DCDC module automatic design method, interaction system and electronic equipment

Abstract

The invention relates to the field of PCB design, in particular to a DCDC module automatic design method, an interaction system and electronic equipment. The method comprises the following steps: acquiring a target module from DCDC modules to be arranged; obtaining circuit parameters and function parameters of the target module in combination with the schematic diagram, and dividing components according to the function parameters to determine the component corresponding to each function; and performing automatic layout on the components in combination with the circuit parameters and the function parameters, and outputting automatic layout results of the at least two target modules. According to the scheme, the circuit parameters and the function parameters are obtained from the schematic diagram, the components are automatically divided and arranged according to the circuit parameters and the function parameters, and the automatic arrangement logic is designed and determines the component corresponding to each function according to the circuit parameters and the function parameters, so that the generated arrangement result is reasonable enough, and the layout efficiency is improved. The time of manual arrangement of devices and manual layout is remarkably shortened, the design efficiency is improved, and the use experience of engineers is optimized.

Description

Technical Field

[0001] This application relates to the field of PCB design, specifically to an automatic design method for DC-DC modules, an interactive system, and electronic devices. Background Technology

[0002] In the field of PCB design, traditional work patterns heavily rely on the professional skills and experience of PCB layout engineers. Engineers often need to perform numerous repetitive tasks such as manually placing components, manually routing, and manually drilling vias. However, not all engineers possess the extensive experience to efficiently and quickly complete each design task. More often than not, engineers need to invest a significant amount of time in the placement and routing phase, iterating repeatedly to achieve a relatively reasonable layout. Currently, although EDA (Electronic Design Automation) software is used in PCB design, and some software has initially implemented automatic routing functions, the effectiveness of automatic routing largely depends on a reasonable initial layout. If the layout is inappropriate, even with automatic routing technology, the output will be difficult to meet high-quality design requirements. Summary of the Invention

[0003] The implementation method of this application mainly solves the technical problem that existing functional module design schemes require engineers to manually plan the layout of each component, which involves a huge amount of engineering work.

[0004] To solve the above-mentioned technical problems, one technical solution adopted in this application is: to provide an automatic design method for DC-DC modules, applied to an interactive system for automatic design of DC-DC modules, the method comprising:

[0005] Obtain the target module from the DC-DC modules to be laid out; obtain the circuit parameters and functional parameters of the target module in combination with the schematic diagram, and divide the components according to the functional parameters to determine the components corresponding to each function; automatically lay out the components in combination with the circuit parameters and the functional parameters, and output at least two automatic layout results of the target module.

[0006] This solution obtains circuit and functional parameters from the schematic diagram and automatically divides and lays out components accordingly. Furthermore, the automatic placement logic is designed based on these parameters to determine the components corresponding to each function. It takes into account the relevant parameters of components for different functions such as input, feedback, and bootstrapping, resulting in a sufficiently reasonable layout. This significantly reduces the time spent on manual component placement and improves design efficiency. In addition, it provides at least two automatic placement results, allowing engineers to choose the optimal solution based on actual needs or make further adjustments. This flexibility helps meet the design requirements of different application scenarios and optimizes the engineer's user experience.

[0007] To address the aforementioned technical problems, another technical solution adopted in this application is: providing an automatic design interactive system for DC-DC modules, the interactive system comprising: a module selection unit for obtaining a target module from DC-DC modules to be laid out; a parameter acquisition unit for obtaining circuit parameters and functional parameters of the target module in conjunction with a schematic diagram, and dividing components according to the functional parameters to determine the components corresponding to each function; and an automatic layout unit for automatically laying out the components in conjunction with the circuit parameters and the functional parameters, and outputting at least two automatic layout results for the target module.

[0008] In some embodiments, the interactive system further includes an automatic routing unit, configured to acquire the automatic layout results of the traces to be routed and perform automatic routing. Specifically, it is configured to: set a positive correlation between current magnitude and trace width to determine the trace width corresponding to different types of signals based on the relationship; determine routing constraints for different signals based on the signal type, wherein the signal type includes at least power signals, normal signals, sensitive signals, and feedback signals; perform automatic routing on the automatic layout results based on the routing constraints; and display the routing results through an interactive window to support users in manually adjusting the routing results through the interactive window.

[0009] To solve the above-mentioned technical problems, another technical solution adopted in the embodiments of this application is: to provide an electronic device, the electronic device comprising: at least one processor, and a memory communicatively connected to the at least one processor, wherein the memory stores instructions executable by the at least one processor, the instructions being executed by the at least one processor to enable the at least one processor to execute the automatic design method of DC-DC modules as described above.

[0010] Unlike related technologies, this application provides an automatic design method and interactive system for DC-DC modules. The method, applied to the interactive system, includes: obtaining a target module from a set of DC-DC modules to be laid out; obtaining circuit parameters and functional parameters of the target module based on a schematic diagram, and dividing components according to the functional parameters to determine the components corresponding to each function; automatically laying out the components based on the circuit parameters and functional parameters, and outputting at least two automatic layout results for the target module. This solution obtains circuit parameters and functional parameters from the schematic diagram and automatically divides and lays out components accordingly. Furthermore, the automatic layout logic is designed based on the circuit parameters and functional parameters to determine the components corresponding to each function. This takes into account the relevant parameters of components corresponding to different functions, such as input, feedback, and bootstrapping, making the generated layout results sufficiently reasonable. This significantly reduces the time spent on manual component placement and layout, improving design efficiency. In addition, it can provide at least two automatic layout results, allowing engineers to choose a better solution based on actual needs or make further adjustments. This flexibility helps meet the design requirements of different application scenarios and optimizes the user experience for engineers. Attached Figure Description

[0011] One or more embodiments are illustrated by way of example with reference to the accompanying drawings. These illustrations do not constitute a limitation on the embodiments. Elements having the same reference numerals in the drawings are denoted as similar elements. Unless otherwise stated, the figures in the drawings are not to be limited by scale.

[0012] Figure 1 This is a flowchart illustrating an automatic design method for a DC-DC module provided in an embodiment of this application;

[0013] Figure 2 This is a schematic diagram of a process for obtaining a target module provided in an embodiment of this application;

[0014] Figure 3 This is a schematic diagram of an interactive window for displaying DC-DC modules to be laid out, provided in an embodiment of this application;

[0015] Figure 4 This is a schematic diagram of an interactive window that displays circuit parameters and components corresponding to each function, provided in an embodiment of this application.

[0016] Figure 5 This is a flowchart illustrating an automatic layout process provided in an embodiment of this application;

[0017] Figure 6 This is a more specific flowchart illustrating an automatic layout provided in an embodiment of this application;

[0018] Figures 7a-7c These are example diagrams showing three automatic layout results corresponding to a certain target module provided in the embodiments of this application;

[0019] Figures 8a-8c They are Figures 7a-7c The corresponding example diagram with annotations;

[0020] Figure 9 This is a flowchart illustrating another automatic design method for DC-DC modules provided in an embodiment of this application.

[0021] Figure 10 This is a schematic diagram of an automatic wiring process provided in an embodiment of this application;

[0022] Figure 11 This is an example diagram of the routing result of an automatic routing method provided in an embodiment of this application;

[0023] Figure 12 yes Figure 11 Example diagram of the routing results after user adjustment;

[0024] Figure 13 This is a schematic diagram of the virtual structure of an automatic design interactive system for DC-DC modules provided in an embodiment of this application;

[0025] Figure 14 This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. Detailed Implementation

[0026] To make the objectives, technical solutions, and advantages of this application clearer, the following detailed description is provided in conjunction with the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are merely illustrative and not intended to limit the scope of this application. It should be noted that, unless otherwise specified, the various features in the embodiments of this application can be combined with each other, all within the protection scope of this application. Furthermore, although functional modules are divided in the device schematic diagram and a logical order is shown in the flowchart, in some cases, the steps shown or described may be performed with a different module division or order than that shown in the device schematic diagram or the flowchart.

[0027] Unless otherwise defined, all technical and scientific terms used in this specification have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of this application. The term "and / or" as used in this specification includes any and all combinations of one or more of the associated listed items.

[0028] Existing PCB design software typically provides functions such as schematic design, PCB layout and routing, and simulation. However, engineers need to spend a lot of time repeatedly trying different approaches during the layout and routing phase in order to achieve a relatively reasonable design solution. Although some EDA software can initially achieve automatic routing, the effectiveness of automatic routing largely depends on the reasonable layout in the early stage. If the layout is not proper, even if automatic routing technology is used, the output results will be difficult to meet the requirements of high-quality design.

[0029] Taking the DC-DC module as an example, after the engineer imports the circuit schematic into the design software, the DC-DC module layout needs to be designed. This involves placing the components in the module on the plane of the analog circuit board according to certain rules and layout methods to meet the performance requirements of the circuit and the manufacturing requirements of the circuit board. During the layout process, factors such as the position and orientation of the components, signal transmission paths, and the area occupied need to be considered. In order to obtain a relatively more reasonable layout scheme, this process also requires engineers to spend a lot of time and effort to try repeatedly.

[0030] Understandably, a schematic diagram, as a graphical representation of the working principle of an electronic system or device, uses symbols and graphics to describe the connections and operating principles between electronic components. This helps designers understand and analyze the system's operation and signal flow paths, facilitating analysis and optimization during the design phase. After importing a schematic, software typically generates a corresponding netlist. The netlist contains the connections between chip components and information about component attributes, such as pin assignments and operating voltages. The netlist clearly shows the location and function of each chip component in the circuit, as well as their connections and signal flow paths. Chip components are usually represented by symbols or footprints. Symbols represent the graphical representation of the component in the circuit diagram, while footprints represent the physical dimensions and pin layout of the component on the PCB board. These components can be categorized according to their function and purpose, such as analog circuit components, digital circuit components, logic circuit components, and memory components. Subsequent placement and routing processes are designed based on the schematic (and netlist) and component data.

[0031] In existing circuit board design software, the placement of components for functional modules based on schematic diagrams is usually done manually by engineers. They manually place all the components of the functional module on the plane of the simulated actual circuit board. In order to ensure that the module can perform its functions properly, the connections between the components need to be as non-overlapping and non-intersecting as possible. Engineers need to consider the area occupied by the entire functional module, determine the position of each component within the specified area, and also consider the impact of the electrical connection relationship between the components on the placement of the components. Engineers often need to spend a lot of time trying repeatedly to find a relatively more reasonable layout. This process is huge and time-consuming.

[0032] To address the aforementioned technical problems, this embodiment proposes an improved method, as follows:

[0033] Typically, a design project may contain more than one DC-DC module in its schematic. Therefore, after importing the schematic into the design software, all DC-DC modules are identified based on the information in the schematic, facilitating automatic placement of these modules. First, the target module is obtained from the DC-DC modules to be placed. Then, the circuit and functional parameters of the target module are obtained from the schematic. These parameters, such as the number of pins on the DC-DC chip, the topology of the target module, and the specific data of relevant signals, can be obtained from the schematic. Next, components are divided according to the functional parameters to determine the components corresponding to each function. For example, the function of an input capacitor is to provide input to the target module, and the function of a feedback resistor is to provide a feedback signal. Based on these functional divisions, the corresponding components are identified, and then these components are automatically placed using the obtained circuit and functional parameters.

[0034] During automatic placement, the positions of components are determined according to certain placement strategies. In this embodiment, the placement condition ranges corresponding to the components are determined based on the obtained circuit and functional parameters. These placement condition ranges constrain the positional relationships between the components and other components, and the automatic placement of components is completed according to the schematic diagram and the placement condition ranges. In this embodiment, different types of components are assigned different placement condition ranges; for example, the placement condition ranges for capacitors and inductors are different. Similarly, components of the same type with different functions are assigned different placement condition ranges; for example, the placement condition ranges for input capacitors and bootstrap capacitors are different. Based on the above automatic placement logic, at least two automatic placement results are output, which not only significantly reduces the time spent manually placing components and improving design efficiency, but also allows engineers to select the optimal automatic placement result based on actual needs.

[0035] Based on the design concept described above in this embodiment, this embodiment will be further elaborated in conjunction with specific scenarios. This embodiment of the application specifically targets the automatic design of the DC-DC module.

[0036] Figure 1 This application provides an automatic design method for DC-DC modules. This method is applied to an interactive system for automatic design of DC-DC modules. Users can input relevant design data, such as schematic diagrams, through this system, and receive assistance from the system to automatically design the DC-DC modules based on the actual design requirements of the project. It is understood that the "user" mentioned in this application refers to an engineer who uses this interactive system to implement the automatic design method for DC-DC modules.

[0037] like Figure 1 As shown, the automatic design method for DC-DC modules provided in this application includes:

[0038] S11. Obtain the target module from the DC-DC modules to be laid out. It is understood that this solution allows users to automatically design individual functional modules. When the schematic contains more than one DC-DC module, it can automatically design each DC-DC module sequentially based on the user's selection. Figure 2 The step of obtaining the target module from the DC-DC modules to be laid out includes:

[0039] S111. Obtain general-purpose chip components based on the imported schematic. It is understood that after obtaining the imported schematic, the system can obtain the corresponding netlist (also called a network list). The netlist not only contains general-purpose chip components, such as resistors, capacitors, inductors, diodes, transistors, integrated circuits / chips (ICs), microprocessors (MPUs), digital signal processors (DSPs), field-programmable gate arrays (FPGAs), etc., and the connection relationships between these general-purpose chip components, but also includes information on the relevant attributes of the general-purpose chip components, such as pin assignments or operating voltages. Based on the information in the netlist, the system can obtain the location and function of each general-purpose chip component in the circuit, as well as their connection methods and signal transmission paths, and use this information to assist in planning subsequent automatic placement and automatic routing.

[0040] S112. Identify and display all DC-DC modules to be laid out based on the general chip material. In this embodiment, all DC-DC modules to be laid out can be identified based on the description of the general chip material. The identification logic is to judge based on the presence of key characters such as "DCDC" or "DC-DC" in the description of the general chip material.

[0041] S113. Obtain the DC-DC module selected by the user as the target module. Combined with... Figure 3 ,by Figure 3 To illustrate, after the user opens the project file and successfully generates the circuit schematic and PCB (referring to the printed circuit board displayed by the system without any components), they can click the "load" button to allow the system to begin recognizing and displaying the DC-DC module. Figure 3 The example shows that 8 DC-DC modules to be laid out were identified and distinguished by UD1-UD8. At this time, the user can trigger the next step of the process by clicking on one of the DC-DC modules. After receiving the user's click action, the system will use the selected DC-DC module as the target module to carry out the next automatic layout process.

[0042] This solution automatically identifies common chip components through schematic diagrams, ensuring the accuracy of module identification. It intelligently displays all relevant DC-DC modules for users to select, enabling users to easily find and select the target module according to their needs. The entire selection process is intuitive and fast, improving the user experience.

[0043] S12. Obtain the circuit parameters and functional parameters of the target module based on the schematic diagram, and divide the components according to the functional parameters to determine the components corresponding to each function. Figure 4 Assuming the user selects the DC-DC module corresponding to UD1, the system will combine the schematic diagram to obtain the components contained in UD1, as well as the corresponding circuit parameters and functional parameters of these components. Based on these functional parameters, the system will then categorize the components to determine the components corresponding to each function. This will be done through methods such as... Figure 4 The interactive window shown displays the circuit parameters and the components corresponding to each function, allowing users to adjust the components corresponding to each function through the interactive window.

[0044] by Figure 4 To illustrate with examples, Figure 4 The document provides examples of circuit and functional parameters in the target module, as shown in the figure. In the figure, Pin Count represents the number of pins on the DC-DC chip in the target module; Topology represents the topology of the DC-DC module; Input Voltage represents the input voltage of the target module; Output Voltage represents the output voltage of the target module; Input Current is the input current; Output Current is the output current; and Efficiency is the conversion efficiency. The circuit parameters described above are primarily used to illustrate the relevant parameters when the target module is operating normally. Furthermore, [the document continues with...] Figure 4As an example, the functional parameters of the components in this DC-DC module include: Input caps (input capacitors); Output caps (output capacitors); IC (integrated circuit / chip); Feedback (feedback-related components); Bootstrap (bootstrap-related components); Enable (enable-related components); Inductor (inductor); and CAF distance (process design requirement parameter). These functional parameters primarily demonstrate the components corresponding to different functions during normal operation. It should be noted that... Figure 4 The example also includes: Diode, representing a diode (to prevent reverse current flow); others, representing other functional devices; Compatible, representing device compatibility design requirements; Entry, representing input. Although no corresponding component is identified for these parameters, they can still be designed into the parameter acquisition logic, as other DC-DC modules may involve these parameters. Furthermore, the parameters listed above are for illustrative purposes only and are not intended to limit the acquisition of only these parameters. In other embodiments, logic for acquiring related parameters other than those in the above examples can be designed, or logic for acquiring only some of the parameters in the above examples can be designed. This application does not limit the type and number of parameters to be acquired in its embodiments.

[0045] Users can also use, for example Figure 4 The interactive window shown allows users to adjust the components corresponding to the functions. Taking "Output caps: CD4-; CD5-; RD3-" in the figure as an example, this result indicates that the system recognizes the components with the symbols "CD4", "CD5", and "RD3" in the schematic as input capacitors. The "+" button on the far right of this column allows users to add components, while the "-" button after the symbol allows users to delete the component from this column. Therefore, users can confirm the accuracy of the displayed content based on the actual schematic and design requirements. If adjustments are needed, they can be made directly through this interactive window, improving the accuracy of subsequent operations.

[0046] S13. Based on the circuit parameters and functional parameters, automatically place the components and output at least two automatic placement results for the target module. Figure 5 The automatic placement of the components by combining the circuit parameters and the functional parameters specifically includes:

[0047] S131. Determine the layout condition range corresponding to the components based on the circuit parameters and the functional parameters. The layout condition range is used to constrain the positional relationship between the components and other components so that the components do not interfere with each other. Different types of components are provided with different layout condition ranges, and components of the same type with different functions are provided with different layout condition ranges.

[0048] The layout conditions described in this application are primarily set based on logic for optimizing circuit operation. For example, for input capacitors: to ensure power input stability and reduce the impact of power supply noise on the chip, the closer the input capacitor is to the chip pin, the better. Therefore, the layout conditions for input capacitors can include the distance between the input circuit and the chip pin being less than a certain preset value. To reduce grounding resistance and inductance and improve the circuit's anti-interference capability, the input capacitor ground needs to be connected to the chip ground on the same layer, and the shorter the distance between them, the better. Therefore, the layout conditions for input capacitors can also include the input capacitor ground and the chip ground being connected on the same layer, and the distance between them being less than a certain preset value. Based on the characteristics that large-capacity capacitors can filter out low-frequency noise and small-capacity capacitors are mainly used to filter out high-frequency noise, the layout conditions for input capacitors can also include arranging them in descending order of capacitance, etc.

[0049] For example, the layout conditions for output capacitors can be set based on logic to optimize circuit operation. Similar to the input capacitors mentioned above, the design logic for the layout conditions of output capacitors can include: the distance between the output capacitor and the output source is less than a certain preset value; the output capacitor ground is connected to the chip ground on the same layer, and the distance between them is less than a certain preset value; the layout conditions for input capacitors can also include arranging them in descending order of capacitance, etc. For another example, since the closer the inductor is to the chip, the more direct the signal transmission between them and the less likely it is to be affected by external interference, the layout conditions for the chip can include: the distance between the chip and the inductor is less than a certain preset value. Furthermore, the power consumption or losses of the chip during operation may cause heat generation. To prevent the chip's heat generation from affecting the normal operation of the module, a blank area for heat dissipation can be set around the chip to meet its heat dissipation requirements. It is understood that the examples given above are only a few examples for ease of explanation; in actual situations, the layout conditions for each component will be much more numerous.

[0050] Based on this, the system sets a relatively precise range of placement conditions for the automatic placement of components by comprehensively considering circuit parameters and functional parameters. These placement condition ranges not only ensure that the components do not interfere with each other and avoid physical conflicts, but also formulate differentiated placement strategies for different types and functions of components. This ensures that the automatic placement results can at least effectively meet the key performance indicators of heat dissipation requirements and non-intersecting traces, and also reduce the cost of manual trial and error and improve design efficiency.

[0051] S132. Based on the aforementioned layout conditions, automatically place the components according to the schematic diagram to ensure that the automatic layout results at least meet the heat dissipation requirements and the requirement that traces do not cross. Please refer to... Figure 6 The automatic placement of components based on the schematic diagram, in conjunction with the layout condition range, to ensure that the automatic placement results at least meet the heat dissipation requirements and the requirement that traces do not cross, specifically includes:

[0052] S1321. Arrange the components included in the target module based on the layout condition range. Under the premise of satisfying the layout condition range of each component, arranging the components included in the target module based on the layout condition range may further include: establishing a planar coordinate system based on the placement plane, with the lower left corner of the placement area as the origin and the bottom edge of the placement area as the X-axis; controlling the placement angle of the components in this planar coordinate system to satisfy 0°, 90°, 180°, and 270°; controlling the edge position or center position of at least one group of adjacent components to satisfy the same horizontal or vertical coordinate, so that the at least one group of adjacent components are arranged neatly. By limiting the position of the components in the planar coordinate system, the automatic placement effect is made to meet the user's aesthetic requirements as much as possible.

[0053] Combination Figure 7a and Figure 8a To illustrate with examples, Figure 7a This is an example diagram showing an automatic layout result for the target module. Figure 8a for Figure 7a The corresponding annotation diagram. As can be seen from the diagram, this target module contains 18 components, which are respectively... Figure 8a The uppercase letters shown indicate that Figure 8a The position of each component is indicated by dashed boxes. It's understandable that the actual automatic layout result will look like this. Figure 7a Examples in, Figure 8a Just for Figure 7aLabels are provided for ease of explanation. As shown in the diagram, the components generally satisfy placement angles of 0°, 90°, 180°, or 270°, and the short side or center position of adjacent components preferably shares the same horizontal or vertical coordinate to ensure a neat arrangement. For example, the four components labeled O, P, Q, and R are considered a group of adjacent components. Although their sizes are not exactly the same, their left sides share the same horizontal coordinate, thus their arrangement appears neat. Similarly, the three components labeled L, M, and N are considered a group of adjacent components, as their center positions share the same horizontal coordinate, resulting in a neat arrangement. For example, the four components labeled H, I, J, and K are considered a relatively broad group of adjacent components. Each pair of adjacent components is considered a relatively strictly defined group of adjacent coordinates, including H+I; I+K; H+J; and J+K. Each group must have at least one x-coordinate or y-coordinate at its center, and because their sizes are similar, each group must also have at least one side with the same x-coordinate or y-coordinate. Therefore, their arrangement appears neat. This solution further refines the placement rules of components within the layout conditions, making the layout more standardized. When components are arranged according to certain rules, the wiring simulation based on the schematic diagram becomes more regular and simpler, reducing the difficulty of subsequent wiring and making the positional relationships between components clearer and more consistent. This not only improves aesthetics but also reduces wiring intersections and interference, and facilitates subsequent maintenance and troubleshooting.

[0054] This solution further refines the placement rules of components within the layout conditions, making the layout more standardized. When components are arranged according to certain rules, the wiring simulation based on the schematic diagram will also be more regular and simple, reducing the difficulty of subsequent wiring and making the positional relationship between components clearer and more consistent. This not only improves aesthetics but also reduces wiring intersections and interference, and facilitates subsequent maintenance and troubleshooting.

[0055] S1322. Perform routing simulation on the target module with components placed according to the schematic diagram. Adjust the automatic placement result based on the routing simulation results to ensure that the automatic placement result meets the requirement of no routing intersections. After initially placing all components included in the target module, a routing simulation will be attempted according to the schematic diagram. If routing intersections occur, the placement of components will be adjusted according to the schematic diagram to prevent routing intersections. It should be noted that since the netlist corresponding to the schematic diagram contains electrical connection networks, as well as information such as network names, node information, and network connection descriptions, the design logic within the layout condition range can be considered to minimize routing intersections when placing components according to the layout condition range.

[0056] S1323. Within the layout conditions, reduce the distance between adjacent components to reduce the area occupied by the target module. In circuit board design, under the premise of ensuring reasonable layout, the area occupied by the entire module is usually as small as possible. Therefore, this solution attempts to optimize the area occupied by the target module without affecting the module's function and performance, thereby improving the accuracy and efficiency of automatic layout.

[0057] S1324. Obtain data related to chip power consumption from the circuit parameters, and adjust the automatic layout result according to the data to ensure that the automatic layout result meets the heat dissipation requirements. In the design of the circuit board, it is necessary to fully consider the heat generated by the power consumption or losses of the devices. Therefore, the layout conditions for the relevant devices need to take into account sufficient heat dissipation area. It is not advisable to ignore the heat generation while only considering the small footprint, so as to avoid affecting the normal operation of the DC-DC module.

[0058] This solution avoids physical conflicts between components by placing them within a range of layout conditions, ensuring the initial rationality of the layout. Furthermore, through routing simulation and adjustment steps, the layout of components is further adjusted to ensure smooth and non-intersecting routing, optimize heat dissipation performance, and reduce the occupied area of ​​the target module without affecting functionality and performance, thereby improving the accuracy and efficiency of automatic layout.

[0059] In some embodiments, the method further includes: displaying the at least two automatic layout results through an interactive window to support users in manually adjusting the automatic layout results through the interactive window; and obtaining the automatic layout result selected by the user as the automatic layout result to be routed. This solution, by displaying multiple automatic layout results and allowing users to manually adjust them, effectively provides a quality control step, helping to ensure the quality of the final layout result.

[0060] Specifically, after performing automatic layout based on the above steps, the automatic layout results for at least two target modules are output. Combined with... Figures 7a-7c as well as Figures 8a-8c ,in, Figures 7a-7c These are example diagrams showing three automatic layout results corresponding to the target module provided in the embodiments of this application. Figures 8a-8c They are Figures 7a-7c The corresponding example diagram with annotations. It is understandable that... Figures 7a-7c The three examples are all different automatic layout results of the same target module UD1, combined with Figures 8a-8cAs can be seen, all three automatic layout results satisfy the relevant logic in the above process. For example, they basically satisfy the placement angles of 0°, 90°, 180° or 270°. For another example, the distance between a specific pin of component U and component V is less than a certain preset value. For some components with distance limitations, such as the five components labeled A, B, C, D and E, there is a relatively compact positional relationship in different automatic layout results.

[0061] Furthermore, different automatic layout results may cause some changes that do not affect functionality and performance. For example, four components labeled O, P, Q, and R may have different layout settings. Figure 7a and 8a In the corresponding automatic layout result, the horizontal coordinates of the left side are the same, while... Figure 7b and 8b In the corresponding automatic layout results, the horizontal coordinates of the center positions are the same. For example, four components labeled O, P, Q, and R... Figure 7b and 8b The corresponding automatic layout results are arranged from left to right, while... Figure 7c and 8c The corresponding automatic layout results are arranged from right to left.

[0062] Therefore, this solution can provide at least two automatic layout results, allowing users to choose the better solution according to their actual needs, or make further adjustments based on it. This flexibility helps to meet the design needs of different application scenarios and optimizes the user experience.

[0063] Combination Figure 9 In some embodiments, this solution provides an automatic design method for DC-DC modules, including as follows: Figure 9 The steps S11-S14 shown are identical to steps S11-S13 in the above embodiments. For related technical details and effects, please refer to steps S11-S13 in the above embodiments. Therefore, the method of this application embodiment further includes:

[0064] S14. Obtain the automatic layout result of the wiring to be routed and perform automatic routing. Combined with... Figure 10 The automatic routing process of obtaining the automatic layout result of the trace to be routed specifically includes:

[0065] S141. Establish a positive correlation between current magnitude and trace width to determine the trace width corresponding to different types of signals based on this relationship. In circuit board design, the relationship between current and trace width is crucial, directly affecting the performance, reliability, and safety of the circuit board. For example, when the target module is working normally, trace a carries a current of 10mA, while trace b carries a current of 20mA. Under the constraint of a positive correlation between current magnitude and trace width, the trace width of trace b will be planned to be greater than that of trace a. This solution establishes a positive correlation between current magnitude and trace width to constrain the trace width under different current conditions. By limiting the trace width, it ensures that the trace has sufficient carrying capacity during high-current signal transmission, guaranteeing circuit safety.

[0066] S142. Determine the routing constraints for different signals based on their types. The signal types include at least power signals, ordinary signals, sensitive signals, and feedback signals. Specifically, power signals typically require wider traces to carry large currents, reduce voltage drop, and minimize heat generation. Therefore, the trace width for power signals can be set to be greater than a first preset trace width to ensure that the trace width is at least greater than a certain value. Ordinary signals generally have fewer routing constraints, only needing to meet basic routing rules, such as those related to ensuring signal integrity and accuracy. Therefore, the routing of ordinary signals is relatively flexible. The routing constraints for sensitive signals (e.g., high-speed digital signals, analog signals, etc.) at least include the need for grounding to reduce external interference to the sensitive signal. They may also require consideration of routing rules related to trace length, spacing, shielding, and impedance matching. Feedback signals typically require limited trace length to reduce delay and noise interference and improve response speed. Therefore, the routing constraints for feedback signals at least include constraints on trace length, and may also include constraints to avoid winding around resistors, as well as constraints related to grounding.

[0067] It is understandable that, in addition to the routing constraints in the examples above, in practice, there may also be special routing constraints that need to be met. For example, GND pad routing is constrained according to the width of the pad; the routing constraints for single-ended non-impedance routing include at least a line width greater than a certain preset value, such as 5mil; single-ended / differential impedance routing needs to be constrained according to impedance requirements; grounding lines need to be punched with vias, etc.

[0068] S143. Automatic routing is performed on the automatic layout result according to the routing constraints, and the routing result is displayed through an interactive window to support manual adjustment of the routing result by the user. Combined with... Figure 11 and Figure 12 , Figure 11 This is an example diagram of the routing result of an automatic routing method provided in an embodiment of this application; Figure 12 yes Figure 11 The example diagram shows the routing results after user adjustments. As can be seen from the diagram, in the system output... Figure 11 After showing the routing result, the user can check and manually adjust it. A section of routing was added to the lower right corner. The adjusted routing result is as follows: Figure 12 As shown.

[0069] This solution provides specific routing logic, ensuring sufficient line capacity for high-current signal transmission by limiting line width. It optimizes signal paths by setting constraints for different signal routing, ensuring signal integrity and module performance. Furthermore, it supports manual adjustment and modification of the results by users, making the design more flexible and controllable. Users can optimize and fine-tune the automatic routing results according to actual needs and their own experience to achieve better design results.

[0070] In some embodiments, the automatic routing process of obtaining the automatic layout result of the trace to be routed further includes: adjusting the trace exit direction of the pads to prioritize center exit; adjusting the distance between vias and between vias and the board edge to be greater than the hole spacing threshold; and restricting the routing range to avoid the area where routing is prohibited if there is a prohibited routing area on the routing panel. This solution, by prioritizing center exit of the pads, allows the solder to be distributed more evenly on the pads, improving the quality and reliability of soldering; by restricting the position of vias, it avoids affecting the mechanical strength or electrical performance of the circuit board; and by considering the constraints of design requirements on the automatic routing position, it can better meet specific design needs, reduce subsequent manual modification work, and improve design efficiency.

[0071] In some embodiments, the method further includes: obtaining user evaluations or ratings of the automatic layout results; adjusting the reward direction based on the evaluations or ratings to assist in machine learning. This solution can combine user feedback data with automatic layout results as training data to optimize and adjust the relevant algorithms for automatic layout, improve the performance of the algorithms, enable them to continuously learn and improve, enhance the rationality of automatic layout results, and help ensure that the final design better meets user expectations.

[0072] Combination Figure 13This application provides an interactive system for automatic design of DC-DC modules, as shown in the figure. The interactive system 200 includes: a module selection unit 201, a parameter acquisition unit 202, an automatic layout unit 203, and an automatic routing unit 204. Specifically, the module selection unit 201 can obtain the target module from the DC-DC modules to be laid out; the parameter acquisition unit 202 can obtain the circuit parameters and functional parameters of the target module in combination with the schematic diagram, and divide the components according to the functional parameters to determine the components corresponding to each function; the automatic placement unit 203 can automatically place the components in combination with the circuit parameters and the functional parameters, and output at least two automatic placement results of the target module; the automatic routing unit 204 can obtain the automatic placement results of the traces to be routed and perform automatic routing, wherein the automatic routing unit 204 can specifically set the current magnitude and the trace width to be positively correlated, so as to determine the trace width corresponding to different types of signals according to the relationship; determine the routing constraints of different signals according to the signal type, the signal type includes at least power signals, ordinary signals, sensitive signals and feedback signals; perform automatic routing on the automatic placement results according to the routing constraints; and display the routing results through an interactive window to support the user to manually adjust the routing results through the interactive window.

[0073] It should be noted that the aforementioned DC-DC module automatic design interactive system can execute the DC-DC module automatic design method provided in the embodiments of this application, and has the corresponding functional modules and beneficial effects of the method. Technical details not described in detail in the embodiments of the DC-DC module automatic design interactive system can be found in the DC-DC module automatic design method provided in the embodiments of this application.

[0074] The system embodiments described above are merely illustrative. The units described as separate components may or may not be physically separate. The components shown as units may or may not be physical units; that is, they may be located in one place or distributed across multiple network units. Some or all of the modules can be selected to achieve the purpose of this embodiment according to actual needs.

[0075] This application provides an electronic device, combined with... Figure 14 , Figure 14This is a schematic diagram of the structure of an electronic device provided in an embodiment of this application. The electronic device 300 includes at least one processor 301 and a memory 302 communicatively connected to the at least one processor 301. The memory 302 stores instructions executable by the at least one processor 301. These instructions, when executed by the at least one processor 301, enable the at least one processor 301 to perform the automatic design method for the DC-DC module in the above-described method embodiment. The processor 301 and the memory 302 can be connected via a bus or other means. Figure 14 Taking the example of a connection between China and Israel via a bus.

[0076] Processor 301 can be a general-purpose processor, including a central processing unit (CPU), a network processor (NP), a hardware chip, or any combination thereof; it can also be a digital signal processor (DSP), an application-specific integrated circuit (ASIC), a programmable logic device (PLD), or a combination thereof. The aforementioned PLD can be a complex programmable logic device (CPLD), a field-programmable gate array (FPGA), a generic array logic (GAL), or any combination thereof.

[0077] Memory 302, as a non-transitory computer-readable storage medium, can be used to store non-transitory software programs, non-transitory computer-executable programs, and modules. Processor 301, by running the non-transitory software programs, instructions, and modules stored in memory 302, can implement the automatic DCDC module design method in any of the above method embodiments, that is, it can achieve... Figure 1 The entire process.

[0078] The electronic devices in this application embodiment exist in various forms, including but not limited to: a) Ultra-mobile personal computer devices, which fall under the category of personal computers, have computing and processing functions, and generally also have mobile internet access capabilities. These devices include PDAs, MIDs, and UMPCs, such as laptops. b) Servers: devices that provide computing services. Servers consist of processors, hard disks, memory, system buses, etc. Servers are similar to general computer architectures, but due to the need to provide highly reliable services, they have higher requirements in terms of processing power, stability, reliability, security, scalability, and manageability. c) Other electronic devices with data interaction functions. The above products can execute the automatic design method for DC-DC modules provided in this embodiment of the invention and have the corresponding functional modules for executing the method. Technical details not described in detail in this embodiment can be found in the automatic design method for DC-DC modules provided in this embodiment of the invention.

[0079] Through the above description of the embodiments, those skilled in the art can clearly understand that each embodiment can be implemented using software and a general-purpose hardware platform, or of course, using hardware. Those skilled in the art will understand that all or part of the processes in the above embodiments can be implemented by a computer program instructing related hardware. The program can be stored in a computer-readable storage medium, and when executed, it can include the processes of the embodiments of the above methods. The storage medium can be a magnetic disk, optical disk, read-only memory (ROM), or random access memory (RAM), etc.

[0080] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application, and not to limit them; under the concept of this application, the technical features of the above embodiments or different embodiments can also be combined, the steps can be implemented in any order, and there are many other variations of different aspects of this application as described above, which are not provided in detail for the sake of brevity; although this application has been described in detail with reference to the foregoing embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or make equivalent substitutions for some of the technical features; and these modifications or substitutions do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of this application.

Claims

1. An automatic design method for DC-DC modules, applied to an interactive system for automatic design of DC-DC modules, characterized in that, The method includes: Obtain the target module from the DCDC modules to be laid out; The circuit parameters and functional parameters of the target module are obtained by combining the schematic diagram, and the components are divided according to the functional parameters to determine the components corresponding to each function. The components are automatically laid out based on the circuit parameters and the functional parameters, and at least two automatic layout results of the target module are output.

2. The method according to claim 1, characterized in that, The step of obtaining the target module from the DC-DC modules to be laid out includes: Obtain general-purpose chip materials based on the imported schematic diagram; Based on the general chip material, identify and display all DC-DC modules to be laid out; Get the DC-DC module selected by the user as the target module.

3. The method according to claim 1, characterized in that, The circuit parameters include at least one of the following: number of chip pins, topology, input voltage, output voltage, input current, and output current.

4. The method according to claim 1, characterized in that, The functional parameters are used to describe the functions of the components, including but not limited to: input capacitance, output capacitance, chip, feedback, bootstrapping, enable, and inductance.

5. The method according to claim 1, characterized in that, The step of dividing components according to the functional parameters to determine the components corresponding to each function further includes: The circuit parameters and the components corresponding to each function are displayed through an interactive window, allowing users to adjust the components corresponding to each function through the interactive window.

6. The method according to claim 1, characterized in that, The automatic placement of the components by combining the circuit parameters and the functional parameters includes: The layout condition range corresponding to the components is determined according to the circuit parameters and the functional parameters. The layout condition range is used to constrain the positional relationship between the components and other components so that the components do not interfere with each other. Different types of components are set with different layout condition ranges, and the same type of components with different functions are set with different layout condition ranges. Based on the aforementioned layout conditions, the components are automatically laid out according to the schematic diagram.

7. The method according to claim 6, characterized in that, The layout condition range includes the layout condition range for both the input capacitor and the output capacitor, and further includes: The distance between the input capacitor and the chip pin is set to be less than a first preset distance; The input capacitor ground is connected to the chip ground on the same layer, and the distance between them is less than the second preset distance; The distance between the output capacitor and the output terminal of the target module is set to be less than a third preset distance; The output capacitor ground is connected to the chip ground on the same layer, and the distance between them is less than the fourth preset distance.

8. The method according to claim 6, characterized in that, The layout condition range includes the layout condition range of the chip, and further includes: The distance between the chip and the inductor is set to be less than a fifth preset distance; A blank area is provided around the chip for heat dissipation.

9. The method according to claim 6, characterized in that, The step of automatically placing the components according to the schematic diagram, based on the layout condition range, to ensure that the automatic layout result at least meets the requirement of no crossover of traces, includes: The components contained in the target module are arranged according to the layout conditions. Based on the schematic diagram, the target module with the components placed is simulated for routing. The automatic layout result is adjusted according to the routing simulation result so that the automatic layout result meets the requirement of no routing intersection. Within the layout conditions, reduce the distance between adjacent components to reduce the area occupied by the target module; Obtain data related to chip power consumption from the circuit parameters, and adjust the automatic layout result based on the data.

10. The method according to claim 9, characterized in that, The placement of the components included in the target module based on the layout condition range also includes: Based on the placement plane, a planar coordinate system is established with the lower left corner of the placement area as the origin and the bottom edge of the placement area as the X-axis. The placement angle of the components in the planar coordinate system is controlled to satisfy 0°, 90°, 180° and 270°. Control the edge position or center position of at least one group of adjacent components to ensure that the horizontal or vertical coordinates are the same, so that the at least one group of adjacent components are arranged neatly.

11. The method according to claim 1, characterized in that, The method also includes obtaining the automatic layout result of the trace to be routed and performing automatic routing, specifically including: The relationship between current magnitude and line width is set to be positively correlated, so that the trace width corresponding to different types of signals can be determined according to the relationship. The routing constraints for different signals are determined based on the type of signal, and the types of signals include at least power signals, ordinary signals, sensitive signals, and feedback signals. Automatic routing is performed on the automatic layout result according to the routing constraints, and the routing result is displayed through an interactive window to support users in manually adjusting the routing result through the interactive window.

12. The method according to claim 11, characterized in that, The routing constraints for the power signal include: setting the routing width of the power signal to be greater than a first preset line width; The routing constraints for the sensitive signal include: setting a ground plane around the routing of the sensitive signal; The routing constraints for the feedback signal include: setting the feedback signal routing to be non-adjacent to the inductor, and setting a ground line around the feedback signal routing.

13. The method according to claim 11, characterized in that, The automatic routing process, which involves obtaining the automatic layout result of the wire to be routed, further includes: Adjust the direction of the solder pad's output line, prioritizing center output; Adjust the distance between vias and between vias and the board edge to be greater than the hole spacing threshold; If there are prohibited wiring areas on the wiring panel, the wiring range should be restricted to avoid those areas.

14. The method according to claim 11, characterized in that, The automatic routing process, which involves obtaining the automatic layout result of the wire to be routed, further includes: The at least two automatic layout results are displayed through an interactive window to allow users to manually adjust the automatic layout results through the interactive window. The auto layout result selected by the user is used as the auto layout result for the wiring to be routed.

15. The method according to claim 1, characterized in that, The method further includes: Obtain user feedback or ratings on the automatic layout results; The reward direction is adjusted based on the evaluation or score to assist in machine learning.

16. An automatic design interactive system for DC-DC modules, characterized in that, The interactive system includes: The module selection unit is used to obtain the target module from the DCDC modules to be laid out; The parameter acquisition unit is used to acquire the circuit parameters and functional parameters of the target module in combination with the schematic diagram, and divide the components according to the functional parameters to determine the components corresponding to each function. An automatic placement unit is used to automatically place the components by combining the circuit parameters and the functional parameters, and output at least two automatic placement results for the target module.

17. The interactive system according to claim 16, characterized in that, The interactive system also includes an automatic routing unit, used to obtain the automatic layout results of the wiring to be routed and perform automatic routing, specifically for: The relationship between current magnitude and line width is set to be positively correlated, so that the trace width corresponding to different types of signals can be determined according to the relationship. The routing constraints for different signals are determined based on the type of signal, and the types of signals include at least power signals, ordinary signals, sensitive signals, and feedback signals. Automatic routing is performed on the automatic layout result according to the routing constraints; The routing results are displayed through an interactive window to allow users to manually adjust the routing results.

18. An electronic device, characterized in that, The electronic device includes: At least one processor, and; A memory communicatively connected to the at least one processor, wherein the memory stores instructions executable by the at least one processor, the instructions being executed by the at least one processor to enable the at least one processor to perform the automatic design method for DC-DC modules as described in any one of claims 1-15.

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