Control method and device of load simulation device for cabinet soft start test

Abstract

This invention relates to a control method and apparatus for a load simulation device used in rack soft-start testing, relating to the field of soft-start testing. The method includes: selecting a load level for the load simulation device according to a simulation level scheme and recording the currently selected load power; real-time acquisition of component temperature values ​​inside the load simulation device; calculating temperature drift information based on the component temperature values ​​and a reference operating temperature range; matching load deviation information with the temperature drift information and correcting the currently selected load power to obtain the operating load power, and outputting the operating load power on a control panel; matching a temperature control adjustment scheme based on the positive and negative relationship of the temperature drift information, and adjusting the component temperature values ​​according to the temperature control adjustment scheme; when the operating load power displayed on the control panel matches the currently selected load power, stopping the temperature control adjustment of the load simulation device and entering a test waiting state. This application has the effect of eliminating the influence of temperature to ensure the output stability of the load simulation device.

Description

Technical Field

[0001] This invention relates to the field of soft-start testing, and more particularly to a control method and apparatus for a load simulation device used for cabinet soft-start testing. Background Technology

[0002] Soft start testing is a critical testing step before the cabinet leaves the factory and during operation and maintenance. By simulating the real scenario of the cabinet starting under load, it verifies the adaptability, shock resistance and stability of operating parameters of components such as power supply modules, heat dissipation systems and wiring connections in the cabinet during the startup phase.

[0003] In rack soft-start testing, the load simulation device is one of the core testing equipment. Its function is to simulate the various load characteristics that the rack bears during actual operation. By outputting specific power, voltage, current, and other parameters, it reproduces the load conditions during the rack soft-start phase. In actual testing scenarios, the electrical characteristics of the core power output components of the load simulation device are easily affected by changes in ambient temperature and its own operating temperature.

[0004] Because existing control methods do not consider the impact of temperature on the output characteristics of the load simulation device, and start the test directly after setting the basic parameters before testing, a deviation occurs between the actual output power of the load simulation device and the preset power. This power deviation leads to inconsistencies between the load conditions on which the cabinet soft-start test is based and the preset conditions, affecting the judgment of key performance indicators such as the stability of the cabinet soft-start current and the output regulation capability of the power supply module. Summary of the Invention

[0005] To eliminate the effects of temperature and ensure the output stability of the load simulation device, this invention provides a control method and apparatus for a load simulation device used for rack soft-start testing.

[0006] In a first aspect, the present invention provides a control method for a load simulation device for rack soft-start testing, employing the following technical solution:

[0007] A control method for a load simulation device used for rack soft-start testing includes:

[0008] When the load simulation device is not powered on, the load simulation device is selected according to the preset simulation range scheme, and the currently selected load power is recorded.

[0009] Real-time acquisition of component temperature values ​​inside the load simulation device;

[0010] When the component temperature exceeds the preset reference operating temperature range, temperature drift information is calculated based on the component temperature and the reference operating temperature range.

[0011] The operating load power is obtained by matching the temperature drift information with the load deviation information and correcting the power of the currently selected load based on the load deviation information. The operating load power is then output on the control panel.

[0012] The temperature control adjustment scheme is matched according to the positive and negative relationship of the temperature drift information, and the temperature value of the components is adjusted according to the temperature control adjustment scheme;

[0013] When the operating load power displayed on the control panel matches the currently selected load power, the temperature control adjustment of the load simulation device stops, and the device enters the test waiting state.

[0014] By adopting the above technical solution, before performing a soft-start test when the load simulation device is not powered on, the temperature of the internal switching power supply of the load simulation device is collected to determine whether there is a temperature deviation in the switching power supply. This determines whether the actual output power of the load simulation device is consistent with the set power of the currently selected load. If there is a discrepancy, the system adjusts the temperature control of the switching power supply. Only when the operating load power displayed on the control panel matches the currently selected load power is the load simulation device allowed to connect to the rack and perform a soft-start test on the rack. This method can eliminate the influence of temperature, thereby ensuring the output stability of the load simulation device.

[0015] Optional temperature control adjustment schemes include:

[0016] When the temperature drift information is negative, temperature control is performed to control the components to start at the preset minimum power state;

[0017] The minimum power state is continuously corrected at a preset power increase rate to control the operating power of the components to increase from the minimum power state to the preset full power state and maintain it at the full power state;

[0018] Record the temperature values ​​of the components;

[0019] When the component temperature enters the reference operating temperature range, the temperature control stops.

[0020] Optional, also includes:

[0021] Acquire array status images of components inside the load simulation device;

[0022] The spacing between components is identified based on the array status image;

[0023] The component array type is determined based on the component spacing.

[0024] When the component array type is inconsistent with the preset zero-pitch contact type, the drive mechanism preset in the load simulation device is controlled according to the component spacing to adjust the component spacing to the zero-pitch contact type.

[0025] Optional, also includes:

[0026] The components of the array are grouped, with the intervening components labeled as the first component group and the remaining components labeled as the second component group.

[0027] In the zero-pitch contact type, the second component group is turned off and the first component group is turned on. The operating power of the first component group is gradually increased to full power, and the temperature of the first component group is collected in real time.

[0028] Set the half-rise temperature value based on temperature drift information and component temperature values;

[0029] When the temperature of the first component group reaches the half-heating temperature value, the first component group is turned off and the second component group is turned on. The operating power of the second component group is gradually increased to the full power state, and the temperature of the second component group is collected in real time.

[0030] When the temperature of the second component group is the same as that of the first component group, the second component group and the first component group are turned on simultaneously until the temperatures of the first component group and the second component group both enter the reference operating temperature range.

[0031] Optional temperature control adjustment solutions also include:

[0032] When the temperature drift information is positive, cooling control is performed, and the ambient temperature value of the load simulation device is collected.

[0033] When the ambient temperature is not greater than the reference operating temperature range, the control components remain in the off state;

[0034] The components are cooled by blowing air at the preset maximum blowing power;

[0035] Record the temperature values ​​of the components;

[0036] When the component temperature drops to the reference operating temperature range, the cooling control stops.

[0037] Optional methods for cooling with airflow include:

[0038] Acquire images of the internal components of the load simulation device;

[0039] The type of heat dissipation airflow direction is determined based on the image recognition inside the load simulation device. The types of heat dissipation airflow direction include forward airflow and side airflow.

[0040] Based on the forward airflow, the distributable range is determined according to the internal image of the load simulation device;

[0041] Based on the distributable range and the preset number of components, and based on the maximum spacing rule, the components are arranged to obtain the distribution position points of each component under the maximum spacing condition.

[0042] The drive mechanism is controlled according to the distribution location points to move the components to the corresponding distribution location points.

[0043] Optional, also includes:

[0044] Based on lateral airflow, the internal height and width ranges of the device are determined according to the internal images of the load simulation device.

[0045] The minimum overlap ratio of lateral projection is determined based on the internal height range of the device, the preset height of a single component, and the number of components.

[0046] The number of distribution columns is determined based on the number of components;

[0047] The maximum horizontal distribution distance between two adjacent components in the lateral projection direction is determined based on the number of distribution columns and the internal width range of the device.

[0048] The distribution location of each component is determined according to the minimum overlap ratio of lateral projection and the maximum horizontal distribution distance;

[0049] The drive mechanism is controlled according to the distribution location points to move the components to the corresponding distribution location points.

[0050] Optional temperature control adjustment schemes when the ambient temperature exceeds the reference operating temperature range include:

[0051] When the ambient temperature is greater than the reference operating temperature range, the blower power is matched based on the component temperature and the ambient temperature.

[0052] The component is blown with the appropriate power, and it is determined whether the component temperature value has entered the redundancy range of the ambient temperature value.

[0053] When the component temperature value enters the redundant range of the ambient temperature value, it enters the analog power mode and matches the conversion ratio according to the difference between the component temperature value and the reference operating temperature range.

[0054] The simulated load power is determined based on the conversion ratio and the currently selected load power.

[0055] Replace the currently selected load power with the simulated load power, and output the simulated load power.

[0056] Optional, also includes:

[0057] When the load simulation device is not powered on, determine whether the temperature value of the components falls within the reference operating temperature range;

[0058] When the temperature of a component exceeds the upper limit of the reference operating temperature range, the load simulation device is switched to the no-load position and a no-load prompt is displayed.

[0059] When the load simulation device is powered on, the error ratio is determined based on the operating load power and the currently selected load power.

[0060] When the error ratio is less than the preset baseline available ratio, the load simulation device is switched to the load level and a load standby prompt is displayed.

[0061] Secondly, this application provides a load simulation device for rack soft-start testing, which adopts the following technical solution:

[0062] A load simulation device for rack soft-start testing is controlled by a control method for a load simulation device for rack soft-start testing. The device includes a cabinet with an internal array of switching power supplies, a range switch and a power interface on the surface of the cabinet; the range switch and the power interface are each electrically connected to the switching power supply.

[0063] In summary, this application includes at least one of the following beneficial technical effects:

[0064] Before performing a soft-start test on the load simulation device when it is not powered on, the temperature of the internal switching power supply of the load simulation device is collected to determine if there is any temperature deviation. This determines whether the actual output power of the load simulation device matches the set power of the currently selected load. If they do not match, the system adjusts the temperature of the switching power supply. Only when the operating load power displayed on the control panel matches the currently selected load power is the load simulation device allowed to connect to the cabinet and the cabinet subjected to a soft-start test. This method can eliminate the influence of temperature, thereby ensuring the output stability of the load simulation device.

[0065] When regulating the temperature rise, the switching power supplies in the load simulation device are rearranged by the drive mechanism, so that all the switching power supplies are gathered together, which causes heat to accumulate and thus accelerates the temperature rise of the switching power supplies.

[0066] When performing cooling regulation, the switching power supplies are rearranged according to the different layout positions of the cooling fans, so that the distance between adjacent switching power supplies is maximized and the cooling fans can blow air on each switching power supply, so that the switching power supplies can be cooled down quickly. Attached Figure Description

[0067] Figure 1 This is a schematic diagram of the overall structure of the load simulation device for rack soft-start testing according to an embodiment of the present invention;

[0068] Figure 2 This is a flowchart of a method for controlling a load simulation device for rack soft-start testing according to an embodiment of the present invention;

[0069] Figure 3 This is the method flow of the air-blowing cooling method according to an embodiment of the present invention. Figure 1 ;

[0070] Figure 4 This is the method flow of the air-blowing cooling method according to an embodiment of the present invention. Figure 2 .

[0071] The parts referred to by the numbers in the above attached diagrams are as follows: 1. Cabinet; 2. Gear switch; 3. Power interface; 4. Control panel. Detailed Implementation

[0072] To make the objectives, technical solutions, and advantages of this invention clearer, the invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the invention.

[0073] This application discloses a load simulation device for rack soft-start testing.

[0074] Reference Figure 1 The load simulation device includes a cabinet 1, a position switch 2, and a power interface 3. An array of switching power supplies is installed inside the cabinet 1, and these power supplies can be used as a load. The cabinet 1 has a control panel 4, on which both the position switch 2 and the power interface 3 are located. Each position switch 2 corresponds to and is electrically connected to a switching power supply, used to adjust the output power of the switching power supply. Each power interface 3 corresponds to and is electrically connected to a switching power supply, used to connect the switching power supply to an external cabinet via wiring to provide power.

[0075] After the power interface 3 of the load simulation device is connected to the external cabinet via a wire, the power of the switching power supply is selected by the gear switch 2, and then the cabinet is soft-started. At this time, the load simulation device can be powered to perform a soft-start test on the cabinet.

[0076] In this embodiment, the position of the switching power supply inside the cabinet 1 can be adjusted by a drive mechanism according to actual needs, and the cabinet 1 also integrates a cooling fan for blowing air to dissipate heat from the switching power supply.

[0077] Based on the same inventive concept, embodiments of the present invention provide a control method for a load simulation device for cabinet soft-start testing.

[0078] Reference Figure 2 A control method for a load simulation device used for rack soft-start testing includes the following steps:

[0079] Step S1: When the load simulation device is not powered on, select the load simulation device according to the preset simulation range scheme and record the currently selected load power.

[0080] The load simulation device here is not powered on when it is not connected to the external cabinet. The load simulation device has its own small power supply, which can power the system to run and allow the sensors to collect parameters, but it cannot be used to power the switching power supply. The switching power supply needs to be powered through the cabinet.

[0081] The simulation gear scheme is a set of gears required by the load simulation device, which is pre-defined by the technicians according to the test needs. The gears of the device need to be adjusted before the load simulation device is powered on.

[0082] The currently selected load power refers to the total power of all switching power supplies within the load simulation device after the load selection is completed. The currently selected load power is acquired by the load simulation device's system.

[0083] Step S2: Real-time acquisition of the temperature values ​​of the components inside the load simulation device.

[0084] The component mentioned here is a switching power supply. All components mentioned later are switching power supplies and will not be described in detail here.

[0085] The component temperature value refers to the surface temperature of the switching power supply inside the load simulation device. Temperature sensors are installed on the surface of the switching power supply to collect its temperature value.

[0086] Temperature data acquisition of the switching power supply can be performed either when the load simulation device is first started or when it is restarted midway through operation.

[0087] Step S3: When the component temperature value exceeds the preset reference operating temperature range, calculate the temperature drift information based on the component temperature value and the reference operating temperature range.

[0088] The reference operating temperature range is the temperature at which the switching power supply can operate at rated power, as determined by technicians through testing. When the temperature of the switching power supply exceeds the upper limit of the reference operating temperature range (i.e., the temperature is too high), the internal resistance of the switching power supply increases, the capacitance of the input filter capacitor increases, and the actual operating power will be less than the rated power, resulting in an increased inrush current. Conversely, if the temperature of the switching power supply is below the lower limit of the reference operating temperature range (i.e., the temperature is too low), the internal resistance of the switching power supply decreases, the capacitance of the input filter capacitor decreases, and the actual operating power will be greater than the rated power, resulting in a decreased inrush current.

[0089] When the component temperature falls within the reference operating temperature range, there is no need to adjust the load simulation device, and the load simulation device can be directly used to perform soft start tests on the cabinet.

[0090] When the component temperature exceeds the reference operating temperature range, the accuracy of the soft-start test will be affected by the temperature factor, so the load simulation device needs to be adjusted.

[0091] Temperature drift information is the difference between the component temperature value and the reference operating temperature range, which is the deviation between the actual operating surface temperature of the switching power supply and the normal operating temperature.

[0092] Step S4: Match the load deviation information with the temperature drift information, and correct the currently selected load power based on the load deviation information to obtain the operating load power. Output the operating load power on the control panel 4.

[0093] Load deviation information indicates the deviation in output power when the switching power supply exhibits temperature deviation. Load deviation information is directly proportional to temperature drift information; the greater the temperature drift, the greater the load deviation.

[0094] The operating load power is the actual power of the switching power supply during operation due to temperature factors. The operating load power is the parameter obtained after correcting for load deviation information for the currently selected load power.

[0095] By displaying the operating load power on the control panel 4, operators can clearly determine the error between the actual operating power of the load simulation device and the selected power, thus facilitating adjustments.

[0096] Step S5: Match the temperature control adjustment scheme according to the positive and negative relationship of the temperature drift information, and adjust the component temperature value according to the temperature control adjustment scheme.

[0097] Due to the existence of errors, in order to better test the cabinet using the load simulation device, it is necessary to adjust the load simulation device before testing so that the power of the load simulation device can be restored to the power of normal operation, thus providing test accuracy.

[0098] The temperature control adjustment scheme is a method for adjusting the power of the load simulation device. It is mainly formulated based on the temperature of the load simulation device to determine whether cooling or heating is needed. A positive temperature drift indicates that the temperature of the switching power supply is too high, while a negative temperature drift indicates that the temperature of the switching power supply is too low.

[0099] After determining the actual power of the switching power supply, the load simulation device is connected to the cabinet for power supply, thereby enabling the load simulation device to operate and perform temperature control regulation on the switching power supply during operation.

[0100] Step S6: When the operating load power displayed on the control panel 4 is consistent with the currently selected load power, stop the temperature control adjustment of the load simulation device and enter the test waiting state.

[0101] After adjusting the temperature of the switching power supply in the load simulation device, the temperature deviation decreases, and correspondingly, the power deviation also decreases. When the operating load power matches the currently selected load power, it indicates that the component temperature values ​​of the switching power supply have returned to the reference operating temperature range. At this point, the load simulation device can be used to perform soft-start tests on the cabinet, and the load simulation device is in a test waiting state. Restarting the load simulation device and the cabinet at this time allows for a soft-start test.

[0102] The temperature control adjustment procedure includes the following steps:

[0103] Step S400: When the temperature drift information is negative, temperature control is performed to control the components to start at the preset minimum power state.

[0104] A negative temperature drift value indicates that the temperature of the switching power supply is too low, and the switch needs to be heated.

[0105] The minimum power state is the minimum power that the switching power supply can output as set by the technician.

[0106] To balance device safety, circuit stability, and lifespan, in this embodiment, the system controls the switching power supply to start up at minimum power.

[0107] Step S401: Continuously correct the minimum power state at a preset power increase rate to control the operating power of the components to increase from the minimum power state to the preset full power state and maintain it at the full power state.

[0108] The power increase rate is the amount of power increase of the switching power supply per unit time set by the technician. Full power state is the state in which the switching power supply outputs at its maximum output power.

[0109] When the switching power supply starts at minimum power, the system controls the switching power supply to gradually increase the output power until the switching power supply operates at full power.

[0110] Step S402: Record the component temperature values.

[0111] When the switching power supply is running, it will start to heat up. At this time, the temperature sensor collects and records the temperature values ​​of the components to facilitate temperature control.

[0112] Step S403: When the component temperature value enters the reference operating temperature range, stop the temperature rise control.

[0113] When the component temperature rises and enters the reference operating temperature range, it indicates that the switching power supply is in normal operation. At this point, temperature control can be stopped, and the device can be restarted for a soft start test.

[0114] The method of temperature control also includes the following steps:

[0115] Step S410: Acquire array status images of the components inside the load simulation device.

[0116] Array status images refer to images obtained by capturing images of the inside of the load simulation device through a camera installed inside the load simulation device. The images contain the characteristics of the switching power supply array installed inside the load simulation device and can be identified and analyzed by the system.

[0117] Step S411: Identify the component spacing based on the array status image.

[0118] Component spacing refers to the distance between adjacent switching power supplies. Component spacing can be obtained through image recognition analysis of the switching power supplies from an array status image. First, the image ratio of the camera image is determined based on the array status image and a pre-set reference point inside the load simulation device. Then, the distance between adjacent switching power supplies in the image is identified. Finally, combining these two methods yields the component spacing.

[0119] Step S412: Determine the component array type based on the component spacing.

[0120] The component array type refers to the type of array of switching power supplies within the load simulation device, mainly including distributed type and zero-pitch contact type. Distributed type means there are gaps between adjacent switching power supplies to facilitate heat dissipation. Zero-pitch contact type means the surfaces of adjacent switching power supplies are pressed together, with all the switching power supplies clustered together.

[0121] Step S413: When the component array type is inconsistent with the preset zero-pitch contact type, the drive mechanism preset in the load simulation device is controlled to adjust the component spacing to the zero-pitch contact type according to the component spacing.

[0122] If the component array type is consistent with the zero-pitch contact type, it means that the load simulation device has already adjusted the distribution of the switching power supply during the previous test, and no further adjustment is needed.

[0123] If the component array type is inconsistent with the zero-pitch contact type, the switching power supply should be adjusted to the zero-pitch contact type. In the zero-pitch contact type, all switching power supplies affect each other, and heat accumulates, causing the temperature to rise more rapidly.

[0124] This embodiment addresses the issue of low temperature and slow heating of the switching power supply, thereby accelerating the preheating process of the load simulation device and enabling soft-start testing in a shorter time.

[0125] In this embodiment, the inner wall of the load simulation device is equipped with slide rails in both the horizontal and vertical directions, and a drive mechanism is provided. All switching power supplies can be moved horizontally and vertically on the slide rails by the drive mechanism to adjust the array state.

[0126] The method of temperature control also includes the following steps:

[0127] Step S420: Group the components of the array, label the interleaved components as the first component group, and label the remaining components as the second component group.

[0128] In this embodiment, all switching power supplies are divided into two groups for separate control, including a first component group and a second component group. The rule for dividing the two groups is that the two groups of switching power supplies are interleaved, and there are no adjacent switching power supplies in any group.

[0129] Step S421: In the zero-pitch contact type, the second component group is turned off and the first component group is turned on. The operating power of the first component group is gradually increased to full power, and the temperature of the first component group is collected in real time.

[0130] The aforementioned independent control is performed under the zero-pitch contact type. The system first controls the switching power supply of the first component group to turn on and gradually increase it to full power. During this process, the heat generated by the switching power supply of the first component group can be synchronously transferred to the second component group, so that the surface temperature of the switching power supply of the second component group can rise.

[0131] During operation, the system collects the surface temperature value of the switching power supply of the first component group in real time through a temperature sensor. This temperature value is the temperature of the first component group.

[0132] Step S422: Set the half-heating temperature value based on the temperature drift information and component temperature values.

[0133] In this embodiment, control switching is performed after the temperature of the first component group reaches a certain temperature; this temperature is the half-rise temperature value. The half-rise temperature value is determined based on temperature drift information and component temperature values. The component temperature value is the starting temperature, the temperature drift information is the total temperature that needs to be increased, and the half-rise temperature value is the increase in temperature by half.

[0134] Step S423: When the temperature of the first component group reaches the half-heating temperature value, the first component group is turned off and the second component group is turned on. The operating power of the second component group is gradually increased to the full power state, and the temperature of the second component group is collected in real time.

[0135] After the temperature of the first component group reaches the half-heating temperature value, the system controls the switching power supply of the first component group to turn off, and then turns on the switching power supply of the second component group. At this time, the second component group can operate and generate heat, and transfer the temperature to the first component group. The system also measures the temperature of the second component group in real time.

[0136] During this process, the temperatures of the first component group and the second component group can rise synchronously.

[0137] Step S424: When the temperature of the second component group is the same as that of the first component group, turn on the second component group and the first component group simultaneously until the temperatures of the first component group and the second component group both enter the reference operating temperature range.

[0138] After the above steps, when the temperature of the second component group is the same as that of the first component group, in order to ensure that both can reach the reference operating temperature range at the same time, the system will turn on both the second component group and the first component group.

[0139] The temperature control adjustment scheme also includes the following steps:

[0140] Step S430: When the temperature drift information is positive, perform cooling control and collect the ambient temperature value of the load simulation device.

[0141] Conversely to step S400, when the temperature drift information is positive, it indicates that the temperature of the switching power supply is too high, and the switching power supply needs to be cooled down.

[0142] The ambient temperature value refers to the temperature of the environment in which the load simulation device is located. The ambient temperature value is measured by a thermometer placed on the surface of the load simulation device. The ambient temperature value determines the lowest temperature that the switching power supply can reach through air cooling; that is, after the switching power supply is cooled by air cooling, its final temperature will approach the ambient temperature value.

[0143] Comparing the ambient temperature value with the reference operating temperature range, two situations will occur due to the influence of ambient temperature: one situation can be cooled by air cooling, and the other cannot be directly cooled by air cooling.

[0144] A positive temperature drift value usually occurs when the load simulation device has been tested and the switching power supply has been running for a period of time. At this time, the temperature of the switching power supply is high, and it needs to be readjusted before the next round of soft-start test.

[0145] Step S431: When the ambient temperature is not greater than the reference operating temperature range, the control components remain in the off state.

[0146] When the ambient temperature is not greater than the reference operating temperature range, in this embodiment, since the ambient temperature is lower than the reference operating temperature range, the switching power supply is directly cooled by air. The surface temperature of the switching power supply can be gradually reduced to the reference operating temperature range. During this process, the switching power supply is kept off to reduce the heat generated by the switching power supply.

[0147] Step S432: Cool the components by blowing air with the preset maximum blowing power.

[0148] The maximum airflow power is the maximum power that the cooling fan inside the load simulation device can output, as set by the technicians. To quickly dissipate heat from the switching power supply, the cooling fan is driven to rotate at maximum airflow power, thereby cooling the switching power supply.

[0149] Step S433: Record the component temperature values.

[0150] During this process, the system records the surface temperature of the switching power supply in real time to facilitate temperature control adjustment.

[0151] Step S434: When the component temperature drops to the reference operating temperature range, stop the cooling control.

[0152] When the system detects that the temperature of the switching power supply has dropped to the reference operating temperature range, the load simulation device stops cooling regulation and enters the test state.

[0153] Reference Figure 3 The method of cooling down by blowing air includes the following steps:

[0154] In this embodiment, a method for rapid heat dissipation is proposed for one of the distribution scenarios of the switching power supply and cooling fan inside the load simulation device.

[0155] Step S440: Acquire images of the inside of the load simulation device.

[0156] Internal images of a load simulation device refer to images captured by a camera installed inside the device. The characteristics of the switching power supply and cooling fan inside the load simulation device can be identified from these images.

[0157] Step S441: Determine the heat dissipation airflow direction type based on the internal image recognition of the load simulation device. The heat dissipation airflow direction type includes forward airflow and side airflow.

[0158] The airflow direction type refers to the cooling fan's airflow method for cooling the switching power supply inside the load simulation device. Frontal airflow means the cooling fan blows air onto the front of the switching power supply, and the path of the switching power supply's horizontal and vertical movement adjustment is perpendicular to the direction of the airflow. Side airflow means the cooling fan blows air onto the side of the switching power supply, and the airflow from the cooling fan is parallel to the plane of the switching power supply's horizontal and vertical movement adjustment.

[0159] Step S442: Based on the forward airflow, determine the distributable range according to the internal image of the load simulation device.

[0160] In this embodiment, the case of forward airflow is described.

[0161] The distributable range refers to the range within the load simulation device that the switching power supply can move horizontally and vertically.

[0162] The distributable range can be obtained by identifying and analyzing the interior of the load simulation device from the internal images of the load simulation device.

[0163] Step S443: Arrange the components according to the distributable range and the preset number of components, and based on the maximum spacing rule, to obtain the distribution position points of each component under the maximum spacing condition.

[0164] The number of components refers to the number of switching power supplies installed inside the load simulation device, which is a fixed parameter of the load simulation device and will not be elaborated here.

[0165] The maximum spacing rule refers to the rule followed when arranging switching power supplies to ensure that the spacing between all adjacent switching power supplies is maximized after the arrangement is completed, so as to improve sufficient heat dissipation space.

[0166] The distribution location point refers to the location where the heat dissipation effect of the switching power supply is best. The system analyzes the arrangement of the component locations within the distributable range to maximize the distance between each pair of switching power supplies, thus obtaining the final distribution location point.

[0167] Step S444: Control the drive mechanism to move the components to the corresponding distribution positions according to the distribution positions.

[0168] The system controls all switching power supplies to be positioned according to the distribution points obtained by the algorithm, and moves each switching power supply to its corresponding position sequentially through the drive mechanism. Once all switching power supplies are in their distributed positions, cooling fans blow air onto them to dissipate heat. At this point, the heat generated by each switching power supply is less likely to be directly transferred to adjacent switching power supplies, thus reducing the cooling time of all switching power supplies.

[0169] Reference Figure 4 The method of cooling down by blowing air also includes the following steps:

[0170] Step S450: Based on the lateral airflow, determine the internal height range and internal width range of the device according to the internal image of the load simulation device.

[0171] This embodiment describes the case of side-blowing airflow. In this embodiment, the load simulation device is structured so that a cooling fan blows air from the side of the switching power supply for heat dissipation.

[0172] The internal height range of the device refers to the height range within the load simulation device's interior that the switching power supply can move. Similarly, the internal width range of the device refers to the width range within the load simulation device's interior that the switching power supply can move.

[0173] The internal height and width ranges of the device can both be obtained from image analysis of the internal images of the load simulation device.

[0174] Step S451: Determine the minimum lateral projection overlap ratio based on the internal height range of the device, the preset height of a single component, and the number of components.

[0175] In this embodiment, since the cooling fan blows air from the side of the switching power supply, the switching power supply cannot be completely reached by the cooling fan as it would be with frontal airflow. When the projection directions of the switching power supplies on the side completely overlap, the cooling fan cannot directly reach the blocked switching power supply. To address this issue, the distribution of the switching power supplies is adjusted so that the projections of adjacent switching power supplies in the side direction are misaligned, preventing them from completely overlapping.

[0176] The height of a single component refers to the height of the switching power supply.

[0177] The minimum lateral projection overlap ratio refers to the minimum percentage of overlap between the lateral projections of adjacent switching power supplies relative to the overall total. This minimum lateral projection overlap ratio can be calculated based on the internal height range of the device, the height of individual components, and the number of components.

[0178] Step S452: Determine the number of distribution columns based on the number of components.

[0179] In this embodiment, after the switching power supplies are arranged in the height direction of the device with the minimum overlap of their lateral projections, in order to ensure that the adjacent switching power supplies are spaced further apart in the width direction of the device for better heat dissipation, all the switching power supplies need to be divided into three equal columns, with a large distance between each pair of columns. The number of columns is the number of columns of the switching power supplies within the width range of the device after being evenly distributed.

[0180] First, determine the number of overlapping switching power supplies based on the internal height range and the number of components of the device, and then determine the number of distribution rows based on the number of overlapping switching power supplies.

[0181] Step S453: Determine the maximum horizontal distribution distance between two adjacent components in the lateral projection direction based on the number of distribution columns and the internal width range of the device.

[0182] The maximum horizontal distribution distance refers to the distribution distance between every two rows of switching power supplies within the width range of the device. The number of rows determines the number of gaps between the switching power supplies within the device's width range; these gaps are the gaps between adjacent rows of switching power supplies. The number of gaps is the number of rows minus one. The maximum horizontal distribution distance is the quotient of the distance within the device's width range and the number of gaps.

[0183] Step S454: Determine the distribution location of each component according to the minimum overlap ratio of lateral projection and the maximum horizontal distribution distance.

[0184] By establishing a planar coordinate system inside the load simulation device, the minimum overlap ratio of lateral projections can determine the vertical coordinate of each switching power supply, and the maximum horizontal distribution distance can determine the horizontal coordinate of the switching power supply, thus obtaining the distribution location point of each switching power supply.

[0185] Step S455: Control the drive mechanism to move the components to the corresponding distribution positions according to the distribution positions.

[0186] The method is the same as in step S444, and will not be repeated here.

[0187] The temperature control adjustment scheme when the ambient temperature is higher than the reference operating temperature range includes the following steps:

[0188] In this embodiment, since the ambient temperature is higher than the reference operating temperature range, direct air cooling of the switching power supply can only lower its temperature to near the ambient temperature, but not to the reference operating temperature range. Specific solutions are needed.

[0189] Step S460: When the ambient temperature is greater than the reference operating temperature range, match the blower power based on the component temperature and the ambient temperature.

[0190] Cooling fan power refers to the output power of a cooling fan based on the deviation between the actual temperature of the power supply and the ambient temperature. The temperature difference between the components and the ambient temperature can be determined; the greater the temperature difference, the greater the cooling fan power.

[0191] Step S461: Blow air onto the components using the appropriate blowing power, and determine whether the component temperature value falls within the redundancy range of the ambient temperature value.

[0192] In this embodiment, the temperature of the switching power supply is first reduced by air cooling to approach the ambient temperature. When the temperature of the switching power supply is reduced to be equal to or slightly higher than the ambient temperature, the switching power supply is ready for use. The redundancy range is the amount by which the temperature of the components in the switching power supply is allowed to exceed the ambient temperature.

[0193] By detecting whether the temperature values ​​of the components fall within the redundancy range of the ambient temperature, it can be determined whether the switching power supply meets the usage requirements.

[0194] Step S462: When the component temperature value enters the redundant range of the ambient temperature value, enter the analog power mode and match the conversion ratio according to the difference between the component temperature value and the reference operating temperature range.

[0195] When the component temperature falls within the redundancy range of the ambient temperature, the temperature deviation between the two is small, and the power deviation of the switching power supply has little impact on the actual measurement. Therefore, a switching power supply with this component temperature value can be used to perform soft-start testing on the cabinet. However, the test needs to be performed based on the actual output power of the switching power supply.

[0196] The conversion ratio is the ratio of the set output power of the switching power supply to the actual output power. First, calculate the difference between the component temperature value and the reference operating temperature range. The conversion ratio is directly proportional to the difference between the two; the larger the difference, the larger the conversion ratio.

[0197] Step S463: Determine the simulated load power based on the conversion ratio and the currently selected load power.

[0198] The simulated load power is the actual output power of the converted load simulation device. The simulated load power is the product of the conversion ratio and the currently selected load power.

[0199] Step S464: Replace the currently selected load power with the simulated load power and output the simulated load power.

[0200] When conducting tests, operators should conduct the tests based on the simulated load power, rather than the currently selected load power.

[0201] In the event of an error in the power output of the load simulation device, the method for protecting the cabinet includes the following steps:

[0202] In this embodiment, due to temperature deviation, the current surge value during the soft-start test will be greater than the theoretical surge value. Therefore, in order to avoid damage to the cabinet caused by the impact under the above conditions, the load simulation device needs to be set before the soft-start test.

[0203] Step S470: When the load simulation device is not powered on, determine whether the component temperature value falls within the reference operating temperature range.

[0204] When the load simulation device is not powered on, first determine whether the component temperature values ​​fall within the reference operating temperature range. If they do, the load simulation device can be directly used to test the cabinet.

[0205] Step S471: When the component temperature exceeds the upper limit of the reference operating temperature range, control the load simulation device to switch to the no-load position and display a no-load prompt.

[0206] If the component temperature exceeds the upper limit of the reference operating temperature range, the current surge value when the switching power supply starts will be greater than the theoretical surge value. Therefore, the load simulation device needs to be switched to the no-load position first. The no-load position has a smaller load and is less likely to generate a large surge. When the load simulation device is in the no-load position, control panel 4 will display "no load".

[0207] Step S472: When the load simulation device is powered on, the error ratio is determined based on the operating load power and the currently selected load power.

[0208] The error ratio refers to the ratio of the deviation between the operating load power and the currently selected load power. The error ratio determines whether the load simulation device can be directly used for soft-start testing when there is a power deviation.

[0209] Step S473: When the error ratio is less than the preset baseline available ratio, control the load simulation device to switch to the load level and display a load standby prompt.

[0210] The baseline available ratio is the deviation ratio that can be directly used for soft-start testing when there is a deviation in the power of the load simulation device set by the technician.

[0211] If the error ratio is not less than the baseline usable ratio, it indicates that the error ratio is large, and temperature control adjustment is required to reduce the error ratio to less than the baseline usable ratio.

[0212] If the error ratio is less than the baseline usable ratio, it indicates that the power of the load simulation device has a deviation, but the deviation is small, and it can still be used directly for soft-start testing. This situation mainly occurs when the ambient temperature is slightly higher than the baseline operating temperature range, and air cooling cannot directly reduce the temperature of the switching power supply to the baseline operating temperature range. In this case, the load simulation device can still be used directly for soft-start testing.

[0213] In this situation, the system controls the load simulation device to switch to the load level, and the load simulation device is in standby mode.

[0214] The above description is merely a preferred embodiment of the present invention. The scope of protection of the present invention is not limited to the above embodiments. All technical solutions falling within the scope of the present invention's concept are within the scope of protection of the present invention. It should be noted that for those skilled in the art, any improvements and modifications made without departing from the principles of the present invention should also be considered within the scope of protection of the present invention.

Claims

1. A control method for a load simulation device used for rack soft-start testing, characterized in that, include: When the load simulation device is not powered on, the load simulation device is selected according to the preset simulation range scheme, and the currently selected load power is recorded. Real-time acquisition of component temperature values ​​inside the load simulation device; When the component temperature exceeds the preset reference operating temperature range, temperature drift information is calculated based on the component temperature and the reference operating temperature range. The load deviation information is matched with the temperature drift information, and the operating load power is obtained by correcting the currently selected load power based on the load deviation information. The operating load power is then output on the control panel (4). The temperature control adjustment scheme is matched according to the positive and negative relationship of the temperature drift information, and the temperature value of the components is adjusted according to the temperature control adjustment scheme; When the operating load power displayed on the control panel (4) is consistent with the currently selected load power, the temperature control adjustment of the load simulation device is stopped and the test waiting state is entered; Temperature control adjustment scheme includes: When the temperature drift information is negative, temperature control is performed to control the components to start at the preset minimum power state; The minimum power state is continuously corrected at a preset power increase rate to control the operating power of the components to increase from the minimum power state to the preset full power state and maintain it at the full power state; Record the temperature values ​​of the components; When the component temperature enters the reference operating temperature range, the temperature control is stopped. Also includes: Acquire array status images of components inside the load simulation device; The spacing between components is identified based on the array status image; The component array type is determined based on the component spacing. When the component array type is inconsistent with the preset zero-pitch contact type, the drive mechanism preset in the load simulation device is controlled according to the component spacing to adjust the component spacing to the zero-pitch contact type. Also includes: The components of the array are grouped, with the interleaved components labeled as the first component group and the remaining components labeled as the second component group. The rule for dividing the two groups is that the components in the two groups are interspersed, and there are no adjacent components in any group. In the zero-pitch contact type, the second component group is turned off and the first component group is turned on. The operating power of the first component group is gradually increased to full power, and the temperature of the first component group is collected in real time. Set the half-rise temperature value based on temperature drift information and component temperature values; When the temperature of the first component group reaches the half-heating temperature value, the first component group is turned off and the second component group is turned on. The operating power of the second component group is gradually increased to the full power state, and the temperature of the second component group is collected in real time. When the temperature of the second component group is the same as that of the first component group, the second component group and the first component group are turned on simultaneously until the temperatures of the first component group and the second component group both enter the reference operating temperature range.

2. The control method for the load simulation device for rack soft-start testing according to claim 1, characterized in that, The temperature control adjustment scheme also includes: When the temperature drift information is positive, cooling control is performed, and the ambient temperature value of the load simulation device is collected. When the ambient temperature is not greater than the reference operating temperature range, the control components remain in the off state; The components are cooled by blowing air at the preset maximum blowing power; Record the temperature values ​​of the components; When the component temperature drops to the reference operating temperature range, the cooling control stops.

3. The control method for the load simulation device for rack soft-start testing according to claim 2, characterized in that, Methods for cooling down by blowing air include: Acquire images of the internal components of the load simulation device; The type of heat dissipation airflow direction is determined based on the image recognition inside the load simulation device. The types of heat dissipation airflow direction include forward airflow and side airflow. Based on the forward airflow, the distributable range is determined according to the internal image of the load simulation device; Based on the distributable range and the preset number of components, and based on the maximum spacing rule, the components are arranged to obtain the distribution position points of each component under the maximum spacing condition. The drive mechanism is controlled according to the distribution location points to move the components to the corresponding distribution location points.

4. The control method for the load simulation device for rack soft-start testing according to claim 3, characterized in that, Also includes: Based on lateral airflow, the internal height and width ranges of the device are determined according to the internal images of the load simulation device. The minimum overlap ratio of lateral projection is determined based on the internal height range of the device, the preset height of a single component, and the number of components. The number of distribution columns is determined based on the number of components; The maximum horizontal distribution distance between two adjacent components in the lateral projection direction is determined based on the number of distribution columns and the internal width range of the device. The distribution location of each component is determined according to the minimum overlap ratio of lateral projection and the maximum horizontal distribution distance; The drive mechanism is controlled according to the distribution location points to move the components to the corresponding distribution location points.

5. The control method for the load simulation device for rack soft-start testing according to claim 2, characterized in that, Temperature control adjustment schemes when the ambient temperature exceeds the reference operating temperature range include: When the ambient temperature is greater than the reference operating temperature range, the blower power is matched based on the component temperature and the ambient temperature. The component is blown with the appropriate power, and it is determined whether the component temperature value has entered the redundancy range of the ambient temperature value. When the component temperature value enters the redundant range of the ambient temperature value, it enters the analog power mode and matches the conversion ratio according to the difference between the component temperature value and the reference operating temperature range. The simulated load power is determined based on the conversion ratio and the currently selected load power. Replace the currently selected load power with the simulated load power, and output the simulated load power.

6. The control method for the load simulation device for rack soft-start testing according to claim 1, characterized in that, Also includes: When the load simulation device is not powered on, determine whether the temperature value of the components falls within the reference operating temperature range; When the temperature of a component exceeds the upper limit of the reference operating temperature range, the load simulation device is switched to the no-load position and a no-load prompt is displayed. When the load simulation device is powered on, the error ratio is determined based on the operating load power and the currently selected load power. When the error ratio is less than the preset baseline available ratio, the load simulation device is switched to the load level and a load standby prompt is displayed.

7. A load simulation device for rack soft-start testing, controlled by the control method of any one of claims 1 to 6, characterized in that, It includes a cabinet (1) with an internal array of switching power supplies, a gear switch (2) and a power interface (3) on the surface of the cabinet (1); the gear switch (2) and the power interface (3) are each corresponding to and electrically connected to the switching power supply.

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