Display panel and electronic device including the same

Abstract

The invention relates to a display panel and an electronic device including the same. The display panel comprises a pixel circuit group which comprises a first pixel circuit, a second pixel circuit and a third pixel circuit; a first pixel electrode overlapping the first pixel circuit in a plan view; a second pixel electrode overlapping the second pixel circuit in a plan view; a third pixel electrode overlapping the third pixel circuit in a plan view; and a connection electrode disposed under the first pixel electrode, the second pixel electrode, and the third pixel electrode. In a plan view, one end of the connection electrode overlaps the first pixel electrode, and the other end of the connection electrode overlaps the second pixel electrode.

Description

[0001] Cross-references to related applications

[0002] This application claims priority and benefit to Korean Patent Application No. 10-2024-0153717, filed on November 1, 2024, with the Korean Intellectual Property Office (KIPO), the entire contents of which are incorporated herein by reference. Technical Field

[0003] The implementation relates to a display panel and an electronic device including the display panel. Background Technology

[0004] The display panel may include multiple pixels. Each pixel may include subpixels that emit light of different colors. Each subpixel may include a light-emitting element and pixel circuitry, the light-emitting element including an emitting layer, and the pixel circuitry configured to control the brightness of the light-emitting element. The pixel circuitry may include thin-film transistors, capacitors, and lines.

[0005] Recently, display panels have become thinner and lighter, and therefore can be used in a variety of electronic devices. Because display panels, as described above, are widely used, various forms of display panels and electronic devices incorporating display panels have been designed. Summary of the Invention

[0006] Defects in some pixel circuits can cause bright or dark spots to appear on a display panel. In this regard, embodiments include display panels that display high-quality images using a repair process that connects light-emitting diodes connected to defective pixel circuits to normal pixel circuits, as well as electronic devices including the display panels. However, the scope of this disclosure is not limited thereto.

[0007] Other aspects will be set forth in part in the description which follows, and in part will be apparent from the description, or may be learned by practice of embodiments of this disclosure.

[0008] According to an embodiment, the display panel may include: a pixel circuit group, including a first pixel circuit, a second pixel circuit, and a third pixel circuit; a first pixel electrode, overlapping the first pixel circuit in a plan view; a second pixel electrode, overlapping the second pixel circuit in a plan view; a third pixel electrode, overlapping the third pixel circuit in a plan view; and a connecting electrode, disposed below the first pixel electrode, the second pixel electrode, and the third pixel electrode. In the plan view, one end of the connecting electrode may overlap with the first pixel electrode, and the other end of the connecting electrode may overlap with the second pixel electrode.

[0009] In an embodiment, the display panel may further include a dam layer disposed above the first pixel electrode, the second pixel electrode, and the third pixel electrode, the dam layer including a first opening overlapping the first pixel electrode in a plan view, a second opening overlapping the second pixel electrode, and a third opening overlapping the third pixel electrode.

[0010] In an implementation, the first opening may be larger than the second and third openings in a plan view, and the second opening may be smaller than the third opening in a plan view.

[0011] In an implementation, the second pixel electrode may include a first portion and a second portion, the first portion overlapping the second opening in a plan view, and the second portion being spaced apart from the first portion and having a gap between the first portion and the second portion, and in a plan view, the gap may extend along a portion of the edge of the second opening.

[0012] In one embodiment, the second part may include a contact portion electrically connected to the second pixel circuit, and the connecting electrode may connect the first pixel electrode and the second part to each other.

[0013] In one embodiment, the second pixel electrode and the third pixel electrode may be adjacent to each other in the first direction, and the second pixel electrode may include a protrusion protruding in a second direction intersecting the first direction.

[0014] In an implementation, the second part may include a protrusion.

[0015] In an implementation, each of the first pixel circuit, the second pixel circuit, and the third pixel circuit may include: a first transistor including a gate, a first terminal, and a second terminal, the gate being connected to a first node, the first terminal being connected to a drive voltage line, and the second terminal being connected to a second node; a second transistor connected between the first node and one of the first data line, the second data line, and the third data line; a third transistor connected between the initialization sensing line and the second node; and a capacitor connected between the first node and the second node.

[0016] In one embodiment, the second transistor of the first pixel circuit can be connected to the first data line, the second node of the first pixel circuit can be connected to the first pixel electrode, the second transistor of the second pixel circuit can be connected to the second data line, the second node of the second pixel circuit can be connected to the second pixel electrode, the second transistor of the third pixel circuit can be connected to the third data line, and the second node of the third pixel circuit can be connected to the third pixel electrode.

[0017] In one implementation, the second transistor of the second pixel circuit can be connected to the first data line, and the second node of the second pixel circuit can be connected to the first pixel electrode.

[0018] According to an embodiment, the display panel may include: a pixel circuit group, including a first pixel circuit, a second pixel circuit, and a third pixel circuit; a first pixel electrode, overlapping the first pixel circuit in a planar view; a second pixel electrode, overlapping the second pixel circuit in a planar view; a third pixel electrode, overlapping the third pixel circuit in a planar view; and a connecting electrode connecting the first pixel electrode and the second pixel electrode to each other. The second pixel electrode may include a first portion and a second portion, the second portion being spaced apart from the first portion and having a gap between the first portion and the second portion, and the second portion being connected to the connecting electrode.

[0019] In an embodiment, the display panel may further include a dam layer disposed above the first pixel electrode, the second pixel electrode, and the third pixel electrode, the dam layer including a first opening overlapping the first pixel electrode in a plan view, a second opening overlapping the second pixel electrode, and a third opening overlapping the third pixel electrode.

[0020] In an implementation, the first opening may be larger than the second and third openings in a plan view, and the second opening may be smaller than the third opening in a plan view.

[0021] In an implementation, in a plan view, the gap may extend along a portion of the edge of the second opening.

[0022] In one embodiment, the second part may include a contact portion electrically connected to the second pixel circuit, and the connecting electrode may connect the first pixel electrode and the second part to each other.

[0023] In one embodiment, the second pixel electrode and the third pixel electrode may be adjacent to each other in the first direction, and the second pixel electrode may include a protrusion protruding in a second direction intersecting the first direction.

[0024] In an implementation, the first part may include a protrusion.

[0025] In an implementation, the second part may include a protrusion.

[0026] According to an embodiment, the electronic device may include a display panel and a processor for driving the display panel. The display panel may include: a pixel circuit group, including a first pixel circuit, a second pixel circuit, and a third pixel circuit; a first pixel electrode, overlapping the first pixel circuit in a plan view; a second pixel electrode, overlapping the second pixel circuit in a plan view; a third pixel electrode, overlapping the third pixel circuit in a plan view; and a connecting electrode disposed below the first pixel electrode, the second pixel electrode, and the third pixel electrode. In the plan view, one end of the connecting electrode overlaps with the first pixel electrode, and the other end of the connecting electrode overlaps with the second pixel electrode.

[0027] According to an embodiment, the electronic device may include a display panel and a processor driving the display panel. The display panel may include: a pixel circuit group including a first pixel circuit, a second pixel circuit, and a third pixel circuit; a first pixel electrode overlapping the first pixel circuit in a planar view; a second pixel electrode overlapping the second pixel circuit in a planar view; a third pixel electrode overlapping the third pixel circuit in a planar view; and a connecting electrode connecting the first pixel electrode and the second pixel electrode to each other. The second pixel electrode may include a first portion and a second portion, the second portion being spaced apart from the first portion and having a gap between the first portion and the second portion, and the second portion being connected to the connecting electrode.

[0028] Other aspects, features, and advantages, in addition to those described above, will become apparent from the following figures, claims, and detailed description. Attached Figure Description

[0029] The above and other aspects, features and advantages of certain embodiments of the present disclosure will become more apparent from the following description taken in conjunction with the accompanying drawings, in which: Figure 1 This is a schematic perspective view of an electronic device according to an embodiment; Figure 2 This is a schematic cross-sectional view of each sub-pixel of the display panel according to the embodiment; Figure 3 yes Figure 2 A schematic diagram of each optical component of the color conversion transmission layer; Figure 4 This is a schematic diagram of the equivalent circuit of a normal pixel according to the implementation method; Figure 5 This is a schematic diagram of the equivalent circuit of the repaired pixel according to the implementation method; Figure 6 This is a schematic plan view of the area of ​​the display panel according to the embodiment; Figure 7 It is along Figure 6 The line I-I' intercepted Figure 6 A schematic cross-sectional view of the display panel; Figure 8A This is a schematic plan view of the area of ​​the display panel according to the embodiment; Figure 8B It is shown Figure 8A A plan view of the second pixel electrode shown; Figure 9 It is along Figure 8A The line II-II' intercepted Figure 8A A schematic cross-sectional view of the display panel; Figure 10This is a schematic plan view of the area of ​​the display panel according to the embodiment; Figure 11 It is along Figure 10 The line III-III' intercepted Figure 10 A schematic cross-sectional view of the display panel; Figure 12A This is a schematic plan view of the area of ​​the display panel according to the embodiment; Figure 12B It is shown Figure 12A A plan view of the second pixel electrode shown; Figure 13 It is a schematic plan view of the area of ​​the display panel according to the embodiment; and Figure 14 This is a schematic block diagram of an electronic device according to an embodiment. Detailed Implementation

[0030] Reference will now be made in detail to embodiments, examples of which are shown in the accompanying drawings, wherein the same reference numerals denote the same elements throughout. In this respect, embodiments may take different forms and should not be construed as limited to the description set forth herein. Therefore, embodiments are described below only with reference to the accompanying drawings to explain various aspects of this specification.

[0031] In the specification and claims, the phrase "at least one of..." is intended to include the meaning of "at least one selected from the group consisting of..." for purposes of its meaning and interpretation. For example, "at least one of A and B" can be understood to mean "A, B, or A and B". In the specification and claims, the term "and / or" is intended to include any combination of the terms "and" and "or" for purposes of its meaning and interpretation. For example, "A and / or B" can be understood to mean "A, B, or A and B". The terms "and" and "or" can be used in combined or separate meanings and can be understood as equivalent to "and / or".

[0032] Because various modifications can be applied and multiple implementations can be achieved, specific embodiments will be shown in the accompanying drawings and described in detail in the written description. Effects and features, as well as methods for implementing them, will be elucidated with reference to the embodiments described in detail below with reference to the accompanying drawings. However, embodiments may take different forms and should not be construed as limited to the description set forth herein.

[0033] In the following description, embodiments will now be described in detail with reference to the accompanying drawings. When describing with reference to the drawings, the same or corresponding elements will be given the same reference numerals, and redundant descriptions of these elements will be omitted.

[0034] Although the terms “first,” “second,” etc., may be used herein to describe various types of elements, these elements should not be limited by these terms. These terms are used to distinguish one element from another. Therefore, the first element discussed below may be referred to as the second element without departing from the teachings of this disclosure.

[0035] As used in this article, the singular form includes the plural form unless the context clearly indicates otherwise.

[0036] The terminology used herein is for the purpose of describing particular embodiments and is not intended to be limiting. As used herein, the singular forms “a,” “an,” and “the” are intended to include the plural forms as well, unless the context clearly indicates otherwise. Furthermore, when used in this specification, the terms “comprising,” “including,” “containing,” and / or “comprising” specify the presence of the stated feature, integral, step, operation, element, component, and / or group thereof, but do not exclude the presence or addition of one or more other features, integrals, steps, operations, elements, components, and / or groups thereof.

[0037] When a component or layer is referred to as being "on," "connected to," or "attached to" another component or layer, it can be directly on, directly connected to, or directly attached to the other component or layer, or there may be an intervening component or layer. However, when a component or layer is referred to as being "directly" on, directly connected to, or directly attached to another component or layer, there is no intervening component or layer. Therefore, the term "connection" can refer to a physical connection, electrical connection, and / or fluid connection with or without an intervening component. Furthermore, when a component is referred to as being "in contact" or "in contact with" another component, the component can be in "electrical contact" or "physical contact" with the other component; or in "indirect contact" or "direct contact" with the other component.

[0038] In this specification, the x-axis, y-axis, and z-axis are not limited to the directions of the three axes of a rectangular coordinate system, and can be interpreted in a broader sense. For example, the x-axis, y-axis, and z-axis can be orthogonal to each other, but they can also refer to different directions that are not orthogonal to each other.

[0039] In this specification, the term "plane" means when the target portion is viewed from above (e.g., when viewed in a direction perpendicular to the upper surface of the substrate), and the term "section" means when a vertical cut section of the target portion is viewed from the side.

[0040] In this specification, when the first element overlaps with the second element, this may mean that the first element is arranged above or below the second element and at least partially overlaps with the second element in a plan view.

[0041] In this specification, the term "on" as used in relation to the state of a component can refer to the active state of the component, and "off" can refer to the deactivated state of the component. The term "on" as used in relation to a signal received by the component can refer to a signal that activates the component, and "off" can refer to a signal that deactivates the component. A component can be activated by a high-level voltage or a low-level voltage. For example, a P-channel transistor (P-type transistor) is activated by a low-level voltage, and an N-channel transistor (N-type transistor) is activated by a high-level voltage. Therefore, it should be understood that the "on" voltages for P-type and N-type transistors are opposite (low and high) voltage levels.

[0042] In this specification, when a particular implementation can be carried out differently, the specific process sequence can also be performed differently from the stated sequence. As an example, two processes described consecutively can be performed substantially simultaneously or in the reverse order.

[0043] For ease of description, the dimensions of the elements in the accompanying drawings may be exaggerated. For example, since the dimensions and thicknesses of the elements in the drawings are arbitrarily shown for ease of explanation, the following embodiments are not limited thereto.

[0044] The term "about" can include variations from a specified value, such as ±20%, ±10%, or ±5%, unless otherwise explicitly stated. In some cases, the term may interpret rounding, inherent measurement limitations, or standard tolerances recognized in the relevant art. When applied to dimensions, concentrations, or other quantifiable parameters, "about" can include minor deviations that would be understood by one of ordinary skill in the art as non-material in the given context. The scope of "about" should be interpreted according to standard laboratory or clinical tolerances applicable to the field of use. Those skilled in the art will recognize that "about" allows for practical deviations that do not materially alter the intended nature of the invention. Similarly, for mechanical dimensions, "about" can include deviations within industrially acceptable tolerances that do not materially affect the performance of this disclosure.

[0045] Unless otherwise defined or implied herein, all terms used (including technical and scientific terms) shall have the same meaning as commonly understood by one of ordinary skill in the art to which this disclosure pertains. It will also be understood that terms (such as those defined in common dictionaries) shall be interpreted as having a meaning consistent with their meaning in the context of the relevant art and shall not be interpreted as having an ideal or overly formal meaning unless clearly defined in the specification.

[0046] Figure 1 This is a schematic perspective view of an electronic device DV according to an embodiment.

[0047] refer to Figure 1An electronic device (DV) may include a display area (DA) and a non-display area (NDA) outside the display area (DA).

[0048] An electronic device (DV) can provide an image using an array of multiple pixels arranged two-dimensionally on a plane within a display area (DA). Each pixel may include a first sub-pixel Pg, a second sub-pixel Pb, and a third sub-pixel Pr. The first sub-pixel Pg, the second sub-pixel Pb, and the third sub-pixel Pr may be areas that emit green light, blue light, and red light, respectively. The electronic device (DV) can provide an image using the light emitted from the sub-pixels.

[0049] The non-display area NDA can be an area in which no subpixels are disposed and no image is provided. In a plan view, the non-display area NDA can surround at least a portion of the display area DA. Drivers or power lines configured to provide electrical signals or power to subpixel circuitry (hereinafter also referred to as pixel circuitry) can be arranged in the non-display area NDA. The non-display area NDA may include pads that electrically connect the display panel, printed circuit board, and electronic components to each other.

[0050] The display area DA can have a polygonal shape in a planar drawing. For example, as shown below. Figure 1 As shown, the display area DA can have a rectangular shape, the length of which in a first direction (e.g., the x-direction) is greater than its length in a second direction (e.g., the y-direction). For example, the display area DA can have a rectangular shape, the length of which in the first direction (e.g., the x-direction) is less than its length in the second direction (e.g., the y-direction), or it can have a square shape. In another embodiment, the display area DA can have various shapes, such as an elliptical shape or a circular shape.

[0051] The electronic device DV according to the embodiments can be a display device for displaying moving or still images, and can be a variety of electronic devices including not only portable electronic devices such as mobile phones, smartphones, tablet personal computers (PCs), mobile communication terminals, e-notebooks, e-book readers, portable multimedia players (PMPs), navigation devices, or ultra-mobile PCs (UMPCs), but also televisions, laptops, monitors, billboards, and Internet of Things (IoT) devices. The electronic device DV according to the embodiments can be a wearable device, such as a smartwatch, watch phone, glasses-type display, or head-mounted display (HMD). The electronic device DV according to the embodiments can be a central information display (CID) located on the vehicle's dashboard, center dashboard, or instrument panel, an interior mirror display replacing the vehicle's side mirrors, or a user interface device located behind the front seats for rear-seat entertainment in the vehicle.

[0052] Figure 2This is a schematic cross-sectional view of each sub-pixel of the display panel 10 according to the embodiment.

[0053] refer to Figure 2 The display panel 10 may include a substrate 100, a circuit layer 200, a light-emitting diode layer 300, an encapsulation layer 400, a color conversion transmission layer 500, a color filter layer 600, and a transmission substrate layer 700.

[0054] Substrate 100 may comprise glass, metal, or polymer resin. When substrate 100 is flexible or bendable, it may comprise polymer resins such as polyethersulfone, polyacrylate, polyetherimide, polyethylene naphthalate, polyethylene terephthalate, polyphenylene sulfide, polyarylate, polyimide, polycarbonate, or cellulose acetate propionate. Various modifications are possible. For example, substrate 100 may have a multilayer structure comprising two layers and a barrier layer, the two layers comprising polymer resins, and the barrier layer comprising an inorganic material (e.g., silicon oxide, silicon nitride, or silicon oxynitride) and located between the two layers.

[0055] The circuit layer 200 and the light-emitting diode layer 300 can be disposed on the substrate 100. The circuit layer 200 may include a first pixel circuit PC1, a second pixel circuit PC2 and a third pixel circuit PC3, and the first pixel circuit PC1, the second pixel circuit PC2 and the third pixel circuit PC3 can be electrically connected to the first light-emitting diode LED1, the second light-emitting diode LED2 and the third light-emitting diode LED3 of the light-emitting diode layer 300, respectively.

[0056] The first light-emitting diode (LED1), the second light-emitting diode (LED2), and the third light-emitting diode (LED3) may each comprise an organic light-emitting diode containing organic materials. In another embodiment, the first light-emitting diode (LED1), the second light-emitting diode (LED2), and the third light-emitting diode (LED3) may each comprise an inorganic light-emitting diode containing inorganic materials. The inorganic light-emitting diode may include a PN junction diode comprising materials based on inorganic semiconductors. The inorganic light-emitting diode may have a width of several micrometers to hundreds of micrometers or several nanometers to hundreds of nanometers. In some embodiments, the emitting layer of each of the first light-emitting diode (LED1), the second light-emitting diode (LED2), and the third light-emitting diode (LED3) may include organic materials, inorganic materials, quantum dots, organic materials and quantum dots, or inorganic materials and quantum dots.

[0057] The first light-emitting diode (LED1), the second light-emitting diode (LED2), and the third light-emitting diode (LED3) can emit light of the same color. For example, the first light-emitting diode (LED1), the second light-emitting diode (LED2), and the third light-emitting diode (LED3) can emit light with wavelengths in a first wavelength band (e.g., blue light Lb). The first wavelength band can, for example, be in the range of about 450 nm to about 495 nm. The light emitted from the first light-emitting diode (LED1), the second light-emitting diode (LED2), and the third light-emitting diode (LED3) (e.g., blue light Lb) can pass through the color conversion transmission layer 500 after passing through the encapsulation layer 400 on the light-emitting diode layer 300.

[0058] The color conversion transmission layer 500 may include an optical portion that converts the color of light emitted from the light-emitting diode layer 300 (e.g., blue light Lb) or transmits light without converting its color. For example, the color conversion transmission layer 500 may include a color conversion portion that converts light emitted from the light-emitting diode layer 300 (e.g., blue light Lb) into another color, and a transmission portion that transmits light emitted from the light-emitting diode layer 300 (e.g., blue light Lb) without converting its color. The color conversion transmission layer 500 may include a second color conversion portion 520 corresponding to a first sub-pixel Pg, a transmission portion 530 corresponding to a second sub-pixel Pb, and a first color conversion portion 510 corresponding to a third sub-pixel Pr. The first color conversion portion 510 can convert light having a wavelength in a first wavelength band (e.g., blue light Lb) into light having a wavelength in a second wavelength band (e.g., red light Lr). The second wavelength band may, for example, be in the range of about 630 nm to about 780 nm. The second color conversion section 520 can convert light having a wavelength in the first wavelength band (e.g., blue light Lb) into light having a wavelength in the third wavelength band (e.g., green light Lg). The third wavelength band can, for example, be in the range of about 495 nm to about 570 nm. The transmission section 530 can transmit light having a wavelength in the first wavelength band (e.g., blue light Lb) without converting the color of the light. However, this disclosure is not limited thereto. The wavelength band of the light emitted from the light-emitting diode layer 300 (e.g., blue light Lb) and the wavelength band of the converted light can be modified differently.

[0059] A color filter layer 600 may be disposed on the color conversion transmission layer 500. The color filter layer 600 may include a first color filter 610, a second color filter 620, and a third color filter 630 of different colors. For example, the first color filter 610 may include a red color filter that allows only light with wavelengths in the range of about 630 nm to about 780 nm to pass through. The second color filter 620 may include a green color filter that allows only light with wavelengths in the range of about 495 nm to about 570 nm to pass through. The third color filter 630 may include a blue color filter that allows only light with wavelengths in the range of about 450 nm to about 495 nm to pass through.

[0060] In one embodiment, although not shown in the drawings, a black matrix can be formed between the first color filter 610, the second color filter 620, and the third color filter 630. In another embodiment, the first color filter 610 may have openings corresponding to the first sub-pixel Pg and the second sub-pixel Pb, the second color filter 620 may have openings corresponding to the third sub-pixel Pr and the second sub-pixel Pb, and the third color filter 630 may have openings corresponding to the third sub-pixel Pr and the first sub-pixel Pg. The overlapping portion of the first color filter 610, the second color filter 620, and the third color filter 630 in the plan view, excluding the openings corresponding to the first sub-pixel Pg, the second sub-pixel Pb, and the third sub-pixel Pr, can be used as a black matrix.

[0061] Color purity can be improved when light converted by the color conversion transmission layer 500 and light transmitted by the color conversion transmission layer 500 pass through the first color filter 610, the second color filter 620, and the third color filter 630. In addition, the color filter layer 600 can prevent or significantly reduce external light (e.g., light incident on the display panel 10 from the outside of the display panel 10) from being reflected and seen by the user.

[0062] In one embodiment, the transmissive substrate layer 700 may be included on the color filter layer 600. The transmissive substrate layer 700 may include glass or a transmissive organic material. For example, the transmissive substrate layer 700 may include a transmissive organic material, such as acrylic resin.

[0063] In an embodiment, the transmissive substrate 700 can be one type of substrate. After the color filter layer 600 and the color conversion transmissive layer 500 are formed on the surface of the transmissive substrate 700, the transmissive substrate 700 can be bonded to the substrate 100 such that the color conversion transmissive layer 500 faces the encapsulation layer 400.

[0064] In another embodiment, after the color conversion transmission layer 500 and the color filter layer 600 are sequentially formed on the encapsulation layer 400, the transmission substrate layer 700 can be formed by directly applying it to the color filter layer 600 and curing it. In this embodiment, although not shown in the figures, another optical film, such as an anti-reflective (AR) film, can be disposed on the transmission substrate layer 700.

[0065] Figure 3 yes Figure 2 A schematic diagram of each optical component of the color conversion transmission layer 500.

[0066] The first color conversion section 510 can convert the incident blue light Lb into red light Lr. For example... Figure 3 As shown, the first color conversion portion 510 may include a first photosensitive polymer 1151 and a first quantum dot 1152 and a first scattering particle 1153 dispersed in the first photosensitive polymer 1151.

[0067] The first quantum dot 1152 can be excited by blue light Lb, thereby isotropically emitting red light Lr with a wavelength longer than that of blue light Lb. The first photosensitive polymer 1151 may include a light-transmitting organic material.

[0068] Quantum dots can be crystals of semiconductor compounds and can include materials that emit light in an emission wavelength band, depending on the size of the crystal. The diameter of each quantum dot can, for example, range from about 1 nm to about 10 nm.

[0069] Quantum dots can be synthesized via wet chemical processes, metal-organic chemical vapor deposition (MOCVD), molecular beam epitaxy (MBE), or similar processes. Wet chemical processes involve growing quantum dot crystals after mixing an organic solvent with a precursor material. In wet chemical processes, the organic solvent naturally acts as a dispersant coordinating with the surface of the quantum dot crystals during crystal growth, regulating the crystal growth. Therefore, wet chemical processes are easier to perform than vapor deposition methods such as MOCVD or MBE. Wet chemical processes are low-cost and allow for controlled growth of quantum dot particles.

[0070] Quantum dots can include group III-VI semiconductor compounds, group II-VI semiconductor compounds, group III-V semiconductor compounds, group I-III-VI semiconductor compounds, group IV-VI semiconductor compounds, group IV elements, group IV compounds, or combinations thereof.

[0071] Examples of III-VI semiconductor compounds may include binary compounds such as GaS, GaSe, Ga2Se3, GaTe, InS, InSe, In2Se3 or InTe, ternary compounds such as InGaS3 or InGaSe3 or combinations thereof.

[0072] Examples of group II-VI semiconductor compounds may include binary compounds such as CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnO, HgS, HgSe, HgTe, MgSe, or MgS; ternary compounds such as CdSeS, CdSeTe, CdSTe, ZnSeS, ZnSeTe, ZnSTe, HgSeS, HgSeTe, HgSTe, CdZnS, CdZnSe, CdZnTe, CdHgS, CdHgSe, CdHgTe, HgZnS, HgZnSe, HgZnTe, MgZnSe, or MgZnS; and quaternary compounds such as CdZnSeS, CdZnSeTe, CdZnSTe, CdHgSeS, CdHgSeTe, CdHgSTe, HgZnSeS, HgZnSeTe, or HgZnSTe, or combinations thereof.

[0073] Examples of group III-V semiconductor compounds may include binary compounds such as GaN, GaP, GaAs, GaSb, AlN, AlP, AlAs, AlSb, InN, InP, InAs, or InSb; ternary compounds such as GaNP, GaNAs, GaNSb, GaPAs, GaPSb, AlNP, AlNAs, AlNSb, AlPAs, AlPSb, InGaP, InNP, InAlP, InNAs, InNSb, InPAs, or InPSb; and quaternary compounds such as GaAlNAs, GaAlNP, GaAlNSb, GaAlPAs, GaAlPSb, GaInNP, GaInNAs, GaInNSb, GaInPAs, GaInPSb, InAlNP, InAlNAs, InAlNSb, InAlPAs, or InAlPSb, or combinations thereof. In embodiments, group III-V semiconductor compounds may also include group II elements. Examples of group III-V semiconductor compounds that also include group II elements may include InZnP, InGaZnP, or InAlZnP.

[0074] Examples of group I-III-VI semiconductor compounds may include ternary compounds or combinations thereof such as AgInS, AgInS2, CuInS, CuInS2, CuGaO2, AgGaO2, or AgAlO2.

[0075] Examples of group IV-VI semiconductor compounds may include binary compounds such as SnS, SnSe, SnTe, PbS, PbSe, or PbTe; ternary compounds such as SnSeS, SnSeTe, SnSTe, PbSeS, PbSeTe, PbSTe, SnPbS, SnPbSe, or SnPbTe; quaternary compounds such as SnPbSSe, SnPbSeTe, or SnPbSTe; or combinations thereof.

[0076] Group IV elements or compounds may include elements such as silicon (Si) or germanium (Ge), binary compounds such as SiC or SiGe, or combinations thereof.

[0077] Each element in a multi-element compound, such as a binary, ternary, or quaternary compound, may exist in the particles at a uniform or non-uniform concentration.

[0078] Quantum dots can have a core-shell structure or a single structure in which the concentration of each element contained in the quantum dot is uniform. For example, the materials contained in the core and the materials contained in the shell can be different. The shell of the quantum dot can be used as a protective layer to maintain semiconductor properties by preventing chemical denaturation of the core and / or as a charging layer to impart electrophoretic properties to the quantum dot. The shell can comprise a single layer or multiple layers. The interface between the core and the shell can have a concentration gradient in which the concentration of the elements present in the shell decreases toward the core.

[0079] Examples of shells for quantum dots can include metal oxides, non-metal oxides, semiconductor compounds, or combinations thereof. Examples of metal oxides or non-metal oxides can include binary compounds such as SiO2, Al2O3, TiO2, ZnO, MnO, Mn2O3, Mn3O4, CuO, FeO, Fe2O3, Fe3O4, CoO, Co3O4, or NiO, and ternary compounds such as MgAl2O4, CoFe2O4, NiFe2O4, or CoMn2O4, or combinations thereof. Examples of semiconductor compounds can include group III-VI, group II-VI, group III-V, group I-III-VI, group IV-VI semiconductor compounds, or combinations thereof as described above. For example, semiconductor compounds may include CdS, CdSe, CdTe, ZnS, ZnSe, ZnTe, ZnSeS, ZnTeS, GaAs, GaP, GaSb, HgS, HgSe, HgTe, InAs, InP, InGaP, InSb, AlAs, AlP, AlSb, or combinations thereof.

[0080] Quantum dots can have a full width at half maximum (FWHM) of an emission wavelength spectrum less than or equal to about 45 nm. For example, quantum dots can have a full width at half maximum (FWHM) of an emission wavelength spectrum less than or equal to about 40 nm. For example, quantum dots can have a full width at half maximum (FWHM) of an emission wavelength spectrum less than or equal to about 30 nm. Within this range, color purity or color reproducibility can be improved. Furthermore, because light emitted through quantum dots is emitted in all directions, optical viewing angles can be improved.

[0081] Quantum dots can be spherical, conical, multi-armed, or cubic in shape, and can take the form of nanoparticles, nanotubes, nanowires, nanofibers, or nanoplate-shaped particles.

[0082] Because the band gap can be tuned by adjusting the size of quantum dots, light in various wavelength bands can be obtained from the quantum dot emission layer. Therefore, by using quantum dots of different sizes, light-emitting elements that emit light of various wavelengths can be realized. For example, the size of the quantum dots can be selected to emit red, green, and / or blue light. For instance, the size of the quantum dots can be configured such that various colors of light can be combined to emit white light.

[0083] The first scattering particle 1153 can scatter blue light Lb that is not absorbed by the first quantum dot 1152, thereby exciting more of the first quantum dots 1152 and improving color conversion efficiency. The first scattering particle 1153 can be, for example, a metal oxide particle or an organic particle. For example, the first scattering particle 1153 may include materials such as titanium oxide (TiO2), zirconium oxide (ZrO2), aluminum oxide (Al2O3), indium oxide (In2O3), and zinc oxide (ZnO2). x These are metal oxides such as tin oxide (SnO2) or organic materials such as acrylic resins or polyurethane resins. Regardless of the angle of incidence, scattering particles can scatter light in all directions without substantially changing the wavelength of the incident light. Therefore, scattering particles can improve the side visibility of a display device.

[0084] The second color conversion section 520 can convert the incident blue light Lb into green light Lg. For example... Figure 3 As shown, the second color conversion portion 520 may include a second photosensitive polymer 1161 and a second quantum dot 1162 and a second scattering particle 1163 dispersed in the second photosensitive polymer 1161.

[0085] The second quantum dot 1162 can be excited by blue light Lb, thereby isotropically emitting green light Lg with a wavelength longer than that of blue light Lb. The second photosensitive polymer 1161 may include a light-transmitting organic material.

[0086] The second scattering particle 1163 can scatter blue light Lb that is not absorbed by the second quantum dot 1162, thereby exciting more of the second quantum dot 1162 and improving color conversion efficiency. Since the descriptions of the first quantum dot 1152 and the first scattering particle 1153 can be applied to the second quantum dot 1162 and the second scattering particle 1163 respectively, the descriptions of the second quantum dot 1162 and the second scattering particle 1163 are omitted.

[0087] In some embodiments, the first quantum dot 1152 and the second quantum dot 1162 may comprise the same material, and the size of the first quantum dot 1152 may be larger than the size of the second quantum dot 1162.

[0088] The transmission portion 530 can transmit blue light Lb incident on it without changing the color of the blue light Lb. Therefore, the transmission portion 530 may not have quantum dots. Figure 3 As shown, the transmissive portion 530 may include a third photosensitive polymer 1171 in which third scattering particles 1173 are dispersed. For example, the third photosensitive polymer 1171 may include, for example, a light-transmitting organic material, such as silicone resin or epoxy resin, and the third photosensitive polymer 1171, the first photosensitive polymer 1151, and the second photosensitive polymer 1161 may include the same material. The third scattering particles 1173 may scatter and emit blue light Lb, and the third scattering particles 1173, the first scattering particles 1153, and the second scattering particles 1163 may include the same material.

[0089] Figure 4 This is a schematic diagram of the equivalent circuit of a normal pixel according to the implementation method.

[0090] Figure 4 This is a schematic diagram of a pixel PX included in a display panel according to an embodiment. Pixel PX may include a first sub-pixel Pg, a second sub-pixel Pb, and a third sub-pixel Pr. The first sub-pixel Pg may include a first light-emitting diode LED1 emitting light of a first color, and a first pixel circuit PC1 electrically connected to the first light-emitting diode LED1. The second sub-pixel Pb may include a second light-emitting diode LED2 emitting light of a second color, and a second pixel circuit PC2 electrically connected to the second light-emitting diode LED2. The third sub-pixel Pr may include a third light-emitting diode LED3 emitting light of a third color, and a third pixel circuit PC3 electrically connected to the third light-emitting diode LED3. A group of first pixel circuits PC1, second pixel circuits PC2, and third pixel circuits PC3 included in pixel PX may be referred to as a pixel circuit group.

[0091] refer to Figure 4Each of the first light-emitting diode LED1, the second light-emitting diode LED2, and the third light-emitting diode LED3 may include an organic light-emitting diode. The pixel electrode (e.g., anode) of each of the first light-emitting diode LED1, the second light-emitting diode LED2, and the third light-emitting diode LED3 may be electrically connected to the corresponding pixel circuit, and the common electrode (e.g., cathode) of each of the first light-emitting diode LED1, the second light-emitting diode LED2, and the third light-emitting diode LED3 may be electrically connected to a common voltage line configured to transmit a common power voltage ELVSS.

[0092] Each of the first pixel circuit PC1, the second pixel circuit PC2, and the third pixel circuit PC3 may include a first transistor T1, a second transistor T2, a third transistor T3, and a storage capacitor (or capacitor) Cst. Each of the first transistor T1, the second transistor T2, and the third transistor T3 may include an oxide semiconductor thin-film transistor comprising a semiconductor layer containing oxide semiconductor, or may include a silicon semiconductor thin-film transistor comprising a semiconductor layer containing polycrystalline silicon. The first pixel circuit PC1, the second pixel circuit PC2, and the third pixel circuit PC3 may have the same or similar structures. Hereinafter, the first pixel circuit PC1 is described.

[0093] The first transistor T1 can be a driving transistor. A first terminal of the first transistor T1 can be electrically connected to a driving voltage line PL, configured to provide a driving power voltage ELVDD, and a second terminal of the first transistor T1 can be electrically connected to a second node N2. The gate electrode (or gate) of the first transistor T1 can be electrically connected to the first node N1. The first transistor T1 can be configured to control the amount of current flowing from the driving voltage line PL to the first light-emitting diode LED1 in response to the voltage at the first node N1.

[0094] The second transistor T2 can be a switching transistor. The first terminal of the second transistor T2 in the first pixel circuit PC1 can be electrically connected to the first data line DL1, and the second terminal of the second transistor T2 can be electrically connected to the first node N1. The gate electrode of the second transistor T2 can be electrically connected to the scan line SL. When a scan signal SS is provided through the scan line SL, the second transistor T2 can be turned on and configured to electrically connect the first data line DL1 to the first node N1 and transmit the first data signal DATA1 from the first data line DL1 to the first node N1.

[0095] The third transistor T3 can be an initialization sensing transistor. The first terminal of the third transistor T3 can be electrically connected to the initialization sensing line ISL, and the second terminal of the third transistor T3 can be electrically connected to the second node N2. The gate electrode of the third transistor T3 can be electrically connected to the control line CL. When a control signal CS is provided via the control line CL, the third transistor T3 can be turned on and configured to electrically connect the initialization sensing line ISL to the second node N2, and transmit the initialization sensing signal ISS from the initialization sensing line ISL to the second node N2.

[0096] In one embodiment, when the third transistor T3 is turned on, the third transistor T3 can be configured to initialize the potential of the pixel electrode of the first light-emitting diode LED1 by using an initialization sensing signal ISS from the initialization sensing line ISL as an initialization voltage. In another embodiment, when the third transistor T3 is turned on, the third transistor T3 can be configured to sense characteristic information about the first light-emitting diode LED1. As described above, the third transistor T3 can have the functions of an initialization transistor and a sensing transistor, or only one of these functions. When the third transistor T3 is used as an initialization transistor, the initialization sensing line ISL can be considered an initialization voltage line, and when the third transistor T3 is used as a sensing transistor, the initialization sensing line ISL can be considered a sensing line. The initialization operation and sensing operation of the third transistor T3 can be performed individually or simultaneously. In other words, the third transistor T3 can be an initialization transistor and / or a sensing transistor. Hereinafter, for ease of description, an embodiment in which the third transistor T3 has the functions of both an initialization transistor and a sensing transistor is described.

[0097] The storage capacitor Cst can be connected between the first node N1 and the second node N2. For example, one capacitor electrode of the storage capacitor Cst can be electrically connected to the gate electrode of the first transistor T1, and the other capacitor electrode of the storage capacitor Cst can be electrically connected to the pixel electrode of the first light-emitting diode LED1.

[0098] The second transistor T2 of each of the first pixel circuit PC1, the second pixel circuit PC2, and the third pixel circuit PC3 can be electrically connected to a corresponding data line among the first data line DL1, the second data line DL2, and the third data line DL3. For example, the first terminal of the second transistor T2 of the second pixel circuit PC2 can be electrically connected to the second data line DL2 configured to transmit the second data signal DATA2, and the first terminal of the second transistor T2 of the third pixel circuit PC3 can be electrically connected to the third data line DL3 configured to transmit the third data signal DATA3. The second node N2 of each of the first pixel circuit PC1, the second pixel circuit PC2, and the third pixel circuit PC3 can be electrically connected to the pixel electrode of a corresponding light-emitting diode among the first light-emitting diode LED1, the second light-emitting diode LED2, and the third light-emitting diode LED3.

[0099] Figure 4 The diagram shows that each of the first pixel circuit PC1, the second pixel circuit PC2, and the third pixel circuit PC3 includes three transistors (e.g., first transistor T1 to third transistor T3) and a storage capacitor Cst, but this disclosure is not limited thereto. The number of transistors or capacitors included in each of the first pixel circuit PC1, the second pixel circuit PC2, and the third pixel circuit PC3 may vary.

[0100] Figure 5 This is a schematic diagram of the equivalent circuit of the repaired pixel according to the implementation method.

[0101] Figure 5 It can be similar to Figure 4 However, the embodiment shown is a defective pixel circuit PC1. The first light-emitting diode LED1 can be electrically connected to the second node N2 of the second pixel circuit PC2 via the connecting line CNL.

[0102] refer to Figure 5 In the first pixel circuit PC1, the first terminal of the first transistor T1 can be electrically disconnected from the driving voltage line PL. The first terminal of the second transistor T2 can be electrically disconnected from the first data line DL1, and the second terminal of the second transistor T2 can be electrically disconnected from the first node N1. The first terminal of the third transistor T3 can be electrically disconnected from the initialization sensing line ISL, and the second terminal of the third transistor T3 can be electrically disconnected from the second node N2.

[0103] In the second pixel circuit PC2, the first terminal of the second transistor T2 can be electrically disconnected from the second data line DL2, and can be electrically connected to the first data line DL1 via the data connection line DCL. The second light-emitting diode LED2 can be electrically disconnected from the second node N2. The second node N2 of the second pixel circuit PC2 can be electrically connected to the first light-emitting diode LED1 via the connection line CNL.

[0104] In this embodiment, during the manufacturing process of the display panel 10, defects in the first pixel circuit PC1, the second pixel circuit PC2, and the third pixel circuit PC3 can be inspected using optical methods. If a defect is identified in the first pixel circuit PC1 during the inspection process, a repair process can be performed on the corresponding pixel PX. A laser beam can be irradiated onto the rear surface of the substrate 100 to electrically disconnect each of the following: the portion connecting the driving voltage line PL and the first transistor T1 of the first pixel circuit PC1; the portion connecting the second transistor T2 and the first data line DL1; the portion connecting the gate electrode of the second transistor T2 and the first transistor T1; the portion connecting the third transistor T3 and the initialization sensing line ISL; and the portion connecting the third transistor T3 and the second node N2. Furthermore, the second light-emitting diode LED2 and the second node N2 of the second pixel circuit PC2 can be electrically disconnected by irradiating the portion connecting the second light-emitting diode LED2 and the second node N2 of the second pixel circuit PC2 with the laser beam. For example, the pixel electrode of the second light-emitting diode LED2 may include a first part containing an emission region and a second part connecting the second light-emitting diode LED2 and the second pixel circuit PC2 to each other, and the first part and the second part may be separated from each other and electrically disconnected by a laser beam.

[0105] The first terminal of the first data line DL1 and the second transistor T2 of the second pixel circuit PC2 can be electrically connected by irradiating the data connection line DCL with a laser beam. The pixel electrode of the first light-emitting diode LED1 and the second node N2 of the second pixel circuit PC2 can be electrically connected to each other by irradiating the connection line CNL with a laser beam or by forming the connection line CNL. The connection line CNL may include the second portion of the pixel electrode of the second light-emitting diode LED2. Through this repair process, the first data line DL1 and the first light-emitting diode LED1 can be electrically connected to the second pixel circuit PC2.

[0106] In an embodiment, the first light-emitting diode LED1 may include a green light-emitting diode that emits green light, and the second light-emitting diode LED2 may include a blue light-emitting diode that emits blue light. In white light, the proportion of blue light may be approximately 10%, the proportion of red light may be approximately 20%, and the proportion of green light may be approximately 70%. Therefore, in the case where the first light-emitting diode LED1 fails to emit light due to a defect in the first pixel circuit PC1, in the electronic device DV (see...) Figure 1 When displaying a white image, the user can identify spots in the image. Conversely, according to an embodiment, when the second pixel circuit PC2 is connected to the first light-emitting diode LED1 and the second light-emitting diode LED2 does not emit light while the first light-emitting diode LED1 emits light, image spots can be reduced or the image spots can be made invisible. Therefore, according to an embodiment, in the event of a defect in the first pixel circuit PC1, by electrically connecting the second pixel circuit PC2 and the first light-emitting diode LED1 to each other, the display panel 10 (see...) Figure 2 ) or electronic device DV ( Figure 1 It can display high-quality images to users.

[0107] Figure 6 This is a schematic plan view of the area of ​​the display panel 10 according to the embodiment, and Figure 7 It is along Figure 6 A schematic cross-sectional view of the display panel 10 taken by line I-I'.

[0108] Figure 6 The above is for reference. Figure 2 A schematic diagram of the region of the described light-emitting diode layer 300. For example, a pixel electrode layer including a pixel electrode of each of a first light-emitting diode LED1, a second light-emitting diode LED2, and a third light-emitting diode LED3 is schematically shown. A circuit layer 200 may be disposed below the light-emitting diode layer 300, and the circuit layer 200 may include a first pixel circuit PC1, a second pixel circuit PC2, and a third pixel circuit PC3. Figure 6The dashed lines in the diagram represent the first pixel circuit PC1, the second pixel circuit PC2, and the third pixel circuit PC3, indicating the areas in the plan view where elements (e.g., transistors and capacitors) forming each of the first pixel circuit PC1, the second pixel circuit PC2, and the third pixel circuit PC3 are arranged. In an embodiment, the first pixel circuit PC1, the third pixel circuit PC3, and the second pixel circuit PC2 may be arranged sequentially in a second direction (e.g., the y-direction). In other words, the first pixel circuit PC1 and the second pixel circuit PC2 may be arranged in a second direction (e.g., the y-direction), and the third pixel circuit PC3 may be disposed between the first pixel circuit PC1 and the second pixel circuit PC2. The first pixel circuit PC1, the second pixel circuit PC2, and the third pixel circuit PC3, along with the first light-emitting diode LED1, the second light-emitting diode LED2, and the third light-emitting diode LED3, can form a pixel PX, as referenced above. Figure 4 As described.

[0109] Let's refer to each other. Figure 6 and Figure 7 The display panel 10 may include an insulating layer IL disposed on a substrate 100. The insulating layer IL may be disposed on a first pixel circuit PC1, a second pixel circuit PC2, and a third pixel circuit PC3, and may include a planarization layer for providing a flat base surface for the pixel electrode layers. The insulating layer IL may include an organic insulating material. For example, the insulating layer IL may include a photoresist, benzocyclobutene (BCB), polyimide, hexamethyldisiloxane (HMDSO), polymethyl methacrylate (PMMA), polystyrene (PS), polymer derivatives having phenolic groups, acrylic polymers, imide-based polymers, aryl ether-based polymers, amide-based polymers, fluorinated polymers, p-xylene-based polymers, vinyl alcohol-based polymers, or blends thereof.

[0110] A pixel electrode layer, including a first pixel electrode PE1, a second pixel electrode PE2, a third pixel electrode PE3, and an auxiliary electrode AE, can be disposed on an insulating layer IL. The first pixel electrode PE1 can be the pixel electrode of a first light-emitting diode LED1 and can be electrically connected to a first pixel circuit PC1 through a contact portion passing through the insulating layer IL. The second pixel electrode PE2 can be the pixel electrode of a second light-emitting diode LED2 and can be electrically connected to a second pixel circuit PC2 through a contact portion CNT2 passing through the insulating layer IL. The third pixel electrode PE3 can be the pixel electrode of a third light-emitting diode LED3 and can be electrically connected to a third pixel circuit PC3 through a contact portion passing through the insulating layer IL.

[0111] Each of the first pixel electrode PE1, the second pixel electrode PE2, and the third pixel electrode PE3, as well as the auxiliary electrode AE, may include a (semi-)transparent electrode or a reflective electrode. For example, each of the first pixel electrode PE1, the second pixel electrode PE2, and the third pixel electrode PE3 may include a reflective layer and a transparent or semi-transparent electrode layer disposed on the reflective layer. The reflective layer may include at least one of silver (Ag), magnesium (Mg), Al, platinum (Pt), palladium (Pd), gold (Au), nickel (Ni), neodymium (Nd), iridium (Ir), chromium (Cr), and alloys thereof. The transparent or semi-transparent electrode layer may include at least one of indium tin oxide (ITO), indium zinc oxide (IZO), ZnO, In2O3, indium gallium oxide (IGO), and zinc aluminum oxide (AZO). For example, each of the first pixel electrode PE1, the second pixel electrode PE2, and the third pixel electrode PE3 may have a three-layer structure of ITO / Ag / ITO.

[0112] The first pixel electrode PE1 may be spaced apart from the second pixel electrode PE2 and the third pixel electrode PE3 in a second direction (e.g., the y-direction). The second pixel electrode PE2 and the third pixel electrode PE3 may be adjacent to each other and spaced apart in a first direction (e.g., the x-direction). In a plan view, at least a portion of the first pixel electrode PE1 may overlap with the first pixel circuit PC1, at least a portion of the second pixel electrode PE2 may overlap with the second pixel circuit PC2, and at least a portion of the third pixel electrode PE3 may overlap with the third pixel circuit PC3.

[0113] The second pixel electrode PE2 may include a protrusion PEp that protrudes in a second direction (e.g., the y-direction). In an embodiment, the protrusion PEp may be arranged adjacent to the portion that connects the gate electrode of the first transistor T1 and the second transistor T2 of the second pixel circuit PC2 to each other, for example, to the portion constituting the first node N1 (see...). Figure 4 The protrusion PEp is partially adjacent to the second pixel circuit PC2. When performing a repair process on a defective pixel, the protrusion PEp can increase the storage capacitor Cst of the second pixel circuit PC2 (see [link]). Figure 4 The capacitor is used to improve the boost efficiency of the second pixel circuit PC2.

[0114] The barrier layer (BNL) can be disposed on top of the insulating layer (IL) and the pixel electrode layer. The barrier layer (BNL) may include at least one organic insulating material, such as polyimide, polyamide, acrylic resin, benzocyclobutene, and phenolic resin, and can be manufactured by methods such as spin coating.

[0115] The dam layer BNL may have (or define) a first opening OP1 exposing the central portion of the first pixel electrode PE1, a second opening OP2 exposing the central portion of the second pixel electrode PE2, and a third opening OP3 exposing the central portion of the third pixel electrode PE3, and may cover the edges of each of the first pixel electrode PE1, the second pixel electrode PE2, and the third pixel electrode PE3. By increasing the distance between the edges of each of the first pixel electrode PE1, the second pixel electrode PE2, and the third pixel electrode PE3 and the common electrode 230, the dam layer BNL can prevent arcing or the like from occurring at the edges of each of the first pixel electrode PE1, the second pixel electrode PE2, and the third pixel electrode PE3.

[0116] An intermediate layer may be disposed between the first pixel electrode PE1, the second pixel electrode PE2, and the third pixel electrode PE3 and the common electrode 230, and at least a portion of the intermediate layer may be disposed in an opening formed by the dam layer BNL. For example, the intermediate layer may include a first emission layer 223g disposed in the first opening OP1, a second emission layer 223b disposed in the second opening OP2, and a third emission layer (not shown) disposed in the third opening OP3. The emission layers may include organic materials, including fluorescent or phosphorescent materials that emit red, green, or white light. Each emission layer may include a low molecular weight organic material or a polymeric organic material. In another embodiment, the emission layers may be commonly formed on multiple pixel electrodes.

[0117] The intermediate layer may include a first functional layer 221 and a second functional layer 225 commonly formed over a plurality of pixel electrodes. The first functional layer 221 may be disposed between the pixel electrodes and the emitter layer, and the second functional layer 225 may be disposed between the emitter layer and the common electrode 230. In an embodiment, each of the first functional layer 221 and the second functional layer 225 may include at least one of a hole transport layer (HTL), a hole injection layer (HIL), an electron transport layer (ETL), and an electron injection layer (EIL). In an embodiment, one of the first functional layer 221 and the second functional layer 225 may be omitted.

[0118] A first opening OP1 may define a first emitting region EA1, which is the area where the first light-emitting diode LED1 emits light. A first pixel electrode PE1 may include the first emitting region EA1 and a first non-emitting region NEA1 surrounding the first emitting region EA1 on its outer side. Similarly, a second opening OP2 may define a second emitting region EA2, which is the area where the second light-emitting diode LED2 emits light. A second pixel electrode PE2 may include the second emitting region EA2 and a second non-emitting region NEA2 surrounding the second emitting region EA2 on its outer side. A dam layer BNL may cover the first non-emitting region NEA1 of the first pixel electrode PE1 and the second non-emitting region NEA2 of the second pixel electrode PE2.

[0119] In one embodiment, the dimensions (or area) of the first opening OP1, the second opening OP2, and the third opening OP3 may differ from each other in the plan view. For example, the first opening OP1 may be larger than the second opening OP2 and the third opening OP3. The second opening OP2 may be smaller than the third opening OP3. However, this disclosure is not limited thereto. In another embodiment, the dimensions of the first opening OP1, the second opening OP2, and the third opening OP3 may be the same. In another embodiment, the first opening OP1 may be larger than the second opening OP2 and the third opening OP3, but the dimensions of the second opening OP2 and the third opening OP3 may be the same.

[0120] The common electrode 230 can be disposed on top of the intermediate layer. The common electrode 230 may include a transmissive electrode or a reflective electrode. For example, the common electrode 230 may include a transparent or semi-transparent electrode and may include a metal thin film having a low work function and comprising at least one of lithium (Li), calcium (Ca), Al, Ag, Mg, and their compounds (such as lithium fluoride (LiF)). In embodiments, the common electrode 230 may also include a transparent conductive oxide (TCO) layer on the metal thin film, the TCO layer comprising ITO, IZO, ZnO, or In2O3. The common electrode 230 may be disposed in the display area DA (see [link to documentation]). Figure 1 The entire surface of the surface is integrated into a single body, and can be arranged on top of the pixel electrodes.

[0121] The first light-emitting diode LED1 may include a first pixel electrode PE1, a first functional layer 221, a first emitting layer 223g, a second functional layer 225, and a common electrode 230. The second light-emitting diode LED2 may include a second pixel electrode PE2, a first functional layer 221, a second emitting layer 223b, a second functional layer 225, and a common electrode 230.

[0122] The embankment layer BNL may have an auxiliary opening AOP that exposes at least a portion of each auxiliary electrode AE. In a plan view, the first functional layer 221 and the second functional layer 225 may not overlap with the auxiliary opening AOP. In an embodiment, the first functional layer 221 and the second functional layer 225 may have openings that overlap with the auxiliary opening AOP in a plan view. The common electrode 230 can be in direct contact with the auxiliary electrode AE ​​through the auxiliary opening AOP. The auxiliary electrode AE ​​may be connected to a configuration for transmitting a common power voltage ELVSS (see...). Figure 4 The power connection line is provided, and the common electrode 230 can be configured to receive the common power voltage ELVSS through the auxiliary electrode AE. Due to this structure, the brightness deviation of the display panel 10 caused by the voltage drop of the common power voltage ELVSS can be reduced.

[0123] Figure 8A This is a schematic plan view of the area of ​​the display panel 10 according to the embodiment, and Figure 8B It is shown Figure 8A The plan view of the second pixel electrode is shown. Figure 9 It is along Figure 8A A schematic cross-sectional view of the display panel 10 taken by line II-II'.

[0124] Figure 8A , Figure 8B and Figure 9 This schematically illustrates a pixel PX that has been repaired due to a defect in the first pixel circuit PC1 (see [link]). Figure 5 (area).

[0125] refer to Figure 8A , Figure 8B and Figure 9 The display panel 10 may include a substrate 100 (see [reference]). Figure 2 A first insulating layer IL1 is formed on top of the first insulating layer IL1. In embodiments, the first insulating layer IL1 may comprise inorganic insulating materials and / or organic insulating materials. For example, the first insulating layer IL1 may comprise silicon oxide, silicon nitride, or silicon oxynitride. For example, the first insulating layer IL1 may comprise photoresist, BCB, polyimide, HMDSO, PMMA, PS, polymer derivatives having phenolic groups, acrylic polymers, imide-based polymers, aryl ether-based polymers, amide-based polymers, fluorinated polymers, p-xylene-based polymers, vinyl alcohol-based polymers, or blends thereof.

[0126] The connecting electrode CNE and the contact metal CNM can be disposed on the first insulating layer IL1. Each of the connecting electrode CNE and the contact metal CNM can include a conductive material such as molybdenum (Mo), Al, copper (Cu), Ti, etc., and can have a single layer or multiple layers including the above materials.

[0127] The connecting electrode CNE and the first pixel electrode PE1, the second pixel electrode PE2, and the third pixel electrode PE3 can be arranged on different layers. For example, the connecting electrode CNE can be arranged below the first pixel electrode PE1, the second pixel electrode PE2, and the third pixel electrode PE3, and the second insulating layer IL2 is inserted between the connecting electrode CNE and the first pixel electrode PE1, the second pixel electrode PE2, and the third pixel electrode PE3.

[0128] In a planar view, the connecting electrode CNE may have one end overlapping with the first pixel electrode PE1 and another end overlapping with the second pixel electrode PE2. In a planar view, the connecting electrode CNE may have an isolated shape. In an embodiment, the connecting electrode CNE may have a curved shape and be spaced apart from the second pixel electrode PE2.

[0129] The connecting electrode CNE can be arranged to connect to the first pixel electrode PE1 and the second pixel electrode PE2 in a normal pixel. The term "connectable" can refer to a state in which they can be connected via laser or the like during the repair process. For example, in the case where the first and second components are arranged to be connectable to each other, this can mean that the first and second components are not actually connected, but are in a state where they can connect to each other during the repair process. From a structural point of view, the first and second components that are "connectable" to each other can overlap, with an insulating layer between them. If a laser beam is irradiated onto the overlapping area during the repair process, the insulating layer can be disrupted, thereby allowing the first and second components to be electrically connected to each other.

[0130] The contact metal CNM can be electrically connected to the second pixel circuit PC2 through a contact portion passing through the first insulating layer IL1. In another embodiment, the contact metal CNM can be omitted, and the contact portion CNT2 of the second pixel electrode PE2 can be electrically connected to the second pixel circuit PC2 through the first insulating layer IL1 and the second insulating layer IL2.

[0131] The second insulating layer IL2 can be disposed on the connecting electrode CNE and the contact metal CNM. The second insulating layer IL2 and Figure 7 The insulating layers IL can have the same configuration. For example, the second insulating layer IL2 may include a planarization layer for providing a flat base surface on the pixel electrode layer. The second insulating layer IL2 may include an organic insulating material.

[0132] A pixel electrode layer, including a first pixel electrode PE1, a second pixel electrode PE2, a third pixel electrode PE3, and an auxiliary electrode AE, can be disposed on the second insulating layer IL2. The first pixel electrode PE1 can be the pixel electrode of the first light-emitting diode LED1 and can be electrically connected to the second node N2 of the first pixel circuit PC1 (see [link to relevant documentation]). Figure 4 The third pixel electrode PE3 can be the pixel electrode of the third light-emitting diode LED3, and can be electrically connected to the second node N2 of the third pixel circuit PC3.

[0133] A dam layer BNL can be disposed above the second insulating layer IL2 and the pixel electrode layer. The dam layer BNL can have a first opening OP1 exposing the central portion of the first pixel electrode PE1, a second opening OP2 exposing the central portion of the second pixel electrode PE2, and a third opening OP3 exposing the central portion of the third pixel electrode PE3, and can cover the edges of each of the first pixel electrode PE1, the second pixel electrode PE2, and the third pixel electrode PE3. In an embodiment, the size (or area) of the first opening OP1, the size of the second opening OP2, and the size of the third opening OP3 can be different from each other in a plan view. For example, the first opening OP1 can be larger than the second opening OP2 and the third opening OP3. The second opening OP2 can be smaller than the third opening OP3. The dam layer BNL can have an auxiliary opening AOP exposing at least a portion of the auxiliary electrode AE.

[0134] The intermediate layer may include a first emission layer 223g disposed in the first opening OP1, a second emission layer 223b disposed in the second opening OP2, and a third emission layer disposed in the third opening OP3. The intermediate layer may include a first functional layer 221 and a second functional layer 225 commonly formed on multiple pixel electrodes. A common electrode 230 may be disposed on the intermediate layer. The common electrode 230 may be commonly disposed on multiple pixel electrodes.

[0135] The dam layer BNL may have an auxiliary opening AOP that exposes at least a portion of the auxiliary electrode AE. In an embodiment, the first functional layer 221 and the second functional layer 225 may have openings that overlap with the auxiliary opening AOP in a plan view. The common electrode 230 can directly contact the auxiliary electrode AE ​​through the auxiliary opening AOP.

[0136] During the manufacturing process of the display panel 10, a pixel electrode layer can be formed, and before the formation of the dam layer BNL, defects in the pixel circuit can be inspected using optical methods. If a defect is identified in the first pixel circuit PC1 during the inspection process, a repair process can be performed on the corresponding pixel PX.

[0137] As per the above reference Figure 5In order to form a connecting line CNL that electrically separates the second light-emitting diode LED2 of the second pixel circuit PC2 from the second node N2 and electrically connects the first light-emitting diode LED1 and the second node N2 of the second pixel circuit PC2, a laser beam can be irradiated to divide the second pixel electrode PE2 into two parts.

[0138] Through the repair process, the second pixel electrode PE2 can be divided into a first portion PE2a that overlaps with the second opening OP2 in a planar view and a second portion PE2b that is spaced apart from the first portion PE2a, with a gap GP between the second portion PE2b and the first portion PE2a. In the planar view, the gap GP formed by the laser beam can extend along a portion of the edge of the second opening OP2.

[0139] For example, such as Figure 8B As shown, the second opening OP2 may have a generally rectangular shape in a plan view. The second opening OP2 may include a first edge E1 and a second edge E2 extending in a first direction (e.g., the x-direction), and a third edge E3 and a fourth edge E4 connecting the first edge E1 and the second edge E2 to each other and extending in a second direction (e.g., the y-direction). The first edge E1 may be an edge closer to the first pixel electrode PE1 than the second edge E2. The third edge E3 may be an edge adjacent to the contact portion CNT2 connected to the second pixel circuit PC2. A gap GP may extend along the first edge E1 and the third edge E3, separating the first portion PE2a and the second portion PE2b from each other. The gap GP may surround a portion of the second emission region EA2 or the second opening OP2.

[0140] The first portion PE2a may include a portion of the second non-emitting region NEA2 and the second emitting region EA2. The second portion PE2b may include the remaining portion of the second non-emitting region NEA2. In a plan view, the first portion PE2a may have an isolated shape and may therefore be a dummy pixel electrode that is electrically isolated from the second pixel circuit PC2 and does not emit light. For example, the second light-emitting diode LED2 may include a light-emitting diode that does not emit light. The first portion PE2a may include a protrusion PEp that protrudes from the second pixel electrode PE2 in a second direction (e.g., the y-direction). The second portion PE2b may include a contact portion CNT2 that passes through the second insulating layer IL2. In a plan view, the second portion PE2b may surround a portion of the first portion PE2a and may have a shape that is approximately similar to an inverted letter "L". The contact portion CNT2 may be electrically connected to the second node N2 of the second pixel circuit PC2 via a contact metal CNM.

[0141] A laser beam can be irradiated onto both ends of the connecting electrode CNE to electrically connect one end of the connecting electrode CNE to the first non-emitting region NEA1 of the first pixel electrode PE1, and the other end of the connecting electrode CNE to the second portion PE2b of the second pixel electrode PE2. Irradiation with the laser beam can form a contact hole penetrating the second insulating layer IL2, and a portion of the electrode exposed by the laser beam can immediately melt and re-solidify to form contact portions CNTa and CNTb.

[0142] For example, in a normal pixel, the connection electrode CNE can be electrically connected to the first pixel electrode PE1 and the second pixel electrode PE2 through the second insulating layer IL2. In a pixel that has been repaired due to a defect in the first pixel circuit PC1, the connection electrode CNE can be electrically connected to the second portion PE2b of the first pixel electrode PE1 and the second pixel electrode PE2 through contact portions CNTa and CNTb passing through the second insulating layer IL2.

[0143] The second part PE2b of the connecting electrode CNE and the second pixel electrode PE2 can form the connecting line CNL. (See above reference.) Figure 5 The connecting line CNL can electrically connect the first pixel electrode PE1 and the second node N2 of the second pixel circuit PC2 to each other. Therefore, even if there is a defect in the first pixel circuit PC1, by electrically connecting the second pixel circuit PC2 and the first light-emitting diode LED1 to each other, the first light-emitting diode LED1 of the display panel 10 or electronic device DV can still emit light to display a high-quality image.

[0144] Figure 10 This is a schematic plan view of the area of ​​the display panel 10 according to the embodiment, and Figure 11 It is along Figure 10 A schematic cross-sectional view of the display panel 10 taken by line III-III'.

[0145] Figure 10 and Figure 11 This schematically illustrates a pixel PX that has been repaired due to a defect in the first pixel circuit PC1 (see [link]). Figure 5 (This refers to the area mentioned above.) Figure 10 and Figure 11 The display panel 10 may include a substrate 100 (see [reference]). Figure 2 The insulating layer IL is above the ).

[0146] A pixel electrode layer comprising a first pixel electrode PE1, a second pixel electrode PE2, a third pixel electrode PE3, and an auxiliary electrode AE ​​can be disposed on an insulating layer IL. The second pixel electrode PE2 can be divided into a first portion PE2a overlapping the second opening OP2 in a planar view and a second portion PE2b spaced apart from the first portion PE2a, with a gap GP between the second portion PE2b and the first portion PE2a. For example, a second emitting layer 223b can be disposed above the first portion PE2a of the second pixel electrode PE2.

[0147] The first portion PE2a may include a portion of the second non-emitting region NEA2 and the second emitting region EA2. The second portion PE2b may include the remainder of the second non-emitting region NEA2. In a plan view, the second opening OP2 may have a generally rectangular shape, and the gap GP may extend along a portion of the edge of the second opening OP2. In a plan view, the first portion PE2a may have an isolated shape and may therefore be a dummy pixel electrode electrically isolated from the second pixel circuit PC2. The first portion PE2a may include a protrusion PEp projecting from the second pixel electrode PE2 in a second direction (e.g., the y-direction). The second portion PE2b may include a contact portion CNT2 extending through the insulating layer IL. The contact portion CNT2 may be electrically connected to a second node N2 of the second pixel circuit PC2.

[0148] The display panel 10 may include a connection electrode CNE that electrically connects the second portions PE2b of the first pixel electrode PE1 and the second pixel electrode PE2 to each other. The connection electrode CNE, the first pixel electrode PE1, the second pixel electrode PE2, the third pixel electrode PE3, and the auxiliary electrode AE ​​may be arranged on the same layer. For example, the connection electrode CNE may be disposed between the insulating layer IL and the dam layer BNL.

[0149] During the manufacturing process of the display panel 10, a pixel electrode layer can be formed, and defects in the pixel circuit can be inspected using optical methods before the formation of the dam layer BNL. If a defect is identified in the first pixel circuit PC1 during the inspection process, a repair process can be performed on the corresponding pixel PX. Before forming the dam layer BNL, a connection electrode CNE can be formed on the insulating layer IL. In this embodiment, the connection electrode CNE can be formed by dot-spraying conductive ink using an inkjet printing method. The conductive ink may include a conductive material, and the conductive material may include copper nanoparticles, silver nanoparticles, or graphene particles.

[0150] For example, the connecting electrode CNE may not exist in a normal pixel. In a pixel that has been repaired due to a defect in the first pixel circuit PC1, one end of the connecting electrode CNE may be connected to the first pixel electrode PE1, and the other end of the connecting electrode CNE may be connected to the second portion PE2b of the second pixel electrode PE2.

[0151] The connecting electrode CNE and the second portion PE2b of the second pixel electrode PE2 can form a connecting line CNL. The connecting line CNL can electrically connect the first pixel electrode PE1 and the second node N2 of the second pixel circuit PC2 to each other. Therefore, even if there is a defect in the first pixel circuit PC1, the display panel 10 or electronic device DV can display a high-quality image by electrically connecting the second pixel circuit PC2 and the first light-emitting diode LED1 to each other.

[0152] Figure 12A This is a schematic plan view of the area of ​​the display panel 10 according to the embodiment, and Figure 12B It is shown Figure 12A The plan view of the second pixel electrode is shown. Figure 13 This is a schematic plan view of the area of ​​the display panel 10 according to the embodiment.

[0153] Figure 12A , Figure 12B and Figure 13 This schematically illustrates a pixel PX that has been repaired due to a defect in the first pixel circuit PC1 (see [link]). Figure 5 (area). Figure 13 It can be similar to Figure 12A However, an embodiment is shown in which the connecting electrode CNE, the first pixel electrode PE1, the second pixel electrode PE2 and the third pixel electrode PE3 and the auxiliary electrode AE ​​are arranged on the same layer.

[0154] refer to Figure 12A and Figure 12B The display panel 10 may include a first pixel electrode PE1, a second pixel electrode PE2, a third pixel electrode PE3, and an auxiliary electrode AE.

[0155] BNL (see levee layer) Figure 7 The first pixel electrode PE1, the second pixel electrode PE2, the third pixel electrode PE3, and the auxiliary electrode AE ​​can be arranged on the first pixel electrode PE1, the second pixel electrode PE2, the third pixel electrode PE3, and the auxiliary electrode AE. The dam layer BNL can have a first opening OP1 that exposes the central portion of the first pixel electrode PE1, a second opening OP2 that exposes the central portion of the second pixel electrode PE2, and a third opening OP3 that exposes the central portion of the third pixel electrode PE3, and can cover the edges of each of the first pixel electrode PE1, the second pixel electrode PE2, and the third pixel electrode PE3.

[0156] In this implementation, the dimensions (or area) of the first opening OP1, the second opening OP2, and the third opening OP3 may differ from each other in the plan view. For example, the first opening OP1 may be larger than the second opening OP2 and the third opening OP3. The second opening OP2 may be smaller than the third opening OP3. The embankment BNL may have auxiliary openings AOP that expose at least a portion of each auxiliary electrode AE. Common electrode 230 (see...) Figure 7 It can directly contact the auxiliary electrode AE ​​through the auxiliary opening AOP.

[0157] The connecting electrode CNE and the first pixel electrode PE1, second pixel electrode PE2, and third pixel electrode PE3 can be arranged on different layers. For example, the connecting electrode CNE can be arranged below the first pixel electrode PE1, second pixel electrode PE2, and third pixel electrode PE3, and at least one insulating layer is inserted between the connecting electrode CNE and the first pixel electrode PE1, second pixel electrode PE2, and third pixel electrode PE3. In a planar view, the connecting electrode CNE can have one end overlapping the first pixel electrode PE1 and another end overlapping the second pixel electrode PE2. In a planar view, the connecting electrode CNE can have an isolated shape. In an embodiment, in a planar view, the connecting electrode CNE can have a curved shape spaced apart from the second pixel electrode PE2.

[0158] Through a repair process, the second pixel electrode PE2 (see...) Figure 6 The opening OP2 can be divided into a first portion PE2a that overlaps with the second opening OP2 in a plan view and a second portion PE2b that is spaced apart from the first portion PE2a, with a gap GP between the second portion PE2b and the first portion PE2a. In the plan view, the gap GP formed by the laser beam can extend along a portion of the edge of the second opening OP2.

[0159] For example, such as Figure 12B As shown, the second opening OP2 may have a generally rectangular shape in a plan view. The second opening OP2 may include a first edge E1 and a second edge E2 extending in a first direction (e.g., the x-direction), and a third edge E3 and a fourth edge E4 connecting the first edge E1 and the second edge E2 to each other and extending in a second direction (e.g., the y-direction). The first edge E1 may be an edge closer to the first pixel electrode PE1 than the second edge E2. The third edge E3 may be an edge adjacent to the contact portion CNT2 connected to the second pixel circuit PC2. The gap GP may extend along the first edge E1, the third edge E3, and the second edge E2, separating the first portion PE2a and the second portion PE2b from each other.

[0160] The first portion PE2a may include a portion of the second non-emitting region NEA2 adjacent to the fourth edge E4 and the second emitting region EA2. The second portion PE2b may include the remaining portion of the second non-emitting region NEA2. In a planar view, the first portion PE2a may have an isolated shape and may therefore be a dummy pixel electrode electrically separated from the second pixel circuit PC2. For example, the second light-emitting diode LED2 may include a light-emitting diode that does not emit light. In a planar view, the second portion PE2b may surround a portion of the first portion PE2a and may have a shape generally resembling the letter "C". The second portion PE2b may include a protrusion PEp projecting in a second direction (e.g., the y-direction).

[0161] In a normal pixel, the connection electrode CNE can be electrically insulated from the first pixel electrode PE1 and the second pixel electrode PE2 through an insulating layer. In other words, in a normal pixel, the connection electrode CNE can be arranged to be connected to the first pixel electrode PE1 and the second pixel electrode PE2. In a pixel that has been repaired due to a defect in the first pixel circuit PC1, the connection electrode CNE can be electrically connected to a second portion PE2b of the first pixel electrode PE1 and the second pixel electrode PE2 through a contact portion passing through the insulating layer.

[0162] The second part PE2b of the connecting electrode CNE and the second pixel electrode PE2 can form the connecting line CNL. (See above reference.) Figure 5 The connecting line CNL can electrically connect the first pixel electrode PE1 and the second node N2 of the second pixel circuit PC2 to each other.

[0163] refer to Figure 13 The display panel 10 may include a connection electrode CNE that electrically connects the second portions PE2b of the first pixel electrode PE1 and the second pixel electrode PE2 to each other. The connection electrode CNE, the first pixel electrode PE1, the second pixel electrode PE2, the third pixel electrode PE3, and the auxiliary electrode AE ​​may be arranged on the same layer. For example, as referenced above... Figure 11 The connecting electrode CNE can be disposed between the insulating layer IL and the dam layer BNL.

[0164] Through a repair process, the second pixel electrode PE2 (see...) Figure 6 The opening OP2 can be divided into a first portion PE2a that overlaps with the second opening OP2 in a plan view and a second portion PE2b that is spaced apart from the first portion PE2a, with a gap GP between the second portion PE2b and the first portion PE2a. In the plan view, the second portion PE2b may surround a portion of the first portion PE2a and may have a shape generally resembling the letter "C". The second portion PE2b may include a protrusion PEp that projects in a second direction (e.g., the y-direction).

[0165] Before forming the dam layer BNL, it can be done in the insulation layer IL (see Figure 7 A connection electrode CNE is formed on the first pixel circuit PC1. For example, the connection electrode CNE may not exist in a normal pixel. In a pixel that has been repaired due to a defect in the first pixel circuit PC1, one end of the connection electrode CNE may be connected to the first pixel electrode PE1, and the other end of the connection electrode CNE may be connected to the second portion PE2b of the second pixel electrode PE2.

[0166] The connecting electrode CNE and the second part PE2b of the second pixel electrode PE2 can form a connecting line CNL. The connecting line CNL can electrically connect the first pixel electrode PE1 and the second node N2 of the second pixel circuit PC2 to each other.

[0167] It can be based on the storage capacitor Cst (see Figure 4 The boost efficiency of a single sub-pixel is determined by the ratio between the capacitance of the second pixel and the parasitic capacitance between other components. In the repaired pixel PX, the second pixel circuit PC2 can be connected to the first data line DL1 (see...). Figure 4 And configured to receive the first data signal DATA1 (see...) Figure 4 Due to the connection line CNL that connects the second pixel circuit PC2 and the first light-emitting diode LED1 to each other, parasitic capacitance may increase. Therefore, due to the difference in boost efficiency between the first pixel circuit PC1 and the second pixel circuit PC2, a brightness deviation may occur between the first light-emitting diode LED1 of the normal pixel and the first light-emitting diode LED1 of the repaired pixel PX.

[0168] In an implementation, the second portion PE2b of the second pixel electrode PE2 may include a protrusion PEp, thereby reducing the difference in boost efficiency between normal pixels and repaired pixels. For example, the protrusion PEp may be arranged adjacent to the portion that connects the gate electrode of the first transistor T1 and the second transistor T2 of the second pixel circuit PC2 to each other, for example, to the portion constituting the first node N1 (see...). Figure 4 The portions of the second pixel circuit PC2 are adjacent to each other, thereby increasing the capacitance of the storage capacitor Cst.

[0169] [Table 1]

[0170] like Figure 8B As shown, Embodiment 1 is a repaired pixel in which the second pixel electrode PE2 is separated such that the protrusion PEp is included in the first portion PE2a of the second pixel electrode PE2, and as... Figure 12BAs shown, Embodiment 2 is a repaired pixel in which the second pixel electrode PE2 is separated, such that the protrusion PEp is included in the second portion PE2b of the second pixel electrode PE2.

[0171] Compared to the boost efficiency of a normal pixel, the boost efficiency of Embodiment 1 is reduced by 1.6%, while the boost efficiency of Embodiment 2 is reduced by only 0.4% compared to the boost efficiency of a normal pixel. Furthermore, in Embodiment 1, it was found that the driving current for driving the first light-emitting diode LED1 is reduced by 14.4% compared to a normal pixel, but in Embodiment 2, it was found that the driving current for driving the first light-emitting diode LED1 is reduced by 4.8% compared to a normal pixel.

[0172] Therefore, in the display panel 10 according to the embodiment, the second portion PE2b of the connecting line CNL constituting the second pixel electrode PE2 may include a protrusion PEp, thereby providing a high-quality image with an improved brightness difference between normal pixels and repaired pixels.

[0173] Figure 14 This is a schematic block diagram of an electronic device DV according to an embodiment.

[0174] refer to Figure 14 The electronic device DV may include a processor 1100, a memory 1200, an input module 1300, a display module 1400, a power module 1500, a built-in module 1600, and an external module 1700. According to embodiments, at least one of these components may be omitted in the electronic device DV, or one or more other components may be added. According to embodiments, some of these components (e.g., built-in module 1600) may be integrated into another component (e.g., display module 1400).

[0175] The processor 1100 can execute software to control at least one other component (e.g., hardware or software component) connected to the electronic device DV, and can perform various data processing or operations. According to an embodiment, as at least part of the data processing or operation, the processor 1100 can store commands or data received from another component (e.g., input module 1300, sensor module 1610, or communication module 1730) in volatile memory 1210, process the commands or data stored in volatile memory 1210, and store the result data in non-volatile memory 1220.

[0176] Processor 1100 may include a main processor 1110 and an auxiliary processor 1120. Main processor 1110 may include at least one of a central processing unit (CPU) 1111 and an application processor (AP). Main processor 1110 may also include at least one of a graphics processing unit (GPU) 1112, a communication processor (CP), and an image signal processor (ISP). Main processor 1110 may also include a neural processing unit (NPU) 1113. NPU 1113 may be a processor specifically designed for processing artificial intelligence models, and the artificial intelligence models may be generated through machine learning. The artificial intelligence model may include multiple layers of artificial neural networks. The artificial neural networks may include one of deep neural networks (DNN), convolutional neural networks (CNN), recurrent neural networks (RNN), restricted Boltzmann machines (RBM), deep belief networks (DBN), bidirectional recurrent deep neural networks (BRDNN), deep Q-networks, and combinations of two or more of the above networks, but this disclosure is not limited to the examples above. In addition to hardware architecture, the artificial intelligence model may additionally or alternatively include software architecture. At least two of the aforementioned processing units or processors can be implemented as a single integrated component (e.g., a single chip), or each can be implemented as an independent component (e.g., multiple chips).

[0177] The auxiliary processor 1120 may include a controller 1121. The controller 1121 may include interface conversion circuitry and timing control circuitry. The controller 1121 may receive image signals from the main processor 1110, convert the data format of the image signals to match the interface specification of the display module 1400, and output image data. The controller 1121 may output various control signals for driving the display module 1400.

[0178] The auxiliary processor 1120 may also include data processing circuitry, such as a data conversion circuit 1122, a gamma correction circuit 1123, or a presentation circuit 1124. The data conversion circuit 1122 may receive image data from the controller 1121 and may compensate the image data to display an image at a desired brightness according to the characteristics of the electronic device DV or user settings, or may convert the image data to reduce power consumption or compensate for afterimages. The gamma correction circuit 1123 may convert the image data or a gamma reference voltage so that the image displayed on the electronic device DV has desired gamma characteristics. The presentation circuit 1124 may receive image data from the controller 1121 and present the image data by taking into account the pixel layout of the display panel 10 applied to the electronic device DV.

[0179] The memory 1200 may store various types of data used by at least one component of the electronic device DV (e.g., processor 1100 or sensor module 1610), as well as input or output data for associated commands. The memory 1200 may include at least one of volatile memory 1210 and non-volatile memory 1220.

[0180] The input module 1300 can receive commands or data from an external source of the electronic device DV (e.g., a user or external electronic device 2000) for components of the electronic device DV (e.g., processor 1100, sensor module 1610, or sound output module 1630).

[0181] The input module 1300 may include a first input module 1310 for inputting commands or data from a user and a second input module 1320 for inputting commands or data from an external electronic device 2000.

[0182] The first input module 1310 may include a microphone, mouse, keyboard, or pen (e.g., a passive or active pen). The first input module 1310 may include mechanical or touch input devices, such as buttons, dome switches, scroll wheels, or jog switches, disposed on the rear or side surface of the electronic device DV.

[0183] The second input module 1320 can be connected via wired or wireless means to various types of external electronic devices 2000 connected to the electronic device DV. According to embodiments, the second input module 1320 may include a High Definition Multimedia Interface (HDMI), a Universal Serial Bus (USB) interface, a Secure Digital Card (SD) card interface, or an audio interface. The second input module 1320 may include a connector capable of physically connecting the electronic device DV to the external electronic device 2000, such as an HDMI connector, a USB connector, an SD card connector, or an audio connector (e.g., a headphone connector). In response to the external electronic device 2000 being connected to the second input module 1320, the electronic device DV can perform appropriate controls associated with the connected external electronic device 2000.

[0184] Display module 1400 can visually provide information to the user. Display module 1400 may include display panel 10, scan driver 1420, and data driver 1430. Display module 1400 may also include a window, base, bracket, support, or heat dissipation component to protect or support display panel 10.

[0185] Display panel 10 can display (output) information processed by the electronic device DV. Display panel 10 can display execution screen information about applications running on the electronic device DV, or user interface (UI) or graphical user interface (GUI) information based on the execution screen information. Display panel 10 can include a liquid crystal display panel, an organic light-emitting display panel, or an inorganic light-emitting display panel, and there are no particular limitations on the type of display panel 10. Display panel 10 can be a rigid display panel or a flexible display panel that is rollable or foldable.

[0186] The scan driver 1420 can be mounted on the display panel 10 as a driver chip. In another embodiment, the scan driver 1420 can be formed directly on the display panel 10. For example, the scan driver 1420 may include an amorphous silicon thin-film transistor (TFT) gate driver circuit (AGS), a low-temperature polycrystalline silicon (LTPS) TFT gate driver circuit, or an oxide semiconductor TFT gate driver circuit (OSG) embedded in the display panel 10. The scan driver 1420 can receive a control signal from the controller 1121 and output a scan signal to the display panel 10 in response to the control signal. The display panel 10 may also include an emission control driver. The emission control driver can output an emission control signal to the display panel 10 in response to the control signal received from the controller 1121. The emission control driver may be formed separately from the scan driver 1420 or may be integrated into the scan driver 1420.

[0187] The data driver 1430 can receive a control signal from the controller 1121, and in response to the control signal, convert the image data into a data voltage in the form of an analog voltage, and output the data voltage to the display panel 10.

[0188] Power module 1500 can provide power to components of an electronic device DV. Power module 1500 may include a battery configured to be charged with a power voltage. For example, power module 1500 may include a connection port, which may be included in a second input module 1320, to which an external charger is connected, configured to provide power for charging the battery. For example, power module 1500 may include wireless power transmission / reception components to enable wireless charging of the battery. The wireless power transmission / reception components may include multiple coil-shaped antenna radiators. Power module 1500 may include a power management IC (PMIC). The PMIC can provide optimized power to each component of the electronic device DV.

[0189] The electronic device DV may also include a built-in module 1600 and an external module 1700. The built-in module 1600 may include a sensor module 1610, an antenna module 1620, and a sound output module 1630. The external module 1700 may include a camera module 1710, an optical module 1720, and a communication module 1730.

[0190] Sensor module 1610 can detect input made by a user's body or by a pen, and generate an electrical signal or data value corresponding to the input. Sensor module 1610 may include at least one of fingerprint sensor 1611, input sensor 1612, digitizer 1613, and strain sensor 1614.

[0191] The fingerprint sensor 1611 can generate data values ​​corresponding to a user's fingerprint. The fingerprint sensor 1611 may include an optical fingerprint sensor or a capacitive fingerprint sensor.

[0192] Input sensor 1612 can generate data values ​​corresponding to coordinate information about input made by a user's body or by a pen. Input sensor 1612 can generate data values ​​based on changes in electrostatic capacitance caused by the input. Input sensor 1612 can detect input made by a passive pen, or transmit data to and receive data from an active pen.

[0193] Input sensor 1612 can measure biometric signals such as blood pressure, humidity, or body fat. For example, if a user touches a part of his or her body on the sensor layer or sensing panel and does not move it for a period of time, input sensor 1612 can detect biometric signals based on changes in the electric field caused by that part of the body and output the information desired by the user to display module 1400.

[0194] The digitizer 1613 can generate data values ​​corresponding to coordinate information about input made by the pen. The digitizer 1613 can generate data values ​​based on changes in electromagnetic force caused by the input. The digitizer 1613 can detect input made by a passive pen, or transmit data to and receive data from an active pen.

[0195] In an embodiment, at least one of the fingerprint sensor 1611, input sensor 1612, digitizer 1613, and strain sensor 1614 can be embedded in the display panel 10. For example, at least one of the fingerprint sensor 1611, input sensor 1612, digitizer 1613, and strain sensor 1614 can be formed by a process that is continuous with the process of forming the pixel circuitry and light-emitting diodes of the display panel 10. Therefore, the display panel 10 can be used as one of an input device configured to provide an input interface between the electronic device DV and the user, and can also be used as one of an output device configured to provide an output interface between the electronic device DV and the user.

[0196] In another embodiment, at least two of the fingerprint sensor 1611, input sensor 1612, digitizer 1613, and strain sensor 1614 may be formed and integrated into a single sensing panel using the same process. The sensing panel may be disposed between the display panel 10 and a window arranged on top of the display panel 10, but this disclosure is not limited thereto.

[0197] Antenna module 1620 may include one or more antennas for transmitting or receiving signals or power to or from an external source. According to an embodiment, communication module 1730 may transmit or receive signals to or from external electronic device 2000 via an antenna suitable for a communication method. The antenna pattern of antenna module 1620 may be integrated into a component of input sensor 1612 or display module 1400 (e.g., display panel 10).

[0198] The sound output module 1630 can be a device for outputting sound signals to the external device DV, and can output sound data received from the communication module 1730 or stored in the memory 1200 in call signal receiving mode, call mode, recording mode, voice recognition mode, or broadcast mode. The sound output module 1630 can output sound signals related to functions performed by the electronic device DV (e.g., call signal receiving sound, message receiving sound, etc.). The sound output module 1630 may include a receiver and a speaker. At least one of the receiver and the speaker may include a sound generating device attached to the bottom of the display panel 10 and vibrating the display panel 10 to output sound. The sound generating device may include a piezoelectric element or piezoelectric actuator that contracts and expands in response to an electrical signal, or an exciter that vibrates the display panel 10 by using a voice coil to generate magnetic force.

[0199] Camera module 1710 can capture still images or record video. According to different embodiments, camera module 1710 may include one or more lenses, an image sensor, or an ISP. Camera module 1710 may also include an infrared camera capable of measuring the presence of a user, the user's position, and the user's line of sight.

[0200] The light module 1720 can output signals to notify of events or provide light for acquiring images by using a light source. Examples of events may include receiving messages, receiving call signals, missed calls, alarms, schedule reminders, receiving emails, or notifications of battery charging capacity information. The light module 1720 may include a light-emitting diode or a xenon lamp. The light module 1720 can emit monochromatic or multicolor light onto the front or rear surface of the electronic device DV. The light module 1720 can operate with the camera module 1710 or independently.

[0201] Communication module 1730 supports the establishment of wired or wireless communication channels between electronic device DV and external electronic device 2000, and the ability to communicate via the established communication channels. Communication module 1730 may include one or both of the following: a wireless communication module such as a cellular communication module, a short-range communication module, or a Global Navigation Satellite System (GNSS) communication module; and a wired communication module such as a Local Area Network (LAN) communication module or a power line communication module. Communication module 1730 can transmit and receive wireless signals via the Internet using at least one of the following technologies: Wireless LAN (WLAN), Wi-Fi, Wi-Fi Direct, and Digital Living Network Alliance (DLNA). Furthermore, communication module 1730 can transmit and receive wireless signals via Bluetooth. ® The communication module 1730 can support short-range communication using at least one of the following technologies: Radio Frequency Identification (RFID), Infrared Data Association (IrDA), Ultra Wideband (UWB), ZigBee Wireless Personal Area Network (ZigBee), Near Field Communication (NFC), Wi-Fi, Wi-Fi Direct, and Wireless USB. The various types of communication modules described above can be implemented as a single chip or multiple separate chips.

[0202] The electronic device DV can output various types of information through the display module 1400 in the operating system. When the processor 1100 executes an application stored in the memory 1200, the display module 1400 can provide application information to the user through the display panel 10.

[0203] Based on the input data received from the input module 1300 or the sensor module 1610, the processor 1100 can output commands or data to the display module 1400, the sound output module 1630, the camera module 1710, or the optical module 1720. For example, the processor 1100 can generate image data corresponding to the input data and output the image data to the display module 1400, or it can generate command data corresponding to the input data and output the command data to the camera module 1710 or the optical module 1720. If no input data is received from the input module 1300 for a certain period of time, the processor 1100 can reduce the power consumption of the electronic device DV by switching the operating mode of the electronic device DV to a lower power mode or a sleep mode.

[0204] Processor 1100 can obtain external input through input module 1300 or sensor module 1610 and execute applications corresponding to the external input. For example, if the user selects a camera icon displayed on display panel 10, processor 1100 can obtain user input through input sensor 1612 and activate camera module 1710. Processor 1100 can transmit image data corresponding to the captured image obtained by camera module 1710 to display module 1400. Display module 1400 can display the image corresponding to the captured image through display panel 10.

[0205] For example, when performing personal information verification in the display module 1400, the fingerprint sensor 1611 can obtain the input fingerprint information as input data. The processor 1100 can compare the input data obtained by the fingerprint sensor 1611 with the verification data stored in the memory 1200, and execute the application based on the comparison result. The display module 1400 can display the information executed according to the application logic through the display panel 10.

[0206] For example, when a music stream icon is selected to be displayed on the display module 1400, the processor 1100 can obtain user input through the input sensor 1612 and activate the music stream application stored in the memory 1200. When a music execution command is entered in the music stream application, the processor 1100 can activate the sound output module 1630 and provide the user with sound information corresponding to the music execution command.

[0207] Some of the components can be connected to each other and exchange signals (e.g., commands or data) through communication methods such as buses, general purpose input / output (GPIO), serial peripheral interfaces (SPI), mobile industrial processor interfaces (MIPI), or ultrapath interconnect (UPI) links between peripheral devices. In one embodiment, the main processor 1110 can transmit image signals to the auxiliary processor 1120 via MIPI.

[0208] According to one or more of the above embodiments, a display panel for displaying high-quality images and an electronic device including the display panel can be realized. However, the scope of this disclosure is not limited to the above-described effects.

[0209] The above description is an example of the technical features of this disclosure, and those skilled in the art to which this disclosure pertains will be able to make various modifications and variations. Therefore, the embodiments of this disclosure described above can be implemented individually or in combination with each other.

[0210] Therefore, the embodiments disclosed herein are not intended to limit the technical spirit of this disclosure, but rather to describe it, and the scope of the technical spirit of this disclosure is not limited by these embodiments. The scope of protection of this disclosure should be interpreted by the appended claims, and it should be understood that all technical spirit within the equivalent scope is included within the scope of this disclosure.

Claims

1. A display panel, comprising: The pixel circuit group includes a first pixel circuit, a second pixel circuit, and a third pixel circuit; The first pixel electrode overlaps with the first pixel circuit in the planar view; The second pixel electrode overlaps with the second pixel circuit in the planar view; The third pixel electrode overlaps with the third pixel circuit in the plan view; as well as The connecting electrode is arranged below the first pixel electrode, the second pixel electrode, and the third pixel electrode. In the planar view, one end of the connecting electrode overlaps with the first pixel electrode, and the other end of the connecting electrode overlaps with the second pixel electrode.

2. The display panel according to claim 1, further comprising: A dam layer is disposed above the first pixel electrode, the second pixel electrode, and the third pixel electrode. The dam layer includes a first opening that overlaps with the first pixel electrode in a plan view, a second opening that overlaps with the second pixel electrode, and a third opening that overlaps with the third pixel electrode.

3. The display panel according to claim 2, wherein, In the plan view, the first opening is larger than the second opening and the third opening, and In the plan view, the second opening is smaller than the third opening.

4. The display panel according to claim 2, wherein, The second pixel electrode includes a first portion and a second portion, the first portion overlapping the second opening in a plan view, and the second portion being spaced apart from the first portion, with a gap between the first portion and the second portion. In the plan view, the gap extends along a portion of the edge of the second opening.

5. The display panel according to claim 4, wherein, The second part includes a contact portion electrically connected to the second pixel circuit, and The connecting electrode connects the first pixel electrode and the second portion to each other.

6. The display panel according to claim 4, wherein, The second pixel electrode and the third pixel electrode are adjacent to each other in a first direction, and The second pixel electrode includes a protrusion that protrudes in a second direction intersecting the first direction.

7. The display panel according to claim 6, wherein, The second part includes the protrusion.

8. The display panel according to claim 1, wherein, Each of the first pixel circuit, the second pixel circuit, and the third pixel circuit includes: A first transistor includes a gate, a first terminal, and a second terminal, wherein the gate is connected to a first node, the first terminal is connected to a drive voltage line, and the second terminal is connected to a second node; The second transistor is connected between the first node and one of the first data line, the second data line, and the third data line; The third transistor is connected between the initialization sensing line and the second node; and A capacitor is connected between the first node and the second node.

9. The display panel according to claim 8, wherein, The second transistor of the first pixel circuit is connected to the first data line. The second node of the first pixel circuit is connected to the first pixel electrode. The second transistor of the second pixel circuit is connected to the second data line. The second node of the second pixel circuit is connected to the second pixel electrode. The second transistor of the third pixel circuit is connected to the third data line, and The second node of the third pixel circuit is connected to the third pixel electrode.

10. The display panel according to claim 8, wherein, The second transistor of the second pixel circuit is connected to the first data line, and The second node of the second pixel circuit is connected to the first pixel electrode.

11. A display panel, comprising: The pixel circuit group includes a first pixel circuit, a second pixel circuit, and a third pixel circuit; The first pixel electrode overlaps with the first pixel circuit in the planar view; The second pixel electrode overlaps with the second pixel circuit in the planar view; The third pixel electrode overlaps with the third pixel circuit in the plan view; as well as Connect the electrodes to link the first pixel electrode and the second pixel electrode together. The second pixel electrode includes a first portion and a second portion, the second portion being spaced apart from the first portion and having a gap between the first portion and the second portion, and the second portion being connected to the connection electrode.

12. The display panel according to claim 11, further comprising: A dam layer is disposed above the first pixel electrode, the second pixel electrode, and the third pixel electrode. The dam layer includes a first opening that overlaps with the first pixel electrode in a plan view, a second opening that overlaps with the second pixel electrode, and a third opening that overlaps with the third pixel electrode.

13. The display panel according to claim 12, wherein, In the plan view, the first opening is larger than the second opening and the third opening, and In the plan view, the second opening is smaller than the third opening.

14. The display panel according to claim 12, wherein, In the plan view, the gap extends along a portion of the edge of the second opening.

15. The display panel according to claim 11, wherein, The second part includes a contact portion electrically connected to the second pixel circuit, and The connecting electrode connects the first pixel electrode and the second portion to each other.

16. The display panel according to claim 11, wherein, The second pixel electrode and the third pixel electrode are adjacent to each other in a first direction, and The second pixel electrode includes a protrusion that protrudes in a second direction intersecting the first direction.

17. The display panel according to claim 16, wherein, The first part includes the protrusion.

18. The display panel according to claim 16, wherein, The second part includes the protrusion.

19. An electronic device comprising: Display panel; as well as The processor drives the display panel. The display panel includes: The pixel circuit group includes a first pixel circuit, a second pixel circuit, and a third pixel circuit; The first pixel electrode overlaps with the first pixel circuit in the planar view; The second pixel electrode overlaps with the second pixel circuit in the planar view; The third pixel electrode overlaps with the third pixel circuit in the plan view; and Connect the electrodes to link the first pixel electrode and the second pixel electrode together. The second pixel electrode includes a first portion and a second portion, the second portion being spaced apart from the first portion and having a gap between the first portion and the second portion, and the second portion being connected to the connection electrode.

20. The electronic device according to claim 19, wherein, The connection electrode is arranged below the first pixel electrode, the second pixel electrode, and the third pixel electrode, and In the plan view, one end of the connecting electrode overlaps with the first pixel electrode, and the other end of the connecting electrode overlaps with the second portion of the second pixel electrode.

Images