Hair growing equipment and manufacturing method thereof

Abstract

The invention belongs to the technical field of phototherapy beauty equipment manufacturing, and provides hair growing equipment and a manufacturing method thereof.The hair growing equipment comprises an outer cloth layer, a flexible circuit layer and an inner cloth layer which are sequentially arranged, and a plurality of light-emitting parts are arranged on one side of the flexible circuit layer; comprising the steps that according to the installation position of the light-emitting part on the flexible circuit layer, a corresponding receding hole is formed in the inner cloth layer; the flexible circuit layer is pre-fixed between the outer cloth layer and the inner cloth layer, so that the light-emitting pieces are embedded into the corresponding receding holes; and performing three-dimensional hot-pressing integrated forming treatment on the pre-fixed outer cloth layer, the flexible circuit layer and the inner cloth layer, so that the outer cloth layer, the flexible circuit layer and the inner cloth layer are integrally formed, and cooling and shaping the hot-pressed outer cloth layer, the hot-pressed flexible circuit layer and the hot-pressed inner cloth layer.

Description

Technical Field

[0001] This invention belongs to the field of phototherapy beauty equipment manufacturing technology, specifically relating to a hair growth device and its manufacturing method. Background Technology

[0002] With the increasing awareness of health and beauty among residents, hair loss is showing a trend of affecting younger people, leading to the rapid development of non-invasive phototherapy hair regrowth technology. Among these, headband-style hair regrowth caps have become the mainstream category of phototherapy hair regrowth equipment due to their advantages such as ease of use, suitability for home use, and non-invasiveness.

[0003] The core structure of most existing hair growth caps is a sandwich-style composite structure, with the mainstream manufacturing process being a traditional stitching and splicing technique. This involves sandwiching a flexible circuit board with light-emitting components between two layers of fabric, using stitching and adhesive splicing to fix and shape each layer. This type of process inevitably creates seams and splicing joints on the inner wall of the cap, resulting in poor inner wall flatness. When worn, this can easily lead to localized pressure and insufficient fit, reducing wearing comfort and causing uneven spacing between the light-emitting components and the scalp, affecting the phototherapy hair growth effect. At the same time, the stitching holes and splicing gaps can compromise the structural seal, failing to provide effective protection for the internal circuit components. Long-term use can lead to malfunctions such as sweat corrosion and short circuits, resulting in a short product lifespan. In addition, the stitching and splicing process relies on manual alignment, resulting in low alignment accuracy between the light-emitting components and the light-transmitting holes, which can easily cause light blockage, further reducing the efficiency of phototherapy. Summary of the Invention

[0004] This application provides a hair growth device and its manufacturing method, aiming to solve the problems that the core structure of existing head-mounted hair growth caps is mostly a sandwich-type composite structure, and the mainstream manufacturing process is a traditional stitching and splicing process. This results in the formation of seams and splicing of bone positions on the inner wall of the cap, leading to poor inner wall flatness and problems such as local pressure and insufficient fit when worn.

[0005] In a first aspect, this application provides a method for manufacturing a hair growth device, the hair growth device comprising an outer fabric layer, a flexible circuit layer, and an inner fabric layer arranged sequentially, wherein a plurality of light-emitting elements are disposed on one side of the flexible circuit layer; including: According to the mounting position of the light-emitting element on the flexible circuit layer, a corresponding clearance hole is opened in the inner fabric layer; The flexible circuit layer is pre-fixed between the outer fabric layer and the inner fabric layer, so that the light-emitting element is embedded in the corresponding clearance hole; The pre-fixed outer fabric layer, flexible circuit layer, and inner fabric layer are subjected to three-dimensional hot pressing integral molding process to integrally form the outer fabric layer, flexible circuit layer, and inner fabric layer. The hot-pressed outer fabric layer, flexible circuit layer, and inner fabric layer are then cooled and shaped.

[0006] In some embodiments, the hair growth device further includes a main structure, and before opening corresponding clearance holes in the inner fabric layer according to the mounting position of the light-emitting element on the flexible circuit layer, the device further includes: obtaining the size information of the outer fabric layer, the flexible circuit layer and the inner fabric layer according to the main body size of the main structure, so as to complete the cutting of the outer fabric layer, the flexible circuit layer and the inner fabric layer.

[0007] In some embodiments, after cooling and shaping the hot-pressed outer fabric layer, flexible circuit layer and inner fabric layer, the method further includes: attaching the hot-pressed outer fabric layer, flexible circuit layer and inner fabric layer to the inner side of the main structure by means of the outer fabric layer.

[0008] In some embodiments, the step of opening a corresponding clearance hole in the inner fabric layer according to the mounting position of the light-emitting element on the flexible circuit layer includes: obtaining the arrangement position and external dimensions of each light-emitting element on the flexible circuit layer; opening the clearance hole corresponding to the light-emitting element on the side of the inner fabric layer away from the outer fabric layer according to the arrangement position and external dimensions; the size of the clearance hole matches the external dimensions of the light-emitting element to ensure that the light emitted by the light-emitting element is output without obstruction.

[0009] In some embodiments, the three-dimensional hot-pressing integral molding process of the pre-fixed outer fabric layer, flexible circuit layer and inner fabric layer includes: placing the pre-fixed outer fabric layer, flexible circuit layer and inner fabric layer into a preset three-dimensional hot-pressing mold, performing hot-pressing under preset temperature and pressure parameters, and forming a positioning imprint structure corresponding to the flexible circuit layer in the inner fabric layer during the hot-pressing process, thereby completing the three-dimensional hot-pressing integral molding process.

[0010] In some embodiments, the cooling and shaping of the outer fabric layer, flexible circuit layer and inner fabric layer after hot pressing includes: placing the outer fabric layer, flexible circuit layer and inner fabric layer that have completed the hot pressing process in the three-dimensional hot pressing mold, allowing them to cool statically in a preset constant temperature environment, and then demolding them after the outer fabric layer, flexible circuit layer and inner fabric layer have completely shaped.

[0011] In some embodiments, before the installation position of the light-emitting element on the flexible circuit layer is determined, the method further includes: soldering a plurality of light-emitting elements to preset pad positions on the flexible circuit board, and soldering corresponding electronic components and power supply components to obtain the flexible circuit layer.

[0012] In some embodiments, before performing three-dimensional hot pressing integral molding on the pre-fixed outer fabric layer, flexible circuit layer and inner fabric layer, the method further includes: performing high-temperature resistant insulation protection treatment on the electronic components and power supply components corresponding to the flexible circuit layer to ensure that the power supply components are not damaged during the hot pressing process.

[0013] In some embodiments, the step of welding multiple light-emitting elements to preset pad positions on a flexible circuit board includes: selecting a vertical cavity surface-emitting laser as the light-emitting element, adjusting the size of the corresponding clearance hole on the inner fabric layer to match the external size of the vertical cavity surface-emitting laser, so that the laser emitted by the vertical cavity surface-emitting laser can be unobstructed through the clearance hole to irradiate the wearer's scalp area.

[0014] Secondly, this application provides a hair growth device for use in preparation according to the method provided in any embodiment of this application.

[0015] This application utilizes a three-dimensional hot-pressing integrated molding process to press and shape a sandwich structure consisting of an outer fabric layer, a flexible circuit layer, and an inner fabric layer in one go. This completely avoids the sutures and bone misalignments produced by traditional sewing processes, as well as the air bubbles and hidden connection bone misalignments produced by injection molding processes. The resulting hair growth device has a smooth inner wall without any protrusions or seams, significantly improving the fit and comfort of wearing it. At the same time, it ensures that the distance between the light-emitting component and the scalp is uniform, enhancing the phototherapy hair growth effect.

[0016] This invention only opens ventilation holes at the position of the light-emitting component in the inner fabric layer, and does not require openings in the outer fabric layer. While ensuring that the light-emitting component outputs light without obstruction and efficiently, it also ensures the integrity of the device's appearance and the airtightness of its structure. It can provide comprehensive protection for the internal flexible circuit layer, preventing sweat and moisture from corroding the circuit components, and improving the safety and service life of the product.

[0017] This invention employs a pre-fixed, three-dimensional hot-pressing integrated molding process. Compared to the high-temperature and high-pressure environment of injection molding, the hot-pressing process offers gentler molding conditions, effectively preventing damage to light-emitting components and electronic components during the molding process, significantly improving product yield, and reducing production costs. At the same time, the development cost of hot-pressing molds is lower, and they can be flexibly adjusted to adapt to hair growth devices of different sizes and head shapes, accommodating rapid product iteration and personalized customization.

[0018] The process steps of this invention are simple and controllable. Pre-fixing achieves precise alignment between the light-emitting component and the clearance hole, and hot-pressing integral molding achieves stable combination of the three-layer structure. There is no need for complicated manual sewing or insert positioning process, which can realize standardized and large-scale production, improve production efficiency, and ensure the consistency of product batches.

[0019] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Attached Figure Description

[0020] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0021] Figure 1 This is an exploded schematic diagram of a hair growth device provided in this application; Figure 2 This is an exploded schematic diagram of another hair growth device provided in this application; Figure 3 This is a schematic flowchart illustrating the steps of a method for manufacturing a hair growth device according to an embodiment of this application; Figure 4 This is a schematic block diagram of the structure of a computer device provided in an embodiment of this application.

[0022] Figure label: 1. Outer fabric layer; 2. Flexible circuit layer; 21. Light-emitting component; 3. Inner fabric layer; 31. Hole opening; 4. Main structure.

[0023] It should be understood that the above general description and the following detailed description are exemplary and explanatory only, and do not limit this application. Detailed Implementation

[0024] The technical solutions of the embodiments of this application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of this application, not all embodiments. Based on the embodiments of this application, all other embodiments obtained by those skilled in the art without creative effort are within the scope of protection of this application.

[0025] The flowchart shown in the attached diagram is for illustrative purposes only and does not necessarily include all content and operations / steps, nor does it necessarily have to be performed in the order described. For example, some operations / steps can be broken down, combined, or partially merged, so the actual execution order may change depending on the actual situation.

[0026] It should be understood that, in order to clearly describe the technical solutions of the embodiments of the present invention, the terms "first" and "second" are used in the embodiments of the present invention to distinguish identical or similar items with essentially the same function and effect. Those skilled in the art will understand that the terms "first" and "second" do not limit the quantity or execution order, and the terms "first" and "second" are not necessarily different.

[0027] It should be understood that the terminology used in this specification is for the purpose of describing particular embodiments only and is not intended to limit the scope of the application. As used in this specification and the appended claims, the singular forms “a,” “an,” and “the” are intended to include the plural forms unless the context clearly indicates otherwise.

[0028] It should also be understood that the term “and / or” as used in this application specification and the appended claims means any combination of one or more of the associated listed items and all possible combinations, and includes such combinations.

[0029] The following detailed description of some embodiments of this application is provided in conjunction with the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0030] With the increasing awareness of health and beauty among residents, hair loss is showing a trend of affecting younger people, leading to the rapid development of non-invasive phototherapy hair regrowth technology. Among these, headband-style hair regrowth caps have become the mainstream category of phototherapy hair regrowth equipment due to their advantages such as ease of use, suitability for home use, and non-invasiveness.

[0031] The core structure of most existing hair growth caps is a sandwich-style composite structure, and the mainstream manufacturing processes fall into two categories: The first is the traditional stitching and splicing process, which uses two layers of fabric to sandwich a flexible circuit board with light-emitting components, and fixes and shapes each layer by stitching and gluing. This type of process inevitably creates seams and splicing joints on the inner wall of the cap, resulting in poor inner wall flatness. When worn, it is prone to local pressure and insufficient fit, which not only reduces wearing comfort but also causes uneven distance between the light-emitting components and the scalp, affecting the phototherapy hair growth effect. At the same time, the stitching needle holes and splicing gaps will damage the structural seal and fail to provide effective protection for the internal circuit components. Long-term use is prone to malfunctions such as sweat corrosion and short circuits, resulting in a short product lifespan. In addition, the stitching and splicing process relies on manual alignment, and the alignment accuracy between the light-emitting components and the light-transmitting holes is low, which can easily lead to light blockage and further reduce the efficiency of phototherapy.

[0032] The second type is the one-piece injection molding process. To address the shortcomings of stitching and splicing processes, the industry has developed an injection molding solution that uses an inner fabric layer and a flexible circuit board as inserts in an injection mold, injecting flexible polymer material to form the outer structure. However, this type of injection molding process is prone to generating air bubbles and shrinkage marks within the material during molding, making it impossible to achieve a smooth and flat inner wall of the cap. Furthermore, there are still hidden ridges at the junction of the insert and the injection-molded layer, failing to fundamentally solve the problem of uneven inner wall. At the same time, the high temperature and high pressure environment required for injection molding can easily cause irreversible damage to the light-emitting components and electronic components on the flexible circuit board, resulting in extremely low product yield and high production costs. In addition, injection-molded products have high hardness, making it difficult to adapt to the head shape curves of different wearers, resulting in significant defects in fit and comfort. Moreover, the high cost of injection mold development makes it difficult to flexibly adapt to rapid product iteration and personalized adjustments.

[0033] To resolve the above issues, please refer to [link / reference]. Figure 3 , Figure 3 This is a schematic flowchart of a method for manufacturing a hair growth device according to an embodiment of this application. The method for manufacturing this hair growth device is used to prepare... Figures 1 to 2 The hair growth device shown includes an outer fabric layer 10, a flexible circuit layer 20, and an inner fabric layer 30 arranged sequentially. A plurality of light-emitting elements 21 are provided on one side of the flexible circuit layer 20, and the inner fabric layer 30 includes light-blocking holes 31 corresponding to the light-emitting elements 21.

[0034] In some embodiments, such as Figure 2 As shown, the hair growth device can be a hair growth cap, and also includes a main structure 40 that works in conjunction with an outer fabric layer 10, a flexible circuit layer 20 and an inner fabric layer 30 to be worn on the user's head.

[0035] like Figure 3 As shown, the provided method includes steps S101 to S103.

[0036] Step S101. According to the mounting position of the light-emitting element on the flexible circuit layer, a corresponding clearance hole is opened in the inner fabric layer.

[0037] Specifically, this step is a core preliminary process to ensure the efficiency of phototherapy and wearing comfort. It addresses the core defects in existing processes, such as low alignment accuracy between the light-emitting components and the light-transmitting structure, light obstruction, uneven inner walls caused by protruding light-emitting components, and local pressure on the scalp. At the same time, it establishes a unified digital benchmark for the precise alignment of the subsequent three-layer structure.

[0038] First, the flexible printed circuit (FPC) layer is prefabricated. Then, using surface mount technology (SMT), the light-emitting components (typically 630nm-670nm red / 850nm near-infrared LEDs), current-limiting resistors, connectors, and other electronic components are precisely mounted onto the flexible substrate, completing the prototype of the flexible circuit layer. The Gerber design file and surface mount coordinate file of this flexible circuit layer are extracted to determine the center coordinates, outline dimensions, and pad positions of each light-emitting component, establishing a unified digital positioning benchmark throughout the entire process to ensure consistency in benchmarks for hole opening and alignment.

[0039] The inner fabric layer is the skin-friendly layer that comes into direct contact with the scalp. It prioritizes skin-friendly, breathable, hypoallergenic, and thermally stable fabrics, such as medical-grade microfiber knitted fabric, nylon / spandex high-elastic blended fabric, and hydrophilic nonwoven fabric. The fabric weight is controlled between 80-150 g / m². 2 It balances softness with heat-pressing shaping properties.

[0040] To prevent the fabric from shrinking and shifting during hot pressing after the holes are made, the fabric needs to be pre-stabilized: the fabric is laid flat on a shaping fixture and pre-shrinked and heat-set for 30-60 minutes in a constant temperature environment of 80-120℃, controlling the warp and weft shrinkage rate of the fabric to ≤1%, eliminating internal stress in the fabric, and ensuring the long-term stability of the hole size and position.

[0041] The clearance hole is machined using a CNC machining process that matches the digital reference, replacing the traditional manual alignment and hole opening. The specific implementation is as follows: the pre-treated inner fabric layer is fixed on a special fixture on the CNC machining platform. The fixture is equipped with positioning pins that correspond one-to-one with the positioning holes of the flexible circuit layer, so as to achieve the reference unification between the fabric and the flexible circuit layer.

[0042] The design of the clearance hole size includes: the inner contour size of a single clearance hole is 0.05-0.2mm larger than the maximum outer dimension of the corresponding light-emitting component, with the tolerance controlled within ±0.03mm, which ensures that the light-emitting component can be inserted without compression, and will not shift due to excessive gap.

[0043] The preferred hole-making process is CNC ultraviolet laser cutting, precision die cutting, or CNC punching, which allows for the simultaneous processing of all clearance holes in one operation. The hole position deviation is ≤ ±0.03mm, which is far higher than the accuracy level of manual alignment.

[0044] After laser drilling, the hole wall is melted simultaneously to prevent the fabric from fraying or fraying at the hole. At the same time, a second low-temperature setting is performed to eliminate the internal stress generated by the drilling and prevent the hole from deforming during subsequent hot pressing.

[0045] Visual inspection equipment is used to perform a full inspection of the hole diameter, hole position accuracy, and hole wall quality of the clearance hole, and defective products with hole position misalignment, hole diameter out of tolerance, and hole wall damage are rejected to ensure the subsequent fitting accuracy.

[0046] Step S102. The flexible circuit layer is pre-fixed between the outer fabric layer and the inner fabric layer, so that the light-emitting element is embedded in the corresponding clearance hole.

[0047] Specifically, this step is a key transitional process in hot pressing integrated molding. Its core is to achieve precise alignment and temporary fixation of the three-layer structure without slippage, completely eliminating traditional suturing and adhesive splicing processes. This avoids the generation of pinholes, sutures, and splicing bone positions from the source, while ensuring that the three-layer structure is not misaligned and the light-emitting components are not shifted during hot pressing, laying the foundation for the final integrated molding.

[0048] The outer fabric layer, flexible circuit layer, and inner fabric layer are all pre-set with 2-4 sets of uniformly sized positioning holes, with a positional tolerance of ≤±0.02mm, forming a unified physical positioning benchmark throughout the entire process. The outer fabric layer preferentially uses high-resilience, aging-resistant, and heat-pressing compatible fabrics, such as high-elastic polyester fiber knitted fabric or neoprene composite fabric, with a weight controlled at 100-200g / m². 2 It balances the shape retention of the hat with the fit of the wearer.

[0049] Before the pre-fixing operation, the outer fabric layer is precisely fixed to the lower mold surface of the pre-fixing fixture using positioning pins to ensure that the fabric is laid flat without wrinkles or stretching, thus completing the bottom reference positioning.

[0050] The prefabricated flexible circuit layer is precisely laid on the upper surface of the outer fabric layer using positioning pins to ensure that the overall outline of the flexible circuit layer matches the design of the cap perfectly, without warping or offset.

[0051] To prevent slippage of the circuit layer during hot pressing and to avoid damage to electronic components, a pre-fixation scheme using hot melt adhesive film in non-functional areas is adopted. TPU hot melt adhesive film with a melting point of 80-100℃ and a thickness of 0.05-0.15mm is selected and cut into shapes that perfectly match the non-light-emitting and non-component areas of the flexible circuit layer. It is strictly forbidden for the hot melt adhesive film to cover the light-emitting surface of the light-emitting components, solder pads, or core electronic components. The cut hot melt adhesive film is then laid between the flexible circuit layer and the outer fabric layer and pre-pressed using a low-temperature hot press or flat press. The pre-pressing parameters are: temperature 60-80℃, pressure 0.2-0.3MPa, and holding time 5-10s. This achieves temporary fixation between the flexible circuit layer and the outer fabric layer, ensuring no slippage during subsequent operations and preventing premature hardening of edges.

[0052] Simultaneously, the external wiring and connector areas of the flexible circuit layer are wrapped and protected with high-temperature resistant Teflon fixtures to prevent the interface components from being squeezed or damaged during subsequent hot pressing.

[0053] After the inner fabric layer has completed the hole inspection, it is precisely aligned with the same set of positioning pins and laid flat on top of the flexible circuit layer. During the operation, each light-emitting component is aligned one by one to ensure that it is embedded into the corresponding clearance hole without compression or displacement.

[0054] After the integration is completed, the height difference between the light-emitting surface of the light-emitting component and the inner wall of the inner fabric layer is controlled within ±0.05mm using a dial indicator and visual inspection equipment. This ensures that there will be no scalp pressure caused by protruding LED beads, nor will there be an increase in optical path and a decrease in phototherapy efficiency caused by recessed LED beads.

[0055] After the alignment and fitting are completed, the fabric positions corresponding to the edge contour areas of the three-layer structure and the blank areas of the flexible circuit layer are pre-fixed without pinholes: along the edge of the design contour of the cap body, an intermittent low-temperature hot-press spot welding process is used. The pre-fixing parameters are: temperature 80-100℃ (matching the melting point of the hot melt adhesive film), pressure 0.3-0.4MPa, single-point pressure holding time 3-5s, and spot welding spacing controlled at 15-20mm; alternatively, hot melt adhesive strips of the same specification can be laid on the edge of the three-layer structure to complete the edge pre-fixing.

[0056] This method ensures that the three-layer structure will not experience interlayer misalignment, slippage, or fabric wrinkling during the transfer to the hot press mold, and will not form solidified splicing ribs. At the same time, it completely eliminates the sewing process, preventing the generation of pinholes and seams from the source, thus ensuring the airtightness of the structure.

[0057] Step S103. Perform three-dimensional hot pressing integral molding process on the pre-fixed outer fabric layer, flexible circuit layer and inner fabric layer to integrally form the outer fabric layer, flexible circuit layer and inner fabric layer, and cool and shape the hot-pressed outer fabric layer, flexible circuit layer and inner fabric layer.

[0058] Specifically, this step is the core process of the entire manufacturing process. Through three-dimensional low-temperature hot pressing, the seamless integration of the three-layer structure is achieved and the three-dimensional shape of the cap is formed simultaneously. This completely solves the problems of splicing bone positions in existing sewing processes, bubble shrinkage marks in injection molding processes, and damage to high-temperature components. At the same time, it achieves a smooth and flat inner wall of the cap, full sealing protection, and high resilience and adaptability, taking into account wearing comfort, phototherapy effect, product reliability, and production economy.

[0059] The hot pressing mold adopts a three-dimensional parting mold that matches the curve of the human head shape. It is divided into an upper mold (corresponding to the inner wall of the hat, i.e. the inner fabric layer side) and a lower mold (corresponding to the outer wall of the hat, i.e. the outer fabric layer side). The mold cavity surface is designed based on the standard head shape based on the big data statistics of human head. The head shape curve can also be customized according to individual needs to adapt to the wearing needs of users with different head circumferences.

[0060] The upper mold's forming working surface (which directly contacts the inner fabric layer) is mirror-polished with a surface roughness Ra≤0.02μm, ensuring that the inner wall of the cap after forming is completely smooth and flat, without any bumps or ridges. The upper and lower molds are independently equipped with circulating temperature control channels and cooling channels, with temperature control accuracy within ±1℃. The temperature of the upper and lower molds can be adjusted independently to achieve low-temperature protection for the components. The mold cavity corresponds to the location of flexible circuit layer wiring, connectors, and large components, and a dedicated clearance groove is reserved to avoid squeezing and damaging electronic components during hot pressing.

[0061] Before hot pressing, the mold is preheated, and the upper and lower molds are controlled differently: the lower mold (outer fabric side) is preheated to 120-160℃, and the upper mold (inner fabric / component side) is preheated to 80-120℃. The key is to control the temperature of the component contact side to not exceed the maximum temperature resistance threshold of LED beads and surface mount components (usually 125℃), so as to fundamentally avoid irreversible damage to components caused by high temperature and high pressure of injection molding.

[0062] The pre-fixed three-layer structure workpiece is precisely placed into the lower mold cavity using the positioning pins on the mold, ensuring that the workpiece is free of wrinkles, offsets, and stretching, and that the light-emitting components are completely aligned with the mold's clearance position; before closing the mold, it is confirmed again that the component protective fixtures are installed in place, without falling off or misaligning.

[0063] A gradient hot pressing process with segmented pressure increase and segmented temperature control is adopted to avoid internal air bubbles, fabric burn, and component damage caused by one-time high pressure and high temperature. It is specifically divided into three stages: Phase 1: Low-pressure venting and pre-compression stage: After mold closing, apply low pressure of 0.3-0.5 MPa for 10-20 seconds. The core function is to completely expel residual air between the three layers from the cavity, preventing air bubbles, voids, and delamination defects after molding. At the same time, it allows the hot melt adhesive layer to initially melt, achieving preliminary bonding of the three layers and laying the foundation for subsequent molding.

[0064] The second stage: Medium-pressure constant-temperature integrated molding stage: The molding pressure is steadily increased to 0.8-1.5MPa, maintaining the preset temperature of the upper and lower molds, and the holding time is 30-90s. This stage is the core molding stage: the hot melt adhesive layer is completely melted, and under uniform pressure, the molten adhesive is evenly filled into the microscopic gaps of the three-layer structure, achieving seamless full bonding of the outer fabric layer, flexible circuit layer, and inner fabric layer, completely eliminating interlayer gaps and cavities; at the same time, under constant temperature and pressure, the three-layer structure synchronously fits the three-dimensional curved surface of the mold, completing the three-dimensional shape of the cap body in one go. The mirror mold will be completely replicated onto the inner wall of the inner fabric layer, achieving a seamless, rib-free, and completely smooth inner wall. It should be noted that the specific temperature, pressure, and holding time can be adjusted according to the fabric material and hot melt adhesive specifications. The molding temperature of knitted fabric is lower than that of non-woven fabric to avoid high-temperature burn damage to the fabric.

[0065] The third stage: Low-pressure holding and internal stress elimination stage: The pressure is steadily reduced to 0.4-0.6MPa, while maintaining the preset temperature, and the holding time is 10-20s. The core function is to eliminate the internal stress between the molten adhesive layer and the fabric, avoid shrinkage, warping, and deformation after cooling, ensure the long-term stability of the three-dimensional shape of the cap, and further improve the uniformity of interlayer bonding.

[0066] After hot pressing and holding, the mold is not opened immediately. Instead, constant temperature cooling water is introduced directly through the cooling channels inside the mold to perform gradient cooling on the mold and the workpiece. The cooling rate is strictly controlled at 5-10℃ / min until the overall temperature of the mold drops to 35-45℃. Then the mold is opened and the molded workpiece is removed.

[0067] Gradient cooling is key to ensuring the stability of the finished product: it avoids uneven shrinkage, warping, and stress concentration in the workpiece caused by rapid cooling, ensuring that the three-dimensional shape of the cap does not spring back and the flatness of the inner wall does not decrease; at the same time, it allows the hot melt adhesive layer to cool and solidify slowly under constant pressure, achieving permanent bonding of the three-layer structure. After molding, the interlayer peel strength is ≥5N / cm, and there will be no delamination or debonding defects during long-term use.

[0068] After removing the workpiece, excess scrap is precisely removed along the designed contour of the cap using CNC cutting equipment. The external connectors of the flexible circuit layer are assembled, and waterproof potting is applied to the interfaces to achieve a waterproof rating of IPX4 or higher. Simultaneously, a full inspection of the finished product is conducted, including checks on inner wall flatness, the precision of the light-emitting component's fit, interlayer adhesion strength, circuit conductivity, light emission uniformity, and waterproof performance, ensuring the finished product fully meets design requirements.

[0069] In some embodiments, the hair growth device further includes a main structure, and before opening corresponding clearance holes in the inner fabric layer according to the mounting position of the light-emitting element on the flexible circuit layer, the device further includes: obtaining the size information of the outer fabric layer, the flexible circuit layer and the inner fabric layer according to the main body size of the main structure, so as to complete the cutting of the outer fabric layer, the flexible circuit layer and the inner fabric layer.

[0070] This embodiment is a preparatory process before the S101 hole-opening process. It mainly solves the problems in the existing process, such as the mismatch between the three-layer structure and the main body size of the cap, insufficient precision of manual cutting leading to subsequent alignment deviations, poor adhesion after molding, and edge warping. It establishes a unified dimensional benchmark for the entire process, ensuring the consistency and adaptability of subsequent hole-opening, alignment, and hot-pressing processes.

[0071] First, the main structure of the hair growth device (i.e., the main body supporting the hair growth cap, which is usually an elastic cap shell, head circumference support skeleton, and shaped cap structure that conforms to the human head circumference size, and is the core of the product's appearance and wearing support) is defined. The inner three-dimensional curved surface data, the inner diameter of the main body (standard head circumference 54-62cm), the outline size of the inner contact surface, and the edge assembly size of the main structure are obtained through three-dimensional scanning, and a full-size digital reference model of the main structure is established.

[0072] Based on the digital reference model of the main structure, the size information of the outer fabric layer, flexible circuit layer, and inner fabric layer are matched respectively. At the same time, compensation values ​​are added in advance to take into account the heat shrinkage characteristics of the fabric: Flexible circuit layer: The outline size is 0.5-1mm smaller than the light-emitting area on the inner side of the main structure on one side, so as to avoid the circuit layer exceeding the edge of the main body after molding, and the lead-out position of connectors and power supply cables is reserved simultaneously; Outer / inner fabric layer: The outline size is 2-3mm larger than the inner bonding surface of the main structure on one side, so as to reserve cutting allowance and assembly allowance after hot pressing; According to the shrinkage rate after the fabric pre-shrinkage treatment, a heat shrinkage compensation of 1%-2% is added to the cutting size to avoid insufficient size due to fabric shrinkage after hot pressing; The three-layer structure is designed with unified positioning holes. The position of the positioning holes is completely consistent with the assembly reference of the main structure and the positioning reference of the flexible circuit layer, and the positional tolerance is controlled within ±0.02mm.

[0073] Based on the matched dimensional information, a CNC laser cutting machine and a CNC cutting machine are used to cut the three-layer structure in an integrated manner, and positioning holes with a unified reference are processed simultaneously. After the cutting is completed, a two-dimensional image instrument is used to fully inspect the outline dimensions and the position of the positioning holes, and defective products with out-of-tolerance dimensions and deformed outlines are rejected to ensure the dimensional compatibility between the three-layer structure and the main structure.

[0074] In some embodiments, after cooling and shaping the hot-pressed outer fabric layer, flexible circuit layer and inner fabric layer, the method further includes: attaching the hot-pressed outer fabric layer, flexible circuit layer and inner fabric layer to the inner side of the main structure by means of the outer fabric layer.

[0075] This embodiment is a post-assembly process following the S103 cooling and shaping process. The core solution is to address the issues of insufficient fit between the three-layer composite structure after hot pressing and the main body of the cap, easy detachment, and interlayer slippage during wear. This achieves stable integration of the composite phototherapy structure and the main body of the cap, while also ensuring the wearing support of the cap and the scalp fit of the phototherapy structure.

[0076] The three-layer composite structure, after cooling and shaping, undergoes CNC edge trimming to cut its outline to a size that perfectly matches the inner bonding surface of the main structure, removing any excess material. Simultaneously, the power supply cables and connectors of the flexible circuit layer are arranged, leaving space for connection with the power supply and control modules on the main structure. The inner bonding surface of the main structure and the outer surface of the outer fabric layer of the composite structure are cleaned to remove oil, dust, and lint, ensuring the bonding surfaces are clean and free of impurities.

[0077] Pre-treatment of the bonding surface is completed according to the bonding process: If self-adhesive bonding is used, a primer is evenly applied to the bonding surface to improve the adhesion of the adhesive layer; if hot melt adhesive bonding is used, a layer of TPU hot melt adhesive film matching the contour of the composite structure is pre-laid on the bonding surface, and the thickness of the adhesive film is controlled at 0.08-0.15mm to avoid bonding protrusions caused by excessive adhesive layer.

[0078] The cut three-layer composite structure is precisely aligned with the assembly benchmark of the main structure using a positioning fixture, so that the outer surface of the outer fabric layer is completely bonded to the inner surface of the main structure. During the bonding process, a center-to-edge rolling process is used to remove residual air between the bonding surfaces, avoiding air bubbles, wrinkles, and achieving 100% full curved surface bonding.

[0079] After bonding, curing should be carried out according to the process: hot melt adhesive bonding requires holding pressure at 80-100℃ and 0.2-0.3MPa for 15-30s to achieve permanent bonding; self-adhesive bonding requires pressing at the edges and standing for 12-24h to fully cure, ensuring a bonding peel strength ≥3N / cm.

[0080] After curing, the power supply cable of the flexible circuit layer is connected to the control module and power supply battery of the main structure to complete the circuit continuity test; at the same time, the flatness of the composite structure and the edge bonding strength are checked to ensure that there will be no delamination, warping or slippage during wear and use.

[0081] In some embodiments, the step of opening a corresponding clearance hole in the inner fabric layer according to the mounting position of the light-emitting element on the flexible circuit layer includes: obtaining the arrangement position and external dimensions of each light-emitting element on the flexible circuit layer; opening the clearance hole corresponding to the light-emitting element on the side of the inner fabric layer away from the outer fabric layer according to the arrangement position and external dimensions; the size of the clearance hole matches the external dimensions of the light-emitting element to ensure that the light emitted by the light-emitting element is output without obstruction.

[0082] This embodiment is a refinement and optimization of the core process S101, which solves the pain points of inaccurate alignment between the light-emitting component and the opening, light blockage, and low light output efficiency in the existing process. By precisely matching the arrangement and size of the light-emitting component, 100% unobstructed light output is achieved, maximizing the efficiency of phototherapy hair growth, while ensuring the fitting accuracy between the light-emitting component and the opening.

[0083] The parameters of the light-emitting components are accurately extracted through the Gerber design files and patch coordinate files of the flexible circuit layer. The two-dimensional arrangement position (center X / Y coordinates), three-dimensional shape dimensions (length / width / height), and effective light-emitting area size of each light-emitting component are accurately obtained. A unique digital model of each light-emitting component is established as the sole reference for the opening of the clearance hole.

[0084] The precise matching of the clearance hole size is based on the design specifications of the light-emitting component parameters: First, the basic fitting size is matched, and the inner contour size of the clearance hole is 0.05-0.2mm larger than the maximum outer size of the light-emitting component, with the tolerance controlled within ±0.03mm. This ensures that the light-emitting component is not squeezed into place and will not shift due to excessive gaps. Second, the light emission design is unobstructed. The minimum light transmission size of the clearance hole completely covers the effective light emission area of ​​the light-emitting component, ensuring 100% unobstructed light output. Third, the array holes are processed synchronously. All clearance holes are formed in one go, and the cumulative deviation between the hole spacing and the light-emitting component arrangement spacing is ≤±0.05mm.

[0085] The directional hole-making process employs CNC ultraviolet laser cutting technology. A through-hole is made on the side of the inner fabric layer facing away from the outer fabric layer (i.e., the inner surface of the finished product that contacts the scalp when worn), moving towards the side closer to the outer fabric layer. This directional opening method ensures a smooth, burr-free, and weld-edge-free hole wall on the laser entry surface (inner wall of the cap), further guaranteeing the flatness of the inner wall and preventing scalp pressure caused by hole wall protrusions. Simultaneously, the tiny weld edge on the exit surface provides a locking effect, preventing the fabric holes from pilling or fraying after long-term use.

[0086] After the holes are drilled, the position, diameter, and wall quality of each hole are fully inspected using visual inspection equipment. At the same time, the holes are tested and fitted with the corresponding light-emitting components to confirm the fitting accuracy and light transmission effect. Defective products with hole misalignment, out-of-tolerance hole diameter, or obstruction of the light transmission area are rejected.

[0087] In some embodiments, the three-dimensional hot-pressing integral molding process of the pre-fixed outer fabric layer, flexible circuit layer and inner fabric layer includes: placing the pre-fixed outer fabric layer, flexible circuit layer and inner fabric layer into a preset three-dimensional hot-pressing mold, performing hot-pressing under preset temperature and pressure parameters, and forming a positioning imprint structure corresponding to the flexible circuit layer in the inner fabric layer during the hot-pressing process, thereby completing the three-dimensional hot-pressing integral molding process.

[0088] This embodiment is a core refinement of the S103 hot pressing process, which solves the problems of interlayer slippage of the three-layer structure, displacement of the flexible circuit layer, and attenuation of alignment accuracy after molding during the hot pressing process. Through standardized mold hot pressing process and positioning imprint structure design, the precise integrated molding of the three-layer structure is achieved, while strengthening the long-term fixation effect of the flexible circuit layer.

[0089] Based on the three-dimensional curved surface of the inner side of the main structure of the hair growth cap and the standard curve of the human head shape, a high-precision three-dimensional hot pressing mold is customized. The mold is divided into an upper mold (corresponding to the inner fabric layer side) and a lower mold (corresponding to the outer fabric layer side). After the mold is closed, the cavity gap is completely matched with the design thickness of the pre-fixed three-layer structure, and the tolerance is controlled within ±0.02mm. The working surface of the upper mold is set with a micro-protrusion imprinting structure that is completely matched with the contour of the flexible circuit layer and the arrangement of the light-emitting components. The imprinting protrusion height is 0.05-0.1mm, which is used for forming positioning imprinting.

[0090] The pre-fixed three-layer workpiece is precisely placed into the lower mold cavity using the mold positioning pins, ensuring that the workpiece is free of wrinkles, stretching, and offset, and that the light-emitting component is completely aligned with the mold clearance groove. Before closing the mold, confirm that the upper and lower mold references are aligned, and the mold closing accuracy is ≤ ±0.01mm.

[0091] Segmented hot pressing is performed according to preset temperature and pressure parameters, which are adapted to the characteristics of the fabric and hot melt adhesive: the temperature is controlled differently, with the lower mold (outer fabric side) at 120-160℃ and the upper mold (inner fabric / component side) at 80-120℃, with a temperature control accuracy of ±1℃, to ensure that the components are within a safe temperature range; the pressure is increased in stages, first applying a low pressure of 0.3-0.5MPa for venting for 10-20s, then increasing to a molding pressure of 0.8-1.5MPa and holding for 30-90s, and finally reducing to 0.4-0.6MPa and holding for 10-20s to eliminate internal stress.

[0092] During the core molding stage of hot pressing and pressure holding, the micro-protrusion imprint structure of the upper mold forms a positioning imprint structure on the surface of the inner fabric layer that perfectly corresponds to the contour of the flexible circuit layer and the arrangement of the light-emitting components. This micro-recessed structure, on the one hand, precisely limits the light-emitting components within the clearance holes to prevent displacement after long-term use; on the other hand, it firmly presses the edges of the flexible circuit layer and the blank areas between the two fabric layers, completely eliminating the risk of interlayer slippage and delamination.

[0093] After hot pressing, the pressure and temperature sensors built into the mold confirm that the molding parameters meet the preset requirements throughout the process, ensuring that the three-layer structure is completely bonded together, the positioning and imprinting structure is formed completely, and there are no defects such as missing glue, hollow areas, or delamination.

[0094] In some embodiments, the cooling and shaping of the outer fabric layer, flexible circuit layer and inner fabric layer after hot pressing includes: placing the outer fabric layer, flexible circuit layer and inner fabric layer that have completed the hot pressing process in the three-dimensional hot pressing mold, allowing them to cool statically in a preset constant temperature environment, and then demolding them after the outer fabric layer, flexible circuit layer and inner fabric layer have completely shaped.

[0095] This embodiment is a core refinement of the S103 cooling and shaping process, which solves the problems of uneven cooling of workpieces, internal stress concentration, warping and deformation after molding, and head shape springback in the existing cooling process. By constant temperature static cooling in the mold, the workpiece is uniformly shaped, ensuring the long-term stability of the three-dimensional shape of the cap and the flatness of the inner wall.

[0096] After the hot pressing and holding process is completed, immediately stop heating the mold, keep the upper and lower molds in the closed state, maintain a holding pressure of 0.4-0.6MPa, do not open the mold, avoid the workpiece springback and deformation caused by pressure release, and provide a constant pressure environment for cooling and shaping.

[0097] The constant temperature cooling environment is established by circulating cooling water through the internal cooling channels of the mold to stably control the temperature of the mold cavity within a preset constant temperature range of 35-45℃, with a temperature control accuracy of ±1℃, thus forming a uniform constant temperature cooling environment and avoiding uneven shrinkage of the workpiece caused by local temperature differences.

[0098] Under constant pressure and temperature, the hot-pressed workpiece is left to cool in the mold for 60-120 seconds (adjusted according to the workpiece thickness and fabric material) to ensure uniform cooling of the workpiece from the inside out, complete cooling and curing of the hot melt adhesive layer, complete shaping of the fabric three-dimensional shape, and full release of internal stress.

[0099] After the workpiece has cooled and settled, the temperature sensor inside the mold is used to confirm that the overall temperature of the workpiece has dropped to a constant temperature range with no local temperature difference, and that the hot melt adhesive layer has been completely cured with no risk of springback. Then, the mold is opened and demolded at a uniform speed to avoid workpiece deformation or tearing caused by excessively fast mold opening speed.

[0100] After demolding, the workpiece is placed on a shaping fixture that matches the head shape and left to stand at room temperature for 10-20 minutes to complete the secondary natural shaping. The three-dimensional shape and inner wall flatness of the workpiece are detected by a three-dimensional scanner to confirm that the deviation between the shape and the design model is ≤ ±0.1mm, the inner wall surface roughness Ra≤0.05μm, and there is no warping, deformation, or springback.

[0101] In some embodiments, before the installation position of the light-emitting element on the flexible circuit layer is determined, the method further includes: soldering a plurality of light-emitting elements to preset pad positions on the flexible circuit board, and soldering corresponding electronic components and power supply components to obtain the flexible circuit layer.

[0102] This embodiment is a core pre-process before the S101 hole-opening process. It addresses issues such as poor consistency of the flexible circuit layer, insufficient welding precision of the light-emitting components, and subsequent alignment deviations and hot-pressing damage caused by unreasonable component layout. It prefabricates a standardized flexible circuit layer to provide a precise benchmark and qualified core functional components for subsequent processes.

[0103] The flexible circuit board substrate is made of highly flexible and heat-resistant polyimide (PI) substrate with a thickness of 25-100μm, which takes into account both bending performance and structural stability. The circuit layout is designed according to the light-emitting area of ​​the hair growth cap, and the circuit avoids the area that is easily squeezed by hot pressing. Positioning holes, connector pads and power supply component connection positions are reserved at the same time to complete the substrate sample preparation.

[0104] Based on the needs of phototherapy for hair growth, 630nm-670nm red LEDs / 850nm near-infrared LEDs are selected as the light-emitting components, along with matching current-limiting resistors, filter capacitors, control chips, and other electronic components, as well as FPC cables, connectors, and other power supply components. All component pads are fully matched with the preset pads on the flexible circuit board, with dimensional tolerances controlled within ±0.02mm to ensure soldering accuracy.

[0105] High-precision SMT surface mount technology (SMT) soldering employs a fully automated SMT process to complete component soldering: First, a fully automated solder paste printer precisely prints solder paste at preset pad positions, with a thickness of 0.1-0.15mm and a printing accuracy of ±0.01mm. Next, a high-precision placement machine precisely places the light-emitting components onto the corresponding pads, with a placement accuracy of ≤±0.02mm, simultaneously placing matching electronic components and power supply components. Finally, a reflow oven completes the soldering process, using a stepped temperature profile with a peak temperature of 230-250℃ and a peak duration of ≤10s to avoid high-temperature damage to the substrate and components, ensuring a cold solder joint rate of ≤0.1%.

[0106] After welding is completed, the component placement accuracy and welding quality are checked by AOI automatic optical inspection equipment, and defective products with placement misalignment, cold solder joints and false solder joints are rejected; continuity test, light emission uniformity test and withstand voltage test are performed to ensure that the circuit conducts normally and the light emission is uniform and without dead lights; the outline dimensions, positioning hole positions and light-emitting component arrangement positions are checked by a 2D image instrument to ensure that they are completely consistent with the design benchmark, and to provide a precise benchmark for the subsequent hole opening process.

[0107] In some embodiments, before performing three-dimensional hot pressing integral molding on the pre-fixed outer fabric layer, flexible circuit layer and inner fabric layer, the method further includes: performing high-temperature resistant insulation protection treatment on the electronic components and power supply components corresponding to the flexible circuit layer to ensure that the power supply components are not damaged during the hot pressing process.

[0108] This embodiment is a key protective process before the S103 hot pressing process. It addresses the issues of damage to electronic components and power supply parts caused by high temperature and high pressure during hot pressing, as well as short circuits in metal pins. Without affecting the hot pressing effect, it achieves comprehensive protection for the core electrical components, further improving product yield and long-term reliability.

[0109] Before the hot pressing process, the flexible circuit layer is thoroughly inspected, and the core protection area is defined, including surface-mount electronic components (control chips, filter capacitors, current-limiting resistors), power supply cables, connectors, soldered pins, and supporting power supply components (micro batteries, power supply interfaces); the light-emitting surface of the light-emitting components is not included in the protection range to avoid blocking the light emission.

[0110] The protective materials selected are high-temperature resistant, highly insulating, flexible, and residue-free after hot pressing: First, PI material gold finger high-temperature tape, with long-term temperature resistance ≥260℃, breakdown voltage ≥5kV, and thickness of 0.025-0.05mm, used for the protection of the main body of components; Second, silicone high-temperature resistant protective sleeves, with temperature resistance ≥200℃ and Shore hardness of 30-40A, used for compression protection of connectors and power supply interfaces; Third, low-viscosity UV-cured insulating adhesive, with temperature resistance ≥180℃, used for insulation protection of pins and pads.

[0111] A tiered protection scheme is adopted based on the characteristics of the components: Level 1 protection (surface mount electronic components): High-temperature insulating tape is used to fully cover the components, extending 0.5-1mm beyond the component edge. The tape is completely adhered without bubbles or curling edges, which not only isolates the high temperature but also buffers the pressure of hot pressing, preventing the components from being crushed; Level 2 protection (connectors and power supply components): Insulating tape is first used to wrap the contact area between the pins and the metal, and then a custom silicone protective sleeve is fitted. The protective sleeve is perfectly matched with the mold clearance groove to avoid pressure impact during hot pressing, preventing connector deformation and pin breakage; Level 3 protection (soldered pins and circuit edges): UV-cured insulating adhesive is used to coat the pins and circuit edges with a coating thickness ≤0.05mm. After UV curing, an insulating protective layer is formed to prevent the pins from piercing the fabric layer during hot pressing, which could lead to short circuits and leakage.

[0112] After the protective treatment is completed, a secondary continuity test and an insulation withstand voltage test are performed on the flexible circuit layer to confirm that the protection does not affect the circuit's conductivity and that the insulation performance meets the requirements. At the same time, the adhesion of the protective layer is checked to ensure that there are no curling edges, no peeling, and no obstruction of the light-emitting surface.

[0113] In some embodiments, the step of welding multiple light-emitting elements to preset pad positions on a flexible circuit board includes: selecting a vertical cavity surface-emitting laser as the light-emitting element, adjusting the size of the corresponding clearance hole on the inner fabric layer to match the external size of the vertical cavity surface-emitting laser, so that the laser emitted by the vertical cavity surface-emitting laser can be unobstructed through the clearance hole to irradiate the wearer's scalp area.

[0114] This embodiment represents an upgrade to the flexible circuit layer prefabrication process. It addresses the pain points of traditional LED light-emitting components, such as low light power density, poor light penetration, and limited hair growth effect. It adopts a vertical cavity surface-emitting laser (VCSEL) as the light-emitting component and matches it with a corresponding hole-avoiding design to achieve higher power density and higher collimation laser light therapy output, thereby significantly improving the hair growth effect.

[0115] VCSEL Light Source Selection and Parameter Matching: Red VCSEL chips with wavelengths of 650nm-680nm were selected as the light source. Compared with traditional LEDs, VCSELs in this wavelength band can increase the light power density by 5-10 times, have a small beam divergence angle and strong light penetration, and can be precisely focused on the hair follicle area of ​​the scalp, avoiding light energy loss. Based on the hair growth area design, the output power and arrangement density of a single VCSEL chip were determined to complete the chip selection.

[0116] Based on SMT (Surface Mount Technology) assembly, the soldering parameters were optimized to complete the VCSEL chip mounting: the stencil aperture design was optimized for the tiny VCSEL pads, and the solder paste printing accuracy was ±0.01mm to avoid bridging and solder balls; a high-precision pick-and-place machine was used for mounting, with a mounting accuracy of ≤±0.01mm, ensuring that the chip's light-emitting center completely coincides with the preset position; the reflow soldering temperature profile was optimized, with a peak temperature of 220-240℃ and a peak duration of ≤8s, to avoid high-temperature damage to the VCSEL chip cavity surface and ensure optical performance and service life.

[0117] Based on the VCSEL chip's external dimensions, aperture diameter, and beam divergence angle, the specifications of the corresponding clearance holes in the inner fabric layer are adjusted as follows: First, the basic dimensions are matched, with the inner contour dimensions of the clearance holes perfectly matching the external dimensions of the VCSEL chip, within a tolerance of ±0.02mm, ensuring precise chip embedding without offset; second, the beam is designed to be unobstructed, with the aperture diameter of the clearance holes completely covering the chip's aperture diameter, while the hole walls are slightly chamfered to prevent the hole walls from obstructing or reflecting the laser beam, ensuring that the laser irradiates the scalp hair follicle area without obstruction or loss; third, the array holes are processed synchronously in one go, with the deviation between the hole center and the chip's light-emitting center ≤±0.02mm, ensuring uniform laser output.

[0118] Meanwhile, the non-light-emitting surface and pins of the VCSEL chip are protected with high-temperature insulation to prevent damage to the chip during hot pressing. After soldering and hole opening, the optical performance of the VCSEL circuit layer is tested, including output power, wavelength stability and beam collimation, to ensure that the optical performance of all chips meets the design requirements. At the same time, the light-emitting component and the hole are trial-fitted to confirm that the laser output is unobstructed.

[0119] Please see Figure 4 , Figure 4 This is a schematic block diagram of the structure of a computer device provided in an embodiment of this application. The computer device includes a processor, a memory, and a network interface connected via a device bus, wherein the memory may include a storage medium and internal memory.

[0120] The storage medium can store operating devices and computer programs. The computer program includes program instructions that, when executed, cause the processor to perform any method of manufacturing the hair growth device.

[0121] The processor provides computing and control capabilities, supporting the operation of the entire computer device.

[0122] Internal memory provides an environment for the execution of computer programs in non-volatile storage media. When executed by a processor, the computer program can enable the processor to execute any method of manufacturing a hair growth device.

[0123] This network interface is used for network communication, such as sending assigned tasks. Those skilled in the art will understand that... Figure 4 The structure shown is merely a block diagram of a portion of the structure related to the present application and does not constitute a limitation on the terminal to which the present application is applied. Specific computer devices may include more or fewer components than those shown in the figure, or combine certain components, or have different component arrangements.

[0124] It should be understood that the processor can be a Central Processing Unit (CPU), but it can also be other general-purpose processors, digital signal processors (DSPs), application-specific integrated circuits (ASICs), field-programmable gate arrays (FPGAs), or other programmable logic devices, discrete gate or transistor logic devices, discrete hardware components, etc. Among these, a general-purpose processor can be a microprocessor or any conventional processor.

[0125] In one embodiment, the processor is configured to run a computer program stored in memory to perform the following steps: According to the mounting position of the light-emitting element on the flexible circuit layer, a corresponding clearance hole is opened in the inner fabric layer; The flexible circuit layer is pre-fixed between the outer fabric layer and the inner fabric layer, so that the light-emitting element is embedded in the corresponding clearance hole; The pre-fixed outer fabric layer, flexible circuit layer, and inner fabric layer are subjected to three-dimensional hot pressing integral molding process to integrally form the outer fabric layer, flexible circuit layer, and inner fabric layer. The hot-pressed outer fabric layer, flexible circuit layer, and inner fabric layer are then cooled and shaped.

[0126] In some embodiments, the hair growth device further includes a main structure, and before opening corresponding clearance holes in the inner fabric layer according to the mounting position of the light-emitting element on the flexible circuit layer, the device further includes: obtaining the size information of the outer fabric layer, the flexible circuit layer and the inner fabric layer according to the main body size of the main structure, so as to complete the cutting of the outer fabric layer, the flexible circuit layer and the inner fabric layer.

[0127] In some embodiments, after cooling and shaping the hot-pressed outer fabric layer, flexible circuit layer and inner fabric layer, the method further includes: attaching the hot-pressed outer fabric layer, flexible circuit layer and inner fabric layer to the inner side of the main structure by means of the outer fabric layer.

[0128] In some embodiments, the step of opening a corresponding clearance hole in the inner fabric layer according to the mounting position of the light-emitting element on the flexible circuit layer includes: obtaining the arrangement position and external dimensions of each light-emitting element on the flexible circuit layer; opening the clearance hole corresponding to the light-emitting element on the side of the inner fabric layer away from the outer fabric layer according to the arrangement position and external dimensions; the size of the clearance hole matches the external dimensions of the light-emitting element to ensure that the light emitted by the light-emitting element is output without obstruction.

[0129] In some embodiments, the three-dimensional hot-pressing integral molding process of the pre-fixed outer fabric layer, flexible circuit layer and inner fabric layer includes: placing the pre-fixed outer fabric layer, flexible circuit layer and inner fabric layer into a preset three-dimensional hot-pressing mold, performing hot-pressing under preset temperature and pressure parameters, and forming a positioning imprint structure corresponding to the flexible circuit layer in the inner fabric layer during the hot-pressing process, thereby completing the three-dimensional hot-pressing integral molding process.

[0130] In some embodiments, the cooling and shaping of the outer fabric layer, flexible circuit layer and inner fabric layer after hot pressing includes: placing the outer fabric layer, flexible circuit layer and inner fabric layer that have completed the hot pressing process in the three-dimensional hot pressing mold, allowing them to cool statically in a preset constant temperature environment, and then demolding them after the outer fabric layer, flexible circuit layer and inner fabric layer have completely shaped.

[0131] In some embodiments, before the installation position of the light-emitting element on the flexible circuit layer is determined, the method further includes: soldering a plurality of light-emitting elements to preset pad positions on the flexible circuit board, and soldering corresponding electronic components and power supply components to obtain the flexible circuit layer.

[0132] In some embodiments, before performing three-dimensional hot pressing integral molding on the pre-fixed outer fabric layer, flexible circuit layer and inner fabric layer, the method further includes: performing high-temperature resistant insulation protection treatment on the electronic components and power supply components corresponding to the flexible circuit layer to ensure that the power supply components are not damaged during the hot pressing process.

[0133] In some embodiments, the step of welding multiple light-emitting elements to preset pad positions on a flexible circuit board includes: selecting a vertical cavity surface-emitting laser as the light-emitting element, adjusting the size of the corresponding clearance hole on the inner fabric layer to match the external size of the vertical cavity surface-emitting laser, so that the laser emitted by the vertical cavity surface-emitting laser can be unobstructed through the clearance hole to irradiate the wearer's scalp area.

[0134] It should be noted that those skilled in the art will understand that, for the sake of convenience and brevity, the specific working process of the steps described above and their corresponding embodiments can be referred to the corresponding processes in the embodiments of the hair growth device manufacturing method described above, and will not be repeated here.

[0135] This application also provides a computer-readable storage medium storing a computer program that, when executed by a processor, causes the processor to perform the steps of the method for manufacturing the hair growth device as described in the first aspect above.

[0136] The computer-readable storage medium may be an internal storage unit of the computer device described in the foregoing embodiments, such as the hard disk or memory of the computer device. The computer-readable storage medium may also be an external storage device of the computer device, such as a plug-in hard disk, SmartMedia Card (SMC), Secure Digital (SD) card, or Flash Card equipped on the computer device.

[0137] The above description is merely a specific embodiment of this application, but the scope of protection of this application is not limited thereto. Any person skilled in the art can easily conceive of various equivalent modifications or substitutions within the technical scope disclosed in this application, and these modifications or substitutions should all be covered within the scope of protection of this application. Therefore, the scope of protection of this application should be determined by the scope of the claims.

Claims

1. A method for manufacturing a hair growth device, the hair growth device comprising an outer fabric layer, a flexible circuit layer, and an inner fabric layer arranged sequentially, wherein a plurality of light-emitting elements are disposed on one side of the flexible circuit layer; characterized in that, include: According to the mounting position of the light-emitting element on the flexible circuit layer, a corresponding clearance hole is opened in the inner fabric layer; The flexible circuit layer is pre-fixed between the outer fabric layer and the inner fabric layer, so that the light-emitting element is embedded in the corresponding clearance hole; The pre-fixed outer fabric layer, flexible circuit layer, and inner fabric layer are subjected to three-dimensional hot pressing integral molding process to integrally form the outer fabric layer, flexible circuit layer, and inner fabric layer. The hot-pressed outer fabric layer, flexible circuit layer, and inner fabric layer are then cooled and shaped.

2. The manufacturing method according to claim 1, characterized in that, The hair growth device also includes a main structure, and before the corresponding clearance hole is opened in the inner fabric layer according to the mounting position of the light-emitting element on the flexible circuit layer, it further includes: Based on the main dimensions of the main structure, the size information of the outer fabric layer, flexible circuit layer, and inner fabric layer is obtained to complete the cutting of the outer fabric layer, flexible circuit layer, and inner fabric layer.

3. The manufacturing method according to claim 2, characterized in that, After the outer fabric layer, flexible circuit layer, and inner fabric layer are cooled and shaped following the hot-pressed process, the process further includes: The outer fabric layer, flexible circuit layer, and inner fabric layer, after being hot-pressed, are bonded to the inner side of the main structure by the outer fabric layer.

4. The manufacturing method according to claim 1, characterized in that, The step of creating corresponding clearance holes in the inner fabric layer according to the mounting position of the light-emitting element on the flexible circuit layer includes: The arrangement position and external dimensions of each light-emitting element on the flexible circuit layer are obtained. According to the arrangement position and external dimensions, the clearance hole corresponding to the light-emitting element is opened on the side of the inner fabric layer away from the outer fabric layer. The size of the clearance hole matches the external dimensions of the light-emitting element to ensure that the light emitted by the light-emitting element is output without obstruction.

5. The manufacturing method according to claim 1, characterized in that, The three-dimensional hot-pressing integral molding process for the pre-fixed outer fabric layer, flexible circuit layer, and inner fabric layer includes: The pre-fixed outer fabric layer, flexible circuit layer, and inner fabric layer are placed into a preset three-dimensional hot press mold and hot-pressed under preset temperature and pressure parameters. During the hot pressing process, a positioning imprint structure corresponding to the flexible circuit layer is formed in the inner fabric layer, thus completing the three-dimensional hot pressing integral molding process.

6. The manufacturing method according to claim 5, characterized in that, The cooling and shaping of the outer fabric layer, flexible circuit layer, and inner fabric layer after hot pressing includes: The outer fabric layer, flexible circuit layer, and inner fabric layer, which have undergone hot pressing, are placed in the three-dimensional hot pressing mold and allowed to cool statically in a preset constant temperature environment. After the outer fabric layer, flexible circuit layer, and inner fabric layer have completely solidified, they are demolded.

7. The manufacturing method according to claim 1, characterized in that, Prior to the mounting position of the light-emitting element on the flexible circuit layer, the method further includes: Multiple light-emitting elements are soldered to preset pad positions on the flexible circuit board, and corresponding electronic components and power supply components are soldered in conjunction to obtain the flexible circuit layer.

8. The manufacturing method according to claim 7, characterized in that, Before performing the three-dimensional hot-pressing integral molding process on the pre-fixed outer fabric layer, flexible circuit layer, and inner fabric layer, the process further includes: The electronic components and power supply parts corresponding to the flexible circuit layer are subjected to high-temperature resistant insulation protection treatment to ensure that the power supply parts are not damaged during the hot pressing process.

9. The manufacturing method according to claim 7, characterized in that, The step of soldering multiple light-emitting elements to preset pad positions on the flexible circuit board includes: A vertical cavity surface emission laser is selected as the light-emitting element. The size of the corresponding hole on the inner fabric layer is adjusted to match the external size of the vertical cavity surface emission laser, so that the laser emitted by the vertical cavity surface emission laser can be unobstructed and irradiate the wearer's scalp area through the hole.

10. A hair regrowth device, characterized in that, Prepared by the method according to any one of claims 1-9.

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