Vibration device

Abstract

The invention belongs to the technical field of force feedback, and particularly relates to a vibration device. Piezoelectric ceramic is arranged on one side of a main body part, a first bonding pad is arranged on the side, facing the piezoelectric ceramic, of the main body part, a second bonding pad is arranged on the side, facing the main body part, of the piezoelectric ceramic, the first bonding pad is electrically connected with the second bonding pad, and a first connecting colloid is connected between the main body part and the piezoelectric ceramic. The first connecting colloid is arranged to respectively cover the first bonding pad and the second bonding pad. According to the vibration device in the technical scheme, the first connecting colloid wraps the first bonding pad and the second bonding pad, so that the first bonding pad and the second bonding pad are isolated from external water vapor, the external water vapor cannot make contact with the first bonding pad or the second bonding pad, the piezoelectric ceramic is prevented from being damaged, and the service life of the piezoelectric ceramic is prolonged. The piezoelectric ceramic can be well protected from being damaged even in an electrified state, and the high-temperature and high-humidity resistance of the piezoelectric ceramic is improved.

Description

Technical Field

[0001] This invention belongs to the field of force feedback technology, and specifically relates to a vibration device. Background Technology

[0002] Piezoelectric ceramics, as electronic components, exhibit both direct and inverse piezoelectric effects. Under the direct piezoelectric effect, piezoelectric ceramics can sense deformation, generating electrical charges and forming electrical signals. Under the inverse piezoelectric effect, when an electrical signal is applied to the piezoelectric ceramic, it can deform. Through different signal inputs, the piezoelectric ceramic can produce different vibration modes. These two working modes of piezoelectricity allow piezoelectric ceramics to be widely used in various actuators and sensors. A tactile feedback circuit is formed by combining a pressure sensor, piezoelectric ceramic, and a driver chip. Utilizing the high sensitivity of the pressure sensor, when a finger lightly presses the pressure sensor, the sensor generates a signal, which is output to the driver chip. The driver chip outputs an electrical signal to the piezoelectric ceramic, causing it to vibrate. The finger feels the vibration of the piezoelectric ceramic, thus forming a tactile feedback action. The solution using a pressure sensor has the characteristics of high sensing sensitivity, low trigger force, and short feedback time, and can realize functions such as long press, short press, and swipe.

[0003] Existing piezoelectric ceramics have strong hygroscopic properties. When piezoelectric ceramics absorb a certain amount of water or water vapor, due to the relatively high voltage or electric field strength of the working environment, the electrodes of the piezoelectric ceramics are very easy to break down when they come into contact with water vapor, resulting in breakdown failure of the piezoelectric ceramics. Summary of the Invention

[0004] The objective of this invention is to at least solve the problem of easy breakdown of existing piezoelectric ceramics during operation. This objective is achieved through the following technical solution: A first aspect of the present invention provides a vibration device comprising: FPC, the FPC including a main body; A piezoelectric ceramic is disposed on one side of the main body. The side of the main body facing the piezoelectric ceramic has a first pad, and the side of the piezoelectric ceramic facing the main body has a second pad. The first pad and the second pad are electrically connected. A first connecting adhesive is connected between the main body and the piezoelectric ceramic. The first connecting adhesive covers the first pad and the second pad respectively.

[0005] By using the vibration device in this technical solution, the first pad of the FPC and the second pad of the piezoelectric ceramic (equivalent to the electrode of the piezoelectric ceramic) are electrically connected. Then, the piezoelectric ceramic is driven by an electrical signal to generate vibration feedback. The first connecting colloid can connect the main body of the FPC and the piezoelectric ceramic. On the other hand, the first connecting colloid covers the first and second pads, so that the first and second pads are isolated from external moisture. External moisture cannot come into contact with the first or second pads, thereby avoiding damage to the piezoelectric ceramic. Even when energized, it can effectively protect the piezoelectric ceramic from damage, improve the high temperature and high humidity resistance of the piezoelectric ceramic, and reduce the occurrence of piezoelectric ceramic breakdown failure.

[0006] In addition, the vibration device according to the present invention may also have the following additional technical features: In some embodiments of the present invention, the FPC further includes two first connecting portions, which are respectively connected to both sides of the main body along the first direction. The vibration device further includes two piezoresistive sensors, which are electrically connected to each other on the two first connecting portions. The main body and the piezoelectric ceramic are arranged in a direction that intersects with the first direction.

[0007] In some embodiments of the present invention, the FPC further includes two transition portions, one of which connects each of the first connecting portions and the main body portion. Along the second direction, the size of the transition portion is smaller than the size of the main body portion and smaller than the size of the first connecting portion. The arrangement directions of the main body portion and the piezoelectric ceramic, the first direction and the second direction are arranged to intersect each other.

[0008] In some embodiments of the present invention, along the arrangement direction of the main body and the piezoelectric ceramic, the size of the main body is larger than the size of the two first connecting portions.

[0009] In some embodiments of the present invention, along the arrangement direction of the main body and the piezoelectric ceramic, the orthogonal projection of the piezoelectric ceramic toward the main body is located within the main body.

[0010] In some embodiments of the present invention, the FPC further includes a second connecting portion, which is electrically connected to one side of the main body portion along a second direction, wherein the arrangement direction of the main body portion and the piezoelectric ceramic is intersecting the second direction.

[0011] In some embodiments of the present invention, the vibration device further includes a reinforcing member, which is attached to the side of the main body away from the piezoelectric ceramic, and the reinforcing member and the main body are connected by a second connecting adhesive. Along the arrangement direction of the main body and the piezoelectric ceramics, the orthographic projection of the main body toward the reinforcing member is located within the reinforcing member.

[0012] In some embodiments of the present invention, the reinforcing member is an alloy member, an epoxy member, or a carbon fiber member.

[0013] In some embodiments of the present invention, the vibration device further includes a keycap disposed on the side of the piezoelectric ceramic away from the main body; or the keycap is disposed on the side of the reinforcing member away from the main body.

[0014] In some embodiments of the present invention, two first pads are provided, and two second pads are provided, with the two first pads being electrically connected to the two second pads in a one-to-one correspondence. Attached Figure Description

[0015] Various other advantages and benefits will become apparent to those skilled in the art upon reading the following detailed description of preferred embodiments. The accompanying drawings are for illustrative purposes only and are not intended to limit the invention. Furthermore, the same reference numerals denote the same parts throughout the drawings. In the drawings: Figure 1 A schematic diagram of the structure of a vibration device according to an embodiment of the present invention is shown. Figure 2 for Figure 1 A top view of the structure of the vibration device; Figure 3 for Figure 1 A front view schematic diagram of the vibration device; Figure 4 for Figure 1 Schematic diagram of the exploded structure of the vibration device; Figure 5 for Figure 1 A schematic diagram of the structure of the FPC in China; Figure 6 for Figure 1 A schematic diagram of the structure of medium-voltage electric ceramics.

[0016] The labels in the attached diagram are as follows: 100. Vibration device; 10. FPC; 11. Main body; 12. First connecting part; 13. Second connecting part; 14. Transition part; 15. First pad; 20. Piezoelectric ceramic; 21. Second solder pad; 30. Reinforcing components; 40. Keycaps; X, the first direction; Y, the second direction. Detailed Implementation

[0017] Exemplary embodiments of the present disclosure will now be described in more detail with reference to the accompanying drawings. While exemplary embodiments of the present disclosure are shown in the drawings, it should be understood that the present disclosure may be implemented in various forms and should not be limited to the embodiments set forth herein. Rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the scope of the disclosure to those skilled in the art.

[0018] It should be understood that the terminology used herein is for the purpose of describing particular exemplary embodiments only and is not intended to be limiting. Unless the context clearly indicates otherwise, the singular forms “a,” “an,” and “described” as used herein may also include the plural forms. The terms “comprising,” “including,” “containing,” and “having” are inclusive and therefore indicate the presence of the stated features, steps, operations, elements, and / or components, but do not exclude the presence or addition of one or more other features, steps, operations, elements, components, and / or combinations thereof. The method steps, processes, and operations described herein are not construed as requiring them to be performed in a particular order described or illustrated unless the order of performance is explicitly indicated. It should also be understood that additional or alternative steps may be used.

[0019] Although terms such as first, second, third, etc., may be used in this document to describe multiple elements, components, regions, layers, and / or segments, these elements, components, regions, layers, and / or segments should not be limited by these terms. These terms may be used only to distinguish one element, component, region, layer, or segment from another. Unless the context clearly indicates otherwise, terms such as "first," "second," and other numerical terms used herein do not imply order or sequence. Therefore, the first element, component, region, layer, or segment discussed below may be referred to as the second element, component, region, layer, or segment without departing from the teachings of the exemplary embodiments.

[0020] For ease of description, spatial relative terms may be used in the text to describe the relationship of one element or feature relative to another element or feature, as shown in the figure. These relative terms include, for example, "inside," "outside," "middle," "outer," "below," "below," "above," "over," etc. Such spatial relative terms are intended to include different orientations of the device in use or operation, other than those depicted in the figure. For example, if the device in the figure is flipped, an element described as "below other elements or features" or "below other elements or features" would subsequently be oriented "above other elements or features" or "above other elements or features." Therefore, the example term "below" can include both upper and lower orientations.

[0021] As electronic components, piezoelectric ceramics exhibit both direct and inverse piezoelectric effects. Under the direct piezoelectric effect, piezoelectric ceramics can sense deformation and generate electrical charges to form electrical signals. Under the inverse piezoelectric effect, when an electrical signal is applied to a piezoelectric ceramic, it can deform. Through different signal inputs, piezoelectric ceramics can produce different vibration modes. The working modes of direct and inverse piezoelectric effects enable piezoelectric ceramics to be widely used in various actuators and sensors.

[0022] A tactile feedback circuit is constructed by combining a pressure sensor, piezoelectric ceramic, and a driver chip. Utilizing the high sensitivity of the pressure sensor, when a finger lightly presses the sensor, it generates a signal, which is output to the driver chip. The driver chip then outputs an electrical signal to the piezoelectric ceramic, causing it to vibrate. The finger feels this vibration, thus generating tactile feedback. The solution using a pressure sensor features high sensitivity, low trigger force, and short feedback time, enabling functions such as long press, short press, and swipe.

[0023] Piezoelectric ceramic materials are divided into leaded and lead-free types. Leaded piezoelectric ceramics are most widely used in the PZT system (PZT system refers to lead zirconate titanate binary solid solution), while lead-free piezoelectric ceramics are based on systems such as KNN (potassium sodium niobate), BNT (bismuth sodium titanate), and BT (bismaleimide triazine resin, a high-performance thermosetting resin). However, all piezoelectric ceramics are highly hygroscopic. When piezoelectric ceramics absorb a certain amount of water or water vapor, they are easily broken down under relatively high voltage or electric field strength operating conditions, leading to breakdown failure. Piezoelectric ceramics are widely used as electronic components in smartphones, smart headphones, smart home products, and smart wearable products. Manufacturers typically set high-temperature and high-humidity reliability requirements for these ceramics. During high-temperature and high-humidity reliability testing, piezoelectric ceramics are highly susceptible to breakdown failure.

[0024] This invention relates to a vibration device that optimizes the connection structure between piezoelectric ceramics and FPCs (Flexible Printed Circuits), thereby improving the high temperature resistance, high humidity resistance, and breakdown voltage resistance of piezoelectric ceramics. This solves the problem of electrical reliability of piezoelectric ceramics in products such as smartphones, smart headphones, and smart wearables under high temperature and humidity conditions, allowing the piezoelectric ceramics to increase their operating voltage and frequency, and have a greater vibration feedback force output.

[0025] Figure 1 A schematic diagram of the structure of a vibration device 100 according to an embodiment of the present invention is shown. Figure 5 for Figure 1A schematic diagram of the structure of FPC10. Figure 6 for Figure 1 A schematic diagram of the structure of the medium-voltage electric ceramic 20. (See diagram below.) Figure 1 , 5 As shown in Figure 6, the present invention proposes a vibration device 100. The vibration device 100 of the present invention includes an FPC 10, a piezoelectric ceramic 20, and a reinforcing member 30. The FPC 10 includes a main body 11, the piezoelectric ceramic 20 is disposed on one side of the main body 11, a first pad 15 is provided on the side of the main body 11 facing the piezoelectric ceramic 20, and a second pad 21 is provided on the side of the piezoelectric ceramic 20 facing the main body 11. The first pad 15 and the second pad 21 are electrically connected. A first connecting adhesive is connected between the main body 11 and the piezoelectric ceramic 20. The first connecting adhesive is respectively disposed covering the first pad 15 and the second pad 21. The reinforcing member 30 is attached to the side of the main body 11 away from the piezoelectric ceramic 20.

[0026] By using the vibration device 100 in this technical solution, the first pad 15 of the FPC 10 and the second pad 21 of the piezoelectric ceramic 20 (equivalent to the electrode of the piezoelectric ceramic 20) are electrically connected. Then, the piezoelectric ceramic 20 is driven by an electrical signal to generate vibration feedback. The first connecting colloid can connect the main body 11 of the FPC 10 and the piezoelectric ceramic 20. On the other hand, the first connecting colloid covers the first pad 15 and the second pad 21, so that the first pad 15 and the second pad 21 are isolated from the external moisture. The external moisture cannot contact the first pad 15 or the second pad 21, thereby avoiding damage to the piezoelectric ceramic 20. Even when energized, the piezoelectric ceramic 20 can be well protected from damage, improving the high temperature and high humidity resistance of the piezoelectric ceramic 20, and reducing the occurrence of piezoelectric ceramic 20 breakdown failure.

[0027] Specifically, in this embodiment, the FPC10 can adopt a multi-layer structure design, which can be 1-100 layers. In addition, the FPC10 adopts a multi-layer structure design, and the thickness at different positions can be changed by changing the number of layers.

[0028] Specifically, in this embodiment, the first pad 15 is equivalent to the electrode of the FPC 10, and the second pad 21 is equivalent to the electrode of the piezoelectric ceramic 20. The first pad 15 and the second pad 21 can be soldered together or connected by other means that can provide electrical connection.

[0029] Specifically, in this embodiment, the reinforcing member 30 can be a plate-like structure with a length of 10-50mm, a width of 3-15mm, and a thickness of 0.05-1mm. The reinforcing member 30 can be arbitrarily combined within the aforementioned length, width, and thickness dimensions to form the required reinforcing member 30 size. Furthermore, the shape of the reinforcing member 30 can be rectangular, circular, or irregular to meet the needs of different application products or application scenarios. The reinforcing member 30 is attached to the side of the main body 11 facing away from the piezoelectric ceramic 20, serving as a structural strength reinforcement for the main body 11 and the piezoelectric ceramic 20. The three are connected as a whole. When the entire vibration device 100 is dropped, the reinforcing member 30 can improve the structural strength and bending strength of the entire vibration device 100, enhance its drop resistance during the drop process, and reduce the risk of breakage of the piezoelectric ceramic 20.

[0030] Furthermore, in other embodiments of the present invention, the reinforcing member 30 may also be provided on the side of the piezoelectric ceramic 20 away from the main body 11, and can also serve as a structural strength reinforcing member 30 for the main body 11 and the piezoelectric ceramic 20. When the entire vibration device 100 is in the process of falling, the reinforcing member 30 can also improve the structural strength and bending strength of the entire vibration device 100, improve the drop resistance during the drop process, and reduce the risk of breakage of the piezoelectric ceramic 20.

[0031] Specifically, in this embodiment, the reinforcing member 30 can also be a hollow or semi-hollow structure to meet the needs of different application products or application scenarios. That is, the reinforcing member 30 is provided with multiple through holes, and the extension direction of the through holes is parallel to the arrangement direction of the main body 11 and the piezoelectric ceramic 20. The multiple through holes are spaced apart, and along the arrangement direction of the main body 11 and the piezoelectric ceramic 20, the multiple through holes are all staggered with the main body 11. This arrangement can avoid the situation where the position of the through holes overlaps with the main body 11, which would reduce the connection area between the main body 11 and the reinforcing member 30, thereby reducing the connection strength between the main body 11 and the reinforcing member 30 of the FPC 10 and improving reliability.

[0032] In some embodiments of the present invention, such as Figure 5 As shown, the FPC10 also includes two first connecting parts 12, which are respectively connected to both sides of the main body 11 along the first direction X. The vibration device 100 also includes two piezoresistive sensors, which are electrically connected to the two first connecting parts 12. The main body 11 and the piezoelectric ceramic 20 are arranged in a direction intersecting the first direction X. In this embodiment, the piezoresistive sensor is a sensor based on the piezoresistive effect. It detects the magnitude of pressure or force by measuring the change in the resistance of a material when it is subjected to force. Its core principle is that when an external force is applied to the sensitive element (usually a silicon or metal thin film), the resistivity of the material changes, thereby outputting an electrical signal proportional to the pressure.

[0033] Specifically, the vibration device 100 in this embodiment can operate in various ways. One of them is: when an external force (which can be the finger of the operator pressing) acts on the piezoresistive sensor, the resistivity of the piezoresistive sensor will change and transmit an electrical signal to the first connection part 12 and the main body part 11. After receiving the electrical signal, the FPC 10 will act on the piezoelectric ceramic 20 and drive the piezoelectric ceramic 20 to vibrate, thereby realizing the corresponding feedback operation.

[0034] Specifically, in this embodiment, the arrangement of the two first connecting parts 12 can accommodate two piezoresistive sensors, thereby facilitating the vibration device 100 to acquire the force from multiple positions and ultimately drive the piezoelectric ceramic 20 to vibrate according to the force, thus completing the corresponding operation of force feedback.

[0035] Specifically, in other embodiments of the present invention, there may be more than two first connecting portions 12, such as three, four, or five. Similarly, multiple piezoresistive sensors are also provided, wherein the number of piezoresistive sensors and the number of first connecting portions 12 are the same and they are connected in a one-to-one correspondence. The combination structure of multiple piezoresistive sensors and multiple first connecting portions 12 can further enable the vibration device 100 to improve the location point and location area of ​​the force acquisition.

[0036] In some embodiments of the present invention, such as Figure 5 As shown, the FPC10 also includes two transition portions 14. Each first connecting portion 12 and the main body portion 11 are connected by a transition portion 14. Along the second direction Y, the size of the transition portion 14 is smaller than the size of the main body portion 11 and smaller than the size of the first connecting portion 12. The arrangement directions of the main body portion 11 and the piezoelectric ceramic 20, the first direction X and the second direction Y are intersected in pairs. In this embodiment, a transition portion 14 is provided between each first connecting portion 12 and the main body portion 11, and the size of the transition portion 14 along the second direction Y is smaller than both the main body portion 11 and the first connecting portion 12. This reduces the connection area between the main body portion 11 and the first connecting portion 12. When a force is applied to the piezoresistive sensor on the first connecting portion 12, more of the force is applied to the piezoresistive sensor and less is transmitted to the main body portion 11 through the narrower transition portion 14. This improves the effect of the force on the piezoresistive sensor and enhances the detection accuracy and sensitivity of the piezoresistive sensor.

[0037] Specifically, in this embodiment, theoretically, the smaller the size of the transition portion 14 along the second direction Y, the better. However, it is necessary to conduct specific analysis and calculation based on the specific structure between the main body portion 11, the first connecting portion 12, and the reinforcing member 30. In this invention, it is only necessary to ensure that the size of the transition portion 14 along the second direction Y is smaller than the size of the main body portion 11 and smaller than the size of the first connecting portion 12.

[0038] Specifically, in this embodiment, the first direction X is the length direction of the overall vibration device 100, the second direction Y is the width direction of the overall vibration device 100, and the arrangement direction of the reinforcing member 30 and the piezoelectric ceramic 20 is the thickness direction (also the height direction) of the overall vibration device 100. The main body 11 and the piezoelectric ceramic 20 are arranged perpendicularly to each other, as are the first direction X and the second direction Y.

[0039] In some embodiments of the present invention, the size of the main body 11 is larger than the size of the two first connecting portions 12 along the arrangement direction of the main body 11 and the piezoelectric ceramic 20. In this embodiment, since the main body 11 and the piezoelectric ceramic 20 are connected, the increased size of the main body 11 along the arrangement direction of the main body 11 and the piezoelectric ceramic 20 further enhances the connection strength between the main body 11 and the piezoelectric ceramic 20. When the entire vibration device 100 is dropped, the structural strength and bending strength of the entire vibration device 100 are further enhanced, the drop resistance is improved, and the risk of breakage of the piezoelectric ceramic 20 is reduced.

[0040] Specifically, in this embodiment, the two first connecting portions 12 have the same size along the arrangement direction of the reinforcing member 30 and the piezoelectric ceramic 20, which can ensure that the FPC10 has symmetry along the first direction X. Furthermore, since the size of the first connecting portions 12 along the arrangement direction of the reinforcing member 30 and the piezoelectric ceramic 20 is small, it is easy to achieve the effect of lightweighting the overall vibration device 100.

[0041] Specifically, in this embodiment, the FPC10 adopts a multi-layer structure design. The thickness at different locations can be changed by altering the number of layers. For example, the thickness at the first connecting portions 12 at both ends can be set to be thinner, while the thickness at the location in the middle where it is bonded to the piezoelectric ceramic 20 (which is the same size as or slightly larger than the piezoelectric ceramic 20) can be set to be thicker. By changing the thickness, various thickness combinations can be formed with the reinforcing member 30 and the piezoelectric ceramic 20, thereby achieving optimal performance and reliability. The FPC10 integrates a piezoresistive sensor and a piezoelectric ceramic 20 driving signal circuit. The FPC10 has piezoresistive sensors at both ends. When the piezoresistive sensors detect a pressure signal and transmit it to the control chip of the main body 11 of the FPC10, it drives the piezoelectric ceramic 20 to vibrate.

[0042] In some embodiments of the present invention, such as Figure 2 and 3As shown, along the arrangement direction of the main body 11 and the piezoelectric ceramic 20, the orthographic projection of the piezoelectric ceramic 20 toward the main body 11 is located inside the main body 11. In this embodiment, the above-mentioned arrangement enables the piezoelectric ceramic 20 to fully contact the main body 11, thereby maximizing the connection area between the main body 11 and the piezoelectric ceramic 20, further enhancing the connection strength between the piezoelectric ceramic 20 and the main body 11. When the entire vibration device 100 is falling, the occurrence of separation between the piezoelectric ceramic 20 and the main body 11 is reduced. In addition, the area of ​​the first connecting adhesive is also maximized. The first connecting adhesive with the largest area can enhance cohesion and better cover the first pad 15 and the second pad 21, so that the first pad 15 and the second pad 21 are isolated from external moisture. External moisture cannot contact the first pad 15 or the second pad 21, thereby avoiding damage to the piezoelectric ceramic 20. Even when energized, the piezoelectric ceramic 20 can be well protected from damage, improving the high temperature and high humidity resistance of the piezoelectric ceramic 20, while reducing the occurrence of piezoelectric ceramic 20 breakdown failure.

[0043] Specifically, in this embodiment, such as Figure 2 and 3 As shown, along the arrangement direction of the main body 11 and the piezoelectric ceramic 20, the orthographic projection of the main body 11 toward the reinforcing member 30 is located within the reinforcing member 30. This arrangement maximizes the connection area between the main body 11 and the reinforcing member 30. When the entire vibration device 100 is dropped, the reinforcing member 30, being fully connected to the main body 11, can further enhance the structural strength and bending strength of the entire vibration device 100, improve its drop resistance during the drop process, and reduce the risk of breakage of the piezoelectric ceramic 20.

[0044] In some embodiments of the present invention, such as Figure 5 As shown, the FPC10 also includes a second connecting portion 13, which is electrically connected to one side of the main body 11 along the second direction Y. The arrangement directions of the main body 11 and the piezoelectric ceramic 20 intersect with the second direction Y. In this embodiment, the second connecting portion 13 is used to connect other electronic devices outside the vibration device 100 to transmit the electrical signal of the piezoresistive sensor for easy recording and analysis.

[0045] Specifically, another of the various operating modes of the vibration device 100 in this embodiment is as follows: the external electrical components directly transmit electrical signals to the main body 11 of the FPC 10 through the second connection part 13, and then the main body 11 transmits electrical signals to the piezoelectric sensor through the first pad 15 and the second pad 21. After receiving the electrical signals, the piezoelectric sensor will deform itself and generate continuous vibration along its own thickness direction to realize the corresponding feedback operation.

[0046] Specifically, in this embodiment, multiple second connection parts 13 may be provided, and each second connection part 13 is connected to an electronic device outside the vibration device 100, so that the vibration device 100 can receive electrical signals from multiple external components and vibrate through the piezoelectric ceramic 20 to achieve the effect of force feedback.

[0047] In some embodiments of the present invention, the reinforcing member 30 and the main body 11 are connected by a second connecting adhesive. In this embodiment, both the second connecting adhesive and the first connecting adhesive are conductive adhesives, which can form a conductive path between the FPC 10, the piezoelectric ceramic 20, and the reinforcing member 30, thereby achieving an electrical connection.

[0048] Specifically, in this embodiment, the conductive adhesive uses a polymer as a matrix and incorporates conductive particles (such as silver, copper, and carbon nanotubes). After curing, it forms a flexible conductive path. Since the piezoelectric ceramic 20 will cause the conductive adhesive and FPC10 to vibrate to a certain extent when it performs force feedback vibration, the conductive adhesive itself has a certain elasticity, allowing itself and FPC10 to maintain electrical connection under bending, thus improving reliability.

[0049] In some embodiments of the present invention, such as Figure 5 and 6 As shown, two first pads 15 and two second pads 21 are provided, with each first pad 15 electrically connected to each of the two second pads 21 in a one-to-one correspondence. In this embodiment, the first pads 15 and the second pads 21 are respectively connected to the positive and negative electrodes (or two electrode surfaces) of the piezoelectric ceramic 20, thereby forming a complete electrical circuit. This ensures that under the positive piezoelectric effect, the charge generated by mechanical stress in the piezoelectric ceramic 20 can be discharged through the first pads 15, forming a measurable voltage signal. Simultaneously, it also ensures that under the inverse piezoelectric effect, the FPC 10 can be applied to the piezoelectric ceramic 20 through the second pads 21, driving the piezoelectric ceramic 20 to vibrate.

[0050] In some embodiments of the present invention, the reinforcing member 30 is an alloy part, an epoxy part, or a carbon fiber part. In this embodiment, the reinforcing member 30 can be stainless steel, iron-nickel alloy, titanium alloy, or other alloys, or it can be FR4 plate or carbon fiber plate, etc. Alloy parts, FR4 parts, and carbon fiber parts all have the characteristics of high strength and rigidity. When the entire vibration device 100 is dropped, the reinforcing member 30 made of alloy, FR4, or carbon fiber can further improve the structural strength and bending strength of the entire vibration device 100, improve the drop resistance during the drop process, and reduce the risk of breakage of the piezoelectric ceramic 20.

[0051] In some embodiments of the present invention, such as Figure 4As shown, the vibration device 100 also includes a keycap 40, which is disposed on the side of the piezoelectric ceramic 20 away from the main body 11; or the keycap 40 is disposed on the side of the reinforcing member 30 away from the main body 11. In this embodiment, the keycap 40 being disposed on either the piezoelectric ceramic 20 or the reinforcing member 30 can achieve an integral structure with the FPC 10, the reinforcing member 30, and the piezoelectric ceramic 20. When the piezoelectric ceramic 20 undergoes deformation vibration, the vibration can be transmitted to the keycap 40, and then transmitted to the person or object that needs to sense the vibration through the keycap 40.

[0052] Specifically, the present invention preferably places the keycap 40 on the side of the piezoelectric ceramic 20 away from the reinforcing member 30 on the main body 11. Since the keycap 40 is directly connected to the piezoelectric ceramic 20, it can better receive feedback vibration and transmit the vibration to the outside of the vibration device 100.

[0053] Furthermore, in this embodiment, the length of the piezoelectric ceramic 20 along the first direction X can be 8-30mm, the width along the second direction Y can be 2-5mm, and the thickness along the arrangement direction of the main body 11 and the piezoelectric ceramic 20 can be 0.1-0.9mm. The piezoelectric ceramic 20 can be arbitrarily combined within the respective ranges of the above-mentioned length, width, and thickness dimensions to form the required size of the piezoelectric ceramic 20. The dimensions of the corresponding reinforcing member 30 and the main body 11 also need to be adjusted accordingly based on the size of the piezoelectric ceramic 20.

[0054] With the development of tactile technology, touch buttons have gradually replaced physical buttons and are being applied in more and more fields such as consumer electronics and automotive cockpits. Vibration feedback structures are increasingly being incorporated into touch buttons. Among these, vibration feedback technology driven by 20 piezoelectric ceramic pads is a commonly used vibration feedback technology besides eccentric motors and linear motors, characterized by its small size, thinness, and strong vibration. In the vibration device 100 of this invention, the first connecting colloid covers the first pad 15 and the second pad 21, isolating them from external moisture. External moisture cannot contact the first pad 15 or the second pad 21, thus preventing damage to the piezoelectric ceramic 20. Even when energized, it effectively protects the piezoelectric ceramic 20 from damage, improving its resistance to high temperature and humidity, and reducing the occurrence of piezoelectric ceramic 20 breakdown failure.

[0055] The above description is merely a preferred embodiment of the present invention, but the scope of protection of the present invention is not limited thereto. Any variations or substitutions that can be easily conceived by those skilled in the art within the technical scope disclosed in the present invention should be included within the scope of protection of the present invention. Therefore, the scope of protection of the present invention should be determined by the scope of the claims.

Claims

1. A vibration device, characterized in that, include: FPC, the FPC including a main body; A piezoelectric ceramic is disposed on one side of the main body. The side of the main body facing the piezoelectric ceramic has a first pad, and the side of the piezoelectric ceramic facing the main body has a second pad. The first pad and the second pad are electrically connected. A first connecting adhesive is connected between the main body and the piezoelectric ceramic. The first connecting adhesive covers the first pad and the second pad respectively.

2. The vibration device according to claim 1, characterized in that, The FPC also includes two first connecting parts, which are respectively connected to both sides of the main body along the first direction. The vibration device also includes two piezoresistive sensors, which are electrically connected to each other on the two first connecting parts. The main body and the piezoelectric ceramic are arranged in a direction that intersects with the first direction.

3. The vibration device according to claim 2, characterized in that, The FPC also includes two transition sections, one of which connects each of the first connecting sections and the main body. Along the second direction, the size of the transition section is smaller than the size of the main body and smaller than the size of the first connecting section. The arrangement directions of the main body and the piezoelectric ceramics, the first direction and the second direction are intersecting each other.

4. The vibration device according to claim 2, characterized in that, Along the arrangement direction of the main body and the piezoelectric ceramic, the size of the main body is larger than the size of the two first connecting parts.

5. The vibration device according to claim 1, characterized in that, Along the arrangement direction of the main body and the piezoelectric ceramic, the orthographic projection of the piezoelectric ceramic toward the main body is located within the main body.

6. The vibration device according to claim 1, characterized in that, The FPC further includes a second connecting portion, which is electrically connected to one side of the main body along the second direction. The main body and the piezoelectric ceramic are arranged in a direction that intersects with the second direction.

7. The vibration device according to claim 1, characterized in that, The vibration device further includes a reinforcing member, which is attached to the side of the main body away from the piezoelectric ceramic, and the reinforcing member and the main body are connected by a second connecting adhesive. Along the arrangement direction of the main body and the piezoelectric ceramics, the orthographic projection of the main body toward the reinforcing member is located within the reinforcing member.

8. The vibration device according to claim 7, characterized in that, The reinforcing component is an alloy component, an epoxy component, or a carbon fiber component.

9. The vibration device according to claim 7, characterized in that, The vibration device further includes a keycap, which is disposed on the side of the piezoelectric ceramic away from the main body; or the keycap is disposed on the side of the reinforcing member away from the main body.

10. The vibration device according to claim 1, characterized in that, There are two first pads and two second pads, with each of the two first pads being electrically connected to the other of the two second pads in a one-to-one correspondence.

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