In summary, the integrated power generation and active radiative cooling composite energy system proposed in this embodiment has successfully overcome many shortcomings of the existing technology through a series of innovative designs, providing a more optimized solution that is suitable for the development needs of future high-performance computing satellites.

[0080] The aforementioned integrated power generation and radiative cooling system for high-power computing satellites integrates a photovoltaic power generation unit 220 and an active radiative cooling unit 230 onto the same panel. A highly efficient heat-insulating panel body 210 blocks heat conduction, ensuring that the two functional units do not interfere with each other, while also achieving a lightweight structure. The photovoltaic power generation unit 220 is located on the first surface of the panel, effectively capturing solar energy and converting it into electrical energy to power the satellite. The active radiative cooling unit 230 is located on the second surface; its unique spectrally selective radiative cooling outer surface 231 maintains a low temperature even under direct sunlight, while its internal microfluidic structure 232 absorbs heat directly from the satellite's heat-generating electronic components 160 through a closed-loop pump-driven heat transfer circuit 300 and efficiently dissipates it into deep space. This design not only significantly improves the satellite's heat dissipation efficiency but also optimizes power generation performance, enabling synergistic growth in power supply and heat dissipation during high-power computing tasks. This achieves integrated thermoelectric management of the high-performance computing satellite platform, significantly improving the overall system's reliability and efficiency. This innovative solution fundamentally solves the problem of imbalance between power supply and heat dissipation capabilities in traditional designs, providing strong support for high-performance satellites.

[0081] In one embodiment, please refer to Figure 1 The aforementioned high-power computing satellite 100 includes a satellite body 110 and an integrated power generation and radiation cooling system for the high-power computing satellite. The integrated functional panel 120 is connected to the satellite body 110, and the closed-loop pump-driven heat transfer circuit 300 is connected to the heat-generating electronic components 160 inside the satellite body 110.

[0082] In this embodiment, the high-power computing satellite 100 includes a satellite body 110 and at least one integrated power generation and active radiative cooling composite energy system. This design aims to provide a lightweight and high-efficiency energy solution for the high-performance computing satellite body 110 while meeting heat dissipation requirements.

[0083] The satellite body 110 is the core structure of the entire satellite body, housing all necessary electronic components and equipment, including but not limited to heat-generating electronic components 160 such as the NPU chip for AI inference and the GPU chip for image processing. These components generate a large amount of waste heat during operation, requiring an effective cooling mechanism to maintain their normal operating temperature.

[0084] In this embodiment, the integrated functional panel 120 is fixed to the satellite body 110 via a mechanical and fluid connection mechanism, ensuring structural stability and sealing. The closed-loop pump-driven heat transfer circuit 300 is directly connected to the heat-generating electronic components 160 inside the satellite body 110, forming a closed cooling cycle. This design not only reduces the complexity and weight of the spacecraft but also improves the overall system reliability and efficiency.

[0085] In summary, this integrated power generation and active radiative cooling composite energy system, through innovative design and material application, significantly improves the energy utilization efficiency and thermal management capabilities of the high-power computing satellite 100, representing a cutting-edge and practical technical solution.

[0086] It should be noted that those skilled in the art will clearly understand that the specific implementation process of the integrated power generation and radiation cooling system for a high-power computing satellite mentioned in this embodiment can be referred to the corresponding description in the above embodiment of the integrated power generation and radiation cooling system for a high-power computing satellite. For the sake of convenience and brevity, it will not be repeated here.

[0087] The above description is merely a specific embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in the present invention, and these modifications or substitutions should all be covered within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. An integrated power generation and radiative cooling system for high-power computing satellites, characterized in that, The system includes an integrated functional panel, a photovoltaic power generation unit, an active radiative cooling unit, and a closed-loop pump-driven heat transfer circuit. The integrated functional panel includes a panel body with opposing first and second surfaces, the panel body blocking heat conduction between the first and second surfaces. The photovoltaic power generation unit is disposed on the first surface, and the active radiative cooling unit is disposed on the second surface. The active radiation cooling unit has an outer surface with spectrally selective radiation cooling characteristics, and the active radiation cooling unit includes an internal microchannel structure thermally coupled to the outer surface; The closed-loop pump-driven heat transfer circuit connects the heat-generating electronic components inside the satellite body with the internal microfluidic structure, transferring heat from the heat-generating electronic components to the active radiative cooling unit, and dissipating it through the outer surface in the form of thermal radiation.

2. The integrated power generation and radiative cooling system for a high-power computing satellite according to claim 1, characterized in that, The area ratio of the first surface to the second surface is 0.8:1 to 1.2:

1.

3. The integrated power generation and radiative cooling system for a high-power computing satellite according to claim 2, characterized in that, The panel body is a heat insulation structure layer with a heat transfer coefficient of no more than 0.01 W / m·K.

4. The integrated power generation and radiative cooling system for a high-power computing satellite according to claim 3, characterized in that, The panel body adopts an aerogel-reinforced honeycomb sandwich structure, with the core layer filled with nanoporous silica aerogel and a thickness of 5mm.

5. The integrated power generation and radiative cooling system for a high-power computing satellite according to claim 1, characterized in that, The outer surface of the active radiation cooling unit is a spectrally selective radiation cooling coating with a reflectivity ≥95% and an absorptivity ≤5% in the solar spectrum band of 0.2-2.5μm; and an emissivity ≥95% in the infrared thermal radiation band of 8-13μm.

6. The integrated power generation and radiative cooling system for a high-power computing satellite according to claim 5, characterized in that, The outer surface of the active radiation cooling unit is a multilayer thin film interference structure or a multi-scale micro-nano porous alumina coating. The multilayer thin film interference structure includes alternating SiO2 and Si3N4 layers. The multi-scale micro-nano porous alumina coating has a multi-level pore structure with a pore size distribution of 50nm-5μm on the surface.

7. The integrated power generation and radiative cooling system for a high-power computing satellite according to claim 1, characterized in that, The internal microchannel structure includes several parallel microchannels, an inlet manifold, and an outlet manifold; wherein the width of the microchannel is 30-100μm and the depth is 150-300μm. The inlet manifold is connected to the microchannel and is used to evenly distribute the heat transfer medium to each of the microchannels. The outlet manifold, which is connected to the microchannel, is used to collect the heat transfer fluid flowing out from each of the microchannels.

8. The integrated power generation and radiative cooling system for a high-power computing satellite according to claim 7, characterized in that, The internal microchannel structure is a jet-enhanced manifold microchannel structure, wherein the inlet manifold is provided with a jet nozzle, the diameter of which is 20-100μm; the jet-enhanced manifold microchannel structure reduces the heat transfer temperature difference between the heat transfer medium and the radiating surface, thereby increasing the equivalent heat dissipation power density of the panel of the active radiative cooling unit.

9. The integrated power generation and radiative cooling system for a high-power computing satellite according to claim 1, characterized in that, The closed-loop pump-driven heat transfer circuit is filled with FC-72 perfluorocarbon liquid as the heat transfer medium; the heat transfer medium is a dielectric coolant with a freezing point below -50°C and a boiling point above 100°C.

10. A high-power computing satellite, characterized in that: It includes the satellite body and an integrated power generation and radiation cooling system for a high-power computing satellite as described in any one of claims 1 to 9.

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